KR20230165667A - Camera module and electronic device having the same - Google Patents

Abstract

An electronic device according to an embodiment may include a housing, a lens assembly disposed along an optical axis, and an AF driver operatively connected to the lens assembly to move the lens assembly in the optical axis direction within the housing. The AF driving unit is an AF carrier including a first AF magnet disposed on a first surface of the lens assembly facing in a first direction and a second AF magnet disposed on a second surface facing in a direction opposite to the first direction with respect to the lens assembly. , a first AF coil disposed inside the housing to face the first AF magnet, a first driving circuit disposed at the center of the first AF coil to control the current applied to the first AF coil, and a second AF magnet inside the housing. It may include a second AF coil disposed to face the second AF coil, and a second driving circuit disposed at the center of the second AF coil to control the current applied to the second AF coil. The first driving circuit moves the lens assembly in the optical axis direction through the AF carrier by controlling the current applied to the first AF coil according to the position of the first AF magnet and the position of the second AF magnet, and the second driving circuit By controlling the current applied to the second AF coil according to the position of the first AF magnet and the position of the second AF magnet, the lens assembly can be moved in the optical axis direction using the AF carrier.
In addition to this, various embodiments identified through the specification are possible.

Description

Camera module and mobile electronic device including same {CAMERA MODULE AND ELECTRONIC DEVICE HAVING THE SAME}

The descriptions below relate to a mobile electronic device including a camera module.

As the functions of mobile electronic devices become more diverse, the demand for improved image capture functions using mobile electronic devices is also increasing. Accordingly, auto focus (AF) functions for controlling focus when taking images are being developed.

A camera applied to a mobile electronic device may be located on at least one of the front and rear sides and operate to provide the function of taking photos and/or videos. When shooting a video, the mobile electronic device moves at least part of the optical system or the image sensor for the user's optical image stabilization (OIS) and auto focus (AF) functions to take clear photos and videos. It may include an actuator for acquisition.

An electronic device according to an embodiment of the present disclosure may include a housing, a lens assembly disposed along an optical axis, and an AF driver operatively connected to the lens assembly to move the lens assembly in the optical axis direction within the housing. The AF driving unit is an AF carrier including a first AF magnet disposed on a first surface of the lens assembly facing in a first direction and a second AF magnet disposed on a second surface facing in a direction opposite to the first direction with respect to the lens assembly. , a first AF coil disposed inside the housing to face the first AF magnet, a first driving circuit disposed at the center of the first AF coil to control the current applied to the first AF coil, and a second AF magnet inside the housing. It may include a second AF coil disposed to face the second AF coil, and a second driving circuit disposed at the center of the second AF coil to control the current applied to the second AF coil. The first driving circuit moves the lens assembly in the optical axis direction through the AF carrier by controlling the current applied to the first AF coil according to the position of the first AF magnet and the position of the second AF magnet, and the second driving circuit By controlling the current applied to the second AF coil according to the position of the first AF magnet and the position of the second AF magnet, the lens assembly can be moved in the optical axis direction using the AF carrier.

A camera module according to an embodiment of the present disclosure may include a housing, a lens assembly disposed along an optical axis, and an AF driver operatively connected to the lens assembly to move the lens assembly in the optical axis direction within the housing. The AF driving unit is an AF carrier including a first AF magnet disposed on a first surface of the lens assembly facing in a first direction and a second AF magnet disposed on a second surface facing in a direction opposite to the first direction with respect to the lens assembly. , a first AF coil disposed inside the housing to face the first AF magnet, a first driving circuit disposed at the center of the first AF coil to control the current applied to the first AF coil, and a second AF magnet inside the housing. It may include a second AF coil disposed to face the second AF coil, and a second driving circuit disposed at the center of the second AF coil to control the current applied to the second AF coil. The second driving circuit can control the current applied to the second AF coil to move the lens assembly in the optical axis direction using the AF carrier.

FIG. 1 is a diagram illustrating the structure of an electronic device and a camera module according to an embodiment.
Figure 2 is an exploded perspective view of an AF driving unit of a camera module according to an embodiment.
FIG. 3 is a diagram illustrating a camera module including an OIS driver and an AF driver driven by Lorentz and solenoid types according to an embodiment.
FIG. 4 is a diagram illustrating an operation of controlling an AF driver based on a calibration value according to an embodiment.
Figure 5 shows a ball-type AF driving unit according to an embodiment.
Figure 6 shows a shaft-type AF driving unit according to an embodiment.
FIG. 7A is a diagram illustrating a light movement path according to a ball-type AF driver including a folded-type optical system according to an embodiment.
FIG. 7B is a diagram illustrating a light movement path according to a shaft-type AF driving unit including a folded-type optical system according to an embodiment.
Figure 8 shows a camera module including a folded type optical system with an AF magnet located at the bottom, according to one embodiment.
Figure 9 is a flowchart showing an operation of determining a calibration value through a stroke adjustment process according to an embodiment.
Figure 10 is a flowchart illustrating an operation of determining an offset value through an additional adjustment process according to an embodiment.
FIG. 11 is a diagram illustrating an electronic device in a network environment according to an embodiment.
12 is a block diagram illustrating a camera module, according to various embodiments.
In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components.

Hereinafter, various embodiments of this document are described with reference to the attached drawings. However, this is not intended to limit this document to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives to the embodiments of this document.

FIG. 1 is a diagram illustrating the structure of an electronic device and a camera module according to an embodiment.

1 shows the exterior and camera module of an electronic device 100 (e.g., the electronic device 1101 of FIG. 11) equipped with a camera module 180 (e.g., the camera module 1180 of FIG. 11) according to an embodiment. This is a diagram schematically showing (180). The embodiment of FIG. 1 is shown and described on the premise of a mobile device, for example, a smart phone, but it is understood by those skilled in the art that it can be applied to an electronic device equipped with a camera among various electronic devices or mobile devices. It will be clearly understandable to you.

Referring to FIG. 1, a display 110 may be placed on the front of the electronic device 100 according to one embodiment. In one embodiment, the display 110 may occupy most of the front surface of the electronic device 100. A display 110 and a bezel 190 area surrounding at least a portion of an edge of the display 110 may be disposed on the front of the electronic device 100. The display 110 may include a flat area and a curved area extending from the flat area toward the side of the electronic device 100. The electronic device 100 shown in FIG. 1 is an example, and various embodiments are possible. For example, the display 110 of the electronic device 100 may include only a flat area without a curved area or may have a curved area only on one edge instead of both sides. Additionally, in one embodiment, the curved area extends to the rear of the electronic device so that the electronic device 100 may have an additional flat area.

In one embodiment, the electronic device 100 may additionally include at least one of a speaker, a receiver, a front camera, a proximity sensor, and a home key. The electronic device 100 according to one embodiment may be provided with the rear cover 150 integrated with the main body of the electronic device. In one embodiment, the rear cover 150 may be separated from the main body of the electronic device 100 so that the battery can be replaced. The rear cover 150 may also be referred to as a battery cover or rear cover.

In one embodiment, a fingerprint sensor 171 for recognizing a user's fingerprint may be included in one area 170 of the display 110. Since the fingerprint sensor 171 is placed on a layer below the display 110, it may not be visible to the user or may be placed to make it difficult to see. Additionally, in addition to the fingerprint sensor 171, additional sensors for user and/or biometric authentication may be placed in some areas of the display 110. In one embodiment, a sensor for user and/or biometric authentication may be placed in one area of the bezel 190. For example, the IR sensor for iris authentication may be exposed through one area of the display 110 or may be exposed through one area of the bezel 190.

In one embodiment, a front camera 161 may be placed in one area 160 of the front of the electronic device 100. In the embodiment of FIG. 1, the front camera 161 is shown as being exposed through one area of the display 110, but the front camera 161 may be exposed through the bezel 190. In one embodiment, the display 110 includes an audio module (e.g., the audio module 1170 of FIG. 11), a sensor module (e.g., the sensor module 1176 of FIG. 11, or It may include at least one of a sensor 163 in 1), a camera module (e.g., the camera module 1180 in FIG. 11, or the front camera 161 in FIG. 1), and a light emitting device (not shown). For example, a camera module may be placed on the front and/or side of the electronic device 100 to face the front and/or side. For example, the front camera 161 may not be visually exposed to one area 160 and may include a hidden under display camera (UDC).

In one embodiment, the electronic device 100 may include one or more front cameras 161. For example, the electronic device 100 may include two front cameras, such as a first front camera and a second front camera. In one embodiment, the first front camera and the second front camera may be cameras of the same type with equivalent specifications (eg, pixels). Additionally, the first front camera and the second front camera may be implemented as cameras with different specifications. The electronic device 100 may support dual camera-related functions (e.g., 3D shooting, auto focus) through two front cameras. The description of the front camera mentioned above may be applied equally or similarly to the rear camera of the electronic device 100.

In one embodiment, the electronic device 100 may be additionally equipped with various hardware or sensors 163 that assist photography, such as a flash. For example, a distance sensor (eg, TOF sensor) may be further included to detect the distance between the subject and the electronic device 100. The distance sensor may be applied to both the front camera and/or the rear camera. The distance sensor may be placed separately or included in the front camera and/or the rear camera.

In one embodiment, at least one physical key may be placed on the side of the electronic device 100. For example, the first function key 151 for turning on and/or off the display 110 or turning on and/or off the power of the electronic device 100 is located at the right edge with respect to the front of the electronic device 100. can be placed in In one embodiment, the second function key 152 for controlling the volume or screen brightness of the electronic device 100 may be placed at the left edge of the front of the electronic device 100. In addition, additional buttons or keys may be placed on the front or back of the electronic device 100. For example, a physical button or a touch button mapped to a specific function may be placed in the lower area of the front bezel 190.

The electronic device 100 shown in FIG. 1 corresponds to an example and does not limit the form of the device to which the technical idea disclosed in this disclosure is applied. For example, the technical idea of the present disclosure can be applied to a foldable electronic device that can be folded horizontally or vertically by employing a flexible display and a hinge structure, a rollable electronic device that can roll, a tablet, or a laptop. It can be applied. Additionally, the present technical idea can be applied even when the first camera and the second camera facing the same direction can be arranged to face different directions through at least one of rotation, folding, and deformation of the device.

Referring to FIG. 1 , an electronic device 100 according to an embodiment may include a camera module 180. The camera module 180 (e.g., the camera module 1180 in FIG. 11) includes a lens assembly 111, a housing 113, an infrared cut filter 115, an image sensor 120, and an image signal processor. (image signal processor) 130 may be included.

In one embodiment, the lens assembly 111 may differ in at least one of the number, arrangement, and type of lenses depending on the front camera and the rear camera. Depending on the type of lens assembly, the front and rear cameras may have different characteristics (e.g. focal length, maximum magnification). The lens can move forward and backward along the optical axis (not shown), and can operate to change the focal length so that the target object can be clearly photographed.

According to one embodiment, light may travel from the front (eg, +z direction) to the rear (eg, -z direction) of the lens assembly 111. Light incident from the front of the lens assembly 111 to the frontmost lens of the lens assembly 111 may travel to the rear of the lens assembly 111 through a plurality of lenses.

