KR20230174717A - Alignment apparatus, bonding appratus of substrates and alignment method - Google Patents

Abstract

[Problem] When aligning the substrate, positioning is performed in the circumferential direction of the substrate, and the substrates overlap each other satisfactorily.
[Solution] The alignment device 60 is an alignment device 60 that positions substrates S1 and S2 on which notches 99 are formed on the outer periphery, and includes a substrate support portion 20 on which the substrates S1 and S2 are placed. and a rotation control portion 63 inserted into the notch 99 of the substrates S1 and S2 placed on the substrate support portion 20, and a substrate ( It is provided with a plurality of blocks 61a and 62a intersecting from a direction along the surfaces of S1 and S2.

Description

Alignment device, substrate overlapping device, and alignment method {ALIGNMENT APPARATUS, BONDING APPRATUS OF SUBSTRATES AND ALIGNMENT METHOD}

The present invention relates to an alignment device, a substrate overlapping device, and an alignment method.

A substrate overlapping device that overlaps a plurality of substrates in an overlapping state is known. In such a substrate overlapping device, a configuration is disclosed in which a first wafer (support plate) is placed on a second wafer (substrate) held on a stage, thereby overlapping the first wafer and the second wafer. (For example, see Patent Document 1). The substrate stacking device disclosed in Patent Document 1 includes an alignment device (position adjustment unit) that adjusts the positions of the first wafer and the second wafer in the horizontal direction before pressure bonding the first wafer and the second wafer. I'm doing it. A plurality of these alignment devices are provided on the radial outer side of the first wafer and the second wafer at intervals in the circumferential direction. The alignment device comes into contact with the first wafer and the second wafer and performs alignment by being pressed by a pressing portion such as a stepping motor or an air cylinder device.

Japanese Patent Laid-Open No. 2013-243226

The alignment device disclosed in Patent Document 1 has a problem in that position adjustment in the circumferential direction (direction around the axis parallel to the vertical axis) of the first wafer and the second wafer cannot be performed.

The purpose of the present invention is to provide an alignment device, a substrate overlapping device, and an alignment method that determine the position of the substrate in the circumferential direction when aligning the substrate and allow the substrates to overlap each other satisfactorily.

In a first aspect of the present invention, there is provided an alignment device for positioning a substrate having a notch formed on an outer peripheral portion, comprising: a substrate support portion for placing the substrate; a rotation regulating portion inserted into the notch of the substrate placed on the substrate support portion; An alignment device is provided, comprising a plurality of blocks inserted into the substrate placed on the substrate support portion from a direction along the surface of the substrate.

In a second aspect of the present invention, the alignment device as described above, a lift pin provided on the substrate support portion to support and raise the substrate, a holding portion for receiving and holding the substrate from the lift pin, and A substrate having an upper pressing portion disposed above a substrate support portion and overlapping the plurality of substrates positioned by the alignment device by inserting the substrate support portion or the lift pin into the upper pressing portion. A nesting device is provided.

In a third aspect of the present invention, there is provided an alignment method for positioning a substrate having a notch formed on its outer periphery, comprising inserting a rotation regulation part into the notch to regulate rotation of the substrate, and a direction along the surface of the substrate with respect to the substrate. An alignment method is provided, comprising incorporating a plurality of blocks from.

According to an aspect of the present invention, when aligning the substrates, positioning is performed in the circumferential direction of the substrates, so that the substrates can be satisfactorily overlapped with each other.

1 is a diagram showing an example of a substrate overlapping device according to an embodiment.
Figure 2 is a view of the upper substrate viewed from below.
Figure 3 is a cross-sectional view of the upper substrate.
Figure 4 is a plan view of the lower plate and the alignment device as seen from above.
FIG. 5 is a cross-sectional view seen along arrow AA in FIG. 4.
Figure 6 is a flow chart showing an example of a substrate overlapping method related to the embodiment.
FIG. 7 is a flow chart continuing from FIG. 6 and showing an example of a substrate overlapping method related to the embodiment.
Fig. 8 shows an example of the operation of the substrate stacking device, and is a diagram in which the upper substrate is loaded into the chamber and supported by lift pins.
Fig. 9 shows an example of the operation of the substrate stacking device and is a diagram showing the upper substrate placed on a support member.
Fig. 10 shows an example of the operation of the substrate stacking device, in which the lower substrate is loaded into the chamber and supported by lift pins.
Fig. 11 shows an example of the operation of the substrate stacking device, and is a diagram showing the lower substrate supported by the lower plate.
Figure 12 shows an example of the operation of the substrate overlapping device, and is a diagram in which the upper substrate and the lower substrate are overlapped by raising the lift pins.
13 is a flow chart showing an example of an alignment method related to the embodiment.
Fig. 14 shows an example of the operation of the alignment device and is a diagram showing a notch pin inserted into a notch of the substrate.
Fig. 15 shows an example of the operation of the alignment device and is a diagram showing a pair of first blocks in contact with a substrate.
Fig. 16 shows an example of the operation of the alignment device and is a diagram showing a substrate being pressed by one side of a pair of second blocks.
Fig. 17 shows an example of the operation of the alignment device and is a diagram showing a substrate being pressed by the other side of a pair of second blocks.
Fig. 18 shows an example of the operation of the alignment device, and is a diagram in which the notch pin, a pair of first blocks, and a pair of second blocks are retracted.

