KR20230153199A - Electronic device including an antenna - Google Patents

Abstract

Electronic devices according to various embodiments disclosed in this document may include an antenna module and a metal bezel disposed adjacent to the antenna module, and the antenna module may include a printed circuit board (PCB) and a first surface of the PCB. It may include conductive patches disposed at or adjacent to, and a wireless communication circuit, wherein the metal bezel includes holes corresponding to the conductive patches, and as the metal bezel is disposed adjacent to the antenna module, the Each of the holes may be disposed closer to the outside of the electronic device than the conductive patches, and the wireless communication circuit may transmit and/or receive a first signal in a first frequency band by feeding power to the holes of the metal bezel. A second signal in a second frequency band higher than the first frequency band can be transmitted and/or received by feeding power to the conductive patches. Various other embodiments may be possible.

Description

Electronic device including an antenna {ELECTRONIC DEVICE INCLUDING AN ANTENNA}

Various embodiments disclosed in this document relate to electronic devices including an antenna.

With the development of communication devices, electronic devices can produce and transmit various contents, connect to the Internet with various things (e.g., Internet of Things (IoT)), or connect communication between various sensors for autonomous driving. For this purpose, an antenna module capable of fast, high-capacity transmission may be included. For example, an electronic device may include an antenna module that radiates mmWave signals (hereinafter referred to as mmWave antenna module).

The mmWave antenna module that supports 5G (new radio) communication may apply array antenna technology that utilizes multiple conductive patches to minimize transmission loss.

Antennas that transmit and/or receive signals in multiple frequency bands may be stacked and arranged on one printed circuit board (PCB). For example, first conductive patches that transmit and/or receive signals in the first frequency band may be disposed on the first layer of the PCB. Additionally, second conductive patches that transmit and/or receive signals in a second frequency band higher than the first frequency band may be disposed on the second layer stacked on the first layer.

When conductive patches are stacked on a PCB to implement multiple frequency bands, the thickness of the PCB may increase and the PCB may occupy a large space within the electronic device. In other words, due to a PCB including a stacked structure of conductive patches, an electronic device may have difficulty securing internal space for arranging various electronic components.

In various embodiments disclosed in this document, an antenna module including a PCB is coupled to or placed adjacent to a metal bezel including a plurality of holes, so that power is supplied to each of the plurality of holes and the conductive patches disposed on the PCB to provide multiple frequencies. Band can be implemented.

Electronic devices according to various embodiments disclosed in this document may include an antenna module and a metal bezel disposed adjacent to the antenna module, and the antenna module may include a printed circuit board (PCB) and a first surface of the PCB. It may include conductive patches disposed on or adjacent to, and a wireless communication circuit, wherein the metal bezel includes holes corresponding to the conductive patches, and the metal bezel is adjacent to the antenna module. As arranged, each of the holes may be placed closer to the outside of the electronic device than the conductive patches, and the wireless communication circuit feeds the holes in the metal bezel to transmit a first signal in the first frequency band and /or may receive, and may transmit and/or receive a second signal in a second frequency band higher than the first frequency band by feeding the conductive patches.

An electronic device according to various embodiments disclosed in this document includes a metal bezel on at least a portion of which a plurality of holes are formed and which forms at least a portion of a side of the electronic device, and a PCB (a PCB) whose first side is disposed toward the plurality of holes. printed circuit board), conductive patches disposed on or adjacent to the first side of the PCB, each of the conductive patches corresponds to the plurality of holes, and the PCB is coupled to the metal bezel. As they are disposed adjacently, each of the holes may be disposed closer to the outside of the electronic device than the conductive patches, and may include a wireless communication circuit electrically connected to the conductive patches, wherein the wireless communication circuit A first signal in a first frequency band may be transmitted and/or received by feeding power to the plurality of holes of the metal bezel, and a second signal in a second frequency band higher than the first frequency band may be transmitted by feeding power to the conductive patches. Signals can be transmitted and/or received.

According to various embodiments disclosed in this document, an electronic device may transmit and/or receive signals in multiple frequency bands using holes and conductive patches formed in a metal bezel.

According to various embodiments, an electronic device can reduce the thickness of a PCB and secure internal space of the electronic device by transmitting and/or receiving signals using holes formed in a metal bezel.

In addition, various effects that can be directly or indirectly identified through this document may be provided.

FIG. 1 is a diagram illustrating an electronic device in a network environment according to an embodiment.
FIG. 2A is a perspective view of an electronic device according to an embodiment.
FIG. 2B is a perspective view showing the electronic device of FIG. 2A as seen from the rear.
Figure 3 is a diagram explaining a metal bezel according to an embodiment.
Figure 4 is a cross-sectional view taken along line aa' of a metal bezel according to an embodiment.
FIG. 5 is a view of the metal bezel and antenna module shown in FIG. 4 according to an embodiment, viewed in the -x-axis direction.
FIG. 6A is a diagram illustrating an arrangement structure of a first conductive patch and a first conductive structure according to an embodiment.
FIG. 6B is a view looking at the first conductive patch and the first conductive structure shown in FIG. 6A in the +z direction according to one embodiment.
Figure 7 shows reflection coefficient graphs of conductive patches according to one embodiment.
Figure 8 shows antenna gains at 28 GHz and 40 GHz according to one embodiment.
9 is a diagram explaining conductive structures according to another embodiment.
FIG. 10 illustrates antenna gains of each of the first hole and the second hole when conductive structures according to an embodiment are disposed at a specified angle with the second axis.
FIG. 11 illustrates an antenna pattern when conductive structures are arranged parallel to a second axis and an antenna pattern when the conductive structures are arranged at a specified angle with the second axis, according to an embodiment.
Figure 12 shows antenna gain at 28 GHz when a wireless communication circuit according to one embodiment feeds holes and conductive patches through conductive structures at a 45 degree angle with the second axis.
Figure 13 shows antenna gain at 40 GHz when a wireless communication circuit according to one embodiment feeds holes and conductive patches through conductive structures at a 45 degree angle with the second axis.
FIG. 14 shows graphs of reflection coefficients of conductive patches when a wireless communication circuit according to an embodiment feeds the conductive patches through conductive structures forming a specified angle with the second axis.
Figure 15 is a diagram explaining conductive structures for forming a polarized signal according to another embodiment.
FIG. 16 is a diagram illustrating antenna gains corresponding to a first polarized signal and a second polarized signal in the frequency bands of 28 GHz and 40 GHz, respectively, according to an embodiment.
FIG. 17 is a diagram illustrating a cross-polarization discrimination graph of a first polarization signal and a second polarization signal in the frequency bands of 28 GHz and 40 GHz according to an embodiment.
FIG. 18 is a diagram comparing the antenna gains of the stacked conductive patches in the 28 GHz and 40 GHz frequency bands according to an embodiment with the antenna gains of the holes and conductive patches shown in FIG. 4.
In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components.

Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives to the embodiments of the present invention.

FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted Boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi Direct (wireless fidelity direct), or IrDA (infrared data association)) or a second network 199 (e.g. It may communicate with an external electronic device 104 through a telecommunication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beamforming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 has a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, or U-plane latency (e.g., downlink (DL) and uplink (UL) of less than 0.5 ms each, or round trip of less than 1 ms) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197. According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); and a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second surface (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. there is.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or through an application store (e.g., Play Store™), or on two user devices (e.g., It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. . According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Additionally or alternatively, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

FIG. 2A is a perspective view of an electronic device according to an embodiment.

FIG. 2B is a perspective view showing the electronic device of FIG. 2A as seen from the rear.

Referring to FIGS. 2A and 2B, the electronic device 101 according to one embodiment includes a first side (or front) 210A, a second side (or back) 210B, and a first side 210A. It may include a housing 210 including a side (or side wall) 210C surrounding the space between the second surfaces 210B. In another embodiment (not shown), housing may refer to a structure that forms some of the first side 210A, second side 210B, and side surface 210C of FIGS. 2A and 2B.

According to one embodiment, the first side 210A of the electronic device 101 may be formed at least in part by a substantially transparent front plate 202 (e.g., a glass plate including various coating layers, or a polymer plate). You can. In one embodiment, the front plate 202 may include a curved portion that extends seamlessly from the first surface 210A toward the rear cover 211 at least at one side edge portion.

According to one embodiment, the second surface 210B may be formed by a substantially opaque rear cover 211. The back cover 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be. According to one embodiment, the rear cover 211 may include a curved portion that extends seamlessly from the second surface 210B toward the front plate 202 at least at one end.

According to one embodiment, the side 210C of the electronic device 101 may be combined with the front plate 202 and the rear cover 211, and may be connected by a metal bezel 215 including metal and/or polymer. can be formed. In another embodiment, the rear cover 211 and the metal bezel 215 may be formed as one piece and may include substantially the same material (eg, a metal material such as aluminum).

