KR20230161307A - Cover window and method for manufacturing the same - Google Patents

Abstract

The present invention provides a method of manufacturing a cover window that can reduce the possibility of defects occurring during the manufacturing process, comprising the steps of providing a first ink to a printing plate, a pad center area including the center of the lower surface, and a pad groove surrounding the pad center area. A step of transferring the first ink to a first pad including the area surrounding the pad where the pad is disposed, and transferring the first ink from the first pad to the cover window substrate, and applying the first ink to the first pad. The transferring step provides a method of manufacturing a cover window, which is a step of transferring the first ink to the area around the pad.

Description

Cover window and method for manufacturing the same {Cover window and method for manufacturing the same}

Embodiments of the present invention relate to a cover window and a method of manufacturing the same, and more specifically, to a cover window and a method of manufacturing the same that can reduce the possibility of defects occurring during the manufacturing process.

The cover window of the display device protects the display elements of the display panel included in the display device from external shock and blocks light so that wiring or circuits of the display panel cannot be identified from the outside. For this purpose, a light blocking layer is formed on one side of the cover window. In the case of a flat cover window, the light blocking layer is formed using a silkscreen printing method, and in the case of a curved cover window, the light blocking layer is formed using a pad printing method.

However, this conventional cover window manufacturing method had a problem in that it was not easy to print the portion of the cover window substrate that was in contact with the pad but did not have a light blocking layer formed in a subsequent process.

The present invention is intended to solve various problems including the problems described above, and its purpose is to provide a cover window and a manufacturing method thereof that can reduce the possibility of defects occurring during the manufacturing process. However, these tasks are examples and do not limit the scope of the present invention.

According to one aspect of the present invention, providing a first ink to a printing plate, and applying the first ink to a first pad including a pad center area including the center of the lower surface and a pad peripheral area surrounding the pad center area and where pad grooves are arranged. It includes transferring the first ink, and transferring the first ink from the first pad to the cover window substrate, wherein the step of transferring the first ink to the first pad comprises transferring the first ink to the area around the pad. 1. A method of manufacturing a cover window, which is a step of transferring ink, is provided.

The step of transferring the first ink to the first pad may be a step in which the first ink is not transferred to the area around the pad where the pad groove is disposed.

The area around the pad may include an outer portion of the lower surface surrounding the center of the lower surface of the first pad, and a portion of a side surface of the first pad that is in contact with the outer portion of the lower surface.

The first ink may include a light blocking material.

The printing plate includes a printing plate central area and a printing plate peripheral area surrounding the printing plate central area and including a printing plate groove, and the step of providing the first ink to the printing plate may be a step of filling the printing plate groove with the first ink. .

The printing plate groove may extend along the outside of the central area of the printing plate.

The step of transferring the first ink to the first pad may be a step of transferring the first ink to the first pad by pressing the first pad on the printing plate filling the printing plate groove with the first ink. there is.

The step of transferring the first ink to the first pad may be a step of transferring the first ink filled in the groove of the printing plate to the first pad.

The step of transferring the first ink to the first pad may be a step in which the center area of the pad is in contact with the center area of the printing plate and the peripheral area of the pad is in contact with the first ink filled in the groove of the printing plate.

The step of transferring the first ink to the first pad may be a step in which a portion of the area around the pad where the pad groove is disposed does not come into contact with the first ink filled in the printing plate groove.

The step of transferring the first ink to the cover window substrate may be a step of transferring the first ink to the cover window substrate by pressing the first pad onto which the first ink is transferred to the cover window substrate. .

The step of transferring the first ink to the cover window substrate may be a step of transferring the first ink transferred to the first pad to the cover window substrate.

The step of transferring the first ink to the cover window substrate may be a step where the pad center area and the pad peripheral area contact the cover window substrate.

The step of transferring the first ink to the cover window substrate may be a step in which a portion of the area around the pad where the pad groove is disposed does not contact the cover window substrate.

The first pad may include a silicon-based compound.

The method of manufacturing the cover window may further include forming a light-shielding layer and a hole in the light-shielding layer on the cover window substrate by heating the cover window substrate onto which the first ink is transferred at 150° C. for 10 minutes.

The method of manufacturing the cover window includes transferring a second ink different from the first ink to the cover window substrate, and heating the cover window substrate onto which the second ink is transferred at 150° C. for 10 minutes to create a hole in the light blocking layer. The step of forming a color layer covering may be further included.

The step of transferring a second ink, which is different from the first ink, to the cover window substrate includes pressing the second pad onto which the second ink is transferred to the cover window substrate, so that the cover window substrate exposed by the light blocking layer hole is This may be a step of transferring the second ink to a portion of the process.

According to one aspect of the present invention, a transparent area including a first transparent area and a second transparent area disposed on both sides of the first transparent area along a first direction, and both sides of the first transparent area along a second direction. A cover window substrate having an opaque area including a first opaque area disposed in and a second opaque area surrounding the second transparent area, a light blocking layer disposed on the opaque area, and a cover window substrate on the first opaque area. It has a color layer that fills the light blocking layer hole, and the interface of the cover window substrate in contact with the color layer has a lower carbon content or silicon content than the surface of the cover window substrate in the direction of the light blocking layer in the transparent area. You can.

The interface of the cover window substrate in contact with the color layer contains carbon (C): 15 at% to 16 at%, and the surface of the cover window substrate in the direction of the light blocking layer in the transparent area contains carbon (C): 31 at%. It may contain from 33 at%.

The interface of the cover window substrate in contact with the color layer contains silicon (Si): 19at% to 20at%, and the surface of the cover window substrate in the direction of the light blocking layer in the transparent area contains silicon (Si): 23at. % to 24 at%.

Other aspects, features and advantages other than those described above will become apparent from the detailed description, claims and drawings for carrying out the invention below.

According to an embodiment of the present invention as described above, a cover window and a manufacturing method thereof that can reduce the possibility of defects occurring during the manufacturing process can be implemented. Of course, the scope of the present invention is not limited by this effect.

1 is a perspective view schematically showing a portion of a display device including a cover window according to an embodiment of the present invention.
FIG. 2A is a cross-sectional view schematically showing a cross-section taken along line A-A' of the display device 1 of FIG. 1.
FIG. 2B is a cross-sectional view schematically showing a cross-section taken along line B-B' of the display device 1 of FIG. 1.
Figure 3 is a cross-sectional view schematically showing a portion of a display device including a cover window according to an embodiment of the present invention.
Figure 4a is a perspective view schematically showing a first pad used in the method of manufacturing a cover window according to an embodiment of the present invention.
FIG. 4B is a cross-sectional view schematically showing a cross-section taken along line C-C' of the first pad of FIG. 4A.
FIG. 4C is a cross-sectional view schematically showing a cross-section taken along line D-D' of the first pad of FIG. 4A.
FIG. 4D is a cross-sectional view schematically showing a cross-section taken along line E-E' of the first pad of FIG. 4A.
5 to 17 are diagrams for explaining a method of manufacturing a cover window according to an embodiment of the present invention.
Figure 18 is a perspective view of a cover window according to an embodiment of the present invention.
19 and 20 are cross-sectional views of a cover window according to an embodiment of the present invention.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components will be assigned the same reference numerals and redundant description thereof will be omitted. .

