KR20230110976A - Apparatus for cooling mold - Google Patents

Abstract

A mold cooling device capable of maximizing cooling efficiency by cooling using latent heat of a cooling medium is introduced. The mold cooling device includes a cooling channel portion provided inside the mold, a supply passage portion for supplying a cooling medium to the cooling channel portion, and a discharge passage portion for recovering the cooling medium from the cooling channel portion, wherein the cooling channel portion includes a supply portion formed to branch from a single channel to a plurality of channels in multiple stages starting from a point extending from the supply passage portion, a heat exchange portion formed to extend from the last branching point of the supply portion to cool an object to be cooled by the mold, and a discharge portion formed to extend from the heat exchange portion and connected to the discharge passage portion. .

Description

Mold cooling device {APPARATUS FOR COOLING MOLD}

The present invention relates to a mold cooling device, and more particularly, to a mold cooling device capable of maximizing cooling efficiency by cooling using latent heat of a cooling medium.

In the case of a conventional mold cooling device, if the distance between the cooling target and the cooling channel through which the cooling medium flows is reduced to a certain size or more in order to increase the cooling efficiency, the durability of the mold is lowered and the life of the mold is significantly reduced. Therefore, significant thermal resistance occurs between the cooling target and the cooling channel through which the cooling medium flows, and thus there is a limit to increasing the cooling efficiency.

The background art of the present invention is disclosed in Korean Patent Publication No. 2017-0046830.

The present invention has been proposed to solve the above problems, and relates to a mold cooling device capable of maximizing cooling efficiency by cooling using latent heat of a cooling medium.

A mold cooling apparatus according to the present invention includes a cooling channel portion installed inside a mold to cool a cooling object in which a cooling medium flows, a supply passage portion for supplying a cooling medium to the cooling channel portion, and a discharge passage portion for recovering the cooling medium from the cooling channel portion, a cooling channel portion formed to branch from a single channel to a plurality of channels in multiple stages starting from a point extending from the supply passage portion, and a heat exchange portion formed to extend from the last branching point of the supply portion to cool the object to be cooled by the mold. It is formed to extend and characterized in that it includes a discharge portion connected to the discharge passage portion.

In addition, since the cooling medium is evaporated in the heat exchange unit of the cooling channel unit, the object to be cooled may be cooled by the latent heat of the cooling medium.

In addition, the supply unit of the cooling channel unit may include a first channel connected to the supply flow path unit, a pair of second channels branching from the first channel, two pairs of third channels branching from the second channel, and four pairs of fourth channels branching from the third channel, and eight pairs of fifth channels branching from the fourth channel.

In addition, the diameters of the first to fifth channels may be formed to a size that satisfies the following equation.

<expression>

0.2≤D ₁ ≤2(mm)

D _i =A×D _i+1

1≤A≤5

Here, D ₁ ,: Diameter of the fifth channel, D ₂ ,: Diameter of the fourth channel, D ₃ ,: Diameter of the third channel, D ₄ ,: Diameter of the second channel, D ₅ ,: Diameter of the first channel, A: Integer

In addition, lengths of the first channel region including the first channel to the fifth channel region including the fifth channel may be formed to satisfy the following equation.

<expression>

0.5≤L ₁ ≤20(mm)

L _i =B×L _i+1

1≤B≤10

Here, L ₁ ,: Length of the fifth channel region, L ₂ ,: Length of the fourth channel region, L ₃ ,: Length of the third channel region, L ₄ ,: Length of the second channel region, L ₅ ,: Length of the first channel region, B: Integer

In addition, the cooling channel unit may include a lattice structure that improves capillary force.

In addition, a concavo-convex structure that improves capillary force and increases a heat exchange area may be formed in the cooling channel portion.

