KR20230055413A - Printed circuit board and manufacturing method thereof - Google Patents

Abstract

A printed circuit board comprises: a substrate; an electrode pad manufactured so as to have a certain size to enable electrical connection with an electronic component to be mounted on the substrate and disposed in pairs on one surface or both surfaces of the substrate; a solder resist stacked on the one surface or both surfaces of the substrate so as to cover the electrode pad; and an exposed part formed by etching one part of the solder resist to a width greater than that of a width of the electrode pad at a position wherein each of the paired electrode pads is disposed. Therefore, the present invention is capable of having an advantage wherein a reflection efficiency can be increased.

Description

Printed circuit board and its manufacturing method {PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF}

The present invention relates to a printed circuit board and a manufacturing method thereof, and relates to a printed circuit board in which errors in mounting electronic components are minimized, and a manufacturing method thereof.

Recently, small and thin electronic products having multiple functions, such as smart phones and tablet PCs, are preferred by consumers.

Due to this, printed circuit boards used in these electronic products are also required to be made thinner, and as a result, a larger number of devices and high-density and multi-layered packages are being mounted, and this trend will continue in the future. likely to persist

Basically, the printed circuit board has played a role of connecting various electronic parts or supporting parts according to the circuit design of electric wiring on the printed circuit board.

1 is a view showing a manufacturing process of a conventional printed circuit board.

Referring to FIG. 1 , in a conventional printed circuit board, first, electrode plates 20 are arranged in pairs on a substrate 10, and then a solder resist 30 is laminated to cover the electrode plates 20, Then, a portion of the electrode plate 20 was exposed by partially etching the solder resist 30 in the region where the electrode plate 20 is located, thereby forming an electrode pad 40 exposed from the solder resist 30. .

However, in the conventional printed circuit board manufacturing process, the electrode plate 20 does not consider the standard of the electronic component to be mounted, and after disposing the plate 20 larger than the standard of the electronic component, the solder resist 30 Since the electrode pads 40 are formed in the process of etching, there is a problem that the size of each pair of electrode pads 40 is different when a tolerance of the etching range occurs. That is, the sizes of the electrode pads 40 are formed to be different, such that one of the electrode pads 40 that are symmetrical to each other is small and the other is large.

When electronic components are mounted on electrode pads 40 of different sizes by soldering or the like, an excessively large amount of lead is distributed in one of the electrode pads 40 and a small amount of lead is distributed in the other. There is, and there was also a problem such as the mounting position of the electronic component is distorted.

2 is a diagram showing a wiring state for electrical connection between electrode pads in a conventional printed circuit board.

On the other hand, in the case of arranging a plurality of pairs of electrode pads 40 in the manufacturing process of such a conventional printed circuit board, the electrode pads of the same pole are connected to each other with a wide bar-type metal plate 50. In this case, there is a problem in that the cooling time after heat generation of each electrode pad 40 is increased.

Therefore, the problem to be solved by the present invention is to form electrode pads connected to electronic components in a uniform size, to prevent over-soldering and short-soldering when mounting electronic components, and to prevent defects such as tilting and twisting of electronic components. To prevent this, and to provide a printed circuit board and a method of manufacturing the same, which can reduce the defect rate due to the lifting of electronic components due to the difference in cooling time of electrode pads.

A printed circuit board according to an embodiment of the present invention includes a substrate; electrode pads manufactured to have a certain size capable of electrical connection with an electronic component to be mounted on the board and arranged in pairs on one or both sides of the board; a solder resist laminated on one or both surfaces of the substrate to cover the electrode pads; and an exposed portion formed by etching a portion of the solder resist to a width greater than the width of the electrode pad at a location where each of the pair of electrode pads is disposed.

In one embodiment, the exposed portion may be formed in a square or circular shape.

In one embodiment, the substrate includes a base substrate and an insulating core layer laminated on one or both sides of the base substrate, and when the insulating core layer is a black color or brown color, the exposure The portion may be formed in a square shape.

In one embodiment, the substrate includes a base substrate and an insulating core layer laminated on one or both surfaces of the base substrate, and when the insulating core layer is a white color, the exposed portion may be formed in a circular shape. there is.

In one embodiment, the electrode pad may include a bottle neck extending while gradually decreasing in width from one side.

In one embodiment, the electrode pad includes a thread wiring portion extending from an end of the bottleneck and having the same width as the width of the end of the bottleneck, and the electrode pads are arranged to form two or more pairs on one or both surfaces of the substrate. In this case, electrode pads of the same polarity may be connected through the real wiring part.