In one embodiment, the camera module 180 includes a barrel for arranging at least one lens aligned on an optical axis, and a housing 113 for arranging at least one coil and/or magnet surrounding the barrel around the optical axis. ) may include. According to one embodiment, the housing 113 may include an opening in the central portion to expose a portion of the lens assembly 111. In one embodiment, the camera module 180 uses at least one coil and/or magnet included in the housing 113 to perform a stabilization function (e.g., OIS) of the image acquired by the image sensor 120. You can. For example, at least one coil may electromagnetically interact with each other under the control of a control circuit (e.g., the image signal processor 130 of FIG. 1 or the processor 1120 of FIG. 11). For example, the camera module 180 may control electromagnetic force by controlling the direction and/or intensity of a current passing through at least one coil, under the control of a processor, and may use a Lorentz force or a solenoid-type actuator by electromagnetic force. At least a portion of the lens assembly 111 and the carrier including the lens assembly 111 (e.g., OIS carrier) can be moved (rotated) in a direction substantially perpendicular to the optical axis (not shown). .

The camera module 180 may perform an autofocus (e.g., AF) function in relation to the image acquired by the image sensor 120 using at least one coil and/or magnet included in the housing 113. . For example, at least one coil may electromagnetically interact with each other under the control of a control circuit (e.g., the image signal processor 130 of FIG. 1 or the processor 1120 of FIG. 11). For example, the camera module 180 may control electromagnetic force by controlling the direction and/or intensity of a current passing through at least one coil, under the control of a processor, and may use a Lorentz force or a solenoid-type actuator by electromagnetic force. At least a portion of the lens assembly 111 and the AF carrier (eg, the AF carrier 210 in FIG. 2) can be moved in the direction of the optical axis (not shown).

In one embodiment, the infrared cut-off filter 115 may be disposed on the upper surface of the image sensor 120. For example, the infrared cut-off filter 115 may be disposed on a side of the image sensor 120 in a direction in which the camera module 180 is exposed to the outside (eg, +z direction). In one embodiment, the image of the subject that has passed through the lens may be partially filtered by the infrared cut-off filter 115 and then detected by the image sensor 120.

In one embodiment, the image sensor 120 is a printed circuit board 140 (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB). It can be placed on the top. According to one embodiment, the upper surface may represent a surface in the direction in which the camera module 180 is exposed to the outside (eg, +z direction). The image sensor 120 may be electrically connected to the image signal processor 130 connected to the printed circuit board 140 through a connector. At least one of a flexible printed circuit board (FPCB) or a cable may be used as the connector.

In one embodiment, the image sensor 120 may be a complementary metal oxide semiconductor (CMOS) sensor or a charged coupled device (CCD) sensor. A plurality of individual pixels are integrated in the image sensor 120, and each individual pixel may include a micro lens, a color filter, and a photodiode. Each individual pixel is a type of light detector that can convert input light into an electrical signal. The light detector may include a photodiode.

In one embodiment, light information about a subject incident through the lens assembly 111 may be converted into an electrical signal by the image sensor 120 and input to the image signal processor 130.

In one embodiment, when the image signal processor 130 and the image sensor 120 are physically separated, a sensor interface that complies with appropriate standards may electrically connect the image sensor 120 and the image signal processor 130.

In one embodiment, the camera module 180 may be disposed on the front as well as the rear of the electronic device 100. Additionally, the electronic device 100 may include not only one camera module 180 but also multiple camera modules 180 to improve camera performance. For example, the electronic device 100 may further include a front camera 161 for video calls or self-camera shooting. The front camera 161 may support a relatively lower number of pixels than the rear camera module. The front camera may be relatively smaller than the rear camera module, but there is no limitation.

In one embodiment, the camera module 180 includes a first housing (e.g., housing 113 in FIG. 1) and a second housing that is combined with the first housing to form a space (e.g., second housing 210 in FIG. 2). ), a lens assembly 111, and an auto focus (AF) carrier (eg, the AF carrier 210 in FIG. 2). The first housing may be referred to or referred to as a shield can. The second housing may be referred to or referred to as a base. Components of the camera module 180 may be accommodated in the space formed between the first housing and the second housing. According to one embodiment, the camera module 180 is not limited to the configurations listed above and may include various configurations. For example, the camera module 180 may include a stopper, a lens barrel, and an OIS carrier accommodated in the second housing.

According to one embodiment, the stopper may limit the movement range of the lens assembly 111. For example, the stopper may limit the movement of the lens assembly 111 moving in the optical axis direction (eg, +z, -z axis direction) according to AF driving.

In one embodiment, the electronic device 100 may drive the OIS carrier for a hand shake correction function (eg, an image stabilization function). For example, the electronic device 100 may correct camera shake by moving the OIS carrier in a direction substantially perpendicular to the optical axis direction (e.g., +x, -x direction or +y, -y direction). .

In one embodiment, the electronic device 100 may drive the AF carrier for a focus control function (eg, an autofocus function). For example, the electronic device 100 may adjust the focal length of the camera by moving the AF carrier in the optical axis direction (eg, +z, -z direction).

According to one embodiment, the camera module 180 may be designed to move the lenses integrally when driving the OIS and the AF. For example, a ball guide may be placed on the AF carrier, an OIS carrier may be placed on the ball guide, and lenses may be placed on the OIS carrier. As the AF carrier and OIS carrier move, the lenses can perform AF and OIS as one.

According to one embodiment, the camera module 180 is a rolling support type using a ball or shaft instead of a type that supports the lens barrel with an elastic member in order for the lens barrel to move without tilt along the optical axis direction to satisfy high pixel resolution and miniaturization. A drive support method is being applied. For example, in order to advance or retract the lens barrel in the optical axis direction, the lens barrel may be slidably installed on a shaft extending in the optical axis direction inside the housing. Alternatively, a ball may be used between the inner part of the housing and the lens barrel to reduce friction, and the lens barrel may be installed to slide according to the rolling of the ball.

Figure 2 is an exploded perspective view of the AF driving unit of the camera module 180 according to an embodiment. FIG. 3 is a diagram illustrating a camera module including an OIS driver and an AF driver driven by Lorentz type and solenoid type according to an embodiment.

In the description of FIGS. 2 and 3, the configuration described in FIG. 1 may be briefly described or the description may be omitted.

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Referring to FIGS. 2 and 3 , the camera module 180 may include an AF driver to implement a focus control function (eg, an autofocus function). According to one embodiment, the AF driving unit includes an AF carrier 210 and a magnet (e.g., the first magnet ( 211), a second magnet 213), a coil (eg, a first coil 225, a second coil 227), and/or an AF ball 230. According to one embodiment, the AF driver is not limited to the examples listed above and may include various components for performing a focus control function.

In one embodiment, the AF carrier 210 may be movably disposed within the second housing 240. The AF carrier 210 can move in one dimension (eg, one axis direction). For example, the electronic device 100 may move the AF carrier 210 to prevent image quality from being deteriorated due to defocus. For example, the electronic device 100 may adjust the focal length of the camera by moving the AF carrier 210 in the optical axis direction (eg, +z, -z direction). For example, the electronic device 100 may perform AF control by moving the AF carrier 210 in the optical axis direction (e.g., +z, -z direction) to move the lens barrel 220 up and down.

In one embodiment, the AF carrier 210 may include a second magnet 213 as well as a first magnet 211 attached to a portion. For example, the AF carrier 210 may include a first magnet 211 attached to a portion and a second magnet 213 disposed on a side facing the first magnet 211. According to one embodiment, the first magnet 211 may be disposed on the first side of the AF carrier 210 facing the first direction (eg, -y direction) to face the first coil 225. The second magnet 213 may be disposed on the second side of the AF carrier 210 facing the second direction (eg, +y direction), so as to face the second coil 227 . The first magnet 211 may move in the third axis direction (eg, +z/-z direction) by magnetic force generated through interaction with the first coil 225. In addition, the second magnet 213 can move in the third axis direction (e.g., +z/-z direction) like the third magnet 211 by the magnetic force generated through interaction with the second coil 227. there is. Accordingly, the AF carrier 210 exerts a Lorentz force between the first magnet 211 and the first coil 225 in the third axis direction (e.g., +z/-z direction) and the second magnet 213 and the second magnet 213. It may be driven by Lorentz force between the coils 227. In one embodiment, the movement of the AF carrier 210 may be guided by the AF ball 230. As the AF carrier 210 drives, the lens assembly 111 moves to adjust the path of light to the image sensor 120, thereby performing a focus control (AF) function. For example, the AF carrier 210 includes a first magnet 211 and a second magnet 213 disposed at positions facing each other, and controls the first coil 225 and the second coil 227. By controlling each lens separately, it is possible to prevent tilt and/or misalignment (e.g., tilt) of the lens assembly 111. The separate control of the first coil 225 and the second coil 227 will be described later with reference to FIGS. 4, 5, and 6.

In one embodiment, at least one printed circuit board (not shown) may be electrically connected to at least a portion of the AF carrier 210. According to one embodiment, when shooting with a camera, at least one processor included in the electronic device 100 (e.g., processor 1120 in FIG. 11) generates an AF control value to adjust the focal distance between the subject and the camera. The electronic device 100 may implement AF by transmitting an electrical signal corresponding to the AF control value to the AF driving coil (eg, the first coil 225 and the second coil 227).

According to one embodiment, at least one processor (e.g., processor 1120 of FIG. 11) included in the electronic device 100 uses memory (e.g., memory) to correct tilt and/or distortion of the lens assembly 111. : Based on the calibration value stored in the memory 440 of FIG. 4 and the memory 1130 of FIG. 11, an electric signal corresponding to the calibration value is sent to the AF driving coil (e.g., the first coil 225, the second coil) (227)). According to one embodiment, the electronic device 100 has separate control circuits in relation to the first coil 225 and the second coil 227, respectively. By controlling it, distortion caused by AF operation can be compensated.

In one embodiment, a driver integrated circuit (IC) may be included in the center of at least one driving coil (eg, the first coil 225 and the second coil 227). According to one embodiment, the driver IC may include a Hall sensor. For example, the first driver IC 221 at the center of the first coil 225 may include a first Hall sensor. The second driver IC 223 at the center of the second coil 227 may include a second Hall sensor. Accordingly, the first Hall sensor may be placed at the center of the first coil 225, and the second Hall sensor may be placed at the center of the second coil 227.

In one embodiment, the at least one Hall sensor (e.g., a first Hall sensor, a second Hall sensor) is a magnet (e.g., a first magnet 211, or a second magnet) that moves together with the AF carrier 210. The displacement of the at least one carrier can be detected through the position (213)). The at least one Hall sensor may measure the position of the opposing magnet with respect to the Hall sensor through interaction with the opposing magnet. The at least one Hall sensor may detect the position of the opposing magnet by measuring a change in the magnetic field formed by the opposing magnet. for example,

The first Hall sensor is included in the first driver IC 221 at the center of the first coil 225, and the position of the first magnet 211 in the third axis (e.g., z-axis) direction relative to the first Hall sensor. It can be configured to measure. The second Hall sensor is included in the second driver IC 223 at the center of the second coil 227, and the position of the second magnet 213 in the third axis (e.g., z-axis) direction relative to the second Hall sensor. It can be configured to measure. In one embodiment, when performing the AF function, the electronic device 100 uses the first coil 225 and the second coil 227 through the first driver IC 221 and the second driver IC 223, respectively. By controlling, distortion and/or tilt (e.g. tilt) that occurs during AF operation can be compensated. For example, the electronic device 100 measures the position of the third axis (e.g., z-axis) direction with respect to the first Hall sensor through the first Hall sensor, and measures the position of the second Hall sensor with respect to the second Hall sensor through the second Hall sensor. The current applied to each of the first coil 225 and the second coil 227 can be controlled by measuring the position in the third axis (eg, z-axis) direction. Accordingly, the electronic device 100 can compensate for distortion and/or tilt (eg, tilt) that occurs during AF driving by controlling both ends of the AF carrier 210, respectively.

