KR20230020304A - Thermally curable silicone resin composition and electronic device using the same - Google Patents
Thermally curable silicone resin composition and electronic device using the same Download PDFInfo
- Publication number
- KR20230020304A KR20230020304A KR1020210102224A KR20210102224A KR20230020304A KR 20230020304 A KR20230020304 A KR 20230020304A KR 1020210102224 A KR1020210102224 A KR 1020210102224A KR 20210102224 A KR20210102224 A KR 20210102224A KR 20230020304 A KR20230020304 A KR 20230020304A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- resin composition
- silicone resin
- weight
- parts
- Prior art date
Links
- 229920002050 silicone resin Polymers 0.000 title claims abstract description 45
- 239000011342 resin composition Substances 0.000 title claims abstract description 43
- -1 siloxane compounds Chemical class 0.000 claims abstract description 50
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 31
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 28
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 23
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 18
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 17
- 239000003054 catalyst Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 125000000524 functional group Chemical group 0.000 claims abstract description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 13
- 239000008393 encapsulating agent Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 9
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- YBUIRAZOPRQNDE-UHFFFAOYSA-N [dimethoxy(methyl)silyl]methyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)COC(=O)C(C)=C YBUIRAZOPRQNDE-UHFFFAOYSA-N 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 claims description 3
- 229960003493 octyltriethoxysilane Drugs 0.000 claims description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 3
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 3
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 claims description 3
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 claims description 3
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 3
- TUQLLQQWSNWKCF-UHFFFAOYSA-N trimethoxymethylsilane Chemical compound COC([SiH3])(OC)OC TUQLLQQWSNWKCF-UHFFFAOYSA-N 0.000 claims description 3
- 125000006702 (C1-C18) alkyl group Chemical group 0.000 claims description 2
- 230000009974 thixotropic effect Effects 0.000 abstract description 12
- 239000004205 dimethyl polysiloxane Substances 0.000 description 16
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 238000002156 mixing Methods 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
본 발명은 열경화성 실리콘 수지 조성물과 이를 이용한 전자소자에 관한 것으로서, 보다 상세하게는 자기 칙소성을 갖는 열경화성 실리콘 수지 조성물과 이를 봉지재로서 이용하는 전자소자에 관한 것이다.The present invention relates to a thermosetting silicone resin composition and an electronic device using the same, and more particularly, to a thermosetting silicone resin composition having self-thixotropic properties and an electronic device using the same as an encapsulant.
발광다이오드(LED), 트랜지스터, 집적회로(IC) 등의 전자 소자는 소자를 보호하면서 기능 저하를 방지하기 위하여 봉지재를 사용한다. 종래 전자소자의 봉지재로 에폭시 수지가 주로 사용되었는데, 에폭시 수지는 탄성율이 높아 온도 변화 시에 균열이 쉽게 발생하고, 내열성이 낮아, 예를 들어 발광다이오드의 봉지재로 장시간 사용 시 황색으로 변색되어 광학특성을 저하시키는 문제가 있었다. 이에, 내열ㆍ내한성, 전기 절연성, 내후성, 발수성, 투명성 등이 우수한 실리콘 수지가 봉지재로 널리 사용되고 있다.Electronic devices such as light emitting diodes (LEDs), transistors, and integrated circuits (ICs) use encapsulants to prevent functional degradation while protecting the devices. Epoxy resin has been mainly used as an encapsulant for conventional electronic devices. Epoxy resin has a high elastic modulus, easily cracks when the temperature changes, and has low heat resistance. There was a problem of lowering the optical characteristics. Accordingly, silicone resins having excellent heat and cold resistance, electrical insulation, weather resistance, water repellency, and transparency are widely used as encapsulants.
한편, 실리콘 수지를 전자소자의 봉지재로 사용하는 경우 실리콘 수지가 봉지 전 경화되거나 반대로 봉지 전 흐르는 문제를 방지하기 위하여 칙소성을 적절히 조절하여야 한다. 칙소성을 조절하기 위해 실리콘 수지에 필러 또는 기타 첨가제를 첨가하는 방법이 알려져 있는데, 필러 또는 기타 첨가제를 사용하는 경우 봉지재로서 요구되는 특성, 예를 들어 투명도 내지 투과성, 광확산성 등이 저하되는 문제가 있다. On the other hand, when using a silicone resin as an encapsulant for an electronic device, the thixotropy must be appropriately adjusted to prevent the silicone resin from curing before encapsulation or flowing before encapsulation. A method of adding fillers or other additives to silicone resins to adjust thixotropy is known. When fillers or other additives are used, properties required as encapsulants, such as transparency, transmittance, light diffusivity, etc. are lowered. there is a problem.
따라서, 자기 칙소성을 구현하면서도 봉지재로서 요구되는 특성을 보장할 수 있는 실리콘 수지 조성물이 요구되고 있다.Accordingly, there is a demand for a silicone resin composition capable of ensuring properties required as an encapsulant while implementing self-thixotropic properties.
본 발명은 상술한 종래기술의 문제점을 해결하기 위한 것으로서, 자기 칙소성을 가지면서도 투명도, 투과성, 광확산성 등이 우수한 열경화성 실리콘 수지 조성물을 제공하는데 그 목적이 있다. The present invention is to solve the problems of the prior art described above, and an object thereof is to provide a thermosetting silicone resin composition having excellent transparency, transmittance, light diffusivity, etc. while having magnetic thixotropic properties.
또한, 본 발명은 자기 칙소성을 갖는 열결화성 실리콘 수지 조성물의 경화물로 이루어지는 봉지재를 포함하는 전자소자를 제공하는 것에 그 목적이 있다.In addition, an object of the present invention is to provide an electronic device including an encapsulant made of a cured product of a thermosetting silicone resin composition having magnetic thixotropy.
