KR20230072369A - Method and System for injecting liquid chemical to bond substrate - Google Patents

Abstract

A chemical injection method for bonding substrates according to an embodiment of the present invention includes a) a first substrate and a second substrate having a chemical injection area, a sealing area, and a vacuum suction area facing each other and having a chemical injection area, a sealing area, and a vacuum suction area at each edge by a position fixing device. positioning the substrate assembly including the substrate so that the substrate assembly including the substrate is inclined with respect to a bottom surface and a suction hole formed by the vacuum suction area is higher than an injection hole formed by the liquid medicine injection area; b) applying a vacuum suction force to the inlet of the substrate assembly by a vacuum suction device and supplying a chemical solution to the inlet of the substrate assembly by a chemical solution supply device; and c) one of a supply amount of the chemical solution supplied to the inlet port and the vacuum suction force applied to the inlet port, based on at least one of a flow rate and a pressure of the chemical solution injected through the inlet port by a control device. and controlling the chemical solution supply device and the vacuum suction device to adjust abnormality.

Description

Chemical injection method and system for substrate bonding {Method and System for injecting liquid chemical to bond substrate}

The present invention relates to a chemical injection method and system for bonding substrates, and more particularly, to a chemical injection method and system for bonding substrates having arbitrary shapes and arbitrary curvatures.

Recently, with the development of the information society, the demand for a display device that outputs image information is increasing. Such a display device is typically manufactured by performing a substrate bonding process in which the substrates are bonded by injecting a liquid chemical such as optical clear resin (OCR) between a pair of substrates.

Patent Document 1 (Korean Patent Publication No. 10-2010-0084381), which is a prior art related to a liquid material injection method between two substrates, is disclosed. Patent Document 1 is a liquid material injection method, i) a first method of injecting a liquid material by making the lower injection port in contact with the liquid material in a state where the substrate assembly in which the space between the two substrates is made into a vacuum state is vertically erected , ii) a second method of injecting a liquid material using capillary action, and iii) a third method of injecting a liquid material through an injection hole provided at one end of an upper portion of a vertically erected substrate assembly.

In the first method, the liquid material is not filled depending on the size and shape of the substrate assembly because the liquid material is injected from the lower end only by the pre-formed vacuum pressure in the substrate assembly in a state in which the substrate assembly is erected vertically. There is a problem.

In the second method, since the liquid material is injected in a state in which the substrate assembly is basically laid on the floor, bubbles are likely to be generated due to an increase in frictional force between the lower substrate and the liquid material. In addition, there is a problem that it cannot be applied to substrate assemblies of various sizes and shapes because there are cases where capillarity cannot be used depending on the size and shape of the substrate assembly.

In the third method, since the liquid material is injected from the upper end of the substrate assembly, the frictional force between the substrate and the liquid material is inevitably large, and there is a high possibility of bubbles being generated. In addition, even if these bubbles are removed later, there is a problem in that time for such a removal process is additionally consumed.

Korean Patent Publication No. 10-2010-0084381

An object of the present invention is a chemical solution injection method for bonding substrates capable of preventing the generation of air bubbles and unfilling of the chemical solution to a substrate having an arbitrary shape and arbitrary curvature and reducing the time required for the substrate bonding process. and to provide a system.

Another object of the present invention is to provide a chemical solution injection method and system for bonding substrates that can reliably prevent unfilled chemical solution due to deviation of internal space between various substrate assemblies caused by substrates having an arbitrary size and shape. is to provide

In order to achieve the above object, a chemical injection method for bonding substrates according to an embodiment of the present invention includes a) a chemical injection region, a sealing region, and a vacuum suction region at each edge by a position fixing device. The substrate assembly including a first substrate and a second substrate facing each other is inclined with respect to a bottom surface, and the suction hole formed by the vacuum suction area is higher than the injection hole formed by the liquid injection area. positioning; b) applying a vacuum suction force to the inlet of the substrate assembly by a vacuum suction device and supplying a chemical solution to the inlet of the substrate assembly by a chemical solution supply device; and c) one of a supply amount of the chemical solution supplied to the inlet port and the vacuum suction force applied to the inlet port, based on at least one of a flow rate and a pressure of the chemical solution injected through the inlet port by a control device. and controlling the chemical solution supply device and the vacuum suction device to adjust abnormality.