According to one embodiment, the electronic device 101 includes a display 201, an audio module 170, a sensor module 204, a first camera module 205, a key input device 217, and a first connector hole ( 208) and a second connector hole 209. In another embodiment, the electronic device 101 may omit at least one of the components (eg, the key input device 217) or may additionally include another component. For example, within the area provided by the front plate 202, a sensor such as a proximity sensor or an illumination sensor may be integrated into the display 201 or placed adjacent to the display 201. In one embodiment, the electronic device 101 may further include a light-emitting device 206, and the light-emitting device 206 may be disposed adjacent to the display 201 within the area provided by the front plate 202. You can. For example, the light emitting device 206 may provide status information of the electronic device 101 in the form of light. In another embodiment, the light emitting device 206 may provide, for example, a light source linked to the operation of the first camera module 205. The light emitting device 206 may include, for example, an LED, an IR LED, and a xenon lamp.

Display 201 may be exposed, for example, through a significant portion of front plate 202 . In another embodiment, the edge of the display 201 may be formed to be substantially the same as the adjacent outer shape (eg, curved surface) of the front plate 202. In another embodiment, in order to expand the area where the display 201 is exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same. In another embodiment, a recess or opening is formed in a portion of the screen display area of the display 201, and another electronic component, such as a first camera, is aligned with the recess or opening. The module 205 may include a proximity sensor or an illumination sensor (not shown).

In another embodiment, the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen.

In one embodiment, the audio module 170 may include a microphone hole 203, at least one speaker hole 207, and a receiver hole 214 for a call. A microphone for acquiring external sound may be placed inside the microphone hole 203, and in one embodiment, a plurality of microphones may be placed to detect the direction of the sound. In another embodiment, the at least one speaker hole 207 and the receiver hole 214 for a call are implemented as a single hole with the microphone hole 203, or without the at least one speaker hole 207 and the receiver hole 214 for a call. Speakers may be included (e.g. piezo speakers).

In one embodiment, the electronic device 101 may include a sensor module 204 to generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. Sensor module 204 may include, for example, a proximity sensor disposed on first side 210A of housing 210, a fingerprint sensor integrated in or adjacent to display 201, and/or a proximity sensor disposed on first side 210A of housing 210. ) may further include a biometric sensor (eg, HRM sensor) disposed on the second surface 210B. The electronic device 101 includes sensor modules not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor.

In one embodiment, the electronic device 101 may include a second camera module 255 disposed on the second surface 210B. The first camera module 205 and the second camera module 255 may include one or more lenses, an image sensor, and/or an image signal processor. A flash, not shown, may be disposed on the second surface 210B. Flashes may include, for example, light-emitting diodes or xenon lamps. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device 101.

In one embodiment, the key input device 217 may be disposed on the side 210C of the housing 210. In another embodiment, the electronic device 101 may not include some or all of the key input devices 217 mentioned above, and the key input devices 217 not included may be other than soft keys on the display 201. It can be implemented in the form In another embodiment, the key input device may include at least a portion of a fingerprint sensor disposed on the second surface 210B of the housing 210.

In one embodiment, the connector holes 208 and 209 include a first connector hole 208 that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/ Alternatively, it may include a second connector hole (eg, earphone jack) 209 that can accommodate a connector for transmitting and receiving audio signals to and from an external electronic device.

In FIGS. 2A and 2B, the electronic device 101 is shown as being a bar-type, but this is only an example and the electronic device 101 may actually correspond to various types of devices. For example, the electronic device 101 may correspond to a foldable device, a slideable device, a wearable device (eg, a smart watch, a wireless earphone), or a tablet PC. Therefore, the technical idea disclosed in this document is not limited to the bar type device shown in FIGS. 2A and 2B and can be applied to various types of devices.

According to one embodiment, an antenna module supporting the mmWave frequency band may be placed toward the side 210C formed by the metal bezel 215. For example, the antenna module may be disposed adjacent to or combined with the metal bezel 215 so as to face a portion (eg, portion A) of the side surface 210C. However, the location where the mmWave disclosed in this document is placed is not limited to the location facing the side 210C of the electronic device 101, and may be placed toward the rear 210B or front of the electronic device 101.

Figure 3 is a diagram explaining a metal bezel according to an embodiment.

Referring to FIG. 3 , the electronic device 101 according to one embodiment may include a metal bezel 300 forming at least a portion of the side surface. The metal bezel 300 may substantially correspond to the metal bezel 215 of FIGS. 2A and 2B. In one embodiment, a groove 310 may be formed in the metal bezel 300. For example, the metal bezel 300 may include a third surface 301, and a groove 310 having a designated depth may be formed in the third surface 301. The third side 301 may correspond to the side 210C described in FIG. 2A. In FIG. 3, the groove 310 is shown as having a rectangular shape, but this is only an example and the groove 310 may have various shapes in other embodiments. For example, the groove 310 may have an oval shape.

According to one embodiment, holes 320 may be formed in the metal bezel 300. The holes 320 may be formed to penetrate the metal bezel 300 in a first direction (eg, +x direction). The holes 320 may include a first hole 321, a second hole 322, a third hole 323, and/or a fourth hole 324. In FIG. 3, the holes 320 are shown as including four holes (e.g., the first hole 321, the second hole 322, the third hole 323, and the fourth hole 324), but this is This is only an example, and the holes 320 may include various numbers of holes. According to another embodiment, only one hole may be formed in the metal bezel 300 instead of the holes 320. In one embodiment, the holes 320 may correspond one-to-one to the conductive patches of the antenna module, which will be described later in FIGS. 4 and 5.

According to one embodiment, the holes 320 may be formed in various shapes. For example, each of the holes 320 may have a rectangular shape. For another example, each of the holes 320 may have a circular shape. In FIG. 3 , the holes 320 are shown as having substantially the same size and shape, but this is only an example, and the sizes and shapes of the holes 320 shown in FIG. 3 may be different from each other. For example, the first hole 321 may have a rectangular shape, and the second hole 322 may have a circular shape. For another example, the first size of the first hole 321 may be larger than the second size of the second hole 322.

Hole disclosed in this document is a term used to refer to a part drilled or dug out in a designated object and may be replaced by another term that is substantially the same or similar. For example, holes disclosed herein may be replaced with openings and/or pits. As an example, the first hole 321 may be replaced with a first opening, and the second hole 322 may be replaced with a second opening. As another example, the first hole 321 may be replaced with a first hole (pit), and the second hole 322 may be replaced with a second hole.

Figure 4 is a cross-sectional view taken along line a-a' of a metal bezel according to an embodiment.

Referring to FIG. 4 , the electronic device 101 according to an embodiment may include an antenna module 400 coupled to or disposed adjacent to the metal bezel 300. In one embodiment, the antenna module 400 may include a PCB 401, conductive patches 420, conductive structures 450, and/or a wireless communication circuit 470 disposed on the PCB 401.

According to one embodiment, the antenna module 400 may be coupled to or disposed adjacent to the metal bezel 300, and the antenna module 400 coupled to or adjacent to the metal bezel 300 may be connected to the metal bezel 300. can be surrounded by For example, the PCB 401 included in the antenna module 400 may include a first surface facing the metal bezel 300 and a second surface on which the wireless communication circuit 470 is disposed. When the antenna module 400 is coupled to the metal bezel 300 or placed adjacent to it, other surfaces of the PCB 401 except the second surface may be surrounded by the metal bezel 300.

According to one embodiment, the metal bezel 300 is opposite to the third side 301 and the third side 301 and faces the first side of the PCB 401 on which the conductive patches 420 are disposed. Can include 4 sides.

According to one embodiment, the PCB 401 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The PCB 401 may provide electrical connections between various electronic components disposed on the PCB 401 using wires and conductive vias formed on the conductive layer. For example, PCB 401 may provide electrical connections for conductive patches 420 and wireless communication circuitry 470.

According to one embodiment, the grooves 310 and the holes 320 may be formed in the metal bezel 300 with a step difference. For example, the groove 310 of the metal bezel 300 may have a first depth D1, and the holes 320 may be formed to have a second depth D2 from the bottom of the groove 310. You can. In one embodiment, the second depth D2 may be longer than the first depth D1. However, the relationship between the first depth D1 and the second depth D2 is not limited to this, and in other embodiments, the first depth D1 may be equal to or longer than the second depth D2. In one embodiment, the groove 310 may be formed on the third surface 301 of the metal bezel 300 with a first depth D1, and may be formed on the third surface 301 of the electronic device 101 more than the conductive patches 420. It can be placed adjacent to the outside.

According to one embodiment, the antenna module 400 may include conductive patches 420. In one embodiment, the conductive patches 420 may include a first conductive patch 421, a second conductive patch 422, a third conductive patch 423, and/or a fourth conductive patch 424. . In one embodiment, the conductive patches 420 may operate as antenna elements to form a directional beam. In one embodiment, the conductive patches 420 may be arranged along one axis (eg, y-axis). For example, the first conductive patch 421, the second conductive patch 422, the third conductive patch 423, and/or the fourth conductive patch 424 are disposed along one axis (e.g., y-axis) A 1x4 antenna array can be formed.

