KR20230072273A - Photosensitive resin composition, photosensitive resin layer using the same and color filter - Google Patents

Abstract

The present description relates to a photosensitive resin composition, a photosensitive resin film manufactured using the photosensitive resin composition, and a color filter including the same, wherein the photosensitive resin composition includes: (A) a binder resin polymerized from a monomer mixture containing a specific content of a monomer of a specific structure; (B) a photopolymerizable compound; (C) a photopolymerizable initiator; (D) a colorant including xanthene-based dyes and pigments; and (E) a solvent. One embodiment is intended to improve chemical resistance, patternability and the like of the photosensitive resin composition.

Description

Photosensitive resin composition, photosensitive resin film and color filter manufactured using the same

The present disclosure relates to a photosensitive resin composition, a photosensitive resin film and a color filter prepared using the photosensitive resin composition.

An image sensor corresponds to a semiconductor that converts photons into electrons to be displayed on a display or stored in a storage device.

The image sensor is classified into a charge coupled device (CCD) image sensor and a complementary metal oxide semiconductor (CMOS) image sensor according to a manufacturing process and an application method.

Meanwhile, the image sensor includes a color filter including filter segments for additive and mixed primary colors of red, green, and blue.

A pigment dispersion method is known as one of the methods for producing the color filter. However, when the color filter is manufactured by the pigment dispersion method, there are limitations in luminance and contrast ratio due to the size of the pigment particle. Moreover, in the case of a color imaging device for an image sensor, a smaller dispersion particle size is required to form a fine pattern.

In this regard, as a photosensitive resin composition for preparing a color filter, a dye-type photosensitive resin composition in which the dye is completely replaced with a dye, a hybrid-type photosensitive resin composition in which the pigment and the dye are simultaneously used, and the like have been proposed. However, the dye has an advantage of not forming particles, but has a disadvantage of inferior chemical resistance and patternability compared to the pigment.

One embodiment is to improve the chemical resistance, patternability, etc. of the photosensitive resin composition.

Another embodiment is to provide a photosensitive resin film prepared using the photosensitive resin composition.

Another embodiment is to provide a color filter manufactured using the photosensitive resin film.

One embodiment is (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a colorant; (E) a solvent; and (F) a silane compound represented by Formula 1 below.

[Formula 1]

In Formula 1, L ¹ is a substituted or unsubstituted alkylene having 7 to 10 carbon atoms; L ² is a single bond or a substituted or unsubstituted alkylene having 1 to 10 carbon atoms; R ¹ to R ³ are the same or different, and each independently represents hydrogen, substituted or unsubstituted alkoxy having 1 to 10 carbon atoms, or substituted or unsubstituted alkyl having 1 to 10 carbon atoms.

The L ² may be a substituted or unsubstituted alkyl having 1 to 5 carbon atoms.

The R ¹ to R ³ are the same or different, and each independently may be a substituted or unsubstituted alkoxy having 1 to 5 carbon atoms.

The silane compound may be represented by any one of Formulas 1-1 to 1-8:

[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

[Formula 1-4]

[Formula 1-5]

[Formula 1-6]

[Formula 1-7]

.

.

[Formula 1-8]

.

.

The silane compound may be included in an amount of 2 wt % to 4 wt % based on the total amount of the photosensitive resin composition.

The colorant may include a dye.

The dye may include a phthalocyanine-based green dye.

The silane compound may be included in an amount of 5 parts by weight to 7 parts by weight based on 100 parts by weight of the phthalocyanine-based green dye.

The photosensitive resin composition, based on the total amount of the photosensitive resin composition, the (A) binder resin 1% to 20% by weight; 0.1% to 20% by weight of the (B) photopolymerizable compound; 0.1% to 5% by weight of the (C) photopolymerization initiator; 15% to 75% by weight of the (D) colorant; 2% to 4% by weight of the (F) silane compound represented by Formula 1; and (E) the remainder of the solvent.

The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; A coupling agent containing a vinyl group or a (meth)acryloxy group; leveling agent; fluorine-based surfactants; And it may further include at least one additive selected from a radical polymerization initiator.

The photosensitive resin composition may be used for a CMOS image sensor.

Another embodiment provides a photosensitive resin film prepared using a photosensitive resin composition.

Another embodiment provides a color filter including the photosensitive resin film.

Another embodiment provides a CMOS image sensor including the color filter.

The specific details of other aspects of the present invention are included in the detailed description below.

The photosensitive resin composition according to an embodiment includes the silane compound represented by Chemical Formula 1, so that excellent properties such as chemical resistance and pattern properties can be exhibited.

Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, and the present invention is not limited thereby, and the present invention is only defined by the scope of the claims to be described later.

Unless otherwise specified herein, "substitution" means that at least one hydrogen atom in a compound is a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, No group, azido group, amidino group, hydrazino group, hydrazono group, carbonyl group, carbamyl group, thiol group, ester group, ether group, carboxyl group or its salt, sulfonic acid group or its salt, phosphoric acid or its salt. , C1 to C20 alkyl group, C2 to C20 alkenyl group, C2 to C20 alkynyl group, C6 to C30 aryl group, C3 to C20 cycloalkyl group, C3 to C20 cycloalkenyl group, C3 to C20 cycloalkynyl group, C2 to C20 heterocycloalkyl group , A C2 to C20 heterocycloalkenyl group, a C2 to C20 heterocycloalkynyl group, or a substituent of a combination thereof.