Preferably, in the chemical injection method for bonding substrates according to the above aspect, after step c), d) when it is determined that the chemical solution overflows from the suction port by the control device, the chemical solution supply device The method may further include stopping supply of the chemical solution to the injection port.

A chemical injection system for bonding substrates according to one feature of an embodiment of the present invention includes a substrate assembly including a first substrate and a second substrate having a chemical injection area, a sealing area, and a vacuum suction area at each edge and facing each other. a position fixing device for positioning the substrate assembly so that an inlet formed by the vacuum suction area is higher than an inlet formed by the liquid injection area and inclined with respect to a bottom surface; a vacuum suction device including a vacuum generating unit applying a vacuum suction force to the suction port of the substrate assembly; a chemical solution supplying device including a chemical solution supply unit supplying a chemical solution to the inlet of the substrate assembly; and adjusting at least one of a supply amount of the chemical solution supplied to the inlet and the vacuum suction force applied to the suction port based on at least one of a flow rate and a pressure of the chemical solution injected through the inlet. It is characterized in that it includes a control device for controlling the vacuum suction device.

Preferably, in the chemical solution injection system for bonding substrates according to the one feature, the chemical solution supply device causes the control device to stop supplying the chemical solution to the injection port when it is determined that the chemical solution overflows from the suction port. can control.

The following effects are achieved by using the chemical injection method and system for bonding substrates of the present invention.

1. With respect to a substrate having an arbitrary shape and arbitrary curvature, it is possible to prevent the generation of air bubbles and the non-filling of the chemical solution, and to reduce the time required for the substrate bonding process.

2. It is possible to reliably prevent unfilling of the chemical solution due to the deviation of the internal space between various substrate assemblies caused by the substrate having an arbitrary size and shape.

Hereinafter, preferred embodiments of a chemical solution injection method and system for bonding substrates according to the present invention will be described in detail with reference to the accompanying drawings.
1 is a schematic side view of a chemical solution injection system for bonding substrates according to an embodiment of the present invention.
2 is a block diagram of a chemical solution injection system for bonding substrates according to an embodiment of the present invention.
3 is a flowchart of a chemical solution injection method for bonding substrates according to an embodiment of the present invention.
4A to 6 are diagrams showing a chemical solution injection system and a substrate assembly for explaining a process in which a chemical solution injection method for bonding substrates according to an embodiment of the present invention is performed.
7 is a diagram showing a chemical solution injection system for bonding substrates according to a first modified example of an embodiment of the present invention.
8 is a diagram showing a chemical solution injection system for bonding substrates according to a second modified example of one embodiment of the present invention.

Hereinafter, preferred embodiments of a chemical solution injection method and system for bonding substrates according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic side view of a chemical solution injection system for bonding substrates according to an embodiment of the present invention. Referring to FIG. 1 , a control device 140 among components of the liquid injection system 100 is not shown. Also, the substrate assembly 11 is shown cut along the vertical direction.

2 is a block diagram of a chemical solution injection system for bonding substrates according to an embodiment of the present invention. Referring to FIG. 2 , only components necessary for controlling the liquid injection system 100 are shown, and the position fixing device 110 is not shown.

3 is a flowchart of a chemical solution injection method for bonding substrates according to an embodiment of the present invention.

4A to 6 are diagrams showing a chemical solution injection system and a substrate assembly for explaining a process in which a chemical solution injection method for bonding substrates according to an embodiment of the present invention is performed.

Specifically, FIG. 4A is a view showing a state in which the substrate assembly 10 is fixed in position by the position fixing device 110, and FIG. 4B is a view showing the inlet 14 and the inlet 13 in the fixed substrate assembly 10. ) is a view for explaining an angle α between a straight line L connecting a line L and the bottom surface BS, and FIG. 4C is a direction toward the surface 11a of the first substrate 11 (D; see FIG. 4B). A diagram showing the substrate assembly 10 as viewed. FIG. 5 is a diagram showing a state in which the chemical solution LC is supplied by the chemical solution supply device 130, and FIG. 6 is a diagram showing a state in which the filling of the chemical solution LC is completed.

