KR20230049877A - Permanent magnet with excellent magnetic property and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a permanent magnet using highly efficient exchange magnetic force that can replace Nd-based permanent magnets and a method of manufacturing the same. The permanent magnet according to the present invention includes a first block; a second block; and an inter-block polymer layer provided between the first block and the second block.

Description

Permanent magnet with excellent magnetic properties and its manufacturing method

The present invention relates to a permanent magnet having excellent magnetic properties and a manufacturing method thereof.

When an atom's electron shell is not completely filled with electrons that do not form pairs (e.g., iron), it has magnetism due to electrons rotating around the nucleus. The sum of magnetism is zero. In general, permanent magnets are made by giving orientation to atoms inside magnetic materials. The materials called hard magnets (i.e., hard magnetic materials) used for permanent magnets have low saturation magnetization and are easily magnetized in an external magnetic field. However, it has a high coercive force, so the atoms maintain an ordered state with directionality even when the external magnetic field is removed. Because of this high coercive force, once the atoms are aligned in an external magnetic field, they continuously emit lines of magnetic force, so hard magnetic materials are used as permanent magnets.

Due to the recent development of permanent magnets, electromagnets requiring strong magnetic fields as well as parts such as motors and actuators are being used. The material called soft magnetism (i.e., soft magnetic material) used for the magnetic core of an electromagnet has very high saturation magnetization, so it is very easily magnetized in an external magnetic field, but there is almost no current magnetism when the external magnetic field is removed with a low coercive force. refers to matter

Despite the high efficiency of the currently widely used Nd-based rare-earth magnet, a new replacement magnet is required due to the disadvantages such as element scarcity. / The exchange-coupling that occurs at the interface of hard magnetic materials shows higher efficiency than rare earth magnets, and research is rapidly progressing recently.

The exchange magnetic force was proposed by E.F.Kneller, and it is produced by depositing a thin film of a soft magnetic material and a hard magnetic material having high saturation magnetization alternately at a nanometer level. After aligning the magnetic spins of the two materials in one direction with a strong external magnetic field, and then applying an external magnetic field in the opposite direction, the spins of the soft magnetic material align in the direction of the external magnetic field, but at the interface of the hard magnetic material, the spin of some soft magnetic materials It does not change in the direction of the external magnetic field and keeps aligned in the opposite direction. Even if the external magnetic field is removed, the spin direction of the soft magnetic material with such a high saturation magnetization does not change. This is the principle that a permanent magnet with a high magnetic field can be made.

It is reported that the critical size for seeing the effect of such exchange magnetic force is about 10 to 30 nm for the thickness of each soft magnetic and hard magnetic thin film. The problem is that although the exchange magnetic force has high magnetism, it is manufactured by laminating two different nanometer-sized thin films, so it takes a long time to laminate to make it in a bulk form of several mm or more, so it is used for large motors used in electric vehicles. this is impossible

Korean Publication No. 1991-0003696

One aspect of the present invention is to provide a permanent magnet using high-efficiency exchange magnetic force that can replace conventional Nd-based permanent magnets and a manufacturing method thereof.

In addition, another aspect of the present invention is to provide a method that can easily manufacture a permanent magnet using exchange magnetic force in a bulk size in a relatively short time.

The object of the present invention is not limited to the foregoing. Anyone skilled in the art to which the present invention pertains will have no difficulty in understanding additional objects of the present invention from the content throughout the present specification.

One aspect of the present invention,

A first block in which hard magnetic thin films and soft magnetic thin films are alternately stacked;

a second block disposed on the first block and in which hard magnetic thin films and soft magnetic thin films are alternately stacked; and

It provides a permanent magnet including an inter-block polymer layer provided between the first block and the second block.

Another aspect of the present invention is,

forming a first block by alternately stacking hard magnetic thin films and soft magnetic thin films on a first substrate;

forming a second block by alternately stacking hard magnetic thin films and soft magnetic thin films on a second substrate; and

bonding the first block and the second block by forming an inter-block polymer layer between the outermost thin film of the first block facing the first substrate and the outermost thin film of the second block facing the second substrate; Provides a method for manufacturing a permanent magnet, including;

According to the present invention, it is possible to provide a permanent magnet using high-efficiency exchange magnetic force that can replace conventional Nd-based permanent magnets and a manufacturing method thereof.

In addition, according to the present invention, it is possible to easily manufacture permanent magnets using exchange magnetic force in a relatively short time in a bulk size, and thus can be suitably used for large motors used in electric vehicles and the like.

1 to 3 show the structure of an exemplary permanent magnet of the present invention, and FIGS. 1 (a), 2 (a) and 3 (a) show the structure before the first substrate and the protective layer are removed. 1(b), 2(b) and 3(b) show the structure after the first substrate 1 and the protective layer 101 are removed.
4 schematically shows a structure after forming a first block on a first substrate.
5 shows a structure manufactured through a process of forming a polymer layer between blocks by applying a polymer solution on the outermost thin film facing the first substrate of the first block.
6 schematically shows the structure after forming the second block on the second substrate.
Figure 7 schematically shows the process of bonding the first block and the second block by forming an inter-block polymer layer, Figure 7 (a) shows the structure before bonding, Figure 7 (b) shows the structure after bonding represents structure.
8 shows a process of removing the second substrate using an etchant. FIG. 8(a) shows the structure before removing the second substrate, and FIG. 8(b) shows the structure after removing the second substrate. .
9 schematically shows a process of forming a third block as an additional block.
10 shows a process of forming an interblock polymer layer corresponding to an example of the present invention in the order of (a) to (d).
11 is a second substrate corresponding to an example of the present invention, and a laminate including a polyimide film and silicon pressure sensitive adhesive layers provided on upper and lower surfaces of the polyimide film, respectively. It schematically shows the case of manufacturing a permanent magnet by using.
12 is a graph showing changes in magnetic properties according to the transfer speed of the substrate.
13 is a graph showing the results of measuring magnetic properties of magnetic thin films in Comparative Example 1 and Example 1 of the present invention.

The present invention relates to a permanent magnet using an exchange magnetic force, and by manufacturing a thin film in a block form and bonding them to a bulk size (eg, several mm or more) to a general permanent magnet size, Nd-based magnets It is intended to provide a method for manufacturing a permanent magnet that is superior in terms of efficiency as well as replacing it.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention may be modified in various forms, and the scope of the present invention is not limited to the embodiments described below.

[Permanent Magnet]

One aspect of the present invention,

A first block in which hard magnetic thin films and soft magnetic thin films are alternately stacked;

a second block disposed on the first block and in which hard magnetic thin films and soft magnetic thin films are alternately stacked; and

It provides a permanent magnet including an inter-block polymer layer provided between the first block and the second block.

According to the present invention, in the first block, hard magnetic thin films and soft magnetic thin films may be alternately laminated, and for example, in the first block, hard magnetic thin films and soft magnetic thin films may be alternately and repeatedly laminated.

Further, according to the present invention, the second block is disposed on the first block, the hard magnetic thin film and the soft magnetic thin film may be alternately laminated. For example, the second block may be disposed on the first block, and the hard magnetic thin film and the soft magnetic thin film may be alternately and repeatedly laminated.

According to the present invention, the meaning that the hard magnetic thin film and the soft magnetic thin film are alternately and repeatedly laminated means that the hard magnetic thin film is first formed, the soft magnetic thin film is laminated on the hard magnetic thin film, and then the hard/hard magnetic thin film is repeatedly laminated. It includes alternately laminating soft magnetic thin films. Alternatively, it includes first forming a soft magnetic thin film, laminating a hard magnetic thin film on the soft magnetic thin film, and then repeatedly stacking soft/hard magnetic thin films alternately.

On the other hand, in each block, it is sufficient if at least a part of the part where the hard magnetic thin film and the soft magnetic thin film are alternately laminated is included, and a part of the soft magnetic thin film-soft magnetic thin film laminated part is included, or the hard magnetic thin film-hard The fact that some parts laminated with magnetic thin films are included does not deviate from the scope of the present invention.

According to the present invention, in each block, the total number of layers of the laminated hard magnetic thin film and soft magnetic thin film must be at least two, and the object of the present invention is to provide a permanent magnet in the form of a bulk of several mm or more Since the upper limit of the number of layers in is preferably higher, it may not be limited.

