KR20220134533A - Metallized film and manufacturing method thereof - Google Patents

Abstract

The present invention provides a metallized film excellent in designability (appearance) and in which cracking is suppressed even when bent. The present invention is a metallized film, wherein the metallized film is formed on a resin film, (1) an aluminum metal vapor deposition portion and (2) an aluminum metal non-deposited portion in a continuous pattern in the advancing direction and in the width direction, , wherein (1) the film resistance value of the aluminum metal deposition part is 0.2 to 2.0 Ω/□, and the area ratio of the (2) aluminum metal non-evaporation part is 5% or more with respect to the total area of the metallized film, characterized in that , to provide a metallized film.

Description

Metallized film and manufacturing method thereof

The present invention relates to a metallized film and a method for making the same.

Conventionally, in order to give functionality, such as designability, electromagnetic wave shielding and absorption, antenna, etc. to the case surface of plastic or glass, provision of the fine pattern which consists of metal is known. As a method of providing a fine pattern made of a metal, a method of forming a pattern by etching after coating on the surface, directly forming a metal film on the surface by vapor deposition or bonding, or the like is known.

However, there is a limit of precision in painting, and it is difficult to form a fine pattern. In addition, direct pattern formation by etching is very expensive, and since a large amount of heat is applied in the process, it is limited to processing for materials that are difficult to receive thermal damage. In addition, there was also a problem that the size of the case that can be processed is limited to a small one due to limitations on the apparatus.

Therefore, after forming a metal film on a thin film by methods, such as vapor deposition, the method of bonding a film to a case and providing a metal pattern to the surface is considered. As for the technical method by vapor deposition on a film, several proposals are made.

Patent Document 1 discloses a metal vapor deposition laminated film in which a plurality of layers including a metal layer are laminated, and a molded article bonded to a curved surface portion thereof. In addition, Patent Document 2 discloses a laminated film used as an electromagnetic wave shielding film having a metal film and an adhesive layer. Further, Patent Document 3 discloses a thin antenna having an antenna portion formed by vapor deposition on the surface of a film substrate.

Japanese Patent Laid-Open No. 2018-144323 Japanese Laid-Open Patent Publication No. 2006-007589 Japanese Patent Laid-Open No. 2011-061567

However, the vapor deposition metal layer of Patent Document 1 is formed on the entire surface with a constant thickness (so-called beta deposition), and although metallic design with a glossy feeling can be provided, designability is imparted by a pattern-like shape with higher designability is difficult Moreover, in beta deposition, when a metal layer became thick, there also existed the subject that a metal layer was easy to crack. In particular, when a metal-deposited laminated|multilayer film is bent, the said subject becomes remarkable at the point of being easy to crack.

Also in Patent Document 2, the deposited metal layer is formed on the entire surface with a certain thickness (beta deposition), and in addition to the problem of being prone to cracking in the same way, it is generally known to have a high effect as an electromagnetic shield for transparent objects such as glass windows. It has not been described that a metal pattern such as a mesh or the like can be formed.

Patent Document 3 discloses a method for forming a metal antenna pattern using masking with a release paper. However, when the pattern becomes fine, the masking process becomes complicated or the pattern reproducibility is poor. Since the process was complicated, there was also a cost problem.

An object of the present invention is to provide a metallized film in which a metal pattern is formed on a resin film, and a method for manufacturing the same, by solving various problems in the prior art using a simpler method for forming a pattern by metal vapor deposition. . Specifically, an object of the present invention is to provide a metallized film excellent in designability (appearance) and in which cracking is suppressed even when bent.

MEANS TO SOLVE THE PROBLEM As a result of earnest examination, the present inventors discovered that the said objective could be achieved by the means described below, and came to complete this invention.

That is, the present invention includes the following preferred embodiments.

1. A metallized film comprising:

The metallized film is a resin film, (1) aluminum metal deposition portion, (2) aluminum metal non-deposition portion is formed in a pattern,

(1) the film resistance value of the aluminum metal deposition part is 0.2 to 2.0 Ω/□,

The metallized film, characterized in that the area ratio of the (2) aluminum metal non-deposited portion is 5% or more with respect to the total area of the metallized film.

2. The metallized film according to item 1, wherein the resin constituting the resin film is at least one selected from the group consisting of polyester and polyolefin.

3. The resin film is conveyed to a patterned non-evaporated part forming part where oil is applied as an oil mask in a patterned pattern, and after the patterned non-evaporated part is formed, it is transported to a vapor deposition part where metal vapor is generated to perform metal deposition, the pattern A method for producing a metallized film according to item 1 or 2, characterized in that type metal vapor deposition is performed.

