KR20220143007A - Electroless plating base agent containing polymer and metal fine particles - Google Patents
Electroless plating base agent containing polymer and metal fine particles Download PDFInfo
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- KR20220143007A KR20220143007A KR1020227024956A KR20227024956A KR20220143007A KR 20220143007 A KR20220143007 A KR 20220143007A KR 1020227024956 A KR1020227024956 A KR 1020227024956A KR 20227024956 A KR20227024956 A KR 20227024956A KR 20220143007 A KR20220143007 A KR 20220143007A
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- South Korea
- Prior art keywords
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- metal
- monomer
- copolymer
- agent
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- 239000002184 metal Substances 0.000 title claims abstract description 142
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- 229920000642 polymer Polymers 0.000 title abstract description 94
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- 238000007747 plating Methods 0.000 claims abstract description 98
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- 229910052802 copper Inorganic materials 0.000 claims description 64
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- NAQQTJZRCYNBRX-UHFFFAOYSA-N n-pentan-3-ylidenehydroxylamine Chemical class CCC(CC)=NO NAQQTJZRCYNBRX-UHFFFAOYSA-N 0.000 description 1
- UBVMBXTYMSRUDX-UHFFFAOYSA-N n-prop-2-enyl-3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCNCC=C UBVMBXTYMSRUDX-UHFFFAOYSA-N 0.000 description 1
- CATWEXRJGNBIJD-UHFFFAOYSA-N n-tert-butyl-2-methylpropan-2-amine Chemical compound CC(C)(C)NC(C)(C)C CATWEXRJGNBIJD-UHFFFAOYSA-N 0.000 description 1
- 238000005329 nanolithography Methods 0.000 description 1
- HVYCQBKSRWZZGX-UHFFFAOYSA-N naphthalen-1-yl 2-methylprop-2-enoate Chemical compound C1=CC=C2C(OC(=O)C(=C)C)=CC=CC2=C1 HVYCQBKSRWZZGX-UHFFFAOYSA-N 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
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- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- KSCKTBJJRVPGKM-UHFFFAOYSA-N octan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCC[O-].CCCCCCCC[O-].CCCCCCCC[O-].CCCCCCCC[O-] KSCKTBJJRVPGKM-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- PBHPFFDRTUWVIT-UHFFFAOYSA-N oxetan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCO1 PBHPFFDRTUWVIT-UHFFFAOYSA-N 0.000 description 1
- AMUUFLNQHMIHRP-UHFFFAOYSA-N oxetan-3-ylmethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1COC1 AMUUFLNQHMIHRP-UHFFFAOYSA-N 0.000 description 1
- ZADZUSCZHASNAH-UHFFFAOYSA-N oxetan-3-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1COC1 ZADZUSCZHASNAH-UHFFFAOYSA-N 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- KOOHRIRWWIYFRH-UHFFFAOYSA-N oxolan-2-one;prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1CCCO1 KOOHRIRWWIYFRH-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- QUBQYFYWUJJAAK-UHFFFAOYSA-N oxymethurea Chemical compound OCNC(=O)NCO QUBQYFYWUJJAAK-UHFFFAOYSA-N 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 description 1
- 239000011238 particulate composite Substances 0.000 description 1
- 229920001277 pectin Polymers 0.000 description 1
- 235000010987 pectin Nutrition 0.000 description 1
- 239000001814 pectin Substances 0.000 description 1
- GXOHBWLPQHTYPF-UHFFFAOYSA-N pentyl 2-hydroxypropanoate Chemical compound CCCCCOC(=O)C(C)O GXOHBWLPQHTYPF-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000005003 perfluorobutyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- 125000005004 perfluoroethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000005009 perfluoropropyl group Chemical group FC(C(C(F)(F)F)(F)F)(F)* 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920002454 poly(glycidyl methacrylate) polymer Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010483 polyoxyethylene sorbitan monopalmitate Nutrition 0.000 description 1
- 239000000249 polyoxyethylene sorbitan monopalmitate Substances 0.000 description 1
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 1
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- 239000004814 polyurethane Substances 0.000 description 1
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- 229910052700 potassium Inorganic materials 0.000 description 1
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- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 1
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- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- UIDUKLCLJMXFEO-UHFFFAOYSA-N propylsilane Chemical compound CCC[SiH3] UIDUKLCLJMXFEO-UHFFFAOYSA-N 0.000 description 1
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- 238000010526 radical polymerization reaction Methods 0.000 description 1
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- SVOOVMQUISJERI-UHFFFAOYSA-K rhodium(3+);triacetate Chemical compound [Rh+3].CC([O-])=O.CC([O-])=O.CC([O-])=O SVOOVMQUISJERI-UHFFFAOYSA-K 0.000 description 1
- SONJTKJMTWTJCT-UHFFFAOYSA-K rhodium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Rh+3] SONJTKJMTWTJCT-UHFFFAOYSA-K 0.000 description 1
- OJLCQGGSMYKWEK-UHFFFAOYSA-K ruthenium(3+);triacetate Chemical compound [Ru+3].CC([O-])=O.CC([O-])=O.CC([O-])=O OJLCQGGSMYKWEK-UHFFFAOYSA-K 0.000 description 1
- YBCAZPLXEGKKFM-UHFFFAOYSA-K ruthenium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Ru+3] YBCAZPLXEGKKFM-UHFFFAOYSA-K 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- OGFYIDCVDSATDC-UHFFFAOYSA-N silver silver Chemical compound [Ag].[Ag] OGFYIDCVDSATDC-UHFFFAOYSA-N 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
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- 229940035048 sorbitan monostearate Drugs 0.000 description 1
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- 238000001179 sorption measurement Methods 0.000 description 1
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- 239000007858 starting material Substances 0.000 description 1
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- 239000002344 surface layer Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- LPSXSORODABQKT-UHFFFAOYSA-N tetrahydrodicyclopentadiene Chemical compound C1C2CCC1C1C2CCC1 LPSXSORODABQKT-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- DANYXEHCMQHDNX-UHFFFAOYSA-K trichloroiridium Chemical compound Cl[Ir](Cl)Cl DANYXEHCMQHDNX-UHFFFAOYSA-K 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- FOQJQXVUMYLJSU-UHFFFAOYSA-N triethoxy(1-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)C(C)[Si](OCC)(OCC)OCC FOQJQXVUMYLJSU-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- NIINUVYELHEORX-UHFFFAOYSA-N triethoxy(triethoxysilylmethyl)silane Chemical compound CCO[Si](OCC)(OCC)C[Si](OCC)(OCC)OCC NIINUVYELHEORX-UHFFFAOYSA-N 0.000 description 1
- YYJNCOSWWOMZHX-UHFFFAOYSA-N triethoxy-(4-triethoxysilylphenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=C([Si](OCC)(OCC)OCC)C=C1 YYJNCOSWWOMZHX-UHFFFAOYSA-N 0.000 description 1
- KENDGHJJHKCUNB-UHFFFAOYSA-N triethoxy-[4-(4-triethoxysilylphenyl)phenyl]silane Chemical group C1=CC([Si](OCC)(OCC)OCC)=CC=C1C1=CC=C([Si](OCC)(OCC)OCC)C=C1 KENDGHJJHKCUNB-UHFFFAOYSA-N 0.000 description 1
- FTXGNVFQZMEDAS-UHFFFAOYSA-N triethoxy-[[4-(triethoxysilylmethyl)phenyl]methyl]silane Chemical compound CCO[Si](OCC)(OCC)CC1=CC=C(C[Si](OCC)(OCC)OCC)C=C1 FTXGNVFQZMEDAS-UHFFFAOYSA-N 0.000 description 1
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DJYGUVIGOGFJOF-UHFFFAOYSA-N trimethoxy(trimethoxysilylmethyl)silane Chemical compound CO[Si](OC)(OC)C[Si](OC)(OC)OC DJYGUVIGOGFJOF-UHFFFAOYSA-N 0.000 description 1
- YIRZROVNUPFFNZ-UHFFFAOYSA-N trimethoxy-(4-trimethoxysilylphenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=C([Si](OC)(OC)OC)C=C1 YIRZROVNUPFFNZ-UHFFFAOYSA-N 0.000 description 1
- SITVYBQUZUHZGY-UHFFFAOYSA-N trimethoxy-[4-(4-trimethoxysilylphenyl)phenyl]silane Chemical group C1=CC([Si](OC)(OC)OC)=CC=C1C1=CC=C([Si](OC)(OC)OC)C=C1 SITVYBQUZUHZGY-UHFFFAOYSA-N 0.000 description 1
- GKMJIVDFRBQRTH-UHFFFAOYSA-N trimethoxy-[[4-(trimethoxysilylmethyl)phenyl]methyl]silane Chemical compound CO[Si](OC)(OC)CC1=CC=C(C[Si](OC)(OC)OC)C=C1 GKMJIVDFRBQRTH-UHFFFAOYSA-N 0.000 description 1
- KCTAHLRCZMOTKM-UHFFFAOYSA-N tripropylphosphane Chemical compound CCCP(CCC)CCC KCTAHLRCZMOTKM-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- UHVMMEOXYDMDKI-JKYCWFKZSA-L zinc;1-(5-cyanopyridin-2-yl)-3-[(1s,2s)-2-(6-fluoro-2-hydroxy-3-propanoylphenyl)cyclopropyl]urea;diacetate Chemical compound [Zn+2].CC([O-])=O.CC([O-])=O.CCC(=O)C1=CC=C(F)C([C@H]2[C@H](C2)NC(=O)NC=2N=CC(=CC=2)C#N)=C1O UHVMMEOXYDMDKI-JKYCWFKZSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/002—Priming paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
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Abstract
[과제] 고분자 및 금속미립자를 포함하는 무전해 도금 하지제를 제공하는 것이다.
[해결수단] 기재 상에 무전해 도금처리에 의해 금속도금막을 형성하기 위한 무전해 도금 하지제로서, (A)분자 내에 적어도 1개의 트리플루오로메틸기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머a에서 유래하는 구성단위와, 분자 내에 금속분산성기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머b에서 유래하는 구성단위를 포함하는 공중합체, (B)금속미립자, 및 (C)용제를 포함하는 하지제.[Problem] To provide an electroless plating brush comprising a polymer and fine metal particles.
[Solutions] An electroless plating brushing agent for forming a metal plating film by electroless plating on a substrate, wherein (A) a monomer having at least one trifluoromethyl group and one radically polymerizable double bond in a molecule a A copolymer comprising a structural unit derived from, and a structural unit derived from a monomer b having a metal dispersible group and one radically polymerizable double bond in the molecule, (B) metal fine particles, and (C) a solvent containing a solvent My.
Description
본 발명은, 고분자, 금속미립자를 포함하는 무전해 도금 하지제에 관한 것이다.The present invention relates to an electroless plating brush comprising a polymer and metal fine particles.
무전해 도금은, 기재를 도금액에 침지하는 것만으로, 기재의 종류나 형상에 관계 없이 두께가 균일한 피막이 얻어지고, 플라스틱이나 세라믹, 유리 등의 부도체 재료에도 금속도금막을 형성할 수 있는 점에서, 예를 들어, 자동차부품 등의 수지 성형체에의 고급감이나 미관의 부여와 같은 장식용도나, 전자차폐, 프린트기판 및 대규모 집적회로 등의 배선기술 등, 다양한 분야에 있어서 폭넓게 이용되고 있다.In electroless plating, a film with a uniform thickness is obtained regardless of the type or shape of the substrate simply by immersing the substrate in a plating solution, and a metal plating film can be formed even on non-conductive materials such as plastics, ceramics, and glass. For example, it is widely used in various fields, such as decorative applications such as imparting a sense of quality and aesthetics to resin molded articles such as automobile parts, and wiring technology for electronic shielding, printed circuit boards and large-scale integrated circuits.
통상, 무전해 도금에 의해 기재(피도금체) 상에 금속도금막을 형성하는 경우, 기재와 금속도금막의 밀착성을 높이기 위한 전처리가 행해진다. 구체적으로는, 우선 다양한 에칭수단에 의해 피처리면을 조면화 및/또는 친수화하고, 이어서, 피처리면 상에의 도금촉매의 흡착을 촉진하는 흡착물질을 피처리면 상에 공급하는 감수성화 처리(sensitization)와, 피처리면 상에 도금촉매를 흡착시키는 활성화 처리(activation)를 행한다. 전형적으로는, 감수성화 처리는 염화제일주석의 산성용액 중에 피처리물을 침지하고, 이로 인해, 환원제로서 작용할 수 있는 금속(Sn2+)이 피처리면에 부착된다. 그리고, 감수성화된 피처리면에 대하여, 활성화 처리로서 염화팔라듐의 산성용액 중에 피처리물을 침지시킨다. 이에 따라, 용액 중의 팔라듐이온은 환원제인 금속(주석이온: Sn2+)에 의해 환원되고, 활성인 팔라듐촉매핵으로서 피처리면에 부착된다. 이러한 전처리 후, 무전해 도금액에 침지하여, 금속도금막을 피처리면 상에 형성한다.In general, when a metal plating film is formed on a substrate (substrate to be plated) by electroless plating, a pretreatment is performed to improve adhesion between the substrate and the metal plating film. Specifically, a sensitization treatment of first roughening and/or hydrophilizing a surface to be treated by various etching means, and then supplying an adsorbent material that promotes adsorption of a plating catalyst onto the surface to be treated. ) and an activation treatment for adsorbing a plating catalyst on the surface to be treated. Typically, in the sensitization treatment, the object to be treated is immersed in an acidic solution of stannous chloride, whereby a metal (Sn 2+ ) capable of acting as a reducing agent adheres to the surface to be treated. Then, the sensitized surface to be treated is immersed in an acidic solution of palladium chloride as an activation treatment. Accordingly, the palladium ions in the solution are reduced by the metal (tin ion: Sn 2+ ) as a reducing agent, and adhere to the surface to be treated as active palladium catalyst nuclei. After such pretreatment, it is immersed in an electroless plating solution to form a metal plating film on the surface to be treated.
이에 반해, 암모늄기를 갖는 고분지 폴리머 및 금속미립자를 포함하는 조성물을 무전해 도금의 하지제(도금촉매)로서 사용한 예가 보고되고, 종래의 무전해 도금처리의 전처리공정(조면화처리)에 있어서 문제가 되고 있던 크롬 화합물(크롬산)의 사용을 회피하고, 또한 전처리의 공정수를 삭감하는 등, 환경면이나 비용면, 번잡한 조작성 등의 다양한 개선을 도모한 무전해 도금 하지제의 제안이 이루어지고 있다(특허문헌 1).On the other hand, an example has been reported in which a composition containing a highly branched polymer having an ammonium group and a composition containing fine metal particles is used as a base agent (plating catalyst) for electroless plating, and there is a problem in the pretreatment process (roughening treatment) of the conventional electroless plating treatment. A proposal has been made for an electroless plating brushing agent that avoids the use of a chromium compound (chromic acid), which has been previously used, and reduces the number of pre-treatment steps, thereby achieving various improvements in environmental aspects, cost aspects, and complicated operability. There is (Patent Document 1).
상기 서술한 무전해 도금의 하지제로서 제안된 다양한 고분지 폴리머 및 금속미립자를 포함하는 조성물에 있어서는, 기판 상에의 다른 기능(예를 들어 밀착성, 내열성, 감광성, 유전성 등)을 부여하기 위해 각각의 기능을 갖는 다른 베이스 수지를 첨가하는 것이 필요시되는데, 도금 하지제로서의 기능을 발휘하지 않는 다른 베이스 수지가 함유되어 있음으로써, 상기의 하지제는 도금의 석출성을 현저히 손상시키는 경우가 있다.In the compositions containing various highly branched polymers and metal fine particles proposed as brushing agents for electroless plating as described above, each of the compositions provides different functions (for example, adhesion, heat resistance, photosensitivity, dielectric properties, etc.) on the substrate. It is necessary to add another base resin having a function of
즉, 지금까지 제안된 고분지 폴리머 및 금속미립자를 포함하는 무전해 도금 하지제는, 도금 하지제의 기능을 갖지 않는 다른 베이스 수지를 첨가했을 때, 도금석출성이 저하되는 경우가 있다는 문제가 있었다.That is, the electroless plating brush agent containing the highly branched polymer and metal fine particles proposed so far has a problem that plating precipitation may be lowered when another base resin having no function of the plating brush agent is added. .
본 발명은 이 종래의 과제를 해결하기 위해 이루어진 것으로서, 밀착성을 부여하는 베이스 수지가 배합되어 있는 조성의 도금 하지제를 이용해도, 우수한 도금석출성을 발현하는 도금하지층을 형성할 수 있는 하지제의 제공을 목적으로 한다. 나아가 본 발명은 그 제조에 있어서도 저비용화를 실현할 수 있는, 무전해 도금의 전처리공정으로서 이용되는 새로운 하지제의 제공을 목적으로 한다.The present invention has been made in order to solve this conventional problem, and it is possible to form a plating base layer that exhibits excellent plating precipitation even if a plating brush agent having a composition containing a base resin for imparting adhesion is used. is intended to provide Furthermore, an object of the present invention is to provide a new brush agent used as a pretreatment step for electroless plating, which can realize cost reduction even in the production thereof.
본 발명자들은, 상기 목적을 달성하기 위해 예의 검토한 결과, 불소원자를 함유하는 폴리머 구체적으로는, 분자 내에 트리플루오로메틸기 및 금속분산성기를 갖는 폴리머가 우수한 금속분산성을 갖고, 이 폴리머와 금속미립자를 조합하고, 이것을 기재 상에 도포하여 얻어지는 층이, 무전해 금속도금의 하지층으로서 도금성이 우수한 것을 발견하여, 본 발명을 완성시켰다.As a result of intensive studies to achieve the above object, the present inventors have found that a polymer containing a fluorine atom, specifically, a polymer having a trifluoromethyl group and a metal dispersing group in the molecule has excellent metal dispersibility, and the polymer and the metal fine particles have excellent metal dispersibility. The present invention was completed by finding that the layer obtained by combining and applying it on a substrate was excellent in plating properties as a base layer for electroless metal plating.
즉 본 발명은, 제1 관점으로서, 기재 상에 무전해 도금처리에 의해 금속도금막을 형성하기 위한 무전해 도금 하지제로서,That is, the present invention provides, as a first aspect, an electroless plating base agent for forming a metal plating film by electroless plating on a substrate,
(A)분자 내에 적어도 1개의 트리플루오로메틸기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머a에서 유래하는 구성단위와, 분자 내에 금속분산성기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머b에서 유래하는 구성단위를 포함하는 공중합체,(A) A structural unit derived from a monomer a having at least one trifluoromethyl group and one radically polymerizable double bond in a molecule, and a monomer b having a metal dispersible group and one radically polymerizable double bond in the molecule A copolymer comprising a constituent unit,
(B)금속미립자, 및(B) metal particles, and
(C)용제(C) Solvent
를 포함하는 하지제에 관한 것이다.It relates to a lower extremity agent comprising a.
제2 관점으로서, 상기 (A)공중합체 중의 금속분산성기에, 상기 (B)금속미립자가 부착 또는 배위한 복합체를 포함하는, 제1 관점에 기재된 하지제에 관한 것이다.As a second aspect, it relates to the brush agent according to the first aspect, comprising a complex in which the (B) metal fine particles are attached or coordinated to the metal dispersible group in the (A) copolymer.
제3 관점으로서, 상기 모노머a가, 비닐기 및 (메트)아크릴로일기 중 어느 일방을 갖는 화합물인, 제1 관점 또는 제2 관점에 기재된 하지제에 관한 것이다.As a 3rd viewpoint, the said monomer a is a compound which has either a vinyl group and a (meth)acryloyl group, It is related with the brush agent as described in the 1st viewpoint or 2nd viewpoint.
제4 관점으로서, 상기 모노머a가, 아래 식(1)로 표시되는 화합물인 제3 관점에 기재된 하지제에 관한 것이다.As a 4th viewpoint, it relates to the brush agent as described in the 3rd viewpoint, wherein the said monomer a is a compound represented by Formula (1) below.
[화학식 1][Formula 1]
(식(1) 중, M은, 단결합, 카르보닐옥시기, 아미드기 또는 페닐렌기를 나타내고, J는, 적어도 1개의 트리플루오로메틸기를 갖는 탄소원자수 1 내지는 10의 직쇄 또는 분지구조의 알킬기를 나타내고, R6은 수소원자 또는 탄소원자수 1 내지 4의 알킬기를 나타낸다.) 제5 관점으로서, 상기 모노머b가, 비닐기 및 (메트)아크릴로일기 중 어느 일방을 갖는 화합물인, 제1 관점 또는 제2 관점에 기재된 하지제에 관한 것이다.(In formula (1), M represents a single bond, a carbonyloxy group, an amide group or a phenylene group, and J is a C1-C10 linear or branched alkyl group having at least one trifluoromethyl group. and R 6 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.) As a fifth aspect, the monomer b is a compound having either a vinyl group or a (meth)acryloyl group, the first aspect Or it relates to the brushing agent according to the second aspect.
제6 관점으로서, 상기 모노머b가, 아래 식(2) 또는 (3)으로 표시되는 화합물인 제5 관점에 기재된 하지제에 관한 것이다.As a sixth aspect, it relates to the brush agent according to the fifth aspect, wherein the monomer b is a compound represented by the following formula (2) or (3).
[화학식 2][Formula 2]
(식(2) 중, R1은, 수소원자 또는 탄소원자수 1 내지 6의 알킬기를 나타내고, L은, O 또는 N을 나타내고, R2는, L이 N을 나타내는 경우에만 존재하고, 수소원자를 나타내거나, 또는, R1 및 R2는, 그들이 결합하는 원자와 하나가 되어, 4 내지 6원의 환상 아미드를 형성할 수도 있다.(In formula (2), R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, L represents O or N, R 2 is present only when L represents N, and a hydrogen atom is Alternatively, R 1 and R 2 may become one with the atom to which they are bonded to form a 4 to 6 membered cyclic amide.
식(3) 중, R3은 수소원자 또는 메틸기를 나타내고,In formula (3), R 3 represents a hydrogen atom or a methyl group,
R4는 수소원자 또는 탄소원자수 1 내지 10의 분지할 수도 있는 알킬기, 탄소원자수 1 내지 10의 분지할 수도 있는 알콕실기 또는, 탄소원자수 1 내지 10의 분지할 수도 있는 알콕실알킬기를 나타내고, L은, O 또는 N을 나타내고, R5는, L이 N을 나타내는 경우에만 존재하고, 수소원자를 나타내거나, 또는, R4 및 R5는, 그들이 결합하는 원자와 하나가 되어, 4 내지 6원의 환상 아미드, 또는, 4 내지 6원의 환상 이미드를 형성할 수도 있다.)R 4 represents a hydrogen atom or an optionally branched alkyl group having 1 to 10 carbon atoms, an optionally branched alkoxyl group having 1 to 10 carbon atoms, or an optionally branched alkoxylalkyl group having 1 to 10 carbon atoms, and L is , O or N, R 5 is present only when L represents N and represents a hydrogen atom, or R 4 and R 5 are one with the atom to which they are bonded, and form a 4 to 6 membered Cyclic amides, or 4 to 6 membered cyclic imides may be formed.)
제7 관점으로서, 상기 모노머b가 N-비닐피롤리돈, N-비닐아세트아미드 또는 N-비닐포름아미드인 제6 관점에 기재된 하지제에 관한 것이다.As a seventh aspect, it relates to the brush agent according to the sixth aspect, wherein the monomer b is N-vinylpyrrolidone, N-vinylacetamide or N-vinylformamide.
제8 관점으로서, 상기 (A)공중합체를 부여하는 모노머 혼합물은, 상기 모노머b의 몰수에 대하여 5~500%의 몰수가 되는 양의 상기 모노머a를 포함하는, 제1 관점 내지 제7 관점 중 어느 하나에 기재된 하지제에 관한 것이다.As an eighth aspect, the monomer mixture giving the copolymer (A) contains the monomer a in an amount that is 5 to 500% of moles based on the number of moles of the monomer b, among the first to seventh aspects. It relates to the lower extremity agent as described in any one.