Unless otherwise specified herein, "heterocycloalkyl group", "heterocycloalkenyl group", "heterocycloalkynyl group" and "heterocycloalkylene group" mean cycloalkyl, cycloalkenyl, cycloalkynyl and cycloalkyl, respectively. It means that at least one N, O, S or P heteroatom exists in the ring compound of ene.

Unless otherwise defined in the chemical formula within this specification, if a chemical bond is not drawn at a position where a chemical bond is to be drawn, it means that a hydrogen atom is bonded to the position.

(Photosensitive Resin Composition)

One embodiment is (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a colorant; (E) a solvent; and (F) a silane compound represented by Formula 1 below.

[Formula 1]

In Formula 1, L ¹ is a substituted or unsubstituted alkylene having 7 to 10 carbon atoms; L ² is a single bond or a substituted or unsubstituted alkylene having 1 to 10 carbon atoms; R ¹ to R ³ are the same or different, and each independently represents hydrogen, substituted or unsubstituted alkoxy having 1 to 10 carbon atoms, or substituted or unsubstituted alkyl having 1 to 10 carbon atoms.

The photosensitive resin composition of one embodiment includes the silane compound represented by Chemical Formula 1, so that excellent properties such as chemical resistance and pattern properties can be exhibited.

Specifically, the silane compound represented by Chemical Formula 1 includes 1) a long linking group (L ¹ ) between a silicon element and an oxygen element, and 2) an epoxy group at at least one terminal.

1) More specifically, the silane compound represented by Formula 1 includes a substituted or unsubstituted alkylene having 7 to 10 carbon atoms as a linking group (L ¹ ) between the silicon element and the oxygen element, thereby improving chemical resistance and pattern It can express itself excellently throughout. However, when the carbon number of the linking group (L ¹ ) between the silicon element and the oxygen element is 6 or less, chemical resistance may be deteriorated, and residue characteristics (developability) may be deteriorated when the carbon number is 11 or more. Therefore, it is important to control the carbon number of the linking group (L ¹ ) between the silicon element and the oxygen element.

2) Furthermore, since the silane compound represented by Chemical Formula 1 includes an epoxy group at at least one terminal, chemical resistance can be further supplemented.

Overall, the silane compound represented by Formula 1, 1) including a long linking group (L ¹ ) between the silicon element and the oxygen element, and 2) including an epoxy group at at least one end, thereby implementing the above embodiment. Examples of the photosensitive resin composition can be made to exhibit excellent properties in chemical resistance, patternability, and the like.

Hereinafter, each component included in the photosensitive resin composition will be described in detail.

(F) a silane compound represented by Formula 1

As mentioned above, the silane compound represented by Chemical Formula 1 is a component that contributes to chemical resistance and pattern properties of the photosensitive resin composition of the embodiment.

In Formula 1, L ¹ may be an alkylene having 7 to 10 carbon atoms.

L ² may be a substituted or unsubstituted alkyl having 1 to 5 carbon atoms; For example, it may be an alkyl having 1 carbon atom (i.e., methyl).

R ¹ to R ³ are the same or different, and each independently may be a substituted or unsubstituted alkoxy group having 1 to 5 carbon atoms; For example, R ¹ to R ³ may be alkoxy having 2 carbon atoms (ie, ethoxy).

Representative examples of the silane compound represented by Formula 1 are as follows:

[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

[Formula 1-4]

[Formula 1-5]

[Formula 1-6]

[Formula 1-7]

.

.

[Formula 1-8]

.

.

Although the silane compound functions as an additive, it may be used in excess of a general additive.

Specifically, if the general additives are included in less than 1% by weight of the total amount of the photosensitive resin composition, the silane compound may be included in 2% to 4% by weight of the total amount of the photosensitive resin composition. For example, the silane compound is present in an amount of 2 wt% or more, 2.1 wt% or more, 2.2 wt% or more, 2.3 wt% or more, 2.4 wt% or more, or 2.5 wt% or more and 4 wt% or less, out of the total amount of the photosensitive resin composition. , 3.9 wt% or less, or 3.8 wt% or less.

More specifically, the content of the silane compound may be determined in relation to the type or content of the colorant.

Although described in more detail later, the colorant may include a dye, and in this case, the resin composition of one embodiment may be a dye-type or hybrid-type composition. In addition, the dye is not particularly limited, but may include a phthalocyanine-based green dye.

When the dye includes the phthalocyanine-based green dye, the silane compound may be included in the photosensitive resin composition in an amount of 5 parts by weight to 7 parts by weight based on 100 parts by weight of the phthalocyanine-based green dye.

For example, based on 100 parts by weight of the phthalocyanine-based green dye, the silane compound may be included in the photosensitive resin composition in an amount of 5 parts by weight or more, 5.5 parts by weight or more, or 6 parts by weight or more and 7 parts by weight or less. Within this range, the photosensitive resin composition can exhibit excellent interfacial adhesion to the wafer even at the lowest exposure amount (eg, 100 mm/sec).

(A) binder resin

The binder resin may include an acrylic resin.

The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and includes one or more acrylic repeating units.

The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5 wt % to 50 wt %, for example, 10 wt % to 40 wt %, based on the total amount of the acrylic binder resin.

The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, or vinylbenzylmethyl ether; Methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxy butyl (meth)acrylate, benzyl (meth)acrylate, unsaturated carboxylic acid ester compounds such as cyclohexyl (meth)acrylate and phenyl (meth)acrylate; Unsaturated carboxylic acid amino alkyl ester compounds, such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; carboxylic acid vinyl ester compounds such as vinyl acetate and vinyl benzoate; unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth)acrylate; vinyl cyanide compounds such as (meth)acrylonitrile; unsaturated amide compounds such as (meth)acrylamide; and the like, and these may be used alone or in combination of two or more.

