KR20230043757A - Architecture for differential drive and sense touch technology - Google Patents

Abstract

Differential drive and sensing can reduce noises within a touch screen. According to some embodiments of the present invention, the touch screen may include row and column electrodes routed vertically in an active area. According to some embodiments of the present invention, the touch electrodes and/or routing traces can be implemented on first and second metal layers by using a metal mesh. In order to improve optical performance, the overlapping portions of the metal mesh can be designed to provide the external appearance of a uniform width/area. According to some embodiments of the present invention, a dielectric layer may include increased thickness and/or a reduced dielectric constant, and the metal mesh within the first meal layer can be flooded with a transparent conductive material. According to some embodiments of the present invention, the routing traces may be disposed below the touch electrodes and/or the metal mesh for the touch electrodes can be flooded with the transparent conductive material while the metal mesh for the routing traces is not flooded. According to some embodiments of the present invention, the touch electrodes can be interleaved within the touch node to improve a differential offset.

Description

Architecture for differential driving and sensing touch technique {ARCHITECTURE FOR DIFFERENTIAL DRIVE AND SENSE TOUCH TECHNOLOGY}

CROSS REFERENCES TO RELATED APPLICATIONS

This application is based on U.S. Provisional Application No. 63/261,620, filed on September 24, 2021, U.S. Provisional Application No. 63/261,624, filed on September 24, 2021, and U.S. Provisional Application No. 63, filed on May 6, 2022. /364,338, which claims the benefit of U.S. Patent Application No. 17/XXX,XXX, filed on Sep. X, 2022, and U.S. Patent Application No. 17/XXX,XXX, filed on Sep. X, 2022, which The contents of are incorporated herein by reference in their entirety for all purposes.

technology field

This application relates generally to touch sensor panels/screens, and more specifically to touch sensor panels/screens with differential drive and/or sensing.

Many types of input devices are currently available for performing operations in a computing system, such as buttons or keys, mouse, trackball, joystick, touch sensor panel, touch screen, and the like. In particular, touch screens are popular not only because of their ease of operation and versatility, but also because of their declining price. Touch screens can include a touch sensor panel, which can be a transparent panel with a touch-sensitive surface, and a display device such as a liquid crystal display (LCD), light emitting diode (LED) display, or organic light emitting diode (OLED) display, The device may be positioned partially or completely behind the panel, such that the touch-sensitive surface may cover at least a portion of the viewable area of the display device. Touch screens may allow a user to perform various functions by touching a touch sensor panel using a finger, stylus or other object at a location indicated by a user interface (UI), often being displayed by a display device. In general, touch screens can recognize a touch and the location of the touch on a touch sensor panel, the computing system can then interpret the touch according to the display appearing at the time of the touch, and then take one or more actions based on the touch. can be done For some touch sensing systems, a physical touch on the display is not required to detect the touch. For example, in some capacitive-type touch sensing systems, the fringing electrical field used to detect a touch may extend beyond the surface of the display, and objects approaching the surface may It can be detected close to the surface without actually touching it.

Capacitive touch sensor panels may be formed by a matrix of partially or fully transparent or opaque conductive plates (eg, touch electrodes) made of materials such as Indium Tin Oxide (ITO). In some examples, the conductive plates may be formed from other materials including conductive polymers, metal meshes, graphene, nanowires (eg silver nanowires) or nanotubes (eg carbon nanotubes). As mentioned above, it is in part due to their substantial transparency that some capacitive touch sensor panels can be overlaid on a display to form a touch screen. Some touch screens may be formed by at least partially integrating touch sensing circuitry into a display pixel stack-up (ie, stacked material layers that form the display pixels).

The present invention relates to touch sensor panels (or touch screens or touch-sensitive surfaces) with improved signal-to-noise ratio (SNR). In some examples, the touch sensor panel can include a two-dimensional array of touch nodes formed from a plurality of touch electrodes. For example, a two-dimensional array of touch nodes can be arranged in rows and columns. Each column (or row) of touch nodes may be driven with a plurality of driving signals. For example, a first driving signal may be applied to first column electrodes in a column of touch nodes, and a second driving signal may be applied to a second column electrode in a column of touch nodes. Each row (or column) of touch nodes may be sensed (eg, differentially) by sensing circuitry. For example, a first row electrode within a row of touch nodes can be coupled to a first input and a second row electrode within a row of touch nodes can be coupled to a second input, such that the first input and second input can be detected differentially. Differential driving (eg, using complementary drive signals) and/or differential sensing can reduce noise within touch and/or display systems of a touch screen.

Column electrodes can be routed perpendicular to (eg, overlapping a two-dimensional array of touch nodes) a first edge of the touch sensor panel to couple the column electrodes to drive circuitry. In some examples, the row electrodes can be routed from the second edge of the touch sensor panel (eg, perpendicular to the first edge) in a border region around the two-dimensional array of touch nodes. In some examples, the row electrodes can also be routed perpendicular to the first edge of the touch sensor panel (eg, overlapping a two-dimensional array of touch nodes). In some examples, routing traces may be formed of metal mesh.

In some examples, the touch sensor panel can be divided into three banks of rows (eg, more generally for a plurality of banks of rows). In some examples, routing traces for rows may be implemented using 4 routing tracks per column for 3 banks (also referred to herein as a set of one or more routing trace segments). In some examples, to improve optical properties (eg, to reduce visibility of a metal mesh), the four routing tracks may extend the vertical length of the touch sensor panel (eg, the length of a row of touch nodes). can In some examples, routing traces implemented as four routing traces using electrical connections and/or discontinuities within the routing tracks can be used to improve the characteristics of routing. For example, a discontinuity in a routing track after an electrical connection to a row electrode can reduce capacitive loading of the routing trace to the row electrode. The discontinuity may also reduce the resistance of the routing trace by allowing other routing trace segments within the routing track to be used for another routing trace. In some examples, utilization of routing tracks for routing traces can be optimized to reduce routing trace resistances.

In some examples, interconnections between routing traces and row electrodes can have a chevron pattern to reduce maximum routing trace resistance and/or balance routing trace resistance across the touch sensor panel. In some examples, the interconnections between the routing traces and the row electrodes are (also referred to as diagonal or zigzag) to reduce row-to-row differences in resistance (and to reduce discontinuities in bandwidth to the touch sensor panel). It may have an S-shaped pattern. In some examples, the interconnections between the routing traces and the row electrodes may have a diagonal pattern in which the top and bottom rows resemble an S-shaped pattern and the middle rows route a border region outside the region of the two-dimensional array of touch nodes. It can have a hybrid pattern that can have. A hybrid pattern can provide increased use of routing tracks for longer routing traces (eg, furthest from the sensing circuitry).

In some examples, differential sense routing can be implemented to reduce cross coupling within the touch sensor panel. For example, routing traces for row electrodes used for differential measurement can be routed in pairs such that cross-coupling becomes common mode and cancels out in differential measurement. In some examples, staggering the differential drive signals can reduce parasitic signal loss for differential drive and sense measurements. For example, rather than applying complementary drive signals to different touch nodes within a column, complementary drive signals may be applied in an adjacent column. In some examples, complementary driving signals may be applied to diagonally adjacent touch nodes.

In some examples, routing traces for a touch sensor panel can be implemented (at least partially) in the active area. In some examples, the touch electrodes and routing traces can be implemented using a metal mesh in a first metal layer and using bridges in a second metal layer to interconnect conductive segments of the metal mesh forming the touch electrodes. there is. In some examples, the touch electrodes can be implemented using a metal mesh in a first metal layer and bridges in a second metal layer to interconnect conductive segments of the metal mesh forming the touch electrodes, wherein the routing traces form the first metal layer. It can be implemented using a metal mesh for the metal layer and a metal mesh for the second metal layer. In some examples, the touch electrodes and/or routing traces can be implemented using a metal mesh for the first metal layer and a metal mesh for the second metal layer.

In some examples, portions of the metal mesh for the touch electrode and/or routing trace overlap and are parallel between the first metal layer and the second metal layer. In some instances, overlapping and parallel portions may be aligned to improve optical performance. In some examples, to improve optical performance, the width of the metal mesh in the first layer can be wider than the width of the metal mesh in the second layer for overlapping and parallel portions. In some examples, to improve optical performance, the metal mesh in the first metal layer and the metal mesh in the second metal layer for the touch electrode may be non-parallel (eg, orthogonal) such that the overlapping portions are It may have a substantially uniform area (eg, within a threshold such as 2 square micrometers or 1.5 square micrometers) across the touch electrode.

In some examples, to improve SNR and touch sensor panel bandwidth, a dielectric layer between the first metal layer and the second metal layer can reduce capacitive coupling (eg, parallel plate capacitance) therebetween. . For example, the dielectric layer can have an increased thickness and/or a reduced dielectric constant to reduce capacitive coupling. In some examples, to improve SNR and touch sensor panel bandwidth, the metal mesh in the first metal layer is a transparent conductive electrically coupled to the metal mesh (optionally separated from the first metal layer by a dielectric layer) It may be flooded, filled, or otherwise reinforced with material.

In some examples, to reduce crosstalk in a non-differential mode of operation (eg, stylus or self-capacitance), the routing traces are touch implemented in the first metal layer (and optionally also in the second metal layer). It may be disposed in the second metal layer below the electrodes. In some examples, to reduce crosstalk and improve SNR and touch sensor panel bandwidth in a non-differential operating mode, the metal mesh for the touch electrodes in the first metal layer is a transparent conductive material in the first metal layer. Without flooding, filling, or otherwise augmenting the metal mesh for routing, it may be flooded, filled, or otherwise augmented with a transparent conductive material that is electrically coupled to the metal mesh.

In some examples, a stack-up of a touch sensor and display may include at least one encapsulation layer upon which components of the stack-up are disposed or otherwise formed. Display components formed on a substrate may be covered by a first encapsulation layer formed using a selective or blanket deposition method (eg, using an inkjet printing process). A display-noise shield or sensor may be formed on the first encapsulation layer using an on-cell process. In some examples, use of an on-cell process can improve alignment of structures of a shield or sensor to display components (and thereby improve manufacturing yield for stackup).

In some examples, a display-noise sensor can detect signals corresponding to electrical interference from display components in these examples, and the display-noise sensor is configured such that rows and columns of display-noise sensor electrodes correspond to rows and columns of display components. and one or more metal layers that can be patterned to be substantially aligned with the During the reading of touch signals in a touch screen formed over the display components, the display-noise sensor signals of the display-noise sensor are simultaneously read and subtracted from the touch signals to reduce or eliminate electrical interference of the display from the touch signals. can

In some examples, the display-noise shield can mitigate signals corresponding to electrical interference from display components going through the stackup to the touch sensor. In these examples, the display-noise shield can be a layer of metal mesh formed over all display components (eg, a global mesh structure). In other examples, the display-noise shield can be a flood of solid transparent conductive material (eg, a global fill, or a solid metal layer structure) formed over all of the display components. In further examples, the display-noise shield is a combination layer of metal mesh and solid transparent conductive material (eg, alternating sections of patches of metal mesh and/or transparent conductive material) formed together across all display components. can be

In some examples, a second encapsulation layer may be formed over the display-noise shield/sensor. In some examples, a dielectric layer may be formed over the second encapsulation layer to mitigate the effect of any parasitic capacitances between the touch screen and shield/sensor in the stackup. The second encapsulation layer may be formed using an inkjet printing deposition process. A touch sensor may be formed over the second encapsulation layer according to an on-cell manufacturing process (eg, to improve alignment and/or avoid lamination of a separate touch sensor to the display stackup).

In some examples, the readout circuitry is configured to simultaneously read the touch signals from the touch sensor and the signals from the display-noise sensor to generate a noise-corrected touch signal (e.g., to reduce electrical interference caused by the display or can be configured to remove). In some examples, the display-noise shield can be biased to a fixed voltage level (eg, a ground voltage level or a non-zero voltage level).

In some examples, a touch electrode architecture for differential driving without differential sensing can be implemented. Differential driving can still reduce touch-to-display noise. A touch electrode architecture for differential drive can simplify touch electrode architecture design because fewer routing traces and fewer bridges are required compared to some of the differential drive and differential sensing touch electrode architectures described herein. there is.

In some examples, one or more touch nodes in the touch electrode architecture each include a differential pair of row electrodes and a differential pair of column electrodes. For example, the touch node may include a portion of the first row electrode Rx0+ and a portion of the second row electrode Rx0− (eg, corresponding to differential inputs for touch sensing), and the first column electrode Tx0+. ) and a portion of the second column electrode Tx0− (eg, corresponding to differential and complementary outputs of touch driving). The arrangement of the first and second row electrodes and the first and second column electrodes can result in two dominant mutual capacitances that are in phase. Additionally, because the touch node includes first and second row electrodes and portions of first and second column electrodes, differential cancellation occurs on a per touch node basis rather than across two touch nodes. Additionally, non-dominant (collateral) parasitic capacitance can be reduced by reducing routing lengths and increasing the separation between electrodes that creates parasitic mutual capacitance.

In some examples, the touch electrode architecture includes fully differentially interleaved row and column electrodes within a touch node. In some examples, a touch electrode architecture that is differential for row (or column) electrodes and pseudodifferential for column (or row) electrodes.

In some examples, common mode noise may be reduced using spatial separation and spatial filtering. Spatial separation between the touch signal and the common mode noise signal can be achieved using a touch electrode architecture with reduced pitch for the transmitter and receiver electrodes.

1A-1E illustrate example systems that may include a touch screen according to examples of the present disclosure.
2 illustrates an example computing system including a touch screen according to examples of the present disclosure.
3A illustrates an example touch sensor circuit corresponding to a self-capacitance measurement portion of a touch node electrode and sensing circuit, according to examples of the present disclosure.
3B illustrates an example touch sensor circuit corresponding to a mutual capacitance drive line and sense line and sense circuit, according to examples of the present disclosure.
4A illustrates a touch screen with touch electrodes arranged in rows and columns, according to examples of the present disclosure.
4B illustrates a touch screen with touch node electrodes arranged in a pixelated touch node electrode configuration, according to examples of the present disclosure.
5 illustrates an example touch screen stackup including a metal mesh layer, in accordance with examples of the present disclosure.
6A illustrates a symbolic representation of a touch sensor panel implementing differential sensing, in accordance with examples of the present disclosure.
6B illustrates a symbolic representation of a touch sensor panel implementing differential driving and differential sensing, in accordance with examples of the present disclosure.
7A illustrates a portion of a touch sensor panel that can be used to implement differential driving and/or differential sensing, according to examples of the present disclosure.
7B and 7C illustrate different configurations of routing traces for a touch node with two vertical routing traces for row electrodes and four vertical routing traces for column electrodes, according to examples of the present disclosure. .
8-10 illustrate different routing patterns for row electrodes, according to examples of the present disclosure.
11A and 11B illustrate an example touch sensor with vertical routing traces and corresponding signal levels with and without crosstalk, according to examples of the present disclosure.
11C and 11D illustrate portions of example touch sensor panels with non-differential routing traces or with differential routing traces, according to examples of the present disclosure.
12A and 12B illustrate an example touch node of a row-column architecture using single-ended capacitance measurements or differential capacitance measurements, according to examples of the present disclosure.
13A and 13B illustrate portions of touch sensor panels and representations of a stimulus applied to the touch sensor panels, according to examples of the present disclosure.
14A and 14B illustrate a two-layer configuration including touch electrodes and routing traces in a first layer and bridges in a second layer, according to examples of the present disclosure.
14A and 14C illustrate a two-layer configuration including touch electrodes and routing traces in a first layer and bridges and stacked routing traces in a second layer, according to examples of the present disclosure.
15A and 15B illustrate partial views of the two-layer configuration of FIGS. 14A-14C, according to examples of the present disclosure.
16 is a two-layer diagram including touch electrode segments stacked in first and second layers, routing traces in the first layer, and routing trace segments stacked in the second layer according to examples of the present disclosure. Illustrates a partial view of the configuration.
17A-17D illustrate cross-sectional views of a portion of exemplary two-layer constructions, according to examples of the present disclosure.
18 illustrates a portion of a two-layer configuration including a touch electrode implemented partially in a first layer and partially in a second layer, according to examples of the present disclosure.
19A illustrates a partial view of a two-layer configuration including touch electrode segments stacked in first and second layers and routing traces stacked in first and second layers, according to examples of the present disclosure; do.
19B illustrates a partial view of a two-layer configuration including touch electrode segments stacked in a first layer and a second layer and a routing trace embedded in the second layer, according to examples of the present disclosure.
19C illustrates a partial view of a two-layer configuration including touch electrode segments stacked in a first layer and a second layer and a routing trace embedded in the second layer, according to examples of the present disclosure.
20A illustrates a partial view of a two-layer configuration including touch electrode segments stacked in first and second layers and routing traces stacked in first and second layers, according to examples of the present disclosure; do.
20B and 20C illustrate example cross-sectional views of a portion of a two-layer construction comprising a flood of transparent conductive material, according to examples of the present disclosure.
21 illustrates a partial view of a two-layer configuration including touch electrode segments stacked in first and second layers and routing traces stacked in first and second layers, according to examples of the present disclosure; do.
22 illustrates an example touch screen stackup including an encapsulation layer for isolation and an optional dielectric layer according to examples of the present disclosure.
23 illustrates example layers of a display-noise sensor formed on a printed layer of a touch screen stackup, in accordance with examples of the present disclosure.
24 illustrates an example display-noise shield formed on a printed layer of a touch screen stackup, in accordance with examples of the present disclosure.
25 illustrates an example touch sensor of a touch screen stackup, in accordance with examples of the present disclosure.
26 illustrates an example transfer type touch sensor of a touch screen stackup, in accordance with examples of the present disclosure.
27 illustrates exemplary read terminals of a touch sensor and pixel-aligned display-noise sensor of a touch screen stackup, in accordance with examples of the present disclosure.
28 illustrates example read terminals of a touch sensor and display-noise shield of a touch screen stackup, in accordance with examples of the present disclosure.
29 illustrates example readout circuitry for a touch sensor and a display-noise sensor of a touch screen stackup, in accordance with examples of the present disclosure.
30 illustrates an example voltage bias for a display-noise shield of a touch screen stackup, in accordance with examples of the present disclosure.
31 illustrates an example process for operating a touch screen stackup with a touch sensor and a display-noise sensor between the touch sensor and a display pixel, in accordance with examples of the present disclosure.
32 illustrates an example process for forming a touch screen stackup having a display-noise shield/sensor formed on a first printed layer and a touch sensor formed on a second printed layer, in accordance with examples of the present disclosure. .
33 illustrates a portion of an example touch sensor panel according to examples of the present disclosure.
34 illustrates a portion of an example touch sensor panel configured for differential drive, in accordance with examples of the present disclosure.
35A and 35B illustrate example touch electrode architectures, according to examples of the present disclosure.
36 illustrates an exemplary touch electrode architecture that is fully differential within a touch node, according to examples of the present disclosure.
37 illustrates a portion of an example touch sensor panel configured for differential drive, in accordance with examples of the present disclosure.
38 illustrates a portion of an example touch sensor panel configured for differential drive, in accordance with examples of the present disclosure.
39 illustrates plots of spatial touch signal and noise, according to examples of the present disclosure.

In the following description of examples, reference is made to the accompanying drawings, which form a part of this specification, and specific examples that can be practiced are shown as examples within the drawings. It will be understood that structural changes may be made and other examples may be used without departing from the scope of the disclosed examples.

The present invention relates to touch sensor panels (or touch screens or touch-sensitive surfaces) with improved signal-to-noise ratio (SNR). In some examples, the touch sensor panel can include a two-dimensional array of touch nodes formed from a plurality of touch electrodes. For example, a two-dimensional array of touch nodes can be arranged in rows and columns. Each column (or row) of touch nodes may be driven with a plurality of driving signals. For example, a first driving signal may be applied to first column electrodes in a column of touch nodes, and a second driving signal may be applied to a second column electrode in a column of touch nodes. Each row (or column) of touch nodes may be sensed (eg, differentially) by sensing circuitry. For example, a first row electrode within a row of touch nodes can be coupled to a first input and a second row electrode within a row of touch nodes can be coupled to a second input, such that the first input and second input can be detected differentially. Differential driving (eg, using complementary drive signals) and/or differential sensing can reduce noise within touch and/or display systems of a touch screen.

Column electrodes can be routed perpendicular to (eg, overlapping a two-dimensional array of touch nodes) a first edge of the touch sensor panel to couple the column electrodes to drive circuitry. In some examples, the row electrodes can be routed from the second edge of the touch sensor panel (eg, perpendicular to the first edge) in a border region around the two-dimensional array of touch nodes. In some examples, the row electrodes can also be routed perpendicular to the first edge of the touch sensor panel (eg, overlapping a two-dimensional array of touch nodes). In some examples, routing traces may be formed of metal mesh.

In some examples, the touch sensor panel can be divided into three banks of rows (eg, more generally for a plurality of banks of rows). In some examples, routing traces for rows may be implemented using 4 routing tracks per column for 3 banks (also referred to herein as a set of one or more routing trace segments). In some examples, to improve optical properties (eg, to reduce visibility of a metal mesh), the four routing tracks may extend the vertical length of the touch sensor panel (eg, the length of a row of touch nodes). can In some examples, routing traces implemented as four routing traces using electrical connections and/or discontinuities within the routing tracks can be used to improve the characteristics of routing. For example, a discontinuity in a routing track after an electrical connection to a row electrode can reduce capacitive loading of the routing trace to the row electrode. The discontinuity may also reduce the resistance of the routing trace by allowing other routing trace segments within the routing track to be used for another routing trace. In some examples, utilization of routing tracks for routing traces can be optimized to reduce routing trace resistances.

In some examples, interconnections between routing traces and row electrodes can have a chevron pattern to reduce maximum routing trace resistance and/or balance routing trace resistance across the touch sensor panel. In some examples, the interconnections between the routing traces and the row electrodes are (also referred to as diagonal or zigzag) to reduce row-to-row differences in resistance (and reduce discontinuities in bandwidth to the touch sensor panel). It may have an S-shaped pattern. In some examples, the interconnections between the routing traces and the row electrodes may have a diagonal pattern in which the top and bottom rows resemble an S-shaped pattern and the middle rows route a border region outside the region of the two-dimensional array of touch nodes. It can have a hybrid pattern that can have. A hybrid pattern may provide increased use of routing tracks for longer routing traces (eg, furthest from the sensing circuitry).

In some examples, differential sense routing can be implemented to reduce cross coupling within the touch sensor panel. For example, routing traces for row electrodes used for differential measurement can be routed in pairs such that cross-coupling becomes common mode and cancels out in differential measurement. In some examples, staggering the differential drive signals can reduce parasitic signal loss for differential drive and sense measurements. For example, rather than applying complementary drive signals to different touch nodes within a column, complementary drive signals may be applied in an adjacent column. In some examples, complementary driving signals may be applied to diagonally adjacent touch nodes.

In some examples, routing traces for a touch sensor panel can be implemented (at least partially) in the active area. In some examples, the touch electrodes and routing traces can be implemented using a metal mesh in a first metal layer and using bridges in a second metal layer to interconnect conductive segments of the metal mesh forming the touch electrodes. there is. In some examples, the touch electrodes can be implemented using a metal mesh in a first metal layer and bridges in a second metal layer to interconnect conductive segments of the metal mesh forming the touch electrodes, wherein the routing traces form the first metal layer. It can be implemented using a metal mesh for the metal layer and a metal mesh for the second metal layer. In some examples, the touch electrodes and/or routing traces can be implemented using a metal mesh for the first metal layer and a metal mesh for the second metal layer.

In some examples, portions of the metal mesh for the touch electrode and/or routing trace overlap and are parallel between the first metal layer and the second metal layer. In some instances, overlapping and parallel portions may be aligned to improve optical performance. In some examples, to improve optical performance, the width of the metal mesh in the first layer can be wider than the width of the metal mesh in the second layer for overlapping and parallel portions. In some examples, to improve optical performance, the metal mesh in the first metal layer and the metal mesh in the second metal layer for the touch electrode may be non-parallel (eg, orthogonal) such that the overlapping portions are It may have a substantially uniform area (eg, within a threshold such as 2 square micrometers or 1.5 square micrometers) across the touch electrode.

In some examples, to improve SNR and touch sensor panel bandwidth, a dielectric layer between the first metal layer and the second metal layer can reduce capacitive coupling (eg, parallel plate capacitance) therebetween. . For example, the dielectric layer can have an increased thickness and/or a reduced dielectric constant to reduce capacitive coupling. In some examples, to improve SNR and touch sensor panel bandwidth, the metal mesh in the first metal layer is a transparent conductive electrically coupled to the metal mesh (optionally separated from the first metal layer by a dielectric layer) It may be flooded, filled, or otherwise reinforced with material.

In some examples, to reduce crosstalk in a non-differential mode of operation (eg, stylus or self-capacitance), the routing traces are touch implemented in the first metal layer (and optionally also in the second metal layer). It may be disposed in the second metal layer below the electrodes. In some examples, to reduce crosstalk and improve SNR and touch sensor panel bandwidth in a non-differential operating mode, the metal mesh for the touch electrodes in the first metal layer is a transparent conductive material in the first metal layer. Without flooding, filling, or otherwise augmenting the metal mesh for routing, it may be flooded, filled, or otherwise augmented with a transparent conductive material that is electrically coupled to the metal mesh. In some examples, the first metal layer can be flooded with a transparent conductive material, and the transparent conductive material can be etched from routing traces in the first metal layer.

In some examples, a touch electrode architecture for differential driving without differential sensing can be implemented. Differential driving can still reduce touch-to-display noise. A touch electrode architecture for differential drive can simplify touch electrode architecture design because fewer routing traces and fewer bridges are required compared to some of the differential drive and differential sensing touch electrode architectures described herein. there is.

In some examples, one or more touch nodes in the touch electrode architecture each include a differential pair of row electrodes and a differential pair of column electrodes. For example, the touch node may include a portion of the first row electrode Rx0+ and a portion of the second row electrode Rx0− (eg, corresponding to differential inputs for sensing touch), and the first column electrode Tx0+. ) and a portion of the second column electrode Tx0− (eg, corresponding to differential and complementary outputs of touch driving). The arrangement of the first and second row electrodes and the first and second column electrodes may result in two dominant mutual capacitances that are in phase. Additionally, because the touch node includes first and second row electrodes and portions of first and second column electrodes, differential cancellation occurs on a per touch node basis rather than across two touch nodes. Additionally, non-dominant (collateral) parasitic capacitance can be reduced by reducing routing lengths and increasing the separation between electrodes that creates parasitic mutual capacitance.

In some examples, the touch electrode architecture includes fully differentially interleaved row and column electrodes within a touch node. In some examples, a touch electrode architecture that is differential for row (or column) electrodes and pseudodifferential for column (or row) electrodes.

In some examples, common mode noise may be reduced using spatial separation and spatial filtering. Spatial separation between the touch signal and the common mode noise signal can be achieved using a touch electrode architecture with reduced pitch for the transmitter and receiver electrodes.

1A-1E illustrate example systems that may include a touch screen according to examples of the present disclosure. 1A illustrates an example mobile phone 136 that includes a touch screen 124 according to examples of the present disclosure. 1B illustrates an example digital media player 140 that includes a touch screen 126 according to examples of the present disclosure. 1C illustrates an example personal computer 144 that includes a touch screen 128 according to examples of the present disclosure. 1D illustrates an example tablet computing device 148 that includes a touch screen 130 according to examples of the present disclosure. 1E illustrates an example wearable device 150 that includes a touch screen 132 according to examples of the present disclosure and can be attached to a user using a strap 152 . It is understood that touch screens may be implemented in other devices as well.

In some examples, touch screens 124, 126, 128, 130, 132 may be based on self-capacitance. A self-capacitance based touch system includes a matrix of small discrete plates of conductive material or groups of discrete plates of conductive material with touch electrodes or touch node electrodes (as described below with reference to FIG. 4B). It can form larger conductive regions that can be referred to as For example, a touch screen may include a plurality of individual touch electrodes, each touch electrode identifying or representing a unique location (eg, touch node) on the touch screen where a touch or proximity is to be sensed, and each touch node The electrode is electrically isolated from other touch node electrodes in the touch screen/panel. Although such a touch screen may be referred to as a pixelated self-capacitance touch screen, in some examples the touch node electrodes on the touch screen may be used to perform a scan other than a self-capacitance scan (e.g., a mutual capacitance scan) on the touch screen. It is understood that there is During operation, the touch node electrode may be stimulated with an alternating current (AC) waveform, and the self-capacitance of the touch node electrode to ground may be measured. As an object approaches the touch node electrode, the self-capacitance of the touch node electrode to ground may change (eg, may increase). This change in the self-capacitance of the touch node electrode can be detected and measured by the touch sensing system to determine the positions of multiple objects as they touch or come close to the touch screen. In some examples, touch node electrodes of a self-capacitance based touch system can be formed from rows and columns of conductive material, and similar to above, a change in self-capacitance of the rows and columns relative to ground can be detected. In some examples, the touch screen can be multi-touch, single-touch, projection scan, full-imaging multi-touch, capacitive touch, and the like.

In some examples, touch screens 124, 126, 128, 130, and 132 may be based on mutual capacitance. A mutual capacitance based touch system is arranged as drive and sense lines that can cross each other on different layers (in a double-sided configuration) or can be adjacent to each other on the same layer (eg, as described below with reference to FIG. 4A). electrodes may be included. Intersecting or adjacent locations may form touch nodes. During operation, the drive line may be stimulated with an AC waveform, and the mutual capacitance of the touch node may be measured. As the object approaches the touch node, the mutual capacitance of the touch node may change (eg decrease). This change in the mutual capacitance of the touch node can be detected and measured by the touch sensing system to determine the positions of multiple objects as they touch or come close to the touch screen. As described herein, in some examples, a mutual capacitance based touch system can form touch nodes from a matrix of small discrete plates of conductive material.

In some examples, touch screens 124, 126, 128, 130, 132 may be based on mutual capacitance and/or self-capacitance. The electrodes can be used as a matrix of small discrete plates of conductive material (e.g., as in touch node electrodes 408 in touch screen 402 in FIG. 4B), or as a row touch (e.g., in touch screen 400 in FIG. 4A). as drive lines and sense lines (as in electrodes 404 and column touch electrodes 406), or in another pattern. The electrodes may be configurable for mutual capacitance or self-capacitance sensing or a combination of mutual capacitance sensing and self-capacitance sensing. For example, in one mode of operation the electrodes can be configured to sense mutual capacitance between the electrodes and in a different mode of operation the electrodes can be configured to sense the self-capacitance of the electrodes. In some examples, some of the electrodes can be configured to sense a mutual capacitance therebetween, and some of the electrodes can be configured to sense a self-capacitance thereof.

2 illustrates an example computing system including a touch screen according to examples of the present disclosure. Computing system 200 may be, for example, a mobile phone, tablet, touchpad, portable or desktop computer, portable media player, wearable device, or any mobile or non-mobile computing device including a touch screen or touch sensor panel. may be included in Computing system 200 may include a touch sensing system that includes one or more touch processors 202, peripherals 204, touch controller 206, and touch sensing circuitry (described in more detail below). . Peripherals 204 may include, but are not limited to, random access memory (RAM) or other types of memory or storage, a watchdog timer, and the like. Touch controller 206 may include, but is not limited to, one or more sense channels 208, channel scan logic 210, and driver logic 214. Channel scan logic 210 may access RAM 212, autonomously read data from and provide control to sense channels. In addition, the channel scan logic 210 may include a stimulus signal at various frequencies and/or phases that may be selectively applied to a driving region of the touch sensing circuitry of the touch screen 220, as described in more detail below. 216) to control the driver logic 214. In some examples, touch controller 206, touch processor 202, and peripherals 204 can be integrated into a single application specific integrated circuit (ASIC), and in some examples, can be integrated with touch screen 220 itself. there is.

It should be clear that the architecture shown in FIG. 2 is just one exemplary architecture of a computing system 200, and that a system may have more or fewer components than shown, or a different configuration of components. Should be. In some examples, computing system 200 may include an energy storage device (eg, battery) to provide power supply and/or communication circuitry (eg, cellular, Bluetooth, Wi-Fi, etc.) to provide wired or wireless communication. can include The various components shown in FIG. 2 may be implemented in hardware including one or more signal processing and/or application specific integrated circuits, software, firmware, or any combination thereof.

Computing system 200 may include a host processor 228 for receiving outputs from touch processor 202 and performing tasks based on the outputs. For example, host processor 228 may be coupled to program store 232 and display controller/driver 234 (eg, a liquid crystal display (LCD) driver). Although some examples of the present disclosure may be described with reference to LCD displays, the scope of the present disclosure is not so limited and includes organic LED (OLED), active-matrix organic LED (AMOLED) and passive-matrix organic LED (PMOLED). ) displays, such as light emitting diode (LED) displays. The display driver 234 can provide voltages on the select (eg, gate) lines to each pixel transistor and can provide data signals along the data lines to these same transistors to control the pixel display image. .

The host processor 228 can use the display driver 234 to generate a display image, such as a display image of a user interface (UI), on the touch screen 220, and a touch screen such as a touch input to the displayed UI. Touch processor 202 and touch controller 206 can be used to detect a touch on or near 220 . Touch input includes moving an object such as a cursor or pointer, scrolling or panning, adjusting control settings, opening files or documents, viewing menus, making selections, and executing commands. activating, operating a peripheral device connected to the host device, receiving a phone call, placing a phone call, ending a phone call, changing the volume or audio settings, addresses, frequently dialed numbers, storing information related to telephony, such as received and missed calls; logging into a computer or computer network; allowing authorized individuals access to restricted areas of a computer or computer network; This may include, but is not limited to, loading a user profile associated with an array of preferences, allowing access to web content, launching a particular program, encrypting or decoding a message, and the like. It can be used by computer programs stored in program store 232 to perform actions. Host processor 228 may also perform additional functions that may not be related to touch processing.

One or more of the functions described herein may be stored in memory (e.g., one of peripherals 204 in FIG. 2) and executed by touch processor 202, or stored in program storage 232 and performed by a host processor. Note that it may be performed by firmware executed by (228). Firmware may also include an instruction execution system, apparatus, or instruction execution system, apparatus, or computer-based system, processor-containing system, or other system capable of fetching instructions from and executing instructions. stored in and/or transmitted in any non-transitory computer-readable storage medium for use by or in connection with a device. In the context of this specification, a "non-transitory computer-readable storage medium" is any medium (other than signals) that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. can In some examples, RAM 212 or program storage 232 (or both) may be a non-transitory computer-readable storage medium. One or both of RAM 212 and program storage 232, when executed by touch processor 202 or host processor 228 or both, allows a device including computing system 200 to implement the present disclosure. It may have stored therein instructions that may cause one or more functions and methods of one or more examples of to be performed. Computer-readable storage media include electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus or devices, portable computer diskettes (magnetic), random access memory (RAM) (magnetic), read-only memory (ROM) (magnetic). , removable programmable read-only memory (EPROM) (magnetic), portable optical discs such as CDs, CD-Rs, CD-RWs, DVDs, DVD-Rs, or DVD-RWs, or compact flash cards, secure digital cards, USB memory devices, flash memories such as memory sticks, etc. may be included, but are not limited thereto.

Firmware may also be performed by an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system capable of fetching instructions from and executing instructions. or within any transmission medium for use in connection therewith. In the context of this specification, a “transmission medium” may be any medium capable of conveying, propagating, or transporting a program for use by or in connection with an instruction execution system, apparatus, or device. Transmission media may include, but are not limited to, wired or wireless propagation media of electronic, magnetic, optical, electromagnetic, or infrared.

Touch screen 220 may be used to derive touch information at multiple distinct locations on the touch screen, referred to herein as touch nodes. The touch screen 220 may include touch sensing circuitry that may include a capacitive sensing medium having a plurality of drive lines 222 and a plurality of sense lines 223 . The term "lines" is sometimes used herein to mean paths of simple conduction, and includes, but is not limited to strictly linear elements, paths that change direction, as will be readily understood by those skilled in the art; It should be noted that it includes paths of different sizes, shapes, materials, etc. Drive lines 222 can be driven by excitation signals 216 from driver logic 214 via drive interface 224, resulting sense signals 217 generated on sense lines 223. ) can be sent to sense channels 208 in touch controller 206 via sense interface 225 . In this way, drive lines and sense lines can be part of touch sensing circuitry that can interact to form capacitive sensing nodes, which can be considered as touch pixels (touch pixels) and herein may be referred to as touch nodes such as touch nodes 226 and 227 in . This understanding can be particularly useful when touch screen 220 appears to capture an “image” of a touch (“touch image”). In other words, after the touch controller 206 determines whether a touch has been detected at each of the touch nodes within the touch screen, the pattern of touch nodes within the touch screen where the touch occurred is an “image” of the touch (e.g., pattern of fingers touching the touch screen). As used herein, an electrical component “coupled” to or “connected to” another electrical component encompasses a direct or indirect connection that provides an electrical path for communication or operation between the coupled components. Thus, for example, drive lines 222 can be directly connected to driver logic 214 or indirectly connected to drive logic 214 via drive interface 224, and sense lines 223 can be connected to a sense channel. 208 or indirectly to the sense channels 208 through the sense interface 225 . In either case, an electrical path may be provided for driving and/or sensing the touch nodes.