In the following embodiments, when various components such as layers, films, regions, and plates are said to be “on” other components, this does not only mean that they are “directly on” the other components, but also when other components are interposed between them. Also includes cases where Additionally, for convenience of explanation, the sizes of components may be exaggerated or reduced in the drawings. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes in the Cartesian coordinate system, but can be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

In the following embodiments, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component.

In the following examples, singular terms include plural terms unless the context clearly dictates otherwise.

In the following embodiments, terms such as “include” or “have” mean that the features or components described in the specification are present, and exclude in advance the possibility of adding one or more other features or components. That is not the case.

In this specification, “A and/or B” refers to A, B, or A and B. And, “at least one of A and B” indicates the case of A, B, or A and B.

FIG. 1 is a perspective view schematically showing a portion of a display device 1 including a cover window 20 according to an embodiment of the present invention, and FIG. 2A is a view taken along line A-A' of the display device 1 of FIG. 1 . It is a cross-sectional view schematically showing a cross-section taken along a line, and FIG. 2B is a cross-sectional view schematically showing a cross-section taken along line B-B' of the display device 1 of FIG. 1.

The display device 1 is a device that displays moving images or still images, and may be used in a mobile phone, a smart phone, a tablet personal computer, a mobile communication terminal, an electronic notebook, an e-book, or a PMP ( It may be a portable electronic device such as a portable multimedia player, navigation, or UMPC (Ultra Mobile PC). Of course, the display device 1 may be an electronic device such as a television, laptop, monitor, billboard, or Internet of Things (IOT). Alternatively, the display device 1 may be a wearable device such as a smart watch, watch phone, glasses-type display, or head mounted display (HMD). Alternatively, the display device 1 may be part of another device. For example, the display device 1 may be a display unit of any electronic device. Alternatively, the display device 1 may be a CID (Center Information Display) placed on the dashboard of a car, the center fascia of a car, or the dashboard, and may be a room mirror display unit that replaces the side mirror of a car. display), and may be a display unit disposed on the back of the front seat as entertainment for the rear seat of a car.

Referring to FIG. 1, a display device 1 capable of displaying an image may have an edge extending in a first direction and an edge extending in a second direction. Here, the first direction and the second direction may be directions that intersect each other. For example, the angle formed by the first direction and the second direction may be an acute angle. Alternatively, the angle formed by the first direction and the second direction may be an obtuse angle or a right angle. Hereinafter, for convenience, the description will focus on the case where the first direction and the second direction are perpendicular. For example, the first direction may be the x direction or the -x direction, and the second direction may be the y direction or the -y direction.

As shown in FIG. 1, the display device 1 may include a display area DA and a non-display area NDA surrounding the display area DA. The display device 1 can provide an image through an array of a plurality of pixels (PX) two-dimensionally arranged in the display area (DA). Each pixel (PX) of the display device 1 is an area that can emit light of a predetermined color, and the display device 1 can provide an image using the light emitted from the pixels (PX). For example, each pixel (PX) may emit red, green, or blue light.

As shown in FIG. 1, the display area DA may have a polygonal shape including a square on a plane. For example, the display area DA may have a rectangular shape where the horizontal length is longer than the vertical length, a rectangular shape where the horizontal length is smaller than the vertical length, or a square shape. Alternatively, the display area DA may have various shapes, such as an ellipse or a circle.

The display area DA may include a first display area DA1 and a second display area DA2. The first display area DA1 may be a flat area. The display device 1 can provide most images in this first display area DA1. As shown in FIG. 2A, the second display area DA2 may be disposed on both sides of the first display area DA1 along a first direction (eg, x-direction or -x-direction). The second display area DA2 may extend in a second direction (eg, y-direction or -y-direction). The display device 1 may be bent in the second display area DA2. In FIG. 2B, it is shown that the bent area along the second direction (eg, y-direction or -y-direction) is not disposed on both sides of the first display area DA1, but the present invention is not limited to this. For example, the second display area DA2, which is a curved area, may surround the first display area DA1. Hereinafter, for convenience, it will be described that the second display area DA2 is disposed on both sides of the first display area DA1 only along the first direction (eg, x-direction or -x-direction).

That is, the second display area DA2 may be defined as an area that is curved differently from the first display area DA1 in a cross-section in the first direction (eg, zx cross-section). On the other hand, the second display area DA2 may appear unbent in a cross section in the second direction (eg, yz cross section). That is, the second display area DA2 may be an area bent around an axis extending in the second direction. In FIG. 2A, the second display area DA2 located in the x-direction from the first display area DA1 and the second display area DA2 located in the -x direction from the first display area DA1 may have the same curvature. . However, the present invention is not limited to this. For example, the second display area DA2 located in the x-direction from the first display area DA1 and the second display area DA2 located in the -x direction from the first display area DA1 may have different curvatures.

The non-display area (NDA) may be placed outside the display area (DA). Specifically, the non-display area (NDA) may include a first non-display area (NDA1) and a second non-display area (NDA2). The first non-display area NDA1 may be disposed on both sides of the first display area DA1 along a second direction (eg, y-direction or -y-direction). The second non-display area NDA2 may partially surround the second display area DA2. Pixels (PX) may not be placed in the non-display area (NDA). That is, the non-display area (NDA) may be an area that does not display images. A driving circuit for providing an electrical signal to the pixel PX may be disposed in the non-display area NDA, or a power wiring for providing power to the pixel PX may be disposed.

Part of this non-display area (NDA) may be curved. Specifically, as shown in FIG. 2A, the second non-display area NDA2 partially surrounding the second display area DA2 may be bent. As shown in FIG. 2B, the first non-display area NDA1 disposed on both sides of the first display area DA1 is not curved and may be flat. That is, as shown in FIG. 2A, the second non-display area NDA2 and the second display area DA2 have a radius of curvature R and can be bent.

FIG. 3 is a cross-sectional view schematically showing a portion of the display device 1 including the cover window 20 according to an embodiment of the present invention. The display device 1 may include a cover window 20 and a display panel 10. The display panel 10 may be placed below the cover window 20. The display panel 10 can display images. The image displayed by the display panel 10 may be provided to the user through the transparent cover window 20. In other words, the image provided by the display device 1 can be understood as being implemented by the display panel 10.

As shown in FIG. 3 , the display panel 10 may include a substrate 100, a pixel circuit layer 200, a display element layer 300, and an encapsulation layer 400. A pixel circuit layer 200 may be disposed on the substrate 100. The substrate 100 may include various materials having flexible or bendable characteristics. For example, the substrate 100 may include glass, metal, or polymer resin. In addition, the substrate 100 is made of polyethersulphone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, and polyphenylene sulfide ( It may include polymer resins such as polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. Of course, the substrate 100 has a multi-layer structure including two layers each containing such a polymer resin and a barrier layer containing an inorganic material (such as silicon oxide, silicon nitride, silicon oxynitride, etc.) sandwiched between the layers. Various modifications are possible, such as having .

