KR20230129873A - A camera module and optical apparatus having the same - Google Patents

Abstract

The camera module according to the embodiment includes a reinforcement plate; a circuit board disposed on the reinforcement plate and including a cavity; A sensor disposed on an area of the upper surface of the reinforcement plate that overlaps with the cavity of the circuit board along an optical axis; and a filter unit disposed on the circuit board, wherein the filter unit includes a filter and a base integrated with the filter.

Description

Camera module and optical device including the same {A CAMERA MODULE AND OPTICAL APPARATUS HAVING THE SAME}

The embodiment relates to a camera module and an optical device including the same.

Recently, ultra-small camera modules have been developed. And ultra-small camera modules are widely used in small electronic products such as smartphones, laptops, and game consoles.

That is, most mobile electronic devices, including smartphones, are equipped with a camera device to obtain images from objects. At this time, mobile electronic devices are gradually becoming smaller for easy portability.

These camera modules generally include a lens through which light enters, an image sensor through which light incident through the lens is captured, and a plurality of devices for transmitting and receiving electrical signals for images obtained from the image sensor to electronic devices equipped with the camera module. Includes parts. Additionally, these image sensors and components are mounted on a general printed circuit board and connected to external electronic devices.

At this time, in the case of a camera module applied to the above electronic devices, impacts may be frequently applied to the camera module during use. Additionally, the camera module may experience slight shaking due to the user's hand shaking during the shooting operation. Accordingly, taking this into consideration, a camera module equipped with an anti-shake function is being provided.

Meanwhile, the camera module as described above includes a filter mounting portion called an inner base, holder, or sensor base that is disposed between the lens module and the image sensor.

However, the filter mounting part according to the prior art is a part manufactured by injection using resin. Accordingly, according to the prior art, there is a limit to reducing the thickness of the filter mounting portion. Also, due to the limit of the minimum thickness of the filter mounting portion, there is a limit to reducing FBL, which is the vertical distance between the lens and the image sensor. For example, parts manufactured by injection have a problem in that extractability from the mold decreases as the thickness decreases. In addition, parts manufactured by injection have a problem in that deformation occurs when extracted from the mold as the thickness decreases. Accordingly, the filter mounting part according to the prior art must have a thickness above a certain level.

Additionally, as the resolution of the camera module increases, the size of the sensor is increasing, and as the size of the sensor increases, the size of the filter also increases. In the case of filter mounting parts manufactured by injection molding according to the prior art, there is a limit to increasing the size due to flatness and warpage problems.

Accordingly, there is a need for a filter mounting part with a new structure that can maintain a certain level of flatness even when the thickness is reduced and maintain a certain level of rigidity even when the size in the horizontal direction increases.

(Patent Document 1) KR 10-2015-0030906 A

The embodiment provides a camera module including a base of a new structure and an optical device including the same.

Additionally, the embodiment provides a camera module including a base directly coupled to a filter using an ultraviolet curing material and an optical device including the same.

Additionally, the embodiment provides a camera module capable of reducing the thickness of the base and an optical device including the same.

Additionally, the embodiment provides a camera module that can improve design freedom and an optical device including the same.

Additionally, the embodiment provides a camera module that can remove the injection base included in the prior art and an optical device including the same.

Additionally, the embodiment provides a camera module that can improve the flatness and bending characteristics of a filter and an optical device including the same.

Additionally, the embodiment provides a camera module capable of reducing FBL and an optical device including the same.

The technical problems to be solved in the embodiment are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below. You will be able to.

The camera module according to the embodiment includes a reinforcement plate; a circuit board disposed on the reinforcement plate and including a cavity; A sensor disposed on an area of the upper surface of the reinforcement plate that overlaps with the cavity of the circuit board along an optical axis; and a filter unit disposed on the circuit board, wherein the filter unit includes a filter and a base integrated with the filter.

Additionally, the base includes a cured material that is cured to the underside of the filter.

Additionally, the base includes an ultraviolet curable material.

Additionally, the upper surface of the base is in direct contact with the lower surface of the filter.

Additionally, the base is disposed in a frame shape at an edge area of the lower surface of the filter.

Additionally, the outer width of the base is smaller than the outer width of the filter.

Additionally, the base is arranged to be spaced inward from the outer end of the lower surface of the filter.

Additionally, the width between the outer end of the base and the outer end of the filter satisfies the range of 30㎛ to 100㎛.

In addition, the camera module further includes a connecting member connecting the terminal of the sensor and the pad of the circuit board, the uppermost end of the connecting member is located higher than the upper surface of the circuit board, and the lower surface of the filter is connected to the connecting member. It is located higher than the top of.

Additionally, the thickness of the base satisfies the range of 150㎛ to 450㎛.

Additionally, the camera module further includes an adhesive portion disposed between the circuit board and the base.

Additionally, the circuit board includes a ground pattern, and the adhesive part is disposed on the ground pattern.

The camera module of the embodiment includes a filter module. The filter module is placed on a circuit board electrically connected to the sensor. At this time, the filter module includes a filter unit and a base. At this time, the base may be integrated with the filter unit. Here, the integration may mean that no additional components exist between the base and the filter unit. Specifically, in the embodiment, an adhesive member for attaching the filter unit to the base may be omitted.

Specifically, the base in the prior art is manufactured separately from the filter unit. For example, in the prior art, the base is an injection molded product made of an insulating material. And in the prior art, after manufacturing the base through an injection process, a process of combining the base and the filter unit using an adhesive member is performed.

In contrast, in the embodiment, the filter unit is disposed with the ultraviolet curable material applied. In addition, the ultraviolet curing process can be performed with the ultraviolet curing material before curing placed at the bottom of the filter unit. Accordingly, in the embodiment, the process of manufacturing the base and the process of combining the base and the filter unit can be performed in one process, thereby simplifying the manufacturing process. Furthermore, in the embodiment, the manufacturing cost of the base can be reduced. As a result, in the embodiment, the product price of the camera module can be lowered.

Additionally, in the embodiment, the thickness of the filter module can be reduced by omitting the adhesive member additionally disposed between the base and the filter unit. For example, in an embodiment, the thickness of the filter module may be reduced by the thickness of the adhesive member. Accordingly, in the embodiment, the FBL of the camera module can be reduced.

Additionally, in an embodiment, the width (or planar area) of the filter module may be reduced. For example, in the prior art, the width or planar area of the base was larger than the width or planar area of the filter portion. Accordingly, in the prior art, the width of the filter module was determined by the width of the base. Accordingly, in the prior art, the area of the space for arranging the filter module was larger than the area of the filter unit. Accordingly, in the prior art, the width of the camera module increased, and the overall volume of the camera module accordingly increased.

Alternatively, the width of the base in the embodiment is smaller than the width of the filter module. And, in the embodiment, the width of the filter module is determined by the width of the filter unit, not the width of the base. Accordingly, in the embodiment, the area of the space where the filter module is placed can be reduced compared to the prior art. Accordingly, in the embodiment, the width of the camera module can be reduced, and thus the overall volume (eg, width and/or height) of the camera module can be reduced.

Additionally, in an embodiment, a base corresponding to the size and shape of the filter unit may be provided. That is, in the prior art, since the base is manufactured through an injection process, it may be difficult to apply filters of various sizes or shapes. In addition, in the prior art, there is a problem in that the reliability of the connection between the base and the filter unit is reduced depending on the injection process. In contrast, in the embodiment, since the base is integrated with the filter unit, it is possible to respond to various shapes and sizes of the filter unit. Accordingly, in the embodiment, design freedom can be improved. Furthermore, in an embodiment, the coupling reliability between the filter unit and the base can be improved by providing a base integrated with the filter unit. As a result, in the embodiment, the operational reliability and product reliability of the camera module can be improved.

Meanwhile, in the embodiment, the thickness of the base can be reduced compared to the prior art. Specifically, in the prior art, the base is manufactured by an injection process. Accordingly, in the prior art, issues such as undermolding in the injection process, deformation issues in the extraction process after injection, and flatness issues of the filter unit must be taken into consideration. As a result, there is a limit to reducing the thickness of the base in the prior art. In contrast, in the embodiment, a base integrated with the filter unit is provided by performing an ultraviolet curing process. Accordingly, in the embodiment, there is no need to consider short-forming issues and deformation issues in the prior art. As a result, in the embodiment, the minimum thickness that the base must have can be reduced compared to the prior art. Accordingly, in the embodiment, manufacturing costs can be reduced by reducing the thickness of the base, and further, the unit price of the product can be lowered. Additionally, in the embodiment, the Flange Back Length (FBL) can be reduced to correspond to the reduced thickness of the base. As a result, in the embodiment, the overall thickness or volume of the camera module can be reduced.

