KR20230021040A - Display apparatus - Google Patents

Abstract

A display apparatus comprises: an organic light emitting display panel; and a touch detection unit arranged on the organic light emitting display panel. The touch detection unit comprises: a touch electrode; and a wiring unit connected to the touch electrode. The wiring unit of the touch detection unit passes a protruding member arranged at a non-display area of the organic light emitting display panel, and comprises a first wiring unit which is not overlapped with the protruding member in plan view, a second wiring unit overlapped with the protruding member, and a connecting wiring unit arranged between the first wiring unit and a second wiring unit and having a wiring width smaller than that of the first wiring unit and the second wiring unit in order to be overlapped with the edge of the protruding member, thereby improving a short failure among the wiring units.

Description

Display device {DISPLAY APPARATUS}

The present invention relates to a display device, and more particularly, to a display device in which a defect in a wiring part of a touch sensing unit is improved.

Various display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game machines are being developed. Input devices of the display devices include a keyboard or a mouse. Also, recent display devices include a touch sensing unit as an input device.

SUMMARY OF THE INVENTION An object of the present invention is to provide a display device having an improved structure of a wiring part for improving a short circuit defect occurring between neighboring wiring parts in a touch sensing unit.

An embodiment includes a base substrate divided into a display area and a non-display area adjacent to the display area; a circuit layer disposed on the base substrate; a light emitting element layer disposed on the display area; an encapsulation layer covering the light emitting element layer; a touch sensing unit disposed on the encapsulation layer and including a touch electrode and a wiring part connected to the touch electrode; and a protruding member disposed on the non-display area. It provides a display device comprising a. In one embodiment, the wiring part may include a first wiring part having a first wiring width and non-overlapping with the protruding member on a plane; a second wiring portion overlapping the protruding member and having a second wiring width; and a connection wiring part having a third wiring width smaller than the first wiring width and the second wiring width, and disposed between the first wiring part and the second wiring part. wherein the first to third wiring widths are widths in a direction perpendicular to an extending direction of the wiring part, and the connection wiring part may overlap an edge of the protruding member.

A ratio of the first wiring width to the third wiring width may be greater than or equal to 1:0.3 and less than 1:1.

A length of the connection wiring part in an extension direction of the wiring part may be 5 μm or more and 50 μm or less.

The connection wiring part may include a first sub-connection part having a wiring width smaller than the first wiring width; a second sub connection part disposed between the first wiring part and the first sub connection part; and a third sub connection part disposed between the second wiring part and the first sub connection part. Including, the first sub-connecting portion may overlap the edge of the protruding member.

A wiring width of the second sub-connection part may increase toward the first wiring part, and a wiring width of the third sub-connection part may increase toward the second wiring part.

The first wiring width and the second wiring width may be the same.

The second wiring unit may include a first sub-wiring unit having a first sub-wiring width greater than the first wiring width; a second sub-wiring unit extending from the connection wiring unit and having a second sub-wiring width smaller than the first sub-wiring width; a third sub-wiring unit disposed between the first sub-wiring unit and the second sub-wiring unit; It may contain.

A wiring width of the third sub-wiring part may decrease toward the second sub-wiring part.

A ratio of the second sub wiring width to the first sub wiring width may be greater than 1:1 and less than 1:2.

The protruding member includes a bottom surface, an upper surface facing the bottom surface, and a side surface connecting the bottom surface and the top surface, the side surface having an inclination with respect to the bottom surface, and the area of the bottom surface is It may be greater than or equal to the top surface area.

The protruding member may include a lower protrusion having a first width in a cross section perpendicular to the base substrate; and an upper protrusion disposed on the lower protrusion and having a second width less than or equal to the first width. and the first width and the second width may be widths in a direction perpendicular to an extension direction of the wiring part.

A ratio of the first width to the second width may be greater than or equal to 1:0.3 and less than 1:1.

The second wiring part may overlap the upper protruding part.

The connection wiring part may include a first sub-connection part having a wiring width smaller than the first wiring width; a second sub connection part disposed between the first wiring part and the first sub connection part; and a third sub connection part disposed between the second wiring part and the first sub connection part. Including, the first sub-connection portion may overlap an edge of the lower protrusion, and the third sub-connection portion may overlap an edge of the upper protrusion.

Each of the upper protrusion and the lower protrusion includes a bottom surface, an upper surface facing the bottom surface, and a side surface disposed between the bottom surface and the top surface, and the side surface may have an inclination with respect to the bottom surface. .

An exposure width of one side of an upper surface of the lower protrusion that does not overlap with the upper protrusion may be greater than or equal to 5 μm and less than or equal to 30 μm.

A ratio of the first width to the exposure width may be 1:0.01 or more and 1:0.4 or less.

A ratio of the height of the lower protrusion to the exposed width may be greater than 1:1 and less than 1:15.

The protruding member may include a first protruding member adjacent to the display area; and a second protruding member disposed outside the first protruding member and having a height greater than or equal to the first protruding member. can include

The first protruding member may include a first lower protrusion and a first upper protrusion that are stacked in a thickness direction, and the second wiring part may overlap the first upper protrusion.

The second protruding member includes a base protrusion, a second lower protrusion, and a second upper protrusion that are sequentially stacked in a thickness direction, the base protrusion has a first width, and the second lower protrusion has a first width or more. 2 widths, the second upper protruding portion may have a third width equal to or greater than the second width, and the first to third widths may be widths in a direction perpendicular to an extending direction of the wiring part.

The second wiring part overlapping the second protruding member may include a first sub-wiring part having a first sub-wiring width greater than the first wiring width; a second sub-wiring part extending from the connection wiring part and having a second wiring width smaller than the first sub-wiring width; and a third sub-wiring unit disposed between the first sub-wiring unit and the second sub-wiring unit, and having a wiring width smaller toward the second sub-wiring unit. can include

The first sub wiring part may overlap the second upper protrusion.

The third sub wiring part may overlap an edge of the second upper protruding part.

The wiring unit may include a first metal layer; an insulating layer disposed on the first metal layer; a second metal layer disposed on the insulating layer; and a plurality of contact holes disposed between the first metal layer and the second metal layer. can include

The plurality of contact holes may not overlap the connection wiring part.

In the display device according to an exemplary embodiment, a width of a wiring portion overlapping an edge of a protruding member may be smaller than a width of a wiring portion at a portion that does not overlap the protruding member, thereby preventing a short circuit between adjacent wiring portions during wiring formation.

1A is a perspective view of a first operation of a display device according to an exemplary embodiment of the present invention.
1B is a perspective view of a second operation of a display device according to an exemplary embodiment of the present invention.
1C is a perspective view according to a third operation of a display device according to an exemplary embodiment of the present invention.
2 is a cross-sectional view of a display device according to an exemplary embodiment of the present invention.
3A and 3B are perspective views of a display device according to an exemplary embodiment of the present invention.
4A and 4B are perspective views of a display device according to an exemplary embodiment of the present invention.
5A is a plan view of an organic light emitting display panel according to an exemplary embodiment of the present invention.
5B is a cross-sectional view of a display module according to an embodiment of the present invention.
6A is an equivalent circuit diagram of a pixel according to an embodiment of the present invention.
6B is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment.
6C is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment of the present invention.
7a to 7c are cross-sectional views of an encapsulation layer according to an embodiment of the present invention.
8 is a cross-sectional view of a touch sensing unit according to an embodiment of the present invention.
9 is a plan view of a display device according to an exemplary embodiment of the present invention.
10A to 10C are plan views of a touch sensing unit according to an embodiment of the present invention.
10D is a partially enlarged view of the BB region of FIG. 10C.
FIG. 11 is a cross-sectional view obtained by cutting an area II′ of FIG. 9 .
12 is a plan view showing an enlarged area AA of FIG. 9 .
FIG. 13A is a cross-sectional view taken along II-II′ of FIG. 12 .
FIG. 13B is a partially enlarged view of the CC region of FIG. 12 .
FIG. 14A is a cross-sectional view taken along II-II′ of FIG. 12 .
FIG. 14B is a partially enlarged view of the CC region of FIG. 12 .
Figure 14c is a cross-sectional view showing a protruding member according to an embodiment of the present invention.
15A and 15B are plan views illustrating exemplary embodiments of a wiring unit including a connection wiring unit.
16 is a plan view showing an enlarged area AA of FIG. 9 .
FIG. 17A is a cross-sectional view of a region III-III' of FIG. 16 .
FIG. 17B is an enlarged plan view of the EE region of FIG. 16 .
18A is a plan view showing an enlarged area AA of FIG. 9 .
FIG. 18B is a cross-sectional view taken along the line IV-IV' of FIG. 18A.
FIG. 19A is a cross-sectional view taken along II-II′ of FIG. 12 .
FIG. 19B is a partially enlarged view of the CC region of FIG. 12 .
20 is a cross-sectional view schematically illustrating a photo process among manufacturing processes of a display device according to an exemplary embodiment.
21A is a plan view exemplarily illustrating a case in which a mask for manufacturing a conventional wiring part is used.
21B is a plan view showing the structure of a conventional wiring unit.
22 and 23 are plan views illustrating a disposition of a mask for manufacturing a wiring unit in a display device according to an exemplary embodiment.

Since the present invention may have various changes and various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, it should be understood that this is not intended to limit the present invention to the specific disclosed form, and includes all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Like reference numerals have been used for like elements throughout the description of each figure. In the accompanying drawings, the dimensions of the structures are shown enlarged than actual for clarity of the present invention. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In this application, the terms "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof. In addition, when a part such as a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where it is "directly on" the other part, but also the case where another part is present in the middle. Conversely, when a part such as a layer, film, region, plate, etc. is said to be "under" another part, this includes not only the case where it is "directly under" the other part, but also the case where there is another part in between. In addition, in the present application, being disposed "on" may include the case of being disposed not only on the top but also on the bottom.

Hereinafter, a display device according to an exemplary embodiment of the present invention will be described with reference to the drawings.

1A is a perspective view of a first operation of a display device DD according to an exemplary embodiment of the present invention. 1B is a perspective view according to a second operation of the display device DD according to an exemplary embodiment of the present invention. 1C is a perspective view according to a third operation of the display device DD according to an exemplary embodiment of the present invention.

As shown in FIG. 1A , in the first operation mode, the display surface IS on which the image IM is displayed is parallel to the plane defined by the first and second directions DR1 and DR2 . The third direction DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display device DD. The front (or upper surface) and rear surface (or lower surface) of each member are divided by the third direction DR3. However, the directions indicated by the first to third directions DR1 , DR2 , and DR3 may be converted into other directions as a relative concept. Hereinafter, the same reference numerals refer to directions indicated by the first to third directions DR1 , DR2 , and DR3 , respectively.

1A to 1C illustrate a flexible foldable display device as an example of the display device DD. However, the present invention may be a rollable display device that rolls or a bended display device, and is not particularly limited. In addition, although the flexible display device is shown in this embodiment, the present invention is not limited thereto. The display device DD according to the present exemplary embodiment may be a flat rigid display device or a curved rigid display device. The display device DD according to the present invention may be used in large-sized electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation devices, game consoles, and smart watches.

