KR20230099250A - Electric range - Google Patents

Abstract

Disclosed is an electric range. The disclosed electric range disposes a first electronic element group on an inner-side of an air guide, disposes a second electronic element group on an outer-side of a first side of the air guide, flows in the inner side of the air guide by forming an air discharge hole on an outer wall of the first side of the air guide, and enables some air among the air that cools the first electronic element group to be provided to the second electronic element group. Accordingly, all of the first and second electronic element groups can be cooled.

Description

Electric range {ELECTRIC RANGE}

The present invention relates to an electric range, and more particularly, to an electric range having a structure capable of effectively cooling the inside.

BACKGROUND OF THE INVENTION Various types of cooking utensils for heating food at home or in restaurants are being used. Cookware includes a gas range using gas and an electric range using electricity.

Electric ranges are largely divided into resistance heating methods and induction heating methods.

The electric resistance method generates heat by applying current to a non-metallic heating element such as a metal resistance wire or silicon carbide, and heats the object to be heated (for example, a cooking vessel such as a pot or frying pan) by radiating or conducting the generated heat. am.

The induction heating method is a method of applying high-frequency power to a coil to generate a magnetic field around the coil, and heating an object to be heated made of a metal component using an eddy current generated from the generated magnetic field.

Looking at the basic heating principle of the induction heating method, when a current is applied to a working coil or a heating coil, heat is generated while induction heating of an object to be heated, and the object to be heated is heated by the generated heat.

As a prior art related to this, Korean Patent Registration No. 1,291,428 discloses a cooking appliance that operates in an induction heating method.

A conventional cooking appliance includes an inverter module including an induction heating unit and electrical elements supplying power to the induction heating unit, a heat sink to which heating electric elements (electronic elements) are mounted, and one end of the heat sink. A cooling fan connected to and a flow guide (air guide) disposed on one side of the heat sink. Here, the flow guide guides a portion of the cooling air discharged from the cooling fan in the direction where the heating electric element is disposed. At this time, a gap is formed below the flow guide in a lateral direction so that air is discharged to the outside of the flow guide.

As another prior art, Korean Patent Registration No. 1,878,048 discloses a cooking appliance that operates in an induction heating method.

In another prior art cooking appliance, the duct transfers outside air to the inside of the cooking appliance with a lateral extension section. In addition, the guide cover (air guide) covers the heat-generating chip and the heat sink to separate the chip (electronic element) and the heat sink from the inner space of the cooking appliance, and the air discharged from the fan flows into the chip and the heat sink. At this time, a gap is formed under the guide cover in the lateral direction so that air is discharged to the outside of the guide cover.

However, the prior art has the following problems.

In the prior art, since the air guide extends in a straight line, the air cooling the heat sink and the electronic device is heated and discharged to the outside. Therefore, the cooling efficiency of the electronic device located outside the air guide is reduced.

In addition, in the prior art, since the lower portion of the air guide in the lateral direction is completely open, a lateral flow loss occurs over the entire length of the air guide. Accordingly, the flow rate of air from the inlet to the outlet of the air guide is slowed, so that both the electronic devices inside the guide cover and the electronic devices outside cannot be efficiently cooled.

In addition, in the prior art, the gap for discharging air to the outside of the air guide is adjacent to the electrical housing and adjacent to the lower side of the heat sink. Here, since the heat sink has a trapezoidal shape, the flow rate of air flowing to the lower side of the heat sink is smaller than the flow rate of air flowing to the upper side of the heat sink. Therefore, a sufficient amount of cooling air cannot be provided to the external electronic device through the gap.

An object of the present invention is to provide an electric range having a structure capable of effectively suppressing overheating of a printed circuit board mounted therein and increasing cooling efficiency of the printed circuit board.

In addition, an object of the present invention is to provide an electric range having a structure capable of efficiently cooling both the heat sink and the first electronic element group disposed inside the air guide and the second electronic element group disposed outside the air guide. is to provide

Another object of the present invention is to provide an electric range having a structure capable of cooling the second electronic element group disposed outside the air guide without reducing the cooling efficiency of the first electronic element group disposed inside the air guide. is to do

Another object of the present invention is to provide an electric range having a structure capable of providing relatively cool air to the second electronic element group disposed outside the air guide.

Another object of the present invention is to provide an electric range having a structure capable of supplying a sufficient amount of air to the second electronic element group disposed outside the air guide.

In addition, an object of the present invention is to provide an electric range capable of cooling a control board disposed outside an air guide together with electronic devices mounted on a printed circuit board.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned above can be understood by the following description and will be more clearly understood by the examples of the present invention.

In the electric range according to an embodiment of the present invention, a first electronic element group is disposed inside the air guide, a second electronic element group is disposed outside the first side of the air guide, and the first side of the air guide By forming an air discharge hole on the outer wall of the air guide, some of the air flowing inside the air guide to cool the first electronic device group may be supplied to the second electronic device group. Thus, both the first and second electronic device groups can be cooled.

In addition, in the electric range according to an embodiment of the present invention, an air discharge hole may be formed in front of a second inner electronic element having a large heat generation amount among a plurality of inner electronic elements included in the first electronic element group. Accordingly, relatively cool air can be provided to the second electronic device group, and cooling efficiency of the second electronic device group can be increased.

In addition, an electric range according to an embodiment of the present invention includes a portion A of the air guide adjacent to the communication portion communicating with the blowing fan, and a portion B of the air guide further away from the communication portion than portion A. At this time, the area of part A is larger than the area of part B, and the air discharge hole may be formed in part A at the boundary between parts A and B. Accordingly, a decrease in cooling efficiency of the first electronic device group disposed in the portion B may be minimized.

Also, in the electric range according to an embodiment of the present invention, among the plurality of outer electronic elements included in the second electronic element group, a first outer electronic element having a height greater than a lower end of the air discharge hole may be disposed. Accordingly, the air discharged from the air discharge hole hits the first outer electronic device and flows to the rear outside of the air guide, thereby cooling the control board disposed on the rear side of the air guide.

In addition, in the electric range according to an embodiment of the present invention, the lower end of the air discharge hole may be formed to be spaced apart from the printed circuit board by a preset distance. In this case, the height of the lower end of the air discharge hole may be greater than the height of the lower surface of the heat sink disposed inside the air guide. Accordingly, some of the air flowing over the heat sink is discharged through the air discharge hole. Accordingly, a flow rate of air discharged through the air discharge hole may increase, and cooling efficiency of the second electronic device group may increase.

In addition, in the electric range according to an embodiment of the present invention, an air outlet may be formed in the air guide adjacent to the blowing fan. Accordingly, the flow rate of air supplied to the second electronic device group may further increase, and the cooling efficiency of the second electronic device group may be increased.

In addition, an electric range according to an embodiment of the present invention includes a case to which a cover plate is coupled to an upper end, a heating unit disposed under the cover plate, an upper bracket disposed under the heating unit, and the upper bracket A base bracket disposed below the base bracket on which a printed circuit board having a plurality of electronic devices including first and second electronic device groups is installed, a heat sink mounted on the printed circuit board, and installed on the base bracket. , a blowing fan for discharging air toward the heat sink, mounted on the printed circuit board to surround the first electronic device group and the heat sink, communicating with the blowing fan, and discharging air from the blowing fan. An air guide forming a flow path may be included. In this case, the air guide may have an air discharge hole through which some of the air flowing toward the first side of the heat sink is provided to the second electronic device group disposed outside the air guide.

In addition, an electric range according to another embodiment of the present invention includes a case in which a cover plate is coupled to an upper end, a heating unit disposed under the cover plate, an upper bracket disposed under the heating unit, and a lower portion of the upper bracket and a base bracket on which a printed circuit board having a plurality of electronic devices including first and second electronic device groups is mounted, a heat sink mounted on the printed circuit board, and installed on the base bracket, the heat sink a blowing fan for discharging air toward the blower, mounted on the printed circuit board so as to surround the first electronic element group and the heat sink, communicates with the blower fan, and forms an internal flow path for the air discharged from the blower fan. An air guide to do; may include. In this case, first and second air outlets may be formed in the air guide to provide some of the air discharged from the blowing fan to the second electronic device group, and the first air outlet may be formed in the second electronic device group. It may be formed closer to the blowing fan than the air outlet, and the air discharged from the first air outlet and the air discharged from the second air outlet may flow along different external air flow paths.

According to the present invention, by forming the air discharge hole on the outer wall of the first side of the air guide, both the first and second electronic device groups disposed inside and outside of the air guide can be cooled. Thus, overheating of the printed circuit board on which the first and second electronic element groups are mounted can be effectively suppressed.

In addition, according to the present invention, since the air discharge hole is formed on the front side of the second inner electronic element having a large amount of heat, the cooling efficiency of the second electronic element group can be increased, and the cooling efficiency of the first electronic element group is also reduced. I never do that. Thus, the entire printed circuit board can be efficiently cooled.