4. An electronic device comprising an electronic circuit board in which the metallized film according to item 1 or 2 is used for a case.

5. The electronic device according to claim 4, wherein the electronic circuit board has a dielectric constant of 3.5 or less and a dielectric loss tangent of 0.007 or less at a frequency of 10 GHz.

ADVANTAGE OF THE INVENTION According to this invention, it is excellent in designability (appearance), and can provide the metallized film by which cracking was suppressed also when it is bent.

1A is a top view of a metallized film in this embodiment including the present invention. In FIG. 1A, a black part is a metal deposition part, and a white part is a metal non-metal deposition part.
1B is a top view of a metallized film in another present embodiment including the present invention. In FIG. 1B, a black part is a metal deposition part, and a white part is a metal non-metal deposition part. The pattern of FIG. 1B is a pattern in which the metal-deposited portion and the non-metal-deposited portion of FIG. 1A are reversed.
Fig. 2 is a top view of a metallized film according to another present embodiment including the present invention.
3 is a diagram showing the relationship between the thickness of an aluminum metal deposition part (metal deposition film) and a resistance value.
4 is a view showing an example of a method for manufacturing a metallized film of the present invention.

1. Metallized Film

An embodiment of a metallized film according to the present invention is described. As necessary, reference is made to the accompanying drawings.

The metallized film according to the present embodiment is a metallized film, wherein the metallized film is formed in a pattern on a resin film, (1) an aluminum metal deposition part, and (2) an aluminum metal non-evaporation part, (1) The film resistance value of the aluminum metal vapor deposition portion is 0.2 to 2.0 Ω/□, and the area ratio of the (2) aluminum metal non-deposited portion is 5% or more with respect to the total area of the metallized film. The metallized film according to the present embodiment is also referred to as a metal vapor deposition laminated film, or simply as a laminated film.

The resin constituting the resin film is not limited, and both a thermoplastic resin and a thermosetting resin can be used. The resin constituting the resin film is preferably at least one resin selected from the group consisting of a polyolefin resin, a polyvinyl resin, a polyester resin, a polyether resin, a polyamide resin, and a polyimide resin. In addition, regarding each resin, resin which has any stereoregularity among isotactic, syndiotactic, and atactic can be used. For example, in the case of polypropylene, all of isotactic polypropylene, syndiotactic polypropylene, and atactic polypropylene can be used, and in the case of polystyrene, all isotactic polystyrene, syndiotactic polystyrene, and atactic polystyrene Can be used.

The polyolefin resin is a polymer formed by polymerization of an olefin, preferably a polymer formed by polymerization of an olefin having 2 to 20 carbon atoms, more preferably 2 to 10 carbon atoms, still more preferably 3 to 6 carbon atoms. Examples of the polyolefin resin include polyethylene resin, polypropylene resin, poly(1-butene) resin, polyisobutene resin, poly(1-pentene) resin, and poly(4-methylpentene-1) resin. . Among polyolefin resins, a polypropylene resin is preferable from a viewpoint of being excellent in a flexibility and being able to provide the outstanding designability.

The polyvinyl resin is a polymer formed by polymerizing a vinyl monomer other than an olefin in which a polar group or an aromatic group is directly bonded to the α-position. Examples of the polyvinyl resin include polyvinyl acetate resin, polystyrene resin, polyvinyl chloride resin, polyvinylidene chloride resin, polymethyl methacrylate resin, and polyvinyl alcohol resin.

A polyester resin is a polymer which has an ester bond in a principal chain. Examples of the polyester resin include polyethylene terephthalate resin (PET), polyethylene naphthalate resin, polybutylene terephthalate resin, polyphenylene sulfide resin, polycarbonate resin, and polylactic acid resin. Polyethylene terephthalate resin is preferable.

A polyether resin is a polymer which has an ether bond in a principal chain. Examples of the ether resin include polyethylene oxide resin, polyacetal resin, polyether ketone resin, polyether ether ketone resin, and polyether imide resin (PEI).

The polyamide resin is a polymer having an amide bond in the main chain. Examples of the polyamide resin include nylon 6 resin, nylon 46 resin, nylon 66 resin, nylon 69 resin, nylon 610 resin, nylon 612 resin, nylon 116 resin, nylon 4 resin, nylon 7 resin, nylon 8 resin, nylon 11 resin, nylon 12 resin, etc. are mentioned.

