KR20230158800A - Frame device for semiconductor production equipment that is easy to maintain vertically and horizontally - Google Patents
Frame device for semiconductor production equipment that is easy to maintain vertically and horizontally Download PDFInfo
- Publication number
- KR20230158800A KR20230158800A KR1020220058366A KR20220058366A KR20230158800A KR 20230158800 A KR20230158800 A KR 20230158800A KR 1020220058366 A KR1020220058366 A KR 1020220058366A KR 20220058366 A KR20220058366 A KR 20220058366A KR 20230158800 A KR20230158800 A KR 20230158800A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor production
- frame
- frame device
- horizontally
- easy
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000007689 inspection Methods 0.000 claims abstract description 13
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 238000012423 maintenance Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M1/00—Frames or casings of engines, machines or apparatus; Frames serving as machinery beds
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Connection Of Plates (AREA)
Abstract
본 발명은 반도체 생산장비 또는 검사장비가 설치되는 프레임 장치에서, 개별 프레임을 레이저 가공한 후 끼워맞
춤 방식으로 조립 및 용접함으로써 수직 및 수평 유지가 용이하고 뒤틀림이 발생하지 않도록 한 반도체 생산 및
검사장비용 프레임 장치에 관한 것이다.The present invention is a frame device in which semiconductor production equipment or inspection equipment is installed, and individual frames are laser processed and then fitted.
Production of semiconductors that are easy to maintain vertically and horizontally and prevent distortion by assembling and welding using a dance method.
This relates to a frame device for inspection equipment.
Description
본 발명은 반도체 생산장비 또는 검사장비가 설치되는 프레임에 관한 것으로서, 특히 개별 프레임을 레이저 가The present invention relates to a frame on which semiconductor production equipment or inspection equipment is installed, and in particular, individual frames can be laser-activated.
공한 후 끼워맞춤 방식으로 조립 및 용접함으로써 수직 및 수평 유지가 용이하고 뒤틀림이 발생하지 않도록 한It is easy to maintain vertically and horizontally and prevents distortion by assembling and welding by fitting after construction.
반도체 생산 및 검사장비용 프레임 장치에 관한 것이다.This relates to frame devices for semiconductor production and inspection equipment.
일반적으로 반도체 생산장비는 반도체를 제작하는 다양한 공정에 있어서 각 공정에서 반제품을 제작하여 생산하In general, semiconductor production equipment produces semi-finished products in each process in various processes for manufacturing semiconductors.
는 장비이고, 반도체 검사장비는 제작된 반제품들에 대한 품질을 검사하는 장비로서, 반제품의 종류에 따라 다is equipment, and semiconductor inspection equipment is equipment that inspects the quality of manufactured semi-finished products, and varies depending on the type of semi-finished products.
양한 형태로 제작되고 있다.It is manufactured in various forms.
본 발명은 상기한 종래 기술의 문제점을 해소하기 위하여 안출된 것으로서, 프레임을 구성하는 각 부재들이 서The present invention was devised to solve the problems of the prior art described above, and each member constituting the frame is
로 견고하게 연결되어 수직 및 수평 유지를 용이하게 함과 아울러 뒤틀림이 발생하는 것을 방지할 수 있도록It is firmly connected to facilitate vertical and horizontal maintenance and prevent distortion.
한, 반도체 생산 및 검사장비용 프레임 장치를 제공하는데 그 목적이 있다.The purpose is to provide frame devices for semiconductor production and inspection equipment.
상기 목적을 달성하기 위한 본 발명은, 베이스 프레임과; 반도체 생산장비 또는 검사장비가 안착될 수 있도록The present invention for achieving the above object includes a base frame; To ensure that semiconductor production equipment or inspection equipment can be installed
상기 베이스 프레임으로부터 일정 정도 이격된 위치에 설치되는 거치 프레임과; 상기 베이스 프레임의 양측에a mounting frame installed at a certain distance from the base frame; on both sides of the base frame
각각 설치되고 상기 거치 프레임이 결합되는 한 쌍의 사이드 프레임을 포함한다.It includes a pair of side frames that are each installed and to which the mounting frame is coupled.
본 발명의 반도체 생산 및 검사장비용 프레임 장치는 프레임을 구성하는 각 부재에 레이저 가공에 의해 형성된The frame device for semiconductor production and inspection equipment of the present invention is formed by laser processing on each member constituting the frame.
