KR20230023439A - Electronic device including camera - Google Patents

Abstract

An electronic device according to an embodiment disclosed in this document comprises: a first camera module including a plurality of image sensors; a regulator which supplies power to the first camera module; a processor which controls the regulator; a first resistor connected between an output terminal of the regulator and a status check pin of the regulator; a second resistor connected between the status check pin and the ground; and a third resistor connected between the status check pin and a first control pin which controls the regulator of the processor. The processor receives identification information corresponding to one of the image sensors from a storage element of the first camera module, and changes the state of the first control pin to correspond to the identification information. Corresponding to the state of the first control pin, a voltage value of the output terminal of the regulator may be changed. In addition, various embodiments identified through the specification are possible. The present invention is to operate a camera module with various driving voltages.

Description

Electronic device including a camera {ELECTRONIC DEVICE INCLUDING CAMERA}

Various embodiments disclosed in this document relate to an electronic device including a camera.

An electronic device such as a smart phone or a tablet PC may include a camera (or a camera module or an imaging device). The camera module may acquire image data through an image sensor. Image data obtained through the camera module may be stored in a memory inside the electronic device or output as a preview image through a display.

Recently, electronic devices including a plurality of image sensors having different characteristics are being released. A plurality of image sensors may be supplied with different powers (or voltage values).

The electronic device is a method of supplying power to a plurality of image sensors, using independent regulators (e.g., low dropout (LDO)) corresponding to the power of each sensor, or a power management module capable of changing the voltage value through software. (e.g. PMIC) can be used.

In the case of a method using independent regulators (eg, LDOs), a separate printed board assembly (PBA) is required, and synchronization of power outputs between the PBA and the image sensor is required.

In the case of using a power management module (eg, PMIC) capable of varying a voltage value in software, power can be supplied to a plurality of image sensors with the same PBA, but manufacturing cost and mounting space may increase.

Various embodiments may provide an electronic device including one regulator for operating the camera module at various driving voltages.

An electronic device according to various embodiments includes a first camera module including a plurality of image sensors, a regulator supplying power to the first camera module, a processor controlling the regulator, an output terminal of the regulator, and a state of the regulator. A first resistor connected between the check pin, a second resistor connected between the status check pin and ground, and a third resistor connected between the check pin and the first control pin controlling the regulator of the processor. wherein the processor receives identification information corresponding to one of the image sensors from a storage element of the first camera module, changes a state of the first control pin to correspond to the identification information, and Corresponding to the state of the control pin, the voltage value of the output terminal of the regulator may be changed.

An electronic device according to various embodiments disclosed in this document may operate a camera module with various driving voltages using one regulator. This makes it possible to provide power supply designs for multiple cameras from the same PBA at a low cost.

An electronic device according to various embodiments disclosed in this document may change an output voltage value of a regulator driving a camera module in response to identification information of an image sensor transmitted from a camera module to a processor.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
2 is a block diagram illustrating a camera module, in accordance with various embodiments.
3 illustrates an electronic device including a camera module according to various embodiments.
4 is a flowchart illustrating a camera driving method according to various embodiments.
5 illustrates an electronic device in which a protection circuit is connected to a regulator control pin according to various embodiments of the present disclosure.
6 illustrates an electronic device including a plurality of regulator control pins according to various embodiments.
7 illustrates a change in a feedback resistance value through switching according to various embodiments.
8 illustrates an electronic device including a plurality of camera modules operating with the same driving voltage according to various embodiments.
9 illustrates an electronic device including a plurality of camera modules operating at different voltage values according to various embodiments.
10 is a flowchart illustrating a method of driving a camera of an electronic device including a plurality of camera modules according to various embodiments.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.

Hereinafter, various embodiments of this document will be described with reference to the accompanying drawings. However, this is not intended to limit the technology described in this document to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of this document. . In connection with the description of the drawings, like reference numerals may be used for like elements.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram 200 illustrating a camera module 180, in accordance with various embodiments.

Referring to FIG. 2, the camera module 180 includes a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (eg, a buffer memory), or an image signal processor. (260). The lens assembly 210 may collect light emitted from a subject that is an image capturing target. The lens assembly 210 may include one or more lenses. According to one embodiment, the camera module 180 may include a plurality of lens assemblies 210 . In this case, the camera module 180 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 may have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly may have the same lens properties as other lens assemblies. may have one or more lens properties different from the lens properties of . The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 220 may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash 220 may include one or more light emitting diodes (eg, a red-green-blue (RGB) LED, a white LED, an infrared LED, or an ultraviolet LED), or a xenon lamp. The image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to one embodiment, the image sensor 230 is, for example, an image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, It may include a plurality of image sensors having a property, or a plurality of image sensors having other properties. Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 240 moves at least one lens or image sensor 230 included in the lens assembly 210 in a specific direction in response to movement of the camera module 180 or the electronic device 101 including the same. Operation characteristics of the image sensor 230 may be controlled (eg, read-out timing is adjusted, etc.). This makes it possible to compensate at least part of the negative effect of the movement on the image being taken. According to an embodiment, the image stabilizer 240 uses a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180 to control the camera module 180 or the electronic device 101 . ) can be detected. According to one embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer.