The pixel circuit layer 200 may include a thin film transistor (TFT), an insulating layer (IL), and a planarization layer 240. As shown in FIG. 3, a thin film transistor (TFT) has a semiconductor layer (Act), a gate electrode (GE), a source electrode (SE), and a drain electrode including amorphous silicon, polycrystalline silicon, an oxide semiconductor material, or an organic semiconductor material. (DE) may be included. The insulating layer IL may include a gate insulating layer 210, a first interlayer insulating layer 220, and a second interlayer insulating layer 230. In order to ensure insulation between the semiconductor layer (Act) and the gate electrode (GE), the gate insulating layer 210 containing an inorganic material such as silicon oxide, silicon nitride, and/or silicon oxynitride is formed between the semiconductor layer (Act) and the gate electrode (GE). GE) may be interposed between them. In addition, a first interlayer insulating layer 220 containing an inorganic material such as silicon oxide, silicon nitride, and/or silicon oxynitride may be disposed on the top of the gate electrode (GE), and the source electrode (SE) and the drain electrode (DE) may be disposed on the gate electrode (GE). A second interlayer insulating layer 230 may be disposed to cover the surface. In this way, the insulating layer (IL) containing an inorganic material may be formed through CVD or ALD. And a planarization layer 240 may be disposed on the thin film transistor (TFT). The planarization layer 240 may serve to substantially planarize the top of the thin film transistor (TFT). For example, the planarization layer 240 may contain an organic material such as acrylic, benzocyclobutene (BCB), or hexamethyldisiloxane (HMDSO). In FIG. 3, the planarization layer 240 is shown as a single layer, but various modifications are possible, such as a multi-layer structure.

The display element layer 300 may be disposed on the pixel circuit layer 200. The display element layer 300 may include a display element 310 and a pixel defining layer 320 that are electrically connected to a thin film transistor (TFT). The display element 310 may be, for example, an organic light emitting diode having a pixel electrode 311, a counter electrode 313, and an intermediate layer 312 interposed therebetween and including a light emitting layer. The fact that the display element 310 is electrically connected to the thin film transistor (TFT) can be understood as the pixel electrode 311 of the display element 310 being electrically connected to the thin film transistor (TFT).

As shown in FIG. 3, the pixel electrode 311 contacts either the source electrode (SE) or the drain electrode (DE) through an opening formed in the planarization layer 240, etc., and is electrically connected to the thin film transistor (TFT). . This pixel electrode 311 includes a translucent conductive layer formed of a translucent conductive oxide such as ITO, In ₂ O ₃ or IZO, and a reflective layer formed of a metal such as Al or Ag. For example, the pixel electrode 311 may have a three-layer structure of ITO/Ag/ITO.

The pixel definition film 320 may be disposed on the planarization layer 240 . The pixel definition film 320 serves to define the pixels by having an opening corresponding to each pixel, that is, an opening that exposes at least the central portion of the pixel electrode 311. In addition, in the case shown in FIG. 3, the pixel defining film 320 increases the distance between the edge of the pixel electrode 311 and the counter electrode 313 on the top of the pixel electrode 311, thereby ) plays a role in preventing arcs from occurring at the edges. The pixel defining layer 320 may include an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

The middle layer 312 of the display element 310 may include a low molecule or high molecule material. When the middle layer 312 includes a low molecular material, the middle layer 312 includes a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), and an electron transport layer (ETL). : Electron Transport Layer), Electron Injection Layer (EIL), etc. may have a single or complex laminated structure and may be formed by vacuum deposition. When the middle layer 312 includes a polymer material, the middle layer 312 may have a structure including a hole transport layer (HTL) and an emission layer (EML). At this time, the hole transport layer may include PEDOT, and the light-emitting layer may include a polymer material such as polyphenylene vinylene (PPV)-based or polyfluorene-based. This intermediate layer 312 can be formed by screen printing, inkjet printing, laser induced thermal imaging (LITI), or the like. Of course, the middle layer 312 is not necessarily limited to this, and may have various structures. Additionally, the middle layer 312 may include a layer that is integrated across the plurality of pixel electrodes 311, or may include a layer patterned to correspond to each of the plurality of pixel electrodes 311.

The counter electrode 313 may be formed integrally with the plurality of display elements 310 and may correspond to the plurality of pixel electrodes 311. This counter electrode 313 may include a translucent conductive layer formed of ITO, In ₂ O ₃ or IZO, and may also include a semi-transmissive film containing a metal such as Al or Ag. For example, the counter electrode 313 may be a semi-permeable film containing Mg or Ag.

An encapsulation layer 400 may be disposed on the display device layer 300. Since the display element 310 can be easily damaged by moisture or oxygen from the outside, the encapsulation layer 400 can cover the display element 310 to protect it. The encapsulation layer 400 may include a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430, as shown in FIG. 3.

The first inorganic encapsulation layer 410 covers the counter electrode 313 and may include silicon oxide, silicon nitride, and/or silicon oxynitride. Of course, if necessary, other layers such as a capping layer may be interposed between the first inorganic encapsulation layer 410 and the counter electrode 313. Since this first inorganic encapsulation layer 410 is formed along the structure below, its upper surface is not flat, as shown in FIG. 3. The organic encapsulation layer 420 covers the first inorganic encapsulation layer 410, and unlike the first inorganic encapsulation layer 410, its upper surface can be substantially flat. This organic encapsulation layer 420 may include one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. there is. The second inorganic encapsulation layer 430 covers the organic encapsulation layer 420 and may include silicon oxide, silicon nitride, and/or silicon oxynitride.

As such, the encapsulation layer 400 includes a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430. Through this multilayer structure, cracks are formed within the encapsulation layer 400. Even if this occurs, it is possible to prevent such cracks from connecting between the first inorganic encapsulation layer 410 and the organic encapsulation layer 420 or between the organic encapsulation layer 420 and the second inorganic encapsulation layer 430. Through this, it is possible to prevent or minimize the formation of a path through which moisture or oxygen from the outside penetrates into the inside of the display device 1.

The cover window 20 may be disposed on the display panel 10 . The cover window 20 may be arranged to cover the upper surface of the display panel 10. This cover window 20 may function to protect the upper surface of the display panel 10. Additionally, since the cover window forms the exterior of the display device 1, it may include flat and curved surfaces corresponding to the shape of the display device 1.

The cover window 20 may have a high transmittance to transmit light emitted from the display panel 10 and may have a thin thickness to minimize the weight of the display device 1. Additionally, the cover window 20 may have high strength and hardness to protect the display panel 10 from external shock. The cover window 20 may include a flexible window. The cover window 20 can protect the display panel 10 by easily bending in response to external force without causing cracks or the like. The cover window 20 may be attached to the display panel 10 using an adhesive layer (not shown). The adhesive layer may include an adhesive member such as, for example, optical clear adhesive (OCA) or pressure sensitive adhesive (PSA).