본 발명의 일 실시예에 따른 열경화성 실리콘 수지 조성물은, 화학식 1의 알케닐기와 하이드록실기를 함유하는 MQ 구조의 실록산 화합물 및 화학식 2의 오르가노 폴리실록산 수지를 포함하는 자기 칙소성을 갖는 MQ 구조의 화합물; 알케닐기를 갖는 MDM 또는 MQ구조의 실록산 화합물; Si-H 기능기를 갖는 폴리실록산; 및 백금 촉매를 포함한다.A thermosetting silicone resin composition according to an embodiment of the present invention is a siloxane compound having an MQ structure containing an alkenyl group and a hydroxyl group of Formula 1 and an organopolysiloxane resin of Formula 2, and having a self-thixotropic MQ structure. compound; MDM or MQ structured siloxane compound having an alkenyl group; polysiloxanes with Si-H functional groups; and platinum catalysts.
[화학식 1][Formula 1]
[화학식 2][Formula 2]
화학식 1에서 R1a 내지 R6a는 서로 동일하거나 서로 다른 탄소 수 1 내지 18의 알킬기 또는 아릴기를 갖는 Q 구조의 화합물이며, R1a 내지 R6a 중 적어도 하나는 하이드록실기를 포함하고, R1b 내지 R6b 중 적어도 하나는 알케닐기를 갖는 말단의 M 구조 화합물이다. 또한, 화학식 2에서 R1 내지 R6 중 적어도 하나는 탄소 수 1 이상의 알콕시기이고, 또 다른 적어도 하나는 에폭시기, 비닐기, 하이드라이드기, 하이드록시기, 머캅토기이며, Ra 및 Rb는 탄소 수 1 내지 18의 알킬기 또는 아릴기이다.In Formula 1, R1a to R6a are compounds of the Q structure having the same or different C1-C18 alkyl or aryl groups, at least one of R1a to R6a includes a hydroxyl group, and at least one of R1b to R6b is It is a terminal M structural compound having an alkenyl group. In Formula 2, at least one of R 1 to R 6 is an alkoxy group having 1 or more carbon atoms, and at least one other is an epoxy group, a vinyl group, a hydride group, a hydroxyl group, or a mercapto group, and Ra and Rb is an alkyl group or an aryl group having 1 to 18 carbon atoms.
본 발명의 일 실시예에 따르면, 화학식 2의 오르가노 폴리실록산 수지는 비닐트리메톡시실란(Vinyltrimethoxysilane), 메타크릴옥시메틸메틸디메톡시실란(Methacryloxymethylmethyldimethoxysilane), 메타크릴옥시메틸트리에톡시실란(Methacryloxymethyltriethoxysilane), 3-메타크릴옥시프로필트리메톡시실란(3-Methacryloxypropyltrimethoxysilane), 메틸트리에톡시실란(Methyltriethoxysilane), 알릴트리에톡시실란(Allyltriethoxysilane), 옥틸트리에톡시실란(Octyltriethoxysilane), 테트라에톡시실란(Tetraethoxysilane), 트리메톡시페닐실란(Trimethoxyphenylsilane) 및 트리메톡시메틸실란 (Trimethoxymethylsilane)으로 이루어지는 군에서 선택되는 적어도 1종의 물질을 포함할 수 있다. According to one embodiment of the present invention, the organopolysiloxane resin of Chemical Formula 2 is vinyltrimethoxysilane, methacryloxymethylmethyldimethoxysilane, methacryloxymethyltriethoxysilane, 3-Methacryloxypropyltrimethoxysilane, Methyltriethoxysilane, Allyltriethoxysilane, Octyltriethoxysilane, Tetraethoxysilane , At least one material selected from the group consisting of trimethoxyphenylsilane and trimethoxymethylsilane may be included.
본 발명의 일 실시예에 따르면, 자기 칙소성을 갖는 MQ 구조의 화합물은 화학식 1의 알케닐기와 하이드록실기를 함유하는 MQ 구조의 화합물 100 중량부 및 화학식 2의 오르가노 폴리실록산 수지 0.1 내지 100 중량부를 포함할 수 있다. According to one embodiment of the present invention, the MQ structure compound having magnetic thixotropy is 100 parts by weight of the MQ structure compound containing an alkenyl group and a hydroxyl group of Formula 1 and 0.1 to 100 parts by weight of the organopolysiloxane resin of Formula 2 wealth may be included.
본 발명의 일 실시예에 따르면, 백금 촉매는 전체 열경화성 실리콘 수지 조성물에 대해서 0.01 내지 1000ppm으로 포함될 수 있다.According to one embodiment of the present invention, the platinum catalyst may be included in an amount of 0.01 to 1000 ppm based on the entire thermosetting silicone resin composition.
본 발명의 일 실시예에 따른 열경화성 실리콘 수지 조성물은 확산입자를 더 포함할 수 있다. 확산 입자는 Ti02, ZnO, ZrO2, SiO2, Al203, MgO 및 형광입자로 이루어지는 군에서 선택되는 적어도 1종의 물질을 포함할 수 있다. The thermosetting silicone resin composition according to an embodiment of the present invention may further include diffusion particles. The diffusion particles may include at least one material selected from the group consisting of TiO 2 , ZnO, ZrO 2 , SiO 2 , Al 2 O 3 , MgO, and fluorescent particles.
본 발명의 일 실시예에 따른 열경화성 실리콘 수지 조성물은 필러를 더 포함할 수 있다.The thermosetting silicone resin composition according to an embodiment of the present invention may further include a filler.
본 발명의 일 실시예에 따른 열경화성 실리콘 수지 조성물은 접착부여제를 더 포함할 수 있다.The thermosetting silicone resin composition according to an embodiment of the present invention may further include an adhesive agent.
본 발명의 일 실시예에 따른 열경화성 실리콘 수지 조성물은 자기 칙소성을 갖는 MQ 구조의 화합물 40 내지 60 중량부, 알케닐기를 갖는 MDM 또는 MQ구조의 실록산 화합물 20 내지 30 중량부, Si-H 기능기를 갖는 폴리실록산 10 내지 30 중량부 및 백금 촉매 0.01 내지 0.1 중량부를 포함할 수 있다.The thermosetting silicone resin composition according to an embodiment of the present invention contains 40 to 60 parts by weight of a magnetic thixotropic MQ structure compound, 20 to 30 parts by weight of an MDM or MQ structure siloxane compound having an alkenyl group, and a Si-H functional group. 10 to 30 parts by weight of polysiloxane and 0.01 to 0.1 parts by weight of a platinum catalyst.