제9 관점으로서, 상기 공중합체(A)가, 분자 내에 가교성기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머c에서 유래하는 구성단위를 추가로 포함하는 제1 관점 내지 제8 관점 중 어느 하나에 기재된 하지제에 관한 것이다.As a ninth aspect, in any one of the first to eighth aspects, the copolymer (A) further comprises a structural unit derived from a monomer c having a crosslinkable group and one radically polymerizable double bond in the molecule. It relates to the described laxatives.
제10 관점으로서, 상기 모노머c가, 비닐기 및 (메트)아크릴로일기 중 어느 일방을 갖는 화합물인, 제9 관점에 기재된 하지제에 관한 것이다.As a 10th viewpoint, the said monomer c is a compound which has either a vinyl group and a (meth)acryloyl group, It is related with the brush agent as described in the 9th viewpoint.
제11 관점으로서, 상기 모노머c가, 아래 식(4)로 표시되는 화합물인 제10 관점에 기재된 하지제에 관한 것이다.As an eleventh aspect, it relates to the brush agent according to the tenth aspect, wherein the monomer c is a compound represented by the following formula (4).
[화학식 3][Formula 3]
(식(4) 중, X는, 단결합, 카르보닐옥시기, 아미드기 또는 페닐렌기를 나타내고, Y는 탄소원자수 1 내지 6의 알킬렌기, 탄소원자수 1 내지 6의 옥시알킬렌기, 분지할 수도 있는 탄소원자수 1 내지 6의 알킬에테르기, 탄소원자수 1 내지 6의 티오알킬렌기 또는 탄소원자수 1 내지 6의 티오알킬에테르기를 나타내고, Z는, 가교성기를 나타내고, R7은 수소원자 또는 탄소원자수 1 내지 4의 알킬기를 나타낸다.)(In formula (4), X represents a single bond, a carbonyloxy group, an amide group or a phenylene group, Y is an alkylene group having 1 to 6 carbon atoms, an oxyalkylene group having 1 to 6 carbon atoms, or branched represents an alkylether group having 1 to 6 carbon atoms, a thioalkylene group having 1 to 6 carbon atoms or a thioalkyl ether group having 1 to 6 carbon atoms, Z represents a crosslinkable group, R 7 is a hydrogen atom or 1 carbon atom to 4 alkyl groups.)
제12 관점으로서, 상기 (A)공중합체를 부여하는 모노머 혼합물은, 상기 모노머b의 몰수에 대하여 5~300%의 몰수가 되는 양의 상기 모노머c를 포함하는, 제9 관점 내지 제11 관점 중 어느 하나에 기재된 하지제에 관한 것이다.As a twelfth aspect, among the ninth to eleventh aspects, the (A) monomer mixture to which the copolymer is provided contains the monomer c in an amount such that the number of moles is 5 to 300% with respect to the number of moles of the monomer b. It relates to the lower extremity agent as described in any one.
제13 관점으로서, 상기 (B)금속미립자가, 철(Fe), 코발트(Co), 니켈(Ni), 구리(Cu), 팔라듐(Pd), 은(Ag), 주석(Sn), 백금(Pt) 및 금(Au)으로 이루어지는 군으로부터 선택되는 적어도 1종의 금속의 미립자인, 제1 관점 내지 제12 관점 중 어느 하나에 기재된 하지제에 관한 것이다.As a thirteenth aspect, the metal fine particles (B) include iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), tin (Sn), platinum ( It relates to the brush agent according to any one of the first to twelfth aspects, which are fine particles of at least one metal selected from the group consisting of Pt) and gold (Au).
제14 관점으로서, 상기 (B)금속미립자가, 팔라듐미립자인, 제13 관점에 기재된 하지제에 관한 것이다.A fourteenth aspect relates to the brush agent according to the thirteenth aspect, wherein the metal fine particles (B) are palladium fine particles.
제15 관점으로서, 상기 (B)금속미립자가, 1~100nm의 1차입자 평균입경을 갖는 미립자인, 제1 관점 내지 제14 관점 중 어느 하나에 기재된 하지제에 관한 것이다.A fifteenth aspect relates to the brush agent according to any one of the first to fourteenth aspects, wherein the metal fine particles (B) are fine particles having an average primary particle diameter of 1 to 100 nm.
제16 관점으로서, (D)비라디칼 중합성 가교성기를 추가로 갖는 베이스 수지를 함유하는 제1 관점 내지 제15 관점 중 어느 하나에 기재된 하지제에 관한 것이다.As a 16th viewpoint, it is related with the brush agent in any one of 1st viewpoint - 15th viewpoint containing (D) a base resin which further has a non-radically polymerizable crosslinkable group.
제17 관점으로서, (E)가교제를 추가로 함유하는 제1 관점 내지 제16 관점 중 어느 하나에 기재된 하지제에 관한 것이다.As a seventeenth aspect, it relates to the brush agent according to any one of the first to sixteenth aspects, further comprising (E) a crosslinking agent.
제18 관점으로서, 제1 관점 내지 제17 관점 중 어느 하나에 기재된 무전해 도금 하지제를 포함하는 막으로 이루어지는, 무전해 금속도금의 하지층에 관한 것이다.As an 18th aspect, it relates to the base layer of electroless metal plating which consists of a film|membrane containing the electroless plating base agent in any one of 1st aspect - 17th aspect.
제19 관점으로서, 제18 관점에 기재된 무전해 금속도금의 하지층의 위에 형성된 금속도금막에 관한 것이다.As a nineteenth aspect, it relates to a metal plating film formed on the underlayer of electroless metal plating according to the eighteenth aspect.
제20 관점으로서, 기재와, 이 기재 상에 형성된 제18 관점에 기재된 무전해 금속도금의 하지층과, 이 무전해 금속도금의 하지층의 위에 형성된 금속도금막을 구비하는, 금속피막기재에 관한 것이다.A twentieth aspect relates to a metal-coated base material comprising a base material, a base layer of electroless metal plating according to the eighteenth aspect formed on the base material, and a metal plating film formed on the base layer of the electroless metal plating. .
제21 관점으로서, 하기 (1)공정 및 (2)공정을 포함하는, 금속피막기재의 제조방법에 관한 것이다.As a twenty-first aspect, it relates to a method for manufacturing a metal-coated substrate comprising the following steps (1) and (2).
(1)공정: 제1 관점 내지 제17 관점 중 어느 하나에 기재된 무전해 도금 하지제를 기재 상에 도포하고, 무전해 금속도금의 하지층을 이 기재의 위에 형성하는 공정,(1) Step: a step of applying the electroless plating brush agent according to any one of the first to seventeenth aspects on a substrate, and forming a base layer of electroless metal plating on the substrate;
(2)공정: 이 하지층을 형성한 기재를 무전해 도금욕에 침지하고, 금속도금막을 이 하지층의 위에 형성하는 공정.(2) Step: A step of immersing the substrate on which the underlayer is formed in an electroless plating bath to form a metal plating film on the underlayer.
본 발명의 하지제는, 기재 상에 도포하는 것만으로 용이하게 무전속 도금의 하지층을 형성할 수 있다. 또한 본 발명에 따르면, 기판에의 밀착성이 우수하고, 도금의 석출성에 영향을 주지 않는 도금의 하지층을 형성할 수 있다. 게다가 본 발명의 하지제는, 다양한 조성으로 용이하게 바니시화가 가능하며, 높은 금속미립자 분산안정성을 갖는 것으로 할 수 있다.The brush agent of the present invention can easily form a base layer for electroless plating just by applying it on a base material. Further, according to the present invention, it is possible to form an underlayer for plating that is excellent in adhesion to a substrate and does not affect precipitation of plating. Furthermore, the brush agent of the present invention can be easily varnished with various compositions and has high dispersion stability of fine metal particles.
나아가, 본 발명의 하지제에 사용하는 폴리머는, 적은 프로세스로 간편하게 조제가능한 점에서, 도금 하지제의 제조공정의 간략화와 제조비용의 저감도 도모할 수 있다.Furthermore, since the polymer used for the brush agent of the present invention can be easily prepared in a small process, it is possible to simplify the manufacturing process of the plating brush agent and reduce the manufacturing cost.
또한, 본 발명의 무전해 도금 하지제로부터 형성된 무전해 금속도금의 하지층은, 무전해 도금욕에 침지하는 것만으로, 용이하게 금속도금막을 형성할 수 있고, 기재와 하지층, 그리고 금속도금막을 구비하는 금속피막기재를 용이하게 얻을 수 있다.In addition, the base layer of electroless metal plating formed from the electroless plating base agent of the present invention can easily form a metal plating film simply by immersion in an electroless plating bath, and the base material, the base layer, and the metal plating film The provided metal coating base material can be easily obtained.
즉, 본 발명의 밀착성을 부여하는 베이스 수지가 배합되어 있는 도금 하지제를 이용해도, 기재 상에 우수한 도금석출성을 발현하는 하지층을 형성할 수 있다.That is, even if the plating base agent in which the base resin which provides adhesiveness of this invention is mix|blended is used, the base layer which expresses the outstanding plating precipitation property on a base material can be formed.
이하, 본 발명에 대하여 상세히 설명한다.Hereinafter, the present invention will be described in detail.
본 발명의 하지제는, (A)상기 서술한 특정의 구성단위를 갖는 공중합체, (B)금속미립자, 및 (C)용제를 포함하고, 필요에 따라 기타 성분을 포함하는 하지제이다.The brush agent of the present invention is a brush agent comprising (A) a copolymer having the above-mentioned specific structural unit, (B) metal fine particles, and (C) a solvent, and optionally other components.
본 발명의 하지제는 기재 상에 무전해 도금처리에 의해 금속도금막을 형성하기 위한 촉매로서 호적하게 사용된다. 이하, 각 성분에 대하여 설명한다.The brush agent of the present invention is suitably used as a catalyst for forming a metal plating film by electroless plating on a substrate. Hereinafter, each component is demonstrated.
<(A)공중합체><(A) copolymer>
(A)성분은, 분자 내에 가교성기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머a에서 유래하는 구성단위와 분자 내에 금속분산성기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머b에서 유래하는 구성단위를 포함하는 공중합체이다.(A) Component is a structural unit derived from a monomer a having a crosslinkable group and one radically polymerizable double bond in the molecule, and a structural unit derived from a monomer b having a metal dispersible group and one radically polymerizable double bond in the molecule. It is a copolymer comprising
[모노머a][monomer a]
모노머a는, 분자 내에 적어도 1개의 트리플루오로메틸기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머이다.The monomer a is a monomer having at least one trifluoromethyl group and one radically polymerizable double bond in the molecule.
구체적인 모노머a로는, 예를 들어, 아래 식(1)로 표시되는 화합물을 들 수 있다.As a specific monomer a, the compound represented by Formula (1) below is mentioned, for example.
[화학식 4][Formula 4]
(식(1) 중, M은, 단결합, 카르보닐옥시기, 아미드기 또는 페닐렌기를 나타내고, J는, 적어도 1개의 트리플루오로메틸기를 갖는 탄소원자수 1 내지는 10의 직쇄 또는 분지구조의 알킬기를 나타내고, R6은 수소원자 또는 탄소원자수 1 내지 4의 알킬기를 나타낸다.)(In formula (1), M represents a single bond, a carbonyloxy group, an amide group or a phenylene group, and J is a C1-C10 linear or branched alkyl group having at least one trifluoromethyl group. and R 6 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.)
M은 카르보닐옥시기 또는 아미드기를 나타내는 경우에 하기 식(1-1)~(1-3)의 구조를 취할 수 있는데, 식(1-1)의 구조가 바람직하다.When M represents a carbonyloxy group or an amide group, the structures of the following formulas (1-1) to (1-3) can be taken, but the structure of the formula (1-1) is preferable.
[화학식 5][Formula 5]
J는 퍼플루오로메틸기(즉, 트리플루오로메틸기), 퍼플루오로에틸기, 2,2,2-트리플루오로에틸기, 1,1,2,2,2-펜타플루오로에틸기, 2,2,2-트리플루오로-1-(트리플루오로메틸)에틸기, 퍼플루오로프로필기, 3,3,3-트리플루오로프로필기, 2,2,3,3,3-펜타플루오로프로필기, 1,1,2,2,3,3,3-헵타플루오로프로필기, 헥사플루오로이소프로필기, 퍼플루오로부틸기, 4,4,4-트리플루오로부틸기, 3,3,4,4,4-펜타플루오로부틸기, 2,2,3,3,4,4,4-헵타플루오로부틸기, 1,1,2,2,3,3,4,4,4-노나플루오로부틸기 또는 2-(퍼플루오로헥실)에틸기 등을 들 수 있다.J is a perfluoromethyl group (ie, trifluoromethyl group), perfluoroethyl group, 2,2,2-trifluoroethyl group, 1,1,2,2,2-pentafluoroethyl group, 2,2, 2-trifluoro-1-(trifluoromethyl)ethyl group, perfluoropropyl group, 3,3,3-trifluoropropyl group, 2,2,3,3,3-pentafluoropropyl group, 1,1,2,2,3,3,3-heptafluoropropyl group, hexafluoroisopropyl group, perfluorobutyl group, 4,4,4-trifluorobutyl group, 3,3,4 ,4,4-pentafluorobutyl group, 2,2,3,3,4,4,4-heptafluorobutyl group, 1,1,2,2,3,3,4,4,4-nona A fluorobutyl group or 2-(perfluorohexyl)ethyl group etc. are mentioned.
이들 중에서도, J는 2,2,2-트리플루오로에틸기, 헥사플루오로이소프로필기 또는 2-(퍼플루오로헥실)에틸기인 것이 바람직하다.Among these, it is preferable that J is a 2,2,2-trifluoroethyl group, a hexafluoroisopropyl group, or 2-(perfluorohexyl)ethyl group.
이러한 모노머a의 구체예로는 한정되는 것은 아닌데, 이하의 것을 들 수 있다. 예를 들어 2,2,2-트리플루오로에틸아크릴레이트, 헥사플루오로-2-프로필메타크릴레이트, 2-(퍼플루오로헥실)에틸메타크릴레이트 등을 들 수 있다.Although it is not limited as a specific example of such a monomer a, The following are mentioned. For example, 2,2,2-trifluoroethyl acrylate, hexafluoro-2-propyl methacrylate, 2-(perfluorohexyl) ethyl methacrylate, etc. are mentioned.
[모노머b][monomer b]
본 발명에 있어서, 모노머b는, 분자 내에 금속분산성기 및 1개의 라디칼 중합성 이중결합을 갖는 화합물이다.In the present invention, the monomer b is a compound having a metal dispersible group and one radically polymerizable double bond in the molecule.
금속분산성기는, (B)성분의 금속미립자와 부착 및/또는 배위 등의 상호작용을 함으로써, 금속미립자의 조성물 중에 있어서의 분산성을 향상시키고, 그로 인해 금속미립자를 조성물 중에 안정적으로 존재시키기 위한 기이다. 이러한 금속분산성기로는, 카르보닐과, 그것에 공유결합으로 결합한 질소원자를 갖는 부위, 즉, -C(=O)-N-부위를 갖는 치환기가 바람직하고, 보다 구체적으로는, 아미드결합을 갖는 기 및 이미드결합을 갖는 기로 이루어지는 군으로부터 선택되는 기가 바람직하다.The metal dispersible group interacts with the metal fine particles of component (B), such as adhesion and/or coordination, to improve the dispersibility of the metal fine particles in the composition, thereby stably presenting the metal fine particles in the composition. it's gi As such a metal-dispersing group, a substituent having a carbonyl and a moiety having a nitrogen atom covalently bonded thereto, that is, a -C(=O)-N- moiety, is preferable, and more specifically, a substituent having an amide bond A group selected from the group consisting of a group and a group having an imide bond is preferred.
라디칼 중합성 이중결합으로는, 바람직하게는 비닐기 또는 (메트)아크릴로일기의 어느 일방을 1개 갖는 화합물인 것이 바람직하다. 한편, 모노머b가 라디칼 중합성 이중결합으로서 (메트)아크릴로일기를 갖는 화합물인 경우, 이 (메트)아크릴로일기에 포함되는 카르보닐기[-C(=O)-]가, 금속분산성기로서의 아미드기에 있어서의 카르보닐기와 중복하는 구조로 되어 있을 수도 있다.As a radically polymerizable double bond, it is preferable that it is a compound which preferably has either one of a vinyl group or a (meth)acryloyl group. On the other hand, when the monomer b is a compound having a (meth)acryloyl group as a radically polymerizable double bond, the carbonyl group [-C(=O)-] contained in this (meth)acryloyl group is an amide as a metal dispersible group It may have a structure overlapping with the carbonyl group in the group.
구체적인 모노머b로는, 예를 들어, 하기 식(2) 또는 식(3)으로 표시되는 화합물을 들 수 있다.As a specific monomer b, the compound represented by following formula (2) or Formula (3) is mentioned, for example.
[화학식 6][Formula 6]
(식(2) 중, R1은, 수소원자 또는 탄소원자수 1 내지 6의 알킬기를 나타내고, L은, O 또는 N을 나타내고, R2는, L이 N을 나타내는 경우에만 존재하고, 수소원자를 나타내거나, 또는, R1 및 R2는, 그들이 결합하는 원자와 하나가 되어, 4 내지 6원의 환상 아미드를 형성할 수도 있다.(In formula (2), R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, L represents O or N, R 2 is present only when L represents N, and a hydrogen atom is Alternatively, R 1 and R 2 may become one with the atom to which they are bonded to form a 4 to 6 membered cyclic amide.
식(3) 중, R3은 수소원자 또는 메틸기를 나타내고, R4는 수소원자 또는 탄소원자수 1 내지 10의 분지할 수도 있는 알킬기, 탄소원자수 1 내지 10의 분지할 수도 있는 알콕실기 또는, 탄소원자수 1 내지 10의 분지할 수도 있는 알콕실알킬기를 나타내고, L은, O 또는 N을 나타내고, R5는, L이 N을 나타내는 경우에만 존재하고, 수소원자를 나타내거나, 또는, R4 및 R5는, 그들이 결합하는 원자와 하나가 되어, 4 내지 6원의 환상 아미드, 또는, 4 내지 6원의 환상 이미드를 형성할 수도 있다.)In formula (3), R 3 represents a hydrogen atom or a methyl group, R 4 represents a hydrogen atom or an optionally branched alkyl group having 1 to 10 carbon atoms, an optionally branched alkoxyl group having 1 to 10 carbon atoms, or the number of carbon atoms 1 to 10 optionally branched alkoxylalkyl group, L represents O or N, R 5 is present only when L represents N and represents a hydrogen atom, or R 4 and R 5 may become one with the atom to which they are bonded to form a 4 to 6 membered cyclic amide or a 4 to 6 membered cyclic imide.)
이러한 모노머b로는, 예를 들어 N-비닐피롤리돈, N-비닐포름아미드, N-비닐아세트아미드, N-비닐아미드, N-메틸(메트)아크릴아미드, N-에틸(메트)아크릴아미드, N-프로필(메트)아크릴아미드, N-부틸(메트)아크릴아미드, N-이소부틸(메트)아크릴아미드, N-헥실(메트)아크릴아미드, N-옥틸(메트)아크릴아미드, N-메톡시메틸(메트)아크릴아미드, N-메톡시부틸(메트)아크릴아미드, N-에톡시메틸(메트)아크릴아미드, N-부톡시메틸(메트)아크릴아미드, N-이소부톡시메틸(메트)아크릴아미드, N-이소부톡시에틸(메트)아크릴아미드, N-비닐프탈이미드, N-비닐석신산이미드 등을 들 수 있다.Examples of the monomer b include N-vinylpyrrolidone, N-vinylformamide, N-vinylacetamide, N-vinylamide, N-methyl(meth)acrylamide, N-ethyl(meth)acrylamide, N-propyl (meth) acrylamide, N-butyl (meth) acrylamide, N-isobutyl (meth) acrylamide, N-hexyl (meth) acrylamide, N-octyl (meth) acrylamide, N-methoxy Methyl (meth) acrylamide, N-methoxybutyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N-isobutoxymethyl (meth) acrylamide , N-isobutoxyethyl (meth)acrylamide, N-vinylphthalimide, N-vinylsuccinimide, and the like.
그 중에서도, 모노머b로는, 모노머의 금속에의 배위능의 관점에서 식(2)로 표시되는 모노머가 바람직하고, N-비닐아미드기를 갖는 모노머가 보다 바람직하고, 입수성 등을 고려하면, N-비닐피롤리돈, N-비닐포름아미드, N-비닐아세트아미드가 더욱 바람직하다.Among them, the monomer b is preferably a monomer represented by formula (2) from the viewpoint of the coordination ability of the monomer to the metal, more preferably a monomer having an N-vinylamide group, and considering availability and the like, N- Vinylpyrrolidone, N-vinylformamide and N-vinylacetamide are more preferable.
이들 모노머b는 1종을 단독으로 사용할 수도 있고, 또한 2종 이상을 병용할 수도 있다.These monomers b may be used individually by 1 type, and may use 2 or more types together.
[모노머c][Monomer c]
(A)성분은, 모노머a, 모노머b 이외에, 분자 내에 가교성기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머c에서 유래하는 구성단위를 추가로 포함하는 공중합체이기도 하다.(A) Component is also a copolymer which further contains the structural unit derived from the monomer c which has a crosslinkable group and one radically polymerizable double bond in a molecule|numerator other than the monomer a and the monomer b.
가교성기로는, N-알콕시메틸기, N-하이드록시메틸기, 치환기Q를 가질 수도 있는 에폭시기, 치환기Q를 가질 수도 있는 지환식 에폭시기, 치환기Q를 가질 수도 있는 옥세탄기 등을 들 수 있다. 치환기Q로는 할로겐으로 치환될 수도 있는 탄소원자수 1 내지 4의 알킬기, 페닐기 등을 들 수 있다.Examples of the crosslinkable group include an N-alkoxymethyl group, N-hydroxymethyl group, an epoxy group which may have a substituent Q, an alicyclic epoxy group which may have a substituent Q, and an oxetane group which may have a substituent Q. Examples of the substituent Q include an alkyl group having 1 to 4 carbon atoms which may be substituted with halogen, a phenyl group, and the like.
구체적인 모노머c로는, 예를 들어, 아래 식(4)로 표시되는 화합물을 들 수 있다.Specific examples of the monomer c include compounds represented by the following formula (4).
[화학식 7][Formula 7]
(식(4) 중, X는, 단결합, 카르보닐옥시기, 아미드기 또는 페닐렌기를 나타내고, Y는 탄소원자수 1 내지 6의 알킬렌기, 탄소원자수 1 내지 6의 옥시알킬렌기, 탄소원자수 1 내지 6의 알킬에테르기, 탄소원자수 1 내지 6의 티오알킬렌기 또는 탄소원자수 1 내지 6의 티오알킬에테르기를 나타내고, Z는, 적어도 1개의 트리플루오로메틸기를 갖는 탄소원자수 1 내지는 10의 직쇄 또는 분지구조의 알킬기를 나타내고, R7은 수소원자 또는 탄소원자수 1 내지 4의 알킬기를 나타낸다.)(In formula (4), X represents a single bond, a carbonyloxy group, an amide group or a phenylene group, Y is an alkylene group having 1 to 6 carbon atoms, an oxyalkylene group having 1 to 6 carbon atoms, or 1 carbon atom. represents an alkyl ether group of to 6 carbon atoms, a thioalkylene group having 1 to 6 carbon atoms, or a thioalkyl ether group having 1 to 6 carbon atoms, and Z is a straight chain or branched chain having 1 to 10 carbon atoms having at least one trifluoromethyl group. represents an alkyl group of the structure, and R 7 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.)