FIG. 3A illustrates an example touch sensor circuit 300 corresponding to the touch node electrode 302 and the self-capacitance measure of the sensing circuit 314 according to examples of the present disclosure. The touch node electrode 302 may correspond to the touch electrode 404 or 406 of the touch screen 400 or the touch node electrode 408 of the touch screen 402 . The touch node electrode 302 can have an inherent self-capacitance to ground associated with it, as well as an additional self-capacitance to ground that forms when an object, such as a finger 305, is in close proximity to or touches the electrode. can have The total self-capacitance of touch node electrode 302 to ground may be shown as capacitance 304 . The touch node electrode 302 may be coupled to the sensing circuit 314 . Sense circuit 314 may include operational amplifier 308, feedback resistor 312 and feedback capacitor 310, although other configurations may be employed. For example, feedback resistor 312 may be replaced by a switched capacitor resistor to minimize parasitic capacitance effects that may be caused by a variable feedback resistor. The touch node electrode 302 may be coupled to an inverting input (-) of the operational amplifier 308 . An AC voltage source 306 (V _ac ) may be coupled to the non-inverting input (+) of operational amplifier 308 . The touch sensor circuit 300 is configured to sense changes (eg, increases) in the total self-capacitance 304 of the touch node electrode 302 induced by a finger or object touching or proximate the touch sensor panel. It can be. Output 320 can be used by the processor to determine the presence of a proximity or touch event, or the output can be input into a separate logic network to determine the presence of a proximity or touch event.

3B illustrates an example touch sensor circuit 350 corresponding to mutual capacitance drive line 322 and sense line 326 and sense circuit 314 according to examples of the present disclosure. Drive line 322 may be stimulated by excitation signal 306 (eg, an AC voltage signal). The excitation signal 306 can be capacitively coupled to the sense line 326 via a mutual capacitance 324 between the drive line 322 and the sense line. When a finger or object 305 approaches the touch node created by the intersection of the drive line 322 and the sense line 326, a mutual capacitance 324 occurs (e.g., the drive line 322 and the finger 305). may be changed (eg, reduced) due to the capacitive coupling represented by capacitance C _FD 311 and capacitance C _FS 313 that may be formed between V and sense line 326 . This change in mutual capacitance 324 can be detected to indicate a touch or proximity event at the touch node, as described herein. A sense signal coupled on sense line 326 may be received by sense circuit 314 . The sensing circuit 314 may include at least one of a feedback resistor 312 and a feedback capacitor 310 and an operational amplifier 308 . 3b illustrates a general case where both resistive and capacitive feedback elements are utilized. A sense signal (referred to as Vin) may be input into an inverting input of operational amplifier 308 and the non-inverting input of the operational amplifier may be coupled to a reference voltage V _ref . Operational amplifier 308 can drive its output with voltage _Vo to keep V _in substantially equal to V _ref , and thus keep V _in constant or substantially grounded. One skilled in the art will understand that equal in this context may include a variance of up to 15%. Thus, the gain of sense circuit 314 composed of resistor 312 and/or capacitor 310 may be primarily a function of the mutual capacitance 324 and the feedback impedance ratio. The output Vo of sense circuit 314 may be filtered by being fed into multiplier 328 and may be heterodyne or homodyne where Vo is multiplied with local oscillator 330 to produce V _detect can do V _detect can be input into filter 332. One skilled in the art will recognize that the placement of filter 332 can be varied; Thus, as shown, a filter may be placed after multiplier 328, or two filters may be employed, one before the multiplier and the other after the multiplier. In some examples, there may be no filter at all. The direct current (DC) portion of V _detect can be used to determine whether a touch or proximity event has occurred. 3A and 3B show that the demodulation in multiplier 328 occurs in the analog domain, the output Vo can be digitized by an analog-to-digital converter (ADC) and blocks 328, 332 and 330 are digitized. (eg, 328 can be a digital demodulator, 332 can be a digital filter, 330 can be a digital Numerical Controlled Oscillator (NCO)).

Referring back to FIG. 2 , in some examples, touch screen 220 may be an integrated touch screen in which touch sensing circuit elements of a touch sensing system may be integrated into display pixel stackups of the display. Circuit elements within touch screen 220 may be, for example, LCD, such as one or more pixel transistors (eg, thin film transistors (TFTs)), gate lines, data lines, pixel electrodes, and common electrodes. Or it may include elements that may exist in other displays (LED display, OLED display, etc.). For a given display pixel, the voltage between the pixel electrode and the common electrode can control the luminance of the display pixel. The voltage on the pixel electrode may be supplied by the data line through the pixel transistor, which may be controlled by the gate line. Note that circuit elements are not limited to entire circuit components, such as an entire capacitor, an entire transistor, etc., but may include portions of circuitry, such as just one of the two plates of a parallel plate capacitor.

4A illustrates a touch screen 400 having touch electrodes 404 and 406 arranged in rows and columns, according to examples of the present disclosure. Specifically, the touch screen 400 may include a plurality of touch electrodes 404 arranged in rows and a plurality of touch electrodes 406 arranged in columns. Touch electrodes 404 and touch electrodes 406 can be on the same or different material layers on touch screen 400 and can cross each other, as shown in FIG. 4A . In some examples, the electrodes may be formed on opposite sides of a (partially or fully) transparent substrate and from a (partially or fully) transparent semiconductor material such as ITO, although other materials are possible. Electrodes displayed on layers on different sides of the substrate may be referred to herein as a double sided sensor. In some examples, touch screen 400 can sense self-capacitance of touch electrodes 404, 406 to detect touch and/or proximity activity on touch screen 400, and in some examples, touch Screen 400 can sense mutual capacitance between touch electrodes 404 and 406 to detect touch and/or proximity activity on touch screen 400 .

4A illustrates touch electrodes 404 and touch electrodes 406 as rectangular electrodes, in some examples other shapes and configurations are possible for the row and column electrodes. For example, in some examples, some or all of the row and column electrodes may be formed from multiple touch electrodes formed on one side of a substrate from (partially or completely) transparent semiconductor material. Touch electrodes in a particular row or column may be interconnected by coupling segments and/or bridges. Row and column electrodes formed in layers on the same side of the substrate may be referred to herein as single sided sensors. As described in more detail below, the row and column electrodes may have other shapes. Additionally, while primarily described in terms of a row-column configuration, it is understood that in some examples the same principles can be applied to a two-axis array of touch nodes in a non-linear arrangement.

4B illustrates a touch screen 402 having touch node electrodes 408 arranged in a pixelated touch node electrode configuration, according to examples of the present disclosure. Specifically, the touch screen 402, as described above, may include a plurality of individual touch node electrodes 408, each touch node electrode detecting a touch or proximity (ie, a touch or proximity event). Identifies or indicates a unique location on the touch screen to be located, and each touch node electrode is electrically isolated from other touch node electrodes in the touch screen/panel. Touch node electrodes 408 may be on the same or different material layers on touch screen 402 . In some examples, touch screen 402 can sense self-capacitance of touch node electrodes 408 to detect touch and/or proximity activity on touch screen 402, and in some examples, touch screen 402 can sense mutual capacitance between touch node electrodes 408 to detect touch and/or proximity activity on touch screen 402 .

In some examples, some or all of the touch electrodes of the touch screen may be formed from a metal mesh in one or more layers. 5 illustrates an example touch screen stackup including a metal mesh layer, in accordance with examples of the present disclosure. Touch screen 500 may include a substrate 509 (eg, a printed circuit board) on which display components 508 (eg, LEDs or other light emitting components and circuitry) are mounted. It can be. In some examples, display components 508 can be partially or fully embedded within substrate 509 (eg, components can be disposed in recesses in the substrate). Substrate 509 may include routing traces in one or more layers to route display components (eg, LEDs) to display drive circuitry (eg, display driver 234 ). The stack-up of touch screen 500 may also include one or more passivation layers deposited over display components 508 . For example, the stack-up of the touch screen 500 illustrated in FIG. 5 is an intermediate layer/passivation layer 507 (eg, transparent epoxy) between the first metal layer 516 and the second metal layer 506. , and a passivation layer 517 . Passivation layers 507 and 517 may planarize the surface for the respective metal mesh layers. Additionally, passivation layers can provide electrical isolation (eg, between metal mesh layers and between LEDs and a metal mesh layer). A metal mesh layer 516 (eg, copper, silver, etc.) may be deposited on the planarized surface of the passivation layer 517 over the display components 508, and the metal mesh layer 506 (eg, eg, copper, silver, etc.) may be deposited on the planarized surface of the passivation layer 507 . In some examples, passivation layer 517 may include a material to encapsulate display components to protect them from corrosion or other environmental exposure. Metal mesh layer 506 and/or metal mesh layer 516 may include a pattern of conductive material in a mesh pattern. In some examples, metal mesh layer 506 and metal mesh layer 516 may be coupled by one or more vias (eg, through interlayer/passivation layer 507 ). Additionally, although not shown in FIG. 5 , the border region around the display active area may include metallization (or other conductive material), which may or may not be a metal mesh pattern. In some examples, the metal mesh is formed of an opaque material, but the metal mesh wires are thin and sparse enough to appear transparent to the human eye. Touch electrodes (and some routing) as described herein may be formed from parts of the metal mesh in the metal mesh layer(s). In some examples, the polarizer 504 can be disposed over the metal mesh layer 506 (optionally another planarization layer is disposed over the metal mesh layer 506). A cover glass (or front crystal) 502 may be disposed over the polarizer 504 to form the outer surface of the touch screen 500 . Although two metal mesh layers (and two corresponding planarization layers) are illustrated, it is understood that more or fewer metal mesh layers (and corresponding planarization layers) may be implemented in some examples. Additionally, in some examples, display components 508, substrate 509, and/or passivation layer 517 may be replaced with a thin film transistor (TFT) LCD display (or other types of displays) in some examples. It is understood that It is also understood that polarizer 504 can include one or more transparent layers including a polarizer, adhesive layers (eg, optically clear adhesive), and protective layers.

As described herein, in some examples, touch electrodes of a touch screen can be differentially driven and/or differentially sensed. Differential drive and differential sensing can reduce noise within the touch screen's touch and/or display systems that can occur due to the proximity of the touch system to the display system. For example, a touch screen may be partially or wholly disposed over a display (e.g., a touch sensor panel laminated to a display, or otherwise incorporated on or into a display stack-up), or otherwise touch proximate to a display. electrodes may be included. For example, touch electrodes (eg, formed of a metal mesh) can capacitively couple with display electrodes (eg, cathode electrodes), which can cause a display operation that injects noise into the touch electrodes. (e.g. degrades touch sensing performance). Additionally, touch actions (eg, stimulating the touch electrodes) may cause noise injection into the display (eg, cause image artifacts). Differential drive and differential sensing can cause most of the noise coupled into the sensing circuitry due to the display to be common mode and the common mode noise can be rejected by the differential sensing circuitry. Likewise, differential drive can reduce the local imbalance on the display electrodes from the touch electrodes. Thus, differential driving may allow the cathode of the display to protect the display from touch operations, which may lower noise injected into the display system (and/or increase amplification of drive signals compared to non-differential driving schemes). may allow more headroom for processing).

As described herein, differential driving simultaneously drives a first one of the two driving electrodes with a first stimulation signal (eg, a sine wave, an inverted square wave, etc.) ) and a second stimulus signal having a phase difference of 180 degrees, which refers to driving a second driving electrode among two driving electrodes. In some examples, the first and second excitation signals may be driven by a differential drive circuit. In some examples, the first and second excitation signals may be driven by two single-ended driving circuits. Differential driving is such that for N simultaneously driven drive electrodes, half of the drive electrodes can be simultaneously driven with a first set of stimulation signals and the other half of the drive electrodes can be driven with stimulation signals complementary to the first set. It can be extended for more than two drive electrodes so that a second set (eg, an inverted version of the first set) can be driven simultaneously. As described herein, differential sensing refers to sensing the two sensing electrodes differentially. For example, a first sensing electrode of the two sensing electrodes may be input to a first terminal of the differential amplifier (eg, an inverting input) and a second sensing electrode of the two sensing electrodes may be input to a second terminal of the differential amplifier (eg, an inverting input). For example, a non-inverting input) may be input. In some examples, differential sensing may be implemented with two single-ended amplifiers (e.g., sense circuit 314), each sensing one sensing electrode, and two ADCs of the two single-ended amplifiers. It is configured to convert the outputs into digital outputs. A differential may be computed (eg, in the analog or digital domain) between the digital outputs of the two amplifiers. In some examples, using differential amplifiers (rather than two single-ended amplifiers) can provide improved input-referred noise for the differential of the signal (common-mode noise rejection and reduced dynamic range). In some examples, using single-ended amplifiers (rather than a differential amplifier) can provide an output representative of common mode noise that can be useful in the system.

6A illustrates a symbolic representation of a touch sensor panel implementing differential sensing, in accordance with examples of the present disclosure. 6A shows a touch sensor panel including row electrodes 602A-602D (also referred to as drive electrodes or lines) and column electrodes 604A-604H (also referred to as sense electrodes or lines). (600) is exemplified. Touch sensor panel 600 also includes drive circuitry configured to drive row electrodes 602A-602D (eg, drivers/transmitters 606A-606D, which may correspond to driver logic 214) and column electrodes. and sensing circuitry configured to sense 604A through 604H (eg, differential amplifiers 608A through 608D, which may correspond to some of the sense channels 208 ). Although the terms "row" and "column" may be used throughout this disclosure with drawings showing row and column arrangements, these terms are used for convenience of explanation and actual orientations are interchangeable according to examples of the disclosure. You have to understand that it can be.

In particular, touch sensor panel 600 illustrates a touch sensor panel with four row electrodes 602A-602D and eight column electrodes 604A-604H. Each driver/transmitter 606A-606D can be coupled to a respective row electrode of row electrodes 602A-602D (e.g., driver/transmitter 606A can be coupled to row electrode 602A). , driver/transmitter 606B may be coupled to row electrode 602B, etc.). Each differential amplifier 608A-608D may be coupled to a respective pair of column electrodes 604A-604H (eg, differential amplifier 608A may be coupled to column electrodes 604A and 604B , differential amplifier 608B may be coupled to column electrodes 604C and 604D, etc.). Differential amplifiers 608A-608D may each include common mode feedback circuitry (eg, including resistive and/or capacitive circuit elements) to hold the inputs to a virtual ground. A first column electrode of each pair of column electrodes may be coupled to an inverting terminal of a corresponding differential amplifier, and a second column electrode of each pair of column electrodes may be coupled to a non-inverting terminal of a corresponding differential amplifier. It can be.

은 행 전극(602A)과 열 전극(604A) 사이에 형성될 수 있고 제2 상호 커패시턴스,

는 행 전극(602A)과 열 전극(604B) 사이에 형성될 수 있다. 그러나, 도 6a에 나타난 바와 같이, 행 전극들 및 열 전극들의 교차부들(또는 인접부들) 중 일부에서의 전도성 재료의 양은 다른 행 전극들의 교차부들(또는 인접부들)에서의 전도성 재료의 양보다 작을 수 있다. 예를 들어, 도 6a에 나타난 바와 같이, 행 전극(602A)과 열 전극(604A)의 교차부에서의 전도성 재료의 양은 행 전극(602A) 및 열 전극(604B)의 교차부에서의 전도성 재료의 양보다 적을 수 있다. 결과적으로, 전자의 상호 커패시턴스(정전기 프린지 필드)는 후자에 대하여 상대적으로 무시할 수 있어서, 일부 예들에서 전자의 상호 커패시턴스가 본질적으로 무시될 수 있도록 할 수 있다. (일부 예들에서, 상대적으로 무시할만한 커패시턴스는 행 및 열 전극들의 소정 부분들 및 또는 행 및 열 전극들의 전기적으로 격리하는 소정 부분들 사이의 거리를 증가시킴으로써 감소될 수 있다.) 예를 들어, 행 전극(602A)과 열 전극(604A) 사이의 상호 커패시턴스(

)는 행 전극(602A)과 열 전극(604B) 사이의 상호 커패시턴스(

) 또는 행 전극(602B)과 열 전극(604A)의 상호 커패시턴스(

)와 비교하여 상대적으로 작을 수 있다.The touch sensor panel 600 can be driven and sensed to detect 16 capacitance values. Technically, a mutual capacitance (electrostatic fringe field) may be formed between the intersection (or adjacent portion) of each row electrode and each column electrode. For example, the first mutual capacitance,

A second mutual capacitance which may be formed between the row electrode 602A and the column electrode 604A,

may be formed between the row electrode 602A and the column electrode 604B. However, as shown in FIG. 6A, the amount of conductive material at some of the intersections (or adjoining portions) of the row and column electrodes may be less than the amount of conductive material at the intersections (or adjoining portions) of other row electrodes. can For example, as shown in FIG. 6A , the amount of conductive material at the intersection of row electrode 602A and column electrode 604A is the amount of conductive material at the intersection of row electrode 602A and column electrode 604B. may be less than the amount. As a result, the mutual capacitance of the former (electrostatic fringe field) can be relatively negligible for the latter, making the mutual capacitance of the former essentially negligible in some instances. (In some examples, the relatively negligible capacitance can be reduced by increasing the distance between certain portions of the row and column electrodes and or electrically isolating portions of the row and column electrodes.) For example, a row Mutual capacitance between electrode 602A and column electrode 604A (

) is the mutual capacitance between the row electrode 602A and the column electrode 604B (

) or the mutual capacitance of the row electrode 602B and the column electrode 604A (

) may be relatively small compared to

For each driver and each differential sense amplifier in FIG. 6A, one of the mutual capacitances may be the dominant (or primary) mutual capacitance, and one of the mutual capacitances may be a minor mutual capacitance (mutual capacitance/static fringe field is may be a function of the amount of conductive material and the arrangement of the conductive material). In some examples, the dominant mutual capacitance may correspond to a fringe field coupling above a threshold (e.g., greater than 80%, 85%, 90%, 95%, etc.) for each driver/differential amplifier, and the incidental mutual capacitance is each may correspond to a fringe field coupling below the threshold (eg, less than 20%, 15%, 10%, 5%, etc.) for a driver/differential amplifier of . Thus, the 16 values measured for the touch sensor panel 600 may indicate dominant mutual capacitances due to the pattern of conductive material for the row electrodes and column electrodes. For example, C ₀ can represent the dominant mutual capacitance between row electrode 602A and column electrode 604B, and C ₁ can represent the dominant mutual capacitance between row electrode 602B and column electrode 604A. , C ₂ can represent a dominant mutual capacitance between row electrode 602C and column electrode 604B, and C ₃ can represent a dominant mutual capacitance between row electrode 602D and column electrode 604A. Each of these dominant mutual capacitances may represent an effective touch node for the touch sensor panel. In some examples, an “effective touch node” described herein may alternatively be referred to as a “touch node” because it may indicate a dominant mutual capacitance for an area of the touch sensor panel.

,

,

,

)과 공간적으로 교번할 수 있다. 나머지 구동기들/행 전극들에 대하여, 지배적 및 부수적 커패시턴스들은 또한 공간적으로 교번할 수 있다. 차동 증폭기(608A)의 반전 단자/열 전극(604B)에 대하여, 지배적 커패시턴스들(C₀, C₂)(행 전극(602A, 602C) 및 대응하는 구동기(606A, 606C)로 형성됨)은 부수적 커패시턴스들(

,

)과 공간적으로 교번할 수 있다. 차동 증폭기(608A)의 비-반전 단자/열 전극(604A)에 대하여, 지배적 커패시턴스들(C₁, C₃)(행 전극(602B, 602D) 및 대응하는 구동기(606B, 606D)로 형성됨)은 부수적 커패시턴스들(

,

)과 공간적으로 교번할 수 있다. 나머지 차동 증폭기/열 전극들에 대하여, 지배적 및 부수적 커패시턴스들은 또한 공간적으로 교번할 수 있다.The dominant mutual capacitance (relatively high electrostatic fringe field) and secondary mutual capacitances (relatively low electrostatic fringe field) may, in some examples, spatially alternate. Spatially alternating may appear along one or both dimensions. For example, for driver 606A/row electrode 602A, the dominant capacitances C ₀ , C ₄ , C ₈ , C ₁₂ (column electrodes 604B, 604D, 604F, 604H) and differential amplifiers ( formed by the inverting terminals of 608A to 608D) are incidental capacitances (

,

,

,

) and spatially alternating. For the remaining drivers/row electrodes, the dominant and secondary capacitances may also spatially alternate. For inverting terminal/column electrode 604B of differential amplifier 608A, the dominant capacitances C ₀ , C ₂ (formed by row electrodes 602A, 602C and corresponding drivers 606A, 606C) are incidental capacitance field(

,

) and spatially alternating. For non-inverting terminal/column electrode 604A of differential amplifier 608A, the dominant capacitances C ₁ and C ₃ (formed by row electrodes 602B and 602D and corresponding drivers 606B and 606D) are Incidental capacitances (

,

) and spatially alternating. For the remaining differential amplifier/column electrodes, the dominant and secondary capacitances may also spatially alternate.

During operation, row electrodes 602A through 602D may be stimulated with multiple stimulation patterns of drive signals H0 through H3, and column electrodes 604A through 604D may be stimulated using differential amplifiers 608A through 608D. can be detected differentially. For example, the multi-stimulus pattern is a Hadamard matrix applied to a common excitation signal (e.g. sine wave, square wave, etc.) to encode the drive signals (e.g., "1" and 4x4 matrix containing "-1" values). A multi-stimulus pattern may allow the dominant mutual capacitances to be measured and decoded based on the multi-stimulus drive pattern. Differential sensing of the column electrodes can remove common mode noise from touch measurements. Although the touch sensor panel 600 includes 16 dominant capacitance values (e.g., corresponding to 16 touch nodes in a 4x4 array), the touch sensor panel can be scaled up or down to include fewer or more touch nodes. You have to understand that there are

In some examples, to improve signal-to-noise ratio (SNR) by reducing noise, touch sensor panel 600 may be modified to implement differential drive. For example, instead of implementing one drive line per row of valid touch nodes, two drive lines per row of valid touch nodes may be used. 6B illustrates a symbolic representation of a touch sensor panel implementing differential driving and differential sensing, in accordance with examples of the present disclosure. 6B shows a touch sensor that includes row electrodes 602A to 602D and row electrodes 602A' to 602D' (eight row electrodes) and column electrodes 604A to 604H (eight column electrodes). Panel 510 is illustrated. The touch sensor panel 600 also includes drive circuitry configured to drive the row electrodes 602A-602D, 602A'-602D' (eg, drivers/transmitters 606A-606D) and drivers/transmitters 606A'. through 606D') and sensing circuitry (eg, differential amplifiers 608A through 608D) configured to sense the column electrodes 604A through 604H.

Each driver/transmitter 606A through 606D, 606A' through 606D' may be coupled to a respective row electrode of row electrodes 602A through 602D, 602A' through 602D', and each differential amplifier 608A through 602D' 608D) may be coupled to each pair of column electrodes 604A-604H. Despite doubling the row electrodes compared to touch sensor panel 600, touch sensor panel 510 can be driven and sensed to detect 16 dominant mutual capacitance values (some row electrodes in FIG. 6A). represented by the relatively large amount of conductive material in the field and column electrodes). The 16 dominant mutual capacitance values may represent a 4x4 array of touch nodes for the touch sensor panel. During operation, row electrodes 602A to 602D and row electrodes 602A' to 602D' may be stimulated with multiple stimulation patterns of drive signals H0 to H3, H0' to H3', and the column electrodes 604A through 604D may be differentially sensed using differential amplifiers 608A through 608D. In some examples, the multi-stimulus pattern is two orthogonal Hadamard matrices (e.g., "1" indexed to driver and drive stage) applied to a common stimulus signal (e.g., sinusoidal, square wave, etc.) to encode the drive signals. and each 4x4 matrix containing "-1" values). In some examples, the multi-stimulus pattern can be one Hadamard matrix and its complementary signals (180 degrees out of phase) applied to a common stimulus signal (eg, sinusoidal, square wave, etc.) to encode the drive signals. A multi-stimulus pattern may allow the dominant mutual capacitances to be measured and decoded based on the multi-stimulus drive pattern. Differential sensing of the column electrodes can remove common mode noise from touch measurements. It is understood that although the touch sensor panel 510 includes 16 dominant capacitance values (eg, corresponding to 16 touch nodes), the touch sensor panel can be scaled up or down to include fewer or more touch nodes. It should be.

As described with respect to FIG. 6A , the dominant mutual capacitance (relatively high electrostatic fringe field) and secondary mutual capacitances (relatively low electrostatic fringe field) can be spatially patterned, in FIG. 6B . In some examples, spatial alternation can occur along one or both dimensions. For example, for driver 606A/row electrode 602A, dominant capacitances may be formed at intersections with column electrodes 604B and 604F, and minor capacitances may be formed at column electrodes 604A, 604C to 604E. , 604G, 604H) are formed at the remaining intersections. In a similar manner, driver 606B/row electrode 602A′, dominant capacitances may be formed at intersections with column electrodes 604D, 604H, and incidental capacitances may be formed at column electrodes 604A to 604C, 604E to 604H. 604G) is formed at the remaining intersections. The spatial pattern of dominant and minor capacitances can be repeated for the remaining rows. For inverting terminal/column electrode 604B of differential amplifier 608A, dominant capacitances C ₀ and C ₂ will be formed at intersections with row electrodes 602A and 602C and corresponding drivers 606A and 606C. may be formed, and incidental capacitances may be formed at the remaining intersections for column 604B. For non-inverting terminal/column electrode 604A of differential amplifier 608A, dominant capacitances C ₁ and C ₃ may form at intersections with row electrodes 602B and 602D, and minor capacitances may be formed at the remaining intersections for the column electrode 604A. The spatial pattern of dominant and minor capacitances can be repeated for the remaining columns. Accordingly, along the rows and along the columns, the dominant capacitances can be spatially separated from each other by three subsidiary capacitances in the spatial pattern of FIG. 6B.

7A illustrates a portion of a touch sensor panel that can be used to implement differential driving and/or differential sensing, according to examples of the present disclosure. The touch sensor panel 700 may have mutual capacitance/electrostatic fringe field coupling with a spatial pattern, in a manner similar to that described above with respect to FIG. 5B. 7A illustrates a touch sensor panel 700 that includes row electrodes 702A-702F and column electrodes 704A-704F. Touch sensor panel 700 also includes drive circuitry configured to drive column electrodes 704A-704F (e.g., drivers/transmitters or drivers/transmitters 606A-606D′, which may correspond to driver logic 214) and sense circuitry configured to sense row electrodes 702A-702F (eg, differential amplifiers or differential amplifiers 608A-608D including common mode feedback circuits that may correspond to a portion of sense channels 208). can include In particular, FIG. 7A illustrates a touch sensor panel 700 with six row electrodes 702A-602F and six column electrodes 704A-704F. Each driver/transmitter can be coupled to a respective column electrode of column electrodes 704A through 704F, and each differential amplifier can be coupled to a respective pair of row electrodes 702A through 702F. A first row electrode of each pair of row electrodes may be coupled to an inverting terminal of a corresponding differential amplifier, and a second row electrode of each pair of row electrodes may be coupled to a non-inverting terminal of a corresponding differential amplifier. It can be. For simplicity of illustration, FIG. 7A illustrates differential driver 706 configured to output complementary drive signals D0+ and D0- to routing traces for column electrodes 704A-704B, but with an additional column electrode It should be understood that additional drivers may be included to drive the . Similarly, for simplicity of illustration, FIG. 7A illustrates a differential amplifier 708 (or 708') configured to differential sense and receive signals from the routing traces for row electrodes 702A and 702B, but with an additional row electrode It should be understood that additional receivers may be included to detect the

Column electrodes 704A-704F may include multiple conductive segments interconnected by routing. For example, column electrode 704A connects two conductive segments (eg, each having an “H” shape) forming effective touch nodes of touch sensor panel 700 that are connected by routing such as routing 705A. include Similarly, row electrodes 702A-702F may include multiple conductive segments interconnected by routing. For example, the row electrodes 702A form effective touch nodes of the touch sensor panel 700 that are connected by routing such as routing 702A"' (e.g., a rectangular shape with an "H" shaped cutout). shaped) conductive segments 702A', 702A". In some examples, as illustrated in FIG. 7A , sensing electrodes are adjacent such that multiple segments 702A′, 702A″ and routing traces 702A″′ can be considered a single row electrode. Similar shading is used for the row electrode pairs in each row and similar shading is used for the column electrodes in each row and optional rows, but these shadings are for ease of illustration and necessarily indicate that the electrodes are coupled to each other. understand that it is not For example, each row electrode can be electrically isolated and coupled to a different input of the sensing circuitry. The column electrodes in alternating rows may be electrically connected, but each column of column electrodes may be coupled to different outputs of the stimulation circuitry.

The touch sensor panel 700 can be seen to include a two-dimensional array (three rows and three columns) of valid touch nodes. Each effective touch node of the touch sensor panel 700 may measure a capacitance dominated by the capacitance between the conductive segments of each row and column electrodes (formed from interdigitated conductive segments). For example, the mutual capacitance between the segment 702A′ of the row electrode 702A and the top segment of the column electrode 704A is at the effective touch node corresponding to the area of column 1 and row 1 of the touch sensor panel 700. may be dominant. Capacitive contributions of routing portions of adjacent row or column electrodes may form negligible incidental mutual capacitances in comparison (e.g., row electrode 702A from routing portion 705A or 705B of column electrode 704A or 704B). contribution to segment 702A' of). As a result of the patterning of the row and column electrodes, the dominant/collateral mutual capacitance/electrostatic fringe field coupling can be spatially patterned as described herein. For example, column electrode 704A can be predominantly coupled with row electrodes 702A and 702E and incidentally coupled to row electrodes 702B, 702C, 702D and 702F. Row electrode 702A may be predominantly coupled with column electrodes 704A and 704E and incidentally coupled to column electrodes 704B, 704C, 704D and 704F. The spatial pattern of dominant/collateral mutual capacitance/electrostatic fringe field coupling can be continued in a similar manner. It should be noted that the size of the routing may be exaggerated for illustrative purposes so the routing size for the conductive segments may be much smaller than shown. In some examples, the conductive segments of the row and column electrodes are formed in a common layer (ie, the same layer of the touch sensor panel), eg, the second metal layer 506 . In some examples, the routing of the row and column electrodes can be at least partially formed in a common layer. In some examples, some or all of the routing can be in a different layer, eg, the first metal layer 516 (eg, electrodes allow for electrical isolation with overlapping in the example, and the capacitance at the effective touch nodes depends on further reducing routing's contribution to

As illustrated in FIG. 7A , the touch sensor panel 700 may include three rows and three columns of touch nodes (eg, valid touch nodes). For example, the first column of touch nodes may be formed primarily from conductive segments of row electrodes 702A, 702C, and 702E and conductive segments of column electrodes 704A, 704B. For another example, the second column of touch nodes may be formed primarily from conductive segments of row electrodes 702B, 702D, and 702F and conductive segments of column electrodes 704C, 704D. In a similar manner, the first row of touch nodes may be formed primarily from the conductive segments of row electrodes 702A, 702B and the conductive segments of column electrodes 704A, 704C, 704E. For another example, the second row of touch nodes may be formed primarily from conductive segments of row electrodes 702C and 702D and conductive segments of column electrodes 704B, 704D and 704F.

During operation, drive circuitry coupled to the column electrodes can differentially drive the column electrodes, and differential amplifiers can differentially sense the row electrodes. For example, column electrodes 704A-704F may be stimulated (e.g., simultaneously) with multiple stimulation patterns of complementary drive signals D0+/-, D1+/-, D2+/- over multiple scan steps. can Although a 3x3 array of touch nodes is shown for simplicity of illustration, the array is composed of complementary drive signals (D0+/-, D1+/- D2+/-, D3+/-, eg alternatively D0 to D3, D0 It should be understood that it can be extended to a 4x4 array (or a larger size array) using ' through D3 '). For example, the multi-stimulus pattern includes values of 1 (phase of 0 degrees) and -1 (phase of 180 degrees) applied to a common excitation signal (eg, a sinusoidal wave of frequency f ₁ ) to encode drive signals. It can be a Hadamard matrix, allowing the dominant mutual capacitances to be measured and decoded based on the stimulus drive pattern. For example, for a 4x4 array, D0 to D3 can be represented by the Hadamard matrix:

where each row in the matrix represents a stage of the scan, and each column represents one of the drive signals D0 to D3, so that the values of the matrix are the common stimulus for D0, D1, D2, and D3 at each stage. Indicates the phase applied to the signal. For each drive signal of the multi-stimulation pattern of drive signals, a complementary signal may be applied simultaneously (eg, drive signals D0 to D3 and D0' to D3'). For example, the first row corresponding to the first scan step indicates that the driving signal D0 has a phase of 180 degrees. The driving signal D0 may be differentially applied to the column electrodes 704A and 704B so that the signal applied to the column electrode 704A has a phase difference of 180 degrees from the signal applied to the column electrode 704B. According to the above exemplary Hadamard matrix, the driver/buffer 706 outputs a drive signal with a phase of 0 and a complementary drive signal with a phase of 180 degrees. In a similar manner, two complementary driving signals may be applied to the touch sensor panel for each of the driving signals D0 to D3 in a 4x4 array. Drive signals may be output for the drive lines according to the remaining rows of the Hadamard matrix for the next three scan steps.

Considering an exemplary receiver of differential amplifier 708 (or 708'), for drive signal DO at the touch node for row 1, column 1, column electrode 704B and column electrode 704B by routing trace 705B. Incidental coupling between row electrodes 702A may be relatively small compared to dominant coupling between column electrodes 704A and row electrodes 702A (eg, via fringe field coupling between them). . Dominant coupling can be represented by the capacitance C0 (to row 1, column 1) coupled to the non-inverting (positive) input terminal of differential amplifier 708. Thus, a current proportional to C0 may appear at the output of differential amplifier 708. In a similar manner, for drive signal D1, the dominant coupling between column electrode 704C and row electrode 702B is coupled to the inverting (negative) input terminal of differential amplifier 708 (row 1, column 2), and a current proportional to C1 may appear at the output of differential amplifier 708. Additional dominant couplings for differential amplifier 708 are similar for the remaining columns corresponding to the first row. Thus, the output of the measurement of current by differential amplifier 708 for the first scan step may be proportional to C0-C1-C2-C3 for an array with four columns. Following the same procedure for the remaining 3 steps, the output for the 4 scan steps can be expressed as a vector proportional to:

This vector encoding can be decoded or inverted by a matrix to extract the individual capacitances, but the effective integration time of the overall measurement is as shown by the equation below:

Although FIG. 7A illustrates the drive circuitry as including three differential drivers 706A-706C that output a signal and its complement, it should be understood that other implementations are possible. For example, six separate drivers may be used, where each of the differential drivers outputs a signal or its complement. In some examples, complementary drive signals can be applied to adjacent column electrodes such that the net electrical effect due to the drive signal is zero (or within a threshold of zero) localized to the two column electrodes. For example, adjacent column electrodes 704A, 704B (or 704B, 704C) can be driven with complementary signals to produce a purely zero (or near zero) electrical effect (e.g., coupled to a display system). reducing noise from the ringing touch system). Although applying complementary signals at adjacent electrodes is shown, the net electrical effect may be zero (or within a threshold of zero) for the touch sensor panel, but not zero in localized areas of the touch sensor panel, It is understood that complementary signals may be applied to non-adjacent column electrodes.

A first driving signal and a second driving signal may be applied to each column of touch nodes in the touch sensor panel 700 . For example, column 1 of the touch sensor panel can be driven with a first drive signal on column electrode 704A (applied to two touch nodes in the column of touch nodes) and a second drive on column electrode 704B. It can be driven by a signal (eg applied to two different touch nodes in a column of touch nodes for a 4x4 array). As shown in FIG. 7A , the first drive signal is applied to alternating touch nodes in a column, and the second drive signal is applied to alternating touch nodes in a column.

The row electrodes can be differentially sensed using differential amplifiers. Differential sensing of the row electrodes can remove common mode noise from touch measurements.

For each column, application of complementary signals at adjacent electrodes is shown (e.g., complementary signals D0/D0' are applied to column 1, and complementary signals D1/D1' are applied to column 2). , etc.), a complementary signal is applied to the different column electrodes such that the net electrical effect is zero (or within a threshold of zero) across the localized area touch sensor panel (eg, across diagonal touch nodes) where the net electrical effect is greater. , but it is understood that it may not be purely zero within a column of a touch sensor panel (eg, for adjacent touch nodes). In some examples, cancellation of complementary signals may occur at diagonal touch nodes, as described in more detail with respect to FIGS. 13A and 13B . For example, the drive circuitry can be configured to drive column electrode 704A to D0+, column electrode 704B to D1-, column electrode 704C to D1+ and column electrode 704D to D0-. . As a result, cancellation of transmitted signals can occur in diagonal directions. For example, the cancellation of D0+ and D0- may occur between the transmitter electrode for the touch node in row 1, column 1 and the transmitter electrode for the touch node in row 2, column 2 of the array of FIG. 7A. In a similar manner, the cancellation of D1+ and D1- may occur between the transmitter electrode for the row 1 column 2 touch node and the transmitter electrode for the row 2 column 1 touch node in the array of FIG. 7A. In some examples, due to the increased distance along the diagonal, the diagonal cancellation of the complementary drive signals compared to the sensed signal for the touch sensor panel having the cancellation of the complementary drive signals in the row of touch nodes, the diagonal cancellation of the touching object can cause an increase in the sensed signal in response to (because there is less cancellation of the signal).

