KR20220148197A - How to divide composites - Google Patents

Abstract

A method for dividing a composite material in which cracks do not occur on the end surface of a brittle material layer is provided. The present invention is a method for dividing a composite material 10 in which an optical function layer 2 and a protective layer 3 are laminated on each side of the brittle material layer 1, respectively, and the laser oscillated from the first laser light source 20 The first processing groove 21 is formed by irradiating the light L1 to the optical functional layer along the dividing line DL of the composite material, and the laser light L2 oscillated from the second laser light source 30 is emitted. The processing groove forming process of forming the second processing groove 31 by irradiating the protective layer along the dividing line DL of the composite material, and the laser light L3 oscillated from the ultrashort pulse laser light source 40 after the processing groove formation process ) is irradiated to the brittle material layer along the dividing line to form a processing mark 11; The resin forming the protective layer is removed so as to be equal to or larger than the spot diameter (D) at the irradiation position of one laser beam to the brittle material layer.

Description

How to divide composites

In the present invention, a resin optical function layer (eg, polarizing film) is laminated on one surface side of the brittle material layer, and a resin protective layer (eg, protective film) is laminated on the other surface side of the brittle material layer. It relates to a method for dividing the laminated composite material. In particular, the present invention relates to a method capable of segmenting a composite material without cracking the end face of the brittle material layer.

In addition to the recent progress in thinning and high definition of liquid crystal panels, liquid crystal panels equipped with a touch sensor function on the screen are used in a wide range of fields from mobile phones to information displays in order to provide a variety of interfaces.

In recent years, a liquid crystal panel having an in-cell type liquid crystal cell in which a touch sensor is mounted on a glass substrate of a liquid crystal cell from the viewpoint of thickness reduction and weight reduction has appeared.

On the other hand, film-shaped glass called thin glass attracts attention as a front plate disposed on the outermost surface of a liquid crystal panel. Since thin glass can be wound up in roll shape, there exists an advantage that it can adapt also to the manufacturing process of a so-called roll-to-roll system, and the glass polarizing film integrated with a polarizing film is proposed (for example, refer patent document 1).

Since a liquid crystal panel equipped with a touch sensor function can be obtained just by bonding a glass polarizing film to an in-cell type liquid crystal cell, the manufacturing process can be greatly simplified compared to a general liquid crystal panel using tempered glass as the front panel.

The method described in Patent Document 2 is proposed as a method for dividing a composite material in which a brittle material layer formed of glass, etc. and an optical function layer formed of a polarizing film, etc. are laminated to a desired shape and size according to the use, such as the glass polarizing film. .

In the method described in Patent Document 2, a laser light oscillated from a laser light source such as a CO ₂ laser light source is irradiated to the optical function layer (resin layer in Patent Document 2) of the composite material along the dividing line of the composite material to form an optical function layer. After removing the resin, laser light (ultra-short pulse laser light) oscillated from an ultra-short pulse laser light source is irradiated to the brittle material layer along the dividing line of the composite to remove the brittle material forming the brittle material layer. .

According to the method described in patent document 2, it has the advantage that a crack does not generate|occur|produce in the end surface of the brittle material layer after division.

Here, like the glass polarizing film, the composite material in which a brittle material layer formed of glass, etc. and an optical function layer formed of a polarizing film, etc. are laminated is on the opposite side to the surface of the brittle material layer on which the optical function layer is laminated in the composite piece after division It is common that a protective layer such as a protective film is laminated on the surface and shipped. Since labor is required to carry out the step of laminating a protective layer for each composite piece after division, an optical function layer is laminated on one side of the brittle material layer, and the other side of the brittle material layer is laminated in order to eliminate this labor and reduce the man-hours. A method of dividing a composite material in which a protective layer is laminated on the face side at a time is desired.

However, Patent Document 2 does not propose a method of dividing a composite material in which an optical function layer is laminated on one surface side of the brittle material layer and a protective layer is laminated on the other surface side of the brittle material layer.

In addition, Non-Patent Document 1 describes the use of the filamentation phenomenon of ultrashort pulse laser light in a processing technique using ultrashort pulse laser light, and application of a multifocal optical system or a Bessel beam optical system to an ultrashort pulse laser light source.

International Publication No. 2013/175767 Japanese Patent Laid-Open No. 2019-122966

John Lopez et al., "GLASS CUTTING USING ULTRASHORT PULSED BESSEL BEAMS", [online], October 2015, International Congress on Applications of Lasers & Electro-Optics (ICALEO) , [Film Search July 8, 1], Internet (URL: https://www.researchgate.net/publication/284617626_GLASS_CUTTING_USING_ULTRASHORT_PULSED_BESSEL_BEAMS)

The present invention has been made to solve the problems of the prior art as described above, and a resin optical function layer is laminated on one side of the brittle material layer, and a resin protective layer is laminated on the other side of the brittle material layer. An object of the present invention is to provide a method for dividing a composite material that has been made into a composite material, wherein cracks do not occur on the end surface of the brittle material layer.

In order to solve the said subject, the present inventors examined applying the method of patent document 2 mentioned above.

Specifically, in a composite material in which an optical functional layer made of a resin is laminated on one surface side of the brittle material layer and a protective layer made of a resin is laminated on the other surface side of the brittle material layer, laser light oscillated from a CO ₂ laser light source or the like A processing groove (first processing groove) is formed in the optical function layer along _the dividing line of the composite material by the It was considered to form a groove (second machining groove). In addition, laser light oscillated from an ultrashort pulse laser light source through the second processing groove in order to prevent serious thermal degradation from occurring on the end surface of the optical functional layer after division (to reduce discoloration due to thermal degradation) (ultrashort pulse laser light) I thought that it would be good to irradiate the brittle material layer along the dividing line of the composite material.

However, as a result of actually testing the method by the present inventors, if the output of the laser light forming the second processing groove is small and the depth of the second processing groove is too small, the brittle material layer is brittle when irradiated with ultrashort pulse laser light. It was found that the composite material could not be divided because it was not possible to form a processing mark penetrating through the material layer in the thickness direction. On the other hand, if the output of the laser light forming the second processing groove is too large, the brittle material layer receives heat damage, and when the ultra-short pulse laser light is irradiated to the brittle material layer, the end surface of the brittle material layer is the starting point. It was found that cracks occurred in In order to set the laser light output for forming the second processing groove to an appropriate value so that processing marks can be formed in the brittle material layer and cracks are not generated on the end surface of the brittle material layer, very subtle adjustment is required. It can be seen that automation is difficult.

For this reason, as a result of further intensive studies by the present inventors, the second processing groove is formed when the second processing groove is formed so that the width of the second processing groove is equal to or greater than the spot diameter at the irradiation position of the ultra-short pulse laser light to the brittle material layer. The present invention was accomplished by discovering that a composite material could be divided without generating a crack in the end face of the brittle material layer without requiring a delicate adjustment of the output of the laser light.

The present invention has been completed based on the findings of the present inventors.

That is, in order to solve the above problems, the present invention divides a composite in which an optical functional layer made of a resin is laminated on one side of the brittle material layer, and a protective layer made of a resin is laminated on the other side of the brittle material layer. As a method, by irradiating a laser light oscillated from a first laser light source to the optical functional layer along a dividing line of the composite material to remove a resin forming the optical functional layer, a first processing groove along the dividing line is formed. In addition to forming, the second processing groove is formed along the predetermined dividing line by irradiating the laser light oscillated from the second laser light source to the protective layer along the predetermined dividing line to remove the resin forming the protective layer. A brittle material for forming the brittle material layer by irradiating the laser light oscillated from the ultra-short pulse laser light source from the side of the second processing groove to the brittle material layer along the predetermined dividing line after the processing groove forming step and the processing groove forming step and a process mark forming step of forming a machining mark along the dividing line by removing Provided is a method for dividing a composite material in which a resin forming the protective layer is removed so as to be equal to or larger than a spot diameter at a location where one laser light is irradiated onto the brittle material layer.

According to the method according to the present invention, in the processing groove forming process, the resin forming the optical function layer and the resin forming the protective layer are removed to form the first processing groove and the second processing groove along the dividing line. In the mark forming step, a machining mark along the same dividing line is formed by removing the brittle material forming the brittle material layer from the second machining groove side. And the width of the second machining groove formed in the machining groove forming step is equal to or greater than the spot diameter at the irradiation position of the laser light (ultra-short pulse laser light) oscillated from the ultra-short pulse laser light source in the machining scar forming step to the brittle material layer. formed to be Thereby, a brittle material layer can be divided without generating a crack in the end surface of a brittle material layer according to the knowledge of the present inventors mentioned above.

As in the method according to the present invention, by making the width of the second processing groove equal to or larger than the spot diameter at the irradiation position of the ultrashort pulse laser light to the brittle material layer, the energy of the ultrashort pulse laser light is consumed to remove the resin forming the protective layer Since it becomes difficult to become brittle and is sufficiently used to remove the brittle material forming the brittle material layer, it is possible to form processing marks in the brittle material layer and to prevent cracks from occurring on the end face of the brittle material layer.

In addition, in the method according to the present invention, "irradiating laser light to the optical function layer along the dividing line of the composite material" means from the thickness direction of the composite material (the direction of lamination of the optical function layer, the brittle material layer, and the protective layer) It means to irradiate a laser beam to an optical function layer along a boa dividing line. In addition, in the method according to the present invention, "irradiating laser light to the protective layer along the predetermined dividing line" means dividing the composite material as viewed from the thickness direction (the direction of lamination of the optical functional layer, the brittle material layer, and the protective layer). It means irradiating laser light to the protective layer along the line. In addition, "irradiating laser light to the brittle material layer from the side of the second processing groove along the predetermined division line" means the division scheduled as viewed from the thickness direction of the composite material (the direction in which the optical function layer, the brittle material layer, and the protective layer are laminated) It means irradiating the laser light along the line from the side of the second processing groove to the protective layer.

In addition, in the method by this invention, "irradiation along the division line..." means irradiation on the division line, or irradiation parallel to the division line in the vicinity of the division line.