As shown in FIG. 1A , the display surface IS of the display device DD may include a plurality of regions. The display device DD includes a display area DD-DA displaying an image IM and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area in which an image is not displayed. FIG. 1A shows a vase as an example of the image IM. As an example, the display area DD-DA may have a rectangular shape. The non-display area DD-NDA may surround the display area DD-DA. However, it is not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA can be designed relatively.

As shown in FIGS. 1A to 1C , the display device DD may include a plurality of regions defined according to an operation type. The display device DD includes a bending area BA that is bent, a first non-bending area NBA1 that is non-bending, and a second non-bending area NBA2 that is bent on the basis of the bending axis BX. can include

As shown in FIG. 1B , the display device DD is inner bent so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. -bending). As shown in FIG. 1C , the display device DD may be outer-bended so that the display surface IS is exposed to the outside.

Although only one bending area BA is illustrated in FIGS. 1A to 1C , the present invention is not limited thereto. For example, in one embodiment of the present invention, the display device DD may include a plurality of bending areas BA.

In an embodiment of the present invention, the display device DD may be configured to repeat only the operation modes shown in FIGS. 1A and 1B. However, the present invention is not limited thereto, and the bending area BA may be defined to correspond to a shape in which the user manipulates the display device DD. For example, unlike FIGS. 1B and 1C , the bending area BA may be defined parallel to the first direction DR1 or may be defined in a diagonal direction. The area of the bending area BA is not fixed and may be determined according to the radius of curvature.

2 is a cross-sectional view of a display device DD according to an exemplary embodiment. 2 illustrates a cross section defined by the second and third directions DR2 and DR3.

As shown in FIG. 2, the display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, and a second adhesive member ( AM2), and a third adhesive member AM3. The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 couples the display module DM and the protective film PM, the second adhesive member AM2 couples the display module DM and the optical member LM, and the third adhesive member AM2 couples the display module DM and the optical member LM. (AM3) couples the optical member (LM) and the window (WM).

The protective film PM protects the display module DM. The protective film PM provides the first outer surface OS-L exposed to the outside and provides an adhesive surface adhered to the first adhesive member AM1. The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external impact.

The protective film PM may include a plastic film as a base substrate. The protective film (PM) is polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethyleneterephthalate (PET), polyetherimide (PEI), phenylene sulfide (PPS, polyphenylene sulfide), polyarylate, polyimide (PI, polyimide), polycarbonate (PC, polycarbonate), poly(arylene ethersulfone), and combinations thereof. It may include a plastic film containing any one selected from the group consisting of

Materials constituting the protective film PM are not limited to plastic resins and may include organic/inorganic composite materials. The protective film PM may include a porous organic layer and an inorganic material filled in pores of the organic layer. The protective film PM may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. In one embodiment of the present invention, the protective film (PM) may be omitted.

The window WM may protect the display module DM from external impact and provide an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside and provides an adhesive surface adhered to the second adhesive member AM2. The display surface IS shown in FIGS. 1A to 1C may be the second outer surface OS-U.

The window WM may include a plastic film. The window WM may have a multi-layered structure. The window WM may have a multilayer structure selected from a glass substrate, a plastic film, and a plastic substrate. The window WM may further include a bezel pattern. The multilayer structure may be formed through a continuous process or an bonding process using an adhesive layer.

The optical member LM reduces reflectance of external light. The optical member LM may include at least a polarizing film. The optical member LM may further include a retardation film. In one embodiment of the present invention, the optical member LM may be omitted.

The display module DM may include an organic light emitting display panel (DP, or display panel) and a touch sensing unit TS. The touch sensing unit TS is disposed on the organic light emitting display panel DP. Also, in one embodiment, the touch sensing unit TS may be directly disposed on the organic light emitting display panel DP. In this specification, "directly disposed" means formed by a continuous process, excluding attachment using a separate adhesive layer.

The organic light emitting display panel DP generates an image (IM, see FIG. 1A) corresponding to the input image data. The organic light emitting display panel DP provides a first display panel surface BS1 -L and a second display panel surface BS1 -U facing each other in the thickness direction DR3 . Although the organic light emitting display panel DP has been described as an example in this embodiment, the display panel is not limited thereto.

The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS may sense an external input in a capacitive manner.

Although not separately shown, the display module DM according to an embodiment of the present invention may further include an antireflection layer. The antireflection layer may include a color filter or a multilayer structure of a conductive layer/insulation layer/conductive layer. The anti-reflection layer may reduce external light reflectance by absorbing, destructively interfering with, or polarizing light incident from the outside. The antireflection layer may replace the function of the optical member LM.

Each of the first adhesive member (AM1), the second adhesive member (AM2), and the third adhesive member (AM3) is an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR). Alternatively, it may be an organic adhesive layer such as a pressure sensitive adhesive film (PSA). The organic adhesive layer may include an adhesive material such as polyurethane-based, polyacrylic-based, polyester-based, polyepoxy-based, or polyvinyl acetate-based.

Although not separately illustrated, the display device DD may further include a frame structure supporting the functional layers to maintain the state shown in FIGS. 1A to 1C . The frame structure may include a joint structure or a hinge structure.

3A and 3B are perspective views of a display device DD-1 according to an exemplary embodiment of the present invention. FIG. 3A shows the display device DD- 1 in an unfolded state, and FIG. 3B shows the display device DD- 1 in a bent state.

The display device DD- 1 may include one bending area BA and one non-bending area NBA. The non-display area DD-NDA of the display device DD- 1 may be bent. However, in one embodiment of the present invention, the bending area of the display device DD-1 may be changed.

Unlike the display device DD shown in FIGS. 1A to 1C , the display device DD- 1 according to the present embodiment may operate while being fixed in one form. The display device DD- 1 may operate in a bent state as shown in FIG. 3B. The display device DD- 1 may be fixed to a frame in a bent state, and the frame may be coupled to a housing of an electronic device.

The display device DD- 1 according to this embodiment may have the same cross-sectional structure as that shown in FIG. 2 . However, the non-bending area NBA and the bending area BA may have a different stacked structure. The non-bending area NBA may have the same cross-sectional structure as that shown in FIG. 2 , and the bending area BA may have a cross-sectional structure different from that shown in FIG. 2 . The optical member LM and the window WM may not be disposed in the bending area BA. That is, the optical member LM and the window WM may be disposed only in the non-bending area NBA. The second adhesive member AM2 and the third adhesive member AM3 may also not be disposed in the bending area BA.

4A is a perspective view of a display device DD-2 according to an exemplary embodiment.

The display device DD-2 includes a non-bending area (NBA, or flat area) in which the main image is displayed on the front side and a bending area (BA, or side area) in which the sub image is displayed on the side. Although not separately shown, the sub image may include an icon providing predetermined information. In this embodiment, the term "non-bending area NBA and bending area BA" defines the display device DD- 2 as a plurality of areas divided into shapes.

The bending area BA bent from the non-bending area NBA displays a sub image in a fourth direction DR4 crossing the first direction DR1 , the second direction DR2 , and the third direction DR3 . . However, directions indicated by the first to fourth directions DR1 to DR4 may be converted to other directions as a relative concept.

4B is a perspective view of a display device DD-3 according to an embodiment of the present invention.

The display device DD-3 includes a non-bending area NBA where the main image is displayed on the front side, and a first bending area BA1 and a second bending area BA2 where the sub image is displayed on the side. The first bending area BA1 and the second bending area BA2 may be bent from both sides of the non-bending area NBA.

5A is a plan view of an organic light emitting display panel DP according to an exemplary embodiment, and FIG. 5B is a cross-sectional view of a display module DM according to an exemplary embodiment. For example, FIG. 5B may show a part of a cross section on a plane parallel to planes defined by the second and third directions DR2 and DR3 .

As shown in FIG. 5A , the organic light emitting display panel DP includes a display area DA and a non-display area NDA on a plane. The display area DA and the non-display area NDA of the organic light emitting display panel DP are the display area DD-DA (see FIG. 1A) and the non-display area DD-NDA of the display device DD (see FIG. 1A). , see Fig. 1a) respectively. The display area DA and the non-display area NDA of the organic light emitting display panel DP are the display area DD-DA (see FIG. 1A) and the non-display area DD-NDA of the display device DD (see FIG. 1A). , see FIG. 1A) and may be changed according to the structure/design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of pixels PX. An area where a plurality of pixels PX is disposed is defined as a display area DA. In this embodiment, the non-display area NDA may be defined along the edge of the display area DA.

The organic light emitting display panel DP includes gate lines GL, data lines DL, emission lines EL, a control signal line SL-D, an initialization voltage line SL-Vint, and a voltage line ( SL-VDD), and a pad part PD.

The gate lines GL are respectively connected to corresponding pixels PX among the plurality of pixels PX, and the data lines DL are respectively connected to corresponding pixels PX among the plurality of pixels PX. do. Each of the light emitting lines EL may be arranged parallel to a corresponding one of the gate lines GL. The control signal line SL-D may provide control signals to the gate driving circuit GDC. The initialization voltage line SL-Vint may provide an initialization voltage to the plurality of pixels PX. The voltage line SL-VDD is connected to the plurality of pixels PX and may provide a first voltage to the plurality of pixels PX. The voltage line SL-VDD may include a plurality of lines extending in the first direction DR1 and a plurality of lines extending in the second direction DR2 .

A gate driving circuit GDC to which gate lines GL and emission lines EL are connected may be disposed on one side of the non-display area NDA. Some of the gate lines GL, data lines DL, light emitting lines EL, control signal line SL-D, initialization voltage line SL-Vint, and voltage line SL-VDD are the same. are placed on a layer, and some are placed on other layers.

The pad part PD may be connected to ends of the data lines DL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD.

As shown in FIG. 5B , the organic light emitting display panel DP includes a base substrate SUB, a circuit layer DP-CL disposed on the base substrate SUB, and a circuit layer DP-CL disposed on the circuit layer DP-CL. It may include a light emitting element layer (DP-OLED), and an encapsulation layer (TFE) surrounding the light emitting element layer (DP-OLED).

The base substrate SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite material substrate. The plastic substrate may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. can include The base substrate SUB may be a flexible substrate. Alternatively, the base substrate SUB may be a rigid substrate.

The base substrate SUB may be divided into a display area and a non-display area adjacent to the display area. The non-display area NDA may be disposed at an edge of the display area DA. However, the embodiment is not limited thereto, and the non-display area NDA may be defined only on one side of the display area DA.

A circuit layer DP-CL may be disposed on the base substrate SUB. The circuit layer DP-CL may be disposed on the display area DA and the non-display area NDA of the base substrate SUB. Although not shown separately in the drawings, the circuit layer DP-CL may include at least one pixel insulating layer, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL may constitute signal lines or a driving circuit of a pixel.

The light emitting device layer DP-OLED may include organic light emitting diodes. The light emitting device layer DP-OLED may be disposed on the display area DA. The organic light emitting diode will be described in detail in the description of FIG. 6C to be described later.

