KR20230010341A - Non-contact infrared thermometer - Google Patents

Abstract

The present invention relates to a non-contact infrared thermometer, and more particularly, to a non-contact infrared thermometer formed by: connecting a lead wire of an infrared sensor to a connection terminal formed on an upper surface and lower surface of a sensor connection board of a size and shape that can be inserted into a hollow of a copper pipe; electrically and mechanically connecting the sensor connection board with a printed circuit board by passing a plurality of connection pins formed on the printed circuit board through a plurality of connection holes formed at a rear end of the sensor connection board; forming one inner case by vertically coupling an upper case on which the printed circuit board connected to the infrared sensor through the sensor connection board is mounted, and a lower case which accommodates a plurality of batteries; inserting the inner case into an outer case made of a square pipe shape by a slide method and coupling the same; and installing a probe surrounding the infrared sensor and a probe cover surrounding the probe sequentially on a front surface of the external case, and installing a battery cover on a rear surface of the external case. The non-contact infrared thermometer simplifies an assembly process and prevents the lead wire of the infrared sensor from breaking.

Description

Non-contact infrared thermometer {NON-CONTACT INFRARED THERMOMETER}

The present invention relates to a non-contact infrared thermometer, and more particularly, rather than directly soldering and connecting an infrared sensor lead wire to a printed circuit board, soldering and connecting an infrared sensor lead wire to a separate sensor connection board, and then connecting the sensor. It relates to a non-contact infrared thermometer that can be easily assembled by connecting a board to a printed circuit board and can prevent the lead wire from being cut by fixing the lead wire of the infrared sensor to the sensor connection board.

A non-contact infrared thermometer measures body temperature by detecting infrared rays generated from the human body and converting them into predetermined electrical signals. It includes a printed circuit board that displays and a housing that surrounds and protects them.

However, since the conventional non-contact thermometer uses a method of directly soldering and connecting the lead wire of the infrared sensor to the printed circuit board, when assembling the thermometer, soldering the lead wire of the infrared sensor to the printed circuit board is required, so assembling time and manpower are required. There was a problem with this taking a lot.

In addition, when the lead wire of the infrared sensor is directly soldered to the printed circuit board as in the prior art, since the infrared sensor is connected to the printed circuit board through the lead wire, the lead wire is easily broken by an external force, resulting in a malfunction.

In addition, since a conventional non-contact infrared thermometer usually combines an upper case and a lower case vertically to form a single housing, the upper case and the lower case are exposed to the outside as they are, resulting in a messy appearance and a display panel on the upper surface of the upper case. Since it is necessary to install an expensive display panel, the product price rises, and a lot of assembly time and manpower are required, resulting in a decrease in productivity.

Republic of Korea Patent No. 10-1804374 (registration date: November 28, 2017) Republic of Korea Registered Utility Model 20-0243898 (registration date; 08/09/2001) Republic of Korea Patent Publication 10-2021-0064933 (published date: June 03, 2021)

The present invention is to solve the problems of the prior art, and the main object of the present invention is to connect the infrared sensor to the printed circuit board by using a separate sensor connection board without directly soldering and connecting the lead wire of the infrared sensor to the printed circuit board. An object of the present invention is to provide a non-contact infrared thermometer capable of simplifying an assembly process by connecting to a board and preventing breakage of a lead wire of an infrared sensor.

In addition, the present invention forms an inner case by vertically combining an upper case accommodating the printed circuit board and a lower case accommodating the battery, and slides the inner case to the outer case, thereby greatly reducing the structure of the outer case. It is to provide a non-contact infrared thermometer capable of improving productivity by simplifying and facilitating assembly.

In addition, the present invention is to provide a non-contact infrared thermometer capable of reducing assembly time and manpower by installing the display so as not to be exposed to the outside of the outer case and reducing costs by not using an expensive display panel.

As a means for achieving the object of the present invention, the non-contact infrared thermometer according to the present invention,

In the non-contact infrared thermometer including an infrared sensor, a printed circuit board and a housing,

The infrared sensor includes a sensor body and a plurality of lead wires, and the lead wires of the infrared sensor are connected to connection terminals formed on the upper and lower surfaces of a sensor connection board having a size and shape that can be inserted into a hollow of a copper tube. electrically and mechanically connecting the sensor connection board and the printed circuit board by passing a plurality of connection pins formed on the printed circuit board through a plurality of connection holes formed at a rear end of the sensor connection board;

In the housing, an inner case is formed by vertically combining an upper case in which the printed circuit board connected to the infrared sensor through the sensor connection board is seated and a lower case accommodating a plurality of batteries, and is shaped like a square pipe. After inserting and combining the inner case in a sliding manner into the outer case, a probe surrounding the infrared sensor and a probe cover surrounding the probe are sequentially installed on the front side of the outer case, and a battery cover is installed on the rear side of the outer case. characterized by being made.