The memory 250 may at least temporarily store at least a portion of an image acquired through the image sensor 230 for a next image processing task. For example, when image acquisition is delayed according to the shutter, or a plurality of images are acquired at high speed, the acquired original image (eg, a bayer-patterned image or a high-resolution image) is stored in the memory 250 and , a copy image (eg, a low resolution image) corresponding thereto may be previewed through the display device 160 . Thereafter, when a specified condition is satisfied (eg, a user input or a system command), at least a part of the original image stored in the memory 250 may be obtained and processed by the image signal processor 260 , for example. According to one embodiment, the memory 250 may be configured as at least a part of the memory 130 or as a separate memory operated independently of the memory 130 .

The image signal processor 260 may perform one or more image processes on an image obtained through the image sensor 230 or an image stored in the memory 250 . The one or more image processes, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring, sharpening, or softening. Additionally or alternatively, the image signal processor 260 may include at least one of the components included in the camera module 180 (eg, an image sensor). 230) may be controlled (eg, exposure time control, read-out timing control, etc.) The image processed by the image signal processor 260 is stored again in the memory 250 for further processing. or may be provided as an external component of the camera module 180 (eg, the memory 130, the display device 160, the electronic device 102, the electronic device 104, or the server 108). According to an example, the image signal processor 260 may be configured as at least a part of the processor 120 or may be configured as a separate processor that operates independently of the processor 120. The image signal processor 260 may be configured as a processor 120 When configured as a separate processor, at least one image processed by the image signal processor 260 may be displayed through the display device 160 as it is or after additional image processing by the processor 120 .

According to an embodiment, the electronic device 101 may include a plurality of camera modules 180 each having different properties or functions. For example, a plurality of camera modules 180 including lenses (eg, the lens assembly 210) having different angles of view may be configured, and the electronic device 101 may be configured based on a user's selection. The angle of view of the camera module 180 performed in step 101 may be controlled to be changed. For example, at least one of the plurality of camera modules 180 may be a wide-angle camera and at least one other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 may be a front camera, and at least another one may be a rear camera. In addition, the plurality of camera modules 180 may include at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (eg, a time of flight (TOF) camera or a structured light camera). can include According to one embodiment, the IR camera may operate as at least a part of a sensor module (eg, the sensor module 176 of FIG. 1 ). For example, the TOF camera may operate as at least a part of a sensor module (eg, the sensor module 176 of FIG. 1 ) for detecting a distance to a subject.

3 illustrates an electronic device including a camera module according to various embodiments.

Referring to FIG. 3 , an electronic device 301 (eg, the electronic device 101 of FIG. 1 ) includes a processor 310, a camera module 320, a regulator 330, a first resistor R1, and a second resistor. (R2) and a third resistor (R3). FIG. 3 shows a configuration for driving the camera module 320, but is not limited thereto.

According to various embodiments, the processor 310 (eg, the processor 120 of FIG. 1 ) may perform various operations required to drive the electronic device 301 and control various internal components of the electronic device 301. there is. For example, the processor 310 may perform an operation necessary for controlling the camera module 320 or the regulator 330 . The processor 310 may transmit and receive various information to and from the camera module 320 or the regulator 330 .

According to various embodiments, the processor 310 may receive identification information about an image sensor that is being driven or is scheduled to be driven from the camera module 320 according to a specified condition (or event) such as booting. The identification information may be a unique name of an image sensor or a code value assigned to each image sensor.

The processor 310 may form a communication channel 311 with the storage element 321 of the camera module 320 . The communication channel 311 may transmit and receive signals through a designated communication method (eg, inter-integrated circuit (I2C), improved inter-integrated circuit (I3C), or serial peripheral interface (SPI)). The processor 310 receives identification information about an image sensor that is being driven or is scheduled to be driven from the camera module 320, and outputs a voltage value corresponding to the received identification information through the output terminal 335 of the regulator 330. can do.

According to various embodiments, the processor 310 may include a regulator control pin (PWR_SEL) 315 . The regulator control pin 315 may be connected to the state checking pin 333 of the regulator 330 through a third resistor 353 . The processor 310 may change the state of the regulator control pin 315 in response to identification information of the image sensor received from the camera module 320 .