Embodiments will be described with reference to the drawings. However, the present invention is not limited to the content described below. In addition, in the drawings, in order to easily explain the embodiments, some parts are omitted. In addition, the scale is changed appropriately, such as enlarging or emphasizing some parts, and the size and shape may be different from the actual product. In each drawing below, the direction in the drawing is explained using the XYZ orthogonal coordinate system. In this XYZ orthogonal coordinate system, the plane parallel to the horizontal plane is called the XY plane. In this XY plane, the direction parallel to the conveyance direction of the substrates S1 and S2 is called the X direction, and the direction orthogonal to the Additionally, the direction perpendicular to the XY plane is referred to as the Z direction (height direction). In each of the

<Substrate overlapping device>

The substrate overlapping device 100 related to the embodiment will be described. FIG. 1 is a diagram showing an example of a substrate stacking device 100 according to an embodiment. The substrate overlapping device 100 overlaps the substrate S1 on which the adhesive layer F is formed and the substrate S2 on which the adhesive layer F is formed, with their adhesive layers F touching each other. In addition, the adhesive layer F is not limited to being formed on both the substrate S1 and the substrate S2, and may be formed on either the substrate S1 or the substrate S2. The adhesive layer F is formed, for example, by applying it to the substrates S1 and S2 using a coating device and drying it before being loaded into the substrate stacking device 100. Additionally, this coating device may be provided in the substrate stacking device 100.

In this embodiment, of the two overlapping substrates, the upper substrate is called substrate S1, and the lower substrate is called substrate S2. The substrate S1 and S2 are, for example, a glass substrate, a semiconductor substrate, a resin substrate, etc. In this embodiment, for example, the upper substrate S1 is a glass substrate, and the lower substrate S2 is a silicon substrate. In addition, the form in which the substrate S1 and the substrate S2 are overlapped is also called the substrate S (see FIG. 18). The substrate S1 and the substrate S2 are both circular substrates having a circular shape in plan view (viewed in the Z direction), but are not limited to circular substrates and are rectangular in plan view (square shape). , rectangular shape), an elliptical shape, an oval shape, etc. may be used.

FIG. 2 is a view of the upper substrate S1 viewed from below. As shown in FIG. 2 , the substrates S1 and S2 are provided with notches 99 . The notch 99 is formed on the outer periphery of the substrates S1 and S2. The notch 99 is formed at one location in the circumferential direction on the outer periphery of the substrates S1 and S2. The notch 99 is formed to be recessed from the outer peripheral portion of the substrates S1 and S2 to the radial inside of the substrates S1 and S2. The notch 99 is formed in a semicircular shape when viewed from below.

Fig. 3 is a cross-sectional view of the upper substrate S1. As shown in FIGS. 2 and 3 , an adhesive layer F is formed on the lower surface of the upper substrate S1 facing downward when brought into the chamber 10 .

As shown in FIG. 1, the substrate stacking device 100 includes a chamber 10, a substrate support portion 20, an upper pressing portion 30, a lift portion 40, a shaft portion 51, and an alignment device. It is provided with a device 60 and a control unit C. The control unit C controls the operations of each unit in the substrate stacking device 100 in a unified manner.

In the substrate overlapping device 100, in order to overlap the substrates S1 and S2, the substrate S1 is first brought into the chamber 10, aligned with the alignment device 60, and then placed in the lift unit 40. ), the substrate S1 is raised and held by the upper pressing portion 30. After that, the substrate S2 is brought into the chamber 10, aligned with the alignment device 60, and then the substrate S2 is raised by the lift unit 40 and held in the upper pressing unit 30. overlaps with the substrate (S1). When the substrate S2 is loaded into the chamber 10, the substrate S2 is loaded with the adhesive layer F facing upward (+Z direction).

The chamber 10 is disposed on the base 15 of the substrate stacking device 100. The chamber 10 is formed in a box shape with a side wall 10a extending upward from the outer periphery of the base 15 and a ceiling plate 10b covering the upper part of the side wall 10a. The chamber 10 accommodates a substrate support portion 20, an upper pressing portion 30, a lift portion 40, a portion of the shaft portion 51, and an alignment device 60. The chamber 10 is formed in a box shape and has an opening 11 in a part of the side wall 10a. The opening 11 is formed on the -X side surface of the chamber 10 and communicates the inside and outside of the chamber 10. The opening 11 is formed to a size that allows the passage of the substrates S1 and S2 held in the transfer device 90 and the substrate S overlapping them.

The substrates S1 and S2 are each loaded into the chamber 10 through the opening 11 by the arm 91 of the transfer device 90 . Additionally, the substrate S is carried out from within the chamber 10 through the opening 11 . In the present embodiment, the transfer device 90 is provided with two flat arms 91, and when the substrate S1 is loaded into the chamber 10, the substrate S1 is adsorbed from above to hold the substrate S1. When holding (S1), loading the substrate (S2), and carrying out the substrate (S) from the chamber (10), the substrate (S2, S) is held by suction from the lower side of the substrate (S2, S). do. Additionally, the arm 91 may be in a form where the substrates S2 and S are placed and held on the upper surface side of the arm 91 without adsorbing them when transporting the substrates S2 and S. Additionally, the number of arms 91 is not limited to two, and may be three or more.

The chamber 10 is equipped with a gate valve 12 that opens and closes the opening 11. The gate valve 12 is disposed on the outside of the - The gate valve 12 opens and closes the opening 11 by sliding. Moreover, even if the opening 11 is closed with the gate valve 12, the chamber 10 remains open to the atmosphere. Additionally, the inside of the chamber 10 may be sealed by closing the opening 11, thereby creating a vacuum atmosphere within the chamber 10. Additionally, a penetrating portion 10h through which a shaft portion 51 described later penetrates is provided on the upper surface of the chamber 10. The shaft portion 51 is inserted into the penetrating portion 10h. Additionally, the shaft portion 51 may be provided to be capable of being raised and lowered.

Additionally, the substrate stacking device 100 may be provided with a chamber 10 or not, and may be in a form without the chamber 10 (open to the atmosphere). When the inside of the chamber 10 is in a vacuum atmosphere, the inside of the chamber 10 is connected to a suction device not shown in the drawing. By suctioning (exhausting) the inside of the chamber 10 with this suction device, the inside of the chamber 10 can be created in a vacuum atmosphere. Additionally, the chamber 10 may be provided with a valve that can be opened to the outside in order to open the internal vacuum atmosphere. Additionally, the inside of the chamber 10 may be connected to a gas supply device not shown in the drawing. By supplying a predetermined gas into the chamber 10 from this gas supply device, the inside of the chamber 10 can be maintained in a predetermined gas atmosphere. As the predetermined gas, for example, a gas inert to the thin film formed on the substrates S1 and S2, such as nitrogen gas, or dry air, etc. are used.

