KR20230149975A - Method of manufacturing a iii-nitride semiconductor lyaers - Google Patents

Abstract

The present disclosure provides a method for manufacturing a group III nitride semiconductor laminate including an uppermost layer, comprising forming a first seed layer on a growth substrate; wherein the first seed layer has a composition that causes the growth substrate to have a downwardly convex shape. Branching stage; Forming a first layer on the first seed layer; wherein the first layer has a composition that reduces the downward convexity of the growth substrate on which the first seed layer is formed; forming a second layer of a Ga-rich group III nitride semiconductor on the first layer; forming a plurality of protrusions in the second layer; Forming a second seed layer on the second layer on which a plurality of protrusions are formed; wherein the second seed layer has a composition that applies stress toward the downwardly convex shape of the growth substrate on which the second layer having a plurality of protrusions is formed. Branching stage; Forming a stress control layer on the second seed layer; wherein the stress control layer relieves or strengthens stress depending on the bending state of the growth substrate on which the second seed layer is formed to prevent cracking of the laminate after formation of the top layer. Having an Al composition; And, it relates to a method of manufacturing a Group III nitride semiconductor laminate including the step of forming a top layer of Ga-rich Group III nitride semiconductor on the stress control layer.

Description

Method for manufacturing a group III nitride semiconductor laminate {METHOD OF MANUFACTURING A III-NITRIDE SEMICONDUCTOR LYAERS}

The present disclosure generally relates to a method of manufacturing a group III nitride semiconductor laminate or a group III nitride semiconductor device, particularly non-emitting devices such as power devices (e.g. diodes, transistors, HEMTs, JFETs). It relates to a method of manufacturing a group III nitride semiconductor laminate or a group III nitride semiconductor device.

Here, background information related to the present disclosure is provided, and this does not necessarily mean prior art.

1 is a diagram showing an example of a Group III nitride semiconductor device presented in U.S. Patent Publication No. 7,230,284. The Group III nitride semiconductor device (e.g., AlGaN/GaN based HEMT) is grown on a growth substrate 11; e.g., a sapphire substrate. , SiC substrate), buffer layer (12; e.g., Al _x Ga _1-x N (0≤x≤1) buffer layer), channel layer (20; e.g., GaN channel layer), 2DEG (22; two-dimensional electron gas) (22), a barrier layer (18; e.g., AlGaN barrier layer), an insulating layer (24; SiN insulating layer), a drain electrode 14, a gate electrode 16, and a source electrode 17.

From the viewpoint of material cost and crystallinity, it is desirable to use a sapphire substrate as the growth substrate 11, but it is not suitable from the viewpoint of heat dissipation. SiC substrates can be considered from the viewpoint of crystallinity and heat dissipation, but the material cost is expensive and this can become a bigger problem as the device area becomes larger. From the viewpoint of material cost, the use of a low-cost Si substrate can be considered, but a method of improving the crystallinity of the group III nitride semiconductor layer grown on it must be accompanied. Below, we will first look at methods for improving the crystallinity of the group III nitride semiconductor layer during the growth process.

Figure 2 is a diagram showing an example of a Group III nitride semiconductor laminate presented in U.S. Patent Publication No. 2005-0156175. The Group III nitride semiconductor stack includes a c-plane sapphire substrate 100 and a c-plane sapphire substrate 100. It includes a growth prevention film 150 made of SiO ₂ formed thereon, and a group III nitride semiconductor layer 310 selectively grown thereon. Through this growth method, crystal defects in the group III nitride semiconductor stack can be reduced.

Figure 3 is a diagram showing another example of a Group III nitride semiconductor laminate presented in U.S. Patent Publication No. 2005-0156175. The Group III nitride semiconductor stack includes a c-plane sapphire substrate 100 and a c-plane sapphire substrate ( 100) A group III nitride semiconductor template 210 pre-formed thereon, a growth prevention film 150 made of SiO ₂ formed on the group III nitride semiconductor template 210, and a group III nitride semiconductor layer selectively grown thereon. Includes (310). The group III nitride semiconductor template 210 is formed by a conventional method of growing a group III nitride semiconductor on a c-plane sapphire substrate 100. That is, it is formed to a thickness of 1 to 3 μm by forming a seed layer at a growth temperature of around 550°C and in a hydrogen atmosphere, and then growing GaN at a growth temperature of 1050°C. Reference numeral 180 represents defects (Threading Dislocations), and the development of defects under the growth prevention film 150 is blocked, resulting in an overall improvement in crystallinity. In other words, the growth prevention film 150 enables ELOG (Epitaxially Lateral Overgrowth) as in the group III nitride semiconductor laminate shown in FIG. 1, and also serves to block defects 180 occurring below.

Figure 4 is a diagram showing an example of a Group III nitride semiconductor light emitting device presented in U.S. Patent Publication No. 2003-0057444. The Group III nitride semiconductor light emitting device is a sapphire substrate 100, n grown on the sapphire substrate 100. It includes a type III nitride semiconductor layer 300, an active layer 400 grown on the n-type group III nitride semiconductor layer 300, and a p-type group III nitride semiconductor layer 500 grown on the active layer 400. Protrusions 110 are formed on the sapphire substrate 100, and the protrusions 110 improve the crystal quality of the group III nitride semiconductor layers (300, 400, 500) grown on the sapphire substrate 100, and the active layer (400) ) functions as a scattering surface that improves the efficiency of emitting light generated from the light emitting device to the outside. The sapphire substrate 100 on which the protrusions 110 are formed in this way is called a patterned sapphire substrate (PSS).

Figure 5 is a diagram showing an example of a Group III nitride semiconductor light emitting device presented in U.S. Patent Publication No. 2005-082546. The Group III nitride semiconductor light emitting device includes a sapphire substrate 101 on which protrusions 111 are formed and a Group III nitride. Includes a semiconductor layer 301. Unlike the example shown in FIG. 4, a protrusion 111 with a round cross-section is presented, which means that when using the protrusion 110 as shown in FIG. 4, the bottom surface of the protrusion 110 (protrusion 110 is formed Epi-growth occurs on both the concave-convex surface (corresponding to a concave part) and the upper surface of the protrusion 110, and thus a crystal defect, a threading dislocation, occurs on both the bottom surface and the upper surface. The protrusion 111 has a round cross-section. ) has the advantage of suppressing epitaxial growth on the upper surface of the protrusion 111 and suppressing the occurrence of penetration dislocations.

Figure 6 is a diagram showing an example of a Group III nitride semiconductor light emitting device presented in U.S. Patent Publication No. 2011-0042711. The Group III nitride semiconductor light emitting device 10 is disposed on a sapphire substrate 11 and a sapphire substrate 11. An n-type group III nitride semiconductor region 12a is grown, an active region 12b is grown on the n-type group III nitride semiconductor region 12a, and a p-type group III nitride semiconductor region 12c is grown on the active region 12b. Includes. Likewise, the sapphire substrate 110 is provided with protrusions 13. However, the protrusion 13 has a pointed cross section. By providing the protrusion 13 in a sharp shape, the upper part of the protrusion 13 has a point or line shape (if the protrusion 13 has a cone shape, it becomes a point, and if the protrusion 13 has a sharp stripe shape, it becomes a line. .) to suppress the formation of penetration dislocations at the top, while suppressing epi growth on the side connecting the top and bottom surfaces of the protrusion 13, thereby suppressing the generation of penetration dislocations on the side of the protrusion 13. do.

FIG. 7 is a diagram illustrating an example of a Group III nitride semiconductor stack presented in U.S. Patent Publication No. 10,361,339. The Group III nitride semiconductor stack includes a sapphire substrate 10, a buffer region 20, and a Group III nitride semiconductor region. (35), and shows that even with the protrusion of the form shown in FIG. 6, the upper part of the protrusion still forms the through dislocation (35).

Figures 26 and 27 are diagrams showing an example of a Group III nitride semiconductor stack or device presented in U.S. Patent Publication No. 9,324,844, which is a non-luminous Group III nitride semiconductor stack or device that is a vertically structured junction field effect transistor. (1000; Vertical Juction Field Effect Transistor; JFET) is presented. The non-light-emitting group III nitride semiconductor device 1000 includes a drain region 102, a drift region 103, a gate region 104, a source region 105, a drain electrode 106, a gate electrode 107, and a source electrode ( 108). FIG. 26 shows the off state, which is the default mode, and the depletion region 109 overlaps the position 120 within the channel 121 (see FIG. 27) to prevent current from flowing. Figure 27 shows the on state, and when voltages (V _D , V _S ) are applied to the gate electrode 107 and the source electrode 108, the gate voltage (V _D ) reduces the size of the depletion region 109. A channel 108 through which current can flow is provided to turn on the vertically structured JFET 1000, and the depletion region 109 is separated so that current flows from the drain region 102 to the drift region 103 and the channel region 121. ) can flow in the vertical direction 122 to the source area 106.

Figure 41 is a diagram showing an example of a non-light-emitting Group III nitride semiconductor laminate or device presented in U.S. Patent Publication No. 7,388,236, and the Group III nitride semiconductor device (e.g., AlGaN/GaN based HEMT) is shown in Figure 1. Like the device, a growth substrate (11; e.g., sapphire substrate, SiC substrate), a buffer layer (12; e.g., Al _x Ga _1-x N (0≤x≤1) buffer layer), and a channel layer (20; e.g., GaN channel layer) ), 2DEG (22; two-dimensional electron gas) (22), barrier layer (18; e.g., AlGaN barrier layer), insulating layer (24; e.g., SiN insulating layer), drain electrode (14), gate electrode (16) ) and a source electrode 17, and a gate field plate 25 is additionally provided on the gate electrode 16. Meanwhile, by providing a group III nitride layer (26; e.g., p-type GaN) of different conductivity between the gate electrode 16 and the barrier layer 17, D-mode (depletion-mode) AlGaN/GaN HEMT (gate voltage E-mode (Enhancement-mode) HEMT (a device in a turn-off state, i.e., normally-off state, when the gate voltage is not applied) can be implemented. The gate field plate 25 is such that when high electrical energy (high voltage, high frequency) is applied (or injected) through the gate electrode 16, a large electric field is concentrated around the gate electrode 16 and is applied to a portion of the group III nitride semiconductor device. Electrical shock can have a negative impact on the lifespan and reliability of the device. To prevent this, the shape of the electrode plate extending from the gate electrode 16 is designed to disperse the concentrated electric field to protect the device.

FIG. 57 is a diagram showing an example of a display device presented in U.S. Patent Publication No. 2021-0183301, where the display device 4100 includes a first subpixel (SP1), a second subpixel (SP2), and a third subpixel. Includes (SP3). Additionally, the display device 4100 includes a support substrate 4110 (e.g., a backplane substrate), a driving layer 4130 provided on the substrate 4110, and light emitting units 4141, 4142, 4143, and 4145 provided on the driving layer 4130. ,4146,4147,4149,4150). The driving layer 4130 drives the light emitting unit and may be made of a driving element 4135 and an insulating layer 4132, and the driving element 4135 may be made of a transistor, thin film transistor, or high electron mobility transistor (HEMT). You can. 4141 is a first electrode, 4142 is a first semiconductor layer, 4143 is an active layer, 4145 is a second semiconductor layer, 4146 is a second electrode, 4147 is an isolation structure, 4149 is a window area, and 4150 is a reflection layer. Of course, in addition to being composed of LED and micro LED, the light emitting part can be composed of OLED.

Figures 58 and 59 are diagrams showing an example of a display device presented in Korean Patent Publication No. 10-2021-0023392, where the display device 5150 includes light emitting units 151, 153, and 155, a pad electrode (PAD), and a buffer layer 5120. ), passivation layers 162 and 164, a switching transistor (SMT), a driving transistor (DRT), a storage capacitor (Cst), and an encapsulation layer (180b). 151 is the first semiconductor layer, 153 is the active layer, and 155 is the second semiconductor layer. The switching transistor (SMT) includes a first heterojunction layer 165a, a first gate electrode 167a, a first source electrode 168a, and a first drain electrode 169a. The first heterojunction layer 165a includes a first channel forming layer 161a and a first channel supply layer 163a. The driving transistor DRT includes a second heterojunction layer 165b, a second gate electrode 167b, a second source electrode 168b, and a second drain electrode 169b. The second heterojunction layer 165b includes a second channel forming layer 161b and a second channel supply layer 163b. The storage capacitor Cst includes a first storage electrode 171, a dielectric layer 173, and a second storage electrode 175. The first storage electrode 171 is connected to the first drain electrode 169a of the switching transistor (SWT), and the second storage electrode 175 is connected to the second source electrode 168b of the driving transistor (DRT). there is. The pad electrode (PAD) is connected to a voltage line (Vdd; see FIG. 59) to which voltages, signals, etc. for driving subpixels are applied, and the S-PAD connects the first source electrode 168a to the data line DL. This is the source pad electrode that is connected. In Figure 59, GL is a gate wire to which the first gate electrode 167a of the switch transistor (SWT) is connected, and Vcom is a common wire to which the second source electrode 168b of the driving transistor (DRT) is connected. In summary, the first gate electrode 167a of the switching transistor (SWT) is connected to the gate wire (GL), the first source electrode 168a is connected to the data wire (DL), and the first drain electrode 169a is connected to the second gate electrode 167b of the driving transistor (DRT), the second source electrode 168b is connected to the common wiring (Vcom), and the second drain electrode 169b is connected to the first semiconductor layer 151. The pad electrode (PAD) is connected to the power wiring (Vdd), the storage capacitor (Cst) is connected to the first drain electrode (169a) and the second source electrode (168b), and the light emitting unit is connected through these wiring. Control the light emission of (151,153,155; μLED). Various types of transistors such as BJT, MOSFET, and TFT can be used as the switching transistor (SWT) and driving transistor (DRT), but HEMT was used in the example presented.

This is described at the end of the ‘specific details for carrying out the invention’.

Here, a general summary of the disclosure is provided, and this should not be construed as limiting the scope of the disclosure (This section provides a general summary of the disclosure and is not a comprehensive disclosure of its full scope or all of its features).

According to one aspect of the present disclosure, a method of manufacturing a non-emissive Group III nitride semiconductor laminate includes preparing a growth substrate containing silicon (Si); Forming a plurality of protrusions on a growth substrate; Growing a first buffer layer to cover a plurality of protrusions on a growth substrate; forming a plurality of growth prevention films on the first buffer layer; Growing a second buffer layer from the first buffer layer exposed through the growth prevention film; And, a method of manufacturing a non-emissive Group III nitride semiconductor laminate is provided, including the step of forming a non-emissive Group III nitride semiconductor laminate on the second buffer layer.

According to another aspect of the present disclosure, there is provided a method for manufacturing a non-luminescent Group III nitride semiconductor stack, comprising: preparing a growth substrate; Forming a plurality of protrusions on a growth substrate; Growing a first buffer layer to cover a plurality of protrusions on a growth substrate; forming a plurality of growth inhibition films on the first buffer layer; growing a second buffer layer from the first buffer layer exposed from the plurality of growth inhibition films; And, a method of manufacturing a non-emissive Group III nitride semiconductor laminate is provided, including the step of forming a non-emissive Group III nitride semiconductor laminate on the second buffer layer.

According to another aspect of the present disclosure, there is provided a method for manufacturing a non-luminescent Group III nitride semiconductor stack, comprising: preparing a growth substrate; Growing a first buffer layer on a growth substrate; Forming a plurality of protrusions made of a first buffer layer on a first buffer layer; growing a second buffer layer on the first buffer layer; Forming a non-emissive Group III nitride semiconductor laminate on the second buffer layer; And, prior to growing the second buffer layer, forming a material layer that slows or prevents the growth of the second buffer layer on the plurality of protrusions; a method of manufacturing a non-light-emitting group III nitride semiconductor laminate comprising: provided.

According to another aspect of the present disclosure, there is provided a non-luminescent Group III nitride semiconductor stack, comprising: sequentially stacked drain regions; drift area; and gate area; a support substrate electrically connected to the drain region; A gate electrode electrically connected to the gate area; a source electrode electrically connected to a channel formed by the drift region exposed through the gate region; A passivation layer covering the entire laminate where the gate electrode and the source electrode are located and having a plurality of openings; a gate electrode for bonding electrically connected to the gate electrode through one of the plurality of openings; In addition, a non-light-emitting group III nitride semiconductor laminate is provided, including a bonding source electrode electrically connected to the source electrode through another one of the plurality of openings.

According to another aspect of the present disclosure, there is provided a method of manufacturing a non-emissive Group III nitride semiconductor stack, comprising: forming a non-emissive Group III nitride semiconductor stack on a growth substrate; Attaching a temporary substrate to the side of the laminate facing the growth substrate; removing the growth substrate; Forming a multilayer thin film including an electrically insulating ceramic layer and a metal layer in the order of the ceramic layer and the metal layer on the side of the laminate from which the growth substrate has been removed; Attaching a support substrate to the multilayer thin film; And, a method of manufacturing a non-emissive Group III nitride semiconductor laminate is provided, including the step of removing the temporary substrate.

According to another aspect of the present disclosure, there is provided a laminate for a non-emissive group III nitride semiconductor device, comprising: a sequentially stacked support substrate; A multilayer thin film composed of an electrically insulating ceramic layer and a metal layer; A non-emitting group III nitride semiconductor region consisting of a buffer layer, a channel layer, and a barrier layer; A gate electrode, a source electrode, and a drain electrode electrically connected to a non-luminescent group III nitride semiconductor region; A passivation layer covering the non-light-emitting group III nitride semiconductor region where the source electrode, drain electrode, and gate electrode are located, and opening the source electrode, drain electrode, and gate electrode to enable electrical connection to the outside; In addition, a non-light-emitting group III nitride semiconductor laminate is provided, including a field plate provided on the passivation layer to be electrically connected to one of the source electrode and the gate electrode.

According to another aspect of the present disclosure, a method of manufacturing a non-luminescent Group III nitride semiconductor stack includes forming a non-luminescent Group III nitride semiconductor stack on a non-conductive growth substrate. step; Attaching a temporary substrate to the side of the laminate facing the growth substrate; reducing the thickness of the growth substrate; Attaching a support substrate to the growth substrate of reduced thickness; And, a method of manufacturing a non-emissive Group III nitride semiconductor laminate is provided, including the step of removing the temporary substrate.

According to another aspect of the present disclosure, a method of manufacturing a non-light-emitting group III nitride semiconductor laminate includes sequentially growing a drain region and a drift region; forming a channel by removing a portion of the drift area; and re-growing a gate region in the drift region from which a portion has been removed, further comprising forming an intervening layer between the gate region and the drift region prior to the re-growing step. A method for manufacturing a nitride semiconductor laminate is provided.

