KR20230025547A - Display device and method of manufacturing the same - Google Patents

Abstract

A display device may comprise: a substrate comprising a display area and a pad area positioned around the display area; a display part disposed in the display area on the substrate; a protective layer disposed on a lower part of the substrate, and defining a first opening part overlapping the pad area; a rigid support member that fills the first opening part of the protective layer, and comprising a glass; and a driving circuit chip disposed in the pad area on the substrate. The rigid support member may be formed prior to a bonding process of the driving circuit chip. Therefore, low-voltage bonding of the driving circuit chip is enabled, and bonding reliability can be improved.

Description

Display device and manufacturing method thereof {DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a display device and a manufacturing method thereof. More specifically, the present invention relates to a flexible display device and a manufacturing method thereof.

A flat panel display device is used as a display device replacing a cathode ray tube display device due to characteristics such as light weight and thin shape. Representative examples of such a flat panel display include a liquid crystal display and an organic light emitting display.

Meanwhile, by bending at least a portion of the display device, visibility at various angles may be improved or the area of the non-display area may be reduced. In the process of manufacturing such a display device at least partially bent, a method of minimizing defects and reducing process costs has been sought.

One object of the present invention is to provide a display device with improved reliability.

Another object of the present invention is to provide a manufacturing method of a display device with a reduced process cost.

However, the present invention is not limited by the above-described objects, and may be expanded in various ways without departing from the spirit and scope of the present invention.

In order to achieve one object of the present invention described above, a display device according to exemplary embodiments of the present invention includes a substrate including a display area and a pad area positioned around the display area, and a display area on the substrate. A display unit disposed under the substrate, a protective layer disposed below the substrate and defining a first opening overlapping the pad region, a rigid support member including glass and filling the first opening of the protective layer, and A driving circuit chip disposed in the pad area may be included.

In one embodiment, the thickness of the support member may be the same as the depth of the first opening of the protective layer.

In one embodiment, the thickness of the support member may be smaller than the depth of the first opening of the protective layer.

In one embodiment, the protective layer may include a photocurable resin.

In one embodiment, the protective layer may be attached to the lower portion of the substrate through an adhesive layer.

In one embodiment, the substrate may further include a bending area positioned between the display area and the pad area. The protective layer may further define a second opening overlapping the bending region.

In order to achieve one object of the present invention described above, a display device according to exemplary embodiments of the present invention includes a substrate including a display area and a pad area positioned around the display area, and a display area on the substrate. a display portion disposed on the substrate; a protective layer disposed under the substrate and defining a first opening overlapping the pad region; filling the first opening of the protective layer and having a depth smaller than a depth of the first opening of the protective layer; A rigid support member having a thickness and a driving circuit chip disposed in the pad area on the substrate may be included.

In order to achieve the above-described other object of the present invention, a method of manufacturing a display device according to exemplary embodiments of the present invention provides a display area and a pad area positioned around the display area, on a lower portion of a substrate. Forming a protective layer defining a first opening overlapping the pad region, forming a rigid support member filling the first opening of the protective layer, and placing a stage under the protective layer and the support member. and bonding a driving circuit chip to the pad region on the substrate.

In one embodiment, the support member may be formed by jetting liquid glass into the first opening of the protective layer.

In one embodiment, the first opening of the passivation layer may expose a lower surface of the substrate.

In one embodiment, the thickness of the support member may be the same as the depth of the first opening of the protective layer.

In one embodiment, the stage may have a flat upper surface.

In one embodiment, the thickness of the support member may be smaller than the depth of the first opening of the protective layer.

In one embodiment, the stage may include a protrusion protruding upward and having a shape corresponding to the first opening of the protective layer. The stage may be positioned below the protective layer and the support member so that the protrusion is inserted into the first opening of the protective layer.

In an embodiment, a sum of a thickness of the support member and a thickness of the protruding portion of the stage may be equal to a depth of the first opening of the protective layer.

In one embodiment, the driving circuit chip may be bonded on the substrate by an ultrasonic bonding method.

In one embodiment, the protective layer may be formed by an inkjet method.

In one embodiment, the protective layer may include a photocurable resin.

In one embodiment, the protective layer may be attached to the lower portion of the substrate through an adhesive layer.

In one embodiment, the substrate may further include a bending area positioned between the display area and the pad area. The protective layer may further define a second opening overlapping the bending region.

A display device according to embodiments of the present invention includes a display panel, a protective layer disposed under the display panel and defining an opening overlapping a pad area (or bonding area), and a rigid support member filling the opening. can do. The support member may be formed prior to a bonding process of a driving circuit chip bonded to the pad area on the display panel. Accordingly, low-pressure bonding using a relatively low pressure may be possible. Accordingly, reliability of the display device may be improved.

In addition, as the support member covers the lower surface of the display panel exposed through the opening, the occurrence of defects due to inflow of foreign substances into the display panel may be prevented or reduced. Accordingly, reliability of the display device may be improved.

In addition, when the driving circuit chip is bonded using an ultrasonic bonding method, ultrasonic energy is sufficiently transmitted by the rigid support member so that the driving circuit chip can be effectively bonded. Accordingly, reliability of the display device may be improved. In addition, the ultrasonic bonding process may be performed using a stage having a flat upper surface. Thus, the manufacturing process of the display device can be simplified and process costs can be reduced.

However, the effects of the present invention are not limited to the above-described effects, and may be variously extended within a range that does not deviate from the spirit and scope of the present invention.