According to one embodiment, the first driver IC 221 and the second driver IC 223 may be configured as one AF driver IC. According to one embodiment, the camera module 180 has separate control circuits connected to each of the first coil 225 and the second coil 227, and the driver IC that controls each control circuit is an AF driver IC. It can be configured.

In one embodiment, at least two Hall sensors (e.g., a first Hall sensor and a second Hall sensor) may be included inside at least two coils (e.g., the first coil 225 and the second coil 227). there is. A Hall sensor included inside a coil may be referred to as a built-in Hall sensor.

According to one embodiment, the camera module 180 moves (rotates) (e.g., x-axis, y-axis) at least one magnetic material (or magnet) (e.g., the first magnet 211 or the second magnet 213). axis, and may include other sensors to check the position in the z-axis direction. For example, the camera module 180 may include a tunnel magneto-resistance sensor (TMR sensor), and uses a resistance value that changes based on the relative angles of a plurality of magnets of the TMR sensor to detect at least one magnet. You can check movement (rotation). According to one embodiment, the camera module 180 may check the movement (rotation) of at least one magnet using an anisotropic magneto-resistance (AMR) sensor or a giant magneto-resistance (GMR) sensor.

A magnet (e.g., the first magnet 211 and/or the second magnet 213) and a coil (e.g., the first coil 225 and/or the second coil 227) of the camera module 180 according to one embodiment. )) is not limited to the arrangement shown in FIGS. 2 and 3.

According to one embodiment, the OIS driver and the AF driver of FIG. 3 may be a diagram in which part of the AF driver of FIG. 2 is omitted.

Referring to FIG. 3 , in various embodiments, the camera module 180 may include the OIS driver described with reference to FIG. 1 for an hand shake correction function. According to one embodiment, the OIS driver may include a third coil 311 and a fourth coil 313. In one embodiment, one of the third coil 311 and the fourth coil 313 is driven by a solenoid type with a corresponding magnet (e.g., the third magnet 301 and/or the fourth magnet 303) The other can be configured to operate in Lorentz type.

According to one embodiment, the OIS of the camera module 180 may be driven by a Lorentz-solenoid type. For example, the third magnet 301 may be placed to face the third coil 311, and the fourth magnet 303 may be placed to face the fourth coil 313. According to one embodiment, as the OIS driver is driven, the image sensor 120 described with reference to FIG. 1 moves to perform an optical image stabilization function (eg, OIS).

In one embodiment, the above structure can also be applied to the curved camera module 180 including a prism.

According to one embodiment, the curved camera module 180 may include an optical system including a lens assembly 111 and a prism (not shown). The curved camera module 180 according to an embodiment may include a refractive optical system in which the light path from the subject to the image sensor 120 through the lens assembly 111 and the prism (not shown) is refracted at least once. there is. The curved camera module 180 according to an embodiment includes at least one magnet (e.g., the first magnet 211, or the second magnet 213, the third magnet 301, and/or the third magnet 301) according to the direction of movement of light. 4 magnet 303) and/or at least one coil (e.g., first coil 225, second coil 227, third coil 311, and/or fourth coil 313) may be disposed. there is.

FIG. 4 is a diagram illustrating an operation of controlling an AF driver based on a calibration value according to an embodiment.

Referring to FIG. 4 , an image actuator 400 including the AF driver described with reference to FIGS. 2 and 3 is shown. The image actuator 400 of the present disclosure may include all components necessary to provide a focus control function of a camera module (eg, the camera module 180 of FIG. 1). According to one embodiment, the AF driver (e.g., the AF driver described with reference to FIGS. 2 and 3) uses a lens assembly (e.g., the lens assembly 111 of FIG. 1) to provide a focus control function of the camera module 180. )) can include all configurations for moving. According to one embodiment, the AF carrier (e.g., the AF carrier 210 in FIG. 2) is connected to the lens assembly 111, and the lens assembly includes a component of the AF driving unit that moves in the optical axis direction to move the lens assembly in the optical axis direction. it means.

Referring to FIG. 4 , the processor 410 (eg, processor 1120 in FIG. 11 ) is connected to the image actuator 400 and can control the focus adjustment function of the camera module 180 . According to one embodiment, the processor 410 sends a tilt correction request 401 to the image actuator 400 to reduce distortion and/or tilt (e.g., tilt) of the lens assembly included in the image actuator 400. It can be delivered to (400). For example, when power is applied, the processor 410 may control the AF driver based on the camera calibration value.

According to one embodiment, the AF driver IC 420 (e.g., the first driver IC 221 and/or the second driver IC 223 in FIG. 2) responds to the tilt correction request 401, memory 440 ) (e.g., the memory 1130 in FIG. 11) can obtain the calibration data 403. Calibration data 403 may include a first calibration value and a second calibration value. According to one embodiment, the calibration data 403 may include values stored in the memory 440 and/or the memory of the AF driver IC 420. According to one embodiment, the calibration data 403 may be obtained by performing an operation described later with reference to FIG. 9. For example, the calibration data 403 may include a value determined through a stroke adjustment process.

According to one embodiment, the AF driver IC 420 may obtain offset data 405 for additionally correcting distortion and/or tilt of the lens assembly through the memory 440. According to one embodiment, the offset data 405 may include values stored in the memory 440 and/or the memory of the AF driver IC 420. According to one embodiment, offset data 405 may be obtained by performing an operation described later with reference to FIG. 10. For example, the offset data 405 may include data for compensating for tilt and/or distortion that occurs in an additional process for the camera module 180.

According to one embodiment, the AF driver IC 420 may map a location corresponding to the calibration data 403. For example, the AF driver IC 420 performs a first calibration, which is the height of the first AF magnet (e.g., the first magnet 211 in FIG. 2) from the second housing 240, which is determined based on the first calibration value. Locations can be mapped. For example, the electronic device 100 may map the second calibration position, which is the height of the second AF magnet (e.g., the second magnet 213) from the second housing 240, which is determined based on the second calibration value. You can.

According to one embodiment, as the AF function is performed, the hall sensor 430 may detect the positions of the first AF magnet and the second AF magnet. According to one embodiment, the Hall sensor 430 may include a first AF Hall sensor corresponding to the first AF magnet and a second AF Hall sensor corresponding to the second AF magnet. In one embodiment, the first AF Hall sensor and the second AF Hall sensor may detect the first position of the first AF magnet and the second position of the second AF magnet. For example, the first AF Hall sensor may detect a first position indicating the current position of the first AF magnet from the second housing 240. For example, the second AF Hall sensor may detect a second position indicating the current position of the second AF magnet from the second housing 240.

According to one embodiment, the hall sensor 430 may generate location data 407 including information about the first location and the second location. In one embodiment, the AF driver IC 420 may obtain location data 407 from the Hall sensor 430.

According to one embodiment, the AF driver IC 420 may determine whether the first position and the first calibration position are the same or have a difference of less than a threshold value. Additionally, the AF driver IC 420 may determine whether the second position and the second calibration position are the same or have a difference of less than a threshold value. In one embodiment, differences less than a threshold may be determined to be substantially the same.

According to one embodiment, the AF driver IC 420 may determine whether the first calibration position, which is a position for compensating tilt, is the same as the first position. Additionally, the AF driver IC 420 may determine whether the second calibration position, which is a position for compensating tilt, is the same as the second position.

According to one embodiment, the AF driver IC 420 determines the positions of the first AF magnet and the second AF magnet when the first position and the first calibration position are not the same or the second position and the second calibration position are not the same. can be adjusted. According to one embodiment, the AF driver IC 420 operates the first AF magnet and The position of the second AF magnet can be adjusted.

In one embodiment, the AF driver IC 420 may adjust the positions of the first AF magnet and the second AF magnet by considering the offset data 405.

According to one embodiment, the AF driver IC 420 may transmit a control signal 409 to the AF coil 450 to adjust the positions of the first AF magnet and the second AF magnet. In one embodiment, the AF coil 450 may include a first AF coil (e.g., the first coil 225 in FIG. 2) and a second AF coil (e.g., the second coil 227 in FIG. 2). there is.

According to one embodiment, the AF driver IC 420 is installed in the AF coil 450 so that the first AF magnet and the second AF magnet are located at the first calibration position and the second calibration position, which are positions for compensating for tilt. The power applied to the first AF coil and the second AF coil can be controlled by transmitting the control signal 409.

According to one embodiment, the electronic device 100 is configured such that the first position and the first calibration position are the same or have a difference less than a threshold, and the second position and the second calibration position are the same or have a difference less than the threshold. If the difference is less than 100%, the operation to correct the tilt can be terminated.

According to one embodiment, the operation of the AF driver IC 420 may be performed by the processor 410.

Figure 5 shows a ball-type first AF driver 500 according to an embodiment. FIG. 6 shows a shaft-type second AF driving unit 600 according to an embodiment.

Referring to FIGS. 5 and 6 , some of a plurality of components included in the AF driver (eg, the first AF driver 500 and/or the second AF driver 600) are shown. At this time, some descriptions of the same configurations as those described with reference to FIGS. 1 to 4 may be omitted. FIGS. 5 and 6 illustrate a direct optical system in which light passing through the optical axis of a lens from a subject is not refracted and is directly incident on an image sensor (eg, the image sensor 120 of FIG. 1 ).

Referring to FIG. 5, a camera module (e.g., the camera module 180 of FIG. 1) may include a first AF driver 500 to perform an AF function. In one embodiment, the first AF driver 500 includes an AF carrier 540 (e.g., the AF carrier 210 of FIG. 2) and a first AF driver IC 512 (e.g., the first driver IC of FIG. 2 (e.g., 221)), second AF driver IC 522 (e.g., second driver IC 223 in FIG. 2), first AF magnet 513 (e.g., first magnet 211 in FIG. 2), second AF magnet 523 (e.g., second magnet 213 in FIG. 2), first AF coil 511 (e.g., first coil 225 in FIG. 2), second AF coil 521 (e.g. It may include a second coil 227 in FIG. 2). The AF driver according to one embodiment may control both ends of the first AF driver 500 by arranging the first AF driver IC 512 and the second AF driver IC 522 at both ends, respectively.

For example, the first AF driver 500 of the camera module 180 may control the current applied to the first AF coil 511 through the first AF driver IC 512. According to one embodiment, as current is applied to the first AF coil 511, the AF driver may move in the optical axis direction by the magnetic force generated between the first AF magnet 513 and the first AF coil 511. . In addition, the AF driver of the camera module 180 controls the current applied to the second AF coil 521 through the second AF driver IC 522 to be different from the current applied to the first AF coil 511. You can control it. According to one embodiment, as current is applied to the second AF coil 521, the first AF driver 500 moves along the optical axis by the magnetic force generated between the second AF magnet 523 and the second AF coil 521. You can move in any direction.

According to one embodiment, the first AF driver IC 512 and the second AF driver IC 522 are memory of the electronic device 100 (e.g., memory 440 in FIG. 4 and memory 1130 in FIG. 11). The magnitude of the current applied to the first AF coil 511 and the second AF coil 521 can be controlled based on the calibration value stored in . For example, the first AF driver IC 512 and the second AF driver IC 522 perform AF driving using a calibration value that ensures that both ends of the first AF driver 500 have substantially the same stroke. You can control it. According to one embodiment, the calibration value may include a value determined as the same stroke adjustment process is applied to both ends of the first AF driver 500 in the process step of the electronic device 100. An example of setting a calibration value according to an embodiment will be described later with reference to FIG. 9.