결합부 및 결합돌기를 이용하여 각 부재를 끼워맞춤 방식으로 조립한 후 용접하여 일체화함에 따라, 각 부재의As each member is assembled using a fitting method using coupling parts and coupling protrusions and then integrated by welding, each member
수직 및 수평 유지가 용이하고 뒤틀림이 발생하지 않으며 전체적인 강도가 향상되어 내구성이 증가하는 효과가It is easy to maintain vertically and horizontally, prevents distortion, and improves overall strength, resulting in increased durability.
있다.there is.
도 1은 본 발명에 의한 반도체 생산 및 검사장비용 프레임 장치가 도시된 사시도.
도 2는 본 발명의 반도체 생산 및 검사장비용 프레임 장치의 분해 사시도.1 is a perspective view showing a frame device for semiconductor production and inspection equipment according to the present invention.
Figure 2 is an exploded perspective view of a frame device for semiconductor production and inspection equipment of the present invention.
본 발명에 의한 반도체 생산 및 검사장비용 프레임 장치는 도 1 내지 5에 도시된 바와 같이, 베이스 프레임(1As shown in FIGS. 1 to 5, the frame device for semiconductor production and inspection equipment according to the present invention includes a base frame (1)
0)과; 반도체 생산장비 또는 검사장비가 안착될 수 있도록 상기 베이스 프레임(10)으로부터 일정 정도 이격된0) and; spaced apart from the base frame 10 to a certain extent so that semiconductor production equipment or inspection equipment can be installed.
위치에 설치되는 거치 프레임(30)과; 상기 베이스 프레임(10)의 양측에 각각 설치되고 상기 거치 프레임(30)이A mounting frame 30 installed at the location; It is installed on both sides of the base frame 10 and the mounting frame 30 is
결합되는 한 쌍의 사이드 프레임(20);을 포함하여 이루어진다.It includes a pair of side frames 20 that are coupled.
그리고, 상기 사이드 프레임(20)은 도 3과 4에 도시된 바와 같이, 양측 단부가 상기 연결편(13)에 연결되는 하And, as shown in FIGS. 3 and 4, the side frame 20 has both ends connected to the connecting piece 13.
부부재(21)와, 상기 베이스재(11)와 하부부재(21)가 각각 끼워맞춤되도록 마주보는 모서리 부분에 결합부A coupling portion is provided at the opposite corner so that the subsidiary member 21, the base member 11, and the lower member 21 are respectively fitted.
(22a)(22b)가 각각 형성되고 상기 연결편(13)에 설치되는 한 쌍의 수직부재(22)와, 양측 단부가 상기 수직부재A pair of vertical members 22 formed by (22a) and (22b) respectively and installed on the connecting piece 13, and both ends of the vertical members
(22)의 상단면에 연결되는 상부부재(26)와; 양측 단부가 상기 수직부재(22)에 끼워 맞춤되어 상기 거치 프레임an upper member (26) connected to the upper surface of (22); Both ends are fitted into the vertical member 22 and the mounting frame
(30)의 측부를 형성하는 센터부재(24)와, 상기 하부부재(21)의 중간 부분에 끼워맞춤되어 상기 센터부재(24)를The center member 24 forming the side portion of (30) is fitted into the middle portion of the lower member 21 to form the center member 24.
지지하는 센터지지부재(23)와, 상기 상부부재(26)와 센터부재(24) 사이에 설치되어 둘 사이의 간격을 유지시키It is installed between the supporting center support member 23 and the upper member 26 and the center member 24 to maintain the gap between the two.
는 간격유지부재(27)와, 상기 사이드 프레임(20)은 일측 단부는 상기 센터지지부재(23)의 외측에서 상기 하부부is a gap maintenance member 27, and one end of the side frame 20 is located at the lower portion on the outside of the center support member 23.
재(21)에 끼워맞춤되고 타측 단부는 상기 센터부재(24)의 하부에서 상기 수직부재(22)에 끼워맞춤되는 한 쌍의It is fitted into the material 21 and the other end is fitted into the vertical member 22 at the lower part of the center member 24.
보강부재(25)로 이루어진다.It consists of reinforcing members (25).
상기 하부부재(21)의 양 끝단 하부에 상기 연결편(13)이 결합되는 턱부(21a)가 형성되고, 상기 하부부재(21)의A jaw portion 21a to which the connecting piece 13 is coupled is formed at the bottom of both ends of the lower member 21, and the lower member 21
중간 부분 내측에는 상기 센터지지부재(23)의 일부와 보강부재(25)의 결합돌기(25')가 결합되는 결합부(21b)가Inside the middle portion, there is a coupling portion (21b) where a part of the center support member (23) and the coupling protrusion (25') of the reinforcing member (25) are coupled.
