KR20230166317A - PCB assembly for car lamps - Google Patents

Abstract

The present invention relates to a PCB assembly for a vehicle lamp. When a heat dissipation plate and a PCB module are press-fitted in the direction of the injection molded product, the heat dissipation plate is pressed into close contact with the curved support surface, and the heat dissipation plate is deformed to correspond to the shape of the curved support surface, and the PCB module As the heat sink is pressed into close contact with the support portion of the injection molded product, the bent beam is bent and deformed based on the rotation support beam of the heat sink plate, thereby guiding the heat sink to be deformed corresponding to the inclination angle of the support portion.
According to the present invention, the inclination angle of the PCB module can be easily changed by press-fitting the PCB module into the support part of the injection-molded product, and the angle of each PCB module can be adjusted differently depending on the inclination angle of the support part formed in the injection-molded product or oriented at the same angle. The direction of light emitted from the LED device can be adjusted in various ways by adjusting the angle of the PCB module, and the bending beam of the PCB module is rotated and bent based on the rotation support beam of the heat dissipation plate, thereby bending the bending beam of the PCB module. During the process, there is no risk of distortion or shape deformation of the bent beam, and since the bent beam is simply bent and deformed in an upward or downward direction based on the rotation support beam, there is no risk of the bent beam being separated from the rotation support beam when the angle of the PCB module is changed. There is no

Description

PCB assembly for car lamps}

The present invention relates to a PCB assembly, and more specifically, a bending beam of a PCB module integrally connected to a rotational support beam of a heat dissipation plate is pressed into close contact with a support part of an injection-molded product and has an angle determined to correspond to a heat dissipation plate that is deformed to correspond to the inclination angle of the support part. It relates to a PCB assembly for a vehicle lamp that is bent to maintain the heat sink in close contact with the support.

In general, PCB (Printed Circuit Board) refers to a wiring board on which electronic components are mounted and electrically connected between components or signal lines.

These PCBs are equipped with LEDs that consume less power, have a long lifespan, and do not generate pollutants such as environmental pollution, and are mainly used for electronic signs and dashboards for automobiles. Recently, they are used in automobile interior lights, signboards, and liquid crystal displays. It is used in various fields such as backlight units and automobile headlights.

Patent Document 1 shows a conventional metal PCB. Referring to this, a PCB made of metal, a unit pattern formed so that three sides are cut on the PCB, one side of which is connected to the PCB and inclined at a predetermined angle, and a unit pattern on the PCB It is composed of injection molded products that are combined so that the unit pattern is supported on a support formed on a horizontal surface.

Here, when the PCB is press-fitted in the direction of the injection-molded product, the plurality of unit patterns formed on the PCB are inclined at a predetermined angle based on one side connected to the PCB and adhere to the support of the injection-molded product, maintaining the unit pattern inclined at a predetermined angle. will be.

At this time, the plurality of unit patterns are in close contact with each support portion and are formed at a predetermined angle to correspond to the inclination angle of the support portion.

Additionally, an LED element is formed on the upper surface of the unit pattern, so the LED element irradiates light in a direction corresponding to the inclination angle direction of the unit pattern.

However, in Patent Document 1 as described above, three sides of the unit pattern are cut on the PCB, but one side is connected, so that when one side is cut during the unit pattern bending process, the unit pattern is removed from the PCB, and the PCB By forming a pattern connecting the LED elements on the upper surface between the unit patterns formed in the unit patterns, the unit patterns are spaced apart, and the number of LED elements decreases simultaneously with the number of unit patterns formed on the PCB in proportion to the distance between the spaced unit patterns. As a result, the brightness of the light emitted through the LED is reduced, and when the unit pattern is removed from the PCB, the pattern connecting the LED elements is disconnected, causing the LED element to lose its function of emitting light, and emitting light at the same time as the LED element's function is lost. This blocks the light, making it difficult to irradiate the light. In particular, since the metal PCB is formed in a flat structure, it is impossible to install the metal PCB in curved areas of the vehicle, which creates limitations in installing it in various areas of the vehicle. , there is a problem that the reliability of the product is reduced.