According to another aspect of the present disclosure, a method of manufacturing a non-emissive Group III nitride semiconductor laminate includes preparing a growth substrate provided with a plurality of protrusions; Growing a first buffer layer to cover a plurality of protrusions on a growth substrate; Forming a plurality of growth prevention films on the first buffer layer without going through an alignment process with respect to the plurality of protrusions; And, growing a second buffer layer from the first buffer layer exposed through a plurality of growth prevention films. A method of manufacturing a non-light-emitting group III nitride semiconductor laminate is provided, including the step.

According to another aspect of the present disclosure, a method of manufacturing a non-emissive group III nitride semiconductor stack includes forming a channel layer, a 2DEG, a barrier layer, and a gate electrode on a growth substrate. forming step; Attaching a temporary substrate using a bonding layer; removing the growth substrate; And, forming a source electrode and a drain electrode on the channel layer from which the growth substrate has been removed; a method of manufacturing a non-light-emitting group III nitride semiconductor laminate is provided, including.

According to another aspect of the present disclosure, in a method of manufacturing a non-luminescent group III nitride semiconductor laminate, a growth substrate made of silicon (Si) is grown with AlN at a first temperature. forming a seed layer; forming a layer of AlN on the seed layer at a second temperature higher than the first temperature; forming a channel layer, 2DEG, and barrier layer on the AlN layer; And, prior to forming the channel layer, a method of manufacturing a non-light-emitting group III nitride semiconductor laminate is provided, including forming at least one of an air void and a protrusion.

According to another aspect of the present disclosure, in a method of manufacturing a non-emissive group III nitride semiconductor device, a non-emissive group III nitride semiconductor laminate is grown on a growth substrate made of sapphire. ordering step; Attaching a temporary substrate to the non-luminescent Group III nitride semiconductor stack on the side opposite the growth substrate; Removing the growth substrate from the non-luminescent Group III nitride semiconductor stack; Attaching a support substrate made of silicon to the non-luminescent Group III nitride semiconductor laminate on the side from which the growth substrate was removed; And, removing the temporary substrate from the non-emissive Group III nitride semiconductor laminate. A method of manufacturing a non-emissive Group III nitride semiconductor device is provided, including.

According to another aspect of the present disclosure, there is provided a method of manufacturing a non-emissive Group III nitride semiconductor device, comprising: forming a trench on one surface of a growth substrate; filling the trench with a trench cover material; Forming a seed layer on one side of the growth substrate while filling the trench with a trench cover material; Forming a non-luminescent group III nitride semiconductor laminate on the seed layer; exposing the trench by reducing the thickness of the growth substrate; And, forming a conductive material in the trench from which the trench cover material has been removed; a method of manufacturing a non-light-emitting group III nitride semiconductor device is provided, including.

According to another aspect of the present disclosure, in a method of manufacturing a group III nitride semiconductor laminate, forming a first seed layer on a growth substrate; as, a first seed the layer having a composition that causes the growth substrate to have a downwardly convex shape; Forming a first layer on the first seed layer; wherein the first layer has a composition that reduces the downward convexity of the growth substrate on which the first seed layer is formed; forming a second layer of a Ga-rich group III nitride semiconductor on the first layer; forming a plurality of protrusions in the second layer; Forming a second seed layer on the second layer on which a plurality of protrusions are formed; wherein the second seed layer has a composition that applies stress toward the downwardly convex shape of the growth substrate on which the second layer having a plurality of protrusions is formed. Branching stage; Forming a stress control layer on the second seed layer; wherein the stress control layer relieves or strengthens stress depending on the bending state of the growth substrate on which the second seed layer is formed to prevent cracking of the laminate after formation of the top layer. Having an Al composition; Also, a method for manufacturing a Group III nitride semiconductor laminate is provided, including forming a top layer of a Ga-rich Group III nitride semiconductor on the stress control layer.

This is described at the end of the ‘specific details for carrying out the invention’.

1 is a diagram showing an example of a Group III nitride semiconductor device presented in U.S. Patent Publication No. 7,230,284;
2 is a view showing an example of a group III nitride semiconductor laminate presented in U.S. Patent Publication No. 2005-0156175;
3 is a view showing another example of a group III nitride semiconductor laminate presented in U.S. Patent Publication No. 2005-0156175;
Figure 4 is a diagram showing an example of a group III nitride semiconductor light emitting device presented in U.S. Patent Publication No. 2003-0057444;
Figure 5 is a diagram showing an example of a group III nitride semiconductor light emitting device presented in U.S. Patent Publication No. 2005-082546;
Figure 6 is a diagram showing an example of a group III nitride semiconductor light emitting device presented in U.S. Patent Publication No. 2011-0042711;
7 is a view showing an example of a Group III nitride semiconductor laminate presented in U.S. Patent Publication No. 10,361,339;
8 is a diagram showing an example of a Group III nitride semiconductor laminate or device according to the present disclosure;
9 is a diagram showing an example of the arrangement relationship between protrusions and a growth prevention film according to the present disclosure;
10 is a diagram illustrating an example of a method of forming protrusions on a growth substrate according to the present disclosure;
11 is a view showing another example of a method of forming protrusions on a growth substrate according to the present disclosure;
12 is a diagram showing another example of a method of forming protrusions on a growth substrate according to the present disclosure;
13 is a view showing another example of a method of forming protrusions on a growth substrate according to the present disclosure;
Figure 14 is a diagram showing a specific example of the method of forming the protrusion shown in Figure 12;
15 to 17 are diagrams showing another example of a method of forming a growth prevention film according to the present disclosure;
18 is a diagram showing another example of a method for forming a growth prevention film according to the present disclosure;
19 is a diagram showing another example of a method for forming a growth prevention film according to the present disclosure;
20 is a diagram showing another example of a method for forming a growth prevention film according to the present disclosure;
21 to 23 are diagrams showing another example of a method of forming a growth prevention film according to the present disclosure;
24 and 25 are diagrams showing another example of a Group III nitride semiconductor laminate or device according to the present disclosure;
26 and 27 are diagrams showing an example of a Group III nitride semiconductor laminate or device presented in U.S. Patent Publication No. 9,324,844;
28 to 37 are diagrams showing another example of a method for manufacturing a Group III nitride semiconductor laminate or device according to the present disclosure;
Figures 38 to 40 are diagrams illustrating an example of a support substrate used in the laminate shown in Figure 37;
41 is a view showing an example of a non-luminescent Group III nitride semiconductor laminate or device presented in U.S. Patent Publication No. 7,388,236;
Figures 42 to 46 are diagrams showing an example of a method for manufacturing the non-luminescent Group III nitride semiconductor laminate or device shown in Figure 41;
47 is a diagram showing another example of a method for manufacturing a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
48 is a diagram showing another example of a method for manufacturing a non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure;
49 is a diagram showing another example of a method for manufacturing a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
50 is a diagram showing another example of a method for manufacturing a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
51 is a diagram showing another example of a method for manufacturing a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
52 and 53 are diagrams showing another example of a method for manufacturing a group III nitride semiconductor laminate or device according to the present disclosure;
54 and 55 are diagrams showing another example of the arrangement relationship between protrusions and a growth prevention film according to the present disclosure;
56 is an example of an image (Monochromatic CL image) showing crystal defects formed in the first buffer layer;
57 is a diagram showing an example of a display device presented in U.S. Patent Publication No. 2021-0183301;
Figures 58 and 59 are diagrams showing an example of the display device presented in Korean Patent Publication No. 10-2021-0023392;
60 is a diagram showing another example of a method for manufacturing a non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure;
Figures 61 and 62 are diagrams illustrating various forms of non-luminescent group III nitride semiconductor laminates or devices manufactured according to the method shown in Figure 60;
Figure 63 is a diagram showing an example of a method for transferring a non-light-emitting group III nitride semiconductor laminate or device manufactured according to the method shown in Figure 60;
Figure 64 is a diagram showing another example of a method for transferring a non-light-emitting group III nitride semiconductor laminate or device manufactured according to the method shown in Figure 60;
65 is a diagram showing another example of a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
FIG. 66 is a diagram illustrating the bowing of the wafer during the growth process of the non-light-emitting group III nitride semiconductor laminate or device shown in FIG. 65;
67 is a diagram showing another example of a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
Figure 68 is a diagram illustrating the bowing of the wafer during the growth process of the non-light-emitting group III nitride semiconductor stack or device shown in Figure 67;
69 is a view showing another example of a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
Figure 70 is a diagram illustrating the bowing of the wafer during the growth process of the non-light-emitting group III nitride semiconductor stack or device shown in Figure 69;
71 is a diagram showing another example of a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
Figure 72 is a diagram illustrating the bowing of the wafer during the growth process of the non-light-emitting group III nitride semiconductor stack or device shown in Figure 70;
73 and 74 are diagrams illustrating another example of manufacturing a non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure;
75 to 87 are diagrams illustrating another example of manufacturing a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure;
88 to 92 are diagrams illustrating another example of a Group III nitride semiconductor laminate or device according to the present disclosure.

Hereinafter, the present disclosure will now be described in detail with reference to the accompanying drawing(s).

Figure 8 is a diagram showing an example of a group III nitride semiconductor laminate or device according to the present disclosure, and a HEMT is shown as an example. The group III nitride semiconductor device includes a growth substrate (42; 6-inch or 8-inch Si substrate) with protrusions (41), a first buffer layer (43), and a growth prevention film (44; e.g., a dielectric material such as SiO ₂ or SiN _x ). ), second buffer layer 45, channel layer (46; e.g., 3㎛ thick GaN channel layer), 2DEG (47), interlayer (48; e.g., 10nm thick thin AlN layer, can be omitted), barrier layer (49; e.g. _, 10~50nm thick _Al It includes a cap layer, an n-layer or a p-layer (can be doped or omitted), a source electrode 51, a gate electrode 52, and a drain electrode 53.

In the case of the growth substrate 42 made of silicon (Si) (hereinafter referred to as Si growth substrate 42), since it is an opaque substrate, the protrusions used on the sapphire substrate (see FIGS. 4 to 7, these protrusions are primarily used as light emitting devices) (LED), it functions as a scatter (light scattering) to eliminate total internal reflection caused by the difference between the refractive index of the group III nitride semiconductor layer and the sapphire substrate, and secondarily, the protrusions form a growth prevention film in the ELOG (Figure 2). and (see FIG. 3), thereby improving the film quality. However, in the non-light-emitting group III nitride semiconductor device or laminate according to the present disclosure, protrusions (even on the Si growth substrate 42) are used to improve film quality. 41) is being adopted. In addition, as previously pointed out, even if the protrusion 41 is employed, the first buffer layer ( 43), crystal defects, specifically threading dislocations (54,55), occur, and it is not easy to achieve this when high quality, that is, TDD (Threading Dislocation Density) of 10 ⁷ /cm2 or less is required. In order to solve this problem, the present disclosure employs protrusions 41 on the Si growth substrate 42 and forms a growth prevention film 44 on the first buffer layer 43 to prevent the growth of the first buffer layer 43. By blocking a portion of the threading dislocations 54 and 55 and forming a group III nitride semiconductor laminate including the second buffer layer 45, the channel layer 46, and the barrier layer 48 thereon, the film quality of these It should have a TDD (Threading Dislocation Density) of 10 ⁷ /㎠ or less. In cases where high heat dissipation specifications are required for the device, the growth substrate 42 may be changed from a Si growth substrate to a SiC growth substrate, and thus a growth substrate containing Si (Si growth substrate, SiC growth substrate) may be used as the growth substrate 42. substrate) may be used. The protrusion 41 may have various shapes shown in FIGS. 4 to 7, and in order to minimize the penetration dislocation 54 on the upper or upper surface 41a of the protrusion 41, it is preferable that the longitudinal cross-section has a sharp shape. do. Depending on the structure and shape of the protrusion 41, the material constituting the protrusion 41 may be the same material as the growth substrate 42 (e.g., Si, SiC) or a material different from the growth substrate 42 (e.g., AlN, AlNO , AlGaN, or GaN).

FIG. 9 is a diagram illustrating an example of an arrangement relationship between a protrusion and a growth prevention film according to the present disclosure, and is a view of the growth substrate 42 or the protrusion 41 provided on the bottom surface 42a of the growth substrate 42 as viewed from above. , Conical protrusions 41 with a circular cross section are arranged at regular intervals in the diagonal direction, and a growth prevention film 44 located on the protrusions 41 is indicated by 44a, and is located on the bottom surface 42a. The growth prevention film 44 is indicated by 44b. The penetration dislocation 54 is blocked by the growth prevention film 44a, and a portion of the penetration dislocation 55 is blocked by the growth prevention film 44b. The size of the growth prevention film 44a is preferably smaller than the cross-sectional size of the protrusion 41 on the bottom surface 42a, because if it is too large, the area in which the second buffer layer 45 will grow will be excessively reduced.

The protrusion 41 may have a height of 0.1 to 2 ㎛, a width of 0.2 to 3.0 ㎛, and a gap of 0.1 to 1.0 ㎛, and its longitudinal cross section may be cone, square pyramid, dome, or trun. It may have a shape such as a truncated cone/pyramid.

Before growing the first buffer layer 43, regardless of the presence or absence of protrusions 41 depending on the type (Si, SiC) of the growth substrate 42 (in the examples shown in FIGS. 10 and 11, the protrusions 41 are grown first). 12 and 13, the protrusions 41 are formed later) and a GaN, AlN, AlNO, or AlGaN seed layer (not shown; Seed Layer) having a thickness of about 20 nm is subjected to CVD (MOCVD, ALD, It can be formed using MBE) or PVD (Sputter, PLD) methods. In particular, when forming an AlN seed layer on the Si growth substrate 42 using the CVD method, TMAl gas, which is a source of aluminum (Al), is supplied alone without supplying ammonia (NH ₃ ) gas, which is a source of nitrogen (N). It is also desirable to introduce a pre-seeding process. In order to grow the first buffer layer 43 made of a group III nitride semiconductor on the Si growth substrate 42, Si atomic debonding (Atomic Debonding & Desorption), and in a high-temperature nitrogen atmosphere, fine amorphous material particles are generated on the Si surface due to Si-N bonding, making it difficult to obtain a high-quality group III nitride semiconductor thin film. In order to effectively suppress this, introducing an aluminum (Al) pre-seeding process from several seconds to tens of seconds on the surface of the Si growth substrate 42 is advantageous for growing a group III nitride semiconductor thin film. After forming a seed layer (not shown) on the Si growth substrate 42, in a subsequent process, the first buffer layer 43 is formed as a GaN monolayer, AlN monolayer, or multilayer thin film, with TMGa, TMAl and NH ₃ as source gases, Using hydrogen (H ₂ ) as a carrier gas, GaN to Ga-rich AlGaN is grown at relatively high pressure (e.g. 250 mbar) in the actual growth temperature range of 800 to 1100°C, while growing at relatively low pressure (e.g. It can be grown from AlN to Al-rich AlGaN at 50 mbar). In some cases, an AlGaN layer made by alloying GaN and AlN materials may be introduced as part of the first buffer layer 43. That is, the first buffer layer 43 may be made of GaN, GaN/AlGaN, AlN, AlN/AlGaN, AlN/AlGaN/GaN, or GaN/AlGaN/AlN, etc. on the growth substrate 42.

The thickness of the first buffer layer 43 must be higher than the height of the protrusion 41, and is at least equal to the height of the protrusion 41 in order to primarily shield and reduce penetration dislocations generated from the difference in lattice constant with the growth substrate 42. Alternatively, after thick growth, it is very important to make the growth rate in the side (horizontal direction) greater than the growth rate in the vertical direction to bend the penetration dislocations moving in the vertical direction parallel to the growth. The conditions for growing to the height of the protrusion 41 are preferably such that the growth rate in the vertical direction is greater than the growth rate in the lateral direction. Bowing may occur in the wafer state in which the first buffer layer 43 is grown on the growth substrate 42, which may interfere with accurate positioning of the growth prevention film 44. In cases where such bending is taken into consideration, the thickness of the first buffer layer 43 may be limited to less than 3㎛, and thus the height of the protrusion 41 may be limited to less than the thickness of the first buffer layer 43.

The growth prevention film 44 may be formed to a thickness of 1 nm to 1 μm, and its thickness is not particularly limited as long as it can suppress the growth of the second buffer layer 45. The shape and position of the growth prevention film 44 are in the shape of a strip mask using a dielectric such as SiO ₂ or SiN _x in the conventional ELOG or similar group III nitride growth process (e.g. Pendeo Epitaxy). Their positions are an area aligned with the center of the protrusion 41 where the growth prevention film 44a is located and an area aligned with the bottom surface of the growth substrate 42 between the protrusions 41 where the growth prevention film 44b is located. For example, the protrusion 41 has an isolation or island shape of various polygonal dimensions, such as circular, triangular, quadrangular, or hexagonal. The width and width of the growth prevention film 44a aligned with the protrusion 41 are first determined according to the shape and dimension of the protrusion 41, but are ultimately determined based on the location of the penetration dislocation formed during the growth of the first buffer layer 43 and It is desirable to set it considering distribution.

Like the first buffer layer 42, the second buffer layer 45 is a GaN single layer, AlN single layer, or multilayer thin film, and is grown at an actual growth temperature of 800 by using TMGa, TMAl, and NH ₃ as source gases and hydrogen (H ₂ ) as carrier gas. In the ~1100°C range, GaN to Ga-rich AlGaN can be grown at relatively high pressure (250 mbar), while AlN to Al-rich AlGaN can be grown at relatively low pressure (50 mbar). In some cases, an AlGaN layer made by alloying GaN and AlN materials may be introduced as part of the second buffer layer 45. That is, the second buffer layer 45 is composed of GaN, GaN/AlGaN, AlN, AlN/AlGaN, AlN/AlGaN/GaN, or GaN/AlGaN/AlN, etc. on the first buffer layer 43 and the growth prevention film 44. It can be. The thickness of the second buffer layer 45 is basically thicker than the thickness of the growth prevention film 44. Generally, the second buffer layer 45 can be grown to have a thickness of 1-5㎛. The penetration dislocations generated in the growth substrate 420 by the growth prevention film 44 are secondarily shielded and eliminated, and the penetration dislocations are significantly less in the region of the first buffer layer 43 where the growth prevention film 44 is not formed. is re-grown to form the second buffer layer 45 through ELOG or a similar growth process. It is possible to create a foundation for manufacturing a Group III nitride semiconductor laminate or a Group III nitride semiconductor device having a threading dislocation density (TDD) of 10 ⁷ /cm 2 or less, which is the goal of the present disclosure.