The substrate support portion 20 supports the substrates S1 and S2 loaded into the chamber 10 from below. The substrate support portion 20 has a circular shape when viewed from above, but is not limited to this shape and may, for example, have a rectangular shape (square shape, rectangular shape), elliptical shape, oval shape, etc. The substrate support portion 20 is set to have an outer diameter larger than that of the substrates S1 and S2.

The substrate support part 20 has a support plate 21, a heater (heating part) 22, and a base plate 23. The support plate 21, heater 22, and base plate 23 are stacked in this order from the lower side (-Z side). The substrate support portion 20 is supported by a plurality of supports 24 provided on the lower surface of the support plate 21 . The support plate 21 and the heater 22 and the heater 22 and the base plate 23 are fixed by fastening members such as bolts, for example. The support plate 21, the heater 22, and the base plate 23 are provided with a plurality of through holes 20h in the vertical direction through which the lift pin 41 of the lift unit 40, which will be described later, penetrates. In addition, whether or not to provide the heater (heating part) 22 is optional, and the substrate support part 20 may be in a form not provided with the heater (heating part) 22.

The support plate 21 is a plate-shaped body formed of a material such as metal, resin, or ceramic, for example. The heater 22 is an example of a heating unit and is, for example, a hot plate having a heating mechanism (heat source) such as a heating wire inside. The substrates S1 and S2 are heated by the heater 22 via the base plate 23. Additionally, the heater 22 may be a laminated structure stacked with a sheet-shaped heat source interposed between them. In the base plate 23, the substrates S1 and S2 and the substrate S are disposed on the upper surface 23f side, which is the +Z side surface. The base plate 23 is, for example, a plate-shaped body made of ceramic, but may be made of metal, resin, etc. The upper surface 23f of the base plate 23 may be a surface in contact with the substrate S2. Therefore, it is desirable that the upper surface 23f has high flatness and small surface roughness (or is a mirror surface).

A plurality of supports 24 are provided on the lower surface of the support plate 21. The plurality of supports 24 are used to support the substrate support portion 20 on the base 15 at the bottom of the chamber 10. Additionally, the number and arrangement of the supports 24 are not limited to the above-described forms, and any configuration capable of supporting the substrate support portion 20 can be applied.

As shown in FIG. 1, when the substrate S1 and the substrate S2 overlap, the upper pressing portion 30 holds the upper substrate S1 toward the substrate S2 side (substrate support portion 20 side). Press firmly toward The upper pressing portion 30 is provided with a base 31 provided at a lower portion of the shaft portion 51 and a suction pad (holding portion) 32 provided on the lower surface side of the base 31. The base 31 and the suction pad 32 have, for example, a circular shape when viewed from above, but are not limited to this shape, and may have, for example, a rectangular shape (square shape, rectangular shape), elliptical shape, or oval shape. etc. may also be used. The base 31 and the suction pad 32 are set to have an outer diameter smaller than that of the substrates S1 and S2. Additionally, the outer diameter dimensions of the base 31 and the suction pad 32 can be set arbitrarily.

The upper pressing portion 30 is provided at the lower end of the shaft portion 51, and its position is fixed in the vertical direction. However, when the shaft portion 51 can be raised and lowered, the upper pressing portion 30 may be raised and lowered integrally with the shaft portion 51. The suction pad 32 can hold the substrate S1 by adsorbing the upper surface of the raised substrate S1 supported by the lift pins 41 by using the lower surface 32a as the suction surface. The suction pad 32 is fixed to the base 31 by, for example, a fastening member such as a bolt. The configuration of the suction pad 32 is arbitrary, and for example, a vacuum suction pad, an electrostatic suction pad, etc. are used. Additionally, the upper pressing portion 30 may be provided with a heater (heating portion). Additionally, instead of the upper pressing portion 30 being provided with a heater, a heater for heating the inside of the chamber 10 may be provided.

The lift unit 40 is provided below the substrate support unit 20 . The lift unit 40 supports the substrates S1, S2, and S above the substrate support unit 20, and raises and lowers the substrates S1, S2, and S. The lift unit 40 lowers the supported substrates S1 and S2 in order to align each of the substrates S1 and S2 loaded into the chamber 10 with the alignment device 60, and the substrate support unit ( 20) Put it on the table. The lift unit 40 raises the supported substrate S1 in order to hold the substrate S1 aligned with the alignment device 60 on the suction pad 32 . The lift unit 40 lifts the substrate S2, which has been aligned with the alignment device 60, in order to overlap the substrate S1.

The lift unit 40 includes a plurality of lift pins 41, a moving part 42 that is connected to the lower ends of the lift pins 41 and moves up and down in the Z direction, and a lift pin driving part that raises and lowers the moving part 42. It has (43). A plurality of lift pins 41 are arranged in the central portion of the substrate support portion 20 . The plurality of lift pins 41 support the substrates S1 and S2 by contacting the central portion of the substrates S1 and S2 from below. Additionally, the upper ends of the lift pins 41 are not in contact with the substrates S1 and S2 after the substrates S1 and S2 are placed on the substrate support portion 20.

FIG. 4 is a plan view of the substrate support portion 20 viewed from above. As shown in FIG. 4 , the lift pins 41 are disposed to penetrate each of the plurality of through holes 20h provided in the substrate support portion 20 . The heights of the upper ends of the plurality of lift pins 41 are the same or aligned to be approximately the same. The lift pin 41 may be formed of, for example, a non-conductive material (eg, resin, metal, ceramic, etc.).