In addition, according to the present invention, by forming an air discharge hole at the boundary between parts A and B of the air guide, it is possible to minimize a decrease in cooling efficiency of the first electronic device disposed in part B, and consequently, the first and second air guides. All groups of electronic elements can be effectively cooled.

In addition, according to the present invention, by further providing the air discharged from the air discharge hole to the control board disposed on the rear side of the air guide, the control board together with the printed circuit board can be further cooled, and eventually damage to the control board is prevented. It can be.

In addition, according to the present invention, by forming the lower end of the air discharge hole to be spaced apart from the printed circuit board by a predetermined distance, interference with other components mounted on the printed circuit board is prevented, the efficiency of assembly is increased, and the air guide strength may not be compromised. In addition, the flow rate of air discharged through the air discharge hole may increase.

In addition, according to the present invention, by forming an air outlet adjacent to the blowing fan in the air guide, the flow rate of air supplied to the second electronic device group is further increased, so that the cooling efficiency of the second electronic device group can be further increased. .

In addition to the effects described above, specific effects of the present invention will be described together while explaining specific details for carrying out the present invention.

1 is a perspective view of an electric range according to an embodiment.
FIG. 2 is a perspective view in which the cover plate is omitted in FIG. 1 .
Figure 3 is an exploded view of Figure 1;
FIG. 4 is a perspective view of FIG. 1 in which a cover plate, a heating unit, and an upper bracket are omitted.
FIG. 5 is a plan view of FIG. 4 .
6 is a perspective view showing a state in which a printed circuit board is mounted on a base bracket according to an embodiment.
FIG. 7 is a plan view of FIG. 6 .
8 is a perspective view of a heat sink according to an embodiment.
Figure 9 is a front view of Figure 8;
10 is a perspective view of a base bracket according to an embodiment.
Fig. 11 is a plan view of Fig. 10;
12 is a perspective view of a case according to one embodiment.
Fig. 13 is a plan view of Fig. 12;
14 is a perspective view showing an air guide according to the first embodiment.
15 is a perspective view of FIG. 14 viewed from another direction.
Fig. 16 is a plan view of Fig. 14;
17 is a perspective view showing an air guide according to a second embodiment.
18 is a perspective view of FIG. 17 viewed from another direction.
Fig. 19 is a plan view of Fig. 17;
20 is a perspective view of FIG. 17 viewed from another direction.
21 is a plan view illustrating the installation structure of the air guide according to the second embodiment.
Fig. 22 is a cross-sectional view of a portion of Fig. 21;
23 is a plan view illustrating a flow path of air inside and outside of an air guide according to an embodiment of the present invention.
Fig. 24 is a cross-sectional view of a portion of Fig. 23;

The above objects, features and effects will be described in detail later with reference to the accompanying drawings. In describing the present invention, if it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

Although first, second, etc. are used to describe various elements, these terms are only used to distinguish one element from another. Throughout this specification, unless otherwise stated, each element may be singular or plural. Throughout this specification, terms such as "comprising" or "comprising" are not necessarily interpreted as including all of the various components or steps described in the specification, and may further include additional components or steps. interpreted as having

Throughout the specification, "up and down direction" means the up and down direction of the electric range in a state where the electric range is installed to be used daily. "Left-right direction" means a direction orthogonal to the up-and-down direction, and the front-back direction means a direction orthogonal to both the up-down direction and the left-right direction. “Both directions” or “lateral directions” have the same meaning as left-right directions, and these terms may be used interchangeably herein.

1 is a perspective view of an electric range according to an embodiment. FIG. 2 is a perspective view in which the cover plate 20 is omitted in FIG. 1 . 3 is an exploded view of an electric range according to one embodiment. FIG. 4 is a perspective view in which the cover plate 20, the heating unit 30 and the upper bracket 40 are omitted in FIG. 1 . FIG. 5 is a plan view of FIG. 4 .

An electric range according to an embodiment may heat an object to be heated by an induction heating method. At this time, the object to be heated may be, for example, tableware containing a metal material such as stainless steel or iron.

The induction heating method is a method of applying high-frequency power to a working coil to generate a magnetic field around the working coil and heating an object to be heated made of a metal component using an eddy current generated by the generated magnetic field.

That is, when the working coil applies high-frequency power to the heating unit 30 having a structure adjacent to the ferrite core to generate a magnetic field around the working coil, and the heating object is placed within the region of the generated magnetic field, An eddy current is induced by a magnetic field in the object to be heated, and Joule's heat is generated by the eddy current, so that the object to be heated may be heated. By heating the tableware, which is the object to be heated, food contained in the object to be heated can be heated and cooked.

The electric range according to the embodiment may include a case 10 , a cover plate 20 , a heating unit 30 , an upper bracket 40 and a base bracket 50 .

The case 10 may function to protect components constituting the electric range. For example, the case 10 may be made of aluminum, but is not limited thereto.

Meanwhile, the case 10 may be insulated to suppress heat generated by the working coil of the heating unit 30 from being emitted to the outside.

Parts constituting an electric range such as the heating unit 30, the working coil, the upper bracket 40, and the control board 90 may be accommodated in the case 10. An upper portion of the case 10 may be opened. The cover plate 20 may close the open top of the case 10 . The case 10 may be made into a box shape by processing a plate-like material as a whole.

The case 10 may include a first casing 110 , a second casing 120 and a third casing 130 .

The first casing 110 may form the bottom surface of the case 10 . The first casing 110 may support the above-described internal parts of the electric range.

A printed circuit board 51 may be provided inside the first casing 110 . In addition, at least one ventilation hole through which air flows may be provided in the first casing 110 to smoothly cool the plurality of electronic devices mounted on the printed circuit board 51 .

The second casing 120 is formed to be bent from the first casing 110 and may form a side surface of the case 10 . The second casing 120 may be bent up and down at the edge of the first casing 110 to become a side wall of the electric range.

The second casing 120 may be disposed on each side of the first casing 110 formed in a substantially rectangular shape. The second casing 120 may reinforce the rigidity of the entire casing 10 .

That is, in order to prevent the plate-shaped first casing 110 from being bent or damaged by the weight of internal components or external force, the second casing 120 may be formed to be bent from the first casing 110 .

The second casing 120 may further include a plurality of exhaust holes 121 formed in a slit shape. The exhaust hole 121 serves to communicate the inside and outside of the case 10 with each other. By allowing air to flow through the exhaust hole 121 , parts accommodated inside the case 10 can be cooled. The third casing 130 is formed to be bent from the second casing 120 and may support the upper bracket 40 . The third casing 130 may be disposed on each side of the first casing 110 .

The first upper plate 410 forming the bottom surface of the upper bracket 40 is seated on the upper surface of the third casing 130, and the first upper plate 410 and the third casing 130 are coupled with bolts or the like. They can be coupled to each other by means of a mechanism.

The cover plate 20 may be coupled to an upper end of the case 10 . The cover plate 20 may close the open top of the case 10 to protect components accommodated in the case 10 .

An object to be heated is placed on the upper surface of the cover plate 20 , and a magnetic field generated by the heating unit 30 may pass through the cover plate 20 and reach the object to be heated. The cover plate 20 may be made of a material including, for example, ceramic, but is not limited thereto.

An input interface for receiving an input from a user may be installed on an upper surface of the cover plate 20 . The input interface is installed in a specific area on the upper surface of the cover plate 20 and can display a specific image.

The input interface may receive a touch input from a user, and the electric range may be driven based on the received touch input.

For example, the input interface is a module for inputting a heating intensity or a heating time desired by a user, and may be implemented as a physical button or a touch panel.

As an example, the input interface may be a TFT LCD (Thin Film Transistor Liquid Crystal Display), but is not limited thereto.

A control board 90 for inputting an operation command to the electric range may be provided under the cover plate 20 . The control board 90 may include a plurality of key switches. The user may control the operation of the electric range by inputting a command to the control board 90 through a plurality of key switches.

In the electric range according to the embodiment, a board supporter 91 may be provided to stably mount the control board 90 to the case 10 . The board supporter 91 may be mounted inside the case 10 . A control board 90 may be mounted on top of the board supporter 91 .

In order to stably mount the board supporter 91 and the control board 90, the board supporter 91 may be manufactured to have a necessary shape. The board supporter 91 may be formed of an electrically insulating plastic material that is easy to manufacture, light in weight, and electrically insulating so as to have electrical insulating properties, but the material is not limited thereto.

In the electric range according to the embodiment, the upper surface of the control board 90 may be provided to closely adhere to the lower surface of the cover plate 20 . At this time, the control board 90 may be disposed at a position corresponding to the input interface.

At this time, the control board 90 and the input interface may be connected to each other using a capacitive touch input method. Accordingly, when a user inputs a control command to the input interface, the control command may be input to the control board 90 .

In addition, a display displaying a driving state of the electric range may be provided in a specific region of the upper surface of the cover plate 20 .

A light display area may be formed on the upper surface of the cover plate 20 . A light source unit 95 may be disposed under the cover plate 20 , and light emitted from the light source unit 95 may be transmitted to the user through the light display area.