FIG. 10 is a diagram illustrating an example of a method of forming protrusions on a growth substrate according to the present disclosure. First, the growth substrate 42 is prepared, then the etch mask 60 is formed, and the growth substrate 42 itself is dry-processed. The protrusions 41 are formed through etching or wet etching. As an example, an etch mask 60 is formed on the (100), (110), or (111) surface of a Si growth substrate with SiO ₂ , _SiN Protrusions 41 can be formed by dimension.

FIG. 11 is a diagram illustrating another example of a method of forming protrusions on a growth substrate according to the present disclosure. In addition to the method shown in FIG. 10, a seed is formed to cover the entire surface of the growth substrate 42 provided with protrusions 41. Form a layer or seed layer (70; Seed Layer, AlN, AlNO, Al ₂ O ₃ , or Ga ₂ O ₃ ). The seed layer 70 may be formed by a PVD method and serves to assist the growth of the first buffer layer 43 grown by a CVD method (eg, MOCVD method).

FIG. 12 is a diagram showing another example of a method of forming protrusions on a growth substrate according to the present disclosure. Unlike the method shown in FIG. 11, the growth substrate 42 is prepared and then the protrusion base layer 71 is formed. Next, after forming the etch mask 60 on it, a portion of the protrusion base layer 71 is etched through etching to form the protrusion 41. Accordingly, the protrusions 41 are not made of a material constituting the growth substrate 42 but are made of a material constituting the protrusion base layer 71 formed on the growth substrate 42 . At this time, by etching the growth substrate 42 so that it is not exposed, the first buffer layer 43 is formed entirely on the protrusion base layer 71, which has the advantage of realizing high-quality film quality. The protruding base layer 71 may be composed of a seed layer 70 (see FIG. 11) and a group III nitride semiconductor layer (e.g., AlGaN and GaN) provided thereon, and the seed layer 70, as described above, It can be made of AlN, AlNO, Al ₂ O ₃ , or Ga ₂ O ₃ with a thickness of 200 nm or less by PVD or CVD method, and the group 3 nitride semiconductor layer is AlGaN or GaN with a thickness of 3 ㎛ or less by CVD method. It can be composed of sequential, multi-layered membranes, etc., and functions as a strain control layer. Etching of the protrusion base layer 71 to form the protrusions 41 may be performed until the seed layer 70 is exposed. As an example, 150 nm thick AlN (in some cases, a pre-seeding process with TMAl gas can be introduced) is deposited as a seed layer 70 on the top of the growth substrate 42 by CVD (MOCVD), and then a group III nitride semiconductor layer is formed. The film can be formed as a multi-layer consisting of two regions (first and second). The first layer may be composed of ₅₀₀ nm thick _Al It plays a mitigating role. The second layer may be composed of GaN with a thickness of 2 μm. Next, an etch mask 60 made of a material such as SiO ₂ or SiN _x is formed, and then the protrusions 41 are formed through dry etching.

FIG. 13 is a diagram showing another example of a method of forming protrusions on a growth substrate according to the present disclosure. Unlike the method shown in FIGS. 11 and 12, a seed layer 70 (see FIG. 11) is formed, but etching is performed. A method of forming without using a lift-off method is proposed. After preparing the growth substrate 42, a patterned photoresist film 80 (PR) is formed, and a protrusion base layer 71 (e.g., AlN layer, AlNO layer, Al ₂ having a thickness of 2㎛ or less) is formed through the PVD method. When the _photoresist film ₈₀ is removed, the protrusion base layer 71a formed on the photoresist film ₈₀ is also removed, leaving the remaining The protrusion base layer 71a is left on the growth substrate 42 in the form of protrusions 41, and here again the protrusion base layer 71 functions as a seed layer 70 (see FIG. 11) through the PVD method; e.g. An AlN layer, AlNO layer, Al ₂ O ₃ layer, or Ga ₂ O ₃ layer (represented by 71b) having a thickness of 1㎛ or less is formed so that the protrusion base layer 71b covers the entire growth substrate 42. , helps the growth of the first buffer layer 43. The thickness of the layers 71a and 71b constituting the protrusion base layer 71 is preferably set with design consideration in order to minimize wafer warpage due to stress of the growth substrate 42. For example, the thickness of the protrusion base layer 71a formed on the photoresist film 80 may be 500 nm, and the thickness of the protrusion base layer 71a may be 20 nm.

FIG. 14 is a diagram showing a specific example of the method of forming the protrusions shown in FIG. 12, in which a seed layer 70 (eg, AlN with a thickness of 200 nm or less) and a first layer 71c (eg, 500 nm thick) are placed on the growth substrate 42. _A protrusion base layer 71 made of _Al ) is presented. Here, the protrusion 41 is composed of only the second layer 71d (Case I), the first layer 71c - the second layer 71d (Case II), or the seed layer 70 - the first layer. (71c) - It may be composed of a second layer (71d) (Case III).

FIGS. 15 to 17 are diagrams illustrating another example of a method of forming a growth prevention film according to the present disclosure, and FIG. 15 shows a growth substrate 42 and a first buffer layer 43 grown thereon. . No protrusions 41 (see FIG. 8) are formed on the growth substrate 42, and the penetrating dislocation 55 penetrates the first buffer layer 43 over the entire sea surface 42a of the growth substrate 41. It is formed by FIG. 16 shows a growth substrate 42 on which protrusions 41 are formed and a first buffer layer 43 grown thereon. In the region A of the bottom surface 42a of the growth substrate 42 where the protrusions 41 are not formed, a through dislocation 55 is formed to penetrate the first buffer layer 43, as shown in FIG. 15. A threading dislocation 54 is also formed in the region B of the upper surface 41a of the protrusion 41 in a form that penetrates the first buffer layer 43. The penetration dislocation 54 occurs directly from the top or upper surface 41a or the first buffer layer 43 grown from the bottom surface 42a coalesces in the upper or upper surface 41a of the protrusion 41, that is, region B. Coalescence may occur, and by forming the upper or upper surface 41a of the protrusion 41 in a sharp shape, the penetration dislocation 54 occurring directly from the upper or upper surface 41a can be minimized. A curved threading dislocation 56 is formed in the region C between the regions A and B, and the threading dislocation 56 is a first buffer layer grown from the bottom surface 42a of the growth substrate 42. (43) is formed in a curved shape in the process of filling the space (concave portion) between the protrusions (41), and if the growth conditions are appropriately adjusted, most of them do not lead to the upper part of the first buffer layer (43). , it is not considered a crystal defect in the second buffer layer 45 (see FIG. 8) formed thereon. Meanwhile, a penetration dislocation may occur on the side of the protrusion 41 (i.e., the area of the protrusion 41 between the bottom surface 42a and the upper to upper surface 41a), as shown in FIGS. 5 to 7. This can be minimized by ensuring that the side surface of the protrusion 41 does not become a crystal plane (for example, in the case of the growth substrate 41 made of sapphire, the c plane is mainly used as the bottom surface 42a). That is, the side of the protrusion 41 has a circular cross-section, and the longitudinal cross-section is straight or curved upwardly, or roughening is applied to the side of the protrusion 41. It may hinder the growth of the first buffer layer 43. Therefore, when growing the first buffer layer 43 on the growth substrate 42 provided with the protrusions 41, the region C should be grown as a region with fewer crystal defects than the regions A and B. You can see that it is possible. Accordingly, the example shown in FIG. 17 is characterized in that the growth prevention film 44 is provided in the region A and region B, and the material constituting the growth substrate 42 is sapphire (Al) in addition to Si and SiC. ₂ O ₃ ), and can further be expanded to Sapphire, AlN, AlGaN, GaN, etc. having an HCP crystal structure, and the C-plane can be used as the growth surface, that is, the bottom surface 42a. The growth prevention film 44 located on the area (A; see Figure 16) blocks the penetration dislocation 55, and the growth prevention film 44 located on the area (B; see Figure 16) blocks the penetration dislocation 54. Since the threading dislocations 56 generated in the region (C; see FIG. 16) are bent and mostly do not penetrate the first buffer layer 43, the threading dislocations on the upper surface of the first buffer layer 43 are minimized, and thus the growth The penetration dislocations 57 and 58 in the second buffer layer 45 grown from the first buffer layer 43 exposed through the prevention film 44, that is, the corresponding first buffer layer 43 at zero C, are 10 ⁷ It can be minimized to have a TDD (Threading Dislocation Density) of /cm2 or less. The threading dislocation 57 is a threading dislocation that occurs from the exposed first buffer layer 43, and since the exposed first buffer layer 43 already has a film quality with minimized crystal defects and is grown therefrom, the number of crystal defects is greatly reduced. do. The penetration dislocation 58 is a crystal defect formed when the second buffer layer 45 grown from the exposed first buffer layer 43 coalesces on the growth prevention film 44, and is blocked by the growth prevention film 44. It has a greatly reduced number compared to the penetration dislocation (55). The protrusions 41 may have a micro scale with a width and height of 1 ㎛ or more (e.g., width - 2.5 ㎛, height - 1.6 ㎛, spacing between protrusions - 0.4 ㎛), and a nano scale with a width and height of less than 1 ㎛ (e.g. : Width-500nm, height-500nm, spacing between protrusions-50nm). The arrangement of the protrusions 41 may be in a stripe shape or a dot shape. In the case of a dot shape, six protrusions 41 may be arranged around one protrusion 41 at the vertices of a hexagon. (From the perspective of an array of dots of the protrusions 41, the protrusions 41 belonging to neighboring rows are not aligned with each other, but are arranged in a zigzag shape), and the first buffer layer 43 can be grown. It is desirable that the bottom surface 42a where growth occurs is minimized.

As described above, the growth prevention film 44 is formed of a dielectric (thickness: 1 to 1000 nm) such as SiO ₂ or SiN _x to suppress the second buffer layer 45 on the growth prevention film 44, or to suppress the second buffer layer 45 ) is made of a material capable of growing, but the second buffer layer 45 is made of a material with a slower growth rate (e.g. AlN, AlNO, AlO) than the material constituting the upper part of the first buffer layer 43 (e.g. GaN). (This is formed by depositing AlN, AlNO, or AlO to a predetermined thickness (e.g., 1 to 100 nm) with a PVD (Sputter, ALD, PLD) device and then patterning), forming a second layer on the growth prevention film 44. It can be configured to delay the growth of the buffer layer 45. When the second buffer layer 45 uses a growth prevention film 44 made of a material with a slow growth rate (e.g., AlN, AlNO, AlO), the exposed material is exposed as in the case of using the growth prevention film 44 made of a dielectric. 1 The second buffer layer 45 grown from the buffer layer 44 is developed on the growth prevention film 44, but since the second buffer layer 45 is also grown on the growth prevention film 44 (the growth prevention film 44 is the second buffer layer 45), Functions as a seed layer of the buffer layer 45), a mechanism for generating a penetration dislocation generated during the coalescence of the second buffer layer 45 on the dielectric (SiO ₂ , SiN _x ) growth prevention film 44 It shows a different behavior than .

FIG. 18 is a diagram illustrating another example of a method of forming a growth prevention film according to the present disclosure. Unlike the previous examples, the growth prevention film 44 is formed by the first buffer layer 43 itself. The growth prevention film 44 is formed in the form of a protrusion 44c in the same concept as the protrusion 41 formed on the growth substrate 42, and can be formed through a photolithography process and an etching process (plasma). The principle of reducing crystal defects in the second buffer layer 45 is the same as the previous examples. The threading dislocation 57 is a threading dislocation that exists in the second buffer layer 45 above the first buffer layer 43 where the protrusion 44c is not formed, and the threading dislocation 57 is a threading dislocation that exists in the second buffer layer 45 in this region (region C; see FIG. 16). Since the penetration dislocation 54 of 43) is bent and does not reach the upper part of the first buffer layer 43, the second buffer layer 45 in this area is grown from the first buffer layer 43 with good film quality to reduce penetration. It has a dislocation 57. The penetrating dislocation 58 is a penetrating dislocation that occurs on the upper to upper surface 44d of the protrusion 44c located at a position corresponding to the protrusion 41, and the penetrating dislocation 59 is a penetrating dislocation on the bottom surface. It is a penetration dislocation that occurs on the upper or upper surface 44d of the protrusion 44c located at a position corresponding to (42a), and the penetration dislocation 55 present in the first buffer layer 43 continues to the protrusion 44c. , the top to the upper surface 44d of the protrusion 44c is a flat surface with a narrow width or is sharp, so it is difficult for the penetration dislocation 55 to exist even in the second buffer layer 45. Some of the penetration dislocations 58 and 59 penetrate through. The second buffer layer 45, which is generated by the dislocation 54 and the through dislocation 55 and is partially grown on the first buffer layer 43 in which the protrusion 44c is not formed, is formed on the upper or upper surface of the protrusion 44c ( Coalescence occurs in 44d). Compared to the example shown in Figure 17, protrusions 44c are formed by a relatively easy process (photolithography and etching (plasma)) on a GaN or AlGaN single crystal (Epitaxy) with an HCP crystal structure. ) and growing a second buffer layer with the same material (GaN or AlGaN), so it has the advantage of minimizing threading dislocations and other crystal defects. Protrusions (44c) ) may have the same or similar dimensions as the protrusions 44a provided on the growth substrate 42, and are nanoscale (e.g., width-500nm high) with a width and height of less than 1㎛ rather than microscale with a width and height of 1㎛ or more. -500nm, spacing between protrusions -50nm) is desirable.

FIG. 19 is a diagram illustrating another example of a method of forming a growth prevention film according to the present disclosure. Unlike the example shown in FIG. 18, the protrusion 44c forming the growth prevention film 44 is located at the bottom of the growth substrate 42. It is formed in the first buffer layer 43 at a position corresponding to the surface 42a, that is, a position corresponding to the area A. The through dislocation 55 existing in the area A is connected to the protrusion 44c, but since the upper or upper surface 44d of the protrusion 44c is narrow or sharp, it disappears or only a portion of it is transferred to the second buffer layer 45. Subsequently, a through dislocation 59 is formed. Some of the threading dislocations 54 existing in the region B lead to the second buffer layer 45 to form a threading dislocation 58a, or in the process of the second buffer layer 45 filling the space between the protrusions 44c. It becomes a curved penetration dislocation 58b and disappears within the second buffer layer 45. Since there are not many threading dislocations in the region C, the occurrence of crystal defects in the second buffer layer 45 growing from the region C is minimized.

FIG. 20 is a diagram illustrating another example of a method of forming a growth prevention film according to the present disclosure. Unlike the example shown in FIG. 18, the protrusion 44c forming the growth prevention film 44 is located at the upper portion of the protrusion 41. It is formed in the first buffer layer 43 at a position corresponding to the upper surface 41a, that is, a position corresponding to area B. Some of the threading dislocations 55 existing in the area A are connected to the second buffer layer 45 and exist as threading dislocations 59b, but some of the threading dislocations 55 exist in the second buffer layer 45 in the space between the protrusions 44c. During the filling process, the through dislocation 59b becomes bent and disappears within the second buffer layer 45. The through dislocation 54 existing in the region B is connected to the protrusion 44c, but since the upper or upper surface 44d of the protrusion 44c is narrow or sharp, it disappears or only a portion of it is transferred to the second buffer layer 45. This continues to form a through dislocation 58a. Since there are not many threading dislocations in the region C, the occurrence of crystal defects in the second buffer layer 45 growing from the region C is minimized.

FIGS. 21 to 23 are diagrams showing another example of a method of forming a growth prevention film according to the present disclosure. In FIG. 21, in addition to the configuration shown in FIG. 18, AlN on the first buffer layer 43 on which the protrusions 44c are formed. , AlNO, or AlO is formed as a material layer 45a. The material layer 45a is made of the same material as the growth prevention film 44 shown in FIG. 17 and can be formed to a thickness of 1 to 100 nm using the same method (deposited using a PVD (Sputter, ALD, PLD) device). In FIG. 22, the material layer 45a is formed only in the area A, and in FIG. 23, the material layer 45a is formed to cover at least part of the protrusion 44c. The material layer 45a shown in FIGS. 21 to 23 can likewise be applied to the configuration shown in FIG. 19 and the configuration shown in FIG. 20. By introducing the material layer 45a, the penetration dislocation generated in the growth substrate 42 and exposed to the surface of the first buffer layer 43 is blocked and reduced, while the first buffer layer 43 grown in the two regions (A, B; see FIG. 16) is reduced. 2 The buffer layer 45 has a small difference in lattice constant with the material layer 45a made of AlN, AlNO, or AlO, thereby suppressing the generation of threading dislocations and minimizing the overall number of threading dislocations. Of course, a material layer 45a can be introduced in the example shown in FIG. 17. The material layer 45a may also function to repair damage that may occur in the first buffer layer 43 exposed in the process of forming the growth prevention film 44 and the protrusion 44c.

Considering all of the examples shown in FIGS. 17 to 23, the growth prevention film 44 may be referred to as a growth inhibition film 44 in that it prevents or slows the growth of the second buffer layer 45.

