KR20230098045A - Optical semiconductor element sealing sheet - Google Patents

Abstract

A sheet for encapsulating an optical semiconductor element that is excellent in designability in a state in which an optical semiconductor element is sealed and can make it difficult for luminance non-uniformity to occur is provided.
The sheet|seat 1 for optical semiconductor element sealing is a sheet|seat for sealing one or more optical semiconductor elements 6 arrange|positioned on the board|substrate 5. The sheet|seat 1 for optical-semiconductor element sealing consists of the 1st sealing layer 21 which contacts the optical semiconductor element 6, the 2nd sealing layer 22 laminated|stacked on the 1st sealing layer 21, and the 2nd A third sealing layer 23 having adhesiveness and/or adhesiveness laminated on the sealing layer 22 is provided. The second sealing layer 22 and/or the third sealing layer 23 contain a colorant. At least one selected from the group consisting of the first sealing layer 21, the second sealing layer 22, and the third sealing layer 23 is a diffusion functional layer.

Description

Optical semiconductor device sealing sheet {OPTICAL SEMICONDUCTOR ELEMENT SEALING SHEET}

The present invention relates to a sheet for encapsulating an optical semiconductor element. More specifically, the present invention relates to a sheet suitable for sealing an optical semiconductor element of a self-luminous display device such as mini/micro LED.

In recent years, as a next-generation display device, a self-emissive display device represented by a mini/micro light emitting diode display (Mini/Micro Light Emitting Diode Display) has been devised. As a basic configuration of a mini/micro LED display device, a substrate on which a large number of minute optical semiconductor elements (LED chips) are arranged at high density is used as a display panel, the optical semiconductor element is sealed with a sealing material, and a resin film is applied to the outermost layer. or a cover member such as a glass plate is laminated.

In a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) of metal or metal oxide such as ITO is disposed on a substrate of a display panel. Such a display device has a problem that, for example, light is reflected by the metal wiring or the like when lights are turned off, resulting in poor aesthetics and poor design of the screen. For this reason, a technique using an antireflection layer for preventing reflection by metal wiring as a sealing material for sealing an optical semiconductor element is employed.

Further, in a display using a self-luminous display device such as a backlight, there is a problem that non-uniformity (brightness non-uniformity) occurs in brightness due to the light source of the optical semiconductor element. Patent Literature 1 has a composite pressure-sensitive adhesive layer comprising a light-diffusion pressure-sensitive adhesive layer containing light-diffusion microparticles and a transparent pressure-sensitive adhesive layer containing no light-diffusion microparticles as a pressure-sensitive adhesive sheet capable of suppressing luminance non-uniformity. A pressure-sensitive adhesive sheet in which at least one of the light-diffusing pressure-sensitive adhesive layer and the transparent pressure-sensitive adhesive layer is made of an active energy ray-curable pressure-sensitive adhesive is disclosed.

Patent Literature 2 discloses a pressure-sensitive adhesive sheet which is a laminate of a colored pressure-sensitive adhesive layer and a colorless pressure-sensitive adhesive layer, and wherein the colorless pressure-sensitive adhesive layer is located on a surface of the pressure-sensitive adhesive layer that contacts irregularities of an adherend. It is described that according to the pressure-sensitive adhesive sheet, the luminance non-uniformity in the pressure-sensitive adhesive layer can be suppressed.

Japanese Unexamined Patent Publication No. 2021-38365 Japanese Unexamined Patent Publication No. 2020-169262

However, the pressure-sensitive adhesive sheet of Patent Literature 1 does not have an antireflection layer and does not solve the problem of design. In addition, in the PSA sheet described in Patent Literature 2, it is considered that the colored PSA layer functions as an antireflection layer, but suppression of luminance nonuniformity is not sufficient.

The present invention has been conceived under these circumstances, and its object is to provide a sheet for encapsulating optical semiconductor elements that is excellent in design in a state where optical semiconductor elements are sealed and can make it difficult for luminance non-uniformity to occur.

As a result of intensive studies to achieve the above object, the inventors of the present invention have found that a sheet having three layers of sealing layers, wherein at least one of the three layers is used as a light diffusion prevention layer, and a colorant is blended into a specific sealing layer. According to the sheet|seat for optical-semiconductor element encapsulation, it discovered that it was excellent in designability in the state which sealed optical-semiconductor element, and it could make it difficult for luminance nonuniformity to occur. The present invention was completed based on these findings.

That is, the present invention is a sheet for sealing one or more optical semiconductor elements disposed on a substrate,

The sheet comprises a first sealing layer in contact with the optical semiconductor element, a second sealing layer laminated on the first sealing layer, and a third sealing layer having adhesiveness and/or adhesiveness laminated on the second sealing layer. provide layers,

The second sealing layer and / or the third sealing layer contains a colorant,

At least one selected from the group consisting of the first sealing layer, the second sealing layer, and the third sealing layer is a diffusion functional layer, and a sheet for sealing optical semiconductor elements is provided.

As described above, the optical semiconductor element encapsulating sheet has a structure in which a first encapsulating layer, a second encapsulating layer, and a third encapsulating layer in contact with the optical semiconductor element are laminated in this order. And, at least one selected from the group consisting of the first sealing layer, the second sealing layer, and the third sealing layer is a diffusion functional layer, and the second sealing layer and/or the third sealing layer contain a colorant. include The sealing layer containing the colorant functions as an antireflection layer. Since the third sealing layer has adhesiveness and/or adhesiveness, the followability of the interface is excellent in a state in which the third sealing layer is laminated with another member. By having such a structure, in the state which sealed the optical semiconductor element with the said sheet, the suppression effect of a luminance nonuniformity and design property are compatible.

It is preferable that the said 1st sealing layer is a diffusion functional layer. By having such a structure, there exists a tendency for designability to improve more.

It is preferable that the said 3rd sealing layer is a diffusion functional layer. By having such a structure, there exists a tendency for luminance nonuniformity to be suppressed more.

Preferably, the diffusion functional layer contains light-diffusing fine particles. The light-diffusing fine particles are preferably composed of silicone resin and/or metal oxide. By having such a structure, the light diffusivity of the said diffusion functional layer is more excellent, and brightness|luminance nonuniformity is suppressed more.

The optical semiconductor element encapsulation sheet has a ratio [L ^* (SCI)(2)/L ^* (SCI) of L ^* (SCI)(2) to L ^* (SCI)(1), each defined below. (1)], and/or the ratio of L ^* (SCE)(2) to L ^* (SCE)(1) [L ^* (SCE)(2)/L ^* (SCE)(1)] is less than or equal to 1.2. it is desirable By having such a structure, it is excellent in designability even when the level difference by an optical semiconductor element is high.

L ^* (SCI) (1): L ^* (SCI) measured from the third sealing layer side in a state where the first sealing layer of the optical semiconductor element sealing sheet is bonded to the aluminum foil

L ^* (SCI) (2): A convex sample having a length of 20 mm, a width of 20 mm, and a thickness of 62 μm and having an aluminum foil on the surface thereof is placed on a substrate having a size larger than that of the convex sample, and a sheet for sealing optical semiconductor elements is formed. L ^* (SCI) measured from the third sealing layer side in a state where the first sealing layer of the optical semiconductor element sealing sheet is bonded to the substrate and the convex sample so as to cover the convex sample

L ^* (SCE) (1): L ^* (SCE) measured from the third sealing layer side in a state where the first sealing layer of the optical semiconductor element sealing sheet is bonded to the aluminum foil

L ^* (SCE) (2): A convex sample having a length of 20 mm, a width of 20 mm, and a thickness of 62 μm having an aluminum foil on the surface thereof is placed on a substrate having a size larger than that of the convex sample, and a sheet for encapsulating optical semiconductor elements is formed. L ^* (SCE) measured from the third sealing layer side in a state where the first sealing layer of the sheet for encapsulating optical semiconductor elements is bonded to the substrate and the convex sample so as to cover the convex sample

It is preferable that the said 1st sealing layer is a radiation non-curing resin layer. By having such a structure, the adhesion to the optical semiconductor element and the substrate when the first sealing layer located on the surface of the optical semiconductor element encapsulating sheet seals the optical semiconductor element is excellent, and the followability of the optical semiconductor element and Reclaimability is excellent. As a result, it is excellent in designability even when the level difference by an optical semiconductor element is high.

Preferably, the second sealing layer and/or the third sealing layer is a radiation curable resin layer. By having such a structure, after sealing an optical semiconductor element, the said 2nd sealing layer and/or the said 3rd sealing layer is hardened by radiation irradiation, and the adhesiveness of the sheet side surface for optical semiconductor element sealing is reduced. As a result, the adhesion between the sheets of adjacent optical semiconductor devices in the tiling state is low, and when the adjacent optical semiconductor devices are separated from each other, chipping of the sheet or sticking of adjacent optical semiconductor device sheets is difficult to occur.

Moreover, this invention provides the optical semiconductor device provided with the board|substrate, the optical semiconductor element arrange|positioned on the said board|substrate, and the said optical semiconductor element sealing sheet which seals the said optical semiconductor element. Such an optical semiconductor device is excellent in designability, and brightness nonuniformity does not occur easily.

It is preferable that the said optical semiconductor device is a self-luminous type display device.

Further, the present invention provides an image display device including the self-emissive display device.

ADVANTAGE OF THE INVENTION According to the sheet|seat for optical-semiconductor element encapsulation of this invention, in the state which sealed optical semiconductor elements, it is excellent in design, and brightness nonuniformity does not occur easily. Therefore, by using the optical semiconductor element sealing sheet of the present invention, the aesthetic appearance is good when the optical semiconductor element is not lit, and the light emitted from the optical semiconductor element is efficiently diffused when the optical semiconductor element is lit. An optical semiconductor device capable of passing through in a state can be provided.

1 is a cross-sectional view of a sheet for encapsulating optical semiconductor elements according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of an optical semiconductor device using a sheet for sealing optical semiconductor elements according to an embodiment of the present invention.
FIG. 3 is an external view showing an embodiment of an optical semiconductor device produced by tiling the optical semiconductor device shown in FIG. 2 .
Fig. 4 is a cross-sectional view showing a state of a sealing step in an embodiment of a method for manufacturing an optical semiconductor device.
FIG. 5 is a cross-sectional view showing a laminate obtained after the sealing process shown in FIG. 4 .
FIG. 6 is a cross-sectional view showing a dicing position in the dicing process of the layered product shown in FIG. 5 .

[Sheet for sealing optical semiconductor elements]

The sheet for sealing optical semiconductor elements of the present invention comprises a first sealing layer in contact with an optical semiconductor element, a second sealing layer laminated on the first sealing layer, and a third sealing layer laminated on the second sealing layer. at least provide The said 1st sealing layer is a layer used as the side which contacts an optical semiconductor element when sealing an optical semiconductor element. In the above optical semiconductor element sealing sheet, it is preferable that the first sealing layer, the second sealing layer, the second sealing layer, and the third sealing layer are directly laminated, respectively.

In addition, in this specification, the sheet|seat for optical-semiconductor element sealing shall mean the sheet|seat for sealing one or more optical semiconductor elements arrange|positioned on a board|substrate. In addition, in this specification, "sealing an optical semiconductor element" means to embed at least a part of an optical semiconductor element in the sealing part which has a 1st sealing layer, a 2nd sealing layer, and a 3rd sealing layer, or the above It means to follow and cover with the sealing part.

The sheet for encapsulating optical semiconductor elements of the present invention may be provided on at least one surface of the substrate portion, or may be formed on a release-treated surface on a release liner. When the sheet for optical semiconductor element encapsulation of the present invention includes the base material portion, the side of the third sealing layer of the sheet for optical semiconductor element encapsulation of the present invention is the side in contact with the base material portion. Further, when the sheet for encapsulating optical semiconductor elements of the present invention is formed on the release liner, the release liner is the side where the first sealing layer side of the sheet for encapsulating optical semiconductor elements of the present invention is in contact with the release liner. When not having the said base material part, the side which contacts a peeling liner may be sufficient as both surfaces of the 1st sealing layer side and the 3rd sealing layer side of the optical-semiconductor element sealing sheet. The release liner is used as a protective material for the sheet for encapsulating optical semiconductor elements, and is peeled off when sealing optical semiconductor elements. In addition, the substrate portion and the peeling liner do not necessarily have to be provided.

Hereinafter, one Embodiment of the sheet|seat for optical semiconductor element sealing of this invention is described. 1 is a cross-sectional view showing one embodiment of the sheet for optical semiconductor element sealing of the present invention. As shown in FIG. 1, the sheet|seat 1 for optical-semiconductor element encapsulation can be used in order to encapsulate one or more optical semiconductor elements arrange|positioned on a board|substrate, and on the base part 4 and the base part 4 It is provided with a sealing portion (2) formed on. The sealing part 2 is formed from the laminated body of the 1st sealing layer 21, the 2nd sealing layer 22, and the 3rd sealing layer 23. The second sealing layer 22 is directly laminated on the first sealing layer 21, and the third sealing layer 23 is directly laminated on the second sealing layer 22. The peeling liner 3 is affixed on one side of the 1st sealing layer 21, and the base material part 4 is affixed on the 3rd sealing layer 23.

In the above optical semiconductor element sealing sheet, the second sealing layer and/or the third sealing layer contains a colorant. That is, at least one of the 2nd sealing layer and the 3rd sealing layer contains a coloring agent. The sealing layer containing the colorant functions as an antireflection layer. For this reason, in the state which sealed the optical semiconductor element with the said sheet|seat for optical-semiconductor element sealing WHEREIN: It is excellent in designability.

