KR20220155217A - Film forming apparatus, program, method of evaluating position detection accuracy, and manufacturing method of electronic device - Google Patents

Abstract

The present invention is to evaluate the detection accuracy of a position of a mark for alignment. A film forming device is provided. A detection means performs a detection process of detecting a position of a substrate mark installed on a substrate and a position of a mask mark installed on a mask. A position adjustment means performs a relative position adjustment of the substrate and the mask based on a result of the detection process by the detection means. A calculation means performs a statistical process on the result of the detection process performed a plurality of times by the detection means in a state in which the substrate and the mask are stopped.

Description

Film forming apparatus, program, evaluation method of position detection accuracy, and manufacturing method of electronic device

The present invention relates to a film forming apparatus, a program, a method for evaluating position detection accuracy, and a method for manufacturing an electronic device.

BACKGROUND OF THE INVENTION [0002] In the manufacture of organic EL display devices (organic EL displays) and the like, alignment of the substrate and the mask is performed when depositing an evaporation material onto the substrate using a evaporation mask. Alignment between the substrate and the mask may be performed using an alignment mark formed on the substrate or mask. Patent Literature 1 discloses calculating the displacement of the position and angle of the substrate from a standard from a captured image obtained by capturing an alignment mark formed on the substrate.

Patent Document 1: Japanese Unexamined Patent Publication No. 2008-010504

In the prior art described above, the calculation accuracy of deviations from standards such as the positions of the substrate and the mask, to put it another way, the detection accuracy of the respective positions of the substrate and mask used for calculation has not been studied. If the detection accuracy is low, the alignment accuracy between the substrate and the mask may decrease. As a result, the evaporation position of the evaporation material relative to the substrate may be disturbed, and the quality of the product may deteriorate. Therefore, grasping the detection accuracy of the position of the mark for alignment is calculated|required.

The present invention provides a technique for evaluating the detection accuracy of the alignment mark position.

According to the present invention, detecting means for performing a detection process for detecting the position of a substrate mark provided on a substrate and the position of a mask mark provided on a mask, and based on a result of the detection process by the detection means, the substrate and the Positioning means for adjusting the relative position of the mask, and calculating means for executing statistical processing on the results of the detection process executed a plurality of times by the detection means in a state where the substrate and the mask are stopped. A characterized film forming apparatus is provided.

ADVANTAGE OF THE INVENTION According to this invention, the detection precision of the position of the mark for alignment can be evaluated.

1 is a schematic diagram showing a part of the configuration of a manufacturing line for an electronic device according to an embodiment.
2 is a schematic diagram of a film forming apparatus according to an embodiment.
FIG. 3 is a diagram showing an example of a hardware configuration of the film forming apparatus of FIG. 2 .
4(a) to (c) are plan views showing configuration examples of a mask and a substrate.
5 is a diagram schematically showing the outline of an alignment process by a film forming apparatus.
6 is a diagram for explaining an example of a fine alignment process.
Fig. 7 (a) is a diagram illustrating an aspect of pattern matching for specifying the position of a mask fine mark, and (b) is a diagram showing an example of a model mark.
8 is a flowchart showing a processing example of a processing unit.
9(a) and (b) are flowcharts showing processing examples of the processing unit.
10 is a flowchart showing a processing example of a processing unit.
11(a) is an overall view of the organic EL display device, and (b) is a view showing a cross-sectional structure of one pixel.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. On the other hand, the following embodiments do not limit the invention according to the claims, and it cannot be said that all combinations of features described in the embodiments are essential to the invention. Two or more of the features described in the embodiments may be arbitrarily combined. In addition, the same reference number is attached|subjected to the same or similar structure, and overlapping description is abbreviate|omitted.

<1. Electronic device manufacturing line>

1 is a schematic diagram showing a part of the configuration of a manufacturing line for an electronic device according to an embodiment. The production line in FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone, and the substrate 100 is sequentially conveyed to the film formation block 301, and the substrate 100 is organically Film formation of EL is performed.

In the film formation block 301, a film formation apparatus 1 described later is installed around a transfer chamber 302 having an octagonal shape in plan view, and a plurality of film formation processes for the substrate 100 are performed. Chambers 303a to 303d and a mask storage chamber 305 in which masks before and after use are stored are arranged. In the transfer room 302 , a transfer robot 302a that transfers the substrate 100 is disposed. The transport robot 302a includes a hand that holds the substrate 100 and an articulated arm that horizontally moves the hand. In other words, the film formation block 301 is a cluster type film formation unit in which a plurality of film formation chambers 303a to 303d are arranged so as to surround the transfer robot 302a. Incidentally, in the following description, the film formation chambers 303a to 303d may be referred to as the film formation chamber 303 unless otherwise distinguished.

A buffer chamber 306 , a turning chamber 307 , and a pass chamber 308 are disposed on the upstream side and the downstream side of the film formation block 301 in the transport direction of the substrate 100 (direction of the arrow), respectively. During the manufacturing process, each seal is kept under vacuum. On the other hand, although only one film formation block 301 is shown in FIG. 1 , the production line according to the present embodiment has a plurality of film formation blocks 301, and the plurality of film formation blocks 301 include a buffer chamber ( 306), the turning chamber 307, and the pass chamber 308 are connected by a connecting device. On the other hand, the configuration of the connection device is not limited to this, and may be configured only of the buffer chamber 306 or the pass chamber 308, for example.

The transfer robot 302a carries the substrate 100 from the pass chamber 308 on the upstream side to the transfer chamber 302, transfers the substrate 100 between the film formation chambers 303, and performs mask storage 305. and the film formation chamber 303, the mask is conveyed, and the substrate 100 is carried out from the conveyance chamber 302 to the buffer chamber 306 on the downstream side.

The buffer room 306 is a room for temporarily storing the substrate 100 according to the operating conditions of the production line. In the buffer chamber 306, a substrate storage shelf (also referred to as a cassette) having a multi-stage structure capable of storing a plurality of substrates 100 while maintaining a horizontal state with the surface to be processed (film-formation surface) of the substrate 100 facing downward in the direction of gravity. ), and a lifting mechanism for lifting the substrate storage shelf so as to align the stage for loading or unloading the substrate 100 to the transport position. Thus, the plurality of substrates 100 can be temporarily accommodated and retained in the buffer chamber 306 .

The turning chamber 307 has a device for changing the direction of the substrate 100 . In this embodiment, the turning chamber 307 rotates the direction of the board|substrate 100 by 180 degrees by the transfer robot installed in the turning chamber 307. The transfer robot installed in the turning room 307 rotates the substrate 100 received in the buffer room 306 in a supported state by 180 degrees and passes it to the pass room 308, thereby moving the substrate 100 into the buffer room 306 and into the pass room. In 308, the front end and the rear end in the conveying direction (arrow direction) of the substrate 100 are exchanged. As a result, since the direction in which the substrate 100 is loaded into the film formation chamber 303 becomes the same direction in each film formation block 301, the film formation scanning direction and the mask direction for the substrate 100 are respectively set. In the film formation block 301, they can be matched. With this structure, it is possible to match the direction in which the masks are installed in the mask storage chamber 305 in each film formation block 301, simplify mask management, and improve usability.

The pass chamber 308 is a chamber for conveying the substrate 100 carried in by the apparatus of the turning chamber 307 to the transfer robot 302a of the downstream film formation block 301 . In this embodiment, as will be described later, alignment of the substrate 100 and measurement of the film thickness of the film formed on the substrate 100 are performed in the pass chamber 308 .

The control system of the manufacturing line includes a host device 300 that controls the entire line as a host computer and control devices 14a to 14d, 309, 310, and 311 that control each component, and these are wired or wireless communication lines ( 300a), communication is possible. The control devices 14a to 14d are installed corresponding to the film formation chambers 303a to 303d, and control the film formation apparatus 1 described later. The control device 309 controls the transfer robot 302a. The control device 310 controls the transfer robot installed in the turning chamber 307 . The control device 311 controls devices that perform alignment and film thickness measurement in the pass chamber 308 . The host device 300 transmits information about the substrate 100 and instructions such as conveyance timing to the respective control devices 14a to 14d, 309, 310, and 311, and the respective control devices 14a to 14d, 309, and 310 , 311) controls each configuration based on the received instructions. On the other hand, in the following description, the control devices 14a to 14d may be referred to as the control device 14 unless otherwise distinguished.