The arrangement relationship of the conductive patches 420 according to one embodiment can also be described as a relationship in which other conductive patches are arranged in a designated direction based on one conductive patch. For example, the second conductive patch 422 may be disposed in a second direction (e.g., +y direction) with respect to the first conductive patch 421, and the third conductive patch 423 may be disposed in a second direction (e.g., +y direction) with respect to the first conductive patch 421. It may be disposed in a second direction (e.g., +y direction) with respect to 422, and the fourth conductive patch 424 is disposed in a second direction (e.g., +y direction) with respect to the third conductive patch 423. can be placed in

According to another embodiment, the antenna module 400 may further include substantially different types of antennas in addition to the conductive patches 420. For example, the antenna module 400 may further include a dipole antenna, a monopole antenna, a slit antenna, and/or an inverted F antenna (IFA). According to another embodiment, the conductive patches 420 disposed on the antenna module 400 may be replaced with other types of antennas. For example, the conductive patches 420 may be replaced with a dipole antenna, monopole antenna, slit antenna, and/or IFA antenna.

According to one embodiment, the conductive patches 420 may be disposed on the base dielectrics 410. For example, base dielectrics 410 may be disposed on one side of the PCB 401, and the conductive patches 420 may be disposed on corresponding dielectrics of the base dielectrics 410, respectively. ) can be disposed in the genomes. As an example, the first conductive patch 421 may be disposed in the first base dielectric 411, the second conductive patch 422 may be disposed in the second base dielectric 412, and the third conductive patch 423 may be disposed in the third base dielectric 413, and the fourth conductive patch 424 may be disposed in the fourth base dielectric 414. As a result, the base dielectrics 410 may have a one-to-one correspondence with the conductive patches 420.

According to another embodiment, the conductive patches 420 may be disposed inside the PCB 401. In addition, in FIG. 4, the concept of the conductive patches 420 being disposed on the base dielectrics 410 disposed on one side of the PCB 401 is explained, but the PCB 401 includes the base dielectrics 410 and , the conductive patches 420 can also be described as being disposed on one side of the PCB 401 formed by the base dielectrics 410. Accordingly, the conductive patches 420 may be understood as being disposed on one side of the PCB 401.

According to one embodiment, the base dielectrics 410 on which the conductive patches 420 are disposed may be disposed between the conductive vias 430. For example, the first base dielectric 411 is the first conductive via. It may be disposed between (431) and the second conductive via (432). The second base dielectric 412 may be disposed between the second conductive via 432 and the third conductive via 433. The third base dielectric 413 may be disposed between the third conductive via 433 and the fourth conductive via 434. The fourth base dielectric 414 may be disposed between the fourth conductive via 434 and the fifth conductive via 435. In one embodiment, as the base dielectrics 410 are disposed between the conductive vias 430, the electronic device 101 can improve the isolation of the conductive patches 420. For example, as the base dielectrics 410 are divided by the conductive vias 430, among the radio frequency (RF) signals radiated from each of the conductive patches 420, the RF signal radiated to another conductive patch is conductive. It may be shielded by vias 430. For example, among the RF signals radiating from the first conductive patch 421, a signal radiating toward the second conductive patch 422 may be shielded by the second conductive via 432. As a result, the electronic device 101 can secure the isolation of the conductive patches 420 by preventing interference between RF signals radiated from the conductive patches 420 through the conductive vias 430.

According to one embodiment, as the antenna module 400 is coupled to or placed adjacent to the metal bezel 300, the holes 320 of the metal bezel 300 are closer to the outside of the electronic device 101 than the conductive patches 420. It can be placed close to .

According to one embodiment, as the antenna module 400 is coupled to or disposed adjacent to the metal bezel 300, the holes 320 of the metal bezel 300 are located on the upper of the corresponding conductive patches 420. can be located For example, the first hole 321 may be disposed on the first conductive patch 421. The second hole 322 may be disposed on the second conductive patch 422. The third hole 323 may be disposed on the third conductive patch 423. The fourth hole 324 may be disposed on the fourth conductive patch 424. As a result, the holes 320 may have a one-to-one correspondence with the conductive patches 420. As another example, the holes 320 of the metal bezel 300 may be located in a first direction (eg, +x direction) with respect to the conductive patches 420 that correspond one-to-one. For example, the first hole 321 may be located in the first direction (eg, +x direction) of the first conductive patch 421. In one embodiment, the holes 320 of the metal bezel 300 may be arranged to be spaced apart from the conductive patches 420 by a specified distance.

According to one embodiment, the antenna module 400 and/or the PCB 401 may include conductive structures 450. In one embodiment, the conductive structures 450 may include a first conductive structure 451, a second conductive structure 452, a third conductive structure 453, and/or a fourth conductive structure 454. .

According to one embodiment, the conductive structures 450 may be disposed closer to the outside of the electronic device 101 than the conductive patches 420. In one embodiment, the conductive structures 450 may be disposed spaced apart from each other on the corresponding conductive patches 420 . For example, the first conductive structure 451 may be spaced apart on the first conductive patch 421, and the second conductive structure 452 may be spaced apart on the second conductive patch 422. The third conductive structure 453 may be spaced apart on the third conductive patch 423, and the fourth conductive structure 454 may be spaced apart on the fourth conductive patch 424. As another example, the conductive structures 450 may be positioned to be spaced apart from the corresponding conductive patches 420 in a first direction (eg, +x direction). For example, the first conductive structure 451 may be positioned spaced apart from the first conductive patch 421 in a first direction (eg, +x direction).

According to one embodiment, the antenna module 400 may include a wireless communication circuit 470, and the wireless communication circuit 470 may be disposed on the second side of the PCB 401. The second side of the PCB 401 may be referred to as a side opposite to the first side of the PCB 401. In one embodiment, the wireless communication circuit 470 may be electrically connected to the conductive patches 420. In one embodiment, the wireless communication circuitry 470 is configured to transmit and/or receive via the conductive patches 420 a first frequency band comprising a designated frequency band (e.g., 26 to 30 GHz and/or 35 to 100 GHz). It may be configured to process RF signals of a second frequency band including. In one embodiment, the wireless communication circuit 470 may convert a baseband signal obtained from the processor 120 into an RF signal in a designated frequency band to transmit an RF signal in a designated frequency band. The wireless communication circuit 470 may convert an RF signal in a designated frequency band received through the conductive patches 420 into a baseband signal and transmit it to the processor 120. According to another embodiment, the wireless communication circuit 470 may up-convert an IF signal obtained from an intermediate frequency integrate circuit (IFIC) into an RF signal of a selected band in order to transmit an RF signal. Additionally, the wireless communication circuit 470 may down-convert the RF signal obtained through the conductive patches 420, convert it into an IF signal, and transmit it to the IFIC.

According to one embodiment, the wireless communication circuit 470 may be electrically connected to the conductive structures 450 and feed power to the holes 320 and/or the conductive patches 420 through the conductive structures 450. RF signals in a designated frequency band can be transmitted and/or received. For example, the wireless communication circuit 470 may supply power through coupling to the holes 320 through the conductive structures 450 and transmit RF power in a first frequency band (e.g., 26 to 30 GHz). Signals can be transmitted and/or received. In one example, the wireless communication circuit 470 may supply power through coupling to the holes 320 through the conductive structures 450 and provide first electrical power based on the first electrical paths formed in the holes 320. RF signals in a frequency band may be transmitted and/or received. As another example, the wireless communication circuit 470 may supply power through coupling to the conductive patches 420 through the conductive structures 450 and in a second frequency band higher than the first frequency band (e.g., 35 to 100 GHz) can transmit and/or receive RF signals. In one example, the wireless communication circuit 470 may supply power through coupling to the conductive patches 420 through the conductive structures 450 and through a second electrical path formed in the conductive patches 420. A signal in the second frequency band may be transmitted and/or received. In one embodiment, the holes 320 may correspond to a cavity antenna.

According to one embodiment, feeding power through coupling may refer to a method in which alternating current signal energy is electromagnetically transferred between substantially independent spaces or lines. In FIG. 3, the wireless communication circuit 470 is described as feeding power to the holes 320 and/or the conductive patches 420 through coupling, but this is only an example, and in another embodiment, the wireless communication circuit 470 Power may be supplied to the holes 320 and/or the conductive patches 420 through conductive structures that directly contact the holes 320 and/or the conductive patches 420. For example, the first conductive structure electrically connected to the wireless communication circuit 470 may be electrically connected to each of the first hole 321 and/or the first conductive patch 421 by directly contacting the wireless communication circuit. 470 may transmit and/or receive signals in multiple frequency bands by feeding power to the first hole 321 and/or the first conductive patch 421 through the first conductive structure.

According to one embodiment, the electronic device 101 increases space utilization and reduces costs by supplying power to the holes 320 and conductive patches 420 used as antenna radiators through the conductive structures 450. You can. For example, if conductive structures that feed power to the holes 320 and the conductive patches 420 used as antenna radiators are disposed in the antenna module 400, there may be restrictions on space utilization within the antenna module 400. On the other hand, if power is supplied to both the holes 320 and the conductive patches 420 using the conductive structures 450 according to an embodiment, the volume of the conductive structures 450 for power feeding in the antenna module 400 is minimized. This can be done, and the electronic device 101 can increase space utilization.

