KR20230170529A - Camera module and electronic device comprisng same - Google Patents

Abstract

In one embodiment, an electronic device includes: a housing that forms the exterior of the electronic device; and a camera module, at least a portion of which is disposed inside the housing, wherein the camera module includes: a fixing part fixedly disposed on the electronic device; A moving part connected to a lens or image sensor; and an actuator including a magnet unit and a coil unit disposed to face each other to move the moving part relative to the fixed part, wherein the coil unit includes a first coil having a first cross-sectional area. coil layer; And it may include a second coil layer that is located relatively farther from the magnet unit than the first coil layer and includes a coil having a second cross-sectional area that is larger than the first cross-sectional area. In addition, various embodiments are possible.

Description

Camera module and electronic device including the same {CAMERA MODULE AND ELECTRONIC DEVICE COMPRISNG SAME}

Various embodiments of this document relate to camera modules and electronic devices including the same.

An electronic device including a camera may provide a shooting function. For example, the electronic device can output an image obtained from a camera to a display and acquire a captured image from the camera while the shutter operates.

In order to implement an autofocus function and/or an image stabilization function, the camera module is provided with an actuator that adjusts the position of the lens or image sensor. For example, the actuator is a voice coil motor using electromagnetic force and may include a magnet and a coil. Thrust can be generated when current flows through the coil within the magnetic field generated by the magnet. Meanwhile, in order to stably implement the autofocus function and/or image stabilization function, an actuator with improved thrust may be required.

According to various embodiments, a camera module with improved thrust generated from an actuator and an electronic device including the same can be provided.

In one embodiment, the electronic device 301 includes a housing 310 that forms the exterior of the electronic device 301, and a camera module 400 at least partially disposed inside the housing 310, The camera module 400 includes a fixed part 430 fixedly disposed on the electronic device 301, a moving part 440 connected to a lens or an image sensor, and a moving part with respect to the fixed part 430. In order to relatively move 440, it includes an actuator 500 including a magnet unit 510 and a coil unit 520 arranged to face each other, and the coil unit 520 has a first cross-sectional area (S ₁ ), a first coil layer 521 including a coil having a coil, and a first coil layer 521 that is located relatively farther from the magnet unit 510 than the first coil layer 521 and is larger than the first cross-sectional area (S ₁ ). It may include a second coil layer 522 including a coil having a cross-sectional area (S ₂ ) of 2.

In one embodiment, the camera module 400 disposed in the electronic device 301 includes a fixed part 430 fixedly disposed in the electronic device 301, a moving part 440 including a lens or an image sensor, and an actuator 500 including a magnet unit 510 and a coil unit 520 arranged to face each other in order to move the movable part 440 relative to the fixed part 430, The coil unit 520 is located relatively farther from the magnet unit 510 than the first coil layer 521, which includes a coil having a first cross-sectional area (S ₁ ), and the first coil layer 521, It may include a second coil layer 522 including a coil having a second cross-sectional area (S ₂ ) that is larger than the first cross-sectional area (S ₁ ).

In one embodiment, the electronic device 301 includes a housing 310 that forms the exterior of the electronic device 301, and a camera module 400 at least partially disposed inside the housing 310, The camera module 400 includes a fixed part 430 fixedly disposed on the electronic device 301, a moving part 440 connected to a lens or an image sensor, and a moving part with respect to the fixed part 430. In order to relatively move 440, it includes an actuator 500 including a magnet unit 510 and a coil unit 520 arranged to face each other, and the coil unit 520 is a plurality of coils stacked on each other. Comprising layers 521 and 522, each of the plurality of coil layers 521 and 522 includes a printed circuit board 5211 and 5221 and a coil pattern 5212 and 5222 formed on the printed circuit board 5211 and 5221. ), and as the distance between the plurality of coil layers 521 and 522 increases from the magnet unit 510, the cross-sectional areas (S ₁ and S ₂ ) of the coil patterns (5212 and 5222) increase or are at least the same. can be formed.

The actuator of the camera module according to various embodiments can increase the total thrust generated by the actuator by increasing the current density in the portion where the magnetic field of the magnet is relatively strong.

The actuator of the camera module according to various embodiments can minimize the increase in resistance of the entire coil by reducing the current density in the area where the magnetic field of the magnet is relatively weak.

The effects of the camera module and the electronic device including the same according to various embodiments are not limited to those mentioned above, and other effects not mentioned may be clearly understood by those skilled in the art from the description below.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.
2 is a block diagram illustrating a camera module, according to various embodiments.
3A is a front perspective view of an electronic device according to various embodiments of the present disclosure.
3B is a rear perspective view of an electronic device according to various embodiments of the present invention.
Figure 4a is a perspective view of a camera module according to one embodiment.
Figure 4b is an exploded perspective view of a camera module according to one embodiment.
Figure 5 is a schematic cross-sectional view of an actuator according to a comparative example.
Figure 6 is a schematic cross-sectional view of an actuator according to one embodiment.
Figure 7 is a schematic cross-sectional view of an actuator according to one embodiment.
8 is a schematic front view of an actuator according to one embodiment.

Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the accompanying drawings, identical components will be assigned the same reference numerals regardless of the reference numerals, and overlapping descriptions thereof will be omitted.

FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Figure 2 is a block diagram 200 illustrating a camera module 180, according to various embodiments. Referring to FIG. 2, the camera module 180 includes a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (e.g., buffer memory), or an image signal processor. It may include (260). The lens assembly 210 may collect light emitted from a subject that is the target of image capture. Lens assembly 210 may include one or more lenses. According to one embodiment, the camera module 180 may include a plurality of lens assemblies 210. In this case, the camera module 180 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 have the same lens properties (e.g., angle of view, focal length, autofocus, f number, or optical zoom), or at least one lens assembly is different from another lens assembly. It may have one or more lens properties that are different from the lens properties of . The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 220 may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash 220 may include one or more light emitting diodes (eg, red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to one embodiment, the image sensor 230 is one image sensor selected from among image sensors with different properties, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, and the same It may include a plurality of image sensors having different properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 240 moves at least one lens or image sensor 230 included in the lens assembly 210 in a specific direction in response to the movement of the camera module 180 or the electronic device 101 including the same. The operating characteristics of the image sensor 230 can be controlled (e.g., adjusting read-out timing, etc.). This allows to compensate for at least some of the negative effects of said movement on the image being captured. According to one embodiment, the image stabilizer 240 is a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180. It is possible to detect such movement of the camera module 180 or the electronic device 101 using . According to one embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer. The memory 250 may at least temporarily store at least a portion of the image acquired through the image sensor 230 for the next image processing task. For example, when image acquisition is delayed due to the shutter or when multiple images are acquired at high speed, the acquired original image (e.g., Bayer-patterned image or high-resolution image) is stored in the memory 250. , the corresponding copy image (e.g., low resolution image) may be previewed through the display module 160. Thereafter, when a specified condition is satisfied (eg, user input or system command), at least a portion of the original image stored in the memory 250 may be obtained and processed, for example, by the image signal processor 260. According to one embodiment, the memory 250 may be configured as at least part of the memory 130 or as a separate memory that operates independently.