Although not shown, a protective film may be disposed on the lower portion of the display panel 10 to face the lower surface (in the -z direction) of the display panel 10. Specifically, the protective film may be disposed on the lower portion of the substrate 100 to face the lower surface (in the -z direction) of the substrate 100. The protective film may serve to protect the display panel 10 during the manufacturing process of the display device. An adhesive layer may be interposed between the protective film and the substrate 100, and the protective film may be attached to the lower portion of the substrate 100 by this adhesive layer. The adhesive layer interposed between the protective film and the substrate 100 may include at least one of optical clear resin (OCR), optical clear adhesive (OCA), and pressure sensitive adhesive (PSA). You can.

Hereinafter, a method of manufacturing a cover window according to an embodiment of the present invention will be described. FIG. 4A is a perspective view schematically showing the first pad 50 used in the method of manufacturing a cover window according to an embodiment of the present invention, and FIG. 4B is a cross-sectional view C-C' of the first pad 50 of FIG. 4A. It is a cross-sectional view schematically showing a cross-section taken along a line. FIG. 4C is a cross-sectional view schematically showing a cross-section taken along line D-D' of the first pad 50 in FIG. 4A, and FIG. 4D is a cross-sectional view taken along line E-E' of the first pad 50 in FIG. 4A. This is a cross-sectional view schematically showing the cross-section taken. In FIGS. 4A and 4B , for convenience of illustration, the first pad 50 is shown turned over so that the lower surface (in the -z direction) of the first pad 50 faces upward.

In FIG. 4A, the first pad 50 is shown as having a rectangular shape in plan view, but the present invention is not limited to this. For example, the first pad 50 may have various shapes other than a rectangular shape in plan view. The first pad 50 may include an elastic material. For example, the first pad 50 may include a silicon-based compound. The first pad 50 may be formed of silicone material. Accordingly, when the first pad 50 is pressed while in contact with the printing plate 60 or the cover window substrate 21, the first pad 50 may be compressed or stretched.

The first pad 50 may include a printing part 50PP and a main body part 50BP. The printing unit 50PP may be a part that contacts the printing plate 60 or the cover window substrate 21 when transferring ink to or from the first pad 50. The printing unit 50PP may have a gentle curvature at the center. Specifically, the center of the printing unit 50PP may be bent along a first direction (eg, x-direction or -x-direction), and may also be bent along a second direction (eg, y-direction or -y-direction). That is, as shown in FIG. 4C, the center of the printing unit 50PP may be bent in a cross section in the first direction (e.g., zx cross section), and as shown in FIG. 4B, the center of the printing unit 50PP may be bent in a cross section in the second direction (e.g., zx cross section). For example, it can also be bent in the yz section). The main body portion 50BP is a part of the first pad 50 other than the printing portion 50PP, and supports the first pad 50 and transfers ink to the first pad 50 or prints the first pad 50. In the process of transferring ink from, it may be a part that does not contact the printing plate 60 or the cover window substrate 21.

The printing unit 50PP may include a pad center area 50CA and a pad peripheral area 50PA surrounding the pad center area 50CA. The pad center area 50CA may be located at the center of the printing unit 50PP. Specifically, the pad center area 50CA may include the center of the lower surface (in the -z direction) of the printing unit 50PP. That is, the pad center area 50CA may include the center of the lower surface (in the -z direction) of the first pad 50. The pad peripheral area 50PA may be disposed outside the pad center area 50CA. The pad peripheral area (50PA) may surround the center of the printing unit (50PP). Specifically, the pad peripheral area 50PA may include an outer portion of the lower surface surrounding the center of the lower surface (in the -z direction) of the printing unit 50PP and a portion of the side surface of the printing unit 50PP in contact therewith. . That is, the pad peripheral area 50PA may include the outer portion of the lower surface surrounding the center of the lower surface (in the -z direction) of the first pad 50 and a portion of the side surface of the first pad 50P in contact therewith. there is.

As shown in FIG. 4D, a pad groove 50G may be disposed in the pad peripheral area 50PA of the printing unit 50PP. Specifically, a pad groove 50G may be disposed on the lower surface (in the -z direction) included in the pad peripheral area 50PA. Accordingly, when ink is transferred to the first pad 50, ink may not be transferred to the portion of the pad peripheral area 50PA where the pad groove 50G is disposed. Additionally, when transferring ink from the first pad 50, the part of the target object corresponding to the pad groove 50G does not contact the first pad 50, and ink may not be transferred to that part. The depth of the pad groove 50G may be 2.4 mm to 7.2 mm based on the lower surface (in the -z direction) of the printing unit 50PP. If the depth of the pad groove (50G) is less than 2.4 mm based on the lower surface (in the -z direction) of the printing unit (50PP), ink may also be transferred to the portion of the pad peripheral area (50PA) where the pad groove (50G) is placed. You can. Additionally, when ink is transferred from the first pad 50, the part of the target object corresponding to the pad groove 50G may be in contact with the first pad 50, or ink may be transferred to the corresponding part. If the depth of the pad groove 50G exceeds 7.2 mm based on the lower surface (in the -z direction) of the printing unit 50PP, the cost for manufacturing the pad may increase.

4A and 4D show one pad groove 50G being disposed in the pad peripheral area 50PA disposed on the lower surface (in the -z direction) of the printing unit 50PP, but the present invention is not limited thereto. That is not the case. For example, a plurality of pad grooves 50G may be arranged in the pad peripheral area 50PA disposed on the lower surface (in the -z direction) of the printing unit 50PP, and the pad grooves 50G may be arranged to be spaced apart from each other. there is. The plurality of pad grooves 50G may have the same or similar shape and the same or similar size. Alternatively, the plurality of pad grooves 50G may have different shapes or sizes. Hereinafter, for convenience, it will be described that one pad groove 50G is disposed in the pad peripheral area 50PA disposed on the lower surface (in the -z direction) of the printing unit 50PP.

5 to 17 are diagrams for explaining a method of manufacturing a cover window according to an embodiment of the present invention. Figures 5 and 6 are diagrams for explaining the step of providing the first ink (I1) to the printing plate 60 in the method of manufacturing a cover window according to an embodiment of the present invention. Specifically, FIG. 6 is a cross-sectional view schematically showing a cross section of the printing plate 60, the printing plate groove 60G, and the first ink I1 of FIG. 5 taken along line II'.

As shown in Figures 5 and 6, the printing plate 60 may be a generally flat plate used in a pad printing method. The printing plate 60 may include a printing plate center area (60CA) and a printing plate peripheral area (60PA). The central area 60CA of the printing plate may have a shape corresponding to the transparent area TA of the cover window 20 (see FIG. 18). For example, when the transparent area TA of the cover window 20 has a long rectangular shape, the center area 60CA of the printing plate may have a long rectangular shape. The printing plate peripheral area (60PA) may surround the printing plate center area (60CA).

A printing plate groove 60G may be disposed in the surrounding area 60PA of the printing plate. The printing plate groove 60G may extend along the outside of the printing plate center area 60CA. For example, the printing plate groove 60G may circumnavigate the printing plate center area 60CA. For example, the printing plate groove 60G may have a rectangular frame shape with an empty center in a plan view. The printing plate groove 60G may have a shape corresponding to the shape of the image to be printed on the cover window 20. That is, the image shape to be printed on the cover window 20 may be formed as an engraved image area on the upper part of the printing plate 60, and the printing plate groove 60G is a shape corresponding to the image shape to be printed on the cover window 20. It may be a negative image area. These printing plate grooves 60G may be filled with the first ink I1.