In this invention, 1 type of resin may be sufficient as resin which comprises a resin film, and it may use it combining 2 or more types of resin. It is preferable that it is at least 1 sort(s) selected from the group which consists of polyester and polyolefin from a viewpoint of being excellent in a softness|flexibility and being able to provide outstanding designability among the said resin.

Although the thickness of a resin film is not limited, 1 micrometer or more, 3 micrometers or more, 5 micrometers or more, 7 micrometers or more, and 10 micrometers or more are preferable, respectively, 120 micrometers or less, 100 micrometers or less, 75 micrometers or less, 50 micrometers or less, 30 μm or less and 15 μm or less are preferred, respectively.

A single layer may be sufficient about the laminated constitution of a resin film, and two or more layers may be sufficient as it. When the laminated constitution of a resin film is two or more layers, resin which comprises each layer may be 1 type of resin as mentioned above, and may use it combining 2 or more types of resin. In addition, resin which comprises said each layer may be respectively same or different.

The unstretched film which has not been extended|stretched may be sufficient as the resin film, the uniaxially stretched film in which uniaxial stretching is made|formed may be sufficient as it, and the biaxially stretched film in which biaxial stretching is made|formed may be sufficient as it.

The resin film may contain at least 1 sort(s) of additives other than resin as needed. The additive is not particularly limited as long as it is an additive generally used for resin. Such additives include, for example, antioxidants, chlorine absorbers, stabilizers such as ultraviolet absorbers, lubricants, plasticizers, flame retardants, antistatic agents, colorants, nucleating agents, and the like. Such an additive may be added in the resin film within the range which does not impair the effect of this invention.

You may use what corona-discharge-treated for the purpose of the adhesive improvement of a metal vapor deposition film for a resin film. Corona discharge treatment can be performed using a well-known method online or offline in a resin film manufacturing process. It is preferable to carry out using air, carbon dioxide gas, nitrogen gas, or these mixed gas as atmospheric gas.

In addition, you may use for the resin film in which the primer layer was formed by well-known methods, such as application|coating, for the purpose of improving the adhesiveness of a metal vapor deposition film. A primer layer is not specifically limited, For example, resin, such as a polyester type, an acrylic urethane type, a polyvinyl chloride type, a vinyl chloride/vinyl acetate copolymer type, a butyral type, may be contained.

In the metallized film according to the present embodiment, (1) an aluminum metal vapor-deposited portion and (2) an aluminum metal non-deposited portion are formed in a pattern shape. It does not specifically limit as a pattern, For example, it is preferable that the (1) aluminum metal vapor deposition part and (2) aluminum metal non-evaporation part are formed continuously in the advancing direction and the width direction in pattern shape. In addition, in this embodiment, the advancing direction is also called MD direction (Mechanical Direction), and means the direction which unwinds or draws out a resin film. In this embodiment, the width direction is also referred to as a TD direction (Transverse Direction), and refers to a direction perpendicular to the MD direction.

An example of the pattern type may include a grid type as described in FIG. 1A or FIG. 1B. In addition, as shown in FIG. 2, only a part of area|region may be made into a grid|lattice shape. In addition, as the said pattern shape, it may be simply formed in a line shape in one direction (for example, the advancing direction or the width direction). On the other hand, with respect to the pattern type, the region of the line forming the pattern may be an aluminum metal non-evaporated portion (hereinafter also simply referred to as “non-evaporated portion”) or an aluminum metal vapor-deposited portion (hereinafter simply referred to as “deposited portion”). may be For example, with respect to the lattice pattern shown in Figs. 1A and 1B, a line in one direction and a line in the other intersecting to form a stripe may be non-evaporated or may be vapor-deposited. When a line in one direction and a line intersecting to form a stripe in the other direction is a non-deposited portion (FIG. 1A), each rectangular area surrounded by each line becomes a deposited portion, and as long as it intersects to form a stripe When the direction line and the other line are the vapor deposition portions (FIG. 1B), each rectangular area surrounded by the respective lines becomes the non-evaporated portion. The lattice pattern illustrated in FIG. 1B is a pattern in which the vapor-deposited portion and the non-deposited portion in the grid pattern illustrated in FIG. 1A are reversed.

The thickness of an aluminum metal vapor deposition part (metal vapor deposition film) will not be specifically limited if it exists in the range of this embodiment. 35-150 nm is preferable and, as for the thickness of an aluminum metal vapor deposition part, 85-130 nm is more preferable. The thickness of the aluminum metal vapor deposition portion in the present embodiment is calculated by a converted value in relation to the film resistance value.

