KR20230044930A - Film for protective film formation, sheet for protective film formation, composite sheet for protective film formation, rework method and device manufacturing method - Google Patents

Abstract

Provided are a protective film-forming film that exhibits good reworkability even when the protective film-forming film that has been scratched after application is reworked, a protective film-forming sheet and a protective film-forming composite sheet including the same, a rework method, and a method of manufacturing of a device such as a semiconductor device, etc. In the protective film-forming film for forming a protective film, the elongation rate when the protective film-forming film breaks in the right-angle tear test is 200% or less at 23℃, and the adhesion to the silicon wafer after one hour of applying the protective film on the #2000 polished surface of the silicon wafer is 20 N/25 mm or less at 23℃.

Description

Protective film forming film, sheet for forming a protective film, composite sheet for forming a protective film, rework method and method for manufacturing a device

The present invention relates to a film for forming a protective film, a sheet for forming a protective film, a composite sheet for forming a protective film, a rework method, and a method for manufacturing an apparatus. In particular, a protective film-forming film preferably used to protect a workpiece such as a semiconductor wafer or a workpiece such as a semiconductor chip obtained by processing the workpiece, a sheet for forming a protective film and a composite sheet for forming a protective film having the protective film-forming film, and It relates to a rework method and a method of manufacturing a device including a semiconductor chip and the like.

In recent years, manufacturing of semiconductor devices has been performed by a mounting method called flip chip bonding. In this mounting method, when mounting a semiconductor chip having a circuit surface on which convex electrodes such as bumps are formed, the semiconductor chip is inverted (face down) so that the circuit surface of the semiconductor chip and the chip mounting surface of the substrate face each other. The circuit surface of the circuit board and the chip mounting surface of the board are bonded wirelessly. Therefore, the surface opposite to the circuit surface of the semiconductor chip (a surface on which circuits are not formed. Hereafter referred to as a back surface) is exposed to the outside.

If the back surface of the semiconductor chip is exposed to the outside, there is a risk that chipping, such as cracks or fractures, caused by impact during conveyance or the like may occur in subsequent steps. Therefore, in order to protect the semiconductor chip from chipping, a hard resin film composed of an organic material is often formed as a protective film on the back surface of the semiconductor chip.

Such a protective film is formed by curing an uncured resin film (hereinafter also referred to as a protective film forming film) as the precursor. The protective film forming film is attached to the back surface of the semiconductor wafer, and before or after curing of the protective film forming film, the semiconductor wafer and the protective film forming film or protective film are diced and divided into a plurality of small pieces (individualized). The divided small piece is a semiconductor chip having a protective film on its back surface (semiconductor chip with a protective film).

However, in the step of attaching the protective film forming film to the semiconductor wafer, when the protective film forming film is affixed out of position from the position to be attached, the protective film forming film, such as when wrinkles are generated in the attached protective film forming film, is properly applied to the semiconductor wafer There are cases where it is not attached.

When the protective film formation film is not properly affixed on the semiconductor wafer, there is a problem that the yield of chips with a protective film is lowered. Then, when the protective film forming film is not affixed appropriately, the said protective film forming film is peeled off from a semiconductor wafer, and returning a semiconductor wafer to the state before a protective film forming film is affixed is performed. This is called a rework. After that, sticking a protective film forming film different from the peeled protective film forming film onto the semiconductor wafer is performed.

As a protective film-forming film suitable for rework, Patent Literature 1 discloses a sheet for forming a protective film containing a predetermined acrylic polymer and having a breaking elongation at a thickness of 200 µm within a predetermined range.

Japanese Unexamined Patent Publication No. 2016-141749

However, the inventors of the present invention, when scratches occur on the pasted protective film forming film and a portion where the thickness of the protective film forming film is not uniform occurs, in order to perform rework, if this protective film forming film is peeled off from the semiconductor wafer, the protective film It was found that part of the formed film remained on the semiconductor wafer as a residue. When such a residue is generated, cleaning of the semiconductor wafer is required, resulting in an increase in the number of processes.

Further, the present inventors have found that such a residue is a residue caused by elongation and breakage of the protective film-forming film resulting from non-uniformity in thickness in the vicinity of the flaw of the protective film-forming film.

Conventionally, in rework based on misalignment of the protective film forming film, occurrence of wrinkles, etc., in order to peel off the protective film forming film having a uniform thickness, residue resulting from high adhesive force of the protective film forming film to the semiconductor wafer has been a problem. . That is, the cause of residue generation is different between the case where the protective film-forming film has flaws and the case where there are no flaws.

Therefore, the sheet for forming a protective film described in Patent Literature 1 had a problem that, when a scratched sheet for forming a protective film was reworked, good reworkability could not be exhibited and residue was generated.

The present invention has been made in view of such an actual situation, and even when reworking a protective film-forming film having scratches during or after sticking, a protective film-forming film with good reworkability, a sheet for forming a protective film comprising the same, and a protective film It aims at providing the manufacturing method of apparatuses, such as a composite sheet for formation, a rework method, and a semiconductor device.

An aspect of the present invention is as follows.

[1] As a protective film forming film for forming a protective film,

The elongation rate when the protective film-forming film breaks in the right angle tear test is 200% or less at 23°C,

It is a protective film formation film whose adhesive force to a silicon wafer 1 hour after affixing a protective film formation film to the #2000 polishing surface of a silicon wafer is 20 N/25 mm or less at 23 degreeC.

[2] The protective film-forming film is the protective film-forming film according to [1], which is thermosetting or energy ray-curable.

[3] A sheet for forming a protective film comprising the film for forming a protective film according to [1] or [2] and a release film disposed on at least one main surface of the film for forming a protective film so that peeling is possible.

[4] A composite sheet for forming a protective film comprising the film for forming a protective film according to [1] or [2] and a support sheet for supporting the film for forming a protective film.

[5] a step of attaching the protective film-forming film according to [1] or [2] to the back side of the work;

A step of inspecting the appearance of the attached protective film forming film;

In the step of inspecting the external appearance of the pasted protective film forming film, it is a rework method comprising a step of peeling off the scratched protective film forming film from the work when a flaw is found in the pasted protective film forming film.

[6] a step of attaching the protective film-forming film according to [1] or [2] to the back side of the work;

A step of inspecting the appearance of the attached protective film forming film;

In the step of inspecting the external appearance of the attached protective film forming film, in the case where a flaw is found in the attached protective film forming film, a step of peeling off the scratched protective film forming film from the work;

A step of attaching a protective film forming film according to [1] or [2] to the back surface of the work, which is different from the protective film forming film peeled off from the work;

A step of forming a protective film forming film into a protective film to obtain a workpiece with a protective film;

It is a manufacturing method of an apparatus which has the process of processing the workpiece|work with a protective film and obtaining the workpiece|workpiece with a protective film.

According to the present invention, even in the case of reworking the protective film-forming film in which scratches occur during or after sticking, a protective film-forming film having good reworkability, a sheet for forming a protective film and a composite sheet for forming a protective film comprising the same, and A rework method and a manufacturing method of devices such as semiconductor devices can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional schematic view showing an example of a workpiece to which a protective film-forming film according to the present embodiment is affixed.
Fig. 2A is a schematic perspective view showing that scratches are generated in the protective film-forming film adhered to the work.
Fig. 2B is a cross-sectional schematic view taken along the line IIB-IIB in Fig. 2A.
3A is a schematic plan view showing a state immediately after starting to peel off a protective film forming film from a work to which a protective film forming film according to a conventional example was stuck.
Fig. 3B is a cross-sectional schematic diagram taken along line IIIB-IIIB in Fig. 3A.
Fig. 3C is a view continuing from Fig. 3A.
Fig. 3d is a view continuing from Fig. 3b.
Fig. 3E is a diagram continuing from Fig. 3C.
Fig. 3f is a diagram continuing from Fig. 3d.
4A is a schematic plan view showing a state in which a peeling interface reaches a flawed portion by peeling a protective film forming film from a work to which the protective film forming film according to the present embodiment has been stuck.
Fig. 4B is a cross-sectional schematic view taken along the IVB-IVB line in Fig. 4A.
Fig. 5 is a schematic cross-sectional view showing an example of the sheet for forming a protective film according to the present embodiment.
Fig. 6 is a schematic cross-sectional view showing an example of the composite sheet for forming a protective film according to the present embodiment.
7A is a cross-sectional schematic diagram for explaining a step of attaching the sheet for forming a protective film according to the present embodiment to the back surface of a workpiece.
7B is a cross-sectional schematic view for explaining a step of attaching the composite sheet for forming a protective film according to the present embodiment to the back surface of a workpiece.
8 is a cross-sectional schematic diagram for explaining a step of obtaining chips with a protective film by dicing the work with a protective film.

Hereinafter, the present invention will be described in detail using drawings based on specific embodiments. First, the main terms used in this specification will be described.

The work is a plate-like body to which the protective film-forming film of the sheet for forming a protective film or the composite sheet for forming a protective film according to the present embodiment is applied and processed. As a work, a wafer and a panel are mentioned, for example. Specifically, a semiconductor wafer and a semiconductor panel are mentioned. Examples of the workpiece include chips obtained by dicing a wafer into pieces. Specifically, a semiconductor chip obtained by cutting a semiconductor wafer into pieces is exemplified.

