KR20230094910A - Electronic device including flexbile printed circuit board - Google Patents

Abstract

An electronic device including a flexible circuit board is disclosed. An electronic device according to various embodiments includes a first housing, a second housing partially movably connected to the first housing along a moving direction, supported by the first housing and the second housing, and the first housing. A display that changes between a first state in which the area of the display area visually exposed to the outside is minimized and a second state in which the area is maximized according to the relative movement of the housing and the second housing, and the first housing and the second housing A flexible circuit board whose length in the moving direction changes according to relative movement, wherein the flexible circuit board includes a first wiring member including a first signal circuit formed along a first longitudinal direction, and a second longitudinal direction. A second wiring member including a second signal circuit formed along the junction, a junction member joining the first wiring member and the second wiring member along a junction region, and disposed in the junction region, the first wiring member and One or more signal vias passing through the second wiring member and electrically connecting the first signal circuit and the second signal circuit may be included. In addition to this, various embodiments may be possible.

Description

Electronic device including a flexible circuit board {ELECTRONIC DEVICE INCLUDING FLEXBILE PRINTED CIRCUIT BOARD}

Various embodiments disclosed in this document relate to an electronic device including a flexible circuit board.

Recently, electronic devices such as portable terminals have been developed to improve usability through miniaturization while having various functions in order to satisfy consumers' purchase desires. Inside the electronic device, various parts and boards for performing each function are disposed, and these parts may be connected through a flexible printed circuit board (FPCB).

An electronic device in which an area of a display exposed to the outside changes according to a use state is being developed. For example, in the case of a slideable electronic device, the display area of the display exposed to the outside can be adjusted while the shape is changed to expand or contract according to the relative motion of the housing. In the case of an electronic device whose shape changes, since the relative position of a plurality of parts disposed inside changes according to the movement of the housing, a flexible circuit board (FPCB) whose shape is deformable in order to electrically connect the parts whose relative position changes printed circuit board) may be used. Since repetitive shape deformation of the flexible circuit board causes stress concentration on a specific portion, for example, a folded portion, the lifespan of the flexible circuit board can be increased by relieving local stress applied to the flexible circuit board.

According to various embodiments, an electronic device including a flexible circuit board may be provided.

According to various embodiments of the present disclosure, the stress concentration applied to the flexible circuit board according to the operation of the electronic device may be alleviated through the flexible circuit board to which the segmental structure is applied.

According to various embodiments of the present disclosure, an internal arrangement space of an electronic device may be optimized by reducing an angle change due to shape deformation of a flexible circuit board.

The technical problem to be achieved through the various embodiments disclosed in this document is not limited to the above-mentioned technical problem, and other technical problems not mentioned are common knowledge in the art to which the invention described in this document belongs from the description below. will be clearly understandable to those who have

An electronic device according to various embodiments includes a first housing, a second housing partially movably connected to the first housing along a moving direction, supported by the first housing and the second housing, and the first housing. A display that changes between a first state in which the area of the display area visually exposed to the outside is minimized and a second state in which the area of the display area is maximized according to the relative movement of the housing and the second housing, the first disposed inside the first housing a component, a second component disposed inside the second housing, and a flexible circuit board connecting the first component and the second component, wherein the flexible circuit board includes a first length formed along a first length direction. A first wiring member including a signal circuit, a second wiring member including a second signal circuit formed along a second longitudinal direction, a joining member joining the first wiring member and the second wiring member along a joining area, and one or more signal vias disposed in the junction area and electrically connecting the first signal circuit and the second signal circuit through the first wiring member and the second wiring member.

A flexible circuit board according to various embodiments includes a first board surface and a second board surface opposite to the first board surface, and a first wiring member having a first signal circuit formed along a longitudinal direction; A second wiring member including a substrate surface and a fourth substrate surface opposite to the third substrate surface, in which a second signal circuit is formed along the length direction, and connected to the first wiring member through a bonding area; a bonding member disposed in the bonding area and having both surfaces bonded to the first and third substrate surfaces, respectively; disposed in the bonding area and penetrating the first wiring member and the second wiring member to the first signal circuit; and a signal via electrically connecting the second signal circuit, and a first cover member disposed on the second substrate surface of the first wiring member to cover the junction area when looking at the second substrate surface; and a second cover member disposed on the fourth substrate surface of the second wiring member to cover the junction area in a state of looking at the fourth substrate surface.

An electronic device according to various embodiments includes a first housing, a second housing partially movably connected to the first housing along a moving direction, supported by the first housing and the second housing, and the first housing. A display that changes between a first state in which the area of the display area visually exposed to the outside is minimized and a second state in which the area of the display area is maximized according to the relative movement of the housing and the second housing, the first disposed inside the first housing A part, a second part disposed inside the second housing, and connecting the first part and the second part, and the length in the moving direction changes according to the relative movement of the first housing and the second housing A flexible circuit board, wherein the flexible circuit board has a first longitudinal direction, a first wiring member including a first signal circuit formed along the first longitudinal direction, and a second longitudinal direction, wherein the first wiring member includes a first signal circuit formed along the first longitudinal direction. 2A second wiring member including a second signal circuit formed along the longitudinal direction and connected to the first wiring member through a junction region, disposed in the junction region, and having both sides of the first wiring member and the second wiring member, respectively. A bonding member bonded to a wiring member, at least a portion of which is disposed in the bonding area, and at least a portion of a first cover member disposed on a surface of the first wiring member opposite to the bonding member is disposed in the bonding area; A second cover member disposed on the surface of the second wiring member opposite to the junction member, disposed in the junction area, and penetrating the first wiring member and the second wiring member to pass through the first signal circuit and the second signal circuit. It may include one or more signal vias connecting the , and one or more dummy vias passing through and connecting the first cover member and the second cover member.

According to various embodiments, by applying a structure in which the stress concentration portion of the flexible circuit board is segmented, local fatigue applied to the flexible circuit board may be alleviated and the service life of the flexible circuit board may be improved.

According to various embodiments of the present disclosure, it is possible to improve utilization of a flexible circuit board arrangement space inside an electronic device by reducing a shape change of the flexible circuit board according to an operation of the electronic device.

According to various embodiments of the present disclosure, a bonding state of a plurality of segmented wiring members may be strengthened through one or more dummy vias that do not interfere with a signal circuit.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
2A is a front view illustrating an electronic device in a first state according to an exemplary embodiment.
2B is a rear view illustrating a first state of an electronic device according to an exemplary embodiment.
2C is a front view illustrating a second state of an electronic device according to an exemplary embodiment.
2D is a front view illustrating a second state of an electronic device according to an exemplary embodiment.
2E is an exploded perspective view of an electronic device according to an exemplary embodiment.
3A is a diagram illustrating a state of a flexible circuit board in a first state of an electronic device according to an exemplary embodiment.
3B is a diagram illustrating a state of a flexible circuit board in a second state of an electronic device according to an embodiment.
4A is a perspective view of a flexible circuit board according to an embodiment.
FIG. 4B is an enlarged view illustrating area A of FIG. 4A.
4C is a partial perspective view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
FIG. 4d is a partial cross-sectional view of the flexible circuit board taken along line IVc-IVc in FIG. 4c.
5A is a partial perspective view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
5B is a partial plan view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
5C is a partial cross-sectional view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
6A is a partial perspective view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
6B is a partial plan view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
6C is a partial cross-sectional view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
7 is a partial perspective view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
8A is a partial perspective view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.
8B is a partial plan view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted.

1 is a block diagram of an electronic device in a network environment according to various embodiments. Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into one component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of other functionally related components (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logic blocks, components, or circuits. can be used A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document describe one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the components described above may include a single object or a plurality of objects, and some of the multiple objects may be separately disposed in other components. . According to various embodiments, one or more components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

2A is a front view illustrating an electronic device in a first state according to an embodiment, FIG. 2B is a rear view illustrating an electronic device in a first state according to an embodiment, and FIG. 2C is an electronic device according to an embodiment. FIG. 2D is a front view illustrating an electronic device in a second state, FIG. 2D is a front view illustrating an electronic device in a second state according to an embodiment, and FIG. 2E is an exploded perspective view of the electronic device according to an embodiment.

Referring to FIGS. 2A to 2E , an electronic device 201 (eg, the electronic device 101 of FIG. 1 ) according to various embodiments includes housings 210 and 220 that form an exterior and accommodate parts therein. can include In one embodiment, the housings 210 and 220 may include a first housing 210 and a second housing 220 that are partially connected so as to be movable relative to each other.

