KR20220140072A - Two-dimensional optical fiber array substrate for light-cured 3D printer and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a 2D optical fiber array substrate for a light-cured 3D printer and a manufacturing method thereof. According to the present invention, a manufacturing method of a 2D optical fiber array substrate includes the steps of: preparing a substrate in which holes with double diameters are formed in a two-dimensional array; inserting an optical fiber, which includes a portion of the optical fiber coated to fit the diameter of the hole and a portion of the optical fiber with the coating removed, from the top to the bottom of the substrate; and applying adhesive so that the substrate and the optical fiber are fixed. Therefore, when constructing a light source of a 3D printer using light emitting diodes, light can be transmitted while preventing light spreading of the light emitting diodes.

Description

Two-dimensional optical fiber array substrate for light-cured 3D printer and manufacturing method thereof

The present invention relates to an optical fiber array substrate, and more particularly, to a two-dimensional optical fiber array substrate for a light-curing type 3D printer comprising a two-dimensional optical fiber array for use as a light source of a light-curing type 3D printer, and a method for manufacturing the same.

Recently, with the development of light-emitting diode technology, attempts have been made to arrange light-emitting diodes in one or two dimensions and apply them to the field of light-curing 3D printers.

For example, in a conventional one-dimensional optical fiber array, a V-groove arrangement is formed on a silica or silicon substrate as shown in FIG. 1 (FIG. 1a), and an optical fiber A with a peeled coating is seated in the V-groove (FIG. 1b) with an adhesive After (B) is applied (FIG. 1c), a cover (C) is attached thereon to manufacture (FIG. 1D). However, this method has problems in that the manufacturing process is complicated and it is difficult to manufacture multilayers for a two-dimensional arrangement.

The conventional two-dimensional optical fiber array forms an array of holes (D) on the substrate as shown in Figure 2 (Figure 2a), and inserts the optical fiber (A) with the peeled coating into the hole (D) (Figure 2b), then the adhesive (B) ) (Fig. 2c). However, in this method, since the size of the hole D must be increased in consideration of the area of the adhesive B, it is difficult to minimize the distance between the optical fibers A, and the hole D is manufactured to have one diameter as shown in the cross-sectional view of FIG. 2D. There is a problem in that it is difficult to align the center of the optical fiber (A) with the lower coating peeled off and the center of the hole (D).

Korean Patent Publication No. 10-0379389 (200.04.10.)

The technical problem to be achieved by the present invention is to produce a two-dimensional optical fiber array in a two-dimensional form that can transmit light while preventing the light spreading of the light emitting diode when configuring the light source of a 3D printer using a light emitting diode. An object of the present invention is to provide an optical fiber array substrate and a method for manufacturing the same.

Another technical problem to be achieved by the present invention is to provide a two-dimensional optical fiber array substrate for a light-curing type 3D printer and a method for manufacturing the same, which secures the ease of manufacturing a two-dimensional optical fiber array, horizontal/vertical alignment, and mechanical reliability. .

A method for manufacturing a two-dimensional optical fiber array substrate for a light-curing 3D printer according to the present invention comprises the steps of preparing a substrate in which double-diameter holes are formed in a two-dimensional array, an optical fiber portion coated to fit the diameter of the hole, and and inserting an optical fiber including a portion of the optical fiber having the coating peeled off from the top of the substrate in a downward direction, and applying an adhesive to fix the substrate and the optical fiber.

In addition, after the step of applying, it characterized in that it further comprises the step of polishing the lower portion of the substrate in line with a polishing line (polishing line).

In addition, before the applying step, it characterized in that it further comprises the step of forming an adhesive dam that prevents the adhesive from flowing due to the application.

In addition, the forming step is characterized in that between the preparing step and the inserting step, the adhesive dam is formed by fixing a mechanism to an edge of the upper surface of the substrate.

In addition, in the forming step, between the inserting step and the applying step, a plurality of films attachable to the edge of the upper surface of the substrate are laminated to form the adhesive dam.

In addition, between the preparing and the inserting step, it characterized in that it further comprises the step of attaching a vertical alignment block provided with a concave groove on the flat plate so that the groove faces the lower portion of the substrate.

In addition, the preparing may include forming a counter sink at an inlet of a hole formed in a downward direction of the substrate.

In addition, the inserting step is characterized in that the portion of the optical fiber from which the coating has been peeled is excessively penetrated to be accommodated in the groove.