Meanwhile, the filter module in the embodiment may be connected to a ground pattern included in the circuit board. For example, the circuit board in the embodiment includes a ground pattern exposed through an opening in the protective layer. Additionally, an adhesive portion for coupling or attaching the filter module to the circuit board may be disposed on the ground pattern. Accordingly, in the embodiment, the coupling reliability between the circuit board and the filter module can be further improved. Furthermore, in the embodiment, the heat transferred to the filter module is discharged through the ground pattern of the circuit board. Accordingly, in the embodiment, the heat dissipation characteristics of the camera module can be further improved.

1 is a perspective view of a camera module according to an embodiment.
Figure 2 is an exploded perspective view of a camera module according to an embodiment.
Figure 3 is a cross-sectional view taken in the direction AA' of the camera module of Figure 1.
Figure 4 is an enlarged view of a partial area of Figure 3.
Figure 5 is an exploded perspective view of a filter module according to an embodiment.
Figure 6 is a plan view of a filter module according to an embodiment.
Figure 7 is a cross-sectional view of a filter module according to an embodiment cut along the AA' direction.
Figure 8 is an enlarged view of a portion of Figure 6.
Figure 9 is a combination diagram of a filter module and a circuit board according to an embodiment.
Figure 10 is a perspective view of a portable terminal according to an embodiment.
FIG. 11 is a configuration diagram of the portable terminal shown in FIG. 10.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining and replacing.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology.

Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and B and C", it is combined with A, B, and C. It can contain one or more of all possible combinations.

Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and are not limited to the essence, sequence, or order of the component. And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also is connected to the other component. It may also include cases where other components are 'connected', 'coupled', or 'connected' by another component between them.

Additionally, when described as being formed or disposed "above" or "below" each component, "above" or "below" refers not only to cases where two components are in direct contact with each other, but also to one This also includes cases where another component described above is formed or placed between two components. In addition, when expressed as "top (above) or bottom (bottom)", it can include not only the upward direction but also the downward direction based on one component.

The optical axis direction used below can be defined as the optical axis direction of the lens coupled to the camera actuator and camera module, and the vertical direction can be defined as the direction perpendicular to the optical axis.

The autofocus function used below is a function that automatically focuses on the subject by adjusting the distance to the image sensor by moving the lens in the direction of the optical axis according to the distance to the subject so that a clear image of the subject can be obtained on the image sensor. It can be defined.

Meanwhile, autofocus can correspond to AF (Auto Focus). In addition, auto focus feedback (CLAF, closed-loop auto focus) control is defined as real-time feedback control of the lens position by detecting the distance between the image sensor and the lens to improve the accuracy of focus control. can do.

Additionally, before describing an embodiment of the invention, the first direction may refer to the x-axis direction shown in the drawing, and the second direction may be a direction different from the first direction. For example, the second direction may refer to the y-axis direction shown in the drawing, which is perpendicular to the first direction. Additionally, the third direction may be different from the first and second directions. For example, the third direction may refer to the z-axis direction shown in the drawing, which is perpendicular to the first and second directions. Here, the third direction may mean the optical axis direction.

Hereinafter, a camera module and an optical device including the same according to an embodiment will be described in detail.

FIG. 1 is a perspective view of a camera module according to an embodiment, FIG. 2 is an exploded perspective view of a camera module according to an embodiment, FIG. 3 is a cross-sectional view in the direction A-A' of the camera module of FIG. 1, and FIG. 4 is a cross-sectional view of the camera module of FIG. 3. It is an enlarged view of a partial area, Figure 5 is an exploded perspective view of a filter module according to an embodiment, Figure 6 is a plan view of a filter module according to an embodiment, and Figure 7 is a filter module according to an embodiment cut along the A-A' direction. It is a cross-sectional view, FIG. 8 is an enlarged view of a partial area of FIG. 6, and FIG. 9 is a combined diagram of a filter module and a circuit board according to an embodiment. In addition, Figure 6 (a) is a plan view of the filter module viewed from the upper side (e.g., the position where the lens is placed), and Figure 6 (b) is a plan view of the filter module from the lower side (e.g., the position where the sensor is placed). ) This is a floor plan seen from ).

Hereinafter, the camera module of the embodiment will be described in detail with reference to FIGS. 1 to 9.

The camera module 100 according to the embodiment includes a lens 110, a lens barrel 120, a lens driving device 130, a filter unit 140, a base 150, a circuit board 160, and a reinforcement plate 170. , may include a sensor 180 and an adhesive portion 190.

Here, the camera module 100 can be expressed as an image sensor or a camera. Additionally, the base 150 can be expressed as a holder, sensor base, inner base, filter mounting part, or filter seating part, etc. Additionally, the lens driving device 130 may also be referred to as an actuator that drives the lens 110 or the lens barrel 120.

The lens 110 or the lens barrel 120 may be coupled to the lens driving device 130. For example, the lens 110 or the lens barrel 120 may be mounted on the lens driving device 130.

For example, the lens 110 may be mounted within the lens barrel 120. Also, the lens barrel 120 may be mounted on the lens driving device 130.

At this time, the lens driving device 130 includes a bobbin (not shown). Additionally, the lens barrel 120 may be coupled to the bobbin of the lens driving device 130.

An adhesive portion 190 may be disposed between the outer surface of the lens barrel 120 and the inner surface of the bobbin of the lens driving device 130. And the lens barrel 120 may be coupled to the bobbin of the lens driving device 130 through the adhesive portion 190. At this time, the lens barrel 120 may move together with the bobbin corresponding to the moving part of the lens driving device 130. As will be explained later, the lens driving device 130 includes a fixed part whose position is fixed and a moving part that moves relative to the fixed part. And, the moving part of the lens driving device 130 includes the bobbin. At this time, the lens barrel 120 is coupled to the bobbin of the moving part of the lens driving device 130. Accordingly, when the moving part of the lens driving device 130 moves, the lens barrel 120 can move together with the moving part.

That is, the lens driving device 130 can drive the lens barrel 120 to which the lens 110 is coupled.

The lens 110 may be an optical system in which three or more lenses are stacked. The lens 110 may be an optical system in which five or more lenses are stacked. The lens 110 may be an optical system in which eight or more lenses are stacked. At this time, the lens 110 is shown in the drawing as including 8 lenses, but it is not limited thereto. For example, the lens 110 may have a stacked structure of less than 8 elements, or alternatively, it may have a stacked structure of 9 or more elements.

The lens 110 may include a lens made of plastic. The lens 110 according to an embodiment of the invention may include a first lens unit made of plastic and a second lens unit made of glass. Additionally, the number of lenses of the first lens unit made of plastic may be greater than the number of lenses of the second lens unit made of glass. For example, the number of lenses in the first lens unit made of plastic may be two or more.

In one embodiment, lens 110 may be laminated with plastic lenses and/or glass lens(s). Here, the coefficient of thermal expansion (CTE) of the plastic material is more than 5 times higher than that of the glass material, and the change value of the refractive index (|dN/Dt|) as a function of temperature can be more than 10 times higher for the plastic material than for the glass material. . Here, dN is the change value of the refractive index of the lens, and dT represents the change value of temperature.

Additionally, the camera module 100 may be either a camera module for Auto Focus (AF) or a camera module for Optical Image Stabilizer (OIS). The AF camera module is capable of performing only the autofocus function. And the camera module for OIS refers to one that performs the autofocus function and OIS function.

For example, the lens driving device 130 may be a lens driving device for AF or a lens driving device for OIS. Here, the meanings of “for AF” and “for OIS” may be the same as those described in the camera module for AF and the camera module for OIS.

For example, the lens driving device 130 of the camera module 100 may be a lens driving device for OIS.

The lens driving device 130 may include a housing 131 and a bobbin 132 disposed within the housing 131 and coupled to the lens barrel 120.

Additionally, although not specifically shown in the drawings, the lens driving device 130 may include a first coil (not shown) coupled to the bobbin 132. Additionally, the lens driving device 130 may include a magnet (not shown) that is coupled to the housing 131 and faces the first coil.

Additionally, the lens driving device 130 may include at least one upper elastic member (not shown) coupled to the upper part of the housing 131 and the upper part of the bobbin 132. Additionally, the lens driving device 130 may include at least one lower elastic member (not shown) coupled to the lower portion of the housing 131 and the lower portion of the bobbin 132.