Y로 표시되는 탄소원자수 1 내지 6의 알킬렌기는, 직쇄상, 분지상의 어느 것이어도 되고, 그의 구체예로는 한정되는 것은 아닌데, 메틸렌기, 에탄-1,1-디일기, 에탄-1,2-디일기, 프로판-1,2-디일기, 프로판-1,3-디일기, 프로판-2,2-디일기, 부탄-1,4-디일기, 펜탄-1,5-디일기, 헥산-1,6-디일기 등을 들 수 있다.The alkylene group having 1 to 6 carbon atoms represented by Y may be either linear or branched, and is not limited to specific examples thereof, but a methylene group, ethane-1,1-diyl group, ethane-1 ,2-diyl group, propane-1,2-diyl group, propane-1,3-diyl group, propane-2,2-diyl group, butane-1,4-diyl group, pentane-1,5-diyl group , a hexane-1,6-diyl group, and the like.
탄소원자수 1 내지 6의 옥시알킬렌기는, 직쇄상, 분지상의 어느 것이어도 되고, -O-R8-을 만족시키는 기이며 R8의 구체예로는 상기 서술한 1 내지 6의 알킬렌기와 동일하다.The oxyalkylene group having 1 to 6 carbon atoms may be either linear or branched, and is a group satisfying -OR 8 -, and as a specific example of R 8 , it is the same as the above-mentioned 1 to 6 alkylene group. .
탄소원자수 1 내지 6의 알킬에테르기는, 직쇄상, 분지상의 어느 것이어도 되고, -R9-O-R9-를 만족시키는 기이며, R9의 구체예로는 한정되는 것은 아닌데, 각각 독립적으로 메틸렌기, 에탄-1,1-디일기, 에탄-1,2-디일기, 프로판-1,2-디일기, 프로판-1,3-디일기, 프로판-2,2-디일기, 부탄-1,4-디일기, 펜탄-1,5-디일기 등을 들 수 있다. 단 2개의 R9의 탄소원자수의 합계는 6으로 한다.The alkyl ether group having 1 to 6 carbon atoms may be either linear or branched, and is a group that satisfies -R 9 -OR 9 -, and is not limited as a specific example of R 9 , but each independently methylene group, ethane-1,1-diyl group, ethane-1,2-diyl group, propane-1,2-diyl group, propane-1,3-diyl group, propane-2,2-diyl group, butane-1 , 4-diyl group, pentane-1,5-diyl group, etc. are mentioned. However, the total number of carbon atoms of two R 9 is set to 6.
탄소원자수 1 내지 6의 티오알킬렌기는, 직쇄상, 분지상의 어느 것이어도 되고, -S-R8-을 만족시키는 기이며 R8은 상기 서술한 바와 같다.The C1-C6 thioalkylene group may be either linear or branched, it is a group which satisfy|fills -SR< 8 >-, and R< 8 > is as above-mentioned.
탄소원자수 1 내지 6의 티오알킬에테르기는, 직쇄상, 분지상의 어느 것이어도 되고, -R9-S-R9-를 만족시키는 기이며 R9는 상기 서술한 바와 같다.The thioalkyl ether group having 1 to 6 carbon atoms may be either linear or branched, and is a group satisfying -R 9 -SR 9 -, and R 9 is as described above.
이러한 모노머c의 구체예로는 한정되는 것은 아닌데, 이하의 것을 들 수 있다.Although it is not limited as a specific example of such a monomer c, The following are mentioned.
1개의 라디칼 중합성 이중결합을 갖고, 추가로 N-알콕시메틸기를 갖는 모노머로는, N-부톡시메틸아크릴아미드, N-이소부톡시메틸아크릴아미드, N-메톡시메틸아크릴아미드, N-메톡시메틸메타크릴아미드, N-메틸올아크릴아미드 등을 들 수 있다.Examples of the monomer having one radical polymerizable double bond and further having an N-alkoxymethyl group include N-butoxymethylacrylamide, N-isobutoxymethylacrylamide, N-methoxymethylacrylamide, N-methoxy Methyl methacrylamide, N-methylolacrylamide, etc. are mentioned.
1개의 라디칼 중합성 이중결합을 갖고, 추가로 N-하이드록시메틸기를 갖는 모노머로는, 한정되는 것은 아닌데, 예를 들어, N-하이드록시메틸아크릴아미드, N-하이드록시메틸메타크릴아미드 등을 들 수 있다.Although not limited as a monomer which has one radically polymerizable double bond and has an N-hydroxymethyl group further, For example, N-hydroxymethylacrylamide, N-hydroxymethylmethacrylamide, etc. are used. can be heard
1개의 라디칼 중합성 이중결합을 갖고, 추가로 에폭시기를 갖는 모노머로는, 한정되는 것은 아닌데 예를 들어 아크릴산글리시딜, 메타크릴산글리시딜, α-에틸아크릴산글리시딜, α-n-프로필아크릴산글리시딜, α-n-부틸아크릴산글리시딜, 아크릴산-3,4-에폭시부틸, 메타크릴산-3,4-에폭시부틸, 아크릴산-6,7-에폭시헵틸, 메타크릴산-6,7-에폭시헵틸, α-에틸아크릴산-6,7-에폭시헵틸, o-비닐벤질글리시딜에테르, m-비닐벤질글리시딜에테르, p-비닐벤질글리시딜에테르, 3,4-에폭시시클로헥실메타크릴레이트 등을 들 수 있다. 이들 중, 메타크릴산글리시딜, 메타크릴산-6,7-에폭시헵틸, o-비닐벤질글리시딜에테르, m-비닐벤질글리시딜에테르, p-비닐벤질글리시딜에테르, 3,4-에폭시시클로헥실메타크릴레이트 등이 바람직하게 이용된다. 이들은, 단독으로 혹은 조합하여 이용된다.The monomer having one radically polymerizable double bond and further having an epoxy group is, but not limited to, for example, glycidyl acrylate, glycidyl methacrylate, α-ethyl glycidyl acrylate, α-n- Glycidyl propyl acrylate, α-n-butyl glycidyl acrylate, acrylic acid-3,4-epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6 ,7-epoxyheptyl, α-ethyl acrylic acid-6,7-epoxyheptyl, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, 3,4-epoxy Cyclohexyl methacrylate etc. are mentioned. Among these, glycidyl methacrylate, methacrylic acid-6,7-epoxyheptyl, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, 3, 4-epoxycyclohexyl methacrylate etc. are used preferably. These are used individually or in combination.
1개의 라디칼 중합성 이중결합을 갖고, 추가로 옥세탄기를 갖는 모노머로는, 한정되는 것은 아닌데, 예를 들어, 옥세탄기를 갖는 (메트)아크릴산에스테르 등을 들 수 있다. 이러한 모노머 중에서는, 3-(메타크릴로일옥시메틸)옥세탄, 3-(아크릴로일옥시메틸)옥세탄, 3-(메타크릴로일옥시메틸)-3-에틸-옥세탄, 3-(아크릴로일옥시메틸)-3-에틸-옥세탄, 3-(메타크릴로일옥시메틸)-2-트리플루오로메틸옥세탄, 3-(아크릴로일옥시메틸)-2-트리플루오로메틸옥세탄, 3-(메타크릴로일옥시메틸)-2-페닐-옥세탄, 3-(아크릴로일옥시메틸)-2-페닐-옥세탄, 2-(메타크릴로일옥시메틸)옥세탄, 2-(아크릴로일옥시메틸)옥세탄, 2-(메타크릴로일옥시메틸)-4-트리플루오로메틸옥세탄, 2-(아크릴로일옥시메틸)-4-트리플루오로메틸옥세탄이 바람직하고, 3-(메타크릴로일옥시메틸)-3-에틸-옥세탄, 3-(아크릴로일옥시메틸)-3-에틸-옥세탄 등이 바람직하게 이용된다.Although it does not limit as a monomer which has one radically polymerizable double bond and has an oxetane group further, For example, (meth)acrylic acid ester etc. which have an oxetane group are mentioned. Among these monomers, 3-(methacryloyloxymethyl)oxetane, 3-(acryloyloxymethyl)oxetane, 3-(methacryloyloxymethyl)-3-ethyl-oxetane, 3- (Acryloyloxymethyl)-3-ethyl-oxetane, 3-(methacryloyloxymethyl)-2-trifluoromethyloxetane, 3-(acryloyloxymethyl)-2-trifluoro Methyloxetane, 3-(methacryloyloxymethyl)-2-phenyl-oxetane, 3-(acryloyloxymethyl)-2-phenyl-oxetane, 2-(methacryloyloxymethyl)ox Cetane, 2-(acryloyloxymethyl)oxetane, 2-(methacryloyloxymethyl)-4-trifluoromethyloxetane, 2-(acryloyloxymethyl)-4-trifluoromethyl Oxetane is preferable, and 3-(methacryloyloxymethyl)-3-ethyl-oxetane, 3-(acryloyloxymethyl)-3-ethyl-oxetane, etc. are used preferably.
이들 중에서도, 기판과의 밀착성의 관점에서 X는 카르보닐옥시기 또는 메틸렌기인 것이 바람직하고, Z는 에폭시기인 것이 바람직하다.Among these, it is preferable that X is a carbonyloxy group or a methylene group from a viewpoint of adhesiveness with a board|substrate, and it is preferable that Z is an epoxy group.
본 발명에서는, (A)성분의 공중합체를 제조할 때에, 상기 모노머a, 상기 모노머b 및 상기 모노머c와 함께, 기타 모노머를 사용할 수도 있다. 그러한 기타 모노머로는, 메틸메타크릴레이트, 에틸메타크릴레이트, 이소프로필메타크릴레이트, 벤질메타크릴레이트, 나프틸메타크릴레이트, 안트릴메타크릴레이트, 안트릴메틸메타크릴레이트, 페닐메타크릴레이트, 시클로헥실메타크릴레이트, 이소보닐메타크릴레이트, 메톡시트리에틸렌글리콜메타크릴레이트, 2-에톡시에틸메타크릴레이트, 테트라하이드로푸르푸릴메타크릴레이트, 3-메톡시부틸메타크릴레이트, γ-부티로락톤메타크릴레이트, 2-프로필-2-아다만틸메타크릴레이트, 8-메틸-8-트리시클로데실메타크릴레이트, 8-에틸-8-트리시클로데실메타크릴레이트, 메틸아크릴레이트, 에틸아크릴레이트, 이소프로필아크릴레이트, 벤질아크릴레이트, 나프틸아크릴레이트, 안트릴아크릴레이트, 안트릴메틸아크릴레이트, 페닐아크릴레이트, 시클로헥실아크릴레이트, 이소보닐아크릴레이트, 메톡시트리에틸렌글리콜아크릴레이트, 2-에톡시에틸아크릴레이트, 테트라하이드로푸르푸릴아크릴레이트, 3-메톡시부틸아크릴레이트, γ-부티로락톤아크릴레이트, 2-프로필-2-아다만틸아크릴레이트, 8-메틸-8-트리시클로데실아크릴레이트, 8-에틸-8-트리시클로데실아크릴레이트, 스티렌, 비닐나프탈렌, 비닐안트라센, 및 비닐비페닐 등을 들 수 있다.In this invention, when manufacturing the copolymer of (A) component, you can also use another monomer with the said monomer a, the said monomer b, and the said monomer c. Such other monomers include methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, benzyl methacrylate, naphthyl methacrylate, anthryl methacrylate, anthryl methyl methacrylate, phenyl methacrylate , cyclohexyl methacrylate, isobornyl methacrylate, methoxytriethylene glycol methacrylate, 2-ethoxyethyl methacrylate, tetrahydrofurfuryl methacrylate, 3-methoxybutyl methacrylate, γ- Butyrolactone methacrylate, 2-propyl-2-adamantyl methacrylate, 8-methyl-8-tricyclodecyl methacrylate, 8-ethyl-8-tricyclodecyl methacrylate, methyl acrylate, Ethyl acrylate, isopropyl acrylate, benzyl acrylate, naphthyl acrylate, anthryl acrylate, anthryl methyl acrylate, phenyl acrylate, cyclohexyl acrylate, isobornyl acrylate, methoxytriethylene glycol acrylate , 2-ethoxyethyl acrylate, tetrahydrofurfuryl acrylate, 3-methoxybutyl acrylate, γ-butyrolactone acrylate, 2-propyl-2-adamantyl acrylate, 8-methyl-8- and tricyclodecyl acrylate, 8-ethyl-8-tricyclodecyl acrylate, styrene, vinylnaphthalene, vinylanthracene, and vinylbiphenyl.
본 발명에 있어서는, (A)성분의 공중합체를 제조할 때에, 상기 기타 모노머를 이용함으로써, 얻어지는 (A)성분의 공중합체의, 도금액 등에 대한 내성을 부여할 수도 있다.In this invention, when manufacturing the copolymer of (A) component, tolerance with respect to the plating liquid etc. of the copolymer of (A) component obtained by using the said other monomer can also be provided.
본 발명에 이용하는 특정 공중합체를 얻는 방법은 특별히 한정되지 않는데, 예를 들어, 상기 모노머a, 상기 모노머b, 상기 모노머c와 필요에 따라 기타 모노머와 중합개시제 등을 공존시킨 용제 중에 있어서, 50 내지 110℃의 온도하에서 중합반응시킴으로써 얻어진다. 그 때, 이용되는 용제는, 특정 관능기를 갖는 모노머, 필요에 따라 이용되는 특정 관능기를 갖지 않는 모노머 및 중합개시제 등을 용해하는 것이면 특별히 한정되지 않는다. 구체예로는, 후술하는 <(C)용제>에 기재한다.The method for obtaining the specific copolymer used in the present invention is not particularly limited, for example, in a solvent in which the above-mentioned monomer a, the above-mentioned monomer b, and the above-mentioned monomer c and, if necessary, other monomers and a polymerization initiator, etc. are coexisted in a solvent, 50 to It is obtained by polymerization reaction under the temperature of 110 degreeC. In that case, the solvent used will not be specifically limited if it melt|dissolves the monomer which has a specific functional group, the monomer which does not have a specific functional group used as needed, a polymerization initiator, etc. As a specific example, it describes in <(C) solvent> mentioned later.
상기 방법에 의해 얻어지는 특정 공중합체는, 통상, 용제에 용해된 용액의 상태이다.The specific copolymer obtained by the said method is the state of the solution melt|dissolved in the solvent normally.
또한, 상기 방법으로 얻어진 특정 공중합체의 용액을, 교반 중의 디에틸에테르나 물 등에 투입하여 침전시키고, 생성된 침전물을 여과·세정한 후에, 상압 또는 감압하에서, 상온건조 또는 가열건조하고, 특정 공중합체의 분체로 할 수 있다. 상기 조작에 의해, 특정 공중합체와 공존하는 중합개시제 및 미반응의 모노머를 제거할 수 있고, 그 결과, 정제한 특정 공중합체의 분체가 얻어진다. 한번의 조작으로 충분히 정제하지 못하는 경우는, 얻어진 분체를 용제에 재용해시키고, 상기의 조작을 반복하여 행하면 된다.In addition, the solution of the specific copolymer obtained by the above method is poured into diethyl ether or water while stirring to precipitate, and the resulting precipitate is filtered and washed, then dried at room temperature or heat-dried under normal pressure or reduced pressure, and then dried in a specific air It can be made into the powder of a coalescence. By the above operation, the polymerization initiator and unreacted monomer coexisting with the specific copolymer can be removed, and as a result, a refined powder of the specific copolymer is obtained. What is necessary is just to make the obtained powder re-dissolve in a solvent again and just to perform said operation repeatedly, when it cannot fully refine|purify by one operation.
본 발명에 있어서는, 특정 공중합체는 분체형태로, 혹은 정제한 분말을 후술하는 용제에 재용해한 용액형태로 이용해도 된다.In the present invention, the specific copolymer may be used in the form of powder or in the form of a solution obtained by re-dissolving the refined powder in a solvent to be described later.
또한, 본 발명에 있어서는, (A)성분의 특정 공중합체는, 복수종의 특정 공중합체의 혼합물일 수도 있다.In addition, in this invention, the mixture of several types of specific copolymers may be sufficient as the specific copolymer of (A) component.
본 발명에 있어서, 상기 모노머a와 상기 모노머b를 공중합시키는 비율은, 반응성이나, 도금성의 관점에서, 바람직하게는 상기 모노머b 1몰에 대하여 상기 모노머a 0.05몰 내지 5몰, 특히 바람직하게는 0.1몰 내지 3몰이다.In the present invention, the ratio of copolymerizing the monomer a and the monomer b is, from the viewpoint of reactivity and plating property, preferably 0.05 to 5 moles of the monomer a with respect to 1 mole of the monomer b, particularly preferably 0.1 mole to 3 moles.
본 발명에 있어서, 상기 모노머b와 상기 모노머c를 공중합시키는 비율은, 반응성이나, 도금성의 관점에서, 바람직하게는 상기 모노머b 1몰에 대하여 상기 모노머C 0.05몰 내지 3몰, 특히 바람직하게는 0.1몰 내지 1몰이다.In the present invention, the ratio of copolymerizing the monomer b and the monomer c is, from the viewpoint of reactivity and plating property, preferably 0.05 to 3 moles of the monomer C per 1 mole of the monomer b, particularly preferably 0.1 mole to 1 mole.
본 발명에 있어서, (A)성분인 공중합체를 제조할 때에 상기 기타 모노머를 이용하는 경우는, 상기 모노머a와 모노머b의 몰수의 합계에 대하여, 또는 상기 모노머a, 모노머b 및 모노머c의 몰수의 합계에 대하여, 1 내지 200%의 몰수의 양, 보다 바람직하게는 10 내지 100%의 몰수의 양이다.In the present invention, in the case of using the other monomers when producing the copolymer as component (A), the number of moles of the monomer a, the monomer b and the monomer c is based on the total number of moles of the monomer a and the monomer b. With respect to the total, it is an amount of 1 to 200% of the number of moles, more preferably an amount of 10 to 100% of the number of moles.
<(B)금속미립자><(B) fine metal particles>
본 발명의 하지제에 이용되는 (B)금속미립자로는 특별히 한정되지 않고, 금속종으로는 철(Fe), 코발트(Co), 니켈(Ni), 구리(Cu), 팔라듐(Pd), 은(Ag), 주석(Sn), 백금(Pt) 및 금(Au) 그리고 이들의 합금을 들 수 있고, 이들 금속의 1종류여도 되고 2종 이상의 합금이어도 상관없다. 그 중에서도 바람직한 금속미립자로는 팔라듐미립자를 들 수 있다. 한편, 금속미립자로서, 상기 금속의 산화물을 이용해도 된다.The metal fine particles (B) used in the brush agent of the present invention are not particularly limited, and the metal species include iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), palladium (Pd), and silver. (Ag), tin (Sn), platinum (Pt), gold (Au), and alloys thereof are exemplified, and one type of these metals or an alloy of two or more types thereof may be used. Among them, palladium fine particles are preferable as the metal fine particles. On the other hand, as the metal fine particles, an oxide of the above metal may be used.
상기 금속미립자는, 예를 들어 금속염의 용액을 고압수은등에 의해 광조사하는 방법이나, 이 용액에 환원작용을 갖는 화합물(소위 환원제)을 첨가하는 방법 등에 의해, 금속이온을 환원함으로써 얻어진다. 예를 들어, 상기 (A)성분 폴리머를 용해한 용액에 금속염의 용액을 첨가하여 이것에 자외선을 조사하거나, 혹은, 이 용액에 금속염의 용액 및 환원제를 첨가하는 등 하여, 금속이온을 환원함으로써, (A)성분 폴리머와 금속미립자의 복합체를 형성시키면서, (A)성분 폴리머 및 금속미립자를 포함하는 하지제를 조제할 수 있다.The metal fine particles are obtained by reducing metal ions, for example, by irradiating a solution of a metal salt with light with a high-pressure mercury lamp, or by adding a reducing compound (so-called reducing agent) to the solution. For example, by adding a solution of a metal salt to the solution in which the component polymer (A) is dissolved and irradiating it with ultraviolet rays, or adding a solution of a metal salt and a reducing agent to this solution to reduce metal ions, ( A brush agent containing the component polymer and the metal fine particles (A) can be prepared while forming a composite of the component polymer and the metal fine particles.
상기 금속염으로는, 염화금산, 질산은, 황산구리, 질산구리, 아세트산구리, 염화주석, 염화제일백금, 염화백금산, Pt(dba)2[dba=디벤질리덴아세톤], Pt(cod)2[cod=1,5-시클로옥타디엔], Pt(CH3)2(cod), 염화팔라듐, 아세트산팔라듐(Pd(OC(=O)CH3)2), 질산팔라듐, Pd2(dba)3·CHCl3, Pd(dba)2, 염화로듐, 아세트산로듐, 염화루테늄, 아세트산루테늄, Ru(cod)(cot)[cot=시클로옥타트리엔], 염화이리듐, 아세트산이리듐, Ni(cod)2 등을 들 수 있다.Examples of the metal salts include chloroauric acid, silver nitrate, copper sulfate, copper nitrate, copper acetate, tin chloride, platinum chloride, chloroplatinic acid, Pt(dba) 2 [dba = dibenzylideneacetone], Pt(cod) 2 [cod = 1,5-cyclooctadiene], Pt(CH 3 ) 2 (cod), palladium chloride, palladium acetate (Pd(OC(=O)CH 3 ) 2 ), palladium nitrate, Pd 2 (dba) 3 CHCl 3 , Pd(dba) 2 , rhodium chloride, rhodium acetate, ruthenium chloride, ruthenium acetate, Ru(cod)(cot)[cot=cyclooctatriene], iridium chloride, iridium acetate, Ni(cod) 2 , etc. have.
상기 환원제로는, 특별히 한정되는 것은 아니고, 다양한 환원제를 이용할 수 있고, 얻어지는 하지제에 함유시키는 금속종 등에 따라 환원제를 선택하는 것이 바람직하다. 이용할 수 있는 환원제로는, 예를 들어, 수소화붕소나트륨, 수소화붕소칼륨 등의 수소화붕소금속염; 수소화알루미늄리튬, 수소화알루미늄칼륨, 수소화알루미늄세슘, 수소화알루미늄베릴륨, 수소화알루미늄마그네슘, 수소화알루미늄칼슘 등의 수소화알루미늄염; 하이드라진 화합물; 구연산 및 그의 염; 석신산 및 그의 염; 아스코르브산 및 그의 염; 메탄올, 에탄올, 이소프로판올, 폴리올 등의 제1급 또는 제2급 알코올류; 트리메틸아민, 트리에틸아민, 디이소프로필에틸아민, 디에틸메틸아민, 테트라메틸에틸렌디아민[TMEDA], 에틸렌디아민사아세트산[EDTA] 등의 제3급 아민류; 하이드록실아민; 트리-n-프로필포스핀, 트리-n-부틸포스핀, 트리시클로헥실포스핀, 트리벤질포스핀, 트리페닐포스핀, 트리에톡시포스핀, 1,2-비스(디페닐포스피노)에탄[DPPE], 1,3-비스(디페닐포스피노)프로판[DPPP], 1,1’-비스(디페닐포스피노)페로센[DPPF], 2,2’-비스(디페닐포스피노)-1,1’-비나프틸[BINAP] 등의 포스핀류 등을 들 수 있다.It does not specifically limit as said reducing agent, Various reducing agents can be used, It is preferable to select a reducing agent according to the metal species etc. contained in the brush agent obtained. As a reducing agent which can be used, For example, borohydride metal salts, such as sodium borohydride and potassium borohydride; aluminum hydride salts such as lithium aluminum hydride, potassium aluminum hydride, cesium aluminum hydride, beryllium aluminum hydride, magnesium aluminum hydride, and calcium aluminum hydride; hydrazine compounds; citric acid and its salts; succinic acid and its salts; ascorbic acid and its salts; primary or secondary alcohols such as methanol, ethanol, isopropanol, and polyol; tertiary amines such as trimethylamine, triethylamine, diisopropylethylamine, diethylmethylamine, tetramethylethylenediamine [TMEDA] and ethylenediaminetetraacetic acid [EDTA]; hydroxylamine; Tri-n-propylphosphine, tri-n-butylphosphine, tricyclohexylphosphine, tribenzylphosphine, triphenylphosphine, triethoxyphosphine, 1,2-bis(diphenylphosphino)ethane [DPPE], 1,3-bis(diphenylphosphino)propane [DPPP], 1,1'-bis(diphenylphosphino)ferrocene [DPPF], 2,2'-bis(diphenylphosphino)- Phosphines, such as 1,1'-binaphthyl [BINAP], etc. are mentioned.