The sheet for encapsulating optical semiconductor elements is provided with at least a layer (diffusion functional layer) exhibiting a function of diffusing light. In the sheet for sealing optical semiconductor elements, at least one selected from the group consisting of a first sealing layer, a second sealing layer, and a third sealing layer is a diffusion functional layer. However, among the 1st sealing layer, the 2nd sealing layer, and the 3rd sealing layer, the layer which is a diffusion functional layer is a colorless layer which does not contain a coloring agent. For example, when the second sealing layer is a colored layer and the third sealing layer is a diffusion functional layer, the third sealing layer is a colorless layer, the third sealing layer is a colored layer, and the second sealing layer is a diffusion functional layer. , the second sealing layer is a colorless layer, and when the second sealing layer and the third sealing layer are colored layers, the first sealing layer is a colorless diffusion functional layer. By having such a structure, the antireflection layer and the diffusion functional layer can sufficiently exert their effects, and in the state where the optical semiconductor element is sealed with the optical semiconductor element encapsulating sheet, the effect of suppressing luminance non-uniformity and the design are compatible. can do.

As the laminated structure of the first sealing layer, the second sealing layer, and the third sealing layer [first sealing layer / second sealing layer / third sealing layer], [diffusion functional layer / colored layer / non-diffusion functional layer], [non-diffusion functional layer] Functional layer / colored layer / diffusion functional layer], [diffusion functional layer / colored layer / diffusion functional layer], [non-diffusion functional layer / diffusion functional layer / colored layer], [diffusion functional layer / non-diffusion functional layer / colored layer], [Diffusion functional layer/diffusion functional layer/colored layer] and [diffusion functional layer/colored layer/colored layer] are exemplified. In addition, in this specification, a "diffusion functional layer" is a layer which does not contain a coloring agent, and a "non-diffusion functional layer" is a colorless and transparent layer which does not aim at exhibiting a light-diffusion function.

It is preferable that one of the 2nd sealing layer and the 3rd sealing layer is a colored layer, and the other is a colorless layer containing no coloring agent. In this case, at least one of the colorless layer and the first sealing layer is a diffusion functional layer, but it is preferable that one is a diffusion functional layer and the other is a non-diffusion functional layer. In these cases, the effect of suppressing luminance nonuniformity and the design properties tend to be more excellent.

Especially, it is preferable that the 2nd sealing layer is a colored layer. In this case, the third sealing layer may be either a colored layer or a colorless layer, but is preferably a colorless layer. When the third sealing layer is a colorless layer, the first sealing layer and/or the third sealing layer are diffusion functional layers. Among them, one of the first sealing layer and the third sealing layer is preferably a diffusion functional layer and the other is a non-diffusion functional layer, more preferably the first sealing layer is a diffusion functional layer, and the first sealing layer is a diffusion functional layer. layer and the third sealing layer is more preferably a non-diffusion functional layer. In these cases, the effect of suppressing luminance nonuniformity and the design properties tend to be more excellent.

As the laminated structure [first sealing layer/second sealing layer/third sealing layer], [diffusion functional layer/coloring layer/non-diffusion functional layer], [non-diffusion functional layer/coloring layer/diffusion functional layer], [ Diffusion functional layer / colored layer / diffusion functional layer], [non-diffusion functional layer / diffusion functional layer / colored layer], [diffusion functional layer / non-diffusion functional layer / colored layer] are preferable, and [diffusion functional layer / colored layer / non-diffusion functional layer / non-diffusion functional layer] Functional layer], [non-diffusion functional layer/coloring layer/diffusion functional layer], and [diffusion functional layer/coloring layer/diffusion functional layer] are more preferable.

The first sealing layer, the second sealing layer, and the third sealing layer may each independently be a resin layer (radiation curable resin layer) having a property to be cured by irradiation with radiation, or a number that does not have a property to be cured by irradiation with radiation. It may be a stratum (radiation non-curable resin layer). Examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X rays.

It is preferable that the 1st sealing layer is a radiation non-curing resin layer. By having such a configuration, the first sealing layer located on the surface of the optical semiconductor element sealing sheet has excellent adhesion to the optical semiconductor element and the substrate when the optical semiconductor element is sealed, and the followability and embedding of the optical semiconductor element The castle is excellent. As a result, it is excellent in designability even when the level difference by an optical semiconductor element is high.

It is preferable that the 2nd sealing layer and/or the 3rd sealing layer is a radiation-curable resin layer. By having such a structure, after sealing an optical semiconductor element, the 2nd sealing layer and/or the 3rd sealing layer are hardened by radiation irradiation, and the adhesiveness of the sheet|seat side surface for optical semiconductor element sealing falls. As a result, the adhesion between the sheets of adjacent optical semiconductor devices in the tiling state is low, and when the adjacent optical semiconductor devices are separated from each other, chipping of the sheet or sticking of adjacent optical semiconductor device sheets is difficult to occur.

A 1st sealing layer is a layer used as the side which contacts an optical-semiconductor element (namely, the board|substrate side provided with an optical-semiconductor element) when sealing an optical-semiconductor element. The first sealing layer may or may not have adhesiveness and/or adhesiveness. Especially, in order that the 1st sealing layer can adhere with sufficient contact|adhesion power to a board|substrate and an optical semiconductor element, and to enable it to fully seal an optical semiconductor element, what has adhesiveness and/or adhesiveness is preferable.

The second sealing layer may or may not have adhesiveness and/or adhesiveness. Among them, those having tackiness and/or adhesiveness are preferable. By having such a structure, when sealing an optical semiconductor element, the optical semiconductor element can be easily sealed, and the adhesiveness with the 1st sealing layer located on the optical semiconductor element side surface is excellent, and sealing of an optical semiconductor element sex is better

The third sealant is tacky and/or adhesive. Accordingly, in the state where the third sealing layer is laminated with the other member, followability of the interface is excellent. For this reason, in the state where the optical semiconductor element is sealed with the optical semiconductor element encapsulating sheet, it is difficult for the third sealing layer to closely adhere or to form a gap with other members to which it adheres, so that the effect of suppressing luminance unevenness and the design are compatible. can Moreover, when sealing an optical semiconductor element, it can seal an optical semiconductor element easily, and it is excellent in adhesiveness with a 2nd sealing layer, and the sealing property of an optical semiconductor element is more excellent.

(Colored layer)

The colored layer, which may be the second sealing layer and/or the third sealing layer, contains at least a colorant. It is preferable that the said colored layer is a resin layer comprised from resin. The coloring agent may be a dye or a pigment as long as it can be dissolved or dispersed in the colored layer. A dye is preferable because it can achieve a low haze even with a small amount of addition and is easy to distribute uniformly without sedimentation like a pigment. Moreover, a pigment is also preferable from the viewpoint of high color expression even when added in a small amount. When using a pigment as a colorant, it is preferable that it has low or no conductivity. As for the said coloring agent, only 1 type may be used and 2 or more types may be used.

As the coloring agent, a black colorant is preferable. As the black colorant, a known or common colorant (pigment, dye, etc.) for showing black can be used, and for example, carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, smoke smoke, etc.) ), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite, chromium oxide, iron oxide, molybdenum disulfide, chromium complex, anthraquine A rice field colorant, zirconium nitride, etc. are mentioned. Further, a colorant that functions as a black colorant by combining a colorant exhibiting a color other than black may be used.

The colorant is not particularly limited, but is preferably one that absorbs visible light and has ultraviolet transmittance. That is, it is preferable that the average transmittance of the colorant at a wavelength of 330 to 400 nm is greater than the average transmittance at a wavelength of 400 to 700 nm. In addition, it is preferable that the maximum value of the transmittance of the colorant at a wavelength of 330 to 400 nm is larger than the maximum value of the transmittance at a wavelength of 400 to 700 nm. The transmittance of the colorant is diluted with an appropriate solvent or dispersion medium (an organic solvent having low absorption in the wavelength range of 330 to 700 nm) such as tetrahydrofuran (THF) so that the transmittance at a wavelength of 400 nm is about 50 to 60%. It is measured using a solution or dispersion.

Examples of black pigments having ultraviolet light transmittance smaller than visible light absorption include "9050BLACK" under the trade name and "UVBK-0001" under the trade name (all manufactured by Tokushiki Co., Ltd.). As a black dye with ultraviolet transmittance, a brand name "SOC-L-0123" (made by Orient Chemical Industry Co., Ltd.), etc. are mentioned.

Carbon black and titanium black, which are generally used as black colorants, absorb ultraviolet rays more than absorb visible light (ultraviolet transmittance is smaller than visible light transmittance). Therefore, when a colorant such as carbon black is added to a radiation curable resin that is sensitive to ultraviolet rays, most of the ultraviolet rays irradiated for photocuring are absorbed by the colorant, the amount of light absorbed by the photopolymerization initiator is small, and time for photocuring is reduced. required (accumulated irradiation light amount increases). Further, when the thickness of the layer to be laminated is large, there is a tendency for insufficient photocuring even if light irradiation is performed for a long time because there are few ultraviolet rays reaching the surface opposite to the light irradiation surface. In contrast, curing inhibition caused by the colorant can be suppressed by using a colorant having a higher transmittance of ultraviolet rays than visible light.

The content of the coloring agent in the colored layer is preferably from 0.01 to 20 parts by weight, more preferably from 0.01 to 20 parts by weight, based on 100 parts by weight of the resin constituting the colored layer, from the viewpoint of imparting an appropriate antireflection ability to the sheet for sealing semiconductor elements. It is 0.1 to 15 parts by mass, more preferably 1 to 10 parts by mass, and may be appropriately set depending on the type of colorant, color tone and light transmittance of the sheet for semiconductor element encapsulation, and the like. The colorant may be added to the composition as a solution or dispersion obtained by dissolving or dispersing in a suitable solvent.

The haze value (initial haze value) of the colored layer is not particularly limited, but is preferably 30% or less, more preferably 25% or less, still more preferably 20% from the viewpoint of securing the visibility of the optical semiconductor device. or less, particularly preferably 15% or less. In addition, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, particularly preferably from the viewpoint of efficiently reducing the luminance nonuniformity of the optical semiconductor device. is 8% or more, and may be 10% or more. When the colored layer is a radiation curable resin layer, the haze value may be a value before curing or a value after curing.

The total light transmittance of the colored layer is not particularly limited, but is preferably 30% or less, more preferably 25% or less, from the viewpoint of further improving the antireflection function and contrast of metal wiring or the like in an optical semiconductor device. , more preferably 20% or less, particularly preferably 10% or less. From the viewpoint of securing the luminance of the optical semiconductor device, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, and particularly preferably 2% or more. It is % or more, and 2.5% or more or 3% or more may be sufficient. When the colored layer is a radiation curable resin layer, the total light transmittance may be a value before curing or a value after curing.

The haze value and total light transmittance of the colored layer can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and can be controlled by the type and thickness, the type and amount of the colorant, and the like.

(diffusion functional layer)

The diffusion functional layer to which the first sealing layer, the second sealing layer, and the third sealing layer can be applied is a layer having a function of diffusing light, and is preferably a resin layer composed of resin. The diffusion functional layer is not limited, but preferably contains light-diffusing fine particles. That is, the diffusion functional layer preferably contains light-diffusing fine particles dispersed in the resin layer. As for the said light-diffusing fine particles, only 1 type may be used, and 2 or more types may be used.

The light-diffusing fine particles have an appropriate refractive index difference with the resin constituting the diffusion functional layer, and impart diffusion performance to the diffusion functional layer. Examples of the light-diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material of the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxides. Examples of the material of the polymer fine particles include silicone resins, acrylic resins (for example, polymethacrylate resins such as polymethyl methacrylate are included), polystyrene resins, polyurethane resins, melamine resins, polyethylene resins, and epoxies. Resin etc. are mentioned.

As the polymer fine particles, fine particles composed of a silicone resin are preferable. Further, as the inorganic fine particles, fine particles composed of metal oxide are preferable. As said metal oxide, titanium oxide and barium titanate are preferable, and titanium oxide is more preferable. By having such a structure, the light diffusivity of the said diffusion functional layer is more excellent, and brightness|luminance nonuniformity is suppressed more.

The shape of the light-diffusing fine particles is not particularly limited, and may be, for example, spherical, flat, or irregular.

The average particle diameter of the light-diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, still more preferably 0.2 μm or more, from the viewpoint of imparting appropriate light-diffusing performance to the optical semiconductor element sealing sheet. Especially preferably, it is 0.25 micrometer or more. The average particle diameter of the light-diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, still more preferably 8 μm, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. less than μm. The average particle diameter can be measured using a coulter counter, for example.

The refractive index of the light-diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, still more preferably 1.3 to 4, and particularly preferably 1.35 to 3.

The absolute value of the difference in refractive index between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) is more efficiently reducing the luminance non-uniformity of the optical semiconductor device. It is preferably 0.001 or more, more preferably 0.01 or more, still more preferably 0.02 or more, particularly preferably 0.03 or more, and may be 0.04 or more or 0.05 or more. The absolute value of the difference in refractive index between the light-diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. 3 or less.

The content of the light-diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more with respect to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of imparting appropriate light-diffusion performance to the sheet for sealing optical semiconductor elements. , More preferably 0.05 parts by mass or more, still more preferably 0.1 parts by mass or more, and particularly preferably 0.15 parts by mass or more. In addition, the content of the light-diffusing fine particles is preferably 80 parts by mass or less, more preferably 80 parts by mass or less with respect to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. It is 70 parts by mass or less.

The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but is preferably 30% or more, more preferably 40% or more, from the viewpoint of efficiently reducing luminance nonuniformity of the optical semiconductor device. It is preferably 50% or more, particularly preferably 60% or more, and may be 70% or more, 80% or more, 90% or more, 95% or more, or 97% or more, and the luminance unevenness improvement effect is better when it is around 99.9%. so it is desirable The upper limit of the haze value of the diffusion functional layer is not particularly limited, that is, it may be 100%. When the diffusion functional layer is a radiation-curable resin layer, the haze value may be a value before curing or a value after curing.