본 발명의 일 실시예에 따른 전자소자는 상술한 열경화성 실리콘 수지 조성물의 경화물로 이루어지는 봉지재를 포함한다.An electronic device according to an embodiment of the present invention includes an encapsulant made of a cured product of the thermosetting silicone resin composition described above.
본 발명의 일 실시예에 따르면, 필러 또는 기타 첨가제의 첨가 없이도 열경화성 실리콘 수지 조성물에 자기 칙소성 특성을 부여할 수 있다.According to one embodiment of the present invention, it is possible to impart magnetic thixotropic properties to the thermosetting silicone resin composition without adding fillers or other additives.
또한, 투과성 및 확산성을 향상시킬 수 있어 우수한 특성의 전자소자 봉지재를 구현할 수 있다.In addition, since permeability and diffusivity can be improved, an electronic device encapsulant with excellent characteristics can be implemented.
이하, 첨부한 도면을 참조하여 본 발명의 바람직한 실시예에 대해 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있을 정도로 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the present invention will be described in detail so that those skilled in the art can easily practice it.
본 발명을 명확하게 설명하기 위하여 본 발명과 관계없는 부분의 설명은 생략하였다. 그리고 명세서에 기재되어 있는 특정 구조 및 특성은 본 발명의 사상 및 범위를 벗어나지 않으면서 일 실시예로부터 다른 실시예로 변경되어 구현될 수 있는 것으로 이해되어야 한다.In order to clearly describe the present invention, descriptions of parts not related to the present invention are omitted. And it should be understood that specific structures and characteristics described in the specification may be implemented by being changed from one embodiment to another without departing from the spirit and scope of the present invention.
따라서, 후술하는 상세한 설명은 한정적인 의미로서 행하여지는 것이 아니며, 본 발명의 범위는 청구범위의 청구항들이 청구하는 범위 및 그와 균등한 모든 범위를 포괄하는 것으로 받아들여져야 한다.Therefore, the detailed description to be described later is not performed in a limiting sense, and the scope of the present invention should be taken as encompassing the scope claimed by the claims and all scopes equivalent thereto.
본 명세서에서는 본 발명이 속하는 기술분야에서 관용적으로 사용되는 M 단위, D 단위, T 단위, Q 단위의 명칭을 사용한다. 오르가노 폴리실록산의 구조와 관용명의 관계는 다음과 같다. In this specification, the names of M unit, D unit, T unit, and Q unit commonly used in the technical field to which the present invention belongs are used. The relationship between the structure and common name of organopolysiloxane is as follows.
(R1 3SiO1/2）a 단위： M 단위(R 1 3 SiO 1/2 ) a unit: M unit
(R2 2SiO2/2）b 단위： D 단위(R 2 2 SiO 2/2 ) b unit: D unit
(R3 1SiO3/2）c 단위： T 단위(R 3 1 SiO 3/2 ) c unit: T unit
(SiO4/2）d 단위： Q 단위(SiO 4/2 ) d unit: Q unit
본 발명의 일 실시예에 따른 열경화성 실리콘 수지 조성물은 알케닐기와 하이드록실기를 함유하는 MQ 구조의 실록산 화합물 및 오르가노 폴리실록산 수지를 포함하는 자기 칙소성을 갖는 MQ 구조의 화합물; 알케닐기를 갖는 MDM 내지 MQ 구조의 실록산 화합물; Si-H 기능기를 갖는 폴리실록산; 백금; 및 확산입자를 포함할 수 있다.The thermosetting silicone resin composition according to an embodiment of the present invention includes an MQ structure compound having a self-thixotropic property including an alkenyl group and a hydroxyl group-containing MQ structure siloxane compound and an organopolysiloxane resin; MDM to MQ structure siloxane compound having an alkenyl group; polysiloxanes with Si-H functional groups; platinum; and diffusion particles.
본 발명의 일 실시예에 따르면, 자기 칙소성을 갖는 MQ 구조의 화합물은 알케닐기와 하이드록실기를 함유하는 MQ 구조의 실록산 화합물 및 오르가노 폴리실록산 수지를 포함하여 구성될 수 있다.According to one embodiment of the present invention, the MQ-structured compound having magnetic thixotropy may include an MQ-structured siloxane compound containing an alkenyl group and a hydroxyl group, and an organopolysiloxane resin.
본 발명의 일 실시예에 따르면, 알케닐기와 하이드록실기를 함유하는 MQ 구조의 실록산 화합물은 하기 화학식 1의 구조를 가진다.According to one embodiment of the present invention, the siloxane compound having an MQ structure containing an alkenyl group and a hydroxyl group has a structure represented by Formula 1 below.
[화학식 1][Formula 1]
화학식 1에서 R1a 내지 R6a는 서로 동일하거나 서로 다른 탄소 수 1 내지 18의 알킬기 또는 아릴기를 갖는 Q 구조의 화합물일 수 있으며, R1a 내지 R6a 중 적어도 하나는 하이드록실기를 포함할 수 있다. 또한, R1b 내지 R6b 중 적어도 하나는 알케닐기를 갖는 말단의 M 구조의 화합물을 포함할 수 있으며, 예를 들어 비닐 말단(vinyl terminated)의 M 구조의 화합물을 포함할 수 있다.In Formula 1, R1a to R6a may be the same as or different from each other and may be a compound having a Q structure having an alkyl group or an aryl group having 1 to 18 carbon atoms, and at least one of R1a to R6a may include a hydroxyl group. In addition, at least one of R1b to R6b may include a terminal M-structured compound having an alkenyl group, for example, a vinyl-terminated M-structured compound.
본 발명의 일 실시예에 따르면, 오르가노 폴리실록산 수지는 하기 화학식 2의 구조를 가진다.According to one embodiment of the present invention, the organopolysiloxane resin has a structure represented by Formula 2 below.
[화학식 2][Formula 2]
화학식 2에서 R1 내지 R6 중 적어도 하나는 탄소 수 1이상의 알콕시기일 수 있으며, 또 다른 적어도 하나는 에폭시기, 비닐기, 하이드라이드기, 하이드록시기, 머캅토기일 수 있다. 또한, 화학식 2에서 Ra 및 Rb는 탄소 수 1 내지 18의 알킬기 또는 아릴기일 수 있다.In Formula 2, at least one of R 1 to R 6 may be an alkoxy group having 1 or more carbon atoms, and at least one other may be an epoxy group, a vinyl group, a hydride group, a hydroxyl group, or a mercapto group. In Formula 2, Ra and Rb may be an alkyl group or an aryl group having 1 to 18 carbon atoms.