In the present invention, a plurality of LED chips expressing a plurality of digital numbers are mounted on the upper surface of the printed circuit board, and a plurality of light transmissions are made so that the light emitted from the plurality of LED chips penetrates the upper surface of the upper case. Holes are formed to correspond to each other, and the outer case includes a translucent portion through which light passing through the light transmission hole is projected to the outside.

A contact switch is mounted on the upper surface of the printed circuit board, a coupling hole for coupling an operation button is formed on the upper surface of the upper case at a position corresponding to the contact switch, and the operation button is on the upper surface of the outer case. This penetrating through hole is formed at a position corresponding to the contact switch.

The outer case has an upper surface, a lower surface, both side surfaces and a rear surface integrally formed, and the front surface is completely open to form a rectangular tube, the through hole is formed on the upper surface, and an insertion hole is formed on the rear surface to insert a battery. is formed;

The upper case is made of a square channel whose upper surface and both side surfaces are integrally formed and whose lower surface and front and rear surfaces are completely open. A plurality of light transmission holes are formed to pass light emitted from the chip, and a plurality of coupling protrusions detachably coupled to both sides of the lower case are formed on both sides;

The lower case is composed of a lower surface, both side surfaces, and a rear surface, and the upper surface and the front surface are completely open. A support boss is formed on the lower surface to protrude at a certain height so as to support the printed circuit board accommodated in the upper case. A battery receiving box is formed to accommodate, and a plurality of coupling grooves are formed on both side surfaces so as to guide and fix a plurality of coupling protrusions formed on both side surfaces of the upper case.

The printed circuit board is formed with a plurality of through-holes through which the plurality of support bosses pass and a plurality of through-pins extending downward by a predetermined length to pass through a plurality of connection holes formed at a rear end of the sensor connection board. The case is made of a translucent material.

In the non-contact infrared thermometer according to the present invention, the lead wire of the infrared sensor is indirectly connected to the printed circuit board using a separate sensor connection board without directly soldering and connecting the lead wire of the infrared sensor to the printed circuit board. By integrally fixing the upper and lower surfaces of the sensor connection board, it is possible to prevent the lead wire from being disconnected, and a plurality of connection pins installed on the printed circuit board pass through a plurality of connection holes formed at the rear end of the sensor connection board. Since the printed circuit board and the printed circuit board are electrically and mechanically connected, there is an effect that assembly is very easy.

In addition, the non-contact infrared thermometer according to the present invention forms one inner case by vertically assembling an upper case accommodating a printed circuit board and a lower case accommodating a battery. After combining this inner case with the inside of the outer case made of a square pipe shape in a sliding manner, the probe and probe cover are sequentially coupled to the front of the outer case, and the battery cover is installed on the rear to make the assembly of the housing very easy. It has the effect of improving productivity by greatly reducing assembly time and manpower.

In addition, in the non-contact infrared thermometer according to the present invention, a plurality of LED chips mounted on the upper surface of the printed circuit board and a plurality of light transmission holes formed on the upper surface of the upper case are installed to correspond to each other, and the light transmission holes are installed on the upper surface of the outer case. Since the display panel is not exposed to the outside of the outer case by forming the translucent portion at a position corresponding to , assembly is easy and cost can be reduced because an expensive display panel is not used.

1 is a perspective view showing a preferred embodiment of a non-contact infrared thermometer according to the present invention;
2 is a perspective view showing a state in which a probe cover and a battery cover are separated from the non-contact infrared thermometer shown in FIG. 1;
3 is an exploded perspective view of the non-contact infrared thermometer shown in FIG. 1;
4 is a cross-sectional view of the non-contact infrared thermometer shown in FIG. 1;
5 is an exploded cross-sectional view illustrating an assembling method of a non-contact infrared thermometer according to the present invention.

1 is a perspective view showing a preferred embodiment of a non-contact infrared thermometer according to the present invention, FIG. 2 is a perspective view showing a state in which a probe cover and a battery cover are separated from the non-contact infrared thermometer shown in FIG. 1, and FIG. It is an exploded perspective view of the non-contact infrared thermometer shown in.

