KR20240002167A - 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치 - Google Patents

폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치 Download PDF

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Publication number
KR20240002167A
KR20240002167A KR1020230062159A KR20230062159A KR20240002167A KR 20240002167 A KR20240002167 A KR 20240002167A KR 1020230062159 A KR1020230062159 A KR 1020230062159A KR 20230062159 A KR20230062159 A KR 20230062159A KR 20240002167 A KR20240002167 A KR 20240002167A
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general formula
group
carbon atoms
partial structure
compound
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Korean (ko)
Inventor
가즈마사 아오야마
신타로우 하시모토
다츠야 오카모토
도모히로 시모노
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디아이씨 가부시끼가이샤
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Publication of KR20240002167A publication Critical patent/KR20240002167A/ko
Priority to KR1020250036486A priority Critical patent/KR20250044232A/ko
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    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H—ELECTRICITY
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020230062159A 2022-06-28 2023-05-15 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치 Pending KR20240002167A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020250036486A KR20250044232A (ko) 2022-06-28 2025-03-21 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022104042A JP7598033B2 (ja) 2022-06-28 2022-06-28 ポリマレイミド樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置
JPJP-P-2022-104042 2022-06-28

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KR1020250036486A Division KR20250044232A (ko) 2022-06-28 2025-03-21 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치

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KR20240002167A true KR20240002167A (ko) 2024-01-04

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KR1020230062159A Pending KR20240002167A (ko) 2022-06-28 2023-05-15 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치
KR1020250036486A Pending KR20250044232A (ko) 2022-06-28 2025-03-21 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치

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KR1020250036486A Pending KR20250044232A (ko) 2022-06-28 2025-03-21 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치

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JP (2) JP7598033B2 (https=)
KR (2) KR20240002167A (https=)
CN (1) CN117304488A (https=)
TW (1) TWI858781B (https=)

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JP2025110515A (ja) 2024-01-16 2025-07-29 セイコーエプソン株式会社 媒体搬送装置及び記録装置

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2020176191A (ja) 2019-04-17 2020-10-29 日本化薬株式会社 芳香族アミン樹脂、マレイミド樹脂、硬化性樹脂組成物およびその硬化物
JP2020176190A (ja) 2019-04-17 2020-10-29 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物

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