KR20230103406A - Photosensitive resin composition, display device and forming method of pattern - Google Patents

Abstract

A photosensitive resin composition capable of realizing a cured film having a forward taper and high hardness during pattern formation in a low-temperature curing process is provided. One embodiment of the present invention is an alkali-soluble resin 100 parts by weight, an initiator 2 to 40 parts by weight, a multifunctional compound 2 to 100 parts by weight, a plasticizer greater than 1 to 30 parts by weight and an epoxy-based additive including 0 to 15 parts by weight photosensitive A resin composition is provided.

Description

Photosensitive resin composition, display device and pattern formation method

The present invention relates to a photosensitive resin composition, a display device, and a pattern forming method, and more particularly, a photosensitive resin composition capable of forming a forward taper and realizing a cured film having high hardness when forming a pattern in a low temperature curing process, a display device, and pattern formation It's about how.

The display industry is largely divided into liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs), and interest in flexible displays based on OLEDs is high.

Following Korea, companies in China, Taiwan and Japan are also competitively trying to expand their flexible display business. As flexibility is given to a rigid display and a rollable and foldable design becomes possible, the display can be applied for various purposes.

In particular, in the case of organic light-emitting diode (OLED) displays, since a curing process at low temperatures is inevitable, materials such as photosensitive resin compositions applied to displays also require properties at low temperatures. However, it is generally known that a stable cured film can be obtained only when the photosensitive resin composition undergoes a post-curing process under conditions of 150 to 300 °C. Due to this, it is difficult to apply a curing step of 150 ° C. or higher to a device based on a flexible material having low heat resistance performance around 100 to 130 ° C.

An object of the present invention is to provide a photosensitive resin composition that forms a forward taper and has high hardness during pattern formation in a low-temperature curing process.

Another object of the present invention is to provide a photosensitive resin composition having excellent planarization performance of a patterned film and excellent adhesion to a substrate.

Another object of the present invention is to provide a display device including a cured film made of the photosensitive resin composition.

Another object of the present invention is to provide a pattern forming method applicable to the display device.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned above can be understood by the following description and will be more clearly understood by the examples of the present invention. It will also be readily apparent that the objects and advantages of the present invention may be realized by means of the instrumentalities and combinations indicated in the claims.

One embodiment of the present invention for achieving the above object, 100 parts by weight of an alkali-soluble resin, 2 to 40 parts by weight of an initiator, 2 to 100 parts by weight of a multifunctional compound, more than 1 part by weight of a plasticizer and less than 30 parts by weight and more than 0 epoxy-based additives It provides a photosensitive resin composition containing 15 parts by weight or less. Specifically, based on 100 parts by weight of the alkali-soluble resin, the content of the plasticizer may be greater than 1 and less than 11 parts by weight, and the content of the epoxy-based additive may be greater than 0 and less than 7 parts by weight.

Another embodiment of the present invention for achieving the above object may provide a display device including a cured film made of the photosensitive resin composition.

Another embodiment of the present invention for achieving the above object is (S1) forming a coating film by applying the photosensitive resin composition according to claim 1 on a substrate, (S2) positionally selectively exposing the coating film to light, It is possible to provide a pattern formation method comprising removing the unexposed coating film with a developer and (S3) curing the exposed coating film, wherein the (S3) step is a step performed at 80 to 150 ° C. .

The solution to the above problems does not enumerate all the features of the present invention. Various features of the present invention and the advantages and effects thereof will be understood in more detail with reference to the following specific examples.

According to one embodiment of the present invention, it is possible to provide a photosensitive resin composition that forms a forward taper during pattern formation in a low-temperature curing process, has excellent planarization performance of a pattern film, and has excellent adhesion to a substrate. By using such a photosensitive resin composition to form a pattern film of high hardness on a substrate of a flexible display, excellent pattern characteristics can be implemented.

In addition to the above effects, specific effects of the present invention will be described together while explaining specific details for carrying out the present invention.

Hereinafter, each configuration of the present invention will be described in more detail so that those skilled in the art can easily practice it, but this is only one example, and the scope of the present invention is Not limited.

One embodiment of the present invention is an alkali-soluble resin 100 parts by weight, an initiator 2 to 40 parts by weight, a multifunctional compound 2 to 100 parts by weight, a plasticizer greater than 1 to 30 parts by weight and an epoxy-based additive including 0 to 15 parts by weight photosensitive A resin composition is provided.

Hereinafter, the configuration of the present invention will be described in more detail.

1. Photosensitive resin composition

The photosensitive resin composition according to the present invention includes an alkali-soluble resin capable of imparting solubility to a developing solution used in a developing process when forming a pattern and performing a binder function.

Alkali-soluble resin according to an embodiment of the present invention may be a copolymer having any one selected from the group consisting of unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, and mixtures thereof as a monomer.

The unsaturated carboxylic acid may be, for example, any one selected from the group consisting of methacrylic acid, acrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, and vinylacetic acid.

The unsaturated carboxylic acid anhydride may be produced by reacting two molecules of one or two kinds selected from the unsaturated carboxylic acid, for example.

Specifically, based on 100 parts by weight of all copolymerization monomers participating in the copolymerization reaction for synthesizing the alkali-soluble resin, any one monomer selected from the group consisting of unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, and mixtures thereof is 10 to 60 parts by weight and may be copolymerized, specifically 20 to 50 parts by weight, more specifically 30 to 40 parts by weight and copolymerized. When the content of the unsaturated carboxylic acid, the unsaturated carboxylic acid anhydride, or a mixture thereof is less than the above numerical range, a problem in which it is difficult to dissolve in aqueous alkali solution may occur, and when it exceeds the above numerical range, solubility in aqueous alkali solution Excessive growth can cause problems.

Alkali-soluble resin according to another embodiment of the present invention may be a copolymer containing an olefin-based unsaturated compound as a monomer.