The "surface" of a work such as a wafer refers to the surface on which convex electrodes such as circuits and bumps are formed, and the "rear surface" refers to the surface on which circuits and electrodes (eg, convex electrodes such as bumps) are not formed. points to A protective film is formed on the back surface of the wafer and chip.

Rework aims at sticking another protective film forming film on a work again, and means peeling off the protective film forming film stuck on the work. The good reworkability of the protective film-forming film refers to a property that can be peeled off without leaving the protective film-forming film on the workpiece when peeling off the protective film-forming film.

Segmentation of a wafer refers to obtaining chips by dividing a wafer for each circuit.

In this specification, for example, the notation "(meth)acrylate" is used as a term indicating both "acrylate" and "methacrylate", and the same applies to other similar notations.

"Energy rays" refer to ultraviolet rays, electron beams, and the like, and are preferably ultraviolet rays.

A peeling film is a film which supports an adhesive layer or a protective film formation film so that peeling is possible. The film is used as a concept including a sheet without limiting the thickness.

The mass ratio in the description of the composition, such as the composition for forming a protective film, is based on the active ingredient (solid content), and the solvent is not included unless otherwise specified.

(1. Protective film forming film)

The protective film-forming film according to the present embodiment forms a protective film for protecting a work or a workpiece of the work by attaching the film to a work and forming a protective film.

"To form a protective film" means to make the protective film-forming film into a state having characteristics sufficient to protect the work or the workpiece of the work. Specifically, when the protective film-forming film according to the present embodiment is curable, "to form a protective film" means to use an uncured protective film-forming film as a cured product. In other words, the protective film forming film formed into a protective film is a cured product of the protective film forming film, and is different from the protective film forming film.

After the work is superimposed on the curable protective film-forming film, the protective film can be firmly adhered to the work by curing the protective film-forming film, thereby forming a durable protective film.

On the other hand, when the protective film-forming film according to the present embodiment does not contain a curable component and is used in an uncured state, the protective film-forming film according to the present embodiment is formed into a protective film at the time when the protective film-forming film according to the present embodiment is attached to the work. do. In other words, the protective film forming film formed into a protective film is the same as the protective film forming film.

When high protective performance is not required, since there is no need to cure the protective film forming film, use of the protective film forming film is easy.

Moreover, it is preferable that the protective film formation film has adhesiveness at normal temperature (23 degreeC), or exhibits adhesiveness by heating. Thereby, when overlapping a workpiece on the protective film formation film, both can be bonded together. Therefore, positioning can be reliably performed before curing the protective film forming film.

The protective film-forming film may be composed of one layer (single layer) or may be composed of a plurality of layers of two or more layers. When the protective film-forming film has multiple layers, these multiple layers may be the same as or different from each other, and the combination of the layers constituting these multiple layers is not particularly limited.

In this embodiment, it is preferable that the protective film forming film is one layer (single layer). The one-layer protective film-forming film is easy to produce because high accuracy in terms of thickness can be obtained. In addition, when the protective film forming film is composed of a plurality of layers, it is necessary to consider the adhesion between the layers and the elasticity of each layer, and there is a risk of peeling from the adherend due to these. When the protective film-forming film is one layer, the risk described above can be reduced, and the degree of freedom in design is also increased. In addition, in a process in which a temperature change occurs (at the time of reflow treatment or use of the device), the risk of occurrence of separation between layers due to the difference in thermal elasticity between the layers can also be reduced.

The thickness of the protective film-forming film is not particularly limited, but is preferably 100 μm or less, 70 μm or less, 45 μm or less, or 30 μm or less. Moreover, the thickness of the protective film formation film is preferably 5 μm or more, 10 μm or more, or 15 μm or more. When the thickness of the protective film-forming film is in the above range, the protective performance of the protective film obtained becomes good.

In addition, the thickness of a protective film formation film means the thickness of the whole protective film formation film. For example, the thickness of a protective film forming film composed of multiple layers means the total thickness of all layers constituting the protective film forming film.

The protective film-forming film according to the present embodiment is applied to protect the back surface of the workpiece. 1 shows a work in which a protective film forming film is affixed to the back surface. A protective film formation film 10 is attached to the back side of the workpiece (lower side in FIG. 1 ), and a convex electrode 6b is formed on the front side of the work 6 (upper side in FIG. 1 ). A circuit is formed on the surface side of the work 6, and the convex electrode 6b is formed so as to be electrically connected to the circuit.

When the protective film-forming film is attached to the work, in order to protect the main surface of the protective film-forming film in the form of a sheet for forming a protective film or a composite sheet for forming a protective film, which will be described later, the release film disposed on the main surface is peeled off, One main surface of the film for forming a protective film is affixed to the back surface of the workpiece.

In addition, after sticking, especially in the sheet for forming a protective film, the main surface on the opposite side to the main surface in contact with the back surface of the workpiece is exposed to the outside in many cases.

The work to which the protective film forming film was affixed is subjected to visual inspection. In this appearance inspection, it is inspected whether or not defects in appearance have occurred in the protective film-forming film. Specifically, it is inspected whether or not misalignment of the pasted protective film forming film, generation of wrinkles, or the like has not occurred. If appearance defects have occurred, the protective film-forming film is reworked.

By the way, when a protective film formation film is curable, compared with a protective film formation film, it is soft.

Therefore, when attaching the protective film forming film, pressing with a laminate roll or the like with a hard incendiary material attached thereto, or immediately after attaching, if the sticking device or the like and the protective film forming film come into contact, the protective film forming film is damaged (e.g. For example, dents) are likely to occur.

In addition, the protective film formation film affixed to the work may be transferred to another process before forming into a protective film (for example, curing), or conveyed from one process to another process. Therefore, similarly, when the protective film forming film contacts a device used in another process, a conveying device, etc., the protective film forming film is likely to be scratched.

If the protective film-forming film having such scratches is converted into a protective film, the scratches are transferred to the protective film as they are, leading to poor appearance of the protective film. As a result, the yield of workpieces with a protective film (for example, chips with a protective film) decreases.

Therefore, even when the protective film forming film is scratched, it is necessary to judge the protective film forming film as a defective appearance in the external appearance inspection of the work to which the protective film forming film is affixed.

As a result, when the protective film forming film is scratched, the scratched protective film forming film is peeled off from the work, and another protective film forming film without scratches is attached to the work. That is, the scratched protective film forming film is reworked. This makes it difficult for the appearance defect of the protective film to occur, and a decrease in chip yield can be suppressed.

Therefore, even if the protective film forming film is scratched, it is required to have good reworkability.

However, in the case of peeling off the conventional protective film-forming film having scratches from the workpiece, the peculiar problem shown below arises.

FIG. 2A is a schematic perspective view ( FIG. 2A ) showing that a scratch portion 12 is generated in a conventional protective film-forming film 100 attached to a work 6 . Fig. 2B is a cross-sectional schematic diagram along the line IIB-IIB in Fig. 2A (Fig. 2B).

As shown in FIG. 2B , the flaw 12 shown in FIG. 2A is a flaw formed by denting or scraping the surface of the protective film forming film 100, and is a flaw that does not penetrate the protective film forming film 100. . Therefore, the thickness T ₁ of the protective film-forming film 100 at the point where the flaws are formed is smaller than the thickness T 100 of the protective film-forming film 100 at the point where the flaws are not formed.

When the protective film-forming film 100 shown in FIGS. 2A and B is peeled off (reworked), for example, by sticking a peeling tape on the protective film-forming film 100 and pulling the peeling tape in a predetermined direction , The protective film formation film 100 is pulled off from the work 6.

3A is a planar schematic diagram showing a state immediately after starting to peel off the protective film forming film 100 from the work 6 to which the protective film forming film 100 and the peeling tape 30 were attached. Fig. 3B is a cross-sectional schematic diagram taken along line IIIB-IIIB in Fig. 3A.

3A and B, the protective film-forming film 100 is pulled off in a predetermined direction (from left to right in FIGS. 3A and B). When the peeling interface of the protective film forming film 100 almost reaches the flawed portion 12, the thickness of the flawed portion 12 is smaller than the thickness at the point where the flawed portion does not occur, so that the protective film forming film resists peeling off. Stress generated inside 100 is concentrated in the vicinity of the flaw 12 .

As the peeling further proceeds, the vicinity of the flawed portion 12 starts to expand due to the concentrated stress, as shown in FIGS. 3C and 3D . On the other hand, in the protective film-forming film 100, the other points where the flaws 12 are not formed have a uniform thickness, and since stress is applied to all other points by peeling, the other points are less likely to elongate. It is pulled off from the work 6 before starting, and the peeling proceeds easily. As a result, although peeling from the work 6 proceeds at points other than the flawed portion 12, the vicinity of the flawed portion 12 continues to elongate without being pulled away from the work 6.

When the elongation in the vicinity of the flaw 12 reaches the limit, the vicinity of the flaw 12 is broken. And as shown to FIG. 3E and f, the vicinity of the flaw part 12 is peeled off from the peeling protective film formation film 100, and remains as the residue 14 on the workpiece. After the scratch portion 12 vicinity is peeled off, about the protective film forming film 100, since the scratch portion 12 vicinity, which is a portion having a different thickness, is peeled off, the overall thickness of the protective film forming film 100 become uniform Therefore, elongation of the protective film-forming film 100 is less likely to occur, and peeling proceeds favorably.