In one embodiment, the first housing 210 and the second housing 220 may be relatively movably connected along a movement direction (eg, an X-axis direction). For example, the second housing 220 moves in a first direction (eg, -X-axis direction) with respect to the first housing 210, or moves in a second direction opposite to the first direction with respect to the first housing 210. It can be connected to move in a direction (eg, +X-axis direction). Meanwhile, the operation of moving the second housing 220 relative to the first housing 210 is for convenience of explanation, and the relative movement of the first housing 210 and the second housing 220 is an example described. is not limited to In addition, although the second housing 220 is shown to move along the X-axis direction with respect to the first housing 210 in the drawing, the relative movement directions of the first housing 210 and the second housing 220 are shown in the drawing. It is not limited to the illustrated example. For example, the first housing 210 and the second housing 220 may be relatively movably connected along the Y-axis direction or movably connected along both X-axis and Y-axis directions. Hereinafter, for convenience of description, the relative movement of the first housing 210 and the second housing 220 is assumed to be the movement of the second housing 220 relative to the first housing 210 along the movement direction. let me explain

In one embodiment, the first housing 210 includes a first surface 210A (eg, a first front surface), a second surface 210B opposite to the first surface 210A (eg, a first rear surface), A plurality of (eg, two) first side surfaces 210C (eg, two) oriented in one direction (eg, +/−X direction) and positioned between the first surface 210A and the second surface 210B (eg, : first left side and first right side), and oriented in another direction (eg, +/-Y direction) intersecting one direction (eg, +/-X direction), and the first side 210A and the second side It may include a plurality (eg, two) of second side surfaces 210D (eg, a first upper side surface and a first lower side surface) positioned between 210B. In one embodiment, the plurality of first side surfaces 210C may be formed as round surfaces. In one embodiment, the first housing 210 is on the second side surface 210D (eg, the first lower surface) oriented in one direction (eg, -Y direction) among the second side surfaces 210D. At least one formed first hole H1 may be included.

In one embodiment, the second housing 220 includes a third surface 220A (eg, a second front surface), a fourth surface 220B opposite to the third surface 220A (eg, a second rear surface), A plurality of (eg, two) third side surfaces 220C (eg, two) oriented in one direction (eg, +/−X direction) and positioned between the third and fourth surfaces 220A and 220B (eg, : second left side and second right side), and oriented in another direction (eg, +/-Y direction) intersecting one direction (eg, +/-X direction), and the third side 220A and the fourth side It may include a plurality (eg, two) of fourth side surfaces 220D (eg, a second upper side surface and a second lower side surface) positioned between 220B. Among the plurality of third side surfaces 220C, a third side surface 220C oriented in one direction (eg, the +X direction) may include an open portion 220E that is at least partially open. In one embodiment, the plurality of third side surfaces 220C may be formed as round surfaces. In one embodiment, the second housing 220 includes a fourth side surface 220D (eg, a second lower surface) oriented in one direction (eg, -Y direction) among a plurality of fourth side surfaces 220D. It may include at least one second hole H2 formed in ). The second hole H2 may be aligned with the first hole H1, for example.

In one embodiment, the electronic device 201 may include a display 261 (eg, the display module 160 of FIG. 1 ) for displaying visual information. The display 261 may include display areas 261A, 261B, 261C, and 261D supported by the first housing 210 and the second housing 220 and visually exposed to the outside. In one embodiment, the display 261 may be one of a flexible display, a foldable display, or a rollable display.

In an embodiment, the display areas 261A, 261B, 261C, and 261D are among the first area 261A and the third side surface 220C located on the first surface 210A and the third surface 220A. The second region 261B located on the third side surface 220C oriented in one direction (eg, -X direction), and the third side surface 220C oriented in the other direction (eg, +X direction) A third region 261C located on the third side face 220C and at least partially surrounding the open portion 220E, and a fourth region 261D located on the second face 210B and the fourth face 220B. ) may be included.

In one embodiment, the second area 261B and the third area 261C of the display 261 may have round surfaces that are flexibly bent. In some embodiments, the second area 261B may be located at least partially on the first surface 210A and the third surface 220A. In some embodiments, the third area 261C may be at least partially located on the first surface 210A and the third surface 220A. In some embodiments, the third area 261C may be at least partially located on the second and fourth surfaces 210B and 220B.

In another embodiment, the display 261 may be configured to partially display a screen. For example, the display 261 displays a screen through the first area 261A located on the first surface 210A and the third surface 220A, and the second area 261B and the third area 261C. And/or the fourth area 261D may display a screen at a different time point than the first area 261A. In one embodiment, the display area of the display 261 may expand or contract as the first housing 210 moves in the first and second directions. For example, the display 261 is in a reduced state (eg, the first state of FIG. 2B) in which the area of the display area is minimized according to the relative movement of the first housing 210 and the second housing 220, and The area of the display area may change between an extended state (eg, the second state of FIG. 2D ) in which the area of the display area is maximized.

In one embodiment, the electronic device 201, when viewed in one direction (eg, the -Z direction), has a first size display area (eg, the first area 261A, the second area 261B, and the third area 261B). region 261C) (eg, the reduced state of FIG. 2B ), and a display region having a second size larger than the first size (eg, first region 261A, second region 261B, and The state may change between the second state (eg, the extended state of FIG. 2D ) having the third region 261C. For example, when the second housing 220 moves in the first direction (eg, the +X direction) with respect to the first housing 210 in the first state, the size of the first region 261A increases and the fourth The size of the area 261D decreases and the display area of the display 261 viewed in one direction (eg, -Z direction) may be expanded. On the other hand, when the second housing 220 moves in a second direction (eg, +X direction) opposite to the first direction with respect to the first housing 210 in the second state, the size of the first region 261A increases. and the size of the fourth region 261D may increase. Meanwhile, while the electronic device 201 operates between the first state and the second state, the size of the second region 261B and the third region 261C may be substantially constant.

In one embodiment, the electronic device 201 may include a sliding device 290 including a driving device 291 configured to move the first housing 210 and the second housing 220 relative to each other. . The slide device 290 is connected to the first housing 210 and the second housing 220, and can slide the other housings 210 and 220 relative to one housing 210 and 220, and the first housing As the 210 or the second housing 220 moves, the display may expand or contract.

In one embodiment, the electronic device 201 may include an input module 250 (eg, the input module 150 of FIG. 1 ). The input module 250 may be formed, for example, on a third side surface 220C (eg, the second left side) on which the open portion 220E is not formed among the plurality of third side surfaces 220C. there is.

In one embodiment, the electronic device 201 includes a first sound output module 255A (eg, the sound output module 155 of FIG. 1 ) and a second sound output module 255B (eg, the sound output module of FIG. 1 ). (155)). In one embodiment, the first audio output module 255A is located on a first portion (eg, top) of the first housing 210, and the second audio output module 255B is located on the first housing 210. It may be located in a second part (eg, lower part) different from the first part.

For example, in a first state (eg, a reduced state of the electronic device 201 of FIG. 2A ), the first audio output module 255A performs a communication function, and the second audio output module 255B performs the first audio output module 255B. While configured to perform a speaker function in the state, in the second state (eg, the extended state of the electronic device 201 of FIG. 2C), the first sound output module 255A and the second sound output module 255B are a speaker It can be configured to perform a function. In some examples, in the second state, the first sound output module 255A and the second sound output module 255B may cooperate with each other to output stereo sound.

In one embodiment, the second sound output module 255B is configured to emit sound through the first hole H1 and the second hole H2 substantially aligned with each other in the first state, and in the second state In, it may be configured to emit sound through the first hole H1. In another embodiment, at least one of the first audio output module 255A and the second audio output module 255B may be located in the second housing 220 . In another embodiment, the electronic device 201 may include only one of the first sound output module 255A and the second sound output module 255B, and may include additional sounds other than the illustrated sound output module. It may further include an output module.

In one embodiment, the electronic device 201 may include a haptic module 279 (eg, the haptic module 179 of FIG. 1 ). The haptic module 279 may include, for example, a vibrator configured to generate vibration. In one embodiment, the haptic module 279 may be located in the second housing 220 . In some embodiments, haptic module 279 may be positioned adjacent to second sound output module 255B. In another embodiment, the haptic module 279 may be located in the first housing 210 .

In an embodiment, the electronic device 201 includes a first camera module 280A (eg, the camera module 180 of FIG. 1 ) and a second camera module 280B (eg, the camera module 180 of FIG. 1 ). can include The first camera module 280A is configured to acquire an image in one direction (eg, +Z direction) of the electronic device 201, and the second camera module 280B is configured to acquire an image in another direction (eg, +Z direction) of the electronic device 201. -Z direction).

