KR102578985B1 - Method and System for injecting liquid chemical to bond substrate - Google Patents

Abstract

A method of injecting a chemical solution for bonding substrates according to an embodiment of the present invention includes a) a first substrate and a second substrate facing each other, each having a chemical injection area, a sealing area, and a vacuum suction area at each edge by a position fixing device; Positioning the substrate assembly including the substrate so that the substrate assembly is inclined with respect to the bottom surface and the suction port formed by the vacuum suction region is higher than the injection port formed by the chemical injection region; b) applying a vacuum suction force to the suction port of the substrate assembly by a vacuum suction device and supplying a chemical solution to the injection port of the substrate assembly by a chemical solution supply device; and c) one of the supply amount of the chemical solution supplied to the injection port and the vacuum suction force applied to the suction port based on one or more of the flow rate and pressure of the chemical solution injected through the injection port by the control device. Characterized by comprising the step of controlling the chemical solution supply device and the vacuum suction device to control the abnormality.

Description

{Method and System for injecting liquid chemical to bond substrate}

The present invention relates to a chemical injection method and system for bonding substrates, and more specifically, to a chemical injection method and system for bonding substrates with arbitrary shapes and arbitrary curvatures.

Recently, with the development of the information society, demand for display devices that output image information is increasing. Such display devices are typically manufactured by performing a substrate bonding process in which the substrates are bonded by injecting a chemical solution such as OCR (Optical Clear Resin) between a pair of substrates.

Patent Document 1 (Korean Patent Publication No. 10-2010-0084381), which is a prior art regarding a method of injecting a liquid material between two substrates, is disclosed. Patent Document 1 is a method of injecting a liquid material, i) a first method of injecting a liquid material by placing the substrate assembly in a vertical state with the space between the two substrates in a vacuum state and bringing the injection hole at the bottom into contact with the liquid material. , ii) a second method of injecting a liquid material using capillary action, and iii) a third method of injecting a liquid material through an injection hole provided at one end of the upper part of a vertically erected substrate assembly.

In the first method, since the liquid material is injected from the bottom only by vacuum pressure previously formed within the substrate assembly while the substrate assembly is standing vertically, there is a problem in that the liquid material is not filled depending on the size and shape of the substrate assembly.

In the second method, since the liquid material is basically injected while the substrate assembly is lying on the floor, there is a high possibility that bubbles will be generated due to an increase in friction between the lower substrate and the liquid material. Additionally, since capillary action may not be utilized depending on the size and shape of the substrate assembly, there is a problem in that it cannot be applied to substrate assemblies of various sizes and shapes.

In the third method, since the liquid material is injected from the top of the substrate assembly, the friction between the substrate and the liquid material is inevitably large, which has the problem of high possibility of generating bubbles. In addition, even if these bubbles are removed later, there is a problem that additional time is consumed for the removal process.

Korean Patent Publication No. 10-2010-0084381

The object of the present invention is a chemical injection method for substrate bonding that can prevent the generation of bubbles and underfilling of the chemical solution for substrates with arbitrary shapes and arbitrary curvatures, and reduce the time required for the substrate bonding process. and providing a system.

Another object of the present invention is to provide a method and system for injecting a chemical solution for bonding substrates that can reliably prevent underfilling of the chemical solution due to differences in the internal space between various substrate assemblies that occur when the substrate has an arbitrary size and shape. It is about providing.

In order to achieve the above object, the chemical injection method for substrate bonding according to an embodiment of the present invention is a) a chemical injection area, a sealing area, and a vacuum suction area at each edge by a position fixing device. A substrate assembly including a first substrate and a second substrate facing each other is inclined with respect to the bottom surface and the suction port formed by the vacuum suction region is higher than the injection port formed by the chemical injection region. positioning; b) applying a vacuum suction force to the suction port of the substrate assembly by a vacuum suction device and supplying a chemical solution to the injection port of the substrate assembly by a chemical solution supply device; and c) one of the supply amount of the chemical solution supplied to the injection port and the vacuum suction force applied to the suction port based on one or more of the flow rate and pressure of the chemical solution injected through the injection port by the control device. Characterized by comprising the step of controlling the chemical solution supply device and the vacuum suction device to control the abnormality.