7 is a diagram showing a chemical solution injection system for bonding substrates according to a first modified example of an embodiment of the present invention, and FIG. 8 is a diagram showing a chemical liquid injection system for bonding substrates according to a second modified example of an embodiment of the present invention. This diagram shows the system. 7 and 8, the positioning device 110 and the control device 140 are not shown.

First, referring to FIGS. 4B and 4C together with FIG. 5 , a substrate assembly 10 into which a chemical liquid LC is injected by a chemical liquid injection method and system for bonding substrates according to an embodiment of the present invention will be described. Same as

The substrate assembly 10 includes a first substrate 11 and a second substrate 12 facing each other. The first substrate 11 and the second substrate 12 have a chemical injection area IA, a sealing area SLA, and a vacuum suction area SA at their respective edges. An edge of the substrate assembly 10 is partially sealed by a sealing material 15 provided in the sealing area SLA. The substrate assembly 10 has a suction port 13 formed by the vacuum suction area SA and an injection port 14 formed by the chemical injection area IA. In addition, the substrate assembly 10 has an inner space S into which the chemical liquid LC is injected.

In addition, the shape of the substrate assembly 10 is not limited to the shapes shown in FIGS. 4B and 4C, and may have various shapes, such as, for example, the substrate assemblies 10A and 10B shown in FIGS. 7 and 8. can

Next, referring to FIGS. 1 and 2 together with FIGS. 4A to 6 , a chemical solution injection system 100 for bonding substrates according to an embodiment of the present invention will be described.

The chemical solution injection system 100 includes a position fixing device 110, a vacuum suction device 120, a chemical solution supply device 130, and a control device 140.

The position fixing device 110 positions the substrate assembly 10 so that the substrate assembly 10 is inclined with respect to the bottom surface BS and the inlet 13 is higher than the inlet 14. For example, the position fixing device 110 may be a fixing device capable of adjusting an angle so that the inlet 13 is positioned higher than the inlet 14 .

In this specification, the "bottom surface (BS)" may mean "a horizontal plane orthogonal to the vertical direction". In addition, "the substrate assembly 10 is inclined with respect to the bottom surface BS" means that the angle α between the straight line L connecting the inlet 14 and the suction port 13 and the bottom surface BS is 0°. It may mean "in the range of more than 90 degrees and less than 90 degrees."

In addition, referring to FIG. 4B, the position fixing device 110 has an angle α between a straight line L connecting the inlet 14 and the inlet 13 and the bottom surface BS in the range of 15 ° or more and 75 ° or less. It is possible to position the substrate assembly 10 so that For example, when the angle α between the straight line L connecting the inlet 14 and the inlet 13 and the bottom surface BS is 15° or more, friction between the chemical liquid L and the second substrate 12 The occurrence of air bubbles can be further prevented. For example, when the angle α between the straight line L connecting the inlet 14 and the inlet 13 and the bottom surface BS is 75° or less, the speed at which the chemical liquid LC fills the inner space S can be further increased.

For example, the position fixing device 110 may include a first position fixing part 111 and a second position fixing part 112 . The first position fixing part 111 may fix the position of the lower end of the substrate assembly 10 . Referring to FIG. 1 , the first position fixing unit 111 may be implemented by the stopper 111, but is not limited thereto, and may include a gripping unit (not shown) holding the lower end of the substrate assembly 10. It can be implemented by means. The second position fixing part 112 may fix the position of the central part or the upper part of the substrate assembly 10 . Referring to FIG. 1 , the second position fixing part 112 may be implemented by the support part 113 provided at the front end of the piston rod 114 moving in the forward and backward direction by the cylinder 115 . However, it is not limited thereto, and the second position fixing unit 112 may be implemented by various means, such as an adsorption unit (not shown) connected to a vacuum generation unit (not shown) that generates vacuum adsorption force. In addition, the position fixing device 110 is one position fixing device, such as, for example, a gripper (not shown) connected to an arm of a robot to grip the substrate assembly 10. It may be implemented by the government.

The vacuum suction device 120 includes a vacuum generator 121 that generates a vacuum to apply a vacuum suction force to the suction port 13 of the substrate assembly 10 . In addition, the vacuum suction device 120 may further include one or more of a vacuum level detector 122 , a liquid overflow detector 123 , and a vacuum pipe 124 .