As shown in FIG. 1, the moving unit 42 moves up and down by driving the lift pin driving unit 43. The plurality of lift pins 41 are simultaneously raised and lowered as the moving unit 42 is raised and lowered. For example, an electric rotation motor, a linear motor, an air cylinder device, or a hydraulic cylinder device is used as the lift pin drive unit 43, and the driving force is transmitted to the moving unit 42 by a transmission mechanism not shown in the drawing.

FIG. 5 is a cross-sectional view taken along the line A-A in FIG. 4. As shown in FIGS. 4 and 5 , the substrate support portion 20 is provided with a support member 80 . The support member 80 supports the outer peripheral portion F1 of the lower surface of the substrate S1 from below when the alignment device 60 positions the substrate S1. The support member 80 is provided on the base plate 23 of the substrate support part 20.

The support member 80 supports the substrate S1 by contacting the outer peripheral portion F1 of the lower surface of the substrate S1 when the lift pin 41 that supports the substrate S1 is lowered. The support members 80 are provided at three or more locations at intervals in the circumferential direction of the substrate support portion 20 . The support members 80 are provided at, for example, four locations at intervals in the circumferential direction of the substrate support portion 20. The support member 80 is, for example, a pin 81 protruding from the upper surface of the substrate support portion 20. By bringing the pins 81 into contact with the outer peripheral portion F1 of the lower surfaces of the substrates S1 and S2, the substrates S1 and S2 can be stably supported with a simple configuration.

The shape of the tip of the pin 81 is not limited to a hemispherical shape, and may be of any other shape as appropriate. Additionally, the configuration of the support member 80 is changed appropriately. Furthermore, the support member 80 may not be provided, and the substrates S1 and S2 may be supported from below by a plurality of lift pins configured to protrude upward from the upper surface 23f of the base plate 23.

As shown in FIGS. 1 and 4 , the alignment device 60 positions the substrates S1 and S2 with respect to the substrate support portion 20 . The alignment device 60 positions the substrates S1 and S2 on which notches 99 are formed on the outer periphery. The alignment device 60 is provided with a pair of first block units 61, a pair of second block units 62, and a rotation regulating portion 63. The pair of first block units 61 are disposed on one side of the rotation regulating portion 63 with the substrates S1 and S2 therebetween. The pair of second block units 62 is disposed on the other side of the pair of first block units 61 across the substrates S1 and S2 with respect to the rotation regulating portion 63 .

The pair of first block units 61 are arranged at intervals in the circumferential direction around the central axis AX of the substrate support portion 20. In this embodiment, the pair of first block units 61 are arranged at intervals at an angle of, for example, 90 degrees in the circumferential direction around the central axis AX. Each first block unit 61 includes a first block 61a and a first block driver 64.

The first block 61a is provided to be able to advance and retreat along the guide member 61s extending in the radial direction of the substrates S1 and S2 supported by the substrate support portion 20. The first block 61a can come into contact with the outer periphery of the substrates S1 and S2 when advanced radially inside the substrates S1 and S2. The first block drive unit 64 advances and retreats the first block 61a in the radial direction of the substrates S1 and S2. The first block drive unit 64 uses, for example, an electric rotation motor, an air cylinder device, or a hydraulic cylinder device. The operation of the first block driver 64 is controlled by the control unit C.

The pair of second block units 62 are arranged at intervals in the circumferential direction of the substrates S1 and S2. In this embodiment, the pair of second block units 62 are arranged at intervals at an angle of, for example, 90 degrees in the circumferential direction around the central axis AX. Each of the pair of second block units 62 is arranged to face each of the pair of first block units 61 with the central axis AX of the substrate support portion 20 interposed therebetween. Each second block unit 62 includes a second block 62a and a second block driver 65.

The second block 62a is provided to be able to advance and retreat along the guide member 62s extending in the radial direction of the substrates S1 and S2 supported on the substrate support portion 20. The second block 62a can come into contact with the outer periphery of the substrates S1 and S2 when advanced in the radial direction of the substrates S1 and S2. The second block drive unit 65 advances and retreats the second block 62a in the radial direction of the substrates S1 and S2. The second block drive unit 65 uses, for example, an electric rotation motor, an air cylinder device, or a hydraulic cylinder device. The operation of the second block driver 65 is controlled by the control unit C. The second block drive unit 65 is provided with an elastic member 66 that elastically supports the second block 62a so as to press it toward the outer periphery of the substrates S1 and S2. The elastic member 66 is, for example, a coil spring.

The rotation regulating portion 63 is disposed between a pair of second block units 62 in the circumferential direction of the substrates S1 and S2. The rotation regulating portion 63 includes a notch pin 67, a pin driving portion 68, and a pin pressing member 69. The notch pin 67 can be inserted into the notch 99 of the substrates S1 and S2. The tip of the notch pin 67 is formed in a semicircular shape when viewed from above. The pin driver 68 advances and retracts the notch pin 67 in the radial direction of the substrates S1 and S2. For the pin driving unit 68, an electric rotation motor, an air cylinder device, a hydraulic cylinder device, etc. are used, for example. The operation of the pin driving unit 68 is controlled by the control unit C. The pin pressing member 69 presses the notched pin 67 toward the radial inner side of the substrates S1 and S2. By inserting the notch pins 67 into the notches 99 of the substrates S1 and S2, movement of the substrates S1 and S2 in the circumferential direction is regulated.

The alignment device 60 has, as a plurality of blocks, a first block 61a of a pair of first block units 61 and a second block 62a of a pair of second block units 62. . As a plurality of blocks, a pair of first blocks 61a and a pair of second blocks 62a support the substrates S1 and S2 placed on the substrate support unit 20. It is inserted from the direction along the surfaces of the substrates S1 and S2 at a plurality of locations spaced apart in the circumferential direction. In the alignment device 60, the notch pin 67 of the rotation regulating portion 63 is inserted into the notches 99 of the substrates S1 and S2 placed on the substrate support portion 20. With this configuration, the substrates S1 and S2 are aligned while rotation in the circumferential direction is restricted.