The image signal processor 260 may perform one or more image processes on an image acquired through the image sensor 230 or an image stored in the memory 250. The one or more image processes may include, for example, depth map creation, three-dimensional modeling, panorama creation, feature point extraction, image compositing, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring). may include blurring, sharpening, or softening. Additionally or alternatively, the image signal processor 260 may include at least one of the components included in the camera module 180 (e.g., an image sensor). (230)) may perform control (e.g., exposure time control, read-out timing control, etc.). The image processed by the image signal processor 260 is stored back in the memory 250 for further processing. or may be provided as an external component of the camera module 180 (e.g., memory 130, display module 160, electronic device 102, electronic device 104, or server 108). According to an example, the image signal processor 260 may be configured as at least a part of the processor 120, or may be configured as a separate processor that operates independently of the processor 120. The image signal processor 260 may be configured as the processor 120. When configured as a separate processor, at least one image processed by the image signal processor 260 may be displayed through the display module 160 as is or after additional image processing by the processor 120.

According to one embodiment, the electronic device 101 may include a plurality of camera modules 180, each with different properties or functions. In this case, for example, at least one of the plurality of camera modules 180 may be a wide-angle camera, and at least another one may be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 may be a front camera, and at least another one may be a rear camera.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. . According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

FIG. 3A is a front perspective view of an electronic device according to various embodiments, and FIG. 3B is a rear perspective view of an electronic device according to various embodiments.

3A and 3B, the electronic device 301 (e.g., the electronic device 101 of FIG. 1) according to an embodiment includes a housing 310 and a display 330 (e.g., the display module of FIG. 1). (160)) and camera modules 400a and 400b (eg, camera module 180 of FIG. 1).

In one embodiment, the housing 310 may form the exterior of the electronic device 301. Housing 310 has a front 310a (e.g., first side), a back side 310b (e.g., second side), and a side 310c surrounding the interior space between the front 310a and the back 310b. (e.g. third side) can be formed. For example, the housing 310 may include a first plate 311 (e.g., a front plate), a second plate 312 (e.g., a rear plate), and a side member 313 (e.g., a side bezel structure). You can.

In one embodiment, the front surface 310a may be formed at least in part by the first plate 311 that is substantially transparent. For example, the first plate 311 may include a glass plate or a polymer plate including at least one coating layer. In one embodiment, the rear surface 310b may be formed by a second plate 312 that is substantially opaque. For example, the second plate 312 may be formed of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel, or magnesium), or a combination thereof. The side 310c is combined with the first plate 311 and the second plate 312 and may be formed by a side member 313 including metal and/or polymer. In one embodiment, the second plate 312 and the side member 313 may be formed seamlessly. In one embodiment, the second plate 312 and the side member 313 may be formed of substantially the same material (eg, aluminum).

In one embodiment, the side member 313 may surround at least a portion of the internal space between the front side 310a and the back side 310b. A support member (not shown) may be disposed in the internal space of the housing 310. For example, the support member may be connected to the side member 313 or may be formed integrally with the side member 313. The support member may form a space for arranging components of the electronic device 301. For example, the display 330 and/or the camera modules 400a and 400b may be fixedly connected to the support member.

In one embodiment, the electronic device 301 may include a display 330 (eg, display module 160 of FIG. 1). In one embodiment, the display 330 may be located on the front surface 310a. In one embodiment, the display 330 may be visible through at least a portion of the first plate 311. In one embodiment, the display 330 may have a shape that is substantially the same as the outer edge shape of the first plate 311. In some embodiments, an edge of the display 330 may substantially coincide with an outer edge of the first plate 311 .

In one embodiment, at least a portion of the camera modules 400a and 400b may be disposed inside the housing 310. The camera modules 400a and 400b may be arranged to be visually exposed through the front 310a and/or rear 310b of the housing 310. In one embodiment, the camera modules 400a and 400b are the rear surface of at least one of the front surface 310a and/or the rear surface 310b of the housing 310 (e.g., a surface facing the -z and/or +z directions). ), it may be arranged to face at least one of the front side (310a) and/or the back side (310b). For example, the camera modules 400a and 400b may not be visually exposed and may include a hidden under display camera (UDC). The camera modules 400a and 400b shown in FIGS. 3A and 3B are exemplary, and the location, size and/or number of the camera modules 400a and 400b are not limited thereto.

Figure 4a is a perspective view of a camera module according to one embodiment. Figure 4b is an exploded perspective view of a camera module according to one embodiment.

Referring to FIGS. 4A and 4B, the camera module 400 (e.g., the camera module 180 of FIG. 1) according to one embodiment includes a lens assembly 410 (e.g., the lens assembly 210 of FIG. 2). , sensor assembly 420, fixed part 430, moving part 440, actuator 500 (e.g., image stabilizer 240 in FIG. 2), printed circuit board 461, flexible printed circuit board 462. , may include a middle guide 485 and a stopper frame 486.

In one embodiment, the lens assembly 410 may include a lens 411 and a lens barrel 412. The lens 411 may have an optical axis (OA). At least one lens 411 may be provided. The lens barrel 412 may at least partially surround the lens 411.

In one embodiment, the sensor assembly 420 may include a circuit board 421 and an image sensor 422 (eg, image sensor 230 of FIG. 2). Image sensor 422 may be located on circuit board 421. The image sensor 422 may be positioned to be substantially aligned with the optical axis OA of the lens 411.

In one embodiment, the fixing part 430 may be a component of the camera module 400 whose position is relatively fixed. For example, the fixing part 430 may be fixedly disposed on an electronic device (eg, the electronic device 301 in FIG. 3A). The fixing part 430 may include a first camera housing 431 and a second camera housing 432. The first camera housing 431 may provide a space where various components are placed. For example, the first camera housing 431 includes a lens assembly 410, a sensor assembly 420, a moving part 440, an actuator 500, a printed circuit board 461, a flexible printed circuit board 462, The middle guide 485 and/or the stopper frame 486 may be at least partially accommodated. The second camera housing 432 may be configured to at least partially surround the first camera housing 431. The second camera housing 432 may be formed of any suitable material to have a shielding function.