KR 10-1589017 B1

The present invention is to solve the problems described above, and the object of the present invention is to provide an injection molded product with a support portion inclined at a predetermined angle on the upper surface and curved support surfaces formed on the upper surfaces of both sides of the support portion, and to have a perup structure. It is closely pressed into the curved support surface of the injection molded product, forming a heat dissipation plate with a rotation support beam on its inner wall, and a heat dissipation plate with LED elements mounted on the upper surface, and both ends of this heat dissipation plate are integrated with the rotation support beam of the heat dissipation plate. A PCB module is formed to form a bent beam that is connected and bent at an angle at a predetermined angle, and a conductive pattern is formed to connect the heat dissipation plate and the LED elements on the upper surface of the PCB module.

When the heat dissipation plate and PCB module are press-fitted in the direction of the injection molded product, the heat dissipating plate is pressed into close contact with the curved support surface, the heat dissipating plate is deformed to correspond to the shape of the curved support surface, and the heat dissipating plate of the PCB module is bent as it is press-fitted into the support of the injection molded product. A PCB assembly for a vehicle lamp is provided that guides the heat sink to be deformed corresponding to the inclination angle of the support portion as the beam is bent and deformed based on the rotational support beam of the heat dissipation plate.

In order to achieve the object of the present invention as described above, the PCB assembly for a vehicle lamp according to the present invention is arranged in a row on the upper surface to form a support portion inclined at a predetermined angle, and two sides adjacent to each other with respect to the support portion. An injection molded product having a curved support surface forming a curved structure on the upper surface; It is formed in the shape of a plate to form a peruf structure, and both sides are in close contact with the curved support surface of the injection molded product, deformed into a curved structure to correspond to the shape of the curved support surface, and facing the same direction on the inner walls facing each other. A heat dissipation plate forming a rotation support beam bent to do so; A heat sink is formed in the shape of a metal plate with LED elements mounted on the upper surface, and both ends of the heat sink are bent in the direction of the rotation support beam and are integrally connected to the rotation support beam, so that an angle is determined based on the rotation support beam. A PCB module that is inclined to form a bent beam that maintains the heat sink inclined at a predetermined angle; It is characterized by being composed of a conductive pattern formed along the heat dissipation plate and the upper surface of the PCB module to connect the LED elements, and to apply power to the LED elements.

In the PCB assembly for a vehicle lamp according to the present invention, the support portion of the injection-molded product is formed to have the same inclination angle or to have different inclination angles, so that the inclination angles of the plurality of PCB modules are the same as each other to correspond to the support portion. It is characterized by being supported or having different inclination angles.

In the PCB assembly for a vehicle lamp according to the present invention, the PCB module is recessed upward on the bottom of the bent beam and further forms a bending groove that guides the bent beam to be bent.

According to the present invention, the inclination angle of the PCB module can be easily changed by press-fitting the PCB module into the support part of the injection-molded product, and the angle of each PCB module can be adjusted differently depending on the inclination angle of the support part formed in the injection-molded product or oriented at the same angle. The direction of light emitted from the LED device can be adjusted in various ways by adjusting the angle of the PCB module, and the bending beam of the PCB module is rotated and bent based on the rotation support beam of the heat dissipation plate, thereby bending the bending beam of the PCB module. During the process, there is no risk of distortion or shape deformation of the bent beam, and since the bent beam is simply bent and deformed in an upward or downward direction based on the rotation support beam, there is no risk of the bent beam being separated from the rotation support beam when the angle of the PCB module is changed. There is no gap, and the conductive pattern is formed to detour in the direction of the rotational support beam of the heat dissipation plate and the bending beam of the PCB module, so the separation distance between PCB modules is reduced, and the PCB is integrally connected to the heat dissipation plate by reducing the separation distance between PCB modules. The number of modules and the number of LED elements increases simultaneously, improving the amount of light emitted from the LED elements. The heat dissipation plate is curved according to the installation location of the vehicle, making it easy to install in curved parts of the vehicle. This has the advantage of improving the reliability of the product.

1 is a perspective view showing a PCB assembly for a vehicle lamp according to the present invention.
Figure 2 is an exploded perspective view of Figure 1.
Figure 3 is a perspective view showing the flat shape of the heat dissipation plate and PCB module of the PCB assembly for vehicle lamps according to the present invention.
Figure 4 is a side view of the PCB assembly for a vehicle lamp according to the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings.

Referring to FIGS. 1 to 4, the injection molded product 100 is arranged in a row on the upper surface to form a support part 101 inclined at a predetermined angle, and curved surfaces are formed on both upper surfaces adjacent to each other based on the support part 101. A curved support surface portion 102 forming the structure is formed.