In one embodiment, the first camera module 280A and the second camera module 280B may be located in the second housing 220 . In another embodiment, at least one of the first camera module 280A and the second camera module 280B may be located in the first housing 210 . In another embodiment, the electronic device 201 may include only one of the first camera module 280A and the second camera module 280B, or may further include an additional camera module in addition to the illustrated camera module. there is.

In one embodiment, the electronic device 201 may include a battery 289 (eg, the battery 189 of FIG. 1 ). In one embodiment, battery 289 may be located in first housing 210 . The battery 289 includes, for example, a first audio output module 255A, a first camera module 280A, a second camera module 280B, a first printed circuit board 251, a slide device 300, It may be at least partially surrounded by the third printed circuit board 253, the haptic module 279 and the second sound output module 255B. In another embodiment, the battery 289 may be located in the second housing 220 .

In one embodiment, the electronic device 201 may include a first printed circuit board 251 , a second printed circuit board 252 and a third printed circuit board 253 . The first printed circuit board 251, the second printed circuit board 252, and the third printed circuit board 253 include a plurality of metal layers and a plurality of dielectrics respectively positioned between a pair of adjacent metal layers. can include In one embodiment, the first printed circuit board 251 may be located in the second housing 220 . The first printed circuit board 251 can include a first electronic component 288 (eg, the power management module 188 of FIG. 1 ). The second printed circuit board 252 may be positioned in the first housing 210 . The second printed circuit board 252 may be electrically connected to, for example, the sliding device 300 . The third printed circuit board 253 may be located in the second housing 220 . The third printed circuit board 253 may be electrically connected to, for example, the haptic module 279 .

In one embodiment, the electronic device 201 may include a structure forming the housings 210 and 220 . For example, the electronic device 201 may include a first cover 211 forming a first housing 210, a first plate 212, a second plate 213, and a support structure 214. , The second cover 221 and the third plate 222 forming the second housing 220 may be included. The second plate 213 connects the first plate 212 and the third plate 222, and according to the relative motion of the second housing 220 with respect to the first housing 210, the first plate 212 Alternatively, it may be slidably connected to the third plate 222 along a moving direction (eg, the X-axis direction of FIG. 2C ).

In one embodiment, the first cover 211 may at least partially enclose the first audio output module 255A, the first camera module 280A, the haptic module 279, and the second audio output module 255B. there is. The first plate 212 includes electronic components (eg, the slide device 300, the first sound output module 255A, the second sound output module 255B, the first camera module 280A, the second camera module ( 280B), first printed circuit board 251, second printed circuit board 252, third printed circuit board 253, connector assembly 290, haptic module 279 and other electronic components) at least partially Acceptable. The second plate 213 is positioned between the first plate 212 and the display 261 and may support the slide device 300 and the display 261 .

In one embodiment, the support structure 214 includes a base plate 214A configured to be flexibly bent, and a plurality of support bars 214B arranged spaced apart from each other along the base plate 214A and configured to support the display 261. ) may be included. The second cover 221 at least partially surrounds the first cover 211 and may be coupled to the first cover 211 such that the first cover 211 is slidably relative to the second cover 221 .

In one embodiment, the second cover 221 may be configured to guide the plurality of support bars 214B. The second cover 221 may expose at least some of the electronic components (eg, the second camera module 280B) to the outside of the electronic device 201 . The third plate 222 may surround at least a portion of the second cover 221 . The third plate 222 may be formed of, for example, a glass material. Meanwhile, the structures forming the first housing 210 and the second housing 220 described in this document are not limited to the illustrated embodiment, and various types of structures may exist.

3A is a diagram illustrating a state of a flexible circuit board in a first state of an electronic device according to an embodiment, and FIG. 3B is a diagram illustrating a state of a flexible circuit board in a second state of an electronic device according to an embodiment. am.

Referring to FIGS. 3A and 3B , an electronic device 301 according to various embodiments may include a first housing 310 , a second housing 320 , and a flexible circuit board 390 .

In one embodiment, the first housing 310 and the second housing 320 may form the exterior of the electronic device 301 . In one embodiment, the first housing 310 and the second housing 320 may be partially movably connected to each other along the movement direction D1 (eg, the X-axis direction). For example, in the process of changing the state of the electronic device 301 (eg, the process of changing between the first state of FIG. 3A and the second state of FIG. 3B ), the second housing 320 is the first housing ( 310) may move relatively along the movement direction D1.

In one embodiment, the first plate 313 may be disposed inside the first housing 310 and the second plate 312 may be disposed inside the second housing 320 . The relative distance between the first plate 313 and the second plate 312 changes according to a state change of the electronic device 301, for example, a relative movement operation of the first housing 310 and the second housing 320. can do. One or more components for performing functions of the electronic device 301 may be disposed on the first plate 313 and the second plate 312 . For example, the first part 350A may be disposed on the first plate 313 and the second part 350B may be disposed on the second plate 312 .

In one embodiment, the flexible circuit board 390 may be disposed inside the electronic device 301 . In one embodiment, the flexible circuit board 390 may electrically connect a plurality of components disposed inside the electronic device 301 . For example, the flexible circuit board 390 is disposed inside the first component 350A (eg, the first sound output module 255) disposed inside the first housing 310 and inside the second housing 320. Both ends are connected to the second component 350B (eg, the first camera module 280A), so that the first component 350A and the second component 350B may be electrically connected. In one embodiment, the length of the flexible circuit board 390 in the movement direction D1 may change according to the relative movement of the first housing 310 and the second housing 320 . In one embodiment, when the flexible circuit board 390 connects the first component 350A and the second component 350B, the flexible circuit board 390 is partially bent or unfolded in the moving direction D1. The length of may change according to the distance between the first part 350A and the second part 350B according to the state of the electronic device 301 . For example, based on the length in the moving direction D1, the flexible circuit board 390 has a first length d1 in the first state of the electronic device (eg, the folded state of FIG. 3A), and the electronic device The shape may change to have a second length d2 in the second state (eg, the unfolded state of FIG. 3B).

FIG. 4A is a perspective view of a flexible circuit board according to an exemplary embodiment, FIG. 4B is an enlarged view illustrating area A of FIG. 4A, and FIG. 4C is a partial perspective view illustrating a bonding area of the flexible circuit board according to an exemplary embodiment. , Fig. 4d is a partial cross-sectional view of the flexible circuit board along the line IVc-IVc in Fig. 4c.

Referring to FIGS. 4A to 4D , the flexible circuit board 490 according to an exemplary embodiment may include a segmented structure for reducing stress due to a bending operation. In an embodiment, the flexible circuit board 490 may include a first wiring member 491, a second wiring member 492, a bonding member 494, a signal via 496, and a rigid member 498. there is.

In one embodiment, the first wiring member 491 includes a first substrate surface 4911 and a second substrate surface 4912 opposite to the first substrate surface 4911, and extends in the first longitudinal direction L1. can be extended along The second wiring member 492 may include a third substrate surface 4921 and a fourth substrate surface 4922 opposite to the third substrate surface 4921, and may extend along the second longitudinal direction L2. there is. In one embodiment, the first wiring member 491 includes a first joint portion 4914 formed at an end in the first longitudinal direction L1, and the second wiring member 492 includes a second longitudinal direction L2. ) may include a second joint portion 4924 formed at the end. The first wiring member 491 and the second wiring member 492 may be connected through a first junction 4914 and a second junction 4924 to form a junction area B1. In one embodiment, the first wiring member 491 and the second wiring member 492 may be connected so that the first substrate surface 4911 and the third substrate surface 4921 face each other in the junction area B1 . In one embodiment, the first wiring member 491 and the second wiring member 492 forming the junction area B1 may have substantially the same shape, for example, a shape overlapping each other while facing each other.

In one embodiment, the first wiring member 491 and the second wiring member 492 may each include a signal circuit 495 for signal transmission. For example, the first wiring member 491 includes a first signal circuit 495a formed along the first longitudinal direction L1, and the second wiring member 492 extends along the second longitudinal direction L2. It may include a second signal circuit (495b) formed according to. In one embodiment, the signal circuit 495 may be formed by patterning a metal (eg, copper) on a surface of a layer forming the wiring members 491 and 492 . For example, the wiring members 491 and 492 include a base layer made of polyimide (PI), and the signal circuit 495 is deposited on the base layer by sputtering, plating, or laminating. After the metal layer is formed through various known methods such as, the surface may be formed by etching to form a pattern. In this case, a dielectric layer may be applied to the surface of the metal pattern forming the signal circuit 495 . In one embodiment, the first signal circuit 495a and the second signal circuit 495b may be electrically connected through the junction area B1. In one embodiment, the first wiring member 491 includes a plurality of first signal circuits 495a, and the second wiring member 492 has a plurality of numbers corresponding to the plurality of first signal circuits 495a. It may include a second signal circuit (495b) of.