The olefinically unsaturated compound is, for example, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, methyl acrylate, isopropyl acrylate, Cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, dicyclopentenyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl methacrylate, dicyclopentanyl methacrylate, 1-adamantyl acrylate , 1-adamantyl methacrylate, dicyclopentanyloxyethyl methacrylate, isoboronyl methacrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, dicyclopentanyloxyethyl acrylate, isoboronyl methacrylate Ronyl acrylate, phenyl methacrylate, phenyl acrylate, benzyl methacrylate, benzyl acrylate, 2-hydroxyethyl methacrylate, styrene, σ-methyl styrene, m-methyl styrene, p-methyl styrene, vinyl Toluene, p-methoxy styrene, 1,3-butadiene, isoprene, 2,3-dimethyl 1,3-butadiene, glycidyl acrylate, glycidyl methacrylate, α-ethyl glycidyl acrylate, α-n -Glycidyl propylacrylate, α-n-butylglycidyl acrylate, β-methylglycidyl acrylate, β-methylglycidyl methacrylate, β-ethylglycidyl acrylate, methacrylic acid- β-Ethylglycidyl, 3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, 6,7-epoxyheptyl acrylate, 6,7-epoxyheptyl methacrylate, α-ethyl 6,7-epoxyheptyl acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, 3,4-epoxy cyclohexyl methacrylate, and combinations thereof It may be any one selected from the group consisting of.

The content of the olefinically unsaturated compound may be 60 to 95 parts by weight, specifically 60 to 80 parts by weight, more specifically 60 to 70 parts by weight based on 100 parts by weight of the total copolymerization monomers participating in the copolymerization reaction of the alkali-soluble resin can When the content of the olefinically unsaturated compound is less than the above numerical range, a problem of deterioration in resolution or heat resistance may occur, and when it exceeds the above numerical range, the alkali-soluble resin is difficult to dissolve in an alkaline aqueous solution as a developer. can happen

The polystyrene equivalent weight average molecular weight of the alkali-soluble resin according to an embodiment of the present invention may be 2,000 to 20,000 g/mol, specifically 2,000 to 10,000 g/mol, and more specifically 3,000 to 7,000 g/mol can When the weight average molecular weight of the alkali-soluble resin is less than the above numerical range, pattern developability, remaining film rate and heat resistance performance may be deteriorated, and when the above numerical range is exceeded, a pattern development problem may occur.

In the present specification, 'acrylic compound' is defined as encompassing all unsaturated carboxylic acids or unsaturated esters. For example, the unsaturated carboxylic acid may be acrylic acid or methacrylic acid, and the unsaturated ester may be methyl methacrylate or benzyl methacrylate.

According to another embodiment of the present invention, the alkali-soluble resin may be a copolymer containing an acrylic compound as a monomer. The glass transition temperature of the homopolymer containing the acrylic compound as a monomer may be 150 °C or less, specifically 110 °C or less, and more specifically 20 to 110 °C. When the glass transition temperature of the homopolymer containing the acrylic compound as a monomer satisfies the above numerical range, reflow characteristics may be advantageous during low-temperature curing. In addition, the homopolymer containing the acrylic compound as a monomer may have a weight average molecular weight of 3,000 to 7,000 g/mol.

The monomer having a glass transition temperature of 150 ° C or less is, for example, methyl methacrylate, glycidyl methacrylate, styrene, ethyl methacrylate, isobornyl acetate, epoxy cyclohexyl methyl methacrylate, N-butyl Methacrylate, isobutyl methacrylate, vinyl acetate, N-butyl acrylate, 2-ethyl hexyl acrylate, acrylic acid, cyclohexyl methacrylate, lauryl acrylate, ethylene glycol dimethyl acrylate, ethylene glycol methyl ether Acrylate, phenoxyethyl acrylate, phenoxy polyethylene glucoacrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxy-3-phenoxypropyl acrylic acid, 2-(acryloyloxy C) ethyl hydrogen succinate, neopentyl glycol diacrylate, 3-methyl-1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, etc. there is.

The initiator according to the present invention may be any one selected from the group consisting of radical photoinitiators, ionic photoinitiators, and combinations thereof.

The content of the initiator according to the present invention may be 2 to 40 parts by weight, specifically 2 to 20 parts by weight, more specifically 3 to 10 parts by weight based on 100 parts by weight of the alkali-soluble resin. When the content of the initiator is less than the above numerical range, there is a problem in that the remaining film rate is deteriorated due to low sensitivity, and when the content of the initiator exceeds the above numerical range, a problem in that developability and resolution is deteriorated may occur.

The radical photoinitiator may photocur the vinyl group of the alkali-soluble resin and the multifunctional compound.

The radical photoinitiator is, for example, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, p-dimethylaninoacetophenone, 1-(4-isopropylphenyl)-2 -Hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2 -Benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4 -morpholinyl)phenyl]-1-butanone and other acetophenone-based compounds, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldimethyl ketal and other benzoin-based compounds, benzophenone, Benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3',4,4'-tetra(t-butylpho Benzophenone compounds such as oxycarbonyl) benzophenone, thioxanthone, 2-chlorothioxanthone, 2-methyldioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2, Thioxanthone compounds such as 4-diethylthioxanthone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2- (p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2- Pipenonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl) - 4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxy-naphtho-1-yl) - 4,6-bis (trichloromethyl) -s-triazine, 2 Triazine compounds such as 4-trichloromethyl-(piperonyl)-6-triazine, 2,4-trichloromethyl(4'-methoxystyryl)-6-triazine, 2-(O- Benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H -Carbazol-3-yl]-ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, 1,2-octanedione, 2-dimethylamino-2-(4- Methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O- Benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-one oxime-O -Acetate, 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate, 2-(O-benzoyloxime)-1-[4-(phenylthio)p-methylphenyl]-1, 2-Octanedione, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-phenyldione, 2-(O-acetyloxime)-1-[4-(phenylthio) )Phenyl]-1,2-octanedione, 2-(O-acetyloxime)-1-[4-(phenylthio)phenyl]-1,2-phenyldione, 2-(O-acetyloxime)-1- [4-(phenylthio)phenyl]-1,2-methyldione, O-(acetyl)-N-(1-phenyl-2-oxo-2-(4'-methoxy-naphthyl)ethylidene)hydride oxime ester compounds such as oxylamine, phosphine compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, 2,2 '-bis(o-chlorophenyl)-4,5,4',5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(o-methoxyphenyl)-4,4' Imidazoles such as 5,5'-tetraphenylbiimidazole and 2,2'-bis(o-methoxyphenyl)-4,4',5,5'-tetra(p-methylphenyl)biimidazole compounds, quinone-based compounds such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone, borate-based compounds, carbazole-based compounds, and titanocene-based compounds.