According to one embodiment, the first AF driver IC 512 and the second AF driver IC 522 may each include a built-in Hall sensor. For example, the first AF driver IC 512 may include a first AF Hall sensor (eg, the third Hall sensor described with reference to FIGS. 2 and 3). For example, the second AF driver IC 522 may include a second AF Hall sensor (eg, the fourth Hall sensor described with reference to FIGS. 2 and 3).

According to one embodiment, at least one Hall sensor may detect displacement of at least one carrier through the position of a magnet moving with the at least one carrier. According to one embodiment, the first AF Hall sensor may measure the position of the opposing first AF magnet 513 with respect to the first AF Hall sensor through interaction with the opposing first AF magnet 513. there is. For example, the first AF Hall sensor may detect the position of the opposing first AF magnet 513 by measuring a change in the magnetic field formed by the opposing first AF magnet 513. Therefore, the first AF Hall sensor is built into the first AF driver IC 512 at the center of the first AF coil 511 and measures the position of the first AF magnet 513 in the optical axis direction with respect to the first AF Hall sensor. It can be configured to do so. According to one embodiment, the first AF driver IC 512 detects the displacement of the AF carrier 540 in the optical axis direction measured through the first AF Hall sensor and detects the displacement of the AF carrier 540 in the optical axis direction, and detects the displacement in the optical axis direction of the AF carrier 540 through a memory (e.g., the memory 440 of FIG. 4, The current applied to the first AF coil 511 can be controlled based on the calibration value stored in the memory 1130 of FIG. 11). For example, the first AF driver IC 512 may control the current applied to the first AF coil 511 to position the AF carrier 540 at a position determined based on the calibration value. Accordingly, the first AF driver IC 512 can control the displacement of the first end (a) of the AF carrier 540 in the optical axis direction.

According to one embodiment, the second AF Hall sensor may measure the position of the opposing second AF magnet 523 with respect to the second AF Hall sensor through interaction with the opposing second AF magnet 523. there is. For example, the second AF Hall sensor may detect the position of the opposing second AF magnet 523 by measuring a change in the magnetic field formed by the opposing second AF magnet 523. Therefore, the second AF Hall sensor is built into the second AF driver IC 522 at the center of the second AF coil 521 to measure the position of the second AF magnet 523 in the optical axis direction with respect to the second AF Hall sensor. It can be configured to do so. According to one embodiment, the second AF driver IC 522 detects the displacement of the AF carrier 540 in the optical axis direction measured through the second AF Hall sensor and detects the displacement of the AF carrier 540 in the optical axis direction and detects the displacement in the optical axis direction of the memory (e.g., memory 440 of FIG. 4, The current applied to the second AF coil 521 can be controlled based on the calibration value stored in the memory 1130 of FIG. 11). For example, the second AF driver IC 522 may control the current applied to the second AF coil 521 to position the AF carrier 540 at a position determined based on the calibration value. Accordingly, the second AF driver IC 522 can control the displacement of the second end (b) of the AF carrier 540 in the optical axis direction. According to one embodiment, the components of the first AF driver 500 corresponding to the first stage (a) and the second stage (b) of the AF driver are controlled separately, so that the first stage (a) and the second stage (b) are controlled separately. Step 2 (b) Tilt that may occur due to height differences in the optical axis direction can be compensated. For example, as the first AF driver 500 is driven, the first end (a) and the second end (b) may be positioned at substantially the same displacement in the optical axis direction.

According to one embodiment, the AF carrier 540 may include an AF ball 530 (eg, AF ball 230 in FIG. 2) on one side. According to one embodiment, the lens barrel (e.g., the lens barrel described with reference to FIG. 1) may be moved inside the housing (e.g., the second housing 240 of FIG. 2) by the rolling movement of the AF ball 230. According to one embodiment, when the AF carrier 540 moves due to the electromagnetic force generated between the first AF coil 511 and the first AF magnet 513, the rolling movement of the AF ball 530 You can move.

Referring to FIG. 6, the camera module 180 may include a second AF driver 600 to perform an AF function. In one embodiment, the second AF driver 600 includes an AF carrier 640, a third AF driver IC 612 (e.g., the first driver IC 221 in FIG. 2), and a fourth AF driver IC 622. (e.g., the second driver IC 223 in FIG. 2), the third AF magnet 613 (e.g., the first magnet 211 in FIG. 2), and the fourth AF magnet 623 (e.g., the first magnet 623 in FIG. 2). 2 magnet 213), a third AF coil 611 (e.g., the first coil 225 in FIG. 2), and a fourth AF coil 621 (e.g., the second coil 227 in FIG. 2). can do. The AF driver according to one embodiment may control both ends of the second AF driver 600 by arranging a third AF driver IC 612 and a fourth AF driver IC 622 at both ends, respectively.

According to one embodiment, the third AF coil 611 and the fourth AF coil 621 may perform the same and/or similar operations as the first AF coil 511 and the second AF coil 521, respectively. . Additionally, the third AF magnet 613 and the fourth AF magnet 623 may perform the same and/or similar operations as the first AF magnet 513 and the second AF magnet 523, respectively. In addition, the third AF driver IC 612 and the fourth AF driver IC 622 may perform the same and/or similar operations as the first AF driver IC 512 and the second AF driver IC 522, respectively. . Accordingly, the third AF driver IC 612 may include a third AF Hall sensor that performs a similar operation as the first AF Hall sensor. Additionally, the fourth AF driver IC 622 may include a fourth AF Hall sensor that performs a similar operation as the second AF Hall sensor.

According to one embodiment, the components of the AF driving unit corresponding to the first stage (a) and the second stage (b) of the AF driving unit are controlled separately, so that the first stage (a) and the second stage (b) Tilt that may occur due to height differences in the optical axis direction can be compensated. According to one embodiment, the AF carrier 540 of FIG. 5 and the AF carrier 640 of FIG. 6 may perform the same and/or similar operations.

According to one embodiment, the AF carrier 640 of FIG. 6 may include an AF shaft (not shown) on one side. According to one embodiment, a lens barrel may be slidably installed on a shaft extending in the optical axis direction. Accordingly, as the lens barrel or AF carrier 640 is slid by the shaft, it may move inside the housing (eg, the second housing 240 in FIG. 2). According to one embodiment, when the AF carrier 640 moves due to electromagnetic force generated between the third AF coil 611 and the third AF magnet 613, it may move by sliding by the AF shaft. According to one embodiment, when the AF carrier 640 moves due to electromagnetic force generated between the fourth AF coil 621 and the fourth AF magnet 623, it may move by sliding by the AF shaft.

FIG. 7A is a diagram illustrating a light movement path according to a ball-type (or refractive ball-type) AF driver including a folded-type optical system according to an embodiment. FIG. 7B is a diagram illustrating a light movement path according to a shaft-type (or refractive shaft-type) AF driving unit including a folded-type optical system according to an embodiment. Figure 8 shows a camera module including a folded type optical system with an AF magnet located at the bottom, according to an embodiment.

7A, 7B, and/or 8, a curved camera module (eg, camera module 180) is shown. 7A, 7B, and/or 8 may be classified depending on whether the method of moving the lens assembly 111 in the optical axis direction is a ball type or a shaft type. Accordingly, other than that, the configuration and operation for AF driving may be similar. Accordingly, descriptions that overlap with those described with reference to FIGS. 1 to 6 may be omitted.

7A, 7B and/or 8 show an optical path from a subject to an image sensor (e.g., image sensor 120 in FIG. 1) through a lens assembly (e.g., lens assembly 111 in FIG. 1) and a prism. It shows a refractive optical system that has been refracted more than once.

Referring to FIG. 7A, the camera module 180 (e.g., the camera module 180 in FIG. 1) uses an AF driver (e.g., the AF driver in FIG. 2, the first AF driver 500 in FIG. 5) to perform the AF function. ) and/or the second AF driver 600 of FIG. 6). In one embodiment, the refractive ball-type AF driver 710 includes a first lens assembly 711 (e.g., the lens assembly 111 of FIG. 1) and a first refractive AF driver IC 714_1 (e.g., FIG. 2). of the first driver IC 221), the second bending AF driver IC 714_2 (e.g., the second driver IC 223 in FIG. 2), and the first bending type AF magnet 715_1 (e.g., in FIG. 2) First magnet 211), second bending AF magnet 715_2 (e.g., second magnet 213 in FIG. 2), first bending AF coil 713_1 (e.g., first coil 225 in FIG. ), and may include a second refractive AF coil 713_2 (e.g., the second coil 227 in FIG. 2). The AF driver according to one embodiment may control both ends of the AF driver by arranging a first refractive AF driver IC (714_1) and a second refractive AF driver IC (714_2) at both ends, respectively.

According to one embodiment, the refractive ball-type AF driver 710 of FIG. 7A moves from the subject through the first lens assembly 711 and the first prism 716 to the image sensor 120 described with reference to FIG. 1. It may include a refractive optical system in which the optical path leading to the light path is refracted one or more times. Accordingly, the refractive ball-type AF driver 710 can perform the AF function by moving the first lens assembly 711 in the optical axis direction.

For example, the refractive ball type AF driver 710 may control the current applied to the first refractive AF coil 713_1 through the first refractive AF driver IC 714_1. According to one embodiment, as current is applied to the first refractive AF coil (713_1), the first lens is formed by a magnetic force generated between the first refractive AF magnet (715_1) and the first refractive AF coil (713_1). The assembly 711 may move in the optical axis direction. In addition, the refractive ball type AF driver 710 of the camera module 180 transfers the current applied to the second refractive AF coil 713_2 through the second refractive AF driver IC 714_2 to the first refractive AF coil. It can be controlled so that a current different from the current applied to (713_1) is applied. According to one embodiment, as current is applied to the second refractive AF coil 713_2, the first lens is formed by a magnetic force generated between the second refractive AF magnet 715_2 and the second refractive AF coil 713_2. The assembly 711 may move in the optical axis direction.

According to one embodiment, the first refractive AF driver IC 714_1 and the second refractive AF driver IC 714_2 are memory of the electronic device 100 (e.g., memory 440 of FIG. 4, memory of FIG. 11). The magnitude of the current applied to the first refractive AF coil 713_1 and the second refractive AF coil 713_2 can be controlled based on the calibration value stored in (1130)). For example, the first refractive AF driver IC (714_1) and the second refractive AF driver IC (714_2) use a calibration value such that both ends of the AF driving unit have substantially the same stroke to form the first lens assembly. Movement of the optical axis direction of (711) can be controlled. According to one embodiment, the calibration value may include a value determined as the same stroke adjustment process is applied to both ends of the AF driver in the process step of the electronic device 100. An example of setting a calibration value according to an embodiment will be described later with reference to FIG. 9.

According to one embodiment, the first refractive-type AF driver IC 714_1 and the second AF refractive-type driver IC 714_2 may each include a built-in Hall sensor. For example, the first refractive AF driver IC 714_1 may include a first refractive AF Hall sensor (eg, the first Hall sensor described with reference to FIG. 2). For example, the second refractive AF driver IC 714_2 may include a second refractive AF Hall sensor (eg, the second Hall sensor described with reference to FIG. 2).