FIGS. 24 and 25 are diagrams showing another example of a group III nitride semiconductor laminate or device according to the present disclosure, in which the protrusion 41 of the form shown in FIG. 14 and the material layer 45a shown in FIG. 21 are combined. An example of the form is given. In terms of the example shown in FIG. 14, protrusions 41 (see FIGS. 16 to 23) made of a material (Al ₂ O ₃ ) forming the growth substrate 42 (e.g., a sapphire substrate) are formed on the growth substrate 42 (e.g., a sapphire substrate). Rather, the protruding bay layer 71 is formed through film formation, and then the protrusions 41 are formed by patterning the protrusion, and then the material layer 45a shown in FIG. 21 is formed on it, and at this time, the growth prevention film or growth prevention film is formed. The suppression layer 44 may be omitted, and in this case, the protrusion base layer 71 corresponds to the first buffer layer 43. In view of the example shown in FIG. 21, the protrusions 41 provided on the growth substrate 42 are omitted, the first buffer layer 43 is formed, and then the protrusions are formed as the growth inhibition layer 44 on the first buffer layer 43. (44c) is formed, and a material layer (45a) is formed thereon. A second buffer layer 45 and a non-light-emitting group III nitride semiconductor laminate or device (A) are stacked thereon. Of course, the material layer 45a can be partially formed in the form shown in FIGS. 22 and 23, and when the material layer 45a is formed in the form shown in FIG. 23, the material layer ( 45a) is not an Al-containing material such as AlN, AlNO, or AlO, which slows down the growth rate of the second buffer layer 45, but is SiO ₂ , SiN _x , which is a material that prevents the growth of the second buffer layer 45 on the protrusion 41 Of course, it can be composed of a dielectric material such as . By using this structure, threading dislocations can be reduced, as described in connection with FIGS. 21 to 23, while, as shown in FIG. 25, support on the non-luminescent Group III nitride semiconductor laminate side of the device (A) After providing a substrate or temporary substrate (S), when removing the growth substrate 42 through a process such as LLO (Laser Lift-Off), protrusions 41 made of the same material as the growth substrate 42 are provided. Compared to the single case, there is an advantage that the growth substrate 42 can be easily separated from the non-light-emitting group III nitride semiconductor stack or device (A) side. When manufacturing a non-light emitting device with vertical current flow using a group III nitride semiconductor, optical, thermal and mechanical damage is caused by irradiating a short wavelength & higher optical flux laser beam to the sapphire growth substrate 42. It is important to improve the performance (particularly breakdown voltage) and reliability of non-light-emitting devices (e.g. transistors or diodes) with vertical current flow through a process of separation and removal without damage (LLO process) and a subsequent wafer bonding process. It is required, in the case where the sapphire growth substrate 42 has protrusions 41 made of a material (Al ₂ O ₃ ) constituting the growth substrate 42, after forming the non-luminescent group III nitride semiconductor laminate (A). In the LLO process, when a short-wavelength, high-density laser beam is irradiated and separated from the backplane of the sapphire growth substrate 42, a large amount of scattering of the laser beam occurs at the boundary where the protrusions 41 are formed, resulting in the separation of the laser beam from the sapphire growth substrate 42. At the same time, it is difficult to separate the luminescent group III nitride semiconductor stack (A) due to a lack of light energy, and at the same time, the scattered laser beam reaches the non-luminescent group 3 nitride semiconductor stack (A), causing an unexpected side effect. ) becomes crazy. Therefore, in order to separate the non-light-emitting group III nitride semiconductor laminate (A) from the sapphire growth substrate 42 and then fabricate a high-quality group III nitride semiconductor non-light-emitting device with vertical current flow, the protrusion 41 is first formed. By forming it on the upper part of the buffer layer 43, it is possible to suppress crystal defects including threading dislocations and minimize damage in the subsequent device manufacturing process. The protrusion base layer 71 to the first buffer layer 43 may be formed with the same composition and growth conditions as in the previous examples, and after forming the seed layer, suppressing crystalline defects including threading dislocations and stress strain. To control , a material layer (GaN, AlN, AlGaN, SiNx) or a multilayer structure (Superlattice) made of these may be introduced.

FIGS. 28 to 37 are diagrams showing another example of a method of manufacturing a Group III nitride semiconductor stack or device according to the present disclosure, in which the Group III nitride semiconductor stack or device is fabricated in a vertical direction as shown in FIGS. 26 and 27. A vertical junction field effect transistor structure is exemplified.

First, as shown in FIG. 28, a buffer layer 82 is formed on the growth substrate 81. Of course, the method described in FIGS. 8 to 25 can be applied to the formation of the buffer layer 82. Compared to the devices shown in Figures 26 and 27, there is a difference in that a heterogeneous substrate (eg, Si substrate, Al ₂ O ₃ substrate) is used, rather than a GaN growth substrate. The buffer layer 82 is preferably made of undoped GaN (uGaN) with a TDD of low 10 ⁷ /cm2 or less. Since the thickness of the buffer layer 82 is aimed at minimizing crystal defects (penetration dislocations, vacancy, interstitial, substitutional), there is no limit as long as it is the thickness necessary to achieve this. The method and thickness described in FIGS. 8 to 25 are preferentially applied.

Next, as shown in FIG. 29, a drain region 83 and a drift region 84 are formed. The drain region 83 is a region in contact with the drain electrode, and may be made of, for example, n ⁺ GaN with N _D (effective electron carrier density) of low 10 ¹⁸ /cm3 or more, n ⁺ (Al)GaN, n ^{+ + It can also be made of (} Al)GaN, Superlattice (AlGaN/GaN, AlInN/GaN, GaInN/GaN), etc. The thickness of the drain region 83 is important in terms of the thickness and doping concentration required to form the ohmic contact electrode, and for example, a thickness of 1 nm to 100 nm may be applied.

The drift region 84 generally has a lower effective electron carrier density than the N _D of the drain region 83, and can increase as its thickness increases, for example, N _D of low 10 ¹⁶ /cm3 or less, Preferably, it may be made of n ^- GaN having N _D in the range of 2x10 ¹⁴ /cm3 to 2x0 ¹⁶ /cm3. The thickness can range from 3㎛ to 20㎛, and the thicker it is, the lower the crystal defects, and the critical voltage at which the device is destroyed by improving crystallinity and distributing and relieving externally applied electrical stress, that is, breakdown voltage. It is known to be able to dramatically improve (Breakdown/Blocking Voltage).

Next, as shown in FIG. 30, an etch mask 91 (e.g., PR, metal, and/or oxide (e.g., SiO ₂ , etc.)) is formed over the drift region 84, and etched (e.g., dry etching and / or wet etching) to remove a portion of the drift area 84 to form a channel 85. The remaining etch mask 91 is removed. The height of the channel 85, which is a passage for the movement of electron carriers with charge (electrical mass), ranges from 100 nm to 1000 nm, preferably around 500 nm, and the cross-sectional width is usually 10 nm or less. The preferred shape is rectangular, but square and circular shapes are also possible.

Next, as shown in FIG. 31, the gate region 86 is formed through regrowth. In order to form the source electrode, the gate area 86 on the upper side of the channel 85 is removed to expose the drift area 84 forming the channel 85. For example, the gate region 86 may be made of p GaN, p ⁺ (Al, In) GaN, p ⁺⁺ (Al, In) GaN, etc. The conductivity of the gate region 86 and the drift region 84 may change, but this is not common when using heterogeneous substrates. Here, n ^- is N _D ≤ 2x0 ¹⁶ /cm, n,p is 2x0 ¹⁶ /cm ≤ N _D ,N _A ≤ 2x0 ¹⁸ /cm, n ⁺ ,p ⁺ is 2x0 ¹⁸ /cm ≤ N _D ,N _A ≤ 2x0 ¹⁹ /㎤, n ⁺⁺ ,p ⁺⁺ is defined as 2x0 ¹⁹ /㎤ ≤ N _D ,N _A. Typically, the planarization process to alleviate thin film steps involves coating and curing a liquid photoresist (PR) material and then using a dry etch process to form a protruding gate area (86) along with the coated PR material. ) portions are sequentially etched until the drift area 84 of the channel 85 is exposed.

Next, as shown in FIG. 32, the source electrode 87 and the gate electrode 88 are formed. The source electrode 87 is formed to make ohmic contact with the drain region 84, and the gate electrode 88 is formed to make ohmic or Schottky contact with the gate region 86. The source electrode 87 may be formed of at least two layers of Cr, Ti, Al, V, W, Re, TiN, CrN, Ni, Pt, and Au materials, for example, Cr/W/Pt/Au or It may consist of 4 or 5 layers, such as Ti/Cr/W/Pt/Au. The gate electrode 88 may be formed of at least two layers of Pd, Ni, Pt, Ru, Rh, Cr, Ti, TiN, NiO, RuO ₂ , and Au materials, for example, Pd/Ni/Pt/ It consists of 4 or 5 layers, such as Au or Cr/Ni/Pt/W/Au.

Next, as shown in FIG. 33, a passivation layer 89 serving as a protective film is formed to cover the entire upper surface of the device where the source electrode 87 and the gate electrode 88 are located, and then the temporary substrate 92 ) is attached using the bonding layer (93). Preferably, a sacrificial layer 94 is provided between the temporary substrate 92 and the bonding layer 93 to later separate the temporary substrate 92. The bonding layer 93 may be provided on both sides or one side. The temporary substrate 92 is preferably made of the same material as the growth substrate 81. For example, when the growth substrate 81 is a sapphire substrate, the temporary substrate 92 may also be made of sapphire. Details of this technology are presented in International Patent Publication Nos. WO2020/175971 and WO2021/112648.

Next, as shown in FIG. 34, the growth substrate 81 is removed (e.g., after the LLO process, the buffer layer 82 is removed along with the residue generated during the removal process of the growth substrate 81 (e.g. : dry etching and/or wet etching) to expose the drain region 83.

Next, as shown in FIG. 35, the growth substrate 81 and the buffer layer 82 are removed to form a drain electrode 95 to make ohmic contact with the exposed drain region 83. In the exposed drain area 83, a surface texture can be formed in the process of removing the buffer layer 82 to expand the bonding area with the drain electrode 95, and active gas plasma treatment can be performed. It is also possible to do so. Drain electrode 95 is formed over the entire exposed drain region 83. The drain electrode 95 may be formed of the same or similar material as the source electrode 87, and may be made of at least two layers of Cr, Ti, Al, V, W, Re, TiN, CrN, Ni, Pt, and Au materials. It can be formed and composed of four or five layers, for example, Cr/W/Pt/Au or Ti/Cr/W/Pt/Au.

Next, as shown in FIG. 36, the support substrate 97 is attached to the drain electrode 95 through the bonding layer 96. The bonding layer 96 may be provided on both sides or one side. The support substrate 97 may be made of composite such as ceramic materials (e.g. Sapphire, AlN, Si), CMC (Cu/Mo/Cu, Cu/MoCu/Cu), and CIC (Cu/Invar/Cu). A material having a difference in coefficient of thermal expansion between the temporary substrate 92 and that of the temporary substrate 92 of less than ±5ppm is preferred. For example, if the temporary substrate 92 is a sapphire substrate, it may be made of sapphire. However, when the support substrate 97 is an insulating material, a vertical JFET cannot be implemented, so it is necessary to provide thermal and electrical paths in the support substrate 97, which will be described later. In addition to forming the support substrate 97 using a wafer bonding method, it is possible to form a thick film of a highly heat-dissipating electrically conductive metallic material (eg, Cu, MoCu) using a high-speed PVD deposition machine, or to use plating. Next, a laser is irradiated to the sacrificial layer 94 to separate the temporary substrate 92, and the bonding layer 93 is removed to expose the passivation layer 89.

Next, as shown in FIG. 37, an opening 98 is formed in the passivation layer 89, and a source electrode 99S for bonding and a gate electrode 99G for bonding are formed through deposition. If necessary, a drain electrode 99D for bonding is formed on the support substrate 97 through vapor deposition. Prior to the process of forming the bonding electrode 99D on the support substrate 97, a process of reducing the thickness of the support substrate 97 through a method such as polishing may be added, and through these processes, according to the present disclosure. As an example of a non-luminescent group III nitride stack or device, a vertically structured JFET can be completed.

FIGS. 38 to 40 are diagrams illustrating an example of a support substrate used in the laminate shown in FIG. 37. As shown in FIG. 38, the support substrate 97 (e.g., sapphire, AlN, Si substrate) is A plurality of trenches or vias 97T are provided on the upper surface, and the trenches or vias 97T are filled with a conductive material 97C. The conductive material 97C serves as a thermal and electrical path when the support substrate 97 is made of an insulating material, and can serve as an improved thermal and/or electrical path even when the support substrate 97 is made of a conductive material. The bonding layer or upper support substrate layer 96 may be formed separately or as part of the process of forming the conductive material 97C. Various methods (plating, wire bonding, press fitting, insert, etc.) of forming a trench or via (97T) and filling it with a conductive material (97C) are presented in International Patent Publication Nos. WO2020/262957 and WO2018/106070. FIG. 39 shows a state in which the support substrate 97 is polished and the conductive material 97C is exposed through the rear surface, as shown in FIG. 37 . Through this, the conductive material 97C can serve as a thermal and electrical path in the support substrate 97. FIG. 40 shows a state in which a drain electrode 99D for bonding is formed on the exposed conductive material 97C as shown in FIG. 37.

FIGS. 42 to 46 are diagrams showing an example of a method of manufacturing the non-light-emitting group III nitride semiconductor laminate or device shown in FIG. 41. First, as shown in FIG. 42, a growth substrate 42 (e.g., sapphire) is formed. substrate, Si substrate), a seed layer (423; e.g., AlN), a buffer layer 435, a channel layer (46; e.g., GaN with a thickness of 2 μm), and a barrier layer (49; e.g., AlGaN within 20 nm) in order. It is formed by As shown in FIG. 8, of course, the interlayer 48 and the cap layer 50 may be provided, and as shown in FIG. 41, the group III nitride layer 26 (e.g., p-type GaN within 20 nm) ) can of course be provided. Here, HEMT is exemplified, but of course it can be extended to non-luminescent group III nitride devices. Preferably, the buffer layer 435 can be formed by applying the method described in FIGS. 8 to 25. Next, the barrier layer 49 and the channel layer 46 are mesa-etched to expose the buffer layer 435, and then the source electrode 51 and the drain electrode 53 are formed on the upper surface of the barrier layer 49. form Here, the source electrode 51 and the drain electrode 53 can also be formed directly on the upper surface of the buffer layer 435 or the channel layer 46 exposed to air (not shown).

Next, as shown in FIG. 43, a gate electrode 52 is formed, and an insulating layer or passivation layer 61 that functions as a protective film is formed to cover the entire upper surface of the device. If necessary, steps such as forming necessary openings in the passivation layer 61 to form the field plate 51F are performed. In FIG. 42, a field plate 51F is formed on the source electrode 51, but as shown in FIG. 41, the gate electrode 52 may also be provided with a field plate 26, and the drain electrode 53 Of course, it can also be provided. Of course, the order of forming the electrodes 51, 52, and 53 can be changed.

Next, as shown in FIG. 44, the temporary substrate 92 with the sacrificial layer 94 is attached to the group III nitride semiconductor laminate through the adhesive layer 93, similar to that described in FIG. 33. At this time, the passivation layer 61 functions the same as the passivation layer 89 in FIG. 33. Organic adhesives such as SOG, BCB, and _FO In this case, a material containing metal (Sn, In, Zn, Au, Ag, Cu, Pd, Ni) is preferred as the adhesive layer 93. In this case, the gate electrode 52 and/or the field plate 51F The forming process is performed after bonding the support substrates 97 and 97a.

Next, as shown in FIG. 45, the growth substrate 42 is removed (e.g., LLO process for a sapphire substrate, CLO process for a Si substrate), similar to that shown in FIG. 34, and the growth substrate ( A portion of the buffer layer 435 is removed (e.g., dry etching and/or wet etching) along with residues generated during the removal process of 42) to expose the buffer layer 435 (e.g., undoped GaN (uGaN)). Preferably, dry etching is performed until a portion of the N-polar uGaN surface is exposed, and a rough surface or surface texture 435a is formed through surface texturing to strengthen adhesion. It is also possible to perform active gas plasma treatment. Next, in order to prevent insulation breakdown and enhance heat dissipation, a multilayer thin film 62 composed of an electrically insulating ceramic layer and a metal layer is formed. The multilayer thin film 62 consists of at least one (ceramic/metal) pair in the buffer layer 435, and can function to buffer stress by repeatedly forming n pairs. The electrically insulating ceramic layer may be made of, for example, AlN _, BN, Diamond, _SiN , CuW, etc. Specifically, it may be made of N-polar GaN (buffer layer)/AlN/Pt, N-polar GaN (buffer layer)/AlN/TiW, N-polar GaN (buffer layer)/SiNx/Pt, etc. Next, the support substrates 97 and 97a are attached to the multilayer thin film 62 through the bonding layer 96, as in FIG. 36. The bonding layer 96 may be provided on both sides or one side. The support substrates 97,97a may be made of ceramic materials (e.g. Sapphire, AlN, Si), CMC (Cu/Mo/Cu, Cu/MoCu/Cu), Cu/MoCu/Cu, CIC (Cu/Invar/Cu), etc. It may be made of a composite, etc., and a material having a difference in thermal expansion coefficient of less than ±5 ppm with the temporary substrate 92 is preferable. For example, if the temporary substrate 92 is a sapphire substrate, it may be made of sapphire. In addition to forming the support substrate 97 using a wafer bonding method, forming a thick film of a highly heat-dissipating electrically conductive metallic material (e.g., Cu, MoCu) using a high-speed PVD deposition machine, or forming the support substrate 97a using plating. It is also possible to form

Next, as shown in FIG. 46, the temporary substrate 92 is removed (e.g., LLO process in the case of a sapphire substrate, CLO process in the case of a Si substrate), similar to that shown in FIG. 36. Next, the adhesive layer 93 is removed to complete the device. When the support substrate 97 is made of an insulating substrate (e.g., sapphire substrate, AlN substrate, Si substrate), a support substrate 97 with a thermal passage is used, as shown in FIGS. 37 to 40, and the thickness is reduced through polishing, and then a bonding pad 63 is formed thereto to complete the device.

FIG. 47 is a diagram showing another example of a method of manufacturing a non-light-emitting group III nitride semiconductor stack or device according to the present disclosure. Unlike the stack or device shown in FIG. 46, the growth substrate 42 is not completely removed. The difference is that it has a form in which some parts are left behind. After going through the process shown in Figure 43, the temporary substrate 92 is attached using the bonding layer 93, and then the growth substrate 42 is not completely removed, but is removed using an appropriate method (e.g., mechanical polishing, ultra-precision CMP). ) to reduce the thickness of the growth substrate 42. Since the heat dissipation characteristics of sapphire or Si, which are the materials that make up the growth substrate 42, are not good, the thickness of the growth substrate 42 is reduced to the minimum thickness (e.g., around 10 μm) required for the subsequent process. Next, as shown in FIG. 45, the support substrate 97 is attached to the growth substrate 42 of reduced thickness using the bonding layer 96. Preferably, the support substrate 97 can be made by the method shown in FIGS. 38 to 40. Next, as shown in FIG. 46, the thickness of the support substrate 97 is reduced through polishing to expose the conductive material 97C (see FIG. 38) to the lower surface of the support substrate 97 to effectively function as a thermal passage. . Next, the temporary substrate 92 is removed. Of course, if necessary, a sacrificial layer 94 can be provided as in Figure 46. Depending on the process, it is also possible to first remove the temporary substrate 92 as shown in FIG. 46.

