KR20230018899A - The manufacturing method of the upright diamond conditioner using etching process - Google Patents

Abstract

The present invention relates to a diamond abrasive grain conditioner manufacturing method using an etching process. A plurality of grooves into which diamonds are inserted are formed on a substrate through the etching process so that a uniformly shaped diamond abrasive is formed. Therefore, since an octahedral diamond is erected in the same shape, performance deviation and occurrence of a scratch can be reduced. The diamond abrasive grain conditioner manufacturing method using the etching process of the present invention comprises: a preparation step; a first formation step; a first attachment step; an insertion step; a second formation step; a third formation step; a fourth formation step; a first removal step; a second attachment step; a second removal step; and a coating step.

Description

Diamond abrasive grain conditioner manufacturing method using etching process {THE MANUFACTURING METHOD OF THE UPRIGHT DIAMOND CONDITIONER USING ETCHING PROCESS}

The present invention relates to a method for manufacturing a pad conditioner for a CMP apparatus used for flattening a wafer, and more particularly, to a method for manufacturing a diamond abrasive grain conditioner using an etching process.

A chemical mechanical polishing (CMP) device, which is an abrasive processing device, is an important characteristic of wafer polishing uniformity in order to obtain a flatness of a semiconductor wafer. Among the various factors to improve the polishing uniformity of the wafer, since the surface state of the polishing pad is non-uniformly deformed over time, the deformed polishing pad surface is treated with a CMP pad conditioner (hereinafter referred to as 'conditioner'). It is used to perform a conditioning operation that finely polishes.

In this way, the conditioner is composed of a conditioner substrate, a plurality of abrasive particles disposed on the conditioner substrate, and a plating layer fixing the abrasive particles on the conditioner substrate.

Conventional methods of manufacturing conditioners such as electrodeposition, fusion, and sintering for fixing abrasive particles have problems in that it is difficult to freely adjust the distance between abrasive particles of the conditioner and it is difficult to accurately form abrasive grains and protruding heights of abrasive particles.

In general, when a conditioner is manufactured using octahedral diamond as an abrasive particle, the shape of the tip of the diamond contacting the polishing pad is randomly determined among points, lines, and planes, and has various angles and directions, resulting in deviation in conditioner performance. In particular, in the case of point contact in a regular octahedral diamond, abrasion easily occurs, resulting in a problem in that the life of the conditioner is shortened.

Therefore, the abrasive grain of diamond is important to maintain the performance of the CMP pad conditioner, but in the conventional conditioner manufacturing method, error or non-uniformity of the placement position occurs during the abrasive process to fix the diamond to the conditioner, which reduces the polishing performance and lifespan of the polishing pad. There is a problem that follows.

Korean Patent Publication No. 2002-0046471

Considering the above points, the present invention uniformly forms grooves into which diamonds are inserted at regular intervals and depths on one conditioner substrate by using an etching process, and all octahedral diamonds used in the conditioner of the polishing pad have the same shape. It is an object of the present invention to provide a method for manufacturing a diamond abrasive grain conditioner using an etching process that can improve the lifespan of the conditioner as well as reduce performance variation and scratch generation by standing and uniformly formed.

In order to achieve the above object, the diamond abrasive conditioner manufacturing method using the etching process of the present invention includes (a) preparing a substrate having a plurality of grooves, (b) plating the entire surface of the prepared substrate to form an underlying plating layer. (c) attaching a photosensitive film in the form of a mesh to the underlying plating layer for diamond arrangement; (d) inserting diamonds into the grooves; Plating to support to form a provisional plating layer, (f) removing the photosensitive film from the substrate on which the provisional plating layer is formed, and plating the entire surface to form a border plating layer, (g) a certain volume on the border plating layer additionally plating with and processing it to a certain thickness to form an additional plating layer, (h) removing the substrate and the base plating layer, (i) reversing the position so that the additional plating layer is at the bottom, and the lower surface of the additional plating layer (j) peeling off the temporary attachment plating layer and then peeling and removing the border plating layer; and (k) applying corrosion resistant coating on the externally exposed diamond and additional plating layer. can do.

In the step (a) of the diamond abrasive grain conditioner manufacturing method using the etching process of the present invention, the plurality of grooves are characterized in that formed through an etching process.

The shape of the groove extending from the surface of the substrate is circular or quadrangular, and if the shape of the groove extending from the surface of the substrate is circular, the bottom surface is also circular, and the shape of the groove extending from the surface of the substrate is rectangular. The lower surface of the back surface is also formed in a quadrangular shape.

The side of the groove becomes narrower towards the bottom of the groove.

The diameter of the circular groove or the length of the side of the square groove is 20% or more of the maximum width of the diamond, and the maximum diameter of the circular groove or the length of the maximum side of the square groove is 200% or less of the maximum width of the diamond. it is desirable

The depth of the groove is preferably 20% or more of the total height of the diamond and 200% or less of the lower height.