상기 금속미립자의 1차입자 평균입경은 1~100nm가 바람직하다. 이 금속미립자의 1차입자 평균입경을 100nm 이하로 함으로써, 표면적의 감소가 적고 충분한 촉매활성이 얻어진다. 1차입자 평균입경으로는, 75nm 이하가 더욱 바람직하고, 1~30nm가 특히 바람직하다.The average primary particle diameter of the metal fine particles is preferably 1 to 100 nm. By setting the average primary particle diameter of the metal fine particles to 100 nm or less, a decrease in surface area is small and sufficient catalytic activity is obtained. As a primary particle average particle diameter, 75 nm or less is more preferable, and 1-30 nm is especially preferable.
1차입자 평균입경은 다음의 방법에 의해 측정할 수 있다.The primary particle average particle diameter can be measured by the following method.
[1차입자 평균입경의 측정][Measurement of average particle diameter of primary particles]
금속미립자를 에탄올에 분산 후, 카본지지막 상에 적하하고, 건조시켜 샘플을 제작 후, 얻어진 샘플을 TEM장치(히다찌제작소제: H-8000 가속전압 200kV)에서 현미경법으로 1차입자 평균입경을 구할 수 있다.After dispersing metal fine particles in ethanol, dropping them on a carbon support film, drying them to prepare a sample, the obtained sample is subjected to microscopy in a TEM apparatus (Hidachi Corporation: H-8000 acceleration voltage 200 kV) to obtain the average particle diameter of the primary particles. have.
본 발명의 하지제에 있어서의 상기 (A)성분인 공중합체의 첨가량은, 상기 (B)금속미립자 100질량부에 대하여 20질량부 이상 10,000질량부 이하로 하는 것이 바람직하다. (B)금속미립자 100질량부에 대한 (A)공중합체의 첨가량을 20질량부 이상으로 함으로써, 상기 금속미립자를 충분히 분산시킬 수 있고, 또한, 20질량부 이하이면, 상기 금속미립자의 분산성이 불충분하여, 침전물이나 응집물을 발생시키기 쉬워진다. 보다 바람직하게는, 30질량부 이상이다. 또한, (B)금속미립자 100질량부에 대하여 (A)공중합체를 10,000질량부 이상 첨가하면, 도포 후의 단위면적당 Pd량이 불충분해지므로, 도금의 석출성이 저하될 우려가 있다.It is preferable that the addition amount of the copolymer which is said (A) component in the brush agent of this invention sets it as 20 mass parts or more and 10,000 mass parts or less with respect to 100 mass parts of said (B) metal fine particles. (B) When the amount of (A) copolymer added to 100 parts by mass of the fine metal particles is 20 parts by mass or more, the fine metal particles can be sufficiently dispersed, and when it is 20 parts by mass or less, the dispersibility of the metal fine particles is It is insufficient, and it becomes easy to generate|occur|produce a deposit and an aggregate. More preferably, it is 30 mass parts or more. In addition, when 10,000 parts by mass or more of the copolymer (A) is added with respect to 100 parts by mass of the fine metal particles (B), the amount of Pd per unit area after application becomes insufficient, so that the precipitation of the plating may decrease.
<하지제><Haji Festival>
본 발명의 무전해 도금 하지제는, 상기 (A)공중합체, (B)금속미립자, 및 (C)용제를 포함하는 것이며, 추가로, 필요에 따라 기타 성분을 포함하는 것이다. 본 발명의 무전해 도금 하지제에 있어서, 상기 (A)성분인 공중합체와 상기 (B)금속미립자가 복합체를 형성하고 있는 것이 바람직하고, 즉 상기 하지제가 상기 (A)성분인 공중합체와 상기 (B)금속미립자에 의해 형성된 복합체를 포함하는 것이 바람직하다.The electroless plating brushing agent of the present invention contains (A) the copolymer, (B) metal fine particles, and (C) a solvent, and further contains other components as necessary. In the electroless plating brushing agent of the present invention, it is preferable that the copolymer as component (A) and the metal fine particles (B) form a complex, that is, the copolymer as the component (A) and the above described brush agent. (B) It is preferable to include a composite formed by fine metal particles.
여기서 복합체란, 상기 (A)성분인 공중합체의 측쇄의 금속분산성기의 작용에 의해, 금속미립자에 접촉 또는 근접한 상태로 양자가 공존하고, 입자상의 형태를 이루는 것이며, 환언하면, 상기 (A)성분인 공중합체의 금속분산성기에 금속미립자가 부착 또는 배위한 구조를 갖는 복합체라고 표현된다.Here, the composite refers to a combination of both coexisting in contact with or close to metal particles by the action of a metal dispersible group in the side chain of the copolymer, which is the component (A), and forms a particulate form, in other words, (A) It is expressed as a composite having a structure in which fine metal particles are attached or coordinated to a metal dispersible group of a copolymer, which is a component.
여기서 “부착 또는 배위한 구조”란, (A)성분인 공중합체의 금속분산성기의 일부 또는 전부가 금속미립자와 상호작용한 상태를 말하고, 이로 인해 착체와 같은 구조를 형성하고 있다고 생각된다. 그 때문에, 금속미립자로서 팔라듐미립자를 채용한 경우, 표층의 Pd원자가 금속분산성기와 상호작용함으로써, (A)성분 폴리머가 금속미립자를 둘러싸는 구조를 형성하고 있다고 생각된다.Here, the term "attached or coordinated structure" refers to a state in which some or all of the metal dispersible groups of the copolymer as component (A) interact with the metal fine particles, which is thought to form a complex-like structure. Therefore, when palladium fine particles are employed as the metal fine particles, it is considered that the Pd atom in the surface layer interacts with the metal dispersing group to form a structure in which the (A) component polymer surrounds the metal fine particles.
따라서, 본 발명에 있어서의 「복합체」에는, 상기 서술한 바와 같이 금속미립자와 (A)성분인 공중합체가 결합하여 하나의 복합체를 형성하고 있는 것뿐만 아니라, 금속미립자와 (A)성분인 공중합체가 결합부분을 형성하는 일 없이, 각각 독립적으로 존재하고 있는 것(외관상, 1개의 입자를 형성하고 있는 것처럼 보이는 것)도 포함되어 있을 수도 있다.Therefore, in the "composite" in the present invention, as described above, the metal fine particles and the copolymer as component (A) are combined to form a single complex, as well as the fine metal particles and the air as component (A). Those that exist independently of each other without the coalescence forming a bonding portion (appearing to form a single particle in appearance) may also be included.
상기 (A)성분인 공중합체와 (B)금속미립자의 복합체의 형성은, (A)성분인 공중합체와 금속미립자를 포함하는 하지제의 조제시에 동시에 실시되고, 그 방법으로는, 금속분산성기에 의해 어느 정도 안정화된 금속미립자를 합성한 후에 (A)성분인 중합체에 의해 배위자를 교환하는 방법이나, (A)성분인 공중합체의 용액 중에서, 금속이온을 직접환원함으로써 복합체를 형성하는 방법이 있다. 또한, 상기 서술한 바와 같이, 상기 (A)성분인 공중합체를 용해한 용액에 금속염의 용액을 첨가하여 이것에 자외선을 조사하거나, 혹은, 이 용액에 금속염의 용액 및 환원제를 첨가하는 등 하여, 금속이온을 환원함으로써도 복합체를 형성할 수 있다.The formation of the composite of the copolymer as component (A) and the fine metal particles (B) is carried out simultaneously when preparing the brush agent containing the copolymer as component (A) and fine metal particles. After synthesizing fine metal particles stabilized to some extent by the sexual organ, a method of exchanging a ligand with a polymer as component (A), or a method of forming a complex by directly reducing metal ions in a solution of a copolymer as component (A) There is this. In addition, as described above, by adding a solution of a metal salt to a solution in which the copolymer as component (A) is dissolved and irradiating it with ultraviolet rays, or by adding a solution of a metal salt and a reducing agent to this solution, metal A complex can also be formed by reducing the ion.
직접환원방법으로는, 금속이온과 (A)성분인 공중합체를 용매에 용해하고, 메탄올, 에탄올, 2-프로판올, 폴리올 등의 제1급 또는 제2급 알코올류로 환원시킴으로써, 목적으로 하는 금속미립자 복합체를 얻을 수 있다.In the direct reduction method, a metal ion and a copolymer as component (A) are dissolved in a solvent and reduced with primary or secondary alcohols such as methanol, ethanol, 2-propanol, and polyol to obtain the target metal A particulate composite can be obtained.
여기서 이용되는 금속이온원으로는, 상기 서술한 금속염을 사용할 수 있다.As a metal ion source used here, the above-mentioned metal salt can be used.
사용하는 용매로는, 금속이온과 금속분산성기를 갖는 폴리머를 필요농도 이상으로 용해할 수 있는 용매이면 특별히 한정되지는 않으나, 구체적으로는, 메탄올, 에탄올, n-프로판올, 2-프로판올 등의 알코올류; 염화메틸렌, 클로로포름 등의 할로겐화탄화수소류; 테트라하이드로푸란(THF), 2-메틸테트라하이드로푸란, 테트라하이드로피란 등의 환상 에테르류; 아세토니트릴, 부티로니트릴 등의 니트릴류; N,N-디메틸포름아미드(DMF), N-메틸-2-피롤리돈(NMP) 등의 아미드류; 디메틸설폭사이드 등의 설폭사이드류 등 및 이들 용매의 혼합액을 들 수 있고, 바람직하게는, 알코올류, 할로겐화탄화수소류, 환상 에테르류를 들 수 있고, 보다 바람직하게는, 에탄올, 2-프로판올, 클로로포름, 테트라하이드로푸란 등을 들 수 있다.The solvent to be used is not particularly limited as long as it is a solvent capable of dissolving a polymer having a metal ion and a metal dispersing group in a concentration higher than necessary. Specifically, alcohol such as methanol, ethanol, n-propanol, and 2-propanol Ryu; halogenated hydrocarbons such as methylene chloride and chloroform; Cyclic ethers, such as tetrahydrofuran (THF), 2-methyltetrahydrofuran, and tetrahydropyran; nitriles such as acetonitrile and butyronitrile; amides such as N,N-dimethylformamide (DMF) and N-methyl-2-pyrrolidone (NMP); Sulfoxides, such as dimethyl sulfoxide, etc., and mixtures of these solvents are mentioned, Preferably, alcohols, halogenated hydrocarbons, and cyclic ethers are mentioned, More preferably, ethanol, 2-propanol, chloroform are mentioned. , tetrahydrofuran, and the like.
환원반응(금속이온과 (A)성분인 공중합체를 혼합한다)의 온도는, 통상 0℃ 내지 용매의 비점의 범위를 사용할 수 있고, 바람직하게는 실온(약 25℃) 내지 100℃의 범위이다.The temperature of the reduction reaction (the metal ions and the copolymer as component (A) are mixed) can usually be in the range of 0°C to the boiling point of the solvent, and preferably is in the range of room temperature (about 25°C) to 100°C. .
다른 직접환원방법으로는, 금속이온과 (A)성분인 공중합체를 용매에 용해하고, 수소가스분위기하에서 반응시킴으로써, 목적으로 하는 금속미립자 복합체를 얻을 수 있다.As another direct reduction method, the target metal fine particle composite can be obtained by dissolving a metal ion and the copolymer as component (A) in a solvent and reacting it in a hydrogen gas atmosphere.
여기서 이용되는 금속이온원으로는, 상기 서술한 금속염이나, 헥사카르보닐크롬[Cr(CO)6], 펜타카르보닐철[Fe(Co)5], 옥타카르보닐디코발트[Co2(CO)8], 테트라카르보닐니켈[Ni(CO)4] 등의 금속카르보닐착체를 사용할 수 있다. 또한 금속올레핀착체나 금속포스핀착체, 금속질소착체 등의 0가의 금속착체도 사용할 수 있다.Examples of the metal ion source used herein include the above-mentioned metal salts, hexacarbonylchrome [Cr(CO) 6 ], pentacarbonyl iron [Fe(Co) 5 ], and octacarbonyl dicobalt [Co 2 (CO)) 8 ] and metal carbonyl complexes such as tetracarbonyl nickel [Ni(CO) 4 ]. In addition, zero-valent metal complexes such as metal olefin complexes, metal phosphine complexes, and metal nitrogen complexes can also be used.
사용하는 용매로는, 금속이온과 (A)성분인 공중합체를 필요농도 이상으로 용해할 수 있는 용매이면 특별히 한정은 되지 않으나, 구체적으로는, 에탄올, 프로판올 등의 알코올류; 염화메틸렌, 클로로포름 등의 할로겐화탄화수소류; 테트라하이드로푸란, 2-메틸테트라하이드로푸란, 테트라하이드로피란 등의 환상 에테르류; 아세토니트릴, 부티로니트릴 등의 니트릴류 등 및 이들 용매의 혼합액을 들 수 있고, 바람직하게는 테트라하이드로푸란을 들 수 있다.The solvent to be used is not particularly limited as long as it is a solvent capable of dissolving the metal ion and the copolymer as component (A) at a required concentration or more, but specifically, alcohols such as ethanol and propanol; halogenated hydrocarbons such as methylene chloride and chloroform; Cyclic ethers, such as tetrahydrofuran, 2-methyltetrahydrofuran, and tetrahydropyran; nitriles, such as acetonitrile and butyronitrile, and the liquid mixture of these solvents are mentioned, Preferably tetrahydrofuran is mentioned.
금속이온과 (A)성분인 공중합체를 혼합하는 온도는, 통상 0℃ 내지 용매의 비점의 범위를 사용할 수 있다.The temperature at which the metal ion and the copolymer which is the component (A) are mixed may be usually in the range of 0°C to the boiling point of the solvent.
또한, 직접환원방법으로서, 금속이온과 (A)성분인 공중합체를 용매에 용해하고, 열분해반응시킴으로써, 목적으로 하는 금속미립자 복합체를 얻을 수 있다.In addition, as a direct reduction method, a target metal particle composite can be obtained by dissolving a metal ion and a copolymer as component (A) in a solvent and performing a thermal decomposition reaction.
여기서 이용되는 금속이온원으로는, 상기 서술한 금속염이나 금속카르보닐착체나 기타 0가의 금속착체, 산화은 등의 금속산화물을 사용할 수 있다.As a metal ion source used here, the above-mentioned metal salt, metal carbonyl complex, other zero-valent metal complex, metal oxides, such as silver oxide, can be used.
사용하는 용매로는, 금속이온과 (A)성분인 공중합체를 필요농도 이상으로 용해할 수 있는 용매이면 특별히 한정되지는 않으나, 구체적으로는, 메탄올, 에탄올, n-프로판올, 이소프로판올, 에틸렌글리콜 등의 알코올류; 염화메틸렌, 클로로포름 등의 할로겐화탄화수소류; 테트라하이드로푸란(THF), 2-메틸테트라하이드로푸란, 테트라하이드로피란 등의 환상 에테르류; 아세토니트릴, 부티로니트릴 등의 니트릴류; 벤젠, 톨루엔 등의 방향족 탄화수소류 등 및 이들 용매의 혼합액을 들 수 있고, 바람직하게는 톨루엔을 들 수 있다.The solvent to be used is not particularly limited as long as it is a solvent capable of dissolving the metal ion and the copolymer as component (A) in a concentration higher than necessary, but specifically, methanol, ethanol, n-propanol, isopropanol, ethylene glycol, etc. of alcohols; halogenated hydrocarbons such as methylene chloride and chloroform; Cyclic ethers, such as tetrahydrofuran (THF), 2-methyltetrahydrofuran, and tetrahydropyran; nitriles such as acetonitrile and butyronitrile; Aromatic hydrocarbons, such as benzene and toluene, and the liquid mixture of these solvents are mentioned, Preferably toluene is mentioned.
금속이온과 금속분산성기를 갖는 (A)성분인 공중합체를 혼합하는 온도는, 통상 0℃ 내지 용매의 비점의 범위를 사용할 수 있고, 바람직하게는 용매의 비점 근방, 예를 들어 톨루엔의 경우는 110℃(가열환류)이다.The temperature for mixing the copolymer as component (A) having a metal ion and a metal dispersible group can usually be in the range of 0° C. to the boiling point of the solvent, preferably near the boiling point of the solvent, for example, in the case of toluene 110°C (heating to reflux).
이리 하여 얻어지는 (A)성분인 공중합체와 금속미립자의 복합체는, 재침전 등의 정제처리를 거쳐, 분말 등의 고형물의 형태로 할 수 있다.The composite of the copolymer as component (A) and the fine metal particles thus obtained can be subjected to refining treatment such as reprecipitation to form a solid such as powder.
본 발명의 하지제는, 상기 (A)성분인 공중합체, (B)금속미립자(바람직하게는 이들로 이루어지는 복합체), 및 (C)용제를 포함하는 것이며, 추가로, 필요에 따라 기타 성분을 포함하는 것으로서, 이 하지제는, 후술하는 [무전해 금속도금의 하지층]의 형성시에 이용하는 바니시의 형태일 수도 있다.The brush agent of the present invention contains the above-mentioned (A) component copolymer, (B) metal fine particles (preferably a composite comprising these), and (C) a solvent. As included, the brush agent may be in the form of a varnish used for forming the [base layer for electroless metal plating] described later.
본 발명의 무전해 도금 하지제는, 필요에 따라, (D)성분인 베이스 수지를 함유시킬 수 있다. (D)성분으로는, (A)성분 중의 가교성기와 열에 의해 가교반응하는 기인, 비라디칼 중합성의 가교성기를 갖는 것이 바람직하고, 예를 들어, WO2014/171376에 (B)성분으로서 기재되어 있는 것이 바람직하다. 이러한 (D)성분을 첨가함으로써, 얻어지는 하지층의 다른 기능(예를 들어 밀착성, 내열성, 감광성, 유전성 등)을 보다 향상시킬 수 있는 경우가 있다.The electroless plating brush agent of this invention can contain the base resin which is (D)component as needed. As (D)component, it is preferable to have a non-radically polymerizable crosslinkable group which is a group which crosslinks with the crosslinkable group in (A) component by heat, for example, described as (B) component in WO2014/171376 it is preferable By adding such (D)component, other functions (for example, adhesiveness, heat resistance, photosensitivity, dielectric property, etc.) of the base layer obtained may be improved more.
본 발명의 도금 하지제에 (D)성분을 함유시키는 경우의 함유량은, (A)성분의 공중합체와, (B)성분의 금속미립자의 합계 100질량부에 기초하여, 0질량부 내지 200질량부인 것이 바람직하고, 보다 바람직하게는 0질량부 내지 150질량부이다. (D)성분의 함유량이 과대인 경우에는 도금석출성이 저하되는 경우가 있다.Content in the case of making the plating brush agent of this invention contain (D)component is 0 mass part - 200 mass based on a total of 100 mass parts of the copolymer of (A) component, and the metal fine particle of (B) component It is preferable that it is negative, More preferably, they are 0 mass parts - 150 mass parts. (D) When content of component is excessive, plating precipitation may fall.
본 발명의 무전해 도금 하지제는, 필요에 따라, (E)성분인 가교제를 함유시킬 수 있다.The electroless plating brush agent of this invention can contain the crosslinking agent which is (E) component as needed.
(E)성분인 가교제로는, 에폭시 화합물, 메틸올 화합물, 블록이소시아네이트 화합물, 페노플라스트 화합물, 트리알콕시실릴기를 2개 이상 갖는 화합물, 아미노기를 갖는 알콕시실란 화합물 등의 화합물, 알콕시기 및/또는 킬레이트 배위자를 갖는 유기금속 화합물, N-알콕시메틸아크릴아미드의 중합체, 에폭시기를 갖는 화합물의 중합체, 알콕시실릴기를 갖는 화합물의 중합체, 이소시아네이트기를 갖는 화합물의 중합체, 및 멜라민포름알데히드 수지 등의 중합체를 들 수 있다.(E) As a crosslinking agent which is a component, Compounds, such as an epoxy compound, a methylol compound, a block isocyanate compound, a phenoplast compound, the compound which has two or more trialkoxysilyl groups, the alkoxysilane compound which has an amino group, an alkoxy group and/or Organometallic compounds having a chelate ligand, polymers of N-alkoxymethylacrylamide, polymers of compounds having epoxy groups, polymers of compounds having alkoxysilyl groups, polymers of compounds having isocyanate groups, and polymers such as melamine formaldehyde resins are mentioned. have.
상기 서술한 에폭시 화합물의 구체예로는, 에틸렌글리콜디글리시딜에테르, 폴리에틸렌글리콜디글리시딜에테르, 프로필렌글리콜디글리시딜에테르, 트리프로필렌글리콜디글리시딜에테르, 폴리프로필렌글리콜디글리시딜에테르, 네오펜틸글리콜디글리시딜에테르, 1,6-헥산디올디글리시딜에테르, 글리세린디글리시딜에테르, 2,2-디브로모네오펜틸글리콜디글리시딜에테르, 1,3,5,6-테트라글리시딜-2,4-헥산디올, N,N,N’,N’-테트라글리시딜-m-자일렌디아민, 1,3-비스(N,N-디글리시딜아미노메틸)시클로헥산, 및 N,N,N’,N’-테트라글리시딜-4, 4’-디아미노디페닐메탄 등을 들 수 있다.As a specific example of the above-mentioned epoxy compound, ethylene glycol diglycidyl ether, polyethyleneglycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl Dil ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin diglycidyl ether, 2,2-dibromoneopentyl glycol diglycidyl ether, 1,3 ,5,6-tetraglycidyl-2,4-hexanediol, N,N,N',N'-tetraglycidyl-m-xylenediamine, 1,3-bis(N,N-diglyc cydylaminomethyl)cyclohexane, and N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane.
상기 서술한 메틸올 화합물의 구체예로는, 알콕시메틸화 글리콜우릴, 알콕시메틸화 벤조구아나민, 및 알콕시메틸화 멜라민 등의 화합물을 들 수 있다.As a specific example of the above-mentioned methylol compound, compounds, such as alkoxy methylation glycoluril, alkoxy methylation benzoguanamine, and alkoxy methylation melamine, are mentioned.