According to one embodiment, the electronic device 101 can minimize the thickness of the antenna module 400 and/or the PCB 401 by using the holes 320 of the metal bezel 300 as antenna radiators. For example, if the electronic device 101 does not use the holes 320 as antenna radiators, additional conductive patches may need to be stacked on the PCB 401 in addition to the conductive patches 420 to implement multiple frequency bands. . Due to the stacking of additional conductive patches, the thickness of the PCB 401 becomes thicker, and space utilization within the electronic device 101 may be limited due to the thicker PCB. On the other hand, if the holes 320 according to one embodiment are used as an antenna radiator, the electronic device 101 can secure multiple frequency bands using only the holes 320 and the conductive patches 420 without a stacked structure of additional conductive patches. there is. As a result, the electronic device 101 can reduce the thickness of the PCB 401 and/or the antenna module 400 and secure space within the electronic device 101.

According to one embodiment, first dielectrics 440 may be disposed in the holes 320. For example, the second dielectric 442 may be placed in the second hole 322, the third dielectric 443 may be placed in the third hole 323, and the fourth dielectric 443 may be placed in the fourth hole 324. 4 dielectrics 444 may be disposed. In FIG. 3 , the first dielectric disposed in the first hole 321 is omitted to explain the arrangement structure of the first conductive patch 421, but in reality, the first dielectric may be disposed in the first hole 321.

According to one embodiment, as the first dielectrics 440 are disposed in the holes 320, RF signals radiated from the conductive patches 420 may pass through the first dielectrics 440 and be transmitted to an external device. RF signals transmitted from an external device may pass through the first dielectrics 440 and be received by the conductive patches 420. In one embodiment, as the conductive patches 420 are disposed in the holes 320, the electronic device 101 can secure relatively wide antenna coverage compared to the case where the first dielectrics 440 are not present.

According to one embodiment, empty spaces may be provided between the first dielectrics 440 and the conductive patches 420, and the empty spaces may be filled with air. Air filled in the empty spaces may correspond to a dielectric. The relationship between the dielectric constants of the first dielectrics 440 and the air corresponding to the dielectric will be described in detail in FIGS. 6A and 6B below.

FIG. 5 is a view of the metal bezel and antenna module shown in FIG. 4 according to an embodiment, viewed in the -x-axis direction.

Referring to FIG. 5 , as the metal bezel 300 and the antenna module 400 according to one embodiment are combined or disposed adjacent to each other, the conductive patches 420 are disposed below the corresponding holes 320, respectively. For example, the first conductive patch 421 may be disposed in a designated direction (eg, -x direction) of the corresponding first hole 321. In one embodiment, as the metal bezel 300 and the antenna module 400 are combined or placed adjacent to each other, the holes 320 are closer to the outside of the electronic device 101 than the conductive patches 420.

According to one embodiment, the first conductive structure 451 may be arranged parallel to a designated axis. For example, the first conductive structure 451 is disposed parallel to one axis (eg, z-axis) and may be disposed on the first conductive patch 421. As another example, the conductive patches 420 may be disposed along a first axis (e.g., y-axis), and the first conductive structure 451 may be disposed along a second axis perpendicular to the first axis (e.g., y-axis). It can be positioned parallel to an axis (e.g. z-axis). The second axis (eg, z-axis) may correspond to an axis perpendicular to the first axis (eg, y-axis) and parallel to the first side of the PCB 401. As another example, the second axis (eg, z-axis) may correspond to an axis perpendicular to the first axis and parallel to one side of the conductive patches 420. As another example, the second axis (eg, z-axis) may correspond to an axis perpendicular to the first axis and parallel to the third surface 301 of the metal bezel 300.

According to one embodiment, the description of the arrangement relationship or positional relationship of the first conductive structure 451 is substantially the same for the second conductive structure 452, the third conductive structure 453, and the fourth conductive structure 454. It can be applied easily. As a result, the conductive structures 450 may be arranged parallel to a direction perpendicular to the direction in which the conductive patches 420 are arranged.

The antenna module 400 shown in FIGS. 4 and 5 is shown as including conductive patches 420 forming a 1x4 antenna array, but this is only an example and the antenna module 400 has various numbers and arrangement structures. The branches may contain conductive patches. For example, the antenna module 400 may include a first conductive patch 421 and a second conductive patch 422, and the first conductive patch 421 and the second conductive patch 422 are 1x2 antennas. An array can be formed. For another example, the antenna module 400 includes a first conductive patch 421, a second conductive patch 422, a third conductive patch 423, a fourth conductive patch 424, and a fifth conductive patch. The first conductive patch 421, the second conductive patch 422, the third conductive patch 423, the fourth conductive patch 424, and the fifth conductive patch can form a 1x5 antenna array. . As another example, the conductive patches 420 may form a 2x2 antenna array.

FIG. 6A is a diagram illustrating an arrangement structure of a first conductive patch and a first conductive structure according to an embodiment.

Referring to FIG. 6A , the first conductive patch 421 according to one embodiment may be disposed in the first base dielectric 411. In another embodiment, the first conductive patch 421 may be disposed on the first base dielectric 411. In one embodiment, the first conductive structure 451 for power feeding may be disposed to be spaced apart from the first conductive patch 421 and may be disposed on top of the first conductive patch 421 .

According to one embodiment, the first conductive structure 451 may include a first part 451a and a second part 451b. The first portion 451a of the first conductive structure 451 may correspond to a portion extending by the first length L1 in a specified direction (eg, +z direction) from above the first conductive patch 421. The second part 451b of the first conductive structure 451 may correspond to a part extended from the first part 451a. The second part 451b may substantially correspond to a conductive via of the PCB 401.

FIG. 6B is a view looking at the first conductive patch and the first conductive structure shown in FIG. 6A in the +z direction according to one embodiment.

Referring to FIG. 6B, a non-conductive material 610 may be disposed in the groove 310 of the metal bezel 300 according to one embodiment. In one embodiment, the first dielectric 441 may be disposed in the first hole 321, and an additional dielectric 621 may be disposed between the first base dielectric 411 and the first conductive patch 421. there is. For example, the additional dielectric 621 may correspond to air. In one embodiment, the non-conductive material 610 may substantially correspond to a dielectric (eg, glass). As another expression, the additional dielectric 621 may be stacked on the first base dielectric 411 and placed in the first hole 321, and the first dielectric 441 may be stacked on the additional dielectric 621. It may be disposed in the first hole 321, and the non-conductive material 610 may also be described as being stacked on the first dielectric 441. In one embodiment, the additional dielectric 621 may be disposed in the first hole 321 and between the first conductive patch 421 and the first dielectric 441. As another example, the additional dielectric 621 may be disposed between the first dielectric 441 and the first surface of the PCB 401 when disposed in the first hole 321.

According to one embodiment, the first dielectric constant of the first dielectric 441, the second dielectric constant of the additional dielectric 621, and the third dielectric constant of the non-conductive material 610 may be different. For example, the first dielectric constant of the first dielectric 441 may be higher than the second dielectric constant of the additional dielectric 621. In one example, the third dielectric constant of the non-conductive material 610 may be lower than the first dielectric constant of the first dielectric 441.

According to one embodiment, as the non-conductive material 610 is disposed in the groove 310 of the metal bezel 300 and the first dielectric 441 and the additional dielectric 621 are disposed in the first hole 321, RF signals transmitted and/or received by the first conductive patch 421 may pass through the non-conductive material 610, the first dielectric 441, and/or the additional dielectric 621.

According to one embodiment, the frequency band of RF signals emitted by the first conductive patch 421 may vary depending on the dielectric constant of the first dielectric 441. For example, as the first dielectric constant of the first dielectric 441 increases, the frequency band of RF signals emitted by the first hole 321 may shift to a relatively low frequency band. Additionally, as the size of the first dielectric 441 becomes relatively larger, the frequency band of RF signals radiated by the first hole 321 may transition to a relatively low frequency band.

According to one embodiment, the first conductive via 431 and/or the second conductive via 432 of the PCB 401 may contact and be electrically connected to the metal bezel 300. For example, the first conductive via 431 and/or the second conductive via 432 may contact the metal bezel 300 area-to-area and be electrically connected to the metal bezel 300. However, this is only an example, and in another embodiment, the first conductive via 431 and/or the second conductive via 432 of the PCB 401 may be spaced apart from the metal bezel 300 without contacting the metal bezel 300.

The description of the first conductive structure 451 described in FIGS. 6A and 6B can be applied substantially equally to the second conductive structure 452, the third conductive structure 453, and the fourth conductive structure 454. . In addition, the description of the first dielectric 441, the additional dielectric 621, and the non-conductive material 610 disposed in the first hole 321 illustrated in FIGS. 6A and 6B are substantially similar to the second hole 322. , the same can be applied to the dielectrics and non-conductive material 610 disposed in the third hole 323 and the fourth hole 324, respectively.

Figure 7 shows reflection coefficient graphs of conductive patches according to one embodiment.

Referring to FIG. 7, the first graph 701 according to an embodiment may be referred to as a reflection coefficient graph of the first hole 321 and the first conductive patch 421, and the second graph 702 may be referred to as the reflection coefficient graph of the first hole 321 and the first conductive patch 421. 2 may be referred to as a reflection coefficient graph of the hole 322 and the second conductive patch 422, and the third graph 703 may be referred to as a reflection coefficient graph of the third hole 323 and the third conductive patch 423. The fourth graph 704 may be referred to as a reflection coefficient graph of the fourth hole 324 and the fourth conductive patch 424.