Specific examples of the acrylic resin include (meth)acrylic acid/benzyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene copolymer, (meth)acrylic acid/benzyl methacrylate/2-hydroxyethyl methacrylate late copolymers, (meth)acrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymers, and the like, but are not limited thereto, and may be used alone or in combination of two or more. .

The binder resin may include an epoxy-based binder resin.

The binder resin may improve heat resistance by further including an epoxy-based binder resin. The epoxy-based binder resin may include, for example, a phenol novolak epoxy resin, a tetramethyl biphenyl epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, an alicyclic epoxy resin, or a combination thereof, but is limited thereto It is not.

Furthermore, the binder resin including the epoxy-based binder resin secures dispersion stability of a colorant such as a pigment, which will be described later, and helps to form a pixel having a desired resolution during a developing process.

The epoxy-based binder resin may be included in an amount of 1 wt % to 10 wt %, for example, 5 wt % to 10 wt %, based on the total amount of the binder resin. When the epoxy-based binder resin is included in the above range, film remaining rate and chemical resistance may be greatly improved.

The epoxy equivalent weight of the epoxy-based binder resin may be 150 g/eq to 200 g/eq. When an epoxy-based binder resin having an epoxy equivalent within the above range is included in the binder resin, there is an advantageous effect in improving the curing degree of the formed pattern and fixing the colorant in the patterned structure.

The binder resin may be dissolved in a solvent to be described later in a solid form to form a photosensitive resin composition. In this case, the binder resin in the solid form may be about 10% to 50% by weight, for example, 20% to 40% by weight based on the total amount of the binder resin solution dissolved in the solvent.

The binder resin may be included in an amount of 1 wt % to 20 wt %, specifically 3 wt % to 15 wt %, for example, 5 wt % to 10 wt %, based on the total amount of the photosensitive resin composition. When the binder resin is included within the above range, it is possible to obtain excellent surface smoothness due to excellent developability and improved crosslinking property during manufacture of the color filter.

(B) photopolymerizable compound

The photopolymerizable compound may be a monofunctional or multifunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

The photopolymerizable compound has the ethylenically unsaturated double bond, so that it can form a pattern having excellent heat resistance, light resistance and chemical resistance by causing sufficient polymerization during exposure in the pattern forming process.

Specific examples of the photopolymerizable compound include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol di (meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, Pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate Latex, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylol propane tri(meth)acrylate ) acrylate, tris(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, and the like.

Examples of commercially available products of photopolymerizable compounds are as follows. Examples of monofunctional esters of (meth)acrylic acid include Aronix M- ^101® , M- ^111® , and M- ^114® from Toagosei Chemical Industry Co., Ltd.; KAYARAD TC-110S ^® of Nippon Kayaku Co., Ltd., the same TC-120S ^® , etc.; Osaka Yuki Kagaku Kogyo Co., Ltd.'s V- ^158® , V- ^2311® , etc. are mentioned. Examples of the bifunctional ester of (meth)acrylic acid include Aronix M- ^210® , M- ^240® , and M- ^6200® of Toagosei Chemical Industry Co., Ltd.; KAYARAD HDDA ^® from Nippon Kayaku Co., Ltd., HX-220 ^® , R-604 ^® , etc.; Examples include V- ^260® , V- ^312® , and V-335 ^HP® of Osaka Yuki Kagaku Kogyo Co., Ltd. Examples of the trifunctional ester of (meth)acrylic acid include Aronix M- ^309® , M- ^400® , M- ^405® , M- ^450® , and M from Toagosei Chemical Industry Co., Ltd. -710 ^® , M-8030 ^® , M-8060 ^® , etc.; KAYARAD TMPTA ^® from Nippon Kayaku Co., Ltd., Copper DPCA-20 ^® , Copper-30 ^® , Copper-60 ^® , Copper-120 ^® , etc.; V-295 ^® , Dong-300 ^® , Dong-360 ® , Dong-GPT ^® , Dong-3PA ^® , Dong-400 ^® and ^the like of Osaka Yuki Kayaku Kogyo Co., Ltd. These products may be used alone or in combination of two or more.

The photopolymerizable compound may be used after being treated with an acid anhydride to impart better developability.

The photopolymerizable compound may be included in an amount of 0.1 wt % to 20 wt %, specifically 1 wt % to 15 wt %, for example, 5 wt % to 13 wt %, based on the total amount of the photosensitive resin composition. When the photopolymerizable compound is included within the above range, sufficient curing occurs during exposure in the pattern forming process, resulting in excellent reliability and excellent developability with an alkaline developer.

(C) photopolymerization initiator

The photopolymerization initiator is an initiator generally used in photosensitive resin compositions, for example, an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or a combination thereof. can be used

Examples of the acetophenone-based compound include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloro acetophenone, p-t -Butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropane-1 -one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc. are mentioned.

Examples of the benzophenone-based compound include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4 '-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.

Examples of the thioxanthone-based compound include thioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2- Chlorothioxanthone etc. are mentioned.

Examples of the benzoin-based compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyldimethylketal.

Examples of the triazine-based compound include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3', 4'- Dimethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)-4, 6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis (trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and the like.

Examples of the oxime-based compound include O-acyloxime-based compounds, 2-(o-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyloxime) )-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one etc. can be used. Specific examples of the O-acyloxime compound include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butane- 1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione 2 -Oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-one oxime-O-acetate and 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O- Acetate etc. are mentioned.