The first ink (I1) may include a light blocking material. That is, the first ink I1 may include an opaque material that blocks light. The light blocking material may include at least one of black dye and black particles. For example, light- _{shielding materials} may _include Cr, _CrO You can. The light blocking material may include a black organic pigment, and the black organic pigment may include one or more selected from the group consisting of aniline black, lactam black, and perylene black.

Figures 7 to 9 are diagrams for explaining the step of transferring the first ink (I1) to the first pad (50) in the method of manufacturing a cover window according to an embodiment of the present invention. FIG. 7 shows the first pad 50 and the printing plate 60 when the first pad 50 is placed on the printing plate 60, with respect to a cross section taken along line I-I' of the printing plate 60 of FIG. 5. ) shows a cross section. FIG. 8 shows the first pad 50 and the printing plate 60 when the first pad 50 is pressed to the printing plate 60, with respect to a cross section taken along line II' of the printing plate 60 of FIG. 5. A cross section is shown. FIG. 9 shows the first pad 50 and the printing plate 60 when the first pad 50 is pressed to the printing plate 60, with respect to a cross section taken along line II-II' of the printing plate 60 of FIG. 5. A cross section is shown.

First, as shown in FIG. 7, the lower surface (in the -z direction) of the first pad 50 is arranged to face the printing plate 60, and then the first pad 50 and the printing plate 60 can be aligned. there is. Specifically, the first pad 50 may be placed on the printing plate 60 so that the pad center area 50CA corresponds to the printing plate center area 60CA.

Next, as shown in FIG. 8, the first pad 50 can be pressed to the printing plate 60 by pressing the first pad 50. The first pad 50 may be connected to the control device (CM). Specifically, the first pad 50 may be attached to one side of the connection portion (CP) connected to the control device (CM). Accordingly, the control device (CM) can control the movement of the first pad 50, and the control device (CM) moves the first pad 50 in the direction (e.g., -z direction) of the printing plate 60. By moving, the first pad 50 can be pressed against the printing plate 60. Since the first pad 50 includes an elastic material such as a silicone-based compound, when pressure is applied to the first pad 50, the first pad 50 may be compressed or stretched. Accordingly, the pad center area 50CA of the first pad 50 is in contact with the printing plate center area 60CA of the printing plate 60, and the pad peripheral area 50PA of the first pad 50 is in contact with the printing plate 60. It can come into contact with the first ink (I1) filled in the printing plate groove (60G). Accordingly, the first ink I1 may be transferred to the pad peripheral area 50PA of the first pad 50. Of course, the first ink I1 transferred to the pad peripheral area 50PA may be at least a portion of the first ink I1 that filled the printing plate groove 60G of the printing plate 60.

Meanwhile, as shown in FIG. 9, the portion of the pad peripheral area 50PA where the pad groove 50G is disposed does not contact the first ink I1 filled in the printing plate groove 60G of the printing plate 60, The first ink (I1) may not be transferred to these parts. Thereafter, the first pad 50 may be separated from the printing plate 60 by moving the first pad 50 in the opposite direction (eg, z-direction) to the printing plate 60 by the control device CM.

10 to 13 are diagrams for explaining the step of transferring the first ink (I1) to the cover window substrate 21 in the method of manufacturing a cover window according to an embodiment of the present invention. FIG. 11 shows the first pad 50 when the first pad 50 is placed on the cover window substrate 21 in a cross section taken along line III-III' of the cover window substrate 21 of FIG. 10. and a cross section of the cover window substrate 21 are shown. FIG. 12 shows the first pad 50 when the first pad 50 is pressed to the cover window substrate 21 with respect to a cross section taken along line III-III' of the cover window substrate 21 of FIG. 10 and A cross section of the cover window substrate 21 is shown. FIG. 13 shows the first pad 50 when the first pad 50 is pressed to the cover window substrate 21 with respect to a cross section taken along line IV-IV' of the cover window substrate 21 of FIG. 10. A cross section of the cover window substrate 21 is shown.

First, as shown in FIG. 10, a cover window substrate 21 can be prepared. The cover window substrate 21 can be modified to have a flat surface and a curved surface using a jig including a concave surface corresponding to the final shape of the cover window 20. In other words, the jig may be a frame having the shape of the display device 1 to be finally manufactured. By attaching the cover window substrate 21 to the concave surface of the jig, the cover window substrate 21 can be deformed according to the shape of the concave surface of the jig.

Then, as shown in FIG. 11, the lower surface (in the -z direction) of the first pad 50 is arranged to face the cover window substrate 21, and then the first pad 50 and the cover window substrate 21 are placed. can be sorted. Specifically, the first pad 50 may be placed on the cover window substrate 21 so that the pad center area 50CA corresponds to a flat area at the center of the cover window substrate 21.

Next, as shown in FIG. 12, the first pad 50 can be pressed to the cover window substrate 21 by pressing the first pad 50. As the first pad 50 moves in the direction (e.g., -z direction) of the cover window substrate 21 by the control device (CM), the first pad 50 may be pressed to the cover window substrate 21. . Accordingly, the pad center area 50CA and the pad peripheral area 50PA of the first pad 50 may contact the cover window substrate 21. Accordingly, the first ink I1 transferred to the pad peripheral area 50PA of the first pad 50 may be transferred to the cover window substrate 21. Of course, the first ink (I1) transferred to the cover window substrate 21 may be at least a part of the first ink (I1) transferred to the pad peripheral area (50PA). The portion of the cover window substrate 21 that is in contact with the pad center area 50CA is in contact with the first pad 50, but the first ink I1 may not be transferred.

Meanwhile, as shown in FIG. 13, the portion of the pad peripheral area 50PA where the pad groove 50G is disposed may not be in contact with the cover window substrate 21. Compared to the portion of the cover window substrate 21 in contact with the pad center area 50CA, the portion of the cover window substrate 21 corresponding to the pad groove 50G not only does not transfer the first ink I1, It may not be in contact with the first pad 50.

In the process of transferring the first ink (I1) transferred to the first pad 50 to the cover window substrate 21, the surface of the portion of the cover window substrate 21 in contact with the first pad 50 is damaged by foreign substances. It may be contaminated. For example, the surface of the portion of the cover window substrate 21 in contact with the pad center area 50CA may be contaminated by foreign substances. These foreign substances may include at least one of silicone oil, organic matter, and dust. For example, if the first pad 50 includes a silicon-based compound, the surface of the portion of the cover window substrate 21 in contact with the first pad 50 may be contaminated by silicone oil. there is. These silicone oils may include at least one of hexamethyldisiloxane, octamethyltrisiloxane, decamethyltetrasiloxane, dodecamethylpentasiloxane, and polydimethylsiloxane. there is.