The total light transmittance of the diffusion functional layer is not particularly limited, but is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, from the viewpoint of securing the luminance of the optical semiconductor device. More preferably, it is 80% or more. The upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. When the diffusion functional layer is a radiation curable resin layer, the total light transmittance may be a value before curing or a value after curing.

The haze value and total light transmittance of the diffusion functional layer can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and are controlled by the type and thickness of the diffusion functional layer, the type and amount of light diffusing fine particles, etc. can do.

(Non-diffusion functional layer)

The non-diffusion functional layer, to which the first sealing layer, the second sealing layer, and the third sealing layer can correspond, is a colorless and transparent layer not intended to exhibit a function of diffusing light, and is a resin layer composed of resin. It is desirable to be

The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but is preferably less than 30%, more preferably 10% or less, and still more preferably 10% or less, from the viewpoint of improving the luminance of the optical semiconductor device. 5% or less, particularly preferably 1% or less, and may be 0.5% or less. In addition, the lower limit of the haze value of the said non-diffusion functional layer is not specifically limited. When the non-diffusion functional layer is a radiation curable resin layer, the haze value may be a value before curing or a value after curing.

The total light transmittance of the non-diffusion functional layer is not particularly limited, but is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, from the viewpoint of securing the luminance of the optical semiconductor device. Preferably it is 90% or more. The upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. When the non-diffusion functional layer is a radiation curable resin layer, the total light transmittance may be a value before curing or a value after curing.

The haze value and total light transmittance of the non-diffusion functional layer can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and can be controlled by the type or thickness of the non-diffusion functional layer.

The content of the colorant and/or the light-diffusing fine particles in the non-diffusion functional layer is preferably less than 0.01 part by mass with respect to 100 parts by mass of the resin constituting the non-diffusion functional layer, from the viewpoint of improving the luminance of the optical semiconductor device. Preferably it is 0.005 mass part or less.

<Resin layer>

When the colored layer, the diffusion functional layer, and the non-diffusion functional layer are the resin layers, examples of the resin constituting the resin layer include known or commonly used resins, such as acrylic resins and urethane acrylate resins. , urethane-based resin, rubber-based resin, epoxy-based resin, epoxy acrylate-based resin, oxetane-based resin, silicone resin, silicone acrylic resin, polyester-based resin, polyether-based resin (polyvinyl ether, etc.), polyamide-based resin, fluorine-based resin resins, vinyl acetate/vinyl chloride copolymers, modified polyolefins, and the like. As for the said resin, only 1 type may be used and 2 or more types may be used. The resin constituting the colored layer, the diffusion functional layer, and the non-diffusion functional layer may be the same as or different from each other.

When the resin layer is an adhesive layer (adhesive layer), a known or commonly used pressure-sensitive adhesive can be used as the resin. Examples of the pressure-sensitive adhesive include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives (natural rubber, synthetic rubber, mixtures thereof, etc.), silicone-based pressure-sensitive adhesives, polyester-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, polyether-based pressure-sensitive adhesives, polyamide-based pressure-sensitive adhesives, fluorine-based pressure-sensitive adhesives, etc. can be heard The said adhesive may use only 1 type, and may use 2 or more types.

The said acrylic resin is a polymer containing the structural unit derived from an acrylic monomer (a monomer component which has a (meth)acryloyl group in a molecule) as a structural unit of a polymer. As for the said acrylic resin, only 1 type may be used and 2 or more types may be used.

It is preferable that the said acrylic resin is a polymer containing the most structural unit derived from (meth)acrylic acid ester by mass ratio. In addition, in this specification, "(meth)acryl" shows "acryl" and/or "methacryl" (either one or both of "acryl" and "methacryl"), and the others are the same.

As said (meth)acrylic acid ester, hydrocarbon group containing (meth)acrylic acid ester is mentioned, for example. As the hydrocarbon group-containing (meth)acrylic acid ester, (meth)acrylic acid ester having an alicyclic hydrocarbon group such as (meth)acrylic acid alkyl ester having a linear or branched aliphatic hydrocarbon group and (meth)acrylic acid cycloalkyl ester; ) (meth)acrylic acid esters having aromatic hydrocarbon groups such as aryl acrylate esters; and the like. As for the said hydrocarbon group-containing (meth)acrylic acid ester, only 1 type may be used, and 2 or more types may be used.

Examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, (meth)acrylate s-butyl, (meth)acrylate t-butyl, (meth)acrylate pentyl, (meth)acrylate isopentyl, (meth)acrylate hexyl, (meth)acrylate heptyl, (meth)acrylate octyl, (meth)acrylate 2-ethylhexyl acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, (meth) Dodecyl acrylate (lauryl (meth)acrylate), tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, (meth) Octadecyl acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate, etc. are mentioned.

As the (meth)acrylic acid alkyl ester, among others, a linear or branched chain aliphatic hydrocarbon group having 1 to 20 (preferably 1 to 14, more preferably 2 to 10, still more preferably 2 to 6) carbon atoms. (meth)acrylic acid alkyl esters are preferred. When the number of carbon atoms is within the above range, the glass transition temperature of the acrylic resin can be easily adjusted, and the adhesiveness of the resin layer can be more appropriate.

Examples of (meth)acrylic acid esters having an alicyclic hydrocarbon group include monocyclic aliphatic hydrocarbons such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, cycloheptyl (meth)acrylate, and cyclooctyl (meth)acrylate. (meth)acrylic acid ester having a ring; (meth)acrylic acid esters having a bicyclic aliphatic hydrocarbon ring such as isobornyl (meth)acrylate; Dicyclopentanyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, tricyclopentanyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl ( (meth)acrylic acid esters having three or more aliphatic hydrocarbon rings, such as meth)acrylate and 2-ethyl-2-adamantyl (meth)acrylate; and the like. Among them, (meth)acrylic acid esters having a monocyclic aliphatic hydrocarbon ring are preferred, and cyclohexyl (meth)acrylate is more preferred.

As (meth)acrylic acid ester which has the said aromatic hydrocarbon group, (meth)acrylic acid phenyl ester, (meth)acrylic acid benzyl ester, etc. are mentioned, for example.

Among the hydrocarbon group-containing (meth)acrylic acid esters, it is preferable to include (meth)acrylic acid alkyl esters having a linear or branched aliphatic hydrocarbon group, and (meth)acrylic acid esters having an alicyclic hydrocarbon group it is more preferable In this case, the balance of adhesiveness of a resin layer is good, and the sealing property of an optical semiconductor element is more excellent.

In order to appropriately express basic properties such as adhesiveness by the hydrocarbon group-containing (meth)acrylic acid ester and adhesion to optical semiconductor elements in the resin layer, the hydrocarbon group in all monomer components constituting the acrylic resin The proportion of (meth)acrylic acid ester contained is preferably 40% by mass or more, more preferably 50% by mass or more, and even more preferably 60% by mass or more with respect to the total amount (100% by mass) of all the monomer components. Moreover, the said ratio is preferably 95% by mass or less, more preferably 80% by mass or less, from the viewpoint of enabling copolymerization of other monomer components and obtaining the effect of the other monomer component.

The ratio of the (meth)acrylic acid alkyl ester having a linear or branched aliphatic hydrocarbon group in all the monomer components constituting the acrylic resin is 30% by mass or more with respect to the total amount (100% by mass) of all the monomer components. preferably, more preferably 40% by mass or more. Moreover, 90 mass % or less of the said ratio is preferable, More preferably, it is 70 mass % or less.

The ratio of the (meth)acrylic acid ester having an alicyclic hydrocarbon group in all the monomer components constituting the acrylic resin is preferably 1% by mass or more with respect to the total amount (100% by mass) of all the monomer components, more preferably is 5% by mass or more. Moreover, 30 mass % or less of the said ratio is preferable, More preferably, it is 20 mass % or less.

The acrylic resin contains structural units derived from other monomer components copolymerizable with the hydrocarbon group-containing (meth)acrylic acid ester for the purpose of introducing a first functional group described later and for the purpose of modifying cohesive force, heat resistance, etc. There may be. Examples of the other monomer component include polar group-containing monomers such as carboxy group-containing monomers, acid anhydride monomers, hydroxyl-group-containing monomers, glycidyl-group-containing monomers, sulfonic acid-group-containing monomers, phosphoric acid-group-containing monomers, and nitrogen atom-containing monomers. . As for the said other monomer component, only 1 type may be used respectively, and 2 or more types may be used.

Examples of the carboxy group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of the acid anhydride monomer include maleic anhydride and itaconic anhydride.

Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, ( 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate, and the like. .

Examples of the glycidyl group-containing monomer include glycidyl (meth)acrylate and methylglycidyl (meth)acrylate.

Examples of the sulfonic acid group-containing monomer include styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acrylamido-2-methylpropanesulfonic acid. ) Acryloyloxy naphthalene sulfonic acid etc. are mentioned.

As said phosphoric acid group containing monomer, 2-hydroxyethyl acryloyl phosphate etc. are mentioned, for example.

Examples of the nitrogen atom-containing monomer include morpholino group-containing monomers such as (meth)acryloylmorpholine, cyano group-containing monomers such as (meth)acrylonitrile, and amide group-containing monomers such as (meth)acrylamide. etc. can be mentioned.

It is preferable to include a hydroxyl group-containing monomer as the polar group-containing monomer constituting the acrylic resin. By using a hydroxyl group-containing monomer, introduction of the first functional group described later is easy. Further, the acrylic resin and the resin layer are excellent in water resistance, and the sheet for encapsulating optical semiconductor elements is resistant to clouding even when used in an environment of high humidity and is excellent in whitening resistance.

As the hydroxy group-containing monomer, 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate are preferred, and 2-hydroxyethyl (meth)acrylate is more preferred.

In order to properly express basic properties such as adhesiveness by the hydrocarbon group-containing (meth)acrylic acid ester and adhesion to optical semiconductor elements in the resin layer, all monomer components (100% by mass) constituting the acrylic resin , the ratio of the polar group-containing monomer is preferably 5 to 50% by mass, more preferably 10 to 40% by mass. In particular, it is preferable that the ratio of the hydroxyl group-containing monomer is within the above range from the viewpoint of better water resistance of the resin layer.

Examples of the other monomer components include vinyl monomers such as caprolactone adducts of (meth)acrylic acid, vinyl acetate, vinyl propionate, styrene, and α-methylstyrene; glycol-based acrylic ester monomers such as polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, and methoxypolypropylene glycol (meth)acrylate; (meth)acrylate tetrahydrofurfuryl, fluorine (meth)acrylate, silicone (meth)acrylate, alkoxy group-substituted hydrocarbon group-containing (meth)acrylate (2-methoxyethyl (meth)acrylate, 3-phenoxybenzyl (meth)acrylate, etc.) may contain acrylic acid ester type monomers, etc.

The ratio of the other monomer components to all the monomer components (100% by mass) constituting the acrylic resin is, for example, about 3 to 50% by mass, and may be 5 to 40% by mass or 10 to 30% by mass. .

The acrylic resin may contain a structural unit derived from a polyfunctional (meth)acrylate copolymerizable with a monomer component constituting the acrylic resin in order to form a crosslinked structure in the polymer skeleton. Examples of the polyfunctional (meth)acrylate include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, and neopentyl glycol di. (meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and the like. there is. As for the said polyfunctional monomer, only 1 type may be used and 2 or more types may be used.

In order to properly express basic properties such as adhesiveness by the hydrocarbon group-containing (meth)acrylic acid ester and adhesion to optical semiconductor elements in the resin layer, all monomer components (100% by mass) constituting the acrylic resin As for the ratio of the said polyfunctional monomer in , 40 mass % or less is preferable, More preferably, it is 30 mass % or less.

When the resin layer is a radiation-curable resin layer, examples of the resin layer include a layer containing a base polymer and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond; and a layer containing a polymer having a sexual functional group (particularly, an acrylic resin) as a base polymer.

Examples of the radiation polymerizable functional group include radiation radical polymerizable groups such as groups containing carbon-carbon unsaturated bonds such as ethylenically unsaturated groups, radiation cation polymerizable groups, and the like. As a group containing the said carbon-carbon unsaturated bond, a vinyl group, a propenyl group, an isopropenyl group, an acryloyl group, a methacryloyl group etc. are mentioned, for example. Examples of the radiation cationic polymerizable group include an epoxy group, an oxetanyl group, and an oxolanyl group. Among them, a group containing a carbon-carbon unsaturated bond is preferable, and an acryloyl group and a methacryloyl group are more preferable. 1 type may be sufficient as the said radiation polymerizable functional group, and 2 or more types may be sufficient as it. The position of the radiation polymerizable functional group may be any of the polymer main chain terminals in the polymer side chain and polymer main chain.

The polymer having the radiation-polymerizable functional group is, for example, a polymer having a reactive functional group (first functional group) and a functional group capable of forming a bond by causing a reaction between the first functional group (second functional group) and It can be prepared by a method in which the compound having the radiation polymerizable functional group is reacted and bonded while maintaining the radiation polymerizability of the radiation polymerizable functional group. For this reason, it is preferable that the polymer having the radiation polymerizable functional group includes a structural part derived from the polymer having the first functional group and a structural part derived from a compound having the second functional group and the radiation polymerizable functional group.

Examples of the combination of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, an isocyanate group and a hydroxy group, and the like. Among these, a combination of a hydroxyl group and an isocyanate group and a combination of an isocyanate group and a hydroxyl group are preferable from the viewpoint of the ease of tracking the reaction. 1 type may be sufficient as the said combination, and 2 or more types may be sufficient as it.