Preferably, the chemical injection method for substrate bonding according to the above feature includes, after step c), d) when the control device determines that the chemical liquid overflows from the suction port, the chemical liquid supply device It may further include stopping the supply of the chemical solution to the injection port.

A chemical injection system for substrate bonding according to an embodiment of the present invention includes a substrate assembly including a first substrate and a second substrate facing each other and having a chemical injection area, a sealing area, and a vacuum suction area at each edge. a position fixing device that is inclined with respect to the bottom surface and positions the substrate assembly so that the suction port formed by the vacuum suction region is higher than the injection port formed by the chemical solution injection region; a vacuum suction device including a vacuum generator that applies a vacuum suction force to the suction port of the substrate assembly; a chemical solution supply device including a chemical solution supply unit that supplies a chemical solution to the injection port of the substrate assembly; And based on one or more of the flow rate and pressure of the chemical solution injected through the injection port, the chemical solution supply device and the It is characterized by including a control device for controlling the vacuum suction device.

Preferably, the chemical injection system for substrate bonding according to the above feature includes the chemical liquid supply device such that the control device stops supplying the chemical liquid to the injection port when it is determined that the chemical liquid overflows from the suction port. can be controlled.

The following effects are achieved by using the chemical injection method and system for substrate bonding of the present invention.

1. For substrates with arbitrary shapes and arbitrary curvatures, the generation of bubbles and underfilling of chemical solutions can be prevented, and the time required for the substrate bonding process can be reduced.

2. As the substrate has an arbitrary size and shape, it is possible to reliably prevent underfilling of the chemical solution due to differences in the internal space between various substrate assemblies.

Hereinafter, preferred embodiments of the chemical injection method and system for bonding substrates according to the present invention will be described in detail with reference to the attached drawings.
1 is a schematic side view of a chemical injection system for bonding substrates according to an embodiment of the present invention.
Figure 2 is a block diagram of a chemical injection system for substrate bonding according to an embodiment of the present invention.
Figure 3 is a flowchart of a chemical injection method for bonding a substrate according to an embodiment of the present invention.
Figures 4A to 6 are diagrams showing a chemical injection system and a substrate assembly to explain the process of performing a chemical injection method for bonding a substrate according to an embodiment of the present invention.
Figure 7 is a diagram showing a chemical injection system for bonding a substrate according to a first modified example of an embodiment of the present invention.
Figure 8 is a diagram showing a chemical injection system for bonding substrates according to a second modification of an embodiment of the present invention.

Hereinafter, preferred embodiments of the chemical injection method and system for bonding substrates according to the present invention will be described in detail with reference to the attached drawings.

1 is a schematic side view of a chemical injection system for bonding substrates according to an embodiment of the present invention. With respect to FIG. 1 , the control device 140 among the components of the chemical injection system 100 is not shown. Additionally, the substrate assembly 11 is shown cut along the vertical direction.

Figure 2 is a block diagram of a chemical injection system for substrate bonding according to an embodiment of the present invention. With respect to FIG. 2 , only the components necessary for controlling the chemical injection system 100 are shown, and the position fixing device 110 is not shown.

Figure 3 is a flowchart of a chemical injection method for bonding a substrate according to an embodiment of the present invention.

Figures 4A to 6 are diagrams showing a chemical injection system and a substrate assembly to explain the process of performing a chemical injection method for bonding a substrate according to an embodiment of the present invention.

Specifically, FIG. 4A is a diagram illustrating a state in which the substrate assembly 10 is positioned fixed by the position fixing device 110, and FIG. 4B shows the inlet 14 and the suction port 13 in the positioned substrate assembly 10. ) is a diagram to explain the angle α between the straight line L connecting the This is a diagram showing the substrate assembly 10 as viewed. FIG. 5 is a diagram showing a state in which the chemical liquid LC is supplied by the chemical liquid supply device 130, and FIG. 6 is a diagram showing a state in which filling of the chemical liquid LC is completed.

Figure 7 is a diagram showing a chemical injection system for bonding a substrate according to a first modification of an embodiment of the present invention, and Figure 8 is a diagram showing a chemical injection system for bonding a substrate according to a second modification of an embodiment of the present invention. This is a diagram showing the system. 7 and 8, the positioning device 110 and the control device 140 are not shown.