In the present invention, since a plurality of grooves are uniformly formed on the body substrate at regular intervals and at a predetermined height through the etching process, there is an effect of manufacturing a CMP pad conditioner in which diamonds, which are abrasive particles, are abraded at a uniform height from the body substrate. there is.

In addition, by making thousands or tens of thousands of diamonds in the form of a regular octahedron, which are abrasive particles, to a certain height through point contact, the load applied to the individual diamonds is reduced, thereby greatly extending the lifespan of the conditioner.

In the present invention, since the lead plating method is performed in terms of the manufacturing method, the manufacturing time of the conditioner is reduced compared to the conventional mold method.

1 is a flow chart of a method for manufacturing a diamond abrasive grain conditioner using the etching process of the present invention.
Figure 2 is a schematic diagram of a diamond abrasive grain conditioner manufacturing method using the etching process of the present invention.
Figure 3 is a schematic diagram for step S1 in the diamond abrasive conditioner manufacturing method using the etching process of the present invention.
4 and 5 are 3D depth images of grooves formed in a substrate according to an embodiment of the present invention.
6 is a schematic diagram of an octahedral diamond.

Hereinafter, a method for manufacturing a diamond abrasive grain conditioner using the etching process of the present invention will be described in detail with reference to the accompanying drawings, which will be implemented in various different forms by those skilled in the art as an example. Therefore, it is not limited to the embodiments described herein.

1 and 2 show a diamond abrasive grain conditioner manufacturing method using the etching process of the present invention.

As shown in FIG. 1, the diamond abrasive conditioner manufacturing method using an etching process includes (a) preparing a substrate having a plurality of grooves (S1), (b) forming a base plating layer on the substrate (S2), (c) ) Attaching a photosensitive film in the form of a mesh on the underlying plating layer (S3), (d) inserting diamonds into the grooves (S4), (e) forming a provisional plating layer on the substrate with the diamonds inserted (S5), (f) Removing the photosensitive film and forming a border plating layer on the entire surface (S6), (g) forming an additional plating layer on the border plating layer (S7), (h) removing the substrate and the base plating layer (S8), (i) The prepared body substrate is attached to the additional plating layer (S9), (j) the temporary attachment plating layer and the boundary plating layer are removed (S10), and (k) corrosion resistance coating is performed (S11) in this order.

The (a) step (S1) is a step of preparing a substrate having a plurality of grooves 11 formed in the same shape on the substrate 10 through an etching process so that a conditioner having diamond abrasive grains of a certain distance and height is manufactured on the substrate. am.

Figure 3 is a schematic diagram of (a) step (S1) in the diamond abrasive grain conditioner manufacturing method using the etching process of the present invention, the etching process performed in (a) step (S1) is the following photolithography (photolithography) process can be used.

The (a) step (S1) is a laminating step (S101) of coating the exposure film 60 on the substrate 10, placing a mask 70 having a predetermined pattern on the exposure film 60, and then applying UV light. An exposure step of sensitizing the exposure film 60 by irradiation (S102), a development step of forming the exposed exposure film in a predetermined pattern (S103), and applying an etchant to the patterned exposure film 61 to form the substrate. An etching step (S104) of forming grooves (11) on (10) and a film removal step (S105) of removing the patterned exposure film (61) on the substrate (10) are performed on the top surface of one side of the substrate (10). A substrate having a plurality of grooves 11 into which diamonds are inserted is prepared.

In the exposure step (S102), ultraviolet rays are irradiated through the mask 70 for forming a desired pattern on the exposure film 60. When the exposure film 60 is irradiated with ultraviolet rays (UV), the portion irradiated with the ultraviolet rays is cured.

In the exposure step (S102), the type and amount of the ultraviolet (UV) light are not particularly limited as long as they can be appropriately selected as needed.

In the exposure step (S102), the shape of the grooves 11 formed in the substrate 10, the size of the diameter of the grooves, the distance between the grooves, and the like can be adjusted through a predetermined pattern in the mask 70.

The shape of the groove 11 may be in various forms such as circular, square, square, pentagonal, hexagonal, etc., and is not particularly limited as long as the diamond particles applied to the diamond abrasive conditioner are inserted, but is preferably circular or square. is formed

In the developing step (S103), the exposure film 60, after which curing has been completed through the exposure step (S102), is connected to a developing solution to dissolve the areas not irradiated with ultraviolet rays (UV) and develop so that only the cured areas remain. form the desired pattern.

Here, the shaping method may use various methods such as a liquid addition method, a dipping method, a spray method, etc. using an aqueous solution containing an alkaline compound and a surfactant as a developer, and if it is commonly used in the art, it can be used without particular limitation. there is.