For example, when the identification information of the image sensor received from the camera module 320 is a first code value, the processor 310 may set the regulator control pin 315 to a first state (eg, an open state). . Another example. When the identification information of the image sensor received from the camera module 320 is the second code value, the regulator control pin 315 may be set to a second state (eg, a ground state).

According to one embodiment, the regulator control pin 315 may support communication by GPIO (Gernel Purpose I/O).

According to various embodiments, the processor 310 may include a regulator enable pin (or camera module enable pin) (CAM_EN) 318 . Regulator enable pin 318 may be coupled to enable pin (EN) 332 of regulator 330 . For example, when the regulator enable pin 318 has a first value, the output terminal 335 of the regulator 330 may output one of designated voltage values. When the regulator enable pin 318 is at the second value, the output of the regulator 330 may be limited.

According to one embodiment, the regulator enable pin 318 may support communication by GPIO (Gernel Purpose I/O).

The camera module 320 (eg, the camera module 180 of FIG. 1 or 2) may acquire image data. For example, the camera module 320 may include a lens assembly (eg, the lens assembly 210 of FIG. 2 ), a flash (eg, the flash 220 of FIG. 2 ), and a plurality of image sensors (eg, the image of FIG. 2 ). sensor 230), an image stabilizer (eg, image stabilizer 240 in FIG. 2), a storage element 321 (eg, memory 250 in FIG. 2), or an image signal processor (eg, image signal processor in FIG. 2). The processor 260) may include the same configuration. According to an embodiment, the camera module 320 may include a plurality of image sensors (not shown) driven by different voltage values (or power).

According to various embodiments, the camera module 320 may include a storage element (or storage unit) 321 (eg, electrically erasable programmable read-only memory (EEPROM)). The camera module 320 may store identification information corresponding to an image sensor that is being driven or is to be driven in the storage element 321 . For example, the camera module 320 may store identification information of a corresponding image sensor in the storage element 321 according to events such as booting, changing zoom magnification, and changing a photographing mode.

The camera module 320 may transfer the identification information stored in the storage element 321 to the processor 310 through the communication channel 311 . For example, the camera module 320 may transmit identification information to the processor 310 through I2C communication.

The camera module 320 may drive at least one image sensor by power provided from the regulator 330 . The power supply pin (DVDD) 325 of the camera module 320 may be connected to the output terminal 335 of the regulator 330 . A voltage corresponding to the identification information transmitted to the processor 310 through the output terminal 335 of the regulator 330 may be applied. The camera module 320 may be driven by one of a plurality of voltage values applied to the output terminal 335 of the regulator 330 .

The regulator 330 may supply power necessary for driving the camera module 320 . The regulator 330 receives power from a power management module (e.g., the power management module 188 of FIG. 1) through an input terminal (IN) 331, and receives power from a plurality of voltage values through an output terminal (OUT) 335. One may be output, for example, the regulator 330 may be a low dropout regulator (LDO).

According to various embodiments, the voltage value of the output terminal 335 of the regulator 330 may be adjusted by a combination of resistors connected to the status check pin (or control pin, feedback pin) (ADJ) 333. The state checking pin 333 of the regulator 330 may be connected to the regulator control pin 315 of the processor 310 through a third resistor R3. When the state of the regulator control pin 315 of the processor 310 is changed, a combination of resistors (hereinafter referred to as feedback resistor values) connected to the state check pin 333 of the regulator 330 may be changed.

For example, when the regulator control pin 315 is in a first state (eg, an open state), the feedback resistance value is determined by a combination of the first resistor R1 and the second resistor R2, and the third resistor may not be affected by (R3). In this case, the output terminal 335 of the regulator 330 may be the first voltage value.

For another example, when the regulator control pin 315 is in the second state (eg, a ground state), the feedback resistance value is a value of all of the first resistor R1, the second resistor R2, and the third resistor R3. can be determined by combination. In this case, the output terminal 335 of the regulator 330 may be the second voltage value.

The first resistor R1 may be connected between the output terminal 335 of the regulator 330 and the status check pin 333. The second resistor R2 may be connected between the state check pin 333 of the regulator 330 and the ground. The third resistor R3 may be connected between the state check pin 333 of the regulator 330 and the regulator control pin 315 of the processor 120 .

According to various embodiments, a combination of resistors connected to the state check pin 333 of the regulator 330 may vary according to the state of the regulator control pin 315 of the processor 120 .

For example, when the regulator control pin 315 is in a first state (eg, an open state), the feedback resistance value is determined by a combination of the first resistor R1 and the second resistor R2, and the third resistor may not be affected by (R3). For another example, when the regulator control pin 315 is in the second state (eg, a ground state), the feedback resistance value is a value of all of the first resistor R1, the second resistor R2, and the third resistor R3. can be determined by combination.