In the present embodiment, the size of the flaw is, for example, 5 mm or more in length, 10 µm or more in depth, and T ₁ obtained by subtracting the depth t of the flaw from the thickness T of the protective film-forming film is 5. more than μm. That is, T ₁ = T - t ≥ 5 µm. If such flaws are formed on the protective film-forming film, residues at the time of peeling as described above are likely to be generated.

From the above, in the case of reworking the protective film forming film in which the flaws were formed, if the protective film forming film is peeled off, the residue of the protective film forming film will be generated on the workpiece after rework. In the case of attaching the protective film formation film to the work again, since it is necessary to remove the residue, there is a problem that an extra step is increased.

In contrast, since the protective film-forming film according to the present embodiment has the physical properties described below, even when the protective film-forming film with flaws is reworked, residue is less likely to be generated during rework, and damage to the work is less likely to occur. are suppressed

(1.1. Elongation at break in right angle tear test)

In this embodiment, in the right angle tear test at 23°C, the elongation rate when the protective film-forming film is broken is 200% or less. Elongation at break is measured according to JIS K 7128-3:1998. That is, the elongation at break of the protective film-forming film is measured in the same way as the measuring method (rectangular tearing method) specified in JIS K 7128-3:1998, but the measuring conditions may be different.

A specific measurement method is described in Examples. The test piece has a shape shown in Fig. 2 of JIS K 7128-3:1998, and the central portion of the test piece has a hollow shape forming an angle of 90°. A right angle tear test is performed by pulling both ends of a test piece.

Therefore, the perpendicular tear test is similar to the manner in which stress is applied to the vicinity of the flawed portion when peeling off the protective film forming film on which the flawed portion is formed. That is, when peeling off the protective film formation film in which the damage|wound part was formed, the elongation of the protective film formation film leading to fracture|rupture can be made small by the elongation rate being in the above-mentioned range. In other words, since the normal tensile test is not similar to the way stress is applied near the flaw, the elongation at break in the normal tensile test is directly related to the elongation at break in the right angle tear test described above. not related to

3A and 3B, when the peeling interface of the protective film-forming film 10 almost reaches the flawed portion 12, stress is concentrated in the vicinity of the flawed portion 12. However, in the protective film-forming film 10 according to the present embodiment, even if the protective film-forming film 10 in the vicinity of the flawed portion 12 starts to elongate, before the elongation increases, destruction starting from the vicinity of the flawed portion 12 begins. reaches the main surface on the opposite side of the protective film forming film 10, and the protective film forming film 10 in the vicinity of the flaw 12 is broken. As shown in FIGS. 4A and B, the thickness around the fracture point is almost the same as that of other points, and there is no point where stress is concentrated. Moreover, the ruptured part was not separated from the protective film forming film 10 as a part of the protective film forming film 10. As a result, no residue is generated, and peeling of the protective film-forming film 10 proceeds favorably. In other words, even when rework of the protective film forming film 10 is required due to formation of the flaws 12, the reworkability of the protective film forming film 10 is good.

The elongation at break is preferably 150% or less, more preferably 120% or less, still more preferably 90% or less. The elongation rate at break is so preferable that it is lower, but the lower limit of the elongation rate at break is, for example, 10%.

(1.2 Adhesion to Silicon Wafer)

In this embodiment, at 23 ° C., the adhesive force to the silicon wafer (hereinafter also referred to as the adhesive force to the silicon wafer) 1 hour after the protective film forming film is attached to the # 2000 polished surface of the silicon wafer is 20 N / 25 mm below The #2000 polished surface is a surface having a surface roughness equal to that of the surface polished with the #2000 abrasive. This surface roughness corresponds to the surface roughness of the back surface of a silicon wafer used to manufacture semiconductor chips and the like. Moreover, after attaching a protective film formation film to a wafer, the external appearance of a wafer is inspected, and when a flaw is formed in the protective film formation film, the protective film formation film is reworked. Therefore, the protective film forming film according to the present embodiment can be controlled in accordance with the specific object to be attached by controlling the adhesive force not immediately after the attachment of the protective film-forming film but one hour after the attachment.

From the above, when the adhesive force to the silicon wafer is within the above range, when the protective film forming film is peeled off from the work (eg wafer), residue is less likely to be generated, and also to the work (eg wafer) The applied load is reduced, and damage to the workpiece can be reduced.

The adhesive force to the silicon wafer is preferably 14 N/25 mm or less, more preferably 9 N/25 mm or less, and still more preferably 4 N/25 mm or less. The adhesive force to the silicon wafer is preferably as low as possible from the standpoint of reworkability, but from the viewpoint of unintentional peeling in each step after sticking, 0.2 N/25 mm or more is preferable, and 0.5 N/25 mm or more is preferable. more preferable

A method for measuring the adhesive force to a silicon wafer will be described in Examples.

(1.3 Composition for protective film forming film)

As long as the protective film has the above physical properties, the composition of the protective film forming film is not particularly limited. In this embodiment, it is preferable that the composition (composition for protective film formation film) which comprises a protective film formation film is a resin composition containing at least a polymer component (A), a curable component (B), and a filler (E). A polymer component is a component that can be considered to have been formed by a polymerization reaction of a polymerizable compound. In addition, the curable component is a component that can undergo a curing (polymerization) reaction. In addition, a polycondensation reaction is also included in the polymerization reaction in this invention.

Moreover, the component contained in a polymer component also corresponds to a curable component in some cases. In this embodiment, when the composition for protective film formation films contains components applicable to both such a polymer component and a curable component, it is considered that the composition for protective film formation films contains both a polymer component and a curable component.

(1.3.1 Polymer component)

The polymer component (A) imparts an appropriate tack to the protective film-forming film while imparting film-formability (film-formability) to ensure uniform adhesion of the protective film-forming film to the workpiece. The weight average molecular weight of the polymer component is usually in the range of 50,000 to 2,000,000, preferably 100,000 to 1,500,000, and particularly preferably 200,000 to 1,000,000. As such a polymer component, for example, an acrylic resin, a urethane resin, a phenoxy resin, a silicone resin, a saturated polyester resin, etc. are used, and an acrylic resin is particularly preferably used.

In addition, in this specification, "weight average molecular weight" is a polystyrene conversion value measured by the gel permeation chromatography (GPC) method unless there is particular notice. Measurement by such a method is, for example, a high-speed GPC device manufactured by Tosoh Corporation "HLC-8120GPC", a high-speed column "TSK guard column H _XL -H", "TSK Gel GMH _XL ", "TSK Gel G2000H _{XL" ”} (above, all manufactured by Tosoh Corporation) were connected in this order, and the detector was a differential refractometer under conditions of a column temperature of 40° C. and a feed rate of 1.0 ml/min.

As an acrylic resin, the (meth)acrylic acid ester copolymer which consists of structural units derived from a (meth)acrylic acid ester monomer and a (meth)acrylic acid derivative is mentioned, for example. Here, the (meth)acrylic acid ester monomer is preferably a (meth)acrylic acid alkyl ester having 1 to 18 carbon atoms in the alkyl group, specifically, methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylate. ) propyl acrylate, butyl (meth)acrylate, and the like. Moreover, as a (meth)acrylic acid derivative, (meth)acrylic acid, glycidyl (meth)acrylate, hydroxyethyl (meth)acrylate etc. are mentioned, for example.

In this embodiment, in order to control the adhesiveness to the workpiece and adhesive physical properties, it is preferable to introduce a hydroxyl group into the acrylic resin using hydroxyethyl acrylate or the like.

The glass transition temperature of the acrylic resin is preferably -70°C to 40°C, -60°C to 30°C, -50°C to 20°C, -40°C to 15°C, or -30°C to 10°C. By setting the glass transition temperature of the acrylic resin within the above-mentioned range, it becomes easier to appropriately increase the tack of the protective film-forming film and to make the elongation at break in the above-mentioned right angle tearing test within the above-mentioned range, and the protective film-forming film When the adhesive force of the protective film with the workpiece is set within an appropriate range, the adhesive force of the protective film with the workpiece is moderately improved.

When an acrylic resin has m type (m is an integer of 2 or more) structural unit, the glass transition temperature of the said acrylic resin is computable as follows. That is, for m types of monomers leading to structural units in the acrylic resin, each non-overlapping number from 1 to m is sequentially assigned and named as "monomer m", the glass transition temperature of the acrylic resin ( Tg) can be calculated using Fox's formula shown below.

(Wherein, Tg is the glass transition temperature of the acrylic resin; m is an integer greater than or equal to 2; Tg _k is the glass transition temperature of the homopolymer of the monomer m; W _k is the composition derived from the monomer m in the acrylic resin; It is the mass fraction of unit m, provided that W _k satisfies the following formula.)

(In the formula, m and W _k are as described above.)

As Tg _k , a value described in Polymer Data Handbook, Adhesion Handbook, or Polymer Handbook can be used. For example, the Tg _k of the homopolymer of methyl acrylate is 10 ° C, the Tg _k of the homopolymer of n-butyl acrylate is -54 ° C, the Tg _k of the homopolymer of methyl methacrylate is 105 ° C, 2-hydroxy Tg _k of homopolymer of oxyethyl acrylate is -15 ℃, Tg _k of homopolymer of glycidyl methacrylate is 41 ℃, Tg _k of homopolymer of 2-ethylhexyl acrylate is -70 ℃, ethyl acryl The Tg _k of the homopolymer of rate is -24°C, and the Tg _k of the homopolymer of 4-hydroxybutyl acrylate is -32°C.