The vacuum level sensor 122 is provided in the vacuum pipe 124 and detects the level of vacuum in the inner space S of the substrate assembly 10 .

The chemical liquid overflow detection unit 123 is provided in the vacuum pipe 124 and detects whether or not the chemical liquid LC overflows from the suction port 13 . For example, the chemical liquid overflow detection unit 123 may be implemented by an optical sensor (not shown) including a light emitting unit emitting light and a light receiving unit receiving light.

The vacuum pipe 124 is a pipe that connects the vacuum generator 121 and the inlet 13 of the substrate assembly 10 .

The chemical solution supply device 130 includes a chemical solution supply unit 131 supplying the chemical solution LC to the inlet 14 of the substrate assembly 10 . In addition, the chemical solution supply device 130 may further include one or more of a flow/pressure sensor 132 , a supply amount controller 133 , and an injection pipe 134 .

The flow/pressure sensor 132 detects at least one of the flow rate and pressure of the chemical liquid LC injected through the inlet 14 . The flow/pressure sensor 132 may be provided in the injection pipe 134 .

The supply amount controller 133 controls the supply amount of the chemical liquid LC supplied to the inlet 14 . The supply amount control unit 133 may be provided in the injection pipe 134.

The injection pipe 134 is a pipe connecting the injection port 14 of the substrate assembly 10 and the chemical solution supply unit 131 .

The control device 140 is applied to the supply amount of the chemical liquid LC supplied to the inlet 14 and the suction port 13 based on at least one of the flow rate and pressure of the chemical liquid LC injected through the inlet 14. Ji controls the chemical liquid supply device 130 and the vacuum suction device 120 to adjust one or more of the vacuum suction power.

In addition, the control device 140 may control the chemical solution supply device 130 to stop the supply of the chemical solution LC to the injection port 14 when it is determined that the chemical solution LC overflows from the inlet 13. there is.

In addition, the control device 140 is a chemical solution supply device for adjusting at least one of the supply amount and vacuum suction power of the chemical solution LC so that the flow rate of the chemical solution LC injected through the inlet 14 is within a predetermined flow rate range. 130 and the vacuum suction device 120 can be controlled. For example, when the flow rate of the chemical liquid LC injected through the inlet 14 is lower than the lower limit of the predetermined flow rate range, the control device 140 may perform a reduction in the supply amount of the chemical liquid LC and an increase in the vacuum suction power. It is possible to control the chemical solution supply device 130 and the vacuum suction device 120 to perform one or more of them. Accordingly, generation of air bubbles due to friction between the chemical liquid LC and the substrate assembly 10 may be prevented.

In addition, the control device 140 is a chemical solution supply device to adjust at least one of the supply amount and vacuum suction power of the chemical solution LC so that the pressure of the chemical solution LC injected through the inlet 14 is within a predetermined pressure range. 130 and the vacuum suction device 120 can be controlled. For example, the control device 140, when the pressure of the chemical liquid LC injected through the inlet 14 is higher than the upper limit of the predetermined pressure range, the supply amount of the chemical liquid LC is reduced and the vacuum suction power is increased. It is possible to control the chemical solution supply device 130 and the vacuum suction device 120 to perform one or more of them. Accordingly, generation of air bubbles due to friction between the chemical liquid LC and the substrate assembly 10 may be prevented.

Referring to FIG. 7 together with FIGS. 1 and 2, a chemical solution injection system 100A for bonding substrates according to a first modified example of an embodiment of the present invention will be described.

The chemical solution injection system 100A according to the first modification includes a position fixing device 110, a vacuum suction device 120, a chemical solution supply device 130A, and a control device 140. Compared to the chemical injection system 100 shown in FIG. 1, the chemical injection system 100A according to the first modified example is a substrate assembly in which the injection holes 14a to 14b are implemented as a plurality of injection holes 14a to 14b ( 10A), there is a difference in injecting the chemical liquid (LC). Therefore, the chemical solution injection system 100A according to the first modified example has a different configuration of the chemical solution supply device 130A compared to the chemical solution injection system 100 shown in FIG. 1 .

