KR20230148061A - Electronic device including anthena - Google Patents

Abstract

An electronic device according to an embodiment includes a housing including at least one opening, a support member within the housing, a display disposed on the support member, a first printed circuit board including a plurality of layers, and a first printed circuit board. A first wireless communication circuit disposed on one side of the first wireless communication circuit, a power supply structure on the other side of the first printed circuit board electrically connected to the first wireless communication circuit, and a signal provided from the first wireless communication circuit to the housing. and a waveguide configured to transmit to the outside, wherein the waveguide may extend from the feed structure along one side of the support member. Other embodiments are possible.

Description

Electronic device including an antenna {ELECTRONIC DEVICE INCLUDING ANTHENA}

Embodiments to be described later relate to electronic devices including an antenna.

Portable electronic devices such as smart phones and tablet personal computers may establish communication channels with external electronic devices such as base stations or other portable electronic devices. The size of signal transmission loss may vary depending on the type of transmission line for transmitting a signal received from an external electronic device or a signal transmitted to an external electronic device.

A portable electronic device may include an antenna for communication with an external electronic device. For large-capacity or high-speed transmission, demand for antennas supporting ultra-high frequency bands is increasing.

When a signal is transmitted through a transmission line (e.g., a coaxial cable, strip line, or microstrip line), the higher the frequency of the signal, the higher the signal transmission loss can be. A method to reduce signal transmission loss in the ultra-high frequency band is needed.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

According to one embodiment, an electronic device includes a housing including at least one opening, a support member within the housing, a display disposed on the support member, a first printed circuit board within the housing including a plurality of layers, the A first wireless communication circuit disposed on a first side of a first printed circuit board, a power feeding structure on a second side of the first printed circuit board facing the first side electrically connected to the first wireless communication circuit, It may include a first printed circuit board in the housing and a waveguide electrically connected to the first wireless communication circuit through the power feeding structure and configured to transmit a signal provided from the first wireless communication circuit to the outside of the housing. there is. According to one embodiment, the waveguide may extend from the power feeding structure along one side of the support member. According to one embodiment, when the at least one aperture is viewed vertically, the at least one aperture overlaps a cross section of the waveguide, and the first wireless communication circuit, through the at least one waveguide, operates at a frequency of 20 GHz. Signals in a frequency band of 300 GHz or less can be transmitted to or received from an external electronic device.

According to one embodiment, an electronic device includes a housing including at least one opening, a support member within the housing, a display disposed on the support member, a first side, a second side facing the first side, the A plurality of layers disposed between a first side and the second side, a first wireless communication circuit disposed on the first side, and a first power supply structure on the second side electrically connected to the first wireless communication circuit. a first printed circuit board within the housing, a second printed circuit board within the housing comprising a plurality of layers, a first wireless communication circuit disposed on a third side of the second printed circuit board, the first wireless A power feeding structure on a fourth side of the first printed circuit board facing the third side electrically connected to a communication circuit, electrically connected to the first wireless communication circuit through the first power feeding structure, and the first wireless communication circuit. It is electrically connected to the second wireless communication circuit through a first waveguide and the second power feeding structure configured to transmit a signal provided from the wireless communication circuit to the second wireless communication circuit, and receives the signal provided from the second wireless communication circuit. It may include a second waveguide configured to transmit a signal to the outside of the housing. According to one embodiment, the second waveguide may extend from the second power feeding structure along one side of the support member. According to one embodiment, when the at least one opening is viewed perpendicularly, the at least one opening overlaps a cross section of the second waveguide, and the second wireless communication circuit is configured to communicate through the second waveguide, Signals in a frequency band of 20 GHz or more and 300 GHz or less can be transmitted to or received from an external electronic device.

An electronic device according to an embodiment can reduce transmission loss of ultra-high frequency band signals (e.g., communication signals of 20 GHz or higher) by including a waveguide.

The electronic device according to one embodiment can reduce signal distortion or interference by forming a power feeding structure with a conductive pin electrically connected to a wireless communication circuit and a shield can surrounding the conductive pin and into which the waveguide is inserted.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication, according to various embodiments.
FIG. 3 shows one embodiment of the structure of the antenna module described with reference to FIG. 2.
Figure 4 is a diagram showing an electronic device according to an embodiment.
Figure 5 is an exploded perspective view of an electronic device according to an embodiment.
Figure 6 is a graph showing signal loss according to the type and transmission length of the transmission line.
FIG. 7 is a cross-sectional view showing the internal arrangement of an electronic device for supporting 6G network communication, according to an embodiment.
Figure 8 is a side view of a waveguide showing that a phase difference in polarization occurs depending on the structure of the waveguide, according to one embodiment.
FIG. 9A is a block diagram of an electronic device including a waveguide, according to one embodiment.
FIG. 9B is a front view of an electronic device with the waveguide facing the side of the housing, according to one embodiment.
Figure 9C is a front view of an electronic device including a plurality of waveguides, according to one embodiment.
FIG. 9D is a side view of an electronic device with a plurality of waveguides facing one side of a housing, according to one embodiment.
Figure 9E is a side view of the electronic device with the waveguide facing the side of the housing, according to one embodiment.
9F is a perspective view of an electronic device with the waveguide facing the side of the housing, according to one embodiment.
FIG. 10A is a block diagram of an electronic device including a plurality of waveguides, according to an embodiment.
10B and 10C are side views of an electronic device including a plurality of waveguides, according to an embodiment.
11A and 11B are front views of an electronic device with the waveguide facing the display surface, according to one embodiment.
Figure 11C is a side view of the electronic device with the waveguide facing the display surface, according to one embodiment.
Figure 12A is a perspective view of a square waveguide showing polarized waves being transmitted, according to one embodiment.
FIG. 12B is a perspective view of an octagonal waveguide showing polarized waves being transmitted, according to one embodiment.
FIG. 13A is a block diagram of an electronic device including a waveguide and an antenna module, according to one embodiment.
13B is a side view of an electronic device including a waveguide and an antenna module, according to one embodiment.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, the co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. The communication module 190 operates independently of the processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication, according to various embodiments.

Referring to FIG. 2, the electronic device 301 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third RFIC. (226), fourth RFIC (228), first radio frequency front end (RFFE) 232, second RFFE (234), first antenna module 242, second antenna module 244, and antenna 248 ) may include. The electronic device 301 may further include a processor 320 and memory (eg, memory 130 of FIG. 1). The second network 399 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 301 may further include at least one of the components shown in FIG. 3, and the second network 399 may further include at least one other network. According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and second RFFE 234 may form at least a portion of wireless communication module 392. According to another embodiment, the fourth RFIC 228 may be omitted or may be included as part of the third RFIC 226.

The first communication processor 212 may support establishment of a communication channel in a band to be used for wireless communication with the first cellular network 292, and legacy network communication through the established communication channel. According to various embodiments, first cellular network 292 may be a legacy network including second generation (2G), third generation (3G), fourth generation (4G), and/or long term evolution (LTE) networks. there is. The second communication processor 214 establishes a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second cellular network 294, and establishes a 5G network through the established communication channel. Can support communication. According to various embodiments, the second cellular network 294 may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network 294. It can support the establishment of a communication channel and 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed within a processor 320, an auxiliary processor 323 of FIG. 3, or a communication module (and a single chip or a single package). You can.

When transmitting, the first RFIC 222 converts the baseband signal generated by the first communications processor 212 to a frequency range from about 700 MHz to about 700 MHz used in the first cellular network 292 (e.g., a legacy network). It can be converted to a radio frequency (RF) signal of 3GHz. Upon reception, an RF signal is obtained from a first cellular network 292 (e.g., a legacy network) via an antenna (e.g., first antenna module 242) and an RFFE (e.g., first RFFE 232). It can be preprocessed through. The first RFIC 222 may convert the pre-processed RF signal into a baseband signal to be processed by the first communication processor 212.

When transmitting, the second RFIC 224 uses the first communications processor 212 or the baseband signal generated by the second communications processor 214 to a second cellular network 294 (e.g., a 5G network). It can be converted into an RF signal (hereinafter referred to as a 5G Sub6 RF signal) in the Sub6 band (e.g., approximately 6 GHz or less). Upon reception, the 5G Sub6 RF signal is obtained from the second cellular network 294 (e.g., 5G network) via an antenna (e.g., second antenna module 244) and RFFE (e.g., second RFFE 234) ) can be preprocessed. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by a corresponding communication processor of the first communication processor 212 or the second communication processor 214.

The third RFIC 226 converts the baseband signal generated by the second communication processor 214 into a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (e.g., a 5G network). It can be converted to an RF signal (hereinafter referred to as 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be obtained from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and preprocessed via a third RFFE 236. For example, the third RFFE 236 may perform signal preprocessing using a phase shifter 238. The third RFIC 226 may convert the pre-processed 5G Above 6 RF signal into a baseband signal to be processed by the second communication processor 214. According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226.

According to one embodiment, the electronic device 301 may include a fourth RFIC 228 separately from the third RFIC 226 or at least as part of it. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an intermediate frequency (IF)) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz). ) signal, the IF signal can be transmitted to the third RFIC (226). The third RFIC 226 can convert the IF signal into a 5G Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and converted into an IF signal by a third RFIC 226. there is. The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.

According to one example, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least part of a single chip or a single package. According to one example, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to one embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246. For example, the wireless communication module 392 or the processor 320 may be disposed on the first substrate (eg, main PCB). In this case, the third RFIC 226 is located in some area (e.g., bottom surface) of the second substrate (e.g., sub PCB) separate from the first substrate, and the antenna 248 is located in another part (e.g., top surface). is disposed, so that the third antenna module 246 can be formed. According to one embodiment, antenna 248 may include an antenna array that may be used for beamforming, for example. By placing the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce the loss (e.g. attenuation) of signals in the high frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communication by transmission lines. Because of this, the electronic device 301 can improve the quality or speed of communication with the second cellular network 294 (eg, 5G network).

The second cellular network 294 (e.g., 5G network) may operate independently (e.g., Stand-Alone (SA)) or connected to the first cellular network 292 (e.g., legacy network) ( Example: Non-Stand Alone (NSA)). For example, a 5G network may have only an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device 301 may access the access network of the 5G network and then access an external network (eg, the Internet) under the control of the core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in the memory 230 and stored in the memory 230, 320, first communication processor 212, or second communication processor 214).

FIG. 3 shows one embodiment of the structure of the antenna module described with reference to FIG. 2.

300a in FIG. 3 is a perspective view of the third antenna module 246 from one side, and 300b in FIG. 3 is a perspective view of the third antenna module 246 from the other side. 300c of FIG. 3 is a cross-sectional view taken along line A-A' of the third antenna module 246.

Referring to FIG. 3, in one embodiment, the third antenna module 246 includes a printed circuit board 310, an antenna array 330, a radio frequency integrate circuit (RFIC) 352, and a power manage integrate circuit (PMIC). (354), and may include a module interface (not shown). Optionally, the third antenna module 246 may further include a shielding member 390. In other embodiments, at least one of the above-mentioned parts may be omitted, or at least two of the above parts may be formed integrally.

The printed circuit board 310 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 310 may provide electrical connections between the printed circuit board 310 and/or various electronic components disposed externally using wires and conductive vias formed on the conductive layer.

Antenna array 330 (e.g., 248 in FIG. 2) may include a plurality of antenna elements 332, 334, 336, or 338 arranged to form a directional beam. The antenna elements may be formed on the first side of the printed circuit board 310 as shown. According to another embodiment, the antenna array 330 may be formed inside the printed circuit board 310. According to embodiments, the antenna array 330 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shapes or types.

The RFIC 352 (e.g., the third RFIC 226 in FIG. 2) is located in another area of the printed circuit board 310 that is spaced apart from the antenna array 330 (e.g., opposite the first side). It can be placed on the second side). The RFIC 352 may be configured to process signals in a selected frequency band that are transmitted/received through the antenna array 330. According to one embodiment, RFIC 352, when transmitting, baseband signals obtained from a communications processor (e.g., first communications processor 212, second communications processor 214 of FIG. 2) (not shown). can be converted to an RF signal in a designated band. When receiving, the RFIC 352 may convert the RF signal received through the antenna array 330 into a baseband signal and transmit it to the communication processor.

According to another embodiment, the RFIC 352, when transmitting, receives an IF signal (e.g., from about 9 GHz to about 11 GHz) can be up-converted to an RF signal of the selected band. When receiving, the RFIC 352 may down-convert the RF signal obtained through the antenna array 330, convert it into an IF signal, and transmit it to the IFIC.

The PMIC 354 may be disposed in another area (eg, the second surface) of the printed circuit board 310, spaced apart from the antenna array. The PMIC 354 may receive voltage from the main PCB (not shown) and provide the necessary power to various components (e.g., RFIC 352) on the antenna module.

The shielding member 390 may be disposed on a portion (eg, the second surface) of the printed circuit board 310 to electromagnetically shield at least one of the RFIC 352 or the PMIC 354. According to one embodiment, the shielding member 390 may include a shield can.

Although not shown, in various embodiments, the third antenna module 246 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface. The module interface may include a connection member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). Through the connection member, the RFIC 352 and/or PMIC 354 of the third antenna module 246 may be electrically connected to the printed circuit board.