In one embodiment, the first wiring member 491 and the second wiring member 492 are connected to an electronic device (eg, the electronic device 101 of FIG. 1 ) through the first signal circuit 495a and the second signal circuit 495b. ), the electronic device 201 of FIG. 2C or the electronic device 301 of FIG. 3A may be electrically connected. For example, the first wiring member 491 is connected to a portion opposite to the first joint portion 4914 in the first longitudinal direction L1 and is connected to another component (eg, the first component of FIG. 3A or the second component). 2 components), and the first wiring member 491 is connected to a portion opposite to the second joint portion 4924 based on the second longitudinal direction L2, and the other A second connector 4925 to be connected to a component (eg, the first component or the second component in FIG. 3A ) may be included. In addition, although the drawing shows that the flexible circuit board 490 includes two wiring members connected through one junction area B1, this is an example for convenience of explanation, and the flexible circuit board 490 The structure of is not limited thereto. For example, the flexible circuit board 490 may include three or more separated wiring members, and the plurality of separated wiring members may be sequentially connected through junction regions B1 formed at ends. Hereinafter, for convenience of description, an embodiment in which the flexible circuit board 490 includes the first wiring member 491 and the second wiring member 492 will be mainly described.

In one embodiment, the first wiring member 491 and the second wiring member 492 are formed of a flexible material, and the operation of the electronic device (eg, the first state of FIG. 3A and the second state of FIG. 3B) The form may change according to the state change operation of the electronic device between For example, the first wiring member 491 and the second wiring member 492 may form a first substrate surface 4911 and a third substrate surface 4921 based on the junction area B1 according to the operation of the electronic device. ) can be bent to change the spacing between them. In one embodiment, the first wiring member 491 includes one or more first bending portions 4913, at least a portion of which is partially bent, and the second wiring member 492 includes one or more first bending portions 4913 of which at least a portion is partially bent. A second bending portion 4923 may be included. In this case, the first bent portion 4913 is formed between the first connector 4914 and the joint area B1, and the second bent portion 4923 is formed between the second connector 4925 and the joint area B1. can be formed

In one embodiment, the bonding member 494 may bond the first bonding portion of the first wiring member 491 and the second bonding portion of the second wiring member 492 to each other. In one embodiment, the bonding member 494 is disposed in the bonding area B1, and both sides are bonded to the first substrate surface and the third substrate surface, respectively, thereby forming the first wiring member 491 and the second wiring member 492. can be joined. In one embodiment, the bonding member 494 is disposed between the first substrate surface and the third substrate surface in the form of a bonding sheet having an adhesive applied to the surface, or the first substrate surface forming the bonding area B1. And it may be formed by curing the adhesive applied between the surfaces of the third substrate. In one embodiment, the bonding member 494 is the first wiring member 491 and the second wiring member 492 forming the bonding area B1 in a state of looking at the second substrate surface 4912 as shown in FIG. 4B. It may be formed to have substantially the same shape as.

In one embodiment, the bonding member 494 may be formed of a material having relatively high stiffness compared to the first wiring member 491 and the second wiring member 492 . For example, the bonding member 494 may be formed of polypropylene resin, epoxy resin, ceramic, glass, and/or metal. In this case, the bonding member 494 is a part of the flexible circuit board 490 to limit the change in the shape of the bonding area B1 while the shape of the flexible circuit board 490 changes in response to the operation of the electronic device. The rigidity of the joint can be improved.

In one embodiment, the signal via 496 electrically connects the first signal circuit 495a of the first wiring member 491 and the second signal circuit 495b of the second wiring member 492. can In one embodiment, the signal via 496 is disposed in the junction area B1 and penetrates the first wiring member 491 and the second wiring member 492 to form the first signal circuit 495a and the second signal circuit. (495b) can be connected. For example, the first signal circuit 495a and the second signal circuit 495b include a via hole located in the junction area B1, and the signal via 496 is connected to the first signal circuit 495a and the second signal circuit 495a. By being inserted into each via hole of the signal circuit 495b, the first signal circuit 495a and the second signal circuit 495b can be electrically connected. In one embodiment, one or more signal vias 496 may be provided to correspond to the number of signal circuits formed on the wiring member. For example, as shown in FIG. 4C , when the first wiring member 491 and the second wiring member 492 each include three signal circuits, the first wiring member 491 is in the junction area B1. ) and three signal vias 496 for connecting three signal circuits formed on the second wiring member 492 to each other. However, the number of signal circuits and signal vias 496 disclosed in the drawing is an example for convenience of explanation, and the number of signal circuits and signal vias 496 is not limited thereto.

In one embodiment, the first cover member 493a and the second cover member 493b may be disposed on the surfaces of the first wiring member 491 and the second wiring member 492 to reinforce the junction area B1. there is. In one embodiment, the first cover member 493a is disposed to cover the second substrate surface 4912 of the first wiring member 491 forming the junction area B1, and the second cover member 493b is It may be disposed to cover the fourth substrate surface 4922 of the second wiring member 492 forming the junction area B1. As shown in FIG. 4B, based on a state in which the bonding area B1 is viewed from the second substrate surface 4912, the first cover member 493a overlaps at least a portion of the second substrate surface 4912 so as to overlap with the bonding member 494. , and the second cover member 493b may be disposed on at least a portion of the fourth substrate surface 4922 to overlap with the bonding member 494 . Hereinafter, for convenience of description, the first cover member 493a and the second cover member 493b are collectively referred to as cover members 493a and 493b, and unless otherwise specified, the cover member 493 It can be understood that the description is common to the first cover member 493a and the second cover member 493b.

In one embodiment, the cover member 493 may be formed of a flexible material. In one embodiment, the cover member 493 may include a first cover part 4931 and a second cover part 4932. In one embodiment, based on a state viewed from the second substrate surface 4912, the first cover part 4931 overlaps with the bonding member 494 and forms a bonding area B1, and the second cover part 4932 ) may extend from the first cover part 4931 so as not to overlap with the bonding member 494 . In one embodiment, the second cover portion 4932 of the first cover member 493a extends from the first cover portion in the first longitudinal direction L1, and the second cover portion of the second cover member 493b ( 4932) may extend from the first cover part 4931 in the second longitudinal direction L2.

In one embodiment, the second cover portion 4932 of the first cover member 493a and the second cover member 493b has a reinforcing area B2 extending from the joint area B1 in the longitudinal directions L1 and L2. can form In one embodiment, the second cover portion 4932 of each of the cover members 493a and 493b forming the reinforcing region B2 is formed on the first substrate surface 4911 and the second cover portion 4932 according to the shape deformation of the flexible circuit board 490. In the process of changing the distance between the third substrate surface 4921, the second substrate surface 4912 and the fourth substrate surface 4922 are supported and partially bent, so that the second substrate surface 4912 and the fourth substrate surface 4912 and the fourth substrate surface 4922 are bent. 4922 can guide to form a curved surface. Therefore, the second cover portion of the cover members 493a and 493b has excessive stress (( stress) can be reduced.

In one embodiment, the rigid member 498 may improve the rigidity of specific portions of the first wiring member 491 and the second wiring member 492 . In one embodiment, the rigid member 498 includes a first rigid member 498a disposed on at least a portion of the surface of the first wiring member 491 and disposed on at least a portion of the surface of the second wiring member 492. A second rigid member 498b may be included. In one embodiment, the rigid member 498 may be formed of a rigid material. For example, the rigid member 498 may be formed of polymer, ceramic, glass, and/or metal. The rigid member 498 may form a flat portion of the wiring member whose surface is not bent during the shape deformation process of the flexible circuit board 490 by supporting the portion of the wiring member not to be bent. In this case, the position and range of the bending portion of the wiring member can be adjusted through the arrangement position of the rigid member 498 with respect to the wiring member. Meanwhile, in FIG. 4A , the first rigid member 498a is disposed on the first substrate surface 4911 of the first wiring member 491, and the second rigid member 498a is disposed on the third substrate surface 4921 of the second wiring member 492. Although the rigid member 498b is illustrated as being disposed, this is for convenience of description, and the disposition position and number of the rigid member 498 relative to the wiring members 491 and 492 are not limited thereto. For example, based on the first wiring member 491, unlike that shown in FIG. 4A, the rigid member 498 is the first substrate surface 4911 and the second substrate surface of the first wiring member 491 ( 4912, and the rigid member 498 may be disposed between the first connector 4915 and the bending portion 4913.

5A is a partial perspective view illustrating a bonding area of a flexible circuit board according to an embodiment, FIG. 5B is a partial plan view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment, and FIG. 5C is a partial perspective view illustrating a bonding area of the flexible circuit board according to an exemplary embodiment. It is a partial sectional view showing the bonding area of the flexible circuit board.