Specifically, the chemical solution supply device 130A includes a chemical solution supply unit 131, a plurality of flow rate/pressure sensing units 132a to 132b, a plurality of supply amount control units 133a to 133b, and a plurality of injection pipes 134a to 134b. includes

The plurality of flow/pressure detectors 132a to 132b respectively detect one or more of the flow rate and pressure of the chemical liquid LC injected through the corresponding inlets 14a to 14b. The plurality of supply amount controllers 133a to 133b respectively control the supply amount of the chemical liquid LC supplied to the corresponding inlets 14a to 14b. The plurality of injection pipes 134a to 134b connect corresponding injection ports 14a to 14c and the chemical solution supply unit 131, respectively.

The control device 140 of the chemical liquid injection system 100A according to the first modified example is configured to control a plurality of inlets 14a to 14b based on at least one of the flow rate and pressure of the chemical liquid LC for each of the plurality of inlets 14a to 14b. The chemical liquid supply device 130A and the vacuum suction device 120 may be controlled to adjust at least one of the supply amount of the chemical liquid LC for each of (14a to 14b) and the vacuum suction force applied to the suction port 13.

Referring to FIG. 8 together with FIGS. 1 and 2 , a chemical solution injection system 100B for bonding substrates according to a second modified example of an embodiment of the present invention will be described.

The chemical solution injection system 100B according to the second modification includes a position fixing device 110, a vacuum suction device 120B, a chemical solution supply device 130B, and a control device 140. Compared to the chemical solution injection system 100A according to the first modification, the chemical solution injection system 100B according to the second modification is a substrate assembly having a plurality of injection ports 14a to 14c and suction ports 13a to 13b, respectively ( 10B), there is a difference in injecting the chemical liquid (LC). Therefore, compared to the chemical solution injection system 100A according to the first modification, the chemical solution injection system 100B according to the second modification has a similar configuration of the chemical solution supply device 130B, and the vacuum suction device 120B There is a difference in the composition of

Specifically, the vacuum suction device 120B according to the second modified example includes a vacuum generator 121, a plurality of vacuum degree detectors 122a to 122b, a plurality of liquid overflow detectors 123a to 123b, and a plurality of vacuums. It includes pipes 124a to 124b.

A plurality of vacuum level detectors 122a to 122b are provided in corresponding vacuum pipes 124a to 124b to sense the vacuum level of the inner space S of the substrate assembly 10B. The plurality of chemical liquid overflow detectors 123a to 123b respectively detect overflow of the chemical liquid LC with respect to corresponding inlets 13a to 13b. The plurality of chemical liquid overflow detectors 123a to 123b may be provided in corresponding vacuum pipes 124a to 124b, respectively. The plurality of vacuum pipes 124a to 124b connect corresponding suction ports 13a to 13b and the vacuum generator 121, respectively.

The control device 140 of the chemical solution injection system 100B according to the second modified example converts the average value of the vacuum level sensed from the plurality of vacuum level detectors 122a to 122b into the inner space S of the substrate assembly 10B. The degree of vacuum can be judged.

In addition, when the control device 140 of the chemical liquid injection system 100B according to the second modified example determines that the liquid liquid LC overflows with respect to all of the plurality of suction ports 13a to 13b, the injection ports 14a to 14c The chemical solution supply device 130B may be controlled to stop supplying the chemical solution LC to the liquid crystal.

According to one feature of the embodiment of the present invention, the chemical injection system for substrate bonding (100, 100A, 100B) has a chemical injection area (IA), a sealing area (SLA), and a vacuum suction area (SA) at each edge. The substrate assemblies 10, 10A, and 10B including the first substrate 11 and the second substrate 12 facing each other are inclined with respect to the bottom surface BS and formed by the vacuum suction area SA. A position fixing device 110 for positioning the substrate assemblies 10, 10A, 10B so that the intake ports 13 and 13a to 13b are higher than the injection ports 14 and 14a to 14c formed by the chemical injection area IA. ); a vacuum suction device (120, 120B) including a vacuum generating unit (121) applying a vacuum suction force to the suction holes (13, 13a-13b) of the substrate assemblies (10, 10A, 10B); Chemical solution supply devices (130, 130A, 130B) including a chemical solution supply unit (131) supplying a chemical solution (LC) to the inlet (14, 14a ~ 14c) of the substrate assembly (10, 10A, 10B); and a supply amount of the chemical liquid LC supplied to the inlets 14 and 14a to 14c based on at least one of the flow rate and pressure of the chemical liquid LC injected through the inlets 14 and 14a to 14c. A control device 140 for controlling the chemical liquid supply devices 130, 130A, 130B and the vacuum suction devices 120, 120B to adjust one or more of the vacuum suction forces applied to the suction ports 13, 13a to 13b. It is characterized in that it includes.