1 and 2 are plan views illustrating a display device according to an exemplary embodiment of the present invention.
FIG. 3 is a bottom view of the display device of FIG. 1 .
4 is a cross-sectional view taken along line II′ of FIG. 1 .
5 is a cross-sectional view taken along line II-II' of FIG. 1 .
6 is a cross-sectional view taken along line III-III' of FIG. 1 .
7 is a cross-sectional view illustrating a bent state of the display device of FIG. 6 .
8 to 12 are cross-sectional views illustrating an example of a method of manufacturing the display device of FIG. 1 .
13 is a cross-sectional view illustrating a display device according to another exemplary embodiment of the present invention.
14 to 17 are cross-sectional views illustrating an example of a method of manufacturing the display device of FIG. 13 .
18 is a cross-sectional view illustrating a display device according to another exemplary embodiment of the present invention.
19 is a cross-sectional view illustrating a display device according to another exemplary embodiment of the present invention.
FIG. 20 is a block diagram illustrating an electronic device including the display device of FIG. 1 .

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same or similar reference numerals are used for like elements in the accompanying drawings.

1 and 2 are plan views illustrating a display device 10 according to an exemplary embodiment of the present invention. FIG. 3 is a bottom view of the display device 10 of FIG. 1 . 4 is a cross-sectional view taken along line II' of FIG. 1 . 5 is a cross-sectional view taken along line II-II' of FIG. 1 . 6 is a cross-sectional view taken along line III-III' of FIG. 1 . FIG. 7 is a cross-sectional view illustrating a bent state of the display device 10 of FIG. 6 .

1 to 7 , a display device 10 according to an exemplary embodiment of the present invention includes a display panel 100, a driving circuit chip 210, a circuit board 220, a protective layer 300, and a support member. (400).

The display panel 100 may include a substrate 110 , a display unit 120 , an encapsulation layer 130 , a first pad unit 140 and a second pad unit 150 .

The substrate 110 may be a flexible and insulating substrate. For example, the substrate 110 may be a transparent resin substrate. As a specific example, the substrate 110 may be a polyimide (PI) substrate. In this case, the substrate 110 may have a structure in which one or more polyimide layers and one or more barrier layers are alternately stacked.

The substrate 110 (or the display panel 100) may include a display area DA and a non-display area NDA. A display unit 120 including a plurality of pixels for generating an image may be disposed in the display area DA on the substrate 110 . The image may be generated by combining light emitted from each of the pixels. The non-display area NDA may be located around the display area DA. For example, the non-display area NDA may surround the display area DA on a plane.

The non-display area NDA may include a first pad area PA1 and a second pad area PA2 positioned around the display area DA. For example, the first pad area PA1 may be spaced apart from the display area DA in the first direction D1. The second pad area PA2 may be spaced apart from the first pad area PA1 in the first direction D1.

In one embodiment, the substrate 110 (or the display panel 100) may include a first area 1A, a second area 2A, and a bending area BA. The second area 2A may be spaced apart from the first area 1A in the first direction D1. The bending area BA may be positioned between the first area 1A and the second area 2A. The bending area BA of the substrate 110 may be bent about a bending axis extending in a second direction D2 perpendicular to the first direction D1. For example, as shown in FIG. 7 , the bending area BA of the substrate 110 may be bent such that the second area 2A is located below the first area 1A.

For example, as shown in FIG. 1 , the first area 1A includes a display area DA and a part of the non-display area NDA, and the bending area BA is the portion of the non-display area NDA. In addition, the second area 2A may include the first pad area PA1 , the second pad area PA2 , and another part of the non-display area NDA. That is, the bending area BA may be positioned between the display area DA and the first pad area PA1. However, this is exemplary and the present invention is not limited thereto.

In one embodiment, as shown in FIG. 1 , the first area 1A, the bending area BA, and the second area 2A may have substantially the same width in the second direction D2. That is, the substrate 110 may have a rectangular shape as a whole on a plane.

In another embodiment, as shown in FIG. 2 , the width of each of the bending area BA and the second area 2A in the second direction D2 is the second direction D2 of the first area 1A. ) may be less than the width of For example, the width of the substrate 110 in the second direction D2 may be narrowed in a portion of the first area 1A adjacent to the bending area BA. For example, the width of the bending area BA in the second direction D2 and the width of the second area 2A in the second direction D2 may be substantially the same.

The display unit 120 may be disposed in the display area DA on the substrate 110 . The display unit 120 may include the pixels. For example, the pixels may be arranged in a matrix form along the first direction D1 and the second direction D2. Each of the pixels may include at least one thin film transistor TR and a light emitting element LED.

An active layer AL may be disposed on the substrate 110 . The active layer AL may include an oxide semiconductor, a silicon semiconductor, or an organic semiconductor. For example, the oxide semiconductor may be indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium It may include at least one oxide of (Cr), titanium (Ti), and zinc (Zn), but the present invention is not limited thereto. The silicon semiconductor may include amorphous silicon, polycrystalline silicon, and the like. The active layer AL may include a source region, a drain region, and a channel region positioned between the source region and the drain region.

In one embodiment, although not shown in the drawings, a buffer layer may be disposed between the substrate 110 and the active layer AL. The buffer layer may prevent diffusion of impurities from the substrate 110 into the active layer AL. The buffer layer may include an inorganic insulating material such as a silicon compound or a metal oxide. Examples of inorganic insulating materials that may be used for the buffer layer include silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), silicon oxycarbide (SiOC), silicon carbonitride (SiCN), aluminum oxide ( AlO), aluminum nitride (AlN), tantalum oxide (TaO), hafnium oxide (HfO), zirconium oxide (ZrO), titanium oxide (TiO), but the present invention is not limited thereto. These may be used alone or in combination with each other. The buffer layer may have a single-layer structure or a multi-layer structure including a plurality of insulating layers. For example, the buffer layer may be entirely disposed in the display area DA and the non-display area NDA.

A first insulating layer 111 may be disposed on the active layer AL. The first insulating layer 111 may cover the active layer AL on the substrate 110 . The first insulating layer 111 may include an inorganic insulating material. For example, the first insulating layer 111 may be entirely disposed in the display area DA and the non-display area NDA.