In the alignment device 60, the pair of first blocks 61a are disposed on opposite sides of the notch pin 67 of the rotation regulating portion 63 with the substrates S1 and S2 therebetween. The pair of first blocks 61a are arranged at intervals on both sides of the notch pin 67 in the radial direction with the centers of the substrates S1 and S2 in between. The pair of first blocks 61a are disposed so as to be in contact with the outer peripheral portions of the substrates S1 and S2 on opposite sides of the notch pin 67 across the substrates S1 and S2. The pair of second blocks 62a are disposed on opposite sides of the pair of first blocks 61a with the substrates S1 and S2 therebetween. A pair of second blocks 62a are arranged at intervals on both sides of the substrates S1 and S2 in the circumferential direction away from the notch 99.

The pair of second blocks 62a are disposed on both sides in the circumferential direction of the substrates S1 and S2 with the notches 99 in between, so as to be able to abut against the outer peripheral portions of the substrates S1 and S2. When these pair of first blocks 61a and pair of second blocks 62a come into contact with the substrates S1 and S2, the substrate S1 in the direction along the surfaces of the substrates S1 and S2 , S2) position is specified. The first block 61a, the second block 62a, and the notch pin 67 are preferably formed of a conductive material to prevent the substrates S1 and S2 from being charged.

The pair of second blocks 62a elastically supports the substrates S1 and S2 by being pressed toward the outer periphery of the substrates S1 and S2 by the pin pressing member 69. In addition, the notch pin 67 is securely engaged with the notch 99 by being pressed against the radial inside of the substrates S1 and S2 by the pin pressing member 69. The contact force of the first block 61a, the second block 62a, and the rotation regulating portion 63 with respect to the outer periphery of the substrates S1 and S2 is the same as that of the second block 62a and the first block 61a. , the notch pin 67 is set to become stronger in that order.

The operation of the alignment device 60 is controlled by the control unit C. For example, the control unit C reads the shape, diameter, position of the notch 99, etc. of the substrates S1 and S2 acquired by other units not shown in the drawing, and After determining the alignment position, the alignment device 60 is operated. When performing alignment adjustment of the substrates S1 and S2, the notch pin 67 is moved to the inside of the substrates S1 and S2 in the radial direction by the pin driving unit 68 operated under the control of the control unit C. It advances and is inserted into the notch 99. The pair of first blocks 61a advance radially inside the substrates S1 and S2 by the first block drive unit 64 operated under the control of the control unit C. The pair of first blocks 61a are arranged at positions based on the outer diameter dimensions of the substrates S1 and S2 that the control unit C has acquired in advance.

The pair of second blocks 62a advances toward the radial inside of the substrates S1 and S2 by the second block driving unit 65 operated under the control of the control unit C, and , S2) touches the outer periphery. The pair of second blocks 62a are pressed against the outer peripheral portions of the substrates S1 and S2 by the second block driving unit 65. Each of the second blocks 62a presses the outer peripheral portions of the substrates S1 and S2 radially inward, thereby causing the substrates S1 and S2 to form a first block on the opposite side between the substrates S1 and S2 ( 61a). The second block driver 65 firmly presses one of the pair of second blocks 62a to the outer periphery of the substrates S1 and S2, and then presses the other of the pair of second blocks 62a to the substrates S1 and S2. Press firmly on the outer periphery of S2).

The second block driver 65 performs an operation of firmly pressing each of the pair of second blocks 62a against the outer periphery of the substrates S1 and S2 and an operation of retracting the pair of second blocks 62a from the outer periphery of the substrates S1 and S2. Take turns and repeat the set number of times. By this operation, the substrates S1 and S2 are positioned based on the pair of first blocks 61a fixed in positions based on the outer diameter dimensions of the substrates S1 and S2. The positions of the substrates S1 and S2 in the circumferential direction are defined by inserting the notch pin 67 into the notch 99.

As shown in FIG. 4 , each of the plurality of first blocks 61a and the second blocks 62a is arranged in a state shifted in the circumferential direction of the substrate support portion 20 with respect to the plurality of pins 81. . With this configuration, when positioning the substrates S1 and S2 by the alignment device 60, the plurality of first blocks 61a and the second blocks 62a are aligned on the surfaces of the substrates S1 and S2. When advancing and retreating in the direction along the board S1 and S2, interference between the first block 61a and the second block 62a and the pin 81 can be suppressed.

<Substrate overlap method>

Next, a substrate overlapping method related to the embodiment will be described. Fig. 6 is a flow chart showing an example of a substrate overlapping method related to the embodiment. FIG. 7 is a flow chart showing an example of a substrate overlapping method related to the embodiment, continuing from FIG. 6 . This substrate overlapping method is executed, for example, by instructions from the control unit C. 8 to 18 are process diagrams showing an example of the operation of the substrate stacking device 100. In addition, in these process charts, the description is simplified to make the movement of each part easier to understand. Hereinafter, description will be given according to the flow charts in FIGS. 6 and 7.

First, the gate valve 12 of the chamber 10 is opened and the substrate is loaded (step S01). As shown in FIG. 8, the control unit C drives a driving unit not shown in the drawing to raise the gate valve 12 and open the opening 11. Subsequently, the substrate S1 (upper substrate) is brought into the chamber 10. At this time, the control unit C raises the lift pin 41 to the height of the transfer and reception of the substrate S1. The arm 91 of the transfer device 90 enters the inside of the chamber 10 through the opening 11 while holding the substrate S1 on the lower surface, and lifts the substrate S1 using the lift pin 41. Place it at the top. The arm 91 adsorbs and holds the substrate S1 using a suction pad, not shown in the drawing, provided on the lower surface. In addition, before the substrate S1 is loaded into the chamber 10, its outer diameter, the position of the notch 99 in the circumferential direction, etc. are measured. The substrate S1 is held by the arm 91 with the position of the notch 99 in the circumferential direction set to a predetermined position.