At this time, the light display area and the light source unit 95 may be disposed at positions corresponding to each other. When a plurality of light source units 95 are provided, the same number of light display areas may be provided on the upper surface of the cover plate 20 .

The electric range according to the embodiment may further include a cover bracket for supporting the cover plate 20 . The cover bracket supports the cover plate 20 on its upper surface and can be coupled to the second casing 120 of the case 10 by a coupling mechanism such as screw bolts.

The heating unit 30 is provided in plurality, is disposed under the cover plate 20, and can heat an object to be heated.

In one embodiment, the plurality of heating units 30 may be provided in an induction heating method.

In another embodiment, some of the plurality of heating units 30 may be provided in an induction heating method, and others may be provided in an electrical resistance heating method. That is, the electric range may be a highlight heating device or a hybrid range.

Hereinafter, an electric range in which all of the plurality of heating units 30 are provided in an induction heating method will be described.

The heating unit 30 may be mounted on the upper bracket 40, and in this embodiment, a total of three heating units 30 may be provided. Of course, the number of heating units 30 is not limited thereto. When a plurality of heating units 30 are provided, a plurality of upper brackets 40 supporting the heating units 30 may also be provided as needed.

The heating unit 30 may include a core frame, a working coil may be helically wound on an upper surface of the core frame, and a ferrite core may be mounted on a lower surface of the core frame. Therefore, when high-frequency power is applied to the working coil, a magnetic field is formed around the ferrite core, and the formed magnetic field can form eddy currents in the object to be heated.

The upper bracket 40 may be disposed below the heating unit 30 to support the heating unit 30 . In this embodiment, the upper bracket 40 may be provided in plurality. The upper bracket 40 may be made of, for example, aluminum, but is not limited thereto.

The upper bracket 40 may be fabricated into a structure that supports the heating unit 30 by processing a plate-shaped metal to have a substantially box-shaped shape.

The upper bracket 40 may include a first top plate 410 and a second top plate 420 . The first upper plate 410 forms the bottom surface of the upper bracket 40, and the heating unit 30 may be mounted thereto.

The first upper plate 410 may be provided to cover the lower printed circuit board 51 in the vertical direction. When there are a plurality of upper brackets 40, according to the area of the printed circuit board 51, one first top plate 410 or a plurality of first top plates 410 are coupled to each other to form a printed circuit board 51 ) can be covered.

Due to this structure, the first upper plate 410 serves to shield the electromagnetic field and electromagnetic waves generated from the heating unit 30 from reaching the printed circuit board 51 and the elements mounted on the printed circuit board 51. can do.

That is, the upper bracket 40 may serve to improve EMC (Electromagnetic Compatibility) and EMI (Electromagnetic Interference) with respect to the printed circuit board 51 .

The second upper plate 420 may be bent from the first upper plate 410 in the vertical direction of the electric range. The second upper plate 420 may be formed to be bent in the vertical direction at the edge of the first upper plate 410 .

A second top plate 420 may be disposed on each side of the first top plate 410 formed in a substantially quadrangular shape. When a plurality of upper brackets 40 are provided, second upper plates 420 may be formed on each side of the first upper plate 410 except for adjacent sides of each upper bracket 40 .

The second upper plate 420 may reinforce the rigidity of the entire upper bracket 40 . That is, in order to prevent the plate-like first upper plate 410 from being bent or damaged by the weight or external force of the internal component including the heating unit 30, the second upper plate 420 is the first upper plate ( 410) may be formed to be bent.

A light source unit 95 may be disposed on the upper bracket 40 . For example, the light source unit 95 is provided on the printed circuit board 51 disposed below the upper bracket 40, and an opening disposed at a position corresponding to the light source unit 95 is formed in the upper bracket 40. It can be.

In another embodiment, the light source unit 95 is disposed on the upper bracket 40, and the light source unit 95 may be electrically connected to the lower printed circuit board 51. 2 and 3 show a structure in which the light source unit 95 is disposed on the upper bracket 40 as an embodiment of the electric range.

As described above, a light display area may be formed in a portion corresponding to the light source unit 95 in the cover plate 20 . The light source unit 95 may be provided in a form in which, for example, a plurality of LEDs are arranged in a line.

The light source unit 95 is turned on when the heating unit 30 is operating, and can inform the user whether the heating unit 30 is operating. Alternatively, the light source unit 95 may inform the user of the operating state of the electric range by changing the lighting shape and color of the plurality of LEDs.

The number of light source units 95 may be appropriately selected according to the number of heating units 30 . In FIGS. 2 and 3 , three light source units 95 are provided for the three heating units 30 . However, the number of light source units 95 is not limited thereto.

The base bracket 50 is disposed under the upper bracket 40, and the printed circuit board 51 may be mounted thereto. The base bracket 50 may include a bottom plate and a side plate.

The bottom plate forms the bottom surface of the base bracket 50, and the printed circuit board 51 may be mounted on the upper surface.

The side plate may be provided to be bent from the bottom plate in the vertical direction of the electric range. The side plate may be formed to be bent in the vertical direction at the edge of the bottom plate.

Side plates may be disposed on each side of the bottom plate formed in a substantially rectangular shape. When a plurality of upper brackets 40 are provided, side plates may be formed on each side of the bottom plate except for sides adjacent to each other of each upper bracket 40 .

The side plate may reinforce the rigidity of the entire base bracket 50. That is, in order to prevent the plate-shaped bottom plate from being bent or damaged by the weight or external force of an internal component such as a circuit board, the side plate may be formed to be bent from the bottom plate.

The base bracket 50 may be formed of an electrically insulating plastic material that is easy to manufacture, light in weight, and electrically insulating to have electrical insulating properties, but the material is not limited thereto.

The printed circuit board 51 may constitute a control unit, receive power from an external power source, and may be provided to communicate with an external device by wire or wirelessly.

A wireless communication circuit board (WiFi PCB) may be mounted on the electric range for wireless communication with an external device, and the printed circuit board 51 may be electrically connected to the wireless communication circuit board.

The printed circuit board 51 may be electrically connected to the control board 90 to receive commands input by a user from the control board 90 . The printed circuit board 51 is electrically connected to the light source unit 95 and the working coil to control their operation.

A heat sink 60 may be mounted on the printed circuit board 51, and a plurality of electronic devices for operating the electric range may be mounted. Accordingly, a driving circuit unit for driving the heating unit 30 may be formed on the printed circuit board 51 .

A plurality of electronic elements may generate heat during operation of the electric range. For example, the driving circuit unit includes a plurality of electronic devices such as a rectifier, a DC link capacitor, an inverter, a resonant capacitor, a burner capacitor, and a shunt resistor, and the plurality of electronic devices may dissipate heat during operation. When the temperature of a plurality of electronic elements is high, the operation of the electric range may be stopped or a failure may occur.

Therefore, in order to cool a plurality of electronic devices, the electric range may include a heat sink 60, a blowing fan 70 and an air guide 80.

The heat sink 60 may protect some electronic devices accommodated in the case 10 by cooling heat inside the case 10 . The heat sink 60 may be mounted on the printed circuit board 51 . The heat sink 60 may have a trapezoidal shape as a whole. The heat sink 60 may cool heat generated due to electromagnetic interaction when the heating unit 30 operates.

The blowing fan 70 may be mounted on the base bracket 50 and may be provided to discharge air toward the heat sink 60 . The blowing fan 70 is electrically connected to the printed circuit board 51, and its operation can be controlled by a control unit implemented on the printed circuit board 51.

The air guide 80 may communicate with the blowing fan 70 and receive air discharged from the blowing fan 70 . The air guide 80 may be provided to surround the heat sink 60 and may be provided to further surround the first electronic device groups 54 and 55 (see FIG. 6 and the like) among a plurality of electronic devices. Inside the air guide 80, an air flow path for cooling the heat sink 60 and the first electronic device groups 54 and 55 may be formed. Accordingly, the air discharged from the blowing fan 70 may flow along the inner flow path to cool the heat sink 60 and the first electronic device groups 54 and 55 .

Referring to FIG. 5 , in order for the air forcedly flowed by the blowing fan 70 to flow to the heat sink 60, the outlet of the blowing fan 70 from which air is discharged is directed in the direction in which the heat sink 60 is disposed. A guide wall for guiding the flow of air may be formed.

The detailed structure and function of the air guide 80 will be described in more detail below.

6 is a perspective view showing a state in which the printed circuit board 51 is mounted on the base bracket 50 according to an embodiment. FIG. 7 is a plan view of FIG. 6 .

Referring to FIGS. 6 and 7 , a heat sink 60 and a plurality of electronic devices may be mounted on the printed circuit board 51 . Also, a blowing fan 70 may be mounted on the base bracket 50 .

The heat sink 60 may be disposed substantially at the center of the printed circuit board 51 . The blowing fan 70 may be mounted on the base bracket 50 while being spaced apart from the rear side of the heat sink 60 . A longitudinal direction (ie, a front-back direction) of the heat sink 60 may be parallel to a flow direction of air passing through the air guide 80 . Accordingly, the contact area and contact time between the heat sink 60 and the forcibly flowing air may increase, and the cooling efficiency of the heat sink 60 may increase.