구체적으로, 오르가노 폴리실록산 수지는 비닐트리메톡시실란(Vinyltrimethoxysilane), 메타크릴옥시메틸메틸디메톡시실란(Methacryloxymethylmethyldimethoxysilane), 메타크릴옥시메틸트리에톡시실란(Methacryloxymethyltriethoxysilane), 3-메타크릴옥시프로필트리메톡시실란(3-Methacryloxypropyltrimethoxysilane), 메틸트리에톡시실란(Methyltriethoxysilane), 알릴트리에톡시실란(Allyltriethoxysilane), 옥틸트리에톡시실란(Octyltriethoxysilane), 테트라에톡시실란(Tetraethoxysilane), 트리메톡시페닐실란(Trimethoxyphenylsilane) 및 트리메톡시메틸실란 (Trimethoxymethylsilane) 및 이들의 혼합물로부터 선택된 것일 수 있다.Specifically, the organopolysiloxane resin is vinyltrimethoxysilane, methacryloxymethylmethyldimethoxysilane, methacryloxymethyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane. Silane (3-Methacryloxypropyltrimethoxysilane), Methyltriethoxysilane, Allyltriethoxysilane, Octyltriethoxysilane, Tetraethoxysilane, Trimethoxyphenylsilane and trimethoxymethylsilane, and mixtures thereof.
한편, 자기 칙소성을 갖는 MQ 구조의 화합물은 화학식 1의 알케닐기와 하이드록실기를 함유하는 MQ 구조의 실록산 화합물 100 중량부 및 화학식 2의 오르가노 폴리실록산 수지 0.1 내지 100 중량부를 포함하여 구성될 수 있다.Meanwhile, the MQ structure compound having magnetic thixotropy may include 100 parts by weight of an MQ structure siloxane compound containing an alkenyl group and a hydroxyl group of Formula 1 and 0.1 to 100 parts by weight of an organopolysiloxane resin of Formula 2. there is.
Si-H 기능기를 갖는 폴리실록산은 가교 결합제의 기능을 수행할 수 있으며, M 구조, D 구조, T 구조 또는 Q 구조에 적어도 하나 이상의 기능성기를 포함하여 구성될 수 있다.The polysiloxane having a Si-H functional group may function as a cross-linking agent and may include at least one functional group in the M structure, D structure, T structure, or Q structure.
백금 촉매는 실리콘의 열경화 반응을 촉진시키는 기능을 수행할 수 있으며, 전체 실리콘 수지 조성물에 대해서 0.01 내지 1000ppm의 범위로 포함될 수 있다.The platinum catalyst may perform a function of accelerating the thermal curing reaction of silicone, and may be included in a range of 0.01 to 1000 ppm with respect to the entire silicone resin composition.
확산입자는 Ti02, ZnO, ZrO2, SiO2, A1203, MgO 및 형광입자로 이루어진 군에서 선택된 적어도 1종의 물질을 포함할 수 있다.The diffusion particle may include at least one material selected from the group consisting of TiO 2 , ZnO, ZrO 2 , SiO 2 , A1 2 O 3 , MgO, and fluorescent particles.
본 발명의 일 실시예에 따르면, 상술한 열경화성 실리콘 수지 조성물의 경화물을 전자소자의 봉지재로 사용할 수 있다. 여기서 전자소자는, 예를 들어, 발광다이오드, 트랜지스터, 사이리스터, 집적회로(일체식 IC 및 혼성 IC)에 사용되는 반도체 소자 등일 수 있다.According to one embodiment of the present invention, the cured product of the thermosetting silicone resin composition described above may be used as an encapsulant for an electronic device. Here, the electronic device may be, for example, a light emitting diode, a transistor, a thyristor, or a semiconductor device used in an integrated circuit (integrated IC and hybrid IC).
이하에서는 실시예들을 통하여 열경화성 실리콘 수지 조성물의 특성을 구체적으로 설명한다.Hereinafter, the characteristics of the thermosetting silicone resin composition will be described in detail through examples.
실시예Example
실시예 1Example 1
(1) 자기 칙소성 화합물 제조(1) Manufacture of magnetic thixotropic compounds
3구 플라스크에 증류수 80ml, 염산 12ml, 톨루엔 100ml, 에탄올 20ml를 넣고, TMDVS(1,1,3,3-tetramethyl divinyl disiloxane) 0.2mol, HMD(hexamethyldisiloxane) 0.2mol, TEOS(Tetraethyl orthosilicate) 1mol을 투입하여 혼합한 후, 가열 교반하여 합성을 진행하여 조성물 A(MQ Resin)를 수득하였다. 제조된 조성물 A의 비닐기의 함량은 2.5mmol/g이고, 하이드록실기의 함량은 0.5%이다. 이어서, 조성물 A 60 중량부와 비닐기를 포함하는 폴리머 40 중량부를 혼합하고, 110℃에서 증류장치를 사용하여 톨루엔이 완전히 제거된 조성물 B(MQ/Polymer)를 제조하였다. 다음으로, 제조된 조성물 B 100 중량부에 3-Glycidoxypropyl trimethoxysilane(오르가노 실록산) 0.5 중량부를 물리적인 교반이 가능한 회전 교반기에서 반응시켜 자기 칙소성 화합물을 수득하였다.Put 80ml of distilled water, 12ml of hydrochloric acid, 100ml of toluene, and 20ml of ethanol in a three-necked flask, and add 0.2mol of TMDVS (1,1,3,3-tetramethyl divinyl disiloxane), 0.2mol of HMD (hexamethyldisiloxane), and 1mol of TEOS (Tetraethyl orthosilicate). After mixing by mixing, heating and stirring were performed to obtain composition A (MQ Resin). The content of the vinyl group of the prepared composition A is 2.5 mmol/g, and the content of the hydroxyl group is 0.5%. Subsequently, 60 parts by weight of Composition A and 40 parts by weight of a polymer containing a vinyl group were mixed, and composition B (MQ/Polymer) from which toluene was completely removed was prepared using a distillation apparatus at 110°C. Next, 0.5 parts by weight of 3-Glycidoxypropyl trimethoxysilane (organosiloxane) was reacted with 100 parts by weight of the prepared composition B in a rotary stirrer capable of physical stirring to obtain a magnetic thixotropic compound.