형성된다. 그리고, 상기 하부부재(21)의 양 끝단에는 상기 수직부재(22)의 결합부(22a)에 끼워맞춤되어 조립되is formed And, both ends of the lower member 21 are assembled by fitting into the coupling portions 22a of the vertical member 22.
도록 결합돌기(21c)가 형성된다. 상기 수직부재(22)의 중간 부분에는 상기 센터부재(24)의 양측 단부에 형성되A coupling protrusion 21c is formed so as to do so. The middle portion of the vertical member 22 is formed on both ends of the center member 24.
는 결합돌기(24b)와 보강부재(25)의 결합돌기(25')가 결합되는 결합부(22c)가 형성된다. 또, 상기 센터부재(2A coupling portion 22c is formed where the coupling protrusion 24b and the coupling protrusion 25' of the reinforcing member 25 are coupled. In addition, the above center member (2
4)의 중간 부분 내측에는 상기 간격유지부재(27)의 하단에 형성된 결합돌기(27')가 결합되도록 결합부(24a)가Inside the middle portion of 4), there is a coupling portion 24a so that the coupling protrusion 27' formed at the lower end of the gap maintenance member 27 is coupled.
형성된다.is formed
10:베이스 프레임
11:베이스재
11a:턱부
11b:결합돌기
12:베이스 중간재
13:연결편
13:구멍
20:사이드 프레임
21:하부부재
21a:턱부
21b:결합돌기
22:수직부재
23:센터지지부재
23a:결합부
23b:결합돌기
24:센터부재
24a:결합부
24b:결합돌기
-10: Base frame
11: Base material
11a: Chin part
11b: Combining protrusion
12: Base intermediate material
13:Connection flight
13:hole
20:Side frame
21: Lower member
21a: Chin part
21b: Combining protrusion
22: Vertical member
23: Center support member
23a: coupling part
23b: Combining protrusion
24: Center member
24a: coupling part
24b: Combining protrusion
-
Claims (1)
부재(21)가 각각 끼워맞춤되도록 마주보는 모서리 부분에 결합부(22a)(22b)가 각각 형성되고 상기 연결편(13)에
설치되는 한 쌍의 수직부재(22)와, 양측 단부가 상기 수직부재(22)의 상단면에 연결되는 상부부재(26)와; 양측
단부가 상기 수직부재(22)에 끼워 맞춤되어 상기 거치 프레임(30)의 측부를 형성하는 센터부재(24)와, 상기 하
부부재(21)의 중간 부분에 끼워맞춤되어 상기 센터부재(24)를 지지하는 센터지지부재(23)와, 상기 상부부재(2
6)와 센터부재(24) 사이에 설치되어 둘 사이의 간격을 유지시키는 간격유지부재(27)를 포함하는 것을 특징으로
하는 반도체 생산 및 검사장비용 프레임 장치.The side frame 20 includes a lower member 21 whose both ends are connected to the connecting piece 13, the base material 11, and the lower member 21.
Coupling portions 22a and 22b are formed at opposite corners so that the members 21 are fitted into each other, and are provided on the connecting pieces 13.
A pair of vertical members 22 are installed, and an upper member 26 whose both ends are connected to the upper surface of the vertical members 22; both sides
a center member 24 whose end is fitted into the vertical member 22 to form a side part of the mounting frame 30; and
A center support member (23) fitted in the middle of the secondary member (21) to support the center member (24), and the upper member (2)
Characterized by comprising a gap maintenance member (27) installed between 6) and the center member (24) to maintain the gap between the two.
A frame device for semiconductor production and inspection equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220058366A KR20230158800A (en) | 2022-05-12 | 2022-05-12 | Frame device for semiconductor production equipment that is easy to maintain vertically and horizontally |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220058366A KR20230158800A (en) | 2022-05-12 | 2022-05-12 | Frame device for semiconductor production equipment that is easy to maintain vertically and horizontally |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230158800A true KR20230158800A (en) | 2023-11-21 |
Family
ID=88982097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020220058366A KR20230158800A (en) | 2022-05-12 | 2022-05-12 | Frame device for semiconductor production equipment that is easy to maintain vertically and horizontally |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20230158800A (en) |
-
2022
- 2022-05-12 KR KR1020220058366A patent/KR20230158800A/en unknown
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