Although the touch sensor panel 700 includes a 3x3 array of 9 dominant capacitance values (e.g., corresponding to 9 valid touch nodes), the touch sensor panel may be expanded or reduced to include fewer or more touch nodes. You have to understand that you can. For example, a touch sensor panel can be spanned with a 4x4 array of 16 dominant capacitance values (e.g., corresponding to 16 valid touch nodes), or row electrodes, column electrodes, drivers/transmitters and differential It can be expanded to an 8x8 array of touch nodes (eg, 64 capacitance values for 64 effective touch nodes) by increasing the amplifiers.

Additionally, although differential driving and sensing are described with reference to the touch sensor panel 700 of FIG. 7A , the touch sensor panel 700, in some examples, operates in a non-differential sensing configuration to contact the touch sensor panel 700. or sense a stimulus from a proximate input device (eg, a stylus providing the stimulus). For example, to detect an input device stimulus, the switching circuitry couples the two row electrodes for a row of touch nodes to the same input of a differential amplifier (eg, an inverting input) and to the other input of the differential amplifier (eg, an inverting input). non-inverting input) to ground or another reference potential (e.g., corresponding to the row electrodes detected as one sense line using touch circuitry in the configuration shown in FIG. 3B). In contrast, for differential driving and sensing described herein, the switching circuitry can couple the row electrodes to differential amplifiers (eg, as represented by differential amplifiers 708). For example, switching circuitry (not shown) may optionally be included between the two routing traces for row electrodes 702A, 702B and the corresponding differential amplifier 708. The switching circuitry may include one or more switches including multiplexer(s) and/or switch(s) that may be controlled by a mode select input. In the differential drive/sense mode of operation, the switching circuitry can couple row electrode 702A to the non-inverting terminal (and decouple row electrode 702A from the inverting terminal) and row electrode 702B can may be coupled to the inverting terminal of differential amplifier 708. In a non-differential sensing configuration that senses a stimulus from an input device (eg, stylus), row electrode 702A and row electrode 702B can be coupled to the inverting terminal of differential amplifier 708, and differential amplifier 708 The non-inverting terminal of ) may be coupled to ground (or virtual ground) using switching circuitry. In some examples, for non-differential operation, the column electrodes in each column may use the same phase excitation signals rather than complementary signals (e.g., D0 applied to column electrodes 704A, 704B for the first column can be, D1 can be applied to the column electrodes 704C, 704D for the second column, and so on).

As shown in FIG. 7A , the column electrodes may be routed to drive circuitry using vertical column routing traces (e.g., column electrodes 704A-704F are vertical column routing traces 705A-705F). can be routed to drivers such as driver 706 using . In some examples, the row electrodes may be routed to sense circuitry using horizontal row routing traces (e.g., row electrodes 702A-702F may be routed to differential amplifier 708' using horizontal column routing traces). may be routed to sensing circuitry). In some examples, both the column electrodes and row electrodes use vertical routing traces (e.g., using vertical column routing traces 705A-705F and using vertical row routing traces 703-703F). so that it can be routed to either drive circuitry or sensing circuitry. Using vertical routing traces for the row and column electrodes (or more alternatively routing the row and column electrodes to the same edge) eliminates the need for vertical routing traces in the border area (for the drive circuitry and sense circuitry). may allow routing the row and column electrodes to a common location (for connection), thereby enabling a device including the touch sensor panel 700 to have a reduced border.

7A illustrates two vertical routing traces for complementary drive signals per column of column electrodes and two vertical routing traces per row of row electrodes (eg, two vertical routing traces per pair of row electrodes). In some examples, additional routing traces may be used for the row and/or column electrodes. For example, rather than using one routing electrode per drive signal per column (e.g., two total for complementary drive signals applied to the column), multiple routing traces (e.g., four routing traces, ie two for each of the complementary drive signals) may be used. In some examples, rather than using one routing electrode per column (eg, two total for a differential amplifier per row), multiple routing traces may be used. For example, FIGS. 7B and 7C show different routing traces for a touch node having two vertical routing traces for row electrodes and four vertical routing traces for column electrodes, according to examples of the present disclosure. Illustrate configurations.

7B illustrates a first configuration 720 of routing traces for a touch node with two vertical routing traces for row electrodes and four vertical routing traces for column electrodes. The touch nodes are segments of row electrodes 702 (eg, having a rectangular shape with “H” shaped cutouts) and segments of column electrodes 704 (eg, having “H” shaped cutouts). includes Configuration 720 includes two vertical routing traces 726 and 728 used to route complementary drive signals to the column in which the touch electrodes of FIG. 7B are located. One of the vertical routing traces - routing trace 726 or routing trace 728 - can be electrically connected to column electrode segment 704 . In some examples, the column electrode segment 704 can be formed in the second metal layer 506 and the routing traces can be formed in the first metal layer 516, with a gap between the column electrode segment 704 and the routing trace. The electrical connection of may be made of a via through the intermediate layer (507). In some examples, routing traces 726 and 728 can extend from one edge of the touch sensor panel to the opposite edge (eg, top to bottom). In some such examples, routing traces 726 and 728 make electrical connections with alternating column electrode segments within the column. For example, column electrode segments within a column can connect to routing trace 726 for even rows of the touch sensor panel, and column electrode segments within a column can connect to routing trace 728 for odd rows of the touch sensor panel. there is.

Configuration 720 also includes four vertical routing traces 730, 732, 734, 736 used to route row electrode 702 (comprising one or more segments). One or more of the vertical routing traces—routing traces 730, 732, 734, and/or 736—can be electrically connected to row electrode 702. As described in more detail herein, in some examples, different numbers of routing traces may be electrically connected to each row electrode 702 depending on the position of each row relative to the sensing circuitry. In some examples, the farther each row electrode is from the sensing circuitry, the more routing traces can be coupled to each row electrode. In some examples, the row electrode 702 can be formed in the second metal layer 506 and the routing traces can be formed in the first metal layer 516, with an electrical connection between the row electrode 702 and the routing trace. The connection may consist of one or more vias through the intermediate layer 507 . In some examples, routing traces 730, 732, 734 and/or 736 may be routed along one edge of the touch sensor panel, optionally with some breaks or interconnections, as described in more detail herein. to the opposite edge (eg, from top to bottom).

As shown in FIG. 7B , vertical routing traces 726 and 728 for the column electrodes may be positioned to overlap (eg, approximately in the middle of the arms) the arms of the H-shaped column electrode segment and , vertical routing traces 730, 732, 734, 736 for row electrodes may be disposed on opposite sides of vertical routing traces 726, 728 for column electrodes. For example, vertical routing traces 726 can be sandwiched between vertical routing traces 730 and 732, and vertical routing traces 728 can be sandwiched between vertical routing traces 734 and 736. there is. In some examples, vertical routing traces 726, 728, 730, 732, 734, 736 may be equally spaced. In some examples, vertical routing traces 730 and 736 can be positioned such that they do not overlap column electrode segment 704 while vertical routing traces 732 and 734 do not overlap column electrode segment 704, but row There may be partial overlap between the arms to minimize overlap with the column electrode of the vertical routing traces for the electrodes.

7C illustrates a second configuration 740 of routing traces for a touch node with two vertical routing traces for row electrodes and four vertical routing traces for column electrodes. Configuration 740 can be similar to configuration 720, but with vertical routing traces 746, 748 for column electrodes (eg, corresponding to vertical routing traces 726, 728) and (eg, vertical routing traces 726, 728). For example, with different placement of vertical routing traces 750, 752, 754, 756 relative to row electrodes (corresponding to vertical routing traces 730, 732, 734, 736).

As shown in FIG. 7C , vertical routing traces 746 and 748 for the column electrodes may be positioned to overlap (eg, approximately at the outer edges of the arms) the arms of the H-shaped column electrode segment. and vertical routing traces 750, 752, 754, 756 for row electrodes can be disposed on opposite sides of vertical routing traces 746, 748 for column electrodes. For example, vertical routing traces 746 can be sandwiched between vertical routing traces 750 and 752, and vertical routing traces 748 can be sandwiched between vertical routing traces 754 and 756. there is. In some examples, vertical routing traces 746, 748, 750, 752, 754, and 756 may be equally spaced, with a greater spacing than in the configuration of FIG. 7 . In some examples, vertical routing traces 750 and 756 do not overlap column electrode segment 704 (eg, at or within a critical distance of the outer edge of the segment of row electrode shown in FIGS. 7B and 7C ). Vertical routing traces 752 and 754 may be positioned partially between the arms to minimize overlap with the column electrode segment 704, but with the column electrode of the vertical routing traces to the row electrodes, while vertical routing traces 752, 754 can overlap. In some examples, vertical routing traces 752 and 754 can be at or within a critical distance of an inner edge of the arms of H-shaped column electrode segment 704 .

Although described with reference to FIGS. 7B and 7C as vertical routing traces 746, 748, 750, 752, 754, and 756, these vertical routing traces are routing tracks in which one or more routing traces can be implemented for a row ( eg regions within a metal mesh). Routing tracks are sometimes referred to herein as a set of one or more routing trace segments, electrically connected portions of the one or more sets of one or more routing trace segments form a respective routing trace for each row electrode (or column electrode). can do. In some examples, the routing tracks are conceptually vertical, despite the possibility that different routing segments may be electrically isolated from each other and used to route (or may be floating) more than one row electrode. The various routing segments within a routing track are referred to simply as routing traces in that they extend the entire length or substantially the entire length of the row.

8-10 illustrate different routing patterns for row electrodes, according to examples of the present disclosure. 8 illustrates a V-shaped routing pattern according to examples of the present disclosure. FIG. 8 illustrates a touch sensor panel 800 comprising a 48×32 array of touch nodes, as indicated by the indexing of the left and top dimensions of the array, where each box in the array (e.g., FIG. 7A to touch nodes formed from the row electrode and column electrode segments (corresponding to the touch nodes shown in FIGS. 7C to 7C). Each of the rows may include two row electrodes, so that a total of 96 row electrodes are routed to sense circuitry (eg, to differential amplifiers). The touch sensor panel 800 can be divided into three banks, where each bank includes 16 rows. For example, first bank 802 can include rows 1-16, second bank 804 can include rows 17-32, and third bank 806 can include rows 33-48. can include It should be understood that the touch sensor panel may include a different size array or number of banks than shown in FIG. 8 .

The touch sensor panel 800 includes vertical routing tracks for the row electrodes in groups 808 of four vertical routing tracks per column. Electrical connections between one or more of the routing traces implemented as vertical routing tracks are indicated at the touch nodes with a numeric text label ("1", "2:1", or "4:2"). A group 808 of four vertical routing tracks within one column of the touch sensor panel (e.g., using three routing traces implemented within the four routing tracks) is an electrical connection to one row electrode per bank can be used to make For example, the leftmost group 808 includes banks 802, 804, and 804, respectively, as indicated by touch nodes with numeric text labels ("1", "2:1", or "4:2"). 806) can be used to make electrical connections to the row electrodes in rows 2, 18, and 34. For each column of the V-shaped routing pattern, the location of the electrical connections to the rows in the different banks may be equally spaced. For example, the connections in column 1 (in rows 2, 18 and 34) could be spaced 16 rows apart, and that equal spacing between connections would be repeated for each of the columns in the V-shaped routing pattern of FIG. 8 . can Such spacing can help balance the bandwidth across the touch sensor panel, since even spacing can help equalize the resistance to route traces across the touch sensor panel. Although not shown in FIG. 8 for ease of illustration, each column of touch sensor panel may include two vertical routing traces (and two vertical routing tracks) for routing the column electrode segments to the drive circuitry. there is.

For ease of illustration, FIG. 8 shows one in a row of touch sensor panels (e.g., coupled to one terminal of a differential amplifier for that row or otherwise coupled to one terminal of an amplifier for differential measurement). Shows groups 808 of four vertical routing tracks for odd-numbered columns representing one of the row electrodes of the pair, but touch (e.g., coupled to the other terminal of the differential amplifier for the row). It is understood that similar groups of vertical routing tracks for even numbered columns may be used to make electrical connections to the other of a pair of row electrodes within a row of a sensor panel. For example, the vertical routing tracks of group 808 in column 1 can be used to make electrical connections to one of the row electrodes in rows 2, 18 and 34 of the touch sensor panel, and the vertical routing tracks in adjacent column 2 Another group may be used to make electrical connections to another of the row electrodes in rows 2, 18 and 24. Thus, for a total of 32 electrical connections per bank, and a total of 96 electrical connections for three banks, each bank may include one electrical connection per column.

Although described above as having second row electrodes to rows that are electrically connected within adjacent columns, it is understood that in some examples, connections to second row electrodes to certain rows may be made in different columns. For example, connections for even-numbered columns may be at touch nodes on a diagonal between two odd-numbered columns. For example, an electrical connection to one row electrode in row 48 can be made in column 15, an electrical connection to a second row electrode in row 48 can be made in column 16; An electrical connection to one row electrode in row 47 may be made in column 17 and an electrical connection to a second row electrode in row 47 may be made in column 14; The electrical connection to one row electrode in row 46 may be made in column 13 and the electrical connection to the second row electrode in row 46 may be made in column 18; An electrical connection to one row electrode in row 45 can be made at column 19, an electrical connection to a second row electrode in row 45 can be made at column 12, and so on.

As illustrated in FIG. 8 , the touch sensor panel 800 can have a V-shaped routing pattern because the locations of the electrical connections for each bank result in a V-shaped pattern. For example, the electrical connections between row electrodes and routing traces for a given bank can be placed in an array of slopes that increase as you move toward the center of the bank and decrease as you move from the center of the bank toward the left and right edges. It can be positioned in a tilted array that In some examples, electrical connections on the left half of the bank may be for even rows, and those connections on the right half of the bank may be for odd rows (and vice versa). For example, in the case of bank 806, the electrical connections to the rows may be at those touch nodes labeled “4:2”. The V-shaped pattern may point upward in FIG. 8 so that the electrical connections to row 48 at the top of bank 806 may be in the center of row 32 (eg, in columns 15 and 16). The V-shaped pattern is repeated in a similar manner for banks 802 and 804.

In some examples, having the apex of the V-shaped pattern facing upward can help reduce the maximum length of the routing trace and thus the maximum resistance. For example, vertical routing traces can be routed to the center area 850 at the bottom of the panel (eg, in a border area outside the active area of the touch sensor panel). Center region 850 may be a group of bond pads or other connections to enable connection to touch sensing circuitry that includes differential amplifiers (or single-ended amplifier configured for differential measurement). As a result, the routing track and groups of routing traces 808 implemented in the routing tracks at the leftmost and rightmost edges of the touch sensor panel compare to the group of routing traces at the center of the touch sensor panel (eg For example, it can move a larger horizontal distance from the bottom boundary region to the center region 850 . To balance these trace lengths, a V-shaped pattern with the apex pointing upwards, compared to the routing traces in the group of routing tracks at the center of the touch sensor panel, the routing traces in the group of routing tracks are the same as those in the touch sensor panel. may allow moving a shorter vertical distance for the leftmost and rightmost edges of . As a result, the upward V-shaped pattern can reduce the maximum path length, thereby reducing the maximum routing trace resistance to increase the bandwidth of the touch sensor panel 800 . However, it should be understood that in some instances, the V-shape may be oriented differently (eg, apex downward).

As shown in FIG. 8 , vertical routing tracks may extend substantially from one edge (eg, bottom edge) to an opposite edge (eg, top edge) of the touch sensor panel for improved optical performance. there is. For example, rather than terminating a vertical routing trace within a vertical routing track at the point of electrical connection with a row electrode, the vertical routing track may be less visible to the user (for improved optical performance). It may include routing trace segments that may extend beyond the point of the electrical connection to provide a more uniform pattern of metal mesh wire. In some examples, the vertical routing tracks are not electrically connected to a sense amplifier (e.g., tied to or floating to a voltage potential) with the remainder of the routing trace segment(s) in the vertical routing track beyond the touch node where the electrical connection is made. may include one or more fractures (eg discontinuities in the metal mesh). For example, FIG. 8 shows a break in the metal mesh of a vertical routing track 813 after vertical routing trace 810D makes an electrical connection to row electrode 814A, vertical routing trace 810C to row electrode 814B break 823 in the metal mesh of the two vertical routing tracks after making electrical connection to ), and 4 after vertical routing traces 810A, 810B make electrical connection(s) to row electrode 814C. shows a fracture 833 in the metal mesh of the two vertical routing tracks. Breaks in the metal mesh beyond the electrical connections can unload the traces.

Additionally or alternatively, as described in more detail below, in some examples the effective resistance of the routing can be different for different banks of the touch sensor panel 800 . For example, after a portion of a routing trace electrically connected to a row electrode (and after a break in the routing track), some or all of the remaining routing trace segments in the routing track may be repurposed and one or more interconnected to one or more of the remaining routing trace segments in other routing tracks to increase the effective width of the routing trace and thereby reduce the effective resistance of the routing trace to routing traces connected to touch nodes in the downstream banks. can reduce In this way, the disconnections (breaks) and interconnections of a group of vertical routing tracks can be used to balance the bandwidth to the touch sensor panel. In some examples, routing trace utilization (disconnects and interconnects of vertical routing tracks) can be optimized on a per touch node basis to reduce maximum routing trace resistance or to reduce variation in overall routing trace resistance.

For example, the first routing trace can include a portion of the first vertical routing track (eg, vertical routing trace 810D), and the row electrode 814A in row 1, column 31 can be connected to the touch sensor panel ( 800) can be used to route to the bottom. The electrical connection is made by one or more vias 812 between the row electrode and a first routing trace (e.g., vertical routing trace 810D) at the location of the row electrode 814A in the touch node of row 1, column 31. It can be done. After break 813, some or all of the remaining portions of the vertical routing track (represented by routing trace segments 810D', 810D", 810D"') are used to reduce routing trace resistance to upstream banks. can be used for For example, the second routing trace may be a second portion (eg, routing trace segment 810D') and a portion (eg, routing trace 810C of the second vertical routing track) of the first vertical routing track. can include For example, segments of the first and second routing tracks may be at one or more points between an electrical connection in row 1, column 31 (in bank 802) and an electrical connection in row 17, column 31 (in bank 804). can be coupled at the s to multiply the effective width for the second routing trace between row 2 and row 17 compared to the width of the second routing trace between row 1 and row 2 (and thereby reduce the resistance there is). Electrical connections are made between the row electrode and the second routing trace (e.g., by vertical routing trace 810C and/or interconnected trace segments 810D') at the location of row electrode 814B in the row 17, column 31 touch node. It can be made by one or more vias 822 between.

After break 823, some or all of the remaining portions of the first and second vertical routing tracks (represented by routing trace segments 810C', 810D", 810D"') are routing traces for the upstream bank. Can be used to reduce resistance. For example, the third routing trace may be a third vertical routing track and a portion of a fourth vertical routing track (e.g., vertical routing traces 810A, 810B, a third portion of the first vertical routing track and a second routing may include a second portion of the track, eg, segments of the third and fourth routing tracks electrical connection to the row electrode 814C (eg, within or outside the active area of the touch sensor panel) Additionally, routing trace segments 810C′, 810D″ in the first and second routing tracks are row 17, column 810D (in bank 804). coupled to vertical routing traces 810A, 810B at one or more points between the electrical connection at 31 and the electrical connection at row 33, column 31 (within bank 806), so that between row 17 and row 33 For routing traces, the effective width of the third routing trace between rows 18 and 33 can be multiplied compared to the width of the third routing trace between rows 1 and 18 (and compared to a single vertical routing track). The effective width can be quadrupled (and thereby the resistance can be reduced) The electrical connection is made at the location of the row electrode 814C in the row 33, column 31 touch node (e.g., the vertical routing trace 810A, 810B and/or interconnected routing trace segments 810C′, 810D″) may be formed by one or more vias 832 between the row electrode and the third routing trace. After 833, the remaining routing segments 810A', 810B', 810C'', 810D''' may be decoupled to the routing traces and from the differential amplifiers.

Numeric text labels for touch nodes with electrical connections provide an indication of the number of vertical routing tracks used for each routing trace and the effective width of routing traces used for routing to a row electrode within each bank. . For example, the numeric text label “1” for touch nodes with electrical connections is part of one of the four vertical routing tracks in group 808 (having an effective width of one routing track). may be used for a routing trace (eg, such as the first routing trace that includes routing trace segment 810D). The numeric text label “2:1” for touch nodes with electrical connections indicates that a portion of two of the four vertical routing tracks in group 808 multiplies the effective width for a portion of the routing length. (eg, a second routing trace comprising routing trace segment 810C and interconnected routing trace segment 810D'). The numeric text label “4:2” for touch nodes with electrical connections indicates that portions of the four vertical routing traces in group 808 can be used to multiply the effective width for a portion of the routing length (e.g. eg, a third routing trace comprising routing trace segments 810A, 810B and interconnected routing trace segments 810C′, 810D″).

Alternatively, the numeric text label “2:1” may provide an indication of a transition point between the effective width of two routing tracks to the effective width of one routing track, and the numeric text label “4:2” may provide an indication of the effective width of 4 routing tracks. It may provide an indication of a transition point between the effective width of two routing tracks versus the effective width of two routing tracks.

It should be understood that the dimensions of the touch sensor panel, the number of banks, and the number of vertical routing tracks per group are exemplary. In some examples, the touch sensor panel can be doubled in size to have 48 rows and 64 columns, and the V-shaped pattern shown in FIG. 8 can be repeated for columns 33-64. In some such examples, each row may have two row electrodes, and additional columns may be used to multiply the number of routing traces used to make the electrical connection. In some such examples, each row may have four row electrodes. For example, two row electrodes per row may be used for columns 1-32, and two additional row electrodes per row may be used for columns 33-64. In some examples, more or fewer vertical routing tracks or banks than shown in FIG. 8 may be used.

The V-shaped routing pattern can be used to maximize the bandwidth to the touch sensor panel by reducing the maximum total routed trace length. However, in some instances, routing for adjacent rows may be separated by multiple columns. For example, the electrical connections for row 36 (at column 3) and row 35 (at column 29) can be separated by 26 columns, and row 32 (at column 15) and row 31 (at column 31). ) The electrical connection to row 33 can be separated by 16 columns. In contrast, the electrical connections to row 48 (at column 15) and row 47 (at column 17) can be separated by two columns. As a result, the touch nodes of the touch sensor panel 800 may have resistance differences between adjacent touch nodes that may result in reduced accuracy for measuring the position of an object moving across the touch sensor panel. In some examples, reduced accuracy may result from increased wobble for active or passive stylus input devices due to resistance differences between adjacent touch nodes within a column (and/or within a row).

9 illustrates an S-shaped or zigzag routing pattern according to examples of the present disclosure. The S-shaped routing pattern can reduce the difference in resistance between adjacent touch nodes within a column (and/or within a row) compared to the V-shaped routing pattern illustrated in FIG. 8 , but due to longer maximum routing trace resistance A bandwidth of the touch sensor panel may be reduced (eg, a bandwidth reduction of 5% to 25%). 9 may include banks 902, 904, 906 (eg, corresponding to banks 802, 804, 806) but may include groups 808 of eg four vertical routing tracks. ), a touch sensor panel 900 that includes a 48x32 array of touch nodes, similar to that of the touch sensor panel 800, that includes a different pattern of electrical connections between groups of vertical routing tracks 908 corresponding to ). foreshadow

Electrical connections between one or more of the row electrodes and routing traces using segments in vertical routing tracks are touched with numeric text labels ("1", "2:1", "2" or "4:2"). displayed on nodes. A group 908 of four vertical routing tracks within one column of a touch sensor panel may be used to make electrical connections to one row electrode per bank. For example, the leftmost group 908 includes banks 902, 904, and 906, respectively, as indicated by touch nodes with numeric text labels ("1", "2:1", or "2"). can be used to make electrical connections to row electrodes in rows 1, 32, and 33 of Unlike the V-shaped routing pattern, the location of electrical connections for rows in different banks may not be equally spaced. For example, the connections in column 1 (in rows 1, 32 and 33) may have some of the connections 31 rows apart and other connections in adjacent rows, and different spacing between the connections. may result in reduced bandwidth for the touch sensor panel due to increased trace resistances and non-uniform spacing of some of the touch sensor panel's routing traces. Although not shown in FIG. 9 for ease of illustration, each column of touch sensor panel may include two vertical routing tracks for routing the column electrode segments to the drive circuitry.

For ease of illustration, FIG. 9 is shown in odd-numbered columns representing one of a pair of row electrodes within a row of a touch sensor panel (e.g., coupled to one terminal of a differential amplifier for that row). groups 908 of four vertical routing tracks for a row, but to the other of a pair of row electrodes in a row of a touch sensor panel (e.g., to be coupled to the other terminal of a differential amplifier for that row). It is understood that similar groups of vertical routing tracks for even-numbered columns may be used to make electrical connections for the . For example, the vertical routing tracks of group 908 in column 1 can be used to make electrical connections to one of the row electrodes in rows 1, 32 and 33 of the touch sensor panel, and the vertical routing tracks in adjacent column 2 Another group may be used to make electrical connections to another of the row electrodes in rows 1, 32 and 33. Thus, for a total of 32 electrical connections per bank, and a total of 96 electrical connections for three banks, each bank may include one electrical connection per column. Although described above as having second row electrodes to rows that are electrically connected within adjacent columns, it is understood that in some examples, connections to second row electrodes to certain rows may be made in different columns.

As illustrated in FIG. 9 , the touch sensor panel 900 can be said to have an S-shaped routing pattern because the locations of the electrical connections for each bank result in an S-shaped pattern. For example, the electrical connections between the row electrodes and routing traces for a given bank can be placed in a single sloped arrangement between the left and right edges of the bank. In some examples, adjacent banks (eg, vertically adjacent) may have their electrical connections arranged at opposite slopes (alternating left to right or right to left). Additionally, electrical connections to two adjacent rows at the boundary between two adjacent banks (e.g., electrical connections between a first row in a first bank and a second row in a second bank different from the first bank) - The first row and the second row are adjacent) may be adjacent to each other (near the common edge of the touch sensor panel). For example, each sequential electrical connection between a bottom row of a first bank and a top row of an adjacent second bank may be located along a common edge (eg, along a right edge or a left edge) of the touch sensor panel. can For example, for bank 906, the electrical connections to the rows would be at those touch nodes labeled “4:2” along the first diagonal going down from row 48, column 32 to row 33, column 1. can The S-shaped pattern follows a second diagonal for banks 902, 904, descending from row 32, column 1 to row 17 column 32, and a third descending from row 16, column 32 to row 1, column 1. It is repeated in a similar manner, with electrical connections along the diagonal. Electrical connections for row 33, column 1 and row 32, column 1 can be along the left edge of the touch sensor panel, and electrical connections for row 17, column 32 and row 16, column 32 can be along the right edge of the touch sensor panel. can follow

In some examples, having an S-shaped pattern can help reduce change in resistance between adjacent rows and thus reduce line-to-line change in bandwidth. For example, the routing trace length and thereby change in resistance for any two adjacent rows may be relatively small (eg, less than 100 Ω), whereas the V-shaped configuration of FIG. may have some discontinuities where the change in β may be relatively larger (eg, greater than 500Ω) between some adjacent rows. For example, in the V-shaped configuration of FIG. 8 , the connections for row 32 and row 33 may be in column 15 and column 1, respectively, which may cause relatively large differences in trace length and resistance. In some examples, reducing line-to-line variation in resistance may result in touch sensing that may result in reduced wobble for active or passive stylus input devices due to smaller resistance differences between adjacent touch nodes within a column (and/or within a row). accuracy can be improved.

As shown in FIG. 9 , vertical routing tracks (and trace segments therein) are routed from one edge (eg, bottom edge) to the opposite edge (eg, bottom edge) of the touch sensor panel for improved optical performance. top edge). For example, rather than terminating the vertical routing traces at the point of electrical connection with the row electrodes, segments within the vertical routing tracks are metal mesh wires so that the vertical routing tracks may be less visible to the user (for improved optical performance). may extend beyond the point of the electrical connection to provide a more uniform pattern of In some examples, the vertical routing tracks are such that the remainder of the vertical routing tracks beyond the touch node where the electrical connection is made (e.g., voltage potential may include breaks so as not to be electrically connected to the sense amplifier (either tied to or floating).

Additionally or alternatively, as described above with respect to FIG. 8 , in some examples the effective resistance of the routing may be different for different banks of touch sensor panel 900 . For example, after a routing trace comprising a portion of a routing track is electrically connected to a row electrode (and after a break in the routing track), some or all of the remainder of the routing track may be modified for purpose and/or the remainder of the routing track. Interconnected to one or more of the routing traces may increase an effective width of the routing trace and thereby reduce an effective resistance of the routing trace to routing traces connected to touch nodes in downstream banks. In this way, the disconnections (breaks) and interconnections of a group of vertical routing tracks can be used to better balance the bandwidth to the touch sensor panel. In some examples, routing track utilization (disconnects and interconnects of vertical routing tracks) can be optimized on a per touch node basis to reduce maximum routing trace resistance or to reduce variation in overall routing trace resistance.

It should be understood that the dimensions of the touch sensor panel, the number of banks, and the number of vertical routing tracks per group are exemplary. In some examples, the touch sensor panel can be doubled in size to have 48 rows and 64 columns, and the S-shaped pattern shown in FIG. 9 can be repeated for columns 33-64 (e.g., column 32 and column 33). In some such examples, each row may have two row electrodes, and additional columns may be used to multiply the number of routing traces used to make the electrical connection. In some such examples, each row may have four row electrodes. For example, two row electrodes per row may be used for columns 1-32, and two additional row electrodes per row may be used for columns 33-64. In some examples, more or fewer vertical routing tracks or banks than shown in FIG. 9 may be used.

In some examples, a hybrid routing pattern may be used. In a hybrid routing pattern, some routing traces are placed in the active area (eg, overlapping row and/or column electrodes), and some routing traces are placed outside the active area (eg, in a border area) . 10 illustrates a hybrid routing pattern according to examples of the present disclosure. A hybrid routing pattern may include features of the S-shaped or zigzag routing pattern illustrated in FIG. 9 (eg, row connections along diagonal lines), but also include some border area routing traces. The hybrid routing pattern can reduce resistance differences between adjacent touch nodes within a column (and/or within a row) in a manner similar to that described above with respect to FIG. 9 . However, the use of border area routing traces may reduce the number of routing tracks required in an active area and/or may reduce the number of routing traces required in an active area by tailoring more of the routing tracks for longer routing traces. resistance can be reduced.

10 may include banks 1002, 1004, 1006 (eg, corresponding to banks 902, 904, 906) but groups 1008 of vertical routing tracks (eg, 2 illustrates a touch sensor panel 1000 that includes a 48x32 array of touch nodes, similar to that of touch sensor panel 900, that includes a different pattern of electrical connections between groups of vertical routing tracks. Although two vertical routing tracks are shown per column, these routing tracks can be thicker (and thus have improved resistance characteristics (eg, reduced resistance per unit length of routing trace)). Alternatively, the vertical routing tracks may include four vertical routing tracks (e.g., corresponding to groups 908 of four vertical routing tracks), where two of the four vertical routing tracks are 10 (or alternatively, some or all of the columns may be routed to the same connections as one of the two illustrated vertical routing traces in FIG. one of them and three of the four vertical routing tracks for the interconnections to the third bank 1006).

Electrical connections between one or more of the row electrodes and routing traces using segments in the vertical routing tracks are indicated at the touch nodes with a numeric text label ("1" or "2:1"). A group of two vertical routing tracks 1008 within one column of the touch sensor panel can be used to make electrical connections to one row electrode in the upper bank and one row electrode in the lower bank. For example, the leftmost group 1008 is the row in rows 16 and 33 in banks 1002 and 1006, respectively, as indicated by the touch nodes with numeric text labels (“1” or “2:1”). It can be used to make electrical connections to electrodes. In a similar manner, vertical routing tracks in column 3 can be used to make electrical connections to row electrodes in rows 15 and 34 in banks 1002 and 1006. Electrical connections to each of the row electrodes in mid-bank 1004 can be made using a routing trace (eg, routing trace 1010) in a border region (eg, outside the active region). Routing traces within a border area may also be referred to herein as border area routing traces or border routing traces. Similar to the S-shaped routing pattern of FIG. 9 , the locations of the electrical connections for the rows in the different banks may not be equally spaced. For example, the connections in column 1 (at rows 16 and 33) may be 17 rows apart, and the connections in column 31 may be 47 rows apart. Different spacing between connections can result in reduced bandwidth for the touch sensor panel due to non-uniform spacing and increased trace resistances for some of the touch sensor panel's routing traces. In some examples, as described herein, increased trace resistances can be reduced using a hybrid routing configuration. Although not shown in FIG. 10 for ease of illustration, each column of touch sensor panel may include two vertical routing tracks for routing the column electrode segments to the drive circuitry.

For ease of illustration, FIG. 10 shows odd-numbered columns representing one of a pair of row electrodes within a row of a touch sensor panel (e.g., coupled to one terminal of a differential amplifier for that row). shows groups 1008 of two vertical routing tracks for a row, but to the other of a pair of row electrodes in a row of a touch sensor panel (e.g., coupled to the other terminal of a differential amplifier for that row). It is understood that similar groups of vertical routing tracks for even-numbered columns may be used to make electrical connections for the . For example, vertical routing tracks of group 1008 in column 1 can be used to make electrical connections to one of the row electrodes in rows 1 and 33 of the touch sensor panel, and another group of vertical routing tracks in adjacent column 2. can be used to make electrical connections to other row electrodes in rows 1 and 33. Electrical connections to a pair of row electrodes may be made in a border area (eg, on the same side of the touch sensor panel or on opposite sides). Thus, for a total of 32 electrical connections per bank, and a total of 96 electrical connections for 3 banks, each of the upper and lower banks may include one electrical connection per column, and the middle bank may include 2 electrical connections per row. two electrical connections (one each for a pair of row electrodes in a row). Although described above as having second row electrodes to rows that are electrically connected in adjacent columns in the upper and lower banks, it should be understood that in some instances the connections to second row electrodes to certain rows can be made in different columns. I understand.

As illustrated in FIG. 10 , the touch sensor panel 1000 may have a routing pattern similar to the S-shaped routing pattern. For example, the electrical connections between the row electrodes and routing traces for a given bank can be placed in a single sloped arrangement between the left and right edges of the bank. For example, for bank 1006, the electrical connections to the rows would be at those touch nodes labeled “2:1” along the first diagonal going down from row 48, column 32 to row 33, column 1. can The electrical connections to bank 1002 run in a similar fashion, with the electrical connections following a second diagonal running down from row 16, column 1 to row 1, column 32. The middle banks 1004 may be connected using border area routing, as described herein. In some examples, a first bank and a third bank separated by an intermediate bank may have their electrical connections arranged at opposite slopes (alternating left to right or right to left). Additionally, electrical connections between first rows in a first bank adjacent to rows connected using border area routing and electrical connections between second rows in a second bank different from the first bank are at a common edge of the touch sensor panel or may be near it. For example, the electrical connections for row 33, column 1 and row 16, column 1 may be along the left edge of the touch sensor panel.

In some examples, having a diagonal pattern similar to that of an S-shape in a hybrid device can help reduce change in resistance between adjacent rows in the upper and lower banks and thus reduce line-to-line variation in bandwidth. In some examples, border region routing traces also reduce line-to-line variation in resistance (e.g., between the resistance of a top row of a lower bank and the resistance of a bottom row of an upper bank) and relative continuity of resistance relative to a middle bank. can be designed to provide

As shown in FIG. 10 , vertical routing tracks (and trace segments therein) are routed from one edge (eg, bottom edge) to the opposite edge (eg, bottom edge) of the touch sensor panel for improved optical performance. top edge). For example, rather than terminating the vertical routing traces at the point of electrical connection with the row electrodes, the vertical routing tracks are more of a metal mesh wire where the vertical routing tracks may be less visible to the user (for improved optical performance). It may extend beyond the point of the electrical connection to provide a uniform pattern. In some examples, the vertical routing tracks are such that the remainder of the vertical routing tracks beyond the touch node where the electrical connection is made (e.g., voltage potential It may include breaks so as not to be electrically connected to the sense amplifier (either tied to or floating).

Additionally or alternatively, as described above with respect to FIG. 8 , in some examples the effective resistance of the routing can be different for different banks of touch sensor panel 1000 . For example, after a routing trace comprising a portion of a routing track is electrically connected to a row electrode (and after a break in the routing track), some or all of the remainder of the routing track may be modified for purpose and/or the remainder of the routing track. Interconnected to one or more of the routing traces may increase an effective width of the routing trace and thereby reduce an effective resistance of the routing trace to routing traces connected to touch nodes in downstream banks. In this way, the disconnections (breaks) and interconnections of a group of vertical routing tracks can be used to better balance the bandwidth to the touch sensor panel. In some examples, routing track utilization (disconnects and interconnects of vertical routing tracks) can be optimized on a per touch node basis to reduce maximum routing trace resistance or to reduce variation in overall routing trace resistance.