In addition, the mold cooling device according to the present invention includes a cooling channel provided inside the mold; and a supply passage portion for supplying a cooling medium to the cooling channel portion, wherein the cooling channel portion includes a supply portion formed such that the cooling channels are multi-step branched in such a manner that a plurality of second cooling channels are branched from the first cooling channel connected to the supply flow passage portion, and third cooling channels are branched from each of the plurality of second cooling channels, and a heat exchange portion formed to extend from the last branch point of the supply portion and cooled by latent heat of the cooling medium by evaporation of the cooling medium, and a diameter of the supply portion of the cooling channel portion is gradually reduced in diameter toward the heat exchange portion , A lattice structure having a porosity of 0.5% to 50% may be provided in the cooling channel portion to improve capillary force.

In the mold cooling device according to the present invention, the diameter of the supply part of the cooling channel through which the cooling medium flows is reduced in multiple steps so that a small flow rate of the cooling medium flows in the heat exchange part of the cooling channel, so that evaporation of the cooling medium is induced and cooling is performed by latent heat, so cooling efficiency can be maximized.

In addition, in the mold cooling device according to the present invention, since the cooling medium can move by capillary force as much as the amount of the cooling medium evaporated in the heat exchange part of the cooling channel unit, a separate circulation device and an additional control device are unnecessary, space utilization can be increased, and cost can be reduced.

1 is a view showing a mold cooling device according to an embodiment of the present invention.
2 is a view showing a change in the diameter of a supply part of a cooling channel applied to a mold cooling device according to an embodiment of the present invention.
3 is a view showing a change in length of a supply section of a cooling channel applied to a mold cooling device according to an embodiment of the present invention.
4 is a view showing a first embodiment of an internal structure of a supply unit of a cooling channel applied to a mold cooling device according to an embodiment of the present invention.
5 is a view showing a second embodiment of the internal structure of the cooling channel supply unit applied to the mold cooling device according to an embodiment of the present invention.
6 is a view showing a heat exchange part of a cooling channel applied to a mold cooling device according to an embodiment of the present invention.

Hereinafter, a mold cooling device according to the present invention will be described in more detail with reference to the accompanying drawings.

In the drawings, the same components or parts are denoted by the same reference numerals as much as possible for convenience of explanation, and the drawings may be exaggerated and schematically illustrated for clear understanding and description of the features of the present invention.

1 is a view showing a mold cooling apparatus according to an embodiment of the present invention, Figure 2 is a view showing a change in the diameter of the supply part of the cooling channel applied to the mold cooling apparatus according to an embodiment of the present invention, Figure 3 is a view showing the change in length of the supply section of the cooling channel applied to the mold cooling apparatus according to an embodiment of the present invention, Figure 4 is a view showing a first embodiment of the internal structure of the supply part of the cooling channel applied to the mold cooling apparatus according to an embodiment of the present invention, A view showing a second embodiment of the internal structure of the cooling channel supply unit applied to the mold cooling device according to an embodiment, and FIG. 6 is a view showing the heat exchange unit of the cooling channel applied to the mold cooling device according to an embodiment of the present invention.

As shown in FIGS. 1 to 6, the mold cooling apparatus according to an embodiment of the present invention includes a cooling channel unit 200 installed inside the mold 10 in which a cooling medium flows and to cool a cooling object 20, a supply channel unit 100 for supplying a cooling medium to the cooling channel unit 200, and a discharge channel unit 300 for recovering the cooling medium from the cooling channel unit 200.

The supply passage part 100 and the discharge passage part 300 are formed in a circular tubular shape and formed to have a certain diameter, and a cooling medium flows therein.

The cooling channel unit 200 includes a supply unit 210 extending from the supply passage unit 100, a heat exchange unit 220 extending from the supply unit 210 and cooling the object to be cooled 20 processed by the mold 10, and a discharge unit 230 extending from the heat exchange unit 220 and connected to the discharge passage unit 300.

As shown in FIGS. 1 and 2 , the supply unit 210 is formed to branch from a single channel to a plurality of channels in multiple stages starting from a point extending from the supply passage unit 100 .