A gate electrode GE may be disposed on the first insulating layer 111 . The gate electrode GE may overlap the channel region of the active layer AL. The gate electrode GE may include a conductive material such as metal, alloy, conductive metal nitride, conductive metal oxide, or transparent conductive material. Examples of the conductive material that can be used for the gate electrode GE include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), and palladium (Pd). ), Magnesium (Mg), Calcium (Ca), Lithium (Li), Chromium (Cr), Tantalum (Ta), Tungsten (W), Copper (Cu), Molybdenum (Mo), Scandium (Sc), Neodymium (Nd), iridium (Ir), alloys containing aluminum, alloys containing silver, alloys containing copper, alloys containing copper, alloys containing molybdenum, aluminum nitride (AlN), tungsten nitride (WN), titanium nitride ( TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide ( GaO), indium zinc oxide (IZO), etc., but the present invention is not limited thereto. These may be used alone or in combination with each other. The gate electrode GE may have a single-layer structure or a multi-layer structure including a plurality of conductive layers.

A second insulating layer 112 may be disposed on the gate electrode GE. The second insulating layer 112 may cover the gate electrode GE on the first insulating layer 111 . The second insulating layer 112 may include an inorganic insulating material. For example, the second insulating layer 112 may be entirely disposed in the display area DA and the non-display area NDA.

A source electrode SE and a drain electrode DE may be disposed on the second insulating layer 112 . The source electrode SE and the drain electrode DE may be connected to the source and drain regions of the active layer AL, respectively. Each of the source electrode SE and the drain electrode DE may include a conductive material. The active layer AL, the gate electrode GE, the source electrode SE, and the drain electrode DE may form the thin film transistor TR.

A third insulating layer 113 may be disposed on the source electrode SE and the drain electrode DE. The third insulating layer 113 may include an organic insulating material. Examples of organic insulating materials that can be used for the third insulating layer 113 include photoresist, polyacryl-based resin, polyimide-based resin, and polyamide-based resin. (polyamide-based resin), siloxane-based resin, acrylic-based resin, epoxy-based resin, and the like, but the present invention is not limited thereto. These may be used alone or in combination with each other. In one embodiment, the third insulating layer 113 may have a multilayer structure including one or more organic insulating layers and one or more inorganic insulating layers.

An anode electrode AE may be disposed on the third insulating layer 113 . The anode electrode AE may include a conductive material. The anode electrode AE may be connected to the drain electrode DE through a contact hole formed in the third insulating layer 113 . Accordingly, the anode electrode AE may be electrically connected to the thin film transistor TR.

A fourth insulating layer 114 may be disposed on the anode electrode AE. The fourth insulating layer 114 may define a pixel opening that covers a peripheral portion of the anode electrode AE and exposes a central portion of the anode electrode AE. The fourth insulating layer 114 may include an organic insulating material.

An emission layer EL may be disposed on the anode electrode AE. The light emitting layer EL may be disposed in the pixel opening of the fourth insulating layer 114 . The light emitting layer EL may include at least one of an organic light emitting material and quantum dots.

In one embodiment, the organic light emitting material may include a low molecular organic compound or a high molecular organic compound. Examples of the low molecular weight organic compound may include copper phthalocyanine, diphenylbenzidine, tris-(8-hydroxyquinoline)aluminum, and the like. there is. Examples of the polymeric organic compound include poly(3,4-ethylenedioxythiophene), polyaniline, poly-phenylenevinylene, and polyfluorene. The invention is not limited thereto, and they may be used alone or in combination with each other.

In one embodiment, the quantum dot may include a core including a group II-VI compound, a group III-V compound, a group IV-VI compound, a group IV element, a group IV compound, and combinations thereof. In one embodiment, the quantum dot may have a core-shell structure including the core and a shell surrounding the core. The shell may serve as a protective layer for maintaining semiconductor properties by preventing chemical deterioration of the core and as a charging layer for imparting electrophoretic properties to the quantum dots.

A cathode electrode CE may be disposed on the light emitting layer EL. The cathode electrode CE may also be disposed on the fourth insulating layer 114 . The cathode electrode CE may include a conductive material. The anode electrode AE, the light emitting layer EL, and the cathode electrode CE may form the light emitting element LED.

The encapsulation layer 130 may be disposed on the cathode electrode CE. The encapsulation layer 130 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the encapsulation layer 130 includes a first inorganic encapsulation layer 131 disposed on the cathode electrode CE, an organic encapsulation layer 132 disposed on the first inorganic encapsulation layer 131, and an organic A second inorganic encapsulation layer 133 disposed on the encapsulation layer 132 may be included.

The first pad part 140 may be disposed in the first pad area PA1 on the substrate 110 . The second pad part 150 may be disposed in the second pad area PA2 on the substrate 110 . Each of the first pad part 140 and the second pad part 150 may include a plurality of pad electrodes arranged in the second direction D2 . The pad electrodes may be electrically connected to the pixels of the display unit 120 through a plurality of wires (not shown). For example, the pad electrodes may be disposed on the same layer as the source electrode SE and the drain electrode DE. However, the present invention is not limited thereto, and the pad electrodes may be disposed on the same layer as other conductive layers such as the gate electrode GE and the anode electrode AE. Also, the pad electrodes may have a multilayer structure including a plurality of conductive layers.

The driving circuit chip 210 may be disposed in the first pad area PA1 on the display panel 100 . That is, the driving circuit chip 210 may be disposed in the second area 2A of the display panel 100 . For example, the driving circuit chip 210 may be directly mounted on the display panel 100 in a chip on plastic (COP) method. The driving circuit chip 210 may be electrically connected to the first pad part 140 .

The circuit board 220 may be disposed on the second pad area PA2 on the display panel 100 . That is, the circuit board 220 may be spaced apart from the driving circuit chip 210 in the first direction D1 and disposed in the second area 2A on the display panel 100 . The circuit board 220 may be electrically connected to the second pad part 150 .