In addition, in the method according to the present invention, "the width of the second processing groove" means the dimension of the bottom of the second processing groove in a direction orthogonal to the dividing line.

In addition, in the method according to the present invention, the types of the first laser light source and the second laser light source used in the processing groove forming step are not particularly limited as long as the resin can be removed with the oscillated laser light. . However, since it is possible to increase the relative movement speed (processing speed) of the laser light with respect to the composite material, it is preferable to use a CO ₂ laser light source or a CO laser light source that oscillates a laser light having a wavelength in the infrared region. The first laser light source and the second laser light source may be of the same type or different types. In addition, the first laser light source and the second laser light source do not necessarily need to be separately prepared, and the first laser light source can also be used as the second laser light source.

When the first laser light source and the second laser light source are separately prepared, the first laser light source is arranged on the optical function layer side, the second laser light source is arranged on the protective layer side, and the first laser light source is used for the optical function layer. After forming the first processing groove, the second processing groove may be formed in the protective layer using a second laser light source. Further, after forming the second processing groove in the protective layer using the second laser light source, the first processing groove may be formed in the optical function layer using the first laser light source. It is also possible to simultaneously form the first processing groove and the second processing groove by using the first laser light source and the second laser light source.

Further, when the first laser light source is also used as the second laser light source, the first laser light source (second laser light source) is disposed on the side opposite to either one of the optical function layer and the protective layer, and the first laser light source (first laser light source) 2 laser light source) is used to form a first processing groove in the optical function layer (or a second processing groove is formed in the protective layer), and then the first laser light source (second laser light source ), it is also possible to invert the composite material to face, and to form a second processing groove in the protective layer (or to form a first processing groove in the optical function layer) using the first laser light source (second laser light source).

Moreover, as a process trace formed in the process trace formation process in the method by this invention, for example, the stitching-line-shaped through-hole along the dividing line as described in patent document 2 can be illustrated. In this case, the composite material can be divided by applying an external force along the dividing line after the process mark forming process. Examples of methods for adding an external force to the composite include mechanical brake (mountain folding), heating of a region near the line to be cut by infrared laser light, vibration addition by an ultrasonic roller, adsorption and lifting by a sucker, etc. . In the case of using the heating in the vicinity of the line to be cut by infrared laser light as a method of adding an external force to the composite material, cracks are formed along the line to be divided so as to connect the through-holes in the stitching line by the thermal stress generated in the brittle material layer. progress, and the brittle material layer is divided (cleaved). In addition, when the resin residue remains at the bottom of the first processing groove, the brittle material layer is divided by applying an external force as described above, and then, for example, by applying an additional mechanical external force to the optical function layer, the composite material may be divided. . Even if an additional mechanical force is applied to the optical function layer and furthermore to the brittle material layer, cracks do not occur on the end face of the brittle material layer because the brittle material layer is already divided at this point.

In the method according to the present invention, the processing marks formed in the processing marks forming step are not necessarily limited to the through-holes in the shape of a stitching line. In the processing scar formation process, if the relative movement speed of the laser light oscillated from the ultrashort pulse laser light source and the brittle material layer along the planned division line is set to be small, or the repetition frequency of the pulse oscillation of the ultrashort pulse laser light source is set to be large, A through hole (long hole) integrally connected along the dividing line is formed. In this case, the brittle material layer can be divided without applying an external force along the dividing line after the process mark forming process. However, when the resin residue remains at the bottom of the first processing groove, the composite material may be divided by, for example, applying a mechanical external force to the optical function layer after the brittle material layer is divided.

In the method according to the present invention, the width of the second machining groove formed in the machining groove forming step is set at the irradiation position of the laser light (ultrashort pulse laser light) oscillated from the ultra-short pulse laser light source in the machining scar forming step to the brittle material layer. In order to set the spot diameter or more, for example, the irradiation position of the laser light oscillated from the second laser light source is shifted in a direction orthogonal to the dividing line, and after irradiating the laser light to the protective layer at each irradiation position, each irradiation position It is considered to peel the resin which forms the protective layer which exists in between. If the dimension of the part where this resin is to be peeled (dimension in the direction perpendicular to the dividing line) is greater than or equal to the spot diameter at the location where the ultra-short pulse laser beam is irradiated to the brittle material layer, the width of the second processing groove is that of the ultra-short pulse laser beam. It can be set as more than the spot diameter in the irradiation position to a brittle material layer.

That is, preferably, in the processing groove forming step, the irradiation position of the laser light oscillated from the second laser light source to the protective layer is shifted in a direction orthogonal to the predetermined dividing line, and at each irradiation position, the divided dividing line is shifted. The second processing groove is formed by irradiating the laser light to the protective layer along the irradiated surface and then peeling the resin forming the protective layer present between the respective irradiation positions.

According to the above preferred method (hereinafter, appropriately referred to as "peel-off method"), for example, in the processing groove forming step, the laser beam oscillated from the second laser light source is directed in a direction orthogonal to the planned dividing line with respect to the dividing line as a reference. It is conceivable to irradiate each of the positions equidistant from each other, and to peel the resin forming the protective layer present therebetween. In this way, after forming the second processing groove having the dividing line as the center in the width direction, when ultra-short pulse laser light is irradiated on the dividing line, the irradiation position of the laser light oscillated from the second laser light source and the ultra-short pulse laser light The irradiation position is shifted by 1/2 of the width of the second machining groove.

Therefore, even if the output of the laser light oscillated from the second laser light source is set to a certain extent large in the process groove forming process, the resin forming the protective layer is removed, and the surface of the brittle material layer is exposed and received some heat damage, the same Since it is difficult to irradiate an ultrashort pulse laser beam to a location, it is hard to generate|occur|produce a crack in the end surface of a brittle material layer.

In addition, it is possible to perform peeling of resin which forms the protective layer which exists between each irradiation position using a well-known peeling apparatus suitably.

In the method according to the present invention, the method in which the width of the second processing groove formed in the processing groove forming step is greater than or equal to the spot diameter at the irradiation position of the ultrashort pulse laser light to the brittle material layer is not limited to the above peeling method. .

For example, in the processing groove forming step, the irradiation position of the laser light oscillated from the second laser light source to the protective layer is sequentially shifted in a direction orthogonal to the dividing line, and the division scheduled at each irradiation position A method of forming the second processing groove by irradiating the protective layer with the laser beam along a line (hereinafter referred to as an "offset method" as appropriate) may be used.

If the range (the range in the direction perpendicular to the division line) for shifting the irradiation position of the laser light oscillated from the second laser light source is greater than or equal to the spot diameter at the irradiation position of the ultra-short pulse laser light to the brittle material layer, the second processing groove The width of can be made equal to or larger than the spot diameter at the irradiation position of the ultra-short pulse laser light to the brittle material layer.

In this invention, the spot diameter in the irradiation position to the brittle material layer of ultrashort pulse laser beam is set to 100 micrometers, for example.

Therefore, in the machining groove forming process, it is preferable to remove the resin forming the protective layer so that the width of the second machining groove is 100 μm or more, and the width of the second processing groove is 150 μm or more. It is more preferable to remove the resin forming the protective layer.

In addition, when the spot diameter at the irradiation position of the ultra-short pulse laser light to the brittle material layer is 100 µm, the spot diameter on the optical function layer side of the brittle material layer is condensed, for example, 1.2 µm. In addition, when the spot diameter at the position where the ultra-short pulse laser light is irradiated to the brittle material layer is 100 µm, the spot diameter at the position corresponding to the surface of the protective layer (the surface on the side opposite to the surface on the brittle material layer side) is For example, it becomes 154 μm.

Preferably, the protective layer includes a base layer and a pressure-sensitive adhesive layer disposed on the side of the brittle material layer, and a resin that forms the protective layer so that a part of the pressure-sensitive adhesive layer in the thickness direction remains in the process groove forming step. Remove.

According to the above preferred method, since the resin forming the protective layer is removed so that a part of the thickness direction of the pressure-sensitive adhesive layer remains in the processing groove forming process, the brittle material layer is less susceptible to heat damage and cracks further on the end surface of the brittle material layer. This is difficult to happen.

As the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer provided with the protective layer, for example, an acrylic pressure-sensitive adhesive can be used. It is preferable to use a urethane-based pressure-sensitive adhesive that is not easily generated.

That is, preferably, the protective layer includes a base layer and a urethane-based pressure-sensitive adhesive layer disposed on the side of the brittle material layer.

According to the above preferred method, it is possible to prevent the generation of fumes from the pressure-sensitive adhesive layer included in the protective layer in the processing groove forming step. The above preferred method is particularly effective when the above-described offset method is applied in the machining groove forming process. That is, when the offset method is applied, compared to the case where the peeling method is applied, there are many irradiation points of the laser light oscillated from the second laser light source to the protective layer. have. Therefore, the above preferable method capable of preventing the generation of fume is particularly effective when the offset method is applied.

The method according to the present invention is suitably used, for example, when the brittle material layer contains glass and the optical function layer contains a polarizing film.

(Effects of the Invention)

According to the present invention, a composite material in which an optical functional layer made of a resin is laminated on one side of the brittle material layer and a protective layer made of a resin is laminated on the other side of the brittle material layer to generate cracks on the end surface of the brittle material layer. It can be divided without work.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically the schematic structure of the composite material to which the division method by one Embodiment of this invention is applied.
2 is an explanatory diagram schematically illustrating a schematic procedure of a method for dividing a composite material according to an embodiment of the present invention.
3 is a cross-sectional view schematically illustrating the outline procedure of the peeling method in the machining groove forming step.
4 is a plan view schematically illustrating the outline of a peeling method and a process mark forming process in the machining groove forming step in the case where the composite material is divided into four rectangular composite pieces.
5 is a cross-sectional view schematically illustrating an outline procedure of an offset method in a machining groove forming step.
6 is a plan view schematically illustrating the outline procedure of the offset method and the machining mark forming step in the machining groove forming step in the case where the composite material is divided into four rectangular composite pieces.
7 shows an example of the result when the peeling method is applied in the process groove forming process as an Example.
8 shows an example of test conditions and test results when the offset method is applied in the machining groove forming process as an Example.