(2) 알케닐기를 갖는 실록산 화합물 제조(2) Preparation of a siloxane compound having an alkenyl group
3구 플라스크에 증류수 80ml, 염산 12ml, 톨루엔 100ml, 에탄올 20ml를 넣고, TMDVS(1,1,3,3-tetramethyl divinyl disiloxane) 0.5mol, HMD(hexamethyldisiloxane) 0.4mol, TEOS(Tetraethyl orthosilicate) 1mol을 투입한 후, 가열 교반하여 조성물 1(MQ Resin)을 수득하였다. 조성물 1의 비닐기의 함량은 2.5mmol/g이고, 하이드록실기의 함량은 0.5%이다. 이어서, 조성물 1 50 중량부와 비닐기를 포함하는 폴리머 50 중량부를 혼합하고, 110℃의 온도에서 증류장치를 사용하여 톨루엔이 완전히 제거된 조성물 2(알케닐기를 갖는 실록산 화합물)를 제조하였다. 조성물 2의 비닐기의 함량은 0.35mmol/g이고, 하이드록실기는 포함하지 않는다.Put 80ml of distilled water, 12ml of hydrochloric acid, 100ml of toluene, and 20ml of ethanol in a three-necked flask, and add 0.5mol of TMDVS (1,1,3,3-tetramethyl divinyl disiloxane), 0.4mol of HMD (hexamethyldisiloxane), and 1mol of TEOS (Tetraethyl orthosilicate). After heating and stirring, composition 1 (MQ Resin) was obtained. The content of vinyl groups in Composition 1 is 2.5 mmol/g, and the content of hydroxyl groups is 0.5%. Subsequently, 50 parts by weight of Composition 1 and 50 parts by weight of a polymer containing a vinyl group were mixed, and composition 2 (siloxane compound having an alkenyl group) from which toluene was completely removed was prepared using a distillation apparatus at a temperature of 110°C. The content of vinyl groups in Composition 2 is 0.35 mmol/g, and hydroxyl groups are not included.
(3) 실리콘 수지 조성물 제조(3) Preparation of silicone resin composition
자기 칙소성 화합물 60 중량부, 알케닐기를 갖는 실록산 화합물 24 중량부, 비닐기 폴리디메틸실록산 10 중량부, 하이드로젠기 폴리디메틸실록산 4.95 중량부, 접착부여제 1.0 중량부, 백금 촉매 0.05 중량부를 혼합하여 실리콘 수지 조성물을 얻었다. Mixing 60 parts by weight of a self-thixotropic compound, 24 parts by weight of a siloxane compound having an alkenyl group, 10 parts by weight of vinyl group polydimethylsiloxane, 4.95 parts by weight of hydrogen group polydimethylsiloxane, 1.0 part by weight of an adhesive agent, and 0.05 part by weight of a platinum catalyst Thus, a silicone resin composition was obtained.
실시예 2Example 2
실시예 1에서 제조된 자기 칙소성 화합물 50 중량부, 실시예 1에서 제조된 알케닐기를 갖는 실록산 화합물 29 중량부, 비닐기 폴리디메틸실록산 13 중량부, 하이드로젠기 폴리디메틸실록산 6.95 중량부, 접착부여제 1.0 중량부, 백금 촉매 0.05 중량부를 혼합하여 실리콘 수지 조성물을 얻었다. 50 parts by weight of the self-thixotropic compound prepared in Example 1, 29 parts by weight of the siloxane compound having an alkenyl group prepared in Example 1, 13 parts by weight of vinyl group polydimethylsiloxane, 6.95 parts by weight of hydrogen group polydimethylsiloxane, adhesion A silicone resin composition was obtained by mixing 1.0 parts by weight of a imparting agent and 0.05 parts by weight of a platinum catalyst.
실시예 3Example 3
실시예 1에서 제조된 자기 칙소성 화합물 40 중량부, 실시예 1에서 제조된 알케닐기를 갖는 실록산 화합물 30 중량부, 비닐기 폴리디메틸실록산 20 중량부, 하이드로젠기 폴리디메틸실록산 7.95 중량부, 접착부여제 1.0 중량부, 필러 1.0 중량부, 백금 촉매 0.05 중량부를 혼합하여 실리콘 수지 조성물을 얻었다. 40 parts by weight of the self-thixotropic compound prepared in Example 1, 30 parts by weight of the siloxane compound having an alkenyl group prepared in Example 1, 20 parts by weight of vinyl group polydimethylsiloxane, 7.95 parts by weight of hydrogen group polydimethylsiloxane, adhesion A silicone resin composition was obtained by mixing 1.0 parts by weight of a imparting agent, 1.0 parts by weight of a filler, and 0.05 parts by weight of a platinum catalyst.
실시예 4Example 4
실시예 1에서 제조된 자기 칙소성 화합물 40 중량부, 실시예 1에서 제조된 알케닐기를 갖는 실록산 화합물 30 중량부, 비닐기 폴리디메틸실록산 19 중량부, 하이드로젠기 폴리디메틸실록산 7.95 중량부, 접착부여제 1.0 중량부, 필러 2.0 중량부, 백금 촉매 0.05 중량부를 혼합하여 실리콘 수지 조성물을 얻었다. 40 parts by weight of the self-thixotropic compound prepared in Example 1, 30 parts by weight of the siloxane compound having an alkenyl group prepared in Example 1, 19 parts by weight of vinyl group polydimethylsiloxane, 7.95 parts by weight of hydrogen group polydimethylsiloxane, adhesion A silicone resin composition was obtained by mixing 1.0 parts by weight of a imparting agent, 2.0 parts by weight of a filler, and 0.05 parts by weight of a platinum catalyst.