An encapsulation layer (TFE) may be disposed on the light emitting element layer (DP-OLED). The encapsulation layer TFE may be disposed to surround the light emitting element layer DP-OLED. The encapsulation layer (TFE) may cover and seal the light emitting element layer (DP-OLED). The encapsulation layer TFE may include an inorganic layer and an organic layer. The encapsulation layer TFE may include at least two inorganic layers and an organic layer interposed therebetween. The inorganic layer protects the light emitting device layer DP-OLED from moisture/oxygen, and the organic layer protects the light emitting device layer DP-OLED from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxy nitride layer, and a silicon oxide layer. The organic layer may include an acryl-based organic material, but is not limited thereto. The inorganic layer may be provided by a deposition method, and the organic layer may be provided by using a coating process, but the embodiment is not limited thereto. The configuration of the encapsulation layer TFE will be described in detail later in the description of FIGS. 7A to 7C.

The touch sensing unit TS is disposed on the encapsulation layer TFE. The touch sensing unit TS may be directly disposed on the encapsulation layer TFE. However, it is not limited thereto, and an inorganic layer may be disposed on the encapsulation layer TFE, and the touch sensing unit TS may be disposed on the inorganic layer. The inorganic layer may be a buffer layer. The inorganic layer may be at least one of a silicon nitride layer, a silicon oxy nitride layer, and a silicon oxide layer. However, this is an example and the embodiment is not limited thereto. Also, the buffer layer may be an organic layer. Although the buffer layer has been described as a separate component, the buffer layer may be included in the encapsulation layer TFE.

The touch sensing unit TS includes touch sensors and touch signal lines. The touch sensors and touch signal lines may have a single-layer or multi-layer structure.

The touch sensors and touch signal lines may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The touch sensors and touch signal lines may include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensors and the touch signal lines may have the same layer structure or different layer structures. Details of the touch sensing unit TS will be described later.

6A is an equivalent circuit diagram of a pixel PX according to an embodiment of the present invention. FIG. 6A illustrates an i-th pixel PXi connected to a k-th data line DLk among a plurality of data lines DL (see FIG. 5A ).

The i-th pixel PXi includes an organic light emitting diode (OLED) and a pixel driving circuit that controls the organic light emitting diode. The driving circuit may include seven thin film transistors T1 to T7 and one storage capacitor Cst.

The driving transistor controls driving current supplied to the organic light emitting diode (OLED). An output electrode of the second transistor T2 is electrically connected to the organic light emitting diode OLED. The output electrode of the second transistor T2 may directly contact the anode of the organic light emitting diode OLED, or may be connected via another transistor (the sixth transistor T6 in the present embodiment).

A control electrode of the control transistor may receive a control signal. Control signals applied to the i-th pixel PXi include the i-1-th gate signal Si-1, the i-th gate signal Si, the i+1-th gate signal Si+1, the data signal Dk, and an i-th emission control signal Ei. In an embodiment of the present invention, the control transistor may include a first transistor T1 and third to seventh transistors T3 to T7.

The first transistor T1 includes an input electrode connected to the k-th data line DLk, a control electrode connected to the ith gate line GLi, and an output electrode connected to the output electrode of the second transistor T2. do. The first transistor T1 is turned on by the gate signal Si (hereinafter referred to as the i-th gate signal) applied to the i-th gate line GLi, and the data signal Dk applied to the k-th data line DLk. is provided to the storage capacitor Cst.

6B is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment. 6C is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment of the present invention. Specifically, FIG. 6B shows a cross-section of a portion corresponding to the first transistor T1 of the equivalent circuit shown in FIG. 6A. FIG. 6C is a cross-sectional view of portions corresponding to the second transistor T2, the sixth transistor T6 and the organic light emitting diode (OLED) of the equivalent circuit shown in FIG. 6A.

Referring to FIGS. 6B and 6C , a buffer layer BFL may be disposed on the base substrate SUB. The buffer layer BFL improves bonding strength between the base substrate SUB and conductive patterns or semiconductor patterns. The buffer layer BFL may include an inorganic layer. Although not separately shown, a barrier layer that prevents foreign substances from entering may be further disposed on the upper surface of the base substrate SUB. The buffer layer (BFL) and the barrier layer may be selectively arranged/omitted.

A semiconductor pattern OSP1 of the first transistor T1 (hereinafter referred to as first semiconductor pattern), a semiconductor pattern OSP2 of the second transistor T2 (hereinafter referred to as second semiconductor pattern), and a sixth transistor T6 are formed on the buffer layer BFL. A semiconductor pattern (OSP6: hereinafter referred to as a sixth semiconductor pattern) is disposed. The first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 may be selected from amorphous silicon, polysilicon, or a metal oxide semiconductor.

A first insulating layer 10 may be disposed on the first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 . 6B and 6C exemplarily show that the first insulating layer 10 is provided in a layer form covering the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6. However, the first insulating layer 10 may be provided in a pattern disposed corresponding to the first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 .

The first insulating layer 10 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer, a silicon oxy nitride layer, and a silicon oxide layer.

On the first insulating layer 10, the control electrode GE1 of the first transistor T1 (hereinafter referred to as the first control electrode), the control electrode GE2 of the second transistor T2 (hereinafter referred to as the second control electrode), and the sixth A control electrode GE6 (hereinafter referred to as a sixth control electrode) of the transistor T6 is disposed. The first control electrode GE1 , the second control electrode GE2 , and the sixth control electrode GE6 may be manufactured according to the same photolithography process as the gate lines GL (see FIG. 5A ).

A second insulating layer 20 may be disposed on the first insulating layer 10 to cover the first control electrode GE1 , the second control electrode GE2 , and the sixth control electrode GE6 . The second insulating layer 20 may provide a flat upper surface. The second insulating layer 20 may include an organic material and/or an inorganic material.

On the second insulating layer 20, the input electrode (SE1: hereinafter referred to as the first input electrode) and the output electrode (DE1: first output electrode) of the first transistor T1, the input electrode of the second transistor T2 ( SE2: hereinafter, second input electrode) and output electrode (DE2: second output electrode), input electrode (SE6: hereinafter, hereinafter, sixth input electrode) and output electrode (DE6: sixth output electrode) of the sixth transistor T6 ) is placed.

The first input electrode SE1 and the first output electrode DE1 have a first through hole CH1 and a second through hole CH2 penetrating the first insulating layer 10 and the second insulating layer 20 . are respectively connected to the first semiconductor pattern OSP1 through The second input electrode SE2 and the second output electrode DE2 include a third through hole CH3 and a fourth through hole CH4 penetrating the first insulating layer 10 and the second insulating layer 20 . are respectively connected to the second semiconductor pattern OSP2 through The sixth input electrode SE6 and the sixth output electrode DE6 include a fifth through hole CH5 and a sixth through hole CH6 penetrating the first insulating layer 10 and the second insulating layer 20 . are respectively connected to the sixth semiconductor pattern OSP6 through Meanwhile, in another embodiment of the present invention, the first transistor T1 , the second transistor T2 , and the sixth transistor T6 may be modified into a bottom gate structure.

On the second insulating layer 20, the first input electrode SE1, the second input electrode SE2, the sixth input electrode SE6, the first output electrode DE1, the second output electrode DE2, A third insulating layer 30 covering the six output electrodes DE6 is disposed. The third insulating layer 30 includes an organic layer and/or an inorganic layer. In particular, the third insulating layer 30 may include an organic material to provide a flat surface.

Any one of the first insulating layer 10 , the second insulating layer 20 , and the third insulating layer 30 may be omitted depending on the circuit structure of the pixel. Each of the second insulating layer 20 and the third insulating layer 30 may be defined as an interlayer. The interlayer insulating layer is disposed between the conductive pattern disposed below and the conductive pattern disposed above the interlayer insulating layer to insulate the conductive patterns.

A pixel defining layer (PDL) and an organic light emitting diode (OLED) are disposed on the third insulating layer 30 . An anode AE is disposed on the third insulating layer 30 . The anode AE is connected to the sixth output electrode DE6 through the seventh through hole CH7 penetrating the third insulating layer 30 . An opening OP is defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL exposes at least a portion of the anode AE.

The pixel PX may be disposed in a pixel area on a plane. The pixel area may include an emission area PXA and a non-emission area NPXA adjacent to the emission area PXA. The non-emission area NPXA may surround the emission area PXA. In this embodiment, the light emitting area PXA is defined to correspond to a partial area of the anode AE exposed through the opening OP.

The hole control layer HCL may be disposed in common in the emission area PXA and the non-emission area NPXA. Although not separately shown, a common layer such as a hole control layer (HCL) may be commonly formed in a plurality of pixels (PX, see FIG. 5A).

An organic light emitting layer (EML) is disposed on the hole control layer (HCL). The organic light emitting layer EML may be disposed in an area corresponding to the opening OP. That is, the organic light emitting layer EML may be separately formed in each of the plurality of pixels PX. Although the patterned organic light emitting layer EML is illustrated as an example in this embodiment, the organic light emitting layer EML may be commonly disposed in a plurality of pixels PX. In this case, the organic light emitting layer EML may generate white light. Also, the organic light emitting layer EML may have a multilayer structure.

An electronic control layer (ECL) is disposed on the organic light emitting layer (EML). Although not separately shown, the electronic control layer ECL may be formed in common with a plurality of pixels PX (see FIG. 5A ).

A cathode CE is disposed on the electronic control layer ECL. The cathode CE is commonly disposed in the plurality of pixels PX.

An encapsulation layer TFE is disposed on the cathode CE. The encapsulation layer TFE is commonly disposed in the plurality of pixels PX. The encapsulation layer TFE includes at least one inorganic layer and at least one organic layer. The encapsulation layer TFE may include a plurality of inorganic layers and a plurality of organic layers that are alternately stacked.

In this embodiment, the encapsulation layer TFE directly covers the cathode CE. In one embodiment of the present invention, a capping layer covering the cathode CE may be further disposed between the encapsulation layer TFE and the cathode CE. In this case, the encapsulation layer TFE may directly cover the capping layer.

7A to 7C are cross-sectional views illustrating examples of encapsulation layers TFE1 , TFE2 , and TFE3 included in a display device according to an exemplary embodiment. As shown in FIG. 7A , the encapsulation layer TFE1 may include n inorganic thin films IOL1 to IOLn including the first inorganic thin film IOL1 disposed on the cathode CE ( FIG. 6C ). In addition, the first inorganic thin film IOL1 may be disposed in direct contact with the cathode CE ( FIG. 6C ). The first inorganic thin film IOL1 may be defined as a lower inorganic thin film, and inorganic thin films other than the first inorganic thin film IOL1 among n inorganic thin films IOL1 to IOLn may be defined as upper inorganic thin films.

The encapsulation layer TFE1 includes n-1 organic thin films OL1 to OLn-1, and the n-1 organic thin films OL1 to OLn-1 include n inorganic thin films IOL1 to IOLn and They can be arranged alternately. The n−1 organic thin films OL1 to OLn−1 may have an average thickness greater than that of the n inorganic thin films IOL1 to IOLn.