According to one embodiment, the first graph 701, the second graph 702, the third graph 703, and the fourth graph 704 are each about -10 dB or less in the first frequency band including 28 GHz. Shows the reflection coefficient value. In the first frequency band including 28 GHz, a reflection coefficient of about -10 dB or less is shown, so that the wireless communication circuit 470 utilizes the holes 320 as antenna radiators to transmit and/or transmit a signal in the first frequency band. Alternatively, it is confirmed that antenna performance exceeding the specified performance can be secured even if received.

In addition, the first graph 701, the second graph 702, the third graph 703, and the fourth graph 704 each have a reflection coefficient value of about -7 dB or less in the second frequency band including 40 GHz. shows. In the second frequency band including 40 GHz, a reflection coefficient of about -7 dB or less is shown, so that the wireless communication circuit 470 utilizes the conductive patches 420 as antenna radiators to transmit a signal in the second frequency band. And/or it is confirmed that antenna performance exceeding the specified performance can be secured even with reception.

Figure 8 shows antenna gains at 28 GHz and 40 GHz according to one embodiment. This is the gain obtained by performing beamforming by four antenna elements for each frequency.

Referring to FIG. 8, the first graph 810 according to an embodiment may be referred to as an antenna gain graph in a frequency band of about 28 GHz when the wireless communication circuit 470 feeds the holes 320. You can. In one embodiment, it can be confirmed that antenna performance above a specified level is secured even when the holes 320 are used as antenna radiators, as the first graph 810 shows an antenna gain of about 10.59 dB.

According to one embodiment, the second graph 820 may be referred to as an antenna gain graph in a frequency band of about 40 GHz when the wireless communication circuit 470 supplies power to the conductive patches 420. In one embodiment, it can be confirmed that antenna performance above a specified level is secured even when the conductive patches 420 are used as antenna radiators, as the second graph 820 shows an antenna gain of about 13.28 dB.

9 is a diagram explaining conductive structures according to another embodiment.

Referring to FIG. 9, the conductive structures 950 according to an embodiment include a first conductive structure 951, a second conductive structure 952, a third conductive structure 953, and/or a fourth conductive structure 954. ) may include.

According to one embodiment, the conductive structures 950 may be disposed closer to the outside of the electronic device 101 than the conductive patches 420. In one embodiment, the conductive structures 950 may be spaced apart and disposed on a corresponding one of the conductive patches 420 . For example, the first conductive structure 951 may be disposed spaced apart from the upper part of the first conductive patch 421, and the second conductive structure 952 may be spaced apart from the upper part of the second conductive patch 422. The third conductive structure 953 may be spaced apart on the third conductive patch 423, and the fourth conductive structure 954 may be spaced apart on the fourth conductive patch 424. It can be.

According to one embodiment, the conductive structures 950 may be arranged to form a specified angle with one axis. For example, the second conductive patch 422 may be disposed along the first conductive patch 421 and a first axis (e.g., y-axis), and the conductive structures 950 may be disposed along the first axis (e.g., y-axis). axis) and may be arranged to form a specified angle with a second axis (eg, z-axis) parallel to the first side of the PCB 401. The specified angle may correspond to a non-zero angle (e.g., 45 degrees). As another example, the conductive structures 950 may be disposed on the conductive patches 420 so as to form an angle greater than a critical value with the second axis (eg, z-axis).

According to one embodiment, as the conductive structures 950 are disposed on the conductive patches 420 at a specified angle with the second axis (e.g., z-axis), the electronic device 101 forms the holes 320 and the conductive patch. Interference between fields 420 can be reduced. For example, if the conductive structures 950 are disposed parallel to the second axis (e.g., z-axis), the RF signal radiated from the second hole 322 is coupled to the adjacent first hole 321 and affects it. As a result, the radiation performance of the second hole 322 may be reduced. Additionally, if the conductive structures 950 are disposed parallel to the second axis (e.g., z-axis), the RF signal radiated from the second hole 322 may be coupled to and affect the adjacent third hole 323. And, as a result, the radiation performance of the second hole 322 may be reduced. On the other hand, when the conductive structures 950 according to an embodiment are disposed on the conductive patches 420 at a specified angle with the second axis (e.g., z-axis), the holes 320 and the conductive patches 420 ) can be reduced, and as a result, the electronic device 101 can prevent the antenna performance of the holes 320 and the conductive patches 420 from being deteriorated. This will be described in detail later in FIG. 11.

According to one embodiment, the conductive structures 950 may extend a specified length while forming a specified angle with the second axis (eg, z-axis). For example, the first conductive structure 951 may extend as much as the first length L1 while forming a specified angle with the second axis (eg, z-axis). As another example, the second conductive structure 952 may extend the second length L2 while forming a specified angle with the second axis (eg, z-axis). For another example, the third conductive structure 953 and the fourth conductive structure 954 each have a third length L3 and a fourth length L4 while forming a specified angle with the second axis (e.g., z-axis). It can be extended by as much as In one embodiment, the first length (L1), the second length (L2), the third length (L3), and/or the fourth length (L4) may be substantially the same. However, the length relationship of the conductive structures 950 is not limited to this, and the first length (L1), second length (L2), third length (L3), and/or fourth length (L4) may be different from each other. .

FIG. 10 illustrates antenna gains of each of the first hole and the second hole when conductive structures according to an embodiment are disposed at a specified angle with the second axis.

Referring to FIG. 10, the first graph 1010 according to one embodiment shows the wireless communication circuit 470 through a first conductive structure 951 disposed at a specified angle with the second axis (e.g., z-axis). It may be referred to as an antenna gain graph when power is supplied to the first hole 321. The second graph 1020 shows when the wireless communication circuit 470 feeds power to the second hole 322 through the second conductive structure 952 disposed at a specified angle with the second axis (e.g., z-axis). It can be referred to as an antenna gain graph.

Referring to the first graph 1010 and the second graph 1020 according to an embodiment, only a difference of about 0.3 dB between the antenna gain of the first hole 321 and the antenna gain of the second hole 322 is confirmed. . As a result, as each of the first conductive structure 951 and the second conductive structure 952 is arranged to form a specified angle with the second axis (e.g., z-axis), interference between the conductive patches 420 can be reduced, The electronic device 101 can prevent the antenna performance of the second hole 322 from being deteriorated.

FIG. 11 illustrates an antenna pattern when conductive structures are arranged parallel to a second axis and an antenna pattern when conductive structures are arranged at a specified angle with the second axis, according to an embodiment.

Referring to FIG. 11, when the wireless communication circuit 470 according to an embodiment feeds power to the holes 320 through the conductive structures 450 arranged parallel to the second axis (e.g., z-axis), the first It is confirmed that the antenna patterns are intensively distributed in the first hole 321 and the third hole 323 adjacent to the second hole 322. Accordingly, when the conductive structures 450 are arranged parallel to the second axis (eg, z-axis), antenna radiation performance may be reduced due to interference of signals between adjacent conductive patches. For example, the radiation performance of the second hole 322 may deteriorate.

According to one embodiment, the wireless communication circuit 470 feeds power to the first hole 321 through the first conductive structure 1051 forming a specified angle (e.g., 45 degrees) with the second axis (e.g., z-axis). Power can be supplied to the second hole 322 through the second conductive structure 1052 forming a specified angle with the second axis (e.g., z-axis), and Power may be supplied to the third hole 323 through the third conductive structure 1053 forming an angle, and the fourth hole 323 may be fed through the fourth conductive structure 1054 forming a specified angle with the second axis (e.g., z-axis). You can dispatch electricity to (324).

When the wireless communication circuit 470 according to an embodiment feeds power to the holes 320 through the conductive structures 1050 arranged at a specified angle with the second axis (e.g., z-axis), the antenna pattern is formed in the holes ( 320) is confirmed to be distributed outside. Accordingly, the electronic device 101 can reduce interference of RF signals between adjacent holes by supplying power to the holes 320 through the conductive structures 1050 forming a specified angle with the second axis (eg, z-axis). As a result, the electronic device 101 can prevent the antenna radiation performance of the holes 320 from deteriorating.

Figure 12 shows antenna gain at 28 GHz when a wireless communication circuit according to one embodiment feeds holes and conductive patches through conductive structures at a 45 degree angle with the second axis.

Referring to FIG. 12, the first graph 1210 according to an embodiment shows the wireless communication circuit 470 forming holes 320 and conductivity through conductive structures forming a 45 degree angle with the second axis (e.g., z-axis). Reference may be made to the antenna gain graph at 28 GHz when feeding patches 420.

According to one embodiment, the wireless communication circuit 470 connects the holes 320 and conductive patches ( 420), the antenna gain at 28 GHz is up to about 11.3926 dB. Therefore, when the wireless communication circuit 470 shown in FIG. 8 feeds power to the holes 320 and the conductive patches 420 through the conductive structures 450 parallel to the second axis (e.g., z-axis) 28 Considering that the antenna gain at GHz is 10.5893, it is confirmed that the antenna gain is improved by about 0.8 dB. As a result, the electronic device 101 feeds the holes 320 and the conductive patches 420 through the conductive structures 950 at a specified angle with the second axis, thereby providing an antenna in the first frequency band including 28 GHz. Benefits can be improved.