The supply unit 210 includes a first channel 211 connected to the supply flow path unit 100, a pair of second channels 212 branching from the first channel, two pairs of third channels 213 branching from the second channel 212, four pairs of fourth channels 214 branching from the third channel 213, and eight pairs of fifth channels 215 branching from the fourth channel 214. can

By configuring the diameter of the supply part 210 of the cooling channel part 200 through which the cooling medium flows is reduced in multiple steps, a small flow rate of the cooling medium can flow in the heat exchange part 220 of the cooling channel part 200, and accordingly, as shown in FIG. Therefore, cooling efficiency can be maximized.

Since the cooling medium can move by capillary force as much as the amount of the cooling medium evaporated in the heat exchange unit 220 of the cooling channel unit 200, a separate circulation device and an additional control device are unnecessary, so space utilization can be increased and facility costs can be reduced.

How many steps or how the supply unit 210 branches can be variously selected according to the installation environment of the mold 10, and is not limited to the form shown in FIGS.

Referring to FIG. 2 , the diameter from the first channel 211 to the fifth channel 215 is preferably formed to a size that satisfies conditional expression (1).

conditional expression (1)

0.2≤D ₁ ≤2(mm)

D _i =A×D _i+1

1≤A≤5

Here, D ₁ ,: Diameter of the fifth channel, D ₂ ,: Diameter of the fourth channel, D ₃ ,: Diameter of the third channel, D ₄ ,: Diameter of the second channel, D ₅ ,: Diameter of the first channel, A: Integer

When the diameter (D ₁ ) of the fifth channel 215 is less than 0.2 mm, the flow rate of the cooling medium becomes insufficient, and when the diameter (D ₁ ) of the fifth channel 215 exceeds 2 mm, sufficient capillary force cannot be obtained. Therefore, the diameter D ₁ of the fifth channel 215 is preferably formed within a range that satisfies conditional expression (1).

In addition, in configuring the diameter to sequentially increase starting from the fifth channel 215 to the first channel 211, it needs to be configured to increase within the range of conditional expression (1), and an integer (A) that determines the increase rate of the diameter is preferably selected between 1 and 5. If the integer A exceeds 5, the diameter may change rapidly, resulting in insufficient capillary force.

Also, referring to FIG. 3 , the length from the first channel region including the first channel 211 to the fifth channel region including the fifth channel 215 is preferably formed to a size that satisfies conditional expression (2).

conditional expression (2)

0.5≤L ₁ ≤20(mm)

L _i =B×L _i+1

1≤B≤10

Here, L ₁ ,: Length of the fifth channel region, L ₂ ,: Length of the fourth channel region, L ₃ ,: Length of the third channel region, L ₄ ,: Length of the second channel region, L ₅ ,: Length of the first channel region, B: Integer

When the length (L ₁ ) of the fifth channel region including the fifth channel 215 is less than 0.5 mm, the flow rate of the cooling medium becomes insufficient, and when the length (L ₁ ) of the fifth channel region exceeds 20 mm, sufficient capillary force cannot be obtained. Therefore, it is preferable that the length L ₁ of the fifth channel region is formed within a range that satisfies conditional expression (1).

In addition, in configuring the length to increase starting from the fifth channel region to the first channel region, it needs to be configured to gradually increase within the range of conditional expression (2), and the integer (B) that determines the increase rate of the length is preferably selected between 1 and 10. When the integer (B) exceeds 10, the length is rapidly changed, and capillary force may be insufficient.

Also, as shown in FIG. 4 , the cooling channel unit 200 may include a lattice structure 240 that improves capillary force. FIG. 4 is a cross section (a cut along line A-A) of the second channel 212 among the supply parts 210 of the cooling channel part 200 shown in FIG. 1 as an example.