However, in consideration of the advantages of the process for minimizing steps in the manufacturing process described later, in each block, the total number of layers of the laminated hard magnetic thin film and soft magnetic thin film may be 10 to 2,000, preferably 50 to 1,000. It may be one, more preferably 100 to 200.

For example, in each block of the present invention, the alternately laminated hard magnetic thin film and the soft magnetic thin film may be alternately laminated 5 to 1,000 times. By setting the number of repetitions of alternating stacking within the above range, it is possible to efficiently manufacture a permanent magnet having a bulk of several millimeters or more in a relatively short time.

According to the present invention, the thickness of each block may be in the range of 500 nm to 50 μm, more preferably in the range of 1 to 10 μm. In the present invention, by setting the thickness of each block in the range of 500 nm to 50 μm, process efficiency is maximized, which is preferable in terms of cost reduction.

In the present invention, the above-described soft magnetic thin film may be formed using a soft magnetic material (ie, soft magnetic material) generally known in the art, and the above-described hard magnetic thin film may be formed using a soft magnetic material generally known in the art. As can be formed using a material (ie, hard magnetic material), the soft magnetic material and the hard magnetic material are not particularly limited.

For example, Fe may be used as the soft magnetic material, and Fe-Ni alloy, Fe-Co alloy, or Nd ₂ Fe ₁₄ B may be used as the hard magnetic material, but is not limited thereto. .

According to the present invention, the exchange magnetic force of the permanent magnet can be formed by alternately and repeatedly laminating a hard magnetic thin film and a soft magnetic thin film having a thickness of units of nm, and the lamination of the hard magnetic thin film and the soft magnetic thin film is It can be manufactured by a method such as deposition using a sputtering method generally known in the art using a soft magnetic material, and the manufacturing process is not particularly limited.

According to the present invention, the thickness of the hard magnetic thin film and the soft magnetic thin film may be set differently according to the material (ie, hard magnetic material or soft magnetic material) used, respectively, and the optimum to improve the efficiency of the exchange magnetic force. The thin film thickness can be appropriately selected. Accordingly, the thicknesses of the hard magnetic thin film and the soft magnetic thin film are not particularly limited.

However, as an example of the present invention, the thickness of the hard magnetic thin film may be in the range of 2 to 50 nm, the thickness of the soft magnetic thin film may be in the range of 10 to 20 nm, or more preferably, the thickness of the hard magnetic thin film is It may range from 25 to 50 nm, and the thickness of the soft magnetic thin film may range from 10 to 20 nm. In the present invention, by controlling the hard magnetic thin film and the soft magnetic thin film to the above-described thickness range, it is possible to effectively manufacture a permanent magnet having excellent magnetic efficiency by satisfying the critical size for forming an exchange magnetic force.

According to the present invention, the permanent magnet may include an inter-block polymer layer provided between the first block and the second block. At this time, all polymer layers formed between blocks as well as between the first block and the second block are referred to as 'inter-block polymer layers'. The interblock polymer layer may serve as an adhesive layer bonding the first block and the second block to each other.

Further, according to the present invention, the permanent magnet may further include an external polymer layer provided on a side surface of the laminate including the interblock polymer layer and the first block. In the present invention, the outer polymer layer is provided on the side surface of the above-described laminate, so that it can serve as a protective layer that protects the block from the etchant used during the manufacturing process described later.

In addition, according to the present invention, the permanent magnet may further include an external polymer layer provided on a side surface, an upper surface, or both of the laminate including the interblock polymer layer, the first block, and the second block. As such, by further including an external polymer layer, it is possible to protect each block from an etchant used during a manufacturing process described later.

Meanwhile, according to the present invention, the outer polymer layer is more preferably provided only on the side surface of the laminate including the interblock polymer layer, the first block and the second block in terms of improving the magnetic efficiency of the permanent magnet.

According to the present invention, the interblock polymer layer and the outer polymer layer may each independently contain an adhesive polymer as a main component or may be made of an adhesive polymer. However, in the present specification, the meaning that the interblock polymer layer and/or the outer polymer layer is composed of the adhesive polymer layer may include impurities unavoidably included during the manufacturing process, except for these impurities, the adhesive polymer layer. This means that it consists of only one layer.

According to the present invention, as the adhesive polymer, any polymer known to have adhesive properties in the art may be used without limitation, and in particular, any polymer capable of serving as the above-described adhesive layer and protective layer is applicable. That is, as the polymer included in the interblock polymer layer and the external polymer layer, the above-described interblock polymer layer has excellent adhesiveness to serve as an adhesive layer, and the above-described external polymer is a substrate and a photocurable polymer described later. In order to simultaneously serve as a protective layer to protect the block from etching used in the thin film removal process, a material having excellent corrosion resistance to hydrofluoric acid and organic solvents may be selected.

As an example, the adhesive polymer may be a hydrocarbon-based polymer. Specifically, an inter-block polymer layer may be formed by applying a polymer solution containing a hydrocarbon-based polymer between blocks and then drying the block, and accordingly, adjacent blocks may be easily bonded.

The method of forming the outer polymer layer is not particularly limited, and for example, the outer polymer layer may be formed by applying the polymer solution to the side surface, top surface, or both of the above-described laminate and then drying it. .

Meanwhile, in the present invention, the hydrocarbon-based polymer means a polymer composed of carbon (C) and hydrogen (H) as main elements, or as additional elements constituting the polymer, oxygen (O) and nitrogen (N ), sulfur (S), and the like may be further included. Non-limiting examples of such hydrocarbon-based polymers include olefinic polymers, or polyethylene, polypropylene, polyisoprene, polybutadiene, polybutene-1, polyisobutylene, ethylene-propylene copolymers, hydrogenated polyisoprene, hydrogenated Polybutadiene, hydrogenated polybutene-1, hydrogenated polyisobutylene, terminally hydrogenated polyisobutylene, cycloolefin homopolymer, cycloolefin copolymer, terpene resin, hydrogenated cycloolefin homopolymer, hydrogenated cycloolefin copolymer and hydrogenated terpene It may be at least one selected from the group consisting of resins and the like, and for example, polymer glue may be used as the hydrocarbon-based polymer.

According to one aspect of the present invention, the thickness of the interblock polymer layer and the thickness of the outer polymer layer may be each independently 0.01 to 0.1 μm (ie, 0.01 μm or more and 0.1 μm or less). Meanwhile, more preferably, the thickness of the interblock polymer layer and the lower limit of the thickness of the outer polymer layer may be independently 0.02 μm. In addition, the thickness of the interblock polymer layer and the upper limit of the thickness of the outer polymer layer may each independently be 0.05 μm. By controlling the thickness of the interblock polymer layer and the thickness of the outer polymer layer to 0.01 μm or more, the functions as the adhesive layer and the protective layer described above can be effectively exhibited, and the thickness of the interblock polymer layer and the outer polymer layer can be By controlling it to 0.1 μm or less, it is possible to effectively obtain a highly efficient permanent magnet that does not affect the magnetism between blocks. At this time, the thickness of the interblock polymer layer represents a value obtained by measuring the shortest distance in the vertical direction (or stacking direction) with respect to the interblock polymer layer provided between each block.

In addition, when the external polymer layer is provided on the side surface of the laminate, the thickness of the external polymer layer is from the side surface of the laminate including each block and the inter-block polymer layer as described above to the surface of the external polymer layer. It represents the value measured by the shortest distance in the vertical direction. On the other hand, when the outer polymer layer is provided on the upper surface of the laminate, the thickness of the outer polymer layer is a value obtained by measuring the shortest distance from the upper surface of the laminate to the surface of the outer polymer layer in a vertical direction (or in the lamination direction). indicates

In addition, according to the present invention, the permanent magnet is disposed on the second block, at least one additional block in which hard magnetic thin films and soft magnetic thin films are alternately stacked; and

An interblock polymer layer may be further included between the second block and the additional block and between the additional blocks when the number of additional blocks is two or more.

According to the present invention, when the permanent magnet further includes an additional block, the laminate may further include, for example, a third block, or the laminate may further include an additional block.

According to the present invention, when the number of additional blocks is two or more, the laminate may include additional blocks other than the interblock polymer layer, the first block, the second block, and the uppermost block. That is, in terms of securing magnetic efficiency, it is preferable that the outer polymer layer is not provided on the side surface and upper surface of the uppermost block.