It should be understood that the dimensions of the touch sensor panel, the number of banks, and the number of vertical routing tracks per group are exemplary. In some examples, the touch sensor panel can be doubled in size to have 48 rows and 64 columns, and the hybrid pattern shown in FIG. 10 can be repeated for columns 33-64 (e.g., columns 32 and 33 may be mirrored across the boundary between). In some such examples, each row may have two row electrodes, and additional columns may be used to multiply the number of routing traces used to make the electrical connection. In some such examples, each row may have four row electrodes. For example, two row electrodes per row may be used for columns 1-32, and two additional row electrodes per row may be used for columns 33-64. In some examples, more or fewer vertical routing traces or banks than shown in FIG. 10 may be used.

10 shows upper and lower banks 1002, 1006 with routing traces in the active area and middle bank 1004 with routing traces in the border area, the distribution of traces within the active area and within the border area is It is understood that it may differ from that shown in For example, more or less electrical connections can be changed between the S-shaped pattern and the hybrid pattern (e.g., by including some active area routing traces/tracks for the rows in the middle bank to the second reducing the length of the diagonal in the upper and/or lower bank by adding a third partial diagonal in the bank or using more border routing traces for electrical connections).

As described herein, in some examples, electrical connections to a row to a differential sense amplifier can affect crosstalk between adjacent rows within a column. 11A and 11B illustrate an example touch sensor with vertical routing traces and corresponding signal levels with and without crosstalk, according to examples of the present disclosure. 11A illustrates a touch sensor panel 1100 that may correspond to the row and column electrodes of touch sensor panel 700 (but with different routing shown). The row electrode 1104 corresponding to the touch node in row 1, column 2 is within the three routing tracks 1106 (with the same three routing trace connection points as the vias shown for the row electrode 1104). It can be coupled to the sense amplifier using a routing trace implemented in segments. Routing tracks 1106 may be vertical routing tracks overlapping other touch nodes within a column (eg, at row 2, column 2 and at row 3, column 2). 11B shows in the second column with and without crosstalk (e.g., real or ideal signals) due to the presence of a finger 1102 touching or proximate to the touch node in row 2, column 2. Comparison of signal measurements at touch electrodes is illustrated. As shown in FIG. 11B , the presence of a finger 1102 proximate to routing traces 1106 in row 2 column 2 can cause modulation of the measured signal in row 1 column 2. In some examples, the modulation may be on the order of 5% to 30% depending on the size, number, and/or orientation of the finger(s). This modulation can cause distortion of the touch signal profile resulting in inaccurate position detection and poorer touch performance. In some examples, as described with respect to FIG. 11D , differential routing traces may be used to mitigate the effects of crosstalk.

11C and 11D illustrate portions of example touch sensor panels with non-differential routing traces or with differential routing traces, according to examples of the present disclosure. Each of the portions 1120 and 1140 of the touch sensor panel are 2x2 of touch nodes comprising four column electrodes 1124A to 1124D (H-shaped electrodes) and four row electrodes labeled 1122A to 1122D, respectively. contains an array Row electrodes 1122A-1122D may be routed to sense circuitry (eg, single-ended or differential amplifiers) using routing traces 1126A-1126H. Electrical connections between row electrodes 1122A-1122D and routing traces implemented in routing tracks 1126A-1126H may be made using vias 1128A-1128L. For simplicity, column routing is not shown in FIGS. 11C and 11D. The four row electrodes can be coupled to the four inputs of the sense circuitry referenced by the labels S0+, S0, S1+, and S1- (which can be used for two differential measurements, for example). The two row electrodes 1122A, 1122B (also labeled S0+ and S0-) are the two inputs of the sense circuitry (e.g., the two terminals of a differential sense amplifier S0) for differential measurement. , and the two row electrodes 1122C, 1122D (also labeled S1+ and S1-) are the two inputs of the sense circuitry (e.g., differential sense amplifier S1) for differential measurement. two terminals of).

In some examples, as shown in the non-differential configuration of FIG. 11C , routing traces for a first input of differential measurement may be placed in one column, and routing traces for a second input of differential measurement may be placed in a second column. Can be placed in a column. For example, a first routing trace may be implemented using routing trace segments in routing tracks 1126A and 1126B and using portions of routing trace segments in routing tracks 1126C and 1126D. A first routing trace may be electrically connected to row electrode 1122A using vias 1128A-1128D and routed vertically in the left column. Routing tracks 1126A and 1126B also overlap row electrode 1122C, but there are no electrical connections. In a similar manner, the second routing trace may be implemented using routing trace segments in routing tracks 1126E and 1126F and using portions of routing trace segments in routing tracks 1126G and 1126H. A second routing trace may be electrically connected to row electrode 1122B using vias 1128E-1128H and may be routed vertically in the right column. Routing tracks 1126E and 1126F also overlap row electrode 1122D, but there are no electrical connections. Routing for row electrodes 1122A, 1122B can range from using two vertical routing tracks to four vertical routing tracks (e.g., to multiply the effective width for a fraction of the routing length and thereby reduce routing trace resistance). It should be understood that it may correspond to two routing traces with a “4:2” electrical connection including the transition to vertical routing tracks. For example, routing trace segments in routing tracks 1126A, 1126B corresponding to one input of sensing circuitry are connected (e.g., near the boundary between row electrode 1122A and row electrode 1122C). It is shown divided into routing trace segments in four tracks across row electrode 1122A (with some horizontal interconnections between the tracks of ). Similarly, routing trace segments in routing tracks 1126E and 1126F corresponding to other inputs of sensing circuitry are connected and (e.g., tracks near the boundary between row electrode 1122B and row electrode 1122D) It is shown divided into routing trace segments in four tracks across row electrode 1122B (with some horizontal interconnections between). 11C also shows routing trace segments in routing tracks 1126C and 1126D that are electrically connected to row electrode 1122C using vias 1128I and 1128J and vias 1128K and 1128L to row electrode 1128L. Illustrates routing trace segments in routing tracks 1126G and 1126H electrically connected to 1122D. As described with reference to FIGS. 11A and 11B , a finger touching or approaching the lower right touch node including the column electrode 1124C and the row electrode 1122C causes some crosstalk (e.g., distorting the touch signal). modulation) can be introduced into the measurement of the top right touch node, including column electrode 1124A and row electrode 1122A, due to routing tracks 1126A and 1126B overlapping the bottom right touch node.

In some examples, crosstalk can be mitigated using differential routing traces as illustrated in FIG. 11D. In a differential routing configuration, the routing traces for the first input of the differential measurement and the routing traces for the second input of the differential measurement may be placed in the same column. For example, a first routing trace may be implemented using routing trace segments in routing tracks 1126A and 1126B and using portions of routing trace segments in routing tracks 1126C and 1126D, and a second routing trace A routing trace may be implemented using routing trace segments in routing tracks 1126E and 1126F and using portions of routing trace segments in routing tracks 1126G and 1126H. A first routing trace is electrically connected to row electrode 1122A using vias 1128A-1128D, and a second electrode is electrically connected to row electrode 1122B using vias 1128E-1128H. . Segments of the first and second routing traces may be routed vertically within pairs of routing tracks (eg, within the left column, and also within the top half of the right column). The first and second routing traces in routing tracks 1126A, 1126B, 1126E, 1126F also overlap row electrode 1122C, but have no electrical connection. 11D also shows routing trace segments in routing tracks 1126C and 1126D that are electrically connected to row electrode 1122C using vias 1128I and 1128J and vias 1128K and 1128L to row electrode 1128L. Illustrates routing trace segments in routing tracks 1126G and 1126H electrically connected to 1122D. These segments can be routed vertically within pairs of routing tracks (eg, within the bottom right column), and these connections to row electrodes 1122C, 1122D are (eg, as in FIG. 11C ). rather than within different columns) within the same column.

A finger touching or approaching the bottom left touch node, which includes column electrode 1124C and row electrode 1122C, modulates the modulation of column electrode 1124A due to routing tracks 1126A and 1126B overlapping the bottom left touch node. and the top left touch node including the row electrode 1122A. However, the same (or similar) modulation may be introduced due to overlapping routing tracks 1126E and 1126F overlapping the bottom left touch node. Thus, differential measurement of inputs received from the first and second routing (eg, including segments within at least routing tracks 1126A, 1126B, 1126E, 1126F) can cancel or reduce crosstalk modulation. (For example, crosstalk modulation becomes common mode). Although FIG. 11D illustrates crosstalk mitigation for a 2x2 array in a connected 4:2 routing trace, it is to be understood that this technique can be used with other routing traces to reduce crosstalk over areas of a larger touch sensor panel. shall.

As described herein, the differential drive and differential sensing architecture can reduce touch of a touch screen and/or noise within display systems that can occur due to proximity of the touch system to the display system. However, the use of differential driving and differential sensing architecture may result in reduced signal-to-noise ratio for sensed touch signals due to parasitic non-idealities of the implementation of the differential driving and differential sensing architecture. . In some examples, as described in more detail herein, staggering connections between drive circuitry and column electrodes and/or between sense circuitry and row electrodes can reduce parasitic effects and/or reduce differential It can increase the signal-to-noise ratio for driven and differential sensing architectures.

12A and 12B illustrate an example touch node of a row-column architecture using single-ended capacitance measurements or differential capacitance measurements, according to examples of the present disclosure. 12A illustrates row electrodes 1202 and column electrodes 1204 of a touch sensor panel, where touch node 1200 corresponds to an abutment between column electrodes 1204 and a portion of row electrodes 1202. As shown in FIG. 12A , column electrode 1204 can include multiple coupled electrode segments 1204A-1204C, and row electrode 1202 can include multiple coupled electrode segments 1202A-1204C. 1202C) (coupling of the segments is not shown for simplicity).

A drive circuit 1206 can excite the row electrode 1202 and a sense circuit 1208 coupled to the column electrode 1204 can measure the capacitance of the touch node 1200 . The capacitance measured by the sensing circuit can primarily measure the capacitive coupling between row electrode segment 1202B and column electrode segment 1204B, illustrated by capacitance C _M (main capacitance) in FIG. 12A. there is. However, in addition to measuring C _M , the capacitance measurement may also include parasitic capacitances coupled between column electrode segments and other row electrode segments of adjacent touch nodes. For example, parasitic couplings include coupling between row electrode segments 1202A and column electrode segments 1204B (C _PR or parasitic row coupling), row electrode segments 1202C and column electrode segments ( 1204B), coupling between row electrode segments 1202B and column electrode segments 1204A (C _PC or parasitic thermal _coupling ), and row electrode segments 1202B and column coupling (C _PC ) between the electrode segments 1204C.

12A illustrates a circuit diagram showing the drive circuit 1206 for the row electrode 1202 and the sense circuit 1208 for the column electrode 1204, where the capacitances measured for the touch node 1200 are the main capacitance ( C _M ) and the combined parasitic capacitance of the two parasitic thermal couplings and the two parasitic row couplings. Since the measurement is single-ended, these capacitances are the sum of C _M + 2C _PC + 2C _PR for the total measured capacitance.

FIG. 12B shows a column with two column electrodes including a first column electrode 1214A (comprising the two electrode segments illustrated in FIG. 12B) and a second column electrode 1214B (comprising the two electrode segments illustrated in FIG. Illustrates a portion of a touch sensor panel that includes a row with two row electrodes, including a first row electrode 1212A and a second column electrode 1212B (including two electrode segments). A touch node 1210 corresponds to an adjacency between a column electrode 1214B and a row electrode 1212B. Drive circuit 1216 can excite row electrode 1212B with a drive signal and row electrode 1212B with a complementary drive signal (as indicated by the D+ and D- labels), column electrodes 1214B and A sensing circuit 1218 coupled to column electrode 1214A can differentially measure the capacitance of touch node 1210 (as indicated by the S+ and S- labels). The capacitance measured by the sensing circuit can primarily measure the capacitive coupling between row electrode 1212B and column electrode 1214B, illustrated by capacitance C _M (main capacitance), and parasitic capacitances can also be measured. The parasitic capacitances are coupling between row electrode 1212A and column electrode segment 1214B (C _PR multiplied for two adjacent segments shown in FIG. 12B ), and row electrode 1202B and column electrode 1214A coupling between (C _PC multiplied for two adjacent segments shown in FIG. 12B ).

12B illustrates a circuit diagram showing the drive circuit 1216 for row electrodes 1212A and 1212B and the sense circuit 1218 for column electrodes 1214A and 1214B, where the capacitances are the main capacitance (C _M ) is measured for the touch node 1210 containing , but attenuated by the combined parasitic capacitances. Due to the differential drive and other sensing configurations, these parasitic capacitances are out of phase and are the sum of the total measured capacitance of C _M - 2C _PC - 2C _PR . Parasitic effects reduce the total measured signal, which reduces the SNR. In some examples, parasitic effects can reduce the total measured signal by approximately 75% to 80%, reducing the SNR for the touch sensor panel. Additionally, parasitic effects can reduce the effectiveness of the differential cancellation of noise described herein, which can also increase noise (eg, by a factor of approximately 3-5) and further degrade SNR. there is.

In some examples, SNR can be measured by changing the pattern of stimuli applied to the touch sensor panel. The pattern can be changed by coupling between the routing traces and the drive circuitry (eg, optionally using switches or alternatively by changing the codes used to generate the drive signals in the driver circuitry). 13A and 13B illustrate portions of touch sensor panels and representations of a stimulus applied to the touch sensor panels, according to examples of the present disclosure. The touch sensor panel 1300 may correspond to the touch sensor panel 700 . The touch sensor panel 1300 includes row electrodes 1302A to 1302F (eg, corresponding to row electrodes 702A to 702F) and (eg, corresponding to column electrodes 704A to 704F) column electrodes 1304A-1304F. The touch sensor panel can be seen to include a two-dimensional array (three rows and three columns) of effective touch nodes, where each of the touch nodes includes one row electrode segment and one column electrode segment. The row electrodes can be coupled to the sensing circuitry and the column electrodes can be coupled to the driver circuitry (eg driver/transmitter). For example, FIG. 13A shows a differential driver circuit 1305A (or two single-output driver circuits) coupled to column electrodes 1304A and 1304B, a differential coupled to column electrodes 1304C and 1304D. Illustrates driver circuit 1305B, and differential driver circuit 1305C coupled to column electrodes 1304E, 1304F (eg, generating coded, complementary drive signals). Differential amplifiers 1308A-1308C (or multiple single-ended amplifiers) may be coupled to each pair of row electrodes 1302A-1302F.

The touch sensor panel 1300 can be viewed as an enlarged portion of the diagram of a portion of the touch sensor panel shown in FIG. 12B (although the row/column convention for driving and sensing differs between FIGS. 12B and 13A). For example, the touch node 1210 may correspond to a touch node at the center of the touch sensor panel 1300 corresponding to the column electrode 1304D and the row electrode 1302D. The polarity of the drive signal applied to adjacent column electrode 1304C is complementary in a similar manner as shown with the complementary phase of adjacent row electrode 1212A, similarly to the differential amplifier terminal coupled to adjacent row electrode 1302C. The polarity is opposite to that of row electrode 1302D, as shown by the opposite polarity of adjacent column electrode 1214A.

13A also illustrates a representation 1310 of a stimulus applied to a touch sensor panel. Although representation 1310 shows the stimulus of a 4x4 array of touch nodes, the portion of touch sensor panel 1300 shown in FIG. 13A only shows a 3x3 array. Representation 1310 shows that a set of complementary drive signals is generated within each column (e.g., with the drive signals labeled TX0, TX1, etc., using indexing corresponding to driver circuits with labels D0, D1, etc.). status) shows what is being used. For example, the leftmost column uses opposite phases of TX0 (alternating + and -), and each column to the right uses opposite phases of TX1, TX2, and TX3 (where TX0, TX1, TX2 and TX3 may be orthogonal drive signals). In a similar manner, each row of row electrodes is coupled to the differential input of one corresponding differential amplifier. As described with respect to FIG. 12B, this configuration can be sensitive to a decrease in SNR due to parasitic capacitances.

13B illustrates a touch sensor panel 1320 that corresponds to touch sensor panel 1300 but has a different coupling between the driver circuitry and the column electrodes. For example, as shown in FIG. 13B, complementary drive signals can be applied to different columns such that the complementary drive signals are diagonally adjacent (staggered). For example, as shown in representation 1330 of a stimulus applied to a touch sensor panel, each drive signal can have its complement applied to a touch node (using column electrodes), which is one Offset by a row and one column. For example, TX0+ is applied to the touch node at column 1, row 1, and its complement is applied to the touch node at column 2, row 2. Similar relationships for complementary touch signals can be applied across the touch sensor panel. Staggering complementary drive signals can reduce the magnitude of parasitic capacitances (eg, C _PC shown in FIG. 12B ), because the diagonal distance between electrodes is not larger, thereby increasing the signal (boosting the SNR). In some examples, the boost of the signal may be 80% to 100% (or more) compared to the unstaggered stimulation pattern of FIG. 13A. It should be understood that staggering increases the differential cancellation pitch (eg, the distance between complementary signals), which increases the area over which the differential signals cancel out. As a result, increasing the differential cancellation pitch may result in less cancellation of coexistence noise (eg, increased touch-to-display noise). However, the improved signal level may outweigh the reduction of the cancellation of coexistence noise to improve the SNR. Although staggering is shown for diagonally adjacent touch nodes of pairs of columns where other staggering patterns are possible, the level of suppression of coexistence noise (improved by a smaller differential cancellation pitch) and the level of suppression of coexistence noise (with the opposite phase) There is a trade-off between signal levels (which is improved by increasing the distance between the drive electrodes). It is also noted that staggering the stimulus pattern should not affect (or should have a minimal effect on) the level of display-to-touch noise, since display-to-touch noise is primarily mitigated by differential sensing. You have to understand.

As shown in FIG. 13B, staggering can be implemented by changing the routing between the column electrodes and drive circuitry. For example, routing traces output by driver circuit 1306A may include one output to column electrode 1304A and a complementary output to column electrode (1304D rather than 1304B as in FIG. 13A). . Similarly, routing traces output by driver circuit 1306B may include one output to column electrode 1304C and a complementary output to column electrode (1304B rather than 1304D as in FIG. 13A). In some examples, staggering can be implemented using the driver circuitry without changing the routing between the electrodes of the touch sensor panel and the driver circuitry. For example, switching circuitry can be implemented between the routing traces and the output of the driver circuitry to achieve a staggered pattern of drive signals. Alternatively, the driver circuitry may use different control signals to generate a staggered pattern (e.g., output TX0− from the output of driver circuit 1305B coupled to column electrode 1304D in FIG. 13A). and output TX1− from the output of the driver circuit 1305A coupled to the column electrode 1304B). Implementing the staggering pattern without changing routing may provide improved flexibility for implementing differential and non-differential scans. For example, while touch sensing can be implemented using a differential configuration, in some examples stylus sensing can be implemented without using differential actuation or differential sensing. For example, the plurality of first electrodes and the plurality of second electrodes may be configured as receiver electrodes during an active stylus sensing operation. A first row electrode and a second row electrode for each row of the two-axis array of touch nodes may be coupled to each other and to an input of the sensing circuit. Thus, implementing the staggering pattern without changing routing allows implementation of differential or single-ended scanning modes.

In some examples, differential drive and sensing can operate in different modes for touch sensing based on noise conditions. For example, a touch system may use the staggering described herein to perform touch sensing operations under relatively more noise conditions (eg, exceeding a threshold amount of noise while a charger is plugged in, etc.) can do so that the sensed signal is boosted (but boosted with less cancellation of coexisting noise), but the touch system is (eg, less than a threshold amount of noise, while not plugged into a charger, etc.) The signal level may be relatively small (e.g., attenuated compared to staggering), although improved cancellation may occur by being able to perform the touch sensing operation without staggering under relatively low noise conditions.

Although staggering is primarily described in the context of the stimulus applied to the column electrodes in FIG. 13B, it is understood that a similar principle may additionally or alternatively be applied to stagger the connections between the row electrodes and the sensing circuitry. do. For example, rather than differentially using one differential amplifier to sense both row electrodes in a row, in some examples one row electrode can be coupled to a first input of a first differential amplifier and a second A row electrode can be coupled to a first input of the second differential amplifier. If staggering is implemented on both the excitation and sensing surfaces of the touch sensor panel, the staggering applied to the excitation and sensing surfaces will not interfere with the ability to measure differential touch signals. It is understood that such precautions must be taken to avoid

As described herein, in some examples, the routing for including the row electrodes and column electrodes of the touch sensor panel can be implemented at least partially in the active area. Active area routing may allow devices with reduced border areas (eg, around the active area). 14A and 14B show a two-layer (e.g., corresponding to touch sensor panel 700) comprising touch electrodes and routing traces in a first layer and bridges in a second layer, according to examples of the present disclosure. Illustrate the configuration. Specifically, FIG. 14A illustrates a first layer 1400A (also referred to herein as “Metal 2” or “TM2”) of a two-layer configuration, and FIG. 14B illustrates a second layer ( 1400B) (also referred to herein as “Metal 1” or “TM1”). Both the first layer 1400A and the second layer 1400B may be metal mesh layers corresponding to the metal layers 506 and 516 . In some examples, the first layer including the touch electrodes can be positioned relatively closer to the cover glass than the second layer. To show the overlapping contents of the layers, FIGS. 14A and 14B each illustrate touch electrodes, routing traces and bridges, but in FIG. 14A the touch electrodes and routing traces within layer 1400A are highlighted and layer 1400B ) are de-emphasized, while in FIG. 14B the bridges in layer 1400B are highlighted and the touch electrodes and routing traces in layer 1400A are de-emphasized. Darker/thicker lines are provided for emphasis compared to lighter/thinner lines for de-emphasized content.

14A illustrates row electrodes 1402A through 1402F and column electrodes 1404A through 1404F (eg, corresponding to row electrodes 702A through 702F and column electrodes 704A through 704F). Additionally, FIG. 14A shows row routing traces 1403A through 1403F (eg, corresponding to row routing traces 703A through 703F and column routing traces 705A through 705F) and column routing traces 1405A through 1405A. 1405F) is exemplified. 14B illustrates bridges 1410, which may be connected to the first layer using a pair of vias at opposite ends (eg, horizontal ends) of the bridge. Unlike FIG. 7A which illustrates routing traces in a different layer than the touch electrodes, routing traces in FIGS. 14A and 14B are implemented on the same layer. As a result, the routing traces that can be used to interconnect the segments of the touch electrodes to each other (and to the drive/sensing circuitry) can also result in further segmentation of the metal mesh of the touch electrodes. In some examples, these segments of touch electrodes can be electrically interconnected using bridges. For example, column electrodes 1404A-1404F may include multiple conductive segments interconnected by routing and/or bridges. Similarly, row electrodes 1402A-1402F may include multiple conductive segments connected to each other and to the sensing circuitry by routing and/or bridges.

As an illustrative example, column electrode 1404A connects conductive segments across routing trace 1405A (including routing trace segments 1405A_1 to 1405A_3) and (routing traces 1403C, 1405B) to each other and to drive circuitry. conductive segments (rather than the two segments shown in FIG. 1404A_1 to 1404A_5). As another illustrative example, row electrode 1402A includes bridges 1410B_1 to 1410B_10 bridging the conductive segments across routing traces including routing 1403A and 1405A to 1405F to each other and to the sensing circuitry. ) connected by bridges 1410 (routing traces including 1405A to 1405F, two segments connected by routing 702A″′) as shown in FIG. (rather than 702A', 702A") conductive segments 1402A_1 to 1402A_13.

14A and 14B show example representations of electrodes, routing and bridges, it is understood that other arrangements of electrodes, routing and bridges may be implemented. It is also understood that for simplicity of illustration, some bridges between conductive segments may not be shown (e.g., conductive segment 1402A_1, conductive segment 1402A_3, and/or conductive segment 1402A_11 may be may extend beyond the bottom edge(s) of conductive segment 1404A_1 and be connected at the bottom edge(s), eg, by one or more bridges across routing traces, e.g., across routing trace 1405A_2. there is). 14A and 14B show two vertical routing traces for complementary drive signals per column of column electrodes and two vertical routing traces per row of row electrodes (eg, two vertical routing traces per pair of row electrodes). Although illustrative, it should be understood that different numbers of vertical routing traces for rows and/or columns are possible. Although the touch sensor panel of FIGS. 14A and 14B includes a 3x3 array of 9 dominant capacitance values (e.g., corresponding to 9 valid touch nodes), the touch sensor panel is extended to include fewer or more touch nodes. Or it should be understood that it can be reduced.

14A and 14C show a touch electrode and routing traces in a first layer and bridges and stacked routing traces in a second layer (e.g., in a touch sensor panel 700) according to examples of the present disclosure. corresponding) two-layer configuration. Stacking the routing traces can reduce the resistance of the routing traces and increase the bandwidth of the touch sensor panel compared to the two-layer configuration of FIGS. 14A and 14B without stacked routing traces. Specifically, FIG. 14A illustrates a first layer 1400A (also referred to herein as “Metal 2” or “TM2”) of a two-layer configuration, and FIG. 14B illustrates a second layer ( 1400C) (also referred to herein as “Metal 1” or “TM1”). Both the first layer 1400A and the second layer 1400C may be metal mesh layers corresponding to the metal layers 506 and 516 . In some examples, the first layer including the touch electrodes can be positioned relatively closer to the cover glass than the second layer. To show the overlapping contents of the layers, FIGS. 14A and 14C each illustrate touch electrodes, routing traces and bridges, but in FIG. 14A the touch electrodes and routing traces within layer 1400A are highlighted and layer 1400C ) are de-emphasized, whereas in FIG. 14C bridges and routing in layer 1400C are emphasized and touch electrodes and routing traces in layer 1400A are de-emphasized. Darker/thicker lines are provided for emphasis compared to lighter/thinner lines for de-emphasized content.

As described herein, FIG. 14A illustrates row electrodes 1402A through 1402F, column electrodes 1404A through 1404F, row routing traces 1403A through 1403F, and column routing traces 1405A through 1405F. do. 14C illustrates bridges 1410, row routing traces 1413A-1413F and column routing traces 1415A-14145F. Bridges 1410 are connected to the first layer using a pair of vias at opposite ends (eg, horizontal ends) of the bridge to connect segments that would otherwise be electrically disconnected due to routing traces. can be connected Unlike in FIG. 14B which illustrates bridges without routing traces in the second layer, in FIG. 14C the second layer also includes additional routing traces (stacked routing traces) corresponding to the routing traces in the first layer. can do. Routing traces in layers 1400A and 1400C may be coupled to each other using vias outside or within the active area.

For example, in addition to coupling segments of column electrode 1404A to each other and to drive circuitry using routing trace 1405A (including routing trace segments 1405A_1 to 1405A_3) within layer 1400A, Additional routing trace segments 1415A_1 - 1415A_5 in the second layer 1400C may be used to reduce the effective resistance of the routing trace (eg, by approximately half). For example, routing trace segment 1415A_1 can run parallel to routing trace segment 1405A_1, routing trace segments 1415A_3 and 1415A_4 can run parallel to routing trace segment 1405A_2, and so on. Additionally, routing trace segments 1415A_2 and 1415A_5 may also run parallel to routing trace segments 1404A_5 and 1404A_1, respectively.

In a similar manner, stacked routing can be used for row routing traces. For example, in addition to coupling segments of row electrode 1402A to each other using bridges 1410 (in layer 1400C) and to sensing circuitry using routing trace 1403A in layer 1400A. , additional routing trace segments 1413A_1 to 1413A_5 in the second layer 1400C may be used to reduce the effective resistance of the routing trace (eg, by approximately half). For example, routing trace segments 1415A_1 to 1415A_5 may run parallel to row routing trace 1403. Routing trace segments within layer 1400C may be interrupted by bridges within layer 1400C.

14A and 14C show example representations of electrodes, routing and bridges, it is understood that other arrangements of electrodes, routing and bridges may be implemented. It is also understood that for simplicity of illustration, some bridges between conductive segments may not be shown (e.g., conductive segment 1402A_1, conductive segment 1402A_3, and/or conductive segment 1402A_11 may be may extend beyond the bottom edge(s) of conductive segment 1404A_1 and be connected at the bottom edge(s), eg, by one or more bridges across routing traces, e.g., across routing trace 1405A_2. there is). 14A and 14C show two vertical routing traces for complementary drive signals per column of column electrodes and two vertical routing traces per row of row electrodes (eg, two vertical routing traces per pair of row electrodes). Although illustrative, it should be understood that different numbers of vertical routing traces for rows and/or columns are possible. Although the touch sensor panel of FIGS. 14A and 14C includes a 3x3 array of 9 dominant capacitance values (e.g., corresponding to 9 valid touch nodes), the touch sensor panel is extended to include fewer or more touch nodes. Or it should be understood that it can be reduced.

15A and 15B show two touch electrode segments 1552A, 1552B and a routing trace 1158 in a first layer (eg, metal 2 layer) and a second layer (metal 1 layer) according to examples of the present disclosure. Sectional views 1500 and 1550 of a two-layered region 1450 of FIGS. 14A-14C including a bridge 1554 and, optionally, stacked routing trace segments 1556A, 1556B in a layer). foreshadow Fractional view 1500 corresponds to the two-layer configuration of FIGS. 14A and 14B, while partial view 1550 corresponds to the two-layer configuration of FIGS. 14A and 14C. Although not shown, the first layer and the second layer may be separated by an insulating layer (eg, a dielectric layer). The electrodes, routing and bridges in FIGS. 15A and 15B are shown as a mesh representing a metal mesh implementation of the electrodes. As described herein, one end of the bridge 1554 may be coupled to the touch electrode segments 1552A (eg, using a via through an intermediate dielectric layer separating the first layer and the second layer). and a second end of the bridge 1554 can be coupled to the touch electrode segment 1552B (eg, using a via through the intermediate dielectric layer separating the first layer and the second layer). Stacked routing trace segments 1556A, 1556B of partial view 1550 (but not shown in partial view 1500 or corresponding FIG. 14B) are routing traces (e.g., using vias through an intermediate dielectric layer). (1558), respectively.

16 shows touch electrode segments 1652A-1652D stacked in a first layer and a second layer (including a bridge portion 1654), according to examples of the present disclosure, with a routing trace 1658 in the first layer. ), and a partial view 1650 of a two-layer construction comprising routing trace segments 1656A, 1656B stacked on a second layer. Stacking routing traces and stacking touch electrodes is compared to the two-layer configuration of FIGS. 14A and 14B without stacked routing traces and stacked electrodes, and in FIGS. 14A and 15A without stacked touch electrodes. Compared with the two-layer configuration, it is possible to increase the bandwidth of the touch sensor panel. For example, in addition to reducing the resistance of routing traces, stacked touch electrodes can increase capacitive signal coupling. 16 includes a partial view for ease of illustration, it is understood that stacked touch electrodes and stacked routing traces may be implemented throughout the touch sensor panel as described herein. Additionally, the stacked touch electrodes of FIG. 16 provide flexibility for placing a via between the touch electrode segments of two layers compared to the configurations of FIGS. 14A-15B. For example, in FIGS. 14B and 15B , opposite ends of each bridge can be connected using two vias (eg, one via per end) to interconnect the two segments using the bridge. However, as shown in FIG. 16 , the stacked touch electrode including the touch electrode segments 1652C and 1652D and the bridge portion 1654 are interconnected in a second layer, and the touch electrode segment between the two layers may be interconnected with the touch electrode segments 1652A and 1652B at any overlapping area between them.

Routing and/or stacking touch electrodes as described herein may result in reduced optical performance (eg, visibility of metal mesh) for the device. In particular, misalignment between the metal mesh between the first layer and the second layer can increase the visibility of the metal mesh to a user. 17A-17D illustrate cross-sectional views 1700, 1710, 1720, 1730 of a portion of exemplary two-layer constructions, according to examples of the present disclosure. 17A and 17B show a second layer with the metal mesh 1702/1702' in the first layer disposed on an interlayer dielectric (ILD) 1704 which may be disposed on the metal mesh 1706 in the second layer. - Illustrate cross-sectional views of parts of the layer configuration. The metal mesh may correspond to routing trace segments in the first layer and the second layer corresponding to stacked routing. The metal mesh in the first layer and the metal mesh in the second layer can have the same widths (eg, a trapezoid representing a metal mesh trace can have the same base width). In FIG. 17A , the metal mesh 1702 in the first layer and the metal mesh 1706 in the second layer may be invisible to a user looking down from the top of the first layer, such that the metal mesh 1706 in the second layer can be sorted so that However, as shown in FIG. 17B, when the metal mesh 1702' in the first layer is not aligned with the metal mesh 1706 in the second layer (eg, due to manufacturing limitations), the metal in the second layer The mesh 1706 may be visible to a user looking down from the top of the first layer.

In some examples, increasing the width of the metal mesh in the first layer and/or reducing the width of the metal mesh in the second layer ensures that the metal mesh in the first layer overlaps the metal mesh in the second layer. Optical performance can be improved. 17C and 17D show a second layer with the metal mesh 1712/1712' in the first layer disposed on an interlayer dielectric (ILD) 1704 which may be disposed on the metal mesh 1706 in the second layer. - Illustrate cross-sectional views of parts of the layer configuration. The metal mesh may correspond to routing trace segments in the first layer and the second layer corresponding to stacked routing. The metal mesh in the first layer and the metal mesh in the second layer may have unequal widths. In particular, the metal mesh 1712/1712' in the first layer ("TM2") is wider than the metal mesh in the second layer ("TM1"), which can improve the optical performance of the touch sensor panel. 17C and 17D, whether the metal mesh 1712 in the first layer is aligned with (eg, centered) the metal mesh 1706 in the second layer or the metal mesh 1712' is aligned with the metal mesh 1706 in the second layer. Whether offset (eccentric) from the metal mesh 1706 in the layer, the metal mesh 1706 may not be visible to a user looking down from the top of the first layer, thereby reducing the visibility of the metal mesh as a whole.

In some examples, visibility improvement may be achieved by increasing the width of the metal mesh 1712/1712' compared to the width of the metal mesh 1702/1702'. In some examples, the visibility improvement can be achieved by reducing the width of the metal mesh 1706 shown in FIGS. 17C and 17D compared to the width of the metal mesh 1706 shown in FIGS. 17A and 17B . In some examples, the visibility improvement increases the width of the metal mesh 1712/1712' compared to the width of the metal mesh 1702/1702' and the width of the metal mesh 1706 shown in FIGS. 17A and 17B. In comparison, this can be achieved by reducing the width of the metal mesh 1706 shown in FIGS. 17C and 17D. For example, metal mesh 1702 and metal mesh 1706 may each be 4 microns wide in FIG. 17A, whereas metal mesh 1712 and metal mesh 1706 may be 5 microns and 3 microns wide, respectively. can be meters.

In some examples, the optical performance of the touch sensor panel may be improved by partially implementing the touch electrodes in two layers rather than fully stacking the touch electrodes (eg, as shown in FIG. 16 ). 18 illustrates a portion of a two-layer configuration including a configuration 1800 of a touch electrode implemented partially in a first layer and partially in a second layer, according to examples of the present disclosure. For example, metal mesh 1802A can be implemented in a first layer and metal mesh 1802B can be implemented in a second layer. Referring back to FIG. 16 , touch electrode segments 1652A and 1652C overlap, and touch electrode segments 1652B and 1652D overlap. Consequently, to reduce optical artifacts, the alignment of metal mesh traces (eg, as described in FIG. 17A) should be maximized over a relatively large area of the touch electrode. For example, FIG. 16 shows a horizontal portion and/or a vertical portion of a parallel metal mesh between two layers. In contrast, in configuration 1800 of FIG. 18 , metal mesh 1802A can be implemented in a first layer and metal mesh 1802B can be implemented in a second layer, such that overlap between the two layers is reduced. can make it Additionally, as shown in FIG. 18 , when the metal mesh 1802A in the first layer and the metal mesh 1802B in the second layer overlap, the point of overlap is a non-parallel intersection (eg, an orthogonal intersection). . For example, intersection point 1804 can represent a square or rectangular overlapping region where metal mesh 1802A and metal mesh 1802B overlap. These identical square or rectangular overlapping areas may appear at each intersection point shown in FIG. 18 . As a result, the appearance of the metal mesh between the first layer and the second layer will have a relatively uniform appearance across the touch sensor panel (eg, uniform area at the intersection points and uniform width outside the intersection points). can

Like FIG. 16, the configuration 1800 of FIG. 18 also provides flexibility in terms of placement of vias (eg, not limited to bridges as in the configurations of FIGS. 14A-15B). However, the bandwidth improvement from the configuration of FIG. 18 is relatively smaller than the bandwidth improvement from the configuration of FIG. 16 (eg, because less metal mesh is used to implement the touch electrode across the two layers), while FIG. It should be appreciated that the optical performance of the configuration of 18 may be greater than that of the configuration of FIG. 16 .

As described herein (eg, with respect to FIGS. 11A-11D ), in some examples, routing traces for a row for a (differential) sense amplifier may affect crosstalk between adjacent rows within a column. there is. In some examples, crosstalk can be mitigated using differential routing traces as described with reference to FIG. 11D, for example when performing differential measurements. However, some touch sensor panel operations may not include differential measurements. For example, a self-capacitance scan or a stylus scan in which touch electrodes may be simultaneously stimulated with the same phase drive signal may not be performed differentially. In some examples, crosstalk can be reduced by embedding routing traces (eg, rather than stacking routing traces as described with reference to FIGS. 15A or 16 ).