Preferably, in the chemical liquid injection system (100, 100A, 100B) for substrate bonding according to the above feature, the control device 140 causes the chemical liquid (LC) to overflow from the suction ports (13, 13a-13b). When it is determined that the chemical solution supply device 130, 130A, 130B is controlled to stop the supply of the chemical solution LC to the inlets 14, 14a to 14c.

Referring to FIG. 3 together with FIGS. 1, 2, and 4A to 8, a chemical solution injection method for bonding substrates according to an embodiment of the present invention will be described.

In step 210, the position fixing device 110 determines that the substrate assemblies 10, 10A, and 10B are inclined with respect to the bottom surface BS and the inlets 13 and 13a to 13b are higher than the inlets 14 and 14a to 14c. position, the substrate assembly 10.

For example, in step 210, the position fixing device 110, the inlet (14, 14a ~ 14c) and the inlet (13, 13a ~ 13b) connecting the straight line (L) and the bottom surface (BS) angle (α) The substrate assemblies 10, 10A, and 10B may be positioned such that a is in the range of 15° or more and 75° or less.

In step 220, the vacuum suction devices 120 and 120B apply a vacuum suction force to the suction ports 13 and 13a to 13b of the substrate assemblies 10, 10A and 10B, and the chemical liquid supply devices 130, 130A and 130B apply a vacuum suction force to the substrate assembly 10, 10A and 10B. The chemical liquid LC is supplied to the injection ports 14 and 14a to 14c of (10).

In step 230, the control device 140, based on at least one of the flow rate and pressure of the chemical liquid LC injected through the inlets 14 and 14a to 14c, is supplied to the inlets 14 and 14a to 14c. The chemical liquid supply devices 130, 130A, and 130B and the vacuum suction devices 120 and 120B are controlled to adjust at least one of the supply amount of the LC and the vacuum suction force applied to the suction port 13.

For example, in step 230, the control device 140 controls the supply amount and vacuum suction power of the chemical liquid LC so that the flow rate of the chemical liquid LC injected through the inlets 14 and 14a to 14c is within a predetermined flow rate range. In order to adjust one or more of the liquid supply devices 130, 130A, 130B and the vacuum suction device 120, 120B may be controlled.

For example, in step 230, the control device 140 controls the supply amount and vacuum suction power of the chemical liquid LC so that the pressure of the chemical liquid LC injected through the inlets 14 and 14a to 14c is within a predetermined pressure range. In order to adjust one or more of the liquid supply devices 130, 130A, 130B and the vacuum suction device 120, 120B may be controlled.

Referring to FIGS. 7 and 8 , when the inlets 14a to 14c are implemented as a plurality of inlets 14a to 14c, in step 230, the control device 140, the plurality of inlets 14a to 14c The supply amount of the chemical liquid LC for each of the plurality of inlets 14a to 14c and the vacuum applied to the suction ports 13 and 13a to 13b based on at least one of the flow rate and pressure of the chemical liquid LC for each of The chemical liquid supply devices 130A and 130B and the vacuum suction devices 120 and 120B may be controlled to adjust one or more of the suction forces.

In addition, after step 230, when it is determined by the control device 140 that the chemical liquid LC overflows from the inlets 13 and 13a to 13b, the inlet 14, A step of stopping the supply of the chemical liquid LC to 14a to 14c) may be further performed. In this case, referring to FIG. 8 , when the intake ports 13a to 13b are implemented as a plurality of intake ports 13a to 13b, the control device 140 controls the chemical liquid LC to be applied to all of the plurality of intake ports 13a to 13b. When it is determined that the supply of the chemical liquid LC to the injection ports 14a to 14c is determined to be excessive, the chemical liquid supply device 130B may be controlled to stop supplying the chemical liquid LC to the injection ports 14a to 14c.