For example, the permanent magnet is disposed on the second block and may further include a third block in which hard magnetic thin films and soft magnetic thin films are alternately (or alternately and repeatedly) laminated. At this time, the permanent magnet is a first block; second block; a third block; and an inter-block polymer layer provided between each block. That is, when the permanent magnet includes the third block, a first interblock polymer layer may be provided between the first block and the second block, and a second interblock polymer layer between the second block and the third block. Layers may be provided.

Further, according to the present invention, when the permanent magnet includes the third block, on the side surface of the laminate including the first block, the first interblock polymer layer, the second block, and the second interblock polymer layer. It may further include an external polymer layer provided on.

According to the present invention, in the permanent magnet, the total number of blocks (including the first block, the second block, and additional blocks when the additional blocks are provided) may be two or more, and the upper limit is larger as the size increases. Since it can be manufactured, it may not be separately limited. However, from the viewpoint of adjusting the size appropriately for use in a large motor of an electric vehicle, etc., the total number of blocks may be 2 to 10,000, more preferably 2 to 5,000, and most preferably 2 to 10,000. It can be 1,000. According to the present invention, by controlling the total number of blocks as described above, the problem that conventional permanent magnets using exchange magnetic force could only be used for micro motors is solved, and permanent magnets using exchange magnetic force in a bulk form of several millimeters or more are solved. A magnet can be manufactured, and thus it can be preferably applied to a large motor such as an electric vehicle.

For example, in addition to the first block and the second block, as additional blocks, a third block, a fourth block, a fifth block, a sixth block, etc. may be sequentially included, which may have a size of several mm (thickness ) It may further include up to the n-th block until a permanent magnet having a is manufactured. In addition, an inter-block polymer layer may be further included between adjacent blocks. Here, n represents an integer of 3 or more, preferably, n may be an integer of 3 to 10,000, more preferably an integer of 3 to 5,000, and most preferably an integer of 3 to 1,000.

In the present specification, the meaning of further including up to the n-th block means that it may further include up to the n-th block sequentially from the third block. For example, in the case of n = 3, the permanent magnet This block means that the first block, the second block, and the third block are included. In addition, when n = 5, it means that the third block to the fifth block are sequentially included, and accordingly, the permanent magnet is a first block, a second block, a third block, a fourth block, and a fourth block. Contains 5 blocks.

According to the present invention, when the permanent magnet further includes up to the n-th block as an additional block, an inter-block polymer layer provided between each adjacent block and provided on each block of the first to n-th blocks, Each of the first interblock polymer layer to the nth interblock polymer layer may be further included. At this time, the first block to the n-th block; and an external polymer layer provided on a side surface, an upper surface, or both of the laminate including the first interblock polymer layer to the n-th interblock polymer layer. In addition, in terms of securing the magnetic efficiency of the permanent magnet, preferably, the outer polymer layer may be provided only on the side surface of the laminate.

Alternatively, according to the present invention, when the permanent magnet further includes up to the n-th block as an additional block, between the blocks provided between each adjacent block and provided on each block of the 1st block to the n-1th block As the polymer layer, each of the first interblock polymer layer to the n-1th interblock polymer layer may be further included. At this time, the first block to the n-1th block; and an external polymer layer provided on a side surface, an upper surface, or both of the laminate including the first interblock polymer layer to the n−1th interblock polymer layer. In addition, in terms of securing the magnetic efficiency of the permanent magnet, preferably, the outer polymer layer may be provided only on the side surface of the laminate.

On the other hand, like the above-mentioned first block and second block, the additional block also has a configuration in which hard magnetic thin films and soft magnetic thin films are alternately (or alternately and repeatedly) laminated, respectively. At this time, hard magnetic thin films, The above description can be equally applied to the soft magnetic thin film, the block, the interblock polymer layer, and the outer polymer layer.

The structure of an exemplary permanent magnet of the present invention is schematically shown in FIGS. 1 to 3 . Specifically, Figures 1 (a), 2 (a) and 3 (a) show the structure of the permanent magnet before being removed by the removal process of the first substrate 1 and the protective layer 101 described later, 1(b), 2(b) and 3(b) show the structure of the permanent magnet after the first substrate 1 and the protective layer 101 are removed.

That is, the permanent magnet according to the present invention includes a first block 21 in which hard magnetic thin films 11 and soft magnetic thin films 12 are alternately laminated; a second block 22 in which hard magnetic thin films 11 and soft magnetic thin films 12 are alternately laminated; and an interblock polymer layer 31 (or a first interblock polymer layer) provided between the first block 21 and the second block 22 .

In addition, the permanent magnet is provided on the second block 22, and may further include additional blocks 23 and 24 in which hard magnetic thin films 11 and soft magnetic thin films 12 are alternately stacked, respectively. , An interblock polymer layer 32 (or a second interblock polymer layer) may be included between the second block 22 and the third block 23 .

On the other hand, as shown in FIGS. 1 to 3, the hard magnetic thin film 11 and the soft magnetic thin film 12 constituting each block may be alternately and repeatedly arranged. At this time, the reference numerals in FIGS. omitted.

In addition, as shown in FIGS. 1 to 3, the permanent magnet according to the present invention may include an external polymer layer 100 provided on both the top and side surfaces of the laminate, as shown in FIG. As shown in 2(b), the outer polymer layer may not be included, and as shown in FIG. 3(b), the outer polymer layer 100 provided only on the side surface of the laminate may be included. However, in terms of the magnetic efficiency of the permanent magnet and the protection of the block from the etchant, FIG. 3(b) is the most preferable form.

Meanwhile, the permanent magnet of the present invention may be disposed such that one surface of the interblock polymer layer is adjacent to the hard magnetic thin film 11 and the other surface is adjacent to the soft magnetic thin film 12. The upper surface of each interblock polymer layer is adjacent to the soft magnetic thin film, and the lower surface of each interblock polymer layer is adjacent to the hard magnetic thin film, or the upper surface of each interblock polymer layer is adjacent to the hard magnetic thin film, and each block It is preferable to dispose the thin films mutually with each other so that the lower surface of the interpolymer layer is adjacent to the soft magnetic thin film. In this way, by mutually selecting the materials of the thin films adjacent to the upper and lower surfaces based on the polymer layer between each block, even if the polymer layer between blocks is placed between each block, the magnetism between adjacent blocks is not adversely affected, and the magnetic exchange has excellent magnetic force. It is possible to effectively provide a permanent magnet having

According to one implementation example of the present invention, a first substrate 1 provided on the lower surface of the permanent magnet may be further included. Alternatively, according to one embodiment of the present invention, a protective layer (or first protective layer) 101 provided on the lower surface of the permanent magnet may be further included. Alternatively, according to one embodiment of the present invention, a first substrate 1 provided on the lower surface of the permanent magnet and having a protective layer 101 formed on the substrate surface may be further included.

That is, according to the present invention, the permanent magnet may or may not include the first substrate 1 and/or the protective layer 101 . However, a preferred example of the present invention is a case in which neither the protective layer nor the first substrate is included.

A typical structure of the permanent magnet including the first substrate and the protective layer described above is shown in FIGS. 1(a), 2(a) and 3(a). That is, FIGS. 1 (a) to 3 (a) show a protective layer 101 (or a first protective layer) on the surface of the substrate under each permanent magnet of FIGS. 1 (b) to 3 (b) described above. ] It shows that the first substrate 1 formed is provided.

According to one embodiment of the present invention, the first substrate 1 having the protective layer 101 formed on the surface of the substrate may be provided below the first block 21 .

Meanwhile, according to the present invention, the protective layer may be a photocurable polymer layer or a polyimide layer.

According to the present invention, when the protective layer is a photocurable polymer layer, the photocurable polymer layer may contain 60% or more of the photocurable polymer, preferably 80% or more, and more preferably 90% or more. can Alternatively, the photocurable polymer layer may be formed of only the photocurable polymer, excluding impurities inevitably included during the manufacturing process. At this time, as long as the photocurable polymer is a polymer that can be cured using light (light), those commonly used in the art can be used without limitation, and preferably, UV curable polymers can be used. For example, the photocurable polymer includes thiorene, polyurethane, urethane acrylate resin, etc., or epoxy, epoxy silane, acrylate, methacrylate, acrylic acid and methacrylic acid type monomers/comonomers / A resin based on a prepolymer may be included. As representative examples, products sold by Norland Optics under the trademark NOA (trademark) Norland Optical Adhesive, such as products NOA81 and NOA60; products sold by Dymax in the range of "Dymax Adhesive and light curing systems"; "UV adhesives" The products sold by Bohle; and the products sold by Sartmer under the trade names SR492 and SR499 can be used as photocurable polymers.