The content of the polymer component when the total weight of the composition for forming a protective film is 100 parts by mass is preferably 1 to 70 parts by mass, 5 to 60 parts by mass, 10 to 50 parts by mass, and 13 to 40 parts by mass. By setting the content of the polymer component within the above range, it becomes easier to make the elongation at break in the right angle tear test within the above range. Moreover, control of the adhesiveness of a protective film formation film becomes easier.

(1.3.2 Thermosetting Components)

The curable component (B) cures the protective film-forming film to form a protective film as a cured product. As described above, as the curable component, a heat curable component, an energy ray curable component, or a mixture thereof can be used.

Since the film for forming a protective film according to the present embodiment contains a filler, a colorant, and the like described later, the light transmittance decreases. Since the energy ray-curable protective film-forming film is cured by energy ray irradiation, for example, when the protective film-forming film is thick, curing by energy ray tends to be insufficient.

On the other hand, even if the thickness of the thermosetting protective film formation film is increased, since it is sufficiently cured by heating, a protective film with high protective performance can be formed. In addition, by using a normal heating means such as a heating oven, a large number of protective film forming films can be collectively heated and thermally cured.

Therefore, it is preferable that the protective film formation film which concerns on this embodiment is thermosetting.

Whether or not the protective film-forming film is thermosetting can be judged as follows. First, a protective film forming film at normal temperature (23°C) is heated to a temperature exceeding normal temperature, and then cooled to normal temperature to obtain a protective film forming film after heating and cooling. Next, when the hardness of the protective film formation film after heating and cooling is compared with the hardness of the protective film formation film before heating at the same temperature, if the protective film formation film after heating and cooling is harder, this protective film formation film is said to be thermosetting. judge

As the thermosetting component, for example, epoxy resins, thermosetting polyimide resins, unsaturated polyester resins, and mixtures thereof are preferably used. In addition, a thermosetting polyimide resin is a general term for a low-molecular-weight, low-viscosity monomer or precursor polymer that forms a polyimide resin by thermally curing. Non-limiting specific examples of thermosetting polyimide resins are described, for example, in the Journal of Textile Society "Fiber and Industry", Vol.50, No.3 (1994), P106-P118.

An epoxy resin as a thermosetting component has a property of forming a three-dimensional network when heated to form a strong film. As such an epoxy resin, well-known various epoxy resins are used. In this embodiment, the molecular weight (diet) of the epoxy resin is preferably 300 or more and less than 50000, 300 or more and less than 10000, 300 or more and less than 5000, and 300 or more and less than 3000. Further, the epoxy equivalent of the epoxy resin is preferably from 50 to 5000 g/eq, more preferably from 100 to 2000 g/eq, still more preferably from 150 to 1000 g/eq.

As such an epoxy resin, specifically, glycidyl ether of phenols, such as bisphenol A, bisphenol F, resorcinol, a phenyl novolac, and a cresol novolak; glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidyl-type or alkyl glycidyl-type epoxy resins in which active hydrogen bonded to a nitrogen atom, such as aniline isocyanurate, is substituted with a glycidyl group; Vinylcyclohexanediepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy ) such as cyclohexane-m-dioxane and the like, so-called alicyclic epoxides in which epoxy is introduced by, for example, oxidizing carbon-carbon double bonds in the molecule. In addition, an epoxy resin having a biphenyl skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton, or the like can also be used.

As the curable component (B), when a thermosetting component is used, it is preferable to use a curing agent (C) in combination as an auxiliary agent. As the curing agent for the epoxy resin, a thermally active type latent epoxy resin curing agent is preferable. A “heat-activated latent epoxy resin curing agent” is a type of curing agent that does not react well with an epoxy resin at room temperature (23° C.), but is activated by heating above a certain temperature and reacts with the epoxy resin. Examples of the activation method of the heat-activated latent epoxy resin curing agent include a method of generating active species (anions and cations) by a chemical reaction by heating; a method in which a curing reaction is initiated by being stably dispersed in an epoxy resin at around normal temperature, and being compatible/dissolved with the epoxy resin at a high temperature; a method of initiating a curing reaction by eluting at a high temperature with a molecular sieve-enclosed curing agent; Methods using microcapsules and the like exist.

Among the exemplified methods, a method in which it is stably dispersed in the epoxy resin at around normal temperature, and is compatible/dissolved with the epoxy resin at a high temperature and initiates a curing reaction is preferable.

Specific examples of the heat-activated latent epoxy resin curing agent include various onium salts, dibasic acid dihydrazide compounds, dicyandiamide, amine adduct curing agents, and high melting point active hydrogen compounds such as imidazole compounds. there is. These heat-activated latent epoxy resin curing agents can be used individually by 1 type or in combination of 2 or more types. In this embodiment, dicyandiamide is particularly preferred.

Moreover, as a hardening|curing agent for an epoxy resin, a phenol resin is also preferable. As the phenolic resin, condensates of phenols such as alkylphenols, polyhydric phenols, and naphthols and aldehydes are used without particular limitation. Specifically, phenol novolak resin, o-cresol novolac resin, p-cresol novolak resin, t-butylphenol novolac resin, dicyclopentadienecresol resin, polyparavinylphenol resin, bisphenol A novolak resin , or modified products thereof, etc. are used.

The phenolic hydroxyl groups contained in these phenol resins easily undergo an addition reaction with the epoxy groups of the epoxy resins by heating to form a cured product having high impact resistance.

The content of the curing agent (C) is preferably 0.2 to 100 parts by mass, 0.5 to 50 parts by mass, 1 to 20 parts by mass, and 1.5 to 10 parts by mass with respect to 100 parts by mass of the epoxy resin. By setting the content of the curing agent (C) within the above range, the network structure of the protective film becomes dense, so that the performance of protecting the work as a protective film is easily obtained, and the elongation at break in the right angle tear test is as described above. It becomes easier to make it within a range.

In the case of using dicyandiamide as the curing agent (C), it is preferable to further use the curing accelerator (D) in combination. Examples of the curing accelerator include 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, Imidazoles (imidazoles in which one or more hydrogen atoms are substituted with groups other than hydrogen atoms) such as 2-phenyl-4-methyl-5-hydroxymethylimidazole are preferred. Among these, 2-phenyl-4,5-dihydroxymethylimidazole is particularly preferable.

The content of the curing accelerator is preferably 0.1 to 10 parts by mass, 0.3 to 5 parts by mass, 0.5 to 4 parts by mass, or 1 to 3 parts by mass with respect to 100 parts by mass of the epoxy resin. By setting the content of the curing accelerator (D) within the above range, the network structure of the protective film becomes dense, so that the performance of protecting the workpiece as the protective film is easily obtained, and the elongation rate at break in the right angle tear test is as described above. It becomes easier to make it within a range.

The total content of the thermosetting component and the curing agent when the total weight of the composition for forming a protective film is 100 parts by mass is preferably 3 to 80 parts by mass, 5 to 60 parts by mass, 7 to 50 parts by mass, and 9 to 40 parts by mass. , 10 to 30 parts by mass. By making the total content of the thermosetting component and the curing agent equal to or more than the lower limit described above, an appropriate tack is exhibited before curing, and the sticking operation can be stably performed. Moreover, after hardening, the performance which protects a workpiece|work as a protective film is easy to be obtained. By adjusting the degree of curing by setting the total content of the thermosetting component and the curing agent within the above range, it becomes easier to make the elongation at break in the right angle tear test within the above range.

(1.3.3 Energy ray curable component)

When the curable component (B) is an energy ray-curable component, the energy ray-curable component is preferably uncured, preferably has adhesive properties, and more preferably has uncured yet adhesive properties.

The energy ray-curable component is a component that is cured by irradiation with energy rays, and is also a component for imparting film-formability, flexibility, and the like to the protective film-forming film.

As the energy ray-curable component, for example, a compound having an energy ray-curable group is preferable. As such a compound, a well-known thing is mentioned.

(1.3.4 Filling)

When the protective film-forming film contains the filler (E), the thermal expansion coefficient of the protective film obtained by converting the protective film-forming film into a protective film can be easily adjusted, and the thermal expansion coefficient is approximated to the thermal expansion coefficient of the workpiece, which is obtained using the protective film-forming film. The adhesion reliability of the chip with a protective film is further improved. In addition, when the protective film-forming film contains the filler (E), a hard protective film is obtained, the moisture absorptivity of the protective film can be reduced, and the adhesion reliability of the tip with a protective film is further improved.

The filler (E) may be either an organic filler or an inorganic filler, but it is preferably an inorganic filler from the viewpoint of shape stability at high temperature.

As a preferable inorganic filler, For example, powders, such as silica, alumina, talc, calcium carbonate, bengala, silicon carbide, boron nitride; Beads which spheroidized these inorganic fillers; surface-modified products of these inorganic fillers; single crystal fibers of these inorganic fillers; Glass fiber etc. are mentioned. Among these, silica and surface-modified silica are preferred. The surface-modified silica is preferably surface-modified with a coupling agent, and more preferably surface-modified with a silane coupling agent.

The average particle diameter of the filler is preferably 0.05 to 10 μm, 0.07 to 3 μm, and 0.09 to 1 μm.