According to one feature of an embodiment of the present invention, a chemical injection method for bonding substrates includes a) a chemical injection area (IA), a sealing area (SLA), and a vacuum suction area at each edge by the position fixing device 100 The substrate assemblies 10, 10A, and 10B including the first substrate 11 and the second substrate 12 facing each other and having a (SA) are inclined with respect to the bottom surface (BS) and the vacuum suction area (SA) positioning the substrate assemblies (10, 10A, 10B) so that the inlet (13) formed by the liquid injection area (IA) is higher than the inlet (14) formed by the injection area (IA); b) A vacuum suction force is applied to the suction ports 13 and 13a to 13b of the substrate assemblies 10, 10A and 10B by the vacuum suction devices 120 and 120B, and the chemical liquid supply devices 130, 130A and 130B supplying a liquid chemical (LC) to the inlet (14, 14a to 14c) of the substrate assembly (10, 10A, 10B); and c) by the control device 140, based on at least one of the flow rate and pressure of the chemical liquid LC injected through the inlets 14 and 14a to 14c, to the inlets 14 and 14a to 14c. The chemical liquid supply devices (130, 130A, 130B) and the vacuum suction device (130, 130, 130B) characterized in that it comprises the step of controlling. Accordingly, with respect to the substrates 11 and 12 having an arbitrary shape and an arbitrary curvature, generation of bubbles and unfilling of the chemical liquid LC can be prevented, and time required for the substrate bonding process can be reduced.

Preferably, in the chemical injection method for substrate bonding according to the above feature, after the step c), d) the control device 140 controls the chemical liquid LC from the inlets 13 and 13a to 13b. A step of stopping the supply of the chemical liquid LC to the injection ports 14 and 14a to 14c by the chemical liquid supply devices 130 , 130A and 130B when it is determined that the liquid is overflowing may be further included. Accordingly, the unfilled chemical liquid LC due to the deviation of the internal space S between the various substrate assemblies 10, 10A, 10B caused by the substrates 11 and 12 having arbitrary sizes and shapes is ensured. It can be prevented.

Although the present invention has been shown and described with reference to the preferred embodiments of the accompanying exemplary drawings, it is not limited thereto, and those skilled in the art to which the present invention pertains within the scope of the technical idea of the present invention described in the claims below. Of course, it can be implemented in various forms.

10, 10A, 10B: substrate assembly 11: first substrate
12: second substrate 13: inlet
14: inlet 15: sealing material
100, 100A, 100B: Chemical injection system
110: position fixing device 111: first position fixing part
112: second position fixing part 113: support part
114: piston rod 115: cylinder
120, 120B: vacuum suction device 121: vacuum generating unit
122, 122a, 122b: Vacuum level detection unit 123, 123a, 123b: Liquid overflow detection unit
124, 124a, 124b: vacuum pipe 130, 130A, 130B: chemical solution supply device
131: chemical solution supply unit
132, 132a, 132b, 132c: flow/pressure sensor
133, 133a, 133b, 133c: supply control unit
134, 134a, 134b, 134c: injection pipe
140: control device
BS: bottom surface IA: liquid injection area
LC: chemical solution S: internal space
SA: vacuum suction area SLA: sealing area

Claims (13)