Additionally, the lens driving device 130 may include a second coil (not shown) disposed under the bobbin 132 or the housing 131. Additionally, the lens driving device 130 may include a driving substrate (not shown) disposed below the second coil. Additionally, the lens driving device 130 may include a frame portion (not shown) disposed below the driving substrate.

Meanwhile, the bobbin 132 may also be referred to as a 'holder' to which the lens barrel 120 is coupled.

In addition, the lens driving device 130 is coupled to the frame portion and may include a cover member 133 that provides a space for accommodating components of the lens driving device 130 together with the frame portion. .

Additionally, the lens driving device 130 may further include a support member (not shown) that electrically connects the driving substrate and the upper elastic member and supports the housing 131 with respect to the frame portion. Each of the first coil and the second coil is electrically connected to a driving substrate and can receive a driving signal (driving current) from the driving substrate.

For example, the upper elastic member may include a plurality of upper springs. And the support member may include support members connected to the upper springs of the upper elastic member. Additionally, the first coil may be electrically connected to the driving substrate through upper springs and a support member. The driving board may include a plurality of terminals. The first coil and/or the second coil may be electrically connected to some of the plurality of terminals.

The lens driving device 130 of the embodiment may move the bobbin 132 and the lens barrel 120 to be coupled to the bobbin 132 in the optical axis direction by electromagnetic force resulting from the interaction between the first coil and the magnet. And the position of the lens barrel 120 and the lens 110 coupled to the lens barrel 120 in the optical axis direction can be controlled by the electromagnetic force. And by this, AF driving can be implemented.

Additionally, the lens driving device 130 may move the housing 131 in a direction perpendicular to the optical axis by electromagnetic force generated by the interaction between the second coil and the magnet. By this, hand shake correction or OIS driving can be implemented.

Additionally, the lens driving device 130 of the camera module 100 may include a position sensor unit (not shown) for AF feedback driving. The position sensor unit may include a sensing magnet (not shown) disposed on the bobbin 132 and an AF position sensor (e.g., hall sensor, not shown) disposed in the housing 131. there is.

Additionally, the lens driving device 130 may be disposed on the housing 131 or/and the frame portion and may further include a sensor substrate (not shown) on which the AF position sensor is disposed or mounted. In another embodiment, the AF position sensor may be placed on the bobbin 132, and the sensing magnet may be placed on the housing 131. Additionally, the lens driving device 130 may further include a balancing magnet (not shown) disposed on the bobbin 132 in response to the sensing magnet.

The AF position sensor detects the strength of the magnetic field of the sensing magnet according to the movement of the bobbin 132. And the AF position sensor can generate an output signal according to the result of the detection. The AF position sensor may be electrically connected to the driving substrate through an upper elastic member (or lower elastic member) and/or a support member. The driving substrate may provide a driving signal to the AF position sensor. And the driving substrate can receive the output signal of the AF position sensor.

In another embodiment, the lens driving device 130 may be an AF lens driving device, and the AF lens driving device includes a housing 131, a bobbin 132 disposed inside the housing 131, and a bobbin 132. It may include a coil disposed, a magnet disposed in the housing 131, at least one elastic member coupled to the bobbin 132 and the housing 131, and a frame portion disposed below the bobbin (or/and housing). You can.

For example, the elastic member may include the upper elastic member and the lower elastic member described above.

The coil may be provided with a drive signal (eg, drive current). And the bobbin 132 can be moved in the optical axis direction by electromagnetic force generated by the interaction between the coil and the magnet based on the provided driving signal.

In another embodiment, the coil may be placed in the housing, and the magnet may be placed in the bobbin 132.

In addition, for AF feedback driving, the AF lens driving device includes a sensing magnet disposed on the bobbin 132, an AF position sensor (e.g., hall sensor), and AF disposed on the housing 131. The position sensor may further include a sensor substrate disposed or mounted on the housing or/and the frame. In another embodiment, the AF position sensor is disposed on the bobbin 132, and the sensing magnet is disposed on the housing 131. It could be.

A camera module according to another embodiment may include a housing coupled to a lens or lens barrel 120 instead of the lens driving device 130 of FIG. 1. Additionally, the housing may be coupled or attached to the upper surface of the base 150. At this time, the housing may be attached or fixed to the base 150 and may not move. For example, the position of the housing may be fixed while attached to the base 150.

The circuit board may be electrically connected to the coil and the AF position sensor, a driving signal may be provided to each of the coil and the AF position sensor through the circuit board, and the output of the AF position sensor may be transmitted to the circuit board.

The filter unit 140 may be mounted or disposed on the base 150.

Preferably, the base 150 may be attached to the filter unit 140. That is, the base 150 in the embodiment may include a hardened material. In addition, the base 150 can be cured while placed on the lower surface of the filter unit 140. Accordingly, the base 150 can directly contact the filter unit 140. For example, the filter unit 140 and the base 150 may be integrated. Here, the integration does not mean that the filter unit 140 and the base 150 are made of one body and contain the same material. In other words, the integration may mean that no other components are disposed between the filter unit 140 and the base 150.

That is, the base 150 is placed on the lower surface of the filter unit 140 before hardening. In addition, the base 150 can be cured while placed on the lower surface of the filter unit 140. Accordingly, the base 150 may be formed integrally with the filter unit 140.

Accordingly, in the embodiment, there is no additional adhesive member between the base 150 and the filter unit 140. And in the embodiment, the vertical distance from the lower surface of the base 150 to the upper surface of the filter unit 140 is reduced by removing the adhesive member disposed between the base 150 and the filter unit 140. You can. And, in an embodiment, FBL can be reduced by reducing the vertical distance. This will be explained in more detail below.

The base 150 may have a frame shape and be disposed on the lower surface of the filter unit 140. Specifically, the base 150 may have a square frame shape. However, the embodiment is not limited to this. For example, the base 150 may have a shape other than a square frame shape.

However, the base 150 may correspond to the shape of the filter unit 140. For example, the filter unit 140 may have a square plate shape. And the base 150 may have a square frame shape corresponding to the shape of the filter unit 140.

The base 150 includes a hardenable material. Preferably, the base 150 includes an ultraviolet curable material. For example, the base 150 may include an ultraviolet curable epoxy that can be cured by irradiation of ultraviolet rays, but is not limited thereto.

Meanwhile, according to the prior art, the base is manufactured separately from the filter unit. For example, in the prior art, the base is an injection molded product made of an insulating material. In addition, in the prior art, after manufacturing the base through an injection process, a process of combining the base and the filter unit using an adhesive member is performed.

In contrast, in the embodiment, the filter unit is disposed with the ultraviolet curable material applied. In addition, the ultraviolet curing process can be performed with the ultraviolet curing material before curing disposed in the lower portion of the filter unit. Accordingly, in the embodiment, the process of manufacturing the base and the process of combining the base and the filter unit can be performed in one process, thereby simplifying the manufacturing process.

Additionally, in the embodiment, by providing the base 150 integrated with the filter unit 140 as described above, it is possible to respond to various shapes and sizes of the filter unit 140. Furthermore, in the embodiment, since there is no additional adhesive member between the filter unit 140 and the base 150, the reliability of the connection between the filter unit 140 and the base 150 can be further improved.

Meanwhile, the base 150 is disposed at the edge area of the lower surface of the filter unit 140. At this time, the base 150 is disposed at a certain distance inward from the edge area of the lower surface of the filter unit 140. For example, the outermost end of the base 150 may be located closer to the optical axis than the outermost end of the filter unit 140. For example, the outermost end of the base 150 may be located inside the outermost end of the filter unit 140.

Accordingly, in the embodiment, the width of the filter module including the filter unit 140 in the base 150 can be reduced. For example, in the prior art, the width of the base was larger than the width of the filter portion. For example, in the prior art, the outermost end of the base was located further outside than the outermost end of the filter unit. Accordingly, in the prior art, the width of the filter module was determined by the width of the base, not the width of the filter unit. And in the prior art, when the size of the filter unit increases, the size of the base is increased larger than the increase in size of the filter unit in order to stably support it. Accordingly, in the prior art, the area of space required to place the filter module within the camera module increased. Accordingly, the prior art had the problem of increasing the overall width and thickness of the camera module.

Differently, the width of the filter module in the embodiment is determined by the width of the filter unit 140 rather than the width of the base 150. For example, when filter units of the same size are applied, the width of the filter module in the embodiment is smaller than that of the filter module in the prior art. Accordingly, in the embodiment, the area of space required to place the filter module within the camera module can be reduced. Accordingly, in the embodiment, the overall width and thickness of the camera module can be reduced.