First, referring to FIGS. 4B and 4C along with FIG. 5 , the substrate assembly 10 into which the chemical liquid (LC) is injected by the chemical liquid injection method and system for substrate bonding according to an embodiment of the present invention will be described as follows. Same as

The substrate assembly 10 includes a first substrate 11 and a second substrate 12 facing each other. The first substrate 11 and the second substrate 12 have a chemical injection area (IA), a sealing area (SLA), and a vacuum suction area (SA) at each edge. The edges of the substrate assembly 10 are partially sealed by the sealant 15 provided in the sealing area SLA. The substrate assembly 10 has a suction port 13 formed by a vacuum suction area SA, and an injection port 14 formed by a chemical injection area IA. Additionally, the substrate assembly 10 has an internal space S into which the chemical liquid LC is injected.

In addition, the shape of the substrate assembly 10 is not limited to the shape shown in FIGS. 4B and 4C, and may have various shapes, such as the substrate assemblies 10A and 10B shown in FIGS. 7 and 8. You can.

Next, referring to FIGS. 1 and 2 along with FIGS. 4A to 6 , the chemical injection system 100 for bonding substrates according to an embodiment of the present invention will be described as follows.

The chemical injection system 100 includes a position fixing device 110, a vacuum suction device 120, a chemical solution supply device 130, and a control device 140.

The position fixing device 110 positions the substrate assembly 10 so that the substrate assembly 10 is inclined with respect to the bottom surface BS and the suction port 13 is higher than the injection port 14. For example, the position fixing device 110 may be a fixing device that can adjust the angle so that the suction port 13 is positioned higher than the injection port 14.

In this specification, “bottom surface (BS)” may mean “a horizontal surface perpendicular to the vertical direction.” In addition, "the substrate assembly 10 is inclined with respect to the bottom surface (BS)" means that the angle (α) between the straight line (L) connecting the inlet 14 and the suction port 13 and the bottom surface (BS) is 0°. It can mean “in a range of more than 90°.”

In addition, referring to Figure 4b, the position fixing device 110 has an angle (α) between the straight line (L) connecting the inlet 14 and the suction port 13 and the bottom surface (BS) in the range of 15° to 75°. The substrate assembly 10 can be positioned so that. For example, if the angle α between the straight line L connecting the inlet 14 and the suction inlet 13 and the bottom surface BS is 15° or more, friction between the chemical liquid L and the second substrate 12 causes This can further prevent the generation of air bubbles. For example, if the angle (α) between the straight line (L) connecting the inlet (14) and the suction port (13) and the bottom surface (BS) is 75° or less, the speed at which the chemical liquid (LC) is filled in the internal space (S) can be further increased.

For example, the position fixing device 110 may include a first position fixing part 111 and a second position fixing part 112. The first position fixing part 111 may position and fix the lower end of the substrate assembly 10 . Referring to FIG. 1, the first position fixing part 111 may be implemented by a stopper 111, but is not limited thereto, and may be implemented by various types such as a gripping part (not shown) that grips the lower end of the substrate assembly 10. It can be implemented by means. The second position fixing unit 112 may fix the central portion or upper portion of the substrate assembly 10 . Referring to FIG. 1 , the second position fixing part 112 may be implemented by a support part 113 provided at the tip of the piston rod 114 that moves in the front-back direction by the cylinder 115. However, it is not limited to this, and the second position fixing unit 112 may be implemented by various means, such as an adsorption unit (not shown) connected to a vacuum generator (not shown) that generates vacuum adsorption force. In addition, the position fixing device 110 is a position fixing device, such as, for example, a gripper (not shown) connected to the arm of the robot and capable of gripping the substrate assembly 10. It could also be implemented by the government.

The vacuum suction device 120 includes a vacuum generator 121 that generates a vacuum to apply a vacuum suction force to the suction port 13 of the substrate assembly 10. Additionally, the vacuum suction device 120 may further include one or more of a vacuum level detection unit 122, a chemical liquid overflow detection unit 123, and a vacuum pipe 124.

The vacuum level detection unit 122 is provided in the vacuum pipe 124 and detects the vacuum level of the internal space S of the substrate assembly 10.