FIG. 48 is a diagram showing another example of a method of manufacturing a non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure. Unlike the laminate or device shown in FIG. 47, the support substrate 97 is made of a ceramic material ( Example: Wafer bonding is made of laminated composites such as Sapphire, AlN, Si, Diamond), CMC (Cu/Mo/Cu, Cu/MoCu/Cu), Cu/MoCu/Cu, and CIC (Cu/Invar/Cu). There is a difference in that point. Preferably, a material having a difference in thermal expansion coefficient from the temporary substrate 92 of less than ±5 ppm is used.

FIG. 49 is a diagram showing another example of a method of manufacturing a non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure. Unlike the laminate or device shown in FIGS. 47 and 48, the support substrate 97a is The difference is that it is formed as a thick film using a high-heat dissipation electrically conductive metallic material (e.g. Cu, MoCu) using a high-speed PVD deposition machine, or it is formed as a thick film using plating (e.g. Cu).

FIG. 50 is a diagram illustrating another example of a method for manufacturing a non-light-emitting Group III nitride semiconductor laminate or device according to the present disclosure. Unlike the laminate or device shown in FIGS. 47 to 49, a growth substrate of reduced thickness is used. The difference is that a trench or via 42T is formed at 42 (e.g., laser drilling), and a support substrate 97b is formed thereon. The trench or via (42T) is filled with a conductive material (97C). As described above, the process of filling the trench or via (42T) with the conductive material (97C) involves methods such as plating, wire bonding, press fitting, and insert (e.g., copper plating, copper deposition, wire bonding & stitching, Au stud bonding & Corning), and is presented in detail in International Patent Publication Nos. WO2020/262957 and WO2018/106070. In the example shown in Figure 50, the support substrate 97b can be formed continuously or discontinuously, and in the case of discontinuous formation (e.g., in the case of wire bonding & stitching, Au stud bonding & coining), additional plating or deposition is required. It is possible to form a continuous support substrate 97b.

Figure 51 is a diagram showing another example of a method of manufacturing a non-light-emitting group III nitride semiconductor stack or device according to the present disclosure. Unlike the stack or device shown in Figure 50, the trench or via (42T) is a nitride layer. The difference is that it extends to the phosphor buffer layer 423. These trenches or vias 42T can be formed by reducing the thickness of the growth substrate 42 to about 20-30㎛ and then dry etching. Of course, the buffer layer 423 can be formed so that it is not exposed. The conductive material 97C, that is, the thermal path continues through the growth substrate 42 to the buffer layer 423, which is a nitride layer, has the advantage of improving thermal characteristics. However, when the trench or via (42T) is formed deeply, it is not easy to form the conductive material (97C) through plating or deposition, and wire bonding & stitching and Au stud bonding & coining are useful to solve this problem. can be used Of course, one of the methods shown in FIGS. 47 to 49 can be added to the configuration shown in FIGS. 50 and 51. As shown in FIG. 46, there is an advantage of improving heat dissipation performance when the growth substrate 42 is completely removed, but during the process of removing the growth substrate 42 and forming a high heat dissipation support substrate, heat dissipation may occur due to thermo-mechanical shock or material diffusion. As this may have a negative impact on the long-term reliability of the device, by using a growth substrate 42 whose thickness is reduced to around 10㎛, the long-term reliability of the device can be guaranteed without significantly damaging radiation heat. Meanwhile, the long-term reliability of the device is further ensured by using a growth substrate 42 whose thickness is reduced to around 20 to 30㎛, and a thermal passage is formed through the conductive material 97C by forming a trench or via 42T. It is also possible to improve heat dissipation performance.

Figures 52 and 53 are diagrams showing another example of a method for manufacturing a group III nitride semiconductor laminate or device according to the present disclosure, which shows a vertical structure junction field effect transistor (Vertical) as shown in Figures 26 and 27. It illustrates a method of manufacturing a Junction Field Effect Transistor, and is overall the same as the method shown in FIGS. 28 to 37, but there is a difference in the process from the method shown in FIG. 30 to the form shown in FIG. 32.

As shown in FIGS. 30 and 31, a portion of the drift region 84 must be removed to form the channel 85, and the gate region 86 must be formed through regrowth. In this case, the gate region 86 must be formed through regrowth. (86; e.g., p-type GaN) has a bottom surface (G; see Figure 52) that is the c-face of the drift region (84; e.g., n-type GaN) and the m-face or a-face. It is formed on two contact surfaces called the side (H; corresponding to the surface where the drift area 84 is exposed through etching) of the (a-face) channel 85, and these two contact surfaces generate leakage current ( This is the area where Leakage Current occurs.

To prevent this, first, as shown in FIG. 52, a buffer layer 82, a drain region 83, a drift region 84, and a channel 85 are formed on the growth substrate 81 through the process shown in FIG. 30. Next, rather than immediately regrowing the gate region 86, an interlayer (84T) is introduced. As described above, the gate region 86 may be made of p GaN, p ⁺ (Al, In) GaN, p ⁺⁺ (Al, In) GaN, etc. The intervening layer 84T may be formed of undoped (Al,In)GaN or n-type (Al,In)GaN by the same method as the drift region 84 (e.g., MOCVD), or may be formed of AlN, or may be formed by sputtering. It can be formed from AlN and AlNO using . In addition, it can be formed as a multilayer consisting of two or more layers, such as (Al _a , In _b )Ga _c N/(Al _x ,In _y )Ga _z N, or as a well-known superlattice structure. Of course, n-type dopants (Si, Ge) can be injected into multilayer and superstructure structures. The structure that introduces the intervening layer (84T) between the drift region (84) and the gate region (86) is designed similarly to the n ^- /i/p ⁺⁺ diode structure, and the bottom surface (G) is the contact surface. It performs a rectifying function by acting as a depletion layer in the vertical or horizontal direction on the and side surfaces (H), respectively. Therefore, the thickness of the intervening layer 84T, which has the same role as "i", is not limited as long as it can enhance the rectifying function. 50 nm or less is preferable, and by introducing an intervening layer (84T) with this function, leakage current can be reduced. After partially removing the drift region 84, which is an n - semiconductor, through an etching process ^, the gate region 86, which is a p ⁺⁺ semiconductor, is regrown to complete the rectification function through an n ^- /p ⁺⁺ diode structure. Ideally, if part of the drift region 84, which is an n ^- semiconductor, is etched and the gate region 86, which is a p ⁺⁺ semiconductor, is continuously re-grown, the drift region 84 will have surface damage resulting in leakage current. The likelihood of this occurring increases. To improve this, it is desirable to introduce an intervening layer 84T. Although the intervening layer 84T is shown not covering the top of the channel 85, it goes without saying that the intervening layer 84T can also be formed on the top of the channel 85.

Next, a gate region 86 is formed as shown in FIG. 31. Of course, the gate area 86 can be formed to cover the upper part of the channel 85.

Next, as shown in FIG. 53, a planarization operation is performed to alleviate the level difference between the channel 85 and the gate region 86, similar to that shown in FIG. 31. At this time, the upper portion 85A of the channel 85 may be left with the side surface exposed by removing the intervening layer 84T. When the upper part (85A) is left, the thickness of the drift area (84) increases, so it is expected that the breakdown voltage can be strengthened due to the dispersion of the electric field, while energy consumption ( Energy Loss) may increase, so it must be designed taking these factors into consideration.

Next, the source electrode 87 and the gate electrode 88 are formed as shown in FIG. 32.

Returning again to FIGS. 8 to 23, in the process of forming the growth prevention film 44, it is not easy to align the growth prevention film 44 on the top of the protrusion 41 (an example of alignment is shown in FIG. 9). It's not just that. In particular, in order to align the upper part of the protrusion 41, an aligned pattern process is usually performed using a photolithography process. However, this process is complicated, so the defect reduction effect is reduced and the process cost increases significantly. There is.

FIGS. 54 and 55 are diagrams illustrating another example of the arrangement relationship between protrusions and a growth prevention film according to the present disclosure. To facilitate understanding, when expressed one-dimensionally as shown in FIG. 54 (explanation based on a longitudinal cross-sectional view) lower surface), when the growth prevention film 44 is not aligned with the protrusion 41, defects (Threading Dislocations) located on the upper or upper surface 41a of the protrusion 41 are reduced through the growth prevention film 44. It may not have the desired effect.

That is, as shown at the top of FIG. 54, when the growth prevention film 44 and the protrusion 41 are accurately aligned, the penetration dislocation 54 located on the upper or upper surface 41a of the protrusion 41 and the growth The penetration dislocation 55 located on the bottom surface of the substrate 42 or the bottom surface 42a of the protrusion 41 will be blocked by the growth prevention film 44, specifically the growth prevention film 44a and the growth prevention film 45b. You can.

In the middle of FIG. 54 , the growth prevention film 44 is shown slightly offset from the protrusion 41, and the penetration dislocations 54 and 55 are still blocked by the growth prevention films 44a and 44b.

At the bottom of Figure 54, the growth prevention film 44 is presented in a state where it is completely misaligned with the protrusion 41. In this case, the growth prevention films 44a and 44b do not function to block the penetration dislocations 54 and 55, and simply It serves to improve the film quality to a certain extent by enabling ELOG (Epitaxially Lateral Overgrowth) of the second buffer layer 45 (see FIG. 8) grown thereon.

In Figure 55, a growth prevention film 44 (44a) longer than the width of the protrusion 41 (width at the bottom surface 42a of the protrusion 41) was introduced. At the top of Figure 55, the growth prevention film 44a is formed as a protrusion ( 41), and the penetration dislocation 54 is blocked by the growth prevention film 44a during the subsequent growth process, thereby improving film quality. In the middle of Figure 55, the growth prevention film 44a is slightly misaligned with the protrusion 41. It is presented in this state, and the penetration dislocation 54 is still blocked by the growth prevention film 44a. At the bottom of Figure 54, the growth prevention film 44a is shown in a state in which the growth prevention film 44a is shifted to the maximum limit from the protrusion 41. Although the growth prevention film 44a does not block the penetration dislocation 54, it blocks the penetration dislocation 55, that is, functions as a growth prevention film 44b, allowing the penetration dislocation 55 to grow in the subsequent growth process. It is blocked by the prevention film 44b and the film quality is improved.

In summary, by designing the growth prevention film 44 at a specific scale, the growth prevention film 44 can prevent at least some of the penetration dislocations 54 and 54 present in the first buffer layer 43, regardless of whether it is aligned with the protrusion 41. It can be seen that it can be blocked.

54 and 55 illustrate the case where the width of the protrusions 41 and the spacing between the protrusions 41 are the same. However, if the width of the protrusions 41 is larger than the spacing between the protrusions 41, the growth prevention film 44 By making the length equal to or larger than the width of the protrusion 41, a portion of the penetration dislocations 54 and 54 can be blocked regardless of whether they are aligned with the protrusion 41, and the width of the protrusion 41 is determined by the distance between the protrusions 41. In the smaller case, by making the length of the growth prevention film 44 equal to or larger than the gap between the protrusions 41, it is possible to block some of the penetration dislocations 54 and 54 regardless of whether they are aligned with the protrusions 41. In other words, if the growth prevention film 44 is designed well considering the size and arrangement of the protrusions 41 on the growth substrate 42, the penetration dislocations 54 and 54 can be blocked to the desired level regardless of whether they are aligned with the protrusions 41. You can see that it is possible. Although it is possible to consider making the growth prevention film 44 infinitely large, the upper limit of the size of the growth prevention film 44 should be limited in consideration of the growth area of the second buffer layer 44.

In the above, to facilitate understanding, the size and arrangement of the growth prevention film 44 were described one-dimensionally (based on a longitudinal cross-sectional view), but the actual growth prevention film 44 is two-dimensional as shown in FIG. 9. It must be explained (based on a plan view) (both the deviation of the x-axis direction and the y-axis direction must be considered), and therefore the concept of length mentioned above can be explained with the concept of area. That is, when the length of the growth prevention film 44a located on the protrusion 41 is equal to or larger than the width of the protrusion 41, the area of the growth prevention film 44a located on the protrusion 41 is increased to the protrusion 41. ) is replaced by the case of being equal to or larger than the area of (area on the bottom surface 42a of the protrusion 41). When the length of the growth prevention film 44b located on the bottom surface 42a of the growth substrate 42 is equal to or greater than the gap between the protrusions 41, the area of the growth prevention film 44b is equal to the distance between the protrusions 41. It can be replaced by making it larger than the area of the circle with the diameter (shapes other than circles can be considered). As described above, the gap between the growth prevention films 44a and 44b whose areas are set (i.e., the upper limit and shape of the growth prevention films 44a and 44b) is from the viewpoint of securing the growth area of the second buffer layer 44. can be decided. Generally, in the case of micro-scale protrusions 41 with a width of 1 μm or more, they have a width of 1 to 2.5 μm and a gap of 0.4 μm or less, and in the case of nano-scale protrusions 41 with a width of less than 1 μm, the protrusions are 500 nm or less. Since it has a width of 50 nm or less, the area of the growth prevention film 44a can be designed according to the width and shape of the protrusion 41. Instead of area, the size of the growth barrier can be defined in terms of horizontal and vertical widths, where one of the horizontal and vertical widths can be equal to or larger than the size and/or spacing of the protrusions, preferably the horizontal width and the vertical width. Both the vertical and horizontal widths can be equal to or larger than the size and/or spacing of the protrusions.

From a different perspective, looking at this problem from the perspective of Threading Dislocation Density (TDD), since the target TDD is 10 ⁷ /cm2 or less, for example, the TDD after the growth of the first buffer layer 43 Assuming that is 10 ⁸ /㎠ (in reality, it will be higher than this), TDD 10 ⁸ /㎠ means that within an area of (width*height) 1cm*1cm (=10 ⁷ nm*10 ⁷ nm), 10 There are ⁸ , or ^100,000,000 , penetration dislocations (54,55), and from a statistical point of view, there is 1 ^penetration dislocation (54, 55), it can be seen that there is. That is, when the TDD of the first buffer layer 43 is 10 ⁸ /cm2, assuming that the penetration dislocations 54 and 55 are uniformly distributed, (horizontal*vertical) 10 ³ nm*10 ³ nm (1㎛* One threading dislocation 54, 55 exists within an area of 1 ㎛ (this is referred to as a unit area). When the TDD of the first buffer layer 43 is 10 ⁹ /cm2, it can be understood that one penetration dislocation 54,55 exists for each unit area of 316nm x 316nm (0.316㎛*0.316㎛). there is. Therefore, if the TDD of the first buffer layer 43 is 10 ⁹ /cm2 or more, by forming a pattern (circle, hexagon, diamond, square, stripe, etc.) with a width or diameter of 0.3 ㎛, the protrusion 41 and the growth prevention film 44 It can be seen that the penetration dislocations 54 and 55 can be reduced below the desired level without alignment.

Figure 56 is an example of an image (Monochromatic CL image) showing crystal defects formed in the first buffer layer, where black dots represent threading dislocations (specifically, screw-type TD), and black dots represent threading dislocations (specifically, screw-type TD). The linear crystal defects that connect them represent mixed TD, a combination of edge-type and thread-type thread dislocations. Threading dislocations 54 formed on the top or upper surface of the protrusion 41 (see FIG. 54) correspond to the thread-like threading dislocations of the black dots. For reference, the majority of penetration dislocations generated from the bottom surface (42a; see Figure 55) of the growth substrate 42 are blade-shaped penetration dislocations, which is why they do not appear independent, that is, as dot shapes, but as connected shapes on the CL image. shows a shape in which the penetration dislocation generated in the growth substrate 42 is bent at an oblique angle and interacts with another penetration dislocation existing in the neighborhood, leading to the growth direction. Accordingly, after forming the first buffer layer 43 (see FIG. 54), the growth prevention film 44 is formed in consideration of the density or average distance of threading dislocations (e.g., the average distance of thread-like threading dislocations) on the first buffer layer 43. It becomes possible to determine the size (horizontal width and vertical width). Preferably, one of the horizontal and vertical widths of the growth prevention film 44 is designed to be equal to or longer than the average distance of the penetration dislocation, so that the growth prevention film 44 and It becomes possible to reduce the penetration dislocation to the required level even when the protrusions 41 are not aligned. For example, in the case of micro-scale protrusions 41 with a width of 1 μm or more, the width of 1 to 2.5 μm and 0.4 In the case of the nanoscale protrusions 41, which have a spacing of less than ㎛ and a width of less than 1 ㎛, have a width of 500 nm or less and a spacing of 50 nm or less, so a growth prevention film is applied according to the width, spacing, and shape of the protrusions 41. You can design the area of (44). Although the blade-like penetration dislocation is a crystal defect, it may be necessary from the viewpoint of relieving the stress of the semiconductor laminate, so when it is necessary to reduce the blade-like penetration dislocation to a certain level. , it is possible to reduce the blade-like threading dislocation by forming a _SiN Properties of GaN-Based HEMT on Si(111) by Controlling SiH ₄ Flow Rate of the SiNx Nano-Mask, MDPI, Published on 25 December 2020).

Figure 60 is a diagram showing another example of a method for manufacturing a non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure. First, a channel layer 46, a 2DEG 47, and a barrier are formed on a growth substrate 42. A layer 49 and a gate electrode 52 are formed. By providing a group III nitride layer (26; see FIG. 41), it is possible to implement a device in a normally-off state. Of course, a first buffer layer 43, a growth prevention film 44, a second buffer layer 45, an interlayer 48, and/or a cap layer 50 may be provided (see FIG. 8).

Next, as shown in FIG. 33, a passivation layer 89 that functions as a protective film is formed, and then the temporary substrate 92 is attached using the bonding layer 93. Preferably, a sacrificial layer 94 is provided between the temporary substrate 92 and the bonding layer 93 to later separate the temporary substrate 92. The bonding layer 93 may be provided on both sides or one side. The temporary substrate 92 is not particularly limited, but is preferably an LLO (Laser) that is relatively easy to lift off the temporary substrate 92 in the subsequent process, can be processed at low cost, and can use a laser beam. Apply transparent materials suitable for the Lift Off process. Of course, chemical etching (Chemical Lift Off (CLO)) or a process that combines chemical etching and mechanical polishing (Chemical-mechanical Polishing (CMP)) is also possible. In particular, in the case of the LLO process, the temporary substrate 92 made of transparent material includes glass, sapphire, quartz, etc. When the temporary substrate 92 is formed of a non-transmissive material such as metal or Si, it is possible to remove the temporary substrate 92 through wet etching and/or mechanical polishing. As shown, the passivation layer 89 can be formed to completely cover the gate electrode 52 and then expose the gate electrode 52. It is desirable to minimize the height difference between the passivation layer 89 and the gate electrode 52, and even if there is a height difference, it is possible to reduce the height difference and flatten it through the bonding layer 93 in the subsequent wafer bonding process.