Therefore, the surface of the portion of the cover window substrate 21 in contact with the pad center area 50CA has a higher content of carbon (C) and silicon (Si) than the surface of the portion of the cover window substrate 21 corresponding to the pad groove 50G. ) content may be high. In this specification, 'the surface of the cover window substrate 21' refers to a portion that goes into the interior of the cover window substrate 21 by about 10 nm from the point where the cover window substrate 21 contacts the outside of the cover window substrate 21. . That is, the surface of the part of the cover window substrate 21 corresponding to the pad groove 50G has a higher content of carbon (C) and silicon (Si) than the surface of the part of the cover window substrate 21 in contact with the pad center area 50CA. ) content may be low. For example, the surface of the portion of the cover window substrate 21 in contact with the pad center area 50CA may include carbon (C): 31 at% to 33 at% and silicon (Si): 23 at% to 24 at%, and the pad groove The surface of the portion of the cover window substrate 21 corresponding to (50G) may include carbon (C): 15 at% to 16 at% and silicon (Si): 19 at% to 20 at%.

Next, the cover window substrate 21 onto which the first ink (I1) is transferred is heated at 150° C. for 10 minutes to form the light blocking layer 22 as shown in FIG. 14. That is, the light blocking layer 22 may be formed by drying the first ink (I1) transferred to the cover window substrate 21 by heating. The light blocking layer 22 may include a light blocking hole 22H exposing a portion of the cover window substrate 21. The light blocking layer hole 22H is formed by not transferring the first ink I1 to this part of the cover window substrate 21 because the first pad 50 is not in contact with the part of the cover window substrate 21. You can.

Meanwhile, the steps of transferring the first ink (I1) to the first pad 50, transferring the first ink (I1) to the cover window substrate 21, and The step of heating the cover window substrate 21 onto which ink I1 is transferred at 150° C. for 10 minutes may be performed multiple times. That is, by performing the above-described steps multiple times, the thickness of the light-shielding layer 22 in the z-axis direction is increased, thereby blocking light so that the wiring or circuitry of the display panel 10 cannot be identified from the outside. The effect of layer 22 can be improved.

Figures 15 and 16 are diagrams for explaining the step of transferring the second ink (I2) to the cover window substrate 21 in the method of manufacturing a cover window according to an embodiment of the present invention. FIG. 15 shows a cross-section taken along line IV-IV' of the cover window substrate 21 of FIG. 10, showing the second pad 80 when the second pad 80 is placed on the cover window substrate 21. and a cross section of the cover window substrate 21 are shown. Figure 16 shows the second pad 80 when the second pad 80 is pressed to the cover window board 21, with respect to a cross section taken along line IV-IV' of the cover window board 21 of Figure 10. A cross section of the cover window substrate 21 is shown.

First, as shown in FIG. 15, the lower surface (in the -z direction) of the second pad 80 onto which the second ink (I2) is transferred is arranged to face the cover window substrate 21, and then the second pad ( 80) and the cover window substrate 21 can be aligned. Specifically, the second pad 80 may be placed on the cover window substrate 21 so that the center of the lower surface (in the -z direction) of the second pad 80 corresponds to the light blocking layer hole 22H.

The second ink (I2) may be different from the first ink (I1). For example, the second ink I2 may include red, green, or blue dye or pigment. Accordingly, the second ink I2 may have a predetermined color. The color of the second ink (I2) may be determined by the dye or pigment contained in the second ink (I2). The second ink (I2) may be placed on a printing plate that does not include a groove, and the second pad (80) is placed on this printing plate and pressed, thereby transferring the second ink (I2) to the second pad (80). You can do it.

Accordingly, the second ink I2 may be transferred to a portion of the lower surface (in the -z direction) and the side surface of the second pad 80. As described above, the first pad 50 may have the first ink I1 transferred to the pad peripheral area 50PA. That is, the first pad 50 contains first ink on the outer portion of the lower surface surrounding the center of the lower surface (in the -z direction) of the first pad 50 and on a part of the side of the first pad 50 that is in contact with it. (I1) can be transcribed. However, the first ink I1 may not be transferred to the center of the lower surface of the first pad 50 (in the -z direction). Compared to the first pad 50, the second pad 80 may have the second ink I2 transferred to the center of the lower surface (in the -z direction) of the second pad 80. Of course, the second pad 80 contains the second ink on the outer portion of the lower surface surrounding the center of the lower surface (in the -z direction) of the second pad 80 and on a part of the side of the second pad 80 that is in contact with it. (I2) can be transcribed. The area of the lower surface (in the -z direction) of the second pad 80 may be the same or similar to the area of the portion of the cover window substrate 21 exposed by the light blocking layer hole 22H.

Next, as shown in FIG. 16, the second pad 80 can be pressed to the cover window substrate 21 by pressing the second pad 80. Accordingly, the second ink I2 transferred to a portion of the lower surface and side surface (in the -z direction) of the second pad 80 may be transferred to the cover window substrate 21. Specifically, the second pad 80 may be pressed to a portion of the cover window substrate 21 exposed by the light blocking layer hole 22H, and the second ink I2 transferred to the second pad 80 may be It may be transferred to a portion of the cover window substrate 21 exposed by the light blocking hole 22H. As described above, the area of the lower surface (in the -z direction) of the second pad 80 may be the same or similar to the area of the portion of the cover window substrate 21 exposed by the light blocking layer hole 22H. Therefore, the second ink (I2) may be transferred only on the part of the cover window substrate 21 exposed by the light blocking layer hole 22H and a part of the light blocking layer 22 adjacent thereto, and may not be transferred to other areas. there is.

Similar to the first pad 50, the second pad 80 is attached to one side of the connection portion CP and may be connected to the control device CM. Since the above-described information regarding the relationship between the first pad 50, the connection portion (CP), and the control device (CM) can also be applied to the relationship between the second pad 80, the connection portion (CP), and the control device (CM), Redundant explanations in this regard will be omitted.

On the other hand, when the part of the cover window substrate 21 to which the second ink (I2) is transferred is a part of the cover window substrate 21 in contact with the first pad 50, the ink is applied to this part of the cover window substrate 21. It may not be easy for 2 ink (I2) to be transferred. That is, in the process of transferring the first ink (I1) to the cover window substrate 21, the second ink (I2) may be transferred to the portion of the cover window substrate 21 that was in contact with the first pad 50. In this case, the surface of the portion of the cover window substrate 21 described above may be contaminated by foreign substances. For example, when the first pad 50 includes a silicon-based compound, the surface of the portion of the cover window substrate 21 in contact with the first pad 50 may be contaminated with silicone oil. Accordingly, it may not be easy for the second ink I2 to be transferred to the portion of the cover window substrate 21 that is in contact with the first pad 50.

However, in the case of the cover window manufacturing method according to this embodiment, the first pad 50 may include a pad groove 50G. Accordingly, the portion of the cover window substrate 21 corresponding to the pad groove 50G of the first pad 50 is used to transfer the first ink I1 to the cover window substrate 21. ) may not come into contact with. Accordingly, the surface of the portion of the cover window substrate 21 onto which the second ink I2 is transferred may not be contaminated by foreign substances. Specifically, in the case of the cover window manufacturing method according to this embodiment, the surface of the part of the cover window substrate 21 exposed by the light blocking layer hole 22H is carbon (C): 15 at% to 16 at% and silicon ( Si): May contain 19at% to 20at%. That is, the partial surface of the cover window substrate 21 exposed by the light blocking hole 22H may not be contaminated by foreign substances. Therefore, when transferring the second ink (I2) to the cover window substrate 21, the second ink (I2) can be easily transferred to the cover window substrate 21. Therefore, the possibility of defects occurring during the manufacturing process can be reduced.