4 is a flowchart illustrating a camera driving method according to various embodiments.

Referring to FIGS. 3 and 4 , in operation 410 , the processor 310 may receive identification information of an image sensor being driven or scheduled to be driven from the camera module 320 . Identification information of the image sensor may be information stored in the storage element 321 of the camera module 320 . The processor 310 may receive identification information through communication of a designated communication method (eg, I2C). The identification information may be a unique name of an image sensor or a code value assigned to each image sensor.

For example, the camera module 320 includes a first image sensor and a second image sensor, and the first image sensor and the second image sensor have a first voltage value (eg, 1.05V) and a second voltage value ( Example: 1.206V). When the first image sensor in the camera module 320 is scheduled to be driven, the storage element 321 may store a first code value corresponding to the first image sensor. In this case, the processor 310 may receive the first code value. When the second image sensor in the camera module 320 is scheduled to be driven, the storage element 321 may store a second code value corresponding to the second image sensor. In this case, the processor 310 may receive the second code value.

According to various embodiments, the processor 310 may receive identification information stored in the storage element 321 of the camera module 320 when a specified condition is satisfied. For example, the condition may be a condition in which the electronic device 301 is booted or the sleep state is released.

In operation 420 , the processor 310 may set the regulator control pin 315 to a state corresponding to the identification information received from the camera module 320 .

For example, when the identification information of the image sensor received from the camera module 320 is a first code value, the processor 310 may set the regulator control pin 315 to a first state (eg, an open state). . Another example. When the identification information of the image sensor received from the camera module 320 is the second code value, the regulator control pin 315 may be set to a second state (eg, a ground state).

In operation 430, the processor 310 may check whether the camera application is running. The camera application may be an application that obtains image data through the camera module 320 and stores a captured image.

In operation 440, when the camera application is executed, the processor 310 may activate the regulator 330. For example, processor 310 may change the state of regulator enable pin 318 to cause regulator 330 to output one of the specified voltage values.

In operation 450, the processor 310 may drive the camera module 320 with a voltage corresponding to the state of the regulator control pin 315. The camera module 320 may be driven by a voltage value applied to the output terminal 335 of the regulator 330 . The voltage value of the output terminal 335 of the regulator 330 may vary according to the state of the regulator control pin 315 of the processor 310 . When the state of the regulator control pin 315 is changed, the combination of resistors (feedback resistance value) connected to the state check pin 333 may change, and the voltage value of the output terminal 335 of the regulator 330 may change. can

For example, when the regulator control pin 315 is in a first state (eg, an open state), the feedback resistance value may be determined by a combination of the first resistor R1 and the second resistor R2, and the feedback resistor The value may not be affected by the third resistor R3. The feedback resistance value may be determined by R1/R2, and the output terminal 335 of the regulator 330 may be the first voltage value.

For another example, when the regulator control pin 315 is in the second state (eg, a ground state), the feedback resistance value is a value of all of the first resistor R1, the second resistor R2, and the third resistor R3. can be determined by combination. The second resistor R2 and the third resistor R3 may be connected in parallel, and the feedback resistance value may be determined as R1/((R2*R3)/(R2+R3)). In this case, the output terminal 335 of the regulator 330 may be the second voltage value.

According to an embodiment, the voltage Vout of the output terminal 335 of the regulator 330 may be determined by the following [Equation Equation].

[mathematical expression]

Vout = Vref + (1+ Rp)

Vout: voltage of the output terminal 335 of the regulator 330

Vref: reference voltage of regulator 330

Rp: feedback resistance value

For example, the reference voltage (Vref) of the regulator 330 = 0.4 (V), the first resistance (R1) = 3.9 (kΩ), the second resistance (R2) = 2.4 (kΩ), the third resistance (R3) = 10.0 (kΩ), and when the regulator control pin 315 is in the first state (eg, open state), the output terminal 335 of the regulator 330 may be 1.05 (V).

For another example, the reference voltage (Vref) of the regulator 330 = 0.4 (V), the first resistance (R1) = 3.9 (kΩ), the second resistance (R2) = 2.4 (kΩ), the third resistance (R3) ) = 10.0 (kΩ), and when the regulator control pin 315 is in the second state (eg, a ground state), the output terminal 335 of the regulator 330 may be 1.206 (V).

According to various embodiments, the reference voltage Vref of the regulator 330 may vary according to characteristics of a chip of the regulator 330 .

According to various embodiments, the processor 310 may receive firmware information of an image sensor being driven or scheduled to be driven from the camera module 320 . The processor 310 may set the regulator control pin 315 to a state corresponding to the firmware received from the camera module 320 . The processor 310 may drive the camera module 320 with a voltage corresponding to the state of the regulator control pin 315 .