Each of the n inorganic thin films IOL1 to IOLn may have a single layer including one material or multiple layers each including a different material. Each of n−1 organic thin films OL1 to OLn−1 may be formed by providing organic monomers. Organic monomers may include acrylic monomers. For example, each of the n−1 organic thin films OL1 to OLn−1 may be formed by coating a composition including an acrylic monomer. Specifically, the organic thin films OL1 to OLn-1 may be formed using an inkjet printing method. In an embodiment of the present invention, the encapsulation layer TFE1 may further include an nth organic thin film.

As shown in FIGS. 7B and 7C , the inorganic thin films included in each of the encapsulation layers TFE2 and TFE3 may have the same or different inorganic materials and may have the same or different thicknesses. The organic thin films included in each of the encapsulation layers TFE2 and TFE3 may have the same or different organic materials and may have the same or different thicknesses.

As shown in FIG. 7B , the encapsulation layer TFE2 includes a sequentially stacked first inorganic thin film IOL1, first organic thin film OL1, second inorganic thin film IOL2, second organic thin film OL2, and a third inorganic thin film IOL3.

The first inorganic thin film IOL1 may have a two-layer structure. The first sub-layer S1 and the second sub-layer S2 may include different inorganic materials.

As shown in FIG. 7C , the encapsulation layer TFE3 may include a first inorganic thin film IOL10, a first organic thin film OL1, and a second inorganic thin film IOL20 sequentially stacked. The first inorganic thin film IOL10 may have a two-layer structure. The first sub-layer S10 and the second sub-layer S20 may include different inorganic materials. The second inorganic thin film IOL20 may have a two-layer structure. The second inorganic thin film IOL20 may include a first sub-layer S100 and a second sub-layer S200 deposited in different deposition environments. The first sub-layer S100 may be deposited under a low power condition and the second sub-layer S200 may be deposited under a high power condition. The first sub-layer S100 and the second sub-layer S200 may include the same inorganic material.

Meanwhile, an inorganic layer may be further disposed on the encapsulation layer TFE. The inorganic layer may be a buffer layer. In one embodiment, the touch sensing unit TS may be disposed on top of a buffer layer disposed on the encapsulation layer TFE.

8 is a cross-sectional view of a touch sensing unit TS included in a display device according to an exemplary embodiment. The touch sensing unit TS may include a first conductive layer TS-CL1, a first insulating layer TS-IL1, a second conductive layer TS-CL2, and a second insulating layer TS-IL2. can The first conductive layer TS-CL1 may be directly disposed on the encapsulation layer TFE. However, the embodiment is not limited thereto, and another inorganic layer (eg, a buffer layer) may be further disposed between the first conductive layer TS-CL1 and the encapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 may have a single-layer structure or a multi-layer structure stacked in the third direction DR3. The conductive layer of the multilayer structure may include at least two or more layers of transparent conductive layers and metal layers. The multi-layered conductive layer may include metal layers containing different metals. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 includes a plurality of patterns. Hereinafter, it will be described that the first conductive layer TS-CL1 includes first conductive patterns and the second conductive layer TS-CL2 includes second conductive patterns. Each of the first conductive patterns and the second conductive patterns may include touch electrodes and touch signal lines.

Each of the first insulating layer TS-IL1 and the second insulating layer TS-IL2 may include an inorganic material or an organic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material includes at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. can do.

Each of the first insulating layer TS-IL1 and the second insulating layer TS-IL2 may have a single-layer or multi-layer structure. Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include at least one of an inorganic layer and an organic layer. The inorganic layer and the organic layer may be formed by chemical vapor deposition. Meanwhile, the laminated structure of the touch sensing unit is not limited to that shown in FIG. 8 . For example, the second touch insulating layer TS-IL2 of the touch sensing unit may be omitted.

The first insulating layer TS-IL1 is sufficient to insulate the first conductive layer TS-CL1 and the second conductive layer TS-CL2, and the shape is not limited. The shape of the first insulating layer TS-IL1 may be changed according to the shapes of the first conductive patterns and the second conductive patterns. The first insulating layer TS-IL1 may entirely cover the encapsulation layer TFE or may include a plurality of insulating patterns. It is sufficient if the plurality of insulating patterns overlap the first connection parts CP1 or the second connection parts CP2 to be described later.

In this embodiment, the two-layered touch sensing unit is shown as an example, but is not limited thereto. The single-layer touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes touch sensors and wiring parts connected to the touch sensors. The single-layered touch sensing unit may acquire coordinate information in a self-cap method.

9 to 19B describe a display device according to an exemplary embodiment. In the following description of the display device according to an exemplary embodiment, descriptions of overlapping contents with those described with reference to FIGS. 1 to 8 will not be described again, and differences will be mainly described.

9 is a plan view of a display device according to an exemplary embodiment. 10A to 10C are plan views of a touch sensing unit TS included in the display device of the exemplary embodiment of FIG. 9 . FIG. 10D shows an enlarged view of a portion of FIG. 10C. FIG. 11 is a cross-sectional view of a display device according to an exemplary embodiment corresponding to lines II′ of FIG. 9 .

The display device according to an embodiment includes a touch sensing unit (TS) disposed on a base substrate (SUB), a circuit layer (DP-CL), a light emitting element layer (DP-OLED), an encapsulation layer (TFE), and an encapsulation layer (TFE). , and a protruding member (DAM). The organic light emitting display panel DP may include a base substrate SUB, a circuit layer DP-CL, a light emitting element layer DP-OLED, and an encapsulation layer TFE. 9 and 11 , the display device DD according to an exemplary embodiment includes an organic light emitting display panel DP, a touch sensing unit TS and a protruding member DAM disposed on the organic light emitting display panel DP. can include

The description of FIG. 5B may be applied to the organic light emitting display panel DP as it is. The display device DD according to an exemplary embodiment may include a base substrate SUB divided into a display area DA and a non-display area NDA. Display device DD according to an exemplary embodiment includes a circuit layer DP-CL disposed on a base substrate SUB, and a light emitting element layer DP-CL disposed on a display area DA of the base substrate SUB. OLED) may be included. The encapsulation layer TFE may be disposed to cover the light emitting device layer DP-OLED.

In addition, the protruding member DAM may be disposed on the non-display area NDA of the base substrate SUB. At least one protruding member DAM may be disposed in the non-display area NDA. For example, one protruding member DAM or two or more protruding members DAM may be disposed in the non-display area NDA. In addition, when the protruding member DAM is disposed in the non-display area NDA, one protruding member DAM is disposed in a part of the non-display area NDA, and a plurality of protruding members DAM are disposed in the remaining portion. It can be. In addition, even when a plurality of protruding members DAM are disposed, the number of protruding members DAM disposed may vary according to the position of the non-display area NDA. In addition, the encapsulation layer TFE may be formed by the protruding member DAM. ) and extend into the non-display area NDA of the base substrate SUB. In this case, the encapsulation layer TFE covering the protruding member DAM may be formed of only the inorganic thin films IOL1 to IOLn ( FIG. 7A ) omitting the organic thin films OL1 to OLn−1 ( FIG. 7A ). However, the embodiment is not limited thereto, and the encapsulation layer TFE is interposed between the inorganic thin films IOL1 to IOLn (FIG. 7A) and the inorganic thin films IOL1 to IOLn (FIG. 7A) even in a portion covering the protruding member DAM. It may include all of the organic thin films OL1 to OLn-1 (FIG. 7A) disposed on. In addition, when a plurality of protruding members DAM are disposed, the encapsulation layer TFE surrounding the first protruding member DAM1, which is the protruding member DAM closer to the display area, includes inorganic thin films IOL1 to IOLn (FIG. 7A). It may include organic thin films OL1 to OLn-1 ( FIG. 7A ) disposed therebetween. In comparison, the encapsulation layer TFE surrounding the second protruding member DAM2 disposed outside the first protruding member DAM1 may be composed of only the inorganic thin films IOL1 to IOLn ( FIG. 7A ).

The protruding member DAM may be disposed on the non-display area NDA. The protruding member DAM may be disposed outside the display area DA. The protruding member DAM may be disposed to surround the display area DA. The protruding member DAM may include a first protruding member DAM1 disposed relatively adjacent to the display area DA and a second protruding member DAM2 disposed outside the first protruding member DAM1. . The second protruding member DAM2 may have a greater thickness in the third direction DR3 than the first protruding member DAM1. For example, the first protruding member DAM1 may prevent an organic monomer formed by coating the organic thin films OL1 to OLn-1 ( FIG. 7A ) from flowing outward.

The protruding member DAM may be composed of a plurality of layers. For example, the first protrusion member DAM1 may include two layers stacked, and the second protrusion member DAM2 may include three layers stacked. Meanwhile, although it is shown in FIG. 9 that the protruding member DAM is arranged to cover the entire display area DA, the embodiment is not limited thereto. For example, the protruding member DAM may be disposed to surround at least one side of the display area DA.

Although not shown in FIG. 9 , the display device according to an exemplary embodiment may further include a side protruding member (not shown) disposed on the non-display area NDA of the base substrate SUB. The side protruding member (not shown) may be disposed outside the second protruding member DAM2. For example, the side protruding member (not shown) may be disposed to extend in the first direction DR1 from the periphery of the second protruding member DAM2 . The side protruding member (not shown) may have a crack prevention function of absorbing an impact when an external stimulus is applied and preventing the impact from being transferred to the display area.

Also, the display device according to an exemplary embodiment may further include a bank unit BK disposed outside the second protruding member DAM2 and adjacent to the touch pad TS-PD. Meanwhile, the bank portion BK may be a third protruding member that is disposed outside the second protruding member DAM2 and extends in the second direction DR2 . The bank part BK is a spacer so that a mask used during the manufacturing process of the organic light emitting display panel DP and the touch sensing unit TS does not directly come into contact with the organic light emitting display panel DP or the touch sensing unit TS. may be functioning. The thickness of the bank portion BK may be higher than that of the first protruding member DAM1 or the second protruding member DAM2.

In one embodiment, the bank unit BK may be omitted. Also, in one embodiment, any one of a side protrusion member (not shown) and a bank portion may be omitted.

The touch sensing unit TS may be disposed on the encapsulation layer TFE. The touch sensing unit TS may include a touch electrode TE and a wiring part TW. The touch electrode TE may be disposed on the encapsulation layer TFE of the display area DA, and the wiring part TW may be connected to the touch electrode TE and disposed on the protruding member DAM. The wiring part TW may be disposed on the protruding member DAM along the step of the protruding member DAM. The wiring part TW may extend from the touch electrode TE and be connected to the touch pad TS-PD.

In the plan view of FIG. 9 , the touch sensing unit TS includes first touch electrodes TE1-1 to TE1-4 and first touch signal lines (connected to the first touch electrodes TE1-1 to TE1-4). SL1-1 to SL1-4), second touch electrodes TE2-1 to TE2-5, and second touch signal lines SL2- connected to the second touch electrodes TE2-1 to TE2-5. 1 to SL2-5). In addition, between the first touch electrodes TE1-1 to TE1-4 and the first touch signal lines SL1-1 to SL1-4 and to the second touch electrodes TE2-1 to TE2-5 Connection electrodes TSD may be disposed between the connected second touch signal lines SL2 - 1 to SL2 - 5 . The connection electrodes TSD are connected to ends of the first touch electrodes TE1 - 1 to TE1 - 4 and the second touch electrodes TE2 - 1 to TE2 - 5 to transfer signals. In another embodiment of the present invention, the connection electrodes TSD may be omitted.