Figure 4 is a diagram showing an electronic device according to an embodiment.

Referring to FIG. 4 , the electronic device 400 according to one embodiment may include a housing that forms the exterior of the electronic device 400. For example, the housing may include a front 400A, a back 400B, and a side 400C surrounding the space between the front 400A and the back 400B. In one embodiment, housing 410 may refer to a structure (e.g., frame structure 440 in FIG. 5) that forms at least a portion of front 400A, back 400B, and/or sides 400C. It may be possible.

The electronic device 400 according to one embodiment may include a substantially transparent front plate 402. In one embodiment, front plate 402 may form at least a portion of front surface 400A. In one embodiment, the front plate 402 may include, but is not limited to, a glass plate including various coating layers, or a polymer plate, for example.

The electronic device 400 according to one embodiment may include a rear plate 411 that is substantially opaque. In one embodiment, the back plate 411 may form at least a portion of the back side 400B. In one embodiment, back plate 411 may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.

The electronic device 400 according to one embodiment may include a side bezel structure (or side member) 418 (eg, the side wall 441 of the frame structure 440 in FIG. 5). In one embodiment, side bezel structure 418 may be combined with front plate 402 and/or back plate 411 to form at least a portion of side 400C of electronic device 400. For example, the side bezel structure 418 may form an entire side 400C of the electronic device 400, and in other examples, the side bezel structure 418 may form the front plate 402 and/or the back plate. Together with 411, it may form the side 400C of the electronic device 400.

Unlike the illustrated embodiment, when the side 400C of the electronic device 400 is partially formed by the front plate 402 and/or the rear plate 411, the front plate 402 and/or the rear plate ( 411 may include a region that is curved from its edge toward the rear plate 411 and/or the front plate 402 and extends seamlessly. The extending area of the front plate 402 and/or the back plate 411 may be, for example, located at both ends of a long edge of the electronic device 400, but according to the above-described example, It is not limited.

In one embodiment, side bezel structure 418 may include metal and/or polymer. In one embodiment, the back plate 411 and the side bezel structure 418 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto. For example, the back plate 411 and the side bezel structures 418 may be formed of separate construction and/or may include different materials.

In one embodiment, the electronic device 400 includes a display 420, an audio module 403, 404, and 407, a sensor module (not shown), a camera module 405, 412, and 413, a key input device 417, It may include at least one of a light emitting device (not shown) and/or a connector hole 408. In another embodiment, the electronic device 400 may omit at least one of the above components (e.g., a key input device 417 or a light emitting device (not shown)) or may additionally include other components.

In one embodiment, display 420 may be visually exposed through a significant portion of front plate 402. For example, at least a portion of display 420 may be visible through front plate 402 forming front surface 400A. In one embodiment, display 420 may be disposed on the back of front plate 402.

In one embodiment, the outer shape of the display 420 may be substantially the same as the outer shape of the front plate 402 adjacent to the display 420. In one embodiment, in order to expand the area to which the display 420 is visually exposed, the distance between the outer edge of the display 420 and the outer edge of the front plate 402 may be formed to be substantially the same.

In one embodiment, the display 420 (or the front 400A of the electronic device 400) may include a screen display area 420A. In one embodiment, the display 420 may provide visual information to the user through the screen display area 420A. In the illustrated embodiment, when the front surface 400A is viewed from the front, the screen display area 420A is shown to be located inside the front surface 400A, spaced apart from the outer edge of the front surface 400A, but is not limited thereto. no. In another embodiment, when the front surface 400A is viewed from the front, at least a portion of an edge of the screen display area 420A may substantially coincide with an edge of the front surface 400A (or the front plate 402).

In one embodiment, the screen display area 420A may include a sensing area 420B configured to obtain the user's biometric information. Here, the meaning of “the screen display area 420A includes the sensing area 420B” can be understood as at least a portion of the sensing area 420B being overlapped with the screen display area 420A. there is. For example, the sensing area 420B, like other areas of the screen display area 420A, can display visual information by the display 420 and can additionally acquire the user's biometric information (e.g., fingerprint). It can mean area. In another embodiment, the sensing area 420B may be formed in the key input device 417.

In one embodiment, the display 420 may include an area where the first camera module 405 is located. In one embodiment, an opening is formed in the area of the display 420, and a first camera module 405 (e.g., a punch hole camera) may be at least partially disposed within the opening to face the front surface 400A. . In this case, the screen display area 420A may surround at least a portion of the edge of the opening. In another embodiment, the first camera module 405 (eg, an under display camera (UDC)) may be placed below the display 420 to overlap the area of the display 420. In this case, the display 420 can provide visual information to the user through the area, and additionally, the first camera module 405 corresponds to the direction toward the front 400A through the area of the display 420. Images can be obtained.

In one embodiment, the display 420 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the strength (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. .

In one embodiment, the audio modules 403, 404, and 407 (e.g., audio module 1270 in FIG. 12) may include microphone holes 403 and 404 and speaker holes 407.

In one embodiment, the microphone holes 403 and 404 may include a first microphone hole 403 formed in a portion of the side 400C and a second microphone hole 404 formed in a portion of the rear 400B. there is. Microphones (not shown) may be placed inside the microphone holes 403 and 404 to acquire external sounds. The microphone may include a plurality of microphones to detect the direction of sound.

In one embodiment, the second microphone hole 404 formed in a portion of the rear surface 400B may be placed adjacent to the camera modules 405, 412, and 413. For example, the second microphone hole 404 may acquire sound according to the operation of the camera modules 405, 412, and 413. However, it is not limited to this.

In one embodiment, the speaker hole 407 may include an external speaker hole 407 and a receiver hole (not shown) for a call. The external speaker hole 407 may be formed on a portion of the side 400C of the electronic device 400. In another embodiment, the external speaker hole 407 and the microphone hole 403 may be implemented as one hole. Although not shown, a receiver hole (not shown) for a call may be formed in another part of the side surface 400C. For example, the receiver hole for a call may be formed on the side opposite to the external speaker hole 407 on the side 400C. For example, based on the illustration in FIG. 1, the external speaker hole 407 is formed on the side 400C corresponding to the lower part of the electronic device 400, and the receiver hole for calls is formed on the upper part of the electronic device 400. It may be formed on the corresponding side (400C). However, it is not limited to this, and in another embodiment, the call receiver hole may be formed in a location other than the side surface 400C. For example, a receiver hole for a call may be formed by a spaced space between the front plate 402 (or display 420) and the side bezel structure 418.

In one embodiment, the electronic device 400 includes at least one speaker (not shown) configured to output sound to the outside of the housing through the external speaker hole 407 and/or the call receiver hole (not shown). can do.

In one embodiment, a sensor module (not shown) (e.g., sensor module 1276 in FIG. 12) generates an electrical signal or data value corresponding to the internal operating state of the electronic device 400 or the external environmental state. can be created. For example, the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.

In one embodiment, the camera modules 405, 412, and 413 (e.g., the camera module 180 in FIG. 1) include a first camera module 405 disposed to face the front 400A of the electronic device 400. , a second camera module 412 disposed to face the rear 400B, and a flash 413.

In one embodiment, the second camera module 412 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera). However, the second camera module 412 is not necessarily limited to including a plurality of cameras and may include one camera.

In one embodiment, the first camera module 405 and the second camera module 412 may include one or more lenses, an image sensor, and/or an image signal processor.

In one embodiment, flash 413 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 400.

In one embodiment, the key input device 417 may be placed on the side 400C of the electronic device 400. In other embodiments, the electronic device 400 may not include some or all of the key input devices 417, and the key input devices 417 that are not included may be in other forms, such as soft keys, on the display 420. It can be implemented as:

In one embodiment, the connector hole 408 may be formed on the side 400C of the electronic device 400 to accommodate a connector of an external device. A connection terminal electrically connected to a connector of an external device may be disposed within the connector hole 408. The electronic device 400 according to one embodiment may include an interface module for processing electrical signals transmitted and received through the connection terminal.

In one embodiment, the electronic device 400 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the front 400A of the housing. The light emitting device (not shown) may provide status information of the electronic device 400 in the form of light. In another embodiment, the light emitting device (not shown) may provide a light source linked to the operation of the first camera module 405. For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Figure 5 is an exploded perspective view of an electronic device according to an embodiment.

Hereinafter, overlapping descriptions of components having the same reference numerals as the above-described components will be omitted.

Referring to FIG. 5, the electronic device 400 according to one embodiment includes a frame structure 440, a first printed circuit board 450, a second printed circuit board 452, a cover plate 460, and a battery. It may include (470).

In one embodiment, the frame structure 440 includes a side wall 441 that forms the exterior of the electronic device 400 (e.g., side 400C in FIG. 1) and a support portion extending inward from the side wall 441. It may include (443). In one embodiment, frame structure 440 may be disposed between display 420 and back plate 411. In one embodiment, sidewalls 441 of frame structure 440 may surround the space between rear plate 411 and front plate 402 (and/or display 420), and frame structure 440 The support portion 443 may extend from the side wall 441 within the space.

In one embodiment, frame structure 440 may support or accommodate other components included in electronic device 400. For example, the display 420 may be placed on one side of the frame structure 440 facing in one direction (e.g., +z direction), and the display 420 may be disposed on the support portion 443 of the frame structure 440. It can be supported by . For another example, a first printed circuit board 450, a second printed circuit board 452, and a battery 470 are placed on the other side of the frame structure 440 facing in a direction opposite to the one direction (e.g., -z direction). ), and the second camera module 412 may be disposed. The first printed circuit board 450, the second printed circuit board 452, the battery 470, and the second camera module 412 are attached to the side wall 441 and/or the support portion 443 of the frame structure 440. Each can be seated in a recess defined by

In one embodiment, the first printed circuit board 450, the second printed circuit board 452, and the battery 470 may each be combined with the frame structure 440. For example, the first printed circuit board 450 and the second printed circuit board 452 may be fixed to the frame structure 440 through a coupling member such as a screw. For example, the battery 470 may be fixed to the frame structure 440 through an adhesive member (eg, double-sided tape). However, it is not limited to the above-described examples.

In one embodiment, the cover plate 460 may be disposed between the first printed circuit board 450 and the back plate 411. In one embodiment, a cover plate 460 may be disposed on the first printed circuit board 450. For example, the cover plate 460 may be disposed on a side of the first printed circuit board 450 facing the -z direction.

In one embodiment, the cover plate 460 may at least partially overlap the first printed circuit board 450 with respect to the z-axis. In one embodiment, the cover plate 460 may cover at least a portion of the first printed circuit board 450 . Through this, the cover plate 460 protects the first printed circuit board 450 from physical shock or the connector coupled to the first printed circuit board 450 (e.g., connector 34 in FIG. 3) is separated. can be prevented.

In one embodiment, the cover plate 460 is fixedly disposed on the first printed circuit board 450 through a coupling member (e.g., screw), or is coupled with the first printed circuit board 450 through the coupling member. Can be coupled to frame structure 440.

In one embodiment, display 420 may be disposed between frame structure 440 and front plate 402. For example, the front plate 402 may be disposed on one side (e.g., +z direction) of the display 420, and the frame structure 440 may be disposed on the other side (e.g., -z direction).

In one embodiment, front plate 402 may be coupled with display 420. For example, the front plate 402 and the display 420 may be adhered to each other through an optical adhesive member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

In one embodiment, front plate 402 may be coupled with frame structure 440. For example, the front plate 402 may include an outer portion that extends outside the display 420 when viewed in the z-axis direction, and the outer portion of the front plate 402 and the frame structure 440 ( For example, it may be adhered to the frame structure 440 through an adhesive member (eg, double-sided tape) disposed between the side walls 441). However, it is not limited to the above-mentioned example.

In one embodiment, the first printed circuit board 450 and/or the second printed circuit board 452 may be equipped with a processor, memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communications processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 400 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector. In one embodiment, the first printed circuit board 450 and the second printed circuit board 452 may be operatively or electrically connected to each other through a connecting member (eg, a flexible printed circuit board).

In one embodiment, battery 470 may supply power to at least one component of electronic device 400. For example, the battery 470 may include a rechargeable secondary battery or fuel cell. At least a portion of the battery 470 may be disposed on substantially the same plane as the first printed circuit board 450 and/or the second printed circuit board 452.

The electronic device 400 according to one embodiment may include an antenna module (not shown). In one embodiment, the antenna module may be disposed between the rear plate 411 and the battery 470. The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna module may perform short-distance communication with an external device or wirelessly transmit and receive power to and from an external device.

In one embodiment, the first camera module 405 (e.g., a front camera) has a lens that covers some area (e.g., camera area 437) of the front plate 402 (e.g., front side 400A in FIG. 1). It may be disposed on at least a part of the frame structure 440 (eg, the support portion 443) to receive external light through the frame structure 440.

In one embodiment, a second camera module 412 (e.g., a rear camera) may be disposed between the frame structure 440 and the rear plate 411. In one embodiment, the second camera module 412 may be electrically connected to the first printed circuit board 450 through a connection member (eg, connector). In one embodiment, the second camera module 412 may be positioned so that the lens can receive external light through the camera area 484 of the rear plate 411 of the electronic device 400.