19A shows touch electrode segments 1952A-1952D stacked in the first and second layers and routing traces 1956, 1958 stacked in the first and second layers, according to examples of the present disclosure. It illustrates a partial view 1900 of a two-layer configuration including. FIG. 19A may correspond to FIG. 16 in the region where the bridge portion 1654 is absent. 19A also shows a two-layer configuration with a metal mesh 1902 in the first layer disposed on an interlayer dielectric (ILD) 1904 which may be disposed on a metal mesh 1906 in the second layer. Corresponding cross-sectional views of portions are illustrated. 19B is a two-layer configuration including touch electrode segments 1962A-1962C stacked in a first layer and a second layer and a routing trace 1966 buried in the second layer, according to examples of the present disclosure. Illustrates a partial view 1910 of 19A also shows a two-layer configuration with a metal mesh 1902 in the first layer disposed on an interlayer dielectric (ILD) 1904 which may be disposed on a metal mesh 1906 in the second layer. Corresponding cross-sectional views of portions are illustrated. Unlike FIG. 19A , in FIG. 19B the buried routing traces 1966 may be at least partially shielded from crosstalk due to an object proximate to the touch sensor panel (eg, a finger or stylus). In some examples, cross coupling can be reduced from approximately 10% of a full-scale touch signal to approximately 2% of a full-scale touch signal.

Although burying routing traces can reduce crosstalk, increasing metal mesh can also increase parallel plate capacitance between the first layer and the second layer, which can reduce the bandwidth of the touch sensor panel. In some examples, the increase in parallel plate capacitance can be mitigated by changing the characteristics of the ILD. 19C shows a two-layer configuration including touch electrode segments 1972A-1972C stacked in a first layer and a second layer and a routing trace 1976 buried in the second layer, according to examples of the present disclosure. Illustrates a partial view 1920 of FIG. 19C also shows a two-layer configuration with metal mesh 1902 in the first layer disposed on an interlayer dielectric (ILD) 1904′ which may be disposed on metal mesh 1906 in the second layer. Illustrates a corresponding cross-sectional view of a portion of The metal mesh touch electrodes and routing traces of FIG. 19C may be the same as or similar to the touch electrodes and routing traces of FIG. 19B. However, the ILD can be modified to have a thickness T2 in FIG. 19C that is greater than the thickness T1 in FIG. 19B (and as shown, the first and second layers in Figures 1920 are more separated from each other than the first and second layers in diagram 1910). In some examples, the increase in thickness may be between 25% and 500%. In some examples, the thickness increase may be between 100% and 250%. In some examples, the increase in thickness may be between 150% and 200%. It should be understood that the above ranges are examples and the thickness can be increased to achieve a desired bandwidth for the touch sensor panel.

Additionally or alternatively, the ILD can be modified to have a different dielectric constant in FIG. 19C that is smaller than the dielectric constant of the ILD in FIG. 19B. In some examples, the dielectric constant of the ILD in FIG. 19C may be between 25% and 75% of the dielectric constant of the ILD in FIG. 19B. In some examples, the dielectric constant of the ILD in FIG. 19C may be 25% to 50% of the dielectric constant of the ILD in FIG. 19B. It should be understood that the above ranges are examples and that the dielectric can be reduced to achieve a desired bandwidth for the touch sensor panel. In some examples, the dielectric constant can be lowered by using organic materials such as photo-patternable ultraviolet curable acrylics or other suitable materials.

Because the parallel plate capacitance is proportional to the dielectric constant and inversely proportional to the separation distance between the plates, increasing the ILD thickness or decreasing the dielectric constant of the ILD can reduce the parallel plate capacitance and improve the touch sensor panel bandwidth.

As described herein, the SNR of a touch sensor panel using metal mesh touch electrodes can be relatively low compared to a touch sensor panel using a transparent conductor such as indium tin oxide. Conceptually, a source of signal loss is that non-solid structures (e.g., gaps) in the metal mesh allow some exposure of the device ground (e.g., display cathodes), so that only a portion of the signal is coupled to the metal mesh. can In some examples, the signal loss may be 30 to 70% depending on the size of the object proximate to the touch sensor panel. In some examples, the metal mesh in the first layer can be flooded or otherwise filled with a transparent conductive material (eg ITO) to boost the SNR (eg, boost the touch signal).

20A shows touch electrode segments 2052A-2052D stacked in the first and second layers and routing traces 2056, 2058 stacked in the first and second layers, according to examples of the present disclosure. It illustrates a partial view 2000 of a two-layer configuration including. 20B and 20C illustrate examples of corresponding cross-sectional views of a portion of a two-layer construction comprising ITO flooded water, according to examples of the present disclosure. As shown in FIG. 20A (and unlike FIG. 19A ), the metal mesh of the touch electrode segments 2052A, 2052B and routing trace 2058 in the first layer is a transparent conductive material such as ITO or any other suitable material. It may be partially or completely filled (eg, flooded) with a transparent or translucent conductive material. The conductive material can fill the gaps in the metal mesh and boost the signal received at the touch electrodes (eg, the signal is received by the ITO rather than passing to the ground electrodes in the device). In some examples, the metal mesh of the touch electrodes can have lower resistive properties compared to a transparent conductor, allowing the metal mesh to handle the conduction required for touch sensing. As a result, the requirements of the sheet resistance of the transparent conductor can be reduced. In some instances, the relaxed sheet resistance of the transparent conductor may allow low temperature deposition techniques (eg, low temperature ITO deposition) to be used.

In some examples, as shown in FIG. 20B , the transparent conductor is deposited on the metal mesh and may be deposited directly on the metal mesh layer. For example, FIG. 20B shows a metal mesh 2002 in a first metal mesh layer disposed on an interlayer dielectric (ILD) 2004 which may be disposed on a metal mesh 2006 in a second metal mesh layer. Illustrates a cross-sectional view of a portion of the two-layer construction of ITO 2001 (or other suitable transparent conductor) may be deposited on the metal mesh 2002. As described herein, connections between the first and second layers of metal mesh may be achieved using vias in the ILD. In some examples, as shown in FIG. 20C , the transparent conductor may be separated from the metal mesh layer by another ILD. For example, FIG. 20C shows a metal mesh 2002 in a first metal mesh layer disposed on a first interlayer dielectric (ILD) 2004B, which may be disposed on a metal mesh 2006 in a second metal mesh layer. A cross-sectional view of a portion of a two-layer construction in an as-built state is illustrated. A second ILD 2004A may be deposited on the metal mesh 2002, and ITO 2001 (or other suitable transparent conductor) may be deposited on the second ILD 2004A. As described herein, connections between the first and second layers of metal mesh may be achieved using vias in the ILD. Additionally, connections between the ITO 2001 and the metal mesh 2002 may be achieved using vias through the second ILD 2004A.

Additionally or alternatively, in some examples, rather than burying routing traces as described with reference to FIGS. 19B and 19C , a filling of a conductive material (eg, optional ITO filling) is used for selected portions of the metal mesh. By doing so, crosstalk can be reduced. 21 shows touch electrode segments 2152A-2152D stacked in the first and second layers and routing traces 2156, 2158 stacked in the first and second layers according to examples of the present disclosure. It illustrates a partial view 2100 of a two-layer configuration including. As shown in FIG. 21 (and unlike FIG. 20A ), the metal mesh of the touch electrode segments 2152A, 2152B in the first layer may route the routing trace 2158 (e.g., using a mask to prevent charging). (e.g., filled) with a transparent conductive material, such as ITO, or any other suitable transparent or translucent conductive material, without filling with a conductive material. In some examples, routing trace 2058 may also be filled, but the filling of conductive material may be etched away. The conductive material can fill the gaps in the metal mesh touch electrodes and boost the signal received at the touch electrodes (eg, the signal is received by ITO rather than passing to ground electrodes in the device). However, crosstalk coupling through routing trace 2158 may not be boosted without a filler on routing trace 2158 (e.g., 4-6% of the full scale touch signal at touch electrodes 2152A, 2152B). can be reduced to). As a result, crosstalk can be reduced using selective ITO flooding without burying routing traces as described with reference to FIGS. 19B and 19C.

Although described separately, it should be understood that the various features described herein may be used in combination. For example, the embedding of routing traces described with reference to FIG. 19B may be combined with the improved ILD characteristics described with reference to FIG. 19C and/or the improved signal characteristics of ITO floods described with reference to FIGS. 20A-20C. can As another example, the routing techniques described with reference to FIGS. 14A to 21 may be applied to the touch sensor panels described with reference to FIGS. 7A to 13B .

As described herein, in some examples, noise from the display can couple to the touch electrodes due at least in part to the proximity of the display to the touch electrodes of the touch sensor panel. In some examples, a shield layer or display-noise sensor can be disposed on a print layer (eg, an encapsulation layer) to reduce noise from the display. 22 illustrates an example touch screen stackup 2200 that includes an encapsulation layer 2208 for isolation and an optional dielectric layer 2214 according to examples of the present disclosure. In some examples, the various layers of stackup 2200 may be formed using a shared fabrication process. In such examples, the components are stacked on their respective locations within stackup 2200 in a serial fashion (e.g., without relying on individual components being manufactured at an earlier time and then transported to a location within stackup 2200). manufactured and placed. In some examples, components that are manufactured and placed on their respective locations within the stackup 2200 and that are not separately manufactured as discrete or semi-discrete components are on-chip fabrication/manufacturing components, or on-chip for fabrication. may refer to components fabricated using techniques. As discussed below, stackup 2200 includes a number of such components that are fabricated using on-chip techniques for fabrication, which require an alternative "discrete" transfer to stackup 2200. They offer several advantages over components.

Stackup 2200 can, in some examples, be built or fabricated on substrate 2202. Substrate 2202 may be a printed circuit board substrate, a silicon substrate, or any other suitable base substrate material(s) for stackup 2200 . Display components 2204 (eg, corresponding to display components 508 ) may, in some examples, be formed over substrate 2202 and include a plurality of display elements arranged in an array (eg, in rows and columns). may include Each display element may, in some examples, include a display pixel. In some examples, a display pixel can correspond to light emitting components capable of producing colored light. Examples of display pixels may include a backlit liquid crystal display (LCD), or a light emitting diode (LED) display including organic LED (OLED), active-matrix organic LED (AMOLED) and passive-matrix organic LED (PMOLED) displays. . In some examples, a display pixel may include multiple sub-pixels (eg, 1, 2, 3, or more sub-pixels). As an example, a display pixel may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, where the various sub-pixels have respective dimensions relative to each other and to dimensions of the entire display pixel. In some examples, the red, green, and blue sub-pixels may have approximately or substantially similar dimensions to each other (eg, the sub-pixels are all within 5% of the target dimension or area for the sub-pixels). In other examples, a blue subpixel may occupy approximately 50% of the area of a display pixel, with red and green subpixels occupying the remaining 50% of the area (e.g., each occupying 25% of the area of a display pixel). box). In some examples, display components 2204 are formed entirely over substrate 2202 . In other examples, display components 2204 are formed over portions of substrate 2202 (eg, some portions of substrate 2202 do not have display components 2204 formed thereon).

In some examples, passivation layer 2206 may be formed over display components 2204 . In some such examples, passivation layer 2206 may directly contact display components 2204 . Similar to layers 507 and 517 described with respect to FIG. 5 , passivation layer 2206 can planarize the surface of display components 2204 and provide electrical isolation (eg, passivation) to display components 2204 . isolation from components in other layers formed over layer 2206). In some examples, passivation layer 2206 is formed after all display sub-pixels and pixels (eg, of display components 2204 ) have been fabricated or formed over substrate 2202 . In some examples, passivation layer 2206 is formed over all of display components 2204 . In some examples, additional passivation layers similar to passivation layer 2206 may be added to any of the layers of stackup 2200, the fabrication of which may result in a non-uniform surface (e.g., a surface on which additional layers are difficult to form). can be formed on top of it. In some examples, an additional passivation layer similar to passivation layer 2206 can be provided over the first encapsulation layer 2208 so that it is in direct contact with the first encapsulation layer and/or a second encapsulation layer so that it is in direct contact with the second encapsulation layer. An encapsulation layer 2212 may be provided over. In some such examples, forming a passivation layer over the first encapsulation layer and/or the second encapsulation layer can improve the fidelity and manufacturability of the components/layers in the stackup 2200 formed over those layers.

In some examples, a first encapsulation layer 2208 may be formed over the passivation layer 2206 . In some such examples, the first encapsulation layer 2208 may directly contact the passivation layer 2206 . In some examples, the first encapsulation layer 2208 may be referred to as a “printed layer” when it is deposited over/on the passivation layer 2206 using a printing or deposition technique. In some examples, the first encapsulation layer 2208 can be deposited on the passivation layer 2206 using an inkjet printing technique. In some examples, inkjet printing techniques may allow layers to be selectively deposited (eg, deposited over a portion of an underlying layer) or globally/blanket deposited (eg, deposited over an entire underlying layer). In some examples, the first encapsulation layer 2208 can be selectively inkjet printed over the regions of the passivation layer 2206 upon which the display components 2204 are formed. In other examples, the first encapsulation layer 2208 can be inkjet printed (eg, blanket deposited) over the entirety of the passivation layer 2206 . The first encapsulation layer 2208 can be an optically transmissive or transparent layer through which light emitted from the display components 2204 can pass. In some examples, the thickness of the first encapsulation layer 2208 is less than the critical thickness (eg, less than or equal to 10 microns, less than or equal to 12 microns, or less than or equal to 14 microns, etc.).

In some examples, a display-noise shield/sensor 2210 can be formed over the first encapsulation layer 2208 . In some such examples, a layer of the display-noise shield/sensor 2210 may directly contact the first encapsulation layer 2208 . During the fabrication process of stackup 2200, display-noise shield/sensor 2210 is fabricated over first encapsulation layer 2208 after layer 2208 is inkjet printed over passivation layer 2206. As discussed with respect to later figures relating to display-noise shield/sensor 2210, shield/sensor is formed from one or more metal layers that may be formed and/or deposited directly over first encapsulation layer 2208. It can be. Providing the display-noise shield/sensor 2210 in this manner may sometimes be referred to herein as “manufacturing by an on-cell process” or in situ manufacturing technique. The process of fabricating a display-noise shield/sensor using an on-cell process includes previous layers (e.g., substrate 2202, display components 2204, passivation layer 2206, and first encapsulation layer 2208). ) compared to alternative techniques in which discrete or semi-discrete components are manufactured using a process different from that used to manufacture (e.g., at a different time, location, using different manufacturing equipment, etc.) offers advantages. In some examples, these advantages are achieved by aligning the (semi-)discrete components associated with the display-noise shield/sensor to already fabricated layers 2202-2208, using a laminate or adhesive to and the elimination of the alignment and lamination steps associated with attaching the to already fabricated layers 2202-2208. These advantages of fabricating the display-noise shield/sensor using an on-cell process contribute to lower yield losses of the overall stackup 2200 compared to alternative processes. Additionally or alternatively, in some examples, the thickness of the touch sensor panel can be reduced using an on-cell process compared to individual touch sensors laminated to the display, thereby reducing the overall thickness of the touch screen.

The display-noise shield/sensor 2210 may be a shield and/or a sensor depending on the implementation. Whether the display-noise shield/sensor 2210 is a shield or a sensor, the shield/sensor 2210 can be fabricated over the first encapsulation layer 2208 . As noted above, in some examples, layer 2208 can sometimes be selectively inkjet printed onto portions of passivation layer 2206 upon which display components 2204 are formed. In such examples, the display-noise shield/sensor 2210 is formed only on their selectively inkjet printed portions of the first encapsulation layer 2208. In some examples, when the display-noise shield/sensor 2210 is a shield, the shield may include a single conductive layer (eg, an ITO layer, a metal layer) or a metal mesh layer. In some examples, the shield layer can be flooded with conductive material(s) (eg ITO, metal). In some examples, the shield layer can include a global mesh pattern such that the footprint of the display-noise shield/sensor 2210 can be occupied by an electrically connected conductive metal mesh. In some examples, the shield layer can include a combination of metal mesh flooded with a conductive material. Conductive materials can help mitigate noise signals generated by display components 2204 from interfering with components formed over display-noise shield/sensor 2210 in stackup 2200 . In some examples, a shield layer comprising a metal mesh in combination with a flood of conductive material can provide improved isolation compared to the metal mesh alone, and reduced resistivity compared to a flood of conductive material alone. In such examples, patches of flooding of conductive material are placed between the metal meshes to create a layer associated with the shield/sensor 2210, sometimes referred to as a layer having alternating metal mesh and conductive material portions (e.g., here wherein the conductive material portions are formed or positioned between gaps in the metal mesh). In such examples, this combination first forms a metal mesh layer (eg, by depositing and/or patterning the first conductive material according to a mesh pattern), and then (eg, a patch pattern aligned to the mesh pattern—the mesh pattern may be formed by forming a flood of conductive material between the mesh patterns of the metal mesh layer (by depositing and/or patterning a second conductive material according to where the paths of material are aligned with the open paths of the patch pattern). there is. One alternative process for forming the combination is to first form a flood of conductive material within patches (eg, by depositing and/or patterning a second conductive material according to a patch pattern), then (eg, by depositing and/or patterning a second conductive material according to a patch pattern) (by depositing and/or patterning a first conductive material according to a mesh pattern aligned to the pattern, wherein the patches of material of the patch pattern are aligned with open sections of the mesh pattern) within the spaces between the patches. may be forming Another alternative process for forming the combination is to first form a flood of conductive material as a solid layer (e.g., directly over the first encapsulation layer 2208), and then subsequently form a metal mesh pattern over the solid layer of conductive material. may be formed.

When the shield layer is formed using two conductive materials (eg, a first material for the mesh pattern, and a second material for the patch pattern) in this way, the first conductive material for the mesh pattern forms the patch pattern. It may be different from the second conductive material for As an example, the first conductive material for the mesh pattern may be aluminum (Al), copper (Cu), or any other suitable conductive material for forming a metal mesh in the shield layer 2210 . As another example, the material for the mesh pattern is conductive deposited as multiple layers, such as a layer of titanium (Ti) on which a layer of aluminum (Al) is deposited on which a layer of titanium (Ti) is deposited. It can be a combination of materials. In some such examples, the mesh pattern formed of the layers of titanium, aluminum and titanium may be over or under the second conductive material. As an example, the second conductive material for the optional patch pattern forms patches that may be formed over, under, or between ITO, silver (Ag) nanowires, or metal mesh in the shield/sensor 2210 layer. It may be any other suitable transparent (or substantially transparent) conductive material for Thus, in some examples, the layer associated with shield/sensor 2210 may be referred to as a metal mesh layer with patches of ITO, silver, or any other suitable conductive material to form the patches.

In some examples, instead of a continuous conductive layer (or a metal mesh pattern, or a combination of both) across the footprint of the display-noise shield/sensor 2210, multiple conductive segments (e.g., the same metal or different metal) to form a shielding layer. In such examples, the segments can be aligned to sub-pixel elements of display components 2204 .

In examples where the display-noise shield/sensor 2210 is a sensor, the sensor may include multiple metal layers or metal mesh layers. Conductive segments with some correspondence to the row and column touch electrodes (e.g., of touch sensor 2216) are formed within one of the metal (mesh) layers of display-noise shield/sensor 2210 so that the sensor (e.g., sensor electrodes) can be formed. In some examples, continuous column electrodes may be formed in the first metal (mesh) layer of the display-noise shield/sensor 2210, with non-continuous row electrodes also formed in the first metal (mesh) layer. In some examples, the second metal (mesh) layer can include bridges connecting discontinuous row electrodes in the first metal (mesh) layer. In some examples, the conductive segments in the metal (mesh) layers of display-noise shield/sensor 2210 can have a one-to-one correspondence to the row and column touch electrodes of touch sensor 2216 (e.g., display-noise sensor Each conductive patch of 2210 has a single corresponding touch electrode of touch sensor 2216 such that the patterning of the electrodes of the display-noise sensor and the touch electrodes of touch sensor 2216 are the same). In some examples, the conductive segments within the metal (mesh) layers of display-noise shield/sensor 2210 may have a size based on respective sizes of the row and column touch electrodes of touch sensor 2216 (e.g., display -Each conductive patch of noise sensor 2210 has the same size as or proportional to the corresponding touch electrode of touch sensor 2216). In examples where the conductive segments in the metal (mesh) layers of display-noise shield/sensor 2210 are smaller than the corresponding row and column touch electrodes of touch sensor 2216, the conductive segments in the layers of sensor 2210 are the touch sensor 2216 may be centered around the center point of the corresponding touch electrode. In some examples, conductive segments in the metal (mesh) layers of display-noise shield/sensor 2210 are aligned to sub-pixel elements of display components 2204 and/or touch electrodes of touch sensor 2216.

In some examples, a second encapsulation layer 2212 can be formed over the display-noise shield/sensor 2210 . In some such examples, the second encapsulation layer 2212 may directly contact the layer of the display-noise shield/sensor 2210 . Similar to the first encapsulation layer 2208, the second encapsulation layer 2212 can be printed using selective or blanket printing. In some examples, the second encapsulation layer 2212 may be referred to as a “printed layer” when it is deposited over/on the display-noise shield/sensor 2210 using a printing or deposition technique. In some examples, the second encapsulation layer 2212 can be deposited over/on the display-noise shield/sensor 2210 using an inkjet printing technique. In some examples, inkjet printing techniques may allow layers to be selectively deposited (eg, deposited over a portion of an underlying layer) or globally/blanket deposited (eg, deposited over an entire underlying layer). In some examples, the second encapsulation layer 2212 can be selectively inkjet printed over the areas of the display-noise shield/sensor 2210 upon which the display components 2204 are formed. In other examples, the second encapsulation layer 2212 can be inkjet printed (eg, blanket deposited) over the entirety of the display-noise shield/sensor 2210 . The second encapsulation layer 2212 can be an optically transmissive or transparent layer through which light emitted from the display components 2204 can pass. In some examples, the thickness of the second encapsulation layer 2212 is less than the critical thickness (eg, 10 microns or less, 12 microns or less, 14 microns or less, etc.).

A dielectric layer 2214 can optionally be formed over the second encapsulation layer 2212 as an isolation layer to isolate the display-noise shield/sensor 2210 from the touch sensor 2216 . In some examples, if one or more metal layers of display-noise shield/sensor 2210 are flooded or provided with a global metal mesh, the high parasitic capacitance may be associated with the row/column electrodes of touch sensor 2216 and display-noise. may occur between the shield/sensor 2210. In such examples, this high capacitance (referred to as C _{M2_M4} in the context of FIG. 29 ) can result in reduced bandwidth for touch signal sensing by touch sensor 2216 . In some examples, the thickness of dielectric layer 2214 is less than a threshold thickness (eg, 3 microns or less, 5 microns or less, 7 microns or less, etc.).

A touch sensor 2216 can be formed over the second encapsulation layer 2212 and/or the dielectric layer 2214 (eg, when the dielectric layer 2214 is included in the stackup 2200 ). Touch sensor 2216 can have metal patterns aligned to display components 2204 (and display-noise shield/sensor 2210) such that the metal patterns of touch sensor 2216 are aligned to display components 2204. light emitted by it may not be obstructed or blocked. In some examples, touch sensor 2216 can be fabricated using an on-cell process over second encapsulation layer 2212 and/or dielectric layer 2214 . In other examples, touch sensor 2216 can be fabricated separately (e.g., at a time prior to stackup 2200 fabrication) as a discrete or semi-individual component, and subsequently, in previous layers (e.g., layers 2202-2214). ) can be transported to its location in the stack-up 2200 after fabrication. In some examples,

A polarization layer 2218 can be formed over the touch sensor 2216 and can include a material that selectively filters light so that only certain polarizations of light are transmitted through the material. In some examples, the thickness of the polarization layer 2218 can be between 10 and 150 microns, or between 30 and 80 microns in other examples. In some examples, the thickness of the polarization layer 2218 is less than a critical thickness (eg, 50 microns or less, 100 microns or less, etc.).

An adhesive layer 2220 may be formed over the polarization layer and may include an optically transmissive/transparent material that allows light to be transmitted therethrough. In some examples, the thickness of the adhesive layer 2220 can be between 10 and 80 microns, or between 35 and 55 microns in other examples. In some examples, the thickness of adhesive layer 2220 is less than a critical thickness (eg, 30 microns or less, 50 microns or less, 70 microns or less, etc.).

A cover layer 2222 may be formed over the adhesive layer 2220 and may include a glass or crystal layer. In some examples, the thickness of the cover layer 2222 can be between 60 and 120 microns, or between 75 and 105 microns in other examples. In some examples, the thickness of cover layer 2222 is less than a threshold thickness (eg, 75 microns or less, 95 microns or less, 115 microns or less, etc.).

23 illustrates example layers of a display-noise sensor 2210A formed on a printed layer of a touch screen stackup, in accordance with examples of the present disclosure. As described with respect to the general display-noise sensor 2210 of FIG. 22 , the display-noise sensor 2210A may be formed on the first encapsulation layer 2208 . In some examples, the first encapsulation layer 2208 is deposited using inkjet printing and forms a substantially flat surface on which the metal layer(s) can be formed (e.g., the first encapsulation layer 2208 points on the surface of are all within 5% of the target level height for the first encapsulation layer in stackup 2200).

A first metal layer 2302 can be formed over the first encapsulation layer 2208 . In some examples, display-noise sensor 2210A may be formed using an on-cell manufacturing technique (eg, by forming sensor 2210A directly on first encapsulation layer 2208 as part of the same manufacturing process). there is. In some examples, forming a display-noise sensor may require forming multiple metal layers (e.g., metal layers 2302 and 2306 separated by interlayer dielectric layer 2304 in FIG. 23); Multiple metal layers are separated by an interlevel dielectric layer therebetween and connected by vias through the interlevel dielectric layer.

In some examples, an on-cell fabricated display-noise sensor 2210A first forms a first metal layer 2302 over a first encapsulation layer 2208, then forms an interlayer dielectric layer 2304, and finally It can be formed by forming the second metal layer 2306 with. In some examples, the thickness of the first metal layer 2302 can be between 0.4 and 1 micron, or between 0.5 and 0.9 micron in other examples. In some examples, the thickness of the first metal layer 2302 can be less than a threshold thickness (eg, 0.4 microns or less, 0.6 microns or less, 0.8 microns or less, etc.). In some examples, the thickness of the interlevel dielectric layer 2304 can be between 1 and 2.2 microns, or between 1.3 and 1.9 microns. In some examples, the thickness of the interlevel dielectric layer 2304 can be less than a critical thickness (eg, 1.4 microns or less, 1.6 microns or less, 1.8 microns or less, etc.). In some examples, the thickness of the second metal layer 2306 can be between 0.4 and 1 micron, or between 0.5 and 0.9 micron in other examples. In some examples, the thickness of the second metal layer 2306 can be less than the critical thickness (0.4 microns or less, 0.6 microns or less, 0.8 microns or less, etc.).

In some examples, the first and second metal layers 2302 and 2306 are row noise-sensor electrodes and column noise of display-noise sensor 2210A, corresponding to the row and column touch electrodes of touch sensor 2216. -Can be used to form sensor electrodes. As an example, row noise-sensor electrodes and thermal noise sensor electrodes in the first and second metal layers 2302, 2306 can form a mutual capacitance type touch sensor, or a self-capacitance type touch sensor. In such examples, the interlayer dielectric layer 2304 between the two metal layers 2302/2306 is used to allow interconnection between at least one portion of one metal layer and at least one portion of the other metal layer, It can be patterned into vias. As an example, row noise-sensor electrodes can be formed in the first metal layer 2302 and thermal noise-sensor electrodes can be formed in the second metal layer 2306. Alternatively, thermal noise-sensor electrodes can be formed in the first metal layer 2302 and row noise-sensor electrodes can be formed in the second metal layer 2306 . As another example, both the row noise-sensor electrodes and the thermal noise-sensor electrodes can be formed within the first metal layer 2302, and the second metal layer 2306 is any discontinuous noise within the first metal layer. It can be used to form conductive bridges for connecting sensor electrodes. Alternatively, both the row noise-sensor electrodes and the thermal noise-sensor electrodes can be formed in the second metal layer 2506, and the first metal layer 2502 is any discontinuous noise in the second metal layer. It can be used to form conductive bridges for connecting sensor electrodes. In examples in which both the row noise-sensor electrodes and the thermal noise-sensor electrodes are formed on a single metal layer of the first/second metal layers, the thermal noise-sensor electrodes may be a solid bar (e.g., a continuous metal mesh pattern). ), and the row noise-sensor electrodes can have a non-continuous shape, such as a plurality of segments (eg, a stripe pattern of non-continuous metal mesh segments adjacent to one or more column electrodes). In such examples, dielectric layer 2304 is formed by discontinuous segments of row noise-sensor electrodes in one of the metal layers (eg, first metal layer 2302) and the other metal layer (eg, second metal layer). 2306) can be patterned with vias allowing for metal interconnections between conductive structures. In such examples, the conductive structures in the other (eg, second) metal layer can include conductive bridging structures, which include, at least, continuous thermal noise-sensor electrodes and non-continuous row noise-sensor electrode segments. Extend the separation length between the non-contiguous row noise-sensor electrode segments in the layer (eg, the first metal layer). With vias formed by patterning of the interlayer dielectric layer 2304, bridge structures in another metal layer can electrically couple discontinuous row noise-sensor electrode segments, such that the segments form continuous row electrode segments along their length. can be allowed to function similarly to

24 illustrates an example display-noise shield formed on a printed layer of a touch screen stackup, in accordance with examples of the present disclosure. As described with respect to the general display-noise sensor 2210 of FIG. 22 , a display-noise shield 2210B may be formed on the first encapsulation layer 2208 . In some examples, the first encapsulation layer 2208 is deposited using inkjet printing and forms a substantially flat surface upon which metal layers can be formed.

A metal layer 2402 may be formed over the first encapsulation layer 2208 . In some examples, the display-noise shield 2210B may be formed using an on-cell fabrication technique (eg, by forming the shield 2210B directly on the first encapsulation layer 2208 as part of the same fabrication process). there is. Forming the display-noise shield includes forming a metal layer 2402, and a dielectric shield (e.g., dielectric layer 2214) within the stackup 2200 to reduce parasitic capacitances with the metal layer 2402. You may need to include

In some examples, an on-cell fabricated display-noise shield 2210B is formed by first forming a metal layer 2402 over a first encapsulation layer 2208, followed by a second encapsulation layer 2212 over the metal layer 2402. By forming, it can be formed. In examples where the metal layer 2402 is flooded or provided with a global metal mesh, high parasitic capacitance can occur between the row/column electrodes of the touch sensor 2216 and the display-noise shield/sensor 2210. In such examples, this high capacitance (sometimes referred to as C _{M2_M4} in the context of FIG. 29 ) can result in a very low bandwidth for touch signal sensing by touch sensor 2216 . An optional dielectric layer 2214 may be provided over the second encapsulation layer 2212 to isolate the touch sensor 2216 from parasitic capacitances with the metal layer 2402 . In some examples, the thickness of metal layer 2402 can be between 0.4 and 1 micron, or between 0.5 and 0.9 micron in other examples. In some examples, the thickness of metal layer 2402 can be less than a critical thickness (0.4 microns or less, 0.6 microns or less, 0.8 microns or less, etc.).

The metal layer 2402 may be flooded with metal or filled with a global metal mesh pattern such that the entire footprint of the display-noise shield/sensor 2210 is such that the noise signals generated by the display components 2204 are stored in the stack. Display-noise shield/sensor 2210 in up 2200 may be occupied by a conductive metal (mesh) that may help mitigate interfering with components formed over it. In some examples, the metal layer 2402 is filled with a combination of a flood of conductive material and a metal mesh to provide improved isolation (eg, compared to a flood of conductive material alone) and reduced resistivity (compared to a flood of conductive material alone). can provide In some such examples, patches of flooding of conductive material may be placed between the metal meshes. Sometimes, the metal layer 2402 may be referred to as having alternating metal mesh and conductive material portions (eg, where the conductive material portions are formed or positioned between gaps in the metal mesh). In some such examples, this combination first forms a metal mesh layer (eg, by depositing and/or patterning the first conductive material according to a mesh pattern), and then (eg, a patch pattern aligned to the mesh pattern—the mesh Forming a flood of conductive material between the mesh patterns of the metal mesh layer (by depositing and/or patterning a second conductive material along the paths of the pattern's material are aligned with the open paths of the patch pattern) can Alternatively, the order of material formation can be reversed (eg, as described above with respect to display-noise shield/sensor 2210 of FIG. 22 ). One alternative process for forming the combination may be to first form a flood of conductive material in the patches, then form a metal mesh pattern in the spaces between the patches. Another alternative process for forming the combination may be to first form a flood of conductive material as a solid layer and then subsequently form a metal mesh pattern over the solid layer of conductive material.

25 illustrates an example touch sensor of a touch screen stackup, in accordance with examples of the present disclosure. In some examples, FIG. 25 may depict sub-stack 2500 of stackup 2200 illustrated/described by FIG. 22 . Specifically, FIG. 25 illustrates a sub-stack 2500 corresponding to the touch sensor 2216 of FIG. 22 when the touch sensor 2216 is fabricated/formed according to an on-cell process or fabricated in-situ, according to some examples. can be illustrated As described above with respect to fabrication of the display-noise shield/sensor 2210, fabricating the touch sensor 2216 using an on-cell process can be done in alternative arrangements (e.g., fabricated using a different process). A discrete or semi-individual touch sensor provides similar advantages over arrangements that are transferred to the fabrication process used to form layers 2202-2214 of FIG. 22 . In some examples, these advantages are achieved by aligning the (semi) discrete touch sensor to already fabricated layers 2202 - 2214 and using a laminate or adhesive to attach the (semi) discrete touch sensor to the already fabricated layers 2202 - 2214 . ) and the elimination of the alignment and lamination/adhesion steps associated with attachment. These advantages of fabricating the touch sensor using an on-cell process contribute to lower yield losses of the overall stackup 2200 compared to alternative processes. In addition, the sensed signal of touch sensor 2216 is eliminated by merging different fabrication processes (e.g., when transferring a semi-individual touch sensor to on-cell fabricated layers 2202-2214), eliminating alignment steps required. Touch accuracy associated with s can be improved. Because touch sensor 2216 is aligned by being fabricated using an on-cell process (sometimes referred to as “process-aligned”), the row touch electrodes and column touch electrodes of touch sensor 2216 are display-aligned. may be substantially aligned with corresponding row noise-sensing electrodes and column noise-sensing electrodes of noise shield/sensor 2210 (e.g., row and column touch electrodes are target centered/aligned within stackup 2200). may overlay the corresponding row and column noise-sensing electrodes within 5% deviation from the measured position). Additionally, process-aligned touch sensor 2216 can improve or optimize alignment of the row touch electrodes and column touch electrodes of the touch sensor with the pixels and/or sub-pixels of display components 2204 .

As illustrated in FIG. 25 , touch sensor 2216 may be formed over dielectric layer 2214 and/or second encapsulation layer 2212 . As described with respect to stackup 2200 of FIG. 22 , the second encapsulation layer 2212 may be deposited according to a blanket deposition process or according to a selective deposition process (eg, inkjet printing). In some examples, depositing the second encapsulation layer 2212 according to a blanket deposition process can result in a surface of the second encapsulation layer being planar (eg, flat, or uniform). In some examples, the layers of touch sensor 2216 can be formed directly on the planar surface of second encapsulation layer 2212 . In some examples, a dielectric layer 2214 may be formed over the second encapsulation layer 2212 . Dielectric layer 2214 is about its separation touch sensor 2216 from display-noise shield/sensor 2210 and from display components 2204 (eg, components formed below touch sensor 2216). , may sometimes be referred to as an "isolation dielectric layer" or even a "thick dielectric layer". In some examples, dielectric layer 2214 is "thick" because its thickness is relatively greater than the thickness of other dielectric layers (such as those of display-noise sensor 2210A) in stackup 2200 of FIG. 22 . " can be called In some examples, the thickness of dielectric layer 2214 may be 1 to 6 microns, or in other examples 2 to 5 microns. In some examples, the thickness of dielectric layer 2214 can be less than a critical thickness (eg, 2 microns or less, 5 microns or less, 8 microns or less, etc.). In some examples, isolating touch sensor 2216 from components formed thereunder (eg, by inclusion of dielectric layer 2214) reduces the impact of noise and/or interference from those components, and additionally Reduce parasitic capacitances between the touch sensor and the components.