According to one embodiment, at least one Hall sensor may detect displacement of the lens assembly through the position of the magnet that moves together with the at least one carrier and the lens assembly. According to one embodiment, the first refractive AF Hall sensor interacts with the opposing first refractive AF magnet 715_1 to detect the first refractive AF hole of the opposing first refractive AF magnet 715_1. The position of the sensor can be measured. For example, the first refractive AF Hall sensor may detect the position of the opposing first refractive AF magnet (715_1) by measuring changes in the magnetic field formed by the opposing first refractive AF magnet (715_1). there is. Therefore, the first refracted AF Hall sensor is built into the first refracted AF driver IC 714_1 at the center of the first refracted AF coil 713_1, and the first refracted AF hall sensor is installed in the first refracted AF driver IC 714_1 at the center of the first refracted AF coil 713_1. It can be configured to measure the position of the optical axis direction with respect to the type AF Hall sensor. According to one embodiment, the first refractive AF driver IC 714_1 detects the displacement in the optical axis direction of the first lens assembly 711 measured through the first refractive AF Hall sensor, and stores the displacement in a memory (e.g., FIG. 4 The current applied to the first refractive AF coil 713_1 can be controlled based on the calibration value stored in the memory 440 (memory 1130 of FIG. 11). For example, the first refractive AF driver IC 714_1 adjusts the current applied to the first refractive AF coil 713_1, so that the first lens assembly 711 is positioned at a position determined based on the calibration value. You can control it to do so.

According to one embodiment, the second refractive AF Hall sensor interacts with the opposing second refractive AF magnet 715_2 to detect the second refractive AF hole of the opposing second refractive AF magnet 715_2. The position of the sensor can be measured. For example, the second refractive AF Hall sensor may detect the position of the opposing second refractive AF magnet (715_2) by measuring changes in the magnetic field formed by the opposing second refractive AF magnet (715_2). there is. Accordingly, the second refracted AF Hall sensor is built into the second refracted AF driver IC 714_2 at the center of the second refracted AF coil 713_2, and the second refracted AF hall sensor is built into the second refracted AF magnet 715_2. It can be configured to measure the position of the optical axis direction with respect to the type AF Hall sensor. According to one embodiment, the second refractive AF driver IC 714_2 detects the displacement in the optical axis direction of the first lens assembly 711 measured through the second refractive AF Hall sensor, and stores the displacement in a memory (e.g., FIG. 4 The current applied to the second refractive AF coil 713_2 can be controlled based on the calibration value stored in the memory 440 (memory 1130 of FIG. 11). For example, the second refractive AF driver IC 714_2 adjusts the current applied to the second refractive AF coil 713_2, so that the first lens assembly 711 is positioned at a position determined based on the calibration value. You can control it to do so. Accordingly, the components of the AF driving unit corresponding to both ends (e.g., the first end (a) and the second end (b) in FIG. 5) divided based on the optical axis of the AF driving unit are controlled separately, so that the 1 Tilt based on the distortion of the lens assembly 711 can be compensated. For example, as both ends of the first lens assembly 711 are controlled separately, distortion of the first lens assembly 711 can be effectively compensated.

According to one embodiment, the refractive ball type AF driver 710 may include a refractive AF ball 712 (eg, AF ball 230 in FIG. 2) on at least one side. According to one embodiment, the first lens assembly 711 may move inside the housing (eg, the second housing 240 in FIG. 2) by the rolling movement of the refractive AF ball 712. According to one embodiment, the electromagnetic force generated between the first bending AF coil (713_1) and the first bending AF magnet (715_1), the second bending AF coil (713_2), and the second bending AF magnet (715_2) The first lens assembly 711 can be moved by the rolling movement of the refractive AF ball 712.

Referring to FIG. 7B, the camera module 180 may include an AF driver to perform the AF function. In one embodiment, the first articulated shaft type AF driver 720 may include an AF driver to perform an AF function. In one embodiment, the first refractive shaft type AF driver 720 includes a second lens assembly 721 (e.g., the lens assembly 111 of FIG. 1) and a third refractive AF driver IC 724_1 (e.g., The first driver IC 221 in FIG. 2), the fourth refractive AF driver IC 724_2 (e.g., the second driver IC 223 in FIG. 2), and the third refractive AF magnet 725_1 (e.g., FIG. 2 first magnet 211), fourth bending AF magnet 725_2 (e.g., second magnet 213 in FIG. 2), third bending AF coil 723_1 (e.g., first bending type AF coil 723_1 in FIG. 2) It may include a coil 225) and a fourth refractive AF coil 723_2 (eg, the second coil 227 in FIG. 2). The AF driver according to one embodiment may control both ends of the AF driver by arranging a third refractive AF driver IC (724_1) and a fourth refractive AF driver IC (724_2) at both ends, respectively.

According to one embodiment, the third refractive AF coil 723_1 and the fourth refractive AF coil 723_2 are the same as the first refractive AF coil 713_1 and the second refractive AF coil 713_2, respectively, and/ Alternatively, a similar operation can be performed. In addition, the third refracted AF magnet 725_1 and the fourth refracted AF magnet 725_2 have the same and/or similar operations as the first refracted AF magnet 715_1 and the second refracted AF magnet 715_2, respectively. It can be done. In addition, the third refracted AF driver IC 724_1 and the fourth refracted AF driver IC 724_2 are the same as the first refracted AF driver IC 714_1 and the second refracted AF driver IC 714_2, respectively, and/ Alternatively, a similar operation can be performed. Accordingly, the third refractive AF driver IC 724_1 may include a third refractive AF Hall sensor that performs a similar operation as the first refractive AF Hall sensor. Additionally, the fourth refractive AF driver IC 724_2 may include a fourth refractive AF Hall sensor that performs a similar operation as the second refractive AF Hall sensor.

According to one embodiment, the third refractive AF driver IC 724_1 and the fourth refractive AF driver IC 724_2 are connected to the third refractive AF coil 723_1 and the fourth refractive AF coil 723_2, respectively. By controlling the applied current, the second lens assembly 721 moves in the direction of the optical axis to perform the AF function and compensate for the distortion of the second lens assembly 721.

The first refractive shaft type AF driver 720 of FIG. 7B has an optical path from the subject to the image sensor 120 described with reference to FIG. 1 through the second lens assembly 721 and the second prism 726. It may include a refractive optical system that is refracted more than once. Accordingly, the first refractive shaft type AF driver 720 can perform the AF function by moving the first lens assembly 721 in the optical axis direction.

According to one embodiment, the first articulated shaft type AF driver 720 of FIG. 7B may include a first AF shaft 722 on at least one side. According to one embodiment, the second lens assembly 721 may be slidably installed on a shaft extending in the optical axis direction. Therefore, as the second lens assembly 721 is slid by the first AF shaft 722_1 and/or the second AF shaft 722_2, it moves inside the housing (e.g., the second housing 240 in FIG. 2). You can. According to one embodiment, the electromagnetic force generated between the third refracted AF coil (723_1) and the third refracted AF magnet (725_1), the fourth refracted AF coil (723_2), and the fourth refracted AF magnet (725_2) When the second lens assembly 721 moves, the second lens assembly 721 may move by sliding by the first AF shaft 722_1 and/or the second AF shaft 722_2. At this time, since both ends of the second lens assembly 721 are controlled separately, the distortion of the second lens assembly 721 can be effectively compensated.

Referring to FIG. 8, the camera module 180 may include an AF driver to perform the AF function. In one embodiment, the second articulated shaft type AF driver 810 may include an AF driver to perform an AF function. In one embodiment, the second articulated shaft type AF driver 810 may perform a similar operation as the first articulated shaft type AF driver 720. However, the second articulated shaft type AF driving unit 810 may have some configurations arranged differently from the first articulated shaft type AF driving unit 720 and may be configured as a solenoid type.

According to one embodiment, the second refracted shaft type AF driver 810 includes a fifth refracted AF driver IC 814_1 and a sixth refracted AF driver IC 814_2 disposed on a plane substantially perpendicular to the optical axis. It can be included. Additionally, the second refractive shaft type AF driver 810 may include a fifth refractive AF coil 813_1 and a sixth refractive AF coil 813_2 disposed on a plane substantially perpendicular to the optical axis. In addition, the second bent shaft type AF driver 810 includes a fifth bendable AF magnet 815_1 and a sixth bendable AF coil 813_2 disposed in a direction facing the fifth bendable AF coil 813_1. It may include a sixth refractive AF magnet (815_2) disposed in a facing direction.

According to one embodiment, the second articulated shaft type AF driver 810 has a fifth articulated AF driver IC (814_1) and a sixth articulated AF driver IC (814_2) disposed at both ends, respectively, to operate the third AF shaft. (812_1) and/or the fourth AF shaft (812_2) may be moved in the optical axis direction.

For example, the fifth refractive AF coil 813_1 may be arranged substantially perpendicular to the optical axis direction and face the fifth refractive AF magnet 815_1. Additionally, the sixth refractive AF coil 813_2 may be arranged substantially perpendicular to the optical axis direction and face the sixth refractive AF magnet 815_2.

According to one embodiment, the fifth refractive AF coil 813_1 and the fifth refractive AF magnet 815_1 may generate magnetic force (attractive force and/or repulsive force) through interaction. Accordingly, the third AF shaft 812_1 and/or the fourth AF shaft 812_2 can be moved in the optical axis direction. For example, a current flows through the fifth bending AF coil (813_1) to generate a magnetic field, and the third AF shaft is formed using the attractive and/or repulsive force generated by the magnetic field and the fifth bending AF magnet (815_1). (812_1) and/or the fourth AF shaft (812_2) may be moved in the optical axis direction. According to the present disclosure, the type of AF driving unit that generates attractive and/or repulsive force as described above may be referred to as a solenoid type.

According to one embodiment, the sixth refracted AF coil (813_2) performs a similar operation as the fifth refracted AF coil (813_1), and the sixth refracted AF magnet (815_2) performs a similar operation as the fifth refracted AF coil (815_1). ) can perform similar operations. Accordingly, the third AF shaft 812_1 and/or the fourth AF shaft 812_2 can be moved in the optical axis direction.

According to one embodiment, the third lens assembly 811 may move in the optical axis direction as the third AF shaft 812_1 and/or the fourth AF shaft 812_2 moves in the optical axis direction.

According to one embodiment, the fifth refractive AF driver IC 814_1 may include a fifth refractive AF Hall sensor that performs a similar operation as the third refractive AF Hall sensor. Additionally, the sixth refractive AF driver IC 814_2 may include a sixth refractive AF Hall sensor that performs a similar operation as the fourth refractive AF Hall sensor.

According to one embodiment, the fifth refracted AF driver IC 814_1 and the sixth refracted AF driver IC 814_2 are connected to the fifth refracted AF coil 813_1 and the sixth refracted AF coil 813_2, respectively. Each applied current can be controlled. Accordingly, a magnetic field is formed in each of the fifth refractive AF coil 813_1 and the sixth refractive AF coil 813_2, and the third lens assembly 811 moves in the optical axis direction to perform the AF function while the third lens assembly (813_2) 811) can compensate for distortion.