In one embodiment, the camera area 484 may be formed on the surface of the back plate 411 (eg, the back side 400B in FIG. 1). In one embodiment, the camera area 484 may be formed to be at least partially transparent to allow external light to enter the lens of the second camera module 412. In one embodiment, at least a portion of the camera area 484 may protrude from the surface of the back plate 411 at a predetermined height. However, it is not limited to this, and in another embodiment, the camera area 484 may form substantially the same plane as the surface of the rear plate 411.

In one embodiment, the housing of the electronic device 400 may refer to a configuration or structure that forms at least part of the exterior of the electronic device 400. In this regard, at least some of the front plate 402, frame structure 440, and/or back plate 411 that form the exterior of the electronic device 400 may be referred to as the housing of the electronic device 400. .

Figure 6 is a graph showing signal loss according to the type and transmission length of the transmission line.

Referring to FIG. 6, the vertical axis of the graph 650 indicates the size of the signal according to frequency when the signal is transmitted through a transmission line inside an electronic device (e.g., the electronic device 400 of FIG. 3). The horizontal axis of the graph 650 represents the frequency of the signal transmitted within the electronic device 400. The size of the signal shown in the graph 650 may mean the ratio of the output signal to the size of the input signal.

Referring to graph 650, signal loss may vary depending on the type of transmission line. Signal loss may be the difference between the size of the input signal and the size of the output signal. Graph 651 represents the output signal magnitude of a strip transmission line. Graph 652 represents the output signal magnitude of a microstrip transmission line. Graph 653 represents the output signal size of the waveguide.

A strip transmission line may have greater transmission loss than a microstrip transmission line. The waveguide may have less transmission loss than the strip transmission line and the microstrip transmission line in a specific frequency band (e.g., 100 GHz or higher).

Graph 651-1, graph 652-1, and graph 653-1 represent signal loss with a signal transmission length of 25 (mm). Graph 651-2, graph 652-2, and graph 653-1 represent signal loss with a signal transmission length of 50 (mm). Graph 651-3, graph 652-3, and graph 653-3 represent signal loss with a signal transmission length of 130 (mm). Referring to the graphs 651 and 652, signal loss may increase as the signal transmission length increases. According to one embodiment, as the signal transmission length becomes longer, the transmission loss of signals transmitted through the microstrip line and strip line may increase. For example, the transmission loss of the strip transmission line and the microstrip transmission line may be less for a 25 (mm) transmission line than for a 50 (mm) transmission line.

Referring to the graphs 651 and 652, signal loss may vary depending on the frequency of the transmission signal. For example, the transmission loss of the strip transmission line and the microstrip transmission line may be less for a 50 GHz signal than for a 100 GHz signal. Transmission loss of the strip transmission line and the microstrip transmission line may increase as the frequency increases.

Referring to the graph 653, the waveguide can maintain transmission loss in a specific frequency band (eg, 100 GHz or higher) regardless of the length of the transmission line and the frequency of the transmission signal. For example, graph 653-1, graph 653-2, and graph 653-3 may have substantially the same signal loss.

According to one embodiment, the waveguide can transmit signals in the frequency band (eg, 100 (GHz) to 300 (GHz)) used in 6G network communication. For example, the waveguide is placed inside the electronic device 400 that supports 6G network communication, and can transmit or receive signals for 6G network communication to an external electronic device.

According to one embodiment, the waveguide may have small restrictions on the length of the signal transmission path inside the electronic device 400. Even if the signal is transmitted to the outside through a side that is far away from the printed circuit board on which the communication module is placed, signal transmission loss may be small.

In the band below 30 GHz, the size of the square waveguide is required to be larger than 7.11 mm * 3.56 mm (cutoff frequency 21.097 GHz, EIA notation WR-28), making it difficult to place it inside narrow electronic devices. The required cross-sectional area of the waveguide may decrease as the frequency of the transmitted signal increases. In electronic devices that support bands of 100 GHz or higher, the size of the waveguide can be reduced, so the waveguide can be placed inside the electronic device. For example, the size of the square waveguide required in the frequency band above 100GHz may be smaller than 1.7mm * 0.83mm (cutoff frequency 90.909GHz, EIA notation WR-7).

According to one embodiment, since the size of the waveguide for transmitting high-frequency signals is small, the electronic device can provide space for the arrangement of the waveguide for transmitting signals with a frequency of 100 GHz or more.

FIG. 7 is a cross-sectional view showing the internal arrangement of an electronic device for supporting 6G network communication, according to an embodiment.

Referring to FIG. 7, an electronic device (e.g., electronic device 400 in FIG. 4) includes a housing (e.g., housing 410 in FIG. 4), a support member 700, a display 420, and a waveguide 600. and a printed circuit board 500. The printed circuit board 500 may include a wireless communication circuit 501, layers 502, and a power feeding structure 503.

According to one embodiment, the support member 700 may form a part of the housing 410 and may support internal components of the electronic device 400. The support member 700 may be a frame structure (eg, frame structure 440 in FIG. 5) for supporting internal components. The support member 700 may be disposed inside the electronic device 400 and supported by the side of the housing 410 (eg, the side 400C in FIG. 4 ). The support member 700 is formed integrally with the side 400C of the housing 410, such as the frame structure 440 of FIG. 4, or is separated from the side 400C of the housing 410 and is located inside the housing 410. It may be a structure placed in space. The support member 700 may be an internal case of the electronic device 400. For example, the support member 700 may partition the internal space of the electronic device 400.

According to one embodiment, the support member 700 may include a material having rigidity and may support the display 420. For example, the support member 700 may be a structure made of metal and may form part of the front side of the housing 410 (e.g., the front side 400A or the back side 400B in FIG. 4). The support member ( 700 may support the display 420. The display 420 may be disposed on one side of the support member 700. The support member 700 is formed of a conductive material, and the display 420 generates energy. It may function as a heat dissipating member that transmits heat and radiates it to the outside, or as a ground, but the material of the support member 700 is not limited to this.

According to one embodiment, the support member 700 may support the waveguide 600. For example, the waveguide 600 may be placed on one surface of the support member 700. The waveguide 600 may be attached to the support member 700 through fusion, adhesive material, or adhesive tape. For another example, the support member 700 and the waveguide 600 may be formed integrally. Waveguide 600 may form part of support member 700 .

According to one embodiment, a portion of the waveguide 600 extends within the support member 700 along one side of the support member 700, and the remainder extends from one side of the support member 700 to the printed circuit board 500. Alternatively, it may be extended to an antenna (e.g., antenna 248 in FIG. 2). For example, a portion of the waveguide 600 is formed integrally with the support member 700 along one side of the support member 700, and the remainder is formed from one side of the support member 700 to the printed circuit board 500. It may extend to the second side 500B.

According to one embodiment, the support member 700 may include an opening or recess for supporting components of the electronic device 400. For example, the support member 700 is integrated with the housing 410, such as the frame structure 440, and the antenna is formed on the side wall of the frame structure 440 (e.g., the side wall 441 in FIG. 4) and/or It may be seated in a recess defined by a support portion (e.g., support portion 443 in FIG. 4).

According to one embodiment, the waveguide 600 may be placed inside the housing 410.

The waveguide 600 disposed within the housing 410 may have a constant cross-sectional shape. The first polarized wave and the second polarized wave orthogonal to the first polarized wave may cross each other while passing through a circular waveguide. The circular waveguide may have a circular cross-section and a constant diameter.

According to one embodiment, one end of the waveguide 600 is connected to at least one processor (e.g., processor 120 in FIG. 1, first communication processor 212, or second communication processor 214 in FIG. 2). In order to transmit or receive signals, it can be coupled to a portion of the printed circuit board 500. The printed circuit board 500 has a feeding structure for transmitting a signal from the communication processor in the electronic device 400 to the antenna module (e.g., the third antenna module 246 in FIG. 2) in the electronic device 400. ) may include (503). The first end of the waveguide 600 may be coupled to a portion of the printed circuit board 500 where a power supply signal is emitted in order to receive a signal. For example, the wireless communication circuit 501 on the first side 500A of the printed circuit board 500 may be electrically connected to the power feeding structure 503. The power feeding structure 503 is disposed on the second surface 500B of the printed circuit board 500 and can feed the signal received from the wireless communication circuit 501 to the waveguide 600. One end of the waveguide 600 may be connected to the power feeding structure 503 disposed on the second surface 500B of the printed circuit board 500.

According to one embodiment, the second end of the waveguide 600 may be connected to an antenna module in order to transmit or receive a wireless communication signal from one end of the waveguide 600 to an external electronic device. For example, the antenna module may be placed on the inner side 400C of the housing 410. In FIG. 13A, the connection structure between the antenna module disposed on the side of the housing 410 and the waveguide 600 will be described later.

According to one embodiment, the printed circuit board 500 may be connected to a wireless communication circuit 501 configured to feed power to the waveguide 600. The printed circuit board 500 may further include a communication processor to support wireless network communication. According to one embodiment, the wireless communication circuit 501 transmits a down-converted signal to the communication processor or receives a signal from the communication processor and up-converts the IFIC (e.g., It can operate as the fourth RFIC (228) of FIG. 2. The IFIC may up-convert a baseband signal (hereinafter referred to as baseband signal) generated by the communication processor into an intermediate frequency signal (hereinafter referred to as intermediate frequency signal). The IFIC can down-convert the intermediate frequency signal received from the waveguide 600 into a baseband signal and transmit it to the communication processor. According to one embodiment, the wireless communication circuit 501 may operate as an RFIC that transmits a down-converted signal to the IFIC or up-converts a signal received from the IFIC. The RFIC up-converts the intermediate frequency signal received from the IFIC into an RF frequency signal (hereinafter referred to as an RF signal) and transmits the RF signal to a cellular network outside the electronic device 400 through the antenna of the electronic device 400. (e.g., the second cellular network 294 of FIG. 2) (e.g., 6G network) or may be transmitted to an external electronic device. The RFIC may down-convert an RF signal received from a cellular network external to the electronic device 400 or an external electronic device into an intermediate frequency signal and transmit it to the IFIC.

According to one embodiment, the electronic device 400 has been described as including an IFIC and an RFIC, but the IFIC of the electronic device 400 may be omitted. For example, the wireless communication circuit 501 may operate as an RFIC. The wireless communication circuit 501 may up-convert the baseband signal received from the communication processor and transmit it to an external electronic device through the waveguide 600. The wireless communication circuit 5010 may down-convert the RF signal received through the waveguide 600 and transmit it to the communication processor.

According to one embodiment, the printed circuit board 500 may include a plurality of layers 502. For example, the printed circuit board 500 may include a plurality of layers 502 disposed between the first surface 500A and the second surface 500B. The first side 500A may face the wireless communication circuit 501, and the second side 500B may face the waveguide 600 and the power feeding structure 503. Layers 502 may include a conductive via 502a passing through layers 502 and carrying signals provided from wireless communication circuitry 501 . The conductive via 502a may connect the power supply structure 503 and the wireless communication circuit 501. The wireless communication circuit 501 is disposed on the first surface 500A and may transmit a signal to the power feeding structure 503 through the conductive via 502a. The power feeding structure 503 may feed the communication signal to the waveguide 600 coupled to the second surface 500B.

According to one embodiment, the printed circuit board 500 may be electrically connected to the wireless communication circuit 501 and the power feeding structure 503. The wireless communication circuit 501 disposed on the first side 500A of the printed circuit board 500 may be connected to the power feeding structure 503 through the conductive via 502a of the printed circuit board 500. The wireless communication signal may be fed to the waveguide 600 disposed on the second surface 500B through the power feeding structure 503. One end of the waveguide 600 may be inserted and coupled to a portion of the power feeding structure 503 disposed on the second surface 500B to which the wireless communication signal is fed.

According to one embodiment, the power feeding structure 503 may include a conductive pin 503a and a shield can 503b. The conductive pin 503a can receive a signal from the wireless communication circuit 501 and transmit the received signal to the waveguide 600. For example, the conductive pin 503a may be electrically connected to the wireless communication circuit 501 disposed on the first side 500A of the printed circuit board 500 through the conductive via 502a. The conductive pin 503a protrudes from the second surface 500B of the printed circuit board 500 and can feed the signal transmitted from the wireless communication circuit 501 to the waveguide 600.

According to one embodiment, the shield can 503b may surround the conductive pin 503a. The cross section of the shield can 503b may be shaped to correspond to the cross section of the waveguide 600 in order to insert the waveguide 600. The shield can 503b may be disposed on the second side 500B of the printed circuit board 500 on which the waveguide 600 is disposed. The conductive pin 503a may protrude from the second side 500B of the printed circuit board 500. The shield can 503b may provide a structure for coupling the waveguide 600 to the printed circuit board 500.

According to one embodiment, the first end of the shield can 503b is in contact with the second surface 500B of the printed circuit board 500 and surrounds the conductive pin 503a, and the second end of the shield can 503b is a waveguide ( 600) can be accommodated.

According to one embodiment, the shield can 503b may be made of at least one of stainless used steel (SUS) or nickel-plated metal in order to reduce signal loss fed to the waveguide 600.

According to one embodiment, when assembling the electronic device 400, a portion of the waveguide 600 may be inserted into the shield can 503b disposed on the printed circuit board 500. For example, the assembled electronic device 400 can be joined by pressing the waveguide 600 and the shield can 503b.