As the photopolymerization initiator, a carbazole-based compound, a diketone compound, a sulfonium borate-based compound, a diazo-based compound, an imidazole-based compound, a biimidazole-based compound, a fluorene-based compound, and the like may be used in addition to the above compounds.

The photopolymerization initiator may be used together with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy thereto.

Examples of the photosensitizer include tetraethylene glycol bis-3-mercapto propionate, pentaerythritol tetrakis-3-mercapto propionate, dipentaerythritol tetrakis-3-mercapto propionate, and the like. can be heard

The photopolymerization initiator may be included in an amount of 0.1 wt % to 5 wt %, specifically 0.5 wt % to 4 wt %, for example, 0.1 wt % to 3 wt %, based on the total amount of the photosensitive resin composition. When the photopolymerization initiator is included within the above range, excellent reliability can be obtained due to sufficient curing during exposure in the pattern forming process, excellent heat resistance, light resistance and chemical resistance of the pattern, excellent resolution and adhesion, and due to the unreacted initiator A decrease in transmittance can be prevented.

(D) colorant

The colorant may include a dye, and in this case, the resin composition of one embodiment may be a dye-type or hybrid-type composition. In addition, the dye is not particularly limited, but may include a metal complex dye.

The metal complex "dye" can use a compound having maximum absorbance in the wavelength range of 200 nm to 650 nm, and if the compound has absorbance in the above range to match the color coordinates to the combination of dyes, the metal complex "dye of all colors that dissolves in an organic solvent" can be used

Specifically, the metal complex dye is a green dye having maximum absorbance in a wavelength range of 530 nm to 680 nm, a yellow dye having maximum absorbance in a wavelength range of 200 nm to 400 nm, and a maximum absorbance in a wavelength range of 300 nm to 500 nm. An orange "dye" having, a red "dye" having maximum absorbance in a wavelength range of 500 nm to 650 nm, or a combination thereof may be used.

The metal complex dyes are direct dyes, acid dyes, basic dyes, acid mordant dyes, sulfur dyes, reducing dyes, azoic dyes, disperse dyes, reactive dyes, oxide dyes, useful dyes, azo dyes, anthraquinone dyes, indigo dyes , carbonium ion "dye," phthalocyanine "dye, nitro" dye, quinoline "dye, cyanine" dye, polymethine "dye" or a combination thereof may be used.

The metal complex/dye may include at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd, and Fe.

The metal complex dye is C.I. C.I. solvents such as greens 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35 solvents and dyes; C.I. Acid “Green” 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109, etc. C.I. acid dyes; C.I. Direct 　 Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, 82 C.I. Direct dye, C.I. C.I. such as Basic, Green, and 1. Basic dyes; C.I. The C.I. Mordant Dye, C.I. Green pigments, such as Pigment "Green" 7, 36, and 58; Solvent Yellow 19, Solvent Yellow 21, Solvent Yellow 25, Solvent Yellow 79, Solvent Yellow 82, Solvent Yellow 88, Solvent Orange 45, Solvent Orange 54, Solvent Orange 62, Solvent Orange 99, Solvent Red 8, Solvent Red 32, Solvent Red 109, Solvent Red 112, Solvent Red 119, Solvent Red 124, Solvent Red 160, Solvent Red 132, and Solvent Red 218 may be used.

The dye containing the metal complex may have a solubility of 5 or more, specifically 5 to 10, in a solvent used in the photosensitive resin composition according to an embodiment, that is, a solvent to be described later. The solubility can be obtained by the amount (g) of the dye dissolved in 100 g of the solvent. When the solubility of the dye containing the metal complex is within the above range, compatibility with other components constituting the photosensitive resin composition according to an embodiment and coloring power may be secured, and precipitation of the dye may be prevented.

For example, the photosensitive resin composition may include a phthalocyanine-based green dye as the dye. The phthalocyanine-based dye covers a bright blue to green range and is known as a material with excellent color intensity and chemical stability.

The solvent is, for example, propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone (cyclohexanone), 3-methoxy-1-butanol, or a combination thereof may be used.

As it has the above specific range, it can be usefully used for color filters such as LCDs and LEDs that express high luminance and high contrast ratio in a desired color coordinate.

The dye containing the metal complex may be included in an amount of 0.01 wt% to 1 wt%, for example, 0.01 wt% to 0.5 wt%, based on the total amount of the photosensitive resin composition. When the dye containing the metal complex is used in the above range, high luminance and contrast ratio can be expressed in a desired color coordinate.

The colorant may further include a pigment as well as the dye, and in this case, the resin composition of one embodiment may be a hybrid composition. As the pigment, a red pigment, a green pigment, a blue pigment, a yellow pigment, a black pigment, or the like may be used.

Examples of the red pigment include C.I. Red Pigment 254, C.I. Red Pigment 255, C.I. Red Pigment 264, C.I. Red Pigment 270, C.I. Red Pigment 272, C.I. Red Pigment 177, C.I. Red pigment 89 etc. are mentioned. Examples of the green pigment include C.I. Green Pigment 7, C.I. Green Pigment 36, C.I. Green Pigment 58, C.I. Green Pigment 59 etc. are mentioned. Examples of the blue pigment include C.I. blue pigment 15:6, C.I. Blue Pigment 15, C.I. blue pigment 15:1, C.I. blue pigment 15:2, C.I. blue pigment 15:3, C.I. blue pigment 15:4, C.I. blue pigment 15:5, C.I. and copper phthalocyanine pigments such as blue pigment 16 and the like. Examples of the yellow pigment include C.I. isoindoline-based pigments such as yellow pigment 139, C.I. quinophthalone pigments such as yellow pigment 138, C.I. nickel complex pigments such as Yellow Pigment 150 and the like; and the like. Examples of the black pigment include aniline black, perylene black, titanium black, and carbon black. The above pigments may be used alone or in combination of two or more thereof. For example, a yellow pigment, a green pigment, or a mixture thereof may be used as the pigment.