<2. Overview of Film Formation Equipment>

2 is a schematic diagram of a film forming apparatus 1 according to an embodiment. The film forming apparatus 1 is a device that forms a film of a deposition material on a substrate 100 and forms a thin film of a deposition material in a predetermined pattern using a mask 101 . As the material of the substrate 100 on which the film is formed by the film forming apparatus 1, a material such as glass, resin, or metal can be appropriately selected, and a resin layer formed on glass such as polyimide is preferably used. Substances, such as an organic material and an inorganic material (metal, metal oxide, etc.), are mentioned as a deposition material. The film forming apparatus 1 can be applied to, for example, electronic devices such as display devices (flat panel displays, etc.), thin-film solar cells, organic photoelectric conversion elements (organic thin-film imaging elements), manufacturing apparatuses for manufacturing optical members, etc. And, in particular, it is applicable to a manufacturing apparatus for manufacturing an organic EL panel. In the following description, an example in which the film forming apparatus 1 forms a film on the substrate 100 by vacuum deposition is described, but the film forming method is not limited to this, and various film forming methods such as sputtering and CVD can be applied. On the other hand, in each drawing, an arrow Z indicates a vertical direction (direction of gravity), and an arrow X and an arrow Y indicate horizontal directions orthogonal to each other.

The film forming apparatus 1 has a box-shaped vacuum chamber 3 . The inner space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump not shown. On the other hand, in this specification, "vacuum" refers to a state filled with gas at a pressure lower than atmospheric pressure, in other words, a reduced pressure state. In the inner space 3a of the vacuum chamber 3, a substrate support unit 6 for supporting the substrate 100 in a horizontal position, a mask stand 5 for supporting the mask 101, a film forming unit 4, and a plate Unit 9 is placed. The mask 101 is a metal mask having an opening pattern corresponding to the thin film pattern formed on the substrate 100, and is fixed on the mask stand 5. As the mask 101, a mask having a structure in which a mask foil having a thickness of about several micrometers to several tens of micrometers is welded and fixed to a frame-shaped mask frame can be used. The material of the mask 101 is not particularly limited, but it is preferable to use a metal having a small coefficient of thermal expansion such as an invar material. The film forming process is performed in a state where the substrate 100 is placed on the mask 101 and the substrate 100 and the mask 101 overlap each other.

The plate unit 9 includes a cooling plate 10 that cools the substrate 100 during film formation, and a magnet plate 11 that attracts the mask 101 by magnetic force to bring the substrate 100 and mask 101 into close contact. ) is provided. The plate unit 9 is installed so that it can be moved up and down in the Z direction by a lift unit 13 equipped with a ball screw mechanism or the like, for example.

The film formation unit 4 is composed of a heater, a shutter, an evaporation source driving mechanism, an evaporation rate monitor, and the like, and is an evaporation source that deposits a evaporation material on the substrate 100 . More specifically, in this embodiment, the film formation unit 4 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged side by side in the X direction, and evaporation materials are discharged from each nozzle. The film formation unit 4 is reciprocally moved in the Y direction (direction away from the connection portion between the film formation chamber 303 and the transfer chamber 302) by an evaporation source moving mechanism (not shown).

Further, the film forming apparatus 1 includes an alignment apparatus 2 that aligns the substrate 100 and the mask 101 . Schematically, the alignment device 2 has an alignment mark formed on a substrate 100 and a mask 101 by a detection unit 17 (see Fig. 3) constituted by a control device 14 and an imaging unit 16. detect the location of And the alignment device 2 adjusts the relative position of the board|substrate 100 and the mask 101 by the position adjustment unit 20 based on this detection result.

The alignment device 2 includes an imaging unit 16 that constitutes a detection unit 17 and captures an image of an alignment mark used for alignment of the substrate 100 and the mask 101 . The imaging unit 16 includes cameras 160 and 161 . In the present embodiment, the film forming apparatus 1 performs two-step alignment of the rough alignment and the fine alignment as the alignment of the substrate 100 and the mask 101 . Rough alignment is rough alignment of the substrate 100 and mask 101, and fine alignment is higher-precision alignment of the substrate 100 and mask 101 than rough alignment. However, the aspect of alignment is not limited to this, and the film forming apparatus 1 may perform only fine alignment, for example.

A camera 160 captures an image of an alignment mark for rough alignment, and a camera 161 captures an image of an alignment mark for fine alignment. In this embodiment, the detection unit 17 includes two cameras 160 and four cameras 161, respectively. Hereinafter, when the two cameras 160 are described separately, they may be expressed as cameras 1601 and 1602. Note that, when the four cameras 161 are described separately, they may be described as cameras 1611 to 1614. In addition, in the following description, the camera 160 may be described as a rough camera 160, and the camera 161 may be described as a fine camera 161. Meanwhile, the number of cameras 160 and 161 is an example and can be changed appropriately.

The alignment device 2 includes a substrate support unit 6 that supports the periphery of the substrate 100 . The substrate support unit 6 includes a pair of base portions 62 spaced apart from each other in the X direction and extending in the Y direction, and a plurality of finger-shaped mounting portions protruding inward from the base portion 62 ( 61) is provided. On the other hand, the mounting unit 61 is sometimes called a "receiving finger" or a "finger". The plurality of mounting portions 61 are arranged at intervals on each of the pair of base portions 62 . The part on the long side of the periphery of the substrate 100 is placed on the mounting portion 61 . The base portion 62 is hung down from the beam member 222 via a plurality of pillars 64 .

As in the present embodiment, the transfer robot 302a has a configuration in which the base portions 62 are spaced apart in the X direction and the base portions 62 are not formed on the short side of the substrate 100 as a pair, so that the transfer robot 302a is placed on the mounting portion 61 ), it is possible to suppress interference between the transfer robot 302a and the base portion 62 at the time of transferring the substrate. However, the base portion 62 may have a rectangular frame shape so as to surround the entire periphery of the substrate 100 . As a result, the efficiency of transportation and transfer of the substrate 100 can be improved. Also, the base portion 62 may have a rectangular frame shape with a partially cutout portion. By partially forming a rectangular frame shape with notches, interference between the transfer robot 302a and the base portion 62 can be suppressed when the transfer robot 302a transfers the substrate to the mounting unit 61, and the substrate The efficiency of transport and delivery of (100) can be improved.

In addition, the substrate support unit 6 includes a clamp unit 63 . The clamp unit 63 has a plurality of clamp parts 66 . Each clamp part 66 is provided corresponding to each mounting part 61, and it is possible to hold the board|substrate 100 with the periphery of the board|substrate 100 interposed by the clamp part 66 and the mounting part 61. The clamp unit 63 includes an actuator for bringing each clamp part 66 closer to and away from the substrate 100, for example. As an aspect of supporting the substrate 100, other than the aspect in which the periphery of the substrate 100 is held with the periphery of the substrate 100 interposed therebetween by the clamp portion 66 and the placing portion 61 as described above, the clamp portion 66 is not provided. An aspect in which the substrate 100 is only placed on the portion 61 can be adopted.

The alignment device 2 includes a position adjusting unit 20 that adjusts the relative positions of the substrate 100 whose periphery is supported by the substrate holding unit 6 and the mask 101 . The position adjustment unit 20 displaces the substrate holding unit 6 on the X-Y plane based on the captured images of the substrate 100 by the cameras 160 and 161 and the alignment marks provided on the mask 101, etc. The relative position of the substrate 100 with respect to (101) is adjusted. In this embodiment, the position of the mask 101 is fixed and the relative positions of the substrate 100 are adjusted by displacing them, but the mask 101 may be displaced and adjusted, or the substrate 100 and the mask ( 101) may be displaced. The position adjustment unit 20 includes, for example, a plurality of electric actuators employing a ball screw mechanism and the like, which move the substrate support unit 6 in the X-Y direction or rotate around the Z axis. It may be configured to do so.