According to one embodiment, the signal fed to the waveguide 600 by the conductive pin 503a may be transmitted to the antenna module through the waveguide 600. For example, the conductive pin 503a may protrude from the second side 500B of the printed circuit board 500. One end of the waveguide 600 connected to the power feeding structure 503 disposed on the second surface 500B may include a portion of the second surface 500B from which the conductive fin 503a protrudes. there is. The other end of the waveguide 600 may be connected to the antenna module of the electronic device 400.

According to the above-described embodiment, the waveguide 600 may provide a signal line for transmitting communication signals for a 6G network within the electronic device 400. Since the waveguide 600 is included in a part of the housing 410, the efficiency of the internal space of the electronic device 400 can be increased. The shield can 503b included in the feeding structure 503 reduces the loss of the signal fed into the waveguide 600 and provides a structure through which the waveguide 600 can be coupled to the feeding structure 503. You can. The transmission loss of a signal in the 100 GHz or higher band transmitted through the waveguide 600 may be smaller than the transmission loss of a signal in the 100 GHz or higher band through a microstrip or strip line. The waveguide 600 for transmitting signals of 100 GHz or higher can be miniaturized so that it can be placed inside an electronic device.

Figure 8 is a side view of a waveguide showing that a phase difference in polarization occurs depending on the structure of the waveguide, according to one embodiment.

Referring to FIG. 8 , at least a portion of the waveguide 600 may be supported by the support member 700 or may be a part of the support member 700. The remaining part, distinct from the above part, of the waveguide 600 may extend from one side of the support member 700 in a direction toward the printed circuit board 500 or the antenna to transmit the supplied signal 550. there is. For example, the waveguide 600 may be bent from the support member 700 toward the printed circuit board 500 or the antenna.

The waveguide 600 may include a corner area 600C to transmit signals to the outside of the electronic device 400. For example, in order to be connected to an electronic component (e.g., an antenna module or a printed circuit board) spaced apart from the support member 700 in a direction perpendicular to the direction in which the waveguide 600 extends, the waveguide 600 has a corner Can include areas. A portion of the waveguide 600 may be included in the support member 700 having substantially the same thickness.

According to one embodiment, the plurality of signals 550-1 and 550-2 transmitted through the waveguide 600 including the corner area 600C are transmitted through different transmission paths within the waveguide 600. You can. For example, among the plurality of signals 550-1 and 550-2, the first signal (e.g., first polarization 550-1) is stronger than the second signal (e.g., second polarization 550-2). Signals can be transmitted over long paths. While the plurality of signals 550-1 and 550-2 fed with the same phase pass through the waveguide 600, the phases of each of the plurality of signals 550-1 and 550-2 may be different from each other. there is. A first polarized wave (550-1) may be fed to the first edge of one end of the waveguide 600, and a second polarized wave (550-2) may be fed to the second edge of one end of the waveguide 600. there is. The first polarized wave 550-1 and the second polarized wave 550-2 may be fed in the same phase, cross each other perpendicularly, and pass through the inside of the waveguide 600. The corner area 600C of the waveguide 600 may change the length and shape of the path of the first polarized wave 550-1, thereby generating a phase difference with the second polarized wave 550-2. Due to the phase difference, synchronization of the plurality of signals 550-1 and 550-2 transmitted through the waveguide 600 may be required. According to one embodiment, the electronic device 400 includes a phase converter. (For example, the phase converter 238 of FIG. 2) may be included. The phase converter 238 can equally adjust the phases of a plurality of signals that vary due to the structure of the waveguide 600 (e.g., corner area 600C). The phase shifter 238 may be included in a wireless communication circuit (eg, the wireless communication circuit 501 of FIG. 7) of the electronic device 400. For example, a communication signal may be transmitted from a first printed circuit board containing wireless communication circuitry operating as a communication processor or IFIC, through waveguide 600 to a second printed circuit board containing wireless communication circuitry operating as an RFIC. can be passed on. Since the waveguide 600 includes at least one corner area 600C, signals including a plurality of polarized waves may have different phases. The wireless communication circuit disposed on the second printed circuit board and operating with the RFIC may further include a phase converter 238 that synchronizes the phase difference.

According to one embodiment, the plurality of signals 550-1 and 550-2 may be totally reflected when passing through the waveguide 600. Each of the plurality of signals may be adjusted so that the initial incident angle of each of the plurality of signals is greater than the critical angle when fed into the waveguide 600 in order to be totally reflected. For example, the first incident angle of the first polarized wave 550-1 ( ) is greater than the critical angle within the waveguide 600 of the first polarized wave 550-1, and the second incident angle of the second polarized wave 550-2 ( ) may be greater than the critical angle within the waveguide 600 of the second polarized wave 550-2.

According to one embodiment, a plurality of signals 550-1 and 550-2 transmitted by total reflection through the waveguide 600 including the corner area 600C are transmitted through different transmission paths within the waveguide 600. It can be delivered. Due to the changed transmission path, a phase difference may occur between the plurality of signals 550-1 and 550-2. For example, the first polarized wave 550-1 and the second polarized wave 550-2 may be fed in the same phase, cross each other perpendicularly, be totally reflected, and pass through the inside of the waveguide 600. The corner area 600C of the waveguide 600 may change the length and shape of the path of the first polarized wave 550-1, thereby generating a phase difference with the second polarized wave 550-2. Due to the phase difference, synchronization of the plurality of signals 550-1 and 550-2 transmitted through the waveguide 600 may be necessary. The phase shifter 238 may provide the plurality of signals 550-1 and 550-2 with reduced phase differences or synchronization. According to the above-described embodiment, the electronic device 400 includes the phase shifter 238. ), it is possible to synchronize signals that have a phase difference due to the corner area (600C).

FIG. 9A is a block diagram of an electronic device including a waveguide, according to one embodiment.

Referring to FIG. 9A, the electronic device 400 includes a printed circuit board 500, a communication processor 505, a first wireless communication circuit 511, a second wireless communication circuit 521, and a waveguide inside the housing 410. It may include (600).

According to one embodiment, the communication processor 505, the first wireless communication circuit 511, and the second wireless communication circuit 521 may be disposed on the first side 500A of the printed circuit board 500. The first wireless communication circuit 511 operates as an IFIC (e.g., the fourth RFIC 228 in FIG. 2) that transmits a down-converted signal to the communication processor 505 or receives a signal from the communication processor and up-converts it. can do. The second wireless communication circuit 521 may operate as an RFIC that transmits a down-converted signal to the first wireless communication circuit 511 or up-converts a signal received from the first wireless communication circuit 511. .

According to one embodiment, the baseband signal generated by the communication processor 505 is transmitted through a transmission line (e.g., strip line, microstrip line) included in the printed circuit board 500, through a first wireless communication circuit ( 511). The first wireless communication circuit 511 may up-convert the baseband signal generated by the communication processor into an intermediate frequency signal. The first wireless communication circuit 511 can down-convert the intermediate frequency signal received from the second wireless communication circuit 521 into a baseband signal and transmit it to the communication processor 505 through a transmission line.

According to one embodiment, the intermediate frequency signal up-converted by the first wireless communication circuit 511 is transmitted to the second wireless communication circuit 521 through a transmission line included in the printed circuit board 500. You can. The second wireless communication circuit 521 up-converts the intermediate frequency signal transmitted from the first wireless communication circuit 511 into an RF signal (e.g., 20 (GHz) to 300 (GHz)) and transmits it to the waveguide 600. It can be delivered. The second wireless communication circuit 521 down-converts the RF signal transmitted from the antenna of the electronic device 400 through the waveguide 600 into an intermediate frequency signal and transmits it to the first wireless communication circuit 511 through a transmission line. It can be passed on.

According to one embodiment, the first wireless communication circuit 511 operating as an IFIC may be omitted. For example, the second wireless communication circuit 521 may up-convert the baseband signal received from the communication processor 505 into an RF signal. The second wireless communication circuit 521 may receive an RF signal from the waveguide 600 and down-convert the received RF signal into a baseband signal. The baseband signal may be transmitted to the communication processor 505 through a transmission line.

According to one embodiment, the communication processor 505 may generate the plurality of signals to have a constant phase difference in order to match the phases of the plurality of signals transmitted through the waveguide 600 and delivered to the outside. . For example, due to the structure of the waveguide 600 (eg, corner area 600C in FIG. 8), a phase difference may occur between a plurality of signals. The second wireless communication circuit 521 transmits a signal to the waveguide 600 by varying the phases of the plurality of signals by the phase difference of the signal transmitted to the outside of the electronic device 400 through the waveguide 600. You can. As the plurality of signals are transmitted to the waveguide 600 with different phases, the phases of the plurality of signals transmitted from the waveguide 600 to the outside of the electronic device 400 may be the same.

According to one embodiment, the second wireless communication circuit 521 may include a phase shifter (eg, phase shifter 238 in FIG. 2). The phase converter 238 may adjust the phases of a plurality of signals that may vary due to the structure of the waveguide 600 (eg, corner area 600C). Considering the path that varies depending on the shape of the waveguide 600, each signal can be transmitted to the waveguide 600 with a different phase. The phase converter 238 may be configured to transmit signals having the same phase to the outside of the electronic device 400.

According to one embodiment, the waveguide 600 transmits a signal of 20 GHz or higher supplied from the second wireless communication circuit 521 to an antenna (e.g., the antenna 238 in FIG. 2) or an antenna module ( Example: It may be configured to transmit to the third antenna module 236 of FIG. 2). For example, one end of the waveguide 600 is a second end facing the first side 500A on which the second wireless communication circuit 521 is disposed, in order to feed a signal from the second wireless communication circuit 521. It may be connected to a power feeding structure (eg, feeding structure 503 in FIG. 7) disposed on the surface 500B. The other end of the waveguide 600 may be connected to an antenna disposed on the inner side of the housing 410 of the electronic device 400 (eg, the side 400C in FIG. 4). The waveguide 600 may extend from one end connected to the power feeding structure 503 to an antenna disposed on the inner side 400C of the housing 410.

According to one embodiment, the antenna may be an aperture antenna. The housing 410 of the electronic device 400 includes at least one opening 419 corresponding to the aperture antenna for transmitting or receiving a wireless communication signal to or from an external electronic device. can do. The aperture antenna transmits a signal fed from one end of the waveguide 600 to an external electronic device, or receives a signal transmitted from an external electronic device, and the other end of the waveguide 600 and the at least one opening. It can be placed between (419). To operate as the aperture antenna, a portion of the housing 410 may be removed. According to one embodiment, the aperture antenna may be connected to the cross section of the waveguide 600 or may be formed integrally with it. In order to reduce distortion or damage to communication signals, the aperture antenna and the waveguide 600 may be made of the same material.

According to one embodiment, at least one opening 419 may be formed in the housing 410. At least one opening 419 may be formed into a plurality of openings 419 according to the frequency of use. At least one opening 419 may overlap a cross section of one end of the antenna connected to the waveguide 600 and the other end of the antenna facing the other end. A wireless communication signal passing through the waveguide 600 may be transmitted to the outside of the electronic device 400 through the antenna and the at least one opening 419.

9B is a front view of an electronic device with the waveguide facing the side of the housing, according to one embodiment. Figure 9C is a front view of an electronic device including a plurality of waveguides, according to one embodiment. FIG. 9D is a side view of an electronic device with a plurality of waveguides facing one side of a housing, according to one embodiment. Figure 9E is a side view of the electronic device with the waveguide facing the side of the housing, according to one embodiment. 9F is a perspective view of an electronic device with the waveguide facing the side of the housing, according to one embodiment.

Hereinafter, overlapping descriptions of components having the same reference numerals as the above-described components will be omitted.

Referring to FIG. 9B , the electronic device 400 may include a housing 410, a support member 700, a waveguide 600, and a printed circuit board 500.

According to one embodiment, support member 700 may be part of housing 410. For example, the support member 700 may be disposed inside the electronic device 400 to support a display (eg, display 420 of FIG. 4). The support member 700 may be integrated with a side of the housing 410 of the electronic device 400 (e.g., the side 400C of FIG. 4 ) and extend to the side 400C.

According to one embodiment, the waveguide 600 may extend to at least one of the side surfaces 400C of the housing 410. The waveguide 600 may be included in the support member 700 that forms part of the housing 410. One end of the waveguide 600 may be connected to a power feeding structure 503 disposed on one side of the printed circuit board 500 for wireless communication signal transmission. Regardless of the distance and direction from one end of the waveguide 600 to one of the sides 400C of the housing 410, the waveguide 600 is directed to one of the sides 400C of the housing 410. It may be extended.

According to one embodiment, the plurality of waveguides 601, 602, 603, and 604 extend the side 400C of the housing 410 from the power feeding structure 503 disposed on one side of the printed circuit board 500. can be extended towards. The plurality of waveguides 601, 602, 603, and 604 may have different directions in which each waveguide extends toward the side 400C of the housing 410.

The housing 410 has a first side 400C-1 facing a first direction, a second side 400C-2 facing the first side 400C-1, and a first side 400C-1. A third side (400C-3) is perpendicular to and disposed between the first side (400C-1) and the second side (400C-2), and a fourth side facing the third side (400C-3) It may include a side (400C-4).