In one embodiment, the moving part 440 may be a component of the camera module 400 whose position is relatively moved. For example, the moving part 440 may be moved relative to the fixed part 430. In one embodiment, the lens assembly 410 (at least the lens 411) may be connected to the moving part 440, and the sensor assembly 420 (at least the image sensor 422) may be connected to the fixed part 430. . For example, the moving part 440 may include a first carrier 441 and a second carrier 442. The first carrier 441 and/or the second carrier 442 carry the lens 411 and the lens barrel 412 and may be located inside the first camera housing 431. For example, the first carrier 441 may be movable at least relative to the first camera housing 431, and the second carrier 442 may be movable at least relative to the first carrier 441. However, this is an example, and the connection relationship of the moving parts 440 is not limited to this. For example, the sensor assembly 420 (at least the image sensor 422) may be connected to the moving part 440, and the lens assembly 410 (at least the lens 411) may be connected to the fixed part 430.

In one embodiment, the actuator 500 may move the moving part 440 relative to the fixed part 430. At least one actuator 500 may be provided. For example, the actuator 500 may include a first actuator 500a, a second actuator 500b, and a third actuator 500c. For example, the first actuator 500a, the second actuator 500b, and the third actuator 500c may implement movement in the z direction, x direction, and y direction, respectively. However, this is an example, and the number and/or movement direction of the actuators 500 are not limited thereto. For example, the first actuator 500a, the second actuator 500b, and the third actuator 500c may implement movement in the z direction, y direction, and x direction, respectively.

In one embodiment, each actuator 500a, 500b, and 500c may include magnet units 510a, 510b, and 510c and coil units 520a, 520b, and 520c. Each of the magnet units 510a, 510b, and 510c may be disposed to face the corresponding coil units 520a, 520b, and 520c and be electromagnetically coupled to them. The magnet units 510a, 510b, and 510c and the coil units 520a, 520b, and 520c may generate electromagnetic force (eg, Lorentz force) by electromagnetic coupling.

In one embodiment, each magnet unit 510a, 510b, and 510c may be placed directly or indirectly on the moving part 440. For example, the first magnet unit 510a may be located on one surface (eg, +y direction surface) of the first carrier 441. The second magnet unit 510b may be located on one surface (eg, +x direction surface) of the second carrier 442. The third magnet unit 510c may be located on the other surface (eg, -y direction surface) of the second carrier 442.

In one embodiment, each coil unit 520a, 520b, and 520c may be placed directly or indirectly on the fixing part 430. For example, each coil unit 520a, 520b, and 520c may be disposed along the inner side of the flexible printed circuit board 462 connected to the fixing part 430. For example, the first coil unit 520a is disposed on the first side (e.g., the inner side oriented in the +y direction) of the flexible printed circuit board 462 to face the first magnet unit 510a, 1 may be electromagnetically coupled to the magnet unit 510a. The second coil unit 520b is disposed on the second side (e.g., the inner side oriented in the +x direction) of the flexible printed circuit board 462 to face the second magnet unit 510b, forming a second magnet unit ( 510b) and may be electromagnetically coupled. The third coil unit 520c is disposed on the third side (e.g., the inner side oriented in the -y direction) of the flexible printed circuit board 462 to face the third magnet unit 510c, forming a third magnet unit ( 510c) and may be electromagnetically coupled. However, this is an example, and the number and/or arrangement of the magnet units 510a, 510b, and 510c and the coil units 520a, 520b, and 520c are not limited thereto. For example, the magnet units 510a, 510b, and 510c may be placed directly or indirectly on the fixed part 430, and the coil units 520a, 520b, and 520c may be placed directly or indirectly on the moving part 440.

In one embodiment, printed circuit board 461 may be configured to connect circuit board 421 and/or other components. For example, the camera module 400 may be electrically connected to an electronic device (eg, the electronic device 301 of FIG. 3A) through the printed circuit board 461.

In one embodiment, the flexible printed circuit board 462 may be arranged to surround at least a portion (eg, a plurality of side surfaces) of the first carrier 441. The flexible printed circuit board 462 is connected to the fixing part 430 so that its position can be relatively fixed. The flexible printed circuit board 462 may supply current to the coil units 520a, 520b, and 520c.

In one embodiment, the middle guide 485 may be located between the first carrier 441 and the second carrier 442. The middle guide 485 may guide relative movement between the first carrier 441 and the second carrier 442 (eg, a ball guide).

In one embodiment, the stopper frame 486 may be configured to limit movement of the first carrier 441 and the second carrier 442 in one direction (eg, z-direction).

Figure 5 is a schematic cross-sectional view of an actuator according to a comparative example. Figure 5 is schematically shown for convenience of explanation, and does not limit the location, size, and/or number of each component.

Referring to FIG. 5 , the actuator 900 according to the comparative example may include a magnet unit 910 and a coil unit 920. The magnet unit 910 and the coil unit 920 may be arranged to face each other. For example, at least a portion (Ba) of the magnetic field B generated in the magnet unit 910 is formed in a direction (e.g., +y direction) from the first pole 911 toward the coil unit 920, and is formed at least The portion Bb may be formed in a direction (eg, -y direction) from the coil unit 920 to the second pole 912. Current may flow in the coil unit 920 at least in a direction substantially perpendicular to the magnetic field B (eg, +/-x direction). The magnet unit 910 and the coil unit 920 may be electromagnetically coupled to each other to generate electromagnetic force (eg, Lorentz force). The force generated between the magnet unit 910 and the coil unit 920 is It can be calculated as Here, B may mean the size of the magnetic field, I may mean the size of the current, L may mean the length of the coil perpendicular to the magnetic field, and n may mean the number of turns of the coil.

In a comparative example, because the coil unit 920 has a thickness (e.g., y-direction thickness) with respect to the direction (e.g., y-direction) of the magnetic field (B), some areas (A ₁ ) are relatively magnetic unit 910. is closer to, and the other area (A ₂ ) may be located relatively further away from the magnet unit 910. For convenience of explanation, as shown in FIG. 5 , the half area relatively close to the magnet unit 910 is referred to as the first area (A ₁ ), and the remaining half area is referred to as the second area (A ₂ ). For example, at least some coils of the coil unit 920 may be disposed in the first area A ₁ , and some remaining coils of the coil unit 920 may be disposed in the second area A ₂ . If the distance from the magnet unit 910 to the first area (A ₁ ) is D ₁ and the distance from the magnet unit 910 to the second area (A ₂ ) is D ₂ , It can be expressed as Here, d may be the center distance between the first area (A ₁ ) and the second area (A ₂ ). Meanwhile, since the size of the magnetic field is inversely proportional to the square of the distance, the size of the magnetic field B generated in the magnet unit 910 may be different in the first area A ₁ and the second area A ₂ . If the size of the magnetic field (B) in the first area (A ₁ ) is B ₁ , B ₁ is inversely proportional to the square of D ₁ (i.e. ). If the size of the magnetic field (B) in the second area (A ₂ ) is B ₂ , B ₂ is inversely proportional to the square of D ₂ (i.e. ).