Moreover, in this embodiment, it is preferable to contain two or more types of fillers with different average particle diameters. When fillers having different average particle sizes are contained in the protective film-forming film, the fillers having a small average particle size are easily disposed in gaps between the fillers having a large average particle size. As a result, it becomes easier to make the elongation at break in the right angle tear test within the above range. Moreover, when two or more types of fillers with different average particle diameters are contained, the average particle diameter of the filler with the largest average particle diameter is preferably 1 μm or less, 0.7 μm or less, or 0.5 μm or less.

In particular, the average particle diameter of the filler having the largest average particle diameter is preferably 1.5 to 10 times the average particle diameter of the filler having the smallest average particle diameter.

In addition, in this specification, "average particle diameter" means the value of the particle diameter (D50) at 50% of the integrated value in the particle size distribution curve obtained by the laser diffraction scattering method unless otherwise specified.

The content of the filler when the total weight of the composition for forming a protective film is 100 parts by mass is preferably 10 to 80 parts by mass, 25 to 75 parts by mass, 40 to 70 parts by mass, and 56 to 70 parts by mass.

By setting the lower limit of the content of the filler to the above-mentioned value, the adhesion reliability of the chip with a protective film obtained using the protective film-forming film is further improved, and it is easier to make the elongation at break in the right angle tear test within the above-mentioned range. It happens. Moreover, by making the upper limit of content of a filler into the above-mentioned value, the adhesive force of a protective film formation film with a workpiece|work is improved, and the adhesive force of a protective film with a workpiece|work improves suitably.

(1.3.5 coupling agent)

It is preferable that the protective film formation film contains a coupling agent (F). By containing a coupling agent, after hardening of a protective film formation film, while being able to improve the adhesiveness of a protective film and a workpiece|work without impairing the heat resistance of a protective film, water resistance (heat-and-moisture resistance) can be improved. As the coupling agent, a silane coupling agent is preferable from the viewpoints of its versatility and cost advantages.

Examples of the silane coupling agent include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and γ -(Methacryloxypropyl)trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ- Aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, Bis (3-triethoxysilylpropyl) tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane, etc. are mentioned. As a preferable silane coupling agent, the oligomer type silane coupling agent which has several alkoxysilyl groups in 1 molecule is mentioned. The oligomeric silane coupling agent is preferable in that it is difficult to volatilize, has a plurality of alkoxysilyl groups in one molecule, and is effective in improving durability. Examples of the oligomeric silane coupling agent include "X-41-1053", "X-41-1059A", "X-41-1056" and "X-40-" which are epoxy group-containing oligomeric silane coupling agents. 2651” (all manufactured by Shin-Etsu Chemical Co., Ltd.); "X-41-1818", "X-41-1810" and "X-41-1805" (all manufactured by Shin-Etsu Chemical Co., Ltd.) which are mercapto group-containing oligomeric silane coupling agents. These can be used individually by 1 type or in mixture of 2 or more types.

The content of the coupling agent when the total weight of the composition for forming a protective film is 100 parts by mass is preferably 0.01 to 20 parts by mass, 0.1 to 10 parts by mass, 0.2 to 5 parts by mass, and 0.3 to 3 parts by mass.

(1.3.6 Colorants)

It is preferable that the protective film formation film contains a coloring agent (G). As a result, since the back side of the workpiece such as chip is concealed, various electromagnetic waves generated in the electronic device can be blocked, and malfunction of the workpiece such as chip can be reduced.

As the colorant (G), known ones such as organic pigments, organic dyes, and inorganic pigments can be used, for example. In this embodiment, an inorganic pigment is preferable.

As the inorganic pigment, for example, carbon black, cobalt pigment, iron pigment, chromium pigment, titanium pigment, vanadium pigment, zirconium pigment, molybdenum pigment, ruthenium pigment, platinum pigment, ITO (indium tin oxide)-based pigments, ATO (antimony tin oxide)-based pigments, and the like. Among these, it is especially preferable to use carbon black. Carbon black can block electromagnetic waves in a wide wavelength range.

The blending amount of the colorant (particularly carbon black) in the protective film-forming film varies depending on the thickness of the protective film-forming film. For example, when the thickness of the protective film-forming film is 25 µm, Content of the coloring agent at the time of setting it as 100 mass parts is Preferably they are 0.01-10 mass parts, 0.03-7 mass parts, and 0.05-4 mass parts.

The average particle diameter of the coloring agent (especially carbon black) is preferably 1 to 500 nm, 3 to 100 nm, and 5 to 50 nm. When the average particle diameter of the colorant is within the above range, it is easy to control the light transmittance within a desired range.

(1.3.7 Other additives)

The composition for a protective film forming film, within the range which does not impair the effect of this invention, as other additives, for example, a photoinitiator, a crosslinking agent, a plasticizer, an antistatic agent, antioxidant, a gettering agent, a tackifier, You may contain a release agent etc.

(2. Sheet for forming protective film)

The sheet for forming a protective film according to the present embodiment has the protective film forming film described above and a release film disposed on at least one main surface of the protective film forming film. A peeling film peels at the time of use of a protective film formation film.

In the sheet 50 for forming a protective film shown in FIG. 5 , the first peeling film 21 supporting the protective film forming film 10 is disposed on one main surface 10a of the protective film forming film 10, and the other side It has the structure in which the 2nd peeling film 22 was arrange|positioned on the main surface 10b of .

The sheet for forming a protective film according to the present embodiment is used to form a protective film on the work or a workpiece of the work by attaching the protective film forming film to the work when processing the work to form a protective film on the protective film forming film. .

Further, the sheet for forming a protective film may be in the form of a long sheet having an extremely long length in the longitudinal direction relative to the length in the width direction. Moreover, the form of the sheet|seat roll on which such a long sheet|seat was wound may be sufficient.

Further, the sheet for forming a protective film may be a sheet for forming a protective film in which a protective film forming film to be affixed to a workpiece is drawn out so as to have a predetermined closed shape. The predetermined closed shape is not particularly limited, but it is preferably substantially the same shape as the work to be affixed.

(2.1 release film)

A peeling film is a film which can support a protective film formation film so that peeling is possible.

The peeling film may be composed of a substrate of one layer (single layer) or two or more layers, and the surface of the substrate may be subjected to a peeling treatment from the viewpoint of controlling the peelability. That is, the surface of the substrate may be modified, or a material (release agent layer) not derived from the substrate may be formed on the surface of the substrate.

The base material is not particularly limited as long as it is a material capable of supporting the protective film forming film until the protective film forming film is attached to the work, and usually a film mainly composed of a resin-based material (hereinafter referred to as "resin film"). is called).

Specific examples of the resin film include a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer film, a polyethylene terephthalate film, a polyethylene naphthalate film, and a polybutyl film. Lenterephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polye A mid film, a fluororesin film, etc. are used. Moreover, these crosslinked films are also used. Moreover, these laminated|multilayer films may be sufficient. In this embodiment, a polyethylene terephthalate film is preferable from viewpoints of environmental safety, cost, and the like.

The resin film described above may contain various additives such as a colorant, a flame retardant, a plasticizer, an antistatic agent, a lubricant, and a filler.

The release agent layer is obtained by applying a coating agent containing the composition for a release agent layer to one surface of the substrate, and then drying and curing the coating film. The composition for the release agent layer is not particularly limited as long as it is a material capable of imparting releasability with the protective film forming film to the base material. In the present embodiment, the release agent layer composition is preferably an alkyd type release agent, a silicone type release agent, a fluorine type release agent, an unsaturated polyester type release agent, a polyolefin type release agent, or a wax type release agent, and among these, a silicone type release agent is preferable.

The thickness of the release film is not particularly limited, but is preferably 15 to 100 μm, more preferably 25 to 80 μm, and still more preferably 35 to 60 μm.

In addition, in the sheet for forming a protective film shown in FIG. 5, it is preferable to increase the peeling force of one release film to obtain a heavy release type release film and to decrease the peel force of the other release film to obtain a light release type release film.

(3. Composite sheet for forming protective film)

The composite sheet for forming a protective film according to the present embodiment has the protective film forming film described above and a support sheet supporting the protective film forming film. The configuration of the support sheet is not particularly limited as long as the adhesion and peelability can be controlled to the extent that a workpiece with a protective film can be obtained. For example, the support sheet may be made of only a substrate having a predetermined rigidity described later. In this embodiment, in order to make control of adhesiveness and peelability easier, it is preferable that a support sheet is an adhesive sheet which has a base material and an adhesive layer.

The composite sheet 60 for forming a protective film shown in FIG. 6 includes an adhesive sheet 4 in which an adhesive layer 42 is laminated on one surface of a substrate 41, and an adhesive layer 42 of the adhesive sheet 4 It has a structure provided with the protective film formation film 10 laminated|stacked on the side, and the adhesive layer 5 for jig laminated|stacked on the periphery of the protective film formation film 10. That is, the adhesive sheet 4 is a support sheet. In addition, the adhesive layer 5 for a jig is a layer for adhering the composite sheet 60 for forming a protective film to a jig such as a ring frame.

In the case of processing a work, the composite sheet for forming a protective film according to the present embodiment is attached to the work to maintain the work, and forms a protective film forming film to form a protective film on the work or a workpiece of the work. used to do

Specifically, while holding the wafer during the dicing process of the wafer as a workpiece, it is used to form a protective film on a chip as a workpiece obtained by dicing, but is not limited thereto.