In the chemical injection method for bonding the substrate,
a) By means of a position fixing device, a substrate assembly including a first substrate and a second substrate having a chemical injection area, a sealing area, and a vacuum suction area at respective edges and facing each other is inclined with respect to the bottom surface and the vacuum suction is performed. positioning the substrate assembly such that an inlet formed by the area is higher than an inlet formed by the liquid injection area;
b) applying a vacuum suction force to the inlet of the substrate assembly by a vacuum suction device and supplying a chemical solution to the inlet of the substrate assembly by a chemical solution supply device; and
c) to adjust at least one of the supply amount of the chemical solution supplied to the inlet and the vacuum suction force applied to the suction port based on at least one of the flow rate and pressure of the chemical solution injected through the inlet by a control device; Controlling the chemical solution supply device and the vacuum suction device
A chemical injection method for bonding a substrate comprising a. The method of claim 1, after the step c), d) stopping the supply of the chemical solution to the inlet by the chemical solution supply device when it is determined by the control device that the chemical solution overflows from the suction port. A chemical solution injection method for bonding the substrate, characterized in that it further comprises. The method of claim 1, wherein in the step c), to adjust at least one of the supply amount of the chemical solution and the vacuum suction power so that the flow rate of the chemical solution injected through the inlet is within a predetermined flow rate range by the control device. A chemical solution injection method for bonding substrates, characterized in that the chemical solution supply device and the vacuum suction device are controlled. The method of claim 1, wherein, in the step c), adjusting at least one of the supply amount of the chemical solution and the vacuum suction force so that the pressure of the chemical solution injected through the inlet is within a predetermined pressure range by the control device. A chemical solution injection method for bonding substrates, characterized in that for controlling the chemical solution supply device and the vacuum suction device. The method of claim 1, wherein in the step a), the substrate assembly is positioned so that an angle between a straight line connecting the inlet and the inlet and the bottom surface is within a range of 15° or more and 75° or less by the position fixing device. A chemical solution injection method for bonding a substrate, characterized in that to do. The method of claim 1, wherein the inlet is implemented as a plurality of inlets,
In the step c), based on at least one of the flow rate and pressure of the chemical solution for each of the plurality of inlets, the control device determines the amount of supply of the chemical solution to each of the plurality of inlets and the vacuum suction force. A chemical solution injection method for bonding substrates, characterized in that the chemical solution supply device and the vacuum suction device are controlled to adjust at least one of them. In the chemical injection system for substrate bonding,
A substrate assembly including a first substrate and a second substrate having a chemical injection area, a sealing area, and a vacuum suction area at respective edges and facing each other is inclined with respect to a bottom surface and a suction port formed by the vacuum suction area is formed as described above. a position fixing device for positioning the substrate assembly so as to be higher than an injection hole formed by a liquid injection region;
a vacuum suction device including a vacuum generating unit generating a vacuum to apply a vacuum suction force to the suction port of the substrate assembly;
a chemical solution supplying device including a chemical solution supply unit supplying a chemical solution to the inlet of the substrate assembly; and
The chemical solution supply device and the vacuum to adjust at least one of a supply amount of the chemical solution supplied to the inlet and the vacuum suction force applied to the suction port based on at least one of a flow rate and a pressure of the chemical solution injected through the inlet. A control device that controls the suction device
Chemical injection system for substrate bonding, characterized in that it comprises a. 8. The chemical liquid for bonding substrates according to claim 7, wherein the control device controls the chemical liquid supply device to stop supplying the chemical liquid to the inlet when it is determined that the chemical liquid overflows from the inlet. injection system. 8 . The method of claim 7 , wherein the control device adjusts at least one of a supply amount of the chemical solution and the vacuum suction power so that the flow rate of the chemical solution injected through the inlet is within a predetermined flow rate range. A chemical liquid injection system for bonding substrates, characterized in that for controlling a vacuum suction device. 8 . The method of claim 7 , wherein the control device adjusts at least one of a supply amount of the chemical solution and the vacuum suction power so that the pressure of the chemical solution injected through the inlet is within a predetermined pressure range. A chemical liquid injection system for bonding substrates, characterized in that for controlling a vacuum suction device. 8. The substrate bonding according to claim 7 , wherein the position fixing device positions the substrate assembly such that an angle between a straight line connecting the inlet and the inlet and the bottom surface is in a range of 15° or more and 75° or less. A liquid injection system for 8 . The chemical solution injection system of claim 7 , wherein the vacuum suction device further comprises a vacuum pipe connected to the suction port, and a chemical solution overflow detection unit provided in the vacuum pipe to detect an overflow of the chemical solution. The method of claim 7, wherein the inlet is implemented as a plurality of inlets,
The control device supplies the chemical solution to adjust at least one of a supply amount of the chemical solution and the vacuum suction power to each of the plurality of inlets based on at least one of a flow rate and a pressure of the chemical solution for each of the plurality of inlets. A chemical liquid injection system for bonding substrates, characterized in that for controlling the device and the vacuum suction device.

Images