After that, the control unit C lowers the arm 91 and passes the substrate S1 from the arm 91 to the lift pin 41 (step S02). The lift pin 41 engages the central portion of the inner peripheral portion F2 of the lower surface of the substrate S1 from below. Afterwards, the arm 91 is withdrawn from the chamber 10 . In addition, when the substrate S1 is provided with the adhesive layer F, the adhesive layer F is on the lower side when the substrate S1 is carried into the chamber 10.

Subsequently, as shown in FIG. 9 , the control unit C lowers the lift pins 41 supporting the substrate S1 to move the substrate S1 to the plurality of support members 80 of the substrate support portion 20. ) (pin 81) (step S03). At this time, the lift pins 41 are lowered to a position below the plurality of support members 80 (that is, the lower surface of the substrate S1), and the substrate S1 is supported by the plurality of support members 80. With this configuration, the substrate S1 is not in contact with the lift pins 41 and is supported only by the plurality of support members 80 that contact the lower surface outer peripheral portion F1 from below. Additionally, the substrate S1 may be heated using the heater 22.

Subsequently, an alignment operation is performed on the substrate S1 (step S04). The alignment operation for the substrate S1 is performed by the alignment device 60, as will be described in detail later.

After the alignment operation, the control unit C lifts the substrate S1 upward by raising the lift pins 41 . Subsequently, the substrate S1 is held by the suction pad 32 (step S05).

Subsequently, the substrate S2 (lower substrate) is loaded into the chamber 10 (step S06). As shown in Fig. 10, the control unit C lowers the lift pin 41 to the height of the transfer of the substrate S2. Thereafter, the substrate S2 is brought into the chamber 10 by the arm 91 and placed above the lift pins 41 . The arm 91 attracts and holds the substrate S2 on its lower surface. After that, the control unit C lowers the arm 91 and passes the substrate S2 from the arm 91 to the lift pin 41. Afterwards, the arm 91 is withdrawn from the chamber 10 . Additionally, when the substrate S2 is brought into the chamber 10, the adhesive layer F is on the upper side.

Subsequently, the gate valve 12 is closed and the substrate is baked (step S07).

Subsequently, as shown in FIG. 11 , the lift pins 41 are lowered to place the substrate S2 on the substrate support portion 20 . The lift pins 41 are lowered to a position below the plurality of support members 80 to support the substrate S2 only with the plurality of support members 80. With this configuration, the substrate S2 is not in contact with the lift pins 41 and is supported by a plurality of support members 80 that contact the lower surface outer peripheral portion F1 from below. Thereafter, the substrate S2 may be heated by the heater 22 and the bake process may be performed in an open atmosphere, or the bake process may be performed in a vacuum atmosphere in the chamber 10.

Subsequently, an alignment operation is performed on the substrate S2 (step S08). The alignment operation here is performed by the alignment device 60, as described in step S04, as will be described in detail later. Accordingly, the substrate S1 and the substrate S2 are positioned at approximately the same position in plan view. At this time, the substrate S2 is supported on the lower surface outer peripheral portion F1 by a plurality of support members 80 . For this reason, in order to position the substrate S2, when the substrate S2 is moved within the plane along the lower surface of the substrate S2 by the alignment device 60, the plurality of support members 80 and the substrate ( Grazing occurs only between the lower surface of S1) and the outer peripheral portion F1. The alignment operation in step S08 is the same as the alignment operation in step S04.

Subsequently, as shown in FIG. 12, the control unit C raises the substrate S2 by raising the lift pins 41, so that the substrates S1 and S2 overlap (step S09). At this time, the suction pad 32 of the upper pressing part 30 is pressing the upper surface side of the substrate S1, and the substrate S2 is raised by the lift pin 41 and overlaps the substrate S1, thereby causing the substrate ( S1) and the substrate S2 overlap. That is, the suction pad 32 functions as a holding portion for holding the substrate S1 and has the function of pressing the upper surface of the substrate S1 by contacting the upper surface of the substrate S1. In step S09, the adhesive layer F of the substrate S1 and the adhesive layer F of the substrate S2 come into contact with each other, thereby overlapping the substrate S1 and S2. Additionally, the force with which the substrate S1 and S2 overlap is controlled by the force with which the lift pins 41 rise. Additionally, instead of raising the lift pin 41, the upper pressing portion 30 holding the substrate S1 may be lowered, or the lift pin 41 may be raised and the upper pressing portion 30 may be lowered.

Subsequently, the adsorption of the suction pad 32 to the substrate S1 is released (step S10). After overlapping the substrates S1 and S2, the control unit C releases the suction to the substrate S1 by the suction pad 32. The lift pins 41 are lowered to place the substrate S on which overlapping has been completed at the height for unloading. Through this process, the substrate S moves away from both the substrate support portion 20 and the upper pressing portion 30. Subsequently, the gate valve 12 is opened to take out the substrate S from the chamber 10 (step S11).

After raising the gate valve 12 to open the opening 11, the arm 91 of the transfer device 90 enters the inside of the chamber 10 from the opening 11 and is supported by the lift pin 41. The arm 91 is disposed below the substrate S. After that, the control unit C raises the arm 91 and adsorbs and holds the substrate S on the upper surface of the arm 91, thereby lifting the substrate S from the lift pin 41 to the arm 91. I hand it over. Additionally, the arm 91 may be in a form that holds the substrate S by placing it on the upper surface of the arm 91, rather than holding the substrate S by adsorbing it. Thereafter, the arm 91 is withdrawn from the chamber 10, and the substrate S is carried out of the chamber 10. After that, the control unit C closes the gate valve 12 and ends the series of processes.