For example, some 601 of the plurality of waveguides 600 are directed toward the first side 400C-1, and the remaining portion 603 of the plurality of waveguides 600 are directed toward the third side (400C-1). 400C-3). However, it is not limited to this, and each of the waveguides 600 is one of the first side (400C-1), the second side (400C-2), the third side (400C-3), or the fourth side (400C-4). It can extend towards at least one. For example, the waveguide 601 directed to the first side 400C-1 may transmit a first signal, and the waveguide 602 directed to the second side 400C-2 may transmit a second signal, The waveguide 603 heading toward the third side 400C-3 can transmit a third signal, and the waveguide 604 toward the fourth side 400C-4 can transmit a fourth signal. According to one embodiment, the waveguides 601, 602, 603, and 604 transmitting each signal may be supplied with power from a plurality of wireless communication circuits.

Referring to FIGS. 9C and 9D, waveguides 601a, 601b, 601c, and 601d may extend to the first side 400C-1. According to one embodiment, the plurality of waveguides 601a, 601b, 601c, and 601d may transmit the same signal to the first side 400C-1. Waveguides 601a, 601b, 601c, and 601d may form an aperture antenna array. For example, the waveguides 601a, 601b, 601c, and 601d extend toward the first side 400C-1, and the ends of the waveguides 601a, 601b, 601c, and 601d extend toward the first side 400C-1. 1) can be placed. The first side 400C-1 of the housing 410 may include a non-conductive material 410a. When looking at the first side 400C-1, the non-conductive material 410a may overlap the ends of the waveguides 601a, 601b, 601c, and 601d. The ends of the waveguides 601a, 601b, 601c, and 601d may be spaced apart from each other. The electronic device 400 may provide directional electromagnetic waves through the antenna array formed through ends of spaced apart waveguides 601a, 601b, 601c, and 601d facing the first side 400C-1. For example, electromagnetic waves emitted from a plurality of antenna arrays may form a beam.

According to one embodiment, a waveguide supporting an ultra-high frequency band of 100 GHz or more has a small cross-sectional area, so the efficiency of the space for mounting the waveguides can be increased. According to the increased space efficiency, the electronic device may include a plurality of devices extending from the wireless communication circuit 501 toward one side (e.g., the first side 400C-1) of the side surfaces 400C of the electronic device 400. waveguides can be arranged, and signals with directivity can be provided through the plurality of arranged waveguides.

Referring to FIGS. 9E and 9F , the display 420 may be disposed and supported in at least a partial area of the support member 700. The support member 700 may be disposed inside the electronic device 400 and supported by the side of the housing 410 (eg, the side 400C in FIG. 4 ). The support member 700 may be formed integrally with the side 400C of the housing 410, such as the frame structure 440 of FIG. 4.

According to one embodiment, a portion of the waveguide 600 extends within the support member 700 along one side of the support member 700 toward the side 400C of the housing 410, and the remainder extends within the support member 700. ) may extend from one side of the printed circuit board 500 or an antenna (e.g., the antenna 248 in FIG. 2). For example, the support member 700 may be formed integrally with the side 400C of the housing 410, such as the frame structure 440 of FIG. 4. A portion of the waveguide 600 is formed integrally with the support member 700 along one side of the support member 700, and may extend to the side surface 400C of the housing 410. The remainder of the waveguide 600 may extend from one side of the support member 700 to the second side 500B of the printed circuit board 500.

According to one embodiment, the electronic device 400 may further include at least one opening 419 formed on the side 400C of the housing 410. One end of the waveguide 600 is connected to the power feeding structure 503 disposed on one side of the printed circuit board 500, and the other end of the waveguide 600 is included in the support member 700, housing It may face the side (400C) of (410).

According to one embodiment, the waveguide 600 may be connected to at least one opening 419 formed on the side 400C of the housing 410. The housing 410 of the electronic device 400 may form at least one opening 419 corresponding to the aperture antenna in order to transmit a wireless communication signal to or receive a wireless communication signal from an external electronic device. .

According to one embodiment, at least one opening 419 may include a plurality of openings 419a disposed along the side 400C of the housing 410. The plurality of openings 419a may overlap a cross section of the waveguide 600 facing the side 400C of the housing 410. However, it is not limited to this. For example, each of a plurality of waveguides (eg, waveguides 601a, 601b, 601c, and 601d in FIG. 9C) may be connected to one opening.

According to one embodiment, the plurality of openings 419a extend from the cross section of one end of the waveguide 600 and overlap the cross section of the antenna corresponding to at least one opening 419 of the housing 410. It can be. The wireless communication signal passing through the waveguide 600 may be transmitted to the outside of the electronic device 400 through the openings 419a. For example, the wireless communication signal is fed from the wireless communication circuit 501 on the printed circuit board 500 to the waveguide 600 through the feeding structure 503 electrically connected to the conductive via 502a, ) may be transmitted to the apertures 419a that operate as an antenna (e.g., an aperture antenna). The waveguide 600 transmits a wireless communication signal to the antenna module, and the transmitted wireless communication signal may be transmitted to the outside of the housing 410 through the openings 419a.

According to the above-described embodiment, a portion of the waveguide 600 may extend to the side 400C of the housing 410 along the support member 700 that forms a portion of the housing 410.

FIG. 10A is a block diagram of an electronic device including a plurality of waveguides, according to an embodiment. 10B and 10C are side views of an electronic device including a plurality of waveguides, according to one embodiment.

Referring to FIG. 10A, the electronic device 400 includes a first printed circuit board 510, a second printed circuit board 520, a communication processor 505, and a first wireless communication circuit 511 inside the housing 410. , may include a second wireless communication circuit 521, a first waveguide 610, and a second waveguide 620.

According to one embodiment, a plurality of printed circuit boards may be disposed within the housing 410. The first printed circuit board 510 is different from the second printed circuit board 520, and different wireless communication circuits may be disposed on each. For example, a communication processor 505 for signal operation and a first wireless communication circuit 511 may be disposed on the first printed circuit board 510 (e.g., Main PCB), and the second printed circuit board 520 ) (e.g. Sub PCB) may be disposed with a second wireless communication circuit 521 for signal transmission.

According to one embodiment, the communication processor 505 and the first wireless communication circuit 511 may be disposed on the third side 510A of the first printed circuit board 510. The first wireless communication circuit 511 operates as an IFIC (e.g., the fourth RFIC 228 in FIG. 2) that transmits a down-converted signal to the communication processor 505 or receives a signal from the communication processor and up-converts it. can do. The baseband signal generated by the communication processor 505 is transmitted to the first wireless communication circuit 511 through a transmission line (e.g., strip line, microstrip line) included in the first printed circuit board 510. It can be. The first wireless communication circuit 511 may up-convert the baseband signal generated by the communication processor 505 into an intermediate frequency signal. The first wireless communication circuit 511 can down-convert the intermediate frequency signal received from the first waveguide 610 into a baseband signal and transmit it to the communication processor 505 through a transmission line.

According to one embodiment, the second wireless communication circuit 521 may be disposed on the fifth side 520A of the second printed circuit board 520. The second wireless communication circuit 521 may operate as an RFIC that transmits a down-converted signal to the IFIC or up-converts a signal received from the IFIC. The intermediate frequency signal up-converted by the first wireless communication circuit 511 may be transmitted to the second wireless communication circuit 521 through the first waveguide 610. The second wireless communication circuit 521 up-converts the intermediate frequency signal transmitted from the first wireless communication circuit 511 into an RF signal (e.g., 20 (GHz) to 300 (GHz)), and transmits it to the second waveguide 620. ) can be passed on. The second wireless communication circuit 521 down-converts the RF signal received from the antenna of the electronic device 400 through the second waveguide 620 into an intermediate frequency signal, and transmits the first signal through the first waveguide 610. It can be transmitted through the wireless communication circuit 511.

According to one embodiment, the first waveguide 610 may be disposed between the first printed circuit board 510 and the second printed circuit board 520. The first end of the first waveguide 610 may be connected to the first power feeding structure 513 disposed on the fourth surface 510B of the first printed circuit board 510. The second end of the first waveguide 610 may be connected to the third power feeding structure 533 disposed on the sixth surface 520B of the second printed circuit board 520. The intermediate frequency signal transmitted from the first wireless communication circuit 611 may be transmitted to the second wireless communication circuit 521 through the signal line provided by the first waveguide 610. The second wireless communication circuit 521 up-converts the intermediate frequency signal transmitted from the first wireless communication circuit 511 into an RF signal (e.g., 150 (GHz) to 300 (GHz)), and transmits it to the second waveguide 620. ) can be passed on. The second wireless communication circuit 521 is a second waveguide from an antenna (e.g., antenna 238 in FIG. 2) or an antenna module (e.g., third antenna module 246 in FIG. 2) of the electronic device 400. The RF signal received through 620 can be down-converted into an intermediate frequency signal and transmitted to the first wireless communication circuit 511 through the first waveguide line.

According to one embodiment, the communication processor 505 converts the plurality of signals into a constant state in order to match the phases of the plurality of signals transmitted through the first waveguide 610 and the second waveguide 620 and delivered to the outside. It can be created to have a phase difference. For example, due to the structure of the first waveguide 610 and the second waveguide 620 (e.g., corner area 600C in FIG. 8), a phase difference may occur between a plurality of signals. The communication processor 505 changes the phases of the plurality of signals by the phase difference of the signal transmitted to the outside of the electronic device 400 through the second waveguide 620 and sends a signal to the first waveguide 610. It can be delivered. As the plurality of signals are transmitted to the first waveguide 610 with different phases, the plurality of signals that pass through the first waveguide 610 and the second waveguide 620 and are transmitted to the outside of the electronic device 400 The phase may be the same.

According to one embodiment, the second wireless communication circuit 521 may include a phase shifter (eg, phase shifter 238 in FIG. 2). The phase converter 238 may adjust the phases of a plurality of signals that may vary due to the structure of the first waveguide 610 and the second waveguide 620 (eg, corner area 600C). Considering the paths that vary depending on the shapes of the waveguides 610 and 620, the phases of each signal may be different and transmitted to the second waveguide 620. The phase converter 238 may be configured to transmit signals having the same phase to the outside of the electronic device 400.

According to one embodiment, the second waveguide 620 transmits a signal of 20 GHz or higher supplied from the second wireless communication circuit 521 to the antenna of the electronic device 400 (e.g., the antenna 238 in FIG. 2) or an antenna. It may be configured to transmit to a module (e.g., the third antenna module 236 in FIG. 2). For example, one end of the second waveguide 620 faces the fifth side 520A where the second wireless communication circuit 521 is disposed, in order to feed a signal from the second wireless communication circuit 521. It may be connected to the second power feeding structure 523 disposed on the sixth surface 520B. The other end of the waveguide 600 may be connected to an antenna disposed on the inner side of the housing 410 of the electronic device 400 (eg, the side 400C in FIG. 4). The second waveguide 620 may extend from one end connected to the second power feeding structure 523 to an antenna disposed on the inner side 400C of the housing 410.

According to one embodiment, the antenna may be an aperture antenna. The housing 410 of the electronic device 400 may include at least one opening 419 corresponding to the aperture antenna for transmitting or receiving a wireless communication signal to or from an external electronic device. . The aperture antenna is connected to the other end of the second waveguide 620 in order to transmit a signal fed from one end of the second waveguide 620 to an external electronic device or to receive a signal transmitted from an external electronic device. It may be disposed between at least one opening 419. To operate as the aperture antenna, a portion of the housing 410 may be removed. According to one embodiment, the aperture antenna may be connected to the cross section of the second waveguide 620 or may be formed integrally with it. In order to reduce distortion or damage to communication signals, the aperture antenna and the second waveguide 620 may be made of the same material.

According to one embodiment, at least one opening 419 may be formed in the housing 410. The wireless communication signal passing through the second waveguide 600 may be transmitted to the outside of the electronic device 400 through the at least one opening 419.

According to one embodiment, the shape or size of the first waveguide 610 and the second waveguide 620 may be different depending on the type of frequency being transmitted. For example, the first waveguide 610 provides an intermediate frequency signal line, and the second waveguide 620 provides an RF frequency signal line, so the first waveguide 610 and the second waveguide 620 Cross-section or size may vary.

Hereinafter, overlapping descriptions of components having the same reference numerals as the above-described components will be omitted.

Referring to FIG. 10B , the electronic device 400 may include a first power feeding structure 513, a second power feeding structure 523, and a third power feeding structure 533. The first power feeding structure 513 may include a first conductive pin 513a and a first shield can 513b. The second power feeding structure 523 may include a second conductive pin 523a and a second shield can 523b. According to one embodiment, the third power feeding structure 533 may be substantially the same or similar to the first power feeding structure 513.

According to one embodiment, the first conductive pin 513a may be disposed on one side of the first printed circuit board 510. The first conductive pin 513a is disposed on the fourth side 510B of the first printed circuit board 510 to transmit a signal from the first wireless communication circuit 511 disposed on the third side 510A. It can receive power and feed it to the first waveguide 610. The third power feeding structure 533 is disposed on the sixth surface 520B of the second printed circuit board 520, receives signals from the first waveguide 610, and transmits signals from the second printed circuit board 520. It can be transmitted to the second wireless communication circuit 521 disposed on the fifth surface 520A.