Additionally, in the embodiment, since the base 150 is integrated with the filter unit 140, the minimum thickness that the base 150 must have can be reduced. For example, as in the prior art, the base is an injection molded product manufactured using an insulating material. Accordingly, in the prior art, the thickness of the base is determined taking into account injection properties and extractability in the injection process.

For example, the base in the prior art must take into account the thickness of the protrusion corresponding to the protrusion height of the connecting member (described later), the thickness of the seating portion where the filter part can be stably seated, and the thickness of the injection molded product that can be injected. Accordingly, there is a limit to reducing the thickness of the base in the prior art.

In contrast, the base 150 in the embodiment is integrated with the filter unit 140. Accordingly, in the base 150 in the embodiment, the protrusion of the base of the prior art can function as a seating part. Accordingly, in the embodiment, the thickness of the base 150 can be reduced by the thickness of the seating portion of the prior art. Furthermore, in the embodiment, there is no need to consider injection properties or extractability in the prior art at all. As a result, in the embodiment, the minimum overall thickness that the base 150 must have can be reduced compared to the prior art. Accordingly, in the embodiment, the Flange Back Length (FBL) can be reduced by reducing the thickness of the base 150.

Meanwhile, the base 150 has a square frame shape on the lower surface of the filter unit 140. Specifically, the base 150 overlaps a portion of the lower surface of the filter unit 140 along the optical axis. Preferably, the base 150 has an opening that overlaps at least a portion of the lower surface of the filter unit 140 along the optical axis. For example, the base 150 may have a structure that protrudes toward the sensor 180 only on a portion of the lower surface of the filter unit 140.

The filter unit 140 is disposed on the base 150. Preferably, the filter unit 140 is integrated with the base 150. That is, the filter unit 140 is directly attached to the base 150. For example, there are no additional components between the filter unit 140 and the base 150. For example, the lower surface of the filter unit 140 directly contacts the upper surface of the base 150.

The filter unit 140 may function to block light of a specific frequency band from light passing through the lens 110 accommodated in the lens 110 .

For example, the filter unit 140 may block light in a specific frequency band from being incident on the sensor 180. For example, the filter unit 140 may be an infrared filter. However, the embodiment is not limited to this. For example, depending on the characteristics of the camera module, the filter unit 140 may include a filter other than an infrared filter.

The filter unit 140 may be arranged parallel to a direction perpendicular to the optical axis (eg, width direction, length direction, or x-y plane direction).

The circuit board 160 may be placed below the base 150. For example, the base 150 integrated with the filter unit 140 may be attached or coupled to the circuit board 160.

For this purpose, an adhesive portion 145 may be disposed between the base 150 and the circuit board 160.

The adhesive portion 145 may be disposed between the upper surface of the circuit board 160 and the lower surface of the base 150. The adhesive portion 145 may be in direct contact with the ultraviolet curing material constituting the base 150. At this time, the base 150 is a part that has already been hardened during the filter module manufacturing process. Accordingly, no deformation of the base 150 occurs in the process of attaching the base 150 using the adhesive portion 145.

The adhesive portion 145 allows the base 150 integrated with the filter portion 140 to be stably placed or coupled to the circuit board 160. For example, the adhesive part 145 may fix the base 150 on the circuit board 160.

Meanwhile, the circuit board 160 may include a cavity C that overlaps the opening of the base 150 perpendicularly or along an optical axis.

At this time, the cavity C may mean a through hole penetrating the circuit board 160. For example, the circuit board 160 includes at least one insulating layer. Additionally, the cavity C may penetrate from the upper surface of the insulating layer disposed on the uppermost side of the circuit board 160 to the lower surface of the insulating layer disposed on the lowermost side of the circuit board 160 . Accordingly, the circuit board 160 may include a hollow corresponding to the cavity (C). At this time, the cavity C may function as an arrangement space where the sensor 180 in the embodiment is placed. For example, the sensor 180 may be placed within the cavity (C). At this time, the sensor 180 may be spaced apart from the inner wall of the cavity (C). Accordingly, the sensor 180 may not directly contact the circuit board 160.

At this time, the cavity C of the circuit board 160 may overlap the lens 110 of the embodiment along the optical axis. For example, the cavity C of the circuit board 160 may overlap the filter unit 140 along the optical axis. For example, the cavity C of the circuit board 160 may overlap the sensor 180 along the optical axis. At this time, the size of the cavity C may be larger than the size of the sensor 180. Additionally, the size of the cavity C may be larger than the size of the filter unit 140 or the size of the lens 110, or may be smaller than these.

The camera module 100 of the embodiment includes a sensor 180. The sensor 180 may also be referred to as an image sensor. For example, the sensor 180 may refer to a sensor that acquires an image using light that has passed through the lens 110 and the filter unit 140 of the embodiment. The sensor 180 may overlap the cavity C formed in the circuit board 160 of the embodiment with an optical axis. For example, the sensor 180 may be placed in the cavity C formed in the circuit board 160.

The camera module 100 of the embodiment may include a reinforcement plate 170.

The reinforcement plate 170 may be attached to the lower surface of the circuit board 160.

The reinforcement plate 170 may include an overlap area that overlaps the cavity C of the circuit board 160 along the optical axis.

And the sensor 180 may be attached on the overlap area of the reinforcement plate 170. For example, the sensor 180 may be attached to the upper surface of the overlap area of the reinforcement plate 170 while being placed in the cavity C of the circuit board 160.

In other words, the resolution required for camera modules has been increasing recently. And as the resolution increases, the size of the sensor 180 increases. At this time, when the sensor 180 is placed on the circuit board 160, it may be difficult to maintain the flatness of the sensor 180 as its size gradually increases. Additionally, when the sensor 180 is disposed on the circuit board 160, the heat dissipation characteristics of the sensor 180 may deteriorate.

Accordingly, in the embodiment, a reinforcement plate 170 is attached to the lower surface of the circuit board 160. And in the embodiment, the sensor 180 can be attached to the reinforcement plate 170 rather than the circuit board 160.

For example, the sensor 180 in this embodiment may be directly attached to the reinforcement plate 170. Here, the directly attached may mean that the sensor 180 is placed directly on an adhesive portion (described later) disposed on the reinforcement plate 170.

Meanwhile, the sensor 180 may be exposed through the cavity C of the circuit board 160 while placed on the reinforcement plate 170. And the terminal 181 of the sensor 180 may be electrically connected to the pad 162 of the circuit board 160. For example, the sensor 180 may be electrically connected to the circuit board 160 through a connection member (W, for example, a wire).

The reinforcement plate 170 may be a plate-like member having a thickness and hardness above a certain level. Accordingly, the reinforcement plate 170 can stably support the sensor 180. Additionally, the reinforcement plate 170 can prevent the sensor 180 from being damaged by external impact. For example, the reinforcement plate 170 may protect the sensor 180 from external shock. Additionally, the reinforcement plate 170 may radiate heat generated from the sensor 180. Accordingly, the reinforcement plate 170 can improve the flatness of the sensor 180 and perform a heat dissipation function by dissipating heat generated by the sensor 180 to the outside.

To this end, the reinforcement plate 170 may include a metal material with high thermal conductivity. As an example, the reinforcement plate 170 may be SUS. However, the embodiment is not limited to this. For example, the reinforcement plate 170 may be formed of aluminum, etc., which has high thermal conductivity other than SUS. Additionally, as another example, the reinforcement plate 170 may include glass epoxy, plastic, or synthetic resin.

The reinforcement plate 170 may be connected to the ground (not shown) of the circuit board 160. For example, the reinforcement plate 170 may be electrically connected to the ground pattern (not shown) of the circuit board 160. Accordingly, the reinforcement plate 170 may serve as a ground to protect the camera module from ESD (Electrostatic Discharge Protection).

For example, the circuit board 160 may include ground patterns (not shown) disposed on the upper and lower surfaces of the insulating layer 161, respectively.

And the reinforcement plate 170 may be connected to the ground pattern disposed on the lower surface of the insulating layer 161. Additionally, the base 150 may be connected to a ground pattern disposed on the upper surface of the insulating layer 161. Through this, in the embodiment, the heat dissipation characteristics of the camera module can be further improved. Specifically, the adhesive portion 145 may be disposed on the ground pattern of the circuit board 160. Through this, the base 150 of the embodiment can be attached to the circuit board 160 through the adhesive portion 145 disposed on the ground pattern.

Light that has passed through the filter unit 140 may be incident on the sensor 180. The sensor 180 may be a part where an image included in light passing through the filter unit 140 is formed.