An on-cell fabricated touch sensor 2216 is formed by first forming a first metal layer 2502 over the second encapsulation layer and/or dielectric layer 2214, then forming an interlayer dielectric layer 2504, and finally It can be formed by forming a second metal layer 2506 . In some examples, first and second metal layers 2502 and 2506 can be used to form row touch electrodes and column touch electrodes of a touch sensor. As an example, the row touch electrodes and column touch electrodes in the first and second metal layers 2502 and 2506 can form a mutual capacitance type touch sensor, or a self-capacitance type touch sensor. In such examples, the interlayer dielectric layer 2504 between the two metal layers 2502/2506 is to allow for interconnection between at least one portion of one metal layer and at least one portion of the other metal layer, It can be patterned into vias. As an example, row touch electrodes can be formed in the first metal layer 2502 and column touch electrodes can be formed in the second metal layer 2506 . Alternatively, column touch electrodes can be formed in the first metal layer 2502 and row touch electrodes can be formed in the second metal layer 2506 . As another example, both the row touch electrodes and the column touch electrodes can be formed in the first metal layer 2502, and the second metal layer 2506 connects any discontinuous touch electrodes in the first metal layer. can be used to form conductive bridges for Alternatively, both the row touch electrodes and column touch electrodes can be formed in the second metal layer 2506, with the first metal layer 2502 connecting any discontinuous touch electrodes in the second metal layer. can be used to form conductive bridges for In examples where both the row touch electrodes and the column touch electrodes are formed on a single metal layer of the first/second metal layers, the column electrodes may have a continuous shape such as a solid bar (eg, a continuous metal mesh pattern); The row electrodes may have a non-continuous shape, such as a plurality of segments (eg, a stripe pattern of non-continuous metal mesh segments adjacent to one or more column electrodes). In such examples, dielectric layer 2504 is formed by discontinuous segments of row electrodes in one of the metal layers (eg, first metal layer 2502) and the other metal layer (eg, second metal layer 2506). ) can be patterned into vias that allow for metal interconnections between conductive structures in the In such examples, the conductive structures in the other (eg, second) metal layer may include conductive bridge structures, which at least include a metal layer (eg, continuous row touch electrodes) and non-continuous row touch electrode segments including continuous row touch electrode segments. extending the separation length between non-contiguous row touch electrode segments in the first metal layer). With vias formed by patterning of the interlayer dielectric layer 2504, bridge structures in another metal layer can electrically couple non-contiguous row touch electrode segments, such that the segments resemble continuous row electrodes along their length. can be allowed to function. In some examples, the touch sensor can be implemented according to the touch electrode (and routing) patterns described with respect to FIGS. 5-21 .

26 illustrates an example transfer type touch sensor of a touch screen stackup, in accordance with examples of the present disclosure. In some examples, FIG. 26 can depict sub-stack 2600 of stackup 2200 shown/described by FIG. 22 . In contrast to the arrangement described above with respect to FIG. 25 , the touch sensor 2216 as illustrated by FIG. 26 is not fabricated using on-cell processes. Instead, touch sensor 2216 in FIG. 26 represents a discrete or semi-discrete component manufactured using a different process than the manufacturing process used to form layers 2202-2214 in FIG. 22 . In other words, touch sensor 2216 may be applied at a different time, in a different location, and/or using a different manufacturing process than layers 2202-2214 of FIG. 22 (eg, previous layers of stackup 2200). represents the component being manufactured.

Similar to the arrangement of FIG. 25 , the touch sensor 2216 of FIG. 26 includes a first metal layer 2602 , an interlevel dielectric layer 2604 , and a second metal layer 2606 . These layers may be reduced in alignment from lamination compared to process-alignment with layers 2202-2214 in FIG. 22 due to on-cell processes, but the corresponding layers in FIG. 25 ( 2502, 2504, 2506) may be equivalent. Because touch sensor 2216 of FIG. 26 is fabricated using a different process than the previous layers of the stackup, the touch sensor may sometimes be referred to as a "transfer type" touch sensor. For a transfer-type touch sensor, some of the advantages of on-cell processes are not available, as illustrated by FIG. ) requires careful alignment and lamination/adhesion steps to integrate. In some examples, these additional alignment and lamination/adhesion steps complicate manufacturing of stackup 2200 and are prone to errors. Examples of misalignment may include misalignment of touch sensor 2216 relative to display-noise shield/sensor 2210 and/or display components 2204 such that rows and columns formed within the metal layers of touch sensor 2216 This may include causing substantial misalignment with display components 2204 and/or corresponding structures within shield/sensor 2210 . Such errors may reduce touch sensor accuracy and/or cause additional yield loss. Examples of errors in lamination/adhesion may include partial/incomplete, or insufficient adhesion of touch sensor 2216 to the rest of stackup 2200 (e.g., previous layers 2202-2214). Specifically, the transfer touch sensor 2216 of FIG. 26 can be laminated/adhered to the rest of the stackup 2200 by an adhesive layer 2610 . However, partial and/or incomplete adhesion between adhesive layer 2610 and dielectric layer 2214 or second encapsulation layer 2212 may result in insufficient fixation of touch sensor 2216 relative to stackup 2200. can Insufficient fixation of touch sensor 2216 relative to stackup 2200 may result in future misalignment of touch sensor 2216 relative to stackup 2200 (e.g., by movement of touch sensor 2216), or (e.g., by movement of touch sensor 2216). , due to strain/forces thereon that cause touch sensor 2216 to move while the device is in use) may cause inconsistent performance of touch sensor 2216 during operation of the device including stack-up 2200. there is. Additionally, since the touch sensor 2216 of FIG. 26 is not formed using on-cell processes, but is instead fabricated using a different process, the touch sensor substrate(s) 2608 may be stacked up 2200 of FIG. 22 . ), and can correspond to the base substrate on which layers 2602-2606 are formed (eg, during separate fabrication of transfer-type touch sensor 2216).

27 illustrates example read terminals of a touch sensor and pixel-aligned display-noise sensor of a touch screen stackup, in accordance with examples of the present disclosure. 27 illustrates a simplified stackup for 2200 in FIG. 22 , which consists of display components 2204 (where each is represented by pixels in an array having a number of subpixels), display-noise sensor 2210A. a metal layer (eg, second metal layer 2306 in FIG. 23 ), and a metal layer of touch sensor 2216 (eg, second metal layer 2506 in FIG. 25 , or second metal layer 2506 in FIG. 26 ). Only the metal layer 2606 is illustrated. Starting from the bottom of the simplified stackup, display components 2204 can be used to display text, images, videos, or other information to a user, and display components 2204 for their own outputs. It may do so by modifying the signals input to the display to cause corresponding/desired changes. When the output values of the pixels within the display components 2204 change during normal operation of the electronic device, the changing pixel output values can create associated noise signals that are typically localized in the vicinity of the changed display components 2204.

Display-noise sensor 2210A is illustrated over display components 2204 and can be formed over first encapsulation layer 2208 as described above with respect to FIGS. 22 and 23 . 27 illustrates the display-noise sensor 2210A as a single metal layer, where both the row-noise-sensor electrodes and thermal noise-sensor electrodes are a single metal layer (e.g., the second metal layer in FIG. 23 ( 2306)) corresponds to the embodiments formed. In this example, another metal layer (eg, first metal layer 2302) may be interposed (eg, in second metal layer 2306) between the discrete row and/or thermal noise sensor electrode segments. It can be used to form connections. However, this is merely exemplary, and the display-noise sensor 2210A may also have row-noise-sensor electrodes and thermal-noise-sensor electrodes formed on different respective metal layers. Row noise-sensor electrodes extending in a first direction over corresponding segments of display components 2204 generated electricity by changes to output values of underlying display components 2204 along the first direction. May be sensitive to noise. The connection point of the row noise-sensor electrode of display-noise sensor 2210A may be labeled terminal B1 and may be read by a readout circuit (e.g., 2900 in FIG. 29). Similarly, thermal noise-sensor electrodes extending over corresponding segments of display components 2204 in a second direction different from the first direction are output values of display components 2204 underlying them along the second direction. may be sensitive to electrical noise generated by changes to . The connection point of the thermal noise-sensor electrode of display-noise sensor 2210A may be labeled terminal B2 and may be read in a readout circuit. The metal used to form the row noise-sensor electrodes and thermal noise-sensor electrodes within display-noise sensor 2210A can be patterned to substantially align with the sub-pixel components of display components 2204, Metal in display-noise sensor 2210A may not optically impede light transmitted from display components 2204 (e.g., pattern features of row and column noise-sensor electrodes in stackup 2200). may overlay corresponding sub-pixel display components within 5% deviation from the target centered/aligned position).

A touch sensor 2216 is illustrated over the display-noise sensor 2210A (the side opposite the display of the display-noise sensor) and is formed of a dielectric layer 2214 and/or a dielectric layer 2214 as described above with respect to FIGS. 22 and 25 . 2 may be formed over encapsulation layer 2212 . Touch sensor 2216 is illustrated as a single metal layer, which is an embodiment in which both row touch electrodes and column touch electrodes are formed in a single metal layer (e.g., second metal layer 2506 in FIG. 25). respond to the In this example, another metal layer (e.g., first metal layer 2502) provides interconnects between discontinuous row and/or column touch electrode segments (e.g., in second metal layer 2506). can be used to form However, this is merely illustrative, and the touch sensor 2216 can also have row noise-sensor electrodes and thermal noise-sensor electrodes formed on different respective metal layers. Row touch electrodes extending in a first direction over corresponding segments of the display components 2204 respond to electrical noise generated by changes to output values of the display components 2204 lying below along the first direction. can be sensitive These row touch electrodes may also extend over the corresponding row noise-sensor electrode of display-noise sensor 2210A. The connection point of the row touch electrode of touch sensor 2216 can be labeled terminal A1 and can be read in a readout circuit in parallel with the corresponding signal from the row noise-sensor electrode labeled terminal B1. . Similarly, column touch electrodes extending over corresponding segments of the display components 2204 in a second direction different from the first direction can generate values of output values of the underlying display components 2204 along the second direction. It can be sensitive to electrical noise created by the changes. These thermal touch electrodes may also extend over the corresponding thermal noise-sensor electrode of display-noise sensor 2210A. The connection point of the thermal touch electrode of the touch sensor 2216 can be labeled terminal A2 and can be read in a readout circuit in parallel with the corresponding signal from the thermal noise-sensor electrode labeled terminal B2. . The metal used to form the row/column touch electrodes within touch sensor 2216 can be patterned to substantially align with the subpixel components of display components 2204 such that the metal within touch sensor 2216 displays Light transmitted from components 2204 may not be optically obstructed (e.g., within 5% deviation of the pattern features of row and column touch electrodes from a target centered/aligned location within stackup 2200). may overlay corresponding subpixel emissive display components in ).

Each row touch electrode of touch sensor 2216 may, in some examples, overlay a corresponding row noise-sensor electrode of display-noise sensor 2210A. Each corresponding pair of row touch electrode and row noise-sensor electrode can overlay a corresponding row of display pixels of display components 2204, and in some examples, the output of underlying display components 2204 It may be sensitive to electrical noise generated by changes to values. To mitigate the effects of electrical noise from display components 2204, display-noise signals from rows/columns of display-noise sensor 2210A (e.g., readout from terminals B1/B2) signals) are, in some examples, parallel with corresponding touch detection signals from rows/columns of touch sensor 2216 (e.g., signals read from terminals A1/A2) by readout circuitry. can be read as In some examples, signals B1/B2 read from display-noise sensor 2210A and signals A1/A2 read from touch sensor 2216 are the rows and/or columns of touch sensor 2216. may correspond to rows and/or columns of display-noise sensor 2210A aligned and overlapping with . Reading the display-noise signals from B1/B2 in parallel with the touch detection signals from A1/A2 causes the read circuit to subtract the display-noise signals from the touch detection signals, thereby reducing the Generating noise-corrected touch detection signals by the mitigated contribution of display-noise signals. In some examples, this arrangement can result in improved accuracy and repeatability when measuring touch input from a user based on noise corrected touch detection signals.

In some examples, certain rows and columns of display-noise sensor 2210A can be combined into larger areas demarcating an area above display components 2204 (or an area below touch sensor 2216). In these examples, particular rows and columns can be combined by “gangling” or electrically connecting the outputs of particular rows and columns, such that a larger area formed by the particular rows and columns combined can be combined at a single time (or at a single terminal) can be read. Alternatively, particular rows and columns may be read sequentially (or at their respective terminals) and then combined to produce an output corresponding to the noise signal in a larger area formed by the particular rows and columns combined. there is. When certain row noise-sensor electrodes and thermal noise-sensor electrodes of display-noise sensor 2210A are combined in this way into larger areas, each area of display-noise sensor 2210A is a display component below 2204 may be sensitive to electrical noise generated by changes to the output values of corresponding regions. Regions formed by the combined row noise-sensor electrodes and thermal noise-sensor electrodes can then be formed below corresponding regions of touch sensor 2216 . In these examples, signals read from a particular area of display-noise sensor 2210A are signals in a corresponding area (e.g., a row touch electrode or a column touch electrode over a particular area of display-noise sensor 2210A). can be read in parallel with the corresponding touch detection signals from the rows/columns of the touch sensor 2216 corresponding to . In some examples, these signals (eg, from the region of display-noise sensor 2210A, and the region corresponding to touch sensor 2216) are sent to common readout circuitry (described below with respect to FIG. 29). can be read by Similar to the approach when a single row/column noise-sensor electrode and a single row/column touch electrode are read by a common readout circuit, first signals from the area of the noise-sensor electrodes of display-noise sensor 2210A and when the second signals from the corresponding region of touch sensor 2216 are read, the first signals are subtracted from the second signals without noise contribution/affect of display components 2204 (e.g., display- noise-free) and can generate readout values corresponding to the touch signals.

This approach of partitioning the display-noise sensor 2210A into larger areas extending beyond a single row or single column is achieved by combining all row noise-sensor electrodes and thermal-noise sensor electrodes of display-noise sensor 2210A. , can be extended to produce a global reading, corresponding to the noise signal in the entire display-noise sensor 2210A. A first signal corresponding to the entire display-noise sensor 2210A, similar to the approach when the area of multiple row/column noise-sensor electrodes and the corresponding area of the row/column touch electrode are read by a common readout circuit. When second signals from any area of the field and touch sensor 2216 are read, the first signals are subtracted from the second signals to avoid noise contribution/affect of display components 2204 (e.g., display -without noise) can generate readings corresponding to touch signals.

28 illustrates example read terminals of a touch sensor and a display-noise shield of a touch screen stackup, in accordance with examples of the present disclosure. 28 illustrates a simplified stackup for 2200 in FIG. 22 , which consists of display components 2204 (where each is represented by pixels in an array having a number of subpixels), display-noise shield 2210B. A metal layer (eg, metal layer 2402 in FIG. 24 ), and a metal layer of touch sensor 2216 (eg, second metal layer 2506 in FIG. 25 , or second metal layer in FIG. 26 ). (2606)) only. Similar to the description above with respect to FIG. 27 , when the output values of pixels within display components 2204 change during normal operation of the electronic device, the changing pixel output values are usually localized in the vicinity of the changed display components 2204 . associated noise signals can be generated.

Display-to-noise shield 2210B is illustrated over display components 2204 and may be formed over first encapsulation layer 2208 as described above with respect to FIGS. 22 and 23 . 28 shows display-noise shield 2210B as a single metal layer corresponding to embodiments in which a global mesh is formed over metal layer 2402 (of FIG. 24) to thereby cover all of display components 2204. ) exemplifies. In some examples, the global mesh associated with display-noise shield 2210B may be partitioned into non-contiguous shield segments. In these examples, multiple connection points corresponding to multiple shield segments may be provided. However, in the example illustrated by FIG. 28 , the connection point of the overall display-to-noise shield 2210B may be labeled terminal C, and as shown by FIG. 30 , terminal C is at ground voltage. coupled, thereby biasing the entire shield 2210B at a fixed voltage level. The metal used to form the display-noise shield electrode(s) of display-noise shield 2210B can be patterned to be substantially aligned with the sub-pixel components of display components 2204, such that the display-noise shield Metal in 2210B may not optically impede transmitted light from display components 2204 (e.g., the display-noise shield's pattern features have a target centered/aligned position in stackup 2200). may overlay corresponding subpixel display components within 5% deviation from ).

A touch sensor 2216 is illustrated over the display-noise shield 2210B and may be formed over the dielectric layer 2214 and/or the second encapsulation layer 2212 as described above with respect to FIGS. 22 and 25 . Due to the high capacitance between touch sensor 2216 and the global mesh of metal layer 2402, sometimes an optional dielectric layer 2214 is provided between display-noise shield 2210B and touch sensor 2216 in some examples. . 22, including a dielectric layer 2214 between the display-noise shield 2210B and the touch sensor 2216 improves the isolation between these layers of the stackup 2200, thereby This can improve touch sensing performance, accuracy, and repeatability. Touch sensor 2216 is illustrated as a single metal layer, which is an embodiment in which both row touch electrodes and column touch electrodes are formed in a single metal layer (e.g., second metal layer 2506 in FIG. 25). respond to the Similar to FIG. 27 , touch sensor 2216 is illustrated as having row and column touch electrodes. The connection point of the row touch electrode of the touch sensor 2216 may be labeled as terminal A1 and may be read in a readout circuit. The connection point of the column touch electrode of the touch sensor 2216 may be labeled as terminal A2 and may be read in a reading circuit. The metal used to form the row/column touch electrodes within touch sensor 2216 can be patterned to substantially align with the subpixel components of display components 2204 such that the metal within touch sensor 2216 displays Light transmitted from components 2204 may not be optically obstructed (e.g., within 5% deviation of the pattern features of row and column touch electrodes from a target centered/aligned location within stackup 2200). may overlay corresponding subpixel display components in ).

In some examples, each row touch electrode of touch sensor 2216 may overlay display-noise shield 2210B. As signals are read from rows/columns of touch sensor 2216, in some examples, display-noise shield 2210B can be actively biased to a specific voltage level during touch sensing operations of touch sensor 2216. In these examples, terminal C of display-noise shield 2210B may receive one or more stimulus signals (eg, a time-varying voltage) during touch sensing operations of touch sensor 2216, or or biased to ground voltage (or any other suitable fixed voltage level). In some examples, this arrangement applies one or more bias voltages to display-noise shield 2210B at least during touch sensing operations of touch sensor 2216, thereby reducing electrical interference generated by display components 2204. Shielding the row/column touch electrodes of the touch sensor from (e.g., display-noise) can result in improved accuracy and repeatability when measuring touch input from a user based on noise-corrected touch detection signals. there is.

29 illustrates example readout circuitry for a touch sensor and a display-noise sensor of a touch screen stackup, in accordance with examples of the present disclosure. Readout circuitry 2900 (also referred to herein as sensing circuitry) connects the connection points to rows/columns of touch sensor 2216 (eg, A1/A2) and rows of display-noise sensor 2210A. /Example circuit schematic modeling parasitic/unwanted capacitances between components of the stackup 2200 of FIG. can indicate The overall function of read circuit 2900 can be to output a voltage V _OUT proportional to the difference between the voltage at positive input 2904 and the voltage at negative input 2902 . Thus, V _OUT is the signal from connection points B1/B2 corresponding to rows/columns of display-noise sensor 2210A and connection points A1/A2 corresponding to rows/columns of touch sensor 2216. ) is proportional to the difference between the signals from Thus, V _OUT is the difference between the touch signal detected by touch sensor 2216 at connection points A1/A2 minus the noise signal detected by display-noise sensor 2210A at connection points B1/B2. represents a signal based on positive input 2904 and negative input 2902 that can be used to determine a minus value.

As described above with respect to FIG. 27 , in some examples, display-noise sensor 2210A sometimes partitions into regions by combining output values from particular row-noise-sensor electrodes and/or thermal noise-sensor electrodes. It can be. In other examples, display-noise sensor 2210A can be used to generate a global reading combining output values from all row-noise-sensor electrodes and all thermal-noise-sensor electrodes. Although not illustrated by FIG. 29 , these signals may also be provided to the positive input 2904 .

In some examples, read circuit 2900 can perform functions similar to touch sensor circuits 300 and 350 of FIGS. 3A and 3B . As described above, touch sensor circuits 300 / 350 , in some examples, output (Vo ) corresponding to a single-ended reading of a row/column of touch sensor 2216 (eg, touch electrode signal reading). ) can be created. Similarly, in some examples, touch sensor circuits 300/350 are coupled to rows/columns of display-noise sensor 2210A to take single-ended readings of rows/columns of display-noise sensor 2210A. can create In these examples, the output from touch sensor circuit 300/350 coupled to the row/column of display-noise sensor 2210A is coupled to the row/column of touch sensor 2216. may be subtracted from the output from the readout circuit 2900 to obtain a difference value comparable to or proportional to the output voltage (V _OUT ).

A voltage source labeled V _NOISE (cathode) represents, in some examples, a noise contribution from display components 2204 to other components of stackup 2200 in FIG. 22 . Capacitor C _{M2_C} is a parasitic or unwanted layer between the cathode (eg, display components 2204) and a metal layer called M2 (eg, a metal layer corresponding to display-noise shield/sensor 2210). Indicates the capacitance that does not In examples where display-noise shield/sensor 2210 is display-noise sensor 2210A, metal layer M2 may correspond to second metal layer 2306 in FIG. 23 . In examples where display-noise shield/sensor 2210 is display-noise shield 2210B, metal layer M2 may correspond to metal layer 2402 in FIG. 24 . Positive input 2904 is connected to display-to-noise shield/sensor 2210 and, therefore, may be subject to the C _{M2_C} capacitance (as illustrated by their connections in FIG. 29 ). Capacitor C _{M4_C} is a parasitic between the cathode (eg, display components 2204) and a metal layer called M4 (eg, a metal layer corresponding to the row/column electrodes of touch sensor 2216). Or represents unwanted capacitance. In examples where the row and column electrodes are formed of a single layer closest to the user (e.g., closest to cover layer 2222 in FIG. 22), metal layer M4 may correspond to second metal layer 2506. there is. Negative input 2902 is coupled to touch sensor 2216 and, therefore, may be affected by the C _{M4_C} capacitance (as illustrated by their connections in FIG. 29 ). In some examples, capacitance C _{M4_M2} represents a parasitic or undesired capacitance between metal layers M2 and M4 and is shown as coupled between positive input 2904 and negative input 2902 since it This is because it can affect the two layers that can be connected.

A positive input 2904 is shown connected to the differential amplifier 2906 through a resistor R _M2 , which may represent the resistivity associated with the metal layer referred to as M2 discussed above. Alternatively, R _M2 can represent the input resistor to the positive terminal of differential amplifier 2906 and can have a specific predefined value. A negative input 2902 is shown coupled to the differential amplifier 2906 through a resistor R _M4 , which may represent the resistivity associated with the metal layer referred to as M4 discussed above. Alternatively, R _M4 can represent the input resistor to the negative terminal of differential amplifier 2906 and can have a specific predefined value. In some examples, R _BIAS can represent a resistor that couples the bias voltage (V _BIAS ) to the positive terminal of differential amplifier 2906, and R _FB connects the output voltage (V _OUT ) to the negative terminal of differential amplifier 2906. It can indicate a feedback resistor to connect.

30 illustrates an example voltage bias for a display-noise shield of a touch screen stackup, in accordance with examples of the present disclosure. In some examples, connection point C representing the connection to the global mesh of display-noise shield 2210B is grounded. In some examples, grounding display-noise shield 2210B can mitigate noise. Alternatively, the display-noise shield 2210B can be biased with any fixed non-zero voltage, in some examples (eg, to also mitigate noise). In some examples, display-noise shield 2210B is only biased to ground, or another fixed voltage, during touch sensing operations of touch sensor 2216 . In some examples (not illustrated by FIG. 30 ), display-noise shield 2210B corresponds to stimulus signals 216 of FIG. 2 provided to drive lines 222 via drive interface 224 or Stimulus signals may be provided during touch sensing operations based thereon.

31 illustrates an example process 3100 for operating a touch screen stackup with a touch sensor and a display-noise sensor between the touch sensor and a display pixel, according to examples of the present disclosure. In some examples, process 3100 also describes operations for operating a touch screen stackup with a touch sensor and a display-noise shield between the touch sensor and display pixels. In some examples, process 3100 can be applied whether positive input 2904 is connected to a display-noise sensor electrode (eg, inputs B1/B2) or a display-noise shield electrode (eg, input ( C)), operations for operating the readout circuit 2900 of FIG. 29 can be described.

Process 3100 begins at 3102 with readout circuitry (eg, 2900 in FIG. 29 ) sampling signals from touch sensor 2216 at a particular location (eg, row and/or column). . As an example, 3102 will describe sampling signals from touch sensor 2216, specifically sampling a particular location of the touch sensor where a touch event can be detected (e.g., by touch controller 206). can In this example, a touch event can be detected on a particular row (eg, row 2) and a particular column (eg, column 3) of the display, and the user can interact with display components 2204 in a particular row and particular column. It may correspond to interacting with or selecting a user interface element displayed by . Signals read through terminals A1/A2 of FIG. 27 may be sampled and/or read at negative input 2902 of readout circuit 2900 of FIG. 29 at 3102 of process 3100 .

The process 3100 continues, at 3104, with the readout circuitry sampling signals from the display-noise sensor at a location corresponding to the particular location. As an example, 3104 can describe sampling signals from display-noise sensor 2210A at the same specific location where a touch event was detected on the touch sensor. In this example, display-noise sensor 2210A has a specific row (e.g., row 2) corresponding to a location within display-noise sensor 2210A below the location of the detected touch event on touch sensor 2216 and It may be sampled in a specific column (e.g., column 3). Signals read through terminals B1/B2 of FIG. 27 may be sampled and/or read at positive input 2904 of read circuit 2900 of FIG. 29 at 3104 of process 3100 . In some examples, signals read through terminal C of FIG. 28 may be sampled and/or read at positive input 2904 of read circuit 2900 of FIG. 29 at 3104 of process 3100 . In some examples, the signals read at the positive input 2904 of the read circuit correspond to electrical noise signals based on the display components 2204, or changes in output values of the display components 2204.

Process 3100 concludes that the readout circuitry generates noise adjusted touch readout signals by subtracting the display-noise sensor signals from the touch sensor panel signals, at 3106 . As an example, 3106 can illustrate a differential amplifier 2906 that produces an output voltage (V _OUT ) corresponding to the difference between the signal at positive input 2904 and the signal at negative input 2902 . As an example, V _OUT can be proportional to the signal at positive input 2904 minus (or subtracted from) the signal at negative input 2902, which in turn equals the signal at negative input 2902 equals the positive Proportional to the minus (or subtracted) value of the signal at input 2904. By determining the signal at negative input 2902 minus the signal at positive input 2904, a noise-corrected touch readout signal can be generated, which at least corresponds to the positive readout from display-noise sensor 2210A. This is because the signal at input 2904 may correspond to an electrical noise contribution at a particular location (eg, where a touch event was detected).

32 is an example process 3200 for forming a touch screen stackup having a display-noise shield/sensor formed on a first printed layer and a touch sensor formed on a second printed layer, in accordance with examples of the present disclosure. exemplify In some examples, process 3200 uses an on-cell manufacturing process to build first encapsulation layer 2208, display-noise shield/sensor 2210, second encapsulation layer ( 2212), and operations for manufacturing the touch sensor 2216 will be described. In some examples, the on-cell fabrication described in process 3200 may alternatively include in-situ (eg, in-situ) first encapsulation layer 2208, display-noise shield as display components 2204 /Sensor 2210, second encapsulation layer 2212, and touch sensor 2216 can be set to manufacture. As described above with respect to FIG. 22 , on-cell fabrication processes are alternative techniques using discrete and semi-discrete components to form display-noise shield/sensor 2210 and/or touch sensor 2216 . can offer advantages over In some examples, these advantages are achieved by aligning the (semi-)discrete components associated with the display-noise shield/sensor to already fabricated layers 2202-2208, using a laminate or adhesive to and the elimination of the alignment and lamination steps associated with attaching the to already fabricated layers 2202-2208. These advantages of fabricating the display-noise shield/sensor using an on-cell process contribute to lower yield losses of the overall stackup 2200 compared to alternative processes.

Process 3200 begins at 3202 by printing a first encapsulation layer (eg, layer 2208) over display components (eg, display components 2204). As described above with respect to the stackup 2200 of FIG. 22 , the first encapsulation layer 2208 covers all of the emissive display pixels/elements of the display components 2204 and sometimes emissive display pixels/elements. Elements may be formed on top of passivation layer 2206 covering portions of the layer for display components 2204 where they are not formed. In some examples, printing the first encapsulation layer 2208 is only over portions of the passivation layer 2206 formed over the light emitting display pixels/elements of the display components 2204 (e.g., with selective deposition (by inkjet printing methods). In these examples, the first encapsulation layer 2208 can be an optically transparent material that can be suitably deposited using a selective deposition technique (eg, an inkjet printing process).

The process 3200 continues at 3204 with forming a display-noise shield/sensor over the printed first encapsulation layer. As described above with respect to FIG. 22 , the display-noise shield/sensor 2210 may, in some examples, be a shield or a sensor. Forming the display-noise shield may require, in some examples, forming a metal layer (eg, metal layer 2402 in FIG. 24 ) over the first encapsulation printed at 3202 . In some examples, forming a display-noise sensor may require forming multiple metal layers (e.g., metal layers 2302 and 2306 separated by interlayer dielectric layer 2304 in FIG. 23); Multiple metal layers are separated by an interlayer dielectric layer therebetween.

The process 3200 continues at 3206 with printing a second encapsulation layer over the display-noise shield/sensor. As described above with respect to FIG. 22 , a second encapsulation layer 2212 may be selectively or blanket deposited over the display-noise shield/sensor 2210 . In some examples, the second encapsulation layer 2212 can be deposited over the entirety of the display-noise shield/sensor 2210 (eg, blanket deposited), or over only a portion of the display-noise shield/sensor 2210. may be deposited (eg, selectively deposited). For example, using a blanket deposition, the second encapsulation layer 2212 is deposited over the entirety of the display-noise shield/sensor 2210 (eg, blanket deposition) so that the surface of the second encapsulation layer is substantially (eg, points on the surface of second encapsulation layer 2212 can all fall within 5% of the target level height for the second encapsulation layer in stackup 2200). As another example, using selective deposition, the second encapsulation layer 2212 is deposited over only a portion of the display-noise shield/sensor 2210 so that the surface of the second encapsulation layer (e.g., in the deposition areas) to a certain height, and to different heights in the non-deposited areas).

Process 3200 can conclude, at 3208, with forming a touch sensor over the printed second encapsulation layer. As described in detail in the description of the touch sensor 2216 with respect to FIG. 22 , a thick dielectric layer 2214 is formed over the second encapsulation layer 2212 to protect the display-noise shield/sensor 2210 from the touch sensor ( 2216) can be improved (eg, by reducing stray/parasitic capacitances between the two). In some examples, touch sensor 2216 may be formed over thick dielectric layer 2214 . In another example, the touch sensor 2216 can be formed directly over the second encapsulation layer 2212 . The touch sensor 2216 of FIG. 22, when formed over the second encapsulation layer 2212 printed in this way (and/or over the dielectric layer 2214 for additional isolation), uses the layers illustrated by FIG. have

At 3208, a first metal layer (eg, layer 2502 of FIG. 25) may be formed over the second encapsulation layer, followed by an interlayer dielectric layer (eg, layer 2504 of FIG. 25) and a second encapsulation layer. Two metal layers (e.g., layer 2506 in FIG. 25) may form. In some examples, the first and second metal layers can be used to form row touch electrodes and column touch electrodes of a touch sensor. In this example, an interlayer dielectric layer between two metal layers can be patterned with vias to allow interconnection between at least one portion of one metal layer and at least one portion of the other metal layer. . As an example, row touch electrodes may be formed on the first metal layer, and column touch electrodes may be formed on the second metal layer. As another example, both row touch electrodes and column touch electrodes can be formed in a first metal layer, and a second metal layer forms conductive bridges for connecting any discontinuous touch electrodes in the first metal layer. can be used to

33 illustrates a portion of an example touch sensor panel according to examples of the present disclosure. A portion of the touch sensor panel 3300 (eg, corresponding to the touch sensor panel 700, 1100, 1300, etc.) includes four column electrodes 3304A to 3304D (H-shaped electrodes) and 3302A to 3302D. It contains a 2x2 array of touch nodes comprising four row electrodes labeled Some row routing traces 3306A-3306D and column routing traces 3308A-3308D are also shown. Row electrodes 3302A-3302D may be routed to sensing circuitry (e.g., single-ended or differential amplifiers used for single-ended or differential measurements) using routing traces 3306A-3306D. can Column electrodes 3304A-3304D may be routed to drive circuitry using routing traces 3308A-3308D. The row and column routing traces may additionally or alternatively be connected to other portions of the row and column electrodes to other portions of the touch sensor panel outside the 2x2 array. The four row electrodes can be coupled to the four inputs of the sense circuitry referenced by the labels Rx0+, Rx0, Rx1+, and Rx1- (which can be used, for example, for two differential measurements). The four column electrodes can be coupled to the four outputs of the drive circuitry referenced by the labels Tx0+, Tx0-, Tx1+, and Tx1-.

As described herein, common mode noise from the display can be rejected using differential sensing (eg, display-to-touch noise is common mode), and differential drive can be used to reject the display from the touch electrodes. may reduce local imbalance on the electrodes (eg, the net touch drive signal is approximately zero, thereby reducing touch-to-display noise). However, the noise reduction benefits of differential drive and sensing techniques are applied to a 2x2 array of touch nodes (e.g., across a pitch of two touch nodes), while each touch node measures each row and column single-ended. It mainly corresponds to the touch signal. For example, a first touch node (touch node A, upper left corner) measures the dominant mutual capacitance between column electrode 3304A and row electrode 3302A, and a second touch node (touch node B, upper right corner) ) measures the dominant mutual capacitance between the column electrode 3304B and the row electrode 3302B, and the third touch node (touch node C, lower left corner) measures the dominant mutual capacitance between the column electrode 3304C and the row electrode 3302C. The mutual capacitance is measured, and the fourth touch node (touch node D, lower right corner) measures the dominant mutual capacitance between the column electrode 3304D and the row electrode 3302D. However, non-dominant (collateral) mutual capacitances can degrade the differential touch signal for each of the touch nodes.

In some examples, a touch electrode architecture for differential driving without differential sensing can be implemented. Differential driving can still reduce touch-to-display noise (without differential sensing to reduce display-to-touch noise). The touch electrode architecture for differential driving requires fewer routing traces and fewer bridges compared to some of the differential driving and differential sensing touch electrode architectures described herein (eg, the touch electrode architecture of FIG. 33 ). Since it is required, it is possible to simplify the touch electrode architecture design.

34 illustrates a portion of an example touch sensor panel configured for differential drive, in accordance with examples of the present disclosure. A portion of the touch sensor panel 3400 includes a 2x2 array of touch nodes including four column electrodes 3404A-3404D and two row electrodes labeled 3402A and 3402B. The row touch electrodes are interconnected horizontally using bridges 3410 and vertically in border areas (eg, outside the touch sensor panel area) and/or by additional bridges (not shown). It can be formed from a two-dimensional array of connectable touch electrode segments. As shown, each of the touch electrode segments for a row electrode is rectangular, but other shapes are possible. Although six touch electrode segments and four bridges are shown for each row electrode for a 2x2 array of touch nodes (e.g., two groups of three touch electrode segments and two bridges), It is understood that different numbers of touch electrode segments and bridges may be used. Although not shown, the row electrodes can be routed to sensing circuitry at the left or right edges of the touch sensor panel (or optionally, vertically as described with reference to FIGS. 7A-14C ). Additionally, as shown in FIG. 34, the row electrodes are almost entirely continuous across the touch sensor panel (except for the column routing traces and bridges over relatively small portions of the column electrodes), which is (e.g. , compared to interleaved row electrodes in FIG. 33) improves the consistency of touch signal detection when an object moves horizontally across the touch sensor panel.

Each column electrode includes a plurality of touch electrode segments connected by bridges 3412 and/or column routing traces 3408A-3408D. As shown, each of the touch electrode segments for the column electrode is E-shaped (e.g., a combination of 5 rectangles - 3 of which are parallel, the other 2 of which are orthogonal to the 3 and interconnected), other shapes are possible. A pair of E-shaped touch electrode segments of the first column electrode for the first touch node in the column are connected to the first column routing segment and by a first three-way bridge 3412 (or the same as the touch electrode segments). by 3-way routing traces within the layer). A pair of E-shaped touch electrode segments of the second column electrode for the second touch node in the column are connected to the first column routing segment and by a second three-way bridge 3412 (or the same as the touch electrode segments). by 3-way routing traces within the layer). A first column routing trace 3408A for a first column electrode can bisect a pair of E-shaped column electrode segments of a second column electrode interleaved with the first column electrode. Similarly, the second column routing trace for the second column electrode may bisect a pair of E-shaped column electrode segments of the first column electrode interleaved with the second column electrode. At the transition from column routing trace 3408A to column routing trace 3408B, one of the column routing traces (eg, using a three-way routing trace) corresponds to a corresponding column in the same layer as the column touch electrode segments. can be coupled to the touch electrode segments, and it is understood that another one of the column routing traces can be coupled to the corresponding column touch electrode segments using the three-way bridge 3412 . However, in some examples, as illustrated, the connections between each column routing trace and the corresponding touch electrode segments can each be made using bridges (but this increases the number of bridges and increases the number of bridges that cross each other). some adjustments are needed to avoid this). This pattern described for two touch nodes in one column can be repeated for the second column shown in FIG. 34 (and extended beyond the 2x2 array to a larger portion of the touch sensor panel).