Hereinafter, a method for dividing a composite material according to an embodiment of the present invention will be described with reference to the accompanying drawings as appropriate.

<Composite material composition>

First, the structure of the composite material to which the dividing method by this embodiment is applied is demonstrated.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows the schematic structure of the composite material to which the division method by this embodiment is applied.

In addition, please note that FIG. 1 is shown for reference, and the dimension, scale, and shape of the member etc. shown in the figure may differ from an actual thing in some cases. The same is true for other drawings.

As shown in Fig. 1, the composite material 10 is a brittle material layer 1 and a resin-made optical function layer 2 laminated on one side of the brittle material layer 1 (lower side in the example shown in Fig. 1). And it has a structure in which the resin protective layer 3 laminated|stacked on the other surface side (upper side in the example shown in FIG. 1) of the brittle material layer 1 was laminated|stacked. The protective layer 3 is provided with the base material layer 3a and the adhesive layer 3b arrange|positioned at the brittle material layer 1 side.

The dividing method according to this embodiment divides the composite material 10 in the thickness direction (the stacking direction of the optical functional layer 2, the brittle material layer 1, and the protective layer 3, the vertical direction in FIG. 1, the Z direction) a way to divide it into

The brittle material layer 1, the optical function layer 2, and the protective layer 3 are laminated by any suitable method. For example, the brittle material layer 1, the optical function layer 2, and the protective layer 3 can be laminated|stacked by what is called a roll-to-roll system. For example, a polarizing film, a pressure-sensitive adhesive, and Release film. However, in Fig. 1, the polarizing film, the pressure-sensitive adhesive, and the release film are not shown) while conveying in the longitudinal direction to match each other in the longitudinal direction, and bonding to each other through an adhesive (not shown) makes it brittle The material layer 1 and the optical function layer 2 (the main body of the optical function layer 2 and the adhesive agent) can be laminated|stacked. Next, while conveying the laminate of the elongate brittle material layer 1 and the optical function layer 2 and the base material layer 3a of the elongated protective layer 3 in the longitudinal direction, make the longitudinal directions coincide with each other, , the brittle material layer 1, the optical function layer 2, and the protective layer 3 can be laminated by bonding to each other via the pressure-sensitive adhesive layer 3b. However, after cutting the main body of the brittle material layer 1 and the optical function layer 2 into a predetermined shape, respectively, you may laminate|stack through an adhesive agent. Moreover, after cutting the laminated body of the brittle material layer 1 and the optical function layer 2, and the base material layer 3a of the protective layer 3 into predetermined shapes, respectively, you may laminate|stack through the adhesive layer 3b.

Glass and single crystal or polycrystalline silicon can be exemplified as a brittle material forming the brittle material layer 1 . Glass is suitably used.

As glass, according to classification by composition, soda-lime glass, boric-acid glass, aluminosilicate glass, quartz glass, and sapphire glass can be illustrated. In addition, according to classification by an alkali component, an alkali free glass and low alkali glass can be illustrated. The content of the alkali metal component of the glass (for example, Na ₂ O, K ₂ O, Li ₂ O) is preferably 15% by weight or less, more preferably 10% by weight or less.

The thickness of the brittle material layer 1 is preferably 150 µm or less, more preferably 120 µm or less, and still more preferably 100 µm or less. On the other hand, the thickness of the brittle material layer 1 is preferably 30 µm or more, and more preferably 80 µm or more. If the thickness of the brittle material layer 1 is in such a range, lamination|stacking with the optical function layer 2 by roll-to-roll will become possible.

When the brittle material forming the brittle material layer 1 is glass, the light transmittance of the brittle material layer 1 at a wavelength of 550 nm is preferably 85% or more. When the brittle material forming the brittle material layer 1 is glass, the refractive index of the brittle material layer 1 at a wavelength of 550 nm is preferably 1.4 to 1.65. When the brittle material forming the brittle material layer 1 is glass, the density of the brittle material layer 1 is preferably 2.3 g/cm 3 to 3.0 g/cm 3 , more preferably 2.3 g/cm 3 to 2.7 g/cm 3 It is ㎤.

When the brittle material forming the brittle material layer 1 is glass, a commercially available glass plate may be used as the brittle material layer 1 as it is, or a commercially available glass plate may be polished to a desired thickness. As a commercially available glass plate, For example, "7059", "1737", or "EAGLE2000" by Corning Incorporated, "AN100" by Asahi Glass Co., Ltd., "NA-35" by NH Techno Glass Corporation, Nippon Electric Glass Co., Ltd. "OA-10G", Schott AG "D263", or "AF45" is mentioned.

Examples of the main body of the optical function layer 2 include acrylic resins such as polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP) and polymethyl methacrylate (PMMA), cyclic olefin polymer (COP), and cyclic Olefin copolymer (COC), polycarbonate (PC), urethane resin, polyvinyl alcohol (PVA), polyimide (PI), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polystyrene (PS), A single-layer film formed of a plastic material such as triacetyl cellulose (TAC), polyethylene naphthalate (PEN), ethylene-vinyl acetate (EVA), polyamide (PA), silicone resin, epoxy resin, liquid crystal polymer, and various resin foams; Or the laminated|multilayer film which consists of several layers can be illustrated.

When the main body of the optical function layer 2 is a laminated|multilayer film which consists of several layers, you may interpose various adhesives and adhesives, such as an acrylic adhesive, a urethane adhesive, and a silicone adhesive, between layers.

In addition, a conductive inorganic film such as indium tin oxide (ITO), Ag, Au, or Cu may be formed on the surface of the main body of the optical function layer 2 .

The division method by this embodiment is used suitably especially when the main body of the optical function layer 2 is a polarizing film, retardation film, etc. used for a display.

The thickness of the main body of the optical function layer 2 becomes like this. Preferably it is 20-500 micrometers, More preferably, it is 50-300 micrometers.

In this embodiment, as mentioned above, the main body of the optical function layer 2 is a laminated|multilayer film on which the polarizing film, the adhesive, and the release film were laminated|stacked in order from the top of FIG. The main body of the optical function layer 2 is laminated with the brittle material layer 1 via an adhesive (not shown). In this embodiment, the combination of the main body (a polarizing film, an adhesive, and a release film) of the optical function layer 2, and an adhesive agent is called the optical function layer 2 .

The polarizing film which comprises the main body of the optical function layer 2 has a polarizer and the protective film arrange|positioned at at least one of a polarizer. The thickness in particular of a polarizer is not restrict|limited, According to the objective, an appropriate thickness is employable. The thickness of the polarizer is typically about 1-80 μm. In one aspect, the thickness of a polarizer becomes like this. Preferably it is 30 micrometers or less. The polarizer is an iodine-based polarizer. In more detail, the polarizer may be formed of a polyvinyl alcohol-based resin film containing iodine.

As a manufacturing method of the polarizer which comprises the said polarizing film, the following methods 1, 2, etc. are mentioned, for example.

(1) Method 1: A method of stretching and dyeing a single polyvinyl alcohol-based resin film.

(2) Method 2: A method of stretching and dyeing a laminate (i) having a resin substrate and a polyvinyl alcohol-based resin layer.

Since Method 1 is a method well known and used in the art, a detailed description thereof will be omitted.

Method 2 preferably includes a step of stretching and dyeing a laminate (i) having a resin substrate and a polyvinyl alcohol-based resin layer formed on one side of the resin substrate, and manufacturing a polarizer on the resin substrate. The laminate (i) can be formed by coating and drying a coating liquid containing a polyvinyl alcohol-based resin on a resin substrate. In addition, the laminated body (i) may transfer and form a polyvinyl alcohol-type resin film on a resin base material. The detail of the method 2 is described in Unexamined-Japanese-Patent No. 2012-73580, for example, This publication is taken in here as a reference.

The protective film constituting the polarizing film is disposed on one side or both sides of the polarizer. As the protective film, a triacetyl cellulose-based film, an acrylic film, a cycloolefin-based film, a polyethylene terephthalate-based film, or the like can also be used. Moreover, the polarizing film may be further equipped with retardation film suitably. The retardation film may have any suitable optical properties and/or mechanical properties depending on the purpose.

The release film constituting the body of the optical function layer 2 has a role of protecting the pressure-sensitive adhesive layer constituting the body of the optical function layer 2 until the composite material 10 is put to practical use. As a constituent material of the release film, for example, plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester film, porous materials such as paper, cloth, and nonwoven fabric, nets, foam sheets, metal foils, and laminates thereof Although suitable thin leaf bodies, such as a sieve, etc. are mentioned, A plastic film is used suitably at the point which is excellent in surface smoothness.

As the adhesive constituting the optical function layer 2, for example, a polyester-based adhesive, a polyurethane-based adhesive, a polyvinyl alcohol-based adhesive, or an epoxy-based adhesive can be used. In particular, it is preferable to use an epoxy-based adhesive from the viewpoint that good adhesiveness is obtained.

When the adhesive is a thermosetting adhesive, peel resistance can be exhibited by curing (solidifying) it by heating. In addition, when the adhesive is a photocurable adhesive such as an ultraviolet curable adhesive, peeling resistance can be exhibited by irradiating and curing the adhesive with light such as ultraviolet rays. In addition, when the adhesive is a moisture-curing adhesive, it can be cured by reacting with moisture or the like in the atmosphere.

As the adhesive, for example, a commercially available adhesive may be used, or various curable resins may be dissolved or dispersed in a solvent to prepare an adhesive solution (or dispersion).

The thickness of the adhesive is preferably 10 µm or less, more preferably 1 to 10 µm, still more preferably 1 to 8 µm, and particularly preferably 1 to 6 µm.

In this embodiment, the base material layer 3a of the protective layer 3 is laminated|stacked on the brittle material layer 1 via the adhesive layer 3b. Although it is also possible to configure the base layer 3a of the protective layer 3 with a self-adhesive film and laminate it on the brittle material layer 1 without passing through the pressure-sensitive adhesive layer, from the viewpoint of protecting the brittle material layer 1 . is preferably laminated on the brittle material layer 1 through the pressure-sensitive adhesive layer 3b as in the present embodiment.