The circuit board 160 can convert the image formed on the sensor 180 into an electrical signal and transmit it to an external device. To this end, the circuit board 160 may include various circuit parts, device parts, and control parts. Additionally, a pattern portion electrically connected to the element portion or the sensor 180 may be formed on the circuit board 160 . The pattern portion may include the pad 162 and a ground pattern. The specific configuration of the circuit board 160 will be described below.

Meanwhile, the sensor 180 may receive an image included in incident light and convert the received image into an electrical signal. For example, the sensor 180 may be a charge coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or the like. However, the embodiment is not limited to this, and the sensor 180 may be implemented as another device that performs a similar function to the CCD or CMOS.

The filter unit 140 and the sensor 180 may face each other in the direction of the optical axis (OA).

Meanwhile, the filter unit 140 may include a filter 141 with a blocking member 142 formed on its upper surface. The blocking member 142 may also be expressed as a “masking part” instead.

The blocking member 142 may be disposed at an edge area of the upper surface of the filter 141. The blocking member 142 may block part of the light passing through the lens 110. For example, the blocking member 142 may block light incident on the edge area of the upper surface of the filter 141 among the light passing through the lens 110. For example, the blocking member 142 may block light passing through the lens 110 from passing through an edge area of the upper surface of the filter 141. The blocking member 142 may be coupled or attached to the upper surface of the filter 141.

For example, the filter 141 may have a rectangular planar shape. In addition, the blocking member 142 may be formed symmetrically with the filter 141 along each side of the upper surface of the filter 141. The blocking member 142 may be formed to have a certain width at an edge area of the upper surface of the filter 141.

The blocking member 142 may be formed of an opaque material. For example, the blocking member 142 may be an opaque adhesive material applied to the filter 141, but is not limited thereto. For example, the blocking member 142 may be a film made of an opaque material attached to the upper surface of the filter unit 140.

The filter 141 and the sensor 180 may be arranged to face each other in the optical axis direction. Additionally, the blocking member 142 may include at least a portion that overlaps the pad 162 and/or the connecting member W disposed on the circuit board 160 in the optical axis direction.

Meanwhile, the connecting member (W) and the pad 162 may be formed of a conductive material. For example, the connecting member (W) and pad 162 may be formed of gold (Au), silver (Ag), copper (Cu), copper alloy, etc. Meanwhile, the conductive material constituting the connecting member W and the pad 162 has the property of reflecting light. Accordingly, the light passing through the filter 141 may be reflected by the pad 162 of the circuit board 160 and/or the connection member (W). And, an instantaneous flare phenomenon may occur due to the reflected light. Additionally, the play phenomenon may distort the image formed on the sensor 180 or deteriorate image quality.

At this time, a portion of the blocking member 142 of the filter unit 140 overlaps the pad 162 and/or the connecting member (W) in the optical axis direction. As a result, among the light passing through the lens 110, the light heading to the pad 162 and/or the connecting member W of the circuit board 160 can be blocked. In an embodiment, the flare phenomenon can be prevented by blocking the light. Accordingly, in the embodiment, the image formed on the sensor 180 can be prevented from being distorted. Furthermore, in an embodiment, the image quality of the image obtained from the sensor 180 can be improved.

Meanwhile, a motion sensor (not shown) may be mounted or disposed on the circuit board 160. The motion sensor may be electrically connected to a control element (not shown) through a pattern portion provided on the circuit board 160.

The motion sensor may obtain rotational angular velocity information about the movement of the camera module 100. The motion sensor may be a 2-axis or 3-axis gyro sensor. The motion sensor may be an angular velocity sensor. The control element may be mounted or disposed on the circuit board 160.

The circuit board 160 may be electrically connected to the lens driving device 130. For example, the circuit board 160 may be electrically connected to a driving board of the lens driving device 130.

For example, the circuit board 160 may supply a driving signal to the first coil and the second coil of the lens driving device 130. Additionally, the circuit board 160 may supply a driving signal to the AF position sensor (or OIS position sensor). Additionally, the circuit board 160 may receive an output signal from an AF position sensor (or OIS position sensor).

Meanwhile, the camera module 100 includes a connector 190.

The connector 190 may be placed on the circuit board 160. For example, the connector 190 may be electrically connected to the circuit board 160. The connector 190 may include a port that is electrically connected to an external device.

Meanwhile, the camera module 100 of the embodiment may include a plurality of adhesive parts disposed between different components. The adhesive portion may provide adhesive force between different components. For example, the adhesive unit may attach or secure one component to another component.

For example, the camera module 100 may include an adhesive portion 175 disposed between the lower surface of the sensor 180 and the upper surface of the reinforcement plate 170. The sensor 180 may be attached or fixed to the reinforcement plate 170 by the adhesive portion 175.

The reinforcement plate 170 may be divided into a plurality of areas.

The reinforcement plate 170 may include a first area and a second area. The first area of the reinforcement plate 170 may be an area that overlaps the sensor 180 and/or the cavity C of the circuit board 160 in the optical axis direction.

The second area of the reinforcement plate 170 may be an area that does not overlap with the sensor 180 and the cavity C in the optical axis direction.

And the adhesive portion 175 may be disposed on the first area of the reinforcement plate 170. That is, the first area of the reinforcement plate 170 may be a sensor attachment area where the sensor 180 is attached by the adhesive portion 175. The adhesive portion 175 may be any one of epoxy, thermosetting adhesive, ultraviolet curing adhesive, and adhesive film, but is not limited thereto.

Meanwhile, the adhesive portion 165 may also be disposed on the second area of the reinforcement plate 170. The adhesive portion 165 may attach or fix the reinforcement plate 170 to the circuit board 160. The area of the adhesive portion 165 may correspond to the area of the circuit board 160.

Meanwhile, the circuit board 160 may include an insulating layer 161, a pad 162, and a protective layer 163.

The insulating layer 161 may include prepreg (PPG). The prepreg can be formed by impregnating an epoxy resin or the like into a fiber layer in the form of a fabric sheet, such as a glass fabric woven with glass fiber yarn, and then performing heat compression. However, the embodiment is not limited to this, and the prepreg constituting the insulating layer 110 may include a fiber layer in the form of a fabric sheet woven with carbon fiber thread. The insulating layer 161 may include a resin and reinforcing fibers disposed within the resin. The resin may be an epoxy resin, but is not limited thereto. The resin is not particularly limited to epoxy resin, and for example, it may contain one or more epoxy groups in the molecule, alternatively, it may contain two or more epoxy groups, and alternatively, it may contain four or more epoxy groups. Additionally, the resin of the insulating layer 110 may contain a naphthalene group, for example, an aromatic amine type, but is not limited thereto. For example, the resin is bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, phenol novolak-type epoxy resin, alkylphenol novolak-type epoxy resin, biphenyl-type epoxy resin, aralkyl-type epoxy resin. Resins, dicyclopentadiene-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, epoxy resins of condensates of phenols and aromatic aldehydes having a phenolic hydroxyl group, biphenylaralkyl-type epoxy resins, fluorene-type epoxy resins. Resins, xanthene-type epoxy resins, triglycidyl isocyanurate, rubber-modified epoxy resins, and phosphorous-based epoxy resins include naphthalene-type epoxy resins, bisphenol A-type epoxy resins, and phenol novolac epoxy resins. , cresol novolak epoxy resin, rubber-modified epoxy resin, and phosphorous-based epoxy resin. In addition, the reinforcing fiber may be glass fiber, carbon fiber, aramid fiber (e.g., aramid-based organic material), nylon, silica-based inorganic material, or titania-based inorganic material. You can. The reinforcing fibers may be arranged in the resin to cross each other in a planar direction.

Meanwhile, glass fiber, carbon fiber, aramid fiber (for example, aramid-based organic material), nylon, silica-based inorganic material, or titania-based inorganic material may be used.

A pattern portion may be disposed on the insulating layer 161. For example, the pattern portion may include a pad 162 that is electrically connected to the sensor 180 through a connection member (W). At this time, the drawing shows that only the pad electrically connected to the sensor 180 is disposed on the insulating layer 161, but the method is not limited thereto.

A protective layer 163 is disposed on the insulating layer 161. The protective layer 163 may be disposed not only on the top surface of the insulating layer 161 but also on the top surface of the pattern portion. The protective layer 163 may function to protect the upper surface of the insulating layer 161 and the upper surface of the pattern portion.

The protective layer 163 may include an open area that vertically overlaps the upper surface of the pad 162 electrically connected to the sensor 180 among the pattern portions. Additionally, the pad 162 may be exposed through the open area of the protective layer 163. Accordingly, in the embodiment, the exposed upper surface of the pad 162 and the terminal 181 of the sensor 180 can be electrically connected through the connection member (W).