The injection molded product 100 supports the heat dissipation plate 200 and the PCB module 300 by allowing the heat dissipation plate 200 and the PCB module 300 to be pressed into close contact with the upper surface.

The injection molded product 100 allows the shapes of the heat dissipation plate 200 and the PCB module 300 to be modified to correspond to the shapes of the support portion 101 and the curved support surface portion 102.

The injection molded product 100 is fixedly installed at a predetermined position in the vehicle and supports the LED element 301a installed on the PCB module 300 so that it is fixed in a predetermined direction.

The injection molded product 100 supports the PCB module 300 on the support part 101 and determines the direction of light irradiation of the LED element 301a installed on the PCB module 300.

The support portion 101 allows the PCB module 300 to come into close contact, thereby changing the inclination angle of the PCB module 300.

The support portion 101 supports the PCB module 300 and maintains the inclination angle of the PCB module 300, which is deformed to be inclined at a predetermined angle.

The support portion 101 of the injection-molded product 100 is formed to have the same inclination angle or to have different inclination angles, so that the inclination angles of the plurality of PCB modules 300 are the same so as to correspond to the support portion 101. It is supported or has different inclination angles.

The support portion 101 is formed to be proportional to the number of PCB modules 300, and supports the PCB module 300 to be deformed at a predetermined angle.

The heat dissipation plate 200 is formed in the shape of a plate to form a peruvial structure, and both sides are in close contact with the curved support surface 102 of the injection-molded product 100, and has a curved structure to correspond to the shape of the curved support surface 102. It is transformed into a rotation support beam 201 that is bent to face the same direction on the inner walls facing each other.

The heat dissipation plate 200 is press-fitted in the direction of the injection-molded product 100 and is bent to correspond to the shape of the curved support surface 102 of the injection-molded product 100.

The heat dissipation plate 200 is preferably fixed to the injection-molded product 100 by a fastening member (not shown) while being pressed into close contact with the injection-molded product 100.

The rotation support beam 201 of the heat dissipation plate 200 supports the bending beam 302 of the PCB module 300 to be bent at an angle at a predetermined angle.

The heat dissipation plate 200 receives heat generated from the PCB module 300 and discharges it to the outside.

The heat dissipation plate 200 allows the conductive pattern 400 to be formed on its upper surface and is connected to the conductive pattern 400 formed on the upper surface of the PCB module 300.

The heat dissipation plate 200 integrally connects the bent beam 302 of the PCB module 300 to the rotation support beam 201, so that a plurality of the PCB modules 300 are installed in a row inside it. do.

The rotation support beam 201 of the heat dissipation plate 200 supports the bent beam 302 of the PCB module 300 to maintain an inclined state at a predetermined angle.

The PCB module 300 is in the shape of a metal plate, forming a heat sink 301 on which LED elements 301a are mounted on the upper surface, and both ends of the heat sink 301 are bent in the direction of the rotation support beam 201, It is integrally connected to the rotation support beam 201 and is inclined at a predetermined angle based on the rotation support beam 201 to form a bent beam 302 that maintains the heat sink 301 at an inclination at a predetermined angle.

The PCB module 300 is press-fitted into close contact with the support portion 101 of the injection-molded product 100, and is deformed to be inclined at a predetermined angle to correspond to the shape of the support portion 101.

The PCB module 300 is closely supported on the support portion 101 and is transformed to have the same angle or different angles to determine the direction of light emitted from the LED device 301a.

The heat sink 301 is deformed to be inclined at a predetermined angle by the support part 101, and causes the bent beam 302 to rotate at a predetermined angle with respect to the rotation support beam 201.

It is preferable that the heat sink 301 is formed in a square shape and that the LED element 301a is formed on its upper surface.

The heat sink 301 receives heat generated from the LED element 301a and transfers it toward the heat sink 200.

The heat sink 301 allows a conductive pattern 400 to be formed on its upper surface to connect the LED elements 301a.

The bent beam 302 of the heat dissipation plate 301 is integrally connected to the rotation support beam 201 of the heat dissipation plate 200, so that the PCB module 300 is connected to the heat dissipation plate 200.

The bent beam 302 is rotated and bent integrally with the heat sink 301 to have the same inclination angle as the heat sink 301, corresponding to the heat sink 301 inclined at a predetermined angle.