A method for manufacturing a printed circuit board according to an embodiment of the present invention includes a first step of disposing pairs of electrode pads on one side or both sides of the board to have a certain size capable of electrical connection with an electronic component to be mounted on the board. ; a second step of laminating a solder resist on one or both surfaces of the substrate so as to cover paired electrode pads on one or both surfaces of the substrate; and a third step of forming an exposed portion exposing the paired electrode patterns by etching a portion of the solder resist to a width larger than the width of the electrode patterns at the location where the paired electrode patterns are disposed.

In one embodiment, in the third step, the exposed part may be formed in a square or circular shape.

In one embodiment, when the substrate has a black or brown insulating core layer, the exposed portion may be formed in a rectangular shape in the third step.

In one embodiment, when the substrate has a white insulating core layer, the exposed portion may be formed in a circular shape in the third step.

In one embodiment, the electrode pad may include a bottle neck extending while gradually decreasing in width from one side.

In one embodiment, the electrode pad includes a thread wiring portion extending from an end of the bottle neck and having the same width as a width of an end of the bottle neck, and in the first step, the electrode pad is disposed on one side or both sides of the substrate. When arranged to form one or more pairs, electrode pads having the same polarity may be connected through the real wiring part.

According to the printed circuit board and its manufacturing method according to the present invention, electrode pads connected to electronic components can be formed in a uniform size, over-soldering and short-soldering can be prevented when electronic components are mounted, and the electronic components are tilted And defects such as twisting can be prevented, the defect rate due to the lifting of electronic components due to the difference in cooling time of the electrode pads can be reduced, and the reflection efficiency can be increased when the electrode pads are disposed on the white-colored insulating core layer. There are benefits to being able to

1 is a view showing a manufacturing process of a conventional printed circuit board.
2 is a diagram showing a wiring state for electrical connection between electrode pads in a conventional printed circuit board.
3 is a plan view for explaining the configuration of a printed circuit board for mounting an LED according to an embodiment of the present invention.
FIG. 4 is a cross-sectional view taken along line AA' of FIG. 1 .
5 is a view showing a state in which the exposed portion shown in FIG. 3 is formed in a circular shape.
FIG. 6 is a view showing a state in which the electrode pads shown in FIG. 3 are arranged in a plurality of pairs and wired.
FIG. 7 is a diagram illustrating the case where the etching position is in the correct position and the tolerance occurs in the third step of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

Hereinafter, a printed circuit board and a manufacturing method thereof according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Since the present invention can have various changes and various forms, specific embodiments will be illustrated in the drawings and described in detail in the text. However, it should be understood that this is not intended to limit the present invention to the specific disclosed form, and includes all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals have been used for like elements throughout the description of each figure. In the accompanying drawings, the dimensions of the structures are shown enlarged than actual for clarity of the present invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

3 is a plan view for explaining the configuration of a printed circuit board for mounting LEDs according to an embodiment of the present invention, FIG. 4 is a cross-sectional view along line AA' of FIG. 1, and FIG. 5 is an exposed portion shown in FIG. FIG. 6 is a view showing a state in which the electrode pads shown in FIG. 3 are disposed in a plurality of pairs and connected by wires.

3 and 4, a printed circuit board for mounting an LED according to an embodiment of the present invention may include a substrate 110, an electrode pad 120, a solder resist 130, and an exposed portion 140. there is.

The substrate 110 may include a base substrate 111 and an insulating core layer 112 . The base substrate 111 may be made of glass or metal. The insulating core layer 112 may be laminated on both sides of the base substrate 111 to insulate between the electrode pad 120 and the base substrate 111 .

The electrode pad 120 is prepared and placed in advance. That is, the electrode pad 120 is prefabricated to have a predetermined size capable of electrical connection with an electronic component to be mounted on the substrate 110, and is placed on the insulating core layer 112 on one or both surfaces of the substrate 110. can be placed in pairs. Here, the arrangement in pairs means that the electrode pads 120 are arranged symmetrically in the upper, lower, left, and right directions, and may be arranged in one pair or two or more pairs. For example, the electrode pad 120 may have a square shape.

Meanwhile, the electrode pad 120 may include a bottle neck portion 121 and a real wiring portion 122 .

The bottle neck portion 121 may extend with a width smaller than that of the electrode pad 120 . For example, the bottle neck portion 121 may extend from one side of the square shape of the electrode pad 120 while gradually decreasing in width.