In the present invention, by using the above-described photocurable polymer as a component constituting the protective layer, when a glass substrate is used as a second substrate or an additional substrate in the manufacturing process described later, light can pass through the glass substrate, Accordingly, light can easily reach the polymer solution containing the photocurable polymer. Therefore, according to the present invention, light is uniformly transmitted to the entire surface of the photocurable polymer layer to be formed, so that a photocurable polymer layer having good surface characteristics can be formed.

Alternatively, according to the present invention, when the protective layer is a polyimide layer, the polyimide layer may contain 60% or more of polyimide, preferably 80% or more, more preferably 90% or more. there is. Alternatively, the polyimide layer may be made of only polyimide, excluding impurities inevitably included during the manufacturing process.

In the present invention, by using polyimide as a component constituting the protective layer, when an organic substrate is used as a second substrate or an additional substrate in the manufacturing process described later, heat treatment within a range that does not cause deformation of the thin film without using an etchant. It is possible to relatively easily remove the protective layer by performing.

Further, according to the present invention, the thickness of the protective layer is not particularly limited, but may be, for example, 1 to 10 μm, more preferably 2 to 3 μm. By setting the thickness of the protective layer within the aforementioned range, adjacent blocks can be effectively protected during a substrate removal process such as etching.

Meanwhile, according to the present invention, the first substrate may be a silicon substrate or a glass substrate, and more preferably, the first substrate may be a silicon substrate (or silicon wafer). Further, according to one aspect of the present invention, the first substrate may have a photocurable polymer thin film formed on a surface of the substrate.

Further, according to the present invention, the thickness of the first substrate may be 0.01 ~ 0.7 mm, more preferably 0.01 ~ 0.1 mm. On the other hand, by setting the thickness of the first substrate to 0.01 mm or more, the block support effect can be effectively exhibited and the first block can be stably formed on the first substrate, and the thickness of the first substrate is 0.7 mm or less. By doing so, the first substrate can be easily removed in a first substrate removal process to be described later.

According to the present invention, an additional protective layer (or second protective layer) may be further included on the second block. That is, the first block, the inter-block polymer layer, the second block, and the additional protective layer may be sequentially disposed from the bottom to the top of the permanent magnet.

For example, if the third block is further included, the second block; An additional protective layer (or second protective layer) may be provided between the interblock polymer layer (or the second interblock polymer layer) provided between the second block and the third block. In this case, the description of the aforementioned protective layer may be equally applied to the aforementioned additional protective layer.

Alternatively, according to the present invention, when an additional block is included, an additional protective layer provided adjacent to the lower surface of the interblock polymer layer may be further included. Therefore, when the number of additional blocks is two or more, an additional protective layer provided adjacent to the lower surface of the polymer layer between each block may be further included.

For example, when the permanent magnet is provided up to the fourth block, in an upward direction, the first substrate, the first protective layer, the first block, the polymer layer between the first blocks, the second block, the second protective layer, and the second block An interblock polymer layer, a third block, a third protective layer, a third interblock polymer layer, and a fourth block may be stacked in this order. Meanwhile, at least one of the first substrate and the first protective layer may be removed during the manufacturing process and not included in the final permanent magnet.

Similarly, according to the present invention, when the permanent magnet includes from the first block to the n-th block, a protective layer and an inter-block polymer layer may optionally be further included between each adjacent block of the second block to the n-th block. there is.

Further, according to the present invention, in a portion between adjacent blocks, an additional protective layer and an additional inter-block polymer layer may be sequentially stacked in an upward direction (or in a stacking direction).

For example, when the permanent magnet includes the first block to the n-th block, it is provided between adjacent blocks, and the additional protective layer is sequentially provided on each block from the second block to the n-th block and between the additional blocks. A polymer layer may be deposited. In this case, a second protective layer and a second interblock polymer layer may be sequentially provided on the second block, and an nth protective layer and an nth interblock polymer layer may be provided on each block up to the nth block.

In addition, according to the present invention, in the permanent magnet, an additional protective layer may be further included on the top surface of the uppermost block. On the other hand, the above-mentioned best block means the nth block if the permanent magnet includes from the first block to the nth block, and means the second block if only the first block and the second block exist. do.

According to the present invention, another additional protective layer may or may not be provided on the uppermost block described above. In addition, according to the present invention, an additional substrate may be provided on the other additional protective layer provided on the uppermost block described above, or the additional substrate may not be provided.

According to the present invention, the additional substrate (or second substrate) may be the same as the first substrate or different from the first substrate. For example, the additional substrate (or second substrate) may be a glass substrate.

Alternatively, as the additional substrate (or second substrate), the laminate 300 including a polyimide film and a silicon pressure sensitive adhesive layer respectively provided on the upper and lower surfaces of the polyimide film ) (or, as shown in FIG. 11(d) below, after the polyimide film 111 or the like is removed, it may mean only the silicone pressure-sensitive adhesive layer 112) may be used.

On the other hand, although not particularly limited, the thickness of the additional substrate (or second substrate) may preferably be 1 mm or less, and the thinner the additional substrate, the better, so the lower limit may not be separately limited.

However, as a non-limiting example of the present invention, it is more preferable that the additional substrate is 0.01 to 0.7 mm, and by setting the thickness of the additional substrate to 0.01 mm, blocks stacked on the substrate can be stably supported during the manufacturing process. In addition, by setting the thickness of the additional substrate to 0.7 mm or less, the substrate can be easily removed in the removal process of such a substrate.

The permanent magnet according to the present invention may have a thickness in the range of several mm, specifically in the range of 1 to 50 mm, and more preferably in the range of 1 to 10 mm. When the size of the permanent magnet satisfies the aforementioned range, it can be effectively applied to large motors such as electric vehicles.

Hereinafter, a method for manufacturing a permanent magnet according to the present invention will be described in detail. However, the manufacturing method described later is only an example for manufacturing the permanent magnet described above, and the permanent magnet according to the present invention does not necessarily have to be manufactured only by the present manufacturing method, and any manufacturing method satisfies the scope of the present invention. It should be noted that there is no problem in implementing each implementation example of the present invention if it is a method.

[Manufacturing method of permanent magnet]

According to another aspect of the present invention,

forming a first block by alternately stacking hard magnetic thin films and soft magnetic thin films on a first substrate;

forming a second block by alternately stacking hard magnetic thin films and soft magnetic thin films on a second substrate; and

bonding the first block and the second block by forming an inter-block polymer layer between the outermost thin film of the first block facing the first substrate and the outermost thin film of the second block facing the second substrate; There is provided a method for manufacturing a permanent magnet, including;

In the permanent magnet manufacturing method, the first substrate, the second substrate (or additional substrate), the block, the hard magnetic thin film, the soft magnetic thin film, the interblock polymer layer and the protective layer (or additional protective layer), etc. In this regard, the above description can be equally applied.

According to the present invention, it is possible to form a first block (or second substrate) by alternately stacking hard magnetic thin films and soft magnetic thin films on a first substrate (or second substrate). At this time, the hard magnetic thin film and the soft magnetic thin film may be stacked using deposition by sputtering, which is commonly used in the art, and the stacking method is not particularly limited.

Further, according to the present invention, as described above in the permanent magnet, the formation of the first block may be performed by alternately (or alternately and repeatedly) stacking the hard magnetic thin film and the soft magnetic thin film. Meanwhile, the formation of the second block is also the same.

When the first block and/or the second block are formed, the above-described description of the permanent magnet can be equally applied to the number or thickness of the hard magnetic thin film and the soft magnetic thin film stacked in each block.

According to the present invention, the first substrate and the second substrate described above may be used as they are during the manufacturing process of the permanent magnet without forming a protective layer on the surface, or at least one of the first substrate and the second substrate may be used on the surface of the substrate. A protective layer may be formed on it.