A plurality of electronic devices may be installed on the printed circuit board 51 . A plurality of electronic devices may constitute a driving circuit unit that controls driving of the heating unit 30 .

The driving circuit includes a rectifier, DC link capacitors 54a and 56a, an inverter, snubber capacitors 54b and 56b, a switching mode power supply (SMPS) 56c, an overcurrent protection circuit, a resonance capacitor, and a first terminal ( 57) may be included.

The rectifier may include rectifying elements 55a and 55c disposed on both sides of the heat sink 60 . The rectifiers 55a and 55c may convert AC power supplied from an external power source into DC power. As an example, the rectifying elements 55a and 55c may include bridge diodes.

The DC link capacitors 54a and 56a may receive DC power from the rectifiers 55a and 55c and reduce ripple of the received DC power. For example, DC link capacitors 54a and 56a may be smoothing capacitors.

The DC voltage rectified by the rectifiers 55a and 55c and reduced in ripple by the DC link capacitors 54a and 56a may be supplied to the inverter.

The inverter may include a plurality of inverter switching elements 55b and 55d disposed on both sides of the heat sink 60 . The inverter switching elements 55b and 55d are alternately turned on or off by a switching signal to convert DC power into high-frequency AC current (ie, resonance current). The converted high-frequency alternating current may be provided to the working coil through the first terminal 57 .

As an example, the inverter switching elements 55b and 55d may include an Insulated Gate Bipolar Transistor (IGBT).

A plurality of snubber capacitors 54b and 56b may be connected to the inverter. That is, each of the plurality of snubber capacitors 54b and 56b may be connected to a corresponding inverter switching element 55b and 55d. A plurality of snubber capacitors 54b may be disposed on both sides of the heat sink 60 . The snubber capacitors 54b and 56b are provided to reduce power loss (that is, power loss due to hard switching) occurring when the inverter switching elements 55b and 55d are turned off, and can also remove electromagnetic noise. there is.

An overcurrent protection circuit may be provided to suppress overcurrent from flowing through the inverter switching elements 55b and 55d. To this end, the overcurrent protection circuit may include a shunt resistor 54c.

A plurality of resonance capacitors may be connected in parallel to each of the plurality of inverter switching elements 55b and 55d. When a voltage is applied by the switching operation of the inverter, the resonant capacitor may start to resonate. Accordingly, the current flowing through the working coil increases, and eddy current is induced. Accordingly, the heating unit 30 may be driven.

Referring to FIGS. 5 to 7 , a heat sink 60 and first electronic device groups 54 and 55 may be disposed inside the air guide 80 . The first electronic device groups 54 and 55 may be defined as inner electronic device groups disposed inside the air guide 80 . The first electronic device groups 54 and 55 may be disposed on the left side (first side) and the right side (second side) of the heat sink 60 .

The first electronic device groups 54 and 55 may include a 1-1 electronic device group 55 and a 1-2 electronic device group 54 .

The 1-1 electronic device group 55 may be disposed adjacent to the heat sink 60 . The 1-2 electronic device group 54 may be disposed farther from the heat sink 60 than the 1-1 electronic device group 55 .

The 1-1 electronic element group 55 includes a plurality of left electronic elements 55c and 55d disposed on the left side of the heat sink 60 and a plurality of right electronic elements disposed on the right side of the heat sink 60 ( 55a, 55b) may be included.

A plurality of left electronic elements 55c and 55d may be provided between the left side of the heat sink 60 and the left side (first side) of the air guide 80. The plurality of left electronic devices 55c and 55d may include at least one first inner electronic device 55c and at least one second inner electronic device 55d. The plurality of left electronic elements 55c and 55d may be sequentially arranged along the air flow path inside the air guide 80 .

At least one first inner electronic device 55c may correspond to the rectifying device 55c disposed on the left side of the heat sink 60 . In the drawings, it has been described that one rectifying element 55c is provided, but two or more rectifying elements 55c may be provided. At least one second inner electronic device may correspond to the inverter switching device 55d disposed on the left side of the heat sink 60 . In the drawing, it has been described that four inverter switching elements 55d are provided, but the inverter switching element 55d may be one.

A plurality of right electronic elements 55a and 55b may be provided between the right side of the heat sink 60 and the right side (second side) of the air guide 80 . The plurality of right electronic devices 55a and 55b may include at least one third inner electronic device 55a and at least one fourth inner electronic device 55b. The plurality of right electronic elements 55a and 55b may be sequentially arranged along the air flow path inside the air guide 80 .

At least one third inner electronic device 55a may correspond to the rectifying device 55a disposed on the right side of the heat sink 60 . In the drawings, it has been described that one rectifying element 55a is provided, but two or more rectifying elements 55a may be provided. At least one fourth inner electronic device may correspond to the inverter switching device 55b disposed on the right side of the heat sink 60 . In the drawing, it has been described that four inverter switching elements 55b are provided, but the inverter switching element 55b may be one.

Meanwhile, the rectifying elements 55a and 55c and the inverter switching elements 55b and 55d may be attached to the left and right sides of the heat sink 60 (FIGS. 8 and 9), or may not be attached to the heat sink 60. (Fig. 6). Cooling efficiency can be increased when the rectifying elements 55a and 55c and the inverter switching elements 55b and 55d are attached to the heat sink 60 .

The 1-2 electronic device group 54 may be disposed on the right side of the heat sink 60 and may include a DC link capacitor 54a, a snubber capacitor 54b, and a shunt resistor 54c.

The DC link capacitor 54a may be disposed on the right side of the heat sink 60 adjacent to the rear side (third side) of the heat sink. The burner capacitor 54b may be disposed on the right side of the heat sink 60 closer to the front side (fourth side) of the heat sink 60 than where the DC link capacitor 54a is disposed. A shunt resistor 54c may be disposed between the DC link capacitor 54a and the burner capacitor 54b.

8 is a perspective view of a heat sink 60 according to one embodiment. 9 is a front view of the heat sink 60 according to one embodiment.

The heat sink 60 may be disposed in a direction parallel to a flow direction of air passing through the air guide 80 in a longitudinal direction. Due to this structure, it is possible to increase the cooling efficiency of the heat sink 60 by increasing the contact area and contact time between the heat sink 60 and the forcibly flowing air.

Meanwhile, to correspond to the above-described arrangement structure of the heat sink 60, the air guide 80 may also be arranged so that its longitudinal direction is substantially parallel to the air flow direction.

Referring to FIGS. 8 and 9 , the heat sink 60 may include a plurality of cooling fins 610 . The plurality of cooling fins 610 are formed to protrude downward from the lower surface of the heat sink 60 and may be formed parallel to the longitudinal direction of the heat sink 60 . The cooling fins 610 can increase the contact area between the heat sink 60 and air, thereby improving the cooling efficiency of the heat sink 60 .

Each of the plurality of cooling fins 610 may be formed on the lower surface of the heat sink 60 and spaced apart from each other at an appropriate distance in the width direction of the heat sink 60 . In this case, the cooling fins 610 may be formed on the inclined portion 630 and the flat portion 640 of the heat sink 60 , respectively.

In addition, the heat sink 60 may include a flow path 620 formed to penetrate the heat sink 60 in the longitudinal direction to form a flow path of air. The flow path 620 may be formed in the longitudinal direction of the heat sink 60 and pass through the flat portion 640 of the heat sink 60 .

Like the cooling fins 610, the flow path 620 can improve the cooling efficiency of the heat sink 60 by increasing the contact area with air in the heat sink 60. At this time, an uneven portion may be formed on an inner surface of the flow path 620 . The concavo-convex portion increases the contact area between air and the heat sink 60, thereby improving the cooling efficiency of the heat sink 60.

The heat sink 60 may include an inclined portion 630 disposed on both sides and having a slope formed on the upper surface, and a flat portion 640 formed in the center, having a flow path 620 formed, and having a flat upper surface. can

A concave-convex portion may be formed on an upper surface of the flat portion 640 . The concavo-convex portion increases the contact area between air and the heat sink 60, thereby improving the cooling efficiency of the heat sink 60.

Rectifier devices 55a and 55c and inverter switching devices 55b and 55d may be mounted on the pair of inclined portions 630 . Accordingly, the air forcedly flowing by the blowing fan 70 may cool the rectifying elements 55a and 55c and the inverter switching elements 55b and 55d mounted on the inclined portion 630 of the heat sink 60 . Thus, overheating of the rectifying elements 55a and 55c and the inverter switching elements 55b and 55d can be effectively suppressed.

The inclined portion 630 may have a structure in which the thickness decreases toward the edge. Therefore, this structure of the inclined portion 630 can effectively cool the electronic device 55 mounted on the inclined portion 630 by playing a role similar to that of the cooling fin 610 .

10 is a perspective view of the base bracket 50 according to one embodiment. 11 is a plan view of the base bracket 50 according to one embodiment.