According to various embodiments, the components of the AF driver may be arranged in various ways without being limited to those shown in FIGS. 7A, 7B, and 8. For example, the second bending shaft type AF driver 810 includes a fifth bending type AF driver IC (814_1), a sixth bending type AF driver IC (814_2), a fifth bending type AF coil (813_1), and a sixth bending type AF driver IC (814_1). A bending type AF coil (813_2), a fifth bending type AF magnet (815_1), and a sixth bending type AF magnet (815_2) are disposed at the lower part of the third prism (816), and some of the above structures are combined with an AF carrier. It may include a support member that moves the third lens assembly 811 in the optical axis direction. In one embodiment, the components of the articulated ball type AF driver 710, the first articulated shaft type AF driver 720, or the second articulated shaft type AF driver 810 are not limited to those shown, A lens assembly (e.g., first lens assembly 711, second lens assembly 721, or third lens assembly 811) and/or prism (e.g., first prism 716, second prism 726) , or may be arranged separately to control (or move) the third prism 816).

For example, the fifth refracted AF driver IC (814_1), the sixth refracted AF driver IC (814_2), the fifth refracted AF coil (813_1), the sixth refracted AF coil (813_2), and the fifth refracted AF coil. The AF magnet 815_1 and the sixth refractive AF magnet 815_2 are disposed at the lower end of the third prism 816, and some of the above configurations include a third AF shaft 812_1 and/or a fourth AF shaft ( It may include a support member coupled to 812_2). Accordingly, the second refractive shaft type AF driving unit 810 can move the third lens assembly 811 in the optical axis direction by sliding by the third AF shaft 812_1 and/or the fourth AF shaft 812_2. there is. Alternatively, the fifth refractive AF driver IC (814_1), the fifth refractive AF coil (813_1), and the fifth refractive AF magnet (815_1) are disposed on the side (side) of the lens assembly 811, and the sixth refractive AF driver IC (814_1) The refractive AF driver IC 814_2, the sixth refractive AF coil 813_2, and the sixth refractive AF magnet 815_2 may be disposed on the side (side) of the third prism 816.

According to one embodiment, the plane facing the second lens assembly 721 among the planes of the second prism 726 and/or the plane facing the third lens assembly 811 among the planes of the third prism 816 The side may be referred to as the top portion. Additionally, each surface of the second prism 726 and/or the third prism 816 facing the image sensor 120 may be referred to as a lower portion. In one embodiment, the surface of the second prism 726 and/or the third prism 816 surrounding the upper and lower parts may be referred to as a side surface.

According to one embodiment, the third refractive AF driver IC (724_1), the third refractive AF coil (723_1), and the third refractive AF magnet (725_1) are located on one of the side surfaces of the second prism (726). Can be placed opposite each other. In addition, the fourth refracted AF magnet 725_2, the fourth refracted AF driver IC 724_2, and the fourth refracted AF coil 723_2 are disposed opposite to one of the side surfaces of the second prism 726. You can. According to one embodiment, when the components are arranged on at least one side of the second prism 726 as described above, one axis of the second prism 726 and the inside of the second lens assembly 721 And/or OIS or sensor OIS may be implemented based on one axis.

According to one embodiment, the fifth refracted AF driver IC (814_1), the fifth refracted AF coil (813_1), and the fifth refracted AF magnet (815_1) are located on one of the side surfaces of the third prism (816). Can be placed opposite each other. In addition, the sixth refracted AF magnet (815_2), the sixth refracted AF driver IC (814_2), and the sixth refracted AF coil (813_2) are disposed opposite to one of the side surfaces of the third prism (816). You can. According to one embodiment, when the components are arranged on at least one side of the third prism 816 as described above, one axis of the third prism 816 and the inside of the third lens assembly 811 And/or OIS or sensor OIS may be implemented based on one axis.

Figure 9 is a flowchart 900 showing the operation of determining a calibration value through a stroke adjustment process according to an embodiment.

Referring to FIG. 9, in operation 901, a processor (e.g., processor 410 in FIG. 4, processor 1120 in FIG. 11) uses a first AF driver IC (e.g., processor 1120 in FIG. 4) to adjust strokes of both ends of the AF driver in the process. : Perform the first Hall calibration through the first AF Hall sensor (e.g., the first Hall sensor described with reference to FIG. 2) for the first driver IC 221 in FIG. 2, and the second AF driver IC ( Example: The second Hall calibration can be performed through the second AF Hall sensor (e.g., the second Hall sensor described with reference to FIG. 2) for the second driver IC 223 of FIG. 2.

According to one embodiment, in operation 903, the processor may measure a first stroke on the first AF driver IC side and a second stroke on the second AF driver IC side among both ends of the AF driver. For example, the processor may generate a first AF Hall sensor facing the first AF Hall sensor in the optical axis direction through the first AF Hall sensor built into the first AF driver IC among both ends of the AF driving unit divided based on the lens assembly 111. The first stroke, which is a position measured based on the second housing 240 of the AF magnet (e.g., the first magnet 211 in FIG. 2), can be measured. In addition, the processor generates a second AF magnet facing the second AF Hall sensor in the optical axis direction through the second AF Hall sensor built into the second AF driver IC among both ends of the AF driving unit divided based on the lens assembly 111. The second stroke, which is a position measured based on the second housing 240 of the second magnet 213 in FIG. 2, can be measured.

According to one embodiment, the processor may adjust the first stroke and the second stroke based on the first AF driver IC and the second AF driver IC in operation 905. For example, the position of the first AF magnet can be adjusted by controlling the current applied to the first AF coil (e.g., the first coil 225 in FIG. 2) for the first AF driver through the first AF driver IC. there is. For example, the position of the second AF magnet can be adjusted by controlling the current applied to the second AF coil (e.g., the second coil 227 in FIG. 2) for the second AF driver through the second AF driver IC. there is.

According to one embodiment, in operation 907, the processor may determine whether the first stroke value and the second stroke value substantially match. For example, the processor determines whether the height of the first AF magnet from the second housing 240 and the substantially height of the second AF magnet from the second housing 240 match with respect to the second housing 240. You can. For example, the processor may determine whether the first stroke value and the second stroke value match. For example, the processor may determine whether the difference between the first stroke value and the second stroke value is less than a threshold value. In one embodiment, the threshold value may mean a value that can be determined to substantially match.

According to one embodiment, in operation 909, in response to the first stroke and the second stroke value substantially matching, the processor generates a first calibration value for the first AF driver IC side and a first calibration value for the second AF driver IC side. 2 The calibration value can be stored in memory (e.g., memory 440 in FIG. 4 and memory 1130 in FIG. 11). For example, the electronic device 100 may store a first calibration value in a memory included in the first AF driver IC and store a second calibration value in a memory included in the second AF driver IC. According to one embodiment, the first calibration value may be determined based on the current value applied by the first AF driver IC to the first AF coil when the first stroke and the second stroke are the same. According to one embodiment, the second calibration value may correspond to a current value applied by the second AF driver IC to the second AF coil when the first stroke and the second stroke are the same.

According to one embodiment, when the first stroke and the second stroke do not substantially match, the electronic device 100 may repeatedly perform operations 907 to 905.

FIG. 10 is a flowchart 1000 illustrating an operation of determining an offset value through an additional adjustment process according to an embodiment.

According to one embodiment, an electronic device (e.g., the electronic device 100 of FIG. 1) may compensate for tilt and/or distortion that occurs during the assembly process of a camera module (e.g., the camera module 180 of FIG. 1). . Hereinafter, inclination and/or distortion may be expressed as tilt.

During the assembly process of the camera module 180 of the electronic device 100, the lens assembly (eg, the lens assembly 111 of FIG. 1) may be distorted and/or tilted. For example, tilt and/or distortion may occur in the process of placing the lens assembly 111 on a component of the base housing (eg, housing 240 in FIG. 2).

According to one embodiment, tilt and/or distortion occurring in the above additional process can be compensated for by adjusting the offset value. For example, the offset value may be a value stored inside the AF driver IC (e.g., AF driver IC 420 in FIG. 4) or in a separate memory (e.g., memory 440 in FIG. 4).

According to one embodiment, a processor (e.g., processor 410 in FIG. 4 and processor 1120 in FIG. 11) may determine whether AF tilt compensation is necessary based on tilt and/or distortion that occurred in an additional process. . For example, in operation 1001, the processor may determine whether the first location and the second location are substantially the same. According to one embodiment, the first position may indicate the position of the first AF magnet (e.g., the first magnet 211 of FIG. 2) from the base housing (e.g., the second housing 240 of FIG. 2). According to one embodiment, the second position may indicate the position of the second AF magnet (e.g., the second magnet 213 in FIG. 2) from the base housing (e.g., the second housing 240 in FIG. 2).

According to one embodiment, the processor may determine that the first location and the second location are substantially the same when they are the same or differ by less than a threshold value. In one embodiment, the processor may perform operation 1005 when the first location and the second location are substantially the same.

In one embodiment, if the first position and the second position are not substantially the same, the processor determines the first AF driver IC (e.g., first driver IC 221 of FIG. 2) and the second AF driver IC in operation 1003. (For example, the offset value of the second driver IC 223 in FIG. 2) can be adjusted. According to one embodiment, the offset value is the first AF coil (e.g., the first coil 225 of FIG. 2) facing the first AF magnet and the second coil (e.g., the first coil 225 in FIG. 2) facing the second AF magnet. It may include information for controlling the current applied to the second coil 227 of FIG. 2.

According to one embodiment, the processor may determine whether tilt compensation is complete in operation 1005. For example, the processor may apply current to the first AF coil and the second coil based on the offset value and determine whether the first position and the second position are substantially the same.

In one embodiment, when it is determined that the first location and the second location are substantially the same, the processor stores the determined offset value in memory (e.g., memory 440 in FIG. 4 or memory 1130 in FIG. 11) in operation 1007. Alternatively, it can be stored in the memory within the AF driver IC.

In one embodiment, the processor may perform operation 1003 again when it is determined that tilt compensation has not been completed (eg, when the first position and the second position differ by more than a threshold value).

The operation of the electronic device 100 described with reference to FIGS. 1 to 10 may be expressed as the operation of the camera module 180 and/or at least the processor.

As described above, an electronic device according to an embodiment of the present disclosure includes a housing, a lens assembly disposed along an optical axis, and operatively connected to the lens assembly to move the lens assembly in the optical axis direction within the housing. It may include an AF driver. The AF driving unit includes a first AF magnet disposed on a first surface of the lens assembly facing in a first direction and a second AF magnet disposed on a second surface facing in a direction opposite to the first direction with respect to the lens assembly. an AF carrier, a first AF coil disposed inside the housing to face the first AF magnet, a first driving circuit disposed at the center of the first AF coil to control a current applied to the first AF coil, It may include a second AF coil disposed inside the housing to face the second AF magnet, and a second driving circuit disposed at the center of the second AF coil to control the current applied to the second AF coil. . The first driving circuit controls the current applied to the first AF coil according to the position of the first AF magnet and the position of the second AF magnet to move the lens assembly in the optical axis direction through the AF carrier. and the second driving circuit controls the current applied to the second AF coil according to the position of the first AF magnet and the position of the second AF magnet, thereby using the AF carrier to control the lens assembly. can be moved in the direction of the optical axis.

According to one embodiment, the electronic device further includes a memory, wherein the memory stores a first calibration value related to a current applied to the first AF coil through the first driving circuit, and the second driving circuit. A second calibration value related to the current applied to the second AF coil may be stored through a circuit.

According to one embodiment, the first calibration value and the second calibration value are values for compensating tilt generated from a height difference between the first surface and the second surface of the lens assembly with respect to the housing.

According to one embodiment, the first driving circuit has a built-in first AF Hall sensor, and can measure the position of the first AF magnet with respect to the first AF Hall sensor using the first AF Hall sensor. .