For example, the first conductive pin 513a is electrically connected to the first wireless communication circuit 511 and is connected to the first waveguide through a first conductive via 512a penetrating the first printed circuit board 510. A signal can be supplied to (610). The third power supply structure 533 may include a conductive pin (eg, the conductive pin 502a of FIG. 7 ) that is electrically connected to the third conductive via 532a. The conductive pin 502a is electrically connected to the second wireless communication circuit 521 and is connected to the first waveguide 600 through a third conductive via 532a penetrating the second printed circuit board 520. 2 A signal can be transmitted to the wireless communication circuit 521.

According to one embodiment, the second conductive pin 523a may receive a signal from the second wireless communication circuit 521 and transmit the received signal to the second waveguide 620. For example, the second conductive pin 523a is on the fifth side 520A of the second printed circuit board 520 through the second conductive via 522a penetrating the second printed circuit board 520. It may be electrically connected to the disposed second wireless communication circuit 521. The second conductive pin 523a protrudes from the sixth surface 520B of the second printed circuit board 520 and transmits the signal transmitted from the second wireless communication circuit 521 to the second waveguide 620. It can be urgent.

According to one embodiment, the first shield can 513b may surround the first conductive pin 513a, and the second shield can 523b may surround the second conductive pin 523a. The cross section of the first shield can 513b may have a shape corresponding to the cross section of the first waveguide 610 in order to insert the first waveguide 610. The cross section of the second shield can 523b may have a shape corresponding to the cross section of the second waveguide 620 in order to insert the second waveguide 620. According to one embodiment, the third power feeding structure 533 is a shield can (e.g., the shield of FIG. 7) having a shape corresponding to the cross section of the first shield can 513b in order to insert the first waveguide 610. It may include a can (503b)).

For example, the first shield can 513b is a structure of the first printed circuit board 510 in order to provide a structure in which one end of the first waveguide 610 can be coupled to the first power supply structure 513. It is disposed on the fourth surface 510B and may surround the first conductive fin 513a protruding from the fourth surface 510B. The third power supply structure 533 is a shield disposed on the sixth side 520B of the second printed circuit board 520 to provide a structure to which different ends of the first waveguide 610 can be coupled. It may include a can 503b.

According to one embodiment, one end of the second shield can 523b is in contact with the sixth side 520B of the second printed circuit board 520 and surrounds the second conductive pin 523a, and the second shield can 523b ) The other end may accommodate the second waveguide 620.

According to one embodiment, the shape or standard of the first power feeding structure 513 and the second power feeding structure 523 may be different depending on the type of frequency to which power is fed. For example, the shape or size of the first waveguide 610 and the second waveguide 620 may be different depending on the type of transmitted frequency. Since the cross-section or size of the first waveguide 610 and the second waveguide 620 are different, the cross-sectional shape or size of the first shield can 513b into which the first waveguide 610 is inserted is 2 The shape or size of the second shield can 523b into which the waveguide 620 is inserted may be different.

According to one embodiment, the support member 700 may support the first waveguide 610 and/or the second waveguide 620. For example, the first waveguide 610 and the second waveguide 620 may be disposed on one surface of the support member 700. The first waveguide 610 and/or the second waveguide 600 may be attached to the support member 700 through fusion, adhesive material, or adhesive tape. For another example, the support member 700 and the first waveguide 610 and/or the second waveguide 620 may be formed integrally. The support member 700 may have a certain thickness. The first waveguide 610 and/or the second waveguide 620 may form part of the support member 700 .

According to one embodiment, a portion of the first waveguide 610 and/or the second waveguide 620 extends within the support member 700 along one side of the support member 700, and the remainder extends within the support member 700. ) may extend from one side of the first printed circuit board 510, the second printed circuit board 520, or an antenna (eg, the antenna 248 in FIG. 2). For example, a portion of the second waveguide 620 is formed integrally with the support member 700 along one side of the support member 700, and the remainder is formed from one side of the support member 700 to the second printed circuit board. It may extend to the sixth side 520B of 520.

Referring to FIG. 10C, the electronic device 400 may further include a conductive element 509 and a substrate 507.

According to one embodiment, the substrate 507 may be a substrate that is different from the first printed circuit board 510 and/or the second printed circuit board 520. One side of the substrate 507 faces the inside of the electronic device 400, and the other side of the substrate 507 overlaps the opening 419 when the electronic device 400 is viewed from the outside. It may face the outside of the electronic device 400. A second waveguide 620 may be electrically connected to one side of the substrate 507, and a conductive element 509 may be disposed on the other side of the substrate 507. The substrate 507 may electrically connect the second waveguide 620 and the conductive element 509.

According to one embodiment, the conductive element 509 forms a directional beam to transmit a signal transmitted through the substrate 507 from the second waveguide 620 electrically connected to the other side of the substrate 507 to the outside. It can operate as an antenna radiator that transmits to. To transmit the signal, the conductive element 509 may be aligned with an opening 419 formed in the housing 410. For example, one side of the substrate 507 on which the conductive element 509 is disposed has an opening 419 of the housing 410 when viewed vertically from the outside of the electronic device 400. It can be arranged to overlap. The conductive element 509 may be arranged to correspond to the opening 419. A signal transmitted from the second wireless communication circuit 521 through the second waveguide 620 may be transmitted to the conductive element 509. The signal transmitted to the conductive element 509 may be transmitted to the outside of the electronic device 400 through the opening 419.

According to one embodiment, the conductive element 509 may include a plurality of conductive elements (eg, a plurality of antenna elements 332, 335, 336, or 338 in FIG. 3). The plurality of conductive elements may be spaced apart from each other. The plurality of conductive elements may form an antenna array (e.g., the antenna array 330 of FIG. 3), and signals radiated from the plurality of conductive elements may be combined to form a beam and provide directionality of the beam. there is. According to one embodiment, the housing 410 of the electronic device 400 may include a plurality of openings (eg, openings 419a in FIG. 9F) corresponding to the conductive elements. The number of openings 419a may correspond to the number of conductive elements. For example, each of the plurality of openings 419a may be arranged to overlap the conductive elements corresponding to each of the plurality of openings 419a. The plurality of openings 419a may be spaced apart such that each of the plurality of openings 419a overlaps a plurality of conductive elements spaced apart from each other. The plurality of openings 419a may be a passage for transmitting beams radiating from the plurality of conductive elements.

According to one embodiment, the substrate 507 on which the conductive element 509 is disposed transmits a signal generated inside the electronic device 400 to the outside of the electronic device 400, or transmits an electronic device from the outside of the electronic device 400. A signal transmitted to the device 400 can be received. A waveguide (eg, the first waveguide 610 or the second waveguide 620) may be a signal line that transmits the signal.

For example, the second wireless communication circuit 521 may be disposed on the fifth side 520A of the second printed circuit board 520. The second wireless communication circuit 521 may operate as an RFIC that transmits a down-converted signal to the IFIC or up-converts a signal received from the IFIC. The intermediate frequency signal up-converted by the first wireless communication circuit 511 may be transmitted to the second wireless communication circuit 521 through the first waveguide 610. The second wireless communication circuit 521 up-converts the intermediate frequency signal transmitted from the first wireless communication circuit 511 into an RF signal (e.g., 20 (GHz) to 300 (GHz)) to provide a second power supply structure ( It can be transmitted to one end of the second waveguide 620 that is electrically connected to 523). Since the other end of the second waveguide 620 is electrically coupled to the other side facing one side of the substrate 507 on which the conductive element 509 is disposed, the signal passing through the second waveguide 620 is , may be transmitted from the conductive element 509 to the outside of the electronic device 400 through the opening 419.

For example, the RF signal received from the outside of the electronic device 400 to the conductive element 509 through the opening 419 is directed to the conductive element 509 facing one side of the substrate 507 on which the conductive element 509 is disposed. It may be transmitted to the second wireless communication circuit 521 through the second waveguide 620 electrically coupled to the other side. The second wireless communication circuit 521 may down-convert the received RF signal into an intermediate frequency signal and transmit it to the first wireless communication circuit 511 through the first waveguide 610.

According to the above-described embodiment, the first waveguide 610 may provide a signal line that transmits an intermediate frequency signal that is up-converted by a first wireless communication circuit or down-converted by a second wireless communication circuit. The second waveguide 620 may transmit an RF signal to the outside of the electronic device 400 or provide a signal line for receiving an RF signal from the outside of the electronic device 400. Since part of the first waveguide 610 and/or the second waveguide 620 are included in part of the housing 410, the efficiency of the internal space of the electronic device 400 can be increased. The transmission loss of a signal in the 100 GHz or higher band transmitted through the first waveguide 610 and the second waveguide 620 may be smaller than the transmission loss of a signal in the 100 GHz or higher band through a microstrip or strip line. The first waveguide 610 and the second waveguide 620 for transmitting signals of 100 GHz or higher can be miniaturized so that they can be placed inside an electronic device.

11A and 11B are front views of an electronic device with the waveguide facing the display surface, according to one embodiment. Figure 11C is a side view of the electronic device with the waveguide facing the display surface, according to one embodiment.

11A, 11B, and 11C, the electronic device 400 may include a housing 410, a support member 700, a display 420, a waveguide 600, and a printed circuit board 500. there is.

According to one embodiment, the support member 700 may be disposed inside the electronic device 400 to support the display 420. One side of the support member 700 may face the printed circuit board 500, and the other side of the support member 700 may face the display 420. For example, a portion of one surface of the support member 700 may overlap the printed circuit board 500. The other side of the support member 700 may overlap a portion of the display 420.

According to one embodiment, the support member 700 may be disposed inside the electronic device 400 to support the display 420. One side of the support member 700 may overlap a portion of the display 420.

According to one embodiment, the electronic device 400 is disposed between the support member 700 and the display 420 and transmits a signal to the outside of the electronic device 400 toward the display 420 or to the display 420. It may include an antenna (e.g., antenna 248 in FIG. 2) or an antenna module (e.g., third antenna module 246 in FIG. 2) for receiving signals from the outside through 420.

According to one embodiment, the antenna may be an aperture antenna. To operate as the aperture antenna disposed between the support member 700 and the display 420 and facing the display 420, a portion of the support member 700 may be removed into a shape corresponding to the aperture antenna. .

According to one embodiment, the first end of the waveguide 600 may be connected to a power feeding structure 503 disposed on one side of the printed circuit board 500 for signal feeding. The second end of the waveguide 600 may be connected to an antenna facing the display 420. A cross section of the other end may overlap a portion of the display 420. The signal fed to the waveguide 600 may pass through the display 420 and be transmitted to the outside of the electronic device 400 through an antenna facing the display 420. A signal passing through the display 420 from outside the electronic device 400 may be transmitted to the waveguide 600 through an antenna facing the display 420.

According to one embodiment, the display 420 may include a touch panel 421 that detects the user's contact. The touch panel 421 may include a plurality of signal lines 421a and empty spaces 421b between the plurality of signal lines 421a. The plurality of signal lines 421a may form a certain pattern by including a plurality of signal lines 421a crossing each other perpendicularly. The signal supplied to the first end of the waveguide 600 is transmitted to the cross section of the second end of the waveguide 600 that overlaps a portion of the display 420 through the waveguide 600 extending toward the display 420. It can be. The transmitted signal may be transmitted to the outside of the electronic device 400 through the empty spaces 421b of the touch panel 421 extending from the end surface of the second end of the waveguide 600. For example, an RF signal in a high frequency band (e.g., 20 (GHz) to 300 (GHz)) may penetrate the empty spaces 421b between the signal lines 421a included in the touch panel 421. . The display 420 has been described based on the gap between the touch panels 421, but it is not limited thereto. For example, a signal transmitted through the waveguide 600 may be transmitted to the outside through a gap between internal electrodes (eg, anode electrode or cathode electrode) and signal wires of the display 420.

According to one embodiment, the display 420 may be disposed and supported in at least a partial area of the support member 700.

According to one embodiment, at least a portion of the waveguide 600 extends within the support member 700 along one side of the support member 700, and at least a portion extends from one side of the support member 700 to the printed circuit board ( 500) or may extend to the display 420. For example, the support member 700 may be formed integrally with the housing 410. At least a portion of the waveguide 600 may be included in the support member 700, extend along one side of the support member 700, and be supported. A first part of at least a portion of the waveguide 600 may be connected from one side of the support member 700 to the power feeding structure 503 disposed on one side of the printed circuit board 500. Among at least a portion of the waveguide 600, the second portion excluding the first portion may extend toward the display 420 from the other side facing one side of the support member 700. By the signal line provided by the waveguide 600, the signal supplied to the waveguide 600 can be transmitted toward the display 420. The signal transmitted from the waveguide 600 toward the display 420 may be transmitted to the outside or receive a signal from the outside through the empty spaces between the signal lines included in the display 420 formed as shown in FIG. 11B. .

According to the above-described embodiment, the waveguide 600 may extend from the power feeding structure 503 toward the display 420. The signal passing through the signal line provided by the waveguide 600 can be transmitted to an external electronic device through the display 420 through the empty spaces 421b between the signal lines 421a of the touch panel 421. there is.