First, referring to FIGS. 1 and 2, the non-contact infrared thermometer 1 of the present invention has a rectangular parallelepiped shape of a size that can be held by hand, and an operating button 38 for operating the thermometer is installed on the upper surface and rear A battery cover 59 is installed to close the battery insertion hole 43a, a sensing hole 57a is formed on the front surface to measure body temperature, and a translucent portion on the upper surface where the body temperature is displayed as digital numbers ( 35a) is formed.

Subsequently, as shown in FIG. 3, the non-contact infrared thermometer 1 of the present invention is divided into a sensing unit 10, a measuring unit 30, and a housing 50 according to functions, and the sensing unit 10 is a non-contact type As a part that detects the body temperature, it includes an infrared sensor 12 and a copper tube 14 surrounding the infrared sensor 12, and the measurement unit 30 is a part that calculates and displays the body temperature from the detected signal, and the printed circuit It includes a sensor connection board 15 that connects the board 32, the printed circuit board 32, and the infrared sensor 12, and the housing 50 protects the sensing unit 10 and the measuring unit 30 by covering them. As such, it includes an outer case 51 and an inner case 52 that protect the probe 11 and the probe cover 57 and the measuring unit 30 to protect the sensing unit 10 .

Specifically, as shown in FIGS. 3 and 4, the infrared sensor 12 detects infrared rays emitted from the human body and outputs a predetermined electrical signal, and includes a sensor body 12b and a plurality of lead wires 12a. made up of The copper pipe 14 is a cylindrical pipe made of a metal material having excellent thermal conductivity, and the infrared sensor 12 is inserted thereinto to protect the infrared sensor 12 from external influences.

The printed circuit board 32 has a size and shape that can be seated inside the inner case 42, and in particular, the front side has a narrow width so that it can be inserted into the probe 11 and has a certain length forward. It protrudes and the protruding portion 32a is integrally formed. In addition, a contact switch 38c is mounted on the front end of the upper surface of the printed circuit board 32 so as to contact the operation button 38, and on both sides of the contact switch 38a, two upper ends of support bosses 56 to be described later pass through. Two through holes 56a are formed. In addition, a plurality of LED chips 35 are mounted at the rear thereof to correspond to the plurality of light penetrating holes 35b, and a connection spring is connected to one surface of the battery 43 accommodated in the battery container 45 on the lower surface. (44) is installed.

The sensor connection board 15 is for connecting the printed circuit board 32 and the infrared sensor 12, one end is made of a size and shape that can be inserted into the copper tube 14, and the other end is a printed circuit board (32) and is made in a form that can be electrically and mechanically connected. Preferably, the sensor connection board 15 is made of a narrow, elongated PCB, has a plurality of connection holes 15a formed at the rear end, and both sides are connected to the lead wire 12a of the infrared sensor 12. A plurality of connection terminals 15b and a plurality of conductive wires 15c electrically connecting the connection terminals 15b and the connection hole 15a are printed.

The outer case 51 forms the exterior of the non-contact infrared thermometer 1, and the top surface 51a, both side surfaces 51b, and the rear surface 51c are integrally formed, and the front surface is completely open to form a square tube. It is done. A through hole 38a for installing the operation button 38 is formed in the upper surface 51a, and an insertion hole 43a through which the battery 43 can be inserted is formed in the rear surface 51c. In addition, a battery cover 59 for closing the insertion hole 43a is detachably coupled to the rear surface 51c. In addition, a translucent portion 35a displaying the body temperature as a digital number is formed on the upper surface 15a of the outer case 51 .

The inner case 52 is inserted into the outer case 51 in a sliding manner, and is divided into an upper case 53 and a lower case 54, and a printed circuit board is inside the upper case 53 ( 32) is accommodated and the battery 43 is accommodated inside the lower case 54.

First, the upper case 53 is composed of a square channel in which an upper surface 53a and both side surfaces 53b are integrally formed and the lower surface and the front and rear surfaces are completely open. In addition, a coupling hole 38b for coupling the operation button 38 is formed on the upper surface 53a, and a plurality of digital numbers are displayed on the translucent portion 35a by passing light emitted from the LED chip at the rear thereof. A plurality of light transmission holes 35b are formed. In addition, a plurality of engaging protrusions 55a are formed on both side surfaces 53b and detachably coupled to both side surfaces of the lower case 54.