The chemical liquid overflow detection unit 123 is provided in the vacuum pipe 124 and detects whether the chemical liquid LC is overflowing from the suction port 13. For example, the chemical overflow detection unit 123 may be implemented by an optical sensor (not shown) including a light emitting unit that emits light and a light receiving unit that receives light.

The vacuum pipe 124 is a pipe that connects the vacuum generator 121 and the suction port 13 of the substrate assembly 10.

The chemical solution supply device 130 includes a chemical solution supply unit 131 that supplies a chemical solution (LC) to the injection port 14 of the substrate assembly 10. In addition, the chemical solution supply device 130 may further include one or more of a flow rate/pressure detection unit 132, a supply amount control unit 133, and an injection pipe 134.

The flow/pressure detection unit 132 detects one or more of the flow rate and pressure of the chemical liquid (LC) injected through the injection port 14. The flow/pressure sensing unit 132 may be provided in the injection pipe 134.

The supply amount control unit 133 controls the supply amount of the chemical liquid (LC) supplied to the injection port 14. The supply amount control unit 133 may be provided in the injection pipe 134.

The injection pipe 134 is a pipe that connects the injection port 14 of the substrate assembly 10 and the chemical solution supply unit 131.

The control device 140 controls the supply amount of the chemical liquid (LC) supplied to the injection port 14 and the pressure applied to the inlet 13 based on one or more of the flow rate and pressure of the chemical liquid (LC) injected through the injection port 14. The chemical solution supply device 130 and the vacuum suction device 120 are controlled to adjust one or more of the vacuum suction forces.

In addition, the control device 140 may control the chemical solution supply device 130 to stop supply of the chemical solution (LC) to the injection port 14 when it is determined that the chemical solution (LC) is overflowing from the inlet 13. there is.

In addition, the control device 140 is a chemical solution supply device to adjust one or more of the supply amount and vacuum suction force of the chemical liquid (LC) so that the flow rate of the chemical liquid (LC) injected through the injection port 14 is within a predetermined flow rate range. (130) and the vacuum suction device (120) can be controlled. For example, when the flow rate of the chemical liquid (LC) injected through the injection port 14 is lower than the lower limit of the predetermined flow rate range, the control device 140 reduces the supply amount of the chemical liquid (LC) and increases the vacuum suction force. The chemical solution supply device 130 and the vacuum suction device 120 can be controlled to perform one or more operations. As a result, it is possible to prevent the generation of bubbles due to friction between the chemical liquid LC and the substrate assembly 10.

In addition, the control device 140 is a chemical solution supply device to adjust one or more of the supply amount and vacuum suction force of the chemical liquid (LC) so that the pressure of the chemical liquid (LC) injected through the injection port 14 is within a predetermined pressure range. (130) and the vacuum suction device (120) can be controlled. For example, when the pressure of the chemical liquid (LC) injected through the injection port 14 is higher than the upper limit of the predetermined pressure range, the control device 140 reduces the supply amount of the chemical liquid (LC) and increases the vacuum suction force. The chemical solution supply device 130 and the vacuum suction device 120 can be controlled to perform one or more operations. As a result, it is possible to prevent the generation of bubbles due to friction between the chemical liquid LC and the substrate assembly 10.

Referring to FIG. 7 along with FIGS. 1 and 2, the chemical injection system 100A for substrate bonding according to the first modified example of an embodiment of the present invention will be described as follows.

The chemical injection system 100A according to the first modification includes a position fixing device 110, a vacuum suction device 120, a chemical liquid supply device 130A, and a control device 140. Compared to the chemical injection system 100 shown in FIG. 1, the chemical injection system 100A according to the first modification is a substrate assembly ( There is a difference in injecting the chemical solution (LC) into 10A). Accordingly, the chemical solution injection system 100A according to the first modification has a different configuration of the chemical solution supply device 130A compared to the chemical solution injection system 100 shown in FIG. 1.

Specifically, the chemical solution supply device 130A includes a chemical solution supply unit 131, a plurality of flow rate/pressure detection units 132a to 132b, a plurality of supply amount control units 133a to 133b, and a plurality of injection pipes 134a to 134b. Includes.