Figure 13 shows antenna gain at 40 GHz when a wireless communication circuit according to one embodiment feeds holes and conductive patches through conductive structures at a 45 degree angle with the second axis.

Referring to FIG. 13, the first graph 1310 according to an embodiment shows the wireless communication circuit 470 forming holes 320 and conductivity through conductive structures forming a 45 degree angle with the second axis (e.g., z-axis). Reference may be made to the antenna gain graph at 40 GHz when feeding patches 420.

According to one embodiment, the wireless communication circuit 470 connects the holes 320 and conductive patches ( 420), the antenna gain at 40 GHz is up to about 13.6682 dB. Accordingly, when the wireless communication circuit 470 shown in FIG. 8 feeds the holes 320 and the conductive patches 420 through the conductive structures 450 parallel to the second axis (e.g., z-axis) 40 Considering that the antenna gain at GHz is 13.3288, it is confirmed that the antenna gain is improved by about 0.3 dB. As a result, the electronic device 101 provides an antenna in a second frequency band including 40 GHz by feeding the holes 320 and the conductive patches 420 through the conductive structures 950 forming a specified angle with the second axis. Benefits can be improved.

FIG. 14 shows graphs of reflection coefficients of conductive patches when a wireless communication circuit according to an embodiment feeds the conductive patches through conductive structures forming a specified angle with the second axis.

Referring to FIG. 14, the first graph 1410 according to one embodiment may be referred to as a reflection coefficient graph of the first hole 321 and the first conductive patch 421, and the second graph 1420 may be referred to as the reflection coefficient graph of the first hole 321 and the first conductive patch 421. 2 may be referred to as a reflection coefficient graph of the hole 322 and the second conductive patch 422, and the third graph 1430 may be referred to as a reflection coefficient graph of the third hole 323 and the third conductive patch 423. The fourth graph 1440 may be referred to as a reflection coefficient graph of the fourth hole 324 and the fourth conductive patch 424.

According to one embodiment, the first graph 1410, the second graph 1420, the third graph 1430, and the fourth graph 1440 are each about -10 dB or less in the first frequency band including 28 GHz. Shows the reflection coefficient value. Holes 320 through conductive structures 950 at a specified angle with the second axis, through which a reflection coefficient of less than about -10 dB is shown in a first frequency band comprising 28 GHz. It is confirmed that the specified antenna performance is secured in the first frequency band including 28 GHz when feeding.

In addition, the first graph 1410, the second graph 1420, the third graph 1430, and the fourth graph 14040 each have a reflection coefficient value of about -7 dB or less in the second frequency band including 40 GHz. shows. A reflection coefficient of about -7 dB or less in a second frequency band including 40 GHz is shown, so that the wireless communication circuit 470 is configured to conduct the conductive patches through the conductive structures 950 at a specified angle with the second axis. 420), it is confirmed that the specified antenna performance is secured in the second frequency band including 40 GHz.

Figure 15 is a diagram explaining conductive structures for forming a polarized signal according to another embodiment.

Referring to FIG. 15, the conductive structures 1550 according to an embodiment include a first conductive structure 1551, a second conductive structure 1552, a third conductive structure 1553, a fourth conductive structure 1554, It may include a fifth conductive structure 1555, a sixth conductive structure 1556, a seventh conductive structure 1557, and/or an eighth conductive structure 1558. In one embodiment, the conductive structures 1550 may be arranged to be spaced apart on a corresponding one of the conductive patches 420 . For example, the first conductive structure 1551 and the second conductive structure 1552 may be arranged to be spaced apart from each other on the first conductive patch 421 . The third conductive structure 1553 and the fourth conductive structure 1554 may be arranged to be spaced apart from each other on the second conductive patch 422 . The fifth conductive structure 1555 and the sixth conductive structure 1556 may be arranged to be spaced apart from each other on the third conductive patch 423 . The seventh conductive structure 1557 and the eighth conductive structure 1558 may be arranged to be spaced apart from each other on the fourth conductive patch 424 .

According to one embodiment, the conductive structures 1550 may be arranged to form a specified angle with each other. For example, the first conductive structure 1551 and the second conductive structure 1552 may be arranged to form a specified angle (eg, 90 degrees). For another example, the third conductive structure 1553 and the fourth conductive structure 1554 may be arranged to form a designated angle (eg, 90 degrees). As another example, the fifth conductive structure 1555 and the sixth conductive structure 1556 may be arranged to form a designated angle (eg, 90 degrees). For another example, the seventh conductive structure 1557 and the eighth conductive structure 1558 may be arranged to form a specified angle (eg, 90 degrees).

According to one embodiment, the wireless communication circuit 470 may be electrically connected to the conductive structures 1550, and the wireless communication circuit 470 supplies power to the conductive patches 420 through the conductive structures 1550. A first polarized signal and a second polarized signal may be transmitted and/or received. For example, the wireless communication circuit 470 is connected to the first conductive patch 421 and the first hole 321 by coupling through the first conductive structure 1551 and the second axis (eg, z axis) and the second axis. Power may be fed at an angle of 1 to form a first polarized signal in a third direction. The wireless communication circuit 470 forms a second angle with the second axis (e.g., z-axis) at the first conductive patch 421 and the first hole 321 by coupling through the second conductive structure 1552. can be fed to form a second polarized signal in the fourth direction. In one example, the third and fourth directions can be substantially perpendicular. In one example, the first angle may be -45 degrees and the second angle may be +45 degrees. In one example, the first conductive patch 421 may be coupled to the first conductive structure 1551 in a first region including a region that overlaps the first conductive structure 1551. The first conductive patch 421 may be coupled to the second conductive structure 1552 in a second region including a region overlapping with the second conductive structure 1552. In one example, the meaning of the overlapping area is that when looking at the antenna module 400 in a direction perpendicular to one side of the first conductive patch 421 (e.g., -x direction), the first conductive patch 421 and the second It may refer to an area where the first conductive structure 1551 or the second conductive structure 1552 overlaps.

For another example, the wireless communication circuit 470 is coupled to the second conductive patch 422 and the second hole 322 in a second axis (e.g., z-axis) by coupling through the third conductive structure 1553. A third polarized signal may be formed by feeding power at a first angle. The wireless communication circuit 470 forms a second angle with the second axis (e.g., z-axis) in the second hole 322 and the second conductive patch 422 by coupling through the fourth conductive structure 1554. Power can be fed to form a fourth polarized signal. In one example, the first angle may be -45 degrees and the second angle may be +45 degrees. In one example, the second conductive patch 422 may be coupled to the third conductive structure 1553 in a third region including a region that overlaps the third conductive structure 1553. The second conductive patch 422 may be coupled to the fourth conductive structure 1554 in a fourth region including a region overlapping with the fourth conductive structure 1554. In one example, the meaning of the overlapping area is that when the antenna module 400 is viewed in a direction perpendicular to one side of the second conductive patch 422 (e.g., -x direction), the second conductive patch 422 and the It may refer to an area where the third conductive structure 1553 or the fourth conductive structure 1554 overlaps.

As another example, the wireless communication circuit 470 is connected to the third conductive patch 423 and the third hole 323 by coupling through the fifth conductive structure 1555 and the second axis (e.g., z-axis). A fifth polarized signal may be formed by feeding power at a first angle. The wireless communication circuit 470 forms a second angle with the second axis (e.g., z-axis) in the third hole 323 and the third conductive patch 423 by coupling through the sixth conductive structure 1556. Power can be fed to form a sixth polarized signal. In one example, the first angle may be -45 degrees, and the second angle may be +45 degrees. In one example, the third conductive patch 423 may be coupled to the fifth conductive structure 1555 in a fifth region including a region overlapping with the fifth conductive structure 1555. The third conductive patch 423 may be coupled to the sixth conductive structure 1556 in a sixth region including a region overlapping with the sixth conductive structure 1556.

As another example, the wireless communication circuit 470 is connected to the fourth conductive patch 424 and the fourth hole 324 by coupling through the seventh conductive structure 1557 and the second axis (e.g., z-axis). A seventh polarized signal may be formed by feeding power at a first angle. The wireless communication circuit 470 forms a second angle with the second axis (e.g., z-axis) in the fourth hole 324 and the fourth conductive patch 424 by coupling through the eighth conductive structure 1558. The eighth polarization signal can be formed by feeding power. In one example, the first angle may be -45 degrees, and the second angle may be +45 degrees. In one example, the fourth conductive patch 424 may be coupled to the seventh conductive structure 1557 in a seventh region including a region overlapping with the seventh conductive structure 1557. The fourth conductive patch 424 may be coupled to the eighth conductive structure 1558 in an eighth region including a region overlapping with the eighth conductive structure 1558. In one embodiment, a first polarized signal formed in the first hole 321 and the first conductive patch 421, a third polarized signal formed in the second hole 322 and the second conductive patch 422, The fifth polarized signal formed in the third hole 323 and the third conductive patch 423 and/or the seventh polarized signal formed in the fourth hole 324 and the fourth conductive patch 424 are substantially in the same direction. It could be a polarized signal. A second polarized signal formed in the first hole 321 and the first conductive patch 421, a fourth polarized signal formed in the second hole 322 and the second conductive patch 422, and a third hole 323 And the sixth polarized signal formed in the third conductive patch 423 and/or the eighth polarized signal formed in the fourth hole 324 and the fourth conductive patch 424 may be polarized signals in substantially the same direction.