The thread wiring part 122 may extend from an end of the bottleneck part 121 and have the same width as the end of the bottleneck part 121 . When the electrode pads 120 are arranged to form two or more pairs, as shown in FIG. 6 , the real wiring part 122 connects the electrode pads 120 of the same pole to each other.

A photo solder resist (PSR) 130 may be stacked on the insulating core layer 112 on one or both surfaces of the substrate 110 to cover the paired electrode pads 120 . The solder resist 130 may be formed of a material having reflectivity.

The exposed portion 140 is formed by etching a portion of the electrode pad 120 and the solder resist 130 at a location where each pair of electrode pads 120 are disposed. At this time, the exposed portion 140 is etched to a width greater than that of each pair of electrode pads 120 to expose each of the electrode pads 120 .

Meanwhile, the exposed portion 140 may be formed in a square or circular shape.

The exposed portion 140 is preferably formed in a rectangular shape as shown in FIG. 3 when the insulating core layer 112 is black color or brown color, and the insulating core layer 112 When the color of ) is white color, it is preferably formed in a circular shape as shown in FIG.

Because, when each of the paired electrode pads 120 is exposed through the exposed portion 140, the insulating core layer 112 is also exposed. At this time, the insulating core layer 112 is black Color) or Brown Color, since the insulating core layer 112 has a relatively low reflectance compared to the solder resist 130, the width of the exposed portion 140 is greater than the width of each electrode pad 120 It is large but formed in a square shape to narrow the range in which the insulating core layer 112 can be exposed around each electrode pad 120 and relatively widen the range of the solder resist 130 to prevent the reflectance from deteriorating it is desirable

In addition, when the insulating core layer 112 is white, the reflectance of the insulating core layer 112 is good, so the exposed portion 140 is formed in a circular shape to ensure the insulation around each electrode pad 120. It is preferable to increase the reflectance by the insulating core layer 112 together with the solder resist 130 by widening the range in which the core layer 112 can be exposed.

Hereinafter, a method of substantially manufacturing the printed circuit board described above will be described.

A method of manufacturing a printed circuit board according to an embodiment of the present invention includes first to third steps.

In the first step, electrode pads 120 manufactured to have a predetermined size capable of electrical connection with electronic components to be mounted on the substrate 110 are disposed in pairs on one or both surfaces of the substrate 110 . At this time, the electrode pads 120 are disposed on the insulating core layer 112 of the substrate 110, and may be disposed in one pair or two or more pairs. When two or more pairs are arranged, the electrode pads 120 having the same polarity may be connected through the real wiring part 122 .

In a second step, a solder resist 130 is laminated on one or both surfaces of the substrate 110 so as to cover the paired electrode pads 120 on one or both surfaces of the substrate 110 . At this time, the solder resist 130 is stacked on the insulating core layer 112 .

In a third step, the exposed portion 140 is formed. That is, the exposed portion 140 is formed by etching a portion of the solder resist 130 to a width greater than the width of the electrode pad 120 at the location where the pair of electrode pads 120 are disposed.

At this time, as described above, when the insulating core layer 112 is black or brown, the exposed portion 140 is formed in a rectangular shape, and when the insulating core layer 112 is white, the exposed portion 140 is formed in a rectangular shape. (140) can be formed in a circular shape.

Using the printed circuit board manufacturing method according to an embodiment of the present invention, even if a tolerance outside the design range of the etching process is generated in the process of etching the solder resist 130 to expose the electrode pad 120, the pair The electrode pads 120 can be easily exposed without a problem in that their sizes are relatively small or large.

FIG. 7 is a diagram illustrating the case where the etching position is in the correct position and the tolerance occurs in the third step of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

That is, as shown in (a) of FIG. 7, when the etching position for forming the exposed part 140 is in the correct position, each pair of electrode pads 120 are normally exposed, and in (b) of FIG. 3 As shown in FIG. 3 (c), each pair of electrode pads 120 are normally exposed even when a tolerance occurs in which the etching position for forming the exposed portion 140 is biased upward. Likewise, even when a tolerance occurs in which the etching position for forming the exposed portion 140 is biased downward, each pair of electrode pads 120 may be normally exposed. In the first step, in the process of disposing the electrode pad 120 having a bottleneck structure and etching a part of the solder resist 130 to form the exposed portion 140, the solder resist 130 This is because the etching range is set to be larger than the width of each pair of electrode pads 120 .