In addition, the preparing may include forming a plate-shaped hole at an inlet of a first diameter hole formed in an upward direction of the substrate and an inlet of a second diameter hole smaller than the first diameter hole, respectively.

A two-dimensional optical fiber array substrate for a light-curing type 3D printer according to the present invention includes a substrate in which double-diameter holes are formed in a two-dimensional array, a coated optical fiber part and a coated optical fiber part, and the coated optical fiber part and the coating and an optical fiber inserted into the hole to fit the diameter of the stripped optical fiber portion, and an adhesive for fixing the substrate and the optical fiber.

The substrate also includes a first diameter hole for accommodating the coated optical fiber portion and a second diameter hole smaller in diameter than the first diameter hole and formed underneath and for receiving the coated optical fiber portion.

In addition, the substrate, characterized in that the plate-shaped hole is formed in at least one of the inlet of the first diameter hole, the inlet of the second diameter hole, and the inlet of the hole formed in the downward direction of the substrate.

A two-dimensional optical fiber array substrate for a light-curing 3D printer of the present invention and a method for manufacturing the same are used as a light source of a light-curing 3D printer by inserting a coated optical fiber part and a coated optical fiber part into a double-structured hole having a different diameter. It is possible to manufacture a two-dimensional optical fiber array substrate for

Through this, the present invention can easily fabricate a two-dimensional optical fiber array, minimize the spacing between the arrays, and at the same time facilitate the horizontal alignment of the hole of the substrate and the center of the optical fiber and the vertical alignment of the end of the optical fiber.

In addition, by forming an adhesive dam on the upper surface of the substrate to prevent the neck from breaking of the optical fiber, mechanical reliability can be improved.

1 is a view for explaining a process of manufacturing a conventional one-dimensional optical fiber array substrate.
2 is a view for explaining a process of manufacturing a conventional two-dimensional optical fiber array substrate.
3 is a view for explaining a double-diameter hole structure and a conventional single-diameter hole structure according to the first embodiment of the present invention.
4 is a view for explaining a double-diameter hole structure including a plate-shaped hole according to a second embodiment of the present invention.
5 to 8 are diagrams for explaining a process of manufacturing a two-dimensional optical fiber array substrate according to a second embodiment of the present invention.
9 is a view for explaining a two-dimensional optical fiber array substrate according to a third embodiment of the present invention.
10 is a view for explaining a double-diameter hole structure including a plate-shaped hole according to a fourth embodiment of the present invention.
11 is a view for explaining a two-dimensional optical fiber array substrate according to a fourth embodiment of the present invention.
12 is a flowchart illustrating a method of manufacturing a two-dimensional optical fiber array substrate according to the first embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated in different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function is obvious to those skilled in the art or may obscure the gist of the present invention, the detailed description thereof will be omitted.

3 is a view for explaining a double-diameter hole structure and a conventional single-diameter hole structure according to the first embodiment of the present invention, and FIG. 4 is a double-diameter hole including a dish-shaped hole according to the second embodiment of the present invention. It is a drawing for explaining the structure.

Referring to FIGS. 3 and 4 , the substrate 10a serves as a base of the two-dimensional optical fiber array substrate. The two-dimensional array holes H are formed, and may be made of a material such as silicon, glass, or quartz. have. In this case, the substrate 10a may form the holes H in a predetermined pattern, and preferably, the holes H may be formed in a checkerboard arrangement. Here, the holes (H) constituting the two-dimensional array have a double diameter.

In detail, the hole H may be manufactured with a double diameter in consideration of the diameter of the coated optical fiber portion and the coated optical fiber portion of the optical fiber. The hole H comprises a first diameter hole 11 and a second diameter hole 12, the first diameter hole 11 receiving a coated optical fiber portion, and the second diameter hole 12 being coated Accommodates the stripped fiber optic portion. In this case, the second diameter hole 12 has a smaller diameter than the first diameter hole 11 and is formed under the first diameter hole 11 . In general, the coated optical fiber portion is 250 μm in diameter, and the coated optical fiber portion is 125 μm, so the diameter of the first diameter hole 11 is 250 to 260 μm, and the diameter of the second diameter hole 12 is It can be formed in 125 ~ 135㎛. On the other hand, the substrate 10a easily aligns the centers of the optical fiber and the hole H in the horizontal direction through the double-diameter structure, so that the center of the hole D and the optical fiber, which is a problem that occurs in the conventional single-diameter hole structure ( FIG. 3A ). It can solve the difficulty of aligning the light and outputting the light to the correct position.