As the base material layer 3a, a film material having isotropy or close to isotropy is selected from the viewpoints of inspection properties, manageability, and the like. Examples of the film material include polyester-based resins such as polyethylene terephthalate film, cellulose-based resins, acetate-based resins, polyethersulfone-based resins, polycarbonate-based resins, polyamide-based resins, polyimide-based resins, and polyolefin-based resins. and transparent polymers such as resins and acrylic resins. Among these, polyester-type resin is preferable. As the base material layer 3a, a laminate of 1 type or 2 or more types of film materials can also be used, and the stretched product of the said film can also be used. It is preferable that the thickness of the base material layer 3a is 35 micrometers - 100 micrometers or less, and exceeds 38 micrometers, and it is preferable that they are 100 micrometers or less.

As the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 3b, a (meth)acrylic polymer, silicone-based polymer, polyester, polyurethane, polyamide, polyether, or a pressure-sensitive adhesive having a polymer such as fluorine-based or rubber-based polymer as the base polymer can be appropriately selected and used. . From the viewpoints of transparency, weather resistance, heat resistance, and the like, an acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferable. However, as will be described later, in order to prevent the generation of fumes when the second processing groove 31 is formed in the protective layer 3, a urethane-based pressure-sensitive adhesive using polyurethane as a base polymer as the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 3b. It is preferable to use The thickness (dry film thickness) of the pressure-sensitive adhesive layer 3b is determined according to the required adhesive force. It is about 1-100 micrometers normally, Preferably it is 5-50 micrometers.

<Segmentation method of composite material>

Hereinafter, a method for dividing the composite material 10 having the above configuration will be described.

The dividing method according to the present embodiment includes a machining groove forming step and a machining scar forming step. Further, the dividing method according to the present embodiment includes a composite material dividing step if necessary. Hereinafter, each process is demonstrated in order.

[Process groove forming process]

2 is an explanatory diagram schematically illustrating a schematic procedure of the dividing method according to the present embodiment. 2(a) and 2(b) are cross-sectional views showing the machining groove forming step of the dividing method according to the present embodiment. Fig. 2(c) is a cross-sectional view showing a process mark forming step of the parting method according to the present embodiment. Fig. 2(d) is a cross-sectional view showing the composite material dividing step of the dividing method according to the present embodiment.

As shown in Fig. 2(a), in the processing groove forming process, the laser light L1 oscillated from the first laser light source 20 is irradiated to the optical function layer 2 along the dividing line of the composite material 10, and optical The resin forming the functional layer 2 is removed. Thereby, the 1st processing groove|channel 21 along the dividing line is formed.

In the example shown in FIG. 2 , for convenience, the straight line DL extending in the Y direction among two orthogonal directions (X direction and Y direction) in the plane (in the XY two-dimensional plane) of the composite material 10 is a dividing line. However, the present invention is not limited to this, for example, a plurality of straight lines DL extending in the X direction and a plurality of straight lines DL extending in the Y direction are set in a grid shape, such as a dividing line It is possible to set the dividing line. Hereinafter, this straight line DL is called a "segmentation scheduled line DL."

The dividing line DL is a visually recognizable mark, and it is also possible to actually draw on the composite 10 , and control to control the relative positional relationship between the laser light L1 and the composite 10 on the XY two-dimensional plane. It is also possible to input the coordinates in advance into an apparatus (not shown). The dividing line DL shown in FIG. 2 is an imaginary line whose coordinates have been input in advance to the control device and is not actually drawn on the composite material 10 . In addition, the dividing line DL is not limited to a straight line, A curved line may be sufficient as it. By determining the dividing line DL according to the use of the composite material 10 , the composite material 10 can be divided into any shape and size according to the use.

In the present embodiment, as the first laser light source 20 , a CO ₂ laser light source having a wavelength of 9 to 11 µm in the infrared range of the laser light L1 oscillating is used.

However, the present invention is not limited to this, and as the first laser light source 20, it is also possible to use a CO laser light source in which the wavelength of the laser light L1 oscillating is 5 µm.

It is also possible to use visible light and ultraviolet (UV) pulsed laser light sources as the first laser light source 20 . As a visible light and UV pulse laser light source, the wavelength of the oscillating laser light L1 is 532 nm, 355 nm, 349 nm, or 266 nm (Nd: YAG, Nd: YLF, or higher harmonics of a solid-state laser light source using YVO4 as a medium) ), an excimer laser light source having a wavelength of 351 nm, 248 nm, 222 nm, 193 nm, or 157 nm of the oscillating laser light L1, and an F2 laser light source having an oscillating laser light L1 wavelength of 157 nm can be exemplified.

In addition, as the first laser light source 20, it is also possible to use a pulsed laser light source having a wavelength outside the ultraviolet range and a pulse width of the femtosecond or picosecond order of the laser light L1 oscillating. By using the laser light L1 oscillating from this pulsed laser light source, ablation processing based on the multiphoton absorption process can be induced.

It is also possible to use a semiconductor laser light source or a fiber laser light source having a wavelength of the laser light L1 oscillating in the infrared range as the first laser light source 20 .

As a mode for irradiating the laser beam L1 along the planned division line of the composite material 10 (the mode for scanning the laser beam L1), for example, the sheet-leaf-shaped composite material 10 is placed on an XY biaxial stage (not shown). not)) and fixed (eg, fixed by adsorption), and by driving the XY biaxial stage by a control signal from a control device, the relative on the XY two-dimensional plane of the composite material 10 with respect to the laser light L1. It is contemplated to change the location. In addition, by fixing the position of the composite material 10 and deflecting the laser light L1 oscillated from the first laser light source 20 using a galvanometer mirror or polygon mirror driven by a control signal from a control device, the composite material It is also considered to change the position on the XY two-dimensional plane of the laser beam L1 irradiated to (10). Moreover, it is also possible to use both the scanning of the composite material 10 using the said XY biaxial stage, and the scanning of the laser beam L1 using a galvanometer mirror etc. together.

The oscillation form of the first laser light source 20 may be pulse oscillation or continuous oscillation. The spatial intensity distribution of the laser light L1 may be a Gaussian distribution, and is flat using a diffractive optical element (not shown) or the like in order to suppress thermal damage to the brittle material layer 1 outside the removal target of the laser light L1. You may shape it to a top distribution. There is no restriction on the polarization state of the laser light L1, and any of linearly polarized light, circularly polarized light, and random polarized light may be used.

Among the resins forming the optical function layer 2 by irradiating the laser light L1 to the optical function layer 2 along the dividing line DL of the composite material 10, the resin to which the laser light L1 is irradiated A local temperature rise occurs due to absorption of infrared light, and the resin scatters so that the resin is removed from the composite material 10 , and a first processing groove 21 is formed in the composite material 10 . In order to suppress the re-adhesion of the resin scattering product removed from the composite material 10 to the composite material 10, it is preferable to provide a dust collecting mechanism in the vicinity of the dividing line DL. In order to suppress the width of the first processing groove 21 from becoming too large, the spot diameter at the irradiation position to the optical function layer 2 (on the side opposite to the surface of the optical function layer 2 on the brittle material layer 1 side) It is preferable to condense the laser light L1 so that the spot diameter on the surface of ) is 300 µm or less, and it is more preferable to condense the laser light L1 so that the spot diameter is 200 µm or less.

The spot diameter of the laser light L1 at the irradiation position to the optical function layer 2 is, for example, about 150 µm, and at this time, on the surface of the optical function layer 2 on the brittle material layer 1 side The spot diameter in this is condensed and becomes 30-40 micrometers, for example. Thereby, the 1st processed groove 21 with a width (the dimension of the bottom of the 1st processed groove 21 in the direction orthogonal to the dividing line DL) of 30-40 micrometers is formed.

The width of the first processing groove 21 is, for example, 100 µm or less, preferably 50 µm or less.

In addition, according to the knowledge of the present inventors, in the case of a resin removal method based on a local temperature rise following infrared light absorption of the resin irradiated with the laser light L1, the type of resin or the layer structure of the optical function layer 2 Regardless, it is possible to roughly estimate the input energy required to form the first processing groove 21 by the thickness of the optical function layer 2 . Specifically, it is possible to estimate the input energy expressed by the following equation (1) required for forming the first processing groove 21 by the following equation (2) based on the thickness of the optical function layer 2 . do.

Input energy [mJ/mm] = Average power of laser light L1 [mW]/Processing speed [mm/sec] ... (1)

Input energy [mJ/mm] = 0.5 x thickness of optical functional layer 2 [μm] ... (2)

The input energy to be actually set is preferably set to 20 to 180% of the input energy estimated by the above formula (2), and more preferably set to 50 to 150%. Setting a margin with respect to the estimated input energy in this way is the light absorptivity of the resin forming the optical function layer 2 (light absorptivity in the wavelength of the laser light L1), the melting point, the decomposition point of the resin, etc. This is because it is considered that there is a difference in the input energy required to form the first processing groove 21 due to the difference in thermal properties. Specifically, for example, a sample of the composite material 10 to which the dividing method according to the present embodiment is applied is prepared, and the first processing groove is formed in the optical function layer 2 of the sample with a plurality of input energies within the above preferred range. What is necessary is just to determine the appropriate input energy by conducting a preliminary test for forming (21).

In addition, as shown in FIG. 2( b ), in the processing groove forming process, the laser light L2 oscillated from the second laser light source 30 is irradiated to the protective layer 3 along the dividing line of the composite material 10 , The resin forming the protective layer 3 is removed. Thereby, the 2nd processing groove|channel 31 (refer FIG.2(c)) along the dividing line is formed. When forming the second processing groove 31, a peeling method or an offset method is used in the present embodiment, but the specific contents thereof will be described later.

In the present embodiment, after forming the first processing groove 21, the second processing groove 31 is formed, but the present invention is not limited thereto. After the second processing groove 31 is formed, the first processing It is also possible to form the groove 21 . In addition, as shown in FIG. 2 , when the first laser light source 20 and the second laser light source 30 are separately prepared, it is also possible to simultaneously form the first processing groove 21 and the second processing groove 31 . do.