In one embodiment, the circuit board 220 may be a flexible printed circuit board (FPCB). A printed circuit board (PCB) (not shown) may be attached to a second end opposite to the first end of the circuit board 220 attached to the display panel 100 .

The driving circuit chip 210 , the circuit board 220 , and the printed circuit board may provide driving signals to the display panel 100 . The driving signal may refer to various signals for driving the display panel 100 , such as a driving voltage, a gate signal, and a data signal.

The protective layer 300 may be disposed under the display panel 100 to protect the display panel 100 from external impact. The protective layer 300 may define a first opening OP1 and a second opening OP2.

The first opening OP1 may overlap the first pad area PA1. For example, the protective layer 300 may expose the first pad area PA1 on the lower surface of the substrate 110 .

The second opening OP2 overlaps the bending area BA and may extend in the second direction D2. The protective layer 300 may include a first part and a second part spaced apart from each other by the second opening OP2 . The first portion of the protective layer 300 may overlap the first region 1A. The second portion of the protective layer 300 may overlap the second region 2A and may be spaced apart from the first portion in the first direction D1. The second portion of the protective layer 300 may define the first opening OP1 and may surround the first opening OP1 on a plane (see FIG. 3 ).

In one embodiment, the upper surface of the protective layer 300 may directly contact the lower surface of the substrate 110 . For example, the protective layer 300 may be formed by an inkjet method.

In one embodiment, the protective layer 300 may include a photocurable resin. Examples of photocurable resins that can be used for the protective layer 300 include epoxy acrylate resin, polyester acrylate resin, urethane acrylate resin, and polyether Acrylate resin (polyether acrylate resin), silicone acrylate resin (silicon acrylate resin), alkyl acrylate resin (alkyl acrylate resin), but the present invention is not limited thereto. These may be used alone or in combination with each other. In another embodiment, the protective layer 300 may include a thermosetting resin.

The support member 400 may be disposed within the first opening OP1 of the protective layer 300 . The support member 400 may fill the first opening OP1 of the protective layer 300 . That is, the support member 400 may cover the first pad area PA1 on the bottom surface of the substrate 110 exposed by the first opening OP1 . Accordingly, the support member 400 can prevent or reduce the occurrence of defects due to the inflow of foreign substances through the lower surface of the substrate 110 exposed by the first opening OP1 .

The support member 400 may include a hard material and have rigidity. In one embodiment, the support member 400 may include glass. Specifically, the support member 400 may include silica glass. However, the present invention is not limited thereto, and the support member 400 may include other hard materials such as metal and alloy.

As will be described later, the rigid support member 400 may be formed before the bonding process of the driving circuit chip 210 . Therefore, during the bonding process of the driver circuit chip 210 , the rigid support member 400 supports the first pad area PA1 of the display panel 100 , so low-pressure bonding may be possible. In addition, when the driving circuit chip 210 is bonded by the ultrasonic bonding method, ultrasonic energy can be sufficiently transmitted by the rigid support member 400, and a stage having a flat upper surface (eg, the stage 500 of FIG. 11) ) can be used to perform an ultrasonic bonding process.

In one embodiment, the thickness of the support member 400 may be substantially the same as the depth of the first opening OP1 of the protective layer 300 . That is, the support member 400 may entirely fill the first opening OP1 of the protective layer 300 . The thickness of the support member 400 may be substantially the same as that of the protective layer 300 . For example, the support member 400 may be formed by jetting a liquid hard material (eg, liquid glass) into the first opening OP1 of the protective layer 300 using an inkjet method and curing the liquid material. there is.

8 to 12 are cross-sectional views illustrating an example of a method of manufacturing the display device 10 of FIG. 1 .

Referring to FIG. 8 , a protective layer is provided under the display panel 100 including the substrate 110, the display unit 120, the encapsulation layer 130, the first pad unit 140 and the second pad unit 150. (300) can be formed.

In one embodiment, the protective layer 300 may be formed on the lower surface of the substrate 110 by an inkjet method. For example, the protective layer 300 may be formed by an inkjet method in a state where the display panel 100 is turned over so that the bottom surface of the substrate 110 faces upward, but will be described below with reference to FIG. 8 .

An ink composition including a photocurable resin may be provided on the lower surface of the substrate 110 . The ink composition may be selectively applied to areas other than the bending area BA and the first pad area PA1. Subsequently, the ink composition may be cured by irradiating light (eg, UV) to the ink composition. Accordingly, the protective layer 300 defining the first opening OP1 overlapping the first pad area PA1 and the second opening OP2 overlapping the bending area BA may be formed. An upper surface of the protective layer 300 may directly contact the lower surface of the substrate 110 .

Referring to FIG. 9 , a rigid support member 400 may be formed in the first opening OP1 of the protective layer 300 .

In one embodiment, the support member 400 may be formed in the first opening OP1 of the protective layer 300 by an inkjet method. For example, the support member 400 may be formed by an inkjet method in a state where the display panel 100 and the protective layer 300 are turned over so that the bottom surface of the protective layer 300 faces upward. based on is explained.

An ink composition including a liquid hard material may be provided in the first opening OP1 of the protective layer 300 . For example, the ink composition may include liquid glass or liquid metal paste.

In one embodiment, the ink composition may be provided in the first opening OP1 of the protective layer 300 to entirely fill the first opening OP1 . That is, the thickness of the ink composition provided in the first opening OP1 may be substantially the same as the depth of the first opening OP1. Subsequently, the hard support member 400 may be formed by curing the ink composition. The thickness of the support member 400 may be substantially the same as the depth of the first opening OP1 . That is, the bottom surface of the protective layer 300 and the bottom surface of the support member 400 may be positioned on substantially the same plane.