<Alignment method>

Next, the alignment method related to the embodiment will be described. Fig. 13 is a flow chart showing an example of an alignment method related to the embodiment. This alignment method is executed, for example, by instructions from the control unit C in steps S04 and S08. 14 to 18 are process diagrams showing an example of the operation of the alignment device 60. In addition, in these process charts, the description is simplified to make it easier to understand the movement of each part.

Additionally, in step S04, an alignment operation is performed on the substrate S1 by the alignment device 60. In step S08, an alignment operation is performed on the substrate S2 by the alignment device 60. That is, the alignment method related to the present embodiment differs only in that in step S04, the substrate S1 is the alignment target, whereas in step S08, the alignment target is the substrate S2, and the alignment device 60 The movements are common. Hereinafter, description will be made according to the flow chart in FIG. 13.

At the start of steps S04 and S08, the substrates S1 and S2 are supported by a plurality of support members 80. As shown in Fig. 14, the control unit C drives the pin driving unit 68 to insert the notched pin 67 into the notch 99 of the substrates S1 and S2 (step S041). By inserting the notch pin 67 into the notch 99, movement (rotation) of the substrates S1 and S2 in the circumferential direction is regulated.

Subsequently, the control unit C drives the first block drive unit 64 based on the outer diameter dimensions of the substrates S1 and S2 acquired in advance, and as shown in FIG. 15, a pair of first blocks 61a ) is advanced inward in the radial direction of the substrates S1 and S2 and placed at a predetermined position based on the outer diameter dimensions of the substrates S1 and S2 (step S042). Depending on the positions of the substrates S1 and S2 at this time, the pair of first blocks 61a may not contact the substrates S1 and S2.

Subsequently, the control unit C drives the second block driving unit 65 to drive one of the pair of second blocks 62a to the radial inner side of the substrates S1 and S2, as shown in FIG. 16. is advanced to come into contact with the outer peripheral surface of the substrates S1 and S2 (step S043). One second block 62a advances to a predetermined position and presses the substrates S1 and S2 based on the outer diameter dimensions of the substrates S1 and S2 previously acquired by the control unit C. The substrates S1 and S2 include a second block 62a on one side that presses the substrates S1 and S2, and a first block opposing the second block 62a with the substrates S1 and S2 in between. (61a).

Subsequently, the control unit C drives the second block driving unit 65 to drive the other of the pair of second blocks 62a to the radial inner side of the substrates S1 and S2, as shown in FIG. 17. is advanced to come into contact with the outer peripheral surface of the substrates S1 and S2 (step S044). The other second block 62a advances to a predetermined position based on the outer diameter dimensions of the substrates S1 and S2 previously acquired by the control unit C and presses the substrates S1 and S2. As a result, the substrates S1 and S2 are sandwiched between a pair of second blocks 62a and a pair of first blocks 61a that press the substrates S1 and S2.

Thereafter, the control unit C drives the second block driving unit 65 to retract both of the pair of second blocks 62a to the radial outside of the substrates S1 and S2 (step S045 ). Subsequently, the control unit C drives the second block driving unit 65 to advance the other of the pair of second blocks 62a in the radial direction of the substrates S1 and S2, , S2) is brought into contact with the outer peripheral surface (step S046). In step S046, of the pair of second blocks 62a, the other second block 62a, which was brought into contact with the substrates S1 and S2 in step S044, is brought into contact with the substrates S1 and S2 first.

Subsequently, the control unit C drives the second block driving unit 65 to advance one of the pair of second blocks 62a in the radial direction of the substrates S1 and S2, thereby advancing the substrate S1 , S2) is brought into contact with the outer peripheral surface (step S047). In step S047, similarly to step S044 described above, the substrates S1 and S2 are inserted into the pair of second blocks 62a and the pair of first blocks 61a. As shown in steps S043 to S047, the second block 62a, which is brought into contact with the substrates S1 and S2 first, is changed to insert the substrates S1 and S2, thereby properly aligning the substrates S1 and S2. You can.

Afterwards, it is checked whether steps S043 to S047 have been repeated a preset number of times (step S048). If the number of times steps S043 to S047 are repeated does not reach the set number (No in step S048), the control unit C drives the second block driver 65 to drive the pair of second blocks 62a. Both sides are retracted to the outside of the substrates S1 and S2 in the radial direction (step S049). After retracting the pair of second blocks 62a, the process returns to step S043 and the processing from step S043 is repeated. If the number of times steps S043 to S047 are repeated reaches the set number (Yes in step S048), the process proceeds to step S050. That is, the control unit C drives the second block driving unit 65 to sequentially press the pair of second blocks 62a onto the outer periphery of the substrates S1 and S2, and The operation of retracting from the outer periphery is alternately repeated a set number of times. By this operation, the substrates S1 and S2 are appropriately aligned based on the pair of first blocks 61a fixed in positions based on the outer diameter dimensions of the substrates S1 and S2.

Subsequently, the control unit C drives the pin driving unit 68 to retract the notch pin 67 outward in the radial direction of the substrates S1 and S2 and retracts it from the notch 99 (step S050). Subsequently, the control unit C drives the second block driving unit 65 to retract the pair of second blocks 62a outward in the radial direction of the substrates S1 and S2, It is retreated from the outer peripheral surface of S2) (step S051). In step S051, for example, both of the pair of second blocks 62a are simultaneously retracted from the outer peripheral surfaces of the substrates S1 and S2.

Subsequently, the control unit C drives the first block driving unit 64 to retract the pair of first blocks 61a to the radial outer side of the substrates S1 and S2, It is retreated from the outer peripheral surface of S2) (step S052). In step S052, for example, both of the pair of first blocks 61a are simultaneously retracted from the outer peripheral surfaces of the substrates S1 and S2. When step S052 is executed, as shown in FIG. 18, the first block 61a and the second block 62a are separated from the substrates S1 and S2. Through this series of operations, the alignment operation in steps S04 and S08 is completed.