In addition, the substrate 10a may be formed as a substrate 10b in which an optical fiber and a substrate are easily assembled by further forming a counter sink. That is, the substrate 10b may form the first plate-shaped hole 13 at the inlet of the first diameter hole 11 . At this time, the substrate 10b also forms the second dish-shaped hole 14 at the entrance of the second diameter hole 12, thereby preventing the optical fiber from being caught in the portion where the hole (H) diameter is changed during the optical fiber insertion process. make assembly easier.

5 to 8 are diagrams for explaining a process of manufacturing a two-dimensional optical fiber array substrate according to a second embodiment of the present invention.

3 to 8 , the two-dimensional optical fiber array substrate 100 is used as a light source of a 3D printer using a light emitting diode. At this time, the two-dimensional optical fiber array substrate 100 may transmit light while preventing the light emitting diode from spreading. The two-dimensional optical fiber array substrate 100 includes a substrate 10b, optical fibers 30 and 40, and an adhesive 50, and may be manufactured by performing the following process.

First, the substrate 10b is prepared in a two-dimensional array of holes H having a double diameter (FIG. 5). Here, the hole H includes the first diameter hole 11 and the second diameter hole 12 , and a plate-shaped hole is formed at the inlet of the first diameter hole 11 and the inlet of the second diameter hole 12 . do. Through this, the substrate 10b allows the optical fibers 30 and 40 to be easily inserted.

When the preparation of the substrate 10b is completed, an adhesive dam 20 is formed on the upper surface of the substrate 10b (FIG. 6). The adhesive dam 20 may be a dam for preventing the applied adhesive 50 from flowing down in a later process. The adhesive dam 20 can effectively trap the adhesive 50 for a period of time for the adhesive 50 to permeate through the double-diameter hole H. Here, the adhesive dam 20 may be formed by fixing a separate device such as a wall to the edge of the upper surface of the substrate 10b before inserting the optical fibers 30 and 40 ( FIG. 6 ), but the present invention is not limited thereto. After inserting (30, 40), it may be formed by laminating a plurality of films capable of being attached, such as a tape, on the edge of the upper surface of the substrate 10b.

When the adhesive dam 20 is formed on the substrate 10b, the optical fibers 30 and 40 are inserted into the hole H of the substrate 10b. Here, the optical fibers 30 , 40 include a stripped optical fiber portion 30 and a coated optical fiber portion 40 . At this time, the optical fiber portion 30 of which the coating is peeled may be silica, and has a diameter smaller than that of the coated optical fiber portion 40 by the coating thickness. Typically, the diameter of the coated optical fiber portion is 250 μm, and the uncoated optical fiber portion is 125 μm. As for the optical fibers 30 and 40, the coated optical fiber portion 30 is inserted into the first diameter hole 11, and the coated optical fiber portion 40 is inserted into the second diameter hole 12 (FIG. 7). Here, the optical fibers 30 and 40 are inserted from the top to the bottom of the substrate 10b.

When the optical fibers 30 and 40 are inserted into the substrate 10b, an adhesive 50 is applied to the top of the substrate 10b to fix the substrate 10b and the optical fibers 30 and 40 (FIG. 8A). The adhesive 50 is filled to a predetermined thickness while surrounding the inserted optical fibers 30 and 40, and the adhesive dam 20 surrounds the filled optical fibers 30 and 40, thereby improving the neck-breaking phenomenon of the optical fibers 30 and 40. In addition, as the substrate 10b and the optical fibers 30 and 40 are fixed through the adhesive 50, the center of the optical fibers 30 and 40 and the center of the hole H can be easily aligned (FIG. 8B). . Here, when the adhesive has low viscosity, it can quickly permeate into the hole H of the substrate 10b when applied.

Finally, the adhesive 50 is applied, and when the applied adhesive 50 is cured, the lower portion of the substrate 10b is polished in line with a polishing line.

9 is a view for explaining a two-dimensional optical fiber array substrate according to a third embodiment of the present invention.

8 and 9 , the two-dimensional optical fiber array substrate 200 is formed between the process of preparing the substrate 10b and the process of inserting the optical fibers 30 and 40 during the manufacturing process of the two-dimensional optical fiber array substrate 100 . It is manufactured by further using a vertical alignment block (60).