In a comparative example, the coil unit 920 may have a form in which coils having the same cross-sectional area (S) are repeatedly wound or disposed. The number of coil turns (n) in the first area (A ₁ ) and the second area (A ₂ ) may be the same. The length L of the coil substantially perpendicular to the magnetic field B in the first area A ₁ and the second area A ₂ may be the same. Since the number of turns (n) and cross-sectional area (S) of the coil in the first area (A ₁ ) and the second area (A ₂ ) are all the same, the coil in the first area (A ₁ ) and the second area (A ₂ ) The resistances (R) may be equal to each other. The overall resistance R _t of the coil unit 920 may be 2R, which is the sum of the coil resistances in the first area A ₁ and the second area A ₂ . The available current (I _max ) that can be applied to the coil unit 920 can be calculated as V/2R. This is summarized in [Table 1] below.

division distance cross-sectional area number of turns resistance available current First area (A ₁ ) D ₁ S n R I _max =V/2R Second area (A ₂ ) D ₁ +d S n R Coil unit (920) - - - 2R

The length of the coil substantially perpendicular to the magnetic field B in the first area A ₁ and the second area A ₂ is equal to L, and in the first area A ₁ and the second area A ₂ Assuming that the applied current is the same as I, the forces (F ₁ and F ₂ ) generated in the first area (A ₁ ) and the second area (A ₂ ), respectively, are calculated as follows.

When referring to the above formula, due to the difference in distance from the magnet unit 910, _the force (F 1 ) generated in the first area (A ₁ ) is the force (F ₂ ) generated in the second area (A ₂ ). You can see something bigger. The force F generated throughout the coil unit 920 may be calculated as the sum of F ₁ and F ₂ .

Figure 6 is a schematic cross-sectional view of an actuator according to one embodiment. Figure 6 is schematically shown for convenience of explanation and does not limit the location, size, and/or number of each component.

Referring to FIG. 6, the actuator 500 (e.g., the actuator 500 in FIG. 4b) according to an embodiment includes a magnet unit 510 (e.g., magnet units 510a, 510b, and 510c in FIG. 4b) and a coil. It may include a unit 520 (eg, coil units 520a, 520b, and 520c in FIG. 4B). The magnet unit 510 and the coil unit 520 may be disposed to face each other and be electromagnetically coupled to each other.

In one embodiment, magnet unit 510 may include a permanent magnet. For example, the first pole 511 and the second pole 512 of the magnet unit 510 may be disposed along the z-direction. At least a portion (Ba) of the magnetic field (B) generated in the magnet unit 510 is formed in a direction (e.g., +y direction) from the first pole 511 toward the coil unit 520, and at least a portion (Bb) may be formed in a direction (eg, -y direction) from the coil unit 520 to the second pole 512. Meanwhile, this is an example, and the pole direction of the magnet unit 510 may be arranged in various ways depending on the type of actuator 500. For example, like the second magnet unit 510b or the third magnet unit 510c in Figure 4b, the first pole 511 and the second pole 512 of the magnet unit 510 are in a substantially horizontal direction ( It may also be placed along (e.g. y-direction or x-direction). Even when the first pole 511 and the second pole 512 of the magnet unit 510 are arranged in a substantially horizontal direction (e.g., y-direction or x-direction), the structure described through FIG. 6 can be applied equally. It will be readily understood by those skilled in the art that this is possible.

In one embodiment, current may flow in the coil unit 520 at least in a direction substantially perpendicular to the magnetic field B (eg, +/-x direction). The magnet unit 510 and the coil unit 520 may be electromagnetically coupled to each other to generate electromagnetic force (eg, Lorentz force).

In one embodiment, the coil unit 520 may have a coil that is repeatedly wound or disposed. For example, coil unit 520 may be a wound coil or a coil printed on a printed circuit board. Hereinafter, for convenience of explanation, the description will be based on the case where the coil unit 520 is a coil printed on a printed circuit board. In the drawings attached to this document, the coil is shown as having a rectangular cross-section, but this is for convenience of explanation and schematics. The cross-sectional shape of the coil is not limited thereto, and the cross-section of the coil may be formed in various ways. For example, the cross-section of the coil may be circular, oval, or polygonal.

In one embodiment, the coil unit 520 may include a plurality of coil layers 521 and 522. For example, the coil unit 520 may include a first coil layer 521 and a second coil layer 522. The first coil layer 521 and the second coil layer 522 may be stacked to be electrically connected to each other. The first coil layer 521 may be located relatively close to the magnet unit 510, and the second coil layer 522 may be located relatively farther from the magnet unit 510 than the first coil layer 521. However, this is an example, and the number of coil layers included in the coil unit 520 is not limited thereto.

In one embodiment, the first coil layer 521 may include a first printed circuit board 5211 and a first coil pattern 5212. For example, based on FIG. 6 , the first printed circuit board 5211 may be disposed along the xz plane. The first coil pattern 5212 may be formed by printing in a coil shape on the first printed circuit board 5211. The first coil pattern 5212 may be formed to have a first cross-sectional area (S ₁ ).

In one embodiment, the second coil layer 522 may include a second printed circuit board 5221 and a second coil pattern 5222. For example, based on FIG. 6 , the second printed circuit board 5221 may be disposed along the xz plane. The second coil pattern 5222 may be formed by printing in a coil shape on the second printed circuit board 5221. The second coil pattern 5222 may be formed to have a second cross-sectional area (S ₂ ). The second coil pattern 5222 may be electrically connected to the first coil pattern 5212. For example, the second coil pattern 5222 may be electrically connected to the first coil pattern 5212 through a via.