In the present embodiment, as the second laser light source 30 , the same type of CO ₂ laser light source as that of the first laser light source 20 is used. However, the present invention is not limited to this, and it is also possible to use other laser light sources such as a CO laser light source as described above for the first laser light source 20 . The second laser light source 30 may be of the same type as the first laser light source 20 or a different type. As a mode (a mode which scans the laser beam L2 relatively) along the parting line DL which irradiates the laser beam L2 similarly to the above-mentioned about the laser beam L1, an XY biaxial stage or a galvanometer mirror An aspect using the etc. is employable.

The laser light L2 has a spot diameter at the irradiation position to the protective layer 3 (spot diameter on the surface opposite to the surface of the protective layer 3 on the brittle material layer 1 side) is, for example, For example, it is condensed so that it may become 120-130 micrometers. As a result, a groove having a width of 20 to 30 µm at the bottom is formed.

The second processing groove 31 has a width W (refer to Fig. 2(c)) of the brittle material layer 1 of the laser light L3 oscillated from the ultra-short pulse laser light source 40 in the processing mark forming process to be described later. It is formed so that it may become more than the spot diameter D (refer FIG.2(c)) in the irradiation position to ).

Specifically, the width W of the second processing groove 31 of the present embodiment is preferably 100 µm or more, and more preferably 150 µm or more. The upper limit of the width W of the second processing groove 31 is, for example, 1000 µm or less, preferably 500 µm or less, and more preferably 300 µm or less.

As described above, the width W of the second processing groove 31 is preferably 100 μm or more, and preferably greater than the width of the first processing groove 21, which is 100 μm or less.

In the example shown in FIG. 2 , the first laser light source 20 is disposed on the side opposite to the optical function layer 2 , and the first laser light source 20 is disposed on the side opposite to the protective layer 3 . Although the two laser light sources 30 are arrange|positioned, this invention is not limited to this, It is also possible to use the 1st laser light source 20 as the 2nd laser light source 30 also.

When the first laser light source 20 is also used as the second laser light source 30 , for example, as shown in FIG. 2A , the first laser light source 20 is on the side facing the optical function layer 2 . ) (the second laser light source 30) is disposed, and the first processing groove 21 is formed in the optical function layer 2 using the first laser light source 20 (the second laser light source 30). Then, the composite material 10 is vertically inverted using a known reversing mechanism so that the first laser light source 20 (the second laser light source 30) faces the protective layer 3, and the first laser light source 20 is What is necessary is just to form the 2nd processing groove|channel 31 in the protective layer 3 using (2nd laser light source 30). Alternatively, as shown in Fig. 2(b) , the first laser light source 20 (second laser light source 30) is disposed on the side opposite to the protective layer 3, and the first laser light source 20 (second laser light source 30) is disposed. After forming the second processing groove 31 in the protective layer 3 using the 2 laser light source 30 ), the first laser light source 20 (the second laser light source 30 ) is formed in the optical function layer 2 . ) to face each other, using a known inversion mechanism to invert the composite material 10 up and down, and use the first laser light source 20 (second laser light source 30 ) to form the first processing groove in the optical function layer 2 . What is necessary is just to form (21).

Moreover, in a process groove|channel formation process, it is also possible as a preferable aspect to remove resin which forms the optical function layer 2 so that a part of thickness direction of the optical function layer 2 may remain|survive as a residue. Moreover, in this embodiment, as a preferable aspect, resin which forms the protective layer 3 is removed so that a part of the thickness direction of the adhesive layer 3b of the protective layer 3 may remain|survive as a residue. The thickness of the residue is preferably 1 to 30 µm, and more preferably 1 to 10 µm for any of the optical function layer 2 and the protective layer 3 .

By removing the resin so that the residue remains in this way, compared to the case of completely removing the resin forming the optical function layer 2 and the protective layer 3 along the dividing line DL, the brittle material layer 1 Heat damage is reduced, and the advantage that cracks are more difficult to generate|occur|produce in the end surface of the brittle material layer 1 is acquired.

[Processing trace formation process]

As shown in Fig. 2(c), in the machining scar forming step, the laser light (ultra-short pulse laser light) L3 oscillated from the ultrashort pulse laser light source 40 after the machining groove forming step (ultra-short pulse laser light) L3 is applied to the second machining groove ( 31), the brittle material layer 1 is irradiated along the division line DL from the side, and the brittle material forming the brittle material layer 1 is removed to form a processing mark 11 along the division line DL. do.

As an aspect of irradiating the laser beam L3 along the division line DL (a aspect which scans the laser light L3 relatively), the aspect which irradiates the above-mentioned laser light L1 along the division line DL. Since the same aspect as described above may be employed, a detailed description thereof will be omitted.

The brittle material forming the brittle material layer 1 utilizes the filamentation phenomenon of the laser light L3 oscillated from the ultrashort pulse laser light source 40, or a multifocal optical system (shown in the figure) not shown) or by applying Bessel beam optics (not shown).

In addition, the use of the filamentation phenomenon of ultra-short pulse laser light and the application of a multi-focus optical system or a Bessel beam optical system to an ultra-short pulse laser light source are described in Non-Patent Document 1. In addition, Germany's TRUMPF SE + Co. Products related to glass processing by applying a multi-focus optical system to an ultra-short pulse laser light source are sold from KG. The use of the filamentation phenomenon of ultra-short pulse laser light as described above and the application of a multi-focus optical system or a Bessel beam optical system to an ultra-short pulse laser light source are well known, and thus detailed description thereof will be omitted.

The process trace 11 formed in the process trace formation process of this embodiment turns into a stitching-line-shaped through-hole along the division planned line DL as described in patent document 2, for example. The pitch of the through holes along the dividing line DL is determined by the repetition frequency of the pulse oscillation and the relative movement speed (processing speed) of the laser light L3 with respect to the composite material 10 . The pitch of the through-holes is preferably set to 10 µm or less in order to easily and stably perform the composite material dividing process described later. More preferably, it is set to 5 micrometers or less. The diameter of the through hole is formed to be 5 µm or less in many cases.

However, the processing marks 11 are not limited to the through-holes of the stitching linear shape along the dividing line DL. The relative movement speed of the laser light L3 oscillated from the ultrashort pulse laser light source 40 along the division line DL of the brittle material layer 1 is set to be small, or the pulse oscillation of the ultrashort pulse laser light source 40 is reduced. When the repetition frequency is set to be large, a through hole (long hole) integrally connected along the dividing line DL is formed as the processing mark 11 .

The wavelength of the laser light L3 oscillating from the ultrashort pulse laser light source 40 is preferably 500 nm to 2500 nm, which exhibits high light transmittance when the brittle material forming the brittle material layer 1 is glass. In order to effectively cause a nonlinear optical phenomenon (multiphoton absorption), the pulse width of the laser light L3 is preferably 100 picoseconds or less, and more preferably 50 picoseconds or less. The oscillation form of the laser light L3 may be single-pulse oscillation or multi-pulse oscillation in burst mode.

As shown in FIG.2(c), the spot diameter d in the irradiation position to the brittle material layer 1 of the laser beam L3 becomes 100 micrometers, for example, 2nd processing as mentioned above. The width (W) of the groove (31) is equal to or greater than the spot diameter (D).

In addition, a cleaning process of removing the residue of the resin forming the protective layer 3 by applying various wet or dry cleaning methods to the second processing grooves 31 formed in the processing groove forming process before the processing marks forming process. You may include more. When the residue of the resin forming the protective layer 3 is removed in the cleaning step, the ultra-short pulse laser light source 40 oscillates from the second machining groove 31 side to the brittle material layer 1 in the machining mark forming step. Even if it irradiates the laser beam L3, the laser beam L3 is not affected by the resin residue, and it is possible to form the processing mark 11 still more suitable in the brittle material layer 1 .

[Composite material division process]

As shown in FIG. 2( d ), in the composite material dividing process, the composite material 10 is divided by applying an external force along the dividing line DL after the processing mark forming process. In the example shown in FIG.2(d), the composite material 10 is divided into composite material pieces 10a, 10b.

In the composite material division process, when the processing mark 11 formed in the processing mark forming process is a through-hole of a stitching linear shape along the dividing line DL, a part of the optical function layer 2 in the thickness direction remains as a residue. It becomes especially necessary when the resin which forms the optical function layer 2 is removed (residue remains in the bottom of the 1st process groove|channel 21). If the processing mark 11 is a through hole (long hole) integrally connected along the dividing line DL, and no residue remains at the bottom of the first processing groove 21, the processing mark forming process is executed Since the composite material 10 can be divided at the same time, the composite material division process is not necessarily required.

As a method of adding an external force to the composite material 10, a mechanical brake (mountain fold), heating of a region near the dividing line DL by infrared laser light, adding vibration by an ultrasonic roller, adsorption and lifting by a sucker etc. can be exemplified.

Hereinafter, the peeling method and the offset method used when forming the 2nd processed groove|channel 31 in the processing groove formation process of the parting method by this embodiment are demonstrated in order.

(Peeling method)

3 is a cross-sectional view schematically illustrating the outline procedure of the peeling method in the machining groove forming step. The peeling method is performed in the order of FIG. 3(a), FIG. 3(b), and FIG. 3(d). Also, FIG. 3C is an enlarged view of a region surrounded by a broken line C in FIG. 3B .

As shown in Figs. 3(a) and 3(b), in the peeling method, the irradiation position of the laser beam L2 oscillated from the second laser light source 30 to the protective layer 3 is a dividing line DL. is shifted in the direction perpendicular to (the X direction in the example shown in Fig. 3), and the dividing line DL is set at each irradiation position (the position of A1 shown in Fig. 3(a), the position of A2 shown in Fig. 3(b)). ) along the laser beam L2 to the protective layer 3 . Specifically, in the present embodiment, the laser light L2 oscillated from the second laser light source 30 is equidistant in the direction (X direction) orthogonal to the dividing line DL with respect to the dividing line DL as a reference. The positions A1 and A2 are respectively irradiated. Thereby, the processing grooves 31a and 31b are formed in each irradiation position A1, A2. And the separation distance (separation distance of each irradiation position A1, A2) of the processing grooves 31a, 31b with respect to the X direction is the brittle material layer 1 of the ultrashort pulse laser beam L3 in a processing mark formation process. The spot diameter D (refer to Fig. 2(c)) at the irradiation position with the light source is equal to or greater.