The alignment device 2 raises and lowers the substrate support unit 6 so that the substrate 100 and the mask 101 whose periphery is supported by the substrate support unit 6 are moved in the thickness direction (Z direction) of the substrate 100. It is provided with an approach and separation unit 22 that approaches and separates (separates). In other words, the approach and separation unit 22 can bring the substrate 100 and the mask 101 closer in an overlapping direction. The approach and separation unit 22 may also include, for example, an electric actuator employing a ball screw mechanism.

<3. Control Configuration>

FIG. 3 is a diagram showing an example of a hardware configuration of the film forming apparatus 1 shown in FIG. 2 . In FIG. 3, the structure related to the alignment of the substrate 100 and the mask 101 is mainly shown. For example, the film forming apparatus 1 executes a predetermined operation based on an instruction from the host apparatus 300, which is a host computer that collectively controls the production line.

The control device 14 includes a processing unit 141, a storage unit 142, and an I/F unit 143 (interface unit), which are connected to each other by a bus not shown. The processing unit 141 is, for example, a CPU. The processing unit 141 controls driving of the position adjustment unit 20 and various actuators 25 by executing the program stored in the storage unit 142 . The storage unit 142 is, for example, RAM, ROM, a hard disk, or the like, and various data other than programs executed by the processing unit 141 are stored. The I/F unit 143 relays transmission and reception of signals between the processing unit 141 and an external device. The I/F section 143 is composed of, for example, a communication I/F and an input/output I/F.

In this embodiment, as described above, the detection unit ( 17) is composed. That is, the position or angle of the alignment marks provided on the substrate 100 and the mask 101 is detected by the control device 14 performing an image recognition process using a captured image captured by the imaging unit 16. do.

The input unit 18 is a touch panel, a hard key, or the like, and receives input from a user. The display unit 19 is, for example, a liquid crystal display or the like, and displays various types of information. In addition, as various types of actuators 25, actuators and the like possessed by the lifting unit 13, the position adjusting unit 20, or the proximity and separation unit 22 described above may be included.

<4. Substrates and Masks>

4(a) to (c) are plan views showing configuration examples of the substrate 100 and the mask 101, FIG. 4(a) shows the mask 101 alone, and FIG. 4(b) shows the substrate ( 100) alone, FIG. 4(c) shows a state in which the mask 101 and the substrate 100 are overlapped. On the other hand, in FIG. 4(c), imaging regions R1 to R6 indicate imaging regions of cameras 1611 to 1614, 1601, and 1602, respectively. In Fig. 4(a) to (c), since each mark is highlighted for ease of understanding, the size relative to the substrate or mask is different from the actual one.

The mask 101 is for depositing a deposition material on the substrate 100 in a desired pattern. A predetermined pattern of openings is formed in a region of the mask 101 overlapping the substrate 100 (omitted in FIG. 4A , etc.), and one surface of the substrate 100 is covered with the mask 101 By performing the vapor deposition in the dark state, the vapor deposition material is deposited on the substrate 100 in a pattern along the opening. On the other hand, as the mask 101, a mask having a structure in which a mask foil having a thickness of about several micrometers to several tens of micrometers is welded and fixed to a frame-shaped mask frame can be used. The material of the mask 101 is not particularly limited, but it is preferable to use a metal having a small thermal expansion coefficient such as an invar material.

Further, the mask 101 is provided with mask marks 1011 and 1012 for rough alignment and mask marks 1013 to 1016 for fine alignment. Mask marks 1011 and 1012 are provided near the center of the short side of the mask 101, respectively, and are imaged by corresponding cameras 1601 and 1602. The mask marks 1013 to 1016 are provided near corners of the mask 101, respectively, and images are captured by corresponding cameras 1611 to 1614. On the other hand, in the following description, the mask marks 1011 and 1012 are collectively referred to as mask rough marks 1017, and the mask marks 1013 to 1016 are collectively referred to as mask fine marks 1018 in some cases. That is, the mask rough mark 1017 is imaged by the rough camera 160, and the mask fine mark 1018 is imaged by the fine camera 161.

The substrate 100 is an object on which a deposition material is deposited and is a transmissive member that transmits light detected by the imaging unit 16 . When the substrate 100 is transported into the vacuum chamber 3 by the transfer robot 302a, the substrate 100 is held by the substrate holding unit 6, and the substrate 100 is moved by the positioning unit 20. ) and position adjustment of the mask 101 is performed. In addition, since the substrate 100 is transparent, even if the substrate 100 is disposed between the mask 101 and the imaging unit 16, the imaging unit 16 can image the mask marks 1017 and 1018. have.

On the substrate 100, substrate marks 1001 and 1002 for rough alignment and substrate marks 1003 to 1006 for fine alignment are provided. Substrate marks 1001 and 1002 are provided near the center of the short side of the substrate 100, respectively, and are detected by corresponding cameras 1601 and 1602, respectively. Substrate marks 1003 to 1006 are respectively provided near corners of the substrate 100 and are detected by corresponding cameras 1611 to 1614 . On the other hand, in the following description, substrate marks 1001 and 1002 are collectively referred to as substrate rough marks 1007, and substrate marks 1003 to 1006 are collectively referred to as substrate fine marks 1008 in some cases. That is, the substrate rough mark 1007 is detected by the rough camera 160, and the substrate fine mark 1008 is detected by the fine camera 161.

In this embodiment, the substrate marks 1007 (1001 to 1002) and 1008 (1003 to 1006) are respectively position detection marks 1001a to 1002a and 1003a to 1006a and angle detection marks 100lb to 1002b and 1003b to 1006b). However, a structure in which these are integrated or a structure in which only the positions of the respective substrate marks 1007 and 1008 are detected is also usable. Alternatively, the substrate fine mark 1008 may be constituted by a mark for position detection and a mark for angle detection, and the substrate rough mark 1007 may be constituted only by a mark for position detection. That is, either one of the substrate marks 1007, 1008 may be constituted by a mark for position detection and a mark for angle detection, and the other may be constituted only by a mark for position detection.

In the present embodiment, in the rough alignment, the relative positions of the substrate 100 and the mask 101 are such that the positional relationship between the substrate rough marks 1007 and the corresponding mask rough marks 1017 satisfies a predetermined condition. is adjusted In fine alignment, the relative positions of the substrate 100 and the mask 101 are adjusted so that the positional relationship between the substrate fine marks 1008 and the corresponding mask fine marks 1018 satisfies a predetermined condition.

<5. Overview of the alignment process>

FIG. 5 is a diagram schematically illustrating an outline of an alignment process performed by the film forming apparatus 1. As shown in FIG. States ST1 to ST2 indicate a state before alignment, state ST3 a state in which a rough alignment is being executed, and states (ST4 to ST8) a state in which a fine alignment is being executed, respectively.

State ST1 represents a state in which the substrate 100 is carried into the vacuum chamber 3 by the transfer robot 302a. In this state, the substrate 100 is placed on the mounting portion 61, but the clamp portion 66 is spaced above the substrate 100. Thus, the substrate 100 is not pinched. In addition, the central portion of the substrate 100 sags due to its own weight.

State ST2 represents a state in which the substrate 100 is clamped by the mounting portion 61 and the clamp portion 66 . Specifically, from the state ST1, the actuator of the clamp unit 63 moves the clamp part 66 downward, so that the long side of the substrate 100 is clamped by the mounting part 61 and the clamp part 66. are interfering

A state ST3 indicates a state in which the rough alignment is being executed. Specifically, the processing unit 141 captures images of the substrate rough mark 1007 and the mask rough mark 1017 with the rough camera 160, and specifies the position and angle of each mark based on the captured images. . Then, the processing unit 141 adjusts the position of the substrate 100 in the XY direction and the rotation angle θ around the Z axis by the position adjustment unit 20 based on the position and angle of each specific mark. On the other hand, after the adjustment by the position adjusting unit 20, the substrate rough mark 1007 and the mask rough mark 1017 are imaged again by the rough camera 160, and the position of each mark specified based on the captured image and If the angle does not satisfy the condition, position adjustment by the position adjustment unit 20 may be performed again.