In one embodiment, the cross-sectional area S ₂ of the second coil pattern 5222 may be larger than the cross-sectional area S ₁ of the first coil pattern 5212 . That is, the second cross-sectional area (S ₂ ) may be larger than the first cross-sectional area (S ₁ ). For example, the coil of the first coil pattern 5212 has a first width (w ₁ ) and a first height (h ₁ ), and the coil of the second coil pattern 5222 has a second width (w ₂ ) and a first height (h 1 ). Assuming that it has a second height (h ₂ ), the second width (w ₂ ) is larger than the first width (w ₁ ), and the first height (h ₁ ) and the second height (h ₂ ) are substantially the same. can do. In this case, the first height (h ₁ ) and the second height (h ₂ ) may be the maximum height at which the coil patterns 5212 and 5222 can be formed on the printed circuit boards 5211 and 5221. However, this is an example, and the size relationship between the coil width (w ₁ , w ₂ ) and/or coil height (h ₁ , h ₂ ) of the first coil pattern 5212 and/or the second coil pattern 5222 is It is not limited to this. For example, the size relationship between the coil width (w ₁ , w ₂ ) and/or coil height (h ₁ , h ₂ ) of the first coil pattern 5212 and/or the second coil pattern 5222 is that of the second coil The cross-sectional area (S ₂ ) of the pattern 5222 may be set in various ways within a range such that it is larger than the cross-sectional area (S ₁ ) of the first coil pattern 5212 . Meanwhile, the cross-sectional area of the coil shown in the drawing is exaggerated for convenience of explanation and illustration, so it should be noted that the cross-sectional area of the coil is not limited by the drawing. For example, the height (h ₁ ) of the first coil pattern 5212 may be approximately 35 um. For example, the pitch (w ₁ + g ₁ -) between two adjacent first coil patterns 5212 may be approximately 22 um.

In one embodiment, when the sizes of the first printed circuit board 5211 and the second printed circuit board 5212 are substantially the same, the cross-sectional area (S ₂ ) of the second coil pattern 5222 is equal to that of the first coil pattern. Since the cross-sectional area (S ₁ ) of 5212 is larger, the number of coil turns (n ₁ ) of the first coil layer 521 may be greater than the number of coil turns (n ₂ ) of the second coil layer 522. For example, as shown in FIG. 6, since the cross-sectional area (S ₂ ) of the second coil pattern 5222 is four times larger than the cross-sectional area (S ₁ ) of the first coil pattern 5212, the The number of coil turns (n ₁ ) may be four times greater than the number of coil turns (n ₂ ) of the second coil layer 522. For example, the coil spacing (g ₁ ) of the first coil pattern 5212 may be substantially equal to the coil spacing (g ₂ ) of the second coil pattern 5222. In this case, each coil spacing (g ₁ , g ₂ ) may be the minimum spacing that can form the coil patterns 5212 and 5222 most densely on the printed circuit boards 5211 and 5221. However, this is an example, and the size relationship between the coil spacing (g ₁ , g ₂ ) of the first coil pattern 5212 and/or the second coil pattern 5222 is not limited thereto. For example, the size relationship between the coil spacing (g ₁ , g ₂ ) of the first coil pattern 5212 and/or the second coil pattern 5222 is the number of coil turns (n ₁ ) of the first coil layer 521. It can be set in various ways within a range that is greater than the number of coil turns (n ₂ ) of the second coil layer 522. Meanwhile, the number of coil turns shown in the drawings is exaggerated for convenience of explanation and illustration, so it should be noted that the number of coil turns is not limited by the drawings.

Hereinafter, the thrust (F') generated by the actuator 500 according to the embodiment of FIG. 6 will be compared with the thrust (F) generated by the actuator 900 according to the comparative example of FIG. 5.

The distance (D ₁ ) between the magnet unit 510 and the first coil layer 521 in _FIG . 6 is the same as the distance (D 1 ) between the magnet unit 910 and the first area (A ₁ ) in FIG. 5 Let's assume. It is assumed that the cross-sectional area (S ₁ ) of the first coil pattern 5212 in FIG. 6 is half of the coil cross-sectional area (S) of the first area (A ₁ ) in FIG. 5 . As the cross-sectional area is reduced by half, the number of coil turns (n ₁ ) in the first coil layer 521 of FIG. 6 may be twice the number of coil turns (n) in the first area (A ₁ ) of FIG. 5 . Since the size of resistance is proportional to the length and inversely proportional to the cross-sectional area, the coil resistance (R ₁ ) of the first coil layer 521 of FIG. 6 is 4 times the coil resistance (R) of the first area (A ₁ ) of FIG. 5 It could be a boat.

The distance (D _{2 ) between the magnet unit 510 and the second coil layer 522 in FIG. 6 is the same as the distance (D 2 )} between the magnet unit 910 and the second area (A ₂ ) in FIG. 5 Let's assume. It is assumed that the cross-sectional area (S ₂ ) of the second coil pattern 5222 in FIG. 6 is twice the coil cross-sectional area (S) of the second area (A ₂ ) in FIG. 5 . As the cross-sectional area increases by two times, the number of coil turns (n ₂ ) in the second coil layer 522 of FIG. 6 may be half of the number of coil turns (n) in the second area (A ₂ ) of FIG. 5 . Since the size of resistance is proportional to the length and inversely proportional to the cross-sectional area, the coil resistance (R ₂ ) of the second coil layer 522 of FIG. 6 is 1 of the coil resistance (R) of the second area (A ₂ ) of FIG. 5 /Can be 4 times.

In one embodiment according to FIG. 6 , the resistance (R _t ') of the entire coil unit 520 may be 4.25R, which is the sum of the coil resistances in the first coil layer 521 and the second coil layer 522. The maximum current (I' _max ) that can be applied to the coil unit 520 can be calculated as V/4.25R. This is summarized in [Table 2] below.

division distance cross-sectional area number of turns resistance available current First coil layer 521 D ₁ S/2 2n 4R I' _max =V/4.25R Second coil layer 522 D ₁ +d 2S n/2 R/4 Coil Unit(520) - - - 4.25R

In the first coil layer 521 and the second coil layer 522, the length of the coil substantially perpendicular to the magnetic field (B) is equal to L, and the length of the coil in the first coil layer 521 and the second coil layer 522 is L. Assuming that the applied current is equal to I, the forces (F ₁ ', F ₂ ') generated in the first coil layer 521 and the second coil layer 522, respectively, are calculated as follows.

Referring to the above formula, the force (F ₁ ') generated in the first coil layer 521 of FIG. 6 is twice as large as the force (F ₁ ) generated in the first area (A ₁ ) of FIG. 5, and It can be seen that the force (F ₂ ') generated in the second coil layer 522 in Figure 6 is reduced by half compared to the force (F ₂ ) generated in the second area (A ₂ ) in Figure 5. The force F' generated throughout the coil unit 520 of FIG. 6 can be calculated as the sum of F1' and F2'.