Examples of the compound having a radiopolymerizable functional group and an isocyanate group include methacryloyl isocyanate, 2-acryloyloxyethyl isocyanate, 2-methacryloyloxyethyl isocyanate (MOI), m-isopropenyl-α,α- Dimethylbenzyl isocyanate etc. are mentioned. As for the said compound, only 1 type may be used and 2 or more types may be used.

From the viewpoint that the content of the structural part derived from the compound having the second functional group and the radiation polymerizable functional group in the acrylic resin having the radiation polymerizable functional group can further advance the curing of the radiation curable resin layer, the first functional group It is preferably 0.5 mol or more, more preferably 1 mol or more, still more preferably 3 mol or more, and still more preferably 10 mol or more with respect to 100 mol of the total amount of structural parts derived from the acrylic resin having . The said content is 100 mol or less, for example.

The molar ratio of the second functional group to the first functional group in the acrylic resin having the radiation-polymerizable functional group [second functional group / first functional group] can further advance the curing of the radiation-curable resin layer, 0.01 or more is preferable, more preferably 0.05 or more, still more preferably 0.2 or more, and particularly preferably 0.4 or more. In addition, the molar ratio is preferably less than 1.0, and more preferably 0.9 or less, from the viewpoint of further reducing the low molecular weight substances in the radiation curable resin layer.

The said acrylic resin is obtained by polymerizing the various monomer components mentioned above. Although it does not specifically limit as this polymerization method, For example, a solution polymerization method, emulsion polymerization method, bulk polymerization method, and the polymerization method by active energy ray irradiation (active energy ray polymerization method) etc. are mentioned. Moreover, any, such as a random copolymer, a block copolymer, and a graft copolymer, may be sufficient as the acrylic resin obtained.

The acrylic resin having the radiation-polymerizable functional group is, for example, polymerized (co-polymerized) a raw material monomer containing a monomer component having a first functional group to obtain an acrylic resin having a first functional group, and then polymerized with the second functional group and radiation polymerization. A compound having a sexual functional group can be produced by a method of condensation reaction or addition reaction with respect to acrylic resin while maintaining the radiation polymerizability of the radiation polymerizable functional group.

At the time of polymerization of the monomer components, various common solvents may be used. Examples of the solvent include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; alicyclic hydrocarbons such as cyclohexane and methylcyclohexane; Organic solvents, such as ketones, such as methyl ethyl ketone and methyl isobutyl ketone, are mentioned. As for the said solvent, only 1 type may be used and 2 or more types may be used.

The polymerization initiator, chain transfer agent, emulsifier, etc. used in the radical polymerization of the monomer components are not particularly limited and may be appropriately selected and used. In addition, the weight average molecular weight of acrylic resin is controllable by the usage-amount of a polymerization initiator and chain transfer agent, and reaction conditions, and the usage-amount is adjusted suitably according to these types.

As the polymerization initiator used for polymerization of the monomer component, depending on the type of polymerization reaction, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like can be used. As for the said polymerization initiator, only 1 type may be used and 2 or more types may be used.

Although it does not specifically limit as said thermal polymerization initiator, For example, an azo type polymerization initiator, a peroxide type polymerization initiator, a redox type polymerization initiator, etc. are mentioned. The amount of the thermal polymerization initiator used is preferably 1 part by mass or less, more preferably 0.005 to 1 part by mass, still more preferably 100 parts by mass of the total amount of all monomer components constituting the acrylic resin having the first functional group. is 0.02 to 0.5 parts by mass.

Examples of the photopolymerization initiator include benzoin ether photopolymerization initiators, acetophenone photopolymerization initiators, α-ketol photopolymerization initiators, aromatic sulfonyl chloride photopolymerization initiators, photoactive oxime photopolymerization initiators, benzoin photopolymerization initiators, and benzyl photopolymerization initiators. initiators, benzophenone-based photopolymerization initiators, ketal-based photopolymerization initiators, thioxanthone-based photopolymerization initiators, acylphosphine oxide-based photopolymerization initiators, titanocene-based photopolymerization initiators, and the like. Among them, an acetophenone-based photopolymerization initiator is preferable.

Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, 4-phenoxydichloroacetophenone, 4-(t-Butyl)dichloroacetophenone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy- 2-methyl-1-phenyl-propan-1-one, methoxy acetophenone, etc. are mentioned.

The amount of the photopolymerization initiator used is preferably 0.005 to 1 part by mass, more preferably 0.01 to 0.7 part by mass, still more preferably 0.18 to 0.5 part by mass, based on 100 parts by mass of all the monomer components constituting the acrylic resin. It is wealth. When the amount used is 0.005 parts by mass or more (particularly, 0.18 parts by mass or more), the molecular weight of the acrylic resin can be easily controlled to be small, the residual stress of the resin layer increases, and step water absorption tends to be better.

The reaction between the acrylic resin having the first functional group and the compound having the second functional group and the radiation polymerizable functional group can be performed by stirring in a solvent in the presence of a catalyst, for example. As said solvent, the thing mentioned above is mentioned. The said catalyst is appropriately selected according to the combination of a 1st functional group and a 2nd functional group. The reaction temperature in the above reaction is, for example, 5 to 100°C, and the reaction time is, for example, 1 to 36 hours.

The said acrylic resin may have a structural part derived from a crosslinking agent. For example, the low molecular weight substances in the resin layer can be further reduced by crosslinking the acrylic resin. Moreover, the weight average molecular weight of acrylic resin can be raised. Moreover, when the said acrylic resin has a radiation polymerizable functional group, the said crosslinking agent is a functional group other than a radiation polymerizable functional group (for example, 1st functional groups, 2nd functional groups, or a 1st functional group and a 2nd functional group). is to bridge. As for the said crosslinking agent, only 1 type may be used and 2 or more types may be used.

Examples of the crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent, a metal salt crosslinking agent, a carbodiimide crosslinking agent, and an oxazoline crosslinking agent. A crosslinking agent, an aziridine type crosslinking agent, an amine type crosslinking agent, a silicone type crosslinking agent, a silane type crosslinking agent, etc. are mentioned. As said crosslinking agent, an isocyanate type crosslinking agent and an epoxy type crosslinking agent are preferable, and an isocyanate type crosslinking agent is more preferable, from a viewpoint of excellent adhesiveness to an optical semiconductor element, and a viewpoint with few impurity ions.

Examples of the isocyanate-based crosslinking agent (polyfunctional isocyanate compound) include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, and hydrogenated xylene diisocyanate; and aromatic polyisocyanates such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate. Moreover, as said isocyanate type crosslinking agent, trimethylol propane/tolylene diisocyanate adduct, trimethylol propane/hexamethylene diisocyanate adduct, trimethylol propane/xylylene diisocyanate adduct, etc. are mentioned, for example.

The content of the structural part derived from the cross-linking agent is not particularly limited, but is preferably 5 parts by mass or less, more preferably 0.001 to 100 parts by mass, based on 100 parts by mass of the total amount of the acrylic resin excluding the structural part derived from the cross-linking agent. 5 parts by mass, more preferably 0.01 to 3 parts by mass.

The resin layer may contain other components other than the above components within a range that does not impair the effects of the present invention in the colored layer, the diffusion functional layer, and the non-diffusion functional layer. Examples of the other components include crosslinking accelerators, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, antioxidants, fillers (metal powders, organic fillers, inorganic fillers, etc.), antioxidants, plasticizers , softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, granular substances, thin substances and the like. As for the said other component, only 1 type may be used respectively, and 2 or more types may be used.

The thickness of each layer of a 1st sealing layer, a 2nd sealing layer, and a 3rd sealing layer is 5-480 micrometers, for example. The thickness of the first sealing layer is preferably 5 to 100 μm, more preferably 10 to 80 μm, still more preferably 20 to 70 μm. When the thickness of the first sealing layer is 5 μm or more, the sealing property of the semiconductor element becomes better. If the thickness of the 1st sealing layer is 100 micrometers or less, it will be easy to ensure the brightness|luminance at the time of light emission of an optical semiconductor element more.

The thickness of the second sealing layer is preferably 5 to 100 μm, more preferably 10 to 80 μm, still more preferably 20 to 70 μm. When the thickness of the second sealing layer is 5 µm or more, the sealing property of the semiconductor element becomes better. If the thickness of the second sealing layer is 100 μm or less, it is easier to ensure the luminance at the time of light emission of the optical semiconductor element.

The thickness of the third sealing layer is preferably 30 to 480 μm, more preferably 40 to 380 μm, still more preferably 50 to 280 μm. When the thickness of the third sealing layer is 30 μm or more, the sealing property of the semiconductor element becomes better. When the thickness of the 3rd sealing layer is 480 micrometers or less, when peeling off adjacent optical semiconductor devices in a tiling state, defect of the optical-semiconductor element sealing sheet or sticking of adjacent optical semiconductor device sheets is more difficult to occur.

The thickness of the sealing portion (for example, a laminate having the first sealing layer and the third sealing layer as both end surfaces) is, for example, 100 to 500 μm, preferably 120 to 400 μm, more preferably is 150 to 300 μm. When the said thickness is 100 micrometers or more, the sealing property of an optical semiconductor element becomes more favorable. When the thickness is 500 μm or less, the handling properties as a sheet and the reworkability in the tiling step become better, and stickiness on the side surfaces is less likely to occur.

In the case of the resin layer, the first sealing layer, the second sealing layer, and the third sealing layer are, for example, coated with a resin composition forming each layer on the release treatment surface of the release liner to form a resin composition layer, It can be produced by removing the solvent by heating or by irradiating active energy rays to polymerize the monomer components, and further heating if necessary to solidify the resin composition layer.

Any form may be sufficient as the said resin composition. For example, the resin composition (adhesive composition) in the case where the resin layer is an adhesive layer may be of an emulsion type, a solvent type (solution type), an active energy ray curing type, or a heat melting type (hot melt type). Among them, a solvent type and an active energy ray curing type are preferable from the viewpoint of being easy to obtain an adhesive layer having excellent productivity.

As the resin composition, for example, a resin composition containing a resin as an essential component, or a mixture of monomers (monomer components) constituting the resin (sometimes referred to as "monomer mixture") or a partial polymer thereof as an essential component A resin composition etc. are mentioned. As the former, so-called solvent type resin compositions etc. are mentioned, for example. also. Examples of the latter include so-called active energy ray-curable resin compositions. The above "monomer mixture" means a mixture containing the monomer components constituting the polymer. In addition, the said "partially polymerized material" is sometimes called a "prepolymer", "syrup", etc., and means a composition in which one or two or more monomer components in the said monomer mixture are partially polymerized.

The said resin composition can be produced by a well-known or common method. For example, a solvent-type resin composition can be produced by mixing additives such as a colorant and light-diffusing fine particles with a solution containing the resin as necessary. For example, an active energy ray-curable resin composition can be produced by mixing an additive as necessary with a mixture of monomer components or a partial polymer thereof constituting the resin.

In addition, you may use a well-known coating method for application|coating (coating) of the said resin composition. For example, a coater such as a gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, spray coater, comma coater, or direct coater may be used.

The heat-drying temperature of the solvent-type resin composition is preferably 40 to 200°C, more preferably 50 to 180°C, still more preferably 70 to 170°C. The drying time is, for example, 5 seconds to 20 minutes, preferably 5 seconds to 10 minutes, more preferably 10 seconds to 5 minutes, although any suitable time can be employed as appropriate.

When forming a resin layer by active energy ray irradiation, while manufacturing the said resin from the said monomer component, a resin layer can be formed. As for the above-mentioned monomer component, at the time of active energy ray irradiation, what was polymerized in advance and made into syrup can be used. For ultraviolet irradiation, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, or the like can be used.

(Ministry of Finance)

The substrate portion serves as a support for the encapsulation portion in the optical semiconductor element encapsulation sheet, and by providing the substrate portion, the handleability of the optical semiconductor element encapsulation sheet is excellent. The base material portion may be a single layer or may be a multi-layer structure having the same or different composition or thickness. When the said base material part is multi-layered, each layer may be joined by another layer, such as an adhesive layer. In addition, the base material layer used for the base material part is a part affixed to the board|substrate provided with the optical semiconductor element together with a sealing part, when sealing an optical semiconductor element using the sheet|seat for optical semiconductor element encapsulation, for optical semiconductor element encapsulation A release liner that is peeled off during use of the sheet (at the time of sticking) and a surface protection film that only protects the surface of the substrate portion are not included in the "substrate portion". The substrate portion is laminated on the third sealing layer, for example.

As a base material layer which comprises the said base material part, glass, a plastic base material (especially plastic film), etc. are mentioned, for example. Examples of the resin constituting the plastic substrate include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerization polypropylene, block copolymerization polypropylene, homopolyprolene, polybutene, and polypropylene. Methylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer , polyolefin resins such as ethylene-butene copolymers and ethylene-hexene copolymers; Polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); polycarbonate; polyimide-based resin; polyether ether ketone; polyetherimide; polyamides such as aramid and wholly aromatic polyamide; polyphenylsulfide; fluororesins; polyvinyl chloride; polyvinylidene chloride; cellulosic resins such as triacetyl cellulose (TAC); silicone resin; acrylic resins such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; Polyvinyl acetate etc. are mentioned. As for the said resin, only 1 type may be used and 2 or more types may be used.

The base material layer may be various optical films such as an antireflection (AR) film, a polarizing plate, or a retardation plate. When the base material portion has an optical film, the optical semiconductor element encapsulating sheet can be applied as it is to an optical member.