The ionic photoinitiator may photocur an epoxy-based additive to be described later, and may be classified into a cationic photoinitiator and an anionic photoinitiator.

The cationic photoinitiators are, for example, sulfonium salts, iodonium salts, phosphonium salts, diazonium salts, pyridinium salts, benzothiazolium salts, sulfoxonium salts, ferrocene compounds, nitrobenzylsulfonates, alkyl or It may be allyl-N-sulfonyloxyimides, halogenated alkyl sulfonic acid esters, oxime sulfonates, etc., but is not limited thereto. Other examples of the cationic photoinitiator include tetrabutylammonium tetrafluoroborate, tetrabutylammonium hexafluorophosphate, tetrabutylammonium hydrogen sulfate, tetraethylammonium tetrafluoroborate, tetraethylammonium, p-toluenesulfonate, N ,N-dimethyl-N-benzylanilinium antimony hexafluoride, N,N-dimethyl-N-benzylanilinium boron tetrafluoride, N,N-dimethyl-N-benzylpyridinium antimony hexafluoride, N,N-dimethyl- N-benzyltrifluoromethanesulfonic acid, N,N-dimethyl-N-(4-methoxybenzyl)pyridinium hexafluoride antimony, N,N-dimethyl-N-(4-methoxybenzyl)toluidinium hexafluoride Antimony, ethyltriphenylphosphonium antimony hexafluoride, tetrabutylphosphonium antimony hexafluoride, triphenylsulfonium boron tetrafluoride, triphenylsulfonium antimony hexafluoride, triphenylsulfonium arsenic hexafluoride, tri(4-methoxyphenyl)sulfonium hexafluoride Arsenic fluoride, diphenyl (4-phenylthiophenyl) sulfonium arsenic hexafluoride, diphenyl iodonium arsenic hexafluoride, di-4-chlorophenyl iodonium arsenic hexafluoride, di-4-bromophenyl iodonium arsenic hexafluoride, phenyl (4- Methoxyphenyl) iodonium arsenic hexafluoride, diphenyl iodonium hexafluoride, di-4-chlorophenyl iodonium hexafluoride, di-4-bromphenyl iodonium hexafluoride, phenyl (4-methoxyphenyl) iodonium hexafluoride , 4-methylphenyl (4- (2-methylpropylphenyl)) iodonium hexafluoride, di-4-tetraphenyl iodonium hexafluoride, diphenyl iodonium hexafluoride, di-4-tetraphenyl iodonium hexafluoride antimony, di phenyl iodonium antimony hexafluoride, 4-methylphenyl (4- (2-methylpropylphenyl)) iodonium arsenic tetrafluoride, etc., but is not limited thereto.

Examples of the anionic photoinitiator include benzoin carbamate, dimethylbenzyloxycarbamoylamine, o-acyloxime, o-nitrobenzoincarbamate, formanilide derivatives, and α-ammonium acetophenone.

According to another embodiment of the present invention, the weight ratio (radical photoinitiator: ionic photoinitiator) of the radical photoinitiator and the ionic photoinitiator may be 1:0.2 to 1:0.9, specifically 1:0.5 to 1:0.9. And, more specifically, it may be 1:0.7 to 1:0.9. As the weight ratio (radical photoinitiator: ionic photoinitiator) of the radical photoinitiator and the ionic photoinitiator satisfies the above numerical range, a cured film having high hardness may be realized and residue may not be generated.

The photosensitive resin composition according to the present invention may contain a multifunctional compound to control sensitivity or workability of a cured film made of the photosensitive resin composition.

The content of the multifunctional compound according to the present invention may be 2 to 100 parts by weight, specifically 10 to 30 parts by weight, more specifically 10 to 20 parts by weight based on 100 parts by weight of the alkali-soluble resin. When the content of the multifunctional compound is less than the above numerical range, a problem of low remaining film rate may occur due to low sensitivity, and when the content of the multifunctional compound exceeds the above numerical range, a problem of deterioration in developability and resolution may occur.

The multifunctional compound according to the present invention may be any one selected from the group consisting of a multifunctional oligomer, a multifunctional monomer, and a mixture thereof.

The multifunctional oligomer has, for example, 2 to 20 functional groups, and includes aliphatic urethane acrylate oligomers, aromatic urethane acrylate oligomers, epoxy acrylate oligomers, epoxy methacrylate oligomers, polyester acrylate oligomers, and silicone acrylates. It may be one or a mixture of two or more selected from the group consisting of an oligomer, a melamine acrylate oligomer, and a dendritic acrylate oligomer.

The multifunctional monomer is, for example, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, pentachloride Erythritol triacrylate, pentaerythritol tetraacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol hexadiacrylate, dipentaerythritol tridiacrylate, dipentaerythritol diacrylate, sorbitol triacryl It may be one or a mixture of two or more selected from the group consisting of late, bisphenol A diacrylate derivatives, and dipentaerythritol polyacrylate.

The photosensitive resin composition according to the present invention includes a plasticizer in order to form a sequential taper during pattern formation under low-temperature curing conditions.

The plasticizer according to the present invention may be one or two or more selected from the group consisting of a phthalate-based compound, an adipate-based compound, a phosphate-based compound, and a monoisobutyrate-based compound.

For example, the phthalate-based compound may be dioctyl phthalate, diisononyl phthalate, etc., the adipate-based compound may be dioctyl adipate, the phosphate-based compound may be tricresyl phosphate, and the monoiso The butyrate-based compound may be 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate.