The pigment may be included in the photosensitive resin composition for color filters in the form of a dispersion. The pigment dispersion may be composed of the pigment, a solvent, a dispersing agent, and a dispersing resin. The solid pigment may be included in an amount of 5 wt % to 20 wt %, for example, 8 wt % to 15 wt %, based on the total amount of the pigment dispersion.

Ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, etc. may be used as the solvent, and among these, propylene glycol methyl ether acetate is preferably used. can

The dispersant helps to uniformly disperse the pigment in the dispersion, and each of a nonionic, anionic or cationic dispersant may be used. Specifically, polyalkylene glycol or its ester, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonic acid salt, carboxylic acid ester, carboxylic acid salt, alkyl amide alkylene oxide adduct Water, alkyl amine, etc. may be used, and these may be used alone or in combination of two or more.

As the dispersion resin, an acrylic resin containing a carboxyl group may be used, which may improve stability of the pigment dispersion and also improve pixel patternability.

When the dye and the pigment are mixed and used, they may be mixed at a weight ratio of 0.1:99.9 to 99.9:0.1, specifically, 1:9 to 9:1. When mixed in the above weight ratio range, chemical resistance and maximum absorption wavelength can be controlled within an appropriate range, and high luminance and contrast ratio can be expressed in a desired color coordinate.

The colorant may be included in an amount of 15 wt % to 75 wt %, specifically 20 wt % to 70 wt %, for example, 30 wt % to 65 wt %, based on the total amount of the photosensitive resin composition. When the colorant is included within the above range, the coloring effect and developability are excellent.

(E) solvent

As the solvent, materials that have compatibility with the colorant, the binder resin, the photopolymerizable compound, and the photopolymerization initiator but do not react may be used.

Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; Cellosolve acetates, such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; Aromatic hydrocarbons, such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone ; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate and isobutyl acetate; lactic acid esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxy acetic acid alkyl esters, such as methoxy methyl acetate, methoxy ethyl acetate, methoxy butyl acetate, ethoxy methyl acetate, and ethoxy ethyl acetate; 3-oxy propionic acid alkyl esters such as 3-oxy methyl propionate and 3-oxy ethyl propionate; 3-alkoxy propionic acid alkyl esters such as 3-methoxy methyl propionate, 3-methoxy ethyl propionate, 3-ethoxy ethyl propionate, and 3-ethoxy methyl propionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxy propionic acid alkyl esters such as 2-methoxy methyl propionate, 2-methoxy ethyl propionate, 2-ethoxy ethyl propionate, and 2-ethoxy methyl propionate; 2-oxy-2-methyl propionic acid esters such as 2-oxy-2-methyl methyl propionate, 2-oxy-2-methyl ethyl propionate, 2-methoxy-2-methyl methyl propionate, 2-ethoxy-2- monooxy monocarboxylic acid alkyl esters of 2-alkoxy-2-methyl alkyl propionate such as methyl ethyl propionate; esters such as 2-hydroxy ethyl propionate, 2-hydroxy-2-methyl ethyl propionate, hydroxy ethyl acetate, and 2-hydroxy-3-methyl methyl butanoate; ketonic acid esters such as ethyl pyruvate, etc., and also N-methylformamide, N,N-dimethylformamide, N-methylformanilad, N-methylacetamide, N,N-dimethylacetamide , N-methylpyrrolidone, dimethylsulfoxide, benzylethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, benzoic acid and high boiling point solvents such as ethyl, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

Among these, considering compatibility and reactivity, ketones such as cyclohexanone; glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as 2-hydroxy ethyl propionate; carbitols such as diethylene glycol monomethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate, and ketones such as cyclohexanone may be used.

The solvent may be included in a balance amount, for example, 5 wt% to 70 wt%, for example, 10 wt% to 50 wt%, based on the total amount of the photosensitive resin composition. When the solvent is included within the above range, it is possible to obtain a coating film having excellent coatability of the photosensitive resin composition and excellent flatness.

(G) other additives

The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; A coupling agent containing a vinyl group or a (meth)acryloxy group; leveling agent; Surfactants; And it may further include at least one additive selected from a radical polymerization initiator.

The additives can be easily adjusted according to desired physical properties.

The coupling agent may be a silane-based coupling agent, and examples of the silane-based coupling agent include trimethoxysilyl benzoic acid, γ methacryloxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ Isocyanate propyl triethoxysilane, (gamma) glycidoxy propyl trimethoxysilane, (beta) epoxycyclohexyl) ethyl trimethoxysilane, etc. are mentioned, These can be used individually or in mixture of 2 or more types.

The silane-based coupling agent may be specifically used in an amount of 0.01 part by weight to 1 part by weight based on 100 parts by weight of the photosensitive resin composition.

In addition, the photosensitive resin composition for color filters may further include a surfactant, such as a fluorine-based surfactant, if necessary.

Examples of the fluorine-based surfactant include F-554, F-482, F-484, and F-478 manufactured by DIC, but are not limited thereto.