Figure 12A is a perspective view of a square waveguide showing polarized waves being transmitted, according to one embodiment. FIG. 12B is a perspective view of an octagonal waveguide showing polarized waves being transmitted, according to one embodiment.

Referring to FIG. 12A, the cross-sectional shape of the waveguide 600 may be square. The cross section of the square waveguide 600 may be composed of two first edges 600-1 that are parallel to each other and two second edges 600-2 that are in contact with the first edges and are parallel to each other. The first edge 600-1 may be perpendicular to the second edge 600-2. A power feeding structure that feeds the signal 550 to the square waveguide 600 (e.g., the power feeding structure 503 in FIG. 7) may include a plurality of power feeding units. For example, the feeding structure 503 supplies signal power to the first feeding unit 503-1 and the second edge 600-2, which supplies signal power to the first edge 600-1. It may include a second power supply unit 503-2.

According to one embodiment, the first polarized wave 550-1 is fed to the first edge 600-1 through the first feeder, and the second polarized wave 550-2 is fed to the second edge 600-1 through the second feeder. Power can be fed to the edge (600-2). According to one embodiment, the first polarized wave 550-1 is fed through the first edge 600-1 and may be polarized in a direction perpendicular to the first edge 600-1. The second polarized wave 550-2 is fed through the second edge 600-2 and may be polarized in a direction perpendicular to the second edge 600-2. The first polarization 500-1 may be perpendicular to the second polarization 500-2. For example, the first polarized wave 550-1 may be reflected between two parallel first edges 600-1 and travel through the waveguide 600. The second polarized wave 550-2 may be reflected between two parallel second edges 600-2 and travel through the waveguide 600. Since the first edge 600-1 is perpendicular to the second edge 600-2, the first polarization 550-1 and the second polarization 550-2 may be perpendicular to each other.

Referring to FIG. 12B, the cross-sectional shape of the waveguide 600 may be a regular octagon. The cross section of the octagonal waveguide has two parallel first edges 600-1, two parallel second edges 600-2, two parallel third edges 600-3 and two parallel third edges 600-1. It may be composed of 4 edges (600-4). The first edge 600-1 may be perpendicular to the second edge 600-2. The third edge 600-3 may be perpendicular to the fourth edge 600-4. The power feeding structure 503 that feeds the signal 550 to the octagonal waveguide 600 may include a plurality of power feeding units. For example, the power supply structure 503 includes a first power supply unit 503-1 that supplies power of the signal to the first edge 600-1, and a first power supply unit 503-1 that supplies power of the signal to the second edge 600-2. The third feeder 503-3 supplies signal power to the second feeder 503-2, the third edge 600-3, and the fourth edge 600-4. It may include a fourth power supply unit 503-4.

According to one embodiment, the first polarized wave (550-1) is fed to the first edge (600-1) through the first feeding portion (503-1), and the second polarized wave (550-2) is fed to the second polarized wave (550-2). Power is fed to the second edge (600-2) through the front (503-2), and the third polarized wave (550-3) is fed to the third edge (600-3) through the third feed portion (503-3). And the fourth polarized wave 550-4 can be fed to the fourth edge 600-4 through the fourth power feeder 503-4. The first polarized wave 550-1 may be reflected between two parallel first edges 600-1 and travel through the waveguide 600. The second polarized wave 550-2 may be reflected between two parallel second edges 600-2 and travel through the waveguide 600. The third polarized wave 550-3 may be reflected between two parallel third edges 600-3 and travel through the waveguide 600. The fourth polarized wave 550-2 may be reflected between two parallel second edges 600-2 and travel through the waveguide 600. Since the first edge 600-1 is perpendicular to the second edge 600-2, the first polarization 550-1 and the second polarization 550-2 may be perpendicular to each other. Since the third edge 600-3 is perpendicular to the fourth edge 600-4, the third polarization 550-3 and the fourth polarization 550-4 may be perpendicular to each other.

According to the above-described embodiment, the waveguide 600 formed in a polygonal shape reduces the influence of each of the plurality of signals 550-1, 550-2, 550-3, and 550-4 fed to the waveguide 600. You can. The waveguide 600 may provide a structure for transmission of a plurality of signals 550. By varying the cross-sectional shape of the waveguide 600, the number of a plurality of different signals 550 passing through the waveguide 600 can be adjusted.

FIG. 13A is a block diagram of an electronic device including a waveguide and an antenna module, according to one embodiment. 13B is a side view of an electronic device including a waveguide and an antenna module, according to one embodiment.

Referring to FIGS. 13A and 13B, the electronic device 400 includes a printed circuit board 500, a communication processor 505, a first wireless communication circuit 511, an antenna module 506, and a waveguide inside the housing 410. It may include (600). The antenna module 506 may include a substrate 507 on which a second wireless communication circuit 521 and a conductive element 509 are disposed.

According to one embodiment, the communication processor 505 and the first wireless communication circuit 511 may be disposed on the first side 500A of the printed circuit board 500. The first wireless communication circuit 511 operates as an IFIC (e.g., the fourth RFIC 228 in FIG. 2) that transmits a down-converted signal to the communication processor 505 or receives a signal from the communication processor and up-converts it. can do. The baseband signal generated by the communication processor may be transmitted to the first wireless communication circuit 511 through a transmission line (eg, strip line, microstrip line) included in the printed circuit board 500. The first wireless communication circuit 511 may up-convert the baseband signal generated by the communication processor 505 into an intermediate frequency signal. The first wireless communication circuit 511 can down-convert the intermediate frequency signal received from the waveguide 600 into a baseband signal and transmit it to the communication processor 505 through a transmission line.

According to one embodiment, the second wireless communication circuit 521 may be disposed on one side of the substrate 507 included in the antenna module 506. The second wireless communication circuit 521 may operate as an RFIC that transmits a down-converted signal to the IFIC or up-converts a signal received from the IFIC. The intermediate frequency signal up-converted by the first wireless communication circuit 511 may be transmitted to the second wireless communication circuit 521 through the waveguide 600. The second wireless communication circuit 521 up-converts the intermediate frequency signal transmitted from the first wireless communication circuit 511 into an RF signal (e.g., 100 (GHz) to 300 (GHz)), and transmits the intermediate frequency signal to the electronic device 400. It can be transmitted outside of . The second wireless communication circuit 521 can down-convert an RF signal transmitted from the outside of the electronic device 400 into an intermediate frequency signal and transmit it to the first wireless communication circuit 511 through the waveguide 600. .

According to one embodiment, the waveguide 600 may be disposed between the printed circuit board 500 and the antenna module 506. The waveguide 600 can transmit signals between the first wireless communication circuit 511 and the second wireless communication circuit 521. Through the signal line provided by the waveguide 600, the intermediate frequency signal can be transmitted from the first wireless communication circuit 611 to the second wireless communication circuit 521. The second wireless communication circuit 521 included in the antenna module 506 down-converts the RF signal received from the outside of the electronic device 400 into an intermediate frequency signal and transmits it to the first wireless signal through the waveguide 600. It can be transmitted to the communication circuit 511.

According to one embodiment, the second wireless communication circuit 521 included in the antenna module 506 may include a phase converter (eg, phase converter 238 in FIG. 2). The phase converter 238 can adjust the phases of a plurality of signals transmitted through the waveguide 600. The phase converter 238 may be configured to transmit signals having the same phase to the outside of the electronic device 400. The phase converter 238 may adjust the phases of the plurality of signals to determine the directionality of electromagnetic waves of the signal transmitted to the antenna module 506.

According to one embodiment, the communication processor 505 may generate the plurality of signals to have a constant phase difference in order to match the phases of the plurality of signals transmitted through the waveguide 600 and delivered to the outside. . For example, due to the structure of the waveguide 600 (eg, corner area 600C in FIG. 8), a phase difference may occur between a plurality of signals. The communication processor 505 may transmit a signal to the waveguide 600 by varying the phases of the plurality of signals by the phase difference of the signal transmitted to the outside of the electronic device 400 through the waveguide 600. As the plurality of signals are transmitted to the waveguide 600 with different phases, the phases of the plurality of signals transmitted from the antenna module 506 to the outside of the electronic device 400 may be the same. When transmitting each phase-delayed signal through the communication processor 505 through a waveguide, the phase converter 238 may be omitted. However, it is not limited to this. For example, the communication processor 505 may be configured to send a signal with the same phase to the antenna module 506, and the phase converter 238 may be configured to provide directivity of electromagnetic waves for signals transmitted to the outside. , the phases of the plurality of signals can be adjusted.

According to one embodiment, the antenna module 506 may be disposed on the side 400C of the housing 410 of the electronic device 400 in order to transmit a communication signal to or receive a communication signal from an external electronic device. .

According to one embodiment, the antenna module 506 may be disposed in the inner space of the housing 410.

According to one embodiment, the conductive element 509 included in the antenna module 506 is connected to the housing 410 of the electronic device 400 in order to transmit a signal to or receive a signal from an external electronic device. It may be disposed on one side of the substrate 507 included in the antenna module 506, toward at least one opening 419 formed on the side 400C. The at least one opening 419 may be filled with a non-conductive material (eg, the non-conductive material 410a in FIG. 9D). At least one opening 419 may overlap a conductive element 509 included in the antenna module 506 connected to the waveguide 600. The wireless communication signal passing through the waveguide 600 may be up-converted by the second wireless communication circuit 521 included in the antenna module 506. The up-converted signal is radiated by the conductive element 509 disposed on the same substrate 507 as the second wireless communication circuit 521, and passes through the at least one opening 419 to the electronic device ( 400) can be transmitted outside.

According to the above-described embodiment, the transmission loss of a signal in a band of 100 GHz or more transmitted through the waveguide 600 may be smaller than the transmission loss of a signal in a band of 100 GHz or more through a microstrip or strip line. The waveguide 600 for transmitting signals of 100 GHz or higher can be miniaturized so that it can be placed inside an electronic device.

The electronic device (e.g., the electronic device 400 of FIG. 4) according to the above-described embodiment includes a housing (e.g., the housing 410 of FIG. 4) including at least one opening (e.g., the opening 419 of FIG. 9A). )), a support member within the housing (e.g., the support member 700 in FIG. 7), a display disposed on the support member (e.g., the display 420 in FIG. 4), and a first side (e.g., the support member 700 in FIG. 7). a first surface 500A), a first printed circuit board (e.g., printed circuit board 500 in FIG. 7) in the housing including a plurality of layers (e.g., layers 502 in FIG. 7), the A first wireless communication circuit (e.g., wireless communication circuit 501 in FIG. 7) disposed on a first side of a printed circuit board and power supply on a second side of the printed circuit board electrically connected to the first wireless communication circuit. A structure (e.g., the power feeding structure 503 in FIG. 7) and electrically connected to the first wireless communication circuit through the power feeding structure, and configured to transmit the signal provided from the first wireless communication circuit to the outside of the housing. It may include a waveguide (e.g., waveguide 600 in FIG. 7). According to one embodiment, the waveguide extends from the feed structure along one side of the support member, and when the at least one opening is viewed perpendicularly, the at least one opening overlaps a cross section of the waveguide. You can. According to one embodiment, the first wireless communication circuit may transmit or receive a signal in a frequency band of 20 GHz to 300 GHz to an external electronic device through the at least one waveguide.

According to one embodiment, the power feeding structure is electrically connected to a conductive via (e.g., the conductive via 502a of FIG. 7) penetrating the plurality of layers and includes a conductive pin (e.g., the conductive via 502a of FIG. 7) protruding from the second surface. a conductive pin 503a) and a shield can disposed on the second side of the first printed circuit board, surrounding the conductive pin, and having an open side facing the second side (e.g., the shield can of FIG. 7 (503b)).

According to one embodiment, the display includes a plurality of signal lines (e.g., signal lines 421a in FIG. 11B) and empty spaces between the plurality of signal lines (e.g., empty spaces 421b in FIG. 11B). and a touch panel (e.g., the touch panel 421 in FIG. 11B), and when the display is viewed from above, a cross section of one end of the waveguide facing the display has at least one of the empty spaces. May overlap.

According to one embodiment, the at least one opening may include a plurality of slots (eg, openings 419a in FIG. 9E) disposed along the side of the housing.

According to one embodiment, the cross-section of the waveguide includes a first edge (e.g., first edge 600-1 in FIG. 12A) and a second edge perpendicular to the first edge (e.g., second edge in FIG. 12A). includes an edge 600-2), and the feeding structure includes a first feeding unit (e.g., the first feeding unit 503-1 in FIG. 12A) that supplies power of the first signal to the first edge, and It may include a second power supply unit (eg, the second power supply unit 503-2 in FIG. 12A) that supplies power of a second signal having a polarization different from that of the first signal to the second edge.

According to one embodiment, the waveguide receives a first signal (e.g., the first polarization 550-1 in FIG. 8) and a second signal (e.g., the second polarization in FIG. 8) provided from the first wireless communication circuit. (550-2)) may be configured to transmit to the outside of the electronic device.

According to one embodiment, the at least one waveguide includes a plurality of waveguides (e.g., the waveguides 601, 602, 603, and 604 of FIG. 9B), and each of the plurality of waveguides transmits a different signal. Each of these may be configured to be delivered to the outside of the electronic device.