According to one embodiment, the electronic device 101 forms polarized signals by feeding each of the conductive patches 420 through at least two conductive structures forming a designated angle, thereby generating more data than when no polarized signal is formed. It can be transmitted to or received from an external device. In one embodiment, the method in which the wireless communication circuit 470 feeds each of the conductive patches 420 through two conductive structures may be substantially referred to as dual polarization feeding.

FIG. 16 is a diagram illustrating antenna gains corresponding to a first polarized signal and a second polarized signal in the frequency bands of 28 GHz and 40 GHz, respectively, according to an embodiment.

Referring to FIG. 16, the first graph 1611 according to an embodiment may be referred to as a graph of antenna gain corresponding to the first polarized signal in the 28 GHz frequency band. The second graph 1612 may be referred to as a graph of antenna gain corresponding to the second polarized signal in the 28 GHz frequency band.

Comparing the first graph 1611 and the second graph 1612 according to an embodiment, the antenna gain of the first graph 1611 is substantially the same as the antenna gain of the second graph 1612. Additionally, the maximum value of the antenna gain in the first graph 1611 and the second graph 1612 is about 11.0391 dB. Referring to FIG. 12, considering that the antenna gain at 28 GHz when the wireless communication circuit 470 feeds power to one point of each of the conductive patches 420 is up to about 11.3926 dB, the conductive patches 420 It is confirmed that substantially the same antenna performance is secured as in the case of single polarization feeding even when dual polarization feeding is performed.

According to one embodiment, the third graph 1613 may be referred to as a graph of antenna gain corresponding to the first polarized signal in the 40 GHz frequency band. The fourth graph 1614 may be referred to as a graph of antenna gain corresponding to the second polarized signal in the 40 GHz frequency band.

Comparing the third graph 1613 and the fourth graph 1614 according to an embodiment, the antenna gain of the third graph 1613 is substantially the same as the antenna gain of the fourth graph 1614. Additionally, the maximum value of the antenna gain in the third graph 1613 and the fourth graph 1614 is about 13.5229 dB. Considering that the antenna gain at 40 GHz when the wireless communication circuit 470 feeds power to one point of each of the conductive patches 420 in FIG. 13 is a maximum of about 13.6682 dB, the double antenna gain on the conductive patches 420 It is confirmed that substantially the same antenna performance is secured as in the case of single-wave feeding even when polarized feeding is used.

FIG. 17 is a diagram illustrating a cross-polarization discrimination graph of a first polarization signal and a second polarization signal in the frequency bands of 28 GHz and 40 GHz according to an embodiment.

Referring to FIG. 17, the first graph 1711 according to an embodiment may be referred to as a cross pole discrimination (XPD) graph corresponding to the first polarization signal in the 28 GHz frequency band. The second graph 1712 may be referred to as a cross pole discrimination (XPD) graph corresponding to the second polarization signal in the 28 GHz frequency band. In one embodiment, there is a difference of about 22 dB between the first graph 1711 and the second graph 1712. Therefore, it is confirmed that the first polarized signal and the second polarized signal do not cause interference or overlap with each other in the 28 GHz frequency band. That is, it is determined that polarization purity between the first polarized signal and the second polarized signal is secured in the 28 GHz frequency band.

The third graph 1713 according to one embodiment may be referred to as a cross pole discrimination (XPD) graph corresponding to the first polarization signal in the 40 GHz frequency band. The fourth graph 1714 may be referred to as a cross pole discrimination (XPD) graph corresponding to the second polarization signal in the 40 GHz frequency band. In one embodiment, there is a difference of about 17 dB between the third graph 1713 and the fourth graph 1714. Accordingly, it is confirmed that the first polarized signal and the second polarized signal do not cause interference or overlap with each other in the 40 GHz frequency band. That is, it is determined that polarization purity between the first polarized signal and the second polarized signal is secured in the 40 GHz frequency band.

FIG. 18 is a diagram comparing the antenna gains of the stacked conductive patches in the 28 GHz and 40 GHz frequency bands according to an embodiment with the antenna gains of the holes and conductive patches shown in FIG. 4.

Referring to FIG. 18, the first graph 1811 according to one embodiment is a graph of the antenna gain of the stacked conductive patches when the conductive patches are stacked in at least two layers on a PCB in the 28 GHz frequency band. The second graph 1812 is a graph of antenna gains of the holes 320 and the conductive patches 420 of the metal bezel 300 according to the embodiment shown in FIG. 4 in the 28 GHz frequency band. In one embodiment, the first graph 1811 and the second graph 1812 have a difference of about 0.5 dB, but the antenna performance is confirmed to be substantially the same.

The third graph 1813 according to one embodiment is a graph of the antenna gain of the conductive patches stacked in the 40 GHz frequency band when the conductive patches are stacked in at least two or more layers on the PCB. The fourth graph 1814 is a graph of antenna gains of the holes 320 and the conductive patches 420 of the metal bezel 300 according to the embodiment shown in FIG. 4 in the 40 GHz frequency band. In one embodiment, the maximum value of the antenna gain in the third graph 1813 and the fourth graph 1814 is approximately 13.6098, which is substantially the same, so it is confirmed that the antenna performance is substantially the same. As a result, even if the electronic device 101 uses the holes 320 and the conductive patches 420 as antenna radiators without using the stacked conductive patches, the electronic device 101 can secure substantially the same antenna performance. In addition, space for arranging electronic components within the electronic device 101 can be secured.

The electronic device 101 according to various embodiments disclosed in this document may include an antenna module 400 and a metal bezel 300 disposed adjacent to the antenna module 400, and the antenna module 400 may include a printed circuit board (PCB) 401, conductive patches 420 disposed on or adjacent to the first side of the PCB 401, and a wireless communication circuit 470. The metal bezel 300 includes holes 320 corresponding to the conductive patches 420, and as the metal bezel 300 is coupled to the antenna module 400, each of the holes 320 may be disposed closer to the outside of the electronic device 101 than the conductive patches 420, and the wireless communication circuit 470 feeds power to the holes 320 of the metal bezel 300 to provide the first A first signal in a frequency band may be transmitted and/or received, and a second signal in a second frequency band higher than the first frequency band may be transmitted and/or received by feeding the conductive patches 420. .

The electronic device according to one embodiment may further include a first dielectric disposed in the holes and a second dielectric disposed in the holes and disposed between the first dielectric and the first surface of the PCB, 1 dielectric may have a higher dielectric constant than the second dielectric.

An electronic device according to an embodiment may include a conductive structure spaced apart from the conductive patches and positioned upper of the conductive patches, and a wireless communication circuit electrically connected to the conductive structure may include the conductive structure. The first signal in the first frequency band may be transmitted and/or received by feeding power to the holes of the metal bezel, and the first signal in the second frequency band may be transmitted and/or received by feeding power to the conductive patches through the conductive structure. 2 Can transmit and/or receive signals.

According to one embodiment, the first frequency band may include at least a portion of 26 to 30 GHz, and the second frequency band may include at least a portion of 35 to 100 GHz.

According to one embodiment, the metal bezel is disposed adjacent to the antenna module, so that the metal bezel has a second side facing the first side of the PCB, and a third side facing in a direction opposite to the second side. may include.

According to one embodiment, the metal bezel has a first depth and is formed on the third surface and may further include grooves disposed closer to the exterior of the electronic device than the conductive patches, and the holes are formed in the third surface. It is formed at the bottom of the groove and may have a second depth from the bottom of the groove.

According to one embodiment, a non-conductive material may be disposed in the groove.

According to one embodiment, the conductive patches may include a first conductive patch and a second conductive patch located in a first direction with respect to the conductive patch.

An electronic device according to an embodiment includes a first conductive structure spaced apart from the first conductive patch and positioned on the first conductive patch, and a second conductive structure spaced apart from the second conductive patch and positioned on the second conductive patch. may include, wherein the first conductive structure may have a first angle with respect to a first axis perpendicular to the first direction and parallel to the first side of the PCB, and the second conductive structure may include the first conductive structure. It may have a second angle with respect to one axis, and the wireless communication circuit can feed power to the first conductive patch through the first conductive structure, and feed power to the second conductive patch through the second conductive structure. You can.

According to one embodiment, the first angle and the second angle may be substantially the same.

An electronic device according to an embodiment includes a first conductive structure spaced apart from the first conductive patch of the conductive patches and located above the first conductive patch, and a first conductive structure spaced apart from the first conductive patch and located above the first conductive patch. It may include a third conductive structure, and the third conductive structure may be disposed perpendicular to the first conductive structure on the first conductive patch.

According to one embodiment, the wireless communication circuit electrically connected to the first conductive structure and the third conductive structure may feed power to the first conductive patch through the first conductive structure to form a first polarized signal. And, the first conductive power can be supplied through the third conductive structure to form a second polarized signal.