The content of the plasticizer according to the present invention may be greater than 1 and less than 30 parts by weight, specifically greater than 1 and less than 11 parts by weight, more specifically 2 to 10 parts by weight, more specifically 5 parts by weight based on 100 parts by weight of the alkali-soluble resin. to 10 parts by weight. When the content of the plasticizer is less than the above numerical range, under-cut may occur during pattern formation, and when the content of the plasticizer exceeds the above numerical range, the hardness of the cured film may be excessively low.

The photosensitive resin composition according to the present invention includes an epoxy-based additive to compensate for the decrease in hardness of the cured film due to the addition of the plasticizer.

The content of the epoxy-based additive according to the present invention may be greater than 0 and less than 15 parts by weight based on 100 parts by weight of the alkali-soluble resin, specifically greater than 0 and less than 7 parts by weight, more specifically 1 to 6 parts by weight, more specifically 3 parts by weight to 5 parts by weight. When the content of the epoxy-based additive is less than the above numerical range, the hardness may not be sufficiently high, and when it exceeds the above numerical range, a problem of remaining residue may occur.

The epoxy-based additive may be an alicyclic compound. The epoxy-based additive may be an aliphatic cyclic compound including two or more aliphatic cyclic structures including an epoxy group. Specifically, the epoxy-based additive may include an aliphatic ring structure including two or more epoxy groups at a chain terminal. For example, the epoxy-based additive may include an aliphatic ring structure including one epoxy group at one end; and an aliphatic ring structure including one epoxy group at the other terminal.

According to another embodiment of the present invention, the epoxy-based additive may further include an organic group having 2 to 70 carbon atoms having one or more ester groups as a linking group of the aliphatic ring structures. The 'organic group having 2 to 70 carbon atoms having one or more ester groups' may be, for example, a chain or branched alkyl group having 2 to 70 carbon atoms having one or more ester groups. However, the technical spirit of the present invention is not limited to an alkyl group, and various organic groups may be applied.

According to one embodiment of the present invention, the epoxy-based additive may be a compound represented by Formula 1 or 2 below.

[Formula 1]

In Formula 1, n may be an integer of 1 to 10, specifically an integer of 1 to 5, more specifically an integer of 1 to 2.

[Formula 2]

In Formula 2, n may be an integer of 1 to 10, specifically an integer of 1 to 5, more specifically an integer of 1 to 2.

According to another embodiment of the present invention, the weight ratio of the plasticizer and the epoxy-based additive (plasticizer: epoxy-based additive) may be 10: 1 to 10:25, specifically 10: 1 to 10: 6 And, more specifically, it may be 10:5 to 10:6. When the weight ratio of the plasticizer and the epoxy-based additive is within the above numerical range, forward taper, high hardness, and high flatness characteristics may be implemented and residue may not be generated.

The photosensitive resin composition according to the present invention may further include a black pigment to impart coloring and light blocking properties. Specifically, the black pigment may be, for example, carbon black, alumina, titanium dioxide, barium titanate, magnesium titanate, calcium titanate, strontium titanate, zinc oxide, silica sand, clay, mica, wollastonite, diatomaceous earth, chromium oxide, cerium oxide, ben It may be powder or particles of antimony trioxide, magnesium oxide, zirconium oxide, barium sulfate, barium carbonate, calcium carbonate, silica powder, silicon carbide, silicon nitride, boron carbide, tungsten carbide, titanium carbide, or the like. The powder or particles may be used after being dispersed in a dispersion medium as needed. In addition, the content of the black pigment may be appropriately adjusted according to the use.

The photosensitive resin composition according to the present invention may further include additives if necessary. The additive may be, for example, any one selected from the group consisting of a crosslinking agent, a dispersing agent, a silane coupling agent, and combinations thereof. The content of the additives may be appropriately adjusted to meet each purpose and use.

The crosslinking agent may be, for example, a melamine-based crosslinking agent, and specifically, the melamine-based crosslinking agent may include methoxy methyl melamine, hexamethoxy methyl melamine, alkoxy alkylmethanol melamine, methanol melamine), carboxymethyl melamine, and a melamine-based compound having a hydroxymethylamino group.

The dispersant may be, for example, a surfactant added to improve coatability or developability of the photosensitive resin composition. The surfactant may be, for example, a silicon-based compound or a fluorine-based compound. The silicon-based compound may be, for example, polydimethylsiloxane, and the fluorine-based compound may be, for example, BM-1000, BM-1100 (BM Chemie Co.), Proride FC-135 / FC-170C / FC-430 (Sumitomo 3M Co., Ltd.), SH-28PA/-190/SZ-6032 (Tore Silicon Co., Ltd.), and the like.

The silane coupling agent may be needed to improve adhesion between the photosensitive resin composition and a lower substrate, for example. The silane coupling agent, for example, (3-glycidoxypropyl)trimethoxysilane, (3-glycidoxypropyl)triethoxysilane, (3-glycidoxypropyl)methyldimethoxysilane , (3-glycidoxypropyl)methyldiethoxysilane, (3-glycidoxypropyl)dimethylethoxysilane, 3,4-epoxybutyltrimethoxysilane, 3,4-epoxybutyltriethoxy Silane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, aminopropyltrimethoxysilane, amino Propyltriethoxysilane, 3-triethoxysilyl-N-(1,3 dimethyl-butylidene)propylamine, N-2(aminoethyl)3-aminopropyltrimethoxysilane, N-2( aminoethyl)3-aminopropyltriethoxysilane, N-2(aminoethyl)3-aminopropylmethyldimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane and (3-isocyanatepropyl) It may be one or a mixture of two or more selected from the group consisting of triethoxysilane.

The photosensitive resin composition according to the present invention may further include a solvent to minimize residual solvent in a low-temperature curing process and to secure chemical resistance. Specifically, the boiling point of the solvent may be less than 150 ℃, more specifically, from 60 to less than 150 ℃.

The solvent may be, for example, any one selected from the group consisting of ester-based solvents, ether-based solvents, alcohol solvents, and mixtures thereof.