The surfactant is preferably included in an amount of 0.01% to 5% by weight and more preferably in an amount of 0.01% to 2% by weight based on the total amount of the photosensitive resin composition. If it is out of the above range, it is not preferable to cause a problem in that foreign substances are generated after development.

In addition, a certain amount of other additives such as antioxidants and stabilizers may be added to the photosensitive resin composition within a range that does not impair physical properties.

The photosensitive resin composition may be applied to a photosensitive resin composition for a color filter of a CMOS image sensor, specifically a photosensitive resin composition for a green color filter of a CMOS image sensor.

(Photosensitive resin film, color filter and CMOS image sensor)

According to another embodiment, a photosensitive resin film prepared using the photosensitive resin composition according to the embodiment is provided.

According to another embodiment, a color filter manufactured using the photosensitive resin composition described above is provided.

A manufacturing method of the color filter is as follows.

A photosensitive resin composition layer is formed on a glass substrate by applying the photosensitive resin composition to a thickness of, for example, 0.5 μm to 10 μm using an appropriate method such as spin coating, roller coating, or spray coating.

Subsequently, light is irradiated to form a pattern required for a color filter on the substrate on which the photosensitive resin composition layer is formed. As a light source used for irradiation, UV, electron beam, or X-ray may be used, and for example, UV in a range of 190 nm to 450 nm, specifically, 200 nm to 400 nm may be irradiated. In the irradiation step, a photoresist mask may be further used. After performing the irradiation step in this way, the photosensitive resin composition layer irradiated with the light source is treated with a developing solution. At this time, the unexposed portion of the photosensitive resin composition layer is dissolved to form a pattern required for the color filter. By repeating this process according to the number of colors required, a color filter having a desired pattern can be obtained. In addition, when the image pattern obtained by development in the above process is heated again or cured by irradiation with actinic rays, etc., crack resistance, solvent resistance, and the like can be improved.

According to another embodiment, a CMOS image sensor including the color filter is provided.

Hereinafter, the present invention will be described in more detail with examples, but the following examples are only preferred examples of the present invention and the present invention is not limited to the following examples.

(Preparation of photosensitive resin composition)

Examples 1 to 5 and Comparative Examples 1 to 3

A photosensitive resin composition was prepared by mixing the compositions shown in Tables 1 and 2.

Specifically, after dissolving the photopolymerization initiator in a solvent, the mixture was stirred at room temperature for 30 minutes, and then a binder resin, photopolymerizable compound, silane compound, and additives were added thereto and stirred at room temperature for 60 minutes. Subsequently, a dye and a pigment dispersion as a colorant were added to the obtained reactant and stirred at room temperature for 30 minutes. Subsequently, a photosensitive resin composition was prepared by filtering the product twice to remove impurities.

(Unit: % by weight) ingredient material name solid content
(%) Example 1 Example 2 Example 3 Example 4 Example 5 (A) binder resin A-1 100 6 6 6 6 (B) photopolymerizable compound B-1 100 9 9 9 9 (C) photopolymerization initiator C-1 100 One One One One C-2 100 0.5 0.5 0.5 0.5 (D) colorant D-1 100 48 48 48 48 D-2 10 22.3 22.3 22.3 22.3 (E) solvent E-1 - 12 11 10 9 8 (F) silane compound F-1 100 One 2 3 4 5 F-2 100 - - - - F-3 100 - - - - F-4 100 - - - - F-5 100 - - - - (G) additives G-1 10 0.2 0.2 0.2 0.2

(Unit: % by weight) ingredient material name solid content
(%) Comparative Example 1 Comparative Example 2 Comparative Example 3 (A) binder resin A-1 100 6 6 6 (B) photopolymerizable compound B-1 100 9 9 9 (C) photopolymerization initiator C-1 100 One One One C-2 100 0.5 0.5 0.5 (D) colorant D-1 100 48 48 48 D-2 10 22.3 22.3 22.3 (E) solvent E-1 - 10 10 10 (F) silane compound F-1 100 - 3 - F-2 100 3 - - F-3 100 - 3 - F-4 100 - - 3 F-5 100 - - - (G) additives G-1 10 0.2 0.2 0.2

Each component used in Tables 1 and 2 is as follows.

(A) binder resin

(A-1) Acrylic binder resin (product name: RY102, manufacturer: Showadenko)

(B) photopolymerizable compound

(B-1) photopolymerizable monomer (substance name: dipentaerythritol hexaacrylate (DPHA), manufacturer: Nippon Explosive)

(C) photopolymerization initiator

(C-1) oxime ester photopolymerization initiator 1 (product name: SPI05, manufacturer: Samyang Corporation)

(C-2) oxime ester photopolymerization initiator 2 (SPI-03W, manufacturer: Samyang Corporation)

(D) colorant

(D-1) Phthalocyanine-based dye (product name: GD17, manufacturer: Kyungin)

(B-2) Pigment dispersion containing Y185 (manufacturer: SKC)

(E) solvent

Propylene glycol monomethyl ether acetate (PGMEA, manufacturer: Sigma-Aldrich)

(F) silane compound

(F-1) A compound represented by Formula 1-3, 8-glycidoxyoctyltrimethoxysilane (product name: KBM-4803, Mw: 306.5 g/mol, manufacturer: Shin-Etsu)

[Formula 1-3]

(F-2) A compound represented by Formula A, 3-methacryloxypropyl trimethoxysilane (product name: KBM-503, Mw: 248.4 g/mol, manufacturer: Shin-Etsu)

[Formula A]

(F-3) A compound represented by the following formula B, 3-glycidoxypropyltrimethoxysilane (product name: KBM-403, Mw: 236.3 g/mol, manufacturer: Shin-Etsu)

[Formula B]

(F-4) A compound represented by the following formula D, 8-methacryloxyoctyltrimethoxysilane (product name: KBM-5803, Mw: 318.5 g/mol, manufacturer: Shin-Etsu)

[Formula D]

(G) additives

Fluorinated surfactant (F-554, manufacturer: DIC)

(evaluation)

Specimens having color filter patterns were prepared using the photosensitive resin compositions prepared in Examples 1 to 5 and Comparative Examples 1 to 3, and chemical resistance and pattern properties were evaluated.