After state ST4, the state in which fine alignment is being executed is shown. State ST4 is a state in which the substrate support unit 6 is lowered by the approach and separation unit 22 and the substrate fine mark 1008 and the mask fine mark 1018 are detected by the fine camera 161. indicates On the other hand, when the position and angle of each mark specified based on the captured image satisfy the conditions, the states ST5 and ST6 may be omitted. Here, in order to improve the accuracy of position adjustment by alignment, it is required to improve the detection accuracy of each mark by the imaging unit 16 . Therefore, it is preferable to use a camera capable of acquiring images with high resolution as the fine camera 161 used in fine alignment requiring high-precision position adjustment. However, since the depth of field becomes shallow when the resolution of the camera is increased, the camera 161 that cuts both marks in order to simultaneously photograph the mark formed on the substrate 100 and the mark formed on the mask 101 to be photographed It is necessary to bring them closer together in the optical axis direction of . Accordingly, in the present embodiment, when detecting the substrate fine mark 1008 and the mask fine mark 1018 in fine alignment, the substrate 100 is set to the substrate rough mark 1007 and the mask rough mark ( 1017) is brought closer to the mask 101 than when it is detected. At this time, as shown in state ST4 of FIG. 5 , the substrate 100 may be brought into contact with the mask 101 partially. Since the peripheral region of the substrate 100 is supported, the central portion is in a state of sagging due to its own weight, and therefore, typically, the central portion of the substrate 100 is in a state of partially contacting the mask 101 .

On the other hand, in the rough alignment, as shown in the state ST3 of FIG. 5, the substrate rough mark 1007 and the mask rough mark 1017 are detected in a state where the substrate 100 and the mask 101 are spaced apart, and the substrate (100) and adjustment of the position of the mask 101 is performed. In the rough alignment, alignment can be performed while the substrate 100 and the mask 101 are spaced apart by using the rough camera 160 having a relatively deep depth of field. In the present embodiment, rough alignment is performed in this way with the substrate 100 and the mask 101 spaced apart from each other, and then fine alignment with higher accuracy of position adjustment is performed. As a result, when the substrate 100 and the mask 101 are brought into contact with each other for mark detection in fine alignment, since the relative positions of the substrate 100 and the mask 101 have already been adjusted to some extent, The pattern of the film formed on the substrate 100 and the opening pattern of the mask 101 come into contact with each other in a somewhat aligned state. Therefore, damage to the film formed on the substrate 100 due to contact between the substrate 100 and the mask 101 can be reduced. That is, as in the present embodiment, rough alignment in which the substrate 100 and the mask 101 are roughly adjusted while leaving them spaced apart, and fine alignment including a step in which the substrate 100 and the mask 101 are partially brought into contact with each other. By executing these in combination, high-accuracy position adjustment can be realized while reducing damage to the film formed on the substrate 100.

A state ST5 indicates a state in which position adjustment of the substrate 100 is performed based on an image captured by the camera 161 . Specifically, after the substrate 100 is separated from the mask 101 by lifting the substrate support unit 6 by the approach separation unit 22, the positioning unit 20 moves the substrate 100 in the XY direction. You are adjusting the position and rotation angle (θ) around the Z axis.

In state ST6, the substrate 100 is brought close to the mask 101 again, and the substrate fine mark 1008 and the mask fine mark are made by the camera 161 in a state where the substrate 100 is in contact with the mask 101. A state in which 1018 is being imaged is shown. If the position and angle of each mark specified based on the captured image satisfies the condition, the process proceeds to state ST7, and if the condition is not satisfied, it returns to state ST5.

State ST7 shows a state in which the substrate 100 is placed on the mask 101 and the plate unit 9 is overlaid thereon. Specifically, after the substrate 100 is placed on the mask 101 by lowering the substrate support unit 6 by the approach separation unit 22, the cooling plate 10 is lowered by the lifting unit 13. to bring the plate unit 9 into contact with the substrate 100.

A state ST8 indicates a state in which the final position confirmation by the camera 161 is being performed. After the substrate 100 is sandwiched between the mask 101 and the cooling plate 10 in state ST7, the actuator of the clamp unit 63 moves the clamp portion 66 upward, so that the clamp portion ( 66) is separated from the substrate 100, and the state of holding the long side of the substrate 100 is released. Thereafter, the substrate holding unit 6 is lowered by the approach and separation unit 22 to separate the mounting portion 61 from the substrate 100 , which has been in contact with the peripheral region of the substrate 100 . As a result, the substrate 100 is separated from the substrate holding unit 6 and is held by the mask 101 and the plate unit 9 . In this state, the substrate fine mark 1008 and the mask fine mark 1018 are imaged by the fine camera 161, and it is checked whether or not their positional relationship satisfies the condition. If these positional relationships satisfy the conditions, the alignment of the substrate 100 and the mask 101 is terminated, and if the conditions are not satisfied, the state returns to ST5.

<6. Position Adjustment in Fine Alignment>

6 is a diagram for explaining an example of a fine alignment process.

The processing part 141 acquires the positions (P1-P4) of the some mask mark 1013-1016 provided in the mask 101 based on the captured image of each camera 1611-1614. In this embodiment, the positions P1 to P4 are the center positions of the circular mask marks 1013 to 1016, respectively. Further, in the present embodiment, the storage unit 142 includes a coordinate system (camera coordinate system) within each field of view of each of the cameras 1611 to 1614 and a coordinate system (world coordinate system) of the film forming apparatus 1 as a whole. Information associated with is stored. The processing part 141 calculates the coordinates of the positions P1-P4 of the mask marks 1013-1016 in each camera coordinate system based on each captured image of each camera 1611-1614. The processing unit 141 acquires the coordinates in the world coordinate system of the positions (P1 to P4) of the plurality of mask marks 1013 to 1016 from information relating the camera coordinate system and the world coordinate system described above.

In addition, the processing unit 141 corresponds to each of the mask marks 1013 to 1016 from the plurality of substrate marks 1003 to 1006 provided on the substrate 100 based on the captured images of the respective cameras 1611 to 1614. Target positions T1 to T4 are set on the substrate 100 . On the other hand, the target positions (T1 to T4) are set as coordinates in the world coordinate system based on information relating the camera coordinate system and the world coordinate system, similarly to the positions (P1 to P4) of the mask marks 1013 to 1016. . In this embodiment, target positions T1 to T4 are set at positions inside the substrate 100 by a predetermined distance from the portions extending in the X direction of the cross-shaped marks for position detection 1003a to 1006a. Meanwhile, in FIG. 6 , the distance between the position P1 and the target position T1 is represented by a distance L1. The respective distances between the positions P2 to P4 and the target positions T2 to T4 are similarly expressed as distances L2 to L4.

Then, the processing unit 141, based on the positions (P1 to P4) of the plurality of mask marks 1013 to 1016 and the target positions (T1 to T4) corresponding to these, the substrate by the position adjustment unit 20 The relative positions of (100) and mask (101) are adjusted. As an example, first, the processing unit 141 positions the substrate 100 by the position adjusting unit 20 so that the centers of the positions P1 to P4 coincide with the centers of the target positions T1 to T4. Adjust the Thereafter, the processing unit 141 moves the substrate ( 100) is rotated by the position adjusting unit 20. On the other hand, the alignment method described is an example, and other well-known techniques are applicable.

<7. Acquisition of alignment mark position>

Hereinafter, details of acquisition of alignment mark positions in alignment, particularly fine alignment, will be described.

As described above, in alignment by the film forming apparatus 1, the detection unit 17 constituted by the control device 14 and the imaging unit 16 detects the position of each alignment mark. In this embodiment, detection of the position of the mask fine mark 1018 on the mask 101 is performed by a pattern matching method using a model mark (model image) prepared to correspond to the mask fine mark 1018. In other words, the detection and positioning of the mask fine marks 1018 of the mask 101 are performed by normalized correlation pattern matching.

For example, the processing unit 141 checks whether or not a region matching the prepared model mark exists in the captured image of the fine camera 161, and if it exists, based on where the region is, the mask fine The position of the mark 1018 is specified.

Fig. 7(a) is a diagram for explaining an aspect of pattern matching for specifying the position of the mask fine mark 1018. In (a) of FIG. 7, an example in the case of using the captured image of the camera 1611 is shown. 7(b) is a diagram showing an example of the model mark 40. As shown in FIG.