Referring to the above equation, it can be seen that the thrust is concentrated on the first coil layer 521. The size (B 1 ) of the magnetic field applied to the first coil layer 521 or the first area (A ₁ ) is the size (B ₂ ) of the magnetic field applied to the second coil layer 522 or the second area (A _{2 )} . ), since the size of the force (F ₁ ') applied to the first coil layer 521 is doubled, the size of the force (F ₂ ') applied to the second coil layer 522 is halved. It may have a greater effect on the force (F') applied to the entire coil unit 520 than that of the coil unit 520. Accordingly, the thrust F' generated by the actuator 500 of FIG. 6 may be increased than the thrust F generated by the actuator 900 of FIG. 5. For example, as the coil unit 520 becomes thicker (i.e., as d becomes larger), the thrust (F') generated by the actuator 500 of FIG. 6 increases with the thrust (F') generated by the actuator 900 of FIG. 5. It can be increased further than F). Additionally, as the thrust (F') generated by the actuator 500 increases, the current consumed when driving the actuator 500 can be reduced.

Meanwhile, as the coil cross-sectional area (S ₁ ) in the first coil layer 521 is reduced and the number of coil turns (n ₁ ) is increased, the coil resistance (R ₁ ) in the first coil layer 521 increases. Therefore, in order to compensate for the significant decrease in available current (I' _max ) due to a significant increase in the total resistance (R _t ') of the coil unit 520, the coil cross-sectional area (S ₂ ) is increased in the second coil layer 522. and the number of coil turns (n ₂ ) can be reduced. According to this configuration, the coil resistance (R ₂ ) is relatively reduced in the second coil layer 522, and thus the overall resistance (R _t ') of the coil unit 520 can be prevented from excessively increasing.

In one embodiment, the coil of the first coil layer 521 may be formed of a material with a lower resistance coefficient than the coil of the second coil layer 522. For example, the coil of the first coil layer 521 may be formed of an ultra-high conductive material (eg, gold), and the coil of the second coil layer 522 may be formed of a highly conductive material (eg, copper). According to this configuration, even if the coil cross-sectional area (S ₁ ) is reduced and the number of coil turns (n ₁ ) is increased in the first coil layer 521, the coil resistance (R ₁ ) is increased in the first coil layer 521. It can be minimized.

Figure 7 is a schematic cross-sectional view of an actuator according to one embodiment. Figure 7 is schematically shown for convenience of explanation and does not limit the location, size, and/or number of each component.

Referring to FIG. 7, the actuator 600 (e.g., the actuator 500 in FIG. 4b) according to an embodiment includes a magnet unit 610 (e.g., magnet units 510a, 510b, and 510c in FIG. 4b) and a coil. It may include a unit 620 (e.g., coil units 520a, 520b, and 520c in FIG. 4B).

In one embodiment, magnet unit 610 may include a permanent magnet. For example, the first pole 611 and the second pole 612 of the magnet unit 610 may be disposed along the z-direction. At least a portion (Ba) of the magnetic field (B) generated in the magnet unit 610 is formed in a direction (e.g., +y direction) from the first pole 611 toward the coil unit 620, and at least a portion (Bb) may be formed in a direction (eg, -y direction) from the coil unit 620 to the second pole 612. Meanwhile, this is an example, and the pole direction of the magnet unit 610 may be arranged in various ways depending on the type of actuator 600. For example, like the second magnet unit 510b or the third magnet unit 510c in Figure 4b, the first pole 611 and the second pole 612 of the magnet unit 610 are in a substantially horizontal direction ( It may also be placed along (e.g. y-direction or x-direction). Even when the first pole 611 and the second pole 612 of the magnet unit 610 are arranged in a substantially horizontal direction (e.g., y-direction or x-direction), the structure described through FIG. 7 can be applied in the same way. It will be readily understood by those skilled in the art that this is possible.

In one embodiment, current may flow in the coil unit 620 at least in a direction substantially perpendicular to the magnetic field B (eg, +/-x direction). The magnet unit 610 and coil unit 620 may be arranged to face each other. The magnet unit 610 and the coil unit 620 may be electromagnetically coupled to each other to generate electromagnetic force (eg, Lorentz force).

In one embodiment, the coil unit 620 may include a plurality of coil layers 621, 622, 623, and 624. For example, the coil unit 620 may include a first coil layer 621, a second coil layer 622, a third coil layer 623, and a fourth coil layer 624. The first coil layer 621, the second coil layer 622, the third coil layer 623, and the fourth coil layer 624 may be stacked to be electrically connected to each other. The first to fourth coil layers 621, 622, 623, and 624 may be arranged away from the magnet unit 610 in that order. That is, the first coil layer 621 may be placed closest to the magnet unit 610, and the fourth coil layer 624 may be placed furthest from the magnet unit 610. The first to fourth coil layers 621, 622, 623, and 624 may include printed circuit boards 6211, 6221, 6231, and 6241 and coil patterns 6212, 6222, 6232, and 6242, respectively. However, this is an example, and the number of coil layers included in the coil unit 620 is not limited thereto.

In one embodiment, the cross-sectional area of the plurality of coil layers (e.g., the first to fourth coil layers 621, 622, 623, and 624) increases as the distance from the magnet unit 610 increases, or at least is formed to be the same. You can. For example, the cross-sectional area S ₂ of the second coil pattern 6222 may be larger than the cross-sectional area S ₁ of the first coil pattern 6212 . The cross-sectional area S ₃ of the third coil pattern 6232 may be larger than the cross-sectional area S ₂ of the second coil pattern 6222. The cross-sectional area S ₄ of the fourth coil pattern 6242 may be substantially equal to the cross-sectional area S ₃ of the third coil pattern 6232 .

In one embodiment, the number of coil turns of the first to fourth coil layers 621, 622, 623, and 624 may increase as they approach the magnet unit 610, or may be formed to be at least the same. For example, the number of coil turns (n ₁ ) of the first coil layer 621 may be greater than the number of coil turns (n ₂ ) of the second coil layer 622. The number of coil turns (n ₂ ) of the second coil layer 622 may be greater than the number of coil turns (n ₃ ) of the third coil layer 623. The number of coil turns (n ₃ ) of the third coil layer 623 may be substantially equal to the number of coil turns (n ₄ ) of the fourth coil layer 624.

In one embodiment, the cross-sectional area (S ₁ ) of the first coil pattern 6212 is approximately 1214um ² , the cross-sectional area (S ₂ ) of the second coil pattern 6222 is approximately 1359um ² , and the third coil pattern 6232 And the cross-sectional area (S ₄ ) of the fourth coil pattern 6242 may be approximately 1743 um ² . According to this configuration, compared to the case where the coil cross-sectional areas of all four coil layers are the same at approximately 1596um ² , the total thrust can increase by about 14% and the current consumption can be reduced by about 8mA. However, the above-mentioned values are illustrative, and the cross-sectional area of the coil pattern is not limited thereto.