5A to 5C, a flexible circuit board 590 according to an exemplary embodiment includes a first wiring member 591, a second wiring member 592, a bonding member 594, a signal via 596, and a first wiring member 591. A first cover member 593a, a second cover member 593b, and a dummy via 597 may be included.

In one embodiment, the first wiring member 591 and the second wiring member 592 may be connected through a junction area B1. In the junction area, the first wiring member 591 and the second wiring member 592 may be disposed to face each other on the surface. The first wiring member 591 may have a first longitudinal direction L1, and the second wiring member 592 may have a second longitudinal direction L2. In one embodiment, the first wiring member 591 includes a first signal circuit 595a formed along the first longitudinal direction L1 and transmitting an electrical signal, and the second wiring member 592 includes a second signal circuit 595a. A second signal circuit 595b formed along the longitudinal direction L2 and transmitting an electrical signal may be included. In one embodiment, the bonding member 594 is disposed in the bonding area B1, and both sides may be bonded to the first wiring member 591 and the second wiring member 592, respectively. In one embodiment, the bonding member 594 is formed of a material having higher rigidity than the first wiring member 591 and the second wiring member 592, so that the flexible circuit board 590 is deformed in the bonding area. The shape of (B1) can be restricted from being deformed. In this case, at least a portion of the first wiring member 591 and the second wiring member 592 may be bent to widen or narrow the gap between them with the junction area B1 as a boundary.

In an embodiment, the signal via 596 may be disposed in the bonding area and pass through the bonding member 594 to connect the first wiring member 591 and the second wiring member 592 . Both ends of the signal via 596 are connected to the first signal circuit 595a and the second signal circuit 595b as shown in FIG. 5C, thereby electrically connecting the first wiring member 591 and the second wiring member 592. can

In one embodiment, the first cover member 593a and the second cover member 593b may be disposed on surfaces of the first wiring member 591 and the second wiring member 592 to reinforce the bonding area. In one embodiment, the first cover member 593a is disposed on the surface of the first wiring member 591 to face the opposite direction to the bonding member 594, and the second cover member 593b is disposed on the bonding member 594. may be disposed on the surface of the second wiring member 592 so as to face the opposite direction. In one embodiment, the first cover member 593a and the second cover member 593b are formed of a flexible material and can be deformed in conformity with the bending operation of the wiring members 591 and 592 .

In one embodiment, the cover members 593a and 593b overlap the bonding member 594 and form the bonding area B1 based on the state in which the surface of the first wiring member 591 is viewed, as shown in FIG. 5B. It may include a first cover part 5931 and a second cover part 5932 extending from the first cover part 5931 along the longitudinal direction of the wiring member and forming the reinforcement region B2. In one embodiment, the second cover part 5932 is a portion of the wiring members 591 and 592 located in the reinforcing area B2 so that the surface of the wiring members 591 and 592 is not folded while the wiring members 591 and 592 are bent. Bending motions can be guided.

In an embodiment, the dummy via 597 may improve bonding strength of the bonding area B1 of the flexible circuit board 590 . In one embodiment, the dummy via 597 penetrates and connects the first cover member 593a and the second cover member 593b, thereby connecting the first wiring member 591 and the second wiring in the junction area B1. It can assist in maintaining the bonding state of the member 592 firmly. In one embodiment, the dummy via 597 may include a plurality of first dummy vias 597 disposed in the junction area. The plurality of first dummy vias 597 may pass through the first cover portion 5931 of the first cover member 593a and the second cover member 593b and be connected in a direction perpendicular to the surface of the wiring member. In this case, the plurality of first dummy vias 597 include the first wiring member 591, the second wiring member 592, the cover members 593a and 593b, and the bonding member 594 forming the junction area B1. It is possible to improve the bonding strength by simultaneously penetrating and physically connecting them.

In an embodiment, the dummy via 597 may be disposed so as not to overlap the first signal circuit 595a and the second signal circuit 595b so as not to interfere with electrical signal transmission through the flexible circuit board 590. . For example, as shown in FIG. 5B, based on a state in which the surface of the first wiring member 591 is viewed (eg, the second substrate surface in FIG. 4A), the signal via 596 is perpendicular to the first longitudinal direction L1. A plurality of dummy vias 597 are disposed at both sides of the wiring members 591 and 592 in the width direction, respectively. It can be. For example, the plurality of first dummy vias 597 may be disposed on the first cover part 5931 along both sides of the wiring member in the width direction.

In one embodiment, the flexible circuit board 590 is bonded to the first wiring member 591 and the second wiring member 592 through the bonding member 594, and the first cover member through the dummy via 597. Through the physical connection between (593a) and the second cover member (593b), it is possible to stably maintain the bonding state of the bonding area (B1).

6A is a partial perspective view illustrating a bonding area of a flexible circuit board according to an embodiment, FIG. 6B is a partial plan view illustrating a bonding area of a flexible circuit board according to an embodiment, and FIG. 6C is a partial perspective view illustrating a bonding area of the flexible circuit board according to an embodiment. It is a partial sectional view showing the bonding area of the flexible circuit board.

6A to 6C, a flexible circuit board 690 according to an exemplary embodiment includes a first wiring member 691, a second wiring member 692, a bonding member 694, a signal via 696, and a first wiring member 691. A first cover member 693a, a second cover member 693b, and a plurality of dummy vias 697 may be included.

In one embodiment, the first wiring member 691 and the second wiring member 692 may be connected through a junction area B1. In one embodiment, the first wiring member 691 includes a first signal circuit 695a formed along the first longitudinal direction L1, and the second wiring member 692 is formed along the second longitudinal direction L2. It may include a second signal circuit (695b) formed along the. In one embodiment, the bonding member 694 is disposed in the bonding area B1, and both surfaces may be bonded to the first wiring member 691 and the second wiring member 692, respectively. In an embodiment, the bonding member 694 may reduce bending of the bonding area B1 during shape deformation of the flexible circuit board 690 by improving the rigidity of the bonding area B1. In this case, at least a portion of the first wiring member 691 and the second wiring member 692 may be bent to widen or narrow the gap between them with the junction area B1 as a boundary.

In one embodiment, the signal via 696 may be disposed in the junction area B1 and pass through the junction member 694 to connect the first wiring member 691 and the second wiring member 692 . Both ends of the signal via 696 are connected to the first signal circuit 695a and the second signal circuit 695b as shown in FIG. 5C, thereby electrically connecting the first wiring member 691 and the second wiring member 692. can

In one embodiment, the first cover member 693a and the second cover member 693b may be disposed on the surfaces of the first wiring member 691 and the second wiring member 692 to reinforce the junction area B1. there is. In one embodiment, the first cover member 693a is disposed on the surface of the first wiring member 691 to face the opposite direction to the bonding member 694, and the second cover member 693b is the bonding member 694. may be disposed on the surface of the second wiring member 692 so as to face the opposite direction. In one embodiment, the first cover member 693a and the second cover member 693b are formed of a flexible material and can be deformed in conformity with the bending operation of the wiring members 691 and 692 . In one embodiment, the cover member 693 overlaps the bonding member 694 in a state in which the surface (eg, the second substrate surface of FIG. 4A) of the first wiring member 691 is viewed, as shown in FIG. 6A. A cover portion 6931 and a second cover portion 6932 extending from the first cover portion 6931 in the longitudinal directions L1 and L2 of the wiring members 691 and 692 may be included. In one embodiment, the first cover part 6931 of the cover member 693 forms the bonding area B1, and the second cover part 6932 of the cover member 693 forms the reinforcing area B2. can

The second cover part 6932 supports the outer surfaces of the wiring members 691 and 692 located in the reinforcing area B2, so that the wiring members 691 and 692 located at the boundary between the bonding area B1 and the reinforcing area B2 It is possible to reduce the occurrence of folding due to excessive stress being concentrated on the surface of the surface.

In one embodiment, the plurality of dummy vias 697 penetrate and connect the first cover member 693a and the second cover member 693b, thereby improving the bonding strength of the bonding area B1. In one embodiment, the plurality of dummy vias 697 may be arranged so as not to interfere with electrical signal transmission through the flexible circuit board 690 . In one embodiment, the plurality of dummy vias 697 are formed around the signal via 696 in a state of looking at the surface of the first wiring member 691 (eg, the second substrate surface in FIG. 4A) as shown in FIG. 6B. It can be arranged to wrap around. For example, the plurality of dummy vias 697 may be disposed at both ends in a width direction (eg, a width in a U-axis direction) of the wiring member along the first length direction. In this case, a plurality of dummy vias 697 may be disposed along the width direction at an end of the junction region B1 where the signal circuit does not extend.