The protective layer 163 may be solder resist, but is not limited thereto.

Meanwhile, in the embodiment, the pad 162 of the circuit board 160 and the terminal 181 of the sensor 180 are electrically connected through a connection member (W).

The top surface of the sensor 180 or the top surface of the terminal 181 is located lower than the top surface of the circuit board 160. And the uppermost end of the connecting member (W) is located higher than the upper surface of the circuit board 160. For example, the top of the connecting member (W) is located higher than the top surface of the protective layer 163.

Preferably, the connecting member W may be positioned higher than the upper surface of the circuit board 160 by a certain protrusion height t1.

Accordingly, the base 150 of the embodiment provides a seating portion for seating the filter unit 140 while being spaced apart by the protruding height t1 of the connecting member W. That is, the minimum thickness of the base 150 may be greater than the protrusion height t1. However, an adhesive portion 145 is disposed between the base 150 and the circuit board. Accordingly, considering the thickness of the adhesive portion 145, the minimum thickness of the base 150 may correspond to the protrusion height t1. Accordingly, in the embodiment, the uppermost end of the connecting member (W) and the filter 141 may be separated by a certain distance along the optical axis by the base 150.

Meanwhile, in the embodiment, the lens barrel 120 and the bobbin 132 of the lens driving device 130 may be coupled to each other without threads. That is, in the embodiment, as a high-performance camera module is required, the lens barrel 120 and the bobbin 132 are coupled using a threadless coupling method that can minimize the error range of optical axis alignment.

In the threadless coupling method, the lens barrel 120 is inserted into the hollow part of the bobbin 132 from the upper or lower side, and the lens barrel 120 is attached to the bobbin 132 using the adhesive portion 190. It may mean a method of fixing.

That is, an adhesive portion 190 may be disposed between the inner surface of the bobbin 132 and the outer surface of the lens barrel 120. The adhesive portion 190 can firmly fix the lens barrel 120 to the bobbin 132. The adhesive portion 190 may include thermosetting epoxy or UV epoxy. When the adhesive portion 190 is implemented with thermosetting epoxy, in an embodiment, the adhesive portion 190 may be cured in an oven, or alternatively, heat may be directly applied to the adhesive portion 190 to cure it. Additionally, when the adhesive portion 190 is implemented with UV epoxy, in an embodiment, the adhesive portion 190 may be cured by applying ultraviolet rays.

Additionally, the adhesive portion 190 may be implemented with epoxy that is a combination of heat curing and ultraviolet curing. For example, the adhesive portion 190 may be epoxy capable of both heat curing and UV curing. Meanwhile, the adhesive portion 190 in the embodiment is not limited to epoxy, and any adhesive material capable of fixing the lens barrel 120 to the bobbin 132 may be replaced.

Hereinafter, the filter module will be described in more detail with reference to FIGS. 5 to 9.

As described above, the filter module in the embodiment may include a base 150 integrated with the filter unit 140.

The filter module may include a base 150, a filter 141 attached to the base 150, and a blocking member 142 attached to the filter unit 140.

The filter 141 may include an upper surface facing the lens 110 and a lower surface facing the sensor 180.

The blocking member 142 may be disposed on the upper surface of the filter 141. The blocking member 142 may be partially disposed on the upper surface of the filter 141. Preferably, the blocking member 142 may be selectively disposed at an edge area of the upper surface of the filter 141. For example, the blocking member 142 may include an opening (not shown) that opens the central area of the upper surface of the filter 141. For example, the blocking member 142 may open an area of the upper surface of the filter 141 that overlaps the sensor 180 and the optical axis. The blocking member 142 may be attached or coupled to the upper surface of the filter 141. The blocking member 142 may be formed by applying an opaque material to the upper surface of the filter 141. The blocking member 142 can be formed by attaching an opaque film to the upper surface of the filter 141.

A base 150 with a certain thickness is disposed on the lower surface of the filter 141. For example, the base 150 may be said to be a protrusion that protrudes from the lower surface of the filter 141 toward the sensor 180. Additionally, the base 150 may be referred to as a seating portion that supports the filter 141 and allows the filter 141 to be stably seated.

At this time, before explaining the numerical characteristics of the base of the present application, specific numerical characteristics of the base of the prior art will be described.

The base in the prior art is an injection molded product manufactured using resin. That is, the base of the prior art includes only insulating materials such as resin.

At this time, the base of the prior art includes a seating portion such as a window on which the filter unit is mounted, a first protrusion protruding downward from the lower surface of the seating portion, and a second protrusion protruding upward from the upper surface of the seating portion. The first protrusion of the base of the prior art separates the seating portion of the base from the circuit board by a predetermined distance. For example, a connecting member (wire) that electrically connects the sensor and the circuit board protrudes from the upper surface of the circuit board toward the lens 110 by a certain protrusion height t1. Accordingly, the first protrusion is formed to have a certain thickness so that the filter portion mounted on the seating portion does not contact the connecting member. At this time, the protrusion height (t1) exceeds 150㎛. For example, the protrusion height t1 exceeds 170 μm. Accordingly, the thickness of the first protrusion of the prior art base exceeds 150 μm. For example, the thickness of the first protrusion of the prior art base exceeds 170 μm.

Meanwhile, the seating portion of the base of the prior art has a certain thickness. At this time, the thickness of the seating portion may be determined by the size of the filter. The thickness of the seating portion of the prior art is about 180㎛. Recently, the size of sensors has increased, and thus the size of filters has also increased. And only when the thickness of the seating portion is 180㎛ or more can a large-sized filter be stably seated. For example, the thickness of the seating portion must be 180㎛ or more to maintain the flatness of the filter (or improve the bending characteristics). This is because the base of the prior art is an injection molded product of an insulating material, and thus the seating portion is also an injection molded product formed of an insulating material. In addition, if the thickness of the seating portion of the prior art is less than 180㎛, injection defects such as undermolding of the seating portion may occur during the process of manufacturing the base by injection. In addition, if the thickness of the seating portion of the prior art is less than 180㎛, injection defects such as burrs may occur during injection molding in the process of manufacturing the base. Accordingly, the prior art seating portion has a thickness of at least 180㎛.

Meanwhile, the second protrusion of the base of the prior art has a certain thickness. The thickness of the second protrusion is determined by the injection properties of the base manufactured by injection molding. For example, if the overall thickness of the base including the second protrusion becomes thin, extractability may be reduced in the process of extracting the injection mold from the injection mold. For example, if the overall thickness of the base including the second protrusion becomes thin, deformation may occur during the process of extracting the injection mold from the injection mold. Accordingly, the total thickness of the base of the prior art is 720 μm. For example, if the total thickness of the base is less than 720㎛, injection defects such as reduced extractability and deformation may occur.

As described above, in the prior art, the base is manufactured using only insulating materials such as resin. Accordingly, in the prior art, there is a limit to reducing the overall thickness of the base because injection defects must be taken into account. Furthermore, if a base injected from an insulating material is used, the filter unit, which is becoming increasingly larger, may not be seated stably. For example, in the prior art, there is a limit to increasing the width of the base in response to an increase in the size of the sensor and filter unit.

Meanwhile, in the prior art, the FBL corresponding to the optical axis distance between the sensor and the lens increases depending on the thickness of each part of the base as described above. For example, in the prior art, the Flange Back Length (FBL) has a minimum level of 1.1 due to the limit of the minimum thickness of the first protrusion, the seating portion, and the second protrusion.

At this time, since the thickness of the first protrusion in the prior art is determined by the protrusion height t1 of the connecting member, it may be difficult to reduce it. However, the thickness of the seating portion and the thickness of the second protrusion (for example, the total thickness of the base) may be reduced due to injection defects or under conditions of improving the bending characteristics of the filter.

Accordingly, in the embodiment, by providing the base 150 integrated with the filter unit 140, the base 150 can have a structure including only the first protrusion of the base in the prior art. Accordingly, in the embodiment, the overall thickness of the filter unit 140 can be dramatically reduced compared to the prior art. Accordingly, in the embodiment, the FBL of the camera module can be reduced.

That is, in the embodiment, rather than manufacturing a base separate from the filter unit as in the prior art through an injection process, the base 150 integrated with the filter unit 140 is manufactured.

A brief description of the manufacturing process of the filter module of the embodiment is as follows.

For manufacturing the filter module, a mold core (not shown) may first be prepared. At this time, a recess (not shown) may be formed in the mold core in an area corresponding to the base 150.