Next, as shown in FIG. 34, the growth substrate 42 is removed (e.g., LLO process) to completely remove the seed layer and buffer layer introduced to form the non-light-emitting group III nitride semiconductor stack, The channel layer 46 is exposed.

Finally, a source electrode 51 and a drain electrode 53 are formed in the channel layer 46. Preferably, as shown in FIGS. 1 and 41, the insulating layer 24 (SiN insulating layer) is formed before or after forming the source electrode 51 and the drain electrode 53. The source electrode 51 and the drain electrode 53 are formed on the exposed channel layer 46 after the growth substrate 42 is removed. At this time, the exposed channel layer 46 becomes a Nitrogen (N) Polarity Surface, so it is Non -Alloyed Ohmic contact formation is easy, and alloyed Ohmic contact formation is also possible at relatively lower temperatures. Meanwhile, the barrier layer 49 on which the gate electrode 52 is formed is a Metallic (Ga, Al) Polarity Surface in its as-grown state, so it is easy to form the gate electrode 52 through Schottky contact or ohmic contact. In addition, in order to form the source electrode 51 and the drain electrode 53 to have ohmic contact characteristics with low contact resistance, plasma treatment or surface roughness is applied to the surface having nitrogen polarity prior to depositing the two electrode materials. Texture) process can also be introduced.

FIGS. 61 and 62 are diagrams illustrating various forms of a non-light-emitting group III nitride semiconductor laminate or device manufactured according to the method shown in FIG. 60. In FIG. 61, the gate electrode 52 is formed throughout the entire laminate or device. is formed, and the passivation layer 89 is omitted. This configuration can have the effect of reducing current leakage. In Figure 62, the gate electrode 52 is located close to the source electrode 51, and by reducing the distance between the gate electrode 52 and the source electrode 51, the size of the device can be reduced, preventing the parasitic effect. ) has the advantage of reducing electrical resistance and parasitic capacitance during high-speed switching operation.

FIG. 63 is a diagram showing an example of a method for transferring a non-luminescent Group III nitride semiconductor laminate or device manufactured according to the method shown in FIG. 60, in which the laminate or device W is placed on a support substrate 99. . If the laminate or device is individualized, it can be transferred onto the support substrate 99 using the Pick&Place method. When the support substrate 99 is the support substrate 4110 (e.g., wiring board, backplane board) described in FIG. 57, the source electrode 51 and the drain electrode 53 may be attached to the support substrate 99. . As described above, when the temporary substrate 92 and the bonding layer 93 are made of a conductive material, current can be supplied to the gate electrode 52, so they can be left as is, and the temporary substrate 92 and/or the bonding layer 93 ) is a non-conductive material, the temporary substrate 92 can be removed. As described above, when the temporary substrate 92 is a light-transmissive substrate, it is possible to remove the temporary substrate 92 while minimizing damage to the support substrate 99 through the configuration and method (LLO process) shown in FIG. 36. And, if necessary, it is possible to remove the bonding layer 93 or the bonding layer/passivation layer 93 and expose the gate electrode 52. Of course, even if the temporary substrate 92 is made of a conductive material, it can be removed.

FIG. 64 is a diagram showing another example of a method for transferring a non-light-emitting group III nitride semiconductor laminate or device manufactured according to the method shown in FIG. 60, and is a diagram showing a plurality of laminates or devices (W, Y) of the temporary substrate 92. ) is transferred to the support substrate 99 while being provided. At this time, by not providing the bonding layer 93 on the temporary substrate 92, the bonding layer 93 can be omitted between the plurality of laminates or elements W and Y. Temporary substrate 92 The arrangement of a plurality of stacks or devices (W,Y) placed on a wafer can be done by performing a photolithography and etching process on the stacks or devices in a wafer state, or by temporarily using the already individualized stacks or devices (W,Y) using the Pick&Place method. This is possible by transferring it to the substrate 92. The specific form of arrangement may vary depending on the wiring type of the base substrate 99, and a plurality of stacks or elements (W, Y) correspond to subpixels within one pixel. In this case, it provides a solution that can transfer while reducing minute errors.The method of removing the temporary substrate 92 has already been described in the example shown in Figure 63.

Figure 65 is a diagram showing another example of a non-light-emitting Group III nitride semiconductor stack or device according to the present disclosure, in which the non-light-emitting Group III nitride semiconductor stack or device (e.g., HEMT) includes a growth substrate 42 and a seed layer. (423), a buffer layer 435, a channel layer (46; e.g., GaN with a thickness of 2 μm) and a barrier layer (49; e.g., AlGaN within 20 nm). Preferably, a pre-seeding layer (42j; formed by supplying TMAl gas, which is an aluminum (Al) source, alone without supplying ammonia (NH ₃ ) gas, which is a nitrogen (N) source), an interlayer (48; 8) and/or a cap layer 50 may be provided, and as shown in FIG. 41, a group III nitride layer 26 (e.g., p-type GaN within 20 nm) may be provided. Of course. When a Si substrate is used as the growth substrate 42, the seed layer 423 may be made of AlN to prevent reaction with GaN present in the upper layer, and the seed layer 423 made of AlN may be formed at a low temperature (500 It can be formed to a thickness of 50 nm or less at -900°C. The buffer layer 435 includes a first layer (43m; Al _a Ga _1-a N (0≤a≤1)) and a second layer (43n; Al _b Ga _1-b N (0≤b<1)). This can be done, and the first layer (43m) resolves the difference in gap constant between the seed layer 423 made of AlN and the layer made of GaN located on top (second layer 43n, channel layer 46). It functions as a strain control layer (corresponding to the first layer in FIG. 12), and the second layer 43n corresponds to the second layer in FIG. 12 and the second buffer layer 45 in FIG. 17. Preferably, the buffer layer 435 is grown at high temperature (1000°C or higher) to improve the crystallinity of itself (43m, 43n) and the group III nitride stack (46, 47, 49) located on the upper layer, and has a thickness of 1㎛. It includes an AlN layer 43k having a thickness of more than 100%.

FIG. 66 is a diagram illustrating bowing of the wafer during the growth process of the non-light-emitting group III nitride semiconductor stack or device shown in FIG. 65.

First, the bending behavior of the wafer without the AlN layer (43k) grown at high temperature (HT) is examined. Before growth, the growth substrate 42 is flat, and the seed layer 423 made of AlN, which is grown at low temperature (LT) on the growth substrate 42, is maximally convex downward. do. This is due to the difference in the lattice constant and thermal expansion coefficient of the Si growth substrate 42 and AlN, and if it is excessively bent, that is, if the tensile stress increases beyond a certain level, cracks occur in the AlN epi layer and wafer. . On this wafer, a first layer (43m; Al _a Ga _1-a N (0≤a≤1)) with a gradually increasing GaN component ratio (1-a) and a second layer with a high GaN component ratio (b-1) ( When 43n; Al _b Ga _1-b N (0≤b<1)) is grown, it changes from a downward convex state to an upward convex state, and when compressive stress is applied, cracks appear in the wafer. does not occur Subsequently, when the channel layer (46; e.g., GaN), 2DEG (47), and barrier layer (49; e.g., AlGaN) are grown, the degree of convexity decreases upward and downward, but growth occurs without cracks while maintaining downward convexity. It's done. For reference, from the viewpoint of device behavior, the second layer 43n and the channel layer 46 are separated, but from the viewpoint of device manufacturing, they may form a single layer made of GaN without aluminum (Al).

Next, the bending behavior of the wafer provided with the AlN layer (43k) grown at high temperature (HT) is examined. Before growth, the growth substrate 42 is flat, and a seed layer 423 of AlN grown at low temperature (LT) and an AlN layer 43k grown at high temperature (HT) are grown on the growth substrate 42. The state is maximally convex downward. Since an AlN layer 43k of 1 μm or more is grown in addition to the seed layer 423, the downward convexity of the wafer becomes much greater, and the risk of wafer cracking becomes much greater. Subsequently, when the first layer 43m and the second layer 43n are grown, the degree of downward convexity decreases, but may not reach a flat state or an upward convex state, as shown in Figure 66, and subsequently When the channel layer 46 (e.g. GaN), 2DEG 47, and barrier layer 49 (e.g. AlGaN) are grown, the downward convexity increases again, raising the possibility of wafer cracks. To reduce the risk of such cracks, it is necessary to adjust growth conditions so that the final finished wafer is flat or convex upward.

FIG. 67 is a diagram showing another example of a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure. Compared to the laminate or device shown in FIG. 65, the AlN layer 43k grown at high temperature (HT) is a diagram illustrating another example. The difference is that it is provided with air voids (AV). By providing an air void (AV), it is possible to relieve tensile stress and improve the crystallinity of the AlN layer 43k grown at high temperature (HT) on the air void (AV). It is possible to improve the layers (43m, 43n, 46, 47, 49) grown on top (Paper: Effectively releasing tensile stress in AlN thick film for low-defect-density AlN/sapphire template; 24 July 2020; semiconductor TODAY). The role of the AlN layer (43k) grown at high temperature (HT) with air voids (AV) is largely ① Tensile stress that rapidly increases in the process of growing the AlN thin film at a high temperature of 100℃ or higher; the wafer is convex downward. ② air voids (AV) introduced inside the AlN high-temperature thin film are used to suppress cracks in the subsequently grown non-luminescent group III nitride semiconductor laminate or Si wafer by relaxing the shape) and Crystalline defects, especially dislocations (Misfit, Threading), generated from the pre-seeding layer 42j or the seed layer 423 are filtered to dramatically reduce the dislocation density.

FIG. 68 is a diagram illustrating the bowing of the wafer during the growth process of the non-light-emitting group III nitride semiconductor laminate or device shown in FIG. 67, and is a diagram illustrating the wafer bowing made of AlN grown at high temperature (HT) with an air void (AV). It can be seen that the maximum downward concave degree of the layer (43k, AV) is small compared to the layer (43k) made of AlN grown at high temperature (HT) without an air void (AV), and thus. It can be seen that the final completed wafer can be made in a convex shape.

FIG. 69 is a diagram showing another example of a non-luminescent Group III nitride semiconductor laminate or device according to the present disclosure, wherein the layer 43k of AlN grown at high temperature (HT) of the laminate or device shown in FIG. 67, A protrusion 44c as shown in FIG. 18 is additionally provided. As described above, the addition of the protrusions 44c improves the film quality of the laminate or device. At this time, it is important to prevent the air void (AV) from being exposed to the upper part of the protrusion 44c. For this purpose, the air void (AV) is formed at the bottom of the AlN layer 43k grown at high temperature (HT), or (HT) The layer 43k made of AlN to be grown is formed sufficiently thick. Formation of air voids (AV) occurs when the growth temperature of the AlN layer 43k grown at high temperature (HT) is 1000°C or higher, and the growth temperature of the seed layer 423 made of AlN grown at low temperature (LT) is 500-500°C. At 900°C, it can be formed by growing a layer (43k) of AlN at an intermediate temperature (MT; 900-1000°C) (Paper: Effectively releasing tensile stress in AlN thick film for low-defect-density AlN/sapphire template; 24 July 2020; semiconductor TODAY). Therefore, by controlling the growth conditions, it is possible to control the position where the air void (AV) is formed within the AlN layer 43k grown at high temperature (HT). Preferably, a material layer 45a (eg, PVD AlN, PVD AlNO) may be introduced as shown in FIG. 21. The air void (AV) may have various shapes such as a sawtooth shape, a circular shape, a toothed shape, a nail shape, etc. For example, the area grown at medium temperature (MT) is 1 within the entire AlN layer 43k. It can be formed to occupy an area of about 4 to 1/3.

FIG. 70 is a diagram illustrating the bowing of the wafer during the growth process of the non-light-emitting group III nitride semiconductor laminate or device shown in FIG. 69, and is a diagram illustrating the wafer bowing made of AlN grown at high temperature (HT) with an air void (AV). At the point where growth begins after forming the protrusions 44c and the material layer 45a on the layers 43k and AV, the wafer is in both a state with increased warpage (Q) and a state with reduced warpage (P). It shows that you can have it.

FIG. 71 is a diagram showing another example of a non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure. Unlike the laminate or device shown in FIG. 69, a protrusion 44c is provided on the first layer 43m. There is little risk of air voids (AV) leading to the top of the protrusions 44c, and the thickness of the layer 43k can be reduced by using AlN grown at high temperature (HT), which requires a lot of tensile stress. , AlN grown at high temperature (HT) can provide elasticity to the growth conditions of the layer 43k. Of course, the material layer 45a may be provided on the protrusion 44c.

FIG. 72 is a diagram illustrating the bowing of the wafer during the growth process of the non-light-emitting group III nitride semiconductor laminate or device shown in FIG. 70. The bowing of the wafer is caused by the stress relief layer (from a composition close to AlN to GaN). The first layer (43m), which is a layer that changes to a close shape (e.g., the composition of Al decreases in the order of 0.8 -> 0.5 -> 0.2), may be in a convex shape after growth, and these wafers In this state, even if the protrusions 44c and the material layer 45a are provided, the formation of the protrusions 44c and the material layer 45a causes the wafer to be in a state (S) in which the bending of the wafer is increased to a downward concave state or the wafer is in a state (S). Regardless of whether the bending is reduced to a convex upward state (T), the state of the final wafer can be adjusted to a convex upward state. It is not excluded to form the protrusions 44c in the lower part of the second layer 43c and the channel layer 46.

Through the preceding examples, various methods of manufacturing non-luminescent group III nitride semiconductor laminates or devices were presented, and a method for reducing crystal defects was presented through the examples shown in FIGS. 8 to 14, and shown in FIGS. 17 to 23. Through examples, a method for reducing crystal defects using the protrusion 41 and the growth prevention film 44 is presented, examples shown in FIGS. 24 and 25, examples shown in FIGS. 33 to 40, and FIGS. 44 to 51 Through the examples presented in , a method of removing the growth substrate 41 and attaching a new support substrate was presented.

From a growth perspective, using GaN substrates, SiC substrates, and sapphire (Al ₂ O ₃ ) substrates is more advantageous than using silicon (Si) substrates in order to reduce crystal defects, but GaN substrates and SiC substrates have the disadvantage of being expensive. Since the sapphire substrate has a disadvantage in terms of heat dissipation, and the silicon substrate has a disadvantage in terms of crystal defects, considering all the aspects of crystal defects, cost, and heat dissipation, a sapphire substrate can be used to A method of growing a light-emitting group III nitride semiconductor laminate and then replacing it with a support substrate made of silicon is summarized below.

Returning to Figure 24, first, on the growth substrate 42 (sapphire substrate), a protruding base layer 71 or a first buffer layer 43, a second buffer layer 45, and a non-luminescent group III nitride semiconductor laminate (A) forms. The protrusion base layer 71 or the first buffer layer 43 is provided with protrusions 41 (44c, 44), and a material layer 45a is provided thereon. Of course, the material layer 45a can be partially formed in the form shown in FIGS. 22 and 23, and when the material layer 45a is formed in the form shown in FIG. 23, the material layer ( 45a) is not an Al-containing material such as AlN, AlNO, or AlO, which slows down the growth rate of the second buffer layer 45, but is a material that prevents the growth of the second buffer layer 45 on the protrusions 41 (44c, 44). Of course, it can be made of dielectric materials such as SiO ₂ and SiN _x . At this time, the configuration described above may be used for the configuration of the protrusion base 71 or the first buffer layer 43.

Next, as shown in FIG. 25, the temporary substrate (S) is attached to the non-luminescent Group III nitride laminate (A), and then the growth substrate 42 made of sapphire is removed. The attachment of the temporary substrate S and the removal of the growth substrate 42 are explained in detail in the examples shown in FIGS. 33 to 40 and the examples shown in FIGS. 44 to 51. Of course, as shown in FIG. 30, necessary electrode formation work, etc. can be performed in advance.

Next, as shown in FIG. 73, the support substrate SP made of silicon is attached through the bonding layer SB, and the temporary substrate S is removed. The configuration of the bonding layer SB and the method of removing the temporary substrate S are also described in detail in the examples shown in FIGS. 33 to 40 and the examples shown in FIGS. 44 to 51.

During the manufacturing process, the first buffer layer 43 itself may be omitted, the protrusions 41 (44c, 44) may be omitted, or the material layer 45a may be omitted, which is not desirable from the viewpoint of reducing crystal defects. 25 , although it is not desirable from the viewpoint of removal of the growth substrate 42, it is of course possible to use the growth substrate 42 provided with protrusions 41 as shown in FIGS. 17 to 23. Therefore, there are eight combinations (two for the case where the growth substrate 42 is provided with the protrusion 41 and two for the case where the growth substrate 42 is not provided with the protrusion 41, and for the case where only the first buffer layer 43 is provided, the first buffer layer 43 and the protrusion ( Four types according to the case of providing 41 (44c, 44), the case of providing the first buffer layer 43, the protrusion 41 (44c, 44), and the material layer (45a), and the case of not providing all of these. ) is possible. From the viewpoint of reducing crystal defects, a growth substrate 42 provided with protrusions 41, a material layer 45a, and a first buffer layer 43 provided with protrusions 41 (44c, 44) It is desirable to provide both. In addition, the protrusion 41 provided on the growth substrate 42 and the protrusion 41 (44c, 44) provided on the protrusion base layer 71 or the first buffer layer 43 and the material layer Of course, the configuration of (45a) can be expanded to the form shown in Figures 8 to 14. That is, the protrusion 41 provided on the growth substrate 42 can have the form shown in Figures 11 to 14. , the protrusions 41 (44c, 44) and the material layer 45a provided on the protrusion base layer 71 or the first buffer layer 43 are replaced with a growth prevention film or growth inhibition film as shown in FIGS. 8 and 17. It can be.