Meanwhile, in describing the coil units 620 and 720 through FIGS. 6 and 7, the coil units 620 and 720 are described as being formed with a coil pattern printed on a printed circuit board. However, the coil units 620 and 720 ) is not limited to this type. For example, the coil units 620 and 720 may be wound coils, and it can be understood that the farther away the coil units are from the magnet units 610 and 710, the larger the cross-sectional area (e.g., thickness) is used.

8 is a schematic front view of an actuator according to one embodiment. Figure 8 is schematically shown for convenience of explanation, and does not limit the location, size, and/or number of each component.

Referring to FIG. 8, the actuator 700 (e.g., the actuator 500 in FIG. 4b) according to an embodiment includes a magnet unit 710 (e.g., magnet units 510a, 510b, and 510c in FIG. 4b) and a coil. It may include a unit 720 (e.g., coil units 520a, 520b, and 520c in FIG. 4B).

In one embodiment, the magnet unit 710 may generate a magnetic field (B). For example, magnet unit 710 may include a permanent magnet. The pole direction of the magnet unit 710 may be disposed along a direction substantially parallel to the coil unit 720 (eg, z-direction). For example, as shown in FIG. 7 , the coil unit 720 may be disposed in the x-z plane, and the first pole 711 and the second pole 712 of the magnet unit 710 may be disposed along the z direction. The magnetic field (B) diverging from the first pole 711 of the magnet unit 710 may converge to the second pole 712. For example, at least a portion (Ba) of the magnetic field B generated in the magnet unit 710 is formed in a direction (e.g., +y direction) from the first pole 711 toward the coil unit 720, and is formed at least A portion (Bb) is formed in a direction (e.g., -y direction) from the coil unit 720 to the second pole 712, and at least a portion (Bc) is formed from the first pole 711 to the second pole 712. It may be formed in a direction facing (e.g., +z direction). However, this is an example, and the direction of the magnetic field B generated from the magnet unit 710 is not limited thereto.

In one embodiment, current may flow through the coil unit 720. The magnet unit 710 and the coil unit 720 may be electromagnetically coupled to each other to generate electromagnetic force (eg, Lorentz force). The coil unit 720 may include a first coil portion 720-1 and a second coil portion 720-2. The first coil portion 720-1 is a portion disposed substantially perpendicular to the magnetic fields Ba and Bb generated from the magnet unit 710, and the second coil portion 720-2 is a portion disposed substantially perpendicular to the magnetic fields Ba and Bb generated from the magnet unit 710. It may be a portion arranged substantially parallel to the generated magnetic field (Bc). For example, based on FIG. 7 , the first coil portion 720-1 may be disposed in the x-direction, and the second coil portion 720-2 may be disposed in the z-direction.

In one embodiment, because the first coil portion 720-1 is disposed substantially perpendicular to the magnetic fields Ba and Bb, the current flowing through the first coil portion 720-1 is connected to the magnetic fields Ba and Bb. It can be electromagnetically coupled to generate electromagnetic force (e.g. Lorentz force). However, since the second coil portion 720-2 is disposed substantially parallel to the magnetic field Bc, electromagnetic force (eg, Lorentz force) may not be generated in the second coil portion 720-2.

In one embodiment, the first coil portion 720-1 may have a first cross-sectional area (S ₁ ). The second coil portion 720-2 may have a cross-sectional area (S ₁ ') that is larger than the first cross-sectional area (S ₁ ). Since resistance is inversely proportional to the cross-sectional area, the second coil portion 720-2 may have a relatively lower resistance than the first coil portion 720-1. According to this configuration, the total resistance of the coil unit 720 can be lowered without affecting the total thrust generated by the actuator 700, and thus the available current can be increased.

In one embodiment, the electronic device 301 includes a housing 310 that forms the exterior of the electronic device 301, and a camera module 400 at least partially disposed inside the housing 310, The camera module 400 includes a fixed part 430 fixedly disposed on the electronic device 301, a moving part 440 connected to a lens or an image sensor, and a moving part with respect to the fixed part 430. In order to relatively move 440, it includes an actuator 500 including a magnet unit 510 and a coil unit 520 arranged to face each other, and the coil unit 520 has a first cross-sectional area (S ₁ ), a first coil layer 521 including a coil having a coil, and a first coil layer 521 that is located relatively farther from the magnet unit 510 than the first coil layer 521 and is larger than the first cross-sectional area (S ₁ ). It may include a second coil layer 522 including a coil having a cross-sectional area (S ₂ ) of 2.

In one embodiment, the number of coil turns (n ₁ ) of the first coil layer 521 may be greater than the number of coil turns (n ₂ ) of the second coil layer 522.

In one embodiment, the first coil layer 521 includes a first printed circuit board 5211 and a first coil pattern 5212 formed on the first printed circuit board 5211, and the first coil layer 521 may include a second printed circuit board 5221 and a second coil pattern 5222 formed on the second printed circuit board 5221.

In one embodiment, the coil width (w ₂ ) of the second coil pattern 5222 may be greater than the coil width (-w ₁ ) of the first coil pattern 5212.

In one embodiment, the coil spacing (g ₂ ) of the second coil pattern 5222 may be the same as the coil spacing (g ₁ ) of the first coil pattern 5212.

In one embodiment, the coil height (h ₂ ) of the second coil pattern 5222 may be the same as the coil height (h ₁ ) of the first coil pattern 5212.

In one embodiment, the first coil pattern 5212 and the second coil pattern 5222 may be electrically connected through a via.

In one embodiment, the coil unit 620 is located relatively farther from the magnet unit 610 than the second coil layer 622 and has a third cross-sectional area (S) larger than the second cross-sectional area (S ₂ ). ₃ ) may further include a third coil layer 623 including a coil.

In one embodiment, the number of coil turns (n ₂ ) of the second coil layer 622 may be greater than the number of coil turns (n ₃ ) of the third coil layer 623.

In one embodiment, the coil of the first coil layer 521 may be formed of a material with a lower resistance coefficient than the coil of the second coil layer 522.

In one embodiment, the first coil layer 521 includes a first coil portion 720-1 having the first cross-sectional area (S ₁ ), and a cross-sectional area (S ₁ ) larger than the first cross-sectional area (S ₁ ). ') may include a second coil portion 720-2.

In one embodiment, the first coil portion 720-1 is a portion disposed perpendicular to the magnetic fields (Ba, Bb) generated from the magnet unit 510, and the second coil portion 720-2 is It may be a portion disposed parallel to the magnetic field Bc generated from the magnet unit 510.

In one embodiment, the first coil layer 521 and the second coil layer 522 may be stacked to be electrically connected to each other.