5 illustrates an electronic device in which a protection circuit is connected to a regulator control pin according to various embodiments of the present disclosure.

Referring to FIG. 5 , unlike the electronic device 301 of FIG. 3 , the electronic device 501 may further include a protection circuit 510 . The protection circuit 510 may protect the regulator control pin 315 of the processor 310 from power induction, leakage current, and external electrostatic discharge (ESD).

In the electronic device 501, the protection circuit 510 may be a switch (eg, FET) connected to both ends of the third resistor R3. The protection circuit 510 may be controlled by the regulator control pin 315 of the processor 310 .

When the protection circuit 510 is turned on, the feedback resistance value is determined by a combination of the first resistor R1 and the second resistor R2 and may not be affected by the third resistor R30 (Rp =R1/R2)

When the protection circuit 510 is turned off, the feedback resistance value may be determined by a combination of all of the first resistor R1, the second resistor R2, and the third resistor R3 (Rp = R1/(R2 +R3))

6 illustrates an electronic device including a plurality of regulator control pins according to various embodiments.

Referring to FIG. 6 , unlike the electronic device 301 of FIG. 3 , the electronic device 601 may include a plurality of regulator control pins 315_1 and 315_2 . For example, the processor 310 may include a first regulator control pin 315_1 and a second regulator control pin 315_2.

The first regulator control pin 315_1 may be connected to the state checking pin 333 of the regulator 330 through the third resistor R3. The second regulator control pin 315_2 may be connected to the state checking pin 333 of the regulator 330 through the fourth resistor R4.

The feedback resistance value may vary according to the state change of the first regulator control pin 315_1 and the second regulator control pin 315_2. For example, when the first regulator control pin 315_1 is in a ground state and the second regulator control pin 315_2 is in an open state, the feedback resistance values are the first resistor R1, the second resistor R2 and the second resistor R2. It is determined by the combination of the three resistors R30 and may not be affected by the fourth resistor R4 (Rp=R1/(R2||R3)). For another example, when the first regulator control pin 315_1 is in an open state and the second regulator control pin 315_2 is in a ground state, the feedback resistance values are the first resistor R1, the second resistor R2 and It is determined by the combination of the fourth resistor R4 and may not be affected by the third resistor R3 (Rp=R1/(R2||R4)).

7 illustrates a change in a feedback resistance value through switching according to various embodiments.

Referring to FIG. 7 , the electronic device 701, unlike the electronic device 301 of FIG. You can change the value of the feedback resistor connected to .

When the switch 710 connects the second resistor R2 to the state check pin 333 of the regulator 330 under the control of the regulator control pin 315, the feedback resistance value is the first resistor R1, It is determined by the combination of the two resistors R2 and may not be affected by the third resistor R3 (Rp=R1/R2).

When the switch 710 connects the third resistor R3 to the state checking pin 333 of the regulator 330 under the control of the regulator control pin 315, the feedback resistance value is the first resistor R1, It is determined by the combination of the three resistors R3 and may not be affected by the second resistor R2 (Rp=R1/R3).

8 illustrates an electronic device including a plurality of camera modules operating with the same driving voltage according to various embodiments.

Referring to FIG. 8 , an electronic device 801, unlike the electronic device 301 of FIG. 3 , may include a first camera module 320a and a second camera module 320b. The first camera module 320a and the second camera module 320b may be driven by the same voltage value supplied from the regulator 330 . The power pin 325a of the first camera module 320a and the power pin 325b of the second camera module 320b may be respectively connected to the output terminal 335 of the regulator 330 .

The first camera module 320a may include a first storage element 321a. The processor 310 may obtain identification information stored in the first storage element 321a through the first communication channel 311a. The second camera module 320b may include a second storage element 321b. The processor 310 may obtain the identification information stored in the second storage element 321b through the second communication channel 311b.

According to various embodiments, when receiving identification information of an image sensor from one of the first camera module 320a or the second camera module 320b, the processor 310 controls the regulator control pin ( 315) can change the state. Accordingly, the voltage value of the output terminal 335 of the regulator 330 may be changed, and the first camera module 320a and the second camera module 320b may be driven by the same voltage value.

9 illustrates an electronic device including a plurality of camera modules operating at different voltage values according to various embodiments.

Referring to FIG. 9 , unlike the electronic device 801 of FIG. 8 , in the electronic device 901 , the first camera module 320a and the second camera module 320b may operate at different voltage values. The electronic device 901 may include a switch 910 for selecting a camera module. The processor 310 may include a camera selection pin 313 , and the camera selection pin 313 may control the switch 910 .

The power pin 325a of the first camera module 320a and the power pin 325b of the second camera module 320b may be connected to the output terminal 335 of the regulator 330 through the switch 910, respectively.