In addition, as mentioned above, in this embodiment, as a preferable aspect, by irradiating the laser beam L2 to the protective layer 3, the protective layer so that a part of the thickness direction of the adhesive layer 3b of the protective layer 3 may remain|survive as a residue. The resin forming (3) is removed (refer to Fig. 3(c)). As described above, the thickness (T) of the residue is preferably 1 to 30 µm, more preferably 1 to 10 µm.

Next, as shown in FIG.3(d), in the peeling method, the 2nd processing groove|channel 31 is formed by peeling the resin which forms the protective layer 3 which exists between each irradiation position A1, A2. It is possible to perform peeling of resin using a well-known peeling apparatus suitably. As described above, since the distance between the processing grooves 31a and 31b is greater than or equal to the spot diameter D of the ultra-short pulse laser light L3, the width W of the second processing groove 31 (see Fig. 2(c)). ) is also equal to or larger than the spot diameter D of the ultrashort pulse laser light L3.

In addition, in the peeling method, when the resin forming the protective layer 3 present between the respective irradiation positions A1 and A2 is peeled off, as can be seen from Fig. 3(c) or Fig. 3(d), each irradiation position In the vicinity of (A1, A2), a part of the thickness direction of the pressure-sensitive adhesive layer 3b remains as a residue, but in other portions, the entire protective layer 3 including the pressure-sensitive adhesive layer 3b is peeled off, and the brittle material layer 1 ) can be expected to be exposed.

According to the peeling method described above, when the ultra-short pulse laser light L3 is irradiated on the dividing line DL (refer to Fig. 2(c)), the laser light L2 oscillated from the second laser light source 30 is irradiated. The positions A1 and A2 and the irradiation position of the ultrashort pulse laser light L3 are shifted by 1/2 of the width W of the second processing groove 31 .

Therefore, if the output of the laser light L2 oscillated from the second laser light source 30 is set to a certain degree large in the processing groove forming step, the resin forming the protective layer 3 is removed and the brittle material layer 1 ), it is difficult to generate cracks on the end surface of the brittle material layer 1 because the ultra-short pulse laser light L3 is difficult to be irradiated to the same location even if the surface of the brittle material layer 1 is exposed to some heat damage.

4 is a plan view schematically illustrating the outline of a peeling method and a process mark forming step in the machining groove forming step in the case where the composite material 10 is divided into four rectangular composite pieces. 4(a) to 4(c) show the schematic procedure of the peeling method, and FIG. 4(d) shows the schematic procedure of the process mark forming process. 4, the second laser light source 30 and the ultra-short pulse laser light source 40 are shown in perspective for convenience.

As shown in Fig. 4(a), in the peeling method, the irradiation position of the laser light L2 oscillated from the second laser light source 30 to the protective layer 3 is shifted in the direction orthogonal to the dividing line DL. Then, the protective layer 3 is irradiated with the laser light L2 along the dividing line DL at each irradiation position. Specifically, in the example shown in FIG.4(a), the position (solid line) shifted inward by 1/2 of the width W of the 2nd processing groove 31 (refer FIG.2(c)) from the division scheduled line DL. The position indicated by ) is irradiated with the laser light L2. The portions indicated by reference numerals 31a and 31b in Fig. 4A correspond to the machining grooves 31a and 31b shown in Fig. 3 .

Next, in the peeling method, the 2nd processing groove|channel 31 is formed by peeling the resin which forms the protective layer 3 which exists between each irradiation position. Fig. 4(b) shows the peeled resin forming the protective layer 3, and Fig. 4(c) shows the composite material 10 after peeling. In the example shown in Fig. 4(b), not only the resin (resin present in the cross-shaped region in Fig. 4(b)) for forming the protective layer 3 present between the irradiation positions, but also outside the irradiation position. The resin forming the protective layer 3 is also peeled off at the same time.

Next, as shown in FIG.4(d), in a process trace formation process, the ultrashort pulse laser beam L3 oscillated from the ultrashort pulse laser light source 40 is irradiated on the dividing line DL.

Thereby (or by further performing the composite material dividing process), it can be divided into 4 rectangular composite pieces.

(Offset method)

5 is a cross-sectional view schematically illustrating an outline procedure of an offset method in a machining groove forming step. The offset method is performed in the order of Figs. 5(a) to 5(d).

As shown to Fig.5(a) - Fig.5(c), in the offset method, the irradiation position to the protective layer 3 of the laser beam L2 oscillated from the 2nd laser light source 30 is divided into division line DL. is sequentially shifted in the direction perpendicular to (the X direction in the example shown in Fig. 5), and each irradiation position (the position of B1 shown in Fig. 5(a), the position of B2 shown in Fig. 5(b), and Fig. 5( The protective layer 3 is irradiated with the laser beam L2 along the dividing line DL at the position of B3 shown in c)). Specifically, in this embodiment, the laser light L2 oscillated from the second laser light source 30 is equidistant in the direction (X direction) orthogonal to the planned division line DL with respect to the predetermined division line DL as a reference. They are sequentially shifted from the position B1 to the position B3 at a predetermined pitch (for example, a pitch of about 30 µm, which is a size equivalent to the spot diameter of the laser light L2), and each position is irradiated. As a result, the width of the processing grooves 31c formed at each irradiation position is sequentially increased, and finally, as shown in Fig. 5(d), the second processing grooves 31 are formed. The irradiation position to the brittle material layer 1 of the ultrashort pulse laser beam L3 in a process trace formation process in the range (separation distance of irradiation positions B1, B3) which shifts the irradiation position of the laser beam L2 By making the spot diameter D (refer to FIG. 2(c)) or more in the , the width W of the second processing groove 31 (refer to FIG. 2(c)) is the spot diameter of the ultrashort pulse laser light L3. (D) The above can be done.

In addition, as a preferable aspect also in the offset method, the protective layer 3 is formed by irradiating the protective layer 3 with laser light L2 so that a part of the pressure-sensitive adhesive layer 3b of the protective layer 3 in the thickness direction remains as a residue. The resin is being removed. In particular, when the offset method is applied, compared to the case where the peeling method is applied, there are many irradiation points of the laser light L2 oscillated from the second laser light source 30 to the protective layer 3, so that the brittle material layer 1 ) becomes a situation where it is easy to receive heat damage. Accordingly, it is particularly effective to leave a part of the pressure-sensitive adhesive layer 3b in the thickness direction as a residue when the offset method is applied.

In addition, when the offset method is applied, compared to the case where the peeling method is applied, there are many irradiation points of the laser beam L2 oscillated from the second laser light source 30 to the protective layer 3, so that the protective layer 3 It is in a situation where fume is easy to generate|occur|produce from this provided adhesive layer 3b. Therefore, in order to prevent generation of fumes when the offset method is applied, it is preferable to use the pressure-sensitive adhesive layer 3b as a urethane pressure-sensitive adhesive layer.

6 is a plan view schematically illustrating an outline procedure of an offset method and a machining mark forming step in the machining groove forming step in the case where the composite material 10 is divided into four rectangular composite pieces. Fig. 6(a) shows a schematic procedure of the offset method, and Fig. 6(b) shows a schematic procedure of the process mark forming step. 6, the second laser light source 30 and the ultra-short pulse laser light source 40 are shown in perspective for convenience.

As shown in Fig. 6(a), in the offset method, the irradiation position of the laser light L2 oscillated from the second laser light source 30 to the protective layer 3 is sequentially in the direction orthogonal to the dividing line DL. , and the protective layer 3 is irradiated with the laser light L2 along the dividing line DL at each irradiation position. Specifically, in the example shown in Fig. 6 (a), the position shifted to the inside and outside by 1/2 of the width W (refer to Fig. 2 (c)) of the second processing groove 31 from the dividing line DL. The laser beam L2 is irradiated to the range (position shown by a solid line), and the width|variety of the processing groove|channel 31c formed in each irradiation position is enlarged sequentially. Thereby, as shown in FIG.6(b), the 2nd process groove|channel 31 (the area|region where hatching is not given by the diagonal line in FIG.6(b)) is formed.

Next, as shown in FIG.6(b), in a process trace formation process, the ultrashort pulse laser beam L3 oscillated from the ultrashort pulse laser light source 40 is irradiated on the dividing line DL.

Thereby (or by further performing the composite material dividing process), it can be divided into 4 rectangular composite pieces.

According to the dividing method according to the present embodiment described above, in the processing groove forming step, the resin forming the optical function layer 2 and the resin forming the protective layer 3 are removed so that the product along the dividing line DL is removed. After forming the first processing groove 21 and the second processing groove 31, the same division is performed by removing the brittle material forming the brittle material layer 1 from the second processing groove 31 side in the processing mark forming step. A processing mark 11 along the predetermined line DL is formed. In addition, the width W of the second processing groove 31 formed in the processing groove forming process is brittleness of the laser light (ultrashort pulse laser light) L3 oscillated from the ultrashort pulse laser light source 40 in the processing mark forming process. Since it is formed so that it may become more than the spot diameter D at the irradiation position to the material layer 1, the brittle material layer 1 can be divided without generating a crack in the end surface of the brittle material layer 1.

Hereinafter, an example of the result of a test for dividing the composite material 10 using the dividing method according to the present embodiment (Examples 1 to 5) and the dividing method according to the comparative examples (Comparative Examples 1 and 2) will be described. .

7 shows an example of main test conditions and test results when the peeling method is applied in the machining groove forming process as an example. 8 shows an example of main test conditions and test results when the offset method is applied in the machining groove forming process as an example.

<Example 1>

[Production of optical functional layer 2]

As a thermoplastic resin substrate, an amorphous isophthalic copolymerized polyethylene terephthalate film (thickness: 100 µm) having a long glass transition temperature (Tg) of about 75°C was used, and one side of this resin substrate was corona-treated.