In one embodiment, the thrust F ₁ 'generated in the first coil layer 521 may be greater than the thrust F ₂ 'generated in the second coil layer 522.

In one embodiment, the coil resistance (R ₂ ) of the second coil layer 522 may be smaller than the coil resistance (R ₁ ) of the first coil layer 521 .

In one embodiment, the camera module 400 disposed in the electronic device 301 includes a fixed part 430 fixedly disposed in the electronic device 301, a moving part 440 including a lens or an image sensor, and an actuator 500 including a magnet unit 510 and a coil unit 520 arranged to face each other in order to move the movable part 440 relative to the fixed part 430, The coil unit 520 is located relatively farther from the magnet unit 510 than the first coil layer 521, which includes a coil having a first cross-sectional area (S ₁ ), and the first coil layer 521, It may include a second coil layer 522 including a coil having a second cross-sectional area (S ₂ ) that is larger than the first cross-sectional area (S ₁ ).

In one embodiment, the number of coil turns (n ₁ ) of the first coil layer 521 may be greater than the number of coil turns (n ₂ ) of the second coil layer 522.

In one embodiment, the first coil layer 521 includes a first printed circuit board 5211 and a first coil pattern 5212 formed on the first printed circuit board 5211, and the first coil layer 521 may include a second printed circuit board 5221 and a second coil pattern 5222 formed on the second printed circuit board 5221.

In one embodiment, the coil width (w ₂ ) of the second coil pattern 5222 may be greater than the coil width (w ₁ ) of the first coil pattern 5221.

In one embodiment, the electronic device 301 includes a housing 310 that forms the exterior of the electronic device 301, and a camera module 400 at least partially disposed inside the housing 310, The camera module 400 includes a fixed part 430 fixedly disposed on the electronic device 301, a moving part 440 connected to a lens or an image sensor, and a moving part with respect to the fixed part 430. In order to relatively move 440, it includes an actuator 500 including a magnet unit 510 and a coil unit 520 arranged to face each other, and the coil unit 520 is a plurality of coils stacked on each other. Comprising layers 521 and 522, each of the plurality of coil layers 521 and 522 includes a printed circuit board 5211 and 5221 and a coil pattern 5212 and 5222 formed on the printed circuit board 5211 and 5221. ), wherein the cross-sectional areas (S ₁ , S ₂ ) of the coil patterns (5212, 5222) of the plurality of coil layers (521, 522) increase as the distance from the magnet unit (510) increases, or are at least the same. can be formed.

Claims (20)

In electronic devices,
a housing that forms the exterior of the electronic device; and
At least a portion includes a camera module disposed inside the housing,
The camera module is,
a fixing part fixedly disposed on the electronic device;
A moving part connected to a lens or image sensor; and
In order to move the moving part relative to the fixed part, it includes an actuator including a magnet unit and a coil unit arranged to face each other,
The coil unit is,
a first coil layer including a coil having a first cross-sectional area; and
An electronic device comprising a second coil layer located relatively farther from the magnet unit than the first coil layer and including a coil having a second cross-sectional area that is larger than the first cross-sectional area. According to paragraph 1,
The electronic device wherein the number of coil turns of the first coil layer is greater than the number of coil turns of the second coil layer. According to paragraph 1,
The first coil layer includes a first printed circuit board and a first coil pattern formed on the first printed circuit board,
The first coil layer includes a second printed circuit board and a second coil pattern formed on the second printed circuit board. According to paragraph 3,
The electronic device wherein the coil width of the second coil pattern is greater than the coil width of the first coil pattern. According to paragraph 4,
The electronic device wherein the coil spacing of the second coil pattern is the same as the coil spacing of the first coil pattern. According to paragraph 4,
The electronic device wherein the coil height of the second coil pattern is the same as the coil height of the first coil pattern. According to paragraph 3,
The first coil pattern and the second coil pattern are electrically connected through a via. According to paragraph 1,
The coil unit is,
The electronic device further includes a third coil layer located relatively farther from the magnet unit than the second coil layer and including a coil having a third cross-sectional area that is larger than the second cross-sectional area. According to clause 8,
The electronic device wherein the number of coil turns of the second coil layer is greater than the number of coil turns of the third coil layer. According to paragraph 1,
The electronic device wherein the coil of the first coil layer is formed of a material with a lower resistance coefficient than the coil of the second coil layer. According to paragraph 1,
The first coil layer is,
a first coil portion having the first cross-sectional area; and
An electronic device comprising a second coil portion having a cross-sectional area greater than the first cross-sectional area. According to clause 11,
The first coil portion is a portion disposed perpendicular to the magnetic field generated from the magnet unit,
The second coil portion is a portion disposed parallel to the magnetic field generated from the magnet unit. According to paragraph 1,
The first coil layer and the second coil layer are stacked so as to be electrically connected to each other. According to paragraph 1,
The electronic device wherein the thrust generated in the first coil layer is greater than the thrust generated in the second coil layer. According to paragraph 1,
The electronic device wherein the coil resistance of the second coil layer is smaller than the coil resistance of the first coil layer. In a camera module disposed in an electronic device,
a fixing part fixedly disposed on the electronic device;
A moving part containing a lens or image sensor; and
In order to move the moving part relative to the fixed part, it includes an actuator including a magnet unit and a coil unit arranged to face each other,
The coil unit is,
a first coil layer including a coil having a first cross-sectional area; and
A camera module comprising a second coil layer located relatively farther from the magnet unit than the first coil layer and including a coil having a second cross-sectional area larger than the first cross-sectional area. According to clause 16,
The number of coil turns of the first coil layer is greater than the number of coil turns of the second coil layer. According to clause 16,
The first coil layer includes a first printed circuit board and a first coil pattern formed on the first printed circuit board,
The first coil layer includes a second printed circuit board and a second coil pattern formed on the second printed circuit board. According to clause 18,
A camera module wherein the coil width of the second coil pattern is larger than the coil width of the first coil pattern. In electronic devices,
a housing that forms the exterior of the electronic device; and
At least a portion includes a camera module disposed inside the housing,
The camera module is,
a fixing part fixedly disposed on the electronic device;
A moving part connected to a lens or image sensor; and
In order to move the moving part relative to the fixed part, it includes an actuator including a magnet unit and a coil unit arranged to face each other,
The coil unit includes a plurality of coil layers stacked on each other,
Each of the plurality of coil layers includes a printed circuit board and a coil pattern formed on the printed circuit board,
The electronic device wherein the cross-sectional area of the coil pattern of the plurality of coil layers increases as the distance from the magnet unit increases or is at least formed to be the same.

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