Returning to FIG. 25, in the process of removing the growth substrate 42, as shown, the first buffer layer 43 is left as is, or the first buffer layer 43 is removed and the material layer 45a is exposed. Three options can be considered: leaving it as is or removing the first buffer layer 43 and the material layer 45a to leave the second buffer layer 45 exposed. Six combinations are possible depending on whether a surface texture is given to them. As shown in FIG. 35, a surface texture can be formed on the first buffer layer 43, and when the material layer 45a is left exposed, the protrusions 41 ( 44c, 44)), a surface texture can be formed, and even when the second buffer layer 45 is left exposed (see FIG. 74), a surface texture (ST; Surface Texture) can be formed without a separate process. can be formed. When the growth substrate 42 is provided with protrusions 41, it is easy to form a surface texture on the first buffer layer 43, and a surface texture can be formed separately on the second buffer layer 45. In some cases, it is formed. By removing the first buffer layer 43 containing a large number of crystal defects (through dislocations 54, 55, and 56 present in the first buffer layer 43 as shown in FIG. 16), the final laminate or device is This has the advantage that crystal defect areas are eliminated. When the protrusions 41 (44c, 44) are removed and the second buffer layer 45 is left exposed, crystal defects present on top of the protrusions 41 (44c, 44) (as shown in FIGS. 18 to 20) Likewise, the penetration dislocations 58, 59, 58a, 58b, 59a, and 59b present on top of the protrusions 41 (44c, 44) can also be removed, thereby further eliminating crystal defect areas in the final laminate or device. The first buffer layer 43, the material layer 45a, and the second buffer layer 45 made of GaN, AlGaN, or AlN can be removed using a dry method containing chlorine (Cl ₂ ) or chlorine boride (BCl ₃ ) gas. Dry etching is preferred, but wet etching using acid or base solutions can also be applied.

FIGS. 75 to 87 are diagrams illustrating another example of manufacturing a non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure, in which the form shown in FIGS. 50 and 51 (a conductive material (growth substrate 42) 97C) relates to another method of manufacturing a non-luminescent Group III nitride semiconductor laminate or device having a thermal passage.

First, as shown in FIG. 75, prepare a growth substrate 42 (e.g., sapphire substrate).

Next, as shown in FIG. 76, one or more trenches 42T are formed. Laser drilling may be used to form the trench 42T, and the trench 42T may be formed in a dot shape and/or a strip shape. The dot shape may be circular, square, hexagonal, etc., and there are no particular restrictions on its shape. For example, the trench 42T may be formed to have a width of 50 μm or less, a spacing of 50 μm or less, and a depth of 100 μm or less.

Next, as shown in FIG. 77, a trench cover material 42TM is formed on the upper surface of the growth substrate 42 to fill the trench 42T. The trench cover material (42TM) may be photoresist (PR), SOG, a resin containing a silicon (Si) component, a composite paste containing an aluminum (Al) component, etc., and may be used by spin coating, dotting ( It can be formed through dotting, screen printing, electrochemical deposition, electrophoresis, etc. As an additional process, it is also possible to introduce an annealing process to solidify the trench cover material (42TM) or remove organic components.

Preferably, as shown in FIG. 78, the trench cover material 42TM formed on the growth substrate 42 is removed. Dry etching, such as ICP or RIE etching, may be preferentially used for this removal process, but mechanical polishing or mechanical chemical polishing processes may also be used depending on the type and formation process of the trench cover material (42TM). It can be.

Next, as shown in FIG. 79, a seed layer 423 (e.g., AlN, AlNO) is formed. The seed layer 423 may be formed by CVD (MOCVD, ALD, MBE) or PVD (Sputter, PLD). Since the trench cover material 42TM must be maintained in the trench 42T during the formation of the seed layer 423, the formation method is preferably performed at a temperature lower than the evaporation temperature of the trench cover material 42TM. For example, when the trench cover material 42TM is PR, the seed layer 423 can be formed through sputtering, a PVD method.

As shown in FIG. 80, it goes without saying that protrusions 41 may be provided on the growth substrate 42 to improve the crystallinity of the group III nitride semiconductor to be deposited.

Next, as shown in Figure 81, a non-luminescent Group III nitride semiconductor laminate (A) is formed thereon. Preferably, a buffer layer 435 is formed on the seed layer 423, and a group III nitride semiconductor laminate (A) is formed.

As shown in FIG. 82, similar to those shown in FIGS. 17 to 23, protrusions 41 are formed on the growth substrate 42, a seed layer 423 is formed, and then a first buffer layer 43 is formed thereon. ) and a growth prevention film 44 are formed, a second buffer layer 45 is formed thereon, and then a non-emissive group III nitride semiconductor laminate (A) can be formed. As described above, the growth prevention film 44 may be made of a different material (e.g., SiO ₂ ) or the same material as the first buffer layer 43, and the protrusions 41 may be omitted. Of course.

Next, as shown in FIG. 83, the thickness of the growth substrate 42 on the side opposite to the non-emissive group III nitride semiconductor stack A is reduced to expose the trench 42T and the trench cover material 42TM. I order it. A lapping & polishing process can be used for this process.

Next, as shown in FIG. 84, the trench cover material 42TM is removed. This process will be determined depending on the type and formation process of the trench cover material 42TM, but dry etching such as ICP or RIE etching may be used preferentially, and a wet etching process using a selective etching solution may also be used.

Meanwhile, after going through the process shown in Figure 79, it is possible to remove the trench cover material (TM; e.g. PR) through heat treatment and then proceed with the subsequent process (see U.S. Patent Publication No. US 9,793,359). In this case, the process shown in Figure 84 can be omitted or simplified.

Finally, as shown in Figure 85, similar to that shown in Figure 50, the trench 42T is filled with a conductive material 97C to form a thermal and/or electrical path. The non-luminescent group III nitride semiconductor laminate (A) may be provided with the necessary electrodes (E1, E2, E3) depending on the device (D-mode HEMT, E-mode HEMT, JFET), and the electrodes (E1, E2, E3) may be provided. ) may be formed before or after the thickness reduction of the growth substrate 42, and by forming before the thickness reduction process of the growth substrate 42, the thick growth substrate 42 serves as a support substrate to ensure the stability of the process. It becomes possible. When the device is a HEMT, the electrodes E1, E2, and E3 can be each source electrode, gate electrode, and drain electrode (see FIG. 41), and when the device is a JFET, the electrodes E1 and E3 This corresponds to the gate electrode, the electrode E2 may correspond to the source electrode, and the conductive material 97C may correspond to the drain electrode (see FIG. 37).

In addition, as shown in FIG. 86, in the process of removing the trench cover material 42TM, the trench 42T is formed with a buffer layer 435 or a non-luminescent group III nitride laminate to expand a thermal passage or form an electrical passage. It can be formed to reach (A) (see Figure 51). This extension of the trench 42T can be formed through dry etching. For example, if the device is a JFET, it is possible to extend the trench 42T to reach the drain region 83, preferably to improve the ohmic properties of the drain region 83 and the conductive material 97C. For this reason, it is possible to first form the ohmic contact electrode 97Oh in the trench 42T. The ohmic contact electrode (97Oh) may be composed of, for example, four layers. The first layer has a small work function value, has excellent adhesion to the non-luminescent group III nitride semiconductor, and forms metal nitride during the heat treatment process. The second layer may be made of relatively easy metals such as Ti or Cr, and the second layer may be made of Al, V, or Re, a metal that has a small work function and is relatively easy to form metal nitride during the heat treatment process. The third layer may be made of Pt, Ni, W, Mo, Ti, Cr, TiW, NiCr, etc., which have a high atomic filling rate and melting point to prevent material movement when applied at high temperature or high power. The layer may be made of Au or Cu, etc., which are easy to connect with external components.

FIG. 87 shows a combination of the example shown in FIG. 82 and the example shown in FIG. 86, and the trench 42T extends to the drain region 83 through the protrusion 41 and the growth prevention film 44. For convenience of explanation, the seed layer 423 is omitted.

Figures 88 to 92 are diagrams illustrating another example of a Group III nitride semiconductor stack or device according to the present disclosure. Unlike the previous examples, in addition to the non-light-emitting Group III nitride semiconductor stack or device (e.g., diode, transistor) It can also be applied to group III nitride semiconductor optical devices (e.g., light emitting devices (LD, LED), light receiving devices (Photodiode, solar cell)), and a technology using a Si substrate or SiC substrate as the growth substrate 42 is proposed. .

As shown in Figure 88, the group III nitride semiconductor stack includes a growth substrate 42 (e.g. Si substrate, SiC substrate), a seed layer 423, a first layer 43m, a second layer 43n, and stress. It includes a control layer (43p) and a top layer (43t). Preferably, it includes a pre-seeding layer 42j.

Unlike the example shown in FIG. 71, the AlN layer 43k is omitted, the protrusions 44c are formed in the second layer 43n, and the second layer 43n with the protrusions 44c and the stress control layer are formed. A material layer 45a made of AlN, AlNO, or AlO is provided between (43p). The process of forming the second layer 43n having the protrusion 44c is a protrusion base layer including the seed layer 70, the first layer 71c, and the second layer 71d shown in Case I of FIG. 14. It is the same as the process of forming (71). The function of the material layer 45a made of AlN, AlNO, or AlO has been described in relation to the examples shown in FIGS. 21 to 23, and the growth of the first layer 43m and the growth of the stress control layer 43p From this point of view, it can be seen that it functions as a seed layer like the seed layer 423, and while the seed layer 423 can be formed of in-situ AlN, ex-situ AlN, or ex-situ AlNO, AlO, AlN, The material layer 45a made of AlNO or AlO is preferably formed ex-situ in terms of protecting the second layer 43n in which the protrusions 44c are formed.

For example, the seed layer 423 may be formed of AlN with a thickness of 50 nm or less at low temperature (500-900° C.) using a MOCVD device. The material layer 45a made of AlN, AlNO, or AlO may be deposited to a thickness of 50 nm or less using a PVD (Sputter, ALD, PLD) device. In the example shown in FIG. 88, the seed layer 423 may be referred to as a first seed layer, and the material layer 45a made of AlN, AlNO, or AlO may be referred to as a second seed layer.

In the example shown in Figure 88, the group III nitride stack serves as the basis, that is, the template (TE), of the device to be formed thereon, and from this point of view, the top layer 43t is preferably made of Ga-rich AlGaInN, especially GaN. Depending on the requirements of the Group III nitride semiconductor device to be implemented thereon, it may be doped with n-type or p-type impurities (e.g. Si, Mg), or may contain some Group III elements (e.g. In, Al). Of course it exists. The thickness of the top layer 43t is not particularly limited, but in order to grow the active layer of a non-light-emitting or light-emitting device (e.g., HEMT, LED) that is continuously grown thereafter with high quality, it is first necessary to have a thickness that minimizes stress and does not cause cracking. It is desirable, and typically grows from at least 500 nanometers (nm) to a maximum of 3 micrometers (㎛) or less.

Referring to FIG. 89, after the seed layer 423 is formed, the warp of the wafer becomes concave downward as shown in FIG. 72, and to resolve this, a stress relief layer (composition close to AlN) is used. A first layer (43 m) is required, which is a layer that changes in form to a form close to GaN (e.g., the composition of Al decreases in the order of 0.8 -> 0.5 -> 0.2). In the example shown in FIG. 88, the first layer (43m) has a thickness of 1 μm or less and is made of a single layer of AlGaN, or is made of AlGaN in which the composition of Al is gradually or stepped, or It can be composed of a multilayer structure or a superlattice structure (AlN/GaN, AlN/AlGaN, Al _x Ga _1-x N/Al _y Ga _1-y N) and contains n-type or p-type impurities (e.g. Si, Mg). Of course, it can be doped with ). In any case, since the wafer is placed at room temperature for the formation of the protrusions 44c after the growth of the second layer 43n, the wafer is convex upward to prevent cracks from occurring after the growth of the second layer 43n (e.g. GaN). It is preferable that the first layer 43m be in a convex shape, and the wafer is excessively concave downward after the growth of the second layer 43n from the state in which the seed layer 423 is formed, causing cracks in the wafer. It must have a composition of Al that reduces the stress of the wafer to prevent it from occurring, and must have an overall composition of Al _x Ga _1-x N (0<x<1).

In addition, after the formation of the protrusions 44c, the warpage of the wafer may increase or decrease, and the formation of the material layer 45a to the second seed layer 45a made of AlN, AlNO, or AlO is performed by forming the first seed layer 423. ), the bending of the wafer is increased toward the concave downward. Since cracks should not occur after the formation of the top layer 43t, the wafer should not be excessively concave downward, and preferably should have a shape convex upward, so that the wafer should be convex through the stress control layer 45p (AlGaInN). These conditions must be satisfied after the formation of the top layer 43p, and therefore the stress control layer 43p has a composition that increases or decreases the stress of the wafer depending on the wafer bending state after formation of the second seed layer 45a. do. The stress control layer 43p can have a single-layer structure, a multi-layer structure, or a superlattice structure, and the composition can be gradual or stepwise, and can be made of AlN, Al-rich group III nitride (e.g. Al-AlGaN), Ga-rich 3 It may be made of group nitride (e.g. Ga-rich AlGaN, Ga-rich GaInN), etc. The thickness of the stress control layer 43p is preferably grown to be at least thicker than the height of the protrusion 44c formed on the top of the second layer 43n. Penetration occurs in the thin film layer below the second layer 43n including the growth substrate 42 and proceeds in the growth direction by proceeding in the ELOG thin film growth mode in 360° directions around the protrusion 44c present on the upper part of the second layer 43n. In order to suppress and minimize crystal defects such as dislocations (threading dislocation), it is desirable to grow to a minimum height of the protrusion 44c or more and flatten it. For example, it can grow to a thickness of 100 nanometers (nm) or more to 2 micrometers (㎛) or less.

Figure 90 shows an example of implementing a HEMT device including a channel layer 46, 2DEG 47, and barrier layer 49 on the group III nitride stack or template (TE) shown in Figure 88, and Figure 91 shows An n-type group III nitride semiconductor region 12a, an active region 12b, and a p-type group III nitride semiconductor region 12c as shown in FIG. 6 are formed on the group III nitride stack or template (TE) shown in FIG. 88. An example of implementing an LED device is presented. Figure 92 shows an actual photograph of the protrusions 44c (see Fig. 88) formed on the second layer 43n, and the hemispherical protrusions 44c are well formed with a width of 2.5 ㎛, a height of 1.5 ㎛, and a width of 0.45 ㎛. can be seen.

Hereinafter, various embodiments of the present disclosure will be described.

(1) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, comprising: preparing a growth substrate containing silicon (Si); Forming a plurality of protrusions on a growth substrate; Growing a first buffer layer to cover a plurality of protrusions on a growth substrate; forming a plurality of growth prevention films on the first buffer layer; Growing a second buffer layer from the first buffer layer exposed through the growth prevention film; And, forming a non-light-emitting Group III nitride semiconductor stack on the second buffer layer.

(2) A method of manufacturing a non-luminescent group III nitride semiconductor laminate in which, in the step of forming a growth prevention film, a plurality of growth prevention films are formed so as to be located on top of each protrusion and between protrusions.

(3) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate in which the plurality of protrusions and the growth substrate are made of the same material.

(4) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein the growth substrate containing silicon (Si) is one of a Si growth substrate and a SiC growth substrate.

(5) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate in which the plurality of protrusions and the growth substrate are different materials.

(6) prior to forming a plurality of protrusions, forming a protrusion base layer; manufacturing a non-light-emitting group III nitride semiconductor laminate, wherein the plurality of protrusions are formed by etching the protrusion base layer. method.

(7) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein the protrusion base layer is composed of a seed layer formed on a growth substrate and a group III nitride semiconductor layer formed on the seed layer.

(8) A method of manufacturing a non-luminescent group III nitride semiconductor laminate in which the group III nitride semiconductor layer of the protrusion base layer is exposed through etching.

(9) A method of manufacturing a non-luminescent group III nitride semiconductor laminate in which the seed layer of the protrusion base layer is exposed through etching.

(10) prior to forming the plurality of protrusions, forming a protrusion base layer; further comprising: a non-emissive group III nitride semiconductor laminate, wherein the plurality of protrusions are formed by lifting off the protrusion base layer. How to manufacture.

(11) forming a seed layer covering the lifted-off protrusion base layer and the lifted-off exposed growth substrate; a method of manufacturing a non-light-emitting group III nitride semiconductor laminate, further comprising:

(12) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, comprising: preparing a growth substrate; Forming a plurality of protrusions on a growth substrate; Growing a first buffer layer to cover a plurality of protrusions on a growth substrate; forming a plurality of growth inhibition films on the first buffer layer; growing a second buffer layer from the first buffer layer exposed from the plurality of growth inhibition films; And, forming a non-light-emitting Group III nitride semiconductor stack on the second buffer layer.

(13) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein in the step of forming a plurality of growth inhibition films, a plurality of growth inhibition films are formed so as to be located on top of each protrusion and between the protrusions.

(14) A method for manufacturing a non-luminescent Group III nitride semiconductor laminate wherein the plurality of protrusions and the growth substrate are made of the same material.

(15) A method for manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein the plurality of growth inhibition films include a dielectric material.

(16) A method for manufacturing a non-luminescent group III nitride semiconductor laminate, wherein the plurality of growth inhibition films include a material from which a second buffer layer can be grown, but whose growth rate is slower than the growth rate of the first buffer layer from the first buffer layer. method.

(17) A method for manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein the plurality of growth inhibition films include one of AlN, AlNO, and AlO.

(18) A method for manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein the plurality of growth inhibition films are made of a material constituting the first buffer layer.

(19) Prior to growing the second buffer layer, forming a material layer that slows down the growth rate of the second buffer layer from the first buffer layer compared to the growth rate of the second buffer layer from the first buffer layer. Method for manufacturing a nitride semiconductor laminate.

(20) Prior to growing the second buffer layer, forming a material layer that slows down the growth rate of the second buffer layer from the first buffer layer than the growth rate of the second buffer layer from the first buffer layer; Method for manufacturing a nitride semiconductor laminate.

(21) A method for manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein the plurality of growth inhibition films include one of AlN, AlNO, and AlO.

(22) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, comprising: preparing a growth substrate; Growing a first buffer layer on a growth substrate; Forming a plurality of protrusions made of a first buffer layer on a first buffer layer; growing a second buffer layer on the first buffer layer; Forming a non-emissive Group III nitride semiconductor laminate on the second buffer layer; And, prior to growing the second buffer layer, forming a material layer to slow or prevent the growth of the second buffer layer on the plurality of protrusions. A method of manufacturing a non-light-emitting group III nitride semiconductor laminate including.

(23) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein the material layer is made of a material that slows the growth of the second buffer layer, and is formed over the entire first buffer layer on which a plurality of protrusions are formed.

(24) A method for manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein the first buffer layer consists of a seed layer formed on a growth substrate and a Group III nitride semiconductor layer formed on the seed layer.

(25) Separating the growth substrate from the non-luminescent Group III nitride semiconductor laminate side.