The ester-based solvent is, for example, methyl-2-hydroxyisobutyrate, ethylene glycol monomethyl ether acetate, 2-methoxy-1-methylethyl ester ( 2-methoxy-1-methylethyl ester), propylene acetate, ethyl propionate, and ethyl pyruvate. It may be one or a mixture of two or more selected from the group consisting of.

The ether-based solvent is, for example, 1-methoxy-2-propanol, dibutyl ether, ethylene glycol, monomethyl ether, ethylene It may be one or a mixture of two or more selected from the group consisting of ethylene glycol dimethyl ether, propylene glycol dimethyl ether, and tetrahydrofuran.

The alcohol solvent may be, for example, one or a mixture of two or more selected from the group consisting of methanol, ethanol, and isopropyl alcohol.

The solvent according to the present invention may be added so that the total solid content of the photosensitive resin composition is 10 to 50% by weight. A thin film can be effectively formed from the photosensitive resin composition only when the content of the solvent is within the above numerical range.

2. Display device

Another embodiment of the present invention provides a display device including a cured film made of the photosensitive resin composition. When the photosensitive resin composition is used, curing is possible at a low temperature of 150° C. or less, and a forward tapered black matrix pattern can be formed. That is, the cured film may be a forward tapered black matrix containing a black pigment.

A display device according to an embodiment of the present invention may be a device on which a pattern is formed using the photosensitive resin composition, and may be a flexible display device having flexibility.

A display device according to another embodiment of the present invention may include a cured film made of the photosensitive resin composition patterned on a substrate. The substrate is, for example, a substrate commonly used in a flexible display device, and may be a glass substrate or a substrate made of a plastic material.

3. Pattern formation method

Another embodiment of the present invention is (S1) forming a coating film by applying the photosensitive resin composition on a substrate, (S2) positionally exposing the coating film to light, and then removing the unexposed coating film with a developer. and (S3) curing the exposed coating film.

The step (S3) may be a step performed at 80 to 150 ° C, and specifically may be a step performed at 80 to 100 ° C.

In general, it is known that a stable cured film can be obtained only when the photosensitive resin composition undergoes a post-curing process under conditions of 150 to 300°C. However, there is a problem in that it is difficult to apply a curing step of 150 ° C or higher to a device based on a flexible material having low heat resistance performance around 100 to 130 ° C. According to one embodiment of the present invention, by using the photosensitive resin composition, it is possible to implement a patterning method having a forward taper, high hardness, excellent adhesion to a substrate, and high smoothness when forming a pattern even at a low temperature.

Hereinafter, an embodiment of the present invention will be described in detail so that those skilled in the art can easily practice it, but this is only one example, and the scope of the present invention is Not limited.

[Synthesis Example 1: Synthesis of alkali-soluble resin]

In a flask equipped with a cooler and a stirrer, 400 parts by weight of propylene glycol methyl ether acetate, 70 parts by weight of methacrylic acid (a homopolymer with a glass transition temperature of 228 ° C), 10 parts by weight of styrene, 10 parts by weight of N-phenylmaleimide and benzyl meth 10 parts by weight of acrylate was added to prepare a mixed solution in which they were mixed. After sufficiently stirring the mixture in the flask at 90 rpm with the stirrer, 15 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) as a polymerization initiator was added to prepare a polymerization mixture solution. After slowly raising the temperature of the polymerization mixture solution to 60 ° C, it was maintained at 60 ° C for 16 hours. Thereafter, the maintained polymerization mixture solution was cooled to room temperature, and 0.05 parts by weight of hydrobenzophenone as a polymerization inhibitor was added to obtain a polymer solution having a solid content of 30% by weight based on the total weight of the polymer solution.

As a result of gel permeation chromatography (GPC) measurement, the weight average molecular weight of the obtained alkali-soluble resin in terms of standard polystyrene was 10,000 g/mol.

[Synthesis Example 2: Synthesis of alkali-soluble resin]

An alkali-soluble resin was synthesized in the same manner as in Synthesis Example 1, but instead of the mixed solution according to Synthesis Example 1, 400 parts by weight of propylene glycol methyl ether acetate, 70 parts by weight of acrylic acid and 4 parts by weight of styrene, 4 parts by weight of N-phenylmaleimide A mixed solution in which 22 parts by weight of part and benzyl methacrylate were mixed was used.

<Production Example: Preparation of photosensitive resin composition>

Photosensitive resin compositions according to Examples and Comparative Examples were prepared, and the mixing ratios were summarized in Tables 1 and 2 below. The content of each component was set based on 100 parts by weight of the alkali-soluble resin.

<Example 1>

100 parts by weight of the alkali-soluble resin synthesized in Synthesis Example 2, 10 parts by weight of a radical photoinitiator (2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione), ion Photoinitiator (di-4-bromophenyliodonium hexafluoride) 5 parts by weight, polyurethane acrylate oligomer containing 10 functional groups 10 parts by weight, multifunctional monomer (dipentaerythritol hexaacrylate) 20 parts by weight, silane coupling agent ((3-glycidoxypropyl)methyldiethoxysilane) 5 parts by weight, black pigment (carbon black) 80 parts by weight, plasticizer (monoisobutyrate; KYOWANOL M from KH Neochem Co., Ltd.) 10 parts by weight, and 5 parts by weight of an epoxy additive (3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane-carboxylate) was mixed. The solution obtained by dissolving the solvent (propylene glycol methyl ether acetate) in the mixture so that the concentration of the solid content is 20% by weight based on the total weight of the photosensitive resin composition is filtered through a 0.2 μm Millipore filter to finally obtain the photosensitive resin composition manufactured.

<Example 2: Unlike Example 1, using an alkali-soluble resin according to Synthesis Example 1>

A photosensitive resin composition was prepared in the same manner as in Example 1, but the alkali-soluble resin according to Synthesis Example 1 was used instead of the alkali-soluble resin according to Synthesis Example 2.

<Examples 3 to 5: When only the content of the ionic photoinitiator is changed>

A photosensitive resin composition was prepared in the same manner as in Example 1, but 5 parts by weight, 7 parts by weight (Example 3), and 9 parts by weight of the ion photoinitiator (di-4-bromophenyliodonium hexafluoride) Example 4) and 2 parts by weight (Example 5), respectively.