The thickness of the plastic film is preferably 20 to 200 μm, more preferably 40 to 150 μm. When the said thickness is 20 micrometers or more, the supportability and handleability of the sheet|seat for optical-semiconductor element encapsulation improve more. If the said thickness is 200 micrometers or less, the thickness of the sheet|seat for optical-semiconductor element sealing can be made thin, and an optical semiconductor device can be made thinner.

The surface of the substrate portion on the side provided with the sealing portion is subjected to, for example, corona discharge treatment, plasma treatment, sand mat processing, ozone exposure treatment, and flame exposure treatment for the purpose of enhancing adhesion to the sealing portion, retention, and the like. , high-voltage electric shock exposure treatment, physical treatment such as ionizing radiation treatment; chemical treatment such as chromic acid treatment; Surface treatment such as adhesion facilitating treatment by a coating agent (undercoat agent) may be performed. It is preferable that the surface treatment for enhancing adhesion is performed on the entire surface of the sealing part side in the base material part.

The thickness of the substrate portion is preferably 5 μm or more, and more preferably 10 μm or more, from the viewpoint of functioning as a support and excellent surface scratch resistance. The thickness of the substrate portion is preferably 300 μm or less, more preferably 200 μm or less, from the viewpoint of more excellent transparency.

(Sheet for sealing optical semiconductor elements)

The optical semiconductor element sealing sheet may include a layer having antiglare properties and/or antireflection properties. By having such a structure, when the said optical semiconductor device is applied to a display, the gloss of a display and reflection of light can be suppressed and the aesthetic appearance of a display can be improved more. As the layer having the antiglare property, an antiglare treatment layer may be mentioned. An antireflection treatment layer is exemplified as the layer having the antireflection property. Antiglare treatment and antireflection treatment can be carried out by known or common methods, respectively. The layer having antiglare properties and the layer having antireflection properties may be the same layer or may be different layers. The layer having antiglare properties and/or antireflection properties may have only one layer, or may have two or more layers.

The haze value (initial haze value) of the sheet for encapsulating optical semiconductor elements is not particularly limited, but is preferably 80% or more, more preferably 85% or more, from the viewpoint of improving the effect of suppressing luminance unevenness and designability. % or more, more preferably 90% or more, particularly preferably 95% or more. In addition, the upper limit of the said haze value is not specifically limited. When the sheet for encapsulating optical semiconductor elements includes a radiation curable resin layer, the haze value may be a value before curing of the radiation curable resin layer or a value after curing.

The total light transmittance of the optical semiconductor element sealing sheet is not particularly limited, but is preferably 30% or less from the viewpoint of further improving the antireflection function and contrast of metal wiring or the like in the optical semiconductor device, more preferably 20% or less, more preferably 5% or less. Moreover, it is preferable that the said total light transmittance is 0.5 % or more from a viewpoint of ensuring the luminance of an optical semiconductor device. When the sheet for encapsulating optical semiconductor elements includes a radiation curable resin layer, the total light transmittance may be a value before curing of the radiation curable resin layer or a value after curing.

The haze value and total light transmittance of the sheet for encapsulating optical semiconductor elements can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and the lamination order of the layers constituting the optical semiconductor element encapsulating sheet It can be controlled by type, thickness, etc.

L ^* (SCI) and/or L ^* (SCE) measured from the third sealing layer side in a state where the first sealing layer of the optical semiconductor element sealing sheet is bonded to the aluminum foil is preferably 60 or less, more preferably is less than 50, more preferably less than 40. The light reflected by the object includes regular reflection light and diffuse reflection light, and the regular reflection light is difficult to perceive with the eyes. L ^* (SCE) is a measurement of reflected light not including regular reflected light, and when L ^* (SCE) is 60 or less, the designability when the image display device is visually recognized is excellent. On the other hand, L ^* (SCI) is a measure of reflected light including regular reflected light, and although it has little relation to eye visibility, it is possible to measure a color tone close to the true color tone of an object. For this reason, if L ^* (SCI) is 60 or less, it is excellent in designability even when there is an influence by the environment with respect to the visibility of an image display apparatus. Further, in the state where the first sealing layer is bonded to the aluminum foil, L ^* (SCI) measured from the third sealing layer side is "L ^* (SCI) (1)", and L ^* (SCE) is "L ^* (SCE) (1)” in some cases. L ^* (SCI)(1) and L ^* (SCE)(1) can be specifically measured by the method described in Examples.

A convex sample of 20 mm long x 20 mm wide x 62 µm thick and having an aluminum foil on the surface of the first sealing layer of the optical semiconductor element sealing sheet is placed on a substrate having a larger size than the convex sample, and the sheet L ^* (SCI) and/or L ^* (SCE) measured from the side of the third sealing layer in a state where the convex sample is bonded to the substrate and the convex sample so as to cover the convex sample is preferably 60 or less, more preferably less than 50 , more preferably less than 40. When L ^* (SCE) is 60 or less, the designability when the image display device is visually recognized is further excellent. When L ^* (SCI) is 60 or less, the designability is further excellent even when the visibility of the image display device is affected by the environment. Further, in the state where the first sealing layer is bonded to the convex sample, L ^* (SCI) measured from the third sealing layer side is "L ^* (SCI) (2)", and L * (SCE) is " ^{L * (} SCE) ) (2)”. L ^* (SCI) (2) and L ^* (SCE) (2) can be specifically measured by the method described in Examples.

The ratio of L ^* (SCI)(2) to L ^{*(SCI)(1) [L* (} SCI)(2)/L ^* (SCI)(1)] of the optical semiconductor element sealing sheet is 1.2 It is preferably less than or equal to, more preferably 1.1 or less, still more preferably 1.05 or less. When the said ratio is 1.2 or less, it is excellent in designability even when the level difference by an optical semiconductor element is high.

The ratio of L ^* (SCE)(2) to L ^{*(SCE)(1) [L* (} SCE)(2)/L ^* (SCE)(1)] of the optical semiconductor element sealing sheet is 1.2 It is preferably less than or equal to, more preferably 1.1 or less, still more preferably 1.05 or less. When the said ratio is 1.2 or less, it is excellent in designability even when the level difference by an optical semiconductor element is high.

The closer L ^* (SCI) and L ^* (SCE) are to 1, the better the design. In the present specification, L ^* (SCI) and L ^* (SCE) can be measured using a known or conventional spectrophotometer. When the sheet for encapsulating optical semiconductor elements includes a radiation curable resin layer, it is preferable to measure the radiation curable resin layer in a state closer to the state at the time of use, so that the value after curing of the radiation curable resin layer is preferably within the above range. do. In addition, the value before curing of the radiation curable resin layer may be within the above range.

The circular diameter measured by the light diffusion effect confirmation test described below using a measurement sample in which the first sealing layer of the optical semiconductor element encapsulating sheet is bonded to a glass plate is preferably 5.0 cm or more, more preferably 5.5 cm. or more, more preferably 6.0 cm or more. When the diameter of the circular shape is 5.0 cm or more, the luminance non-uniformity is further suppressed.

<Light Diffusion Effect Confirmation Test>

When an LED lamp is installed on the screen, a glass plate is brought into close contact with the LED lamp, and light is irradiated from the LED lamp onto the screen through the glass plate, the position where a circular light having a diameter of 4.0 cm appears on the screen is indicated by the LED. position of the lamp. Then, in a state where the glass plate side of the measurement sample in which the first sealing layer of the optical semiconductor element encapsulating sheet was bonded to the glass plate was brought into close contact with the LED lamp, the glass plate and the optical semiconductor element encapsulating sheet were interposed from the LED lamp onto the screen. Measure the diameter of the circular light that appears when irradiated with light.

The thickness of the optical semiconductor element sealing sheet of the present invention is preferably 10 to 600 μm from the viewpoint of more efficiently reducing color cast while improving the antireflection function and contrast of metal wiring or the like in an image display device. And, more preferably 20 to 550㎛, still more preferably 30 to 500㎛, still more preferably 40 to 450㎛, particularly preferably 50 to 400㎛. Further, when the sheet for encapsulating optical semiconductor elements of the present invention includes a base material portion, the base material portion is included in the thickness of the sheet for encapsulating optical semiconductor elements of the present invention, but the release liner does not exceed the thickness of the sheet for encapsulating optical semiconductor elements of the present invention. to be not included.

ADVANTAGE OF THE INVENTION According to the sheet|seat for optical-semiconductor element encapsulation of this invention, in the state which sealed optical semiconductor elements, it is excellent in design, and brightness nonuniformity does not occur easily. Therefore, by using the optical semiconductor element sealing sheet of the present invention, the aesthetic appearance is good when the optical semiconductor element is not lit, and the light emitted from the optical semiconductor element is efficiently diffused when the optical semiconductor element is lit. An optical semiconductor device capable of passing through in a state can be provided.

[Releasable liner]

The release liner is an element for covering and protecting the surface of the sheet for encapsulating optical semiconductor elements, and when bonding the sheet for encapsulating optical semiconductor elements to a substrate on which optical semiconductor elements are disposed, it is peeled off from the sheet.

Examples of the release liner include polyethylene terephthalate (PET) films, polyethylene films, polypropylene films, plastic films and papers surface-coated with release agents such as fluorine-based release agents and long-chain alkyl acrylate-based release agents.

The release liner has a thickness of, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, it is difficult to break by incision during processing of the release liner. If the said thickness is 200 micrometers or less, at the time of use, it will be easy to peel the release liner from the said sheet|seat for optical-semiconductor element sealing.

[Method for Manufacturing Sheet for Optical Semiconductor Element Encapsulation]

One Embodiment of the manufacturing method of the sheet|seat for optical semiconductor element sealing of this invention is described. For example, the sheet 1 for optical semiconductor element encapsulation shown in FIG. 1 is, for example, as described above, the first sealing layer 21 sandwiched between the release treatment surfaces of two release liners, respectively. ), the second sealing layer 22 and the third sealing layer 23 are individually produced. One release liner bonded to the first sealing layer 21 is the release liner 3 .

Next, one side of the release liner affixed to the third sealing layer 23 is peeled off to expose the surface of the third sealing layer 23, and the exposed surface is bonded to the substrate portion 4. After that, one side of the release liner attached to the second sealing layer 22 is peeled off, and the release liner on the surface of the third sealing layer 23 is peeled off, and the second sealing layer is applied to the exposed third sealing layer 23 surface. Bond the exposed surface of (22).

Next, one side of the release liner (a release liner that is not the release liner 3) attached to the first sealing layer 21 is peeled off, and the release liner on the surface of the second sealing layer 22 is peeled off to expose the second The exposed surface of the first sealing layer 21 is bonded to the surface of the sealing layer 22 . In addition, lamination of various layers can be performed using a well-known roller or laminator. In this way, the third sealing layer 23, the second sealing layer 22, the first sealing layer 21 and the release liner 3 are laminated in this order on the substrate portion 4, in FIG. The illustrated sheet 1 for optical semiconductor element sealing can be produced.

An optical semiconductor device can be obtained by bonding a 1st sealing layer on the board|substrate on which optical semiconductor elements were arrange|positioned using the sheet|seat for optical semiconductor device sealing of this invention, and sealing an optical semiconductor element. Specifically, first, the release liner is peeled from the sheet for optical semiconductor element sealing of the present invention to expose the first sealing layer. Then, the sheet for encapsulating optical semiconductor elements of the present invention is applied to the substrate surface on which the optical semiconductor elements are disposed, of an optical member including a substrate and optical semiconductor elements (preferably a plurality of optical semiconductor elements) disposed on the substrate. The first sealing layer surface, which is the exposed surface, is bonded, and when the optical member is provided with a plurality of optical semiconductor elements, it is further arranged so that the radiation first sealing layer fills the gap between the plurality of optical semiconductor elements, and the plurality of light The semiconductor elements are collectively sealed. In this way, an optical semiconductor element can be sealed using the sheet|seat for optical semiconductor device sealing of this invention. Moreover, you may seal an optical semiconductor element by bonding in a reduced-pressure environment or pressurizing using the sheet|seat for optical semiconductor device sealing of this invention. As such a method, the method disclosed in Unexamined-Japanese-Patent No. 2016-29689 or Unexamined-Japanese-Patent No. 6-97268 is mentioned, for example.

[Optical Semiconductor Device]

An optical semiconductor device can be produced using the sheet for optical semiconductor element sealing of the present invention. An optical semiconductor device manufactured using the optical semiconductor element encapsulating sheet of the present invention is a substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element encapsulating sheet of the present invention for sealing the optical semiconductor element, or A cured product obtained by curing the sheet is provided. The cured product is a cured product obtained by curing the radiation curable resin layer by irradiation of radiation in the case where the sheet for encapsulating optical semiconductor elements of the present invention includes a radiation curable resin layer.

As said optical semiconductor element, light emitting diodes (LED), such as a blue light emitting diode, a green light emitting diode, a red light emitting diode, and an ultraviolet light emitting diode, are mentioned, for example.

In the above optical semiconductor device, the optical semiconductor element sealing sheet of the present invention is excellent in followability to irregularities when the optical semiconductor elements are convex portions and the gaps between a plurality of optical semiconductor elements are concave portions, and the followability of optical semiconductor elements And since it is excellent in embedding property, it is preferable to enclose a plurality of optical semiconductor elements collectively.

In FIG. 2, one Embodiment of the optical semiconductor device using the sheet|seat 1 for optical-semiconductor element sealing shown in FIG. 1 is shown. The optical semiconductor device 10 shown in FIG. 2 includes a substrate 5, a plurality of optical semiconductor elements 6 arranged on one surface of the substrate 5, and light sealing the optical semiconductor element 6. A sheet 1 for sealing semiconductor elements is provided. The sheet|seat 1 for optical-semiconductor element encapsulation is what the peeling liner 3 peeled from the sheet|seat 1 for optical-semiconductor element encapsulation shown in FIG. The plurality of optical semiconductor elements 6 are collectively sealed by the sealing portion. The 1st sealing layer 21 adheres to the optical semiconductor element 6 and the board|substrate 5 following the concavo-convex shape formed by the several optical semiconductor element 6, and embeds the optical semiconductor element 6.