(26) A non-luminescent Group III nitride semiconductor stack, comprising: sequentially stacked drain regions; drift area; and gate area; a support substrate electrically connected to the drain region; A gate electrode electrically connected to the gate area; a source electrode electrically connected to a channel formed by the drift region exposed through the gate region; A passivation layer covering the entire laminate where the gate electrode and the source electrode are located and having a plurality of openings; a gate electrode for bonding electrically connected to the gate electrode through one of the plurality of openings; And, a source electrode for bonding electrically connected to the source electrode through another one of the plurality of openings; a non-light-emitting group III nitride semiconductor laminate including a.

(27) The support substrate is made of the same material as the growth substrate and has a plurality of thermal and electrical passages, and the laminate further includes a drain electrode for bonding provided below the support substrate. A non-light-emitting group III nitride semiconductor. Laminate.

(28) A non-luminescent group III nitride semiconductor laminate in which the support substrate is made of sapphire.

(29) A non-luminescent group III nitride semiconductor laminate in which the support substrate is made of AlN.

(30) A non-luminescent group III nitride semiconductor laminate wherein the support substrate is made of Si.

(31) A method of manufacturing a non-luminescent Group III nitride semiconductor stack, comprising: forming a non-luminescent Group III nitride semiconductor stack on a growth substrate; Attaching a temporary substrate to the side of the laminate facing the growth substrate; removing the growth substrate; Forming a multilayer thin film including an electrically insulating ceramic layer and a metal layer in the order of the ceramic layer and the metal layer on the side of the laminate from which the growth substrate has been removed; Attaching a support substrate to the multilayer thin film; And, removing the temporary substrate; A method of manufacturing a non-light-emitting group III nitride semiconductor laminate including.

(32) the support substrate has a thermal passage, reducing the thickness of the support substrate; and forming a bonding pad on the support substrate of reduced thickness.

(33) Forming at least one electrode in the laminate from which the temporary substrate is removed. A method of manufacturing a light-emitting group III nitride semiconductor laminate, further comprising:

(34) A laminate for a non-luminescent group III nitride semiconductor device, comprising: sequentially laminated support substrates; A multilayer thin film composed of an electrically insulating ceramic layer and a metal layer; A non-emitting group III nitride semiconductor region consisting of a buffer layer, a channel layer, and a barrier layer; A gate electrode, a source electrode, and a drain electrode electrically connected to a non-luminescent group III nitride semiconductor region; A passivation layer covering the non-light-emitting group III nitride semiconductor region where the source electrode, drain electrode, and gate electrode are located, and opening the source electrode, drain electrode, and gate electrode to enable electrical connection to the outside; And, a field plate provided on the passivation layer to be electrically connected to one of the source electrode and the gate electrode. A non-light-emitting group III nitride semiconductor laminate including a.

(35) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, comprising: forming a non-luminescent Group III nitride semiconductor laminate on a non-conductive growth substrate; Attaching a temporary substrate to the side of the laminate facing the growth substrate; reducing the thickness of the growth substrate; Attaching a support substrate to the growth substrate of reduced thickness; And, removing the temporary substrate; A method of manufacturing a non-light-emitting group III nitride semiconductor laminate including.

(36) the support substrate has a thermal passage, and prior to removing the temporary substrate, reducing the thickness of the support substrate to expose the thermal passage; manufacturing a non-luminescent group III nitride semiconductor laminate, further comprising: How to.

(37) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein the support substrate is attached to a growth substrate of reduced thickness through a bonding layer.

(38) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, further comprising forming a thermal passage in a growth substrate of reduced thickness.

(39) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein the thermal passage is connected to the non-luminescent Group III nitride stack.

(40) A method for manufacturing a non-luminescent group III nitride semiconductor laminate, wherein the growth substrate is a sapphire substrate or a Si substrate.

(41) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, comprising: sequentially growing a drain region and a drift region; forming a channel by removing a portion of the drift area; and re-growing a gate region in the drift region from which a portion has been removed, further comprising forming an intervening layer between the gate region and the drift region prior to the re-growing step. Method for manufacturing a nitride semiconductor laminate.

(42) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein the intervening layer is removed and formed on the bottom surface of the exposed drift region and the sides of the channel.

(43) A method of manufacturing a non-light-emitting group III nitride semiconductor laminate, further comprising the step of alleviating the step between the gate region and the drift region.

(44) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein in the relaxation step, the intervening layer is removed and the upper side of the channel is exposed.

(45) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, comprising: preparing a growth substrate provided with a plurality of protrusions; Growing a first buffer layer to cover a plurality of protrusions on a growth substrate; Forming a plurality of growth prevention films on the first buffer layer without going through an alignment process with respect to the plurality of protrusions; And, growing a second buffer layer from the first buffer layer exposed through a plurality of growth prevention films. A method of manufacturing a non-light-emitting group III nitride semiconductor laminate including.

(46) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein each of the plurality of growth prevention films has a horizontal width and a vertical width, and the horizontal width and the vertical width are determined from the density of threading dislocations on the first buffer layer. Here, the horizontal width and vertical width mean the maximum width in the horizontal and vertical directions, and when the growth prevention film is circular, the widths are the same.

(47) Each of the plurality of growth prevention films has a horizontal width and a vertical width, and at least one of the horizontal width and the vertical width is equal to or longer than the average distance of the penetration dislocation on the first buffer layer, manufacturing a non-luminescent group III nitride semiconductor laminate. How to.

(48) Each of the plurality of growth prevention films has a horizontal width and a vertical width, and the plurality of protrusions have a constant interval, a constant horizontal width, and a constant vertical width, and the horizontal and vertical widths have a constant interval, a constant horizontal width, and a constant vertical width. A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein the width is determined.

(49) Each of the plurality of growth prevention films has a horizontal width and a vertical width, and the plurality of protrusions have a constant spacing, a constant horizontal width, and a constant vertical width, and at least one of the horizontal width and the vertical width has a constant horizontal width and a constant vertical width. A method of manufacturing a non-luminescent group III nitride semiconductor laminate that is equal to or longer than the width.

(50) Each of the plurality of growth prevention films has a horizontal width and a vertical width, and the plurality of protrusions have a constant interval, a constant horizontal width, and a constant vertical width, and at least one of the horizontal width and the vertical width is equal to or longer than the constant interval. , Method for manufacturing a non-luminescent group III nitride semiconductor laminate.

(51) Prior to forming a growth prevention film, forming a _SiN

(52) Forming a non-light-emitting Group III nitride semiconductor stack on the second buffer layer.

(53) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, comprising: forming a channel layer, a 2DEG, a barrier layer, and a gate electrode on a growth substrate; Attaching a temporary substrate using a bonding layer; removing the growth substrate; And, forming a source electrode and a drain electrode on the channel layer from which the growth substrate has been removed. A method of manufacturing or transferring a non-light-emitting group III nitride semiconductor laminate.

(54) A method for manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein an insulating layer is provided between the source electrode and the drain electrode.

(55) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate in which a gate electrode is formed over the entire barrier layer.

(56) A method for manufacturing a non-luminescent group III nitride semiconductor laminate, in which the gate electrode is provided closer to the source electrode than the drain electrode.

(57) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, wherein the gate electrode is provided so that at least a portion of the gate electrode overlaps the source electrode.

(58) attaching the source electrode and drain electrode to the support substrate; And, the method of manufacturing a non-light-emitting group III nitride semiconductor laminate further comprising the step of removing the temporary substrate.

(59) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein in the step of removing the temporary substrate, the gate electrode is exposed.

(60) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, comprising: forming a seed layer of AlN at a first temperature on a growth substrate of silicon (Si); forming a layer of AlN on the seed layer at a second temperature higher than the first temperature; forming a channel layer, 2DEG, and barrier layer on the AlN layer; And, prior to forming the channel layer, forming at least one of an air void and a protrusion; A method of manufacturing a non-light-emitting group III nitride semiconductor laminate including.

(61) A method for manufacturing a non-luminescent group III nitride semiconductor laminate in which protrusions are formed on a layer of AlN.

(62) A method for manufacturing a non-luminescent group III nitride semiconductor laminate in which air voids are formed in a layer made of AlN.

(63) A method of manufacturing a non-luminescent group III nitride semiconductor laminate, wherein air voids are formed at a third temperature higher than the first temperature and lower than the second temperature.

(64) Prior to forming the channel layer, forming a strain control layer that resolves the strain caused by the difference in lattice constant between the AlN layer and the channel layer; a non-luminescent group III nitride semiconductor laminate comprising a. How to manufacture.

(65) A method for manufacturing a non-luminescent Group III nitride semiconductor laminate in which protrusions are formed in the strain control layer.

(66) A method of manufacturing a non-luminescent Group III nitride semiconductor laminate, further comprising forming a material layer on the protrusions.

(67) A method of manufacturing a non-luminescent Group III nitride semiconductor device, comprising: growing a non-luminescent Group III nitride semiconductor laminate on a growth substrate made of sapphire; Attaching a temporary substrate to the non-luminescent Group III nitride semiconductor stack on the side opposite the growth substrate; Removing the growth substrate from the non-luminescent Group III nitride semiconductor stack; Attaching a support substrate made of silicon to the non-luminescent Group III nitride semiconductor laminate on the side from which the growth substrate was removed; And, removing the temporary substrate from the non-emissive Group III nitride semiconductor laminate. Alternatively, instead of the sapphire substrate as the growth substrate, it would be possible to use the recently introduced SAM (ScAlMgO ₄ ) single crystal substrate, which can minimize crystal defects in the growth process.

(68) Prior to the growing step, growing a first buffer layer on which a growth inhibition film is formed; And, growing a second buffer layer to cover the growth inhibition film on the first buffer layer; A method of manufacturing a non-emissive group III nitride semiconductor device further comprising.

(69) Prior to growing the second buffer layer, forming a material layer that blocks and reduces threading dislocations exposed on the surface of the first buffer layer. A method of manufacturing a non-emissive group III nitride semiconductor device, further comprising:

(70) A method of manufacturing a non-emissive group III nitride semiconductor device comprising: removing a portion of the first buffer layer prior to attaching the support substrate.

(71) A method of manufacturing a non-emissive group III nitride semiconductor device comprising: removing the entire first buffer layer prior to attaching the support substrate.

(72) Prior to attaching the support substrate, removing the first buffer layer to expose the material layer. A method of manufacturing a non-emissive group III nitride semiconductor device comprising.

(73) A method of manufacturing a non-emissive group III nitride semiconductor device comprising: removing a portion of the first buffer layer, the material layer, and the second buffer layer prior to attaching the support substrate.

(74) Prior to attaching the support substrate, removing a portion of the first buffer layer, the material layer, and the second buffer layer, and then surface texturing the second buffer layer; manufacturing a non-emissive group III nitride semiconductor device, comprising: How to.

(75) A method of manufacturing a non-emitting group III nitride semiconductor device in which a growth substrate is provided with protrusions.

(76) A method of manufacturing a non-emissive group III nitride semiconductor device, comprising: forming a trench on one surface of a growth substrate; filling the trench with a trench cover material; Forming a seed layer on one side of the growth substrate while filling the trench with a trench cover material; Forming a non-luminescent group III nitride semiconductor laminate on the seed layer; exposing the trench by reducing the thickness of the growth substrate; And, forming a conductive material in the trench from which the trench cover material has been removed. A method of manufacturing a non-light-emitting group III nitride semiconductor device including.

(77) A method for manufacturing a non-luminescent Group III nitride semiconductor device in which the seed layer is formed by a PVD method and a non-luminescent Group III nitride semiconductor laminate is formed by a CVD method.

(78) A method for manufacturing a non-luminescent group III nitride semiconductor device, wherein the seed layer is made of AlN or AlNO.

(79) A method for manufacturing a non-emissive group III nitride semiconductor device, wherein the trench cover material is formed by spin coating.

(80) A method of manufacturing a non-emissive group III nitride semiconductor device, wherein the trench is formed by laser drilling.

(81) A method of manufacturing a non-luminescent group III nitride semiconductor device in which protrusions are formed on a growth substrate.

(82) A method of manufacturing a non-emissive group III nitride semiconductor device, wherein a growth prevention film is provided between the growth substrate and the non-emissive group III nitride semiconductor laminate and spaced apart from the growth substrate.

(83) A method of manufacturing a non-luminescent Group III nitride semiconductor device in which a source electrode and a gate electrode are provided on a non-luminescent Group III nitride semiconductor laminate, and a conductive material forms a drain electrode.

(84) A method of manufacturing a non-luminescent Group III nitride semiconductor device in which the trench is connected to a non-luminescent Group III nitride semiconductor laminate.

(85) A method of manufacturing a non-luminescent Group III nitride semiconductor device in which the trench is connected to a non-luminescent Group III nitride semiconductor laminate.

(86) At least one of a protrusion formed on the growth substrate and a growth prevention film spaced apart from the growth substrate is provided between the growth substrate and the non-luminescent group III nitride semiconductor stack, and the trench passes through these and continues to the non-luminescent group III nitride semiconductor stack. A method of manufacturing a non-luminescent group III nitride semiconductor device.

(87) A method of manufacturing a group III nitride semiconductor laminate including an uppermost layer, comprising forming a first seed layer on a growth substrate; wherein the first seed layer has a composition that causes the growth substrate to have a downward convex shape. Branching stage; Forming a first layer on the first seed layer; wherein the first layer has a composition that reduces the downward convexity of the growth substrate on which the first seed layer is formed; forming a second layer of a Ga-rich group III nitride semiconductor on the first layer; forming a plurality of protrusions in the second layer; Forming a second seed layer on the second layer on which a plurality of protrusions are formed; wherein the second seed layer has a composition that applies stress toward the downwardly convex shape of the growth substrate on which the second layer having a plurality of protrusions is formed. Branching stage; Forming a stress control layer on the second seed layer; wherein the stress control layer relieves or strengthens stress depending on the bending state of the growth substrate on which the second seed layer is formed to prevent cracking of the laminate after formation of the top layer. Having an Al composition; And, forming a top layer of a Ga-rich group III nitride semiconductor on the stress control layer. Here, Ga-rich means that Ga accounts for more than 50% of the total composition, and Al-rich means that Al accounts for more than 50% of the total composition.

(88) A method of manufacturing a group III nitride semiconductor laminate in which the first seed layer is formed by the MOCVD method.

(89) A method of manufacturing a group III nitride semiconductor laminate in which the first seed layer is made of one of AlN, AlNO, and AlO.

(90) A method of manufacturing a group III nitride semiconductor laminate in which the first layer consists of Al _x Ga _1-x N (0<x<1).

(91) A method for manufacturing a group III nitride semiconductor laminate in which the second layer is made of GaN.

(92) A method of manufacturing a group III nitride semiconductor laminate in which the second seed layer is made of one of AlN, AlNO, and AlO.

(93) A method of manufacturing a group III nitride semiconductor laminate in which the second seed layer is formed by a PVD method.

(94) A method for manufacturing a group III nitride semiconductor laminate where the uppermost layer is made of GaN.

(95) A method of manufacturing a group III nitride semiconductor laminate in which the stress control layer adjusts the Al composition to suppress the occurrence of cracks in the laminate between the second seed layer made of one of AlN, AlNO, and AlO and the top layer made of GaN.

(96) A method of manufacturing a group III nitride semiconductor laminate where the growth substrate is a Si substrate or SiC substrate.

According to a non-light-emitting group III nitride semiconductor stack or device according to the present disclosure, a stack or device having a TDD (Threading Dislocation Density) of 10 ⁷ /cm 2 or less can be implemented.

According to another non-light-emitting group III nitride semiconductor stack or device according to the present disclosure, a JFET with a new type of vertical structure can be implemented.

According to another non-light-emitting group III nitride semiconductor laminate or device according to the present disclosure, a vertically structured JFET having a TDD (Threading Dislocation Density) of 10 ⁷ /cm 2 or less can be implemented.

Protrusions 41, growth substrate 42, first buffer layer 43, growth prevention film 44, second buffer layer 45, channel layer 46, 2DEG 47, interlayer 48, barrier layer (49), cap layer 50, source electrode 51, gate electrode 52, drain electrode 53

Claims (10)

In a method of manufacturing a Group III nitride semiconductor laminate including an uppermost layer,
Forming a first seed layer on a growth substrate, wherein the first seed layer has a composition that causes the growth substrate to have a downwardly convex shape;
Forming a first layer on the first seed layer; wherein the first layer has a composition that reduces the downward convexity of the growth substrate on which the first seed layer is formed;
forming a second layer of a Ga-rich group III nitride semiconductor on the first layer;
forming a plurality of protrusions in the second layer;
Forming a second seed layer on the second layer on which a plurality of protrusions are formed; wherein the second seed layer has a composition that applies stress toward the downwardly convex shape of the growth substrate on which the second layer having a plurality of protrusions is formed. Branching stage;
Forming a stress control layer on the second seed layer; wherein the stress control layer relieves or strengthens stress depending on the bending state of the growth substrate on which the second seed layer is formed to prevent cracking of the laminate after formation of the top layer. Having an Al composition; and,
A method of manufacturing a Group III nitride semiconductor laminate comprising: forming a top layer of a Ga-rich Group III nitride semiconductor on the stress control layer. In claim 1,
A method of manufacturing a group III nitride semiconductor laminate in which the first seed layer is formed by the MOCVD method. In claim 1,
A method of manufacturing a group III nitride semiconductor laminate in which the first seed layer is made of one of AlN, AlNO, and AlO. In claim 3,
A method of manufacturing a group III nitride semiconductor laminate in which the first layer consists of Al _x Ga _1-x N (0<x<1). In claim 1,
A method of manufacturing a group III nitride semiconductor laminate in which the second layer is made of GaN. In claim 1,
A method of manufacturing a group III nitride semiconductor laminate in which the second seed layer is made of one of AlN, AlNO, and AlO. In claim 1,
A method of manufacturing a group III nitride semiconductor laminate in which the second seed layer is formed by a PVD method. In claim 6,
A method of manufacturing a Group III nitride semiconductor laminate in which the uppermost layer is made of GaN. In claim 8,
The stress control layer is a method of manufacturing a group III nitride semiconductor laminate in which the Al composition is adjusted to suppress the occurrence of cracks in the laminate between the second seed layer made of one of AlN, AlNO, and AlO and the top layer made of GaN. The method according to any one of claims 1 to 9,
A method of manufacturing a group III nitride semiconductor laminate where the growth substrate is a Si substrate or SiC substrate.