As an example, in the case of using a laminate including the above-described polyimide film and silicon pressure sensitive adhesive layers respectively provided on the upper and lower surfaces of the polyimide film as the second substrate, The desired permanent magnet in the present invention can be manufactured without forming the protective layer on the surface of the second substrate.

Alternatively, as another example, as the first substrate and the second substrate, commercially available products coated with a protective layer on the surface of the substrate may be used. Accordingly, the method may further include forming a protective layer on a surface of at least one of the first substrate and the second substrate.

That is, according to the present invention, before the step of forming the first block by alternately stacking the hard magnetic thin film and the soft magnetic thin film on the first substrate, a protective layer (or first protective layer) on the first substrate A step of forming a may be further included.

In addition, according to the present invention, before the step of forming the second block by alternately stacking the hard magnetic thin film and the soft magnetic thin film on the second substrate, an additional protective layer (or second protective layer) on the second substrate ) may be further included.

On the other hand, as an example, FIG. 4 schematically shows a structure after forming a first block on a first substrate, and FIG. 6 schematically shows a structure after forming a second block on a second substrate. was

Specifically, Figure 4 is a first substrate (1); protective layer 101 (or first protective layer 101); and a first block 21 in which hard magnetic thin films 11 and soft magnetic thin films 12 are alternately and repeatedly stacked. 6 also shows a second substrate 2; additional protective layer] (102) [or, second protective layer]; and a second block 22 in which the hard magnetic thin film 11 and the soft magnetic thin film 12 are alternately and repeatedly stacked.

Meanwhile, according to the present invention, as described above, by forming a protective layer (or an additional protective layer) on the first substrate (or second substrate), blocks stacked on the first substrate (or second substrate) In addition to being easily adhered to a substrate, an adjacent block can be protected from an etchant or heat treatment used in a substrate removal process described later, and at the same time, a substrate can be easily removed from a block in a substrate removal process.

According to the present invention, in the step of forming the protective layer on the first substrate, it is sufficient if the protective layer is provided on a partial surface of the first substrate. For example, the protective layer may be provided on the upper surface of the first substrate, or the first protective layer may be provided on all surfaces including the upper, lower and side surfaces of the first substrate.

According to the present invention, the step of forming the protective layer on the substrate described above may be performed by applying a solution containing a photocurable polymer or polyimide to the surface of the substrate and drying (or curing) it.

At this time, as a method of applying a solution containing the photocurable polymer or polyimide, a method commonly used in the art may be applied without limitation. For example, a protective layer may be formed by coating a solution containing the photocurable polymer or polyimide on the first substrate and drying or curing the solution. Alternatively, the first substrate is immersed in a solution containing the photocurable polymer or polyimide so that a layer made of the solution containing the photocurable polymer or polyimide is formed (coated) on all surfaces of the substrate, then dried or By hardening, the protective layer can be formed thinly.

According to the present invention, the solution containing the photocurable polymer or polyimide may include at least one selected from the group consisting of a photocurable polymer and polyimide, and a solvent.

In addition, according to the present invention, in the case of applying and curing a solution containing a photocurable polymer to form the protective layer, a method of curing using a UV lamp may be used, specifically using a UV lamp It can be cured for 1 to 30 minutes, preferably for 2 to 3 minutes.

According to the present invention, in the step of forming an additional protective layer on the second substrate, it is sufficient if the additional protective layer is provided on a partial surface of the second substrate. Specifically, the additional protective layer may be formed on all surfaces of the second substrate, including the upper, lower and side surfaces, or the additional protective layer may be formed only on the upper surface of the second substrate. However, it is not particularly limited, but it is preferable that an additional protective layer is formed only on the upper surface of the second substrate. This is because it is easy to remove the second substrate when the additional protective layer is formed only on one surface of the second substrate that is in contact with the second block in the step of removing the second substrate, which will be described later. Therefore, as an example of the present invention, in the step of forming the additional protective layer on the second substrate, it is more preferable in terms of process efficiency to form the additional protective layer on only one side of the second substrate.

On the other hand, as the second substrate, the laminate 300 including the above-described polyimide film and silicon pressure sensitive adhesive layers respectively provided on the upper and lower surfaces of the polyimide film (or, As shown in FIG. 11(d) below, after the polyimide film 111 or the like is removed, the case of using the silicone pressure-sensitive adhesive layer 112) will be described.

FIG. 11 schematically shows a case in which a laminate 300 including a polyimide film and a silicon pressure-sensitive adhesive layer is used as the above-described second substrate.

First, as shown in FIG. 11 (a), a polyimide film 111; silicone pressure-sensitive adhesive layers 112 respectively provided on the upper and lower surfaces of the polyimide film 111; A laminate 300 including additional polyimide films 111 respectively provided on the silicone pressure-sensitive adhesive layer 112 is prepared.

Subsequently, as shown in FIG. 11(b), after removing any one of the additional polyimide films 111 provided on the outermost side of the laminate 300, the silicone pressure-sensitive adhesive layer 112 exposed on the surface is freed. It is attached on the substrate 200.

In addition, after removing the polyimide film 111 provided on the outermost surface of the laminate 300, as shown in FIG. 11(c), on the silicone pressure-sensitive adhesive layer 112, the hard magnetic thin film 11 and The soft magnetic thin films 12 are alternately and repeatedly laminated to form the second block 2 .

In addition, as shown in FIG. 11(d), by removing the glass substrate 200, the silicon pressure-sensitive adhesive layer 112 and the polyimide film 111 provided on the glass substrate 200, the second block ( 2) Only the silicone pressure-sensitive adhesive layer 112 remains on the top. Subsequently, after preparing the first block 1 formed on the first substrate 1, the outermost thin film of the first block 1 facing the first substrate and the silicon decompression of the second block 2 The first block 1 and the second block 2 are bonded by forming an interblock polymer layer described later between the outermost thin films facing the adhesive layer. After that, the silicone pressure-sensitive adhesive layer 112 remaining on the surface of the second block may be removed using a solution such as ethanol or acetone. By repeating this method, a plurality of blocks can be repeatedly formed on the second block 2 .

At this time, the thickness of the polyimide film and the silicone pressure-sensitive adhesive layer is not particularly limited, but may be 20 to 60 μm as an example. By setting the thickness of the adhesive layer in the range of 20 to 60 μm, the polyimide film and the silicone pressure-sensitive adhesive layer can be easily removed during the manufacturing process.

Meanwhile, the polyimide film and the silicone pressure-sensitive adhesive layer can be easily removed during the manufacturing process. For example, the polyimide film can be easily removed by peeling it from the laminate 300, and the silicone pressure-sensitive adhesive layer can be easily removed by applying a solution such as ethanol or acetone as described above. In this case, the silicone pressure sensitive adhesive layer may be formed by applying a silicone pressure sensitive adhesive composition, and a commonly known material may be applied as the material of the silicone pressure sensitive adhesive without limitation.

On the other hand, according to the present invention, an interblock polymer layer is formed between the outermost thin film of the first block facing the first substrate and the outermost thin film of the second block facing the second substrate, thereby forming a polymer layer between the first block and the first block. The second block can be joined. Meanwhile, in the case of using the above-described laminate 300 as the second substrate, it is necessary to note that the meaning of the second substrate side of the second block is different. In other words, as shown in FIG. 11(d) described above, after at least one polyimide film 111 and/or silicone pressure-sensitive adhesive layer 112 in the laminate 300 is removed during the manufacturing process, the second block Finally, the remaining silicone pressure-sensitive adhesive layer 112 may correspond to the second substrate. Therefore, in the above case, the 'outermost thin film facing the second substrate of the second block' refers to 'the outermost thin film facing the remaining silicon pressure-sensitive adhesive layer 112,' as shown in FIG. It may mean 'outer thin film'.

According to the present invention, the step of bonding the first block and the second block by forming the interblock polymer layer, the polymer on the outermost thin film facing the substrate of any one of the first block and the second block applying a solution and bringing the outermost thin film facing the substrate of another block into contact with the surface on which the polymer solution is applied; and drying the polymer solution.

However, in a preferred example of the present invention, a polymer solution is applied on the outermost thin film facing the first substrate of the first block, and the outermost thin film facing the second substrate of the second block is coated with the polymer solution. contacting the coated surface; and drying the polymer solution.