(1) Preparation of color filter specimen

The photosensitive resin composition was applied to a thickness of 2.3 μm to 2.5 μm on a glass substrate having a thickness of 1 mm that had been degreased and washed, and dried on a hot plate at 90° C. for 2 minutes to obtain a coating film. Subsequently, the whole surface was exposed to the coating film under conditions of 40 mJ/cm ² using a UV lamp having a dominant wavelength of 365 nm. Thereafter, by drying in a hot air oven at 230 ° C. for 20 minutes, a specimen having a color filter pattern of 0.5 μm or more to 2.2 μm or less was obtained.

The same operation was performed for each of the photosensitive resin compositions of Examples 1 to 5 and Comparative Examples 1 to 3 to obtain specimens having each color filter pattern formed thereon.

(2) Evaluation 1: pattern evaluation

For each color filter specimen of Examples 1 to 5 and Comparative Examples 1 to 3, the degree of pattern formation was confirmed.

Specifically, the degree of formation of the color filter pattern was visually observed and evaluated according to the following criteria, and the evaluation results are shown in Table 3.

0: When no color filter pattern is formed

1: When more than 0 sq% and less than 50 sq% of the entire surface of the color filter pattern is formed

2: When more than 50 sq% and less than 70 sq% of the entire surface of the color filter pattern is formed

3: When more than 70 sq% and less than 80 sq% of the entire surface of the color filter pattern is formed

4: When more than 80 sq% and less than 95 sq% of the entire surface of the color filter pattern is formed

5: When more than 95 sq% and less than 100 sq% of the entire surface of the color filter pattern is formed

(2) Evaluation 2: Chemical resistance evaluation

After immersing each color filter specimen of Examples 1 to 5 and Comparative Examples 1 to 3 in a solution of tetramethylammonium hydroxide (Tetramethylammonium hydroxide, 　TMAH, Cas No., 75-59-2) for 10 minutes, The degree of peeling of the color filter pattern was confirmed.

Specifically, the degree of peeling of the color filter pattern was visually observed and evaluated according to the following criteria, and the evaluation results are shown in Table 3.

0: When the change in transmittance due to color loss (initial transmittance - transmittance after chemical resistance) is 0% after chemical resistance evaluation compared to the initial

1: When the transmittance change due to color loss (initial transmittance - transmittance after chemical resistance) exceeds 0% and is less than 2% after chemical resistance evaluation compared to the initial

2: When the change in transmittance (initial transmittance - transmittance after chemical resistance) due to color loss after evaluation of chemical resistance compared to the initial one is more than 2% and less than 5%

3: When the transmittance change due to color loss (initial transmittance - transmittance after chemical resistance) exceeds 5% and is less than 10% after chemical resistance evaluation compared to the initial test

4: When the change in transmittance due to color loss (initial transmittance - transmittance after chemical resistance) is more than 10% and less than 20% after chemical resistance evaluation compared to the initial test

5: When the transmittance change due to color loss (initial transmittance - transmittance after chemical resistance) exceeds 20% after chemical resistance evaluation compared to the initial

pattern chemical resistance Example 1 4 One Example 2 5 0 Example 3 5 0 Example 4 5 0 Example 5 4 One Comparative Example 1 0 5 Comparative Example 2 3 2 Comparative Example 3 2 3

In Table 3, the pattern property is excellent as indicated by a higher number from 0 to 5, and the chemical resistance is improved as indicated by a lower number from 0 to 5.

Based on this criterion, it can be seen that the photosensitive resin compositions of Examples 1 to 5 have excellent effects in improving chemical resistance and patternability when manufacturing color filters, compared to the photosensitive resin compositions of Comparative Examples 1 to 4. .

Hereinafter, the above evaluation results are examined in more detail.

In the photosensitive resin compositions of Comparative Examples 1 and 2, the number of carbon atoms of the linking group (L ¹ ) located between the silicon element and the oxygen element is the same, but a silane compound having different types of substituents introduced at either end was used. .

Specifically, the photosensitive resin composition of Comparative Example 1 used a silane compound having an acrylate group introduced at one terminal, and the photosensitive resin composition of Comparative Example 2 used a silane compound having an epoxy group introduced at one terminal. Among these Comparative Examples 1 and 2, the color filter specimen prepared using the photosensitive resin composition of Comparative Example 2 had better chemical resistance and pattern properties.

From this, it can be seen that when the number of carbon atoms of the linking group (L ¹ ) located between the silicon element and the oxygen element in the silane compound is the same, the chemical resistance and patternability of the color filter specimen can be improved by introducing an epoxy group at either end. there is.

On the other hand, the photosensitive resin compositions of Comparative Examples 1 and 3 have in common that an acrylate group is introduced at either terminal, but a silane compound in which the carbon number of the linking group (L ¹ ) located between the silicon element and the oxygen element is different. was used.