The bent beam 302 is formed to be parallel to the heat sink 301 and integrally connects the heat sink 301 and the rotation support beam 201 of the heat sink plate 200.

The bent beam 302 is bent at an angle corresponding to the support portion 101 by the heat sink 301 that is pressed into close contact with the support portion 101, so that the heat sink 301 corresponds to the inclination angle of the support portion 101. Maintain the transformed state so as to

The LED element 301a irradiates light in the direction toward which the heat sink 301 of the PCB module 300 faces, thereby emitting light to the outside.

The LED element 301a receives power from the conductive pattern 400 and emits light.

The conductive pattern 400 is formed along the heat dissipation plate 200 and the upper surface of the PCB module 300 to connect the LED elements 300, and applies power to the LED element 301a.

The conductive pattern 400 is formed in a predetermined pattern along the heat dissipation plate 200 and the upper surface of the PCB module 300, and applies power to the LED device 301a.

The multi-stage bent PCB assembly according to the present invention configured as described above is used as follows.

Hereinafter, the heat dissipation plate 200 and the PCB module 300 will be described taking as an example that they are manufactured in a flat structure.

First, the injection molded product 100 is provided with a support portion 101 formed in a row on the upper surface and a curved support surface portion 102 formed on both upper surfaces adjacent to each other based on the support portion 101.

In addition, a heat dissipation plate 200 of a peruvial structure forming a flat surface on the upper part of the injection molded product 100, and a PCB module ( 300) is formed, and the heat dissipation plate 200 and the PCB module 300 are pressed into close contact with each other in the direction of the injection-molded product 100.

At this time, an LED element (301a) is formed on the upper surface of each of the PCB modules (300), and the LED elements (301a) are connected to the heat dissipation plate (200) and the conductive pattern (400) formed along the upper surface of the PCB module (300). are connected to each other by

Subsequently, the heat dissipation plate 200 and the PCB module 300 are pressed into close contact with the injection molded product 100 so that the heat dissipation plate 200 is positioned on the curved support surface 102 of the injection molded product 100. In this state, when the heat dissipation plate 200 is pressed in, the heat dissipation plate 200 comes into close contact with the curved support surface portion 102 and is deformed into a curved structure to correspond to the shape of the curved support surface portion 102.

At this time, the heat dissipation plate 200 is deformed to form a curved structure and primarily adjusts the direction in which the plurality of PCB modules 300 face.

Meanwhile, with the PCB module 300 installed integrally connected to the heat dissipation plate 200 positioned on the upper part of the support part 101 of the injection-molded product 100, the PCB module 300 is moved in the direction of the support part 101. When pressed into close contact, the heat sink 301 of the PCB module 300 comes into close contact with the support portion 101, and the angle of the heat sink 301 is modified to correspond to the inclination angle of the support portion 101.

That is, as the heat sink 301 is pressed into close contact with the support portion 101 of the injection-molded product 100, the bending beam 302 is formed so that the heat sink 301 is deformed corresponding to the inclination angle of the support portion 101. It is deformed to correspond to the inclination angle of the support part 101 with respect to the rotation support beam 201, and the heat sink 301 is brought into close contact with the support part 101, so that the heat sink 301 is adjusted to the inclination angle of the support part 101. transformed to correspond.

At this time, the bent beam 302 is formed parallel to the heat sink 301 and rotates integrally with the heat sink 301, thereby changing the inclination angle of the heat sink 301.

In particular, the bent beam 302 is formed integrally with the rotation support beam 201 in a state in which both ends of the heat sink 301 are bent toward the rotation support beam 201, and the rotation support beam 201 ), the heat sink 301 can be inclined and bent at a predetermined angle.

Here, a bending groove (302a) is formed on the bottom of the bent beam (302), and the bent beam (302) is bent and deformed based on the bending groove (302a) to form a bent portion of the bent beam (302). Cracks are prevented from occurring.

In addition, the bent beam 302 is integrally connected to the rotation support beam 201 so as to face each other, and is bent at a predetermined angle with respect to the rotation support beam 201, thereby causing distortion or excessive deformation during the bending process. damage is prevented.

Then, the heat dissipation plate 200 is in close contact with the curved support surface 102 of the injection molded product 100, and the PCB module 300 is in close contact with the support portion 101, so that the heat dissipation plate 200 and the PCB module The shape of 300 is modified to correspond to the shapes of the curved support surface 102 and the support portion 101 of the injection molded product 100.