According to the present invention, as a method of applying the polymer solution, a spin coat method, a wipe coat method, a spray coat method, a squeegee coat method, a dip coat method, a die coat method, an inkjet method, a flow coat method, a roll coat method, and a cast method , A commonly known coating method such as a gravure coat method can be applied.

Further, according to the present invention, the step of bonding the first block and the second block by forming the inter-block polymer layer may include a step of thinning the applied polymer solution.

For example, the step of bonding the first block and the second block by forming the inter-block polymer layer may include the first substrate on which the first block is stacked or the second substrate on which the second block is stacked on the rotating plate, placing the substrate facing the rotating plate; applying a polymer solution on the thin film; and rotating the rotating plate to thin the applied polymer solution.

A method of forming an interblock polymer layer by rotating the above-described rotary plate is shown in FIG. 10 . For example, on the rotating plate 60, the first substrate 62 on which the first block is stacked is disposed so that the substrate faces the rotating plate 60 (see FIG. 10(a)), and on the thin film of the substrate A polymer solution 61 is applied (see FIG. 10(b)). Next, the rotary plate 60 is rotated to adjust the layer 63 made of the polymer solution for forming the inter-block polymer layer to be thin (see FIG. 10(c)), and the polymer solution is dried or cured to form a thin block. An inner polymer layer 64 (or an outer polymer layer included) can be formed (see FIG. 10(d)).

According to the present invention, it is preferable to set the rotational speed of the rotating plate in the range of 100 to 20,000 rpm, and by controlling the rotational speed of the rotating plate in the above range, the interblock polymer layer and the outer polymer layer formed by the above process are thinned. can do.

In addition, according to the present invention, a polymer solution is applied on the outermost thin film facing the substrate of any one of the first block and the second block to form an inter-block polymer layer, and any one of the blocks An external polymer layer may also be formed by applying a polymer solution on the side surface of the outer layer.

According to the present invention, the step of forming an outer polymer layer during formation of the interblock polymer layer or forming an outer polymer layer after formation of the interblock polymer layer may be further included. Meanwhile, when the outer polymer layer is separately formed, a step of applying a polymer solution on the side surface may be further included, and the above description may be applied to the method of applying the polymer solution in the same manner.

That is, according to the present invention, when forming the interblock polymer layer, an external polymer layer provided on the side surface of the laminate including the interblock polymer layer and the first block may be formed, or the interblock polymer layer may be formed. After forming the layer, a step of forming an external polymer layer provided on a side surface of the laminate may be further included. Here, the description of the permanent magnet described above can be equally applied to the laminate.

Meanwhile, a structure manufactured through a process of forming an inter-block polymer layer by applying a polymer solution on the outermost thin film facing the substrate of the first block, which is one example of the above-described methods, is shown in FIG. 5 . That is, with respect to the laminate formed in FIG. 4 , the interblock polymer layer 31 can be formed by applying a polymer solution on the outermost thin film facing the substrate of the first block 21 .

According to the present invention, the description of the polymer included in the interblock polymer layer described above in relation to the permanent magnet is equally applicable to the polymer solution used when forming the interblock polymer layer. However, the polymer solution may further include components such as a solvent in addition to the polymer described above. On the other hand, as the solvent, a conventional solvent that can be used in the art may be used, for example, an organic solvent, a ketone solvent, an alcohol solvent, and the like may be used.

Further, according to the present invention, the step of drying the polymer solution described above may include both natural drying and curing of the polymer solution.

Meanwhile, a process of bonding the first block and the second block by forming the aforementioned inter-block polymer layer is schematically shown in FIG. 7 . That is, in the lower laminate of FIG. 7 (a), the protective layer 101 is formed on the surface of the substrate 1 of the first substrate, and the first block 21 is formed on the protective layer 101. there is. Meanwhile, in the upper laminate, an additional protective layer 102 is formed on the surface of the substrate 2 of the second substrate, and a second block 22 is formed on the additional protective layer 102 .

In this way, in the process of bonding the first block 21 and the second block 22, a polymer solution is applied on the outermost thin film opposite to the substrate of the first block 21, and the surface to which the polymer solution is applied After the outermost thin film 42 facing the substrate of the second block 22 is brought into contact with (41), the polymer solution is dried to form an interblock polymer between the first block 21 and the second block 22. A layer 31 (and/or an outer polymer layer) may be formed to form the laminate of FIG. 7(b).

According to the present invention, after the step of forming the second block or the step of bonding the first block and the second block, a substrate removal step of removing any one of the first substrate and the second substrate is further included. can do.

At this time, although not particularly limited, in the step of removing the substrate, the substrate may be removed using a hydrofluoric acid solution as an etchant for removing the substrate, or the substrate may be removed by heat treatment.

Alternatively, when the above-described laminate 300 (or the silicone pressure-sensitive adhesive layer 112 in FIG. 11 (d)) is used as the second substrate 2, with reference to FIGS. 11 (b) to (d) As described above, after the step of forming the second block, at least one layer of the laminate 300 is removed, and after the step of forming the first block and the second block, the silicone pressure-sensitive adhesive layer finally remains. can also be removed.

According to the present invention, in the substrate removal step, the substrate may be removed using a hydrofluoric acid solution as an etchant for removing the substrate. That is, the step of removing the substrate may be performed by etching the substrate in the thickness direction from the surface using the hydrofluoric acid solution as an etchant for removing the substrate, or may be performed by immersing the substrate in the etchant.

Meanwhile, according to the present invention, the hydrofluoric acid solution is a solution containing hydrofluoric acid, and a commonly used solution in the art may be used, or a commercial product may be used. For example, the hydrofluoric acid solution may be a solution containing 10% or more of hydrofluoric acid, or a solution containing 90% or more of hydrofluoric acid.

Alternatively, in the step of removing the substrate, the substrate may be removed through heat treatment to the extent of not causing deformation of the hard magnetic thin film and the soft magnetic thin film of blocks adjacent to the substrate to be removed.

As an example, the first substrate may be a silicon substrate and the second substrate may be a glass substrate. In this case, it is preferable to first remove the second substrate in the substrate removing step. Meanwhile, by using a glass substrate as the second substrate, the second substrate can be relatively easily removed by using a hydrofluoric acid solution as an etchant or by heat treatment.

On the other hand, according to the present invention, in the case of etching from the surface of the second substrate to the bottom surface of the substrate by gradually etching in the thickness direction, an additional protective layer is formed on the surface of the second substrate facing the side to which the etchant is supplied. may have been In this way, by providing the additional protective layer on the surface of the second substrate facing the side to which the etchant is supplied, blocks adjacent to the additional protective layer can be effectively protected from the hydrofluoric acid solution used as the etchant described above.

Alternatively, according to the present invention, in the step of removing the substrate, an additional protective layer may be formed on the block-side surface of the substrate to be removed. Meanwhile, when an additional protective layer is formed on the block-side surface of the substrate, the substrate and the additional protective film can be simultaneously removed by heat treatment without using the above-described etching method. That is, in the case of removing the substrate and the additional protective film by the heat treatment, it can be made by heat treatment at a temperature within a range that does not deform the hard magnetic thin film and the soft magnetic thin film of blocks disposed adjacent to each other. The substrate and additional protective film can be easily removed from the block.

A process of removing the second substrate using an etchant, which is an example of the present invention, is shown in FIG. 8 . Specifically, FIG. 8(a) shows the structure of the laminate in the step of performing HF etching to remove the substrate 2 of the second substrate, and FIG. 8(b) shows the substrate 2 of this second substrate. ), a structure in which an interblock polymer layer 32 is formed on the additional protective film 102 with the additional protective film 102 left is shown.

On the other hand, according to the present invention, in the method of manufacturing a permanent magnet, after the above-described substrate removal process, the additional protective film thin film may not be removed, and may be left in the final permanent magnet, by an optional additional process described later. An additional protective layer may be removed.

According to the present invention, the substrate removal step,

removing the substrate by gradually etching it from the surface in the thickness direction using a hydrofluoric acid solution as an etchant for removing the substrate; and

Thereafter, a step of removing the protective layer formed on the surface of the removed substrate may be further included.

In addition, according to the present invention, the substrate removal step,

removing the substrate by gradually etching it from the surface in the thickness direction using a hydrofluoric acid solution as an etchant for removing the substrate; and

Thereafter, with respect to the protective layer formed on the surface of the removed substrate, using an organic solvent as an etchant for removing the protective layer, a step of gradually etching and removing the protective layer from the surface in the thickness direction may be further included. there is.