According to the printed circuit board and its manufacturing method according to an embodiment of the present invention, even if an exposure tolerance is generated in the process of etching the solder resist 130 for exposure of the paired electrode pads 120, it is formed by etching The electrode pads 120 exposed in the exposed portion 140 may be formed in a uniform size.

Since the electrode pads 120 can be formed in a uniform size, when electronic components are mounted using lead, the lead is uniformly distributed on the electrode pads 120 of a uniform size, preventing over- and under-soldering. . Furthermore, it is possible to prevent defects such as tipping and twisting of electronic components mounted on the paired electrode pads 120 by preventing oversoldering and undersoldering.

In addition, the electrode pad 120 has a bottleneck structure in which a bottleneck portion 121 that is smaller than the width of the electrode pad 120 is formed, and through a seal wiring portion 122 having the same width as the bottleneck portion 121. Since the electrode pads 120 are electrically connected, the cooling time after heat generation of the plurality of paired electrode pads 120 can be achieved at the same level, and thus the electronic component due to the difference in cooling time of the electrode pads 120. There is an advantage in that the defect rate due to the excitation phenomenon (aka, Manhattan phenomenon) can be reduced.

In addition, since the electrode pad 120 has a bottleneck portion 121 that is smaller in width than the electrode pad 120, the area where the electrode pad 120 is placed in the exposed portion 140 is reduced, so that the insulating core layer 112 ) is white color, the exposure range of the insulating core layer 112 increases, and the reflection efficiency increases due to light reflection in the white color insulating core layer 112 and light reflection in the solder resist 130 There is an advantage to being

The description of the presented embodiments is provided to enable any person skilled in the art to use or practice the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments without departing from the scope of the present invention. Thus, the present invention is not to be limited to the embodiments presented herein, but is to be construed in the widest scope consistent with the principles and novel features presented herein.

Claims (12)

Board;
electrode pads manufactured to have a certain size capable of electrical connection with an electronic component to be mounted on the board and arranged in pairs on one or both sides of the board;
a solder resist laminated on one or both surfaces of the substrate to cover the electrode pads; and
Including an exposed portion formed by etching a portion of the solder resist to a width greater than the width of the electrode pad at a position where each of the pair of electrode pads is disposed.
printed circuit board. According to claim 1,
The exposed portion is formed in a square or circular shape,
printed circuit board board. According to claim 1,
The substrate includes a base substrate and an insulating core layer laminated on one or both surfaces of the base substrate,
When the insulating core layer is black color or brown color, the exposed portion is formed in a square shape,
printed circuit board board. According to claim 1,
The substrate includes a base substrate and an insulating core layer laminated on one or both surfaces of the base substrate,
When the insulating core layer is white color, the exposed portion is formed in a circular shape,
printed circuit board. According to claim 1,
The electrode pad includes a bottleneck extending while gradually decreasing in width from one side,
printed circuit board. According to claim 5,
The electrode pad includes a thread wiring portion extending from an end of the bottleneck and having the same width as a width of an end of the bottleneck,
When the electrode pads are arranged to form two or more pairs on one side or both sides of the substrate, the electrode pads of the same pole are connected through the real wiring part.
printed circuit board. A first step of disposing pairs of electrode pads manufactured to have a certain size capable of electrical connection with an electronic component to be mounted on the board on one side or both sides of the board;
a second step of laminating a solder resist on one or both surfaces of the substrate so as to cover paired electrode pads on one or both surfaces of the substrate; and
A third step of forming an exposed portion exposing the paired electrode pattern by etching a portion of the solder resist to a width greater than the width of the electrode pattern at a position where the paired electrode pattern is disposed,
Method for manufacturing a printed circuit board. According to claim 7,
In the third step, the exposed part is formed in a square or circular shape,
Method for manufacturing a printed circuit board. According to claim 7,
When the substrate has a black or brown insulating core layer, in the third step, the exposed portion is formed in a rectangular shape,
Method for manufacturing a printed circuit board. According to claim 7,
When the substrate has a white insulating core layer, the exposed portion is formed in a circular shape in the third step.
Method for manufacturing a printed circuit board. According to claim 7,
The electrode pad includes a bottleneck extending while gradually decreasing in width from one side,
Method for manufacturing a printed circuit board. According to claim 11,
The electrode pad includes a thread wiring portion extending from an end of the bottleneck and having the same width as a width of an end of the bottleneck,
In the first step, when the electrode pads are arranged to form two or more pairs on one side or both sides of the substrate, the electrode pads of the same pole are connected through the real wiring part.
Method for manufacturing a printed circuit board.

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