As shown, pairs of E-shaped touch electrode segments are connected from each E-shaped touch electrode segment to a column routing trace by a three-way bridge 3412 . The three-way bridges 3412 are illustrated as providing a three-way connection between a column routing trace and a pair of E-shaped touch electrode segments, but it is understood that other bridge connections are possible. For example, a pair of bridges can be used instead of a three-way bridge, or a pair of E-shaped touch electrode segments can be connected by one or more horizontal bridges, and one or more additional bridges can be connected to a pair of A corresponding column routing trace may be connected from one or more of the E-shaped touch electrode segments.

As shown, the E-shaped electrode may include a center bar that is thicker than the upper and lower bars. The dimensions of the E-shaped electrodes can be optimized to improve the total touch signal measured at the touch nodes.

Each touch node includes a differential pair of column electrodes and single-ended row electrodes. For example, a first touch node (touch node A, upper left corner) is a portion of row electrode 3402A (e.g., corresponding to a single-ended input for touch sensing), a portion of column electrode 3404A, and a portion of column routing trace 3408C (eg, corresponding to the differential complementary outputs of the touch drive). Similarly, the second touch node (touch node B, upper right corner) is a portion of row electrode 3402A (e.g., corresponding to a single-ended input for touch sensing), a portion of column electrode 3404B, and includes a portion of column routing trace 3408F (eg, corresponding to the differential complementary outputs of the touch drive); A third touch node (touch node C, lower left corner) is a portion of row electrode 3402B (eg, corresponding to a single-ended input for touch sensing), a portion of column electrode 3404C, and a column routing trace 3408A (e.g., corresponding to differential complementary outputs of touch drive); A fourth touch node (touch node D, lower right corner) is a portion of row electrode 3402B (e.g., corresponding to a single-ended input for touch sensing), a portion of column electrode 3404D, and a column routing trace 3408B (e.g., corresponding to differential complementary outputs of touch drive). Differential cancellation of drive signals occurs across the two touch nodes in each column.

The touch electrode architecture of FIG. 34 can provide a simplified design in the form of fewer traces and bridges. For example, the touch electrode architecture of FIG. 34 includes four column electrodes, but includes only two row electrodes, thereby reducing the number of routing traces from eight to six compared to the touch electrode architecture of FIG. 33 . let it The simplified architecture can also reduce the number of bridges needed.

34 provides some simplifications in the touch electrode architecture (eg, fewer routing traces and bridges), but improved cancellation resolution (eg, cancellation occurring in a smaller area for better cancellation performance). ) may be desirable. In some examples, a touch electrode architecture for differential driving and differential sensing may be implemented in which row electrodes are interleaved and column electrodes are not interleaved, or column electrodes are interleaved and row electrodes are not interleaved. Although a set of touch electrodes are not interleaved, the touch signal processing algorithm can be tuned to achieve a pseudo-differential result (eg, mimicking the result from physically interleaving).

35A and 35B illustrate example touch electrode architectures, according to examples of the present disclosure. The touch electrode architectures of FIGS. 35A and 35B include the same number of electrodes (and corresponding routing traces for drive and sense circuitry) as the touch electrode architecture of FIG. 33 . However, unlike the touch electrode architecture of FIG. 33 , the touch electrode architectures of FIGS. 35A and 35B reduce the distance over which differential effects are achieved. For example, assuming the same dimensions for the 2x2 array of touch nodes in FIGS. 33 and 35A or 35B , differential cancellation is better for the touch electrode architectures of FIGS. 35A and 35B compared to the touch electrode architecture of FIG. 33 . over half the distance (eg, over half the touch electrode pitch).

A portion of the touch sensor panel 3500 illustrated in FIG. 35A includes a 2x2 array of touch nodes comprising four column electrodes 3504A-3504D and four row electrodes labeled 3502A-3502D. Each row electrode includes a plurality of touch electrode segments connected by bridges 3510 across column routing traces. As shown, each of the touch electrode segments for a row electrode is rectangular, but other shapes are possible. Although three touch electrode segments and two bridges are shown for each row electrode in the 2x2 touch node array, it is understood that a different number of touch electrode segments and bridges may be used. Although not shown, the row electrodes can be routed to sensing circuitry at the left or right edges of the touch sensor panel (or optionally, vertically as described with reference to FIGS. 7A-14C ). Additionally, as shown in FIG. 35A , the row electrodes are almost entirely continuous across the touch sensor panel (except for the column routing traces and bridges over relatively small portions of the column electrodes), which is (e.g. , compared to interleaved row electrodes in FIG. 33) improves the consistency of touch signal detection when an object moves horizontally across the touch sensor panel.

Each column electrode includes a plurality of touch electrode segments connected by three-way bridges 3512 and column routing traces 3508A-3508D. As shown, each of the touch electrode segments for the column electrode is U-shaped (e.g., a combination of 3 rectangles - two of which are parallel, and a third of which is orthogonal to the two and interconnect them). connected), other shapes are possible. A pair of U-shaped touch electrode segments of a first column electrode for a first touch node in a column and a pair of U-shaped touch electrode segments of a first column electrode for a second touch node in a column are connected by one column routing segment and by a first three-way bridge 3512 (or a three-way routing connection in the same layer as the touch electrode segments). A first column routing trace for a first column electrode may bisect a pair of U-shaped column electrode segments of a second column electrode interleaved with the first column electrode. Similarly, a pair of U-shaped touch electrode segments of a second column electrode for a first touch node in a column and a pair of U-shaped touch electrodes of a second column electrode for a second touch node in a column The segments are connected by a second column routing segment and by a second three-way bridge 3512 (or a three-way routing connection in the same layer as the touch electrode segments). The second column routing trace for the second column electrode may bisect a pair of U-shaped column electrode segments of the first column electrode interleaved with the second column electrode. This pattern can be repeated for the second column shown in FIG. 35A (and extended beyond the 2x2 array to a larger portion of the touch sensor panel). Each pair of U-shaped touch electrode segments can be seen as forming a segmented H-shape (e.g., the U-shaped touch electrode segments are mirrored across bisecting column routing traces for interleaved column electrodes). ).

As shown, pairs of U-shaped touch electrode segments are connected to each U-shaped touch electrode by three-way bridges 3512 (or three-way routing connections in the same layer as the touch electrode segments). It is connected to the column routing trace from the segment. A pair of three-way bridges 3512 are illustrated as providing a three-way connection between a column routing trace and a pair of U-shaped touch electrode segments, but it is understood that other bridge connections are possible. . For example, a pair of bridges may be used instead of a three-way bridge, or a pair of U-shaped touch electrode segments may be connected by one or more horizontal bridges, and one or more bridges may be connected to a pair of U-shaped touch electrode segments. - Can be connected to a corresponding column routing trace from one or more of the shaped touch electrode segments. Although four touch electrode segments and four bridges are shown for each column electrode in FIG. 35A, it is understood that a different number of touch electrode segments and bridges may be used.

Each touch node includes a differential pair of row electrodes and a differential pair of column electrodes. For example, the first touch node (touch node A, upper left corner) is a portion of row electrode 3502A and a portion of second row electrode 3502B (e.g., corresponding to differential inputs for touch sensing). , and a portion of column electrode 3504A and a portion of column electrode 3504B (eg, corresponding to differential complementary outputs of touch drive). Thus, differential cancellation occurs on a per touch node basis rather than across two touch nodes. Similarly, the second touch node (touch node B, upper right corner) is a portion of row electrode 3502A and a portion of second row electrode 3502B (e.g., corresponding to differential inputs for touch sensing); and a portion of column electrode 3504C and a portion of column electrode 3504D (eg, corresponding to differential complementary outputs of touch drive); The third touch node (touch node C, lower left corner) is a portion of row electrode 3502C and a portion of second row electrode 3502D (e.g., corresponding to differential inputs for touch sensing), and a column electrode a portion of 3504A and a portion of column electrode 3504B (eg, corresponding to differential complementary outputs of touch drive); A fourth touch node (touch node D, lower right corner) is a portion of row electrode 3502C and a portion of second row electrode 3502D (e.g., corresponding to differential inputs for touch sensing), and a column electrode 3504C and a portion of column electrode 3504D (e.g., corresponding to differential and complementary outputs of touch drive). Thus, differential cancellation occurs on a per touch node basis for each touch node in the 2x2 array of touch nodes.

The touch signal level can be improved and parasitic losses can be reduced for the touch electrode architecture of FIG. 35A compared to the touch electrode architecture of FIG. 33 . For example, unlike the touch electrode architecture of FIG. 33, two dominant and complementary mutual capacitances are represented at each touch node in FIG. 35A. For example, the first touch node (touch node A, upper left corner) is determined by the dominant mutual capacitance between the column electrode 3504A (Tx0+) and the row electrode 3502A (Rx0+) and the column electrode 3504B (Tx0-) measure the complementary dominant mutual capacitance between P and row electrode 3502B (Rx0-); The second touch node (touch node B, upper right corner) is the dominant mutual capacitance between the column electrode 3504C (Tx1+) and the row electrode 3502A (Rx0+) and the column electrode 3504D (Tx1-) and the row electrode ( 3502B) measure the complementary dominant mutual capacitance between (Rx0-); The third touch node (touch node C, lower left corner) is the dominant mutual capacitance between the column electrode 3504A (Tx0+) and the row electrode 3502C (Rx1+) and the column electrode 3504B (Tx0-) and the row electrode ( 3502D) measure the complementary dominant mutual capacitance between (Rx1-); The fourth touch node (touch node D, lower right corner) is the dominant mutual capacitance between the column electrode 3504C (Tx1+) and the row electrode 3502C (Rx1+) and the column electrode 3504D (Tx1-) and the row electrode ( 3502D) (Rx1-) to measure the complementary dominant mutual capacitance between them. The two dominant mutual capacitances at each node add up due to the fact that they are in phase with each other.

Additionally, non-dominant (incidental) parasitic capacitance can be reduced in the touch electrode architecture of FIG. 35A compared to the touch electrode architecture of FIG. 33 . For example, for the first touch node (touch node A), there is still some parasitic capacitance due to mutual capacitance between column routing trace 3508B (Tx0-) and row electrode 3502A (Rx0+) (and There is still some parasitic capacitance due to mutual capacitance between column routing trace 3508A (Tx0+) and row electrode 3502B (Rx0-)), column electrode 3504B (Tx0-) and row electrode 3502A ( Separation is increased between column electrodes 3504A (Tx0+) and row electrodes 3502B (Rx0-) and row routing is reduced compared to the touch electrode architecture of FIG. The length and proximity of column routing trace 3308C to electrode 3302A is eliminated), thereby reducing parasitic signal loss due to mutual capacitance between them.

In some examples, the touch electrode architecture of FIG. 35A can be used for single-ended sensing. For example, a pair of row electrodes are differentially sensed (e.g., row electrode 3502A is coupled to one differential input and row electrode 3502B is coupled to a second differential input of the sense circuitry). Switching circuitry (not shown) may be implemented to enable sensing in a single-ended fashion (e.g., row electrodes 3502A, 3502B coupled together and to one single-ended input of the sensing circuitry). can In some examples, the switching circuitry can enable single-ended sensing at a smaller pitch (e.g., row electrode 3502A is coupled to one single-ended input and row electrode 3502B is coupled to the other single-ended input of the sensing circuitry). As described herein, the touch electrode architecture of FIG. 33 can also be used for single-ended sensing, but due to the interleaving of row electrodes, measurements can be offset between adjacent rows.

FIG. 35B illustrates a variation of FIG. 35A , but with row electrodes interleaved and column electrodes not interleaved (e.g., pseudo-interleaved due to modifications in the touch sensing algorithm). For example, a portion of the touch sensor panel 3520 illustrated in FIG. 35B includes a 2x2 array of touch nodes including four column electrodes 3524A-3524D and four row electrodes labeled 3522A-3522D. do. Each column electrode includes a plurality of touch electrode segments connected by bridges 3530 across row routing traces. As shown, each of the touch electrode segments for a column electrode is rectangular, but other shapes are possible. Although three touch electrode segments and two bridges are shown for each column electrode in the 2x2 array of touch nodes, it is understood that a different number of touch electrode segments and bridges may be used. Although not shown, the column electrodes can be routed to drive circuitry at the top or bottom edges of the touch sensor panel (or optionally, horizontally in a manner similar to that described herein for row electrodes used for sensing). there is.

Each row electrode includes a plurality of touch electrode segments connected by three-way bridges 3532 and row routing traces 3526A-3526D. As shown, each of the touch electrode segments for the row electrode is U-shaped (e.g., a combination of 3 rectangles - two of which are parallel, the third of which is orthogonal to the two and intersect them). connected), other shapes are possible. A pair of U-shaped touch electrode segments of a row electrode for a first touch node in a row and a pair of U-shaped touch electrode segments of a first row electrode for a second touch node in a row are connected by a routing segment and by a first three-way bridge 3532 (or a three-way routing connection in the same layer as the touch electrode segments). A first row routing trace for a first row electrode may bisect a pair of U-shaped row electrode segments of a second row electrode interleaved with the first row electrode. Similarly, a pair of U-shaped touch electrode segments of a second row electrode for a first touch node in a row and a pair of U-shaped touch electrodes of a second row electrode for a second touch node in a row The segments are connected by a second row routing segment and by a second three-way bridge 3532 (or a three-way routing connection in the same layer as the touch electrode segments). The second row routing trace for the second row electrode may bisect a pair of U-shaped row electrode segments of the first row electrode interleaved with the second row electrode. This pattern can be repeated for the second row of touch nodes shown in FIG. 35B (and extended beyond the 2x2 array to a larger portion of the touch sensor panel). Each pair of U-shaped touch electrode segments can be seen as forming a segmented H-shape (e.g., U-shaped touch electrode segments are mirrored across bisecting row routing traces for interleaved row electrodes). ).

As shown, pairs of U-shaped touch electrode segments are row routed from each touch electrode segment by three-way bridges 3532 (or a three-way routing connection in the same layer as the touch electrode segments). connected to A pair of three-way bridges 3532 are illustrated as providing a three-way connection between a row routing trace and a pair of U-shaped touch electrode segments, but it is understood that other bridge connections are possible. . For example, a pair of bridges may be used instead of a three-way bridge, or a pair of U-shaped touch electrode segments may be connected by vertical bridges, and one or more bridges may be connected to a pair of U-shaped touch electrode segments. can be connected to a corresponding row routing trace from one or more of the touch electrode segments of Although four touch electrode segments and four bridges are shown for each row electrode in FIG. 35B, it is understood that a different number of touch electrode segments and bridges may be used.

Each touch node includes a differential pair of row electrodes and a differential pair of column electrodes. For example, the first touch node (touch node A, upper left corner) is a portion of row electrode 3522A and a portion of second row electrode 3522B (e.g., corresponding to differential inputs for touch sensing). , and a portion of column electrode 3524A and a portion of column electrode 3524B (eg, corresponding to differential complementary outputs of a touch drive). Thus, differential cancellation occurs on a per touch node basis rather than across two touch nodes. Similarly, the second touch node (touch node B, upper right corner) is a portion of row electrode 3522A and a portion of second row electrode 3522B (e.g., corresponding to differential inputs for touch sensing); and a portion of column electrode 3524C and a portion of column electrode 3524D (eg, corresponding to differential complementary outputs of touch drive); The third touch node (touch node C, lower left corner) is a portion of row electrode 3522C and a portion of second row electrode 3522D (e.g., corresponding to differential inputs for touch sensing), and a column electrode 3524A and a portion of column electrode 3524B (eg, corresponding to differential complementary outputs of touch drive); A fourth touch node (touch node D, lower right corner) is a portion of row electrode 3522C and a portion of second row electrode 3522D (e.g., corresponding to differential inputs for touch sensing), and a column electrode 3524C and a portion of column electrode 3524D (e.g., corresponding to differential complementary outputs of touch drive). Thus, differential cancellation occurs on a per touch node basis for each touch node in the 2x2 array of touch nodes.

Compared to the touch electrode architecture of FIG. 33 , a touch signal level may be improved and parasitic losses may be reduced for the touch electrode architecture of FIG. 35B . For example, unlike the touch electrode architecture of FIG. 33, two dominant and complementary mutual capacitances are represented at each touch node in FIG. 35B. For example, the first touch node (touch node A, upper left corner) is determined by the dominant mutual capacitance between the column electrode 3524A (Tx0+) and the row electrode 3522A (Rx0+), and the column electrode 3524B (Tx0- ) and the complementary dominant mutual capacitance between the row electrode 3522B (Rx0-); The second touch node (touch node B, upper right corner) is the dominant mutual capacitance between the column electrode 3524C (Tx1+) and the row electrode 3522A (Rx0+), and the column electrode 3524D (Tx1-) and the row electrode (3522B) Measure the complementary dominant mutual capacitance between (Rx0-); The third touch node (touch node C, lower left corner) is the dominant mutual capacitance between the column electrode 3524A (Tx0+) and the row electrode 3522C (Rx1+), and the column electrode 3524B (Tx0-) and the row electrode (3522D) Measure the complementary dominant mutual capacitance between (Rx1-); The fourth touch node (touch node D, lower right corner) is the dominant mutual capacitance between the column electrode 3524C (Tx1+) and the row electrode 3522C (Rx1+), and the column electrode 3524D (Tx1-) and the row electrode Measure the complementary dominant mutual capacitance between (3522D)(Rx1-). The two dominant mutual capacitances at each node add up due to the fact that they are in phase with each other.

Additionally, non-dominant (minor) parasitic capacitance is between column electrode 3524B (Tx0-) and row electrode 3522A (Rx0+) and between column electrode 3524A (Tx0+) and row electrode 3522B (Rx0-). can be reduced due to the increased separation between and due to reduced thermal routing.

36 illustrates an exemplary touch electrode architecture that is fully differential within a touch node, according to examples of the present disclosure. In the touch electrode architecture of FIG. 36, both row and column electrodes can be differentially interleaved within a touch node. A portion of the touch sensor panel 3600 illustrated in FIG. 36 corresponds to a single touch node, as a modification of each of the touch nodes in the touch electrode architectures of FIG. 35A or 35B (or across a larger touch sensor panel). can be applied The illustrated touch electrodes include two column electrodes 3604A, 3604B and two row electrodes 3602A, 3602B (expanding to four column electrodes and four row electrodes for a 2x2 array of touch nodes). include Each row electrode includes a plurality of touch electrode segments connected by bridges 3606A and 3606B. As shown, each of the touch electrode segments for the row electrode is rectangular (with rectangular routing extensions to reduce bridge length), but other shapes are possible. Although two touch electrode segments and one bridge are shown for each row electrode, it is understood that a different number of touch electrode segments and bridges may be used.

Each column electrode includes a plurality of touch electrode segments connected by a bridge (eg, bridges 3608A, 3608B) or routing traces. As shown, each of the touch electrode segments for a column electrode is complementary to the shape of the touch electrode segments for the row electrode, the shape of the touch electrode segments for the column electrode is approximately U-shaped (except for modifications to allow routing extensions for the row touch electrode segments), Other shapes are possible, although two touch electrode segments and one bridge (or routing trace) are shown for each column electrode, it is understood that a different number of touch electrode segments and bridges may be used.

As shown, the touch node includes a differential pair of row electrodes and a differential pair of column electrodes. For example, the touch node in FIG. 36 includes a portion of the first row electrode 3602A and a portion of the second row electrode 3602B (e.g., corresponding to differential inputs for touch sensing), and a column electrode 3604A. ) and a portion of column electrode 3604B (eg, corresponding to the differential complementary outputs of touch drive). Thus, differential cancellation occurs on a per touch node basis. The enhanced touch signal from the two (or four if each quadrant of the touch node is viewed individually) dominant capacitances can be applied in a similar manner to the other touch nodes.

Compared to the touch electrode architecture of FIG. 33 , a touch signal level may be improved and parasitic losses may be reduced for the touch electrode architecture of FIG. 36 . For example, unlike the touch electrode architecture of FIG. 33 , two (or four if each quadrant of the touch node is viewed individually) dominant and complementary mutual capacitances are represented at the touch node of FIG. 36 . For example, the touch node is determined by the dominant mutual capacitance between the column electrode 3604A (Tx0+) and the row electrode 3602A (Rx0+), and the column electrode 3604B (Tx0-) and the row electrode 3602B (Rx0-). Measure the complementary dominant mutual capacitance between The two (or four) dominant mutual capacitances at each node add up due to the fact that they are in phase with each other.

Additionally, non-dominant (collateral) parasitic capacitance may be reduced. For example, due to mutual capacitance between column electrode 3604B (Tx0-) and row electrode 3602A (Rx0+) and between column electrode 3604A (Tx0+) and row electrode 3602B (Rx0-), still Although some parasitic capacitance is present, the isolation is primarily increased (outside the small row extensions) and limited by short routing, thereby reducing parasitic signal loss due to mutual capacitance between them. The reduced parasitic loss from the two non-dominant capacitances can be applied in a similar way to other touch nodes.

Referring back to the discussion of FIG. 34 , in some examples, a touch electrode architecture for differential drive without differential sensing may be implemented. Differential driving can still reduce touch-to-display noise (without differential sensing to reduce display-to-touch noise). Additionally, common mode noise can be reduced using spatial separation and spatial filtering. Spatial separation between the touch signal and the common mode noise signal can be achieved using a touch electrode architecture with reduced pitch for the transmitter and receiver electrodes.

37 illustrates a portion of an example touch sensor panel configured for differential drive, in accordance with examples of the present disclosure. A portion of the touch sensor panel 3700 includes a 4x4 array of touch nodes including 8 transmitter electrodes interleaved within 4 rows of touch nodes and 8 receiver electrodes within 4 columns of touch nodes. To simplify the illustration, bridges are not shown in FIG. 37 , but it is understood that most of the touch electrodes in FIG. 37 are implemented in a first metal mesh layer with bridges in a second metal mesh layer.

As shown in touch sensor panel 3700, a first row includes a first pair of interleaved transmitter electrodes labeled D0+ and D0- representing the complementary drive signals applied to this row during a touch sensing operation; a second row includes a second pair of interleaved transmitter electrodes labeled D1+ and D1- representing the complementary drive signal applied to this row during a touch sensing operation; a third row includes a third pair of interleaved transmitter electrodes labeled D2+ and D2- representing the complementary drive signal applied to this row during a touch sensing operation; The fourth row includes a fourth pair of interleaved transmitter electrodes labeled D3+ and D3- representing the complementary drive signal applied to this row during a touch sensing operation. Additionally, touch sensor panel 3700 includes a first pair of non-interleaved receiver electrodes labeled S0 _A and S0 _B where the first column represents the two single-ended sense lines for this column during a touch sensing operation. do; a second column includes a second pair of non-interleaved receiver electrodes labeled S1 _A and S1 _B representing the two single-ended sense lines for this column during touch sensing operation; a third column includes a third pair of non-interleaved receiver electrodes labeled S2 _A and S2 _B representing the two single-ended sense lines for this column during touch sensing operation; It is shown that the fourth column contains a fourth pair of non-interleaved receiver electrodes labeled S3 _A and S3 _B representing the two single-ended sense lines for this column during touch sensing operation.

37 illustrates a touch node 3710 corresponding to a unit cell of the touch electrode architecture, which can be repeated for a 4x4 array of touch nodes (or beyond, for a larger touch sensor panel). During a touch sensing operation, a first pair of interleaved transmitter electrodes labeled D0+ and D0- may be stimulated, and the resulting mutual capacitance(s) of the corresponding first pair of receiver electrodes labeled S0 _A and S0 _B can be measured by A touch signal for the touch node 3710 may be expressed as a sum of touch signals measured from a pair of receiver electrodes.

37 also shows the data line orientation for the touch sensor panel 3700 . As shown in FIG. 37, the data line is oriented orthogonal to the receiver electrodes and parallel to the transmitter electrodes (eg, such that the receiver electrodes receive the average of the display data line noise). As described herein, the data lines of the display represent a source of noise to the touch sensing system, also referred to herein as “cathode noise”. 37 illustrates representative spatial shapes 3720 of cathode noise along the direction of touch transmitter electrodes and representative spatial shapes 3740 of cathode noise along the (eg, orthogonal) direction of touch receiver electrodes. The spatial shapes of the cathode noise may be similar along the direction of the touch transmitter electrodes (eg, similar RC characteristics), with the amplitude of the shape scaling, usually, with the gray levels of the different display images (eg, similar RC characteristics). For example, a nearly constant noise spatial spectrum). In contrast, the spatial shapes of cathode noise can vary and can be image dependent along the direction of the touch receiver electrodes. Additionally, the spatial shapes of the cathode noise along the direction of the touch transmitter electrodes can be measured in a correlated fashion with the analog front ends (sensing circuitry) to the receiver electrodes, while the spatial shapes of the cathode noise along the direction of the touch receiver electrodes can be measured in a temporally uncorrelated way.

Thus, the touch electrode architecture can achieve spatial noise cancellation by encoding the excitation of the transmitter electrodes along the direction of the correlated and shape-coherent cathode noise along the direction of the interleaved transmitter electrodes. Additionally, as described herein with respect to FIGS. 38 and 39 , spatial separation and spatial noise cancellation can be improved by reducing the pitch of the touch electrodes.

39 illustrates three plots of spatial touch signal and noise, according to examples of the present disclosure. Plot 3900 shows noise along the axis of the touch sensor panel (eg, corresponding to touch sensor panel 3700 or 3800) and spatial data corresponding to different touches. The axis of the touch sensor panel is represented by an array of receiver electrodes 3902 having a receiver electrode pitch (P _RX ). The bars above the array of receiver electrodes 3902 represent the touch signal and/or noise signal at the corresponding receiver electrodes. As shown, a first profile 3904 corresponds to a first touching object (eg, a small finger) and a second profile 3906 corresponds to a second touching object (eg, a larger finger or multiple little fingers). Profile 3908 represents cathode noise. The data represented by the plot 3900 is spatial data, and as shown, the profile of the cathode noise has a spatial shape corresponding to the spatial shapes 3720 of the cathode noise along the direction of the touch transmitter electrodes. As shown, the shape of the cathode noise is spatially wide (e.g., extending across the panel) relative to the spatial width of the first or second touching objects, (e.g., relative to the noise along the orthogonal axis) have a low frequency.

Plot 3920 shows the spatial spectrum corresponding to the spatial data in plot 3900. Profile 3922 represents the spatial spectral domain corresponding to the cathodic noise of profile 3908 in spatial data. A relatively broad noise signal has a low frequency and therefore appears near the center of the spatial spectrum in the spatial spectral domain (e.g., at low spatial frequencies centered at zero). In contrast, profile 3924 represents the spatial spectral domain corresponding to profiles 3904 and/or 3906 of the touch signal(s) in spatial data. Relatively narrow touch signals in spatial data appear wider in the spatial spectral domain compared to noise. However, plot 3920 corresponds to a non-differential transmit electrode configuration (eg, without interleaving and stimulation by complementary drive signals).

Plot 3940 corresponds to the spatial data in plot 3900, but shows the spatial spectrum when using a differential transmit electrode configuration. In plot 3940, the cathode noise from the display is not coded, so the profile 3942 of the spectrum of cathode noise remains the same as profile 3922 in plot 3920. However, encoding the spectrum for the touch signal using a differential transmitter configuration results in upconversion of the touch signal in the spatial spectral domain resulting in two half-lobes 3944A, 3944B. The two half-lobes 3944A, 3944B due to upconversion may at least partially overlap, in some examples. For example, plot 3940 illustrates some overlap between profiles 3942 and half-lobes 3944A or 3944B. In some examples, the separation between the profiles in the spatial spectral domain may be improved or eliminated by sufficient upconversion through reducing the transmitter and/or receiver pitch. The spatially separated signals may be filtered using a spatial high pass filter to remove noise (and possibly parts of the touch signal when some overlap remains).

In some examples, the non-overlap condition between cathode noise and touch signal spatial spectra can be expressed as Ts + Ns < 1/P _RX , where Ts represents the touch signal spatial spectral width and Ns is the noise signal spatial spectrum represents the width, and P _RX represents the receiver electrode pitch.

In some examples, the coding will appear to cause the touch signal to have a sawtooth shape or other relatively high frequency shape (e.g., due to coded differential simulation) that is easier to resolve from the flatter common mode shape of the cathode noise. can In particular, a flatter common mode shape (with a relatively low frequency, and correlated shape) of the cathode noise for transmitter electrodes parallel to the data lines, as described herein.

38 illustrates a portion of an example touch sensor panel configured for differential drive, in accordance with examples of the present disclosure. A portion of the touch sensor panel 3800 includes eight transmitter electrodes (labeled D0+, D0-, D1+, D1, D2+, D2-, D3+, and D3-) interleaved in four rows of touch nodes and a touch node. It includes a 1x4 array of touch nodes including two receiver electrodes (labeled S0 _A and S0 _B ) in one row of . To simplify the example, bridges are not shown in FIG. 38 , but touch node 3810 (corresponding to the full dimensions of touch node 3710) is included for reference. Additionally, for ease of illustration, dimensions of portions of touch sensor panel 3800 are exaggerated (eg, width is exaggerated relative to length to show details of features), but touch nodes ( 3810, 3710) can have the same overall dimensions.

One primary rectangular segment (e.g., primary rectangular segments 3712A, 3712B for transmitter electrodes D0+, D0- in touch node 3710) and one round between transmitter electrodes in the touch node. Unlike FIG. 37 which includes two interleaved transmitter electrodes each having an interleaved transition, in FIG. ), four primary rectangular segments 3812A and four primary rectangular segments 3812B for the transmitter electrodes D0+, D0−) and seven interleaved transitions between the transmitter electrodes in the touch node. include

As described herein, encoding touch signals at higher spatial frequencies compared to cathode noise enables separation of the touch and noise spatial spectra for noise cancellation. Isolation can be improved by reducing the receiver electrode pitch. Comparing FIGS. 37 and 38 , the receiver electrode pitch P _RX can be reduced by approximately a factor of 4 (eg, touch nodes 3710 and 3810 have the same dimensions). While FIG. 37 illustrates one primary rectangular segment per transmitter electrode and FIG. 38 illustrates four primary rectangular segments per transmitter electrode, different numbers per transmitter electrode (e.g., two, three, five , etc.) of first order rectangular segments are possible.

It is understood that reducing the receiver electrode pitch can provide better isolation, but there are tradeoffs. For example, comparing FIGS. 37 and 38, the two receiver electrodes in FIG. 37 are replaced with the eight narrower receiver electrodes in FIG. As a result, the touch-sensing circuitry potentially requires a quadruple in number of receiver channels, which increases the size, cost, and power consumption of the touch-sensing circuitry (or reduced, if channels are multiplexed between receiver electrodes). integral time required). In some examples, the above sensing circuitry (or integration time) penalties can be mitigated by interconnecting (eg, grouping/aggregating) an increased number of narrower receiver electrodes. For example, as shown in FIG. 38, four receiver electrodes can be interconnected and connected to one single-ended sensing channel of touch sensing circuitry, and the other four receiver electrodes can be interconnected and connected to another single-ended sensing channel of touch sensing circuitry. It can be connected to a single-ended sense channel. The interconnects avoid the need for additional sensing circuitry, and the touch node resolution of the touch sensor panel does not change between touch sensor panels 3700 and 3800. In some examples, interconnection between multiple receiver electrodes occurs at a touch sensor panel boundary (e.g., in a border region) to reduce the number of in-panel jumpers and/or vias. . However, it is understood that in some examples, interconnection may additionally or alternatively be performed within the touch sensor panel area.

While grouping receiver electrodes can avoid the touch sensing circuitry penalty, reducing receiver electrodes can involve other tradeoffs. For example, narrower receiver electrodes can cause increased resistance, which thereby reduces the touch sensor panel bandwidth (however, the impact on bandwidth is somewhat mitigated by the reduced loading of the narrower receiver electrodes). can be). Additionally or alternatively, narrower receiver electrodes and a corresponding reduction in transmitter electrode pitch may reduce the arrival of mutual capacitance fringing fields. If the fringing fields are reduced too much, they may not extend far enough beyond the touch sensor panel surface (eg, cover glass or other material) to be able to interact with objects (eg, fingers). there is.

It is understood that the spatial noise cancellation techniques described herein with respect to FIGS. 37-39 may be applied to other touch electrode architectures. For example, the pitch of the receiver electrodes and the corresponding pitch of the interleaved transmitter electrodes are the same as the interleaved transmitter electrodes (e.g., column electrodes) and non-interleaved receiver electrodes (e.g., column electrodes) in the touch electrode architecture of FIGS. 34 and 35A. For example, row electrodes).

Accordingly, in accordance with the foregoing, some examples of the present invention relate to a touch sensor panel. The touch sensor panel includes: a plurality of touch electrodes including a plurality of first electrodes and a plurality of second electrodes in a first layer and forming a two-axis array of touch nodes; a plurality of first routing traces in a second layer different from the first layer and coupled to the first electrodes using a plurality of first electrical interconnections between the first layer and the second layer; and a plurality of second routing traces in the second layer and coupled to the second electrodes using a plurality of second electrical interconnections between the first layer and the second layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of first routing traces can be routed along a first axis of the two-axis array, at least partially overlapping the two-axis array of touch nodes. It can be. Additionally or alternatively to one or more of the examples disclosed above, in some examples the plurality of second traces may be routed along a first axis of the two-axis array and at least partially overlap the two-axis array of touch nodes. can

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first electrodes can include column electrodes, the second electrodes can include row electrodes, and the two-axis array of touch nodes comprises a touch It can contain a row-column arrangement of nodes. Additionally or alternatively to one or more of the examples disclosed above, in some examples the second layer may include, for a first column of the row-column arrangement of touch nodes, multiple sets of one or more routing trace segments; The plurality of sets of one or more routing trace segments may include a first set of one or more routing trace segments, a second set of one or more routing trace segments, a third set of one or more routing trace segments, and a fourth set of one or more routing trace segments. includes

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the second layer may include, for a first column of the row-column arrangement of touch nodes, multiple sets of one or more routing trace segments; The plurality of sets of one or more routing trace segments include a first set of one or more routing trace segments, a second set of one or more routing trace segments, a third set of one or more routing trace segments, a fourth set of one or more routing trace segments, A fifth set of one or more routing trace segments, and a sixth set of one or more routing trace segments.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first column can include a first column electrode and a second column electrode, and the first set of one or more routing trace segments comprises a plurality of first column electrodes. may include a first one of the routing traces, the second set of one or more routing trace segments may include a second routing trace of the plurality of first routing traces disposed in the first column, and A first routing trace of the first routing traces may be coupled to the first column electrode, and a second routing trace of the plurality of first routing traces may be coupled to the second column electrode.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, a first routing trace of a plurality of second routing traces, a second routing trace of a plurality of second routing traces, and a plurality of second routing traces A third of the routing traces may be disposed within the first column. A first routing trace of the second plurality of routing traces is a first portion of a first set of one or more routing trace segments, a first portion of a second set of one or more routing trace segments, a third set of one or more routing trace segments. and a first portion of a fourth set of one or more routing trace segments. A second routing trace of the plurality of second routing traces may include a second portion of the first set of one or more routing trace segments and a second portion of the second set of one or more routing trace segments. A third routing trace of the second plurality of routing traces may include a third portion of the first set of one or more routing trace segments. Within the first column, a first routing trace of the plurality of second routing traces may be coupled to the first row electrode, and a second routing trace of the plurality of second routing traces may be coupled to the second row electrode. and a third routing trace among the plurality of second routing traces may be coupled to the third row electrode.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the first set of one or more routing trace segments can include a first electrical discontinuity along a first axis and a second electrical discontinuity along a first axis. . The second set of one or more routing trace segments may include a third electrical discontinuity along the first axis. the first electrical discontinuity may be within a threshold distance along the first axis from an electrical interconnection between a third routing trace of the plurality of second routing traces and a third row electrode; the second electrical discontinuity may be within a threshold distance along the first axis from an electrical interconnection between a second row electrode and a second routing trace of the plurality of second routing traces; The third electrical discontinuity may be within a threshold distance along the first axis from an electrical interconnection between a second routing trace of the plurality of second routing traces and a second row electrode.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the first set of one or more routing trace segments can include a fourth electrical discontinuity along the first axis and the second set of one or more routing trace segments may include a fifth electrical discontinuity along the first axis, the third set of one or more routing trace segments may include a sixth electrical discontinuity along the first axis, and the fourth set of one or more routing trace segments may include a sixth electrical discontinuity along the first axis. A seventh electrical discontinuity may be included along one axis. The fourth electrical discontinuity, the fifth electrical discontinuity, the sixth electrode discontinuity, and the seventh electrode discontinuity extend the first axis from the electrical interconnection between the first routing trace and the first row electrode of the plurality of second routing traces. may be within a critical distance. Additionally or alternatively to one or more of the examples disclosed above, in some examples the threshold distance may be the length of one row of the row-column arrangement of touch nodes along the first axis.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the fourth portion of the first set of one or more routing trace segments may include the first floating segment, the first set of one or more routing trace segments a fourth portion of is separated from a third portion of the first set of one or more routing trace segments by a fourth electrical discontinuity; A third portion of the second set of one or more routing trace segments may include a second floating segment, and a third portion of the second set of one or more routing trace segments may comprise one or more routing trace segments by a fifth electrical discontinuity. separated from the second portion of the second set of ; The second portion of the third set of one or more routing trace segments may include a third floating segment, the second portion of the third set of one or more routing trace segments comprising the one or more routing trace segments by the sixth electrical discontinuity. separated from the first portion of the third set of ; The second portion of the fourth set of one or more routing trace segments may include a fourth floating segment, the second portion of the fourth set of one or more routing trace segments comprising the one or more routing trace segments by the seventh electrical discontinuity. are separated from the first part of the fourth set of . Additionally or alternatively to one or more of the examples disclosed above, in some examples the first set of one or more routing trace segments and the second set of one or more routing trace segments may overlap one or more column electrodes in the first column. there is. The third set of one or more routing trace segments and the fourth set of one or more routing trace segments may not overlap one or more column electrodes in the first column.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, a first set of one or more routing trace segments, a second set of one or more routing trace segments, a third set of one or more routing trace segments, and one or more a fourth set of routing trace segments may be coupled to the row electrodes; a fifth set of one or more routing trace segments and a sixth set of one or more routing trace segments can be coupled to the column electrodes and overlap one or more column electrodes in the first column; the fifth set of one or more routing trace segments may be disposed adjacent to and between the first set of one or more routing trace segments and the second set of one or more routing trace segments; the sixth set of one or more routing trace segments may be disposed adjacent to and between the third set of one or more routing trace segments and the fourth set of one or more routing trace segments; the second set of one or more routing trace segments may be disposed adjacent to and between the fifth set of one or more routing trace segments and the third set of one or more routing trace segments; The third set of one or more routing trace segments may be disposed adjacent to and between the second set of one or more routing trace segments and the sixth set of one or more routing trace segments.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the row-column arrangement of touch nodes can be divided into a plurality of banks of rows; a first row electrode may be disposed within a first bank of the plurality of banks of rows; the second row electrode may be disposed in a second bank of the plurality of banks of rows; A third row electrode may be disposed in a third bank of the plurality of banks of rows.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the first row electrode and the second row electrode can be separated by a first number of rows of a row-column arrangement of touch nodes along the first axis; , the second row electrode and the third row electrode may be separated by a first number of rows of a row-column arrangement of touch nodes along the first axis.