Or, according to the present invention, the substrate removal step,

It may include a step of removing the substrate and the additional protective layer at the same time by performing heat treatment on the substrate having the additional protective layer formed thereon.

According to the present invention, when the substrate is removed using the etchant, the additional protective film can be easily removed by using an organic solvent as the etchant for removing the protective layer in order to remove the additional protective film. For example, as the etching solution for removing the protective film, an alcohol-based solvent or a ketone-based solvent may be preferably used, and for example, ethanol, acetone, or the like may be preferably used.

Alternatively, when the above-described laminate 300 (or the silicone pressure-sensitive adhesive layer 112 in FIG. 11(d)) is used as the second substrate 2, as described above, the second block is formed. After the step, after removing one or more layers in the laminate 300, and after the step of forming the first block and the second block, the remaining silicone pressure-sensitive adhesive layer may be finally removed, and the silicone pressure-sensitive adhesive layer may be removed. When removing the layer, the silicone pressure-sensitive adhesive layer can be easily removed using a solution such as ethanol or acetone.

According to the present invention, a protective layer is formed on the substrate surface of the first substrate, and an additional protective layer may be formed on the substrate surface of the second substrate. In this case, when the second substrate is removed first in the above-described substrate removing step, an additional protective layer (second protective layer) formed on the surface of the second substrate may be removed.

On the other hand, the present invention selectively includes the step of removing the above-described protective layer, for example, when the second substrate is removed, the additional protective layer may be removed from the finally manufactured permanent magnet, and the additional protective layer may be left in the finally manufactured permanent magnet without removing it.

According to the present invention, as described above, the magnetic efficiency of the permanent magnet according to the present invention is improved by removing the protective layer formed on the surface of the removed substrate that can affect the magnetism in the permanent magnet finally manufactured. can be further improved.

On the other hand, according to the present invention, in the substrate removal step, after the substrate removal step of removing only one substrate,

forming an additional block by alternately stacking a hard magnetic thin film and a soft magnetic thin film on an additional substrate; and

The method may further include bonding the laminate and the additional block by forming an interblock polymer layer between an outermost thin film on a side from which the substrate is removed and an outermost thin film facing the substrate of the additional block.

In addition, according to the present invention, in the method of manufacturing the permanent magnet, removing the additional substrate;

forming another additional block by alternately stacking a hard magnetic thin film and a soft magnetic thin film on another additional substrate; and

It may further include forming an interblock polymer layer between the outermost thin film on the side from which the additional substrate is removed and the outermost thin film facing the substrate of the other additional block to bond the laminate and the other additional block. there is.

According to the present invention, the description of the permanent magnet can be equally applied to the laminate.

Meanwhile, according to the present invention, when the number of additional blocks is two or more, an interblock polymer layer may be formed between each additional block to bond adjacent additional blocks to each other. In this case, the formation of the additional block may be applied in the same manner as the aforementioned method of forming the additional block.

According to the present invention, the step of forming an outer polymer layer during formation of the interblock polymer layer or separately forming an outer polymer layer after formation of the interblock polymer layer may be further included.

According to the present invention, when the interblock polymer layer is formed, an outer polymer layer provided on the side surface, upper surface, or both of the laminate including the first block, the second block, the additional block, and the interblock polymer layer is formed. It may further include steps to do.

For example, when forming a third block as an additional block,

forming a third block by alternately stacking hard magnetic thin films and soft magnetic thin films on a third substrate; and

An interblock polymer layer (or, bonding the laminate and the third block by forming a second inter-block polymer layer; and

The method may further include removing the third substrate.

On the other hand, according to the present invention, an additional protective layer may be formed on the substrate surface of the additional substrate (eg, commercially available products), or a hard magnetic thin film and a soft magnetic thin film are alternately formed on the additional substrate. The step of forming an additional protective layer (or a third protective layer, etc.) on the additional substrate may be further included before the step of repeatedly stacking to form the additional block.

A schematic cross section of a manufacturing process for forming a third block as an additional block according to the present invention is shown in FIG. 9 . That is, with respect to the laminate manufactured in FIG. 8(b) described above, the additional substrate 3 [or the third substrate] and the additional protective layer 103 on the additional substrate 3 [or the third protective layer] After forming ], the third block 23 is formed on the additional protective layer 103, and then the surface 51 of the interblock polymer layer 32 (or the second interblock polymer layer) and the The outermost thin film 52 facing the substrate of the third block was bonded.

Meanwhile, although not separately shown in FIG. 9 , the method described in FIG. 11 may be applied to form a third block and remove the third substrate. In addition, the same applies to the formation of additional blocks including a fourth block, a fifth block, and a sixth block described later.

According to the present invention, the formation of the additional block is performed by sequentially forming a fourth block, a fifth block, a sixth block, etc. in the same manner as the above-described step of forming the third block to have a size of several mm (ie, , thickness) can be repeated until a permanent magnet is manufactured.

According to another aspect of the present invention, n additional blocks may be formed, and specifically, the method of manufacturing the permanent magnet may further include forming up to the n-th block as additional blocks, and each additional block The forming method can be performed by repeatedly applying the above-described method in the same manner. Meanwhile, the above description regarding the permanent magnet may be equally applied to the nth block.

Specifically, according to the present invention, the method of manufacturing the permanent magnet may include forming up to the n-th block as an additional block,

The step of forming up to the nth block as the additional block,

forming an n-th block by alternately stacking a hard magnetic thin film and a soft magnetic thin film on an n-th substrate;

A polymer layer between the (n-1)th block is formed between the outermost thin film of the (n−1)th block facing the substrate and the outermost thin film of the nth block facing the nth substrate, thereby forming a polymer layer between the nth block and the nth block. joining n-1 blocks; and

It may be performed including removing the n-th substrate.

In addition, according to the present invention, prior to the step of forming the n-th block by alternately stacking hard magnetic thin films and soft magnetic thin films on the n-th substrate, forming an n-th protective layer on the n-th substrate is further performed. can include

According to the present invention, the manufacturing method of the permanent magnet, the first block to the n-th block; And the first interblock polymer layer to the nth interblock polymer layer; may further include forming an external polymer layer provided on a side surface, an upper surface, or both of them.

According to the present invention, the manufacturing method of the permanent magnet, the first block to the n-1th block; And the first interblock polymer layer to the n-1th interblock polymer layer; may further include forming an external polymer layer provided on a side surface, an upper surface, or both of them.

On the other hand, according to the present invention, forming the outer polymer layer;

It may be formed by applying a polymer solution when forming each interblock polymer layer, or may be performed by further including separately forming an external polymer layer after formation of each interblock polymer layer.

Meanwhile, the description of the above-described additional blocks in the first block, the second block, and the permanent magnet can be equally applied to the manufacturing method of the above-described additional block.

According to the present invention, after the above-described step of forming additional blocks or the above-described bonding step between blocks, a step of finally removing the remaining substrate (hereinafter, a step of removing the remaining substrate) may be further included.

Meanwhile, the present invention selectively includes the step of removing the remaining substrates, so that the remaining substrates may be present in the finally manufactured permanent magnet, or the remaining substrates may be removed and may not exist.

According to the present invention, in the step of removing the remaining substrate, the remaining substrate may be removed using hydrofluoric acid as an etchant for removing the substrate. Meanwhile, the description of the above-described substrate removal method may be equally applied to the remaining substrate removal methods.

According to the present invention, the remaining substrates may be a first substrate, and a silicon substrate or a glass substrate may be used as the first substrate, and more preferably, a silicon substrate (or silicon wafer) may be used. That is, by selecting the above-described material as the first substrate, the first substrate can be removed relatively easily by using a hydrofluoric acid solution as an etchant for removing the substrate or by performing heat treatment.

According to the present invention, it is preferable to first remove the second substrate in the aforementioned substrate removing step, and then remove the first substrate in the aforementioned remaining substrate removing step.

According to the present invention, by including the above-described step of removing the remaining substrates, the remaining substrates that may adversely affect the magnetism of the permanent magnets can be removed from the final permanent magnets, thereby further improving the magnetic efficiency of the manufactured permanent magnets. can make it

According to the present invention, after the step of removing the remaining substrate, the step of removing the protective layer formed on the surface of the remaining substrate may be further included, or at the same time as the removing of the remaining substrate, the protective layer may be removed. can also be removed.