Meanwhile, in FIG. 9 , the first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5 correspond to the touch electrode TE and the touch pad TS-PD. The connection between them corresponds to the wiring portion TW of the present invention. In FIG. 11 , the wiring part TW may represent any one of the first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5. there is. Also, the touch electrode TE shown in FIG. 11 may be any one of the first touch electrodes TE1-1 to TE1-4 or the second touch electrodes TE2-1 to TE2-5.

9 illustrates a touch sensing unit TS including four first touch electrodes TE1-1 to TE1-4 and five second touch electrodes TE2-1 to TE2-5. However, the embodiment is not limited thereto.

Each of the first touch electrodes TE1 - 1 to TE1 - 4 may have a mesh shape in which a plurality of touch openings are defined. Each of the first touch electrodes TE1-1 to TE1-4 includes a plurality of first touch sensor parts SP1 and a plurality of first connection parts CP1. The first touch sensor parts SP1 are arranged along the first direction axis DR1. Each of the first connection parts CP1 connects two adjacent first touch sensor parts SP1 among the first touch sensor parts SP1. Although not specifically illustrated, the first touch signal lines SL1 - 1 to SL1 - 4 may also have a mesh shape.

The second touch electrodes TE2-1 to TE2-5 insulate and cross the first touch electrodes TE1-1 to TE1-4. Each of the second touch electrodes TE2 - 1 to TE2 - 5 may have a mesh shape in which a plurality of touch openings are defined. Each of the second touch electrodes TE2-1 to TE2-5 includes a plurality of second touch sensor parts SP2 and a plurality of second connection parts CP2. The second touch sensor parts SP2 are arranged along the second direction axis DR2. Each of the second connection parts CP2 connects two adjacent second touch sensor parts SP2 among the second touch sensor parts SP2. The second touch signal lines SL2 - 1 to SL2 - 5 may also have a mesh shape.

The first touch electrodes TE1-1 to TE1-4 and the second touch electrodes TE2-1 to TE2-5 are electrostatically coupled. As the touch sensing signals are applied to the first touch electrodes TE1-1 to TE1-4, capacitors are formed between the first touch sensor units SP1 and the second touch sensor units SP2.

A plurality of first touch sensor parts SP1, a plurality of first connection parts CP1, and first touch signal lines SL1-1 to SL1-4, a plurality of second touch sensor parts SP2, a plurality of Some of the two second connection parts CP2 and the second touch signal lines SL2-1 to SL2-5 are formed by patterning the first conductive layer TS-CL1 shown in FIG. may be formed by patterning the second conductive layer TS-CL2 shown in FIG. 6A.

In order to electrically connect conductive patterns disposed on other layers, contact holes may be formed penetrating the first insulating layer TS-IL1 shown in FIG. 8 . Hereinafter, a touch sensing unit TS according to an exemplary embodiment will be described with reference to FIGS. 10A to 10C. 10A to 10C , the first to third protruding members DAM1 , DAM2 , and BK may be disposed in the non-display area NDA.

As shown in FIG. 10A , first conductive patterns are disposed on the encapsulation layer TFE. The first conductive patterns may include bridge patterns CP2. Bridge patterns CP2 are directly disposed on the encapsulation layer TFE. The bridge patterns CP2 correspond to the second connection parts CP2 shown in FIG. 9 .

As shown in FIG. 10B , a first insulating layer TS-IL1 covering the bridge patterns CP2 is disposed on the encapsulation layer TFE. Contact holes CH partially exposing the bridge patterns CP2 are defined in the first insulating layer TS-IL1. The contact holes CH may be formed by a photolithography process.

As shown in FIG. 10C , second conductive patterns may be disposed on the first insulating layer TS-IL1. The second conductive patterns include a plurality of first touch sensor parts SP1, a plurality of first connection parts CP1, first touch signal lines SL1-1 to SL1-4, and a plurality of second touch sensor parts. (SP2) and second touch signal lines SL2-1 to SL2-5. Although not separately illustrated, a second touch insulating layer TS-IL2 covering the second conductive patterns is disposed on the first touch insulating layer TS-IL1.

In another embodiment of the present invention, the first conductive patterns may include first touch electrodes TE1-1 to TE1-4 and first touch signal lines SL1-1 to SL1-4. The second conductive patterns may include second touch electrodes TE2-1 to TE2-5 and second touch signal lines SL2-1 to SL2-5. In this case, contact holes CH are not defined in the first touch insulating layer TS-IL1.

Also, in one embodiment of the present invention, the first conductive patterns and the second conductive patterns may be interchanged. That is, the second conductive patterns may include bridge patterns CP2.

FIG. 10D is an enlarged view of the “BB” region of FIG. 10C. As shown in FIG. 10D , the first touch sensor unit SP1 overlaps the non-emission area NPXA. The first touch sensor unit SP1 includes a plurality of first extension parts SP1-A extending in a fifth direction DR5 intersecting the first and second directions DR1 and DR2, and a fifth direction ( DR5) and a plurality of second extension parts SP1-B extending in the sixth direction DR6 crossing. The plurality of first extension parts SP1 -A and the plurality of second extension parts SP1 -B may be defined as mesh lines. The line width of the mesh line may be several microns.

The plurality of first extension parts SP1 -A and the plurality of second extension parts SP1 -B are connected to each other to form a plurality of touch openings TS-OP. In other words, the first touch sensor unit SP1 has a mesh shape having a plurality of touch openings TS-OP. Although it is illustrated that the touch openings TS-OP correspond to the light emitting areas PXA one-to-one, it is not limited thereto. One touch opening TS-OP may correspond to two or more light emitting areas PXA.

The light emitting areas PXA may have various sizes. For example, among the light emitting areas PXA, the light emitting areas PXA providing blue light and the light emitting areas PXA providing red light may have different sizes. Accordingly, the sizes of the touch openings TS-OP may also vary. In FIG. 10 , various sizes of the light emitting regions PXA are illustrated as an example, but are not limited thereto. The light emitting regions PXA may have the same size, and the touch openings TS-OP may also have the same size.

In the exemplary embodiment shown in FIGS. 9 and 10C , the protruding member DAM is disposed in the non-display area NDA, and the first protruding member DAM1 and the second protruding member DAM2 are disposed in the display area DA. The touch electrodes TE1-1 to TE1-4 and TE2-1 to TE2-5 may be surrounded and disposed. In addition, although the wiring part TW is shown passing only the protruding member DAM adjacent to the touch pad TS-PD, the embodiment is not limited thereto. The wiring part TW may be disposed to pass not only a portion adjacent to the touch pad TS-PD but also another portion of the protruding member DAM. For example, the second touch signal lines SL2-1 to SL2-5 of the wiring part TW include a first protruding member DAM1 and a second protruding member DAM2 extending in the first direction DR1. It may be arranged to pass at least one of them. Meanwhile, the bank part BK is a third protruding member and is disposed on one side of the outer edge of the second protruding member DAM2, and the wiring part TW may pass through the bank part BK and be connected to the touch pad TS-PD. there is.

FIG. 12 is an enlarged plan view of part “AA” of FIG. 9 . FIG. 12 is an enlarged plan view of the wiring part TW connecting the touch electrode and the touch pad TS-PD (FIG. 9). The touch electrode may be any one of the first touch electrodes TE1-1 to TE1-4 or the second touch electrodes TE2-1 to TE2-5. The wiring part TW may represent any one of the first touch signal lines SL1-1 to SL1-4 (FIG. 9) and the second touch signal lines SL2-1 to SL2-5 (FIG. 9). there is.

FIG. 13A is a cross-sectional view of a portion corresponding to lines II-II' in FIG. 12, and FIG. 13B is an enlarged plan view of a portion “CC” in FIG. 12. Referring to FIG. 13A and 13B illustrate an embodiment of the wiring part TW passing through the first protruding member DAM1 in the plan view of FIG. 12 .

Meanwhile, in FIG. 12 , after passing through the first protruding member DAM1 and passing through the wiring portion TW and the second protruding member DAM2 overlapping the first protruding member DAM1 and overlapping the second protruding member DAM2. Although the shape of the wiring part TW is shown as the same, the embodiment is not limited thereto. The shape of the second wire part TW2 overlapping the first protruding member DAM1 and the second wire part TW2 overlapping the second protruding member DAM2 may be different from each other.

12 shows a wiring part TW passing through the first protruding member DAM1 and the second protruding member DAM2, and the wiring part TW passes through the first protruding member DAM1 and the second protruding member DAM2. ) extends in the direction The wiring part TW may extend in the first direction DR1.

Referring to FIGS. 12 and 13A to 13B , the wiring part TW includes a first wiring part TW1 that does not overlap with the protruding member DAM and a second wiring part that overlaps with the protruding member DAM on a plane. TW2) and a connection wire part TWC disposed between the first wire part TW1 and the second wire part TW2. Meanwhile, the wiring part TW disposed between the first protruding member DAM1 and the second protruding member DAM2 corresponds to the first wiring part TW1 that does not overlap with the protruding member DAM.

13A to 13B are views illustrating the first protruding member DAM1 and the wiring portion TW passing through the first protruding member DAM1 in FIG. 12 . The first wiring part TW1 has a first wiring width W1, the second wiring part TW2 has a second wiring width W2, and the connection wiring part TWC has a first wiring width W1 and a third wiring width W3 smaller than the second wiring width W2. For example, the first wiring width W1 and the second wiring width W2 may be the same. However, the embodiment is not limited thereto, and the first wiring width W1 and the second wiring width W2 may be different from each other.

In the description of the present invention, the wiring widths W1, W2, and W3 of the first wiring part TW1, the second wiring part TW2, and the connection wiring part TWC are perpendicular to the extending direction of the wiring part TW. indicates the width in the direction of Hereinafter, in the description of the exemplary embodiment of the present invention, the wiring width of the wiring part indicates the width in a direction perpendicular to the extending direction of the wiring part on a plane. Referring to FIG. 12 , wiring widths W1 , W2 , and W3 may represent widths in a second direction DR2 perpendicular to the first direction DR1 in which the wiring part TW extends.

In an exemplary embodiment, the first wiring part TW1 is a part having a constant wiring width of the first wiring width W1, and the second wiring part TW2 has a wiring width of the second wiring width W2. It may be a part that is kept constant. However, the embodiment is not limited thereto. The first wiring part TW1 may have a partially different wiring width. Also, the second wiring part TW may have a partially different wiring width.

The connection wire part TWC may have a smaller width than the first wire part TW1 and the second wire part TW2 . The third wiring width W3 may indicate a minimum wiring width in the connection wiring part TWC. The connection wiring part TWC may be disposed to overlap the edge DM-E of the protruding member DAM. For example, a portion of the connection wiring portion TWC having the third wiring width W3, which is the minimum wiring width, may overlap the protruding member edge DM-E.