The lattice structure 240 is made of a three-dimensional structure and, similar to a crystal structure, may be made of various shapes such as FCC, FCCZ, BCC, BCCZ, Schwarz surface, etc., and may be made of a shape such as a circle, a triangle, a quadrangle, a rhombus, an ellipse, or an airfoil.

In applying the lattice structure to the supply unit 210 of the cooling channel unit 200, a lattice structure made of metal can be formed with a 3D printer, and when manufacturing a mold, EBM (Electron Beam Melting), SLM (Selective Laser Melting), DMLS (Direct metal laser sintering), LC (Laser Cladding), SMD (Shape Metal Deposition), LMF (Laser Metal Forming), etc. can be used.

When the lattice structure 240 is applied to the supply part 210 of the cooling channel part 200, the capillary force increases because the hydraulic diameter inside the channel decreases and the surface area increases. If the capillary force increases, it is possible to secure a sufficient flow rate of the cooling medium when a high cooling capacity is required, so that the object to be cooled 20 can be effectively cooled.

When the lattice structure 240 is applied, it is necessary to adjust the number of passages H and porosity, and the number of passages H per square centimeter is 4 to 200, the porosity is 0.5 to 50%, and the number of channel regions is preferably designed to be 3 to 10 at the place in contact with the cooling object 20.

As shown in FIG. 5 , a concavo-convex structure 250 may be formed in the cooling channel unit 200 to improve capillary force and increase a heat exchange area. 5 illustrates the internal structure of the heat exchanger 220 of the cooling channel unit 200 as an example.

The concavo-convex structure 250 has a structure in which convex portions 251 and concave portions 252 are alternately and continuously formed.

In forming such a concavo-convex structure 250, a linear exposure method in which a laser beam is continuously exposed is conventionally used, but in the present invention, the capillary force is increased and the cooling medium and the mold 20. In order to increase the surface area between the 20, it is preferable to expose the laser beam using the following method.

Step exposure method: A method of exposing a laser beam, stopping it, moving it by a certain length (50 μm to 500 μm), and then exposing the laser beam again. When this method is applied, the roughness of the surface of the concavo-convex structure 250 increases, and the capillary force and surface area increase.

Multi-exposure method: This is a method in which a convex portion 251 is formed on a surface by exposing a laser beam several times at one location. In the case of such a multi-exposure method, it is preferable that the amount of energy of subsequent exposures is equal to or lower than that of previous exposures.

As described above, according to the present invention, by reducing the diameter of the supply part of the cooling channel part through which the cooling medium flows in multiple stages so that a small flow rate of the cooling medium flows in the heat exchange part of the cooling channel part, evaporation of the cooling medium is induced and cooling is performed by latent heat. Therefore, cooling efficiency can be maximized. In addition, since the cooling medium can move by capillary force as much as the amount of the cooling medium evaporated in the heat exchange unit of the cooling channel unit, a separate circulation device and an additional control device are unnecessary, so space utilization can be increased and costs can be reduced.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the claims below.

*10: Mold 20: Cooling target
100: supply passage part 200: cooling channel part
210: supply unit 211: first channel
212: second channel 213: third channel
214: 4th channel 215: 5th channel
220: heat exchange unit 230: discharge unit
240: lattice structure 250: uneven structure
300: discharge flow path part H: flow path

Claims (1)

A cooling channel provided inside the mold; and
And a supply flow passage for supplying a cooling medium to the cooling channel,
The cooling channel part,
A supply part formed such that a plurality of second cooling channels are branched from the first cooling channel connected to the supply passage part, and a third cooling channel is branched from each of the plurality of second cooling channels, so that the cooling channels are branched in multiple stages;
A heat exchange unit extending from the last branching point of the supply unit and allowing the cooling medium to evaporate and cool the object to be cooled by the latent heat of the cooling medium;
The supply part of the cooling channel part is gradually reduced in diameter in the direction of the heat exchange part,
Mold cooling device, characterized in that the cooling channel portion is provided with a lattice structure having a porosity of 0.5% to 50% to improve capillary force.