For example, when the processor 310 receives identification information of the image sensor from the first camera module 320a, the state of the regulator control pin 315 may be changed to correspond to the received identification information. The processor 310 may change the state of the camera select pin 313 so that the switch 910 connects the power pin 325a of the first camera module 320a and the output terminal 335 of the regulator 330. there is. In this case, the second camera module 320b may not be connected to the output terminal 335 of the regulator 330.

For another example, when the processor 310 receives identification information of the image sensor from the second camera module 320b, the state of the regulator control pin 315 may be changed to correspond to the received identification information. The processor 310 may change the state of the camera selection pin 313 so that the switch 910 connects the power pin 325b of the second camera module 320b and the output terminal 335 of the regulator 330. there is. In this case, the first camera module 320a may not be connected to the output terminal 335 of the regulator 330 .

10 is a flowchart illustrating a method of driving a camera of an electronic device including a plurality of camera modules according to various embodiments.

Referring to FIG. 10 , in operation 1010, the processor 310 may receive identification information of an image sensor being driven or scheduled to be driven from at least one of the plurality of camera modules 320a and 320b. Identification information of the image sensor may be information stored in the storage element 321 of the camera module 320 . The processor 310 may receive identification information through communication of a designated communication method (eg, I2C). The identification information may be a unique name of an image sensor or a code value assigned to each image sensor.

In operation 1020, the processor 310 may check whether the camera application is running. The camera application may be an application that obtains image data through the camera module 320 and stores a captured image. Unlike FIG. 4 , the processor 310 may check whether the camera application is executed before setting the regulator control pin 315 .

In operation 1030, when the camera application is executed, the processor 310 may set the regulator control pin 315 to a state corresponding to identification information received from at least one of the plurality of camera modules 320a and 320b.

For example, when the identification information of the image sensor received from at least one of the plurality of camera modules 320a and 320b is a first code value, the processor 310 sets the regulator control pin 315 to a first state (eg : open state). Another example. When the identification information of the image sensor received from the camera module 320 is the second code value, the regulator control pin 315 may be set to a second state (eg, a ground state).

At operation 1040 , processor 310 may activate regulator 330 . For example, processor 310 may change the state of regulator enable pin 318 to cause regulator 330 to output one of the specified voltage values.

In operation 1050, the processor 310 may drive at least one of the plurality of camera modules 320a and 320b with a voltage corresponding to the state of the regulator control pin 315. The plurality of camera modules 320a and 320b may be driven by a voltage value applied to the output terminal 335 of the regulator 330 . The voltage value of the output terminal 335 of the regulator 330 may vary according to the state of the regulator control pin 315 of the processor 310 . When the state of the regulator control pin 315 is changed, the combination of resistors (feedback resistance value) connected to the state check pin 333 may change, and the voltage value of the output terminal 335 of the regulator 330 may change. can

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

An electronic device (eg, the electronic device 101 of FIG. 1 or the electronic device 301 of FIG. 3 ) according to various embodiments includes a first camera module including a plurality of image sensors (eg, the electronic device 101 of FIGS. 1 and 2 ). supplying power to the camera module 180, the camera module 320 of FIG. 3), and the first camera module (eg, the camera module 180 of FIGS. 1 and 2, the camera module 320 of FIG. 3) A regulator (eg, the regulator 330 of FIG. 3 ), a processor (eg, the processor 120 of FIG. 1 , the processor 310 of FIG. 3 ) controlling the regulator (eg, the regulator 330 of FIG. 3 ), A first resistor connected between an output terminal of the regulator (eg, the regulator 330 of FIG. 3 ) and a state check pin of the regulator (eg, the regulator 330 of FIG. 3 ), and between the state check pin and the ground. Controlling the connected second resistor, the status check pin, and the regulator (eg, the regulator 330 of FIG. 3) of the processor (eg, the processor 120 of FIG. 1 and the processor 310 of FIG. 3) A third resistor is connected between the first control pins, and the processor (eg, the processor 120 of FIG. 1 or the processor 310 of FIG. 3 ) is connected to the first camera module (eg, the processor 120 of FIG. 1 and the processor 310 of FIG. 2 ). Receiving identification information corresponding to one of the image sensors from a storage element (eg, storage element 321 of FIG. 3) of the camera module 180 of FIG. 3 and the camera module 320 of FIG. 3, and receiving the identification information The state of the first control pin may be changed to correspond to , and the voltage value of the output terminal of the regulator (eg, the regulator 330 of FIG. 3 ) may be changed in response to the state of the first control pin.

According to various embodiments, the processor (eg, the processor 120 of FIG. 1 or the processor 310 of FIG. 3 ) may open the first control pin when the identification information is a first code value.