In one embodiment, the support member 400 may include glass. Specifically, the support member 400 may include silica glass. However, the present invention is not limited thereto, and the support member 400 may include other hard materials such as metal and alloy.

Referring to FIG. 10 , the driving circuit chip 210 may be bonded to the first pad area PA1 on the display panel 100 .

First, the rigid stage 500 may be positioned below the protective layer 300 and the support member 400 . In one embodiment, the stage 500 may have a flat top surface.

Next, the driving circuit chip 210 is placed on the first pad part 140, and pressure (or pressure and heat) is applied to the upper surface of the driving circuit chip 210 through a compression head (not shown) to form a driving circuit. The chip 210 may be bonded on the first pad area PA1 of the display panel 100 .

In one embodiment, the driving circuit chip 210 may be bonded to the first pad area PA1 of the display panel 100 by an ultrasonic bonding method. For example, the driving circuit chip 210 may be bonded by an ultrasonic bonding method having high bonding reliability according to a fine pitch of bump electrodes of the driving circuit chip 210 . In this case, when the protective layer 300 does not define the first opening OP1 (ie, when the protective layer 300 is disposed in the first pad area PA1 below the substrate 110), the protective layer A bonding defect may occur in which the pad electrodes of the first pad part 140 and the bump electrodes of the driving circuit chip 210 are not bonded to each other because 300 absorbs ultrasonic energy. However, according to embodiments of the present invention, the protective layer 300 defines the first opening OP1 overlapping the first pad area PA1, and the rigid support member 400 defines the first opening OP1. ) can be placed in Therefore, ultrasonic energy is sufficiently transmitted by the rigid support member 400 so that the pad electrodes of the first pad part 140 and the bump electrodes of the driving circuit chip 210 can be bonded. Accordingly, reliability of the display device 10 may be improved.

In addition, since the bonding process of the driving circuit chip 210 is performed in a state in which the rigid support member 400 fills the first opening OP1 of the protective layer 300, the stage 500 having a flat upper surface is used An ultrasonic bonding process may be performed. Therefore, a process of preparing a stage having a protrusion corresponding to the first opening OP1 of the protective layer 300 and aligning the stage so that the protrusion is inserted into the first opening OP1 may not be required. . Accordingly, a manufacturing process of the display device 10 may be simplified and process costs may be reduced.

In addition, since the bonding process of the driving circuit chip 210 is performed in a state in which the hard support member 400 supports the first pad area PA1 of the display panel 100, the protection layer 300 having a relatively low hardness ) may support the first pad area PA1 of the display panel 100, and low-pressure bonding may be possible using a relatively lower pressure than when the bonding process of the driving circuit chip 210 is performed. Accordingly, damage to the first pad area PA1 of the display panel 100 and components (eg, the wirings) positioned around the first pad area PA1 may be prevented or reduced from being damaged by the high voltage. Accordingly, reliability of the display device 10 may be improved.

In another embodiment, the driving circuit chip 210 may be bonded to the first pad area PA1 of the display panel 100 by an ACF bonding method using an anisotropic conductive film (ACF). Even in this case, the bonding process of the driving circuit chip 210 may be performed in a state in which the rigid support member 400 supports the first pad area PA1 of the display panel 100 . Thus, low-pressure bonding using a relatively low pressure may be possible.

Referring to FIG. 11 , a circuit board 220 may be bonded to the second pad area PA2 on the display panel 100 .

The first end of the circuit board 220 is placed on the second pad part 150, and pressure (or pressure and heat) is applied to the first end of the circuit board 220 through a compression head (not shown). may be applied to bond the circuit board 220 onto the second pad area PA2 of the display panel 100 .

In one embodiment, the circuit board 220 may be bonded to the second pad area PA2 of the display panel 100 using an ACF bonding method. For example, according to the relatively wide pitch of the bump electrodes of the circuit board 220, the circuit board 220 may be bonded using an ACF bonding method, which is a relatively easy process. In another embodiment, when the bump electrodes of the circuit board 220 have a fine pitch, the circuit board 220 may be bonded using an ultrasonic bonding method similar to the driving circuit chip 210 .

Referring to FIG. 12 , the display panel 100 may be bent. The bending area BA of the display panel 100 may be bent about the bending axis so that the second area 2A is located below the first area 1A. Accordingly, the second portion of the protective layer 300 and the support member 400 may face the first portion of the protective layer 300 .

According to embodiments of the present invention, the rigid support member 400 may be formed prior to a bonding process of the driving circuit chip 210 . That is, the bonding process of the driving circuit chip 210 may be performed in a state in which the support member 400 having a relatively higher hardness than the protective layer 300 supports the first pad area PA1 of the display panel 100 . can Accordingly, low-pressure bonding using a relatively low pressure may be possible. Accordingly, reliability of the display device 10 may be improved.

In addition, as the support member 400 covers the lower surface of the display panel 100 exposed by the first opening OP1 of the protective layer 300, foreign matter or the like flows into the display panel 100, resulting in defects. can be prevented or reduced. Accordingly, reliability of the display device 10 may be improved.

In addition, when the driving circuit chip 210 is bonded by the ultrasonic bonding method, ultrasonic energy is sufficiently transmitted by the rigid support member 400 so that the driving circuit chip 210 can be effectively bonded. Accordingly, reliability of the display device 10 may be improved. In addition, the ultrasonic bonding process may be performed using the stage 500 having a flat upper surface (ie, no protrusions are formed). Accordingly, a manufacturing process of the display device 10 may be simplified and process costs may be reduced.

13 is a cross-sectional view illustrating a display device 11 according to another exemplary embodiment of the present invention.

The display device 11 according to another embodiment described with reference to FIG. 13 is substantially similar to the display device 10 according to the embodiment described with reference to FIGS. 1 to 7 except for the configuration of the support member 401 . may be the same or similar to Therefore, redundant descriptions will be omitted or simplified.