The recess may have a rectangular frame shape that is concave from the upper surface of the mold core toward the lower surface. And the outer width of the recess may be determined based on the outer width of the filter 141. For example, the outer width of the recess may be smaller than the outer width of the filter 141.

Next, in the embodiment, a process of applying a cured material into the recess formed in the mold core may be performed. For example, in an embodiment, a process of filling the recess of the mold core with ultraviolet paint may be performed. For example, in an embodiment, a process may be performed to fill the recess of the mold core with epoxy that can be cured with ultraviolet rays.

Afterwards, in the embodiment, a process of placing the filter 141 on the mold core may be performed. At this time, the filter 141 disposed on the mold core may be a filter fabric. Generally, the filter fabric is composed of a polyester (PET:polyethyleneterephthalate) film sheet.

Accordingly, in the embodiment, a process of applying the polyester film sheet of the filter 141 on the recess filled with the ultraviolet curing material may be performed.

Thereafter, in an embodiment, a process of curing the ultraviolet curable material filled in the recess may be performed by irradiating ultraviolet rays while the polyester film sheet is applied. At this time, the ultraviolet irradiation may be performed on the polyester film sheet. That is, the polyester film sheet is a film made of a transparent material that can transmit ultraviolet rays. Accordingly, when the ultraviolet rays are irradiated, the irradiated ultraviolet rays may pass through the polyester film sheet and be transmitted to the ultraviolet curing material disposed in the recess.

And by the irradiated ultraviolet rays, the ultraviolet curing material filled in the recess can be cured. Specifically, the ultraviolet curing material may be cured while attached to a polyester film sheet disposed on the mold core.

Next, in an embodiment, after curing of the ultraviolet curable material, a black masking process may be performed on the polyester film sheet. The black masking process may include, but is not limited to, a process of applying a light blocking material (for example, an opaque adhesive material) on the polyester film sheet. For example, the black masking process may be a process of attaching a film of an opaque material to the polyester film sheet.

Next, in the embodiment, as the black masking process is completed as described above, a process of cutting the polyester film sheet can be performed. For example, the polyester film sheet may be larger than the size of the actually applied filter 141. Accordingly, in the embodiment, a process of cutting the polyester film sheet to fit the size of the filter 141 to be actually applied may be performed.

And, as the above cutting process is completed, the filter module according to the embodiment can be manufactured.

That is, the filter module may include a base 150 and a blocking member 142 integrated with the filter 141, which is a polyester film sheet. And the base 150 may have a square frame shape including an opening 151 that opens the central area of the lower surface of the filter 141.

Meanwhile, the base 150 may have a certain thickness.

The thickness of the base 150 may be greater than the protrusion height t1 of the connecting member W. For example, the minimum thickness of the base 150 may correspond to the protrusion height t1 of the connecting member W.

The base 150 may seat the filter 141 and allow the filter 141 to be spaced upward from the top of the connection member (W). The thickness T1 of the base 150 may satisfy the range of 150㎛ to 450㎛. Preferably, the thickness T1 of the base 150 may satisfy the range of 200㎛ to 400㎛. More preferably, the thickness T1 of the base 150 may satisfy the range of 250㎛ to 350㎛.

At this time, if the thickness T1 of the base 150 is less than 150㎛, physical or electrical reliability problems may occur in the operating environment of the camera module.

If the thickness T1 of the base 150 is less than 150㎛, a problem may occur in which the filter 141 contacts the connecting member (W). And when the filter 141 contacts the connection member W, electrical disconnection may occur between the sensor 180 and the circuit board 160.

In addition, if the thickness T1 of the base 150 is less than 150㎛, the flatness of the filter 141 may decrease, which may cause a problem of decreased bending characteristics.

Additionally, if the thickness T1 of the base 150 is less than 150㎛, reliability problems may occur in the process of curing the ultraviolet curing material. For example, if the thickness T1 of the base 150 is less than 150㎛, an open problem may occur in which a specific area is not filled with the cured material during the ultraviolet curing process.

If the thickness T1 of the base 150 exceeds 450㎛, the thickness of the filter module may increase accordingly. And when the thickness of the filter module increases, the Flange Back Length (FBL) of the camera module may increase. And, as the thickness of the filter module increases, the thickness of the camera module may increase.

The thickness T2 of the filter 141 disposed on the base 150 may range from 100 ㎛ to 140 ㎛. And in the FBL in the embodiment, the thickness T2 of the filter 140 may be reflected in the thickness T1 of the base 150.

Meanwhile, the base 150 may have a certain width W1 at the lower surface of the filter 141. For example, the width W1 of the base 150 may range from 350 ㎛ to 700 ㎛. If the width W1 of the base 150 is less than 350㎛, an open problem may occur during the manufacturing process of the base 150. Additionally, if the width of the base 150 is less than 350㎛, the flatness of the filter 141 may be reduced.

If the width W1 of the base 150 exceeds 700㎛, the area of the base 150 may increase correspondingly. And as the area of the base 150 increases, the area of the filter 141 may also increase. And accordingly, the area or volume of the camera module may increase.

Meanwhile, the base 150 may be spaced inward from the edge of the lower surface of the filter 141.

For example, the base 150 may be disposed inside the second width W2 from the outermost end of the lower surface of the filter 141. For example, the outer surface of the base 150 may be spaced apart from the outer surface of the adjacent filter by the second width W2.

At this time, the second width W2 may satisfy a range between 30㎛ and 100㎛. Preferably, the second width W2 may satisfy a range between 35㎛ and 90㎛. More preferably, the second width W2 may satisfy a range between 40㎛ and 70㎛.

If the second width W2 is less than 30㎛, a problem may occur in which part of the ultraviolet cured material constituting the base 150 overflows onto the side or top surface of the filter 141.

Additionally, if the second width W2 is less than 30 μm, the flatness of the filter 141 may be reduced. For example, if the second width W2 is less than 30㎛, a problem may occur in which the flatness of the inner (or central) area of the filter 141 is lowered compared to the outer area. And in order to solve this problem, a problem may arise in which the width W1 of the base 150 must be further increased.

If the second width W2 exceeds 100㎛, a problem may occur in which the outer area of the filter 141 is damaged due to external impact. Additionally, if the second width W2 exceeds 100㎛, the area of the filter 141 that is meaninglessly wasted may increase. As a result, problems such as an increase in manufacturing cost or an increase in the volume of the camera module may occur.

As described above, the thickness of the base 150 in the embodiment may be smaller than the thickness of the base in the prior art. That is, the thickness T1 of the base 150 in the embodiment is 150㎛ to 450㎛. And the thickness of the base in the prior art was about 720㎛. Accordingly, in the embodiment, the thickness of the base can be reduced to 20% to 63% compared to the prior art. Accordingly, in the embodiment, the Flange Back Length (FBL) can be lowered compared to the prior art. Furthermore, in embodiments, the overall thickness or volume of the camera module can be reduced.

Specifically, when applying the base 150 integrated and coupled to the filter 141 using the ultraviolet curing material in the embodiment, the Flange Back Length (FBL) can be lowered to the level of 0.84.

The camera module of the embodiment includes a filter module. The filter module is placed on a circuit board electrically connected to the sensor. At this time, the filter module includes a filter unit and a base. At this time, the base may be integrated with the filter unit. Here, the integration may mean that no additional components exist between the base and the filter unit. Specifically, in the embodiment, an adhesive member for attaching the filter unit to the base may be omitted.

Specifically, the base in the prior art is manufactured separately from the filter unit. For example, in the prior art, the base is an injection molded product made of an insulating material. And in the prior art, after manufacturing the base through an injection process, a process of combining the base and the filter unit using an adhesive member is performed.

In contrast, in the embodiment, the filter unit is disposed with the ultraviolet curable material applied. In addition, the ultraviolet curing process can be performed with the ultraviolet curing material before curing placed at the bottom of the filter unit. Accordingly, in the embodiment, the process of manufacturing the base and the process of combining the base and the filter unit can be performed in one process, thereby simplifying the manufacturing process. Furthermore, in the embodiment, the manufacturing cost of the base can be reduced. As a result, in the embodiment, the product price of the camera module can be lowered.

Additionally, in the embodiment, the thickness of the filter module can be reduced by omitting the adhesive member additionally disposed between the base and the filter unit. For example, in an embodiment, the thickness of the filter module may be reduced by the thickness of the adhesive member. Accordingly, in the embodiment, the FBL of the camera module can be reduced.