In an embodiment, the dummy via 697 may include a first dummy via 697a disposed on the first cover part 6931 and a second dummy via 697b disposed on the second cover part 6932. can In an embodiment, the first dummy via 697a includes a first cover member 693a, a first wiring member 691, a bonding member 694, a second wiring member 692, and a second cover member 693b. By physically penetrating and connecting, the bonding strength of the bonding area B1 can be improved. In one embodiment, the second dummy via 697b penetrates and connects the second cover part 6932 of the first cover member 693a and the second cover part 6932 of the second cover member 693b, A distance between the first wiring member 691 and the second wiring member 692 forming the reinforcement region B2 may be maintained constant. Therefore, in the second dummy via 697, portions of the first wiring member 691 and the second wiring member 692 overlapping the second cover portion 6932 are bent during the shape deformation process of the flexible circuit board 690. It is possible to limit stress and reduce the concentration of stress on the parts of the wiring members 691 and 692 forming the boundary between the bonding area B1 and the reinforcing area B2.

7 is a partial perspective view illustrating a bonding area of a flexible circuit board according to an exemplary embodiment.

Referring to FIG. 7 , a flexible circuit board 790 according to an embodiment includes a first wiring member 791, a second wiring member 792, and a bonding member 794. ), a signal via 796, a first cover member 793a, a second cover member 793b, and a plurality of dummy vias 797.

In one embodiment, the first wiring member 791 and the second wiring member 792 may be connected through a junction area B1. In one embodiment, the first wiring member 791 and the second wiring member 792 may each include a signal circuit 795 formed along the longitudinal directions L1 and L2. In one embodiment, the bonding member 794 is disposed in the bonding area B1, and both sides thereof may be bonded to the first wiring member 791 and the second wiring member 792, respectively. In an embodiment, the bonding member 794 may reduce bending of the bonding area B1 during the shape deformation process of the flexible circuit board 790 by improving the rigidity of the bonding area B1. In this case, at least a portion of the first wiring member 791 and the second wiring member 792 may be bent to widen or narrow the gap between them with the junction area B1 as a boundary.

In one embodiment, the signal via 796 is disposed in the bonding area B1 and may pass through the bonding member 794 to connect the first wiring member 791 and the second wiring member 792 . Both ends of the signal via 796 are connected to the first signal circuit 595a and the second signal circuit 595b as shown in FIG. 5C, thereby electrically connecting the first wiring member 791 and the second wiring member 792. can

In one embodiment, the first cover member 793a and the second cover member 793b may be disposed on the surfaces of the first wiring member 791 and the second wiring member 792 to reinforce the bonding area B1. there is. In one embodiment, the first cover member 793a is disposed on the surface of the first wiring member 791 to face the opposite direction to the bonding member 794, and the second cover member 793b is the bonding member 794. may be disposed on the surface of the second wiring member 792 so as to face the opposite direction. In one embodiment, the first cover member 793a and the second cover member 793b are formed of a flexible material and can be deformed in conformity with the bending operation of the wiring members 791 and 792 .

In one embodiment, the cover member 793 has substantially the same shape as the bonding member 794 when looking at the surface of the first wiring member 791 (eg, the second substrate surface of FIG. 4A) as shown in FIG. 7 . It can be arranged so as to overlap the bonding member 794 with.

In one embodiment, the plurality of dummy vias 797 may penetrate and connect the first cover member 793a and the second cover member 793b. In this case, the plurality of dummy vias 797 include the first cover member 793a, the first wiring member 791, the bonding member 794, the second wiring member 792, and the second cover member 793b. By penetrating and connecting the two substrates in a direction perpendicular to the plane, bonding strength of the bonding region B1 can be improved. In one embodiment, the plurality of dummy vias 797 may be disposed not to overlap with the signal circuit so as not to interfere with signal transmission of the flexible circuit board 790 . For example, the plurality of dummy vias 797a and 797b are bonded to surround the circumference of the signal via 796 while looking at the surface of the first cover member 793a (eg, the second substrate surface of FIG. 4A). It may be disposed along the longitudinal direction at both ends of the area B1 in the width direction. In an embodiment, the dummy via 797 may include one or more auxiliary dummy vias 797c disposed along the width direction at a portion of the cover member 793 forming the boundary of the junction area B1. The auxiliary dummy via 797c is formed in the junction area B1 so that the junction state at the boundary of the junction region B1 is not released according to the change in the distance between the first wiring member 791 and the second wiring member 792. It can perform a function of reinforcing the bonding state of the boundary.

8A is a partial perspective view illustrating a bonding area of the flexible circuit board according to an exemplary embodiment, and FIG. 8B is a partial plan view illustrating a bonding area of the flexible circuit board according to an exemplary embodiment.

Referring to FIGS. 8A and 8B , a flexible circuit board 890 according to an exemplary embodiment includes a first wiring member 891, a second wiring member 892, a bonding member 894, a signal via 896, and a first wiring member 891. A first cover member 893a, a second cover member 893b, and a plurality of dummy vias 897 may be included.

In one embodiment, the first wiring member 891 and the second wiring member 892 may be connected through a junction area B1. In one embodiment, the first wiring member 891 includes a first signal circuit 895a formed along the first longitudinal direction L1, and the second wiring member 892 is formed along the second longitudinal direction L2. It may include a second signal circuit (895b) formed along. In one embodiment, the bonding member 894 is disposed in the bonding area B1, and both surfaces may be bonded to the first wiring member 891 and the second wiring member 892, respectively. In an embodiment, the bonding member 894 may reduce the degree of bending of the bonding area B1 during the shape deformation process of the flexible circuit board 890 by improving the rigidity of the bonding area B1. In this case, at least a portion of the first wiring member 891 and the second wiring member 892 may be bent to widen or narrow the gap between them with the junction area B1 as a boundary.

In one embodiment, the signal via 896 is disposed in the bonding area B1 and may pass through the bonding member 894 to connect the first wiring member 891 and the second wiring member 892 . Both ends of the signal via 896 are connected to the first signal circuit 895a and the second signal circuit 895b as shown in FIG. 5C, thereby electrically connecting the first wiring member 891 and the second wiring member 892. can

In one embodiment, the first cover member 893a and the second cover member 893b may be disposed on the surfaces of the first wiring member 891 and the second wiring member 892 to reinforce the junction area B1. there is. In one embodiment, the first cover member 893a is disposed on the surface of the first wiring member 891 to face the opposite direction to the bonding member 894, and the second cover member 893b is disposed on the bonding member 894. may be disposed on the surface of the second wiring member 892 so as to face the opposite direction. In one embodiment, the first cover member 893a and the second cover member 893b are formed of a flexible material and can be deformed in conformity with the bending operation of the wiring members 891 and 892 .

In one embodiment, the cover member 893 overlaps the bonding member 894 and overlaps the bonding area B1 based on a state in which the surfaces of the wiring members 891 and 892 are viewed (eg, the second substrate surface of FIG. 4A). ), and extends to both sides of the first cover part 8931 along the width direction perpendicular to the first longitudinal direction L1 (eg, the width in the U-axis direction) to form the first cover part 8931. A third cover part 8933 forming the second reinforcing area C may be included. The third cover part 8933 extends to the left side of the first cover part 8931 (eg, in the -U axis direction) and includes a 3-1 cover part 8933a forming a 2-1 reinforcement area C1, and , a 3-2 cover part 8933b extending to the right side of the first cover part 8931 (eg, in the +U-axis direction) and forming the 2-2 reinforcement region C2. Meanwhile, in the drawings, a pair of third cover parts 8933a and 8933b are connected to the first cover part, but this is for convenience of explanation, and the cover member 893 is the 3-1 cover part 8933a. ) and 3-2 cover parts 8933b, it may include only one of the third cover parts 8933a and 8933b, and the area of the pair of third cover parts 8933a and 8933b may be the same or different from each other. there is.

In an embodiment, the plurality of dummy vias 897 may penetrate and connect the first cover member 893a and the second cover member 893b. In an embodiment, the plurality of dummy vias 897 include a plurality of first dummy vias 897a and 897b disposed on the first cover part 8971 and a plurality of third dummy vias 897a and 897b disposed on the third cover part 8973. Dummy vias 897c and 897d may be included. In an embodiment, the plurality of first dummy vias 897a and 897b include a first cover member 893a, a first wiring member 891, a bonding member 894, a second wiring member 892, and a second cover. By connecting the member 893b in a direction perpendicular to the surfaces of the wiring members 891 and 892, bonding strength of the bonding region B1 may be improved. For example, the plurality of first dummy vias 897a and 897b may be disposed along the longitudinal direction at both ends of the junction region B1 in the width direction so as not to overlap with the signal circuit 895 . For example, the plurality of first dummy vias 897a and 897b include the 1-1st dummy via 897a disposed on the left side of the junction area B1 in the width direction (eg, -U axis direction) and the right side of the junction area B1 in the width direction. The first and second dummy vias 897b disposed in the (eg +U-axis direction) may be included.