Referring to FIG. 13 , a display device 11 according to another embodiment of the present invention includes a display panel 100, a driving circuit chip 210, a circuit board 220, a protective layer 300, and a support member 401. can include

The support member 401 may be disposed within the first opening OP1 of the protective layer 300 . The support member 401 may include a hard material and may have rigidity. In one embodiment, the support member 401 may include glass. Specifically, the support member 401 may include silica glass. However, the present invention is not limited thereto, and the supporting member 401 may include other hard materials such as metal and alloy.

In one embodiment, the thickness of the support member 401 may be smaller than the depth of the first opening OP1 of the protective layer 300 . That is, the support member 401 may fill only a portion of the first opening OP1 of the protective layer 300 . The thickness of the support member 401 may be smaller than the thickness of the protective layer 300 .

14 to 17 are cross-sectional views illustrating an example of a method of manufacturing the display device 11 of FIG. 13 .

Referring to FIG. 14 , a protective layer under the display panel 100 including the substrate 110 , the display unit 120 , the encapsulation layer 130 , the first pad unit 140 and the second pad unit 150 . (300) can be formed. The protective layer 300 may be formed by the same method as the method described with reference to FIG. 8 .

Subsequently, a rigid support member 401 may be formed in the first opening OP1 of the protective layer 300 .

In one embodiment, the support member 401 may be formed in the first opening OP1 of the protective layer 300 by an inkjet method. For example, the support member 401 may be formed by an inkjet method in a state where the display panel 100 and the protective layer 300 are turned over so that the bottom surface of the protective layer 300 faces upward. based on is explained.

An ink composition including a liquid hard material may be provided in the first opening OP1 of the protective layer 300 . For example, the ink composition may include liquid glass or liquid metal paste.

In one embodiment, the ink composition may be provided in the first opening OP1 of the protective layer 300 to fill only a portion of the first opening OP1 . That is, the thickness of the ink composition provided in the first opening OP1 may be smaller than the depth of the first opening OP1. Subsequently, the hard support member 401 may be formed by curing the ink composition. The thickness of the support member 401 may be smaller than the depth of the first opening OP1 . That is, the lower portion of the first opening OP1 may not be filled by the support member 401 .

In one embodiment, the support member 401 may include glass. Specifically, the support member 401 may include silica glass. However, the present invention is not limited thereto, and the supporting member 401 may include other hard materials such as metal and alloy.

Referring to FIG. 15 , the driving circuit chip 210 may be bonded to the first pad area PA1 on the display panel 100 .

First, a rigid stage 501 may be positioned under the protective layer 300 and the support member 401 .

In one embodiment, the stage 501 may include a body portion 501a and a protrusion portion 501b protruding upward from the body portion 501a. The protrusion 501b of the stage 501 may have a shape corresponding to the first opening OP1 of the protective layer 300 so as to be inserted into the first opening OP1 . The stage 501 may be positioned below the protective layer 300 and the support member 401 such that the protrusion 501b is inserted into the first opening OP1 of the protective layer 300 . An upper surface of the protruding portion 501b of the stage 501 may contact a lower surface of the support member 401 .

For example, the sum of the thickness of the support member 401 and the thickness of the protruding portion 501b of the stage 501 may be substantially equal to the depth of the first opening OP1 of the protective layer 300 . That is, when the protruding portion 501b of the stage 501 is inserted into the first opening OP1 of the protective layer 300 and the upper surface of the protruding portion 501b contacts the lower surface of the support member 401, the body portion ( The upper surface of 501a) may contact the lower surface of the protective layer 300 .

Next, the driving circuit chip 210 is placed on the first pad part 140, and pressure (or pressure and heat) is applied to the upper surface of the driving circuit chip 210 through a compression head (not shown) to form a driving circuit. The chip 210 may be bonded on the first pad area PA1 of the display panel 100 . In one embodiment, the driving circuit chip 210 may be bonded to the first pad area PA1 of the display panel 100 by an ultrasonic bonding method. In another embodiment, the driving circuit chip 210 may be bonded to the first pad area PA1 of the display panel 100 using an ACF bonding method.

Referring to FIG. 16 , a circuit board 220 may be bonded to the second pad area PA2 on the display panel 100 .

The first end of the circuit board 220 is placed on the second pad part 150, and pressure (or pressure and heat) is applied to the first end of the circuit board 220 through a compression head (not shown). may be applied to bond the circuit board 220 onto the second pad area PA2 of the display panel 100 .

Referring to FIG. 17 , the display panel 100 may be bent. The bending area BA of the display panel 100 may be bent about the bending axis so that the second area 2A is located below the first area 1A. Accordingly, the second portion of the protective layer 300 and the support member 401 may face the first portion of the protective layer 300 .

According to example embodiments, the rigid support member 401 may be formed to partially fill the first opening OP1 of the protective layer 300 . Accordingly, since the amount of hard material used to form the support member 401 is reduced, material costs may be reduced. In addition, a process margin for managing the thickness of the support member 401 can be secured.

Also, the rigid support member 401 may be formed before the bonding process of the driving circuit chip 210 . That is, the bonding process of the driving circuit chip 210 may be performed in a state in which the support member 401 having a relatively higher hardness than the protection layer 300 supports the first pad area PA1 of the display panel 100 . can Accordingly, low-pressure bonding using a relatively low pressure may be possible. Accordingly, reliability of the display device 11 can be improved.

In addition, as the support member 401 covers the lower surface of the display panel 100 exposed by the first opening OP1 of the protective layer 300, foreign matter or the like flows into the display panel 100, resulting in defects. can be prevented or reduced. Accordingly, reliability of the display device 11 can be improved.

In addition, when the driving circuit chip 210 is bonded by the ultrasonic bonding method, ultrasonic energy is sufficiently transmitted by the rigid support member 401 so that the driving circuit chip 210 can be effectively bonded. Accordingly, reliability of the display device 11 can be improved.