According to various embodiments, the processor (eg, the processor 120 of FIG. 1 or the processor 310 of FIG. 3 ) connects the first control pin to the ground when the identification information is a second code value. can

According to various embodiments, the processor (eg, processor 120 of FIG. 1 or processor 310 of FIG. 3 ) activates the regulator (eg, regulator 330 of FIG. 3 ) when a camera application is executed. and when the regulator (eg, the regulator 330 of FIG. 3) is activated, the voltage value may be applied to the output terminal.

According to various embodiments, the electronic device (eg, the electronic device 101 of FIG. 1 or the electronic device 301 of FIG. 3 ) includes the status check pin, the processor (eg, the processor 120 of FIG. 1 , A fourth resistor connected between second control pins controlling the regulator (eg, the regulator 330 of FIG. 3 ) of the processor 310 of FIG. 3 may be further included.

According to various embodiments, the processor (eg, the processor 120 of FIG. 1 or the processor 310 of FIG. 3 ) changes the state of the second control pin to correspond to the identification information, and the first control pin And corresponding to the state of the second control pin, the voltage value of the output terminal of the regulator (eg, the regulator 330 of FIG. 3 ) may be changed.

According to various embodiments, the plurality of image sensors may be driven by different voltage values.

According to various embodiments, the processor (eg, the processor 120 of FIG. 1 or the processor 310 of FIG. 3 ) may be the electronic device (eg, the electronic device 101 of FIG. 1 or the electronic device 301 of FIG. 3 ). )) is booted or the sleep state is released, the storage element of the first camera module (eg, the camera module 180 of FIGS. 1 and 2, the camera module 320 of FIG. 3) (eg, FIG. The identification information may be received from the storage element 321 of No. 3.

According to various embodiments, the processor (eg, the processor 120 of FIG. 1 or the processor 310 of FIG. 3 ) may be an inter-integrated circuit (I2C), an improved inter-integrated circuit (I3C), or a serial peripheral (SPI). The identification information may be received by at least one of interface) protocols.

According to various embodiments, the status check pin may support communication through a general purpose input and output (GPIO).

According to various embodiments, the regulator (eg, the regulator 330 of FIG. 3 ) may be a Low Dropout Regulator (LDO).

According to various embodiments, the electronic device (eg, the electronic device 101 of FIG. 1 or the electronic device 301 of FIG. 3 ) further includes a second camera module, and the first camera module and the second camera module Each may be connected to the output terminal of the regulator (eg, the regulator 330 of FIG. 3 ) and driven by the voltage value.

According to various embodiments, the electronic device (eg, the electronic device 101 of FIG. 1 or the electronic device 301 of FIG. 3 ) further includes a second camera module, and the first camera module and the second camera module is connected to or disconnected from the output terminal of the regulator (eg, the regulator 330 of FIG. 3) through a switch controlled by the processor (eg, the processor 120 of FIG. 1 or the processor 310 of FIG. 3). can

According to various embodiments, the processor (eg, the processor 120 of FIG. 1 or the processor 310 of FIG. 3 ) is configured to store the data from the storage element (eg, the storage element 321 of FIG. 3 ) of the first camera module. When identification information is received, the first camera module (eg, the camera module 180 of FIGS. 1 and 2, the camera module 320 of FIG. 3) is connected to the regulator (eg, the regulator of FIG. 3) through the switch. (330)) can be connected to the output terminal.

An electronic device (eg, the electronic device 501 of FIG. 5 ) according to various embodiments includes a first camera module including a plurality of image sensors, a regulator supplying power to the first camera module, and a processor controlling the regulator. , a first resistor connected between the output terminal of the regulator and the state check pin of the regulator, a second resistor and a third resistor connected in series between the state check pin and the ground, and connected to both ends of the third resistor and a switch, wherein the processor receives identification information corresponding to one of the image sensors from a storage element of the first camera module, and determines a state of a first control pin controlling the switch to correspond to the identification information. and, corresponding to the state of the first control pin, the voltage value of the output terminal of the regulator may be changed.

According to various embodiments, when the identification information is a first code value, the processor may turn on the switch to connect the second resistor between the state check pin and the ground.

According to various embodiments, the processor may turn off the switch when the identification information is a second code value.

An electronic device (eg, the electronic device 701 of FIG. 7 ) according to various embodiments includes a first camera module including a plurality of image sensors, a regulator supplying power to the first camera module, and a processor controlling the regulator. , a first resistor connected between the output terminal of the regulator and the status check pin of the regulator, a switch connected to the status check pin, a second resistor connected to or disconnected from the status check pin through the switch, the switch and a third resistor connected to or disconnected from the status checking pin through a third resistor, wherein the processor receives identification information corresponding to one of the image sensors from a storage element of the first camera module, and corresponds to the identification information. A state of a first control pin controlling the switch may be changed, and a voltage value of the output terminal of the regulator may be changed in response to the state of the first control pin.