알콕시메틸화 글리콜우릴의 구체예로는, 예를 들어, 1,3,4,6-테트라키스(메톡시메틸)글리콜우릴, 1,3,4,6-테트라키스(부톡시메틸)글리콜우릴, 1,3,4,6-테트라키스(하이드록시메틸)글리콜우릴, 1,3-비스(하이드록시메틸)요소, 1,1,3,3-테트라키스(부톡시메틸)요소, 1,1,3,3-테트라키스(메톡시메틸)요소, 1,3-비스(하이드록시메틸)-4,5-디하이드록시-2-이미다졸리논, 및 1,3-비스(메톡시메틸)-4,5-디메톡시-2-이미다졸리논 등을 들 수 있다. 시판품으로서, 미쯔이사이텍(주)제 글리콜우릴 화합물(상품명: 사이멜(등록상표) 1170, 파우더링크(등록상표) 1174) 등의 화합물, 메틸화 요소 수지(상품명: UFR(등록상표) 65), 부틸화 요소 수지(상품명: UFR(등록상표) 300, U-VAN10S60, U-VAN10R, U-VAN11HV), DIC(주)제 요소/포름알데히드계 수지(고축합형, 상품명: 베카민(등록상표) J-300S, 동 P-955, 동 N) 등을 들 수 있다.Specific examples of the alkoxymethylated glycoluril include 1,3,4,6-tetrakis (methoxymethyl) glycoluril, 1,3,4,6-tetrakis (butoxymethyl) glycoluril, 1,3,4,6-tetrakis (hydroxymethyl) glycoluril, 1,3-bis (hydroxymethyl) urea, 1,1,3,3-tetrakis (butoxymethyl) urea, 1,1 ,3,3-tetrakis(methoxymethyl)urea, 1,3-bis(hydroxymethyl)-4,5-dihydroxy-2-imidazolinone, and 1,3-bis(methoxymethyl) ) -4,5-dimethoxy-2-imidazolinone etc. are mentioned. As a commercially available product, compounds such as glycoluril compound (trade name: Cymel (registered trademark) 1170, Powderlink (registered trademark) 1174) manufactured by Mitsui Cytec Co., Ltd.), methylated urea resin (trade name: UFR (registered trademark) 65), butyl Urea resin (brand name: UFR (registered trademark) 300, U-VAN10S60, U-VAN10R, U-VAN11HV), DIC Corporation urea/formaldehyde-based resin (high condensation type, brand name: Becamine (registered trademark)) J-300S, copper P-955, copper N), etc. are mentioned.
알콕시메틸화 벤조구아나민의 구체예로는, 예를 들어, 테트라메톡시메틸벤조구아나민 등을 들 수 있다. 시판품으로서, 미쯔이사이텍(주)제(상품명: 사이멜(등록상표) 1123), (주)산와케미칼제(상품명: 니카락(등록상표) BX-4000, 동 BX-37, 동 BL-60, 동 BX-55H) 등을 들 수 있다.As a specific example of alkoxymethylation benzoguanamine, tetramethoxymethylbenzoguanamine etc. are mentioned, for example. As a commercial product, Mitsui Cytech Co., Ltd. (trade name: Cymel (registered trademark) 1123), Sanwa Chemical Co., Ltd. (trade name: Nikalac (registered trademark) BX-4000, copper BX-37, copper BL-60, Copper BX-55H) etc. are mentioned.
알콕시메틸화 멜라민의 구체예로는, 예를 들어, 헥사메톡시메틸멜라민 등을 들 수 있다. 시판품으로서, 미쯔이사이텍(주)제 메톡시메틸타입 멜라민 화합물(상품명: 사이멜(등록상표) 300, 동 301, 동 303, 동 350), 부톡시메틸타입 멜라민 화합물(상품명: 마이코트(등록상표) 506, 동 508), 산와케미칼제 메톡시메틸타입 멜라민 화합물(상품명: 니카락(등록상표) MW-30, 동 MW-22, 동 MW-11, 동 MS-001, 동 MX-002, 동 MX-730, 동 MX-750, 동 MX-035), 부톡시메틸타입 멜라민 화합물(상품명: 니카락(등록상표) MX-45, 동 MX-410, 동 MX-302) 등을 들 수 있다.As a specific example of alkoxymethylation melamine, hexamethoxymethylmelamine etc. are mentioned, for example. As a commercial item, Mitsui Cytec Co., Ltd. methoxymethyl type melamine compound (trade name: Cymel (registered trademark) 300, copper 301, copper 303, copper 350), butoxymethyl type melamine compound (trade name: Mycoat (registered trademark) ) 506, Copper 508), Sanwa Chemical Methoxymethyl-type melamine compound (trade name: Nickarak (registered trademark) MW-30, Copper MW-22, Copper MW-11, Copper MS-001, Copper MX-002, Copper MX-730, copper MX-750, copper MX-035), a butoxymethyl type melamine compound (trade name: Nickarak (trademark) MX-45, copper MX-410, copper MX-302), etc. are mentioned.
또한, 이러한 아미노기의 수소원자가 메틸올기 또는 알콕시메틸기로 치환된 멜라민 화합물, 요소 화합물, 글리콜우릴 화합물 및 벤조구아나민 화합물을 축합시켜 얻어지는 화합물일 수도 있다. 예를 들어, 미국특허 제6323310호에 기재되어 있는 멜라민 화합물 및 벤조구아나민 화합물로부터 제조되는 고분자량의 화합물을 들 수 있다. 상기 멜라민 화합물의 시판품으로는, 상품명: 사이멜(등록상표) 303(미쯔이사이텍(주)제) 등을 들 수 있고, 상기 벤조구아나민 화합물의 시판품으로는, 상품명: 사이멜(등록상표) 1123(미쯔이사이텍(주)제) 등을 들 수 있다.In addition, it may be a compound obtained by condensing a melamine compound, a urea compound, a glycoluril compound, and a benzoguanamine compound in which the hydrogen atom of the amino group is substituted with a methylol group or an alkoxymethyl group. For example, a high molecular weight compound prepared from a melamine compound and a benzoguanamine compound described in US Patent No. 6323310 can be mentioned. As a commercial item of the said melamine compound, a brand name: Cymel (trademark) 303 (made by Mitsui Cytec Co., Ltd.) etc. are mentioned, As a commercial item of the said benzoguanamine compound, a brand name: Cymel (trademark) 1123 (Mitsui Cytec Co., Ltd. product) etc. are mentioned.
상기 서술한 블록이소시아네이트 화합물이란, 이소시아네이트기가 적당한 보호기에 의해 블록된 이소시아네이트기를 1분자 중 2개 이상 갖고, 열경화시의 고온에 노출되면, 보호기(블록부분)가 열해리하여 분리되고, 발생한 이소시아네이트기가 수지와의 사이에서 가교반응을 일으키는 것이다.With the above-mentioned block isocyanate compound, the isocyanate group has two or more isocyanate groups in one molecule blocked by an appropriate protecting group, and when exposed to high temperature during thermosetting, the protecting group (block portion) is thermally dissociated and separated, and the generated isocyanate group is a resin It causes a crosslinking reaction between
이러한 다관능 블록이소시아네이트 화합물은, 예를 들어, 1분자 중 2개 이상의 이소시아네이트기를 갖는 다관능 이소시아네이트 화합물에 대하여 적당한 블록제를 반응시켜 얻을 수 있다.Such a polyfunctional block isocyanate compound can be obtained by making a suitable blocking agent react with respect to the polyfunctional isocyanate compound which has two or more isocyanate groups in 1 molecule, for example.
상기 다관능 이소시아네이트 화합물로는, 예를 들어, 1,4-테트라메틸렌디이소시아네이트, 1,5-펜타메틸렌디이소시아네이트, 1,6-헥사메틸렌디이소시아네이트, 2,2,4-트리메틸-1,6-헥사메틸렌디이소시아네이트, 1,3,6-헥사메틸렌트리이소시아네이트, 라이신디이소시아네이트, 이소포론디이소시아네이트, 4,4’-디시클로헥실메탄디이소시아네이트, 1,3-비스(이소시아네이트메틸)시클로헥산, 1,4-시클로헥실디이소시아네이트, 2,6-비스(이소시아네이트메틸)테트라하이드로디시클로펜타디엔, 비스(이소시아네이트메틸)디시클로펜타디엔, 비스(이소시아네이트메틸)아다만탄, 2,5-디이소시아네이트메틸노보넨, 노보난디이소시아네이트, 디시클로헵탄트리이소시아네이트, 4,4’-디페닐메탄디이소시아네이트, 2,4-톨릴렌디이소시아네이트, 2,6-톨릴렌디이소시아네이트, 자일릴렌디이소시아네이트, 테트라메틸자일릴렌디이소시아네이트, 1,5-나프탈렌디이소시아네이트, p-페닐렌디이소시아네이트, 1,3-비스(이소시아네이트메틸)벤젠, 디아니시딘디이소시아네이트, 3,3’-디메틸디페닐-4,4’-디이소시아네이트, 디페닐에테르디이소시아네이트, 2,6-비스(이소시아네이트메틸)데카하이드로나프탈렌, 비스(디이소시아네이트톨릴)페닐메탄, 1,1’-메틸렌비스(3-메틸-4-이소시아네이트벤젠), 1,3-비스(1-이소시아네이트-1-메틸에틸)벤젠, 1,4-비스(1-이소시아네이트-1-메틸에틸)벤젠, 4,4’-비페닐렌디이소시아네이트, 3,3’-디메틸-4,4’-비페닐렌디이소시아네이트, 3,3’-디메톡시-4,4’-비페닐렌디이소시아네이트, 비스(이소시아네이트메틸)티오펜, 비스(이소시아네이트메틸)테트라하이드로티오펜, 및 이들의 변성 화합물(예를 들어, 이소시아누레이트체, 뷰렛체, 에틸렌글리콜어댁트체, 프로필렌글리콜어댁트체, 트리메틸올프로판어댁트체, 에탄올아민어댁트체, 폴리에스테르폴리올어댁트체, 폴리에테르폴리올어댁트체, 폴리아미드어댁트체, 폴리아민어댁트체)을 들 수 있다.Examples of the polyfunctional isocyanate compound include 1,4-tetramethylene diisocyanate, 1,5-pentamethylene diisocyanate, 1,6-hexamethylene diisocyanate, 2,2,4-trimethyl-1,6 -hexamethylene diisocyanate, 1,3,6-hexamethylene triisocyanate, lysine diisocyanate, isophorone diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, 1,3-bis (isocyanate methyl) cyclohexane, 1,4-cyclohexyldiisocyanate, 2,6-bis(isocyanatemethyl)tetrahydrodicyclopentadiene, bis(isocyanatemethyl)dicyclopentadiene, bis(isocyanatemethyl)adamantane, 2,5-diisocyanate Methyl norbornene, norbornane diisocyanate, dicycloheptane triisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, xylylene diisocyanate, tetramethylxylyl Rendiisocyanate, 1,5-naphthalenediisocyanate, p-phenylenediisocyanate, 1,3-bis(isocyanatemethyl)benzene, dianisidine diisocyanate, 3,3'-dimethyldiphenyl-4,4'-diisocyanate, Diphenyl ether diisocyanate, 2,6-bis (isocyanate methyl) decahydronaphthalene, bis (diisocyanate tolyl) phenylmethane, 1,1'-methylene bis (3-methyl-4-isocyanate benzene), 1,3- Bis(1-isocyanate-1-methylethyl)benzene, 1,4-bis(1-isocyanate-1-methylethyl)benzene, 4,4'-biphenylenediisocyanate, 3,3'-dimethyl-4,4 '-biphenylene diisocyanate, 3,3'-dimethoxy-4,4'-biphenylene diisocyanate, bis (isocyanate methyl) thiophene, bis (isocyanate methyl) tetrahydrothiophene, and modified compounds thereof (eg For example, an isocyanurate body, a biuret body, an ethylene glycol adduct body, a propylene glycol adact body, a trimethylolpropane adact body, an ethanolamine adduct body, a polyester polyol adduct body, a polyether polyol adduct body, a polyamide adduct body , polyamine adduct).
상기 블록제로는, 예를 들어, 메탄올, 에탄올, 이소프로판올, n-부탄올, 헵탄올, 헥산올, 2-에톡시헥산올, 시클로헥산올, 옥탄올, 이소노닐알코올, 스테아릴알코올, 벤질알코올, 2-에톡시에탄올, 유산메틸, 유산에틸, 유산아밀, 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르, 에틸렌글리콜모노부틸에테르, 프로필렌글리콜모노메틸에테르, 프로필렌글리콜모노에틸에테르, 프로필렌글리콜모노프로필에테르, 디에틸렌글리콜모노에틸에테르, 디에틸렌글리콜모노부틸에테르, 트리에틸렌글리콜모노에틸에테르, N,N-디메틸아미노에탄올, N,N-디에틸아미노에탄올, N,N-디부틸아미노에탄올 등의 알코올류, 페놀, 에틸페놀, 프로필페놀, 부틸페놀, 옥틸페놀, 노닐페놀, 니트로페놀, 클로로페놀, o-크레졸, m-크레졸, p-크레졸, 자일레놀 등의 페놀류, α-피롤리돈, β-부티로락탐, β-프로피오락탐, γ-부티로락탐, δ-발레로락탐, ε-카프로락탐 등의 락탐류, 아세톤옥심, 메틸에틸케톤옥심, 메틸이소부틸케톤옥심, 디에틸케톤옥심, 시클로헥사논옥심, 아세토페논옥심, 벤조페논옥심 등의 옥심류, 피라졸, 3,5-디메틸피라졸, 3-메틸피라졸, 4-벤질-3,5-디메틸피라졸, 4-니트로-3,5-디메틸피라졸, 4-브로모-3,5-디메틸피라졸, 3-메틸-5-페닐피라졸 등의 피라졸류, 부틸메르캅탄, 헥실메르캅탄, 도데실메르캅탄, 벤젠티올 등의 메르캅탄류, 말론산디에스테르, 아세토아세트산에스테르, 말론산디니트릴, 아세틸아세톤, 메틸렌디설폰, 디벤조일메탄, 디피발로일메탄, 아세톤디카르본산디에스테르 등의 활성메틸렌계 화합물류, 디부틸아민, 디이소프로필아민, 디-tert-부틸아민, 디(2-에틸헥실)아민, 디시클로헥실아민, 벤질아민, 디페닐아민, 아닐린, 카바졸 등의 아민류, 이미다졸, 2-에틸이미다졸 등의 이미다졸류, 메틸렌이민, 에틸렌이민, 폴리에틸렌이민, 프로필렌이민 등의 이민류, 아세트아닐리드, 아크릴아미드, 아세트산아미드, 다이머산아미드 등의 산아미드류, 석신산이미드, 말레산이미드, 프탈산이미드 등의 산이미드류, 요소, 티오요소, 에틸렌요소 등의 요소 화합물류를 들 수 있다. 또한, 우레토디온결합(이소시아네이트기의 2량화)에 의한 내부블록형일 수도 있다.Examples of the blocking agent include methanol, ethanol, isopropanol, n-butanol, heptanol, hexanol, 2-ethoxyhexanol, cyclohexanol, octanol, isononyl alcohol, stearyl alcohol, benzyl alcohol, 2-ethoxyethanol, methyl lactate, ethyl lactate, amyl lactate, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether , alcohols such as diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monoethyl ether, N,N-dimethylaminoethanol, N,N-diethylaminoethanol, and N,N-dibutylaminoethanol phenols such as phenol, ethylphenol, propylphenol, butylphenol, octylphenol, nonylphenol, nitrophenol, chlorophenol, o-cresol, m-cresol, p-cresol, xylenol, α-pyrrolidone, Lactams such as β-butyrolactam, β-propiolactam, γ-butyrolactam, δ-valerolactam and ε-caprolactam, acetone oxime, methyl ethyl ketone oxime, methyl isobutyl ketone oxime, diethyl ketone Oximes such as oxime, cyclohexanone oxime, acetophenone oxime, benzophenone oxime, pyrazole, 3,5-dimethylpyrazole, 3-methylpyrazole, 4-benzyl-3,5-dimethylpyrazole, 4- pyrazoles such as nitro-3,5-dimethylpyrazole, 4-bromo-3,5-dimethylpyrazole, and 3-methyl-5-phenylpyrazole; butyl mercaptan, hexyl mercaptan, dodecyl mercaptan; Mercaptans such as benzenethiol, malonic acid diester, acetoacetic acid ester, malonic acid dinitrile, acetylacetone, methylenedisulfone, dibenzoylmethane, dipivaloylmethane, acetonedicarboxylic acid diester and other active methylene-based compounds, di Amines such as butylamine, diisopropylamine, di-tert-butylamine, di(2-ethylhexyl)amine, dicyclohexylamine, benzylamine, diphenylamine, aniline and carbazole; imidazole, 2-ethyl imidazoles such as imidazole; imines such as methyleneimine, ethyleneimine, polyethyleneimine, and propyleneimine; acid amides such as acetanilide, acrylamide, acetate amide and dimer amide; succinimide; maleic imide , acid imides such as phthalic acid imide, and urea compounds such as bovine, thiourea, and ethyleneurea. Moreover, it may be an internal block type by a uretodione bond (dimerization of an isocyanate group).
상기 다관능 블록이소시아네이트 화합물의 시판품으로는, 예를 들어, 하기 제품을 들 수 있다.As a commercial item of the said polyfunctional block isocyanate compound, the following products are mentioned, for example.
타케네이트〔등록상표〕 B-815N, 동 B-830, 동 B-842N, 동 B-846N, 동 B-870, 동 B-870N, 동 B-874, 동 B-874N, 동 B-882, 동 B-882N, 동 B-5010, 동 B-7005, 동 B-7030, 동 B-7075(이상, 미쯔이화학(주)제).Takenate [registered trademark] B-815N, B-830, B-842N, B-846N, B-870, B-870N, B-874, B-874N, B-882, B-882N, B-5010, B-7005, B-7030, B-7075 (above, manufactured by Mitsui Chemicals).
듀라네이트〔등록상표〕 ME20-B80S, 동 MF-B60B, 동 MF-B60X, 동 MF-B90B, 동 MF-K60B, 동 MF-K60X, 동 SBN-70D, 동 17B-60P, 동 17B-60PX, 동 TPA-B80E, 동 TPA-B80X, 동 E402-B80B, 동 E402-B80T, 동 K6000(이상, 아사히카세이케미칼즈(주)제), 코로네이트〔등록상표〕 2503, 동 2507, 동 2512, 동 2513, 동 2515, 동 2520, 동 2554, 동 BI-301, 동 AP-M, 밀리오네이트 MS-50(이상, 토소(주)제).Duranate [registered trademark] ME20-B80S, copper MF-B60B, copper MF-B60X, copper MF-B90B, copper MF-K60B, copper MF-K60X, copper SBN-70D, copper 17B-60P, copper 17B-60PX, Copper TPA-B80E, Copper TPA-B80X, Copper E402-B80B, Copper E402-B80T, Copper K6000 (above, manufactured by Asahi Kasei Chemicals), Coronate [registered trademark] 2503, Copper 2507, Dong 2512, Copper 2513, 2515, 2520, 2554, BI-301, AP-M, Milionate MS-50 (above, manufactured by Tosoh Corporation).
버녹〔등록상표〕 D-500, 동 D-550, 동 DB-980K(이상, DIC(주)제).Vernock [registered trademark] D-500, copper D-550, copper DB-980K (above, manufactured by DIC Corporation).
스미듈〔등록상표〕 BL-3175, 동 BL-4165, 동 BL-4265, 동 BL-1100, 동 BL-1265, 데스모듈〔등록상표〕 TPLS-2957, 동 TPLS-2062, 동 TPLS-2078, 동 TPLS-2117, 동 BL-3475, 데스모섬〔등록상표〕 2170, 동 2265(이상, 스미카바이엘우레탄(주)제).Sumidul [registered trademark] BL-3175, copper BL-4165, copper BL-4265, copper BL-1100, copper BL-1265, death module [registered trademark] TPLS-2957, copper TPLS-2062, copper TPLS-2078, Copper TPLS-2117, Copper BL-3475, Desmosum [registered trademark] 2170, Copper 2265 (above, manufactured by Sumika Bayer Urethane Co., Ltd.).
TRIXENE BI-7641, 동 BI-7642, 동 BI-7986, 동 BI-7987, 동 BI-7950, 동 BI-7951, 동 BI-7960, 동 BI-7961, 동 BI-7963, 동 BI-7981, 동 BI-7982, 동 BI-7984, 동 BI-7986, 동 BI-7990, 동 BI-7991, 동 BI-7992, 동 BI-7770, 동 BI-7772, 동 BI-7779, 동 DP9C/214(이상, 박센덴케미칼즈사제).TRIXENE BI-7641, East BI-7642, East BI-7986, East BI-7987, East BI-7950, East BI-7951, East BI-7960, East BI-7961, East BI-7963, East BI-7981, East BI-7982, East BI-7984, East BI-7986, East BI-7990, East BI-7991, East BI-7992, East BI-7770, East BI-7772, East BI-7779, East DP9C/214 ( Above, Park Senden Chemicals Co., Ltd.).
VESTANAT〔등록상표〕 B1358A, 동 B1358/100, 동 B1370, VESTAGON〔등록상표〕 B1065, 동 B1400, 동 B1530, 동 BF1320, 동 BF1540(이상, 에보닉인더스트리즈사제).VESTANAT [registered trademark] B1358A, copper B1358/100, copper B1370, VESTAGON [registered trademark] B1065, copper B1400, copper B1530, copper BF1320, copper BF1540 (above, made by Evonik Industries).
또한, 상기 다관능 블록이소시아네이트 화합물로는, 블록이소시아네이트기를 갖는 (메트)아크릴레이트를 라디칼중합하여 얻어지는 호모폴리머 또는 코폴리머를 들 수 있다. 여기서, 코폴리머란, 2종 이상의 모노머를 중합하여 얻어지는 폴리머를 의미한다. 코폴리머는, 블록이소시아네이트기를 갖는 2종 이상의 (메트)아크릴레이트를 중합하여 얻어지는 코폴리머일 수도 있고, 블록이소시아네이트기를 갖는 (메트)아크릴레이트 및 기타 (메트)아크릴레이트를 중합하여 얻어지는 코폴리머일 수도 있다. 이러한 블록이소시아네이트기를 갖는 (메트)아크릴레이트의 시판품으로는, 예를 들어, 쇼와덴코(주)제 카렌즈〔등록상표〕 MOI-BM, 동 AOI-BM, 동 MOI-BP, 동 AOI-BP, 동 MOI-DEM, 동 MOI-CP, 동 MOI-MP, 동 MOI-OEt, 동 MOI-OBu, 동 MOI-OiPr을 들 수 있다.Moreover, as said polyfunctional block isocyanate compound, the homopolymer or copolymer obtained by radical polymerization of (meth)acrylate which has a block isocyanate group is mentioned. Here, a copolymer means a polymer obtained by superposing|polymerizing 2 or more types of monomers. The copolymer may be a copolymer obtained by polymerizing two or more types of (meth)acrylates having a block isocyanate group, or may be a copolymer obtained by polymerizing (meth)acrylates having a block isocyanate group and other (meth)acrylates. have. As a commercial item of the (meth)acrylate which has such a block isocyanate group, For example, Showa Denko Co., Ltd. car lens [registered trademark] MOI-BM, AOI-BM, MOI-BP, AOI-BP , copper MOI-DEM, copper MOI-CP, copper MOI-MP, copper MOI-OEt, copper MOI-OBu, and copper MOI-OiPr.
이들 다관능 블록이소시아네이트 화합물은 단독으로 이용할 수도 있고, 2종 이상을 조합하여 이용할 수도 있다.These polyfunctional block isocyanate compounds may be used independently and may be used in combination of 2 or more type.
상기 서술한 페노플라스트 화합물의 구체예로는 이하의 화합물을 들 수 있는데, 페노플라스트 화합물은 이하의 화합물예로 한정되는 것은 아니다.Although the following compounds are mentioned as a specific example of the above-mentioned phenoplast compound, A phenoplast compound is not limited to the following compound examples.