18 is a cross-sectional view illustrating a display device 12 according to another exemplary embodiment of the present invention.

The display device 12 according to another embodiment described with reference to FIG. 18 is similar to the display device 10 according to the embodiment described with reference to FIGS. 1 to 7 except for the configuration of the protective film PF. may be substantially the same or similar. Therefore, redundant descriptions will be omitted or simplified.

Referring to FIG. 18 , a display device 12 according to another embodiment of the present invention includes a display panel 100, a driving circuit chip 210, a circuit board 220, a protective film PF, and a support member 400. ) may be included.

The protective film PF may be attached to a lower portion of the display panel 100 to protect the display panel 100 from external impact. The protective film PF may include a protective layer 301 and an adhesive layer ADL.

In one embodiment, the protective layer 301 may include a polymer material having flexibility. Examples of polymer materials that can be used for the protective layer 301 include polyethylene terephthalate (PET), polyethylene naphthalene (PEN), polypropylene PP, polycarbonate (PC), Polystyrene (PS), polysulfone (PSul), polyethylene (PE), polyphthalamide (PPA), polyethersulfone (PES), polyarylate (PAR) ), polycarbonate oxide (PCO), modified polyphenylene oxide (MPPO), etc., but the present invention is not limited thereto. These may be used alone or in combination with each other.

The protective layer 301 may be attached to the lower portion of the substrate 110 by an adhesive layer ADL. That is, the protective layer 301 may be spaced apart from the substrate 110 with the adhesive layer ADL interposed therebetween. The upper surface of the adhesive layer ADL may contact the lower surface of the substrate 110 , and the lower surface of the adhesive layer ADL may contact the upper surface of the protective layer 301 . For example, the adhesive layer ADL may include pressure sensitive adhesive (PSA), optical clear adhesive (OCA), optical clear resin (OCR), and the like.

The protective film PF may define the first opening OP1 and the second opening OP2. For example, each of the protective layer 301 and the adhesive layer ADL may define a first opening OP1 and a second opening OP2 . That is, the protective layer 301 and the adhesive layer ADL may have substantially the same planar shape. For example, the protective layer 301 and the adhesive layer ADL may be cut and attached to the lower portion of the substrate 110 .

The support member 400 may be disposed within the first opening OP1 of the protective film PF. An upper surface of the support member 400 may contact a lower surface of the substrate 110 . An outer surface of the support member 400 may contact an inner surface of the adhesive layer ADL defining the first opening OP1 and an inner surface of the protective layer 301 .

In one embodiment, as shown in FIG. 18 , the thickness of the support member 400 may be substantially the same as the depth of the first opening OP1 of the protective film PF. That is, the support member 400 may entirely fill the first opening OP1 of the protective film PF. The thickness of the support member 400 may be substantially equal to the sum of the thickness of the protective layer 301 and the thickness of the adhesive layer ADL.

In another embodiment, although not shown in the drawing, the thickness of the support member 400 may be smaller than the depth of the first opening OP1 of the protective film PF. That is, the support member 400 may fill only a part of the first opening OP1 of the protective film PF. The thickness of the support member 400 may be smaller than the sum of the thickness of the protective layer 301 and the thickness of the adhesive layer ADL.

19 is a cross-sectional view illustrating a display device 13 according to another exemplary embodiment of the present invention.

A display device 13 according to another embodiment described with reference to FIG. 19 is shown in FIGS. It may be substantially the same as or similar to the display device 10 according to the exemplary embodiment described with reference to FIG. 7 . Therefore, redundant descriptions will be omitted or simplified.

Referring to FIG. 19 , a display device 13 according to another embodiment of the present invention includes a display panel 100, a driving circuit chip 210, a circuit board 220, a protective layer 302, and a first support member. 410 and a second support member 420 .

The protective layer 302 may define a first opening OP1 , a second opening OP2 , and a third opening OP3 . The first opening OP1 may overlap the first pad area PA1. The second opening OP2 may overlap the bending area BA. The third opening OP3 may overlap the second pad area PA2.

The first support member 410 may be disposed within the first opening OP1 of the protective layer 302 . The second support member 420 may be disposed within the third opening OP3 of the protective layer 302 .

Each of the first support member 410 and the second support member 420 may include a hard material and may have rigidity. In one embodiment, the first support member 410 and the second support member 420 may include the same material. For example, each of the first support member 410 and the second support member 420 may include glass. Specifically, each of the first support member 410 and the second support member 420 may include silica glass. However, the present invention is not limited thereto, and each of the first support member 410 and the second support member 420 may include other hard materials such as metal or alloy.

In one embodiment, the first support member 410 and the second support member 420 may be formed substantially simultaneously. For example, a liquid hard material (eg, liquid glass) is jetted into the first opening OP1 and the third opening OP3 by an inkjet method, and cured to form a first support member 410 ) and the second support member 420 may be formed substantially simultaneously. The first support member 410 and the second support member 420 may be formed before a bonding process between the driving circuit chip 210 and the circuit board 220 .

According to embodiments of the present invention, the bonding process of the driving circuit chip 210 is performed in a state in which the rigid first support member 410 supports the first pad area PA1 of the display panel 100. The bonding process of the circuit board 220 may be performed in a state in which the hard second support member 420 supports the second pad area PA2 of the display panel 100 . Accordingly, in the bonding process of the circuit board 220, low-pressure bonding using a relatively low pressure may be possible. In addition, the circuit board 220 may be bonded using an ultrasonic bonding method as well as an ACF bonding method.

FIG. 20 is a block diagram illustrating an electronic device including the display device of FIG. 1 .