Meanwhile, according to the present invention, the remaining substrate is preferably a first substrate, and the protective layer (first protective layer) formed on the surface of the first substrate may be removed.

At this time, the protective layer may be selectively removed, that is, the protective layer may be included in the finally manufactured permanent magnet, or it may be removed and not included.

Alternatively, according to the present invention, after the above-described step of removing the second substrate, the steps of removing the first substrate and removing the first protective layer may be further included, and the first substrate and the first protective layer may be further included. The order of removing is applicable regardless.

That is, after removing the first substrate, the first protective layer may be removed, or the first substrate and the first protective layer may be simultaneously removed by first removing the first protective layer provided to cover the first substrate.

Meanwhile, according to the present invention, the above description can be equally applied to the material constituting the protective layer, and the above description can be equally applied to the removal of the protective layer.

(Example)

Hereinafter, the present invention will be described in more detail through specific examples. The following examples are merely examples to aid understanding of the present invention, and the scope of the present invention is not limited thereto.

(Experimental Example 1)

For the deposition of magnetic thin films, the hard magnetic thin film containing Nd and the soft magnetic thin film containing Fe were alternately deposited five times. At this time, in order to measure the magnetic properties according to the thin film thickness change, the substrate transfer speed was adjusted to 1000 pulses, 1500 pulses, and 2000 pulses, respectively, as shown in Table 1 below. In order to accurately measure the thickness of the thin film, it was measured using an x-ray reflectance equipment, and magnetization and coercive force were measured for an external magnetic field, which is shown in FIG. 12.

As shown in FIG. 12, when the transfer speed of the substrate is fast and the thickness of the thin film is thin, magnetization and coercive force are weak.

On the other hand, when the thickness of the thin film was slow at 1000 puls, the coercive force was high, but the magnetization was lower than that of the magnetic thin film using 1500 puls, which was relatively thin.

Substrate speed/puls Nd thickness (x-ray) /nm Fe thickness (x-ray)/ nm 1000 23.0 14.6 1500 18.4 9.9 2000 10.89 6.5

(Experimental Example 2)

In Comparative Example 1, after forming a polyimide thin film on a substrate, only one block was manufactured in the same manner as in Experimental Example 1 with the transfer speed of the substrate set to 2000 pulses.

On the other hand, in Example 1, after forming a polyimide thin film as a protective layer on the first substrate, the first block was manufactured by depositing a magnetic thin film in the same manner as in Experimental Example 1 with the transfer speed of the substrate set to 2000 pulses. Then, like the first block, the laminate 300 as shown in FIG. 11 (a) was used using the method described in FIG. 11, and after first removing the lowermost polyimide film 111, FIG. As in (b), a silicone pressure sensitive adhesive layer was attached on the glass substrate 200. Subsequently, as shown in FIG. 11(c), the uppermost polyimide film 111 was removed, and a magnetic thin film was alternately deposited on the silicon pressure-sensitive adhesive layer 112 like the first block to form a second block 2. was formed. Thereafter, the polyimide film 111 was removed from the glass substrate 200 so that only the silicon pressure-sensitive adhesive layer 112 remained on the second block 2 . Subsequently, as shown in FIG. 11(d), after applying and bonding a polyethylene solution between the first block and the second block, the layer formed of the polymer solution is thinned and dried using a rotary plate to form a layer between the first block, the second block, and the second block. A permanent magnet including an interblock polymer layer was manufactured.

With respect to Comparative Example 1 and Example 1 described above, the magnetic properties of the magnetic thin film with respect to the block were measured and shown in FIG. 13 .

As shown in FIG. 13 , it was confirmed that the magnetization and coercive force of Example 1 increased by about 2 times or more compared to Comparative Example 1.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and variations are possible without departing from the technical spirit of the present invention described in the claims. It will be obvious to those skilled in the art.

1: first substrate
2: second substrate
3: additional substrate
11: hard magnetic thin film
12: soft magnetic thin film
21: first block
22: second block
23, 24: additional blocks
31, 32: interblock polymer layer
100: outer polymer layer
101: protective layer
102, 103: additional protective layer
41: surface with polymer solution applied
42: the outermost thin film facing the substrate of the second block
51: surface of additional interblock polymer layer
52: the outermost thin film facing the substrate of the third block
60: rotary plate
61: polymer solution
62: first substrate on which the first block is stacked
63: a layer made of a polymer solution for forming an interblock polymer layer
64: interblock polymer layer
111: polyimide film
112: silicone pressure sensitive adhesive layer
200: glass substrate
300: laminate

Claims (16)

A first block in which hard magnetic thin films and soft magnetic thin films are alternately stacked;
a second block disposed on the first block and in which hard magnetic thin films and soft magnetic thin films are alternately stacked; and
A permanent magnet comprising an inter-block polymer layer provided between the first block and the second block.
The method of claim 1,
Further comprising an external polymer layer provided on a side surface, an upper surface, or both of the laminate including the interblock polymer layer, the first block and the second block, the permanent magnet.
The method of claim 1,
The permanent magnet may include at least one additional block disposed on the second block, in which hard magnetic thin films and soft magnetic thin films are alternately stacked; and
Further comprising an inter-block polymer layer provided between the second block and the additional block and between the additional blocks when the number of additional blocks is two or more, respectively.
The method of claim 1,
The thickness of the interblock polymer layer is each independently 0.01㎛ or more and 0.1㎛ or less, permanent magnet.
The method of claim 1,
The polymer included in the interblock polymer layer is a hydrocarbon-based polymer, a permanent magnet.
The method of claim 1,
Hard magnetic thin films and soft magnetic thin films alternately laminated in each block are alternately laminated by repeating 5 to 1,000 times.
The method of claim 1,
The permanent magnet is disposed so that one side of the interblock polymer layer is adjacent to the hard magnetic thin film and the other side is adjacent to the soft magnetic thin film.
forming a first block by alternately stacking hard magnetic thin films and soft magnetic thin films on a first substrate;
forming a second block by alternately stacking hard magnetic thin films and soft magnetic thin films on a second substrate; and
bonding the first block and the second block by forming an inter-block polymer layer between the outermost thin film of the first block facing the first substrate and the outermost thin film of the second block facing the second substrate; Method of manufacturing a permanent magnet, including;
The method of claim 8,
Joining the first block and the second block,
A polymer solution is applied on the outermost thin film facing the substrate of any one of the first block and the second block, and the outermost thin film facing the substrate of the other block is applied to the surface where the polymer solution is applied. contacting; and
A method of manufacturing a permanent magnet comprising the step of drying the polymer solution.
The method of claim 8,
At least one of the first substrate and the second substrate is a method of manufacturing a permanent magnet in which a protective layer is formed on a surface of the substrate.
The method of claim 9,
Wherein the step of bonding the first block and the second block by forming the inter-block polymer layer is performed by including the step of thinning the applied polymer solution.
The method of claim 11,
In the step of bonding the first block and the second block by forming the inter-block polymer layer, the first substrate on which the first block is stacked or the second substrate on which the second block is stacked is disposed on the rotation plate so that the substrate faces the rotation plate. doing;
applying a polymer solution on the thin film; and
A method for producing a permanent magnet, which is performed by rotating the rotating plate to thin the applied polymer solution.
The method of claim 8,
After forming the second block or bonding the first block and the second block,
The method of manufacturing a permanent magnet further comprising a substrate removal step of removing any one of the first substrate and the second substrate.
The method of claim 13,
After the substrate removal step,
forming an additional block by alternately stacking a hard magnetic thin film and a soft magnetic thin film on an additional substrate; and
An additional interblock polymer layer is formed between the outermost thin film on the side from which the substrate is removed and the outermost thin film facing the substrate of the additional block, thereby forming a laminate including the first block and the second block and the additional block. A method of manufacturing a permanent magnet comprising the step of bonding.
The method of claim 13,
Further comprising forming an outer polymer layer during formation of the interblock polymer layer or separately performing the step of forming the outer polymer layer after formation of the interblock polymer layer.
The method of claim 10,
The protective layer is a photocurable polymer layer or a polyimide layer, a method of manufacturing a permanent magnet.

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