실시예 5Example 5
실시예 1에서 제조된 자기 칙소성 화합물 50 중량부, 실시예 1에서 제조된 알케닐기를 갖는 실록산 화합물 29 중량부, 비닐기 폴리디메틸실록산 12 중량부, 하이드로젠기 폴리디메틸실록산 6.95 중량부, 접착부여제 1.0 중량부, 필러 1.0 중량부, 백금 촉매 0.05 중량부를 혼합하여 실리콘 수지 조성물을 얻었다.50 parts by weight of the self-thixotropic compound prepared in Example 1, 29 parts by weight of the siloxane compound having an alkenyl group prepared in Example 1, 12 parts by weight of vinyl group polydimethylsiloxane, 6.95 parts by weight of hydrogen group polydimethylsiloxane, adhesion A silicone resin composition was obtained by mixing 1.0 parts by weight of a imparting agent, 1.0 parts by weight of a filler, and 0.05 parts by weight of a platinum catalyst.
비교예 1Comparative Example 1
실시예 1에서 제조된 알케닐기를 갖는 실록산 화합물 50 중량부, 비닐기 폴리디메틸실록산 40 중량부, 하이드로젠기 폴리디메틸실록산 8.95 중량부, 접착부여제 1.0 중량부, 백금 촉매 0.05 중량부를 혼합하여 실리콘 수지 조성물을 얻었다.50 parts by weight of the siloxane compound having an alkenyl group prepared in Example 1, 40 parts by weight of vinyl polydimethylsiloxane, 8.95 parts by weight of hydrogen polydimethylsiloxane, 1.0 part by weight of an adhesive agent, and 0.05 part by weight of a platinum catalyst were mixed to form silicone. A resin composition was obtained.
비교예 2Comparative Example 2
실시예 1에서 제조된 알케닐기를 갖는 실록산 화합물 80 중량부, 비닐기 폴리디메틸실록산 14 중량부, 하이드로젠기 폴리디메틸실록산 4.95 중량부, 접착부여제 1.0 중량부, 백금 촉매 0.05 중량부를 혼합하여 실리콘 수지 조성물을 얻었다.80 parts by weight of the siloxane compound having an alkenyl group prepared in Example 1, 14 parts by weight of vinyl polydimethylsiloxane, 4.95 parts by weight of hydrogen polydimethylsiloxane, 1.0 part by weight of an adhesive agent, and 0.05 part by weight of a platinum catalyst were mixed to form silicone. A resin composition was obtained.
비교예 3Comparative Example 3
실시예 1에서 제조된 알케닐기를 갖는 실록산 화합물 60 중량부, 비닐기 폴리디메틸실록산 29 중량부, 하이드로젠기 폴리디메틸실록산 8.95 중량부, 접착부여제 1.0 중량부, 필러 1.0 중량부, 백금 촉매 0.05 중량부를 혼합하여 실리콘 수지 조성물을 얻었다.Siloxane compound having an alkenyl group prepared in Example 1 60 parts by weight, vinyl group polydimethylsiloxane 29 parts by weight, hydrogen group polydimethylsiloxane 8.95 parts by weight, adhesive agent 1.0 parts by weight, filler 1.0 parts by weight, platinum catalyst 0.05 parts by weight Parts by weight were mixed to obtain a silicone resin composition.
이처럼, 실시예 1 내지 5의 열경화성 실리콘 수지 조성물은 모두 자기 칙소성 화합물을 포함한다. 이 중 실시예 1 및 실시예 2는 자기 칙소성 화합물을 포함하면서 필러를 포함하지 않고, 실시예 3 내지 실시예 5는 자기 칙소성 화합물과 필러를 모두 포함한다. 반면에, 비교예 1 내지 3의 열경화성 실리콘 수지 조성물은 자기 칙소성 화합물을 포함하지 않는다. 그 중에서도 비교예 1 및 비교예 2는 자기 칙소성 화합물 및 필러를 모두 포함하지 않고, 비교예 3은 자기 칙소성 화합물을 포함하지 않으면서 필러를 포함한다.As such, all of the thermosetting silicone resin compositions of Examples 1 to 5 contain a self-thixotropic compound. Among them, Examples 1 and 2 contain the magnetic thixotropic compound but do not include a filler, and Examples 3 to 5 contain both the magnetic thixotropic compound and the filler. On the other hand, the thermosetting silicone resin compositions of Comparative Examples 1 to 3 do not contain a self-thixotropic compound. Among them, Comparative Example 1 and Comparative Example 2 do not contain both the magnetic thixotropic compound and the filler, and Comparative Example 3 does not contain the magnetic thixotropic compound and includes the filler.
평가방법Assessment Methods
실시예 및 비교예에 따라 수득한 샘플의 물성을 아래와 같은 방법으로 평가하였다.The physical properties of the samples obtained according to Examples and Comparative Examples were evaluated in the following manner.
(1) 점도 및 칙소성(1) Viscosity and thixotropy
Anton Paar의 Rheology 장비인 MCR-103을 사용하여 40 mm 원형의 콘 엔 플레이트 점도 측정장치를 사용하여 25 ℃의 온도에서 외부 응력의 shear rate(1/s)를 1, 10, 100의 조건에서 2분간 측정하였다. 점도는 shear rate 10의 조건에서의 측정값의 평균으로 계산하였으며, 칙소성은 shear rate 1과 10의 조건에서의 측정값의 평균값을 다음 식에 따라 계산하였다.Anton Paar's rheology equipment, MCR-103, was used to measure the external stress shear rate (1/s) at 25 ℃ using a 40 mm circular cone-and-plate viscosity measuring device at 1, 10, and 100 conditions of 2 minutes was measured. Viscosity was calculated as the average of the measured values under the condition of shear rate 10, and thixotropy was calculated as the average value of the measured values under the conditions of shear rate 1 and 10 according to the following equation.
(2) 투과도 및 확산도(2) transmittance and diffusivity
샘플을 1mm 두께로 만들 수 있는 고정틀에 투입하고, 경화 오븐을 이용하여 150℃에서 1시간 동안 경화시킨 다음, 투과도 측정장비(코니카미놀타 CM-3600A)를 사용하여 투과도 및 확산도를 측정하였다.The sample was put into a fixing frame capable of making a thickness of 1 mm, cured for 1 hour at 150 ° C. using a curing oven, and transmittance and diffusivity were measured using a transmittance measuring device (Konica Minolta CM-3600A).