Afterwards, the PCB module 300 in close contact with the support part 101 is maintained at an angle inclined at a predetermined angle, and at this time, power is applied through the conductive pattern 400 so that the LED element 301a simultaneously emits light, thereby externally emitting light. Let the light shine through.

Here, the LED element 301a irradiates light to correspond to the direction in which the PCB module 300 faces, thereby emitting light to the outside.

On the other hand, when the PCB module 300 is to form the same inclination angle or different inclination angles, the inclination angles of the support portions 101 of the injection-molded product 100 are formed differently or are formed to be the same, and these supports ( When the PCB module 300 is pressed into close contact with 101), the inclination angles of the plurality of PCB modules 300 integrally connected to the heat dissipation plate 200 are deformed to be the same or to form different inclination angles.

And, as described above, depending on the inclination angle of the PCB module 300, the direction of the light emitted from the LED element 301a is directed in the same direction or in different directions, so that the light emitted from the LED element 301a is radiated from the LED element 301a. It is possible to change the direction of light.

As described above, the heat dissipation plate 200 is pressed into close contact with the curved support surface 102 of the injection molded product 100, and the heat dissipation plate 200 is transformed into a curved structure to correspond to the shape of the curved support surface 102, but the PCB module ( The structure in which the inclination angle of the PCB module 300 is modified to correspond to the inclination angle of the support part 101 by press-fitting the PCB module 300 into close contact with the support part 101 allows the PCB module 300 to be closely attached to the support part 101 of the injection-molded product 100. By press-fitting, the inclination angle of the PCB module 300 can be easily changed, and the angle of each PCB module 300 can be adjusted differently depending on the inclination angle of the support part 101 formed on the injection-molded product 100, or can be made to face the same angle. It can be adjusted, and the direction of light emitted from the LED element (301a) can be adjusted in various ways by adjusting the angle of the PCB module (300), and the PCB module (300) can be adjusted based on the rotation support beam (201) of the heat dissipation plate (200). ) of the bent beam 302 is rotated and bent, so that in the process of bending the bent beam 302 of the PCB module 300, there is no risk of distortion or shape deformation of the bent beam 302, and the bent beam Since (302) is simply bent and deformed in an upward or downward direction based on the rotation support beam (201), there is no fear of the bent beam (302) falling off from the rotation support beam (201) when the angle of the PCB module (300) is deformed.

The PCB assembly for a vehicle lamp according to the present invention described above is not limited to the above-described embodiment, and those skilled in the art will understand the present invention without departing from the gist of the present invention as claimed in the following claims. The technical spirit extends to the extent that anyone can make various changes and implement it.

100: Injection product 101: Support part
102: curved support surface 200: heat dissipation plate
201: rotation support beam 300: PCB module
301: Heat sink 301a: LED element
302: bent beam 302a: bent groove
400: Challenge pattern

Claims (3)

An injection molded product ( 100) and;
It is formed in the shape of a plate to form a peruf structure, and both sides are in close contact with the curved support surface portion 102 of the injection-molded product 100, and are transformed into a curved structure to correspond to the shape of the curved support surface portion 102, facing each other. A heat dissipation plate (200) forming a rotating support beam (201) bent to face the same direction on the inner wall of the beam;
A heat sink 301 is formed in the shape of a metal plate with LED elements 301a mounted on its upper surface, and both ends of the heat sink 301 are bent in the direction of the rotation support beam 201. ) is integrally connected to the PCB module 300, which is inclined at a predetermined angle based on the rotation support beam 201 to form a bent beam 302 that maintains the heat sink 301 inclined at a predetermined angle;
A conductive pattern 400 formed along the upper surface of the heat dissipation plate 200 and the PCB module 300 to connect between the LED elements 300 and to apply power to the LED element 301a;
A PCB assembly for a vehicle lamp, characterized in that it consists of. According to clause 1,
The support portion 101 of the injection molded product 100 is,
Formed to have the same inclination angle or different inclination angles, the plurality of PCB modules 300 are supported to have the same inclination angle or different inclination angles so that the inclination angles correspond to the support portion 101. Characterized by PCB assembly for vehicle lamps. According to clause 1,
The PCB module 300 is,
A PCB assembly for a vehicle lamp, characterized in that a bending groove (302a) is further formed on the bottom of the bent beam (302), which is recessed upward in the bottom surface and guides the bent beam (302) to be bent.

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