In an embodiment, the plurality of third dummy vias 897c and 897d are disposed on the third cover part 8933 along the first longitudinal direction L1, and the first cover forming the third cover part 8933 By passing through and connecting the member 893a and the second cover member 893b, it is possible to maintain a constant distance between the first cover member 893a and the second cover member 893b. For example, the plurality of third dummy vias 897c and 897d are disposed on the 3-1st dummy via 897c disposed on the 3-1 cover part 8933a and on the 3-2 cover part 8933b. A 3-2 dummy via 897d may be included.

The plurality of third dummy vias 897c maintain a gap between the first cover member 893a and the second cover member 893b forming the second reinforcing regions C1 and C2 to join the bonding region B1. strength can be enhanced.

An electronic device 301 according to various embodiments includes a first housing 310, a second housing 320 partially movably connected to the first housing 310 along a movement direction D1, the The area of the display area supported by the first housing 310 and the second housing 320 and visually exposed to the outside according to the relative movement of the first housing 310 and the second housing 320 is minimal. a display (261) that changes between a first state and a second state that is maximum, and a flexible circuit board whose length in the movement direction changes according to the relative movement of the first housing and the second housing, The flexible circuit board 490 includes a first wiring member 491 including a first signal circuit 495a formed along a first longitudinal direction L1, and a first wiring member 491 formed along a second longitudinal direction L2. A second wiring member 492 including a two-signal circuit 495b, a joining member 494 joining the first wiring member 491 and the second wiring member 492 along the bonding area B1, and Disposed in the bonding area B1 and passing through the first wiring member 491 and the second wiring member 492 to electrically connect the first signal circuit 495a and the second signal circuit 495b It may include one or more signal vias 496 (vias).

In various embodiments, the first wiring member 491 includes a first substrate surface 4911 and a second substrate surface 4912 opposite to the first substrate surface 4911, and the second wiring member 491 Reference numeral 492 includes a third substrate surface 4921 and a fourth substrate surface 4922 opposite to the third substrate surface 4921, and in the bonding area B1, the first wiring member 491 ) and the second wiring member 492 are disposed so that the first substrate surface 4911 and the third substrate surface 4921 face each other with the bonding member 494 therebetween, and the bonding member 494 It may be formed to have substantially the same shape as.

In various embodiments, the flexible circuit board 490 is formed on at least a portion of the second substrate surface 4912 so as to overlap with the bonding member 494 based on a state in which the second substrate surface 4912 is viewed. The first cover member 493a and the fourth substrate surface 4922 are viewed, and the bonding member 494 is overlapped with the fourth substrate surface 4922. 2 may further include a cover member (493b).

In various embodiments, the flexible circuit board 490 may further include one or more dummy vias 597 connected to pass through the first cover member 493a and the second cover member 493b. there is.

In various embodiments, in a state in which the second substrate surface 4912 is viewed, the one or more dummy vias 597 (vias) are different from the first signal circuit 495a and the second signal circuit 495b. They can be arranged to be non-overlapping.

In various embodiments, in a state in which the second substrate surface 4912 is viewed, each of the first cover member 593a and the second cover member 593b overlaps the bonding member 594 and the bonding area ( B1) in the first longitudinal direction L1 and in the second longitudinal direction L2 from the first cover portion 5931 so as not to overlap with the first cover portion 5951 and the joining member 494. An extended second cover part 5932 may be included.

In various embodiments, the flexible circuit board 690 further includes a plurality of dummy vias 697 connected to pass through the first cover member 593a and the second cover member 693b. The dummy via 697 includes a plurality of first dummy vias 697a disposed on the first cover part 6931 and a plurality of second dummy vias 697b disposed on the second cover part 6932. can include

In various embodiments, based on a state in which the second substrate surface 4912 is viewed, the plurality of first dummy vias 597a extend along a width direction perpendicular to the first longitudinal direction L1, and the one or more first dummy vias 597a Each may be disposed on both sides of the signal via 596 .

In various embodiments, in a state in which the second substrate surface 4912 is viewed, each of the first cover member 893a and the second cover member 893b overlaps the bonding member 894 and the bonding area ( A first cover part 8931 forming B1), and a third cover part 8933a extending to both sides of the first cover part 8931 along the width direction perpendicular to the first longitudinal direction L1, 8933b).

In various embodiments, the flexible circuit board 890 further includes a plurality of dummy vias 897 connected to pass through the first cover member 893a and the second cover member 893b. The dummy via 597 includes a plurality of first dummy vias 897a disposed on the first cover part 8931 and the third cover part 8933a, in a state in which the second substrate surface 4912 is viewed. 8933b) may include a plurality of third dummy vias 897c.

In various embodiments, when looking at the second substrate surface 4912, each of the first cover member 793a and the second cover member 793b has substantially the same shape as the bonding member 794, It is arranged to overlap with the bonding member 794, and the flexible circuit board 790 penetrates and connects the first cover member 793a and the second cover member 793b, and the second substrate surface 4912 ), a plurality of dummy vias 797 disposed to surround the one or more signal vias 796 may be further included.

In various embodiments, the flexible circuit board 490 has a first connection to a first end of the first wiring member 491 opposite to the junction area B1 based on the first longitudinal direction L1. A connector 4915 and a second connector 4925 connected to a second end of the second wiring member 492 opposite to the bonding area B1 in the second longitudinal direction L2 may be further included. can

In various embodiments, the first wiring member 491 includes a first bending portion 4913 formed between the first connector 4915 and the junction area B1 and at least partially bent; , The second wiring member 492 may include a second bending portion 4923 formed between the second connector 4925 and the junction area B1 and at least partially bent.

In various embodiments, the flexible circuit board 490 is disposed on at least a portion of the surface of the first wiring member 491 and is a first rigid member for reinforcing the rigidity of the first wiring member 491 ( 498a), and a second rigid member 498b disposed on at least a portion of the surface of the second wiring member 492 to reinforce the rigidity of the second wiring member 492.

In various embodiments, the bonding member 494 may be formed of a material having higher rigidity than the first wiring member 491 and the second wiring member 492 .

A flexible circuit board 490 according to various embodiments includes a first substrate surface 4911 and a second substrate surface 4912 opposite to the first substrate surface 4911, and has a first substrate surface 4911 along a length direction. It includes a first wiring member 491 on which the signal circuit 495a is formed, a third substrate surface 4921, and a fourth substrate surface 4922 opposite to the third substrate surface 4921, and extends in the longitudinal direction. Accordingly, a second signal circuit 495b is formed, and a second wiring member 492 connected to the first wiring member 491 through a bonding area B1 is disposed in the bonding area B1, and both sides are A bonding member 494 bonded to the first substrate surface 4911 and the third substrate surface 4921, and disposed in the bonding area B1, the first wiring member 491 and the second wiring member ( 492) to electrically connect the first signal circuit 495a and the second signal circuit 495b, the junction The first cover member 493a disposed on the second substrate surface 4912 of the first wiring member 491 to cover the region B1 and the fourth substrate surface 4922 are viewed, and the bonding A second cover member 493b disposed on the fourth substrate surface 4922 of the second wiring member 492 may be included to cover the region B1.

In various embodiments, the flexible circuit board 490 further includes one or more dummy vias 597 penetrating and connecting the first cover member 493a and the second cover member 493b, and In a state in which the surface 4912 is viewed, the dummy via 597 may be disposed so as not to overlap the first signal circuit 495a and the second signal circuit 495b.

In various embodiments, each of the first cover member 493a and the second cover member 493b overlaps the bonding member 494 in a state of looking at the second substrate surface 4912 and the bonding area ( B1) may include a first cover part 4931 and a second cover part 4932 extending from the first cover part 4931 along the longitudinal direction.

In various embodiments, the first cover member 493a and the second cover member 493b are formed of a flexible material, and the first substrate surface 4911 and the third substrate surface 4921 are formed in the second cover portion. In the course of changing the distance between them, the first substrate surface 4911 and the third substrate surface 4921 may be guided to form a curved surface.

In various embodiments, in a state in which the second substrate surface 4912 is viewed, each of the first cover member 893a and the second cover member 893b overlaps the bonding member 894, and the bonding area A first cover part 8931 forming part (B1), and a third cover part 8933a, 8933b extending from the first cover part 8931 in a width direction perpendicular to the length direction, A plurality of dummy vias 897 passing through and connecting the first cover member 493a and the second cover member 493b may be disposed in the first cover part and the third cover part, respectively.