The etching step (S104) is a process of forming a groove 11 of a desired shape on the substrate, and the groove ( 11), an etching process is performed by applying an etchant to the patterned exposure film 61. The etching solution does not react on the portion of the substrate to which the patterned exposure film 61 is attached, and a plurality of grooves 11 are formed on the portion of the substrate to which the patterned exposure film 61 is not attached through an etching reaction.

In the etching step (S104), the time of the etching process is not particularly limited, but since the depth of the groove 11 formed may vary according to the time of the etching process, the desired shape of the groove 11 can be formed sufficiently. It is preferable to do it in time.

The etchant composition used in the etching step (S104) is not particularly limited, and an etchant composition commonly used in the art may be used.

Finally, in the film removing step (S105), a substrate having a plurality of grooves is prepared by peeling and removing the patterned exposure film 61 attached to the substrate.

4 and 5 are shown as a three-dimensional depth image of a groove formed on a substrate according to an embodiment of the present invention, and the upper surface of the substrate is displayed in orange, and when the depth of the groove is expressed in color, it is displayed in yellow. The deeper the purple color, the deeper the groove.

As shown in FIGS. 4 and 5, looking at the shape of the groove 11 formed on the substrate 10 through the etching process according to one embodiment, the circular groove 11 is formed when observing the top of the substrate. do.

As shown in FIG. 5, looking at the cross-sectional shape of the substrate 10 in the thickness direction of the groove 11 cut along the vertical axis, the bottom surface of the groove includes a circular plane, and the side surface of the groove extends from the top surface of the groove. The deeper the depth, the narrower the width. And from the side of the groove to the bottom of the groove is connected by a curved surface.

5 shows that the shape formed on the substrate is circular, but as described above, polygons such as squares, pentagons, hexagons, etc. It can be formed, and the same shape appears on the bottom surface according to the shape of the groove extending from the surface of the substrate.

For example, the shape of the groove extending from the surface of the substrate is circular or quadrangular, and if the shape of the groove extending from the surface of the substrate is circular, the bottom surface is also circular, and the groove extending from the surface of the substrate is circular. If the shape of is a rectangle, the bottom surface is also formed in a rectangle.

In the method for manufacturing a diamond abrasive grain conditioner using an etching process, the groove 11 formed on the upper surface of the substrate 10 through step (S1) of (a) is preferably formed to a size that allows diamond to be inserted.

The specific size of the groove 11 can be explained as follows based on the shape of the octahedral diamond shown in FIG. 6 .

In FIG. 6, the maximum width of the diamond is indicated by D, the overall height of the diamond is indicated by H2, and the height of the lower part of the diamond corresponding to half of the total height (H2) is indicated by H1.

The diameter of the circular groove or the length of the side of the square groove is 20% or more of the maximum diamond width (D), and the maximum diameter of the circular groove or the length of the maximum side of the square groove is the maximum width of the diamond ( D) of 200% or less.

In addition, the depth of the groove 11 may be 20% or more of the total diamond height H2 and 200% or less of the lower height H1.

(b) step (S2) is a step of base plating to improve the adhesion of the plating with the substrate 10 to achieve a solid plating state during the manufacture of the diamond abrasive grain conditioner, as shown in FIG. 2, the (b) step (S2) may form the underlying plating layer 21 on the entire surface of the substrate 10 on which the plurality of grooves 11 prepared through step (S1) of (a) are formed.

In the step (b) (S2), the underlying plating layer 21 is formed so that diamond, which is an abrasive particle, can be abrasive without directly contacting the substrate.

Step (c) (S3) is a step of attaching the photosensitive film 30 in the form of a mesh for arranging diamonds on the underlying plating layer 21 through step (b) (S2). In the mesh-type photosensitive film 30 used in the step (c) (S3), the size of the pores formed in the photosensitive film is the same as the maximum diameter or maximum side length of the grooves 11 formed in the substrate 10, or It is preferable to use a large one. If the pore size of the photosensitive film is smaller than the diameter of the circular groove or the length of the side of the rectangular groove, the diamond abrasive grain cannot be inserted into the groove 11, and the diamond abrasive grain conditioner cannot be properly manufactured.

Step (d) (S4) is a step of inserting the diamond 100 so as to be seated in the groove 11 of the substrate to which the mesh-shaped photosensitive film 30 is attached through step (c) (S3).

In the step (d) (S4), vibration is applied to the substrate 10 for the diamonds 100 to be seated, or a plurality of diamonds 11 are positioned in the groove 11 by using a separate device. can make it settle in.

Step (e) (S5) is a step of forming a provisional plating layer 22 by plating to support the diamond 100 on the substrate on which the diamond 100 is inserted through step (d) (S4).

In step (f) (S6), the mesh-shaped photosensitive film 30 is removed from the substrate on which the provisional plating layer 22 is formed through step (e) (S5), and then the photosensitive film 30 is The entire surface of the removed substrate is plated to form a boundary plating layer 23 .