Next, the cover window substrate 21 onto which the second ink (I2) is transferred is heated at 150° C. for 10 minutes to form the color layer 23 as shown in FIG. 17. That is, the color layer 23 may be the second ink (I2) transferred to the cover window substrate 21 and dried by heating. The color layer 23 may cover the light blocking layer hole 22H. That is, a portion of the color layer 23 may be formed within the light blocking layer hole 22H, and a portion of the color layer 23 may be formed on a portion of the light blocking layer 22 adjacent to the light blocking layer hole 22H.

So far, the manufacturing method of the cover window has been described, but the present invention is not limited to this. For example, the cover window 20 manufactured by this manufacturing method also falls within the scope of the present invention. Below, this cover window 20 will be described. Since the effect of the cover window 20 manufactured in this way has been described above, it will be omitted and only the structure of the cover window 20 will be described. Hereinafter, for convenience, content that overlaps with the content described above with reference to FIGS. 1 to 17 will be omitted.

FIG. 18 is a perspective view of the cover window 20 according to an embodiment of the present invention, and FIG. 19 is a cross-sectional view of the cover window 20 according to an embodiment of the present invention. Specifically, FIG. 19 is a cross-sectional view schematically showing a cross-section taken along line F-F' of the cover window 20 of FIG. 18. 18 and 9 show the cover window 20 separated from the display panel 10 for convenience of illustration. In Figures 18 and 19, the cover window 20 is shown in an overturned state so that the back of the cover window 20 faces upward.

As shown in FIG. 18, the cover window 20 may include a transparent area (TA) and an opaque area (OA) corresponding to the display area (DA) and non-display area (NDA) shown in FIG. 1, respectively. there is. The transparent area (TA) may include a first transparent area (TA1) and a second transparent area (TA2), and the opaque area (OA) may include a first opaque area (OA1) and a second opaque area (OA2). there is. That is, the first transparent area (TA1), the second transparent area (TA2), the first opaque area (OA1), and the second opaque area (OA2) are the first display area (DA1), the second display area (DA2), It can correspond to the first non-display area (NDA1) and the second non-display area (NDA2), respectively. The positions and shapes of the first transparent area (TA1), the second transparent area (TA2), the first opaque area (OA1), and the second opaque area (OA2) are the first display area (DA1) and the second display area (DA2). ), may correspond to the positions and shapes of the first non-display area (NDA1) and the second non-display area (NDA2), respectively. Specifically, the second transparent area TA2 is disposed on both sides of the first transparent area TA1 along a first direction (for example, x-direction or -x-direction), and the first opaque area OA1 is disposed in the second direction (for example, For example, it may be arranged on both sides of the first transparent area TA1 along the y-direction or -y-direction, and the second opaque area OA2 may be arranged to surround the second transparent area TA2. Therefore, redundant description in this regard will be omitted.

The transparent area (TA) may be an optically transparent area. Accordingly, the display panel 10 can display images through the optically transparent first and second transparent areas TA1 and TA2 of the cover window 20. Similar to the relationship between the display area (DA) and the non-display area (NDA), in one embodiment, the transparent area (TA) may be surrounded by the opaque area (OA). The light transmittance of the opaque area (OA) may be lower than that of the transparent area (TA).

The cover window 20 may include a cover window substrate 21, a light blocking layer 22, and a color layer 23. The cover window substrate 21 may have substantially the same shape as the cover window 20. The cover window substrate 21 may include glass, sapphire, or plastic. For example, the cover window substrate 21 may be ultra-thin glass (UTG ^® ) whose strength has been strengthened by chemical strengthening or thermal strengthening, or it may be transparent polyimide (Colorless Polyimide, CPI). The cover window substrate 21 may have a structure in which a flexible polymer layer is disposed on one side of a glass substrate, or may be composed only of a polymer layer. Of course, since the cover window 20 includes the cover window substrate 21, the cover window substrate 21 includes the first transparent area (TA1), the second transparent area (TA2), and the first opaque area (TA2) as described above. It may be said to have a second opaque area (OA1) and a second opaque area (OA2). Hereinafter, for convenience, the cover window substrate 21 will be described as having a first transparent area (TA1), a second transparent area (TA2), a first opaque area (OA1), and a second opaque area (OA2).

The light blocking layer 22 may be disposed on the cover window substrate 21. Specifically, the light blocking layer 22 may be disposed on the opaque area (OA). In one embodiment, the light blocking layer 22 may include a light blocking material. That is, the light blocking layer 22 may include an opaque material that blocks light so that the wiring or circuitry of the display panel 10 cannot be identified from the outside. The light blocking material may include at least one of black dye and black particles. For example, light- _{shielding materials} may _include Cr, _CrO You can. The light blocking material may include a black organic pigment, and the black organic pigment may include one or more selected from the group consisting of aniline black, lactam black, and perylene black.

The light blocking layer 22 may include a light blocking hole 22H exposing a portion of the cover window substrate 21. In one embodiment, the light blocking layer hole 22H may be disposed on the upper side of the cover window 20. Specifically, the light blocking layer hole 22H may be disposed in the first opaque area OA1 located above the first transparent area TA1. However, the present invention is not limited to this. For example, the light blocking layer hole 22H may be located in the first opaque area OA1 located below the first transparent area TA1.

As shown in FIG. 19, the color layer 23 may fill the light blocking layer hole 22H. Specifically, the color layer 23 may be disposed within the light blocking layer hole 22H. In one embodiment, a portion of the color layer 23 is disposed within the light-shielding layer hole 22H, and another portion of the color layer 23 is disposed on a portion of the light-shielding layer 22 adjacent to the light-shielding hole 22H. It can be. The color layer 23 may include red, green, or blue dye or pigment. Accordingly, the color layer 23 may have a predetermined color. The color of the color layer 23 may be determined by the dye or pigment contained in the color layer 23. Although not shown, the display device 1 may include components disposed below the color layer 23. That is, the component may overlap with the color layer 23. The component is a camera that uses infrared or visible light, and may be equipped with an imaging device. Alternatively, the component may include at least one of a flash, a proximity sensor, an illumination sensor, and an infrared sensor. Since the color layer 23 blocks a smaller amount of light compared to the light blocking layer 22, external light can reach the component or light from the component can reach the outside through the color layer 23.