In detail, the vertical alignment block 60 is provided with a concave groove in a flat plate formed on a flat surface. In this case, the groove may have a flat bottom surface. The vertical alignment block 60 is attached so that the groove faces the lower portion of the substrate 10b, and the optical fibers 30 and 40 are inserted after the vertical alignment block 60 is attached. Through this, the optical fiber portion 30 of which the coating has been peeled is excessively penetrated 35 to be accommodated in the groove of the vertical alignment block 60 . Preferably, the optical fiber 30 of which the coating has been peeled may be excessively penetrated 35 up to the bottom surface of the groove.

When the optical fiber portion 30 of which the coating has been peeled is excessively penetrated (35), an adhesive 50 is applied, and the applied adhesive 50 permeates to the vertical alignment block 60 to the substrate 10b and the optical fibers 30 and 40. completely adhered.

After the adhesive 50 is cured, a polishing process is performed on the optical fiber portion 30 and the cured adhesive 50 in which the excessively penetrated coating is peeled in line with the polishing line. Through this, the two-dimensional optical fiber array substrate 200 can easily align the ends of the optical fiber part 30 from which the coating is peeled in the vertical direction.

10 is a view for explaining a double diameter hole structure including a plate-shaped hole according to a fourth embodiment of the present invention, Figure 11 is for explaining a two-dimensional optical fiber array substrate according to the fourth embodiment of the present invention It is a drawing.

9 to 11 , the two-dimensional optical fiber array substrate 300 changes the substrate 10b into the substrate 10c in the process of preparing the substrate 10b during the manufacturing process of the two-dimensional optical fiber array substrate 200 . is produced by

The substrate 10c additionally forms a third plate-shaped hole 15 at the inlet of the hole formed in the downward direction of the substrate 10b. That is, the substrate 10c includes a first plate-shaped hole 13 , a second plate-shaped hole 14 , and a third plate-shaped hole 15 . Here, the third plate-shaped hole 15 may secure a space through which the applied adhesive 50 may permeate.

Through this, the two-dimensional optical fiber array substrate 300 is completely adhered to the lower portion of the substrate 10c by the optical fiber portion 30 of which the coating has been peeled off and the adhesive 50 to which the substrate 10c is applied, so that the two-dimensional optical fiber is formed. A more stable polishing process may be performed than the array substrate 200 .

12 is a flowchart illustrating a method of manufacturing a two-dimensional optical fiber array substrate according to the first embodiment of the present invention.

3 and 12, the manufacturing method of the two-dimensional optical fiber array substrate (hereinafter referred to as 'manufacturing method') is by inserting the coated optical fiber part and the coated optical fiber part into the double-structured holes having different diameters. A two-dimensional optical fiber array substrate 100 for use as a light source of a light-curing type 3D printer is manufactured. Through this, the manufacturing method can easily fabricate a two-dimensional optical fiber array, minimize the spacing between the arrays, and at the same time facilitate the horizontal alignment of the hole in the substrate and the center of the optical fiber and the vertical alignment of the end of the optical fiber. In the manufacturing method, mechanical reliability can be improved by forming an adhesive dam on the upper surface of the substrate 10a to prevent the neck from breaking of the optical fiber.

In step S110 , the substrate 10a in which the double diameter holes H are formed in a two-dimensional arrangement is prepared. The substrate 10a has a first diameter hole 11 for accommodating the coated optical fiber portion and a second diameter hole 12 smaller in diameter than the first diameter hole and formed thereunder and for accommodating the coated optical fiber portion. include

In step S120, an optical fiber is inserted into the hole H of the substrate 10a. The optical fiber includes a coated optical fiber part and a coated optical fiber part, and is inserted from the top to the bottom of the substrate 10a to fit the diameter of the hole H. At this time, the coated optical fiber part is inserted into the second diameter hole 12 through the first diameter hole 11 , and the coated optical fiber part is inserted into the first diameter hole 11 .

In step S130, an adhesive is applied to the upper portion of the substrate 10a. The adhesive fixes the substrate 10a and the optical fiber inserted into the substrate 10a. At this time, the adhesive has low viscosity and is applied while permeating the hole of the substrate 10a to fix the substrate 10a and the optical fiber.

In step S140 , the lower portion of the substrate 10a is polished. The substrate 10a is polished on the lower side in line with the polishing line. In this case, the polishing process may be performed after curing of the adhesive is completed.