<Examples 6 to 8: When only the content of plasticizer is changed>

A photosensitive resin composition was prepared in the same manner as in Example 1, but the content of the plasticizer (monoisobutyrate) was 10 parts by weight, 2 parts by weight (Example 6), 5 parts by weight (Example 7) and 10 parts by weight ( Example 8) were respectively changed.

<Examples 9 to 11: When the content of the epoxy-based additive is changed>

A photosensitive resin composition was prepared in the same manner as in Example 1, but 5 parts by weight, which is the content of the epoxy-based additive (3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane-carboxylate), 1 part by weight ( Example 9), 2 parts by weight (Example 10) and 6 parts by weight (Example 11), respectively.

<Example 12: When the weight ratio of plasticizer:epoxy-based additive is 10:5>

A photosensitive resin composition was prepared in the same manner as in Example 1, but the content of the plasticizer (monoisobutyrate) was changed from 10 parts by weight to 30 parts by weight, and the epoxy additive (3,4-epoxycyclohexylmethyl 3,4 -Epoxycyclohexane-carboxylate) content of 5 parts by weight was changed to 15 parts by weight.

<Example 13: When the weight ratio of plasticizer:epoxy-based additive is 10:14>

A photosensitive resin composition was prepared in the same manner as in Example 1, but the content of the plasticizer (monoisobutyrate), 10 parts by weight, was changed to 8.4 parts by weight, and the epoxy additive (3,4-epoxycyclohexylmethyl 3,4 -Epoxycyclohexane-carboxylate) content of 5 parts by weight was changed to 12 parts by weight.

<Example 14: When the weight ratio of plasticizer:epoxy-based additive is 10:5.7 >

A photosensitive resin composition was prepared in the same manner as in Example 1, but the content of the plasticizer (monoisobutyrate) was changed from 10 parts by weight to 21 parts by weight, and the epoxy additive (3,4-epoxycyclohexylmethyl 3,4 -Epoxycyclohexane-carboxylate) content of 5 parts by weight was changed to 12 parts by weight.

<Examples 15 to 17: Unlike Example 12, when the content of the epoxy-based additive is changed>

A photosensitive resin composition was prepared in the same manner as in Example 12, but 15 parts by weight of the epoxy additive (3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane-carboxylate) was 3 parts by weight Example 15), 6 parts by weight (Example 16) and 12 parts by weight (Example 17), respectively.

<Examples 18 to 20: Unlike Example 1, the content of the ion photoinitiator is different>

A photosensitive resin composition was prepared in the same manner as in Example 1, but 5 parts by weight of the ion photoinitiator (di-4-bromophenyliodonium hexafluoride), 0 parts by weight (Example 18), and 1 part by weight (Example 18). Example 19) and 10 parts by weight (Example 20), respectively.

<Examples 21 and 22: Unlike Example 1, when the content of the epoxy-based additive is changed>

A photosensitive resin composition was prepared in the same manner as in Example 1, but the content of the epoxy-based additive, 5 parts by weight, was changed to 0.9 parts by weight (Example 21) and 7 parts by weight (Example 22), respectively.

<Comparative Example 1: In the case of not using both an epoxy-based additive and a plasticizer>

A photosensitive resin composition was prepared in the same manner as in Example 1, but all epoxy-based additives and plasticizers were removed.

<Comparative Example 2: Unlike Comparative Example 1, when an epoxy-based additive is added>

A photosensitive resin composition was prepared in the same manner as in Comparative Example 1, but 5 parts by weight of an epoxy-based additive (3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane-carboxylate) was additionally added.

<Comparative Example 3: Unlike Comparative Example 2, when a plasticizer is added>

A photosensitive resin composition was prepared in the same manner as in Comparative Example 2, but 1 part by weight of a plasticizer (monoisobutyrate) was additionally added.

<Comparative Example 4: Unlike Comparative Example 1, when the ionic photoinitiator is removed>

A photosensitive resin composition was prepared in the same manner as in Comparative Example 1, but an ion photoinitiator was not used.

<Comparative Example 5: Unlike Example 1, when an excessive amount of epoxy-based additive is added>

A photosensitive resin composition was prepared in the same manner as in Example 1, but 5 parts by weight of the epoxy-based additive was changed to 26 parts by weight.

<Comparative Example 6: Unlike Example 1, when the content of the plasticizer is changed>

A photosensitive resin composition was prepared in the same manner as in Example 1, but 10 parts by weight of the plasticizer (monoisobutyrate) was changed to 31 parts by weight.

<Comparative Example 7: Unlike Example 1, when the contents of the plasticizer and the epoxy-based additive are changed>

A photosensitive resin composition was prepared in the same manner as in Example 1, but 10 parts by weight of the plasticizer (monoisobutyrate) was changed to 13.2 parts by weight, and 5 parts by weight of the epoxy additive was changed to 16 parts by weight.

<Comparative Example 8: Unlike Example 1, when no epoxy additive is used>

A photosensitive resin composition was prepared in the same manner as in Example 1, but the epoxy-based additive was removed.