The base bracket 50 may include a first vent 510 formed at a portion corresponding to the blowing fan 70 and a second vent 520 formed at a portion corresponding to the outlet of the air guide 80. can At this time, the first ventilation unit 510 may have a shape corresponding to the shape of the blowing fan 70, and the second ventilation unit 520 may have a shape corresponding to the shape of the outlet of the air guide 80. .

When the blowing fan 70 operates, air rises from the first ventilation unit 510 and is introduced into the blowing fan 70, and the flow direction is changed in the blowing fan 70 to flow in the front and rear directions of the electric range, so that the air It may pass through the inside of the guide 80.

The flow direction of the air is changed again at the outlet of the air guide 80 so as to flow downward of the electric range, pass through the second vent 520, and be discharged to the outside of the air guide 80.

Meanwhile, rectifying elements 55a and 55c and inverter switching elements 55b and 55d may be disposed on each of the pair of inclined portions 630 of the heat sink 60 . Therefore, in order to uniformly cool the rectifying elements 55a and 55c and the inverter switching elements 55b and 55d disposed on both sides of the heat sink 60, the air discharged from the outlet of the blowing fan 70 is transferred to the heat sink ( 60), it is necessary to guide the flow of air to flow uniformly to both sides.

Therefore, in order to uniformly flow air to both sides of the heat sink 60, the electric range according to the embodiment may be provided with vanes 53.

Referring to FIGS. 7, 10 and 11, the vane 53 is disposed at a portion where the blowing fan 70 and the air guide 80 communicate, and controls the flow direction of the air in the air guide 80. Air may flow uniformly on both sides of the heat sink 60 .

For example, the vane 53 may be formed on the base bracket 50 . In another embodiment, the vane portion 53 may be integrally formed with the air guide 80 at the inlet of the air guide 80 . In another embodiment, the vane 53 may be integrally formed with the housing of the blowing fan 70 at the outlet of the blowing fan 70 .

12 is a perspective view of case 10 according to one embodiment. 13 is a plan view of case 10 according to one embodiment.

Referring to FIGS. 12 and 13 , the case 10 may be provided with first and second through-holes 140 and 150 to effectively introduce and discharge air forcedly flowing by the blowing fan 70 .

The first through-hole 140 may be formed at a portion corresponding to the first ventilation portion 510 , and the second through-hole 150 may be formed at a portion corresponding to the second ventilation portion 520 . The first and second through-holes 140 and 150 may be formed by piercing the first casing 110 forming the bottom surface of the case 10 .

The first and second through-holes 140 and 150 may be provided in plurality. Since the case 10 is the outermost wall of the electric range, the first and second through-holes 140 , 150) is formed as a hole with a relatively small area, but it is appropriate to have a plurality of them.

Hereinafter, the structure of the air guide 80 will be described in detail.

14 is a perspective view showing the air guide 80 according to the first embodiment. 15 is a perspective view of FIG. 14 viewed from another direction. Fig. 16 is a plan view of Fig. 14;

17 is a perspective view showing an air guide 80 according to a second embodiment. 18 is a perspective view of FIG. 17 viewed from another direction. Fig. 19 is a plan view of Fig. 17;

Meanwhile, except for the shape of the air discharge hole 870, the air guide 80 according to the first embodiment of the present invention and the air guide 80 according to the second embodiment of the present invention have the same shape.

Referring to FIGS. 14 to 20 , the air guide 80 may be provided to communicate with the blowing fan 70 .

The air guide 80 may be provided to surround the heat sink 60 and the first electronic device groups 54 and 55 . An air flow path for cooling the heat sink 60 and the first electronic device groups 54 and 55 may be formed inside the air guide 80 .

The air guide 80 may be formed of an electrically insulating plastic material that is easy to injection process, but the material is not limited thereto.

Arrows shown in FIGS. 14 and 17 indicate the flow direction of air outside the air guide 80 . 14 and 17, the air guide 80 can change the flow direction of air.

An inlet of the air guide 80 may communicate with the blowing fan 70 . Air introduced into the inlet of the air guide 80 may flow toward the outlet of the air guide 80 . At the outlet of the air guide 80, air may flow in the vertical direction of the electric range.

Due to this structure, the air discharged from the blowing fan 70 can flow in the front and rear directions of the electric range at the inlet of the air guide 80, and the air flows downward of the electric range at the outlet of the air guide 80. may spill out.

Meanwhile, based on the inlet of the air guide 80, the front and rear sides of the air guide 80 may be defined. That is, the front side of the air guide 80 is close to the inlet of the air guide 80, and the rear side of the air guide 80 is close to the outlet of the air guide 80.

The air guide 80 may be detachably coupled to the base bracket 50. For example, an inlet of the air guide 80 into which air discharged from the blowing fan 70 is introduced may be coupled to the base bracket 50 by a coupling mechanism such as a screw bolt. And, the outlet of the air guide 80 through which air is discharged can be coupled to the base bracket 50 in a shape-fitting manner.

The air guide 80 may be composed of a pair of side walls 810 and an upper wall 820 . A flow space in which air flows may be formed inside the air guide 80 by the pair of side walls 810 and the upper wall 820 . That is, the flow space of the air guide 80 may be defined by a pair of side walls 810 and an upper wall 820 .

The sidewalls 810 may be respectively disposed on left and right sides of the heat sink 60 . The upper wall 820 may be provided to cover the heat sink 60 and the first electronic device group 54 by being coupled to the top of the pair of side walls 810, and at the inlet and outlet of the air guide 80. can be bent

The heat sink 60 and the first electronic element groups 54 and 55 may be disposed in the flow space of the air guide 80 and cooled by air flowing through the flow space.

The air guide 80 may include a communication board mounting portion 830 . The communication board mounting portion 830 may be disposed at a portion protruding laterally from the end of the upper bracket 40 while the air guide 80 is mounted on the electric range.

The wireless communication circuit board mounted on the communication board mounting part 830 may be arranged so as not to overlap with the upper bracket 40 made of metal in the vertical direction. Therefore, the wireless communication circuit board can communicate smoothly with external devices without being interfered with by the metal upper bracket 40 .

Referring to FIGS. 14, 16, 17 and 18, the air guide 80 may be divided into first and second parts 801 and 802. The first and second parts 801 and 802 of the air guide 80 may be divided by a first virtual plane 81. The first and second parts 801 and 802 of the air guide 80 may be divided into air flow spaces formed in the air guide 80 . Accordingly, the first and second parts 801 and 802 of the air guide 80 may communicate with each other.

The first part 801 of the air guide 80 may be the main part of the air guide 80 . The first part 801 of the air guide 80 may communicate with the blowing fan 70 . The blowing fan 70 may discharge air toward the rear side (ie, the first side) of the heat sink 60 . A first internal flow path among internal air flow paths may be formed in the first part 801 of the air guide 80 .

The second part 802 of the air guide 80 may be a sub part of the air guide 80 . The second part 802 of the air guide 80 may protrude from the right side of the first part 801 of the air guide 80. A second internal flow path among internal air flow paths may be formed in the second part 802 of the air guide 80 .

Meanwhile, based on the vane 53 and the inclined surface 63 on the right side of the heat sink 60, the internal air flow path may be divided into first and second internal flow paths. Also, considering the location and shape of the vane 53, the amount of air flowing through the first internal flow path may be greater than the amount of air flowing into the second internal flow path.

A communication part 850 and a guide coupling part 860 may be formed in the first part 801 of the air guide 80 .

The communication unit 850 may communicate with the outlet of the blowing fan 70 . Air forcedly flowing by the blowing fan 70 is introduced into the air guide 80 through the outlet of the blowing fan 70 and the communication portion 850 and may flow through an internal flow path.

The guide coupling part 860 may protrude from the inlet of the air guide 80 and couple the inlet of the air guide 80 to the base bracket 50 . The guide coupling part 860 may be mounted on the base bracket 50 by a coupling mechanism such as a screw bolt.

Referring to FIGS. 14 to 20 , a front air outlet 840 may be further provided in the first part 801 of the air guide 80 . The front air outlet 840 may discharge some of the air supplied to the inlet of the air guide 80 to the outside of the air guide 80 .

The front air outlet 840 may include a front right air outlet 841 formed on the right side of the communication unit 850 and a front left air outlet 842 formed on the left side of the communication unit 850 .

The front right air outlet 841 may be disposed at a portion connected to the communication unit 850 . A part of the front left air outlet 842 may be formed to be surrounded by the guide coupling part 860 . The first and second air outlets 841 and 842 may be formed such that air flow directions are opposite to each other, and may be formed at substantially symmetrical positions with respect to the guide coupling part 860 . The front right air outlet 841 may discharge air to the left side of the air guide 80 . The front left air outlet 842 may discharge air to the right side of the air guide 80 .

The first and second electronic device groups 54 among the first electronic device groups 54 and 55 may be disposed in the second part 802 of the air guide 80 . A second internal flow path may be formed in the second part 802 of the air guide 80 . The air flowing through the second internal flow path may cool the first and second electronic device groups 54 .