The plurality of flow/pressure detection units 132a to 132b each detect one or more of the flow rate and pressure of the chemical liquid (LC) injected through the corresponding injection ports 14a to 14b. A plurality of supply amount control units (133a to 133b) each adjust the supply amount of chemical liquid (LC) supplied to the corresponding injection ports (14a to 14b). A plurality of injection pipes 134a to 134b connect the corresponding injection ports 14a to 14c and the chemical solution supply unit 131, respectively.

The control device 140 of the chemical liquid injection system 100A according to the first modification is configured to operate a plurality of injection holes 14a to 14b based on one or more of the flow rate and pressure of the chemical liquid LC for each of the plurality of injection holes 14a to 14b. The chemical liquid supply device 130A and the vacuum suction device 120 can be controlled to adjust one or more of the supply amount of the chemical liquid (LC) and the vacuum suction force applied to the suction port 13 for each of (14a to 14b).

Referring to FIG. 8 along with FIGS. 1 and 2, the chemical injection system 100B for substrate bonding according to the second modification of an embodiment of the present invention will be described as follows.

The chemical injection system 100B according to the second modification includes a position fixing device 110, a vacuum suction device 120B, a chemical liquid supply device 130B, and a control device 140. Compared to the chemical injection system 100A according to the first modification, the chemical injection system 100B according to the second modification example is a substrate assembly ( There is a difference in injecting the chemical solution (LC) into 10B). Therefore, compared to the chemical injection system 100A according to the first modification, the chemical injection system 100B according to the second modification example has a similar configuration of the chemical liquid supply device 130B and the vacuum suction device 120B. There is a difference in the composition.

Specifically, the vacuum suction device 120B according to the second modification includes a vacuum generating unit 121, a plurality of vacuum degree detection units 122a to 122b, a plurality of chemical liquid overflow detection units 123a to 123b, and a plurality of vacuum Includes pipes 124a to 124b.

A plurality of vacuum level detection units (122a to 122b) are provided in the corresponding vacuum pipes (124a to 124b) to detect the vacuum level of the internal space (S) of the substrate assembly (10B). The plurality of chemical liquid overflow detection units 123a to 123b each detect the overflow of chemical liquid LC to the corresponding suction ports 13a to 13b. A plurality of chemical liquid overflow detection units 123a to 123b may be provided in corresponding vacuum pipes 124a to 124b, respectively. A plurality of vacuum pipes 124a to 124b connect the corresponding suction ports 13a to 13b and the vacuum generator 121, respectively.

The control device 140 of the chemical injection system 100B according to the second modification uses the average value of the vacuum degree detected from the plurality of vacuum degree detection units 122a to 122b to the internal space S of the substrate assembly 10B. It can be judged by the degree of vacuum.

In addition, the control device 140 of the chemical injection system 100B according to the second modification example is configured to operate the injection ports 14a to 14c when it is determined that the chemical liquid LC overflows all of the plurality of suction ports 13a to 13b. The chemical solution supply device 130B can be controlled to stop supply of the chemical solution LC to .

According to one feature of an embodiment of the present invention, the chemical injection system (100, 100A. 100B) for substrate bonding has a chemical injection area (IA), a sealing area (SLA), and a vacuum suction area (SA) at each edge. A substrate assembly (10, 10A, 10B) including a first substrate (11) and a second substrate (12) facing each other is inclined with respect to the bottom surface (BS) and is formed by the vacuum suction area (SA). A position fixing device (110) for positioning the substrate assembly (10, 10A, 10B) so that the suction port (13, 13a ~ 13b) is higher than the injection port (14, 14a ~ 14c) formed by the chemical injection area (IA) ); A vacuum suction device (120, 120B) including a vacuum generator (121) that applies vacuum suction force to the suction ports (13, 13a-13b) of the substrate assembly (10, 10A, 10B); a chemical solution supply device (130, 130A, 130B) including a chemical solution supply unit (131) for supplying a chemical solution (LC) to the injection ports (14, 14a to 14c) of the substrate assembly (10, 10A, 10B); And based on one or more of the flow rate and pressure of the chemical liquid (LC) injected through the injection ports (14, 14a ~ 14c), the supply amount of the chemical liquid (LC) supplied to the injection ports (14, 14a ~ 14c), and A control device 140 that controls the chemical solution supply devices 130, 130A, 130B and the vacuum suction devices 120, 120B to adjust one or more of the vacuum suction forces applied to the suction ports 13, 13a ~ 13b. It is characterized by including.