(3.1. Adhesive Sheet)

The pressure-sensitive adhesive sheet 4 of the composite sheet for forming a protective film according to the present embodiment includes a base material 41 and a pressure-sensitive adhesive layer 42 laminated on one surface of the base material 41 .

(3.1.1. Description)

As long as the base material of the pressure-sensitive adhesive sheet is suitable for workpiece processing, for example, wafer dicing and expanding, the constituent material thereof is not particularly limited, and usually a film mainly composed of a resin-based material (hereinafter referred to as "resin film"). is called).

Specific examples of the resin film include polyethylene films such as low-density polyethylene (LDPE) film, linear low-density polyethylene (LLDPE) film, high-density polyethylene (HDPE) film, polypropylene film, polybutene film, polybutadiene film, and polymethylpentene film. Polyolefin films, such as an ethylene-norbornene copolymer film and a norbornene resin film; Ethylene copolymer films, such as an ethylene-vinyl acetate copolymer film, an ethylene-(meth)acrylic acid copolymer film, and an ethylene-(meth)acrylic acid ester copolymer film; Polyvinyl chloride type films, such as a polyvinyl chloride film and a vinyl chloride copolymer film; Polyester-type films, such as a polyethylene terephthalate film and a polybutylene terephthalate film; polyurethane film; polyimide film; polystyrene film; polycarbonate film; A fluororesin film etc. are mentioned. In addition, modified films such as these crosslinked films and ionomer films are also used. The base material 41 described above may be a film composed of one of these, or may be a laminated film obtained by combining two or more of these. In this embodiment, a polypropylene film and a polybutylene terephthalate film are preferred from the viewpoint of heat resistance when the composite sheet for forming a protective film is used in a heating step.

For the purpose of improving adhesion to the pressure-sensitive adhesive layer 42 laminated on the surface of the resin film described above, surface treatment by an oxidation method or a concavo-convex method or a primer treatment can be applied to one or both surfaces as desired. . Examples of the oxidation method include corona discharge treatment, plasma discharge treatment, chromium oxidation treatment (wet), flame treatment, hot air treatment, ozone, and ultraviolet irradiation treatment. A sand blast method, a thermal spray treatment method, etc. are mentioned.

The resin film described above may contain various additives such as a colorant, a flame retardant, a plasticizer, an antistatic agent, a lubricant, and a filler.

The thickness of the substrate 41 is not particularly limited as long as it can properly function in each step in which the composite sheet for forming a protective film is used. It is preferably in the range of 20 to 200 μm, more preferably in the range of 40 to 170 μm, and particularly preferably in the range of 50 to 140 μm.

(3.1.2. Adhesive layer)

The pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet of the composite sheet for forming a protective film according to the present embodiment may be composed of a non-energy ray-curable pressure-sensitive adhesive or an energy ray-curable pressure-sensitive adhesive. As the non-energy ray curable adhesive, those having desired adhesive strength and re-peelability are preferable. For example, acrylic adhesives, rubber-based adhesives, silicone-based adhesives, urethane-based adhesives, polyester-based adhesives, polyvinyl ether-based adhesives, etc. can be used. there is. Among these, an acrylic pressure-sensitive adhesive is preferable from the viewpoint of having high adhesion to the protective film forming film and effectively suppressing the drop-off of the workpiece or the workpiece of the workpiece in a dicing step or the like. In addition, an acrylic pressure-sensitive adhesive is preferable also from the viewpoint of easy control of pick-up aptitude of a chip with a protective film.

On the other hand, since the adhesive force of energy ray-curable pressure-sensitive adhesive is reduced by energy ray irradiation, it can be easily separated by energy ray irradiation when it is desired to separate a workpiece or a workpiece of a workpiece from an adhesive sheet.

The energy ray-curable pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer may have a polymer having energy ray curability as a main component, or may have a mixture of a polymer having no energy ray curability and an energy ray curable monomer and/or oligomer as a main component. do.

Examples of polymers having energy ray curability include (meth)acrylic acid ester (co)polymers in which energy ray curable groups are introduced. As an energy ray-curable monomer and/or oligomer, ester of a polyhydric alcohol and (meth)acrylic acid is illustrated. Moreover, the energy-beam curable adhesive may contain additives, such as a photoinitiator and a crosslinking agent, other than the component which has energy-beam curability.

The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as it can properly function in each step in which the composite sheet for forming a protective film is used. Specifically, the thickness of the pressure-sensitive adhesive layer is preferably 1 to 50 μm, 2 to 30 μm, 2 to 20 μm, 3 to 10 μm, and 3 to 8 μm.

The adhesive constituting the pressure-sensitive adhesive layer for a jig is preferably one having desired adhesive strength and releasability, and examples thereof include acrylic adhesives, rubber-based adhesives, silicone-based adhesives, urethane-based adhesives, polyester-based adhesives, polyvinyl ether-based adhesives, etc. can be used. Among these, an acrylic pressure-sensitive adhesive is preferable because it has high adhesion to a jig such as a ring frame and can effectively suppress peeling of the composite sheet for forming a protective film from the ring frame or the like in a dicing step or the like. Further, in the middle of the pressure-sensitive adhesive layer for jig in the thickness direction, a base material as a core material may be interposed.

The thickness of the pressure-sensitive adhesive layer for jigs is preferably 5 to 200 μm, particularly preferably 10 to 100 μm, from the viewpoint of adhesiveness to jigs such as ring frames.

(4. Manufacturing method of protective film forming film and sheet for forming protective film)

The manufacturing method of the protective film formation film is not specifically limited. The said film is manufactured using the above-mentioned composition for protective film formation films, or the composition obtained by diluting the said protective film formation film composition with a solvent (The said two compositions are called a "coating agent."). The coating agent is prepared by mixing the components constituting the composition for a protective film-forming film by a known method.

The obtained coating agent is applied to the release surface of the first release film using a coating machine such as a roll coater, knife coater, roll knife coater, air knife coater, die coater, bar coater, gravure coater, curtain coater, and the like, as needed It is made to dry and a protective film formation film is formed on the 1st peeling film.

Next, the sheet|seat for protective film formation shown in FIG. 5 is obtained by bonding together the peeling surface of the 2nd peeling film further to the exposed surface of the protective film formation film formed on the 1st peeling film.

(5. Manufacturing method of composite sheet for forming protective film)

The manufacturing method of the composite sheet for forming a protective film is not particularly limited. For example, after separately producing a first laminate containing a protective film forming film and a second laminate containing an adhesive sheet as a support sheet, the first laminate and the second laminate are used to form a protective film. It can be manufactured by laminating a film and an adhesive sheet.

The first layered product can be manufactured by the same method as the sheet for forming a protective film described above. That is, a protective film forming film is formed on the peeling surface of the first peeling film, and the peeling surface of the second peeling film is bonded to the exposed surface of the protective film forming film.

On the other hand, in order to manufacture a 2nd laminated body, first, the adhesive composition which comprises the adhesive layer or the composition which diluted the said adhesive composition with a solvent (the said two compositions are called "coating agent") is prepared. Subsequently, a coating agent is applied to the peeling surface of the third peeling film, and dried as necessary to form an adhesive layer on the third peeling film. After that, a base material is bonded to the exposed surface of the pressure-sensitive adhesive layer to obtain a laminate (second laminate) composed of an adhesive sheet composed of the base material and the pressure-sensitive adhesive layer, and a third peeling film.

Here, when the pressure-sensitive adhesive layer is made of an energy ray-curable pressure-sensitive adhesive, the pressure-sensitive adhesive layer may be cured by irradiating energy rays to the pressure-sensitive adhesive layer at this stage, or the pressure-sensitive adhesive layer may be cured after being laminated with a protective film forming film. Moreover, when hardening an adhesive layer after laminating|stacking with a protective film formation film, you may harden an adhesive layer before a dicing process, and you may harden an adhesive layer after a dicing process.

As the energy beam, an ultraviolet ray, an electron beam or the like is usually used. The irradiation amount of the energy ray varies depending on the type of the energy ray, but in the case of ultraviolet rays, for example, the light amount is preferably 50 to 1000 mJ/cm 2 , particularly preferably 100 to 500 mJ/cm 2 . Moreover, in the case of an electron beam, about 10 to 1000 krad is preferable.

When the 1st laminated body and the 2nd laminated body are obtained as mentioned above, while peeling the 2nd peeling film in a 1st laminated body, the 3rd peeling film in a 2nd laminated body is peeled, and the 1st The protective film forming film exposed from the laminate and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet exposed from the second laminate are bonded together.

In this way, the adhesive sheet formed by laminating the adhesive layer on the substrate, the protective film forming film laminated on the adhesive layer side of the adhesive sheet, and the protective film formed of the first peeling film laminated on the opposite side of the adhesive sheet in the protective film forming film A composite sheet for formation is obtained. After peeling off the 1st peeling film as needed, the adhesive layer for jig|tools is formed in the peripheral part of the exposed adhesive layer.

(6. Rework method and device manufacturing method)

The rework method using the protective film formation film concerning this embodiment and the manufacturing method of an apparatus are demonstrated. As an example of the manufacturing method of the apparatus, a method of obtaining a workpiece with a protective film obtained by singling a workpiece to which a protective film forming film has been affixed will be described.