[화학식 8][Formula 8]
트리알콕시실릴기를 2개 이상 갖는 화합물의 구체예로는, 예를 들어, 1,4-비스(트리메톡시실릴)벤젠, 1,4-비스(트리에톡시실릴)벤젠, 4,4’-비스(트리메톡시실릴)비페닐, 4,4’-비스(트리에톡시실릴)비페닐, 비스(트리메톡시실릴)에탄, 비스(트리에톡시실릴)에탄, 비스(트리메톡시실릴)메탄, 비스(트리에톡시실릴)메탄, 비스(트리메톡시실릴)에틸렌, 비스(트리에톡시실릴)에틸렌, 1,3-비스(트리메톡시실릴에틸)테트라메틸디실록산, 1,3-비스(트리에톡시실릴에틸)테트라메틸디실록산, 비스(트리에톡시실릴메틸)아민, 비스(트리메톡시실릴메틸)아민, 비스(트리에톡시실릴프로필)아민, 비스(트리메톡시실릴프로필)아민, 비스(3-트리메톡시실릴프로필)카보네이트, 비스(3-트리에톡시실릴프로필)카보네이트, 비스[(3-트리메톡시실릴)프로필]디설파이드, 비스[(3-트리에톡시실릴)프로필]디설파이드, 비스[(3-트리메톡시실릴)프로필]티오우레아, 비스[(3-트리에톡시실릴)프로필]티오우레아, 비스[(3-트리메톡시실릴)프로필]우레아, 비스[(3-트리에톡시실릴)프로필]우레아, 1,4-비스(트리메톡시실릴메틸)벤젠, 1,4-비스(트리에톡시실릴메틸)벤젠, 트리스(트리메톡시실릴프로필)아민, 트리스(트리에톡시실릴프로필)아민, 1,1,2-트리스(트리메톡시실릴)에탄, 1,1,2-트리스(트리에톡시실릴)에탄, 트리스(3-트리메톡시실릴프로필)이소시아누레이트, 및 트리스(3-트리에톡시실릴프로필)이소시아누레이트 등의 화합물을 들 수 있다.Specific examples of the compound having two or more trialkoxysilyl groups include, for example, 1,4-bis(trimethoxysilyl)benzene, 1,4-bis(triethoxysilyl)benzene, 4,4'- Bis(trimethoxysilyl)biphenyl, 4,4'-bis(triethoxysilyl)biphenyl, bis(trimethoxysilyl)ethane, bis(triethoxysilyl)ethane, bis(trimethoxysilyl) Methane, bis(triethoxysilyl)methane, bis(trimethoxysilyl)ethylene, bis(triethoxysilyl)ethylene, 1,3-bis(trimethoxysilylethyl)tetramethyldisiloxane, 1,3- Bis(triethoxysilylethyl)tetramethyldisiloxane, bis(triethoxysilylmethyl)amine, bis(trimethoxysilylmethyl)amine, bis(triethoxysilylpropyl)amine, bis(trimethoxysilylpropyl) )Amine, bis(3-trimethoxysilylpropyl)carbonate, bis(3-triethoxysilylpropyl)carbonate, bis[(3-trimethoxysilyl)propyl]disulfide, bis[(3-triethoxysilyl) )propyl]disulfide, bis[(3-trimethoxysilyl)propyl]thiourea, bis[(3-triethoxysilyl)propyl]thiourea, bis[(3-trimethoxysilyl)propyl]urea, bis [(3-triethoxysilyl)propyl]urea, 1,4-bis(trimethoxysilylmethyl)benzene, 1,4-bis(triethoxysilylmethyl)benzene, tris(trimethoxysilylpropyl)amine , tris(triethoxysilylpropyl)amine, 1,1,2-tris(trimethoxysilyl)ethane, 1,1,2-tris(triethoxysilyl)ethane, tris(3-trimethoxysilylpropyl) ) isocyanurate and compounds such as tris(3-triethoxysilylpropyl)isocyanurate.
아미노기를 갖는 알콕시실란 화합물의 구체예로는, 예를 들어, N,N’-비스[3-(트리메톡시실릴)프로필]-1,2-에탄디아민, N,N’-비스[3-(트리에톡시실릴)프로필]-1,2-에탄디아민, N-[3-(트리메톡시실릴)프로필]-1,2-에탄디아민, N-[3-(트리에톡시실릴)프로필]-1,2-에탄디아민, 비스-{3-(트리메톡시실릴)프로필}아민, 비스-{3-(트리에톡시실릴)프로필}아민, 3-아미노프로필트리메톡시실란, 3-아미노프로필트리에톡시실란, 트리메톡시{3-(메틸아미노)프로필실란, 3-(N-알릴아미노)프로필트리메톡시실란, 3-(N-알릴아미노)프로필트리에톡시실란, 3-(디에틸아미노)프로필트리메톡시실란, 3-(디에틸아미노)프로필트리에톡시실란, 3-(페닐아미노)프로필트리메톡시실란, 및 3-(페닐아미노)프로필트리에톡시실란 등의 화합물을 들 수 있다.As a specific example of the alkoxysilane compound which has an amino group, For example, N,N'-bis[3-(trimethoxysilyl)propyl]-1,2-ethanediamine, N,N'-bis[3- (triethoxysilyl)propyl]-1,2-ethanediamine, N-[3-(trimethoxysilyl)propyl]-1,2-ethanediamine, N-[3-(triethoxysilyl)propyl] -1,2-ethanediamine, bis-{3-(trimethoxysilyl)propyl}amine, bis-{3-(triethoxysilyl)propyl}amine, 3-aminopropyltrimethoxysilane, 3-amino Propyltriethoxysilane, trimethoxy{3-(methylamino)propylsilane, 3-(N-allylamino)propyltrimethoxysilane, 3-(N-allylamino)propyltriethoxysilane, 3-( Compounds such as diethylamino)propyltrimethoxysilane, 3-(diethylamino)propyltriethoxysilane, 3-(phenylamino)propyltrimethoxysilane, and 3-(phenylamino)propyltriethoxysilane can be heard
알콕시기 및/또는 킬레이트배위자를 갖는 유기금속 화합물의 구체예로는, 예를 들어, 디이소프로폭시에틸아세토아세테이트알루미늄, 디이소프로폭시아세틸아세토네이트알루미늄, 트리아세틸아세토네이트알루미늄, 테트라키스이소프로폭시티타늄, 테트라키스노말부톡시티타늄, 테트라옥틸티타네이트, 디이소프로폭시비스(아세틸아세토네이트)티타늄, 티탄테트라아세틸아세토네이트, 테트라키스(노말프로폭시)지르코늄, 테트라키스(노말부톡시)지르코늄, 테트라키스(아세틸아세토네이트)지르코늄 등의 화합물을 들 수 있다.Specific examples of the organometallic compound having an alkoxy group and/or chelate ligand include, for example, diisopropoxyethylacetoacetate aluminum, diisopropoxyacetylacetonate aluminum, triacetylacetonate aluminum, tetrakisisopro. Titanium foxy, tetrakis normal butoxy titanium, tetraoctyl titanate, diisopropoxybis (acetylacetonate) titanium, titanium tetraacetylacetonate, tetrakis (normal propoxy) zirconium, tetrakis (normal butoxy) zirconium and compounds such as tetrakis(acetylacetonate)zirconium.
나아가, 상기 서술한 N-알콕시메틸아크릴아미드의 중합체로는, 예를 들어, N-하이드록시메틸(메트)아크릴아미드, N-메톡시메틸(메트)아크릴아미드, N-에톡시메틸(메트)아크릴아미드, N-부톡시메틸(메트)아크릴아미드 등의 하이드록시메틸기 또는 알콕시메틸기로 치환된 아크릴아미드 화합물 또는 메타크릴아미드 화합물을 사용하여 제조되는 폴리머를 들 수 있다.Furthermore, as a polymer of N-alkoxymethyl acrylamide mentioned above, N-hydroxymethyl (meth)acrylamide, N-methoxymethyl (meth)acrylamide, N-ethoxymethyl (meth) is, for example, and polymers produced using acrylamide compounds or methacrylamide compounds substituted with hydroxymethyl groups or alkoxymethyl groups, such as acrylamide and N-butoxymethyl (meth)acrylamide.
그러한 폴리머의 구체예로는, 예를 들어, 폴리(N-부톡시메틸아크릴아미드), N-부톡시메틸아크릴아미드와 스티렌의 공중합체, N-하이드록시메틸메타크릴아미드와 메틸메타크릴레이트의 공중합체, N-에톡시메틸메타크릴아미드와 벤질메타크릴레이트의 공중합체, 및 N-부톡시메틸아크릴아미드와 벤질메타크릴레이트와 2-하이드록시프로필메타크릴레이트의 공중합체 등을 들 수 있다. 이러한 폴리머의 중량평균 분자량은, 1,000 내지 200,000이며, 보다 바람직하게는 3,000 내지 150,000이며, 더욱 바람직하게는 3,000 내지 50,000이다.Specific examples of such a polymer include, for example, poly(N-butoxymethylacrylamide), a copolymer of N-butoxymethylacrylamide and styrene, and N-hydroxymethylmethacrylamide and methylmethacrylate. A copolymer, a copolymer of N-ethoxymethyl methacrylamide and benzyl methacrylate, and a copolymer of N-butoxymethyl acrylamide, benzyl methacrylate and 2-hydroxypropyl methacrylate, etc. are mentioned. . The weight average molecular weight of such a polymer is 1,000 to 200,000, more preferably 3,000 to 150,000, still more preferably 3,000 to 50,000.
에폭시기를 갖는 화합물의 중합체로는, 예를 들어, 글리시딜메타크릴레이트, 3,4-에폭시시클로헥실메틸메타크릴레이트, 3,4-에폭시시클로헥실메틸메타크릴레이트 등의 에폭시기를 갖는 화합물을 사용하여 제조되는 폴리머를 들 수 있다.As the polymer of the compound having an epoxy group, for example, a compound having an epoxy group such as glycidyl methacrylate, 3,4-epoxycyclohexylmethyl methacrylate, and 3,4-epoxycyclohexylmethyl methacrylate; polymers prepared using
그러한 폴리머의 구체예로는, 예를 들어, 폴리(3,4-에폭시시클로헥실메틸메타크릴레이트), 폴리(글리시딜메타크릴레이트), 글리시딜메타크릴레이트와 메틸메타크릴레이트의 공중합체, 3,4-에폭시시클로헥실메틸메타크릴레이트와 메틸메타크릴레이트의 공중합체, 글리시딜메타크릴레이트와 스티렌의 공중합체 등을 들 수 있다. 이러한 폴리머의 중량평균 분자량은, 1,000 내지 200,000이며, 보다 바람직하게는 3,000 내지 150,000이며, 더욱 바람직하게는 3,000 내지 50,000이다.Specific examples of such polymers include, for example, poly(3,4-epoxycyclohexylmethylmethacrylate), poly(glycidylmethacrylate), a copolymer of glycidylmethacrylate and methylmethacrylate. a copolymer of 3,4-epoxycyclohexylmethyl methacrylate and methyl methacrylate, a copolymer of glycidyl methacrylate and styrene, and the like. The weight average molecular weight of such a polymer is 1,000 to 200,000, more preferably 3,000 to 150,000, still more preferably 3,000 to 50,000.
상기 서술한 알콕시실릴기를 갖는 화합물의 중합체로는, 예를 들어, 3-메타크릴옥시프로필트리메톡시실란 등의 알콕시실릴기를 갖는 화합물을 사용하여 제조되는 폴리머를 들 수 있다.As a polymer of the compound which has an alkoxysilyl group mentioned above, the polymer manufactured using the compound which has alkoxysilyl groups, such as 3-methacryloxypropyl trimethoxysilane, is mentioned, for example.
그러한 폴리머의 구체예로는, 예를 들어, 폴리(3-메타크릴옥시프로필트리메톡시실란), 3-메타크릴옥시프로필트리메톡시실란과 스티렌의 공중합체, 3-메타크릴옥시프로필트리메톡시실란과 메틸메타크릴레이트의 공중합체 등을 들 수 있다. 이러한 폴리머의 중량평균 분자량은, 1,000 내지 200,000이며, 보다 바람직하게는 3,000 내지 150,000이며, 더욱 바람직하게는 3,000 내지 50,000이다. 한편 본 명세서에 있어서, 상기 「폴리((메트)아크릴옥시프로필트리메톡시실란)」은, 알콕시실릴기를 갖는 폴리(메트)아크릴레이트를 의미한다.Specific examples of such polymers include, for example, poly(3-methacryloxypropyltrimethoxysilane), a copolymer of 3-methacryloxypropyltrimethoxysilane and styrene, 3-methacryloxypropyltrimethyl The copolymer of oxysilane and methyl methacrylate, etc. are mentioned. The weight average molecular weight of such a polymer is 1,000 to 200,000, more preferably 3,000 to 150,000, still more preferably 3,000 to 50,000. In addition, in this specification, the said "poly((meth)acryloxypropyltrimethoxysilane)" means poly(meth)acrylate which has an alkoxysilyl group.
이들 가교제는, 단독으로 또는 2종 이상을 조합하여 사용할 수 있다.These crosslinking agents can be used individually or in combination of 2 or more types.
본 발명의 도금 하지제에 (E)성분을 함유시키는 경우의 함유량은, (A)성분의 공중합체와, (B)성분의 금속미립자의 합계 100질량부에 기초하여, 0질량부 내지 100질량부인 것이 바람직하고, 보다 바람직하게는 0질량부 내지 50질량부이다.Content in the case of making the plating brush agent of this invention contain (E) component, 0 mass part - 100 mass parts based on a total of 100 mass parts of the copolymer of (A) component, and the metal fine particle of (B) component It is preferable that it is negative, More preferably, they are 0 mass parts - 50 mass parts.
<기타 첨가제><Other additives>
본 발명의 하지제는, 본 발명의 효과를 손상시키지 않는 한에 있어서, 추가로 계면활성제, 각종 표면조정제, 증점제 등의 첨가제 등을 적당히 첨가할 수도 있다.To the brush agent of the present invention, additives such as surfactants, various surface conditioning agents, and thickeners may be appropriately added as long as the effects of the present invention are not impaired.
상기 계면활성제로는, 예를 들어, 폴리옥시에틸렌라우릴에테르, 폴리옥시에틸렌스테아릴에테르, 폴리옥시에틸렌세틸에테르, 폴리옥시에틸렌올레일에테르 등의 폴리옥시에틸렌알킬에테르류; 폴리옥시에틸렌옥틸페닐에테르, 폴리옥시에틸렌노닐페닐에테르 등의 폴리옥시에틸렌알킬아릴에테르류; 폴리옥시에틸렌·폴리옥시프로필렌블록코폴리머류; 솔비탄모노라우레이트, 솔비탄모노팔미테이트, 솔비탄모노스테아레이트, 솔비탄모노올리에이트, 솔비탄트리스테아레이트, 솔비탄트리올리에이트 등의 솔비탄지방산에스테르류; 폴리옥시에틸렌솔비탄모노라우레이트, 폴리옥시에틸렌솔비탄모노팔미테이트, 폴리옥시에틸렌솔비탄모노스테아레이트, 폴리옥시에틸렌솔비탄트리올리에이트 등의 폴리옥시에틸렌비이온계 계면활성제; 에프톱(등록상표) EF-301, 동 EF-303, 동 EF-352[이상, 미쯔비시머테리얼전자화성(주)제], 메가팍(등록상표) F-171, 동 F-173, 동 R-08, 동 R-30[이상, DIC(주)제], Novec(등록상표) FC-430, 동 FC-431[이상, 스미토모쓰리엠(주)제], 아사히가드(등록상표) AG-710[아사히글라스(주)제], 서플론(등록상표) S-382[AGC세이미케미칼(주)제] 등의 불소계 계면활성제 등을 들 수 있다.As said surfactant, For example, polyoxyethylene alkyl ethers, such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether; polyoxyethylene alkyl aryl ethers such as polyoxyethylene octylphenyl ether and polyoxyethylene nonylphenyl ether; polyoxyethylene/polyoxypropylene block copolymers; sorbitan fatty acid esters such as sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan tristearate, and sorbitan trioleate; polyoxyethylene nonionic surfactants such as polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, and polyoxyethylene sorbitan trioleate; F-top (registered trademark) EF-301, Dong EF-303, Dong EF-352 [above, manufactured by Mitsubishi Material Electromagnetic Chemicals Co., Ltd.], Megapac (registered trademark) F-171, Dong F-173, Dong R -08, copper R-30 [above, manufactured by DIC Corporation], Novec (registered trademark) FC-430, copper FC-431 [above, manufactured by Sumitomo 3M Co., Ltd.], Asahi Guard (registered trademark) AG-710 A fluorine-type surfactant, such as [Asahi Glass Co., Ltd. product], Sufflon (trademark) S-382 [AGC Seimi Chemical Co., Ltd. product], etc. are mentioned.
또한, 상기 표면조정제로는, 신에쯔실리콘(등록상표) KP-341[신에쯔화학공업(주)제] 등의 실리콘계 레벨링제; BYK(등록상표)-302, 동 307, 동 322, 동 323, 동 330, 동 333, 동 370, 동 375, 동 378[이상, 빅케미·재팬(주)제] 등의 실리콘계 표면조정제 등을 들 수 있다.Moreover, as said surface conditioning agent, Silicone-type leveling agents, such as Shin-Etsu Silicone (trademark) KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.); Silicone-based surface conditioners such as BYK (registered trademark)-302, 307, 322, 323, 330, 333, 370, 375, 378 [above, made by Big Chemie Japan] can be heard
상기 증점제로는, 예를 들어, 카르복시비닐폴리머(카르보머) 등의 폴리아크릴산류(가교한 것도 포함한다); 폴리비닐피롤리돈(PVP), 폴리비닐알코올(PVA), 폴리아세트산비닐(PVAc), 폴리스티렌(PS) 등의 비닐폴리머; 폴리에틸렌옥사이드류; 폴리에스테르; 폴리카보네이트; 폴리아미드; 폴리우레탄; 덱스트린, 한천, 카라기난, 알긴산, 아라비아검, 구아검, 트래거캔스검, 로커스트빈검, 전분, 펙틴, 카르복시메틸셀룰로오스, 하이드록시에틸셀룰로오스, 하이드록시프로필셀룰로오스 등의 다당류; 젤라틴, 카제인 등의 단백질 등을 들 수 있다. 또한, 상기 각 폴리머에는, 호모폴리머뿐만 아니라 코폴리머도 포함된다. 이들 증점제는 1종을 단독으로 사용할 수도 있고, 또한 2종 이상을 병용할 수도 있다.Examples of the thickener include polyacrylic acids (including crosslinked ones) such as carboxyvinyl polymer (carbomer); vinyl polymers such as polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polyvinyl acetate (PVAc), and polystyrene (PS); polyethylene oxides; Polyester; polycarbonate; polyamide; Polyurethane; polysaccharides such as dextrin, agar, carrageenan, alginic acid, gum arabic, guar gum, tragacanth gum, locust bean gum, starch, pectin, carboxymethyl cellulose, hydroxyethyl cellulose, and hydroxypropyl cellulose; Proteins, such as gelatin and casein, are mentioned. Further, each of the above polymers includes not only homopolymers but also copolymers. These thickeners may be used individually by 1 type, and may use 2 or more types together.
본 발명의 하지제는, 필요에 따라 증점제를 배합함으로써, 하지제의 점도나 레올로지특성을 조정할 수 있고, 하지제의 적용방법이나 적용개소 등, 그 용도에 따라 적당히 채용·선택할 수 있다.The brush agent of the present invention can adjust the viscosity and rheological properties of the brush agent by adding a thickener as needed, and can be appropriately employed and selected according to the intended use, such as the application method of the brush agent and the site of application.
이들 첨가제는 1종을 단독으로 사용할 수도 있고, 또한 2종 이상을 병용할 수도 있다. 첨가제의 사용량은, 상기 (A)성분인 폴리머와 (B)성분인 금속미립자로부터 형성된 복합체 100질량부에 대하여, 0.001~50질량부가 바람직하고, 0.005~10질량부가 보다 바람직하고, 0.01~5질량부가 보다 한층 바람직하다.These additives may be used individually by 1 type, and may use 2 or more types together. The amount of the additive used is preferably 0.001 to 50 parts by mass, more preferably 0.005 to 10 parts by mass, and 0.01 to 5 parts by mass, with respect to 100 parts by mass of the composite formed from the polymer as component (A) and fine metal particles as component (B). Addition is even more preferable.
[무전해 금속도금의 하지층][Underlayer of electroless metal plating]
상기 서술한 본 발명의 무전해 도금 하지제는, 기재 상에 도포함으로써, 무전해 금속도금의 하지층을 형성할 수 있다. 이 무전해 금속도금의 하지층도 본 발명의 대상이다.The electroless plating base agent of this invention mentioned above can form the base layer of electroless metal plating by apply|coating on a base material. The base layer of this electroless metal plating is also a subject of the present invention.
상기 기재로는 특별히 한정되지 않으나, 비도전성 기재 또는 도전성 기재를 바람직하게 사용할 수 있다.The substrate is not particularly limited, but a non-conductive substrate or a conductive substrate may be preferably used.
비도전성 기재로는, 예를 들어 유리, 세라믹 등; 폴리에틸렌 수지, 폴리프로필렌 수지, 염화비닐 수지, 나일론(폴리아미드 수지), 폴리이미드 수지, 폴리카보네이트 수지, 아크릴 수지, PEN(폴리에틸렌나프탈레이트) 수지, PET(폴리에틸렌테레프탈레이트) 수지, PEEK(폴리에테르에테르케톤) 수지, ABS(아크릴로니트릴-부타디엔-스티렌 공중합체) 수지, 에폭시 수지, 폴리아세탈 수지, LCP(액정폴리머) 수지 등; 종이 등을 들 수 있다. 이들은 시트 혹은 필름 등의 형태로 호적하게 사용되고, 이 경우의 두께에 대해서는 특별히 한정되지 않는다.Examples of the non-conductive substrate include glass, ceramic, and the like; Polyethylene resin, polypropylene resin, vinyl chloride resin, nylon (polyamide resin), polyimide resin, polycarbonate resin, acrylic resin, PEN (polyethylene naphthalate) resin, PET (polyethylene terephthalate) resin, PEEK (polyether ether) ketone) resin, ABS (acrylonitrile-butadiene-styrene copolymer) resin, epoxy resin, polyacetal resin, LCP (liquid crystal polymer) resin, etc.; paper and the like. These are suitably used in the form of a sheet|seat, a film, etc., and it does not specifically limit about the thickness in this case.
또한 도전성 기재로는, 예를 들어 ITO(주석도프산화인듐)나, ATO(안티몬도프산화주석), FTO(불소도프산화주석), AZO(알루미늄도프산화아연), GZO(갈륨도프산화아연), 또한 각종 스테인레스강, 알루미늄 그리고 듀랄루민 등의 알루미늄합금, 철 그리고 철합금, 구리 그리고 진유, 인청동, 백동 및 베릴륨동 등의 구리합금, 니켈 그리고 니켈합금, 그리고, 은 그리고 양은 등의 은합금 등의 금속 등을 들 수 있다.Examples of the conductive substrate include ITO (tin-doped indium oxide), ATO (antimond-doped tin oxide), FTO (fluorine-doped tin oxide), AZO (aluminum-doped zinc oxide), GZO (gallium-doped zinc oxide), In addition, various metals such as stainless steel, aluminum alloys such as aluminum and duralumin, iron and iron alloys, copper and copper alloys such as copper, phosphor bronze, cupronickel and beryllium copper, nickel and nickel alloys, and silver alloys such as silver and silver silver and the like.
나아가 상기 비도전성 기재 상에 이들 도전성 기재로 박막이 형성된 기재도 사용가능하다.Furthermore, a substrate in which a thin film is formed with these conductive substrates on the non-conductive substrate may also be used.
또한, 상기 기재는, 3차원 성형체여도 된다.In addition, a three-dimensional molded object may be sufficient as the said base material.