The processing unit 141 captures image data (e.g., luminance data per pixel) of an area R10 having the same size as the model mark 40 in the imaging area R1 of the camera 1611 and the model mark 40. ) of data (eg, luminance data for each pixel) is compared with each other, and a correlation value between these images is calculated. The correlation value is, for example, a value of a parameter representing the degree to which the model mark 40 and the luminance data of all pixels of the corresponding region in the imaging region R1 coincide.

When the calculated correlation value exceeds a predetermined threshold and has sufficient correlation, the processing unit 141 places a model mark ( It is determined that an alignment mark corresponding to 40) exists. On the other hand, the processing unit 141, when the calculated correlation value is equal to or less than a predetermined threshold value, that is, when the degree of matching of the data is low, is located in the region R10 where the correlation value is calculated in the imaging region R1. It is determined that there is no alignment mark corresponding to the model mark 40 .

The processing unit 141 repeatedly performs the same processing while moving the position of the region R10 on the XY plane, for example, one pixel at a time within the imaging region R1. The processing unit 141, when there is a position of the region R10 in which the correlation value with the model mark 40 exceeds the threshold value exists in the imaging region R1, the region R10 having the largest correlation value The position can be specified as the position of the mask fine mark 1018. On the other hand, the processing unit 141 determines that the mask fine mark 1018 is not detected when the correlation value is equal to or less than the threshold value at all positions where the correlation value is calculated. On the other hand, the method of normalized correlation pattern matching described above is an example, and a well-known method can be appropriately employed.

On the other hand, data of the model mark 40 (for example, luminance data for each pixel) is stored in the storage unit 142, for example. In other words, the storage unit 142 stores the data of the corresponding model mark 40 separately for each camera, for example, for the cameras 1611 to 1614 .

Incidentally, although the detection of the position of the mask fine mark 1018 of the mask 101 has been described here, the position of the substrate fine mark 1008 of the substrate 100 may be detected by the same method.

By the way, when the detection unit 17 detects the position of the alignment mark on the substrate 100 or the mask 101 by image recognition of the captured image of the camera 161, the camera 161 attachment position shifts , out of focus, or other factors may cause the detection result to change. Due to variations in detection results, an increase in alignment time or a decrease in alignment accuracy may occur. Therefore, in this embodiment, the detection accuracy by the detection unit 17 is evaluated by the following process.

<8. Processing example of processing unit 141>

(Processing Example 1)

8 is a flowchart showing a processing example of the processing unit 141. In this flowchart, the fine alignment between the substrate 100 and the mask 101 (S101 to S105) and the evaluation of the position detection accuracy by the detection unit 17 as necessary after the fine alignment (S106 to S111) are performed. represents the processing of That is, this flowchart can be executed after execution of rough alignment. This flowchart is realized by, for example, the processing unit 141 reading and executing a program stored in the storage unit 142.

In step S101 (hereinafter, each step is simply referred to as S101 or the like), the processing unit 141 executes detection processing by the detection unit 17. The detection process is a process in which the detection unit 17 detects the positions of the substrate fine mark 1008 and the mask fine mark 1018 . To describe an example of the processing, first, the processing unit 141 controls the camera 161 to capture images of the substrate fine marks 1008 and the mask fine marks 1018 . Next, the processing unit 141 specifies the positions of the substrate fine mark 1008 and the mask fine mark 1018 based on the captured image of the camera 161 . For example, the processing unit 141 performs <7. The positions of the substrate fine mark 1008 and the mask fine mark 1018 are specified by the method described in Acquisition of Alignment Mark Position>.

In S102, the processing unit 141 executes position adjustment processing. The position adjustment process is a process of adjusting the relative position between the substrate 100 and the mask 101 . The processing unit 141, for example, <6. Position adjustment in fine alignment> controls the position adjustment unit 20 to execute position adjustment processing.

In S103, the processing unit 141 executes detection processing by the detection unit 17 again. Here, the detection unit 17 detects the positions of the substrate fine mark 1008 and the mask fine mark 1018 after position adjustment has been performed by the process of S102.

In S104, the processing unit 141 executes error judgment processing. The error determination processing is a processing for determining whether or not the error in the position or angle between the substrate 100 and the mask 101 after alignment is within a reference value. For example, based on the result of the detection process in S103, the processing unit 141 may determine that the error is within the reference value if the distance and angle difference between the centers of the substrate 100 and the mask 101 are within the reference value.

S105 is a conditional branch for the judgment result of S104. When the processing unit 141 determines that the error is within the reference value in S104, it proceeds to S106, and when it is determined that the error is not within the reference value in S104, it returns to S102. That is, the processing unit 141 repeats the steps of S102 to S104 until the error in the position or angle of the substrate 100 and the mask 101 falls within the reference value. On the other hand, if the processing unit 141 does not determine that the error is within the reference value in S104 even after repeating S102 to S104 a predetermined number of times, it may notify the operator of an alignment-related error.

In S106, the processing unit 141 executes execution judgment of the position detection precision evaluation by the detection unit 17. For example, the processing unit 141 determines whether to execute the detection processing a plurality of times in S108 according to the processing conditions of the film forming apparatus 1 . Fig. 9(a) is a flowchart showing a processing example of the processing unit 141, and shows a specific processing example of S106 in Fig. 8 .

In S161, the processing unit 141 acquires information about the number of re-execution of alignment in the past. For example, the processing unit 141 acquires the information by reading it from the storage unit 142 . In this embodiment, the storage unit 142 stores the detection results in the detection processing (S101, S103) and the judgment result in the error determination processing (S104) for each substrate 100 as history information of the alignment operation. do it by doing For example, the processing unit 141 acquires, as information on the number of times of re-execution of alignment, an average value of the number of times of re-execution for the latest predetermined number of substrates 100 based on the determination result of the error determination process.

S162 is a conditional branch regarding the number of re-execution of alignment. The processing unit 141 proceeds to S163 when the number of times of re-execution of alignment satisfies the condition, and proceeds to S164 otherwise. Although the conditions here can be set appropriately, for example, the processing unit 141 may determine that the number of times of re-execution satisfies the condition when the average value of the number of times of re-execution is equal to or less than a threshold value. In S163, the processing unit 141 determines not to execute the precision evaluation, and returns to the flowchart of FIG. 8. In S164, the processing unit 141 determines that the accuracy evaluation is to be executed, and returns to the flowchart of FIG. 8.

When the average value of the number of times of re-execution of alignment is equal to or less than the threshold value, it can be considered that the alignment is being performed with constant accuracy. Accordingly, in the present embodiment, by judging that the position detection precision evaluation is executed when the number of alignment re-executions does not satisfy the condition, the position detection precision evaluation can be executed when it is considered that the alignment precision has deteriorated. .

Return to the description of FIG. 8 . S107 is a conditional branch for the judgment result of S106. The processing unit 141 proceeds to S108 when it is determined that the precision evaluation is to be executed in S106, and when it is determined that the precision evaluation is not to be executed, the flowchart is terminated.

In S108, the processing unit 141 executes the detection processing a plurality of times in a state where the substrate 100 and the mask 101 are stopped. The processing unit 141 repeats the detection processing similar to S101 or S103 a plurality of times. The number of times of detection processing to be executed can be set appropriately, but may be, for example, 2 to 5000 times, 2000 to 4000 times, or, in other words, 3000 times. In this embodiment, this multiple times of detection process is performed after position adjustment of the board|substrate 100 and the mask 101 by the position adjustment unit 20.

In S109, the processing unit 141 executes statistical processing on the result of the detection processing in S108. For example, the processing unit 141 calculates an average value (μ), a variance (σ2), or a standard deviation (σ) of the distance between the center of the substrate 100 and the mask 101. Further, for example, the processing unit 141 may acquire the maximum or minimum value of the distance between the center of the substrate 100 and the mask 101, and values such as 2σ and 3σ for the standard deviation.