In the optical semiconductor device 10 shown in FIG. 2 , the optical semiconductor element 6 is completely embedded and sealed in the first sealing layer 21, and furthermore, the second sealing layer 22 and the third It is indirectly sealed by the sealing layer 23. That is, the optical semiconductor element 6 is sealed by the sealing part 2 which consists of a laminated body of the 1st sealing layer 21, the 2nd sealing layer 22, and the 3rd sealing layer 23. The said optical semiconductor device is not limited to this aspect, A part of the optical semiconductor element 6 protrudes from the 1st sealing layer 21, and the said part is the 2nd sealing layer 22 or the 2nd sealing layer 22 and the third sealing layer 23, the first sealing layer 21 and the second sealing layer 22, or the first sealing layer 21, the second sealing layer 22 and An aspect in which the optical semiconductor element 6 is completely embedded and sealed by the three-sealing layer 23 may be used.

As for the said optical semiconductor device, what each optical semiconductor device tiled may be sufficient as it. That is, as for the said optical semiconductor device, the several optical semiconductor device arrange|positioned tile-like in the planar direction may be sufficient as it.

An embodiment of an optical semiconductor device produced by arranging a plurality of optical semiconductor devices in FIG. 3 is shown. In the optical semiconductor device 20 shown in FIG. 3 , a total of 16 optical semiconductor devices 10, 4 in the vertical direction and 4 in the lateral direction, are tiled (tiled) in the planar direction. At the boundary 20a between two adjacent optical semiconductor devices 10, the optical semiconductor devices 10 adjoin each other.

It is preferable that the said optical semiconductor device is a backlight of a liquid crystal screen, and it is especially preferable that it is a front direct type backlight. Further, by combining the backlight and the display panel, an image display device can be obtained. The optical semiconductor element in case the said optical semiconductor device is a backlight of a liquid crystal screen is an LED element. For example, in the backlight, a metal wiring layer for sending a light emission control signal to each LED element is laminated on the substrate. Each LED element emitting light of each color of red (R), green (G), and blue (B) is alternately arranged on a substrate of a display panel with a metal wiring layer interposed therebetween. The metal wiring layer is formed of a metal such as copper, reflects the light emission of each LED element, and reduces the visibility of the image. In addition, the light emitted from each LED element of each color of RGB is mixed in color, and the contrast is lowered.

Moreover, it is preferable that the said optical semiconductor device is a self-emission type display device. In addition, an image display device can be obtained by combining the self-luminous display device and a display panel as necessary. An optical semiconductor element in the case where the optical semiconductor device is a self-luminous display device is an LED element. Examples of the self-luminous display device include an organic electroluminescent (organic EL) display device and the backlight. For example, in the self-emissive type display device, a metal wiring layer for sending an emission control signal to each LED element is laminated on the substrate. Each LED element emitting light of each color of red (R), green (G), and blue (B) is alternately arranged on a substrate with a metal wiring layer interposed therebetween. The metal wiring layer is formed of a metal such as copper, and displays each color by adjusting the degree of light emission of each LED element.

The sheet for encapsulating optical semiconductor elements of the present invention is suitable for an optical semiconductor device that is bent and used, for example, an optical semiconductor device having a bendable image display device (flexible display) (particularly, a foldable image display device (foldable display)). can be used Specifically, it can be used for a foldable backlight and a foldable self-emission type display device.

Since the sheet for encapsulating optical semiconductor elements of the present invention is excellent in trackability and embedding of optical semiconductor elements, it can be suitably used in both cases where the optical semiconductor device is a mini LED display device and a micro LED display device. there is.

[Method for Manufacturing Optical Semiconductor Device]

The optical semiconductor device is, for example, a cured product obtained by curing a substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element encapsulating sheet or radiation curable resin layer of the present invention for sealing the optical semiconductor element. It can manufacture by the manufacturing method provided with at least the dicing process which dices the laminated body provided and obtains an optical semiconductor device. The cured product is a cured product obtained by curing the sheet for encapsulating optical semiconductor elements of the present invention by radiation, and specifically, the radiation-curable resin layer that the sheet for encapsulating optical semiconductor elements of the present invention can be provided is exposed to radiation. It has a cured product cured by

In the manufacturing method, a laminate comprising the substrate, optical semiconductor elements disposed on the substrate, and the optical semiconductor element encapsulating sheet for sealing the optical semiconductor element is irradiated with radiation to form the radiation curable resin layer. You may further include the radiation irradiation process which hardens and obtains the said hardened|cured material.

Even if the manufacturing method includes, before the radiation irradiation step, a sealing step of bonding the optical semiconductor element sealing sheet to the optical semiconductor element provided on the substrate and sealing the optical semiconductor element with the sealing part. do.

Moreover, the said manufacturing method may further be equipped with the tiling process of arranging so that the some optical semiconductor device obtained at the said dicing process may be contacted in a plane direction. Hereinafter, the manufacturing method of the optical semiconductor device 10 shown in FIG. 2 and the optical semiconductor device 20 shown in FIG. 3 is demonstrated taking into consideration suitably.

(Sealing process)

In the sealing step, the optical semiconductor element sealing sheet of the present invention is bonded to the substrate on which the optical semiconductor element is arranged, and the optical semiconductor element is sealed by the sealing portion. In the said sealing process, as shown in FIG. 4 specifically, the 1st sealing layer 21 of the sheet|seat 1 for optical-semiconductor element sealing from which the peeling liner 3 was peeled was made into the optical semiconductor of the board|substrate 5 Arranged so as to face the surface on which the element 6 was arranged, and the sheet 1 for optical semiconductor element encapsulation was bonded to the surface of the substrate 5 on which the optical semiconductor element 6 was arranged, as shown in FIG. The optical semiconductor element 6 is embedded in the sealing portion 2.

When the optical semiconductor element sealing sheet 1 includes a radiation curable resin layer, as shown in FIG. 4 , the substrate 5 used for bonding is in the optical semiconductor device 10 shown in FIG. 2 It extends wider in the plane direction than the board|substrate 5 of this, and the optical semiconductor element 6 is not arrange|positioned near the edge part of the board|substrate 5. In addition, in this case, the sheet|seat 1 for optical-semiconductor element sealing to be bonded extends wider than the board|substrate 5 used for bonding in the plane direction. That is, the area of the surface of the sheet 1 for optical semiconductor element encapsulation bonded in the sealing step facing the substrate 5 is the area of the sheet 1 for optical semiconductor element encapsulation of the substrate 5 bonded in the sealing process. is greater than the area of the side opposite to This sufficiently advances curing in the later irradiation step in the region used for the optical semiconductor device in the laminate of the sheet 1 for optical semiconductor element encapsulation and the substrate 5, and the sheet for optical semiconductor element encapsulation ( This is because 1) and the vicinity of the end portions of the substrate 5 where there is a possibility of insufficient hardening are diced and removed in a later dicing process.

The temperature at the time of the said bonding is within the range of room temperature to 110 degreeC, for example. In addition, you may reduce pressure or pressurize at the time of the said bonding. Formation of a void between the sealing portion and the substrate or the optical semiconductor element can be suppressed by depressurization or pressurization. Moreover, in the said sealing process, it is preferable to bond the optical-semiconductor element sealing sheet under reduced pressure, and to pressurize after that. The pressure in the case of reducing pressure is, for example, 1 to 100 Pa, and the pressure reduction time is, for example, 5 to 600 seconds. In addition, the pressure in the case of pressurizing is 0.05-0.5 Mpa, for example, and the pressure reduction time is 5-600 second, for example.

(Irradiation process)

In the radiation irradiation step, radiation is irradiated to a laminate in which the optical semiconductor element encapsulating sheet is bonded to the substrate on which the optical semiconductor element is disposed (for example, the laminate obtained in the encapsulation step), The radiation curable resin layer is cured. Examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, X rays, and the like, as described above. Among them, ultraviolet rays are preferable. The temperature during irradiation is, for example, within the range of room temperature to 100°C, and the irradiation time is, for example, 1 minute to 1 hour.

(dicing process)

In the dicing step, a substrate, an optical semiconductor element disposed on the substrate, and a cured product obtained by curing the optical semiconductor element encapsulating sheet or radiation curable resin layer of the present invention for sealing the optical semiconductor element are provided. The laminate is diced. Here, in the case where the laminate includes the cured product, in the laminate subjected to the dicing step, the cured product of the optical semiconductor element sealing sheet and the substrate 5 are the optical semiconductor finally obtained as described above. It extends wider in the plane direction than the device 10 . And, in the said dicing process, the hardened|cured material of the optical-semiconductor element sealing sheet and the side edge part of a board|substrate are diced and removed. Specifically, dicing is performed at the position of the dashed line shown in FIG. 6 to remove the side end portion. The dicing can be performed by a known or common method, for example, a method using a dicing blade or laser irradiation. In this way, the optical semiconductor device 10 shown in FIG. 2 can be manufactured, for example.

(Tiling process)

In the tiling step, tiling is performed by arranging a plurality of optical semiconductor devices obtained in the dicing step so as to be in contact with each other in the plane direction. In this way, the optical semiconductor device 20 shown in FIG. 3 can be manufactured, for example.

[Example]

The present invention will be explained in more detail by way of examples below, but the present invention is not limited at all by these examples.

Preparation Example 1

(Preparation of non-diffusion functional layer 1)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. After adding 1.5 parts by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals Co., Ltd., solid content: 75% by mass) to 100 parts by mass of this partial polymer in terms of solid content, these were mixed uniformly A photopolymerizable composition was prepared.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, ultraviolet light having an intensity of 5 mW/cm 2 was irradiated with a black light until the cumulative amount of light reached 3600 mJ/cm 2 to perform polymerization, thereby producing a non-diffusion functional layer 1 as an adhesive layer.

Preparation Example 2

(Production of colored layer 1)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. To 100 parts by mass of this partial polymer, 0.1 part by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals, Inc., 75 mass% solid content) in terms of solid content and a black pigment dispersion (trade name “9050Black”, After adding 9.2 mass parts of (made by Tokushiki Co., Ltd.), these were mixed uniformly and the photopolymerizable composition was prepared.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, with a black light, ultraviolet rays having an intensity of 5 mW/cm 2 were irradiated until the cumulative amount of light reached 3600 mJ/cm 2 to perform polymerization, thereby producing a colored layer 1 as an adhesive layer.

Preparation Example 3

(Preparation of diffusion functional layer 1)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. To 100 parts by mass of this partial polymer, 0.1 part by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals Co., Ltd., solid content 75% by mass) in terms of solid content and titanium oxide (trade name “Tipure R706”, After adding 3 parts by mass of DuPont Co., Ltd., refractive index: about 2.5, average particle diameter: 0.36 µm), these were mixed uniformly to prepare a photopolymerizable composition.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, ultraviolet light having an intensity of 5 mW/cm 2 was irradiated with a black light until the cumulative amount of light reached 3600 mJ/cm 2 , and polymerization was performed to prepare diffusion functional layer 1 as an adhesive layer.

Production Example 4

(Preparation of diffusion functional layer 2)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. To 100 parts by mass of this partial polymer, 1.5 parts by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals Co., Ltd., solid content: 75 mass%) in terms of solid content and titanium oxide (trade name “Tipure R706”, After adding 3 parts by mass of DuPont Co., Ltd., refractive index: about 2.5, average particle diameter: 0.36 µm), these were mixed uniformly to prepare a photopolymerizable composition.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, ultraviolet rays having an intensity of 5 mW/cm 2 were irradiated with a black light until the cumulative amount of light reached 3600 mJ/cm 2 to perform polymerization, thereby producing a diffusion functional layer 2 as an adhesive layer.

Preparation Example 5

(Preparation of non-diffusion functional layer 2)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. To 100 parts by mass of this partial polymer, after adding 0.1 part by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals Co., Ltd., solid content: 75% by mass) in terms of solid content, these were mixed uniformly A photopolymerizable composition was prepared.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, ultraviolet rays having an intensity of 5 mW/cm 2 were irradiated with a black light until the cumulative light amount became 3600 mJ/cm 2 , and polymerization was performed to prepare a non-diffusion functional layer 2 as an adhesive layer.

Preparation Example 6

(Preparation of diffusion functional layer 3)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. To 83 parts by mass of this partial polymer, 1.2 parts by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals Co., Ltd., 75 mass% solid content) in terms of solid content, silicone resin (trade name “Tospearl 145”) , manufactured by Momentive Performance Materials Japan Co., Ltd., refractive index: 1.42, average particle diameter: 4.5 µm), 30 parts by mass, 3-phenoxybenzyl acrylate (trade name "Light Acrylate POB-A", Kyoeisha Chemical Co., Ltd.) after adding 16 mass parts and 1 mass part of brand name "Omnirad 651", these were mixed uniformly and the photopolymerizable composition was prepared.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, ultraviolet light having an intensity of 5 mW/cm 2 was irradiated with a black light until the cumulative amount of light reached 3600 mJ/cm 2 , and polymerization was performed to prepare a diffusion functional layer 3 as an adhesive layer.