16 and 19, the first part 801 of the air guide 80 covers the first area 80a, the second area 80b, the third area 80c and the fourth area 80d. The second part 802 of the air guide 80 may include a fifth region 80e, a sixth region 80f, and a seventh region 80g. The fifth to seventh regions 80e, 80f, and 80g may protrude from the right side of the first portion 801 of the air guide 80 adjacent to the communication portion 850 . The first to seventh regions 80a, 80b, 80c, 80d, 80e, 80f, and 80g may be divided into air flow spaces formed in the air guide 80.

Among the internal flow paths of the air guide 80, a first internal flow path may be formed in the first to fourth regions 80a, 80b, 80c, and 80d, and the fifth to seventh regions 80e, 80f, and 80g A second internal flow path among the internal flow paths of the air guide 80 may be formed.

A front air discharge port 840, a communication portion 850, a guide coupling portion 860, and an air discharge hole 870 may be formed in the first region 80a. In addition, a heat sink 60 may be disposed in the first region 80a.

The air introduced into the inlet of the air guide 80 passes through the first area 80a of the air guide 80 and flows through the heat sink 60 to form a heat sink 60 and the 1-1 electronic element group 55 can be cooled.

The second region 80b is bent in the vertical direction of the base bracket 50 and may guide air to be discharged to the outside. The second region 80b is formed to face the lower direction of the electric range, so that the flow direction of the air introduced into the air guide 80 can be changed. That is, the upper wall 820 defining the second region 80b may be bent downward, and air discharged from the second region 80b may be directed to the lower portion of the case 10 .

Due to the structure described above, as shown by the arrows in FIGS. 14 and 17, the air discharged from the blowing fan 70 is introduced into the air guide 80 in the front and rear directions of the electric range, and flows downward of the electric range. It can pass through the air guide 80.

A third area 80c and a fourth area 80d may be provided between the first area 80a and the second area 80b.

The third region 80c extends from the first region 80a and may change a flow direction of air passing through the first region 80a. The sidewall 810 defining the third region 80c may be bent to be inclined at an end of the first region 80a. Due to this structure, in the third region 80c, air may flow in a direction inclined with respect to the front-rear direction of the air guide 80. In addition, when the air guide 80 is mounted on the base bracket 50, the electronic device mounted on the printed circuit board 51 and the sidewall 810 interfere with each other at the portion overlapping the air guide 80 in the vertical direction. can avoid becoming

The fourth region 80d extends from the third region 80c and communicates with the second region 80b, and may change a flow direction of air passing through the third region 80c. The sidewall 810 defining the fourth region 80d may be bent to have an inclination at an end of the third region 80c. Due to this structure, the air flow direction of the air guide 80 in the fourth region 80d can be restored to the forward and backward directions of the air guide 80 .

Air passing through the fourth region 80d may be discharged to the lower portion of the electric range through the second region 80b. 16 and 19, the air flowing through the air guide 80 in the forward and backward directions of the electric range up to the exit of the fourth area 80d is changed in the second area 80b, and the air flow direction is changed to the second area 80b. The air may be discharged from the air guide 80 by flowing in the lower direction of the electric range through the outlet of the region 80b.

The fifth area 80e may be formed adjacent to the blowing fan 70 on the right side of the first area 80a. The sidewall 810e of the fifth region 80e may be formed parallel to the sidewall 810 defining the first region 80a. The upper wall 820e of the fifth region 80e may be formed at the same height as the upper wall 820a of the first region 80a. The upper wall 820e of the fifth region 80e may be bent at the rear side of the fifth region 80e. A DC link capacitor 54a may be disposed in the fifth region 80e.

The sixth area 80f may be formed from the right side of the first area 80a to the front of the fifth area 80e. The sidewall 810f of the sixth region 80f may be formed parallel to the sidewall 810 defining the first region 80a, but inclined from the front side of the sixth region 80f. A snubber capacitor 54b may be disposed in the sixth region 80f.

Referring to FIGS. 14 to 19 , the sixth region 80f may be formed to be stepped from the first region 80a. That is, the upper wall 820a defining the first region 80a and the upper wall 820f defining the sixth region 80f may be connected by the first upper wall connection portion 82, and the sixth region 80a may be connected to the upper wall 820f. An upper wall 820f defining 80f may have a lower height than an upper wall 820a defining first region 80a. Due to this structure, when the air guide 80 is mounted on the base bracket 50, elements connected to the printed circuit board 51 are prevented from interfering with the upper wall 820f defining the sixth region 80f. can be avoided

The sidewall 810f of the sixth region 80f may be bent to be inclined at an end of the sixth region 80f and connected to the sidewall 810 defining the first region 80a.

The seventh area 80g may be formed on the right side of the first area 80a. The seventh region 80g may connect the fifth region 80e and the sixth region 80f. A shunt resistor 54c may be disposed in the seventh region 80g.

14 to 19 , upper walls 820g and 820h of the seventh region 80g may include an upper wall 820g having a first height and an upper wall 820h having a second height. The upper wall 820g of the first height of the seventh region 80g and the upper wall 820h of the second height of the seventh region 80g may be connected by the second upper wall connection part 83 .

The upper wall 820g of the first height of the seventh region 80g may have the same height as the upper wall 820a of the first region 80a and the upper wall 820f of the sixth region 80f. . The upper wall 820h of the second height of the seventh region 80g may have the same height as the upper wall 820f of the sixth region 80f.

The second upper wall connection portion 83 may have an inclined shape based on the sidewall 810 defining the first region 80a. In particular, the second upper wall connecting portion 83 may be inclined in a curved shape. Through this, interference between the air guide 80 and the wires connected to the first terminal 57 can be avoided.

The sidewall 810e of the fifth region 80e and the sidewall 810f of the sixth region 80f may be connected through the sidewall 810g of the seventh region 80g. In this case, the sidewall 810g of the seventh region 80g may be inclined with respect to the sidewall 810 defining the first region 80a.

Meanwhile, the air discharge hole 870 may be an air discharge port different from the front air discharge port 840 . The air discharge hole 870 may be formed in the first part 801 . The air discharge hole 870 may be formed in the first part 801 farther from the blowing fan 70 (ie, the inlet of the air guide 80) than the front air outlet 840. The air discharge hole 870 may discharge some of the air flowing in the first internal flow path of the air guide 80 to the outside of the air guide 80 .

Specifically, the air discharge hole 870 may be formed on an outer wall of the left side of the air guide 80 . The air discharge hole 870 may supply air from the outside of the left side of the air guide 80 to the second electronic device group 56 mounted on the printed circuit board 51 .

Referring to FIGS. 14 to 16 , the air discharge hole 870 may be formed only on the left side wall 810 of the pair of side walls 810 .

Alternatively, referring to FIGS. 17 to 20 , the air discharge hole 870 may be formed across the left sidewall 810 of the pair of sidewalls 810 and the upper wall 820 connected to the left sidewall 810. can Since the air discharge hole 870 is formed over the left side wall 810 and the upper wall 820 , the air discharge hole 870 can be more easily drilled when manufacturing the air guide 80 . Meanwhile, a portion of the air discharge hole 870 formed on the upper wall 820 may have a smaller size than the other portion of the air discharge hole 870 formed on the left side wall 810 .

For convenience of description below, with reference to FIGS. 20 to 22 based on the second embodiment in which the air discharge hole 870 is formed over the left side wall 810 and the upper wall 820, the air discharge hole 870 ) describes in detail the formation position and air flow path.

20 is a perspective view of FIG. 17 viewed from another direction. 21 is a plan view illustrating the installation structure of the air guide according to the second embodiment. FIG. 22 is a cross-sectional view taken along line A-A' shown in FIG. 21;

17 to 22, the first area 80a included in the first part 801 of the air guide 80 may define the entrance of the air guide 80 in which the communication part 850 is formed. . A heat sink 60 may be disposed in the first region 80a. Fifth to seventh areas 80e, 80f, and 80g constituting the second part 801 of the air guide 80 may be formed on the right side of the first area 80a.

A plurality of left electronic elements 55c and 55d may be disposed between the left side of the heat sink 60, that is, between the left inclined surface 630 of the heat sink 60 and the left sidewall 810 of the first region 80a. . A plurality of right electronic elements 55a and 55b may be disposed on the right side of the heat sink 60, that is, between the right inclined surface 630 of the heat sink 60 and the right sidewall 810 of the second portion 802. . The plurality of left electronic devices 55c and 55d and the plurality of right electronic devices 55a and 55b may be attached to the inclined surface 630 of the heat sink 60 . Meanwhile, the plurality of left electronic elements 55c and 55d and the plurality of right electronic elements 55a and 55b may be spaced apart from the inclined surface 630 of the heat sink 60 by a predetermined distance.

The plurality of left electronic elements 55c and 55d and the plurality of right electronic elements 55a and 55b may be sequentially disposed along the first internal air flow path. That is, the rectifying elements 55a and 55c may be disposed closer to the communication unit 850, and the plurality of inverter switching elements 55b and 55d are disposed farther from the communication unit 850 than the rectifying elements 55a and 55c. It can be.