The boundary plating layer 23 is plated on the entire surface so as to cover all of the base plating layer 21 and the provisional plating layer 22 except for diamond, so as not to be exposed to the outside.

(g) step (S7), as shown in FIG. 2, is additionally plated over a certain volume so as to sufficiently cover the externally exposed diamonds on the boundary plating layer 23, and to a thickness such that the diamonds are not exposed to the outside. This is a step of forming the additional plating layer 24 by processing.

(h) In step S8, the substrate 10 and the underlying plating layer 21 are removed.

(i) Step (S9) reverses the position of the additional plating layer 24 so that the substrate 10 and the underlying plating layer 21 are removed through the (h) step S8 so that the additional plating layer 24 is at the bottom, and the additional plating layer ( 24) Attach the prepared body substrate 40 to the lower surface. That is, the body substrate 40 is attached to the opposite side from where the substrate 10 and the underlying plating layer 21 are removed.

Since the diamond and the substrate are reversed differently in the process step described above through step (i) (S9), the process after step (i) (S9) is reverse plating performed in an inverted state.

(j) In step S10, the provisional plating layer 22 is sequentially peeled off, and then the boundary plating layer 23 is peeled off and removed.

In step (k) (S11), the outer surface of the diamond exposed to the outside by removing the temporary attachment plating layer 22 and the boundary plating layer 23 through the step (j) (S10) is coated with a coating composition having excellent corrosion resistance. coating to produce a diamond abrasive grain conditioner with improved physical properties such as durability and corrosion resistance.

In this specification, plating solution components forming the plating layer are not particularly limited, and plating solution components including copper, nickel, and the like used in conventional CMP pad conditioners may be used.

Through the diamond abrasive grain conditioner manufacturing method using the above-described etching process, grooves into which diamonds, which are abrasive particles, are inserted are uniformly formed on the conditioner substrate at regular intervals and depths so that all octahedral diamonds are uniformly formed, resulting in variation in polishing performance and scratches It is possible to realize an excellent diamond abrasive grain conditioner with improved lifespan of the conditioner by reducing the occurrence and increasing the number of point contacts of the regular octahedral diamond.

10: Substrate
11: home
21: base plating layer
22: provisional plating layer
23: boundary plating layer
24: additional plating layer
30: photosensitive film
40: body substrate
51: corrosion resistant coating layer
60: exposure film
61: patterned exposure film
70: mask
100 : Diamond

Claims (7)

(a) preparing a substrate having a plurality of grooves;
(b) forming an underlying plating layer by underplating the entire surface of the prepared substrate;
(c) attaching a photosensitive film in the form of a mesh to the underlying plating layer for diamond arrangement;
(d) inserting a diamond into the groove;
(e) forming a provisional plating layer by plating to support the diamond on the substrate in which the diamond is inserted;
(f) removing the photosensitive film from the substrate on which the temporary attachment plating layer is formed, and plating the entire surface to form a boundary plating layer;
(g) additionally plating a predetermined volume on the boundary plating layer and processing the additional plating layer to a predetermined thickness to form an additional plating layer;
(h) removing the substrate and the underlying plating layer;
(i) reversing the position of the additional plating layer so that it is at the bottom, and attaching the prepared body substrate to the lower surface of the additional plating layer;
(j) removing the boundary plating layer after peeling off the temporary attachment plating layer; and
(k) coating an anti-corrosion coating on the externally exposed diamond and an additional plating layer;
In step (a),
A method of manufacturing a diamond abrasive grain conditioner using an etching process, characterized in that the plurality of grooves are formed by an etching process for the substrate. According to claim 1,
Diamond abrasive conditioner manufacturing method using an etching process, characterized in that the shape of the groove extending from the surface of the substrate is circular or square. According to claim 1,
Diamond abrasive grain conditioner manufacturing method using an etching process, characterized in that the side surface of the groove becomes narrower toward the bottom surface of the groove. According to claim 3,
If the shape of the groove extending from the surface of the substrate is circular, the bottom surface is also circular, and if the shape of the groove extending from the surface of the substrate is rectangular, the bottom surface is also rectangular. Diamond abrasive grain conditioner using an etching process, characterized in that manufacturing method. According to claim 1,
Diamond abrasive conditioner manufacturing method using an etching process, characterized in that the diameter of the circular groove or the length of the side of the square groove is 20% or more of the maximum width of the diamond. According to claim 1,
Diamond abrasive conditioner manufacturing method using an etching process, characterized in that the maximum diameter of the circular groove or the maximum length of the side of the square groove is 200% or less of the maximum width of the diamond According to claim 6,
The depth of the groove is 20% or more of the total height of the diamond, diamond abrasive grain conditioner manufacturing method using an etching process, characterized in that less than 200% of the lower height.

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