According to one embodiment, the second driving circuit has a built-in second AF Hall sensor, and can measure the position of the second AF magnet with respect to the second AF Hall sensor using the second AF Hall sensor. .

According to one embodiment, the electronic device may determine the first calibration position by mapping the height of the first AF magnet from the housing based on the first calibration value.

According to one embodiment, the driving circuit measures a first current position, which is the height of the first AF magnet, from the housing using a first AF Hall sensor built in the first driving circuit, and determines the first calibration position. and the first current position, and based on the comparison result, the lens assembly may be moved in the optical axis direction by controlling the current applied to the first AF coil.

According to one embodiment, the electronic device may determine the second calibration position by mapping the height of the second AF magnet from the housing based on the second calibration value.

According to one embodiment, the second driving circuit measures a second current position, which is the height of the second AF magnet, from the housing using a second AF Hall sensor built in the second driving circuit, and the second driving circuit measures the second current position, which is the height of the second AF magnet, from the housing. The calibration position and the second current position may be compared, and based on the comparison result, the current applied to the second AF coil may be controlled to move the lens assembly in the optical axis direction.

According to one embodiment, the current applied by the first driving circuit to the first AF coil may be different from the current applied by the second driving circuit to the second AF coil.

According to one embodiment, the AF carrier further includes at least one AF ball, and the AF driver may control the lens assembly to move in the optical axis direction as the at least one AF ball rolls.

According to one embodiment, the AF carrier further includes at least one AF shaft, and the AF driver may control the lens assembly to move in the optical axis direction as the at least one AF shaft slides.

According to one embodiment, the electronic device may further include a prism onto which light passing through the lens assembly is incident, and an image sensor acquiring the light passing through the lens assembly and the prism.

According to one embodiment, the electronic device further includes an AF driver IC connected to the first driving circuit and the second driving circuit, and the AF driver IC connects the first driving circuit and the second driving circuit, respectively. You can control it.

According to one embodiment, the first driving circuit applies a current to the first AF coil based on the position of the second AF magnet with respect to the second AF Hall sensor obtained using the second AF Hall sensor. Controls, and the second driving circuit controls the current applied to the second AF coil based on the position of the first AF magnet with respect to the first AF Hall sensor obtained using the first AF Hall sensor. can do.

As described above, a camera module according to an embodiment of the present disclosure includes a housing, a lens assembly disposed along an optical axis, and operatively connected to the lens assembly to move the lens assembly in the optical axis direction within the housing. It may include an AF driving unit. The AF driving unit includes a first AF magnet disposed on a first surface of the lens assembly facing in the first direction and a second AF magnet disposed on a second surface facing in a direction opposite to the first direction with respect to the lens assembly. An AF carrier comprising, a first AF coil disposed inside the housing to face the first AF magnet, and a first driving circuit disposed at the center of the first AF coil to control the current applied to the first AF coil. , a second AF coil disposed inside the housing to face the second AF magnet, and a second driving circuit disposed at the center of the second AF coil to control the current applied to the second AF coil. You can. The second driving circuit can control the current applied to the second AF coil to move the lens assembly in the optical axis direction using the AF carrier.

According to one embodiment, the first driving circuit includes a first memory that stores a first calibration value related to a current applied to the first AF coil through the first driving circuit, and the second driving circuit includes It may include a second memory that stores a second calibration value related to the current applied to the second AF coil through the second driving circuit.

According to one embodiment, the first driving circuit controls the current applied to the first AF coil based on the first calibration value, and the second driving circuit controls the current applied to the first AF coil based on the second calibration value. The current applied to the AF coil can be controlled.

According to one embodiment, the first calibration value and the second calibration value may be values that compensate for tilt occurring from a height difference between the first surface and the second surface of the lens assembly with respect to the housing.

According to one embodiment, the first driving circuit includes a first AF Hall sensor, and measures the position of the first AF magnet with respect to the first AF Hall sensor using the first AF Hall sensor. You can. The second driving circuit may have a built-in second AF Hall sensor, and may measure the position of the second AF magnet with respect to the second AF Hall sensor using the second AF Hall sensor.

According to one embodiment, the first driving circuit measures the first current position, which is the height of the first AF magnet, from the housing using the first AF Hall sensor, and determines the first current position based on the first calibration value. The first calibration position and the first current position may be compared, and based on the comparison result, the current applied to the first AF coil may be controlled to move the lens assembly in the optical axis direction. The second driving circuit measures a second current position, which is the height of the second AF magnet, from the housing using the second AF Hall sensor, and has a second calibration position determined based on the second calibration value. The second current position may be compared, and based on the comparison result, the current applied to the second AF coil may be controlled to move the lens assembly in the optical axis direction.

As the design of lowering the height of the camera module is required, efforts are continuing to lower the height of the AF driver. However, as the height of the AF driving unit decreases, the AF driving stroke decreases, which may increase the straightness error in the length that the AF moves at the same interval. Accordingly, distortion and/or tilt (e.g., tilt) of the AF driving unit may increase. For example, the height of the AF drive unit is lowered and the ball bearing spacing is shortened, which may increase tilt sensitivity due to tolerance.

The camera module may include a refractive optical system in which light passing through the optical axis of the lens from the subject is refracted while passing through components of the optical system and enters the image sensor. If the camera module includes a folded type optical system, which is a refractive optical system, the back focus length (BFL) becomes significantly longer, and as the lens is tilted, the amount of parallax change on the image sensor's image sensor may become larger than before. As the height of the AF driver for performing lens AF decreases, a large tilt of the lens may occur.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

According to various embodiments disclosed in this document, tilt, distortion, or tilt due to AF driving can be compensated by separately controlling both ends of the AF driving unit of the camera module.

According to various embodiments, the camera module may compensate for inclination, distortion, or tilt due to AF driving by controlling the driving by arranging driver ICs at both ends of the AF driving unit.

The structure of the AF driver according to various embodiments can also be applied to the ball type and shaft type of a direct optical system in which light passing from the subject through the optical axis of the camera lens is directly incident on the image sensor without being refracted. Additionally, the structure of the AF driver according to various embodiments can also be applied to a camera module including a prism-type lens lead-type folded type optical system.

The AF driver according to various embodiments can improve driving power by securing a high driving current by controlling both ends with separate driver ICs.

The AF driving unit according to various embodiments can improve the stroke deviation at both ends of the AF by applying the same stroke adjustment process to both ends.

In addition, various effects that can be directly or indirectly identified through this document may be provided.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

FIG. 11 is a block diagram of an electronic device 1101 in a network environment 1100 according to various embodiments. Referring to FIG. 11, in the network environment 1100, the electronic device 1101 communicates with the electronic device 1102 through a first network 1198 (e.g., a short-range wireless communication network) or a second network 1199. It is possible to communicate with the electronic device 1104 or the server 1108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 1101 may communicate with the electronic device 1104 through the server 1108. According to one embodiment, the electronic device 1101 includes a processor 1120, a memory 1130, an input module 1150, an audio output module 1155, a display module 1160, an audio module 1170, and a sensor module ( 1176), interface 1177, connection terminal 1178, haptic module 1179, camera module 1180, power management module 1188, battery 1189, communication module 1190, subscriber identification module 1196. , or may include an antenna module 1197. In some embodiments, at least one of these components (eg, the connection terminal 1178) may be omitted or one or more other components may be added to the electronic device 1101. In some embodiments, some of these components (e.g., sensor module 1176, camera module 1180, or antenna module 1197) are integrated into one component (e.g., display module 1160). It can be.

The processor 1120, for example, executes software (e.g., program 1140) to operate at least one other component (e.g., hardware or software component) of the electronic device 1101 connected to the processor 1120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 1120 stores commands or data received from another component (e.g., sensor module 1176 or communication module 1190) in volatile memory 1132. The commands or data stored in the volatile memory 1132 can be processed, and the resulting data can be stored in the non-volatile memory 1134. According to one embodiment, the processor 1120 may include a main processor 1121 (e.g., a central processing unit or an application processor) or an auxiliary processor 1123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 1101 includes a main processor 1121 and a auxiliary processor 1123, the auxiliary processor 1123 may be set to use lower power than the main processor 1121 or be specialized for a designated function. You can. The auxiliary processor 1123 may be implemented separately from the main processor 1121 or as part of it.

The auxiliary processor 1123 may, for example, act on behalf of the main processor 1121 while the main processor 1121 is in an inactive (e.g., sleep) state, or while the main processor 1121 is in an active (e.g., application execution) state. ), together with the main processor 1121, at least one of the components of the electronic device 1101 (e.g., the display module 1160, the sensor module 1176, or the communication module 1190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 1123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 1180 or communication module 1190). there is. According to one embodiment, the auxiliary processor 1123 (e.g., neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 1101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 1108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted Boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 1130 may store various data used by at least one component (eg, the processor 1120 or the sensor module 1176) of the electronic device 1101. Data may include, for example, input data or output data for software (e.g., program 1140) and instructions related thereto. Memory 1130 may include volatile memory 1132 or non-volatile memory 1134.

The program 1140 may be stored as software in the memory 1130 and may include, for example, an operating system 1142, middleware 1144, or application 1146.

The input module 1150 may receive commands or data to be used in a component of the electronic device 1101 (e.g., the processor 1120) from outside the electronic device 1101 (e.g., a user). The input module 1150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 1155 may output sound signals to the outside of the electronic device 1101. The sound output module 1155 may include, for example, a speaker or receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 1160 can visually provide information to the outside of the electronic device 1101 (eg, a user). The display module 1160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 1160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 1170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 1170 acquires sound through the input module 1150, the sound output module 1155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 1101). Sound may be output through an electronic device 1102 (e.g., speaker or headphone).

The sensor module 1176 detects the operating state (e.g., power or temperature) of the electronic device 1101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 1176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 1177 may support one or more designated protocols that can be used to directly or wirelessly connect the electronic device 1101 to an external electronic device (eg, the electronic device 1102). According to one embodiment, the interface 1177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1178 may include a connector through which the electronic device 1101 can be physically connected to an external electronic device (eg, the electronic device 1102). According to one embodiment, the connection terminal 1178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 1179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 1179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1180 can capture still images and moving images. According to one embodiment, the camera module 1180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1188 can manage power supplied to the electronic device 1101. According to one embodiment, the power management module 1188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 1189 may supply power to at least one component of the electronic device 1101. According to one embodiment, the battery 1189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 1190 provides a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 1101 and an external electronic device (e.g., electronic device 1102, electronic device 1104, or server 1108). It can support establishment and communication through established communication channels. Communication module 1190 operates independently of processor 1120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 1190 is a wireless communication module 1192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 1198 (e.g., a short-range communication network such as Bluetooth, WiFi Direct (wireless fidelity direct), or IrDA (infrared data association)) or a second network 1199 (e.g. It may communicate with an external electronic device 1104 through a telecommunication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 1192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1196 to communicate within a communication network such as the first network 1198 or the second network 1199. The electronic device 1101 can be confirmed or authenticated.

The wireless communication module 1192 may support 5G networks and next-generation communication technologies after 4G networks, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 1192 may support high frequency bands (e.g., mmWave bands), for example, to achieve high data rates. The wireless communication module 1192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beamforming, or large scale antenna. The wireless communication module 1192 may support various requirements specified in the electronic device 1101, an external electronic device (e.g., electronic device 1104), or a network system (e.g., second network 1199). According to one embodiment, the wireless communication module 1192 has a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, or U-plane latency (e.g., downlink (DL) and uplink (UL) of less than 0.5 ms each, or round trip of less than 1 ms) can be supported.