Referring to FIG. 20 , in one embodiment, an electronic device 900 includes a processor 910, a memory device 920, a storage device 930, an input/output device 940, a power supply 950, and a display device. (FIG. 960). In this case, the display device 960 includes the display device 10 according to one embodiment described with reference to FIGS. 1 to 7 , the display device 11 according to another embodiment described with reference to FIGS. 13 to 17 , and FIG. It may correspond to either the display device 12 according to another embodiment described with reference to FIG. 18 or the display device 13 according to another embodiment described with reference to FIG. 19 . The electronic device 900 may further include several ports capable of communicating with a video card, a sound card, a memory card, a USB device, and the like. In one embodiment, the electronic device 900 may be implemented as a television. In another embodiment, the electronic device 900 may be implemented as a smart phone. However, the electronic device 900 is not limited thereto, and for example, the electronic device 900 includes a mobile phone, a video phone, a smart pad, a smart watch, a tablet PC, a vehicle navigation system, It may be implemented as a computer monitor, a laptop computer, a head mounted display (HMD), or the like.

Processor 910 may perform certain calculations or tasks. In one embodiment, the processor 910 may be a microprocessor, a central processing unit (CPU), an application processor (AP), or the like. The processor 910 may be connected to other components through an address bus, a control bus, a data bus, and the like. In one embodiment, the processor 910 may also be coupled to an expansion bus, such as a peripheral component interconnect (PCI) bus.

The memory device 920 may store data necessary for the operation of the electronic device 900 . For example, the memory device 920 may include an erasable programmable read-only memory (EPROM) device, an electrically erasable programmable read-only memory (EEPROM) device, a flash memory device, a PRAM ( phase change random access memory (PRAM) device, resistance random access memory (RRAM) device, nano floating gate memory (NFGM) device, polymer random access memory (PoRAM) device, magnetic random access memory (MRAM) device Non-volatile memory devices such as access memory (MRAM), ferroelectric random access memory (FRAM) devices, and/or dynamic random access memory (DRAM) devices, static random access memory (SRAM) devices, mobile A volatile memory device such as a DRAM device may be included.

The storage device 930 may include a solid state drive (SSD), a hard disk drive (HDD), a CD-ROM, and the like. The input/output device 940 may include an input means such as a keyboard, a keypad, a touch pad, a touch screen, and a mouse, and an output means such as a speaker and a printer.

The power supply 950 may supply power necessary for the operation of the electronic device 900 . Display device 960 may be connected to other components through buses or other communication links. In one embodiment, the display device 960 may be included in the input/output device 940 .

The present invention can be applied to various display devices. For example, the present invention can be applied to various display devices such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for display or information transmission, and medical display devices.

Although the above has been described with reference to exemplary embodiments of the present invention, those skilled in the art can make various modifications to the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. It will be understood that modifications and changes may be made.

10, 11, 12, 13: display device 100: display panel
110: substrate 120: display unit
130: encapsulation layer 140: first pad part
150: second pad part 210: driving circuit chip
220: circuit board 300, 301, 302: protective layer
PF: protective film ADL: adhesive layer
400, 401: support member 500, 501: stage

Claims (20)

a substrate including a display area and a pad area positioned around the display area;
a display unit disposed in the display area on the substrate;
a protective layer disposed under the substrate and defining a first opening overlapping the pad region;
a rigid support member filling the first opening of the protective layer and including glass; and
A display device comprising a driving circuit chip disposed in the pad area on the substrate. The display device of claim 1 , wherein a thickness of the support member is equal to a depth of the first opening of the passivation layer. The display device of claim 1 , wherein a thickness of the support member is smaller than a depth of the first opening of the passivation layer. The display device of claim 1 , wherein the passivation layer comprises a photocurable resin. The display device of claim 1 , wherein the passivation layer is attached to the lower portion of the substrate through an adhesive layer. The method of claim 1 , wherein the substrate further comprises a bending area positioned between the display area and the pad area,
The display device of claim 1 , wherein the protective layer further defines a second opening overlapping the bending area. a substrate including a display area and a pad area positioned around the display area;
a display unit disposed in the display area on the substrate;
a protective layer disposed under the substrate and defining a first opening overlapping the pad region;
a rigid support member filling the first opening of the protective layer and having a thickness smaller than a depth of the first opening of the protective layer; and
A display device comprising a driving circuit chip disposed in the pad area on the substrate. forming a protective layer defining a first opening overlapping the pad area under a substrate including a display area and a pad area positioned around the display area;
forming a rigid support member filling the first opening of the protective layer; and
and positioning a stage under the protective layer and the support member, and bonding a driving circuit chip to the pad area on the substrate. The method of claim 8 , wherein the support member is formed by jetting liquid glass into the first opening of the passivation layer. The method of claim 8 , wherein the first opening of the passivation layer exposes a lower surface of the substrate. The method of claim 8 , wherein a thickness of the support member is equal to a depth of the first opening of the passivation layer. The method of claim 11 , wherein the stage has a flat upper surface. The method of claim 8 , wherein a thickness of the support member is smaller than a depth of the first opening of the passivation layer. 14. The method of claim 13, wherein the stage includes a protruding portion protruding upward and having a shape corresponding to the first opening of the protective layer,
The method of manufacturing a display device according to claim 1 , wherein the stage is positioned below the protective layer and the support member so that the protrusion is inserted into the first opening of the protective layer. 15 . The method of claim 14 , wherein a sum of a thickness of the support member and a thickness of the protrusion of the stage is equal to a depth of the first opening of the protective layer. The method of claim 8 , wherein the driving circuit chip is bonded to the substrate using an ultrasonic bonding method. The method of claim 8 , wherein the passivation layer is formed by an inkjet method. The method of claim 17 , wherein the passivation layer comprises a photocurable resin. The method of claim 8 , wherein the protective layer is attached to the lower portion of the substrate through an adhesive layer. The method of claim 8 , wherein the substrate further comprises a bending area positioned between the display area and the pad area,
The manufacturing method of the display device of claim 1 , wherein the protective layer further defines a second opening overlapping the bending area.

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