The interface of the cover window substrate 21 in contact with the color layer 23 has a higher content of carbon (C) and silicon (Si) than the surface of the cover window substrate 21 in the direction of the light blocking layer 22 in the transparent area (TA). The content may be low. In this specification, 'interface of the cover window substrate in contact with the color layer' refers to the area of the cover window substrate 21 that is about 10 nm into the interior of the cover window substrate 21 from the point where the cover window substrate 21 and the color layer 23 contact. Refers to the part, and in this specification, the 'surface of the cover window substrate' refers to the cover window that is about 10 nm deep into the inside of the cover window substrate 21 from the point where the cover window substrate 21 and the outside of the cover window substrate 21 contact. It refers to the part of the substrate 21. That is, the surface of the cover window substrate 21 in the direction of the light blocking layer 22 in the transparent area (TA) has a higher carbon (C) content and silicon ( The content of Si) may be high. For example, the surface of the cover window substrate 21 in the direction of the light blocking layer 22 in the transparent area (TA) may include carbon (C): 31 at% to 33 at% and silicon (Si): 23 at% to 24 at%. The interface of the cover window substrate 21 in contact with the color layer 23 may include carbon (C): 15 at% to 16 at% and silicon (Si): 19 at% to 20 at%.

In FIG. 19, the light blocking layer 22 is shown as including only one light blocking layer hole 22H, but the present invention is not limited thereto. For example, as shown in FIG. 20, which is a cross-sectional view schematically showing a portion of the cover window 20 according to an embodiment of the present invention, a plurality of light blocking layer holes 22H may be provided. The light blocking layer holes 22H may be disposed in the first opaque area OA1, and the light blocking layer holes 22H may be disposed to be spaced apart from each other.

In this case, the color layer 23 may fill a plurality of light blocking layer holes 22H. Specifically, one color layer 23 provided integrally can fill a plurality of light blocking layer holes 22H. Alternatively, a plurality of color layers 23 may be provided, and each of the color layers 23 may fill the light blocking layer hole 22H. Accordingly, the predetermined color of the plurality of color layers 23 that respectively fill the plurality of light blocking layer holes 22H may be different for each color layer 23. However, the present invention is not limited to this, and even if the plurality of color layers 23 each fills the plurality of light blocking layer holes 22H, the predetermined color of the plurality of color layers 23 may be the same. The plurality of light blocking layer holes 22H may have the same or similar shape and the same or similar size. Alternatively, the plurality of light blocking layer holes 22H may have different shapes or sizes.

As such, the present invention has been described with reference to the embodiments shown in the drawings, but these are merely illustrative, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. will be. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the attached claims.

20: Cover window
21: Cover window substrate
22: light blocking layer
22H: Shading layer hole
23: Color layer
50: pad
60: Printing plate
I1: first ink
50CA: Pad center area
50PA: Area around pad
TA: transparent area
TA1: first transparent area
TA2: Second transparent area
OA: opaque area
OA1: First opaque area
OA2: Second opaque area

Claims (21)

providing first ink to a printing plate;
transferring the first ink to a first pad including a pad center area including the center of the lower surface and a pad peripheral area surrounding the pad center area and having a pad groove disposed; and
Comprising: transferring the first ink from the first pad to the cover window substrate,
The step of transferring the first ink to the first pad is,
A method of manufacturing a cover window, comprising the step of transferring the first ink to the area around the pad. According to paragraph 1,
The step of transferring the first ink to the first pad is,
A method of manufacturing a cover window, wherein the first ink is not transferred to a portion of the area around the pad where the pad groove is disposed. According to paragraph 1,
The pad peripheral area includes an outer portion of the lower surface surrounding the center of the lower surface of the first pad, and a portion of a side surface of the first pad in contact with the outer portion of the lower surface. According to paragraph 1,
A method of manufacturing a cover window, wherein the first ink includes a light blocking material. According to paragraph 1,
The printing plate includes a printing plate central area and a printing plate peripheral area surrounding the printing plate central area and including a printing plate groove,
The step of providing the first ink to the printing plate,
A method of manufacturing a cover window, which is the step of filling the printing plate groove with the first ink. According to clause 5,
A method of manufacturing a cover window, wherein the printing plate groove extends along the outside of the central area of the printing plate. According to clause 5,
The step of transferring the first ink to the first pad is,
A method of manufacturing a cover window, comprising the step of transferring the first ink to the first pad by pressing the first pad on the printing plate filling the printing plate groove with the first ink. In clause 7,
The step of transferring the first ink to the first pad is,
A step of transferring the first ink filled in the printing plate groove to the first pad. Manufacturing method of cover window. According to clause 5,
The step of transferring the first ink to the first pad is,
A method of manufacturing a cover window, wherein the pad center area is in contact with the printing plate center area and the pad peripheral area is in contact with the first ink filled in the printing plate groove. In paragraph 9
The step of transferring the first ink to the first pad is,
A method of manufacturing a cover window, wherein a portion of the area around the pad where the pad groove is disposed does not come into contact with the first ink filled in the printing plate groove. According to paragraph 1,
The step of transferring the first ink to the cover window substrate,
A method of manufacturing a cover window, comprising the step of transferring the first ink to the cover window substrate by pressing the first pad onto which the first ink is transferred to the cover window substrate. According to clause 9,
The step of transferring the first ink to the cover window substrate,
A method of manufacturing a cover window, comprising the step of transferring the first ink transferred to the first pad to the cover window substrate. According to clause 9,
The step of transferring the first ink to the cover window substrate,
A method of manufacturing a cover window, wherein the pad center area and the pad peripheral area are in contact with the cover window substrate. According to clause 9,
The step of transferring the first ink to the cover window substrate,
A method of manufacturing a cover window, wherein the portion of the area around the pad where the pad groove is disposed is not in contact with the cover window substrate. According to paragraph 1,
A method of manufacturing a cover window, wherein the first pad includes a silicon-based compound. According to paragraph 1,
A method of manufacturing a cover window, further comprising forming a light-shielding layer and a hole in the light-shielding layer on the cover window substrate by heating the cover window substrate onto which the first ink is transferred at 150° C. for 10 minutes. According to clause 16,
transferring a second ink different from the first ink to the cover window substrate; and
A method of manufacturing a cover window, further comprising: forming a color layer covering the hole in the light blocking layer by heating the cover window substrate onto which the second ink is transferred at 150° C. for 10 minutes. According to clause 17,
The step of transferring a second ink different from the first ink to the cover window substrate,
A method of manufacturing a cover window, comprising the step of transferring the second ink to a portion of the cover window substrate exposed by the light blocking layer hole by pressing the second pad onto which the second ink is transferred to the cover window substrate. A transparent area including a first transparent area and a second transparent area disposed on both sides of the first transparent area along a first direction, and a first opaque area disposed on both sides of the first transparent area along a second direction. and a cover window substrate having an opaque area including a second opaque area surrounding the second transparent area.
A light blocking layer disposed on the opaque area; and
A color layer filling the hole of the light blocking layer disposed on the first opaque area,
A cover window wherein the interface of the cover window substrate in contact with the color layer has a lower carbon content or silicon content than the surface of the cover window substrate in the direction of the light blocking layer disposed in the transparent area. According to clause 19,
The interface of the cover window substrate in contact with the color layer contains carbon (C): 15 at% to 16 at%,
A cover window, wherein the surface of the cover window substrate in the direction of the light blocking layer in the transparent area includes carbon (C): 31 at% to 33 at%. According to clause 19,
The interface of the cover window substrate in contact with the color layer includes silicon (Si): 19 at% to 20 at%,
A cover window, wherein the surface of the cover window substrate in the direction of the light blocking layer in the transparent area includes silicon (Si): 23 at% to 24 at%.

Images