Preparation Example 7

(Production of colored layer 2)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. To 100 parts by mass of this partial polymer, 1.2 parts by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals Co., Ltd., 75 mass% solid content) and a black pigment dispersion (trade name “9050Black”, in terms of solid content) were added to 100 parts by mass of this partial polymer. After adding 9.2 mass parts of (made by Tokushiki Co., Ltd.), these were mixed uniformly and the photopolymerizable composition was prepared.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, with a black light, ultraviolet rays having an intensity of 5 mW/cm 2 were irradiated until the cumulative amount of light reached 3600 mJ/cm 2 , and polymerization was performed to prepare a colored layer 2 as an adhesive layer.

Preparation Example 8

(Preparation of diffusion functional layer 4)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. To 83 parts by mass of this partial polymer, 0.08 parts by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals Co., Ltd., solid content 75% by mass) in terms of solid content, silicone resin (trade name “Tospearl 145”) , manufactured by Momentive Performance Materials Japan Co., Ltd., refractive index: 1.42, average particle diameter: 4.5 µm), 30 parts by mass, 3-phenoxybenzyl acrylate (trade name "Light Acrylate POB-A", Kyoeisha Chemical Co., Ltd.) after adding 16 mass parts and 1 mass part of brand name "Omnirad 651", these were mixed uniformly and the photopolymerizable composition was prepared.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, ultraviolet rays having an intensity of 5 mW/cm 2 were irradiated with a black light until the cumulative amount of light reached 3600 mJ/cm 2 to perform polymerization, thereby producing a diffusion functional layer 4 as an adhesive layer.

Preparation Example 9

(Preparation of non-diffusion functional layer 3 having ultraviolet curing properties)

189.77 parts by mass of butyl acrylate (BA), 38.04 parts by mass of cyclohexyl acrylate (CHA), 85.93 parts by mass of 2-hydroxyethyl acrylate (HEA), and 0.94 mass parts of 2,2'-azobisisobutyronitrile as a polymerization initiator polymerization solvent, and 379.31 parts by mass of methyl ethyl ketone as a polymerization solvent, in a 1 L round-bottom separable flask, a separable cover, a separatory funnel, a thermometer, a nitrogen inlet tube, a Libith condenser, a vacuum seal, a stirring bar, and a stirring blade. The mixture was put into an experimental apparatus for use, and was purged with nitrogen at room temperature for 6 hours while stirring. Thereafter, polymerization was carried out by holding at 65°C for 4 hours and at 75°C for 2 hours while stirring under nitrogen flow, and a resin solution was obtained.

Next, the obtained resin solution was cooled to room temperature. Thereafter, 5.74 mass of 2-isocyanatoethyl methacrylate (MOI) (trade name "Karenz MOI", manufactured by Showa Denko Co., Ltd.) was added to the resin solution as a compound having a polymerizable carbon-carbon double bond. Wealth was added. Further, 0.03 parts by mass of dibutyltin (IV) dilaurate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added, and the mixture was stirred under an air atmosphere at 50°C for 24 hours to obtain a base polymer.

1.5 parts by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals, Inc., 75% by mass solid content) with respect to 100 parts by mass solid content of the obtained base polymer, and 2,2-dimethoxy-1, 1 part by mass of 2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) was mixed. Toluene was used as a diluting solvent, and the solid content was adjusted to 20 to 40% by mass to obtain an adhesive solution.

The pressure-sensitive adhesive solution was applied to the treated surface of a release liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film on one side of which release treatment was performed, thickness of 50 μm), and the thickness after drying was 50 μm. It was coated as much as possible, and heated and dried at 50° C. for 1 minute and 125° C. for 5 minutes under normal pressure to form a resin layer. Thereafter, the release treatment surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was bonded to the surface of the resin layer. Thereafter, heating was applied at 50°C for 48 hours under shading to produce a non-diffusion functional layer 3 having ultraviolet curability and being an adhesive layer.

Example 1

(Manufacture of Sheet for Optical Semiconductor Element Sealing)

The release liner (trade name "MRF38") was peeled from the non-diffusion functional layer 1 obtained in Production Example 1 to expose the adhesive face. The exposed surface of the non-diffusion functional layer 1 is a base film (trade name "Diafoil T912E75 (UE80-)", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film, one side of which is treated to facilitate adhesion, thickness 75 μm) was bonded to the adhesion-facilitating surface of the substrate film to form a third sealing layer composed of the non-diffusion functional layer 1.

Next, the release liner (trade name "MRA50") was peeled off from the surface of the third sealing layer (non-diffusion functional layer 1) to expose the adhesive face. The adhesive surface exposed by peeling off the release liner (trade name "MRF38") from the colored layer 1 obtained in Production Example 2 is bonded to the exposed surface of the third sealing layer, and the second sealing layer composed of the colored layer 1 is attached to the third sealing layer. A sealing layer was formed.

Next, the release liner (trade name "MRA50") was peeled off from the surface of the second sealing layer (colored layer 1) to expose the adhesive face. The adhesive surface exposed by peeling off the release liner (trade name "MRF38") from the diffusion functional layer 1 obtained in Production Example 3 is bonded to the exposed surface of the second sealing layer, and the diffusion functional layer 1 is formed on the second sealing layer. A first sealing layer was formed.

Then, at room temperature (23°C), they were bonded together so as not to contain air bubbles with a hand roller, and left to stand for 2 days under light shielding. In this way, a sheet for encapsulating optical semiconductor elements composed of [release liner/diffusion functional layer 1/coloring layer 1/non-diffusion functional layer 1/base film] was obtained.

Examples 2 to 8, Comparative Examples 1 to 2

(Manufacture of Sheet for Optical Semiconductor Element Sealing)

As a 1st sealing layer, a 2nd sealing layer, and a 3rd sealing layer, except having formed the layer shown in Table 1 or Table 2, it carried out similarly to Example 1, and obtained the sheet|seat for optical semiconductor element sealing.

Comparative Example 3

(Production of colored layer 3)

67 parts by mass of butyl acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 27 parts by mass of 4-hydroxybutyl acrylate (4HBA), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 2,2 -Dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 0.05 parts by mass, and 1-hydroxy-cyclohexyl-phenyl-ketone (trade name "omnirad 184"; IGM Resins Italia Srl) 0.05 mass part was injected|thrown-in to a 4-necked flask, and it exposed to ultraviolet rays in a nitrogen atmosphere and partially photopolymerized, and obtained the partially polymerized product (monomer syrup) of 10% of polymerization rate. To 100 parts by mass of this partial polymer, 0.1 part by mass of an isocyanate compound (trade name “Takenate D-101A”, manufactured by Mitsui Chemicals, Inc., 75 mass% solid content) in terms of solid content and a black pigment dispersion (trade name “9050Black”, After adding 2 mass parts of (made by Tokushiki Co., Ltd.), these were mixed uniformly and the photopolymerizable composition was prepared.

The photopolymerizable composition was applied on the peeling treated surface of a peeling liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to peeling treatment on one side, thickness 50 µm) to form a resin composition layer After forming, the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was also bonded onto the resin composition layer. Next, ultraviolet rays having an intensity of 5 mW/cm 2 were irradiated with a black light until the cumulative light amount reached 3600 mJ/cm 2 , and polymerization was performed to prepare a colored layer 3 (thickness: 150 μm) as an adhesive layer.

(Manufacture of Sheet for Optical Semiconductor Element Sealing)

The release liner (trade name "MRF38") was peeled off from the colored layer 3 to expose the adhesive face. The exposed surface of the colored layer 3 is a base film (trade name "Diafoil T912E75 (UE80-)", manufactured by Mitsubishi Chemical Corporation, one side of a polyethylene terephthalate film subjected to an adhesion-facilitating treatment, thickness 75 μm) It was bonded to the adhesion-facilitating treated surface to form a sealing layer composed of the colored layer 3 on the base film.

Then, at room temperature (23°C), they were bonded together so as not to contain air bubbles with a hand roller, and left to stand for 2 days under light shielding. Thus, a sheet for optical semiconductor element encapsulation comprising [release liner/colored layer 3/base film] was obtained.

Comparative Example 4

(Preparation of non-diffusion functional layer 4)

The photopolymerizable composition prepared in Production Example 5 was placed on the release-treated surface of a release liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to release treatment on one side, thickness 50 μm) After coating to form a resin composition layer, the release treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was bonded also on the resin composition layer. Next, ultraviolet rays having an intensity of 5 mW/cm 2 were irradiated with a black light until the cumulative amount of light reached 3600 mJ/cm 2 , and polymerization was performed to prepare a non-diffusion functional layer 4 (thickness: 150 μm) as an adhesive layer.

(Manufacture of Sheet for Optical Semiconductor Element Sealing)

The release liner (trade name "MRF38") was peeled off from the non-diffusion functional layer 4 to expose the adhesive face. The exposed surface of the non-diffusion functional layer 4 is a base film (trade name "Diafoil T912E75 (UE80-)", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film, one side of which is treated to facilitate adhesion, thickness 75 μm) was bonded to the adhesion-facilitating surface of the substrate film to form a sealing layer composed of the non-diffusion functional layer 4.

Then, at room temperature (23°C), they were bonded together so as not to contain air bubbles with a hand roller, and left to stand for 2 days under light shielding. In this way, a sheet for encapsulating optical semiconductor elements composed of [release liner/non-diffusion functional layer 4/base film] was obtained.

Comparative Example 5

(Preparation of diffusion functional layer 5)

The photopolymerizable composition prepared in Production Example 3 was placed on the release-treated surface of a release liner (trade name "MRA50", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film subjected to release treatment on one side, thickness 50 μm) After coating to form a resin composition layer, the release treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) was bonded also on the resin composition layer. Next, ultraviolet rays having an intensity of 5 mW/cm 2 were irradiated with a black light until the cumulative light amount reached 3600 mJ/cm 2 , and polymerization was performed to prepare a diffusion functional layer 5 (thickness: 150 μm) as an adhesive layer.

(Manufacture of Sheet for Optical Semiconductor Element Sealing)

The release liner (trade name "MRF38") was peeled off from the diffusion functional layer 5 to expose the adhesive face. The exposed surface of the diffusion functional layer 5 is a base film (trade name "Diafoil T912E75 (UE80-)", manufactured by Mitsubishi Chemical Corporation, polyethylene terephthalate film to which adhesion-facilitating treatment is applied to one side, thickness 75 μm) was bonded to the adhesion-facilitating surface of the substrate film to form a sealing layer composed of the diffusion functional layer 5 on the base film.

Then, at room temperature (23°C), they were bonded together so as not to contain air bubbles with a hand roller, and left to stand for 2 days under light shielding. In this way, a sheet for encapsulating optical semiconductor elements composed of [release liner/diffusion functional layer 5/base film] was obtained.

Comparative Example 6

(Manufacture of Sheet for Optical Semiconductor Element Sealing)

As a 1st sealing layer, a 2nd sealing layer, and a 3rd sealing layer, except having formed the layer shown in Table 2, it carried out similarly to Example 1, and obtained the sheet|seat for optical semiconductor element sealing.

<evaluation>

About the sheet|seat for optical-semiconductor element sealing obtained by the Example and the comparative example, the following evaluation was performed. Results are shown in a table.

(1) Total light transmittance (each layer)

The release liner on one side was peeled off from each adhesive layer used in Examples and Comparative Examples (type in which two release liners were sandwiched and supported), and the surface of each exposed adhesive layer was separated into a glass plate (slide glass, product number "S-9112", made by Matsunami Glass High School Co., Ltd.). Then, the other release liner was peeled off to prepare a measurement sample having a layer configuration of [glass plate/adhesive layer]. About the said measurement sample, the total light transmittance was measured with the haze meter (device name "HM-150", Murakami Shikisai Co., Ltd. product made by Kijutsu Genkyujo). The measurement was performed by introducing measurement light from the side of the adhesive layer.

(2) Haze value (each layer)

With respect to the measurement sample prepared for measuring the total light transmittance of (1), the total light transmittance and diffuse transmittance were measured by a haze meter (apparatus name "HM-150", manufactured by Murakami Shikisai Kijutsu Genkyujo Co., Ltd.). And the haze value of the measurement sample was calculated|required by the formula of "diffusion transmittance/total light transmittance x 100", and it was set as the initial stage haze value.

(3) Total light transmittance (sheet for sealing optical semiconductor elements)

The release liner was peeled off from the sheet for encapsulating optical semiconductor elements of Examples and Comparative Examples, and the exposed adhesive layer surface was bonded to a glass plate (slide glass, product number "S-9112", manufactured by Matsunami Glass Kogyo Co., Ltd.), and measurement samples was produced. About the said measurement sample, the total light transmittance was measured with the haze meter (device name "HM-150", Murakami Shikisai Co., Ltd. product made by Kijutsu Genkyujo). The measurement was performed by introducing measurement light from the base film side. Regarding Example 8, a sample in which the adhesive layer was cured by irradiation with ultraviolet rays under the following conditions from the base film side before measurement was used as a measurement sample.

<Ultraviolet irradiation conditions>

Ultraviolet irradiation device: Trade name "UM810", manufactured by Nitto Seki Co., Ltd.

Light source: high pressure mercury lamp

Irradiation intensity: 50 mW/cm2 (measurement device: trade name "ultraviolet ray illuminance meter UT-101", manufactured by Ushio Denki Co., Ltd.)

Irradiation time: 6 seconds

Accumulated amount of light: 300mJ/cm2

(4) Haze value (sheet for sealing optical semiconductor elements)

The total light transmittance and diffuse transmittance of the measurement sample prepared for measuring the total light transmittance were measured with a haze meter (apparatus name "HM-150", manufactured by Murakami Shikisai Kijutsu Genkyujo Co., Ltd.). And the haze value of the measurement sample was calculated|required by the formula of "diffusion transmittance/total light transmittance x 100", and it was set as the haze value. The measurement was performed by introducing measurement light from the base film side (first surface side).