(3) 경도(3) hardness
샘플을 10mm 두께로 만들 수 있는 고정틀에 투입하고, 경화 오븐을 이용하여 150℃에서 1시간 동안 경화시킨 다음, 경도 측정장비(ASKER DD4, Shore A)를 사용하여 경도를 측정하였다.The sample was put into a fixing frame capable of making a thickness of 10 mm, cured at 150 ° C. for 1 hour using a curing oven, and then hardness was measured using a hardness measuring device (ASKER DD4, Shore A).
(4) 형태안정성(4) shape stability
샘플을 동일한 부피로 토출할 수 있는 공압 장치를 고안하여 소수점 4자리를 인식할 수 있는 저울에 유리판을 올려놓고, 0.5g을 계량하여 상온에서 5시간 방치한 다음, 경화 오븐을 이용하여 150℃에서 1시간 동안 경화를 진행하였다. 경화 종료 후, 초기 샘플의 사이즈와 경화 후 샘플의 사이즈를 비교하여 형태안정성을 판단하였다. A pneumatic device capable of discharging the sample in the same volume is devised, a glass plate is placed on a scale that can recognize 4 decimal places, 0.5 g is weighed, left at room temperature for 5 hours, and then cured at 150 ° C using an oven. Curing proceeded for 1 hour. After completion of curing, shape stability was determined by comparing the size of the initial sample and the size of the sample after curing.
각 실시예 및 비교예의 평가 결과를 정리하면 아래 표 1과 같다.The evaluation results of each Example and Comparative Example are summarized in Table 1 below.
(shore A)Hardness
(shore A)
표 1을 참조하면, 자기 칙소성을 갖는 화합물을 포함하는 경우(실시예 1 내지 5), 자기 칙소성을 갖는 화합물을 포함하지 않는 경우(비교예 1 내지 3)보다 칙소성이 우수하고 일반적으로 점도도 높은 것을 확인할 수 있다. 또한, 자기 칙소성을 갖는 화합물을 포함하는 경우 나머지 특성, 즉 투과도, 확산도, 경도 및 형태안정성도 우수한 것을 확인할 수 있다. 특히, 열경화성 실리콘 수지 조성물이 자기 칙소성을 갖는 화합물을 포함함으로써 확산도와 형태안정성이 매우 우수하게 됨을 확인할 수 있다.Referring to Table 1, in the case of including a compound having magnetic thixotropy (Examples 1 to 5), the thixotropic property is superior to the case of not including a compound having magnetic thixotropy (Comparative Examples 1 to 3), and generally It can be confirmed that the viscosity is also high. In addition, it can be confirmed that the other properties, that is, transmittance, diffusivity, hardness and shape stability, are also excellent when the compound having magnetic thixotropy is included. In particular, it can be confirmed that the thermosetting silicone resin composition has very excellent diffusivity and shape stability by including a compound having magnetic thixotropy.
이상, 본 발명의 바람직한 실시예들을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 본 발명이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해되어야 한다.Although the preferred embodiments of the present invention have been described above, those skilled in the art can understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. There will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.
Claims (10)
알케닐기를 갖는 MDM 또는 MQ구조의 실록산 화합물;
Si-H 기능기를 갖는 폴리실록산; 및
백금 촉매;
를 포함하는 열경화성 실리콘 수지 조성물.
[화학식 1]
(여기서, R1a 내지 R6a는 서로 동일하거나 서로 다른 탄소 수 1 내지 18의 알킬기 또는 아릴기를 갖는 Q 구조의 화합물이며, R1a 내지 R6a 중 적어도 하나는 하이드록실기를 포함하고, R1b 내지 R6b 중 적어도 하나는 알케닐기를 갖는 말단의 M 구조의 화합물임)
[화학식 2]
(여기서, R1 내지 R6 중 적어도 하나는 탄소 수 1이상의 알콕시기이고, 또 다른 적어도 하나는 에폭시기, 비닐기, 하이드라이드기, 하이드록시기, 머캅토기이며, Ra 및 Rb는 탄소 수 1 내지 18의 알킬기 또는 아릴기임)A siloxane compound having an MQ structure including an alkenyl group and a hydroxyl group of Formula 1 and an MQ structure compound having magnetic thixotropy including an organopolysiloxane resin of Formula 2 below;
MDM or MQ structured siloxane compound having an alkenyl group;
polysiloxanes having Si-H functional groups; and
platinum catalyst;
Thermosetting silicone resin composition comprising a.
[Formula 1]
(Here, R1a to R6a are compounds of the Q structure having the same or different C1-C18 alkyl or aryl groups, and R1a to R6a includes a hydroxyl group, and at least one of R1b to R6b is a terminal M-structured compound having an alkenyl group)
[Formula 2]
(Wherein, at least one of R 1 to R 6 is an alkoxy group having 1 or more carbon atoms, and at least one other is an epoxy group, a vinyl group, a hydride group, a hydroxyl group, a mercapto group, and Ra and Rb is an alkyl group or an aryl group having 1 to 18 carbon atoms)
상기 화학식 2의 오르가노 폴리실록산 수지는 비닐트리메톡시실란(Vinyltrimethoxysilane), 메타크릴옥시메틸메틸디메톡시실란(Methacryloxymethylmethyldimethoxysilane), 메타크릴옥시메틸트리에톡시실란(Methacryloxymethyltriethoxysilane), 3-메타크릴옥시프로필트리메톡시실란(3-Methacryloxypropyltrimethoxysilane), 메틸트리에톡시실란(Methyltriethoxysilane), 알릴트리에톡시실란(Allyltriethoxysilane), 옥틸트리에톡시실란(Octyltriethoxysilane), 테트라에톡시실란(Tetraethoxysilane), 트리메톡시페닐실란(Trimethoxyphenylsilane) 및 트리메톡시메틸실란 (Trimethoxymethylsilane)으로 이루어지는 군에서 선택되는 적어도 1종의 물질을 포함하는, 열경화성 실리콘 수지 조성물.According to claim 1,
The organopolysiloxane resin of Formula 2 is vinyltrimethoxysilane, methacryloxymethylmethyldimethoxysilane, methacryloxymethyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane. 3-Methacryloxypropyltrimethoxysilane, Methyltriethoxysilane, Allyltriethoxysilane, Octyltriethoxysilane, Tetraethoxysilane, Trimethoxyphenylsilane ) And a thermosetting silicone resin composition containing at least one material selected from the group consisting of trimethoxymethylsilane.