The air discharge hole 870 formed in the first region 80a may have a rectangular shape as a whole. The air discharge hole 870 may include a lower end 871, an upper end 872, and a pair of side ends 873.

The lower end 871 of the air discharge hole 870 may be located on the left sidewall 810 of the air guide 80 . Here, the lower end 871 of the air discharge hole 870 may be spaced apart from the printed circuit board 51 by a predetermined distance d1. That is, the lower end 871 of the air discharge hole 870 may not contact the printed circuit board 51 .

An upper end 872 of the air discharge hole 870 may be located on an upper wall 820 of the air guide 80 . A pair of side ends 873 of the air discharge hole 870 may connect an upper end 872 of the air discharge hole 870 and a lower end 871 of the air discharge hole 870 . The side end 873 of the air discharge hole 870, the first side end 8731 of the straight line located on the left side wall 810 of the air guide 80, and the upper wall 820 of the air guide 80 It may include a second side end 8732 of the curved formation to do.

In the above structure, the air discharge hole 870 may be formed across the left side wall 810 and the upper wall 820 of the first region 80a. In addition, the air discharge hole 870 may be formed at a first point of the first region 80a corresponding to an area between the rectifying element 55c and the plurality of inverter switching elements 55d.

Specifically, the air discharge hole 870 may be formed in front of the plurality of inverter switching elements 55d. That is, the air discharge hole 870 may be disposed closer to the blowing fan 70 (ie, the inlet of the air guide 80) than the plurality of inverter switching elements 55d. In other words, the air discharge hole 870 may be disposed closer to the blowing fan 70 than the first inverter switching element 55d among the plurality of inverter switching elements 55d. Accordingly, the air discharge hole 870 may be formed so as not to overlap with the plurality of inverter switching elements 55d. In addition, the air discharge hole 870 may be formed to overlap with the rectifying element 55c. However, the present invention is not limited thereto, and the air discharge hole 870 may be formed so as not to overlap with the rectifying element 55c.

Meanwhile, referring specifically to FIG. 20 , the air guide 80 may also be divided into a third part 803 and a fourth part 804. The third and fourth parts 803 and 804 of the air guide 80 may be divided by a second imaginary plane 85. The third and fourth parts 803 and 804 of the air guide 80 may be divided into air flow spaces formed in the air guide 80 . Therefore, the third and fourth parts 803 and 804 of the air guide 80 can communicate with each other, and the air inside the air guide 80 flows to the third part 803 and then the fourth part 804 ) can flow. The third portion 803 may be referred to as portion A and the fourth portion 804 may be referred to as portion B. The second virtual plane 85 may correspond to a boundary between the third portion 803 and the fourth portion 804 .

The third part 803 may be a part located close to the communication part 850 . The third portion 803 may include a portion of the aforementioned first area 80a and a fifth area 80e.

The fourth portion 804 may be a portion further away from the communication unit 850 than the third portion 803 . The fourth part 804 may be a part other than the third part 803 . In particular, a region of the fourth portion 804 adjacent to the third portion 803 may include the remaining portion of the first region 80a and the seventh region 80f.

In the above structure, the air discharge hole 870 may be formed in the third portion 803 at the boundary between the third portion 803 and the fourth portion 804 . For example, the rear side end 873 of the air discharge hole 870 may come into contact with the boundary between the third portion 803 and the fourth portion 804 .

Meanwhile, referring specifically to FIGS. 21 and 22, the second electronic element group 56 disposed on the left side of the air guide 80 includes a DC link capacitor 56a, a burner capacitor 56b, and an SMPS 56c. can include In this case, a DC link capacitor 56a, which is a first external electronic device among the second electronic device group 56, may be disposed adjacent to the air discharge hole 870.

Here, the height of the DC link capacitor 56a may be greater than the height d1 of the lower end 871 of the air discharge hole 870 . That is, the height of the second side surface 561a of the DC link capacitor 56a adjacent to the air discharge hole 870 may be greater than the height d1 of the lower end 871 of the air discharge hole 870 .

Also, the heat sink 60 may have a trapezoidal shape as a whole. In this case, the height d2 of the lowermost end of the inclined surface 630 of the heat sink 60 may be greater.

Hereinafter, with reference to FIGS. 23 and 24 , the flow of air discharged from the blowing fan 70 will be summarized.

23 is a plan view illustrating a flow path of air inside and outside of an air guide according to an embodiment of the present invention. FIG. 24 is a cross-sectional view taken along line A-A' shown in FIG. 23;

Referring to FIGS. 23 and 24 , the blowing fan 70 may flow into the air guide 80 through the communication unit 850 . Most of the air introduced into the communication unit 850 may flow into an internal air flow path formed inside the air guide 80 .

Due to the inclined shapes of the vanes 53 and the heat sink 60, the internal air flow path may be divided into first and second internal flow paths. Here, the first internal flow path may be formed in the first part 801 of the air guide 80, and the second internal flow path may be formed in the second part 802 of the air guide 80.

The air flowing through the first internal flow path may flow along the flow path 620 , the inclined portion 630 , and the flat portion 640 of the heat sink 60 . Accordingly, the air flowing through the first internal flow path may cool the heat sink 60 and the 1-1 electronic device group 55 .

The air flowing through the second internal flow path may collide with the first and second electronic device groups 54 . Accordingly, the air flowing through the second internal flow path may cool the 1-1 electronic device group 55 .

Specifically, some of the air introduced into the second internal flow path may collide with the inclined sidewall 810g of the seventh region 80g and diverge in both directions. Part of the branched air may flow into the first and second internal flow paths, and part of the branched air may flow into the fifth region 80e. That is, the other branched air may flow in the opposite direction of the second internal flow path.

The air flowing in the reverse direction may flow to at least one of the left, upper, and rear sides of the DC link capacitor 54a. That is, the air may flow in the entire area of the fifth area 80e by the diverged part of the air. Accordingly, the cooling efficiency of the DC link capacitor 54a can be increased.

In addition, some of the air introduced into the second internal flow path may collide with the inclined second upper wall connection portion 83 and diverge in both directions. Part of the branched air may flow into the first internal flow path, and part of the branched air may flow into the fifth region 80e. That is, the other branched air may flow in the opposite direction of the second internal flow path.

The air flowing in the reverse direction may flow to the left side, upper side, and rear side of the DC link capacitor 54a. In particular, air turbulence may occur around the second upper wall connection portion 83 due to the curved second upper wall connection portion 83 . Accordingly, the cooling efficiency of the DC link capacitor 54a may be further increased by the turbulence of the air.

In addition, since the end of the sidewall 810g of the sixth region 80f is inclined, air flowing into the second internal flow path can flow naturally, and cooling efficiency can be increased.

The air flowing into the second internal flow path may be joined at the end of the first region 80a and flow into the first internal flow path. Accordingly, high-temperature air cooling the heat sink 60, some of the electronic elements 54, and some of the electronic elements 55 may be discharged through the outlet of the air guide 80.

Meanwhile, some of the air introduced into the communication unit 850 may be discharged to the outside of the air guide 80 through the front air outlet 840 and flow into an external flow path. That is, the air discharged from the blowing fan 70 may be discharged to the outside of the left side of the air guide 80 through the front left air outlet 842 and flow into the first external flow path, and the front right air outlet 842 ) through the air guide 80, it can flow to the third external flow path. Air flowing through the first external flow path may be provided to the second electronic element group 56, and air flowing through the third external flow path may be provided to electronic elements disposed outside the right side of the air guide 80. It can be.

Meanwhile, an additional external flow path of air, that is, a second external flow path may be formed based on the air discharge hole 870 formed in the air guide 80 .

Specifically, the air flowing to the left side of the heat sink 60 among the air flowing through the first internal flow path (hereinafter, referred to as "left side flow air") is a plurality of left side portions disposed on the left side of the heat sink 60. The electronic elements 55c and 55d may be cooled. Also, the air discharge hole 870 may discharge some of the left-flowing air to the outside of the air guide 80 . The air discharged through the air discharge hole 870 may cool the second electronic device group 56 .

That is, air discharged through the front right air outlet 842 (ie, the first air outlet) located close to the blowing fan 70 and flowing into the first external flow path, and air located far from the blowing fan 70 The second electronic device group 56 may be cooled based on the air discharged through the discharge hole 870 (ie, the second air outlet) and flowing into the second external flow path. Accordingly, the flow rate of air provided to the second electronic device group 56 may be increased, and the cooling efficiency of the second electronic device group 56 may be increased.

In addition, some of the left-flowing air cooling the rectifying element 55c may be discharged through the air discharge hole 870, and the remaining part of the air may flow in the direction of the plurality of inverter switching elements 55d. .

Meanwhile, the plurality of inverter switching elements 55d generate a large amount of heat. If the plurality of inverter switching elements 55d are located closer to the blowing fan 70 than the air discharge hole 870, the air cooling the plurality of inverter switching elements 55d is heated, and the heated air It may be discharged through the air discharge hole 870 . In this case, the cooling efficiency of the second electronic device group 56 is reduced.