On the other hand, polyvinyl alcohol (polymerization degree 4200, saponification degree 99.2 mol%) and acetacetyl-modified PVA (The Nippon Synthetic Chemical Industry Co., Ltd., trade name "GOHSEFIMER") are mixed at 9:1 by PVA-based resin 100 weight What added 13 weight part of potassium iodide to the part was dissolved in water, and the PVA aqueous solution (coating liquid) was prepared.

And the said PVA aqueous solution was apply|coated to the corona-treated surface of the said resin base material, and the PVA-type resin layer of thickness 13 micrometers was formed by drying at 60 degreeC, and the laminated body was produced.

The laminate produced as described above was uniaxially stretched 2.4 times in the longitudinal direction (longitudinal direction) in an oven at 130°C (air-assisted stretching treatment).

Next, the laminate after uniaxial stretching was immersed in an insolubilization bath (a boric acid aqueous solution obtained by blending 4 parts by weight of boric acid with respect to 100 parts by weight of water) at a liquid temperature of 40°C for 30 seconds (insolubilization treatment).

Next, the layered product is subjected to a dyeing bath at a liquid temperature of 30° C. (an aqueous solution of iodine obtained by mixing iodine and potassium iodide in a weight ratio of 1:7 with respect to 100 parts by weight of water) to obtain a single transmittance (Ts) of the finally obtained polarizer. It was immersed for 60 seconds while adjusting the density|concentration so that it might become a value (dyeing process).

Next, the laminate was immersed in a crosslinking bath (a boric acid aqueous solution obtained by blending 3 parts by weight of potassium iodide with respect to 100 parts by weight of water and 5 parts by weight of boric acid) with a liquid temperature of 40° C. for 30 seconds (crosslinking treatment).

Next, while immersing the laminate in an aqueous boric acid solution (boric acid concentration of 4% by weight, potassium iodide concentration of 5% by weight) at a liquid temperature of 70°C, the total draw ratio is 5.5 times in the longitudinal direction (longitudinal direction) between rolls having different circumferential speeds. Uniaxial stretching was performed (underwater stretching process).

Next, the said laminated body was immersed in the washing|cleaning bath (aqueous solution obtained by mix|blending 4 weight part of potassium iodide with respect to 100 weight part of water) with a liquid temperature of 20 degreeC (washing process).

Finally, the laminate was brought into contact with a stainless steel heating roll maintained at a surface temperature of about 75° C. while being dried in an oven maintained at about 90° C. (dry shrinkage treatment).

As described above, a polarizer having a thickness of about 5 µm was formed on the resin substrate to prepare a laminate having a configuration of the resin substrate/polarizer.

Next, an acryl-type protective film (thickness: 40 micrometers) was bonded together on one surface (surface on the opposite side to the surface on the side of a resin base material) of the polarizer which comprises the said laminated body, and the polarizing film was produced. And the main body of the optical function layer 2 was produced by peeling the resin base material from the polarizing film, and bonding a polyethylene terephthalate release film (thickness: 38 micrometers) to the said peeling surface through an acrylic adhesive (thickness: 20 micrometers).

Further, as an adhesive, 70 parts by weight of CELLOXIDE 2021P (manufactured by Daicel Corporation), 5 parts by weight of EHPE3150, 19 parts by weight of ARON OXETANE OXT-221 (manufactured by TOAGOSEI CO., LTD.), KBM-403 (Shin-Etsu Chemical Co.). , Ltd.) and 4 parts by weight of CPI101A (manufactured by San-Apro Ltd.) were blended with 2 parts by weight of an epoxy adhesive was prepared.

The combination of the main body of the optical function layer 2 and the adhesive constitutes the optical function layer 2 .

[Production of laminate of brittle material layer (1) and optical function layer (2)]

As the brittle material layer 1, a glass film (manufactured by Nippon Electric Glass Co., Ltd., trade name "OA-10G", thickness: 100 µm) was prepared.

Then, the main body of the brittle material layer 1 and the optical function layer 2 was bonded through the adhesive. At this time, the main body of the optical function layer 2 was arrange|positioned so that the acrylic protective film might become the brittle material layer 1 side. Next, a laminate of the brittle material layer 1 and the optical function layer 2 was produced by irradiating the adhesive with ultraviolet rays (500 mJ/cm 2 ) with a high-pressure mercury lamp to cure the adhesive. The thickness of the adhesive after curing was 5 µm.

[Production of the composite material (10)]

Next, as shown in FIG. 7, the surface protection film (The Nitto Denko Corporation make, brand name "RP207") which has an acrylic adhesive layer as the protective layer 3 was prepared.

The base layer 3a of the protective layer 3 is formed of an untreated polyethylene terephthalate film (manufactured by Mitsubishi Polyester Film Corporation, DIAFOIL T100 #38) having a thickness of 38 µm.

In addition, the adhesive layer 3b of this protective layer 3 is produced as follows. First, 100 weight part of 2-ethylhexyl acrylate and 4 weight part of 2-hydroxyethyl acrylate are copolymerized so that it may become 35 % by monomer base in ethyl acetate, and the solution containing the acrylic polymer with a weight average molecular weight of 600,000 is obtained. Next, 4 parts by weight of an isocyanate-based crosslinking agent having an isocyanurate ring (manufactured by Nippon Polyurethane Industry Co., Ltd., CORONATE HX) with respect to 100 parts by weight of the acrylic polymer (dry weight) is blended in this solution, and ethyl acetate is further added to the solution. The adhesive solution which added and adjusted the solid content concentration to 20% is prepared. Finally, this adhesive solution is apply|coated so that the dry film thickness may be set to 20 micrometers on the base material layer 3a, and it is made to dry at 140 degreeC for 2 minutes, and the adhesive layer 3b is formed.

The protective layer 3 (RP207) is provided with the base material layer 3a and the adhesive layer 3b which were produced as mentioned above. And by bonding the protective layer 3 and the brittle material layer 1 of the laminate of the brittle material layer 1 and the optical function layer 2 through the pressure sensitive adhesive layer 3b of the protective layer 3, the composite material ( 10) was made.

[Process groove forming process (formation of first processing groove 21)]

After the composite material 10 produced as described above was sheet-wafered, the first processing groove 21 was formed in the optical function layer 2 . Specifically, it is a laser processing apparatus provided with the first laser light source 20 and an optical system and control device for controlling the scanning of the laser light L1, and is a TLSU series manufactured by Takei Electric Industries Co., Ltd. (with an oscillation wavelength of 9.4 µm). Using a CO ₂ laser light source, pulse oscillation repetition frequency of 12.5 kHz, and laser light L1 power of 250 W), the output of the laser light L1 oscillated from the first laser light source 20 is 11.8 W, and condensed Condensed to a spot diameter of 150 µm at the irradiation position to the optical function layer 2 using a lens, optical function along the division line (a plurality of division lines set in a grid shape) DL of the composite material 10 The layer (2) was irradiated. The relative moving speed (processing speed) of the laser light L1 with respect to the composite material 10 was set to 400 mm/sec. Thereby, the resin which forms the optical function layer 2 was removed, and the 1st process groove|channel 21 along the dividing line DL was formed. At this time, the resin was removed so that a part of the resin forming the optical function layer 2 remained as a residue (thickness: 10 to 20 µm) at the bottom of the first processing groove 21 .

[Process groove forming process (formation of second processing groove 31)]

Next, a second processing groove 31 was formed in the protective layer 3 . Specifically, as in the case of forming the first processing groove 21, a laser processing apparatus provided with a second laser light source 30 and an optical system and control device for controlling the scanning of the laser light L2, Takei Electric Industries Co., Ltd. , Ltd. (CO2 laser light source _with oscillation wavelength of 9.4 µm, pulse oscillation repetition frequency of 12.5 kHz, laser light L2 power of 250 W) is used, and as shown in Fig. 7, a second laser light source ( 30), the output of the laser light L2 oscillated from the laser beam L2 is set to 10.5 W, and is condensed to a spot diameter of 120 to 130 μm at the irradiation position to the protective layer 3 using a condensing lens, and the composite material 10 is divided The protective layer 3 was irradiated along the predetermined line (a plurality of division lines set in a grid shape) DL. The relative moving speed (processing speed) of the laser light L2 with respect to the composite material 10 was set to 400 mm/sec. And by applying the peeling method, as shown in FIG. 7, the 2nd processing groove|channel 31 with a width|variety of 200 micrometers was formed. In addition, when irradiating the laser beam L2 to the protective layer 3, as shown in Fig. 7, a resin forming the protective layer 3 at the irradiation position does not remain as a residue (thickness: 0 µm). has been removed

[Processing trace formation process]

After the machining groove forming process, a machining mark forming process was performed. Specifically, as the ultra-short pulse laser light source 40, an oscillation wavelength of 1064 nm, a pulse width of the laser light L3 of 10 picoseconds, a repetition frequency of pulse oscillation of 50 kHz, and an average power of 10 W are used, and the ultra-short pulse laser light source 40 ) was irradiated to the brittle material layer 1 of the composite material 10 from the second processing groove 31 side through the multi-focus optical system. The spot diameter d in the irradiation position to the brittle material layer 1 of the laser beam L3 was 100 micrometers. The relative movement speed (processing speed) of the laser light L3 with respect to the composite material 10 is 100 mm/sec, and the result of scanning the laser light L3 along the dividing line DL, the processing marks 11 As a result, a needle-shaped through-hole (about 1 to 2 µm in diameter) with a pitch of 2 µm was formed.

[Composite material division process]

After the process mark forming process, the composite material parting process was performed. Specifically, MLG-9300 (oscillation wavelength 10.6 µm, laser light power 30 W) manufactured by KEYENCE CORPORATION is used as a laser processing apparatus equipped with a CO ₂ laser light source and an optical system and control device for controlling the laser light scanning, and from the laser light source The output of the oscillated laser light is set to 80% (that is, output 24W), and is condensed to a spot diameter of 0.7 mm using a condensing lens (the energy density at this time is 62 W/m2), and the dividing line (DL) of the composite material 10 is The brittle material layer 1 was irradiated from the protective layer 3 side. At this time, the relative movement speed of the laser light with respect to the composite material 10 was set to 500 mm/sec.