Although the above has been described and illustrated in relation to a preferred embodiment for illustrating the technical idea of the present invention, the present invention is not limited to the configuration and operation as shown and described as such, and without departing from the scope of the technical idea. It will be apparent to those skilled in the art that many changes and modifications to the present invention are possible. Accordingly, all such suitable alterations and modifications and equivalents are to be considered as being within the scope of the present invention.

10a, 10b, 10c: substrate
11: first diameter hole
12: second diameter hole
13: first plate-shaped hole
14: second plate-shaped hole
15: third plate-shaped hole
20: glue dam
30: optical fiber portion of the coating peeled off
40: coated optical fiber part
50: adhesive
60: vertical alignment block
100: two-dimensional optical fiber array substrate
H: Hall

Claims (12)

Preparing a substrate in which double-diameter holes are formed in a two-dimensional array;
inserting an optical fiber including a coated optical fiber part and a coated optical fiber part to fit the diameter of the hole from the top to the bottom of the substrate; and
applying an adhesive to fix the substrate and the optical fiber;
A method of manufacturing a two-dimensional optical fiber array substrate for a light-curing 3D printer comprising a. The method of claim 1,
After the applying step,
polishing the lower portion of the substrate in line with a polishing line;
Method of manufacturing a two-dimensional optical fiber array substrate for a light-curing 3D printer, characterized in that it further comprises. The method of claim 1,
Prior to the applying step,
forming an adhesive dam that prevents the adhesive from flowing out due to the application;
Method of manufacturing a two-dimensional optical fiber array substrate for a light-curing 3D printer, characterized in that it further comprises. 4. The method of claim 3,
The forming step is
Between the step of preparing and the step of inserting,
A method of manufacturing a two-dimensional optical fiber array substrate for a light-curing type 3D printer, characterized in that the adhesive dam is formed by fixing a mechanism to an edge of the upper surface of the substrate. 4. The method of claim 3,
The forming step is
Between the inserting step and the applying step,
A method of manufacturing a two-dimensional optical fiber array substrate for a light-curing type 3D printer, characterized in that the adhesive dam is formed by laminating a plurality of films attachable to the edge of the upper surface of the substrate. The method of claim 1,
between the preparing and inserting, attaching a vertical alignment block having a concave groove on a flat plate so that the groove faces a lower portion of the substrate;
Method of manufacturing a two-dimensional optical fiber array substrate for a light-curing 3D printer, characterized in that it further comprises. 7. The method of claim 6,
The preparing step is
forming a counter sink at an inlet of the hole formed in a downward direction of the substrate;
A method of manufacturing a two-dimensional optical fiber array substrate for a light-curing 3D printer, comprising: 7. The method of claim 6,
The inserting step is
A method of manufacturing a two-dimensional optical fiber array substrate for a light-curing type 3D printer, characterized in that the optical fiber portion of which the coating has been peeled is excessively penetrated to be accommodated in the groove. The method of claim 1,
The preparing step is
forming a plate-shaped hole at an inlet of a first diameter hole formed in an upper direction of the substrate and an inlet of a second diameter hole smaller than the first diameter hole, respectively;
A method of manufacturing a two-dimensional optical fiber array substrate for a light-curing 3D printer, comprising: a substrate in which holes having a double diameter are formed in a two-dimensional arrangement;
an optical fiber comprising a coated optical fiber portion and a bare optical fiber portion, wherein the optical fiber is inserted into the hole to fit a diameter of the coated optical fiber portion and the coated optical fiber portion; and
an adhesive for fixing the substrate and the optical fiber;
A two-dimensional optical fiber array substrate for a light-curing 3D printer comprising a. 11. The method of claim 10,
The substrate is
a first diameter hole receiving the coated optical fiber portion; and
a second diameter hole having a smaller diameter than the first diameter hole, a second diameter hole formed underneath, and receiving a portion of the optical fiber from which the coating has been peeled off;
A two-dimensional optical fiber array substrate for a light-curing 3D printer comprising a. 12. The method of claim 11,
The substrate is
A two-dimensional optical fiber array substrate for a light-curing type 3D printer, characterized in that a plate-shaped hole is formed in at least one of an entrance of the first diameter hole, an entrance of the second diameter hole, and an entrance of a hole formed in a downward direction of the substrate.

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