In order to solve the above problem, the air discharge hole 870 may be located closer to the blowing fan 70 than the plurality of inverter switching elements 55d. Accordingly, relatively cool air may be provided to the second electronic device group 56 , and cooling efficiency of the second electronic device group 56 may be increased.

In particular, the air discharge hole 870 may also be formed on the upper wall 820 of the air guide 80 . Accordingly, the left-flowing air can be further discharged to a part of the air discharge hole 870 formed in the upper wall 820, and the air can flow to a farther area. As a result, the cooling efficiency of the second electronic element group 56 may be further increased.

In addition, the air guide 80 may be divided into a third part 803 and a fourth part 804 by the second virtual plane 85 . In this case, an area of the fourth portion 804 adjacent to the third portion 803 may have a trapezoidal shape as a whole. That is, the area of the third portion 803 may be greater than that of the fourth portion 804 .

If the air discharge hole 870 is formed in the fourth portion 804 , the flow rate of the fourth portion 804 may decrease due to the air discharged through the air discharge hole 870 . When the flow rate of the fourth part 804 is lowered, the cooling efficiency of the first electronic device groups 54 and 55 disposed in the fourth part 804 may be reduced.

In order to solve the above problem, the air discharge hole 870 may be formed in the third portion 803 at the boundary between the third portion 803 and the fourth portion 804 . At this time, the air discharge hole 870 may be formed to come into contact with the boundary between the third portion 803 and the fourth portion 804 . Therefore, it is possible to minimize a decrease in cooling efficiency of the first electronic device groups 54 and 55 disposed in the fourth portion 804, and eventually, both the first and second electronic device groups 54, 55, and 56 can be effectively cooled.

Also, referring specifically to FIG. 24 , the lower end 871 of the air discharge hole 870 may be spaced apart from the printed circuit board 51 by a predetermined distance d1. In addition, the height d1 of the lower end 871 of the air discharge hole 870 is the height of the lower surface of the trapezoidal heat sink 60 disposed inside the air guide 80, that is, the height of the heat sink 60. It may be greater than the height d2 of the lowermost end of the inclined surface 630 .

Due to this structure, the distance between the sidewall 810 of the air guide 80 and the upper side of the inclined surface 630 of the heat sink 60 is the distance between the sidewall 810 of the air guide 80 and the inclined surface of the heat sink 60 ( 630), and the flow rate of air flowing to the upper side of the sidewall 810 of the air guide 80 and the inclined surface 630 of the heat sink 60 is the sidewall of the air guide 80 ( 810) and the flow rate of air flowing to the lower side of the inclined surface 630 of the heat sink 60. At this time, the air discharge hole 870 may be formed on the upper side of the sidewall 810 of the air guide 80. Accordingly, a larger flow rate of air can be discharged through the air discharge hole 870, so that the cooling efficiency of the second electronic device group 56 can be further increased.

In addition, an air discharge hole 870 may be formed in the air guide 80 adjacent to the DC link capacitor 56a of the second electronic device group 56 . In this case, the height of the second side surface 561a of the DC link capacitor 56a may be greater than the height d1 of the lower end 871 of the air discharge hole 870 . Therefore, the air discharged from the air discharge hole 870 hits the second side surface 561a of the DC link capacitor 56a and flows to the area of the printed circuit board 51 where the second electronic device group 56 is disposed. can

In particular, the control board 90 is provided adjacent to the outlet of the air guide 80, and the air discharged from the air discharge hole 870 collides with the second side surface 561a of the DC link capacitor 56a so that the control board ( 90) may flow further in the direction in which it is disposed. Therefore, the control board 90 can also be cooled, and damage to the control board 90 can be prevented.

As described above, the present invention has been described with reference to the drawings illustrated, but the present invention is not limited by the embodiments and drawings disclosed in this specification, and various modifications are made by those skilled in the art within the scope of the technical idea of the present invention. It is obvious that variations can be made. In addition, although the operational effects according to the configuration of the present invention have not been explicitly described and described while describing the embodiments of the present invention, it is natural that the effects predictable by the corresponding configuration should also be recognized.

Claims (20)

A case in which a cover plate is coupled to the top;
a heating unit disposed under the cover plate;
an upper bracket disposed below the heating unit;
a base bracket disposed under the upper bracket and having a printed circuit board on which a plurality of electronic devices including first and second electronic device groups are mounted;
a heat sink mounted on the printed circuit board;
a blowing fan installed on the base bracket and discharging air toward the heat sink; and
An air guide mounted on the printed circuit board to surround the first electronic device group and the heat sink, communicates with the blowing fan, and forms a flow path for air discharged from the blowing fan,
Wherein the air guide is formed with an air discharge hole for providing some of the air flowing to the first side of the heat sink to the second electronic element group disposed outside the air guide.
According to claim 1,
A plurality of first-side electronic elements among the first electronic element group are disposed between the first side of the heat sink and the first side of the air guide;
Air flowing to the first side of the heat sink cools the plurality of first-side electronic elements.
According to claim 2,
The plurality of first-side electronic elements are mounted on the first side of the heat sink, the electric range.
According to claim 2,
the plurality of first-side electronic devices include at least one first inner electronic device and at least one second inner electronic device sequentially disposed along a direction of the air flow path;
The air discharge hole is formed at a first point of the air guide corresponding to a region between the at least one first inner electronic element and the at least one second inner electronic element.
According to claim 4,
The air discharge hole is formed so as not to overlap with the at least one second inner electronic element, the electric range.
According to claim 4,
The air discharge hole is formed in the first area of the air guide so as not to overlap with the second inner electronic element disposed first among the at least one second inner electronic element.
According to claim 4,
The air discharge hole is formed to overlap the at least one first inner electronic element, the electric range.
According to claim 4,
The at least one first inner electronic element corresponds to a rectifying element for driving the heating unit, the electric range.
According to claim 4,
The at least one second inner electronic element corresponds to an inverter switching element for driving the heating unit, the electric range.
According to claim 1,
The blowing fan communicates with the inlet of the air guide,
The plurality of first-side electronic elements include at least one first inner electronic element and at least one second inner electronic element sequentially disposed based on the inlet of the air guide,
The air discharge hole is disposed closer to the blowing fan than to the at least one second inner electronic element.
According to claim 1,
A communication part communicating with the blowing fan is formed at the inlet of the air guide,
The area of the portion A of the air guide adjacent to the communication portion is larger than the area of the portion B of the air guide further away from the communication portion than the portion A;
The air discharge hole is formed in the portion A at the boundary between the portion A and the portion B, the electric range.
According to claim 1,
The air guide includes a pair of side walls and an upper wall coupled to an upper end of the pair of side walls,
The air discharge hole is formed on a side wall of a first side of the air guide among the pair of side walls of the air guide.
According to claim 12,
The air discharge hole is formed across the side wall of the first side of the air guide and the upper wall of the air guide, the electric range.
According to claim 12,
The lower end of the air discharge hole is formed to be spaced apart from the printed circuit board by a predetermined distance, the electric range.
According to claim 1,
The second electronic element group is disposed outside the first side of the air guide,
The air discharge hole is disposed on an outer wall of the first side of the air guide to discharge some of the air to the outside of the first side of the air guide and provide it to the second electronic element group.
According to claim 15,
The second electronic device group includes a first outer electronic device disposed adjacent to the air discharge hole;
The height of the first outer electronic element is higher than the height of the lower end of the air discharge hole, the electric range.
According to claim 16,
The electric range of claim 1 , wherein the part of the air hits a surface of the first outer electronic element adjacent to the air discharge hole and then flows into an area of the printed circuit board where the second electronic element group is disposed.
According to claim 17,
A control board disposed adjacent to the outlet of the air guide; further comprising,
After the part of the air collides with one surface of the first outer electronic element, the electric range further flows in a direction in which the control board is disposed.
A case in which a cover plate is coupled to the top;
a heating unit disposed under the cover plate;
an upper bracket disposed below the heating unit;
a base bracket disposed under the upper bracket and having a printed circuit board on which a plurality of electronic devices including first and second electronic device groups are mounted;
a heat sink mounted on the printed circuit board;
a blowing fan installed on the base bracket and discharging air toward the heat sink; and
An air guide mounted on the printed circuit board to surround the first electronic device group and the heat sink, communicates with the blowing fan, and forms an internal flow path for air discharged from the blowing fan,
First and second air outlets are formed in the air guide to provide some of the air discharged from the blowing fan to the second electronic device group,
The first air outlet is formed closer to the blowing fan than the second air outlet,
The air discharged from the first air outlet and the air discharged from the second air outlet flow along different external flow paths of the air, the electric range.
According to claim 19,
The blowing fan communicates with the inlet of the air guide,
The plurality of first-side electronic elements include at least one first inner electronic element and at least one second inner electronic element sequentially disposed based on the inlet of the air guide,
The air discharge hole is disposed closer to the blowing fan than to the at least one second inner electronic element.

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