Preferably, the chemical injection system (100, 100A, 100B) for substrate bonding according to the above feature is configured to allow the control device (140) to allow the chemical liquid (LC) to overflow from the suction ports (13, 13a to 13b). When it is determined that the chemical solution (LC) is supplied to the injection ports (14, 14a to 14c), the chemical solution supply devices (130, 130A, 130B) can be controlled to stop supply.

Referring to FIG. 3 along with FIGS. 1, 2, and 4A to 8, a method of injecting a chemical solution for bonding a substrate according to an embodiment of the present invention will be described as follows.

In step 210, the position fixing device 110 is configured such that the substrate assembly 10, 10A, 10B is inclined with respect to the bottom surface BS and the inlet ports 13, 13a-13b are higher than the inlet ports 14, 14a-14c. Position the substrate assembly 10 as shown.

For example, in step 210, the position fixing device 110 sets an angle (α) between a straight line (L) connecting the inlet (14, 14a-14c) and the suction port (13, 13a-13b) and the bottom surface (BS). The substrate assemblies 10, 10A, 10B can be positioned so that is in a range of 15° or more and 75° or less.

In step 220, the vacuum suction device (120, 120B) applies vacuum suction force to the suction ports (13, 13a ~ 13b) of the substrate assembly (10, 10A, 10B), and the chemical solution supply device (130, 130A, 130B) is applied to the substrate assembly (10, 10A, 10B). The chemical solution (LC) is supplied to the injection ports (14, 14a to 14c) of (10).

In step 230, the control device 140 controls the chemical liquid supplied to the injection ports 14, 14a to 14c based on one or more of the flow rate and pressure of the chemical liquid LC injected through the injection ports 14 and 14a to 14c. The chemical solution supply devices (130, 130A, 130B) and the vacuum suction devices (120, 120B) are controlled to adjust one or more of the supply amount of (LC) and the vacuum suction force applied to the suction port 13.

For example, in step 230, the control device 140 adjusts the supply amount and vacuum suction force of the chemical liquid (LC) so that the flow rate of the chemical liquid (LC) injected through the injection ports 14, 14a ~ 14c is within a predetermined flow rate range. In order to adjust one or more of the chemical solution supply devices (130, 130A, 130B) and vacuum suction devices (120, 120B), it is possible to control.

For example, in step 230, the control device 140 adjusts the supply amount and vacuum suction force of the chemical liquid LC so that the pressure of the chemical liquid LC injected through the injection ports 14, 14a to 14c is within a predetermined pressure range. In order to adjust one or more of the chemical solution supply devices (130, 130A, 130B) and vacuum suction devices (120, 120B), it is possible to control.

7 and 8, when the injection ports 14a to 14c are implemented as a plurality of injection ports (14a to 14c), in step 230, the control device 140 operates the plurality of injection ports 14a to 14c. Based on one or more of the flow rate and pressure of the chemical liquid (LC) for each of the supply amount of the chemical liquid (LC) to each of the plurality of injection ports (14a to 14c) and the vacuum applied to the suction ports (13, 13a to 13b) The chemical solution supply devices (130A, 130B) and the vacuum suction devices (120, 120B) can be controlled to adjust one or more of the suction forces.

In addition, after step 230, when it is determined by the control device 140 that the chemical liquid (LC) overflows from the inlet ports 13, 13a to 13b, the chemical liquid supply devices 130, 130A, 130B are used to inject the chemical liquid LC into the injection port 14, A further step of stopping the supply of the chemical liquid (LC) to 14a-14c) may be further performed. In this case, referring to FIG. 8, when the inlet ports 13a to 13b are implemented as a plurality of inlet ports 13a to 13b, the control device 140 controls the chemical liquid LC to flow through all of the plurality of inlet ports 13a to 13b. When it is determined that the chemical solution LC is overflowing, the chemical solution supply device 130B can be controlled to stop supply of the chemical solution LC to the injection ports 14a to 14c.