In this way, the alignment device 60 according to the present embodiment inserts the rotation regulating portion 63 into the notch 99 of the substrates S1 and S2 and connects the substrates S1 and S2 to a plurality of blocks ( 61a and 62a), it enters from the direction along the surfaces of the substrates S1 and S2. Therefore, alignment of the substrates S1 and S2 can be performed while restraining the rotation of the substrates S1 and S2. As a result, when aligning the substrates S1 and S2, positioning is performed in the circumferential direction of the substrates S1 and S2, and it becomes possible to overlap the substrates S1 and S2 with good quality.

Although the embodiments and modifications have been described above, the technical scope of the present invention is not limited to the above-described embodiments and modifications. It is clear to those skilled in the art that various changes or improvements can be made to the above-described embodiments and modifications. In addition, forms with such changes or improvements are also included in the technical scope of the present invention. One or more of the requirements described in the above-described embodiments and modifications may be omitted. Additionally, the requirements described in the above-described embodiments and modifications can be appropriately combined. Additionally, the execution order of each operation shown in the embodiments and modifications can be implemented in any order as long as the results of the previous operation are not used in the subsequent operation. Additionally, although the operations in the above-described embodiments are described using “first,” “next,” “continuing,” etc. for convenience, it is not essential to perform them in this order.

In addition, in the above-described embodiment, a form in which two substrates S1 and S2 are overlapped is explained as an example, but it is not limited to this form. For example, a form may be used in which another substrate is overlapped with the substrate S in which the substrate S1 and the substrate S2 are overlapped.

In addition, in the above-described embodiment, when positioning the substrate S2 by the alignment device 60, the substrate S1 is suction-held by the suction pad 32, but the present invention is not limited to this. The substrate S1 may be supported by a plurality of spacers disposed above the substrate support portion 20, with the outer peripheral portion of the substrate S1 inserted.

10···chamber
20···Substrate support part
30···Upper press part
41···Lift pin
60···Alignment device
61a...1st block
62a···2nd block
63···Rotation regulation department
64···First block driving unit
65···2nd block driving unit
66···elastic member
67···Notch pin
68···Pin driving part
69···Pin pressing member
99···Notch
100···Substrate overlapping device

Claims (18)

An alignment device for positioning a substrate with a notch formed on the outer periphery, comprising:
a substrate support portion for placing the substrate;
a rotation regulating portion inserted into the notch of the substrate placed on the substrate support portion;
An alignment device comprising a plurality of blocks inserted into the substrate placed on the substrate support portion from a direction along the surface of the substrate. According to claim 1,
An alignment device wherein the rotation regulating portion includes a notch pin insertable into the notch. According to claim 2,
The notch pin is provided to be able to advance and retreat in the radial direction of the substrate,
An alignment device comprising a pin driving unit that advances and retracts the notch pin in a radial direction of the substrate. According to claim 3,
An alignment device wherein the pin driving unit advances the notch pin in the radial direction of the substrate based on an outer diameter dimension of the substrate obtained in advance. According to claim 3 or 4,
An alignment device wherein the rotation regulation unit includes a pin pressing member that presses the notch pin toward a radial inside of the substrate. The method of claim 1 or 2,
The plurality of blocks include a pair of first blocks disposed on opposite sides of the rotation regulating portion with the substrate interposed therebetween, and a pair of first blocks disposed on opposite sides of the rotation regulating portion with the substrate interposed therebetween. An alignment device comprising a second block of According to claim 6,
The pair of first blocks are arranged at intervals in the circumferential direction of the substrate, and are provided on the substrate support portion to be able to advance and retreat in the radial direction of the substrate,
An alignment device comprising a first block driving unit that advances and retreats the pair of first blocks in a radial direction of the substrate. According to claim 6,
The pair of second blocks are arranged at intervals in the circumferential direction of the substrate away from the notch, and are provided in the substrate support portion to be able to advance and retreat in the radial direction of the substrate,
An alignment device comprising a second block drive unit that advances and retreats the pair of second blocks in a radial direction of the substrate. According to claim 8,
An alignment device wherein the pair of second blocks are arranged to be in contact with each other in a circumferential direction of the substrate with the notch therebetween. According to claim 8,
The second block driver advances the pair of second blocks while the pair of first blocks are in contact with the outer periphery of the substrate, and presses the pair of second blocks to the outer periphery of the substrate. Device. According to claim 10,
An alignment device wherein the second block drive unit presses one of the pair of second blocks against the outer periphery of the substrate and then presses the other of the pair of second blocks against the outer periphery of the substrate. According to claim 8,
An alignment device in which the second block driver alternately repeats an operation of pressing each of the pair of second blocks against the outer periphery of the substrate and an operation of retracting them from the outer periphery of the substrate a predetermined number of times. According to claim 8,
An alignment device wherein the second block driver includes an elastic member that elastically supports the pair of second blocks to press them toward the outer periphery of the substrate. According to claim 8,
An alignment device in which the first block, the second block, and the rotation regulating portion have a strong abutting force against the outer peripheral portion of the substrate in the order of the second block, the first block, and the notch pin that is the rotation regulating portion. . The alignment device according to claim 1,
Lift pins provided on the substrate support part to support and elevate the substrate;
a holding portion that receives and holds the substrate from the lift pin;
It has an upper pressing part disposed above the substrate support part,
A substrate overlapping device that overlaps the plurality of substrates positioned by the alignment device by inserting them into the substrate support portion or the lift pin and the upper pressing portion. According to claim 15,
A substrate overlapping device comprising a chamber accommodating the alignment device, the lift pin, the holding portion, and the upper pressing portion. An alignment method for positioning a substrate with a notch formed on the outer periphery, comprising:
Inserting a rotation regulation part into the notch to regulate the rotation of the substrate,
An alignment method comprising inserting a plurality of blocks into the substrate from a direction along a surface of the substrate. According to claim 17,
An alignment method comprising inserting the rotation regulating portion into the notch and then inserting the substrate into the plurality of blocks.