Specifically, the photosensitive resin composition of Comparative Example 1 uses a silane compound having 3 carbon atoms in the linking group (L ¹ ) located between the silicon element and the oxygen element, and the linking group located between the silicon element and the oxygen element of Comparative Example 3. A silane compound having 8 carbon atoms in (L ¹ ) was used. Among these Comparative Examples 1 and 3, the color filter specimen prepared using the photosensitive resin composition of Comparative Example 3 had better chemical resistance and pattern properties.

On the other hand, in the photosensitive resin compositions of Comparative Example 1 and Examples 1 to 5, the fact that an epoxy group is introduced at either terminal is the same, but the carbon number of the linking group (L ¹ ) located between the silicon element and the oxygen element is changed to each other. A different silane compound was used.

Specifically, the photosensitive resin compositions of Examples 1 to 5 used a silane compound having 8 carbon atoms as a linking group (L ¹ ) located between a silicon element and an oxygen element, and in Comparative Examples 3 to 5, the linking group (L ¹ ) A silane compound having 3 carbon atoms was used. In Comparative Example 1 and Examples 1 to 5, the color filter specimens prepared using the photosensitive resin compositions of Examples 1 to 5 had remarkably excellent chemical resistance and pattern properties.

Thus, while introducing an epoxy group at either end of the silane compound, as the carbon number of the linking group (L ¹ ) located between the silicon element and the oxygen element increases, the chemical resistance and patternability of the color filter specimen can be remarkably improved. can know

Here, for convenience, only examples in which the number of carbon atoms of the linking group (L ¹ ) is 8 are presented, but excellent chemical resistance and patternability can be expressed within the range of 7 to 10 carbon atoms. However, when the carbon number of the linking group (L ¹ ) between the silicon element and the oxygen element is 6 or less, chemical resistance may be deteriorated, and residue characteristics (developability) may be deteriorated when the carbon number is 11 or more. Therefore, it is important to control the carbon number of the linking group (L ¹ ) between the silicon element and the oxygen element.

In this regard, in one embodiment, the silane compound represented by Chemical Formula 1 is proposed.

In addition, among the photosensitive resin compositions of Examples 1 to 5, the color filter specimens to which the photosensitive resin compositions of Examples 2 to 4 are applied have excellent chemical resistance and pattern properties.

Accordingly, even when the silane compound represented by Formula 1 is used, it can be seen that chemical resistance and patternability can be further improved by comprehensively considering the content in the photosensitive resin composition and the mixing ratio with the dye.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and it is possible to carry out various modifications within the scope of the claims and detailed description of the invention and the accompanying drawings, and this also It goes without saying that it falls within the scope of the invention.

Claims (14)

(A) a binder resin;
(B) a photopolymerizable compound;
(C) a photopolymerization initiator;
(D) a colorant;
(E) a solvent; and
(F) a silane compound represented by Formula 1 below
A photosensitive resin composition comprising:
[Formula 1]

In Formula 1,
L ¹ is a substituted or unsubstituted alkylene having 7 to 10 carbon atoms;
L ² is a single bond or a substituted or unsubstituted alkylene having 1 to 10 carbon atoms;
R ¹ to R ³ are the same or different, and each independently represents hydrogen, substituted or unsubstituted alkoxy having 1 to 10 carbon atoms, or substituted or unsubstituted alkyl having 1 to 10 carbon atoms.
According to claim 1,
Wherein L ² is a substituted or unsubstituted alkyl having 1 to 5 carbon atoms; the photosensitive resin composition.
According to claim 1,
Wherein R ¹ to R ³ are the same or different, and each independently represents a substituted or unsubstituted alkoxy having 1 to 5 carbon atoms.
According to claim 1,
The silane compound is a photosensitive resin composition represented by any one of Formulas 1-1 to 1-8:
[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

[Formula 1-4]

[Formula 1-5]

[Formula 1-6]

[Formula 1-7]

.
[Formula 1-8]

.
According to claim 1,
The silane compound is included in 2% by weight to 4% by weight of the total amount of the photosensitive resin composition photosensitive resin composition.
According to claim 1,
The colorant is a photosensitive resin composition containing a dye.
According to claim 6,
The dye is a photosensitive resin composition comprising a phthalocyanine-based green dye.
According to claim 7,
The silane compound is included in 5 parts by weight to 7 parts by weight based on 100 parts by weight of the phthalocyanine-based green dye photosensitive resin composition.
According to claim 1,
The photosensitive resin composition, relative to the total amount of the photosensitive resin composition,
1% to 20% by weight of the (A) binder resin;
0.1% to 20% by weight of the (B) photopolymerizable compound;
0.1% to 5% by weight of the (C) photopolymerization initiator;
15% to 75% by weight of the (D) colorant;
2% to 4% by weight of the (F) silane compound represented by Formula 1; and
The remaining amount of the above (E) solvent
Photosensitive resin composition comprising a.
According to claim 1,
The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; A coupling agent containing a vinyl group or a (meth)acryloxy group; leveling agent; fluorine-based surfactants; And a photosensitive resin composition further comprising at least one additive selected from a radical polymerization initiator.
According to claim 1,
The photosensitive resin composition is a photosensitive resin composition for a CMOS image sensor.
A photosensitive resin film prepared using the photosensitive resin composition of claim 1.
A color filter comprising the photosensitive resin film of claim 12 .
A CMOS image sensor comprising the color filter of claim 13 .