According to various embodiments, when the identification information is a first code value, the processor connects the second resistor to the status check pin through the switch, and connects the third resistor to the status check pin through the switch. can be separated from

According to various embodiments, when the identification information is a second code value, the processor connects the third resistor to the status check pin through the switch, and connects the second resistor to the status check pin through the switch. can be separated from

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, program 10) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

Claims (20)

In electronic devices,
A first camera module including a plurality of image sensors;
a regulator supplying power to the first camera module;
a processor controlling the regulator;
a first resistor connected between an output terminal of the regulator and a status checking pin of the regulator;
a second resistor connected between the status check pin and ground;
A third resistor connected between the status checking pin and a first control pin controlling the regulator of the processor;
The processor
receiving identification information corresponding to one of the image sensors from a storage element of the first camera module;
Changing the state of the first control pin to correspond to the identification information;
An electronic device in which a voltage value of the output terminal of the regulator is changed in response to a state of the first control pin. The method of claim 1, wherein the processor
An electronic device that opens the first control pin when the identification information is a first code value. The method of claim 1, wherein the processor
An electronic device that connects the first control pin to the ground when the identification information is a second code value. The method of claim 1, wherein the processor
When the camera application is running, activate the regulator,
An electronic device in which the voltage value is applied to the output terminal when the regulator is activated. According to claim 1,
The electronic device further includes a fourth resistor connected between the state checking pin and a second control pin controlling the regulator of the processor. The method of claim 5, wherein the processor
Changing the state of the second control pin to correspond to the identification information;
An electronic device in which the voltage value of the output terminal of the regulator is changed in response to states of the first control pin and the second control pin. The method of claim 1, wherein the plurality of image sensors
Electronic devices powered by different voltage values. The method of claim 1, wherein the processor
An electronic device that receives the identification information from the storage element of the first camera module when the electronic device is booted or a sleep state is released. The method of claim 1, wherein the processor
An electronic device that receives the identification information through at least one of an inter-integrated circuit (I2C), an improved inter-integrated circuit (I3C), and a serial peripheral interface (SPI) protocol. The method of claim 1, wherein the state check pin
An electronic device that supports communication by means of a general purpose input and output (GPIO). The method of claim 1, wherein the regulator
An electronic device that is a Low Dropout Regulator. According to claim 1,
Further comprising a second camera module,
The first camera module and the second camera module are each connected to the output terminal of the regulator and driven by the voltage value. According to claim 1,
Further comprising a second camera module,
The first camera module and the second camera module are connected to or separated from the output terminal of the regulator through a switch controlled by the processor. 14. The method of claim 13, wherein the processor
An electronic device that connects the first camera module to the output terminal of the regulator through the switch when the identification information is received from the storage element of the first camera module. In electronic devices,
A first camera module including a plurality of image sensors;
a regulator supplying power to the first camera module;
a processor controlling the regulator;
a first resistor connected between an output terminal of the regulator and a status checking pin of the regulator;
a second resistor and a third resistor connected in series between the status check pin and ground;
A switch connected to both ends of the third resistor,
The processor
receiving identification information corresponding to one of the image sensors from a storage element of the first camera module;
Changing a state of a first control pin controlling the switch to correspond to the identification information;
An electronic device in which a voltage value of the output terminal of the regulator is changed in response to a state of the first control pin. 16. The method of claim 15, wherein the processor
When the identification information is a first code value, turn on the switch to connect the second resistor between the status check pin and the ground. 16. The method of claim 15, wherein the processor
An electronic device that turns off the switch when the identification information is a second code value. In electronic devices,
A first camera module including a plurality of image sensors;
a regulator supplying power to the first camera module;
a processor controlling the regulator;
a first resistor connected between an output terminal of the regulator and a status checking pin of the regulator;
a switch connected to the status check pin;
a second resistor connected to or disconnected from the status checking pin through the switch;
A third resistor connected to or separated from the status checking pin through the switch; includes,
The processor
receiving identification information corresponding to one of the image sensors from a storage element of the first camera module;
Changing a state of a first control pin controlling the switch to correspond to the identification information;
An electronic device in which a voltage value of the output terminal of the regulator is changed in response to a state of the first control pin. 19. The method of claim 18, wherein the processor
When the identification information is a first code value, connecting the second resistor to the status check pin through the switch;
An electronic device that separates the third resistor from the status check pin through the switch. 19. The method of claim 18, wherein the processor
When the identification information is a second code value, connecting the third resistor to the status check pin through the switch;
An electronic device that separates the second resistor from the status check pin through the switch.

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