According to one embodiment, it transmits at least one signal to the first wireless communication circuit, and includes at least one processor (e.g., communication processor 505 in FIG. 9A) disposed on the first printed circuit board, The first wireless communication circuit may be configured to up-convert the frequency band of the at least one signal.

According to one embodiment, the first wireless communication circuit may further include a phase converter (eg, phase converter 238 in FIG. 2) that adjusts the phase of the at least one signal.

According to one embodiment, the at least one signal includes a plurality of signals, and the at least one processor may transmit the plurality of signals having different phases from each other to the first wireless communication circuit.

According to one embodiment, a second wireless communication circuit (e.g., the second wireless communication circuit 521 in FIG. 10A) that is distinct from the first wireless communication circuit (e.g., the first wireless communication circuit 511 in FIG. 10A). , at least one conductive element corresponding to the at least one opening (e.g., conductive element 509 in Figure 10C) and disposed between the at least one conductive element and the second wireless communication circuit, and the at least one conductive It may further include an antenna module (e.g., antenna module 506 in FIG. 13A) including a substrate (e.g., substrate 507 in FIG. 10C) that electrically connects the element and the second wireless communication circuit. . According to one embodiment, the at least one opening is formed on one of the sides of the housing, and the waveguide can transmit the signal from the first wireless communication circuit to the second wireless communication circuit. . According to one embodiment, the second wireless communication circuit may be configured to up-convert the signal to a frequency band of 20 GHz or more and 300 GHz or less.

According to one embodiment, the first printed circuit board may include a second wireless communication circuit electrically connected to the first wireless communication circuit and disposed on the first surface.

According to one embodiment, it may transmit at least one signal to the first wireless communication circuit and include at least one processor disposed on the first printed circuit board. According to one embodiment, the first wireless communication circuit is configured to transmit a first converted signal in a first frequency band obtained by up-converting the frequency band of the at least one signal to the second wireless communication circuit, and 2 The wireless communication circuit may be configured to transmit a second converted signal in a second frequency band obtained by up-converting the first frequency band of the first converted signal to the waveguide.

According to one embodiment, the power feeding structure is electrically connected to a conductive via penetrating the plurality of layers from a region of the first surface corresponding to the second wireless communication circuit, and protrudes from the second surface. It may include a conductive pin and a shield can disposed on the second side of the first printed circuit board, surrounding the conductive pin, and having an open side facing the second side.

According to one embodiment, the first frequency band may be 20 GHz to 200 GHz, and the second frequency band may be 100 GHz to 300 GHz.

An electronic device according to an embodiment includes a housing including at least one opening, a support member within the housing, a display disposed on the support member, and a first printed circuit board within the housing including a plurality of layers (e.g. A first printed circuit board 510 in FIG. 10B), a first wireless communication circuit disposed on a first side of the first printed circuit board (e.g., third side 510A in FIG. 10B), and the first wireless communication A first feed structure (e.g., the first feed structure in FIG. 10B) on the second side of the first printed circuit board (e.g., the fourth side 510B in FIG. 10B) facing the first side electrically connected to the circuit. Structure 513) may be included. According to one embodiment, the electronic device includes a second printed circuit board in the housing that is distinct from the first printed circuit board and includes a plurality of layers (e.g., the second printed circuit board 520 in FIG. 10B). , a second wireless communication circuit disposed on the third side (e.g., the fifth side 520A in FIG. 10B) and a fourth side (e.g., facing the third side) electrically connected to the second wireless communication circuit. : It may further include a second power feeding structure (e.g., the second power feeding structure 523 in FIG. 10B) on the sixth surface 520B of FIG. 10B. According to one embodiment, a first waveguide ( Example: electrically connected to the second wireless communication circuit through the first waveguide 610 in FIG. 10b and the second power supply structure, and to transmit the signal provided from the second wireless communication circuit to the outside of the housing. It may further include a configured second waveguide (e.g., the second waveguide 620 of FIG. 10B). According to one embodiment, the second waveguide extends from the second feed structure along one side of the support member, and when the at least one opening is viewed perpendicularly, the at least one opening is It may overlap the cross section of the waveguide. According to one embodiment, the second wireless communication circuit may transmit or receive a signal in a frequency band of 20 GHz or more and 300 GHz or less to an external electronic device through the second waveguide.

According to one embodiment, the first power feeding structure is electrically connected to a first conductive via (e.g., the first conductive via 512a in FIG. 10B) penetrating the plurality of layers of the first printed circuit board, and A first conductive pin protruding from the second side (e.g., the first conductive pin 513a in FIG. 10B) and disposed on the second side of the first printed circuit board, surrounding the first conductive pin, and It includes a first shield can (e.g., the first shield can 513b in FIG. 10B) with an open side facing the second surface, and the second power feeding structure is formed by forming the plurality of layers of the second printed circuit board. A second conductive pin (e.g., the second conductive pin 523a in FIG. 10b) is electrically connected to a second conductive via penetrating the second conductive via (e.g., the second conductive via 522a in FIG. 10b) and protrudes from the fourth surface. ) and a second shield can disposed on the fourth side of the second printed circuit board, surrounding the second conductive pin, and having an open side facing the fourth side (e.g., the second shield can in Figure 10b) (523b)).

According to one embodiment, the display includes a touch panel including a plurality of signal lines and empty spaces between the plurality of signal lines, and when the display is viewed from above, the second waveguide facing the display One cross section may overlap at least one of the empty spaces.

According to one embodiment, the first wireless communication circuit includes at least one processor that transmits at least one signal to the first wireless communication circuit and is disposed on the first printed circuit board, and the first wireless communication circuit includes the at least one It is configured to transmit a first converted signal of a first frequency band obtained by up-converting the frequency band of the signal to the second wireless communication circuit through the first waveguide, and the second wireless communication circuit is configured to transmit the first converted signal of the first converted signal. It may be configured to transmit a second converted signal of a second frequency band obtained by up-converting the first frequency band to the second waveguide.

According to one embodiment, the second wireless communication circuit may further include a phase converter that adjusts the phase of the at least one second converted signal.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. or one or more other operations may be added.

Claims (20)

In electronic devices,
a housing including at least one opening;
a support member within the housing;
a display disposed on the support member;
a first printed circuit board within the housing comprising a plurality of layers;
a first wireless communication circuit disposed on a first side of the first printed circuit board;
a power feeding structure on a second side of the first printed circuit board facing the first side electrically connected to the first wireless communication circuit; and
a waveguide electrically connected to the first wireless communication circuit through the power feeding structure and configured to transmit a signal provided from the first wireless communication circuit to the outside of the housing; Including,
The waveguide extends from the power supply structure along one side of the support member, and when the at least one opening is viewed perpendicularly, the at least one opening overlaps a cross section of the waveguide,
The first wireless communication circuit,
Transmitting or receiving signals in a frequency band of 20 GHz or more and 300 GHz or less to an external electronic device through the at least one waveguide,
Electronic devices.
According to paragraph 1,
The feeding structure is,
a conductive pin electrically connected to a conductive via penetrating the plurality of layers and protruding from the second surface; and
a shield can disposed on the second side of the first printed circuit board, surrounding the conductive pin, and having an open side facing the second side; Including,
Electronic devices.
According to paragraph 1,
The display is,
A touch panel including a plurality of signal lines and empty spaces between the plurality of signal lines,
When looking at the display from above, the cross section of one end of the waveguide facing the display is:
Overlapping with at least one of the empty spaces,
Electronic devices.
According to paragraph 1,
The at least one opening is,
Comprising a plurality of slots disposed along a side of the housing,
Electronic devices.
According to paragraph 1,
The cross section of the waveguide is,
first edge and
comprising a second edge perpendicular to the first edge,
The feeding structure is,
a first power supply unit supplying power of a first signal to the first edge; and
a second power supply unit supplying power of a second signal having a polarization different from that of the first signal to the second edge; Including,
Electronic devices.
According to clause 5,
The waveguide is,
Configured to transmit the first signal and the second signal provided from the first wireless communication circuit to the outside of the electronic device,
Electronic devices.
According to paragraph 1,
The at least one waveguide is,
comprising a plurality of waveguides,
Each of the plurality of waveguides is configured to transmit each of different signals to the outside of the electronic device,
Electronic devices.
According to paragraph 1,
At least one processor transmits at least one signal to the first wireless communication circuit and is disposed on the first printed circuit board,
The first wireless communication circuit,
Configured to up convert the frequency band of the at least one signal,
Electronic devices.
According to clause 8,
The first wireless communication circuit,
a phase converter that adjusts the phase of the at least one signal; Containing more,
Electronic devices.
According to clause 8,
The at least one signal is,
Contains a plurality of signals,
The at least one processor,
Transmitting the plurality of signals having different phases from each other to the first wireless communication circuit,
Electronic devices.
According to paragraph 1,
a second wireless communication circuit distinct from the first wireless communication circuit, at least one conductive element corresponding to the at least one opening, and disposed between the at least one conductive element and the second wireless communication circuit, an antenna module including one conductive element and a substrate electrically connecting the second wireless communication circuit; It further includes,
The at least one opening is,
Formed on one of the sides of the housing,
The waveguide is,
transmitting the signal from the first wireless communication circuit to the second wireless communication circuit,
The second wireless communication circuit,
Configured to upconvert the signal to a frequency band of 20 GHz or more and 300 GHz or less,
Electronic devices.
According to paragraph 1,
The first printed circuit board is,
Comprising a second wireless communication circuit electrically connected to the first wireless communication circuit and disposed on the first side,
Electronic devices.
According to clause 12,
At least one processor transmits at least one signal to the first wireless communication circuit and is disposed on the first printed circuit board,
The first wireless communication circuit,
Configured to transmit a first converted signal in a first frequency band obtained by up-converting the frequency band of the at least one signal to the second wireless communication circuit,
The second wireless communication circuit,
Configured to transmit a second converted signal in a second frequency band obtained by up-converting the first frequency band of the first converted signal to the waveguide,
Electronic devices.
According to clause 13,
The feeding structure is,
a conductive pin electrically connected to a conductive via penetrating the plurality of layers from a region of the first surface corresponding to the second wireless communication circuit and protruding from the second surface; and
a shield can disposed on the second side of the first printed circuit board, surrounding the conductive pin, and having an open side facing the second side; Including,
Electronic devices.
According to clause 13,
The first frequency band is 20 GHz to 200 GHz,
The second frequency band is 100 GHz to 300 GHz,
Electronic devices.
In electronic devices,
a housing including at least one opening;
a support member within the housing;
a display disposed on the support member;
a first printed circuit board within the housing comprising a plurality of layers;
a first wireless communication circuit disposed on a first side of the first printed circuit board;
a first power supply structure on a second side of the first printed circuit board facing the first side electrically connected to the first wireless communication circuit;
a second printed circuit board within the housing comprising a plurality of layers;
a second wireless communication circuit disposed on a third side of the second printed circuit board;
a second power supply structure on a fourth side of the second printed circuit board facing the third side electrically connected to the second wireless communication circuit;
a first waveguide electrically connected to the first wireless communication circuit through the first power supply structure and configured to transmit a signal provided from the first wireless communication circuit to the second wireless communication circuit; and
a second waveguide electrically connected to the second wireless communication circuit through the second power supply structure and configured to transmit a signal provided from the second wireless communication circuit to the outside of the housing; Including,
The second waveguide extends from the second feed structure along one side of the support member, and when the at least one opening is viewed perpendicularly, the at least one opening overlaps a cross section of the second waveguide. ,
The second wireless communication circuit,
Transmitting or receiving signals in a frequency band of 20 GHz or more and 300 GHz or less to an external electronic device through the second waveguide,
Electronic devices.
According to clause 16,
The first feeding structure is,
a first conductive pin electrically connected to a first conductive via penetrating the plurality of layers of the first printed circuit board and protruding from the second surface; and
a first shield can disposed on the second side of the first printed circuit board, surrounding the first conductive pin, and having an open side facing the second side; Including,
The second feeding structure is,
a second conductive pin electrically connected to a second conductive via penetrating the plurality of layers of the second printed circuit board and protruding from the fourth surface; and
a second shield can disposed on the fourth side of the second printed circuit board, surrounding the second conductive pin, and having an open side facing the fourth side; Including,
Electronic devices.
According to clause 16,
The display is,
A touch panel including a plurality of signal lines and empty spaces between the plurality of signal lines,
When viewing the display from above, a cross section of one end of the second waveguide facing the display is:
Overlapping with at least one of the empty spaces,
Electronic devices.
According to clause 16,
At least one processor transmits at least one signal to the first wireless communication circuit and is disposed on the first printed circuit board,
The first wireless communication circuit,
Configured to transmit a first converted signal in a first frequency band obtained by up-converting the frequency band of the at least one signal to the second wireless communication circuit through the first waveguide,
The second wireless communication circuit,
Configured to transmit a second converted signal in a second frequency band obtained by up-converting the first frequency band of the first converted signal to the second waveguide,
Electronic devices.
According to clause 19,
The second wireless communication circuit,
a phase converter that adjusts the phase of the at least one second converted signal; Containing more,
Electronic devices.

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