(5) L ^* (1) (stick to adherend without irregularities)

The surface obtained by peeling the release liner of the sheet for encapsulating semiconductor elements obtained in Examples and Comparative Examples on the surface of the inner winding of aluminum foil (30 cm in width x 50 m in length x 12 μm in thickness) manufactured by Mitsubishi Aluminum Corporation was peeled off with a hand roller. A measurement sample was produced by bonding without biting air bubbles. After bonding, it was left to stand under light-shielding at 25 degreeC for 30 minutes. Then, what was joined in a size larger than 5.0 cm x 5.0 cm was cut out. After that, the measurement sample was left standing on a flat surface so that the base film surface of the optical semiconductor element sealing sheet faced outward. Then, L ^* (SCI)(1) and L ^* (SCE)(1) were measured with a spectrophotometer (trade name "CM-26dG", manufactured by Konica Minolta Co., Ltd.) from the base film surface side. In addition, the measurement area of the colorimeter was installed so as to come to the center of the measurement sample, and the measurement was performed under the following conditions. In addition, before measuring with the said spectrophotometer, zero-point calibration, white calibration, and GROSS calibration were performed according to the manufacturer's manual. Further, when measured only on the aluminum foil (inner winding surface), L ^* (SCI) was 95.88 and L ^* (SCE) was 88.32. Regarding Example 8, a sample in which the adhesive layer was cured by irradiation with ultraviolet rays under the conditions described in (3) total light transmittance from the side of the base film before measurement was taken as a measurement sample.

<L ^* measurement condition>

How to Measure: Color & Gloss

Geometry: di: 8°, de: 8°

Specular reflection treatment: SCI+SCE

Observation light source: D65

Observation conditions: 10° field of view

Measurement Diameter: MAV (8mm)

UV conditions: 100% Full

Automatic average measurement: 3 times

Skip Zero Calibration: Enabled

(6) L ^* (2) (stick to adherend with irregularities)

<Preparation of adherend with irregularities>

(Preparation of silicon wafer)

A back grind tape (trade name "ELP UB-3083D", manufactured by Nitto Denko Co., Ltd.) was bonded to one side of an 8-inch silicon mirror wafer, and the back side of the wafer was back ground. Back grinding was performed using a grinding device (trade name "DFG-8560", manufactured by Disco Co., Ltd.) so that the thickness of the wafer after back grinding was 40 µm.

(Manufacture of die attach film)

79 parts by mass of an epoxy resin (trade name "HP-400", manufactured by DIC Co., Ltd.), phenol resin (trade name "H -4", Maywa Chemical Industry Co., Ltd.) 93 parts by mass, spherical silica (trade name "SO-25R", manufactured by Admatex Co., Ltd.) 189 parts by mass, and a curing catalyst (trade name "2PHZ", Shikoku Kasei Kogyo Co., Ltd. make) 0.6 mass part was melt|dissolved in methyl ethyl ketone, and the adhesive composition solution used as 20 mass % of solid content concentration was prepared. Then, the adhesive composition solution was coated on a release liner (trade name “MRF30”, manufactured by Mitsubishi Chemical Corporation), and the solvent was volatilized and solidified by heating at 150° C. for 2 minutes to obtain a die-attach film having a thickness of 10 μm. was produced.

(bonding of die attach film and 40 μm thick wafer)

A die attach film was bonded to the entire surface of one side of a 40 μm thick wafer using a hand roller under a heating temperature of 40° C.

(bonding between die attach film and aluminum foil)

The release liner was peeled off from the die attach film, and the outer winding surface of the aluminum foil was applied to the entire surface using a hand roller under a temperature of 40°C. Thereafter, the die-attach film was cured by heating at 150°C for 1 hour in an oven. After returning to room temperature, the aluminum foil and die attach film were cut along the shape of the wafer using a cutter knife.

(dicing)

The aluminum foil side of [wafer/die attach film/aluminum foil] was bonded to a dicing sheet (trade name "ELP DU-2187G", manufactured by Nitto Denko Co., Ltd.). Next, a dicing ring for 8-inch wafers was attached with a hand roller to the region of the dicing sheet where the wafer was not mounted. Then, using a dicing device (trade name "DFD-6450", manufactured by Disco Co., Ltd.), the wafer was diced into a size of 20 mm × 20 mm, and a silicon chip (20 mm × 20 mm) was obtained. The base material surface of the dicing sheet was irradiated with ultraviolet rays under the following conditions, and silicon chips were taken out.

<Ultraviolet irradiation conditions>

Ultraviolet irradiation device: Trade name "UM810", manufactured by Nitto Seki Co., Ltd.

Light source: high pressure mercury lamp

Irradiation intensity: 50 mW/cm2 (measurement device: trade name "ultraviolet ray illuminance meter UT-101", manufactured by Ushio Denki Co., Ltd.)

Irradiation time: 6 seconds

Accumulated amount of light: 300mJ/cm2

<Bonding of Sheet for Optical Semiconductor Element Sealing>

An 8-inch unground Si mirror wafer was prepared. A silicon chip was placed thereon with the aluminum foil side facing up, and the sheet for sealing optical semiconductor elements obtained in Examples and Comparative Examples was attached to the surface from which the release liner was peeled off using an adhesive device under the following conditions. It was affixed so that a silicon chip might be covered with the optical-semiconductor element sealing sheet.

Apparatus: Trade name "DR-3000III", manufactured by Nitto Seki Co., Ltd.

Table warming temperature: 80℃

Table type: 8-inch table (FOR700)

Attachment pressure: 0.5 MPa (pressure 100%)

Paste speed: 2mm/sec

<Method for measuring L ^* value when applied to an adherend with irregularities>

An 8-inch mirror wafer on which a layered body of silicon chips with [aluminum foil/die attach film] was mounted was placed on a flat surface so that the base film surface of the sheet for sealing optical semiconductor elements faced the outside. On the mirror wafer, a silicon chip (length 20 mm × width 20 mm × thickness 62 μm) with [aluminum foil/die attach film] is stacked.

The entire surface of the measurement part of the spectrophotometer (trade name "CM-26dG", manufactured by Konica Minolta Co., Ltd.) is installed on the base film surface of the optical semiconductor element sealing sheet affixed to the portion where the aluminum foil exists, L ^* (SCI )(2) and L ^* (SCE)(2) were measured. Measurement conditions for L ^* (SCI)(2) and L ^* (SCE)(2) were the same as for L ^* (SCI)(1) and L ^* (SCE)(1). In addition, before measuring with the said spectrophotometer, zero-point calibration, white calibration, and GROSS calibration were performed according to the manufacturer's manual. Regarding Example 8, a sample in which the adhesive layer was cured by irradiation with ultraviolet rays under the conditions described in (3) total light transmittance from the side of the base film before measurement was taken as a measurement sample.

(7) light diffusion effect confirmation test

The release liner of the optical semiconductor element sealing sheet obtained in Examples and Comparative Examples was peeled off, and a glass plate (slide glass, product number "S-9112", Matsunami Glass Kogyo Co., Ltd.) was used to prevent air bubbles from entering using a hand roller. 76mm × 52mm × 1.0 to 1.2mm). After bonding, it was left to stand under light-shielding at 25 degreeC for 30 minutes. The size of the affixed sheet for optical semiconductor element sealing was appropriately cut so that it might become the same size as that of the glass plate, and a measurement sample was produced. An LED lamp (trade name "LK-3PG", manufactured by EK Japan Co., Ltd.) was installed on the top of the screen so as to have a height of 2.4 cm. The glass plate side of the obtained measurement sample was adhered to the LED lamp. A battery box (trade name "AP-180", manufactured by IKEA Japan) was connected to the LED lamp, the LED lamp was turned on, and the diameter of a circular image projected on the screen was measured. When measured only with a glass plate without the optical semiconductor element sealing sheet, the diameter of the light reflected on the screen was 4.0 cm. When measured through the sheet|seat for optical-semiconductor element sealing, when an optical diameter became 5.0 cm or more, it was judged that there was a light-diffusion effect.

(8) Judgment

Based on the results of the above evaluations (5) to (7), L ^* (SCI), L ^* (SCE) and the light diffusion effect were determined based on the following criteria. And as a comprehensive judgment, the case where all of L ^* (SCI), L ^* (SCE), and light-diffusion effect was ○ was made into ○, and the case where even one was × was made into ×.

L ^* (SCI): In either of L ^* (SCI) (1) and L ^* (SCI) (2), the case of 60 or less is designated as ○, and the case of greater than 60 is designated as ×.

L ^* (SCE): In either of L ^* (SCE) (1) and L ^* (SCE) (2), the case of 60 or less is designated as ○, and the case of greater than 60 is designated as ×.

Light diffusion effect: The case of 5.0 cm or more is made into ○, and the case of less than 5.0 cm is made into ×.

As shown in Table 1, the sheet for encapsulating optical semiconductor elements of the present invention (Example) has L ^* (SCI) and L ^* (SCE) of 60 for both adherends without irregularities and adherends with irregularities. From the following points, it was evaluated that the designability was excellent in the state in which the optical semiconductor element was sealed. In addition, since the light diffusion effect was 5.0 cm or more, it was evaluated that luminance nonuniformity hardly occurs.

On the other hand, as shown in Table 2, when the colored layer is in the first sealing layer in contact with the optical semiconductor element, both L ^* (SCI) and L ^* (SCE) of the adherend with irregularities exceed 60. In, it was judged that the designability was poor (Comparative Examples 1 and 2). When the sealing portion is composed of a single layer of the colored layer, the light diffusing effect is less than 5.0 cm for L ^* (SCI) and L ^* (SCE), and therefore, it is judged that the luminance non-uniformity suppression effect is insufficient (Comparative Example 3). When the sealing part is composed of a single layer of the non-diffusion functional layer, since both the adherend without irregularities and the adherend with irregularities exceed 60, and the light diffusion effect is less than 5.0 cm, the designability is poor and the luminance unevenness is suppressed. The effect was judged to be insufficient (Comparative Example 4). When the sealing portion was composed of a single layer of the diffusion functional layer, since both L ^* (SCI) and L ^* (SCE) exceeded 60, it was judged that the design was poor (Comparative Example 5). In the case of not having a diffusion functional layer, since the light diffusion effect was less than 5.0 cm, it was judged that the effect of suppressing luminance nonuniformity was insufficient (Comparative Example 6).

1: sheet for optical semiconductor element sealing
2: seal
21: first sealing layer
22: second sealing layer
23: third sealing layer
3: release liner
4: Ministry of Finance
5: substrate
6: optical semiconductor element
10, 20: optical semiconductor device

Claims (11)

A sheet for sealing one or more optical semiconductor elements disposed on a substrate,
The sheet comprises a first sealing layer in contact with the optical semiconductor element, a second sealing layer laminated on the first sealing layer, and a third sealing layer having adhesiveness and/or adhesiveness laminated on the second sealing layer. provide layers,
The second sealing layer and / or the third sealing layer contains a colorant,
At least one selected from the group consisting of the first sealing layer, the second sealing layer, and the third sealing layer is a diffusion functional layer, the optical semiconductor element sealing sheet. The sheet for encapsulating optical semiconductor elements according to claim 1, wherein the first encapsulating layer is a diffusion functional layer. The sheet for encapsulating optical semiconductor elements according to claim 1 or 2, wherein the third encapsulating layer is a diffusion functional layer. The sheet for encapsulating optical semiconductor elements according to claim 1 or 2, wherein the diffusion functional layer contains light-diffusing fine particles. The sheet for encapsulating an optical semiconductor element according to claim 4, wherein the light-diffusing fine particles are composed of a silicone resin and/or a metal oxide. The ratio of L ^* (SCI) (2) to L * (SCI) (1) according to claim 1 or 2, each defined below [ ^{L * (} SCI) (2) / L ^* (SCI) )(1)], and/or the ratio of L ^* (SCE)(2) to L ^* (SCE)(1) [L ^* (SCE)(2)/L ^* (SCE)(1)] is 1.2 The sheet|seat for optical-semiconductor element sealing which is the following.
L ^* (SCI) (1): L ^* (SCI) measured from the third sealing layer side in a state where the first sealing layer of the optical semiconductor element sealing sheet is bonded to the aluminum foil
L ^* (SCI) (2): A convex sample having a length of 20 mm, a width of 20 mm, and a thickness of 62 μm and having an aluminum foil on the surface thereof is placed on a substrate having a size larger than that of the convex sample, and a sheet for sealing optical semiconductor elements is formed. L ^* (SCI) measured from the third sealing layer side in a state where the first sealing layer of the optical semiconductor element sealing sheet is bonded to the substrate and the convex sample so as to cover the convex sample
L ^* (SCE) (1): L ^* (SCE) measured from the third sealing layer side in a state where the first sealing layer of the optical semiconductor element sealing sheet is bonded to the aluminum foil
L ^* (SCE) (2): A convex sample having a length of 20 mm, a width of 20 mm, and a thickness of 62 μm having an aluminum foil on the surface thereof is placed on a substrate having a size larger than that of the convex sample, and a sheet for encapsulating optical semiconductor elements is formed. L ^* (SCE) measured from the third sealing layer side in a state where the first sealing layer of the sheet for encapsulating optical semiconductor elements is bonded to the substrate and the convex sample so as to cover the convex sample The sheet for encapsulating optical semiconductor elements according to claim 1 or 2, wherein the first encapsulating layer is a radiation-non-curable resin layer. The optical semiconductor element sealing sheet according to claim 1 or 2, wherein the second sealing layer and/or the third sealing layer are radiation curable resin layers. An optical semiconductor device comprising a substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet according to claim 1 or 2 for sealing the optical semiconductor element. The optical semiconductor device according to claim 9, which is a self-luminous display device. An image display device comprising the self-emissive display device according to claim 10.

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