상기 (A)성분인 공중합체, (B)금속미립자(바람직하게는 이들로 이루어지는 복합체), 및 (C)용제를 포함하고, 추가로, 필요에 따라 (D)베이스 수지, (E)가교제 및 기타 성분을 포함하는 무전해 도금 하지제로부터 무전해 금속도금의 하지층을 형성하는 구체적인 방법으로는, 우선 상기 (A)성분 폴리머와 (B)금속미립자(바람직하게는 이들로 이루어지는 복합체)(와 필요에 따라 (D)베이스 수지, (E)가교제 및 기타 성분)를 (C)용제에 용해 또는 분산하여 바니시의 형태로 하고, 이 바니시를, 금속도금피막을 형성하는 기재 상에 스핀코트법; 블레이드코트법; 딥코트법; 롤코트법; 바코트법; 다이코트법; 스프레이코트법; 잉크젯법; 파운텐펜나노리소그래피(FPN), 딥펜나노리소그래피(DPN) 등의 펜리소그래피; 활판인쇄, 플렉소인쇄, 수지볼록판인쇄, 컨택트프린팅, 마이크로컨택트프린팅(μCP), 나노임프린팅리소그래피(NIL), 나노트랜스퍼프린팅(nTP) 등의 볼록판인쇄법; 그라비아인쇄, 인그레이빙 등의 오목판인쇄법; 평판인쇄법; 스크린인쇄, 등사판 등의 공판인쇄법; 오프셋인쇄법 등에 의해 도포하고, 그 후, 용매를 증발·건조시킴으로써, 박층을 형성한다.The copolymer as component (A), (B) metal fine particles (preferably a composite comprising these), and (C) a solvent, and, if necessary, (D) a base resin, (E) a crosslinking agent and As a specific method of forming a base layer for electroless metal plating from an electroless plating base agent containing other components, first, the (A) component polymer and (B) metal fine particles (preferably a composite comprising these) If necessary, (D) the base resin, (E) a crosslinking agent and other components) are dissolved or dispersed in the (C) solvent to form a varnish, and the varnish is applied to a substrate forming a metal plating film by spin coating; blade coat method; dip coating method; roll coat method; barcoat method; die coat method; spray coating method; inkjet method; Pen lithography, such as a fountain pen nanolithography (FPN) and a dip pen nanolithography (DPN); embossing printing methods such as letterpress printing, flexographic printing, resin embossing printing, contact printing, microcontact printing (μCP), nanoimprinting lithography (NIL), and nanotransfer printing (nTP); intaglio printing methods such as gravure printing and engraving; lithography; stencil printing methods such as screen printing and copying; It is applied by an offset printing method or the like, and then the solvent is evaporated and dried to form a thin layer.
이들 도포방법 중에서도 바코트법, 플렉소인쇄, 그라비아인쇄, 스핀코트법, 스프레이코트법, 잉크젯법, 펜리소그래피, 컨택트프린팅, μCP, NIL 및 nTP가 바람직하다. 스핀코트법을 이용하는 경우에는, 단시간에 도포할 수 있으므로, 휘발성이 높은 용액이어도 이용할 수 있고, 또한, 균일성이 높은 도포를 행할 수 있다는 이점이 있다. 스프레이코트법을 이용하는 경우에는, 극소량의 바니시로 균일성이 높은 도포를 행할 수 있고, 공업적으로 매우 유리해진다. 잉크젯법, 펜리소그래피, 컨택트프린팅, μCP, NIL, nTP를 이용하는 경우에는, 예를 들어 배선 등의 미세패턴을 효율적으로 형성(묘화)할 수 있고, 공업적으로 매우 유리해진다.Among these coating methods, the bar coating method, flexographic printing, gravure printing, spin coating method, spray coating method, inkjet method, pen lithography, contact printing, μCP, NIL and nTP are preferable. In the case of using the spin coating method, since it can be applied in a short time, even a highly volatile solution can be used, and there is an advantage that application with high uniformity can be performed. When the spray coating method is used, application with high uniformity can be performed with a very small amount of varnish, which is industrially very advantageous. In the case of using inkjet method, pen lithography, contact printing, μCP, NIL, or nTP, for example, fine patterns such as wiring can be efficiently formed (drawn), which is industrially very advantageous.
<(C)용제><(C) Solvent>
또한 여기서 이용되는 용매로는, 상기 (A)성분인 폴리머와 (B)금속미립자(바람직하게는 이들로 이루어지는 복합체), 및 필요에 따라 (D)성분, (E)성분 및 기타 성분을 용해 또는 분산하는 것이면 특별히 한정되지 않는데, 예를 들어, 물; 벤젠, 톨루엔, 자일렌, 에틸벤젠, 클로로벤젠, 디클로로벤젠 등의 방향족 탄화수소류; 메탄올, 에탄올, n-프로판올, 이소프로판올, n-부탄올, 2-부탄올, n-헥산올, n-옥탄올, 2-옥탄올, 2-에틸헥산올 등의 알코올류; 메틸셀로솔브, 에틸셀로솔브, 부틸셀로솔브, 페닐셀로솔브 등의 셀로솔브류; 프로필렌글리콜모노메틸에테르(PGME), 프로필렌글리콜모노에틸에테르, 프로필렌글리콜모노부틸에테르, 디에틸렌글리콜모노메틸에테르, 디에틸렌글리콜모노부틸에테르, 디프로필렌글리콜모노메틸에테르, 트리에틸렌글리콜모노메틸에테르, 트리프로필렌글리콜모노메틸에테르, 에틸렌글리콜디메틸에테르, 프로필렌글리콜디메틸에테르, 디에틸렌글리콜디메틸에테르, 디에틸렌글리콜디에틸에테르, 디에틸렌글리콜디부틸에테르, 디에틸렌글리콜에틸메틸에테르, 디에틸렌글리콜부틸메틸에테르, 디에틸렌글리콜이소프로필메틸에테르, 디프로필렌글리콜디메틸에테르, 트리에틸렌글리콜디메틸에테르, 트리프로필렌글리콜디메틸에테르 등의 글리콜에테르류; 에틸렌글리콜모노메틸에테르아세테이트, 프로필렌글리콜모노메틸에테르아세테이트(PGMEA) 등의 글리콜에스테르류; 테트라하이드로푸란(THF), 메틸테트라하이드로푸란, 1,4-디옥산, 디에틸에테르 등의 에테르류; 아세트산에틸, 아세트산부틸 등의 에스테르류; 아세톤, 메틸에틸케톤(MEK), 메틸이소부틸케톤(MIBK), 시클로펜탄온, 시클로헥사논 등의 케톤류; n-헵탄, n-헥산, 시클로헥산 등의 지방족 탄화수소류; 1,2-디클로로에탄, 클로로포름 등의 할로겐화 지방족 탄화수소류; N-메틸-2-피롤리돈(NMP), N,N-디메틸포름아미드(DMF), N,N-디메틸아세트아미드 등의 아미드류; 디메틸설폭사이드 등을 사용할 수 있다. 이들 용매는 단독으로 사용할 수도 있고, 2종류 이상의 용매를 혼합할 수도 있다. 나아가, 바니시의 점도를 조정하는 목적으로, 에틸렌글리콜, 프로필렌글리콜, 부틸렌글리콜 등의 글리콜류를 첨가할 수도 있다.In addition, as the solvent used herein, the polymer as component (A), (B) metal fine particles (preferably a composite comprising these), and, if necessary, component (D), component (E) and other components are dissolved or It will not specifically limit if it disperse|distributes, For example, Water; aromatic hydrocarbons such as benzene, toluene, xylene, ethylbenzene, chlorobenzene, and dichlorobenzene; alcohols such as methanol, ethanol, n-propanol, isopropanol, n-butanol, 2-butanol, n-hexanol, n-octanol, 2-octanol, and 2-ethylhexanol; cellosolves such as methyl cellosolve, ethyl cellosolve, butyl cellosolve and phenyl cellosolve; Propylene glycol monomethyl ether (PGME), propylene glycol monoethyl ether, propylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, dipropylene glycol monomethyl ether, triethylene glycol monomethyl ether, triethylene glycol monomethyl ether Propylene glycol monomethyl ether, ethylene glycol dimethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, diethylene glycol ethyl methyl ether, diethylene glycol butyl methyl ether, glycol ethers such as diethylene glycol isopropyl methyl ether, dipropylene glycol dimethyl ether, triethylene glycol dimethyl ether, and tripropylene glycol dimethyl ether; glycol esters such as ethylene glycol monomethyl ether acetate and propylene glycol monomethyl ether acetate (PGMEA); ethers such as tetrahydrofuran (THF), methyltetrahydrofuran, 1,4-dioxane, and diethyl ether; esters such as ethyl acetate and butyl acetate; ketones such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), cyclopentanone, and cyclohexanone; aliphatic hydrocarbons such as n-heptane, n-hexane and cyclohexane; halogenated aliphatic hydrocarbons such as 1,2-dichloroethane and chloroform; amides such as N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), and N,N-dimethylacetamide; Dimethyl sulfoxide and the like can be used. These solvents may be used independently and may mix 2 or more types of solvent. Furthermore, glycols, such as ethylene glycol, propylene glycol, butylene glycol, can also be added for the purpose of adjusting the viscosity of a varnish.
또한 상기 용매에 용해 또는 분산시키는 농도는 임의인데, 바니시 중의 비용매성분의 농도[하지제에 포함되는 용매를 제외한 전체성분((A)성분인 폴리머와 (B)금속미립자(바람직하게는 이들로 이루어지는 복합체), 필요에 따라 (D)베이스폴리머, (E)가교제 및 기타 성분 등)의 농도]는 0.05~90질량%이며, 바람직하게는 0.1~80질량%이다.In addition, the concentration for dissolving or dispersing in the solvent is arbitrary, but the concentration of the non-solvent component in the varnish [all components excluding the solvent included in the brush agent ((A) component polymer and (B) metal fine particles (preferably with these) (concentration of (D) base polymer, (E) crosslinking agent and other components, etc.) if necessary) is 0.05 to 90 mass %, preferably 0.1 to 80 mass %.
용매의 건조법으로는, 특별히 한정되는 것은 아니고, 예를 들어, 핫플레이트나 오븐을 이용하여, 적절한 분위기하, 즉 대기, 질소 등의 불활성 가스, 진공 중 등으로 증발시키면 된다. 이에 따라, 균일한 성막면을 갖는 하지층을 얻는 것이 가능하다. 소성온도는, 용매를 증발시킬 수 있으면 특별히 한정되지 않는데, 40~250℃에서 행하는 것이 바람직하다.It does not specifically limit as a drying method of a solvent, For example, what is necessary is just to evaporate in an appropriate atmosphere, ie, air|atmosphere, inert gas, such as nitrogen, vacuum, etc. using a hotplate or oven. Accordingly, it is possible to obtain a base layer having a uniform film-forming surface. The calcination temperature is not particularly limited as long as the solvent can be evaporated, but it is preferably carried out at 40 to 250°C.
[무전해 도금처리, 금속도금막, 금속피막기재][Electroless plating treatment, metal plating film, metal film substrate]
상기와 같이 하여 얻어진 기재 상에 형성된 무전해 금속도금의 하지층을 무전해 도금함으로써, 이 하지층의 위에 금속도금막이 형성된다. 이리 하여 얻어지는 금속도금막, 그리고, 기재 상에 무전해 금속도금의 하지층, 금속도금막의 순으로 구비하는 금속피막기재도 본 발명의 대상이다.By electroless plating the base layer of the electroless metal plating formed on the substrate obtained as described above, a metal plating film is formed on the base layer. The metal plating film thus obtained, and a metal coating substrate provided on the substrate in the order of an electroless metal plating base layer and a metal plating film are also objects of the present invention.
무전해 도금처리(공정)는 특별히 한정되지 않고, 일반적으로 알려져 있는 어느 무전해 도금처리로 행할 수 있고, 예를 들어, 종래 일반적으로 알려져 있는 무전해 도금액을 이용하고, 이 도금액(욕)에 기재 상에 형성된 무전해 금속도금의 하지층을 침지하는 방법이 일반적이다.The electroless plating treatment (process) is not particularly limited, and can be performed by any generally known electroless plating treatment. For example, a conventionally generally known electroless plating solution is used, and the plating solution (bath) is described. A method of immersing the underlayer of the electroless metal plating formed thereon is common.
상기 무전해 도금액은, 주로 금속이온(금속염), 착화제, 환원제를 주로 함유하고, 기타 용도에 맞추어 pH조정제, pH완충제, 반응촉진제(제2착화제), 안정제, 계면활성제(도금막에의 광택부여용도, 피처리면의 습윤성 개선용도 등) 등이 적당히 포함되어 이루어진다.The electroless plating solution mainly contains a metal ion (metal salt), a complexing agent, and a reducing agent, and according to other uses, a pH adjuster, a pH buffer, a reaction accelerator (second complexing agent), a stabilizer, a surfactant (for the plating film) The use of glossing, the use of improving the wettability of the surface to be treated, etc.) are included as appropriate.
여기서 무전해 도금에 의해 형성되는 금속도금막에 이용되는 금속으로는, 철, 코발트, 니켈, 구리, 팔라듐, 은, 주석, 백금, 금 및 그들의 합금을 들 수 있고, 목적에 따라 적당히 선택된다.Examples of the metal used for the metal plating film formed by electroless plating include iron, cobalt, nickel, copper, palladium, silver, tin, platinum, gold and alloys thereof, and is appropriately selected according to the purpose.
또한 상기 착화제, 환원제에 대해서도 금속이온에 따라 적당히 선택하면 된다.Moreover, what is necessary is just to select suitably according to the metal ion also about the said complexing agent and a reducing agent.
또한 무전해 도금액은 시판의 도금액을 사용해도 되고, 예를 들어 멜텍스(주)제의 무전해 니켈도금약품(멜플레이트(등록상표) NI시리즈), 무전해 구리도금약품(멜플레이트(등록상표) CU시리즈); 오쿠노제약공업(주)제의 무전해 니켈도금액(ICP니코론(등록상표)시리즈, 톱피에나 650), 무전해 구리도금액(OPC-700 무전해 구리 M-K, ATS아도카퍼 IW, 동 CT, OPC 카퍼(등록상표) AF시리즈, 동 HFS, 동 NCA), 무전해 주석도금액(서브스타 SN-5), 무전해 금도금액(플래시골드 330, 셀프골드 OTK-IT), 무전해 은도금액(무덴실버); 코지마화학약품(주)제의 무전해 팔라듐도금액(팔레트II), 무전해 금도금액(딥G시리즈, NC골드시리즈); 사사키화학약품(주)제의 무전해 은도금액(에스다이어 AG-40); 일본카니젠(주)제의 무전해 니켈도금액(카니젠(등록상표)시리즈, 슈마(등록상표)시리즈, 슈마(등록상표) 카니블랙(등록상표)시리즈), 무전해 팔라듐도금액(S-KPD); 다우케미칼사제의 무전해 구리도금액(큐포짓(등록상표) 카퍼믹스시리즈, 서큐포짓(등록상표)시리즈), 무전해 팔라듐도금액(파라무스(등록상표)시리즈), 무전해 니켈도금액(듀라포짓(등록상표)시리즈), 무전해 금도금액(오로렉트로레스(등록상표)시리즈), 무전해 주석도금액(틴포짓(등록상표)시리즈); 우에무라공업(주)제의 무전해 구리도금액(설캡(등록상표) ELC-SP, 동 PSY, 동 PCY, 동 PGT, 동 PSR, 동 PEA, 동 PMK), 아토텍재팬(주)제의 무전해 구리도금액(프린트건트(등록상표) PV, 동 PVE) 등을 호적하게 이용할 수 있다.In addition, as the electroless plating solution, a commercially available plating solution may be used, for example, an electroless nickel plating chemical manufactured by Meltex Co., Ltd. (Melplate (registered trademark) NI series), an electroless copper plating solution (Melplate (registered trademark)) ) CU series); Electroless nickel plating solution (ICP Nicoron (registered trademark) series, Toppiena 650) manufactured by Okuno Pharmaceutical Co., Ltd., electroless copper plating solution (OPC-700 electroless copper M-K, ATS Adobe Copper IW, Copper CT, OPC Copper (registered trademark) AF Series, Copper HFS, Copper NCA), Electroless Tin Plating (Substar SN-5), Electroless Gold Plating (Flash Gold 330, Self Gold OTK-IT), Electroless Silver Plating ( Muden Silver); Electroless palladium plating solution (Palette II) manufactured by Kojima Chemical Co., Ltd., Electroless gold plating solution (Deep G series, NC Gold series); Electroless silver plating solution manufactured by Sasaki Chemical Co., Ltd. (S-DIA AG-40); Electroless nickel plating solution (Kanizen (registered trademark) series, Schuma (registered trademark) series, Shuma (registered trademark) Kani Black (registered trademark) series) made by Nippon Kanigen Co., Ltd.), electroless palladium plating solution (S) -KPD); Electroless copper plating solution made by Dow Chemical (Qposite (registered trademark) Coppermix series, Circuposite (registered trademark) series), electroless palladium plating solution (Paramus (registered trademark) series), electroless nickel plating solution ( Duraposit (registered trademark) series), electroless gold plating solution (Aurolectrores (registered trademark) series), electroless tin plating solution (Tinposit (registered trademark) series); Electroless copper plating solution manufactured by Uemura Industrial Co., Ltd. (Seolcap (registered trademark) ELC-SP, Copper PSY, Copper PCY, Copper PGT, Copper PSR, Copper PEA, Copper PMK), Atotech Japan Co., Ltd. An electroless copper plating solution (Print Gaunt (registered trademark) PV, Copper PVE) or the like can be suitably used.
상기 무전해 도금공정은, 도금욕의 온도, pH, 침지시간, 금속이온농도, 교반의 유무나 교반속도, 공기·산소의 공급의 유무나 공급속도 등을 조절함으로써, 금속피막의 형성속도나 막두께를 제어할 수 있다.In the electroless plating process, by controlling the temperature, pH, immersion time, metal ion concentration, presence or absence or stirring speed of agitation, the presence or absence or supply rate of air and oxygen of the plating bath, the metal film formation rate or film You can control the thickness.
실시예Example
이하, 실시예를 들어 본 발명을 더욱 상세히 설명하는데, 본 발명은, 이들 실시예로 한정되는 것은 아니다. 한편, 수평균 분자량 및 중량평균 분자량의 측정은 이하와 같다.Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples. In addition, the measurement of a number average molecular weight and a weight average molecular weight is as follows.
[수평균 분자량 및 중량평균 분자량의 측정][Measurement of number average molecular weight and weight average molecular weight]
이하의 합성예에 따라 얻어진 공중합체의 수평균 분자량 및 중량평균 분자량을, 토소(주)제 GPC장치(Shodex컬럼 KD800 및 TOSOH컬럼 TSK-GEL)를 이용하고, 용출용매 N,N-디메틸포름아미드(첨가제로서, 브롬화리튬-수화물(LiBr·H2O)을 10mmol/L(리터)혼합)를 유량 1mL/분으로 컬럼 중에(컬럼온도 40℃) 흘려 용리시킨다는 조건으로 측정하였다. 한편, 하기의 수평균 분자량(이하, Mn이라고 칭한다.) 및 중량평균 분자량(이하, Mw라고 칭한다.)은, 폴리스티렌 환산값으로 표시된다.The number-average molecular weight and weight-average molecular weight of the copolymer obtained according to the following synthesis examples were measured using a GPC apparatus manufactured by Tosoh Corporation (Shodex column KD800 and TOSOH column TSK-GEL), and the elution solvent N,N-dimethylformamide (As an additive, 10 mmol/L (liter) of lithium bromide-hydrate (LiBr·H 2 O) was mixed) was flowed into the column (column temperature 40° C.) at a flow rate of 1 mL/min to elute. In addition, the following number average molecular weight (it is hereafter called Mn.) and weight average molecular weight (it is hereafter called Mw.) are represented by polystyrene conversion value.
이하의 실시예에서 이용하는 약기호의 의미는, 다음과 같다.The meanings of the abbreviations used in the following examples are as follows.
HEA: 2-하이드록시에틸아크릴레이트HEA: 2-hydroxyethyl acrylate
NVA: N-비닐아세트아미드NVA: N-vinylacetamide
GMA: 글리시딜메타크릴레이트GMA: glycidyl methacrylate
사이클로머M100: 3,4-에폭시시클로헥실메틸메타아크릴레이트(다이셀제)Cyclomer M100: 3,4-epoxycyclohexylmethyl methacrylate (manufactured by Daicel)
비스코트3F: 2,2,2-트리플루오로에틸아크릴레이트(오사카유기화학공업제)Viscot 3F: 2,2,2-trifluoroethyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.)
HFIP-M: 헥사플루오로-2-프로필메타크릴레이트(센트랄유리제)HFIP-M: Hexafluoro-2-propyl methacrylate (manufactured by Central Glass)
FAMAC-6: 2-(퍼플루오로헥실)에틸메타크릴레이트(유니마텍제)FAMAC-6: 2-(perfluorohexyl)ethyl methacrylate (manufactured by Unimatech)
AMBN: 2,2’-아조비스-2-메틸부티로니트릴AMBN: 2,2'-azobis-2-methylbutyronitrile
PGME: 프로필렌글리콜모노메틸에테르PGME: propylene glycol monomethyl ether
IPE: 디이소프로필에테르IPE: diisopropyl ether
BL-10: 폴리비닐아세탈 수지(세키스이화학공업사제)BL-10: polyvinyl acetal resin (manufactured by Sekisui Chemical Industry Co., Ltd.)
8KX-127: 아크릴 수지(타이세이파인케미칼사제)8KX-127: Acrylic resin (manufactured by Taisei Fine Chemicals)
[폴리머의 합성][Synthesis of Polymer]
<합성예 1><Synthesis Example 1>
스티렌 2.00g, NVA 1.63g, HEA 2.23g, AMBN 0.29g을 PGME 14.37g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P1). 얻어진 중합체의 Mn은 6,806, Mw는 11,797이었다.2.00 g of styrene, 1.63 g of NVA, 2.23 g of HEA, and 0.29 g of AMBN were dissolved in 14.37 g of PGME, and a polymer solution (solid content concentration of 30% by mass) obtained by reacting at 80 ° C. for 20 hours was added to 500 mL of diethyl ether with stirring. , the polymer was deposited. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P1). The obtained polymer had Mn of 6,806 and Mw of 11,797.
<합성예 2><Synthesis Example 2>
스티렌 2.00g, NVA 1.63g, GMA 2.73g, AMBN 0.32g을 PGME 15.59g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P2). 얻어진 공중합체의 Mn은 6,057, Mw는 8,884이었다.2.00 g of styrene, 1.63 g of NVA, 2.73 g of GMA, and 0.32 g of AMBN were dissolved in 15.59 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80° C. for 20 hours was added while stirring to 500 mL of diethyl ether. Thus, the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P2). Mn of the obtained copolymer was 6,057 and Mw was 8,884.
<합성예 3><Synthesis Example 3>
스티렌 2.00g, NVA 1.63g, 사이클로머M100 3.76g, AMBN 0.37g을 PGME 18.14g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P3). 얻어진 공중합체의 Mn은 5,336, Mw는 8,669이었다.2.00 g of styrene, 1.63 g of NVA, 3.76 g of Cyclomer M100, and 0.37 g of AMBN were dissolved in 18.14 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80°C for 20 hours was stirred in 500 mL of diethyl ether. It was injected while being carried out, and a polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P3). Mn of the obtained copolymer was 5,336, and Mw was 8,669.
<합성예 4><Synthesis Example 4>
스티렌 2.00g, NVA 1.63g, HEA 1.56g, 비스코트3F 0.89g, AMBN 0.30g을 PGME 14.90g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P4). 얻어진 공중합체의 Mn은 7,669, Mw는 16,610이었다.2.00 g of styrene, 1.63 g of NVA, 1.56 g of HEA, 0.89 g of biscoat 3F, and 0.30 g of AMBN were dissolved in 14.90 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80°C for 20 hours was added to diethyl It poured into 500 mL of ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P4). Mn of the obtained copolymer was 7,669, and Mw was 16,610.
<합성예 5><Synthesis Example 5>
스티렌 2.00g, NVA 1.63g, HEA 1.56g, FAMAC-6 2.49g, AMBN 0.38g을 PGME 18.83g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P5). 얻어진 공중합체의 Mn은 6,146, Mw는 13,143이었다.2.00 g of styrene, 1.63 g of NVA, 1.56 g of HEA, 2.49 g of FAMAC-6, and 0.38 g of AMBN were dissolved in 18.83 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80°C for 20 hours was added to diethyl It poured into 500 mL of ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P5). Mn of the obtained copolymer was 6,146, and Mw was 13,143.