The rework method according to the present embodiment includes at least the following steps 1 to 3. In addition, the manufacturing method of the device according to the present embodiment includes at least the following steps 1 to 6. That is, the rework method according to the present embodiment and the device manufacturing method according to the present embodiment overlap with respect to steps 1 to 3.

Step 1: Step of attaching the protective film-forming film described above to the back surface of the workpiece

Process 2: Process of inspecting the external appearance of the affixed protective film forming film

Step 3: In step 2, when a flaw is found in the pasted protective film forming film, a step of peeling off the scratched protective film forming film from the work

Step 4: A step of attaching the protective film-forming film described above to the back side of the work, separate from the protective film-forming film peeled off from the work

Step 5: A step of forming a protective film forming film into a protective film to obtain a workpiece with a protective film

Step 6: Step of processing the workpiece with protective film to obtain a workpiece with protective film

A rework method having steps 1 to 3 described above and a method for manufacturing a device having steps 1 to 6 described above will be described using FIGS. 7A, 7B and 8 .

As shown in FIG. 7A, the protective film formation film 10 of the sheet|seat 50 for protective film formation is affixed on the back surface of the wafer 6 as a workpiece (process 1). What is necessary is just to peel the 1st peeling film 21 as needed.

Moreover, as shown in FIG. 7B, the protective film formation film 10 of the composite sheet 60 for protective film formation is affixed to the wafer 6 as a work (process 1). At this time, you may fix the outer periphery of the protective film formation film 10 with the ring frame 7. In this embodiment, as shown in Fig. 6, since the adhesive layer 5 for jigs is formed on the outer periphery of the protective film forming film 10, the adhesive layer 5 for jigs is attached to the ring frame 7. . The wafer 6 is affixed on a surface opposite to the affixed surface of the protective film-forming film 10 with the pressure-sensitive adhesive layer 42 . When attaching the protective film-forming film 10 to the wafer 6, if desired, the protective film-forming film 10 may be heated and adhesiveness may be exhibited.

Next, the external appearance of the affixed protective film forming film is inspected (step 2). Although you may progress immediately from process 1 to process 2, you may progress to process 2 from process 1 through another process. The method for inspecting the appearance of the protective film-forming film is not particularly limited as long as it can detect whether or not a flaw is formed in the protective film-forming film. For example, an inspection may be performed to visually confirm the appearance of the protective film forming film, or an inspection may be performed to visually confirm an image of the protective film forming film acquired using an imaging device having a predetermined optical system, and the image may be processed by image processing software Alternatively, it may be an inspection performed by image processing by an image processing processor or the like, or an inspection in which light having a predetermined wavelength is irradiated and transmitted light or reflected light is analyzed to confirm the appearance.

In step 2, if no scratches are found on the protective film-forming film, the work to which the protective film-forming film has been affixed is transported to the next step.

On the other hand, when a flaw is found in the protective film forming film, the protective film forming film is reworked from the work to which the protective film forming film was affixed (step 3). In Step 3, when the protective film forming film of the composite sheet for forming a protective film is attached to the work, first, a protective film is formed on a support sheet (adhesive sheet) disposed on the surface opposite to the surface on which the protective film forming film is attached to the work It is pulled off from the film to expose the protective film forming film to the outside. Then, the tape for peeling is affixed on the surface of the protective film formation film in which the flaw part was formed. The peeling tape is a sheet having a substrate and an adhesive layer. By pulling the peeling tape at a predetermined angle, the protective film forming film follows the peeling tape, and the protective film forming film is pulled off (reworked) from the work together with the peeling tape.

At this time, since the protective film-forming film has the above-mentioned physical properties, even if a flaw is formed, no residue consisting of the protective film-forming film remains on the work after being peeled off. That is, the protective film-forming film is reworked satisfactorily. Moreover, since it pulls off satisfactorily even without increasing the peeling force, damage to the workpiece resulting from application of strong force can be suppressed.

From the above, the rework method is established by passing through steps 1 to 3.

Subsequently, the manufacturing method of the apparatus which has process 1 - process 6 is demonstrated. In the device manufacturing method, since steps 1 to 3 are the same as steps 1 to 3 in the rework method, descriptions of steps 1 to 3 are omitted.

When the protective film forming film is reworked, the protective film forming film does not exist on the back side of the work. Then, another protective film forming film different from the reworked protective film forming film is affixed on the back surface of a work (process 4).

After sticking, as mentioned above, it is good to inspect whether or not a flaw part is formed in the protective film formation film, and what is necessary is just to rework when a flaw part is formed.

When the flaw part is not formed in the protective film formation film, the protective film formation film is made into a protective film, the protective film 1 is formed, and the workpiece|work with a protective film is obtained (process 5). What is necessary is just to perform operation which hardens a protective film formation film, when a protective film formation film is curable. For example, what is necessary is just to heat the protective film formation film 10 at predetermined temperature for an appropriate time, when a protective film formation film is thermosetting. For example, the heating temperature is preferably 100 to 200°C, and may be, for example, 110 to 180°C or 120 to 170°C. The heating time is preferably 0.5 to 5 hours, and may be, for example, 0.5 to 3 hours or 1 to 2 hours. Moreover, what is necessary is just to make an energy beam incident from the adhesive sheet 4 or the peeling film side, when the protective film formation film 10 is energy-beam curable. For example, the illuminance of the energy ray is preferably 120 to 280 mW/cm 2 , and the light quantity of the energy ray is preferably 100 to 1000 mJ/cm 2 .

Next, the workpiece with a protective film is processed (Step 6). As a process of processing a workpiece with a protective film, a process of obtaining a predetermined number of workpieces with a protective film by dividing the workpiece with a protective film is exemplified. When the work is a wafer and the workpiece is a chip, as shown in FIG. 8 , the wafer with a protective film held by the dicing tape 22 may be diced to obtain a chip 70 with a protective film. In Step 6, when a wafer with a protective film is obtained using the composite sheet for forming a protective film, the wafer with a protective film held by the support sheet may be diced to obtain a chip with a protective film. As the dicing method, a known dicing method may be employed. The obtained chip 70 with a protective film is picked up and collected by a suction collet or the like.

The picked-up chip with a protective film may be conveyed to the next step, or may be temporarily housed in a tray, tape, etc., and then conveyed to the next step after a predetermined period of time.

The chip 70 with a protective film conveyed in the next step is mounted on a substrate, and a semiconductor device is manufactured.

(7. Variation)

A release film may be laminated on the surface of the composite sheet 60 for forming a protective film on the side of the protective film forming film 10 in order to protect the protective film forming film until use.

As mentioned above, although the embodiment of the present invention has been described, the present invention is not limited to the above-described embodiment at all, and may be modified in various aspects within the scope of the present invention.

[Example]

Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to these examples.

(Production of Sheet for Forming a Protective Film)

A sheet for forming a protective film was produced as follows using a coating agent containing the following composition for forming a protective film.

(Coating agent containing composition for protective film forming film)

Each of the following components was mixed at the compounding ratio (in terms of solid content) shown in Table 1, diluted with methyl ethyl ketone so that the solid content concentration was 50% by mass, and a coating agent containing the composition for forming a protective film was prepared.

(A) polymer component

(A-1): A (meth)acrylic acid ester copolymer obtained by copolymerizing 10 parts by mass of n-butyl acrylate, 70 parts by mass of ethyl acrylate, 10 parts by mass of methyl acrylate, and 10 parts by mass of 4-hydroxybutyl acrylate ( Weight average molecular weight: 600,000, glass transition temperature: -25 ℃)

(A-2): (meth)acrylic acid ester copolymer (weight Average Molecular Weight: 500,000, Glass Transition Temperature: 1℃)

(B) curable component (heat curable component)

(B-1) bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER828, epoxy equivalent 184 to 194 g/eq)

(B-2) bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER1055, epoxy equivalent 800 to 900 g/eq)

(B-3) dicyclopentadiene type epoxy resin (Epiclon HP-7200HH manufactured by Dainippon Ink & Chemicals, Inc., softening point 88-98°C, epoxy equivalent 274-286 g/eq)

(C) curing agent: dicyandiamide (manufactured by ADEKA, Adeka Hardner EH-3636AS, thermally active latent epoxy resin curing agent, active hydrogen amount 21 g/eq)

(D) Curing accelerator: 2-phenyl-4,5-dihydroxymethylimidazole (Curesol 2PHZ, manufactured by Shikoku Chemical Industry Co., Ltd.)

(E) filling material

(E-1) Silica filler (Admatex Co., Ltd., SC2050-MNU, average particle diameter 0.5 μm)

(E-2) Silica filler (Admatex Co., Ltd., SC1050-MLQ, average particle diameter 0.3 μm)

(E-3) Silica filler (manufactured by Admatechs, Y100SV-CM1, average particle diameter: 0.1 µm)

(F) Coupling agent

(F-1): 3-glycidyloxypropyltrimethoxysilane (Shin-Etsu Silicone Co., Ltd., KBM403)

(F-2): Oligomeric silane coupling agent containing an epoxy group, a methyl group and a methoxy group (manufactured by Shin-Etsu Silicone Co., Ltd., X-41-1056, epoxy equivalent 280 g/eq)

(G) Colorant: Carbon black (manufactured by Mitsubishi Chemical Corporation, MA-600B, average particle diameter 28 nm)

A first release film (SP-PET502150 manufactured by Lintec Corporation) in which a silicone-based release agent layer is formed on one side of a polyethylene terephthalate (PET) film having a thickness of 50 μm was prepared. In addition, a second release film (SP-PET381031 manufactured by Lintec Corporation) in which a silicone-based release agent layer is formed on one side of a polyethylene terephthalate (PET) film having a thickness of 38 μm was prepared.