An electronic device 301 according to various embodiments includes a first housing 310, a second housing 320 partially movably connected to the first housing 310 along a movement direction D1, the The area of the display area supported by the first housing 310 and the second housing 320 and visually exposed to the outside according to the relative movement of the first housing 310 and the second housing 320 is minimal. A display 261 that changes between a first state and a second state that is maximum, and a flexible circuit board 490 having both ends disposed in the first housing 310 and the second housing 320, respectively wherein the flexible circuit board 490 has a first longitudinal direction L1, and a first wiring member including a first signal circuit 495a formed along the first longitudinal direction L1 ( 491), has a second longitudinal direction L2, and includes a second signal circuit 495b formed along the second longitudinal direction L2, and includes the first wiring member 491 through the junction area B1. ), a second wiring member 492 connected to the junction region B1, and both sides of the junction member 494 bonded to the first wiring member 491 and the second wiring member 492, respectively; At least a portion of the first cover member 493a disposed in the bonding area B1 and disposed on the surface of the first wiring member 491 to be opposite to the bonding member 494, at least a portion of the first cover member 493a is disposed in the bonding area ( B1), a second cover member 493b disposed on the surface of the second wiring member 492 opposite to the bonding member 494, disposed in the bonding area B1, and disposed on the first wiring One or more signal vias 496 passing through the member 491 and the second wiring member 492 to connect the first signal circuit 495a and the second signal circuit 495b, and the first cover member 493a ) and one or more dummy vias 597 penetrating and connecting the second cover member 493b.

Claims (20)

In electronic devices,
a first housing;
a second housing partially movably connected to the first housing along a movement direction;
A first state in which the area of the display area supported by the first housing and the second housing and visually exposed to the outside is minimized and a second state in which the area is maximized according to the relative movement of the first and second housings display changing between; and
a flexible circuit board whose length in the movement direction changes according to the relative movement of the first housing and the second housing;
The flexible circuit board,
a first wiring member including a first signal circuit formed along a first longitudinal direction;
a second wiring member including a second signal circuit formed along a second longitudinal direction;
a bonding member joining the first wiring member and the second wiring member along a bonding area; and
and one or more signal vias disposed in the bonding area and electrically connecting the first signal circuit and the second signal circuit through the first wiring member and the second wiring member. According to claim 1,
The first wiring member includes a first substrate surface and a second substrate surface opposite to the first substrate surface, and the second wiring member includes a third substrate surface and a fourth substrate surface opposite to the third substrate surface. Including the substrate surface,
In the junction area,
The first wiring member and the second wiring member are disposed so that the first substrate surface and the third substrate surface face each other with the bonding member interposed therebetween, and are formed to have substantially the same shape as the bonding member. electronic device. According to claim 2,
The flexible circuit board,
Based on the state of looking at the second substrate surface,
a first cover member disposed on at least a portion of the surface of the second substrate so as to overlap the bonding member; and
The electronic device further includes a second cover member disposed on at least a portion of the surface of the fourth substrate to overlap the bonding member. According to claim 3,
The flexible circuit board,
The electronic device further comprises one or more dummy vias connected to pass through the first cover member and the second cover member. According to claim 4,
In the state of looking at the second substrate surface,
The electronic device of claim 1 , wherein the one or more dummy vias are arranged to non-overlap the first signal circuit and the second signal circuit. According to claim 3,
In the state of looking at the second substrate surface,
Each of the first cover member and the second cover member,
a first cover portion overlapping the bonding member and forming the bonding area; and
and a second cover portion extending in the first longitudinal direction and the second longitudinal direction from the first cover portion so as not to overlap with the bonding member. According to claim 6,
Further comprising a plurality of dummy vias connected to pass through the first cover member and the second cover member,
The dummy via,
a plurality of first dummy vias disposed in the first cover portion; and
An electronic device comprising a plurality of second dummy vias disposed in the second cover portion. According to claim 7,
Based on the state of looking at the second substrate surface,
The plurality of first dummy vias are respectively disposed on both sides of the one or more signal vias along a width direction perpendicular to the first length direction. According to claim 3,
In the state of looking at the second substrate surface,
Each of the first cover member and the second cover member,
a first cover portion overlapping the bonding member and forming the bonding area; and
and a pair of third cover parts extending to both sides of the first cover part along a width direction perpendicular to the first length direction. According to claim 9,
Further comprising a plurality of dummy vias connected to pass through the first cover member and the second cover member,
The dummy via, in a state of looking at the second substrate surface,
a plurality of first dummy vias disposed in the first cover portion; and
and a plurality of third dummy vias disposed in the third cover portion. According to claim 3,
In the state of looking at the second substrate surface,
Each of the first cover member and the second cover member has substantially the same shape as the bonding member and is arranged to overlap with the bonding member,
The flexible circuit board,
The electronic device may further include a plurality of dummy vias passing through the first cover member and the second cover member and disposed to surround the at least one signal via in a state of looking at the second substrate surface. According to claim 1,
The flexible circuit board,
a first connector connected to a first end of a first wiring member opposite to the junction area in the first longitudinal direction; and
The electronic device further includes a second connector connected to a second end of the second wiring member opposite to the junction area based on the second longitudinal direction. According to claim 12,
The first wiring member includes a first bending portion formed between the first connector and the junction region, at least a portion of which is partially bent;
The electronic device of claim 1, wherein the second wiring member includes a second bending portion formed between the second connector and the bonding region, and at least a portion of which is partially bent. According to claim 1,
The flexible circuit board,
a first rigid member disposed on at least a portion of a surface of the first wiring member and reinforcing rigidity of the first wiring member; and
The electronic device further comprises a second rigid member disposed on at least a portion of a surface of the second wiring member and reinforcing rigidity of the second wiring member. According to claim 1,
The joining member is
An electronic device formed of a material having higher rigidity than the first wiring member and the second wiring member. In the flexible circuit board,
a first wiring member including a first substrate surface and a second substrate surface opposite to the first substrate surface, and having a first signal circuit formed along the length direction;
A second wiring member including a third substrate surface and a fourth substrate surface opposite to the third substrate surface, in which a second signal circuit is formed along the length direction, and connected to the first wiring member through a bonding area. ;
a bonding member disposed in the bonding area and having both surfaces bonded to the first substrate surface and the third substrate surface, respectively;
a signal via disposed in the bonding area and passing through the first wiring member and the second wiring member to electrically connect the first signal circuit and the second signal circuit;
a first cover member disposed on the second substrate surface of the first wiring member to cover the junction area in a state of looking at the second substrate surface; and
and a second cover member disposed on the fourth substrate surface of the second wiring member to cover the bonding area in a state in which the fourth substrate surface is viewed. According to claim 16,
Further comprising one or more dummy vias penetrating and connecting the first cover member and the second cover member,
The flexible circuit board of claim 1 , wherein the dummy via is disposed so as not to overlap the first signal circuit and the second signal circuit when viewed from the second substrate surface. According to claim 16,
Each of the first cover member and the second cover member,
In the state of looking at the second substrate surface,
a first cover portion overlapping the bonding member and forming the bonding area; and
and a second cover portion extending from the first cover portion along the longitudinal direction. According to claim 18,
The first cover member and the second cover member are formed of a flexible material,
and guides the second substrate surface and the second substrate surface to form a curved surface in a process in which a distance between the first substrate surface and the third substrate surface is changed in the second cover portion. In electronic devices,
a first housing;
a second housing partially movably connected to the first housing along a movement direction;
A first state in which the area of the display area supported by the first housing and the second housing and visually exposed to the outside is minimized and a second state in which the area is maximized according to the relative movement of the first and second housings display changing between; and
Both ends include a flexible circuit board disposed on the first housing and the second housing, respectively;
The flexible circuit board,
a first wiring member having a first longitudinal direction and including a first signal circuit formed along the first longitudinal direction;
a second wiring member having a second longitudinal direction, including a second signal circuit formed along the second longitudinal direction, and connected to the first wiring member through a junction area;
a bonding member disposed in the bonding area and having both surfaces bonded to the first wiring member and the second wiring member, respectively;
a first cover member at least partially disposed in the bonding area and disposed on a surface of the first wiring member so as to be opposite to the bonding member;
a second cover member at least partially disposed in the bonding area and disposed on a surface of the second wiring member so as to be opposite to the bonding member;
one or more signal vias disposed in the junction area and passing through the first wiring member and the second wiring member to connect the first signal circuit and the second signal circuit; and
and one or more dummy vias penetrating and connecting the first cover member and the second cover member.

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