Referring back to FIG. 13B , the ratio of the first wiring width W1 of the first wiring part TW1 to the third wiring width W3 of the connection wiring part TWC may be 1:0.3 or more and less than 1:1. . For example, the first wiring width W1 may be 8 μm or more and 15 μm or less, and the third wiring width W3 may be 4 μm or more and 10 μm or less. The first wiring width W1 may be 10 μm or more and 12 μm or less, and the third wiring width W3 may be 6 μm or more and 8 μm or less. When the third wiring width W3 is less than 4 μm, disconnection of the wiring part may occur, and when the wiring width W3 exceeds 10 μm, a gap between adjacent connection wiring parts is narrowed and a short circuit may occur.

A length L of the connection wire part TWC in the extension direction of the wire part TW may be 5 μm or more and 50 μm or less. That is, the distance between the first wire part TW1 and the second wire part TW2 extending in the first direction DR1 may be 5 μm or more and 50 μm or less. Meanwhile, the central portion of the connection wire portion TWC and the edge DM-E of the protruding member may overlap. For example, a portion overlapping the protruding member DAM1 and a portion not overlapping the protruding member DAM1 of the connection wiring portion TWC may have the same length.

For example, when the length L of the connection wire part TWC in the first direction DR1 is 50 μm, the first wire part TW1 overlaps with the protruding member edge DM-E as a reference. ) is L1, and when the length from the portion overlapping the protruding member edge DM-E to the second wire portion TW2 is L2, both L1 and L2 may be 25 μm. However, the embodiment is not limited thereto, and L1 and L2 may be different from each other. In this case, L1 may be the length of a portion of the connection wire portion TWC that does not overlap with the protruding member DAM1, and L2 may be the length of a portion of the connection wire portion TWC that overlaps with the protruding member DAM2.

In the wiring part TW, the connection wiring part TWC may be a part having a notch shape. Referring to FIG. 13B, the connection wiring part TWC includes a first sub-connection part TWC-1 having a wiring width smaller than the first wiring width W1, and the first wiring part TW1 and the first sub-connection part TWC. -1) to include a second sub connection part TWC-2 disposed between the second wiring part TW2 and a third sub connection part TWC-3 disposed between the first sub connection part TWC-1. can The first sub connection part TWC- 1 may be a part having a third wiring width W3 which is the minimum width in the connection wiring part TWC. Referring to FIG. 13B , the first sub-connecting portion TWC-1 of the connection wiring portion TWC may overlap the protruding member edge DM-E.

The wiring width of the second sub-connection part TWC-2 may gradually increase in the direction from the first sub-connection part TWC-1 to the first wiring part TW1. Also, the wiring width of the third sub-connecting part TWC-3 may gradually increase in the direction from the first sub-connecting part TWC-1 to the second wiring part TW2. For example, the edges of the second sub-connection part TWC-2 and the third sub-connection part TWC-3 may be curved. In addition, although not shown in the drawing, the edge of the second sub-connection part TWC-2 or the third sub-connection part TWC-3 may have a straight line shape.

Referring to FIG. 13A, the first protruding member DAM1 has a bottom surface BS, an upper surface US opposite to the bottom surface BS, and a side surface connecting the bottom surface BS and the top surface US ( SS) may be included. The side surface SS may be inclined with respect to the bottom surface BS. For example, the first protruding member DAM1 may have a trapezoidal shape in a cross section perpendicular to the base substrate SUB. That is, the first protruding member DAM1 has a shape in which the width of the dam gradually decreases from the bottom surface BS to the upper surface US on a plane defined by the first direction DR1 and the third direction DR3. can be An area of the bottom surface BS of the protruding member DAM may be greater than or equal to an area of the top surface US. On the other hand, although not shown separately in the drawings, the protruding member may be a plurality of layers stacked.

In FIG. 13A, only the first protruding member DAM1 and the wiring portion TW passing through the first protruding member DAM1 are shown, but the second protruding member DAM2 of FIG. 12 is also the same as the first protruding member DAM1. It may have a shape. However, the embodiment is not limited thereto, and the first protruding member DAM1 and the second protruding member DAM2 may have different shapes. For example, the first protruding member DAM1 and the second protruding member DAM2 may have different heights. The height of the second protruding member DAM2 may be higher than the height of the first protruding member DAM1.

14A to 14B are diagrams illustrating an example in which the protruding member DAM is formed of a plurality of layers in the display device according to the exemplary embodiment shown in FIG. 9 . 14A to 14B illustratively show a case in which the first protruding member DAM1 is stacked in two layers.

FIG. 14A is a cross-sectional view of a portion corresponding to lines II-II' in FIG. 12, and FIG. 14B is an enlarged plan view of a portion “CC” in FIG. 12. Referring to FIG. 14A and 14B are views of the wiring part TW passing through the first protruding member DAM1 in the plan view of FIG. 12 . 14C is a cross-sectional view illustrating the first protruding member DAM1 of FIG. 14A.

When the first protruding member DAM1 is viewed in a cross section perpendicular to the base substrate SUB, the lower protrusion DAM1-B and the lower protrusion DAM1 have a first width D1 and are disposed on the base substrate SUB. -B) and may include an upper protrusion DAM1-T having a second width D2.

Each of the upper and lower protrusions DAM1 -T and DAM1 -B may include bottom surfaces BS1 and BS2 , top surfaces US1 and US2 , and side surfaces SS1 and SS2 . The bottom surfaces BS1 and BS2 and the top surfaces US1 and US2 are opposite to each other, and the side surfaces SS1 and SS2 are disposed between the bottom surfaces BS1 and BS2 and the top surfaces US1 and US2 to form a bottom surface. It may be a surface connecting (BS1, BS2) and the upper surface (US1, US2). For example, the side surfaces SS1 and SS2 may be inclined surfaces inclined with respect to the bottom surfaces BS1 and BS2, respectively. Also, the bottom surface BS2 of the upper protrusion DAM1 -T may be a part of the upper surface US1 of the lower protrusion DAM1 -B.

In the cross-sections shown in FIGS. 14A and 14C , each of the lower protrusion DAM1-B and the upper protrusion DAM1-T may have a trapezoidal shape. That is, each of the upper and lower protrusions DAM1-T and DAM1-B may have a trapezoidal shape in which the width of the dam gradually decreases from the bottom surfaces BS1 and BS2 to the upper surfaces US1 and US2.

Widths of the lower protrusion DAM1 -B and the upper protrusion DAM1 -T may be different from each other. A first width D1 of the bottom surface BS1 of the lower protrusion DAM1-B and a second width D2 of the bottom surface BS2 of the upper protrusion DAM1-T may be different from each other. The first width D1 of the lower protrusion DAM1 -B may be greater than the second width D2 of the upper protrusion DAM1 -T. The upper protrusion DAM1 -T may be disposed on the lower protrusion DAM1 -B such that a part of the upper surface US1 of the lower protrusion DAM1 -B is exposed. That is, the lower protrusion DAM1-B may include a portion overlapping the upper protrusion DAM1-T and a portion that is exposed and does not overlap the upper protrusion DAM1-T. For example, the first protrusion member DAM1 may have a step shape by stacking a lower protrusion DAM1-B and an upper protrusion DAM1-T having different widths.

Meanwhile, in FIGS. 14A to 14C , the first protruding member DAM1 and the wiring part TW passing through the first protruding member DAM1 are illustrated, but the embodiment is not limited thereto. The shape of the protruding member illustrated in FIGS. 14A to 14C may also be applied to the second protruding member DAM2 shown in FIG. 12 .

In the first protruding member DAM1 including the lower protrusion DAM1-B and the upper protrusion DAM1-T stacked in steps, the lower protrusion DAM1-B exposed without overlapping the upper protrusion DAM1-T. The exposure width D3 of the exposed portion of may be 5 μm or more and 30 μm or less. For example, the exposure width D3 may be 10 μm or more and 25 μm or less, and specifically, the exposure width D3 may be 15 μm or more and 20 μm or less.

The first width D1 of the bottom surface BS1 of the lower protrusion DAM1-B may be greater than or equal to 60 μm and less than or equal to 80 μm. Specifically, the first width D1 may be greater than or equal to 65 μm and less than or equal to 75 μm. The width of the bottom surface BS2 of the upper protrusion DAM1-T, which is the second width D2, may be greater than or equal to 10 μm and less than or equal to 60 μm. Specifically, the second width D2 may be greater than or equal to 30 μm and less than or equal to 50 μm.

A ratio of the first width D1 of the lower protrusion DAM1-B to the exposed width D3 of the exposed portion of the lower protrusion DAM1-B may be 1:0.01 or more and 1:0.4 or less. As the exposure width D3 increases, a short circuit phenomenon between adjacent wiring parts TW and connection wiring parts TWC may be improved. However, when the ratio of D1:D3 is greater than 1:0.4, the area of the upper protrusion DAM1-T is reduced, so that the wiring portion TW passing through the upper protrusion DAM1-T cannot be stably disposed.

The height H1 of the lower protrusion DAM1-B may be greater than or equal to 2 μm and less than or equal to 5 μm. Specifically, the height H1 of the lower protrusion DAM1-B may be greater than or equal to 2 μm and less than or equal to 3 μm. As the ratio of the exposed width D3 of the lower protrusion to the height H1 of the lower protrusion increases, the wiring unit can be stably disposed on the protruding member. The ratio may be greater than 1:1 and less than or equal to 1:15. When the ratio between the exposed width D3 of the lower protrusion and the height H1 of the lower protrusion is 1:1 or less, or when the ratio between the exposed width D3 and the height H1 of the lower protrusion exceeds 1:15, the connection wiring unit is stable. cannot be formed Specifically, the ratio between the exposed width D3 of the lower protrusion and the height H1 of the lower protrusion may be greater than 1:1 and less than 1:5.

Also, the height H2 of the upper protrusion DAM1-T may be 2 μm or more and 5 μm or less. Specifically, the height H2 of the upper protrusion DAM1-T may be greater than or equal to 2 μm and less than or equal to 3 μm. For example, the height H2 of the upper protrusion DAM1-T may be smaller than the height H1 of the lower protrusion DAM1-B. However, the embodiment is not limited thereto, and the height H2 of the upper protrusion DAM1-T and the height H1 of the lower protrusion DAM1-B may be the same.

Meanwhile, the first protruding member DAM1 shown in FIG. 14A may be formed during the manufacturing process of the organic light emitting display panel. The first protruding member DAM1 may be manufactured in the same process as forming the device layer DP-OLED. For example, the lower protrusion DAM1 -B and the upper protrusion DAM1 -T may be manufactured at the same time as forming the pixel defining layer PDL ( FIG. 6B ), but the embodiment is not limited thereto.

In the exemplary embodiment illustrated in FIGS. 14A and 14B , the second wiring part TW2 overlapping the first protruding member DAM1 may overlap the upper protruding part DAM1-T. The connection wire portion TWC may overlap an edge of the lower protrusion DAM1-B of the first protrusion member DAM1. The first sub-connection part TWC-1 having the third width W3 of the connection wiring part TWC overlaps the edge of the lower protruding part DAM1-B, and the second wiring part TW2 and the first sub-connection part The third sub connection part TWC-3 connecting TWC-1 may overlap the edge of the upper protrusion part DAM1-T.