S110 is a conditional branch for statistical processing in S109. The processing unit 141 ends the flowchart if the result of the statistical processing in S109 satisfies the criteria, and proceeds to the processing in S111 if the criteria are not satisfied. The criterion here may relate to values such as variance (σ2), standard deviation (σ), 2σ, and 3σ of the distance between the centers of the substrate 100 and the mask 101, for example. That is, the criterion here may relate to the deviation of the distance between the centers of the substrate 100 and the mask 101 .

In S111, the processing unit 141 executes detection unit adjustment processing, which is processing for executing adjustment of the detection unit 17. In S108, the detection process is executed a plurality of times with the substrate 100 and the mask 101 still. Therefore, when it is determined in S110 that the statistical results do not satisfy the criterion, there is a possibility that the variation in the detection results by the detection unit 17 increases. Accordingly, the processing unit 141 executes processing for adjusting the detection unit 17 in order to suppress variations in detection results. For example, the processing unit 141 displays a notification on the display unit 19 to prompt the operator to adjust the position and focus of the camera 161 in the Z direction. Further, for example, the processing unit 141 adjusts the size of the model mark 40 used for pattern matching. After that, the processing unit 141 returns to S108. That is, the processing unit 141 repeats the detection processing and the statistical processing a plurality of times until the result of the statistical processing in S109 satisfies the standard. On the other hand, the processing unit 141 may notify the operator of an error if the statistical result does not satisfy the criterion even after repeating these a predetermined number of times.

According to this processing example, since statistical processing is performed on the result of multiple times of detection processing, the detection accuracy by the detection unit 17 can be evaluated. Further, since the detection unit 17 is adjusted according to the statistical result, it is possible to suppress a decrease in alignment accuracy due to a decrease in the detection accuracy of the position of the detection unit 17 .

On the other hand, in this example of processing, it is determined whether or not to evaluate the position detection accuracy of the detection unit 17 based on the number of re-runs of alignment in the past, but based on the required time for alignment in the past, the evaluation is performed. It may be judged whether or not to do so. Alternatively, as shown in FIG. 1 , when a plurality of film formation chambers 303 having film formation apparatuses 1 are arranged in a production line, for comparison with the number of re-execution of alignment or the required time in other film formation apparatuses 1 Based on this, it may be determined whether or not to perform the evaluation. For example, the control device 14 acquires information about the number of times the alignment is re-executed from the other control devices 14 . Then, the processing unit 141 of the control device 14 determines that the average number of re-execution of alignment for a predetermined number of recent substrates 100 is equal to or greater than a certain ratio compared to the average value of the average number of re-executions of the other film forming apparatuses 1 . When it is large (for example, twice or more), it may be judged that the evaluation is performed.

In addition, in this processing example, when it is judged to be Yes in the conditional branch of S110, the flowchart ends. However, if Yes is determined in the conditional branch of S110 without going through the step of S111 and the flowchart ends, it is determined that precision evaluation is executed in S106, but the statistical processing in S109 satisfies the standard. That is, in such a case, there is a possibility that the accuracy of the alignment is lowered due to factors other than the detection unit 17 . Accordingly, the processing unit 141 may display on the display unit 19 a notification to the effect that there is a possibility that the alignment accuracy may be reduced due to a factor other than the detection unit 17 .

(Processing Example 2)

9(b) is a flowchart showing a processing example of the processing unit 141. This flowchart shows a specific processing example of S106 in FIG. 8 . In the manufacture of electronic devices, there are cases where film formation is performed on a plurality of substrates (one lot) of substrates 100 using one mask 101 . When the position adjustment unit 20 displaces the substrate 100 to adjust the position of the substrate 100 and the mask 101 as in the present embodiment, the camera 161 and the camera 161 are in use while the same mask 101 is being used. The distance of the mask 101 is kept constant. However, when the mask 101 is exchanged, the distance between the camera 161 and the mask 101 changes, which may affect the detection accuracy of the position by the detection unit 17. Therefore, in this processing example, the detection accuracy of the position of the detection unit 17 is evaluated when the mask 101 is exchanged in the manufacturing process of the electronic device.

In S261, the processing unit 141 acquires information about the substrate 100 aligned in S101 to S105. For example, the processing unit 141 stores the information about the substrate 100 that has been aligned in steps S101 to S105 by reading it from the processing unit 141 . In this embodiment, the storage unit 142 stores identification information and attribute information of the substrate 100 in association with each other as information about the substrate 100 . The attribute information includes information on whether the target substrate 100 is the substrate 100 for production or the substrate 100 for testing, or the number of times the target substrate 100 is brought into the film forming apparatus 1 within the same lot. It may also include information about whether or not it is.

S262 is a conditional branch related to the properties of the substrate 100. The processing unit 141 proceeds to S263 if the substrate 100 for which information has been acquired in S261 is a target substrate for precision evaluation, and otherwise proceeds to S264. Here, the target substrate for precision evaluation can be set appropriately, but may be, for example, a test substrate for film formation evaluation for evaluating the film formation performance after the mask 101 is replaced. Further, for example, the target substrate for precision evaluation may be a test substrate for detection accuracy evaluation carried in for evaluation of the detection accuracy of the position of the detection unit 17 after the test substrate for film formation evaluation. Further, for example, the target substrate for precision evaluation may be the substrate for production 100 that is initially carried into the film forming apparatus 1 within the same lot. In S263, the processing unit 141 determines not to execute the precision evaluation, and returns to the flowchart of FIG. 8. In S264, the processing unit 141 determines that the accuracy evaluation is to be executed, and returns to the flowchart of FIG. 8.

According to this processing example, when the mask 101 is exchanged, the detection unit 17 evaluates the detection accuracy of the position, so the distance between the camera 161 and the mask 101 changes due to the mask exchange. It is possible to evaluate the decrease in detection accuracy due to the failure.

On the other hand, as described above, although the target substrate for precision evaluation can be set appropriately, by using the test substrate for detection accuracy evaluation carried into the film deposition apparatus 1 after the test substrate for film formation evaluation as the target substrate, during film formation evaluation. Position detection accuracy can be evaluated. This makes it possible to evaluate the detection unit 17 without affecting the productivity of the electronic device.

On the other hand, by using a test substrate for film formation evaluation or a production substrate 100 first brought into the film formation apparatus 1 within the same lot as a target substrate, dedicated use for evaluating the detection accuracy of the position of the detection unit 17 The substrate 100 becomes unnecessary. Therefore, an increase in manufacturing cost can be suppressed.

(Processing Example 3)

10 is a flowchart showing a processing example of the processing unit 141. This flowchart shows a processing example in the case where the position detection accuracy of the detection unit 17 is evaluated for each camera 161 . Hereinafter, the same reference numerals are assigned to the same steps as those in the flowchart of Fig. 8, and descriptions thereof are omitted.

As shown by imaging regions R1 to R4 in FIG. 4 , the respective cameras 1611 to 1614 respectively capture a set of substrate fine marks 1008 and mask fine marks 1018 corresponding to each other. In this processing example, for each such set, statistical processing for the result of the detection processing of the position by the detection unit 17 is executed.

Steps S101 to S108 are the same as those of the flowchart in FIG. 8 .

In S309, the processing unit 141 executes statistical processing on the result of the multiple detection processing in S108 for each of the cameras 1611 to 1614. For example, the processing unit 141 calculates the average value μ, the variance σ2, the standard deviation σ, or the like of the distances L1 to L4 (see Fig. 4) for each of the cameras 1611 to 1614. do. Further, for example, the processing unit 141 may obtain the maximum value or minimum value of the distances L1 to L4 and values such as 2σ and 3σ for the standard deviation.

S310 is a conditional branch for statistical processing in S309. As a result of the statistical processing in S109, the processing unit 141 ends the flowchart when all the cameras 1611 to 1614 satisfy the criteria, and proceeds to the process in S312 when the criteria are not satisfied. The criterion here may relate to values such as variance (σ2), standard deviation (σ), 2σ, and 3σ of the distances L1 to L4, for example. That is, the criterion here may relate to the variation of the distances L1 to L4.

S312 is also a conditional branch for statistical processing in S309. As a result of the statistical processing in S109, the processing unit 141 proceeds to S313 when a predetermined number of cameras 161 satisfy the criterion, and otherwise proceeds to S311. For example, the processing unit 141 may proceed to S313 when three of the four installed cameras 1611 to 1614 satisfy the criteria.