Additionally or alternatively to one or more of the examples disclosed above, in some examples each row of the row-column arrangement of touch nodes may include a pair of row electrodes. The second layer may include, for a second column of the row-column arrangement of touch nodes adjacent to the first column, a fourth routing trace of a plurality of second routing traces, a fifth routing trace of a plurality of second routing traces, and a plurality of second routing traces. a second plurality of sets of one or more routing trace segments forming a sixth routing trace of the second routing traces of; within the second column, a fourth routing trace of the second plurality of routing traces may be coupled to the fourth row electrode and a fifth routing trace of the second plurality of routing traces may be coupled to the fifth row electrode; and a sixth routing trace of the plurality of second routing traces may be coupled to the sixth row electrode; The first row electrode and the fourth row electrode may be a first respective pair of row electrodes disposed within the first respective row, and the second row electrode and the fifth row electrode may be a first respective pair of row electrodes disposed within the second respective row. a second respective pair, and the third row electrode and sixth row electrode may be a third respective pair of row electrodes disposed within the third respective row.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the row-to-column arrangement of touch nodes can be divided into a plurality of banks of rows. The plurality of second routing traces may be coupled to the second electrodes in a V-shaped pattern using the plurality of second electrical connections. Additionally or alternatively to one or more of the examples disclosed above, in some examples, for each bank of the plurality of banks of rows in the V-shaped pattern, even rows of the row-column arrangement of touch nodes are row-column of touch nodes. can be interconnected within a first set of contiguous columns of an arrangement; odd-numbered rows of the row-column arrangement of touch nodes may be interconnected in a second set of contiguous columns of the row-column arrangement of touch nodes; Each distance along a second axis different from the first axis between a respective interconnection for each row and a line along the first axis separating the first set of contiguous columns from the second set of contiguous columns is It can decrease for rising rows within a bank.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the row-column arrangement of touch nodes can be divided into a plurality of banks of rows; A plurality of second routing traces may be coupled to the second electrodes in an S-shaped pattern using a plurality of second electrical connections. Additionally or alternatively to one or more of the examples disclosed above, in some examples, for each bank of the plurality of banks of rows of the S-shaped pattern, adjacent rows of the row-column arrangement of touch nodes are a row of touch nodes. -can be interconnected in adjacent pairs of columns in a column arrangement, and adjacent rows between adjacent banks can be interconnected in common pairs of columns.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the row-column arrangement of touch nodes comprises a first bank, a second bank, and a third bank between the first and second banks. It can be divided into multiple banks of rows. Adjacent rows of the row-column arrangement of touch nodes of the first bank may be interconnected in adjacent pairs of columns of the row-column arrangement of touch nodes; Adjacent rows of the row-column arrangement of touch nodes of the second bank may be interconnected in adjacent pairs of columns of the row-column arrangement of touch nodes; A plurality of third routing traces in a border region outside the two-axis array may be coupled to row electrodes in rows of the third bank.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the second layer may include, for a second column of the row-column arrangement of touch nodes, a second plurality of sets of one or more routing trace segments. and the plurality of sets of one or more routing trace segments include a fifth set of one or more routing trace segments, a sixth set of one or more routing trace segments, a seventh set of one or more routing trace segments, and a seventh set of one or more routing trace segments. Includes 8 sets.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the first routing trace of the plurality of second routing traces and the second routing trace of the plurality of second routing traces are within the first column and within the second column. can be placed; The third routing trace of the plurality of second routing traces, the fourth routing trace of the plurality of second routing traces, the fifth routing trace of the plurality of second routing traces, and the sixth routing trace of the plurality of second routing traces Can be placed within 2 rows. A first routing trace of the second plurality of routing traces is a first portion of a first set of one or more routing trace segments, a first portion of a third set of one or more routing trace segments, a fifth set of one or more routing trace segments. and a first portion of a seventh set of one or more routing trace segments; A second routing trace of the second plurality of routing traces is a first portion of a second set of one or more routing trace segments, a first portion of a fourth set of one or more routing trace segments, a sixth set of one or more routing trace segments. and a first portion of an eighth set of one or more routing trace segments; a third routing trace of the second plurality of routing traces may include a second portion of a fifth set of one or more routing trace segments and a second portion of a seventh set of one or more routing trace segments; a fourth routing trace of the second plurality of routing traces may include a second portion of a sixth set of one or more routing trace segments and a second portion of an eighth set of one or more routing trace segments; a fifth routing trace of the second plurality of routing traces may include a third portion of the sixth set of one or more routing trace segments; A sixth routing trace of the second plurality of routing traces may include a third portion of an eighth set of one or more routing trace segments. A first routing trace of the plurality of second routing traces may be coupled to a first row electrode within a first row within a first column and/or within a second column; a second routing trace of the plurality of second routing traces may be coupled to a second row electrode within a first row within the first column and/or within a second column; a third routing trace of the plurality of second routing traces may be coupled to a third row electrode of a second row within the second column; a fourth routing trace of the plurality of second routing traces may be coupled to a fourth row electrode of a second row within the second column; a fifth routing trace of the plurality of second routing traces may be coupled to a fifth row electrode of a third row within the second column; a sixth routing trace of the plurality of second routing traces may be coupled to a sixth row electrode of a third row within the second column;

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the second layer may include, for a second column of the row-column arrangement of touch nodes, a second plurality of sets of one or more routing trace segments. and the plurality of sets of one or more routing trace segments include a fifth set of one or more routing trace segments, a sixth set of one or more routing trace segments, a seventh set of one or more routing trace segments, and a seventh set of one or more routing trace segments. Includes 8 sets. A first routing trace of the plurality of second routing traces, a second routing trace of the plurality of second routing traces, and a third routing trace of the plurality of second routing traces may be disposed in the first column; A fourth routing trace of the plurality of second routing traces, a fifth routing trace of the plurality of second routing traces, and a sixth routing trace of the plurality of second routing traces may be disposed in the second column. A first routing trace of the second plurality of routing traces is a first portion of a first set of one or more routing trace segments, a first portion of a second set of one or more routing trace segments, a third set of one or more routing trace segments and a first portion of a fourth set of one or more routing trace segments; a second routing trace of the plurality of second routing traces may include a second portion of the first set of one or more routing trace segments and a second portion of the second set of one or more routing trace segments; A third routing trace of the second plurality of routing traces may include a third portion of the first set of one or more routing trace segments. Within the first column, a first routing trace of the plurality of second routing traces may be coupled to a first row electrode of a first row, and a second routing trace of the plurality of second routing traces may be coupled to a first row electrode of a first row. A third routing trace of the plurality of second routing traces may be coupled to a third row electrode of a third row. A fourth routing trace of the second plurality of routing traces is a first portion of a fifth set of one or more routing trace segments, a first portion of a sixth set of one or more routing trace segments, a seventh set of one or more routing trace segments. and a first portion of an eighth set of one or more routing trace segments; a fifth routing trace of the second plurality of routing traces may include a second portion of a fifth set of one or more routing trace segments and a second portion of a sixth set of one or more routing trace segments; A sixth routing trace of the second plurality of routing traces may include a third portion of the fifth set of one or more routing trace segments. Within the second column, a fourth routing trace of the plurality of second routing traces may be coupled to a fourth row electrode of the first row, and a fifth routing trace of the plurality of second routing traces may be coupled to a fourth row electrode of the first row. and a sixth routing trace of the plurality of second routing traces can be coupled to a sixth row electrode of a third row.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, in a differential drive and differential sense mutual capacitance sensing operation, the first electrodes can be configured as transmitter electrodes and the second electrodes can be configured as receiver electrodes. . Additionally or alternatively to one or more of the examples disclosed above, in some examples the drive circuitry can be coupled to the first electrodes and can be configured to drive the plurality of transmitter electrodes with a plurality of drive signals. For a first column in the two-axis array of touch nodes, the plurality of drive signals are a first drive signal applied to one or more first touch nodes of the first column and one or more second touch nodes of the first column of touch nodes. It may include a second driving signal applied to. For a second column in the two-axis array of touch nodes, the plurality of drive signals include a third drive signal applied to one or more first touch nodes in the second column and a second drive signal applied to one or more second touch nodes in the second column. 4 drive signals may be included. The first drive signal, the second drive signal, the third drive signal, and the fourth drive signal may be applied at least partially simultaneously. The first driving signal and the third driving signal may be complementary driving signals, and the second driving signal and the fourth driving signal may be complementary driving signals. The one or more first touch nodes in the first column and the one or more first touch nodes in the second column may be diagonally adjacent touch nodes; One or more second touch nodes in the first column and one or more second touch nodes in the second column may be diagonally adjacent touch nodes.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of sets of one or more routing trace segments may be connected from a first touch node at one end of the first row to a second row, opposite the first end, of the first row. It may extend to the second touch node at the second end. Additionally or alternatively to one or more of the examples disclosed above, in some examples, a length of each of the plurality of sets of one or more routing trace segments along the first axis may be within a threshold percentage of a length of the first column along the first axis. there is. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the threshold percentage of the length of the first column along the first axis is 1%. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the threshold percentage of the length of the first column along the first axis is 5%. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the threshold percentage of the length of the first column along the first axis is 10%.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of sets of one or more routing trace segments are equally spaced along a second axis of the two-axis array that is different from the first axis of the two-axis array. It can be. Additionally or alternatively to one or more of the examples disclosed above, in some examples the plurality of touch electrodes may be formed of a metal mesh, and the plurality of first routing traces and the plurality of second routing traces are formed of a metal mesh .

Some examples of the present disclosure relate to electronic devices. Electronic devices include energy storage devices; communication circuitry; and a touch screen. A touch screen is a display having an active area; and the touch screen described herein.

Some examples of the present disclosure relate to a touch sensor panel. The touch sensor panel includes: a plurality of touch electrodes including a plurality of column electrodes and a plurality of row electrodes in a first layer and forming a row-column arrangement of touch nodes; a plurality of first routing traces in a second layer different from the first layer and coupled to the column electrodes using a plurality of first electrical interconnections between the first layer and the second layer; and a plurality of second routing traces in the second layer and coupled to the row electrodes using a plurality of second electrical interconnections between the first layer and the second layer. the plurality of first routing traces may be routed along columns of the row-column arrangement and may at least partially overlap the row-column arrangement of touch nodes; The plurality of second traces may be routed along columns of the row-column arrangement and may at least partially overlap the row-column arrangement of touch nodes. The pair of columns may include six routing traces of the plurality of second routing traces, the six routing traces comprising a first routing trace and a second routing trace disposed in a first column and in a second column of the pair of columns. 2 routing traces; and a third routing trace, a fourth routing trace, a fifth routing trace, and a sixth routing trace disposed in a second one of the pair of columns.

Some examples of the present disclosure relate to a touch sensor panel. The touch sensor panel includes: a plurality of touch electrodes including a plurality of column electrodes and a plurality of row electrodes in a first layer and forming a row-column arrangement of touch nodes; a plurality of first routing traces in a second layer different from the first layer and coupled to the column electrodes using a plurality of first electrical interconnections between the first layer and the second layer; and a plurality of second routing traces in the second layer and coupled to the row electrodes using a plurality of second electrical interconnections between the first layer and the second layer. the plurality of first routing traces may be routed along columns of the row-column arrangement and may at least partially overlap the row-column arrangement of touch nodes; The plurality of second traces may be routed along columns of the row-column arrangement and may at least partially overlap the row-column arrangement of touch nodes. The pair of columns may include six routing traces of the plurality of second routing traces, and the six routing traces include a first routing trace disposed in a first column of the pair of columns, a second routing trace, and a third routing trace; and a fourth routing trace, a fifth routing trace, and a sixth routing trace disposed in a second one of the pair of columns.

Some examples of this disclosure relate to touch screens. A touch screen includes a display having an active area; a first metal layer and a second metal layer disposed over the display; and an intermediate dielectric layer disposed between the first metal layer and the second metal layer. A plurality of touch electrodes of the touch screen may be formed in an active area of the display, and the plurality of touch electrodes may include a touch electrode formed of a first metal mesh in a first metal layer and a first metal mesh in a second metal layer. can Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first metal mesh of the first metal layer can be aligned with the first metal mesh of the second metal layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, a width of the first metal mesh of the second metal layer is smaller than a width of the first metal mesh of the first metal layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples the touch screen can include a plurality of routing traces formed within an active area of the display and coupled to a plurality of touch electrodes. The plurality of routing traces may include a routing trace formed of a second metal mesh in the second metal layer and a second metal mesh in the first metal layer.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the second metal mesh of the first metal layer can be aligned with the second metal mesh of the second metal layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, a width of the second metal mesh of the second metal layer is smaller than a width of the second metal mesh of the first metal layer.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, a plurality of touch electrodes may be formed using bridges in the active area of the display formed of the first mesh metal in the second layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen may further include a plurality of routing traces formed within the active area of the display and coupled to the plurality of touch electrodes. The plurality of routing traces may include a routing trace formed of a second metal mesh in the second metal layer. A routing trace may be disposed below the touch electrode formed of the first metal mesh in the first metal layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of routings of the touch screen can be formed with a second metal mesh in a second metal layer without a metal mesh in the first metal layer.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, each of the plurality of touch electrodes of the touch screen may be formed of a first metal mesh in a first metal layer and a first metal mesh in a second metal layer. can

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch electrode formed of the first metal mesh in the first metal layer and the first metal mesh in the second metal layer has non-overlapping regions and overlapping regions. can include The first metal mesh of the first metal layer and the first metal mesh of the second metal layer may not be parallel in overlapping regions. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first metal mesh of the first metal layer and the first metal mesh of the second metal layer may be orthogonal at overlapping regions of the touch electrode. Additionally or alternatively to one or more of the examples disclosed above, in some examples, an area of each of the overlapping regions of the touch electrode may be uniform.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen fills gaps in the first metal mesh of the first metal layer and/or fills gaps in the second metal mesh of the first metal layer. A transparent conductive material may be further included. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen is transparent to fill gaps in the first metal mesh of the first metal layer without filling gaps in the second metal mesh of the first metal layer. A conductive material may be further included.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen may include a first metal layer disposed between the first transparent conductive material and the first metal layer and/or between the second transparent conductive material and the first metal layer. 2 may further include an intermediate dielectric layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples the intermediate dielectric layer can be greater than 0.5 microns thick. Additionally or alternatively to one or more of the examples disclosed above, in some examples the intermediate dielectric layer can be between 1 and 2.5 microns thick. Additionally or alternatively to one or more of the examples disclosed above, in some examples the middle dielectric layer can include an organic material. Additionally or alternatively to one or more of the examples disclosed above, in some examples the intermediate dielectric layer can have a dielectric constant less than 5. Additionally or alternatively to one or more of the examples disclosed above, in some examples the intermediate dielectric layer can have a dielectric constant between 2.5 and 4.

Some examples of this disclosure relate to touch screens. A touch screen includes a display having an active area; a first metal layer and a second metal layer disposed over the display; and an intermediate dielectric layer disposed between the first metal layer and the second metal layer. A plurality of touch electrodes of the touch screen may be formed as a first metal mesh in a first metal layer within an active area of the display. The plurality of touch electrodes may include a touch electrode including a first segment formed of the first metal mesh on the first layer and a second segment formed of the first metal mesh on the first layer. The first segment and the second segment may be interconnected by a bridge electrode formed by the first metal mesh in the second metal layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen may include a plurality of touches formed of a second metal mesh in a first metal layer and a second metal mesh in a second metal layer in an active area of the display. It may further include a plurality of routing traces of the touch screen coupled to the electrodes.

Some examples of the present disclosure relate to electronic devices. A touch screen is an energy storage device; communication circuitry; and a touch screen. A touch screen includes a display having an active area; a first metal layer and a second metal layer disposed over the display; and an intermediate dielectric layer disposed between the first metal layer and the second metal layer. A plurality of touch electrodes of the touch screen may be formed in an active area of the display, the plurality of touch electrodes including a touch electrode formed of a first metal mesh in a first metal layer and a first metal mesh in a second metal layer. . Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen may include a plurality of touches formed of a second metal mesh in a first metal layer or a second metal mesh in a second metal layer in an active area of the display. It may further include a plurality of routing traces of the touch screen coupled to the electrodes.

Some examples relate to touch screens. The touch screen includes a first substrate, a plurality of display pixels disposed on the first substrate, a first encapsulation layer formed over the plurality of display pixels, the plurality of display pixels being between the first encapsulation layer and the first substrate; A touch sensor panel comprising one or more first electrodes formed on one or more metal layers disposed on the first encapsulation layer, one or more second electrodes formed on one or more layers, and between the one or more first electrodes and the touch sensor panel. It may include a dielectric layer disposed on.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the one or more first electrodes of the touch screen may include a display-noise shield between the plurality of display pixels and the touch sensor panel. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the one or more metal layers on the first encapsulation layer can include a metal mesh layer that includes a metal mesh, and the display-noise shield comprises a plurality of display pixels It can extend across fields. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the display-noise shield can include indium tin oxide (ITO) deposited in the openings of the metal mesh in the metal mesh layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples the display-noise shield can include a conductive material deposited within the openings of the metal mesh within the metal mesh layer.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the one or more first electrodes of the touch screen may include a display-noise sensor between the plurality of display pixels and the touch sensor panel, wherein the first encapsulation The one or more metal layers on the layer can include a first metal layer, a second metal layer, and an interlevel dielectric layer between the first metal layer and the second metal layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, each of the one or more first electrodes of the display-noise sensor may correspond to a respective second electrode of the one or more second electrodes of the touch sensor panel. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen can further include a plurality of vias between the first metal layer and the second metal layer through the interlayer dielectric layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen further includes sensing circuitry coupled to the display-noise sensor and coupled to the touch sensor panel, the sensing circuitry comprising one or more first Noise may be removed from touch signal measurement values of one or more second electrodes based on the measurement values of the electrodes.

Additionally or alternatively to one or more of the examples disclosed above, in some examples the first encapsulation layer of the touch screen can include an inkjet printed layer of transparent material. Additionally or alternatively to one or more of the examples disclosed above, in some examples the inkjet printed layer can include a first inkjet printed layer and the dielectric layer can include a second inkjet printed layer. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first inkjet printed layer can be less than 25 microns thick, the second inkjet printed layer less than 25 microns thick, and one or more first inkjet printed layers can be less than 25 microns thick. The electrodes are less than 1 micrometer thick. Additionally or alternatively to one or more of the examples disclosed above, in some examples the one or more metal layers on the first encapsulation layer can each be less than 1 micron thick and the dielectric layer can be less than 10 microns thick. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the one or more layers of the touch sensor panel include a first metal layer, a second metal layer, and an interlayer dielectric layer between the first and second metal layers. wherein both the first metal layer and the second metal layer are indium tin oxide (ITO) layers.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch screen may further include a polarizing layer formed over the touch sensor panel, a cover layer, and an adhesive layer between the cover layer and the touch sensor panel. Additionally or alternatively to one or more of the examples disclosed above, in some examples the touch screen can further include one or more sensing circuits, each sensing circuit having a first input coupled to one or more first electrodes. , a second input coupled to one or more second electrodes, and a differential amplifier that produces an output proportional to the first input subtracted from the second input.

Some examples of the present disclosure relate to a touch sensor panel. The touch sensor panel may include a plurality of touch nodes including a first touch node. The first touch node includes a first differential sensing pair of touch electrodes including a first touch electrode formed of a plurality of first segments on a first layer and a second touch electrode formed of a plurality of segments of a second layer on the first layer; and a third touch electrode formed of a third plurality of segments having a first routing trace on the first layer and a fourth touch electrode formed of a fourth plurality of segments having a second routing trace on the first layer. It may correspond to the first differential driving pair of electrodes. the first routing trace may be disposed between the pair of the fourth plurality of segments and between the first pair of the second plurality of segments; The second routing trace may be disposed between the pair of the third plurality of segments and between the first pair of the first plurality of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the touch sensor panel may further include a plurality of bridges including a first bridge and a second bridge. A first bridge over the second routing trace can connect the first pair of the first plurality of segments and a second bridge over the first routing trace can connect the first pair of the second plurality of segments.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first routing trace and the second routing trace can be parallel and interleaved (e.g., aligned horizontally and alternatively vertically). there is). Additionally or alternatively to one or more of the examples disclosed above, in some examples, an area of the first plurality of segments for the first touch node is the same as an area of the second plurality of segments for the first touch node. Additionally or alternatively to one or more of the examples disclosed above, in some examples, an area of the third plurality of segments for the first touch node is the same as an area of the fourth plurality of segments for the first touch node. Additionally or alternatively to one or more of the examples disclosed above, in some examples, one segment of the pair of third plurality of segments is disposed on three sides of one segment of the first pair of first plurality of segments. and the other of the third plurality of pairs of segments is disposed on the three sides of the other of the first pair of the first plurality of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples, one segment of the pair of the fourth plurality of segments is disposed on three sides of one segment of the first pair of the second plurality of segments. and the other of the fourth plurality of pairs of segments is disposed on the three sides of the other of the first pair of the second plurality of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples the first plurality of segments and the second plurality of segments are rectangular. Additionally or alternatively to one or more of the examples disclosed above, in some examples the third plurality of segments and the fourth plurality of segments are rectangular.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of touch nodes include a first differential sensing pair of touch electrodes including a first touch electrode and a second touch electrode; and a fifth touch electrode formed of a fifth plurality of segments having a third routing trace on the first layer and a sixth touch electrode formed of a sixth plurality of segments having a fourth routing trace on the first layer. and a second touch node (eg, horizontally adjacent to the first touch node) corresponding to the second differential driving pair of electrodes. Additionally or alternatively to one or more of the examples disclosed above, in some examples, in addition to or alternatively to one or more of the examples disclosed above, in some examples, the third routing trace is between a pair of the sixth plurality of segments and 2 may be disposed between a second pair of plurality of segments; A fourth routing trace may be disposed between the pair of the fifth plurality of segments and between the second pair of the first plurality of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of bridges include a third bridge and a fourth bridge. A third bridge over the fourth routing trace may connect the second pair of segments of the first plurality; A fourth bridge over the third routing trace may connect the second pair of the second plurality of segments.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of touch nodes include a fifth touch electrode formed of a fifth plurality of segments and a sixth plurality of segments in the first layer. a second differential sensing pair of touch electrodes including a sixth touch electrode formed of; and a third touch electrode formed of a third plurality of segments having a third routing trace on the first layer and a fourth touch electrode formed of a fourth plurality of segments having a fourth routing trace on the first layer. and a second touch node corresponding to the first differential driving pair of electrodes (eg, vertically adjacent to the first touch node). Additionally or alternatively to one or more of the examples disclosed above, in some examples, the third routing trace can be disposed between the pair of the sixth plurality of segments and between the second pair of the fourth plurality of segments; A fourth routing trace may be disposed between the pair of the fifth plurality of segments and between the second pair of the third plurality of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of bridges include a third bridge and a fourth bridge. a third bridge over the fourth routing trace may connect the pair of segments of the fifth plurality; A fourth bridge over the third routing trace may connect the pair of the sixth plurality of segments.

Some examples of the present disclosure relate to a touch sensor panel. The touch sensor panel may include a plurality of touch nodes including a first touch node. The first touch node includes a differential sensing pair of touch electrodes including a first touch electrode formed of a first plurality of segments on the first layer and a second touch electrode formed of a second plurality of segments on the first layer; and a third touch electrode formed of a third plurality of segments having a first routing trace on the first layer and a fourth touch electrode formed of a fourth plurality of segments having a second routing trace on the first layer. It may correspond to a differential driving pair of electrodes. A pair of first plurality of segments may be connected by a first bridge in a second layer, a pair of second plurality of segments may be connected by a second bridge in a second layer, and a pair of third plurality of segments may be connected by a second bridge in a second layer. may be connected by a third bridge in the second layer, and a pair of fourth plurality of segments may be connected by a fourth bridge in the second layer or by a routing trace in the first layer.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first touch electrode and the second touch electrode are interleaved within the first touch node, and the third touch electrode and the fourth touch electrode are interleaved within the first touch node. are interleaved. Additionally or alternatively to one or more of the examples disclosed above, in some examples, an area of the first plurality of segments for the first touch node is the same as an area of the second plurality of segments for the first touch node. Additionally or alternatively to one or more of the examples disclosed above, in some examples, an area of the third plurality of segments for the first touch node is the same as an area of the fourth plurality of segments for the first touch node. Additionally or alternatively to one or more of the examples disclosed above, in some examples one segment of the third plurality of pairs of segments is disposed on three sides of one of the first plurality of pairs of segments; Another one of the third plurality of pairs of segments is disposed on three sides of the other of the first plurality of pairs of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples one segment of the pair of fourth plurality of segments is disposed on three sides of one segment of the pair of second plurality of segments; Another one of the fourth plurality of pairs of segments is disposed on three sides of the other of the second plurality of pairs of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples the first plurality of segments and the second plurality of segments are rectangular. Additionally or alternatively to one or more of the examples disclosed above, in some examples the third plurality of segments and the fourth plurality of segments are rectangular. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first plurality of segments comprises a first extension and a second extension, and the second plurality of segments comprises a third extension and a fourth extension. include Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first bridge connects the first extension to the second extension and the second bridge connects the third extension to the fourth extension. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the third touch electrode is disposed between the first touch electrode and the fourth touch electrode and the fourth touch electrode is disposed between the second touch electrode and the third touch electrode. is placed on Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first touch node may be configured to measure a mutual capacitance between the first touch electrode and the third touch electrode and a mutual capacitance between the second touch electrode and the fourth touch electrode. detected to measure the sum.

Some examples of the present disclosure relate to a touch sensor panel. The touch sensor panel may include a plurality of touch nodes including a first touch node and a second touch node. The first touch node may correspond to a first touch electrode including a plurality of first segments on the first layer and a second touch electrode including a plurality of second segments and a first routing trace on the first layer. The second touch node may correspond to a third touch electrode including a plurality of third segments on the first layer and a fourth touch electrode including a plurality of fourth segments and a second routing trace on the first layer. The first routing trace may be disposed between the pair of the fourth plurality of segments and may separate the pair of the third plurality of segments. A second routing trace can be disposed between the pair of the second plurality of segments and can separate between the pair of the first plurality of segments.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first bridge over the second routing trace connects the pair of first plurality of segments, and the second bridge over the first routing trace connects the pair of segments to the third. Connect a plurality of pairs of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the second touch electrode and the fourth touch electrodes are a differential driving pair of touch electrodes, and the first touch electrode and the third touch electrode are non-differential (eg , single-ended sensing). Additionally or alternatively to one or more of the examples disclosed above, in some examples the second touch electrode and the fourth touch electrode are interleaved and the first touch electrode and the third touch electrode are not interleaved. Additionally or alternatively to one or more of the examples disclosed above, in some examples, an area of the first plurality of segments for the first touch node is the same as an area of the third plurality of segments for the second touch node. Additionally or alternatively to one or more of the examples disclosed above, in some examples, an area of the second plurality of segments for the first touch node is the same as an area of the fourth plurality of segments for the second touch node. Additionally or alternatively to one or more of the examples disclosed above, in some examples, one segment of the fourth plurality of pairs of segments is disposed on three sides of one segment of the first plurality of pairs of segments; Another one of the fourth plurality of pairs of segments is disposed on three sides of the other of the first plurality of pairs of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples one segment of the pair of second plurality of segments is disposed on three sides of one segment of the pair of third plurality of segments; The other of the second plurality of pairs of segments is disposed on the three sides of the other of the third plurality of pairs of segments. Additionally or alternatively to one or more of the examples disclosed above, in some examples the first plurality of segments and the third plurality of segments are rectangular. Additionally or alternatively to one or more of the examples disclosed above, in some examples the second plurality of segments and the fourth plurality of segments are rectangular.

Some examples of this disclosure relate to touch screens. The touch screen may include a plurality of display data lines along a first axis, a plurality of differential drive pairs of touch electrodes along a first axis, and a plurality of sensing touch electrodes along a second axis different from the first axis. Each differential drive pair (or, in some examples, each differential drive pair) includes a first touch electrode formed of a first plurality of segments in a first layer and a second touch formed of a second plurality of segments in a first layer. contains electrodes. The first plurality of segments and the second plurality of segments are interleaved along a first axis. The plurality of sensing touch electrodes include a third touch electrode formed of a plurality of third segments on the first layer and a fourth touch electrode formed of a plurality of fourth segments on the first layer. The first touch node may include a plurality of first plurality of segments interleaved with a plurality of second plurality of segments; and a plurality of third plurality of segments interleaved along the first axis with a plurality of fourth plurality of segments.

Additionally or alternatively to one or more of the examples disclosed above, in some examples, each portion of a plurality of segments of the first plurality for the first touch node is a portion of each of a plurality of segments of the third plurality for the first touch node disposed around a portion of; A portion of each of a plurality of segments for the first touch node is disposed around a portion of each of a plurality of segments for the first touch node. Additionally or alternatively to one or more of the examples disclosed above, in some examples the first axis and the second axis are orthogonal. Additionally or alternatively to one or more of the examples disclosed above, in some examples, a first segment of the third plurality and a first one of the fourth plurality of segments closest to the first segment of the third plurality The pitch of the segments is less than 1/4 of the pitch of the first touch node. Additionally or alternatively to one or more of the examples disclosed above, in some examples the third plurality is interconnected in a border area outside or at an edge of the active area of the touch screen. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the plurality of sensing electrodes are coupled to the sensing circuitry in a sensed single-ended configuration. Additionally or alternatively to one or more of the examples disclosed above, in some examples, a first plurality of segments are interconnected in an active area of the touch screen and a second plurality of segments are interconnected in an active area of the touch screen. Additionally or alternatively to one or more of the examples disclosed above, in some examples, the first touch node comprises at least one pair of first plurality of segments interleaved with a pair of second plurality of segments, and a fourth plurality of pair of segments. and at least one pair of the third plurality of segments interleaved with

Some examples of the present disclosure relate to an electronic device that includes an energy storage device, communication circuitry, and a touch screen as described by some of the examples presented above. Although examples of the present disclosure have been fully described with reference to the accompanying drawings, it will be noted that various changes and modifications will become apparent to those skilled in the art. Such changes and modifications are to be understood as being included within the scope of examples of the present disclosure as defined by the appended claims.

Claims (25)

As a touch screen,
a display having an active area;
a first metal layer and a second metal layer disposed over the display; and
an intermediate dielectric layer disposed between the first metal layer and the second metal layer;
A plurality of touch electrodes of the touch screen are formed in an active area of the display, the plurality of touch electrodes are formed of a first metal mesh in the first metal layer and a first metal mesh in the second metal layer. Including, touch screen. The touch screen of claim 1 , wherein the first metal mesh of the first metal layer is aligned with the first metal mesh of the second metal layer. The touch screen according to claim 1 , wherein a width of the first metal mesh of the second metal layer is smaller than a width of the first metal mesh of the first metal layer. According to claim 1,
further comprising a plurality of routing traces formed within an active area of the display and coupled to the plurality of touch electrodes, the plurality of routing traces to a second metal mesh in the second metal layer and to the first metal layer; A touch screen comprising a routing trace formed of a second metal mesh in a layer. 5. The touch screen of claim 4, wherein the second metal mesh of the first metal layer is aligned with the second metal mesh of the second metal layer. The touch screen according to claim 4 , wherein a width of the second metal mesh of the second metal layer is smaller than a width of the second metal mesh of the first metal layer. The touch screen of claim 1 , wherein the plurality of touch electrodes are formed using bridges in an active area of the display formed of the first mesh metal in the second layer. According to claim 1,
further comprising a plurality of routing traces formed in an active area of the display and coupled to the plurality of touch electrodes, the plurality of routing traces comprising a routing trace formed of a second metal mesh in the second metal layer. and wherein the routing trace is disposed under the touch electrode formed of the first metal mesh in the first metal layer. The touch screen of claim 8 , wherein the plurality of routings of the touch screen are formed with the second metal mesh in the second metal layer without a metal mesh in the first metal layer. The touch screen according to claim 1 , wherein each of the plurality of touch electrodes of the touch screen is formed of the first metal mesh in the first metal layer and the first metal mesh in the second metal layer. The method of claim 1 , wherein the touch electrode formed of the first metal mesh in the first metal layer and the first metal mesh in the second metal layer includes non-overlapping regions and overlapping regions, The touch screen of claim 1 , wherein the first metal mesh of the metal layer and the first metal mesh of the second metal layer are not parallel in the overlapping regions. The touch screen according to claim 11 , wherein the first metal mesh of the first metal layer and the first metal mesh of the second metal layer are orthogonal at overlapping regions of the touch electrode. The touch screen according to claim 12 , wherein an area of each of the overlapping regions of the touch electrode is uniform. According to claim 1,
and a transparent conductive material that fills gaps in the first metal mesh of the first metal layer and fills gaps in the second metal mesh of the first metal layer. According to claim 1,
and a transparent conductive material that fills gaps in the first metal mesh of the first metal layer without filling gaps in the second metal mesh of the first metal layer. According to claim 14,
and a second intermediate dielectric layer disposed between the first transparent conductive material and the first metal layer and between the second transparent conductive material and the first metal layer. The touch screen of claim 1 , wherein the intermediate dielectric layer is greater than 0.5 microns thick. The touch screen of claim 1 , wherein the intermediate dielectric layer has a thickness of 1 to 2.5 micrometers. The touch screen of claim 1 , wherein the intermediate dielectric layer comprises an organic material. The touch screen of claim 1 , wherein the intermediate dielectric layer has a dielectric constant less than 5. As a touch screen,
a display having an active area;
a first metal layer and a second metal layer disposed over the display; and
an intermediate dielectric layer disposed between the first metal layer and the second metal layer;
A plurality of touch electrodes of the touch screen are formed of a first metal mesh in the first metal layer within an active area of the display, and the plurality of touch electrodes are formed of a first metal mesh in the first layer. a touch electrode including a segment and a second segment formed of the first metal mesh in the first layer, wherein the first segment and the second segment are formed by the first metal mesh in the second metal layer; interconnected by electrodes,
wherein a plurality of routing traces of the touch screen coupled to the plurality of touch electrodes are formed with a second metal mesh in the first metal layer and a second metal mesh in the second metal layer in an active area of the display. , touch screen. According to claim 21,
and a transparent conductive material that fills gaps in the first metal mesh of the first metal layer or fills gaps in the second metal mesh of the first metal layer. 22. The touch screen of claim 21, wherein the second metal mesh of the first metal layer is aligned with the second metal mesh of the second metal layer. 22. The touch screen of claim 21, wherein a width of the second metal mesh of the second metal layer is smaller than a width of the second metal mesh of the first metal layer. As an electronic device,
energy storage devices;
communication circuitry; and
It includes a touch screen, the touch screen,
a display having an active area;
a first metal layer and a second metal layer disposed over the display; and
an intermediate dielectric layer disposed between the first metal layer and the second metal layer;
A plurality of touch electrodes of the touch screen are formed in an active area of the display, the plurality of touch electrodes are formed of a first metal mesh in the first metal layer and a first metal mesh in the second metal layer. contains;
A plurality of routing traces of the touch screen coupled to the plurality of touch electrodes are formed with a second metal mesh in the first metal layer or a second metal mesh in the second metal layer in an active area of the display. , electronic devices.

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