Finally, by applying a mechanical external force to the composite material 10, the resin residue remaining at the bottom of the first processing groove 21 after the processing groove forming process was divided, and the composite material 10 was divided.

As a result of visually observing the end surface of the brittle material layer 1 of the composite material 10 (composite piece) divided by the division method according to Example 1, the brittle material layer 1 was divided without a problem as shown in FIG. and no cracks occurred.

<Example 2>

As shown in Fig. 7, when the second processing groove 31 is formed, the output of the laser light L2 oscillated from the second laser light source 30 is 8.0 W, and the protective layer 3 is applied at the irradiation position. The composite material 10 was sectioned under the same conditions as in Example 1, except that the resin was removed so that a part of the resin to be formed (the pressure-sensitive adhesive layer 3b) remained as a residue (thickness: 10 µm).

As a result of visually observing the end surface of the brittle material layer 1 of the composite material 10 (composite piece) divided by the division method according to Example 2, the brittle material layer 1 was divided without a problem as shown in FIG. and no cracks occurred.

<Comparative Example 1>

When the second processing groove 31 is formed, the laser light L2 oscillated from the second laser light source 30 is projected on the division line (a plurality of division lines set in a grid shape) DL of the composite material 10 . Parting of the composite material 10 was attempted under the same conditions as in Example 1, except that the protective layer 3 was irradiated only once (a peeling method was not applied). As shown in Fig. 7, the width of the second processing groove 31 formed in Comparative Example 1 is 30 μm, and the brittle material layer ( 1) was smaller than the spot diameter D (100 µm) at the irradiation position.

As shown in FIG. 7 , in the dividing method according to Comparative Example 1, the processing marks 11 penetrating the brittle material layer 1 were not formed, so that the composite material 10 could not be divided.

<Example 3>

Except for the points shown in (1) to (3) below, a composite material 10 was produced under the same conditions as in Example 1, and the composite material 10 was divided.

(1) As shown in FIG. 8, the surface protection film (The Nitto Denko Corporation make, brand name "AW700EC") which has a urethane-type adhesive layer as the protective layer 3 was prepared.

The base material layer 3a of this protective layer 3 is formed from the base material "LUMIRROR S10" (38 micrometers in thickness, Toray Industries, Inc. make) which consists of a polyester resin.

In addition, the adhesive layer 3b of this protective layer 3 is produced as follows. First, as a polyol, PREMINOL S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000), which is a polyol having three OH groups, and SANNIX GP-3000, a polyol having three OH groups (manufactured by Sanyo Chemical Industries, Ltd., Mn= 3000), a polyol having three OH groups, SANNIX GP-1000 (manufactured by Sanyo Chemical Industries, Ltd., Mn=1000) is used. Moreover, CORONATE HX (made by Nippon Polyurethane Industry Co., Ltd.) which is a polyfunctional alicyclic type isocyanate compound is used as a polyfunctional isocyanate compound. In addition, the brand name "NACEM ferric iron" manufactured by NIHON KAGAKU SANGYO CO., LTD. is used as the catalyst. In addition, Irganox1010 (made by BASF SE) is used as a deterioration inhibitor. Further, as fatty acid ester, isopropyl myristic acid (manufactured by Kao Corporation, trade name "EXEPAL IPM", Mn = 270) or cetyl 2-ethylhexanoate (manufactured by The Nisshin OilliO Group, Ltd., trade name "SALACOS 816T", Mn = 368) is used. Then, 1-ethyl-3-methylimidazolium bis(fluoromethanesulfonyl)imide (manufactured by DKS Co. Ltd., trade name "AS110") and both terminal polyether-modified silicone oil (Shin-) Etsu Chemical Co., Ltd. make, brand name "KF-6004") and ethyl acetate as a diluent solvent are added, and a urethane-type adhesive composition is produced by mixing and stirring. Then, the prepared urethane-based pressure-sensitive adhesive composition is applied on the base layer 3a to a thickness of 10 μm after drying with a fountain roll, cured at a drying temperature of 130° C. and a drying time of 30 seconds, and dried to form an adhesive layer 3b. do.

The protective layer 3 (AW700EC) is provided with the base material layer 3a and the adhesive layer 3b which were produced as mentioned above. And the protective layer 3 through the pressure-sensitive adhesive layer 3b of the protective layer 3, the brittle material layer 1 of the laminate of the same brittle material layer 1 and the optical function layer 2 as in Example 1 The composite material 10 was produced by joining.

(2) When forming the second processing groove 31, an offset method was applied.

(3) As shown in Fig. 8, when the second processing groove 31 is formed, the output of the laser light L2 oscillated from the second laser light source 30 is 4.3 W, and the protective layer ( 3) The resin was removed so that a part of the resin (the pressure-sensitive adhesive layer 3b) remained as a residue (thickness: 7.5 µm).

As a result of visually observing the end surface of the brittle material layer 1 of the composite material 10 (composite piece) divided by the division method according to Example 3, the brittle material layer 1 was divided without any problem as shown in FIG. and no cracks occurred.

<Example 4>

As shown in Fig. 8, when the second processing groove 31 is formed, the output of the laser light L2 oscillated from the second laser light source 30 is 4.9 W, and the protective layer 3 is applied at the irradiation position. The composite material 10 was sectioned under the same conditions as in Example 3, except that the resin was removed so that a part of the resin to be formed (the pressure-sensitive adhesive layer 3b) remained as a residue having a thickness of 2.1 μm.

As a result of visually observing the end surface of the brittle material layer 1 of the composite material 10 (composite piece) divided by the division method according to Example 4, as shown in FIG. 8, the brittle material layer 1 was divided without a problem. and no cracks occurred.

<Example 5>

As shown in Fig. 8, when forming the second processing groove 31, the output of the laser light L2 oscillated from the second laser light source 30 is 5.1 W, and the protective layer 3 is applied at the irradiation position. The composite material 10 was divided under the same conditions as in Example 3, except that the resin was removed so that a part of the resin to be formed did not remain as a residue (thickness: 0 µm).

As a result of visually observing the end surface of the brittle material layer 1 of the composite material 10 (composite piece) divided by the division method according to Example 5, as shown in FIG. 8, the brittle material layer 1 was divided without any problem. and no cracks occurred.

<Comparative Example 2>

When the second processing groove 31 is formed, the laser light L2 oscillated from the second laser light source 30 is projected on the division line (a plurality of division lines set in a grid shape) DL of the composite material 10 . Parting of the composite material 10 was attempted under the same conditions as in Example 5, except that the protective layer 3 was irradiated only once (the offset method was not applied). As shown in Fig. 8, the width of the second processing groove 31 formed in Comparative Example 2 is 30 μm, and the brittle material layer of the laser light L3 oscillated from the ultrashort pulse laser light source 40 in the processing mark forming process 1) was smaller than the spot diameter D (100 µm) at the irradiation position.

As shown in FIG. 8 , in the dividing method according to Comparative Example 2, the processing marks 11 penetrating the brittle material layer 1 were not formed, so that the composite material 10 could not be divided.

1: Brittle material layer 2: Optical function layer
3: protective layer 3a: base layer
3b: adhesive layer 10: composite material
11: processing mark 20: first laser light source
21: first processing groove 30: second laser light source
31: second processing groove 40: ultra-short pulse laser light source
D: Spot diameter DL: Predicted dividing line
L1, L2, L3: laser light W: width of the second machining groove

Claims (8)

A method of dividing a composite material in which a resin optical function layer is laminated on one surface side of the brittle material layer and a resin protective layer is laminated on the other surface side of the brittle material layer,
Forming a first processing groove along the dividing line by irradiating the laser light oscillated from the first laser light source to the optical functional layer along the dividing line of the composite material to remove the resin forming the optical functional layer; In addition, by irradiating the laser light oscillated from the second laser light source to the protective layer along the predetermined dividing line to remove the resin forming the protective layer, a processing groove is formed to form a second processing groove along the predetermined dividing line. process and
After the processing groove forming step, laser light oscillated from an ultra-short pulse laser light source is irradiated to the brittle material layer from the side of the second processing groove along the predetermined division line to remove the brittle material forming the brittle material layer. Including a machining mark forming process of forming a machining mark along a predetermined line,
The protective layer so that the width of the second processing groove in the processing groove forming step is equal to or greater than the spot diameter at the irradiation position of the laser beam oscillated from the ultrashort pulse laser light source in the processing scar formation step to the brittle material layer A method of segmenting a composite to remove the resin forming the. The method of claim 1,
In the processing groove forming step, the irradiation position of the laser light oscillated from the second laser light source to the protective layer is shifted in a direction orthogonal to the predetermined dividing line, and the laser light is oriented along the divided dividing line at each irradiation position. After irradiating the protective layer, a method of dividing a composite material to form the second processing groove by peeling off the resin forming the protective layer existing between the respective irradiation positions. The method of claim 1,
In the processing groove forming step, the irradiation position of the laser light oscillated from the second laser light source to the protective layer is sequentially shifted in a direction orthogonal to the predetermined dividing line, and at each irradiation position along the divided dividing line. A method of dividing a composite material by irradiating laser light to the protective layer to form the second processing groove. 4. The method according to any one of claims 1 to 3,
A method of dividing a composite material by removing the resin forming the protective layer so that the width of the second processing groove is 100 μm or more in the processing groove forming step. 5. The method according to any one of claims 1 to 4,
The protective layer includes a base layer and an adhesive layer disposed on the side of the brittle material layer,
A method for dividing a composite material by removing the resin forming the protective layer so that a portion of the pressure-sensitive adhesive layer in the thickness direction remains in the processing groove forming step. 6. The method according to any one of claims 1 to 5,
The protective layer is a method for dividing a composite material comprising a base layer and a urethane-based pressure-sensitive adhesive layer disposed on the side of the brittle material layer. 7. The method according to any one of claims 1 to 6,
The second laser light source is a CO ₂ laser light source, a method for dividing a composite material. 8. The method according to any one of claims 1 to 7,
The method for dividing a composite material, wherein the brittle material layer includes glass, and the optical function layer includes a polarizing film.

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