Subsequently, the lower case 54 is formed in a form corresponding to the upper case 53, and includes a lower surface 54a, both side surfaces 54b, and a rear surface 54c, and the upper and front surfaces are completely open. And, at the front end of the lower surface 54a, a support boss 56 is formed to protrude at a certain height so as to support the printed circuit board 32 accommodated in the upper case 53, and two batteries 43 are installed at the rear end. A battery accommodating box 45 partitioned by a plurality of partition walls is formed so as to be accommodated. An insertion hole 43b is formed in the rear surface 54c so that the battery 43 can be inserted. In addition, coupling grooves 55b are formed on both side surfaces 54b to guide and fix the plurality of coupling protrusions 55a formed on both sides of the upper case 53.

Subsequently, the probe 11 is coupled to the front of the outer case 51 and protects the infrared sensor 12 and the copper tube 14 by surrounding it, and is made of synthetic resin in a conical shape with a hollow inside, and the outer case at the rear end. A coupling portion 11a to which 51 is coupled is formed, and a coupling portion 11b to which a probe cover 57 to be described later is coupled is formed at the front.

The probe cover 57 is formed in the shape of a square box with an open rear surface, a sensor hole 57a is formed on the front side, and a coupling groove coupled to the coupling portion 11b formed on the probe 11 is formed at the rear end. there is.

In the non-contact infrared thermometer 1 according to the present invention, instead of directly soldering and connecting the lead wire 12a of the infrared sensor 12 to the printed circuit board 32, the infrared sensor 12 ) is indirectly connected to the printed circuit board 32, it is possible to prevent the lead wire 2a from being disconnected by integrally fixing the lead wire 12a of the infrared sensor 12 to the upper and lower surfaces of the sensor connection board 15. A plurality of connection pins 37 installed on the printed circuit board 32 are coupled to pass through a plurality of connection holes 15a formed at the rear end of the sensor connection board 15, thereby connecting the sensor connection board 15 and the printed circuit. Assembly is very easy because the boards 32 can be connected electrically and mechanically.

In addition, in the non-contact infrared thermometer 1 according to the present invention, the inner case 52 is formed by vertically assembling an upper case 53 accommodating a printed circuit board 32 and a lower case 54 accommodating a battery 43. After forming and coupling the inner case 52 to the inside of the outer case 51 in a sliding manner. Assembling the housing 50 is very easy by sequentially combining the probe 11 and the probe cover 57 on the front of the outer case 51 and installing the battery cover 59 on the rear, reducing assembly time and manpower. It has the effect of improving productivity by significantly reducing costs.

In addition, the non-contact infrared thermometer 1 according to the present invention includes a plurality of LED chips 35 mounted on the upper surface of the printed circuit board 32 and a plurality of light transmission holes 35b formed on the upper surface of the upper case 35b. are installed to correspond to each other, and the translucent portion 35a is formed to correspond to the upper surface of the outer case 51, so that the display panel is not exposed to the outside of the outer case 51, so the appearance is beautiful and assembly time and manpower are reduced. And it has the effect of lowering the product price by not using an expensive display panel.

Hereinafter, a method of assembling the non-contact infrared thermometer 1 according to the present invention will be described with reference to FIG. 5 .

First, in a state where the infrared sensor 12 is inserted into the copper tube 14, the lead wire 12a of the infrared sensor 12 is brought into close contact with the sensor connection board 15, and the connection terminal formed on the sensor connection board 15 It is connected by soldering to (15b). At this time, the sensor body 12b adheres closely to the front surface of the sensor connection board 15, and the lead wire 12a and the sensor connection board 15 are integrally fixed using the elastic band 17.

Subsequently, the sensor connection board 15 and the printed circuit board are connected by passing through the plurality of connection pins 32b installed on the lower surface of the printed circuit board 32 through the plurality of connection holes 15a formed at the rear end of the sensor connection board 15. (32) to be connected electrically and mechanically.

Subsequently, the printed circuit board 32 to which the infrared sensor 12 is connected through the sensor connection board 15 is seated inside the upper case 53, and the lower case 54 is coupled to the lower portion to form an inner case 52. form At this time, the plurality of coupling protrusions 55a formed on both sides of the upper case 53 slide along the plurality of coupling grooves 55b formed on both sides of the lower case 54, and the coupling grooves and coupling protrusions, not shown, are engaged with each other. Thus, the upper case 53 and the lower case 54 are integrally coupled. In addition, the upper end of the support boss 56 formed in the lower case 54 passes through the through hole 56s formed in the printed circuit board 32 to fix the printed circuit board 32 in place, and the printed circuit board 32 The plurality of LED chips 35 formed in ) are fixed to correspond to the plurality of light transmission holes 35b formed on the upper surface of the upper case 53 . Preferably, the upper surface 53a of the upper case 53 may be formed with a predetermined thickness so that the LED chip 35 and the light transmission hole 35b are as close as possible.