According to one embodiment, the conductive patches may include a first conductive patch, a second conductive patch, a third conductive patch, and a fourth conductive patch, and the holes include a first hole corresponding to the first conductive patch, It may include a second hole corresponding to the second conductive patch, a third hole corresponding to the third conductive patch, and a fourth hole corresponding to the fourth conductive patch.

According to one embodiment, the conductive patches may be disposed on dielectrics disposed on the first side of the PCB, and the conductive patches on the first side of the PCB may be disposed between conductive vias. there is.

According to one embodiment, the metal bezel may form at least a portion of a side surface of the electronic device.

An electronic device 101 according to various embodiments disclosed in this document includes a metal bezel 300, a first side of which has holes 320 formed on at least a portion thereof and forms at least a portion of a side of the electronic device 101. A printed circuit board (PCB) 401 disposed toward the holes 320, conductive patches 420 disposed on or adjacent to the first side of the PCB 401, and the conductive patch. Each of the holes 420 corresponds to the holes 320, and as the PCB 401 is coupled to or placed adjacent to the metal bezel 300, each of the holes 320 is larger than the conductive patches 420. It may be disposed adjacent to the outside of the electronic device 101 and may include a wireless communication circuit 470 electrically connected to the conductive patches 420, and the wireless communication circuit 470 may be connected to the metal A first signal in a first frequency band may be transmitted and/or received by feeding power to the holes 320 of the bezel 300, and a second signal higher than the first frequency band may be transmitted by feeding power to the conductive patches 420. A second signal in a frequency band may be transmitted and/or received.

The electronic device according to an embodiment may further include a first dielectric disposed in the plurality of holes and a second dielectric disposed in the plurality of holes and between the first dielectric and the conductive patches, The first dielectric may have a higher dielectric constant than the second dielectric.

An electronic device according to an embodiment may include a conductive structure spaced apart from the conductive patches and positioned upper of the conductive patches, and a wireless communication circuit electrically connected to the conductive structure may include the conductive structure. The first signal in the first frequency band may be transmitted and/or received by feeding power to the metal bezel through coupling, and the second signal may be transmitted and/or received by feeding power to the conductive patches through coupling through the conductive structure. The second signal in the frequency band may be transmitted and/or received.

The conductive patches according to one embodiment may include a first conductive patch and a second conductive patch disposed to be spaced apart in a first direction with respect to the first conductive patch, and the electronic device may include the first conductive patch and the first conductive patch. It may include a first conductive structure spaced apart and located on the first conductive patch, and a second conductive structure spaced apart from the second conductive patch and located on the second conductive patch, wherein the first conductive structure is located on the second conductive patch. may have a first angle with respect to a first axis perpendicular to the first direction and parallel to the first side of the PCB, and the second conductive structure may have the first angle with respect to the first axis, The wireless communication circuit may supply power to the first conductive patch through the first conductive structure and may supply power to the second conductive patch through the second conductive structure.

An electronic device according to an embodiment includes a first conductive structure spaced apart from the first conductive patch of the conductive patches and located above the first conductive patch, and a first conductive structure spaced apart from the first conductive patch and located above the first conductive patch. It may further include a second conductive structure, and the second conductive structure may be perpendicular to the first conductive structure.

Claims (20)

In electronic devices,
Antenna module, said antenna module:
printed circuit board (PCB),
conductive patches disposed on or adjacent to the first side of the PCB, and
Contains wireless communications circuitry; and
A metal bezel disposed adjacent to the antenna module, the metal bezel including holes corresponding to the conductive patches, and as the metal bezel is disposed adjacent to the antenna module, each of the holes is configured to conduct the conductive patch. disposed closer to the exterior of the electronic device than patches;
The wireless communication circuit:
transmitting and/or receiving a first signal in a first frequency band by feeding power to the holes of the metal bezel,
An electronic device that supplies power to the conductive patches to transmit and/or receive a second signal in a second frequency band higher than the first frequency band. In claim 1,
a first dielectric disposed within the holes; and
Further comprising a second dielectric disposed within the holes and disposed between the first dielectric and the first surface of the PCB,
The first dielectric has a higher dielectric constant than the second dielectric. In claim 1,
It includes a conductive structure spaced apart from the conductive patches and positioned upper of the conductive patches,
The wireless communication circuit electrically connected to the conductive structure is:
transmitting and/or receiving the first signal in the first frequency band by feeding power to the holes of the metal bezel through the conductive structure,
An electronic device that transmits and/or receives the second signal in the second frequency band by feeding power to the conductive patches through the conductive structure. In claim 1,
The first frequency band includes at least a portion of 26 to 30 GHz,
The second frequency band includes at least a portion of 35 to 100 GHz. In claim 1,
The metal bezel is:
A second side facing the first side of the PCB as the metal bezel is disposed adjacent to the antenna module, and
An electronic device comprising a third side facing in an opposite direction to the second side. In claim 5,
The metal bezel has a first depth and is formed on the third surface and further includes grooves disposed closer to the exterior of the electronic device than the conductive patches,
The holes are formed in the bottom of the groove and have a second depth from the bottom of the groove. In claim 6,
An electronic device, wherein a non-conductive material is disposed in the groove. In claim 1,
The conductive patches include a first conductive patch and a second conductive patch located in a first direction with respect to the conductive patch. In claim 8,
A first conductive structure spaced apart from the first conductive patch and positioned on the first conductive patch, the first conductive structure having a first axis with respect to a first axis perpendicular to the first direction and parallel to the first side of the PCB. has 1 angle; and
A second conductive structure spaced apart from the second conductive patch and positioned on the second conductive patch, the second conductive structure having a second angle with respect to the first axis,
The wireless communication circuit:
Supplying power to the first conductive patch through the first conductive structure,
An electronic device that supplies power to the second conductive patch through the second conductive structure. In claim 9,
The first angle and the second angle are substantially equal. In claim 1,
a first conductive structure spaced apart from the first conductive patch of the conductive patches and positioned above the first conductive patch; and
A third conductive structure spaced apart from the first conductive patch and positioned above the first conductive patch, the third conductive structure being disposed perpendicular to the first conductive structure above the first conductive patch. Electronic devices. In claim 11,
The wireless communication circuit electrically connected to the first conductive structure and the third conductive structure is:
Forming a first polarized signal by feeding power to the first conductive patch through the first conductive structure,
An electronic device that feeds power to the first conductive patch through the third conductive structure to form a second polarized signal. In claim 1,
The conductive patches include a first conductive patch, a second conductive patch, a third conductive patch, and a fourth conductive patch,
The holes include a first hole corresponding to the first conductive patch, a second hole corresponding to the second conductive patch, a third hole corresponding to the third conductive patch, and a fourth hole corresponding to the fourth conductive patch. Electronic devices, including. In claim 1,
The conductive patches are disposed on dielectrics disposed on the first side of the PCB,
wherein the conductive patches on the first side of the PCB are disposed between conductive vias. In claim 1,
The metal bezel forms at least a portion of a side of the electronic device. In electronic devices,
a metal bezel forming at least a portion of a side of the electronic device, and a plurality of holes formed in at least a portion of the metal bezel;
a printed circuit board (PCB) whose first side faces the plurality of holes;
Conductive patches disposed on or adjacent to the first side of the PCB, each of the conductive patches corresponding to the plurality of holes, when the PCB is coupled to or adjacent to the metal bezel. Each of the holes is disposed closer to the outside of the electronic device than the conductive patches; and
Comprising a wireless communication circuit electrically connected to the conductive patches,
The wireless communication circuit:
Transmitting and/or receiving a first signal in a first frequency band by feeding power to the plurality of holes in the metal bezel,
An electronic device that supplies power to the conductive patches to transmit and/or receive a second signal in a second frequency band higher than the first frequency band. In claim 16,
a first dielectric disposed in the plurality of holes; and
Further comprising a second dielectric disposed in the plurality of holes and disposed between the first dielectric and the conductive patches,
The first dielectric has a higher dielectric constant than the second dielectric. In claim 16,
It includes a conductive structure spaced apart from the conductive patches and positioned upper of the conductive patches,
The wireless communication circuit electrically connected to the conductive structure is:
transmitting and/or receiving the first signal in the first frequency band by feeding power to the metal bezel through coupling through the conductive structure,
An electronic device that transmits and/or receives the second signal in the second frequency band by feeding power through coupling to the conductive patches through the conductive structure. In claim 16,
The conductive patches include a first conductive patch and a second conductive patch arranged to be spaced apart in a first direction with respect to the first conductive patch,
The electronic device:
A first conductive structure spaced apart from the first conductive patch and positioned on the first conductive patch, the first conductive structure having a first axis with respect to a first axis perpendicular to the first direction and parallel to the first side of the PCB. has 1 angle; and
A second conductive structure spaced apart from the second conductive patch and positioned on the second conductive patch, the second conductive structure having the first angle with respect to the first axis,
The wireless communication circuit:
Supplying power to the first conductive patch through the first conductive structure,
An electronic device that supplies power to the second conductive patch through the second conductive structure. In claim 16,
a first conductive structure spaced apart from the first conductive patch of the conductive patches and positioned above the first conductive patch; and
A second conductive structure spaced apart from the first conductive patch and positioned above the first conductive patch, the second conductive structure being perpendicular to the first conductive structure.

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