In S313, the processing part 141 changes the camera 161 used by alignment. For example, when it is determined in S312 that the three cameras 161 satisfy the criteria, the processing unit 141 selects the cameras 161 used in the alignment from the four cameras 1611 to 1614 that satisfy the criteria. It is changed to the three cameras 161 determined to be so. After that, the processing unit 141 ends the flowchart.

For example, when the camera 161 used for alignment is changed from the cameras 1611 to 1614 to the cameras 1611 to 1613, the processing unit 141 determines the center of the positions P1 to P3 and the target position T1. The positions of the substrate 100 and the mask 101 may be adjusted so that the centers of -T3) coincide. Then, the processing unit 141 adjusts the position while maintaining a state in which the centers of the positions P1 to P3 coincide with the centers of the target positions T1 to T3 so that the sum of squares of the distances L1 to L3 is minimized. The substrate 100 may be rotated by the unit 20 . Meanwhile, the described method is an example, and other known technologies can be applied.

In S311, the processing unit 141 executes detection unit adjustment processing, which is processing for executing adjustment of the detection unit 17. In this processing example, the processing unit 141 causes the display unit 19 to display a notification prompting adjustment of the camera 161 determined not to satisfy the standard among the cameras 1611 to 1614 in S312. After that, the processing unit 141 ends the flowchart.

According to this processing example, since statistical processing is executed on the result of the detection processing for each of the cameras 1611 to 1614, if there is a possibility that the detection accuracy by the detection unit 17 is reduced, which camera is it? (161). In addition, in this processing example, the alignment after evaluation of the detection accuracy by the detection unit 17 is performed based on the camera 161 determined to satisfy the standard in S312. Therefore, even if there is a camera 161 that does not satisfy the criteria, alignment can be performed by excluding the possibility of a decrease in accuracy due to the camera 161.

On the other hand, in this processing example, statistical processing is performed for the distances L1 to L4 for each of the cameras 1611 to 1614, but the items to be subjected to the statistical processing are not limited. For example, the processing unit 141 may calculate the recognition rate of the substrate fine mark 1008 or the mask fine mark 1018 for each of the cameras 1611 to 1614 . In this case, the criterion in S310 may be whether or not the recognition rate of each mark is equal to or higher than the threshold value. Alternatively, the coordinates of the positions P1 to P4 and target positions T1 to T4 (see Fig. 6) may be subjected to statistical processing.

On the other hand, the processing described in each processing example can be combined appropriately. For example, the detection unit adjustment processing may be executed when at least one of the results of statistical processing of the distance between the center of the substrate 100 and the mask 101 and the distances L1 to L4 does not satisfy the standard. Alternatively, as the determination of execution of the precision evaluation in S106, it is judged that the flowcharts shown in FIGS. In some cases, precision evaluation may be performed. That is, at the timing when the mask 101 is exchanged, while the accuracy evaluation of the detection unit 17 is executed each time, even if the accuracy evaluation of the detection unit 17 is executed again when the number of re-execution of alignment increases within the same lot do.

<9. Manufacturing Method of Electronic Device>

Next, an example of a manufacturing method of an electronic device is described. Hereinafter, the configuration and manufacturing method of an organic EL display device as an example of an electronic device will be illustrated. In the case of this example, the film formation block 301 illustrated in FIG. 1 is installed, for example, in three places on the production line.

First, an organic EL display device to be manufactured will be described. Fig. 11(a) is an overall diagram of the organic EL display device 50, and Fig. 11(b) is a diagram showing a cross-sectional structure of one pixel.

As shown in (a) of FIG. 11 , in the display area 51 of the organic EL display device 50, a plurality of pixels 52 having a plurality of light emitting elements are arranged in a matrix form. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

On the other hand, the term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 51 . In the case of a color organic EL display device, a pixel 52 is formed by a combination of a plurality of subpixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B exhibiting different light emission. is composed of The pixel 52 is often composed of a combination of three types of sub-pixels: a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 just needs to include at least one type of subpixel, preferably includes two or more types of subpixels, and more preferably includes three or more types of subpixels. As the subpixels constituting the pixel 52, for example, a combination of four types of subpixels: a red (R) light emitting element, a green (G) light emitting element, a blue (B) light emitting element, and a yellow (Y) light emitting element. may be continued

Fig. 11(b) is a partial cross-sectional schematic view along the line A-B of Fig. 11(a). The pixel 52 includes a first electrode (anode) 54, a hole transport layer 55, and any one of a red layer 56R, a green layer 56G, and a blue layer 56B on the substrate 100. and an electron transport layer 57 and a plurality of sub-pixels composed of organic EL elements including a second electrode (cathode) 58. Among them, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are each formed in a pattern corresponding to a light emitting element emitting red, green, and blue (sometimes described as an organic EL element).

In addition, the 1st electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed commonly over a plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in (b) of FIG. 11, after the hole transport layer 55 is formed as a common layer over a plurality of sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B are formed as sub-pixel regions. It may be formed separately for each pixel region, and furthermore, the electron transport layer 57 and the second electrode 58 may be formed as a common layer over a plurality of sub-pixel regions.

Meanwhile, in order to prevent a short circuit between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer is degraded by moisture or oxygen, a protective layer 60 is provided to protect the organic EL element from moisture or oxygen.

In (b) of FIG. 11, the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but depending on the structure of the organic EL display element, a plurality of layers having a hole blocking layer or an electron blocking layer are formed. It can be. Further, between the first electrode 54 and the hole transport layer 55, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 54 into the hole transport layer 55 is performed. may form Similarly, an electron injection layer may also be formed between the second electrode 58 and the electron transport layer 57 .

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed as a single light emitting layer, or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed of a red light emitting layer, and the lower layer may be formed of a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light emitting layer, and the upper layer may be formed of an electron transport layer or a hole blocking layer. By providing the layer below or above the light emitting layer in this way, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

In addition, although the example of the red layer 56R was shown here, the same structure may be employed also in the green layer 56G or the blue layer 56B. Also, the number of layers may be two or more. Further, layers of different materials such as a light emitting layer and an electron blocking layer may be laminated, or layers of the same material may be laminated, for example, two or more light emitting layers may be laminated.

Next, an example of a method for manufacturing an organic EL display device will be described in detail. Here, it is assumed that the red layer 56R is composed of two layers, a lower layer 56R1 and an upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light emitting layer.

First, a circuit (not shown) for driving an organic EL display device and a substrate 100 on which a first electrode 54 is formed are prepared. Meanwhile, the material of the substrate 100 is not particularly limited, and may be made of glass, plastic, metal, or the like. In this embodiment, as the substrate 100, a substrate in which a polyimide film is laminated on a glass substrate is used.

On the substrate 100 on which the first electrode 54 is formed, a resin layer such as acrylic or polyimide is coated with a bar coat or spin coat, and the resin layer is formed by lithography to open an opening in the portion where the first electrode 54 is formed. An insulating layer 59 is formed by patterning to form. This opening corresponds to a light emitting region in which the light emitting element actually emits light. On the other hand, in the present embodiment, processing is performed on a large-size substrate until the formation of the insulating layer 59, and a division process of dividing the substrate 100 is executed after the formation of the insulating layer 59.

The substrate 100 on which the insulating layer 59 is patterned is carried into the first film formation chamber 303, and the hole transport layer 55 is formed as a common layer over the first electrode 54 in the display area. The hole transport layer 55 is formed into a film using a mask in which openings are formed for each display area 51 that will eventually become a panel portion of each organic EL display device.

Next, the substrate 100 formed up to the hole transport layer 55 is carried into the second film formation chamber 303 . Align the substrate 100 and the mask, place the substrate on the mask, and place the substrate 100 on the hole transport layer 55 in a portion of the substrate 100 where a red-emitting element is disposed (a region where red sub-pixels are formed). , the red layer 56R is formed. Here, the mask used in the second film formation chamber is a very fine mask in which openings are formed only in a plurality of regions serving as red subpixels among a plurality of regions on the substrate 100 serving as subpixels of the organic EL display device ( fixed tax) is a mask. As a result, the red layer 56R including the red light emitting layer is formed only in the region to be the red sub-pixel among the regions to be the plurality of sub-pixels on the substrate 100 . In other words, the red layer 56R is not formed in an area serving as a blue sub-pixel or a region serving as a green sub-pixel among regions serving as a plurality of sub-pixels on the substrate 100, but in an area serving as a red sub-pixel. It is formed selectively.