Additionally, in an embodiment, the width (or planar area) of the filter module may be reduced. For example, in the prior art, the width or planar area of the base was larger than the width or planar area of the filter part. Accordingly, in the prior art, the width of the filter module was determined by the width of the base. Accordingly, in the prior art, the area of the space for arranging the filter module was larger than the area of the filter unit. Accordingly, in the prior art, the width of the camera module increased, and the overall volume of the camera module accordingly increased.

Alternatively, the width of the base in the embodiment is smaller than the width of the filter module. And, in the embodiment, the width of the filter module is determined by the width of the filter unit, not the width of the base. Accordingly, in the embodiment, the area of the space where the filter module is placed can be reduced compared to the prior art. Accordingly, in the embodiment, the width of the camera module can be reduced, and thus the overall volume (eg, width and/or height) of the camera module can be reduced.

Additionally, in an embodiment, a base corresponding to the size and shape of the filter unit may be provided. That is, in the prior art, since the base is manufactured through an injection process, it may be difficult to apply filters of various sizes or shapes. In addition, in the prior art, there is a problem in that the reliability of the connection between the base and the filter unit is reduced depending on the injection process. In contrast, in the embodiment, since the base is integrated with the filter unit, it is possible to respond to various shapes and sizes of the filter unit. Accordingly, in the embodiment, design freedom can be improved. Furthermore, in an embodiment, the coupling reliability between the filter unit and the base can be improved by providing a base integrated with the filter unit. As a result, in the embodiment, the operational reliability and product reliability of the camera module can be improved.

Meanwhile, in the embodiment, the thickness of the base can be reduced compared to the prior art. Specifically, in the prior art, the base is manufactured by an injection process. Accordingly, in the prior art, issues such as undermolding in the injection process, deformation issues in the extraction process after injection, and flatness issues of the filter unit must be taken into consideration. As a result, there is a limit to reducing the thickness of the base in the prior art. In contrast, in the embodiment, a base integrated with the filter unit is provided by performing an ultraviolet curing process. Accordingly, in the embodiment, there is no need to consider short-forming issues and deformation issues in the prior art. As a result, in the embodiment, the minimum thickness that the base must have can be reduced compared to the prior art. Accordingly, in the embodiment, manufacturing costs can be reduced by reducing the thickness of the base, and further, the unit price of the product can be lowered. Additionally, in the embodiment, the Flange Back Length (FBL) can be reduced to correspond to the reduced thickness of the base. As a result, in the embodiment, the overall thickness or volume of the camera module can be reduced.

Meanwhile, the filter module in the embodiment may be connected to a ground pattern included in the circuit board. For example, the circuit board in the embodiment includes a ground pattern exposed through an opening in the protective layer. Additionally, an adhesive portion for coupling or attaching the filter module to the circuit board may be disposed on the ground pattern. Accordingly, in the embodiment, the coupling reliability between the circuit board and the filter module can be further improved. Furthermore, in the embodiment, the heat transferred to the filter module is discharged through the ground pattern of the circuit board. Accordingly, in the embodiment, the heat dissipation characteristics of the camera module can be further improved.

FIG. 10 shows a perspective view of a portable terminal 200A according to an embodiment, and FIG. 11 shows a configuration diagram of the portable terminal shown in FIG. 10.

10 and 11, the portable terminal (200A, hereinafter referred to as “terminal”) includes a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, and an input/output unit 720. It may include an output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

The body 850 shown in FIG. 10 has a bar shape, but is not limited to this, and can be a slide type, folder type, or swing type in which two or more sub-bodies are coupled to enable relative movement. It may have various structures such as , swirl type, etc.

The body 850 may include a case (casing, housing, cover, etc.) that forms the exterior. For example, the body 850 may be divided into a front case 851 and a rear case 852. Various electronic components of the terminal may be built into the space formed between the front case 851 and the rear case 852.

The wireless communication unit 710 may be configured to include one or more modules that enable wireless communication between the terminal 200A and a wireless communication system or between the terminal 200A and the network where the terminal 200A is located. For example, the wireless communication unit 710 may be configured to include a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-range communication module 714, and a location information module 715. there is.

The A/V (Audio/Video) input unit 720 is for inputting audio or video signals and may include a camera 721 and a microphone 722.

The camera 721 may include a camera module according to the embodiment shown in FIG. 1.

The sensing unit 740 monitors the current state of the terminal 200A, such as the open/closed state of the terminal 200A, the location of the terminal 200A, presence or absence of user contact, the direction of the terminal 200A, acceleration/deceleration of the terminal 200A, etc. It is possible to detect and generate a sensing signal to control the operation of the terminal 200A. For example, if the terminal 200A is in the form of a slide phone, it can sense whether the slide phone is opened or closed. In addition, it is responsible for sensing functions related to whether the power supply unit 790 supplies power and whether the interface unit 770 is connected to an external device.

The input/output unit 750 is for generating input or output related to vision, hearing, or tactile sensation. The input/output unit 750 can generate input data for controlling the operation of the terminal 200A and can also display information processed by the terminal 200A.

The input/output unit 750 may include a key pad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The key pad unit 730 can generate input data through key pad input.

The display module 751 may include a plurality of pixels whose colors change according to electrical signals. For example, the display module 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, or a three-dimensional display. It may include at least one display (3D display).

The audio output module 752 outputs audio data received from the wireless communication unit 710 in call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or stored in the memory unit 760. Audio data can be output.

The touch screen panel 753 can convert the change in capacitance that occurs due to the user's touch to a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store programs for processing and controlling the control unit 780 and stores input/output data (e.g., phone book, messages, audio, still images, photos, videos, etc.). It can be stored temporarily. For example, the memory unit 760 may store images captured by the camera 721, such as photos or videos.

The interface unit 770 serves as a passage connecting external devices connected to the terminal 200A. The interface unit 770 receives data from an external device, receives power and transmits it to each component inside the terminal 200A, or transmits data inside the terminal 200A to an external device. For example, the interface unit 770 includes a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port for connecting a device equipped with an identification module, and audio I/O (Input/ Output) port, video I/O (Input/Output) port, and earphone port.

The controller 780 can control the overall operation of the terminal 200A. For example, the control unit 780 may perform related control and processing for voice calls, data communications, video calls, etc.

The control unit 780 may be equipped with a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented within the control unit 180 or may be implemented separately from the control unit 780.

The control unit 780 can perform pattern recognition processing to recognize handwriting or drawing input on the touch screen as text and images, respectively.

The power supply unit 790 can receive external power or internal power under the control of the control unit 780 and supply power necessary for the operation of each component.

The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

Claims (13)

reinforcement plate;
a circuit board disposed on the reinforcement plate and including a cavity;
A sensor disposed on an area of the upper surface of the reinforcement plate that overlaps with the cavity of the circuit board along an optical axis;
A filter unit disposed on the circuit board,
The filter unit,
Comprising a filter and a base integrated with the filter
Camera module. According to paragraph 1,
The base includes a cured material cured on the lower surface of the filter,
Camera module. According to paragraph 2,
The base includes an ultraviolet curable material,
Camera module. According to any one of claims 1 to 3,
The upper surface of the base is in direct contact with the lower surface of the filter,
Camera module. According to any one of claims 1 to 3,
The base is disposed in a frame shape at the edge area of the lower surface of the filter,
Camera module. According to any one of claims 1 to 3,
The outer width of the base is smaller than the outer width of the filter,
Camera module. According to clause 6,
The base is arranged to be spaced inward from the outer end of the lower surface of the filter,
Camera module. In clause 7,
The width between the outer end of the base and the outer end of the filter satisfies the range of 30㎛ to 100㎛,
Camera module. According to any one of claims 1 to 3,
Further comprising a connection member connecting the terminal of the sensor and the pad of the circuit board,
The uppermost end of the connecting member is located higher than the upper surface of the circuit board,
The lower surface of the filter is located higher than the uppermost end of the connecting member,
Camera module. According to clause 9,
The thickness of the base satisfies the range of 150㎛ to 450㎛,
Camera module. According to any one of claims 1 to 3,
Further comprising an adhesive portion disposed between the circuit board and the base,
Camera module. According to clause 11,
Including the circuit board ground pattern,
The adhesive portion is disposed on the ground pattern,
Camera module. A main body, the camera module of claim 4 disposed in the main body and taking images of a subject, and
A display unit disposed on the main body and outputting an image captured by the camera module,
The camera module is,
a lens unit disposed on the filter unit; and
Comprising a lens driving device that moves the lens unit in at least one of the optical axis direction and the direction perpendicular to the optical axis direction,
Optical equipment.

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