Unit: parts by weight Binder ¹⁾
(synthesis example)
RI ²⁾ II ³⁾ 10MM ⁴⁾ MM ⁵⁾ pigment ⁶⁾
Coupling agent ⁷⁾ Plasticizer (P) ⁸⁾
Epoxy additives (E) ⁹⁾
P:E (w/w) Example 1 100(2) 10 5 10 20 80 5 10 5 10:5 Example 2 100(1) 10 5 10 20 80 5 10 5 10:5 Example 3 100(2) 10 7 10 20 80 5 10 5 10:5 Example 4 100(2) 10 9 10 20 80 5 10 5 10:5 Example 5 100(2) 10 2 10 20 80 5 10 5 10:5 Example 6 100(2) 10 5 10 20 80 5 2 5 10:25 Example 7 100(2) 10 5 10 20 80 5 5 5 10:10 Example 8 100(2) 10 5 10 20 80 5 10 5 10:5 Example 9 100(2) 10 5 10 20 80 5 10 One 10:1 Example 10 100(2) 10 5 10 20 80 5 10 2 10:2 Example 11 100(2) 10 5 10 20 80 5 10 6 10:6 Example 12 100(2) 10 5 10 20 80 5 30 15 10:5 Example 13 100(2) 10 5 10 20 80 5 8.4 12 10:14 Example 14 100(2) 10 5 10 20 80 5 21 12 10:5.7 Example 15 100(2) 10 5 10 20 80 5 30 3 10:1 Example 16 100(2) 10 5 10 20 80 5 30 6 10:2 Example 17 100(2) 10 5 10 20 80 5 30 12 10:4 1) Binder: Alkali-soluble resin (Synthesis Example 1 or 2)
2) RI: radical photoinitiator (2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione)
3) II: ionic photoinitiator (di-4-bromophenyliodonium hexafluoride)
4) 10MM: polyurethane acrylate oligomer containing 10 functional groups
5) MM: multifunctional monomer (dipentaerythritol hexaacrylate)
6) Pigment: carbon black
7) Coupling agent: (3-glycidoxypropyl)methyldiethoxysilane
8) Plasticizer: monoisobutyrate
9) Epoxy additive: 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane-carboxylate
The above 1) to 9) are the same in Table 2 below.

Unit: parts by weight bookbinder
(synthesis example)
RI II 10MM MM pigment
coupling agent Plasticizer (P)
Epoxy additive (E)
P:E
(w/w) Example 18 100(2) 10 0 10 20 80 5 10 5 10:5 Example 19 100(2) 10 One 10 20 80 5 10 5 10:5 Example 20 100(2) 10 10 10 20 80 5 10 5 10:5 Example 21 100(2) 10 5 10 20 80 5 10 0.9 10:0.9 Example 22 100(2) 10 5 10 20 80 5 10 7 10:7

Unit: parts by weight bookbinder
(synthesis example)
RI II 10MM MM pigment
coupling agent Plasticizer (P)
Epoxy additive (E)
P:E
(w/w) Comparative Example 1 100(2) 10 5 10 20 80 5 0 0 0:0 Comparative Example 2 100(2) 10 5 10 20 80 5 0 5 0:1 Comparative Example 3 100(2) 10 5 10 20 80 5 One 5 10:50 Comparative Example 4 100(2) 10 0 10 20 80 5 0 0 0:0 Comparative Example 5 100(2) 10 5 10 20 80 5 10 26 10:26 Comparative Example 6 100(2) 10 5 10 20 80 5 31 5 1:0.1 Comparative Example 7 100(2) 10 5 10 20 80 5 13.2 16 10:12 Comparative Example 8 100(2) 10 5 10 20 80 5 10 0 1:0

[Experimental Example: Evaluation of Cured Film Made of Photosensitive Resin Composition]

After applying the photosensitive resin composition according to Preparation Example on a bare glass substrate using a slit coater, prebaking was performed on a hot plate at 85° C. for 2 minutes to form a film having a thickness of 2.0 μm. The obtained film was irradiated with 100 mJ of ultraviolet light having an intensity of 100 mW/cm ² at 365 nm using a broadband exposure device using a predetermined pattern mask. Then, after developing for 60 seconds at 23 ℃ with tetramethylammonium hydroxide aqueous solution (2.38wt%), washed for 60 seconds with ultrapure water. For final curing, a patterned film was obtained by heating in an oven at 85° C. for 60 minutes. 10 μm lines and spaces were analyzed using a scanning electron microscope (SEM).

1) Forward taper

Mark O if there is no under-cut of the lower critical dimension (CD) size, △ if the length of the combined under-cut on both sides is 0.1 to 0.9㎛, and X if it is 1.0㎛ or more did If the under-cut is 0, 'O' if the taper angle exceeds 80° and is less than 90°; If it is 80° or less, it is marked with '◎'.

2) Hardness

Under the measurement conditions (F = 200 uN, loading / unloading time = 5 seconds, creep time = 2 seconds, 3 times), the line was measured using a nano indenter (HM200). When the firing hardness was 350 N/mm ² or more, O was indicated as ◎, especially when it was 370 N/mm ² or more, 320 to less than 350 N/mm ² was indicated as △, and 319 N/mm ² or less was indicated as X.

3) flattening

Separately, the photosensitive resin composition according to the Preparation Example was spin-coated on a substrate (glass) on which a lower pattern film having a 1:1 line and space of 20 μm was formed, and a flat part was prepared under the curing conditions. Then, the degree of planarization (DOP) was calculated according to Equation 1 below. If the calculated value was 85% or more, O was indicated as ◎, especially if it was 88% or more, △ if it was 76~84%, and X if it was 75% or less.

[Equation 1]

DOP(%)={①-(②-③)}/① X 100

(In Equation 1, ① = the thickness of the lower pattern film, ② = the maximum thickness of the flat part with the lower pattern film, and ③ = the maximum thickness of the flat part without the lower pattern film.)

4) residue

If the residue in the space part between the lines in the Line & Space is less than 0.4㎛ (5% of the area), it is 'O', and in particular, if it is 0, it is '◎', less than 0.5 to 1㎛ Residues were marked with 'Δ', and residues of 1 µm or more were marked with 'X'.

forward taper Hardness flattening residue Example 1 ◎ ◎ ◎ O Example 2 O ◎ O O Example 3 ◎ ◎ ◎ O Example 4 ◎ ◎ ◎ O Example 5 ◎ O ◎ O Example 6 O ◎ O O Example 7 O ◎ O O Example 8 ◎ ◎ ◎ O Example 9 ◎ O ◎ O Example 10 ◎ O ◎ O Example 11 ◎ ◎ ◎ O Example 12 O O O O Example 13 O O O O Example 14 O O O O Example 15 O O O O Example 16 O O O O Example 17 O O O O

forward taper Hardness flattening residue Example 18 O △ O O Example 19 O △ O O Example 20 O O O △ Example 21 O △ O O Example 22 △ O △ △

forward taper Hardness flattening residue Comparative Example 1 X X X O Comparative Example 2 X O X O Comparative Example 3 △ O △ O Comparative Example 4 X X X O Comparative Example 5 X X X O Comparative Example 6 O X O O Comparative Example 7 X O X X Comparative Example 8 △ X △ O

Referring to Examples 1 and 2 in Table 4, it can be seen that the forward taper and planarization performance are further improved by using acrylic acid instead of methacrylic acid as a monomer for synthesizing the alkali-soluble resin.