Also, the inner case 52 is inserted into the outer case 51 through the open front of the outer case 51 . And when the operation button 38 is coupled to the coupling hole 38b of the upper case 53 through the through hole 38a formed on the upper surface of the outer case 51, the lower end of the operation button 38 is printed circuit board ( 32) can be contacted with the contact switch 38c installed on the upper surface.

Subsequently, the probe 11 and the probe cover 57 are sequentially coupled to the front of the outer case 51, and the two batteries 43 are inserted through the insertion holes 43a formed on the rear surface 51c of the outer case 51. After accommodating ) in the battery compartment 45, the non-contact infrared thermometer 1 of the present invention can be assembled by coupling the battery cover 59 to the rear surface of the outer case 51.

As described above, the non-contact infrared thermometer 1 of the present invention is easy to assemble because the inner case 52 is inserted in a sliding manner into the outer case 51 made of a square pipe shape and made of a translucent material. In addition, the appearance is beautiful because the display device or the case coupling device is not exposed to the outside. In addition, there is no need to use special tools for assembly as all parts can be easily assembled by hand.

1: non-contact infrared body temperature 10: sensor
11: probe 12: infrared sensor
12a: lead wire 14: copper tube
15: sensor connection board 30: measuring unit
32: printed circuit board 35: LED chip
35a: Translucent part 35b: Guan Tusa Hall
38: operation button 38a: through hole
38b: installation hole 38c: contact switch
43: battery 43a: insertion hole
45: battery accommodating box 50: housing
51: outer case 52: inner case
53: upper case 54: lower case
56: support boss 57: probe cover
59: battery cover

Claims (5)

In the non-contact infrared thermometer including an infrared sensor, a printed circuit board and a housing,
The infrared sensor includes a sensor body and a plurality of lead wires, and the lead wires of the infrared sensor are connected to connection terminals formed on the upper and lower surfaces of a sensor connection board having a size and shape that can be inserted into a hollow of a copper tube. electrically and mechanically connecting the sensor connection board and the printed circuit board by passing a plurality of connection pins formed on the printed circuit board through a plurality of connection holes formed at a rear end of the sensor connection board;
In the housing, an inner case is formed by vertically combining an upper case in which the printed circuit board connected to the infrared sensor through the sensor connection board is seated and a lower case accommodating a plurality of batteries, and is shaped like a square pipe. After inserting and combining the inner case in a sliding manner into the outer case, a probe surrounding the infrared sensor and a probe cover surrounding the probe are sequentially installed on the front side of the outer case, and a battery cover is installed on the rear side of the outer case. Non-contact infrared thermometer, characterized in that consisting of.
According to claim 2,
A plurality of LED chips representing a plurality of digital numbers are mounted on the upper surface of the printed circuit board, and a plurality of light-transmitting holes are formed to correspond to the upper surface of the upper case so that light emitted from the plurality of LED chips passes through. The non-contact infrared thermometer characterized in that the outer case includes a translucent part to project the light passing through the light transmission hole to the outside.
According to claim 2,
A contact switch is mounted on the upper surface of the printed circuit board, a coupling hole for coupling an operation button is formed on the upper surface of the upper case at a position corresponding to the contact switch, and the operation button is on the upper surface of the outer case. A non-contact infrared thermometer, characterized in that the penetrating through hole is formed at a position corresponding to the contact switch.
According to claim 3,
The outer case has an upper surface, a lower surface, both side surfaces, and a rear surface integrally formed, and the front surface is completely open to form a square tube. formed;
The upper case is made of a square channel whose upper surface and both side surfaces are integrally formed and whose lower surface and front and rear surfaces are completely open. A plurality of light-transmitting holes are formed to pass light emitted from the chip, and a plurality of coupling protrusions detachably coupled to both sides of the lower case are formed on both side surfaces;
The lower case is composed of a lower surface, both side surfaces, and a rear surface, and the upper surface and the front surface are completely open. A support boss is formed on the lower surface to protrude at a certain height so as to support the printed circuit board accommodated in the upper case. A non-contact infrared thermometer, characterized in that a battery container for accommodating is formed, and a plurality of coupling grooves are formed on both sides to guide and fix the plurality of coupling protrusions formed on both side surfaces of the upper case.
According to claim 4,
The printed circuit board is formed with a plurality of through-holes through which the plurality of support bosses pass and a plurality of through-pins extending downward by a predetermined length to pass through a plurality of connection holes formed at a rear end of the sensor connection board. The case is a non-contact infrared thermometer, characterized in that made of a translucent material.

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