According to one feature of an embodiment of the present invention, the chemical injection method for bonding a substrate is a) a chemical injection area (IA), a sealing area (SLA), and a vacuum suction area at each edge by the position fixing device 100. A substrate assembly (10, 10A, 10B) including a first substrate (11) and a second substrate (12) facing each other (SA) is inclined with respect to the bottom surface (BS) and is positioned in the vacuum suction area (SA). Positioning the substrate assembly (10, 10A, 10B) so that the suction port (13) formed by is higher than the injection port (14) formed by the chemical solution injection area (IA); b) Vacuum suction force is applied to the suction ports 13, 13a to 13b of the substrate assembly 10, 10A, 10B by the vacuum suction device 120, 120B, and chemical solution supply device 130, 130A, 130B Supplying a chemical liquid (LC) to the injection ports (14, 14a to 14c) of the substrate assembly (10, 10A, 10B); and c) to the injection ports 14, 14a to 14c based on one or more of the flow rate and pressure of the chemical liquid (LC) injected through the injection ports 14, 14a to 14c by the control device 140. The chemical liquid supply device (130, 130A, 130B) and the vacuum suction device (130, It is characterized in that it includes the step of controlling 130B). Accordingly, with respect to the substrates 11 and 12 having arbitrary shapes and arbitrary curvatures, the generation of bubbles and underfilling of the chemical liquid (LC) can be prevented, and the time required for the substrate bonding process can be reduced.

Preferably, in the method of injecting a chemical solution for bonding a substrate according to the above feature, after step c), d) the control device 140 allows the chemical solution LC to be dispensed from the suction ports 13, 13a to 13b. When it is determined that it is overflowing, the step of stopping the supply of the chemical solution (LC) to the injection ports (14, 14a to 14c) by the chemical solution supply device (130, 130A, 130B) may be further included. Accordingly, non-filling of the chemical liquid (LC) due to variation in the internal space (S) between the various substrate assemblies (10, 10A, 10B) caused by the substrates (11, 12) having arbitrary sizes and shapes is ensured. It can be prevented.

The present invention has been shown and described focusing on the preferred embodiments of the attached exemplary drawings, but is not limited thereto and is within the scope of the technical idea of the present invention as set forth in the following claims. Of course, it can be implemented in various forms.

10, 10A, 10B: substrate assembly 11: first substrate
12: second substrate 13: intake port
14: Inlet 15: Sealing material
100, 100A, 100B: Chemical injection system
110: position fixing device 111: first position fixing unit
112: second position fixing part 113: support part
114: piston rod 115: cylinder
120, 120B: Vacuum suction device 121: Vacuum generating unit
122, 122a, 122b: Vacuum level detection unit 123, 123a, 123b: Chemical overflow detection unit
124, 124a, 124b: Vacuum piping 130, 130A, 130B: Chemical solution supply device
131: Chemical supply unit
132, 132a, 132b, 132c: Flow/pressure sensing unit
133, 133a, 133b, 133c: Supply amount control unit
134, 134a, 134b, 134c: injection pipe
140: control device
BS: Bottom IA: Chemical injection area
LC: chemical liquid S: internal space
SA: Vacuum suction area SLA: Sealing area

Claims (15)