As mentioned above, the thickness of the aluminum metal vapor deposition part in this embodiment is adjusted by setting a film resistance value to an appropriate range. When the film resistance value is too low, that is, when the deposition portion is too thick, in the metal deposition process, from the effect of thermal damage on the substrate by the high-temperature metal vapor, the substrate is deformed, wrinkles are generated, and the metal of the desired quality is There is a possibility that the film cannot be manufactured. Moreover, when a film resistance value is too low, the adhesiveness to a base material will fall and it will become easy to peel. When the metallized film is bent, there is also a problem such as cracking in the metal deposition portion. On the other hand, when the film resistance value is too high, that is, when the deposition portion is too thin, the appearance quality or electrical performance as a metal film of the deposition portion becomes insufficient, which is unsuitable.

Therefore, the film resistance value of the aluminum metal vapor deposition part in the metallization film of this embodiment is 0.2-2.0 ohms/square. 0.2-1.0 ohm/square is preferable and, as for the film resistance value of an aluminum metal vapor deposition part, 0.2-0.5 ohm/square is more preferable. When the film resistance value is less than 0.2 ?/?, since the metal-deposited portion is too thick, wrinkles at the time of deposition and cracks in the metal-deposited portion occur, and the adhesion to the substrate is lowered, which is therefore unsuitable. In addition, if the film resistance value is larger than 2.0 Ω/□, the metal vapor deposition portion is too thin, and the desired appearance quality or electrical performance is not obtained, so it is unsuitable.

The area ratio of the aluminum metal non-evaporated part in the metallized film of this embodiment is 5 % or more with respect to the area of the said whole metallization film. That is, the area ratio of the aluminum metal non-deposited portion to the entire area of the metallized film is 5% or more. Since the area ratio of the aluminum metal non-deposited portion in the metallized film of the present embodiment is 5% or more with respect to the entire area of the metallized film, the appearance evaluation of the metallized film is excellent. Specifically, the metallic luster is sufficiently obtained, and it has a contrast of such a degree that the vapor-deposited part and the non-evaporated part can be clearly recognized. 98% or less is preferable with respect to the area of the said whole metallization film, and, as for the area ratio of an aluminum metal non-deposited part, 96% or less is more preferable. In addition, with respect to the upper limit of the area ratio of the aluminum metal non-deposited portion to the total area of the metallized film, 90% or less, 80% or less, 70% or less, 60% or less, 50% or less, 40% or less, 30% or less, Each of 20% or less and 10% or less is more preferable. In addition, with respect to the lower limit of the area ratio of the aluminum metal non-deposited portion to the total area of the metallized film, 10% or more, 20% or more, 30% or more, 40% or more, 50% or more, 60% or more, 70% or more, Each of 80% or more and 90% or more is more preferable.

2. Method of making metallized film

In the method for producing a metallized film of the present invention, a resin film is conveyed to a patterned non-deposited portion forming portion where oil is applied as an oil mask in a patterned pattern, and after the patterned non-deposited portion is formed, metal vapor is generated to deposit metal It is conveyed to the vapor deposition unit to carry out, and is a method of manufacturing a metallized film, characterized in that the pattern-type metal deposition is carried out. Hereinafter, it demonstrates using drawings.

4 is a view for explaining a method of manufacturing the metallized film 1 . The manufacturing apparatus includes a resin film supply unit 101 , a pattern forming unit 103 , a vapor deposition unit 104 , and a winding roll 105 . You may provide the pattern non-formation part 102 as needed.

The resin film supply unit 101 supports the resin film roll 2R on which the resin film 2 is wound, and supplies the resin film 2 . The resin film 2 supplied from the resin film roll 2R is conveyed to the pattern-type non-evaporated part forming part 103 .

The pattern-type non-deposition part forming part 103 forms an oil mask by applying oil to one surface 2a of the resin film 2 in a pattern substantially corresponding to the pattern of the metal deposition layer 3 . The oil mask is for preventing metal particles from adhering to the portion to be the pattern-type non-deposited portion of the metallized film 1 in the deposition process. The patterned non-deposited portion forming portion 103 has an oil tank 103a, an anilox roll 103b, a transfer roll 103c, a plate roll 103d, and a backup roll 103e. The oil tank 103a vaporizes the stored oil and ejects it from the nozzle. The anilox roll 103b and the transfer roll 103c rotate with the oil ejected from the nozzle of the oil tank 103a attached to their outer peripheral surfaces.