15A and 15B are diagrams illustrating example embodiments of shapes of a wiring part TW including a connection wiring part TWC. The wiring part of the embodiment illustrated in FIGS. 15A and 15B has a different shape of the connection wiring part TWC compared to the wiring part TW shown in FIGS. 13B and 14B .

On the other hand, the shape of the wiring part TW shown in FIGS. 13B and 14B and the shape of the wiring part TW shown in FIGS. 15A to 15B represent one embodiment, and the connection wiring part of the wiring part TW ( TWC) shape is not limited thereto.

Referring to FIG. 15A , the connection wiring part TWC may be a part in which the wiring width is constantly maintained at the third wiring width W3. The first wiring part TW1, the connection wiring part TWC, and the second wiring part TW2 may be distinguished by a difference in wiring width. For example, compared to the connection wiring part TWC in the embodiment shown in FIG. 13B, in the embodiment of FIG. 15A, the first wiring part TW1 maintained constant with the first wiring width W1, and A curved sub-connection wiring part may be omitted between the connection wiring parts TWC having the third wiring width W3 smaller than the first wiring width W1 . In addition, the curved sub connection wiring part may be omitted even between the connection wiring part TWC and the second wiring part TW2 whose wiring width is constantly maintained at the second wiring width W2. That is, in the wiring part TW of the embodiment of FIG. 15A , the sub connection part having a curved edge between the first wiring part TW1 and the connection wiring part TWC may be omitted. For example, compared to the wiring part TW in the embodiment shown in FIG. 13B , at least one of the second sub connection part TWC-2 and the third sub connection part TWC-3 may be omitted. .

Referring to FIG. 15B , the connection wire part TWC may be a concave portion between the first wire part TW1 and the second wire part TW2 . For example, the connection wiring part TWC may be a part concave inward with respect to the virtual line IML connecting the edge portions of the first wiring part TW1 and the second wiring part TW2. there is.

Meanwhile, although not shown in FIGS. 15A and 15B , the connection wiring part TWC is disposed between the first wiring part TW1 and the second wiring part TW2 and the first wiring part TW1 and the second wiring part ( Any shape in which the edge of the connection wiring unit TWC is disposed inward with respect to the imaginary line connecting the edge portions of TW2) may be used without limitation.

FIG. 16 may be an enlarged plan view of a portion corresponding to area “AA” of FIG. 9 . 16 may have a different shape of the second wiring part TW2 overlapping the protruding member compared to the embodiment of FIG. 12 . Meanwhile, as shown in FIG. 16 , the shape of the wiring part TW passing through the first protruding member DAM1 and the second protruding member DAM2 may be the same, but the embodiment is not limited thereto. For example, the wiring part TW passing through the first protruding member DAM1 may have a shape shown in FIG. 14B on a plane.

17A and 17B may show an example of the second protruding member DAM2 and the wiring portion TW passing through the second protruding member DAM2 in FIG. 16 . FIG. 17A may be a cross-section of a surface corresponding to III-III' in FIG. 16 . FIG. 17B may be an enlarged plan view of an area “EE” in FIG. 16 . In the embodiment of FIG. 17A, the second protrusion member DAM2 is exemplified and described, and the second protrusion member DAM2 in the embodiment of FIG. It may be of a different shape.

Referring to FIG. 17A , the second protrusion member DAM2 includes a base protrusion DAM2-U, a second lower protrusion DAM2-B, and a second upper protrusion DAM2-T sequentially stacked in the thickness direction. can include The second protruding member DAM2 may be formed in the process of manufacturing the organic light emitting display panel. For example, the base protrusion DAM2-U of the second protrusion member DAM2 may be formed in the same process as the circuit layer DP-CL, and the second lower protrusion DAM2-B and the second upper protrusion DAM2-B may be formed together. (DAM2-T) may be manufactured at the same time as forming the pixel defining layer (PDL, FIG. 6B) of the device layer (DP-OLED). However, the embodiment is not limited thereto, and the second protruding member DAM2 may be formed by a process different from the suggested process.

In the second protruding member DAM2, the base protrusion DAM2-U, the second lower protrusion DAM2-B, and the second upper protrusion DAM2-T may be stacked in a step shape. The base protrusion DAM2-U has a first width D1, the second lower protrusion DAM2-B has a second width D2, and the second upper protrusion DAM2-T has a fourth width ( D4) may have. Also, when the second lower protrusion DAM2-B is disposed on the base protrusion DAM2-U. An upper surface of the base protrusion DAM2-U may be exposed. When the exposed width of the exposed base protrusion DAM2-U is the third width D3, the ratio of the first width D1 and the exposed width D3 of the base protrusion DAM2-U is 1:0.1. It may be more than 1:0.4 or less. Also, when the second upper protrusion DAM2-T is disposed on the second lower protrusion DAM2-B, the difference between the second width D2 and the exposure width D5 of the second lower protrusion DAM2-B is The ratio may be 1:0.1 or more and 1:0.4 or less.

17A and 17B, the wiring part TW passing through the second protruding member DAM2 includes the first wiring part TW1 that does not overlap with the second protruding member DAM2, and the second protruding member ( It may include a second wire part TW2 overlapping DAM2 and a connection wire part TWC disposed between the first wire part TW1 and the second wire part TW2. The connection wire part TWC connects the first wire part TW1 and the second wire part TW2 and may overlap the edge DM-E of the second protruding member DAM2.

In addition, the second wiring portion TW2 overlapping the second protruding member DAM2 includes a first sub-wiring portion TW2-1 having a first sub-wiring width W4 greater than the first wiring width W1; The second sub-wiring part TW2-2 and the first sub-wiring part TW2-1 extending from the connection wiring part TWC and having a second wiring width W2 smaller than the first sub-wiring width W4; A third sub-wiring unit TW2 - 3 disposed between the second sub-wiring units TW2 - 2 may be included. In this case, the wiring width of the second sub-wiring part TW2 - 2 may be the same as the first wiring width W1 that is the wiring width of the first wiring part TW1 .

The wiring width of the third sub-wiring part TW2 - 3 may decrease from the first sub-wiring part TW2 - 1 toward the second sub-wiring part TW2 - 2 . The third sub-wiring part TW2 - 3 may be disposed to overlap an edge of the second upper protruding part DAM2 - T of the second protruding member DAM2 .

That is, in the embodiment shown in FIGS. 17A and 17B , the wiring part TW has a notch shape in which the connection wiring part TWC overlapping the edge of the base protruding part DAM-U is formed concavely into the wiring part. can In addition, on the upper surface of the second upper protruding portion DAM2-T, which is the uppermost surface of the second protruding member DAM2, the second wiring portion TW2 does not overlap with the second protruding member DAM2. A first sub-wiring part TW2-1 protruding from TW1) may be included. The first sub-wiring part TW2 - 1 may have a wiring width larger than that of the first wiring part TW1 . That is, the second wire part TW2 may include a first sub-wire part TW2 - 1 that protrudes convexly with respect to the first wire part TW1 . For example, in the second wiring part TW2, the first sub-wiring part TW2-1 includes a protruding first sub-wiring part and overlaps the uppermost surface of the protruding member having a relatively small flat surface. Disconnection of the wiring part can be prevented by having a sufficient wiring width.

18A is a top plan view illustrating a protruding member and a wiring portion disposed past the protruding member in a display device according to an exemplary embodiment. FIG. 18A may be an enlarged plan view of a portion corresponding to area “AA” of FIG. 9 . 18A shows a second wiring part TW2a overlapping the first protruding member DAM1 and a second wiring part TW2b overlapping the second protruding member DAM2 compared to the exemplary embodiment of FIGS. 12 and 16 . It shows the case where the shape of is different from each other. FIG. 18B is a cross-sectional view of a surface corresponding to line IV-IV' in FIG. 18A.

In the description of FIGS. 18A and 18B , contents overlapping with the description of an embodiment of FIGS. 12 and 16 will not be described again, and the differences will be mainly described.

Referring to FIGS. 18A and 18B , the first protruding member DAM1 may be a protruding member in which two layers are stacked, and the second protruding member DAM2 may be a protruding member in which three layers are stacked. The first protruding member DAM1 includes a first lower protruding portion DAM1-B and a first upper protruding portion DAM1-T, and the second protruding member DAM2 includes a base protruding portion DAM2-U and a second lower protruding portion DAM2-U. A protrusion part DAM2-B and a second upper protrusion part DAM2-T may be included.

In an embodiment, the first lower protrusion DAM1 -B and the second lower protrusion DAM2 -B may be manufactured in the same process. Also, the first upper protrusion DAM1-T and the second upper protrusion DAM2-T may be manufactured in the same process. For example, the first lower protrusion DAM1-B and the second lower protrusion DAM2-B, and the first upper protrusion DAM1-T and the second upper protrusion DAM2-T may include an organic light emitting display panel ( It may be formed in the same process as the process of forming the pixel defining layer (PDL of FIG. 6C ) of DP). Also, the base protrusion DAM2-U of the second protrusion member DAM2 may be formed in the same process as the process of forming the circuit layer DP-CL.

18A and 18B , the second wiring part TW2a disposed on the second protruding member DAM2 overlaps the second upper protruding part DAM2-T and the first sub-wiring part TW2-1. ), the second sub-wire portion TW2-2 overlapping the exposed portion of the second lower protrusion DAM2-B and the gap between the second lower protrusion DAM2-B and the second upper protrusion DAM2-T. A third sub wiring part TW2 - 3 disposed in the stepped portion may be included.

When viewed from a plan view, the wiring part TW has a concave notch shape at portions overlapping the edges of the first protruding member DAM1 and the second protruding member DAM2. In addition, the second protruding member having a higher dam height than the first protruding member may include a convexly protruding portion of the second wiring portion TW2b.

In the protruding member formed by stacking a plurality of layers, the wiring part has a notch shape at the stepped part, and the wiring part has a shape protruding more convexly than other parts on the uppermost surface of the protruding member with a relatively small flat surface, so that the wiring as a whole Poor short-circuit defects or disconnection defects can be improved.

19A and 19B are cross-sectional and plan views in the case where the configuration of the connection part TW is different compared to the embodiment of FIGS. 14A and 14B described above. Referring to FIGS. 19A and 19B , the wiring part TW may have a double wiring structure.

In one embodiment, the wiring part TW may include a first metal layer MTL1 , an insulating layer ISL, a second metal layer MTL2 , and a contact hole CL. The first metal layer MTL1 may be disposed on the encapsulation layer TFE, and an insulating layer ISL may be disposed between the first metal layer MTL1 and the second metal layer MTL2 . Also, a plurality of contact holes CL may be disposed between the first metal layer MTL1 and the second metal layer MTL2 . The contact holes CL may electrically connect the first metal layer MTL1 and the second metal layer MTL2. The contact hole CL may be formed to pass through the insulating layer ISL. Resistance of the wiring part may be reduced by forming a double wiring structure in which the first metal layer MTL1 and the second metal layer MTL2 are stacked.