In a method of injecting a chemical solution for bonding a substrate,
a) By a position fixing device, a substrate assembly including a first substrate and a second substrate facing each other and having a chemical injection area, a sealing area, and a vacuum suction area at each edge is inclined with respect to the bottom surface and the vacuum suction area is tilted with respect to the bottom surface. Positioning the substrate assembly so that the suction port formed by the region is higher than the injection port formed by the chemical solution injection region;
b) Applying a vacuum suction force to the suction port of the substrate assembly by a vacuum suction device, and the chemical solution supply device including a flow/pressure detection unit that detects one or more of the flow rate and pressure of the chemical solution injected through the injection port. Supplying a chemical solution to the injection port of the substrate assembly; and
c) controlling the chemical solution supply device to adjust the supply amount of the chemical solution supplied to the injection port based on one or more of the flow rate and pressure of the chemical solution injected through the injection port by a control device.
A method of injecting a chemical solution for bonding a substrate, comprising: The method of claim 1, after step c), d) stopping the supply of the chemical solution to the injection port by the chemical solution supply device when the control device determines that the chemical solution is overflowing from the inlet. A method of injecting a chemical solution for bonding a substrate, further comprising: The method of claim 1, wherein in step c), the control device controls the chemical solution supply device to adjust the supply amount of the chemical solution so that the flow rate of the chemical solution injected through the injection port is within a predetermined flow rate range. A method of injecting a chemical solution for bonding a substrate, characterized in that: The method of claim 1, wherein in step c), the control device controls the chemical solution supply device to adjust the supply amount of the chemical solution so that the pressure of the chemical solution injected through the injection port is within a predetermined pressure range. A method of injecting a chemical solution for bonding a substrate, characterized in that: The method of claim 1, wherein in step a), the substrate assembly is positioned by the position fixing device so that the angle between the bottom surface and a straight line connecting the inlet and the suction inlet is in a range of 15° to 75°. A method of injecting a chemical solution for bonding a substrate, characterized in that: The method of claim 1, wherein the injection port is implemented as a plurality of injection ports,
In step c), the control device adjusts the supply amount of the chemical solution to each of the plurality of injection ports based on one or more of the flow rate and pressure of the chemical solution to each of the plurality of injection ports. A method of injecting a chemical solution for bonding a substrate, characterized in that the supply device is controlled. The method of claim 1, wherein step c) is performed by the control device, based on one or more of the flow rate and pressure of the chemical solution injected through the injection port, the supply amount of the chemical solution supplied to the injection port, and the supply amount of the chemical solution to the inlet port. A method of injecting a chemical solution for bonding a substrate, comprising the step of controlling the chemical solution supply device and the vacuum suction device to adjust the applied vacuum suction force. In a chemical injection system for substrate bonding,
A substrate assembly including a first substrate and a second substrate facing each other and having a chemical injection area, a sealing area, and a vacuum suction area at each edge is inclined with respect to the bottom surface, and the suction port formed by the vacuum suction area is a position fixing device that positions the substrate assembly so that it is higher than the injection hole formed by the chemical injection area;
a vacuum suction device including a vacuum generator that generates a vacuum to apply a vacuum suction force to the suction port of the substrate assembly;
a chemical solution supply device including a flow rate/pressure sensing unit that detects one or more of the flow rate and pressure of the chemical solution injected through the injection hole, and a chemical solution supply unit that supplies the chemical solution to the injection hole of the substrate assembly; and
A control device that controls the chemical solution supply device to adjust the supply amount of the chemical solution supplied to the injection port based on one or more of the flow rate and pressure of the chemical solution injected through the injection port.
A chemical injection system for substrate bonding, comprising: The chemical solution for substrate bonding according to claim 8, wherein the control device controls the chemical solution supply device to stop supplying the chemical solution to the injection port when it is determined that the chemical solution overflows from the inlet. injection system. The method of claim 8, wherein the control device controls the chemical solution supply device to adjust the supply amount of the chemical solution so that the flow rate of the chemical solution injected through the injection hole is within a predetermined flow rate range. Chemical injection system for. The method of claim 8, wherein the control device controls the chemical solution supply device to adjust the supply amount of the chemical solution so that the pressure of the chemical solution injected through the injection hole is within a predetermined pressure range. Chemical injection system for. The method of claim 8, wherein the position fixing device positions the substrate assembly such that an angle between a straight line connecting the inlet and the suction inlet and the bottom surface is in a range of 15° to 75°. Chemical injection system for. The chemical injection system for substrate bonding according to claim 8, wherein the vacuum suction device further includes a vacuum pipe connected to the suction port, and a chemical liquid overflow detection unit provided in the vacuum pipe to detect overflow of the chemical liquid. The method of claim 8, wherein the injection port is implemented as a plurality of injection ports,
The control device is characterized in that it controls the chemical solution supply device to adjust the supply amount of the chemical solution to each of the plurality of injection ports based on one or more of the flow rate and pressure of the chemical solution to each of the plurality of injection ports. A chemical injection system for bonding substrates. The method of claim 8, wherein the control device adjusts the supply amount of the chemical solution supplied to the injection port and the vacuum suction force applied to the suction port based on one or more of the flow rate and pressure of the chemical solution injected through the injection port. A chemical injection system for substrate bonding, characterized in that the chemical liquid supply device and the vacuum suction device are controlled so as to do so.

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