상기 자기 칙소성을 갖는 MQ 구조의 화합물은 상기 화학식 1의 알케닐기와 하이드록실기를 함유하는 MQ 구조의 화합물 100 중량부 및 상기 화학식 2의 오르가노 폴리실록산 수지 0.1 내지 100 중량부를 포함하는, 열경화성 실리콘 수지 조성물.According to claim 1,
The MQ structure compound having magnetic thixotropy includes 100 parts by weight of the MQ structure compound containing an alkenyl group and a hydroxyl group of Formula 1 and 0.1 to 100 parts by weight of an organopolysiloxane resin of Formula 2, thermosetting silicone resin composition.
상기 백금 촉매는 전체 열경화성 실리콘 수지 조성물에 대해서 0.01 내지 1000ppm으로 포함되는, 열경화성 실리콘 수지 조성물.According to claim 1,
The platinum catalyst is contained in 0.01 to 1000ppm with respect to the total thermosetting silicone resin composition, thermosetting silicone resin composition.
확산입자를 더 포함하는 열경화성 실리콘 수지 조성물.According to claim 1,
A thermosetting silicone resin composition further comprising diffusion particles.
상기 확산입자는 Ti02, ZnO, ZrO2, SiO2, A1203, MgO 및 형광입자로 이루어지는 군에서 선택되는 적어도 1종의 물질을 포함하는, 열경화성 실리콘 수지 조성물.According to claim 5
The diffusion particles include Ti0 2 , ZnO, ZrO 2 , SiO 2 , A 12 0 3 , MgO and at least one material selected from the group consisting of fluorescent particles, thermosetting silicone resin composition.
필러를 더 포함하는 열경화성 실리콘 수지 조성물.According to claim 1,
A thermosetting silicone resin composition further comprising a filler.
접착부여제를 더 포함하는 열경화성 실리콘 수지 조성물.According to claim 1,
A thermosetting silicone resin composition further comprising an adhesive agent.
자기 칙소성을 갖는 MQ 구조의 화합물 40 내지 60 중량부, 알케닐기를 갖는 MDM 또는 MQ구조의 실록산 화합물 20 내지 30 중량부, Si-H 기능기를 갖는 폴리실록산 10 내지 30 중량부 및 백금 촉매 0.01 내지 0.1 중량부를 포함하는, 열경화성 실리콘 수지 조성물.According to claim 1,
40 to 60 parts by weight of an MQ structure compound having magnetic thixotropy, 20 to 30 parts by weight of an MDM or MQ structure siloxane compound having an alkenyl group, 10 to 30 parts by weight of a polysiloxane having a Si-H functional group, and 0.01 to 0.1 part by weight of a platinum catalyst A thermosetting silicone resin composition containing parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210102224A KR20230020304A (en) | 2021-08-03 | 2021-08-03 | Thermally curable silicone resin composition and electronic device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210102224A KR20230020304A (en) | 2021-08-03 | 2021-08-03 | Thermally curable silicone resin composition and electronic device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230020304A true KR20230020304A (en) | 2023-02-10 |
Family
ID=85223424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210102224A KR20230020304A (en) | 2021-08-03 | 2021-08-03 | Thermally curable silicone resin composition and electronic device using the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20230020304A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110121151A (en) | 2010-04-30 | 2011-11-07 | 주식회사 케이씨씨 | Organopolysiloxane resin for light emitting diode encapsulation |
-
2021
- 2021-08-03 KR KR1020210102224A patent/KR20230020304A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110121151A (en) | 2010-04-30 | 2011-11-07 | 주식회사 케이씨씨 | Organopolysiloxane resin for light emitting diode encapsulation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5004433B2 (en) | Curable silicone composition and cured product thereof | |
| EP3099746B1 (en) | Silicone gel composition | |
| EP3133105B1 (en) | Hydrosilyl-containing organopolysiloxane, making method, addition curable silicone composition, and semiconductor package | |
| EP2628770A1 (en) | Curable polyorganosiloxane composition | |
| EP3133106B1 (en) | Addition curable organopolysiloxane composition, and semiconductor package | |
| EP3483217B1 (en) | Epoxy-modified silicone composition and semiconductor device | |
| TW201843282A (en) | Silicone resin composition for die-bonding and cured product | |
| EP2599836B1 (en) | Curable composition for semiconductor encapsulation | |
| JPWO2017122762A1 (en) | Condensation reaction type silicone composition and cured product | |
| EP2716717A1 (en) | Silicone composition for sealing semiconductor | |
| JP6313722B2 (en) | Addition-curing silicone composition and semiconductor device | |
| KR101169031B1 (en) | Thermosetting Silicone Composition for Light Emitting Diode Encapsulant | |
| JP6349163B2 (en) | Organopolysiloxane prepolymer, organopolysiloxane polymer gel, sealing material for SiC or GaN power module, semiconductor sealing structure | |
| KR101566529B1 (en) | Curable polysiloxane composition for optical device and encapsulant and optical device | |
| US20210277236A1 (en) | Curable resin composition, cured product of same and semiconductor device | |
| JP6496185B2 (en) | Curable silicone resin composition and cured product thereof | |
| US10259911B2 (en) | Addition curable resin composition and semiconductor package | |
| KR20230020304A (en) | Thermally curable silicone resin composition and electronic device using the same | |
| JP6452545B2 (en) | Curable silicone resin composition and cured product thereof | |
| KR101767085B1 (en) | Curable organo polysiloxane composition, encapsulant, and electronic device | |
| KR101486566B1 (en) | Composition for encapsulant and encapsulant and electronic device | |
| KR20150066969A (en) | Composition for encapsulant and encapsulant and electronic device | |
| KR20150030925A (en) | Organopolysiloxane composition | |
| KR101418012B1 (en) | curable silicone compositions and electronic device | |
| KR20140064638A (en) | Forming method of protective film, protective film, curable composition and laminate |