Referring to Examples 1 and 3 to 5 in Table 4, when the weight ratio (radical photoinitiator: ion photoinitiator) of the radical photoinitiator and the ion photoinitiator is 1:0.7 to 1:0.9, an optimal cured film having high hardness is realized. It can be, and it can be confirmed that no residue is formed.

Referring to Examples 6 to 11 in Table 4, when the weight ratio of the plasticizer and the epoxy-based additive (plasticizer: epoxy-based additive) is 10: 1 to 10: 6, the forward taper and planarization performance can be simultaneously improved, A cured film having high hardness can be implemented.

Referring to Tables 4 and 6, Comparative Examples 1 and 4 in which neither a plasticizer nor an epoxy-based additive were used had problems in that the hardness of the cured film was low and the forward taper and flattening performance were poor. In addition, Comparative Example 2 using only epoxy-based additives among plasticizers and epoxy-based additives can implement a cured film with low hardness, but has a problem in that forward taper and flattening performance are not improved. Comparative Example 8 using only plasticizers is epoxy-based There was a problem that the hardness of the cured film was very low by not using the additive. On the other hand, according to Examples 1 to 22 using both the epoxy-based additive and the plasticizer, both a cured film having high hardness and high forward taper and planarization performance can be implemented by using an appropriate amount of the plasticizer and the epoxy-based additive.

Comparing Comparative Examples 3, 5 and 6 with Examples, it was confirmed that the net taper and flattening performance were improved when the content of the plasticizer was greater than 1 and less than 30 parts by weight based on 100 parts by weight of the alkali-soluble resin, specifically greater than 1 and less than 11 It was confirmed that the weight part was further improved. In addition, comparing Comparative Examples 7 and 8 with Examples, it can be confirmed that when the content of the epoxy-based additive is greater than 0 and 15 parts by weight or less based on 100 parts by weight of the alkali-soluble resin, the high hardness cured film and the forward taper and planarization performance are improved. It can be confirmed that it is further improved when it is specifically greater than 0 and less than 7 parts by weight.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also present. It falls within the scope of the right of invention.

Claims (19)

Alkali-soluble resin 100 parts by weight;
2 to 40 parts by weight of an initiator;
2 to 100 parts by weight of a multifunctional compound;
More than 1 and up to 30 parts by weight of a plasticizer; and
more than 0 to 15 parts by weight of an epoxy-based additive; containing
A photosensitive resin composition. According to claim 1,
Based on 100 parts by weight of the alkali-soluble resin,
The content of the plasticizer is more than 1 and less than 11 parts by weight,
The content of the epoxy-based additive is greater than 0 and less than 7 parts by weight,
A photosensitive resin composition. According to claim 1,
The weight average molecular weight of the alkali-soluble resin is,
2,000 to 20,000 g/mol
A photosensitive resin composition. According to claim 1,
The alkali-soluble resin,
A copolymer containing an acrylic compound as a monomer,
A photosensitive resin composition. According to claim 4,
The glass transition temperature of the homopolymer containing the acrylic compound as a monomer is 150 ° C or less,
A photosensitive resin composition. According to claim 1,
The initiator,
Any one selected from the group consisting of radical photoinitiators, ionic photoinitiators, and combinations thereof,
A photosensitive resin composition. According to claim 6,
The weight ratio of the radical photoinitiator and the ionic photoinitiator (radical photoinitiator: ionic photoinitiator) is,
1:0.2 to 1:0.9;
A photosensitive resin composition. According to claim 1,
The multifunctional compound,
Any one selected from the group consisting of multifunctional oligomers, multifunctional monomers, and mixtures thereof,
A photosensitive resin composition. According to claim 1,
The plasticizer,
One or two or more selected from the group consisting of phthalate-based compounds, adipate-based compounds, phosphate-based compounds and monoisobutyrate-based compounds,
A photosensitive resin composition. According to claim 1,
The weight ratio of the plasticizer and the epoxy-based additive (plasticizer: epoxy-based additive) is 10: 1 to 10: 25,
A photosensitive resin composition. According to claim 1,
The epoxy-based additive,
An alicyclic compound,
A photosensitive resin composition. According to claim 11,
The epoxy-based additive,
An aliphatic ring compound containing two or more aliphatic ring structures containing an epoxy group,
A photosensitive resin composition. According to claim 12,
The epoxy-based additive,
Further comprising an organic group having 2 to 70 carbon atoms having at least one ester group as a linking group of the aliphatic ring structures,
A photosensitive resin composition. According to claim 11,
The epoxy-based additive,
A compound represented by Formula 1 or 2 below,
A photosensitive resin composition.
[Formula 1]

(In Formula 1, n is an integer from 1 to 10.)
[Formula 2]

(In Formula 2, n is an integer from 1 to 10.) According to claim 1,
black pigment; further comprising
A photosensitive resin composition. According to claim 1,
additive; Including more,
The additive is
Any one selected from the group consisting of a crosslinking agent, a dispersing agent, a silane coupling agent, and combinations thereof
A photosensitive resin composition. A display device comprising a cured film made of the photosensitive resin composition according to any one of claims 1 to 16. 18. The display device of claim 17, wherein the cured film is a forward tapered black matrix containing a black pigment. (S1) forming a coating film by applying the photosensitive resin composition according to claim 1 on a substrate;
(S2) positionally selectively exposing the coated film and then removing the unexposed coated film with a developing solution; and
(S3) curing the exposed coating film; including,
The step (S3) is a step performed at 80 to 150 ° C,
How to form a pattern.