A coating agent containing the prepared composition for forming a protective film was coated on the release-treated surface of the first release film, and dried at 100°C for 2 minutes to form a film for forming a protective film having a thickness of 25 µm. Then, the 2nd peeling film was affixed on the protective film formation film, and the sheet|seat for forming a protective film of 3 layer structure in which the peeling film was laminated|stacked on both surfaces of the protective film formation film was obtained. As for the sticking conditions of the 2nd peeling film, the temperature was 60 degreeC, the pressure was 0.4 Mpa, and the speed was 1 m/min.

The following measurement and evaluation were performed using the obtained sheet for forming a protective film.

(Elongation at break of protective film-forming film in right angle tear test)

In the obtained two sheets for forming a protective film, the respective second peeling films were peeled off, the exposed surfaces of the protective film forming films (surfaces on which the first peeling film was not formed) were adhered to each other, and one of the first peeling films was formed. It peeled and obtained the laminated body in which the 2 protective film formation films were laminated|stacked on the other 1st peeling film. In addition, the exposed surface of the protective film forming film obtained by peeling the second peeling film from a separate sheet for forming a protective film and the exposed surface of the protective film forming film of a laminate in which two protective film forming films are laminated on the first peeling film are adhered, , the first peeling film of another sheet for forming a protective film was peeled off. This was repeated 6 times, a total of 8 sheets of protective film forming film were laminated, and a laminate composed of a first peeling film, a protective film forming film having a thickness of 200 μm, and a first peeling film were laminated in this order was produced.

In addition, when the protective film forming film is 25 μm, the laminated protective film forming film preferably has a thickness of 200 μm, but when the protective film forming film is not 25 μm, the number of laminations is appropriately selected, and the thickness of the laminated protective film forming film is 180 It is preferable to set it as -220 micrometers.

A rectangular tear test piece described in JIS K 7128-3: 1998 using a super dumbbell cutter (SDBK-1000, manufactured by Dumbbell Co., Ltd.) for a laminate in which the first release film is laminated on both surfaces of the obtained laminated protective film forming film. It was punched with the size of . The shape of the rectangular tear test piece was the shape shown in FIG. 2 of JIS K 7128-3:1998.

The first peeling films on both surfaces were removed from the obtained right-angle tear test piece, and a right-angle tear test was conducted at a test temperature of 23°C using a universal tensile tester (manufactured by Shimadzu Corporation, AG-IS). In the right angle tear test, the test length (distance between chucks) of the right angle tear test piece before the test was set to 60 mm, and the tensile speed was set to 200 mm/min.

The elongation rate (%) at break at 23°C was calculated from the following equation when the elongation of the test piece at break was ΔL with the start of tension as the starting point. A result is shown in Table 1.

Elongation at break = (ΔL/Test length (60 mm) of rectangular tear test piece before test) × 100

(Adhesion of protective film forming film to silicon wafer)

In the obtained sheet for forming a protective film, an adhesive tape composed of a base material and an adhesive layer (manufactured by Lintec, Adwill D -841) was attached. Then, using an ultraviolet irradiation device, the adhesive tape was irradiated with ultraviolet rays under the conditions of an illuminance of 230 mW/cm 2 and an amount of light of 190 mJ/cm 2 to cure the adhesive tape to such an extent that the protective film forming film and the adhesive tape did not separate. . A test piece was produced by cutting the obtained layered product into a size of 25 mm x 140 mm.

In addition, since the protective film formation film will harden when a protective film formation film is energy-beam curable, the test piece which irradiated the adhesive tape with the ultraviolet-ray is used for the measurement.

Next, the first peeling film was peeled from the obtained test piece, and the surface of the exposed protective film forming film was placed on the #2000 polished surface of a silicon wafer with a thickness of 500 µm and an outer diameter of 6 inches by a laminator (VA-400 manufactured by Taisei Laminator Co., Ltd.). type) was used to attach it. At this time, the roller temperature was 70 degreeC, the sticking speed|rate was 0.3 m/min, and the sticking pressure was made into the conditions of 0.3 Mpa. Then, it was left still for 1 hour in an environment of 23°C and 50% relative humidity.

Then, under the condition of 23 degreeC, the laminated body of the protective film formation film and adhesive tape was peeled off from the silicon wafer at the peeling speed of 300 mm/min using the precision universal testing machine (Autograph AG-IS manufactured by Shimadzu Corporation). At this time, so-called 180° peeling was performed in which the surfaces where the protective film forming film and the silicon wafer were in contact formed an angle of 180°. The peeling force (N/25 mm) at this time was measured, and this measured value was made into the adhesive force of the protective film formation film to the silicon wafer. A result is shown in Table 1.

(rework test)

The exposed surface of the protective film formation film of the sheet for forming a protective film cut and processed in the same shape as the silicon wafer is applied to the back surface (#2000 polished surface) of a workpiece made of a silicon wafer with a thickness of 300 μm and an outer diameter of 8 inches. It was affixed at 70 degreeC using manufacture, RAD-3600F/12). Then, in order to reproduce the protective film-forming film having scratches during or after the application, linear scratches having a length of 10 mm and a depth of 12 μm were formed on the protective film-forming film. The position and direction of the linear flaw were the position and direction shown in the flaw part 12 of FIG. 4A. Next, at 23°C, the release film was peeled off, and an adhesive tape (Adwill D-841, manufactured by Lintec Co., Ltd.) composed of a base material and an adhesive layer was affixed as a peeling tape to the surface of the exposed protective film forming film. Then, using an ultraviolet irradiation device, the adhesive tape was irradiated with ultraviolet rays under the conditions of an illuminance of 230 mW/cm 2 and an amount of light of 190 mJ/cm 2 to cure the adhesive tape to such an extent that the protective film forming film and the adhesive tape did not separate. .

The silicon wafer to which the protective film forming film and the adhesive tape were affixed was fixed to a suction table, and the laminated body of the protective film forming film and the adhesive tape was pulled off from the silicon wafer at a peeling speed of 300 mm/min. At this time, so-called 180° peeling was performed in which the surfaces where the protective film forming film and the silicon wafer were in contact formed an angle of 180°.

About the protective film formation films of Examples and Comparative Examples, the rework test described above was performed 10 times, and the following evaluation criteria were evaluated. A result is shown in Table 1.

Excellent: Out of 10 wafers subjected to the rework test, 9 or more wafers had no residue and the protective film forming film was peeled off.

Good: Out of 10 wafers subjected to the rework test, 6 or more and 8 or less wafers had no residue and the protective film forming film was peeled off.

Impossible: Out of 10 wafers subjected to the rework test, 5 or less wafers have no residue and the protective film forming film has been peeled off.

From Table 1, it was confirmed that when the elongation at break and the adhesive force to the silicon wafer in the right angle tear test of the protective film forming film were within the above-mentioned range, no residue was generated during rework and was good. On the other hand, when the elongation rate at break in the perpendicular tear test of the protective film-forming film was outside the above-mentioned range, it was confirmed that residues were likely to be generated during rework.

10, 100: protective film forming film
50: sheet for forming a protective film
10: protective film forming film
21: first release film
22: second peeling film
60: composite sheet for forming a protective film
10: protective film forming film
4: adhesive sheet
70: chip with protective film
1 : Shield

Claims (6)

As a protective film forming film for forming a protective film,
The elongation rate when the protective film-forming film is broken in a right angle tear test is 200% or less at 23°C,
A protective film-forming film having an adhesive force to the silicon wafer 1 hour after attaching the protective film-forming film to the #2000 polished surface of a silicon wafer at 23°C of 20 N/25 mm or less. According to claim 1,
The protective film forming film wherein the protective film forming film is heat curable or energy ray curable. A sheet for forming a protective film comprising the protective film-forming film according to claim 1 or 2 and a release film disposed on at least one main surface of the protective film-forming film so that peeling is possible. A composite sheet for forming a protective film comprising the protective film-forming film according to claim 1 or 2 and a support sheet supporting the protective film-forming film. A step of attaching the protective film-forming film according to claim 1 or 2 to the back surface of the work;
A step of inspecting the appearance of the attached protective film forming film;
A rework method comprising a step of peeling off the scratched protective film forming film from the work when a flaw is found in the applied protective film forming film in the step of inspecting the external appearance of the applied protective film forming film. A step of attaching the protective film-forming film according to claim 1 or 2 to the back surface of the work;
A step of inspecting the appearance of the attached protective film forming film;
In the step of inspecting the external appearance of the attached protective film forming film, in the case where a flaw is found in the attached protective film forming film, a step of peeling off the scratched protective film forming film from the work;
A step of attaching the protective film-forming film according to claim 1 or 2 to the back surface of the work, which is different from the protective film-forming film peeled off from the work;
A step of forming a protective film forming film into a protective film to obtain a workpiece with a protective film;
A method for manufacturing an apparatus having a step of processing a workpiece with a protective film to obtain a workpiece with a protective film.

Images