<합성예 6><Synthesis Example 6>
스티렌 2.00g, NVA 1.63g, GMA 1.91g, 비스코트3F 0.89g, AMBN 0.32g을 PGME 15.76g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P6). 얻어진 공중합체의 Mn은 6,170, Mw는 10,023이었다.2.00 g of styrene, 1.63 g of NVA, 1.91 g of GMA, 0.89 g of Biscoat 3F, and 0.32 g of AMBN were dissolved in 15.76 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80°C for 20 hours was treated with diethyl It poured into 500 mL of ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P6). Mn of the obtained copolymer was 6,170, and Mw was 10,023.
<합성예 7><Synthesis Example 7>
스티렌 2.00g, NVA 1.63g, GMA 1.91g, HFIP-M 1.36g, AMBN 0.34g을 PGME 16.92g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P7). 얻어진 공중합체의 Mn은 5,257, Mw는 9,324이었다.2.00 g of styrene, 1.63 g of NVA, 1.91 g of GMA, 1.36 g of HFIP-M, and 0.34 g of AMBN were dissolved in 16.92 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80°C for 20 hours was added to diethyl It poured into 500 mL of ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P7). Mn of the obtained copolymer was 5,257, and Mw was 9,324.
<합성예 8><Synthesis Example 8>
스티렌 2.00g, NVA 1.63g, GMA 1.91g, FAMAC-6 2.49g, AMBN 0.40g을 PGME 19.69g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P8). 얻어진 공중합체의 Mn은 4,718, Mw는 8,940이었다.2.00 g of styrene, 1.63 g of NVA, 1.91 g of GMA, 2.49 g of FAMAC-6, and 0.40 g of AMBN were dissolved in 19.69 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80°C for 20 hours was added to diethyl It poured into 500 mL of ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P8). Mn of the obtained copolymer was 4,718, and Mw was 8,940.
<합성예 9><Synthesis Example 9>
스티렌 2.00g, NVA 1.63g, 사이클로머M100 2.64g, 비스코트3F 0.89g, AMBN 0.36g을 PGME 17.54g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P9). 얻어진 공중합체의 Mn은 6,558, Mw는 10,706이었다.2.00 g of styrene, 1.63 g of NVA, 2.64 g of Cyclomer M100, 0.89 g of Biscoat 3F, and 0.36 g of AMBN were dissolved in 17.54 g of PGME, and a copolymer solution obtained by reacting at 80° C. for 20 hours (solid content concentration: 30 mass%) was It poured into 500 mL of diethyl ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P9). Mn of the obtained copolymer was 6,558, and Mw was 10,706.
<합성예 10><Synthesis Example 10>
스티렌 2.00g, NVA 1.63g, 사이클로머M100 2.64g, HFIP-M 1.36g, AMBN 0.38g을 PGME 18.70g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P10). 얻어진 공중합체의 Mn은 5,021, Mw는 8,277이었다.2.00 g of styrene, 1.63 g of NVA, 2.64 g of Cyclomer M100, 1.36 g of HFIP-M, and 0.38 g of AMBN were dissolved in 18.70 g of PGME, and a copolymer solution obtained by reacting at 80° C. for 20 hours (solid content concentration of 30 mass%) was It poured into 500 mL of diethyl ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P10). The obtained copolymer had Mn of 5,021 and Mw of 8,277.
<합성예 11><Synthesis Example 11>
스티렌 2.00g, NVA 1.63g, 사이클로머M100 2.64g, FAMAC-6 2.49g, AMBN 0.44g을 PGME 21.47g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P11). 얻어진 공중합체의 Mn은 4,842, Mw는 7,853이었다.2.00 g of styrene, 1.63 g of NVA, 2.64 g of Cyclomer M100, 2.49 g of FAMAC-6, and 0.44 g of AMBN were dissolved in 21.47 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80°C for 20 hours was added. It poured into 500 mL of diethyl ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P11). Mn of the obtained copolymer was 4,842, and Mw was 7,853.
<합성예 12><Synthesis Example 12>
스티렌 2.00g, NVA 1.63g, 사이클로머M100 1.88g, 비스코트3F 1.48g, AMBN 0.35g을 PGME 17.14g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P12). 얻어진 공중합체의 Mn은 6,592, Mw는 10,717이었다.2.00 g of styrene, 1.63 g of NVA, 1.88 g of Cyclomer M100, 1.48 g of Biscoat 3F, and 0.35 g of AMBN were dissolved in 17.14 g of PGME, and a copolymer solution obtained by reacting at 80° C. for 20 hours (solid content concentration of 30% by mass) was It poured into 500 mL of diethyl ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P12). Mn of the obtained copolymer was 6,592, and Mw was 10,717.
<합성예 13><Synthesis Example 13>
스티렌 2.00g, NVA 1.63g, 사이클로머M100 1.88g, FAMAC-6 4.15g, AMBN 0.48g을 PGME 23.69g에 용해하고, 80℃에서 20시간 반응시킴으로써 얻어진 공중합체용액(고형분농도 30질량%)을 디에틸에테르 500mL에 교반하면서 투입하여, 폴리머를 석출시켰다. 석출한 폴리머를 감압여과하고, 50℃에서 진공건조하여, 공중합체분말을 얻었다(P13). 얻어진 공중합체의 Mn은 5,814, Mw는 8,518이었다.2.00 g of styrene, 1.63 g of NVA, 1.88 g of Cyclomer M100, 4.15 g of FAMAC-6, and 0.48 g of AMBN were dissolved in 23.69 g of PGME, and a copolymer solution (solid content concentration of 30% by mass) obtained by reacting at 80° C. for 20 hours was added. It poured into 500 mL of diethyl ether while stirring, and the polymer was precipitated. The precipitated polymer was filtered under reduced pressure and vacuum dried at 50° C. to obtain a copolymer powder (P13). Mn of the obtained copolymer was 5,814, and Mw was 8,518.
[Pd입자 복합체의 합성][Synthesis of Pd particle complex]
<합성예 14><Synthesis Example 14>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 1에서 중합한 P1 1.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving 1.0 g of P1 polymerized in Synthesis Example 1 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. The mixture was stirred at 60 DEG C under a nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M1) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M1) as a black powder.
<합성예 15><Synthesis Example 15>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 2에서 중합한 P2 1.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving 1.0 g of P2 polymerized in Synthesis Example 2 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. The mixture was stirred at 60 DEG C under a nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M2) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M2) as a black powder.
<합성예 16><Synthesis Example 16>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 3에서 중합한 P31.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P31.0 g polymerized in Synthesis Example 3 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. The mixture was stirred at 60 DEG C under a nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M3) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M3) as a black powder.
<합성예 17><Synthesis Example 17>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 4에서 중합한 P4 1.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving 1.0 g of P4 polymerized in Synthesis Example 4 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. The mixture was stirred at 60 DEG C under a nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M4) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M4) as a black powder.
<합성예 18><Synthesis Example 18>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 5에서 중합한 P5 1.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving 1.0 g of P5 polymerized in Synthesis Example 5 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. This mixture was stirred at 60 DEG C under nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M5) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M5) as a black powder.
<합성예 19><Synthesis Example 19>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 6에서 중합한 P61.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P61.0 g polymerized in Synthesis Example 6 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. The mixture was stirred at 60 DEG C under a nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M6) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M6) as a black powder.
<합성예 20><Synthesis Example 20>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 7에서 중합한 P71.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P71.0 g polymerized in Synthesis Example 7 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. The mixture was stirred at 60 DEG C under a nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M7) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M7) as a black powder.
<합성예 21><Synthesis Example 21>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 8에서 중합한 P81.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P81.0 g polymerized in Synthesis Example 8 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. This mixture was stirred at 60 DEG C under nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M8) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M8) as a black powder.
<합성예 22><Synthesis Example 22>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 9에서 중합한 P91.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P91.0 g polymerized in Synthesis Example 9 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. The mixture was stirred at 60 DEG C under a nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M9) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M9) as a black powder.
<합성예 23><Synthesis Example 23>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 10에서 중합한 P101.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P101.0 g polymerized in Synthesis Example 10 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. The mixture was stirred at 60 DEG C under a nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M10) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M10) as a black powder.
<합성예 24><Synthesis Example 24>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 11에서 중합한 P111.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P111.0 g polymerized in Synthesis Example 11 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. This mixture was stirred at 60 DEG C under nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M11) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M11) as a black powder.
<합성예 25><Synthesis Example 25>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 12에서 중합한 P121.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P121.0 g polymerized in Synthesis Example 12 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. This mixture was stirred at 60 DEG C under nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M12) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M12) as a black powder.
<합성예 26><Synthesis Example 26>
냉각기를 설치한 100mL의 반응플라스크에, 아세트산팔라듐[와코순약(주)제] 0.90g 및 클로로포름 9.10g을 투입하고, 균일해질 때까지 교반하였다. 이 용액에, 합성예 13에서 중합한 P131.0g을 클로로포름 16.40g, 에탄올 6.40g에 용해시킨 용액을, 적하깔때기를 사용하여 첨가하였다. 이 혼합물을, 질소분위기하 60℃에서 8시간 교반하였다.To a 100 mL reaction flask equipped with a condenser, 0.90 g of palladium acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 9.10 g of chloroform were added, and stirred until uniform. To this solution, a solution obtained by dissolving P131.0 g polymerized in Synthesis Example 13 in 16.40 g of chloroform and 6.40 g of ethanol was added using a dropping funnel. This mixture was stirred at 60 DEG C under nitrogen atmosphere for 8 hours.
액온 30℃까지 냉각 후, 이 용액을 IPE/헥산용액(질량비 10:1) 341g에 교반하면서 투입하여, 폴리머/Pd입자 복합체를 석출시켰다. 석출한 폴리머/Pd입자 복합체를 감압여과하고, 50℃에서 진공건조하여, Pd입자의 복합체(M13) 0.9g을 흑색분말로서 얻었다.After cooling to a liquid temperature of 30°C, this solution was added to 341 g of an IPE/hexane solution (mass ratio of 10:1) while stirring to precipitate a polymer/Pd particle composite. The precipitated polymer/Pd particle composite was filtered under reduced pressure and vacuum dried at 50° C. to obtain 0.9 g of a Pd particle composite (M13) as a black powder.
상기 Pd입자의 복합체 M1~M13에, (C)성분 및 (D)성분을 하기 표 1과 같은 비율로 첨가하고, 무전해 도금 하지제를 작성하였다. M1~M3을 각각 포함하는 무전해 도금 하지제는 비교예로 한다. M4~M13을 각각 포함하는 무전해 도금 하지제는 실시예로 한다.To the composites M1 to M13 of the Pd particles, component (C) and component (D) were added in the proportions shown in Table 1 below to prepare an electroless plating brush. The electroless plating brush agent containing each of M1 to M3 is set as a comparative example. An electroless plating brush containing each of M4 to M13 is used as an example.
[표 1][Table 1]
[도금액의 조제][Preparation of plating solution]
<조제예 1><Preparation Example 1>
200mL 비커에 순수 100mL, 베이직 프린트건트V(Atotech제) 17mL, 카퍼솔루션 프린트건트V(Atotech제) 9mL, 스타터 프린트건트PV(Atotech제) 1.6mL, 스태이빌라이저 프린트건트PV(Atotech제) 0.24mL, 리듀서Cu(Atotech제) 3.2mL, 18.5질량% NaOH수용액 4mL를 투입하고, 추가로 순수를 첨가하여 용액의 총량을 200mL로 하였다. 이 용액을 교반하여, 무전해 구리도금액으로 하였다.100 mL of pure water in a 200 mL beaker, Basic Print Gaunt V (manufactured by Atotech) 17 mL, Copper Solution Print Gaunt V (manufactured by Atotech) 9 mL, Starter Print Gaunt PV (manufactured by Atotech) 1.6 mL, Stabilizer Print Gaunt PV (manufactured by Atotech) 0.24 mL, 3.2 mL of reducer Cu (manufactured by Atotech), and 4 mL of an 18.5 mass % NaOH aqueous solution were added, and pure water was further added to make the total amount of the solution 200 mL. This solution was stirred to prepare an electroless copper plating solution.
[도금석출성의 평가][Evaluation of plating precipitation]
폴리이미드(도레이·듀폰주식회사제 캡톤 100EN(등록상표)) 기재에 대하여, 실시예 1 내지 실시예 10 그리고 비교예 1 내지 비교예 6의 각 무전해 도금 하지제를 막두께 6μm로 바코트도포한 후, 80℃에서 5분간 가열함으로써 도막을 형성하였다. 이 도막을 추가로 250℃에서 30분간 가열함으로써 건조시켰다. 얻어진 막을 조제예 1에서 조제한 무전해 구리도금액에 10분간 침지하였다. 그 후, 얻어진 도금기재를 수세한 후, 금속도금막의 상태를 육안으로 평가하였다. 평가결과는, 나중에 표 2에 정리하여 나타낸다.On a polyimide (Kapton 100EN (registered trademark) manufactured by Toray DuPont Co., Ltd.) substrate, each of the electroless plating base agents of Examples 1 to 10 and Comparative Examples 1 to 6 were bar-coated to a film thickness of 6 μm. Then, a coating film was formed by heating at 80 degreeC for 5 minutes. This coating film was further dried by heating at 250 degreeC for 30 minutes. The obtained film was immersed in the electroless copper plating solution prepared in Preparation Example 1 for 10 minutes. Thereafter, after the obtained plating substrate was washed with water, the state of the metal plating film was visually evaluated. An evaluation result is put together in Table 2 and shown later.
<도금석출성의 평가기준><Evaluation Criteria for Plating Precipitation>
○: 도막 전체면에 균일하게 도금이 석출되어 있다.○: Plating is uniformly deposited on the entire surface of the coating film.
×: 도막 전체면에 균일하게 도금이 석출되어 있지 않다.x: Plating is not uniformly deposited on the entire surface of the coating film.
[표 2][Table 2]
표 2에 나타낸 바와 같이, 실시예 1 내지 실시예 13의 무전해 도금 하지제, 비교예 1 내지 비교예 3의 무전해 도금 하지제는 도금석출성이 양호하였다. 한편, 비교예 4 내지 비교예 7의 무전해 도금 하지제는 도금의 석출을 확인할 수는 없었다.As shown in Table 2, the electroless plating brushing agents of Examples 1 to 13 and the electroless plating brushing agents of Comparative Examples 1 to 3 had good plating precipitation properties. On the other hand, the electroless plating brush agent of Comparative Examples 4 to 7 could not confirm the precipitation of the plating.
Claims (21)
(A)분자 내에 적어도 1개의 트리플루오로메틸기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머a에서 유래하는 구성단위와, 분자 내에 금속분산성기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머b에서 유래하는 구성단위를 포함하는 공중합체,
(B)금속미립자, 및
(C)용제
를 포함하는 하지제.An electroless plating base agent for forming a metal plating film on a substrate by electroless plating, comprising:
(A) A structural unit derived from a monomer a having at least one trifluoromethyl group and one radically polymerizable double bond in a molecule, and a monomer b having a metal dispersible group and one radically polymerizable double bond in the molecule A copolymer comprising a constituent unit,
(B) metal particles, and
(C) Solvent
a laxative containing
상기 (A)공중합체 중의 금속분산성기에, 상기 (B)금속미립자가 부착 또는 배위한 복합체를 포함하는, 하지제.According to claim 1,
A brush agent comprising a complex in which the (B) metal fine particles are attached or coordinated to the metal dispersible group in the (A) copolymer.
상기 모노머a가, 비닐기 및 (메트)아크릴로일기 중 어느 일방을 갖는 화합물인, 하지제.3. The method of claim 1 or 2,
The said monomer a is a compound which has either a vinyl group and a (meth)acryloyl group, The brush agent.
상기 모노머a가, 아래 식(1)로 표시되는 화합물인 하지제.
[화학식 1]
(식(1) 중, M은, 단결합, 카르보닐옥시기, 아미드기 또는 페닐렌기를 나타내고, J는, 적어도 1개의 트리플루오로메틸기를 갖는 탄소원자수 1 내지는 10의 직쇄 또는 분지구조의 알킬기를 나타내고, R6은 수소원자 또는 탄소원자수 1 내지 4의 알킬기를 나타낸다.)4. The method of claim 3,
A brush agent wherein the monomer a is a compound represented by the following formula (1).
[Formula 1]
(In formula (1), M represents a single bond, a carbonyloxy group, an amide group or a phenylene group, and J is a C1-C10 linear or branched alkyl group having at least one trifluoromethyl group. and R 6 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.)
상기 모노머b가, 비닐기 및 (메트)아크릴로일기 중 어느 일방을 갖는 화합물인, 하지제.3. The method of claim 1 or 2,
The brush agent in which the said monomer b is a compound which has any one of a vinyl group and a (meth)acryloyl group.
상기 모노머b가, 아래 식(2) 또는 (3)으로 표시되는 화합물인 하지제.
[화학식 2]
(식(2) 중, R1은, 수소원자 또는 탄소원자수 1 내지 6의 알킬기를 나타내고, L은, O 또는 N을 나타내고, R2는, L이 N을 나타내는 경우에만 존재하고, 수소원자를 나타내거나, 또는, R1 및 R2는, 그들이 결합하는 원자와 하나가 되어, 4 내지 6원의 환상 아미드를 형성할 수도 있다.
식(3) 중, R3은 수소원자 또는 메틸기를 나타내고, R4는 수소원자 또는 탄소원자수 1 내지 10의 분지할 수도 있는 알킬기, 탄소원자수 1 내지 10의 분지할 수도 있는 알콕실기 또는, 탄소원자수 1 내지 10의 분지할 수도 있는 알콕실알킬기를 나타내고, L은, O 또는 N을 나타내고, R5는, L이 N을 나타내는 경우에만 존재하고, 수소원자를 나타내거나, 또는, R4 및 R5는, 그들이 결합하는 원자와 하나가 되어, 4 내지 6원의 환상 아미드, 또는, 4 내지 6원의 환상 이미드를 형성할 수도 있다.)6. The method of claim 5,
A brush agent wherein the monomer b is a compound represented by the following formula (2) or (3).
[Formula 2]
(In formula (2), R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, L represents O or N, R 2 is present only when L represents N, and a hydrogen atom is Alternatively, R 1 and R 2 may become one with the atom to which they are bonded to form a 4 to 6 membered cyclic amide.
In formula (3), R 3 represents a hydrogen atom or a methyl group, R 4 represents a hydrogen atom or an optionally branched alkyl group having 1 to 10 carbon atoms, an optionally branched alkoxyl group having 1 to 10 carbon atoms, or the number of carbon atoms 1 to 10 optionally branched alkoxylalkyl group, L represents O or N, R 5 is present only when L represents N and represents a hydrogen atom, or R 4 and R 5 may become one with the atom to which they are bonded to form a 4 to 6 membered cyclic amide or a 4 to 6 membered cyclic imide.)
상기 모노머b가 N-비닐피롤리돈, N-비닐아세트아미드 또는 N-비닐포름아미드인 하지제.7. The method of claim 6,
A brush agent wherein the monomer b is N-vinylpyrrolidone, N-vinylacetamide or N-vinylformamide.
상기 (A)공중합체를 부여하는 모노머 혼합물은, 상기 모노머b의 몰수에 대하여 5~500%의 몰수가 되는 양의 상기 모노머a를 포함하는, 하지제.8. The method according to any one of claims 1 to 7,
The (A) monomer mixture to which the copolymer is imparted contains the monomer a in an amount of 5 to 500% of moles based on the number of moles of the monomer b.
상기 공중합체(A)가, 분자 내에 가교성기 및 1개의 라디칼 중합성 이중결합을 갖는 모노머c에서 유래하는 구성단위를 추가로 포함하는 하지제.9. The method according to any one of claims 1 to 8,
A brush agent in which the copolymer (A) further contains a structural unit derived from a monomer c having a crosslinkable group and one radically polymerizable double bond in the molecule.
상기 모노머c가, 비닐기 및 (메트)아크릴로일기 중 어느 일방을 갖는 화합물인, 하지제.10. The method of claim 9,
The said monomer c is a compound which has either a vinyl group and a (meth)acryloyl group, The brush agent.
상기 모노머c가, 아래 식(4)로 표시되는 화합물인 하지제.
[화학식 3]
(식(4) 중, X는, 단결합, 카르보닐옥시기, 아미드기 또는 페닐렌기를 나타내고, Y는 탄소원자수 1 내지 6의 알킬렌기, 탄소원자수 1 내지 6의 옥시알킬렌기, 분지할 수도 있는 탄소원자수 1 내지 6의 알킬에테르기, 탄소원자수 1 내지 6의 티오알킬렌기 또는 탄소원자수 1 내지 6의 티오알킬에테르기를 나타내고, Z는, 가교성기를 나타내고, R7은 수소원자 또는 탄소원자수 1 내지 4의 알킬기를 나타낸다.)11. The method of claim 10,
A brush agent wherein the monomer c is a compound represented by the following formula (4).
[Formula 3]
(In formula (4), X represents a single bond, a carbonyloxy group, an amide group or a phenylene group, Y is an alkylene group having 1 to 6 carbon atoms, an oxyalkylene group having 1 to 6 carbon atoms, or branched represents an alkylether group having 1 to 6 carbon atoms, a thioalkylene group having 1 to 6 carbon atoms or a thioalkyl ether group having 1 to 6 carbon atoms, Z represents a crosslinkable group, R 7 is a hydrogen atom or 1 carbon atom to 4 alkyl groups.)
상기 (A)공중합체를 부여하는 모노머 혼합물은, 상기 모노머b의 몰수에 대하여 5~300%의 몰수가 되는 양의 상기 모노머c를 포함하는, 하지제.12. The method according to any one of claims 9 to 11,
The (A) monomer mixture to which the copolymer is imparted contains the monomer c in an amount of 5 to 300% of moles based on the number of moles of the monomer b.
상기 (B)금속미립자가, 철(Fe), 코발트(Co), 니켈(Ni), 구리(Cu), 팔라듐(Pd), 은(Ag), 주석(Sn), 백금(Pt) 및 금(Au)으로 이루어지는 군으로부터 선택되는 적어도 1종의 금속의 미립자인, 하지제.13. The method according to any one of claims 1 to 12,
The (B) metal fine particles are iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), tin (Sn), platinum (Pt) and gold ( A brush agent, which is a fine particle of at least one metal selected from the group consisting of Au).
상기 (B)금속미립자가, 팔라듐미립자인, 하지제.14. The method of claim 13,
The brush agent, wherein the (B) metal fine particles are palladium fine particles.
상기 (B)금속미립자가, 1~100nm의 1차입자 평균입경을 갖는 미립자인, 하지제.15. The method according to any one of claims 1 to 14,
The (B) metal fine particles are fine particles having an average primary particle diameter of 1 to 100 nm, a brush agent.
(D)비라디칼 중합성 가교성기를 추가로 갖는 베이스 수지를 함유하는 하지제.16. The method according to any one of claims 1 to 15,
(D) A brush agent containing a base resin further having a non-radically polymerizable crosslinkable group.
(E)가교제를 추가로 함유하는 하지제.17. The method according to any one of claims 1 to 16,
(E) A brush agent further containing a crosslinking agent.
(1)공정: 제1항 내지 제17항 중 어느 한 항에 기재된 무전해 도금 하지제를 기재 상에 도포하고, 무전해 금속도금의 하지층을 이 기재의 위에 형성하는 공정,
(2)공정: 이 하지층을 형성한 기재를 무전해 도금욕에 침지하고, 금속도금막을 이 하지층의 위에 형성하는 공정A method for producing a metal coating substrate, comprising the following steps (1) and (2).
(1) Step: A step of applying the electroless plating base material according to any one of Items 1 to 17 on a base material, and forming a base layer of electroless metal plating on the base material;
(2) Step: A step of immersing the substrate on which the underlayer is formed in an electroless plating bath, and forming a metal plating film on the underlayer
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CN115135803B (en) | 2024-06-28 |
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