Similarly to the film formation of the red layer 56R, the green layer 56G is formed in the third film formation chamber 303, and further, the blue layer 56B is formed in the fourth film formation chamber 303. After the film formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth film formation chamber 303 . The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G, and 56B.

The substrate formed up to the electron transport layer 57 is moved to the sixth film formation chamber 303, and the second electrode 58 is formed. In this embodiment, in the first film formation chamber 303 to the sixth film formation chamber 303, film formation of each layer is performed by vacuum deposition. However, the present invention is not limited to this, and for example, the second electrode 58 in the sixth film formation chamber 303 may be formed by sputtering. Thereafter, the substrate formed up to the second electrode 58 is moved to a sealing device, and the protective layer 60 is formed by plasma CVD (sealing step), and the organic EL display device 50 is completed. On the other hand, although the protective layer 60 is formed here by the CVD method, it is not limited thereto, and may be formed by the ALD method or the inkjet method.

Here, film formation in the first film formation chamber 303 to the sixth film formation chamber 303 is performed using a mask having openings corresponding to patterns of respective layers to be formed. In film formation, after adjusting (aligning) the relative positions of the substrate 100 and the mask, the substrate 100 is placed on the mask to form the film. Here, the alignment process performed in each film formation chamber is performed in the same way as the alignment process described above.

<10. Other Embodiments>

In the above embodiment, the position detection accuracy is evaluated by the detection unit 17 after the fine alignment of the substrate 100 and the mask 101, but other configurations can also be employed. Specifically, if the substrate marks 1003 to 1006 for fine alignment and the mask marks 1013 to 1016 for fine alignment are located in the imaging regions R1 to R4, respectively, the above-described plurality of times of detection processing (S108) and statistical processing (S109). Accordingly, the processing unit 141 may evaluate the position detection accuracy by the detection unit 17 before the rough alignment or between the rough alignment and the fine alignment.

According to the present invention, a program for realizing one or more functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device reads and executes the program. It can also be realized by processing. It can also be realized by a circuit (eg ASIC) that realizes one or more functions.

The invention is not limited to the above embodiment, and various modifications and changes are possible within the scope of the gist of the invention.

1: Tabernacle device
2: alignment device
14: control device
17: detection unit
20: position adjustment unit
141: processing unit

Claims (19)

detection means for executing a detection process for detecting the position of the substrate mark provided on the substrate and the position of the mask mark provided on the mask;
Position adjusting means for adjusting the relative positions of the substrate and the mask based on a result of the detection process by the detection means;
and calculation means for executing statistical processing on results of a plurality of times of the detection processing executed by the detection means in a state where the substrate and the mask are stopped. According to claim 1,
The film forming apparatus according to claim 1, wherein the result is a result of the plurality of times of the detection processing executed by the detection means after the position adjustment by the position adjustment means. According to claim 1 or 2,
The film forming apparatus further comprising judgment means for determining whether to execute the plurality of times of the detection processing according to processing conditions of the film forming apparatus. According to claim 1 or 2,
The film forming apparatus according to claim 1, further comprising judgment means for judging whether or not to execute the detection processing a plurality of times based on the information on the number of times of re-execution of alignment by the detection means and the position adjusting means. According to claim 1 or 2,
The film forming apparatus performs film formation on a plurality of substrates using one mask;
The film forming apparatus further includes determining means for judging that the plurality of times of the detection processing is executed when the mask is exchanged. According to claim 1 or 2,
the film formation apparatus performs film formation on the substrate for test carried into the film formation apparatus after exchanging the mask, and evaluates a result of film formation on the substrate for test;
The film forming apparatus further includes judgment means for judging that the plurality of times of the detection processing is executed with respect to the substrate carried into the film forming apparatus next to the substrate for the test. According to claim 1 or 2,
The film forming apparatus according to claim 1, further comprising adjusting means for performing adjustment of the detection means based on a result of the statistical processing by the calculating means. According to claim 7,
The detecting means includes imaging means for capturing images of the substrate mark and the mask mark;
The film forming apparatus according to claim 1, wherein the adjustment is an adjustment of the position of the imaging means. According to claim 7,
The detecting means includes imaging means for capturing images of the substrate mark and the mask mark;
The film forming apparatus according to claim 1, wherein the adjustment is an adjustment of the focus of the imaging means. According to claim 7,
The detecting means is
imaging means for capturing images of the substrate mark and the mask mark;
and specifying means for specifying the positions of the substrate mark and the mask mark by pattern matching using a captured image of the imaging means and a model mark,
The film forming apparatus according to claim 1, wherein the adjustment is an adjustment of the model mark. According to claim 1 or 2,
The substrate includes a plurality of the substrate marks,
The mask includes a plurality of mask marks respectively corresponding to the plurality of substrate marks,
The detecting means is
a plurality of imaging means for respectively imaging a plurality of sets of the substrate marks and the mask marks corresponding to each other;
and specifying means for specifying the position of the substrate mark and the position of the mask mark constituting the set, respectively, using captured images of each of the plurality of imaging means. According to claim 11,
the statistical processing is performed for each set;
The position adjustment means performs the position adjustment without using a specific result of the specific means for the set for which a result of the statistical processing does not satisfy a criterion. According to claim 1 or 2,
substrate holding means for holding the substrate;
further comprising mask holding means for holding the mask;
The substrate holding means and the mask holding means are maintained in a stopped state from the time when one of the plurality of detection processes by the detection means is executed until the other detection process is executed. A film forming apparatus characterized in that it becomes. According to claim 1 or 2,
The statistical processing is performed on the position of the substrate mark, the position of the mask mark, and the position calculated based on at least one of the position of the substrate mark and the position of the mask mark, or their relative positions or relative distances. A film forming apparatus comprising a process of calculating some or all of the average value, variance, standard deviation, maximum value, and minimum value for each of the above values. detection means for executing a detection process for detecting the position of the substrate mark provided on the substrate and the position of the mask mark provided on the mask;
Positioning means for adjusting the relative positions of the substrate and the mask based on the result of the detection process by the detection means.
A computer of a film forming apparatus having a
A program for causing the substrate and the mask to function as calculating means for executing statistical processing on the results of a plurality of times of the detection processing executed by the detection means in a stopped state. detection means for executing a detection process for detecting the position of the substrate mark provided on the substrate and the position of the mask mark provided on the mask;
Positioning means for performing positional adjustment of the substrate and the mask based on the result of the detection process by the detection means.
As a method for evaluating position detection accuracy of a film forming apparatus having
a step of executing the detection processing a plurality of times by the detection means in a state where the substrate and the mask are stopped;
A method for evaluating position detection accuracy, characterized by including a step of performing statistical processing on the results of the plurality of times of the detection processing. a step of evaluating position detection accuracy of the substrate mark and the mask mark by the position detection accuracy evaluation method according to claim 16;
a step of performing the positional adjustment of the substrate and the mask by the positioning means;
and a step of forming a film on the substrate through the mask on which the position adjustment has been performed. detection means for executing a detection process for detecting the position of the substrate mark provided on the substrate and the position of the mask mark provided on the mask;
Positioning means for performing positional adjustment of the substrate and the mask based on the result of the detection process by the detection means.
A method for adjusting a film forming apparatus having
a step of executing the detection processing a plurality of times by the detection means in a state where the substrate and the mask are stopped;
a step of performing statistical processing on the results of the plurality of times of the detection processing;
and a step of performing adjustment of the detecting means based on a result of the statistical processing. a step of adjusting the film forming apparatus by the method for adjusting the film forming apparatus according to claim 18;
a step of performing the positional adjustment of the substrate and the mask by the positioning means;
and a step of forming a film on the substrate through the mask on which the position adjustment has been performed.

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