The antenna module 1197 may transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module 1197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 1197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 1198 or the second network 1199 is, for example, connected to the plurality of antennas by the communication module 1190. can be selected. Signals or power may be transmitted or received between the communication module 1190 and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 1197. According to various embodiments, the antenna module 1197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); and a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second surface (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. there is.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 1101 and the external electronic device 1104 through the server 1108 connected to the second network 1199. Each of the external electronic devices 1102 or 1104 may be of the same or different type as the electronic device 1101. According to one embodiment, all or part of the operations performed in the electronic device 1101 may be executed in one or more of the external electronic devices 1102, 1104, or 1108. For example, when the electronic device 1101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 1101 does not execute the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 1101. The electronic device 1101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 1101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 1104 may include an Internet of Things (IoT) device. Server 1108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 1104 or server 1108 may be included in the second network 1199. The electronic device 1101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 12 is a block diagram 1200 illustrating a camera module 1180, according to various embodiments. Referring to FIG. 12, the camera module 1180 includes a lens assembly 1210, a flash 1220, an image sensor 1230, an image stabilizer 1240, a memory 1250 (e.g., buffer memory), or an image signal processor. It may include (1260). The lens assembly 1210 may collect light emitted from a subject that is the target of image capture. Lens assembly 1210 may include one or more lenses. According to one embodiment, the camera module 1180 may include a plurality of lens assemblies 1210. In this case, the camera module 1180 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 1210 have the same lens properties (e.g., angle of view, focal length, autofocus, f number, or optical zoom), or at least one lens assembly is different from another lens assembly. It may have one or more lens properties that are different from the lens properties of . The lens assembly 1210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 1220 may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash 1220 may include one or more light emitting diodes (eg, red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor 1230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 1210 into an electrical signal. According to one embodiment, the image sensor 1230 is one image sensor selected from among image sensors with different properties, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, and the same It may include a plurality of image sensors having different properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor 1230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 1240 moves at least one lens or image sensor 1230 included in the lens assembly 1210 in a specific direction in response to the movement of the camera module 1180 or the electronic device 1101 including the same. The operating characteristics of the image sensor 1230 can be controlled (e.g., adjusting read-out timing, etc.). This allows to compensate for at least some of the negative effects of said movement on the image being captured. According to one embodiment, the image stabilizer 1240 is a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 1180. It is possible to detect such movement of the camera module 1180 or the electronic device 1101 using . According to one embodiment, the image stabilizer 1240 may be implemented as, for example, an optical image stabilizer. The memory 1250 may at least temporarily store at least a portion of the image acquired through the image sensor 1230 for the next image processing task. For example, when image acquisition is delayed due to the shutter or when multiple images are acquired at high speed, the acquired original image (e.g., Bayer-patterned image or high-resolution image) is stored in the memory 1250. , the corresponding copy image (e.g., low resolution image) may be previewed through the display module 1160. Thereafter, when a specified condition is satisfied (eg, user input or system command), at least a portion of the original image stored in the memory 1250 may be obtained and processed, for example, by the image signal processor 1260. According to one embodiment, the memory 1250 may be configured as at least part of the memory 1130 or as a separate memory that operates independently.

The image signal processor 1260 may perform one or more image processes on an image acquired through the image sensor 1230 or an image stored in the memory 1250. The one or more image processes may include, for example, depth map creation, three-dimensional modeling, panorama creation, feature point extraction, image compositing, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring). may include blurring, sharpening, or softening. Additionally or alternatively, the image signal processor 1260 may include at least one of the components included in the camera module 1180 (e.g., an image sensor). (1230)) may perform control (e.g., exposure time control, read-out timing control, etc.). The image processed by the image signal processor 1260 is stored back in the memory 1250 for further processing. or may be provided as an external component of the camera module 1180 (e.g., memory 1130, display module 1160, electronic device 1102, electronic device 1104, or server 1108). According to an example, the image signal processor 1260 may be configured as at least a part of the processor 1120, or may be configured as a separate processor that operates independently of the processor 1120. The image signal processor 1260 may be configured as the processor 1120. When configured with a separate processor, at least one image processed by the image signal processor 1260 may be displayed through the display module 1160 as is or after additional image processing by the processor 1120.

According to one embodiment, the electronic device 1101 may include a plurality of camera modules 1180, each having different properties or functions. In this case, for example, at least one of the plurality of camera modules 1180 may be a wide-angle camera and at least another one may be a telephoto camera. Similarly, at least one of the plurality of camera modules 1180 may be a front camera, and at least another one may be a rear camera.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-mentioned devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document are one or more instructions stored in a storage medium (e.g., built-in memory 1136 or external memory 1138) that can be read by a machine (e.g., electronic device 1101). It may be implemented as software (e.g., program 1140) including these. For example, a processor (e.g., processor 1120) of a device (e.g., electronic device 1101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or through an application store (e.g., Play Store™), or on two user devices (e.g., It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. . According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Additionally or alternatively, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Claims (21)

In electronic devices,
housing;
a lens assembly disposed along an optical axis;
An AF driving unit operatively connected to the lens assembly to move the lens assembly in the optical axis direction within the housing, the AF driving unit:
An AF carrier including a first AF magnet disposed on a first surface of the lens assembly facing in a first direction and a second AF magnet disposed on a second surface facing in a direction opposite to the first direction with respect to the lens assembly. ;
a first AF coil disposed inside the housing to face the first AF magnet;
a first driving circuit disposed at the center of the first AF coil to control a current applied to the first AF coil;
a second AF coil disposed inside the housing to face the second AF magnet; and
It includes a second driving circuit disposed at the center of the second AF coil to control the current applied to the second AF coil,
The first driving circuit controls the current applied to the first AF coil according to the position of the first AF magnet and the position of the second AF magnet to move the lens assembly in the optical axis direction through the AF carrier. move it,
The second driving circuit controls the current applied to the second AF coil according to the position of the first AF magnet and the position of the second AF magnet, thereby moving the lens assembly to the optical axis using the AF carrier. An electronic device that moves in a direction. The method of claim 1, wherein the electronic device further includes a memory,
The memory is:
storing a first calibration value related to a current applied to the first AF coil through the first driving circuit, and
An electronic device that stores a second calibration value related to a current applied to the second AF coil through the second driving circuit. In claim 2,
The first calibration value and the second calibration value are values for compensating tilt generated from a height difference between the first surface and the second surface of the lens assembly with respect to the housing. In claim 1,
The first driving circuit includes a first AF Hall sensor,
An electronic device that measures the position of the first AF magnet with respect to the first AF Hall sensor using the first AF Hall sensor. In claim 4,
The second driving circuit includes a second AF Hall sensor,
An electronic device that measures the position of the second AF magnet with respect to the second AF Hall sensor using the second AF Hall sensor. The method of claim 2, wherein the electronic device:
An electronic device that determines a first calibration position by mapping the height of the first AF magnet from the housing based on the first calibration value. The method of claim 6, wherein the first driving circuit:
Measure the first current position, which is the height of the first AF magnet, from the housing using the first AF Hall sensor built into the first driving circuit,
Compare the first calibration position and the first current position,
An electronic device that moves the lens assembly in the optical axis direction by controlling the current applied to the first AF coil based on the comparison result. The method of claim 2, wherein the electronic device:
An electronic device that determines a second calibration position by mapping the height of the second AF magnet from the housing based on the second calibration value. The method of claim 8, wherein the second driving circuit is:
Measure a second current position, which is the height of the second AF magnet, from the housing using a second AF Hall sensor built into the second driving circuit,
Compare the second calibration position and the second current position,
An electronic device that moves the lens assembly in the optical axis direction by controlling the current applied to the second AF coil based on the comparison result. In claim 1,
The electronic device wherein the current applied by the first driving circuit to the first AF coil is different from the current applied by the second driving circuit to the second AF coil. In claim 1,
The AF carrier further includes at least one AF ball,
The AF driver controls the lens assembly to move in the optical axis direction as the at least one AF ball rolls. In claim 1,
The AF carrier further includes at least one AF shaft,
The AF driver controls the lens assembly to move in the optical axis direction as the at least one AF shaft slides. In claim 1,
The electronic device:
a prism onto which light passing through the lens assembly is incident; and
An electronic device further comprising an image sensor configured to acquire the light passing through the lens assembly and the prism. In claim 1,
The electronic device further includes an AF driver IC connected to the first driving circuit and the second driving circuit,
The AF driver IC is an electronic device that controls the first driving circuit and the second driving circuit, respectively. In claim 5,
The first driving circuit controls the current applied to the first AF coil based on the position of the second AF magnet with respect to the second AF Hall sensor obtained using the second AF Hall sensor,
The second driving circuit is an electronic device that controls the current applied to the second AF coil based on the position of the first AF magnet with respect to the first AF Hall sensor obtained using the first AF Hall sensor. In the camera module,
housing;
a lens assembly disposed along an optical axis;
An AF driving unit operatively connected to the lens assembly to move the lens assembly in the optical axis direction within the housing, the AF driving unit:
An AF carrier including a first AF magnet disposed on a first surface of the lens assembly facing in a first direction and a second AF magnet disposed on a second surface facing in a direction opposite to the first direction with respect to the lens assembly. ;
a first AF coil disposed inside the housing to face the first AF magnet;
a first driving circuit disposed at the center of the first AF coil to control a current applied to the first AF coil;
a second AF coil disposed inside the housing to face the second AF magnet; and
It includes a second driving circuit disposed at the center of the second AF coil to control the current applied to the second AF coil,
The first driving circuit moves the lens assembly in the optical axis direction using the AF carrier by controlling the current applied to the first AF coil,
The second driving circuit controls the current applied to the second AF coil, thereby moving the lens assembly in the optical axis direction using the AF carrier. In claim 16,
The first driving circuit includes a first memory that stores a first calibration value related to a current applied to the first AF coil through the first driving circuit,
The second driving circuit includes a second memory that stores a second calibration value related to a current applied to the second AF coil through the second driving circuit. In claim 17,
The first driving circuit controls the current applied to the first AF coil based on the first calibration value,
The second driving circuit is a camera module that controls the current applied to the second AF coil based on the second calibration value. In claim 18,
The first calibration value and the second calibration value are values that compensate for tilt generated from a height difference between the first surface and the second surface of the lens assembly with respect to the housing. In claim 19,
The first driving circuit is:
Built-in first AF Hall sensor, and
Measure the position of the first AF magnet with respect to the first AF Hall sensor using the first AF Hall sensor,
The second driving circuit is:
Built-in second AF Hall sensor, and
A camera module that measures the position of the second AF magnet with respect to the second AF Hall sensor using the second AF Hall sensor. In claim 20,
The first driving circuit is:
Measure the first current position, which is the height of the first AF magnet, from the housing using the first AF Hall sensor,
Compare the first calibration position determined based on the first calibration value and the first current position,
Based on the comparison result, control the current applied to the first AF coil to move the lens assembly in the optical axis direction,
The second driving circuit is:
Measure a second current position, which is the height of the second AF magnet, from the housing using the second AF Hall sensor,
Compare the second current position with a second calibration position determined based on the second calibration value,
A camera module that moves the lens assembly in the optical axis direction by controlling the current applied to the second AF coil based on the comparison result.

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