Also, in one embodiment, the contact hole CL may be disposed so as not to overlap with the connection wiring part TWC. The contact hole CL may be arranged so as not to overlap with the stepped portion of the protruding member. The contact hole CL is disposed on the flat surface of the encapsulation layer TFE and the flat surface of the upper protrusion DAM-T to improve electrical connection between the first metal layer MTL1 and the second metal layer MTL2. Resistance of the wiring part TW may be reduced.

In one embodiment described above with reference to FIGS. 9 to 19B , the shape of the wiring portion passing through the protruding member at a portion adjacent to the touch pad of the touch sensing unit is shown as an example, but the embodiment is not limited thereto. For example, the wiring part TW connected to the second touch electrodes TE2-1 to TE2-5 shown in FIG. 9 and extending in the second direction DR2 extends in the first direction DR1. The shape of the wiring unit according to the above-described embodiment may be applied even when the protruding member DAM is disposed to pass through. In addition, the wiring part not only passing through the protruding member DAM but also passing through the stepped structure may have a notch shape concavely recessed in the stepped portion of the structure.

In the display device according to an exemplary embodiment having the structure of the wiring unit described above, a short circuit defect between wiring units or a disconnection defect of the wiring units may be reduced.

20 is a cross-sectional view of a part of a photo process among processes of forming a wiring part of a touch sensing unit in a display device according to an exemplary embodiment. In one embodiment, the wiring part may be formed by patterning the metal layer TW-M deposited on the encapsulation layer TFE of the organic light emitting display panel DP in the process of FIG. 20 . A metal layer TW-M may be deposited on the encapsulation layer TFE, and an organic layer OM for patterning a wiring unit may be provided on the metal layer TW-M. The organic layer OM may be a photo resist material, for example, a negative type photo resist may be used as the organic layer OM. A mask MSK is placed on the organic light emitting display panel DP coated with the organic layer OM, UV light is provided to cure the organic layer OM, and then the uncured organic layer OM is removed to adjust the mask shape according to the shape of the mask. The organic layer OM is patterned. Thereafter, an etching process is performed to pattern the metal layer TW-M along the patterned organic layer OM. After patterning the metal layer (TW-M), a strip process is performed to remove the remaining organic layer (OM) to form a wiring part.

21A shows the shape of a conventional mask (MSK') used to form a wiring part. FIG. 21B is a diagram showing a wiring portion TW' formed using the mask MSK' shown in FIG. 21A.

In FIG. 21A , the mask MSK' may include a light transmission part OTA and a light blocking part OBA. In the mask MSK′ shown in FIG. 21A , the edge of the light transmitting portion OTA has a straight line shape. When the wiring part passing through the protruding member DAM' is formed using the mask MSK' having the shape shown in FIG. A short circuit may occur in the wiring part TW' because adjacent wiring parts TW' are connected to each other. This is because when the organic layer OM is provided for patterning the wiring part TW', the stacking height of the organic layer OM is increased at the portion where the protruding member DAM' has a step, so that the metal layer TW-M is etched. This is because the patterning quality of the negative (TW') edge portion is degraded. Due to the influence of the thick organic layer OM, the metal layer passing through the protruding member DAM' is not patterned to have a straight edge along the mask pattern, so that the distance between the adjacent patterned wiring parts TW' becomes closer. A short may occur partially in the wiring part.

22 illustrates a shape of a mask MSK1 used to form a wiring part in a display device according to an exemplary embodiment. The mask MSK1 includes a light transmission part OTA and a light blocking part OBA, and the shape of the light transmission part OTA is that of the wiring part TW of FIG. 12 formed on the protruding member DAM in the display device according to an exemplary embodiment. It may correspond to a shape.

22 illustrates the shape of the mask MSK1 disposed overlapping on the protruding member DAM. The light transmitting portion OTA of the mask MSK1 has a first width M1 at a portion that does not overlap with the protruding member DAM and has a second width M2 at a portion overlapping with the protruding member DAM. The connection portion overlapping the edge DM-E of the protruding member DAM may have a third width M3. In this case, the first width M1 and the second width M2 may be the same, and the third width M3 may be smaller than the first width M1 and the second width M2. For example, the first width M1 and the second width M2 of the light transmitting part OTA in the mask MSK1 are respectively the first wiring part TW1 among the wiring parts in the display device according to the exemplary embodiment shown in FIG. 12 . ) and the first wiring width W1 and the second wiring width W2, which are wiring widths of the second wiring part TW2. Also, the third width M3 of the light transmitting part OTA may correspond to the third wiring width W3 of the connection wiring part TWC.

When the wiring part is patterned using the shape of the mask MSK1 shown in FIG. 22, the light transmitting part OTA of the mask MSK1 has a first width M1 or A short circuit between wiring parts may be prevented by designing the third width M3 to be smaller than the second width M2. The portion where the light transmitting portion OTA of the mask MSK1 overlaps the edge DM-E of the protruding member DAM has a smaller third width M3 compared to the portion overlapping the protruding member DAM. , the thickness of the organic layer formed by the light passing through the mask transmission portion OTA of the third width M3 can be reduced. Therefore, the wiring parts formed by the subsequent etching process can be sufficiently spaced apart from each other at the portion overlapping the edge DM-E of the protruding member, so that a short circuit problem between wiring parts can be improved.

Meanwhile, when the protruding member is formed by stacking a plurality of layers and the area of the uppermost surface of the protruding member is smaller than the area of the lower protruding part, the wiring portion may be patterned using the mask MSK2 shown in FIG. 23 .

23 illustrates a shape of a mask MSK2 used to form a wiring part in a display device according to an exemplary embodiment. The mask MSK2 includes a light transmitting part OTA and a light blocking part OBA, and the shape of the light transmitting part OTA is the same as that of the wiring part TW of FIG. 16 formed on the protruding member DAM in the display device according to an exemplary embodiment. It may correspond to a shape.

23 illustrates the shape of the mask MSK2 disposed overlapping on the protruding member DAM. The light transmitting portion OTA of the mask MSK2 has a first width M1 at a portion that does not overlap with the protruding member DAM, and has a second width M2 at a portion overlapping with the protruding member DAM. and a portion having a fourth width M4 greater than the second width. In addition, a connection portion overlapping the edge DM-E of the protruding member DAM may have a third width M3. In this case, the first width M1 and the second width M2 may be the same, and the third width M3 may be smaller than the first width M1 and the second width M2. For example, the first width M1 and the second width M2 of the light transmitting part OTA in the mask MSK2 are respectively the first wiring part TW1 among the wiring parts in the display device according to the exemplary embodiment shown in FIG. 16 . ) and the first wiring width W1 and the second wiring width W2, which are wiring widths of the second wiring part TW2. Also, the third width M3 of the light transmitting part OTA may correspond to the third wiring width W3 of the connection wiring part TWC. The fourth width M4 of the light transmitting part OTA may correspond to the first sub wiring width W4 of the first sub wiring part TW2 - 1 .

When patterning the wiring part using the shape of the mask MSK2 shown in FIG. 23, the light transmitting part OTA of the mask MSK2 has a first width M1 or A short circuit between wiring parts may be prevented by designing the third width M3 to be smaller than the second width M2.

On the other hand, in the case of the top surface of the protruding member, when patterning the connecting portion using a conventional mask (MSK') due to the relatively small area, the etching degree of the metal layer becomes excessive at the edge portion of the uppermost layer of the protruding member, resulting in disconnection of the connecting portion. problems may occur.

In comparison, in the case of patterning the connecting portion using the mask MSK2 shown in FIG. 23, the wiring portion has a sufficient width by making the width of the light transmitting portion (OTA) of the mask on the uppermost layer of the protruding member relatively large. can be patterned so that the disconnection problem of the wiring part can be improved.

Therefore, in the display device according to an exemplary embodiment, a concave notch may be formed in the stepped portion of the protruding member to prevent a short circuit problem between adjacent wiring portions, and a convex protruding portion may be formed on the uppermost surface of the protruding member. Thus, the disconnection problem of the wiring part can be improved.

Meanwhile, in the display device according to an exemplary embodiment, the protruding member is disposed so that the lower protruding portion and the upper protruding portion are stacked in a step shape, and a flat surface is introduced on the protruding member, thereby reducing a short circuit problem between adjacent wiring portions.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art or those having ordinary knowledge in the art do not deviate from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that the present invention can be variously modified and changed within the scope not specified.

Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description of the specification, but should be defined by the claims.

DD : Display device TS : Touch sensing unit
TW: wiring part DAM, DAM1, DAM2: protruding member

Claims (13)

a base substrate divided into a display area and a non-display area adjacent to the display area;
a light emitting device layer disposed on the display area and including a pixel defining layer and an organic light emitting diode;
a touch sensing unit disposed on the light emitting element layer and including a touch electrode and a wiring unit connected to the touch electrode;
an encapsulation layer disposed between the light emitting element layer and the touch sensing unit; and
a protruding member disposed on the same layer as the pixel defining layer on the non-display area; including,
The wiring part is on a plane,
a first wiring portion non-overlapping with the protruding member and having a first wiring width;
a second wiring portion overlapping the protruding member and having a second wiring width; and
a third wiring portion having a third wiring width different from the first wiring width and the second wiring width, and disposed between the first wiring portion and the second wiring portion; including,
The first to third wiring widths are widths in a direction perpendicular to an extending direction of the wiring part. According to claim 1,
The display device of claim 1 , wherein the third wiring portion overlaps a periphery of an edge of the protruding member. According to claim 1,
The third wiring width is smaller than the first wiring width and the second wiring width. According to claim 1,
The third wiring part,
a first sub wiring unit;
a second sub-wiring unit disposed between the first wiring unit and the first sub-wiring unit; and
a third sub-wiring unit disposed between the second wiring unit and the first sub-wiring unit; including,
The display device of claim 1 , wherein the first sub wiring part overlaps a periphery of an edge of the protruding member. According to claim 4,
The wiring width of the second sub-wiring part increases in the direction of the first wiring part;
A wiring width of the third sub-wiring part increases toward the second wiring part. According to claim 1,
The protruding member,
a first protruding member adjacent to the display area; and
a second protruding member disposed outside the first protruding member; A display device comprising a. According to claim 6,
The height of the second protruding member is equal to or greater than that of the first protruding member. According to claim 1,
The encapsulation layer covers the protruding member. According to claim 1,
The encapsulation layer includes at least two inorganic layers and an organic layer disposed between the inorganic layers,
The display device of claim 1 , wherein the protruding member is covered with the at least two inorganic layers. According to claim 1,
The base substrate includes at least one bending area bent based on a bending axis extending in one direction and a non-bending area adjacent to the bending area. According to claim 1,
The display device further comprising an optical member disposed on the touch sensing unit and including a polarizing film. According to claim 1,
The touch sensing unit further includes a touch pad connected to the wiring part, and the protruding member is spaced apart from the touch pad. According to claim 1,
The display device of claim 1 , wherein the protruding member surrounds a periphery of the display area.

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