On the outer peripheral surface of the plate roll 103d, a convex plate portion 103da having a pattern corresponding to the pattern of the aluminum metal vapor deposition portion is formed, and the plate roll 103d rotates in synchronization with the conveyance of the resin film 2, Oil of a pattern corresponding to the pattern of the aluminum metal deposition portion is applied to the surface 2a of the resin film 2 to form an oil mask.

The backup roll 103e faces the plate roll 103d via the resin film 2 and comes into contact with the surface 2b of the resin film 2 .

The resin film 2 passing through the non-patterned portion 102 and the non-patterned non-deposited portion forming portion 103 is conveyed to the vapor deposition portion 104 .

The vapor deposition unit 104 includes a metal vapor generating unit 104a and a cooling roll 104c facing the metal vapor generating unit 104a with the resin film 2 interposed therebetween. The metal vapor generating unit 104a heats and evaporates metal, which is a material of the metal deposition layer 3 , to generate metal vapor, and deposits the generated metal vapor on the surface 2a of the resin film 2 . On the other hand, the metal vapor generated in the metal vapor generating unit 104a is attached to a portion other than the oil mask formed on the surface 2a of the resin film 2 to form the metal vapor deposition layer 3 . The cooling roll 104c contacts the resin film 2 and cools the resin film 2 . In addition, the vapor deposition part 104 may be provided with the metal vapor production|generation part 104b further.

The metallized film 1 formed by forming the aluminum metal vapor deposition part as the vapor deposition part 104 in the resin film 2 is conveyed by the take-up roll 105, and is wound up.

Thus, a desired aluminum metal vapor deposition part can be formed on the surface 2a of the resin film 2 by the manufacturing method using the manufacturing apparatus in embodiment.

On the other hand, for each condition in metal deposition (for example, tension, line speed, aluminum evaporation source output, Al wire feed, etc.), what is necessary is just to adjust appropriately in order to adjust the desired metal deposition amount, and the metal according to this embodiment It does not specifically limit as long as a film can be produced preferably.

3. Electronic devices

The electronic device of this invention is an electronic device containing the electronic circuit board which used the said metallization film for a case.

Since cracking is suppressed even when the metallized film of the present invention is bent, as an electromagnetic wave absorbing/shielding film, by attaching it to the inside or outside of the case of an electronic device including an electronic circuit board, etc. It can exhibit excellent performance as a device. In addition, it can be used as a film antenna by affixing it on the surface opposite to the electronic circuit of an electronic circuit board (case), etc. The metallized film of the present invention can sufficiently exhibit the effects of the present invention, particularly for 5G (low dielectric) electronic circuit boards.

The metallized film used in the electronic device of the present invention suppresses cracking even when bent, is less likely to wrinkle during metal deposition, and has excellent adhesion to the metal deposition layer. Excellent as an antenna. For this reason, it can be preferably applied to electronic devices using electromagnetic waves in the high-frequency region of 3 to 100 GHz, which are required to have small relative permittivity and low dielectric loss tangent.

3.5 or less are preferable, as for the dielectric constant in frequency 10 GHz of the electronic circuit board which the electronic device of this invention contains, 3.3 or less are more preferable, and 3.1 or less are still more preferable. In addition, the lower limit of the said dielectric constant is not specifically limited, It is so preferable that it is low, and may be 0.

0.007 or less is preferable, as for the dielectric loss tangent in the frequency of 10 GHz of the electronic circuit board contained in the electronic device of this invention, 0.005 or less are more preferable, 0.004 or less are still more preferable. In addition, the lower limit of the said dielectric loss tangent is not specifically limited, It is so preferable that it is low, and may be 0.

As for the electronic circuit board included in the electronic device of this invention, it is more preferable that the dielectric constant in frequency 10 GHz is 3.5 or less, and it is more preferable that a dielectric loss tangent is 0.007 or less.

The relative dielectric constant and dielectric loss tangent at the frequency of 10 GHz can be measured with a split post dielectric resonator (manufactured by Agilent Technologies) at a temperature of 23°C and a humidity of 50%.

The metallized film of this embodiment described above can be suitably used for decorative film applications, electromagnetic wave absorption/shielding film applications, film antenna applications, electronic circuit board applications, transparent electrode film applications, heat shielding/light-shielding film applications, touch panel applications, etc. have. In this invention, when resin which comprises a resin film is a thermoplastic resin, the thermoplastic resin composition may contain at least 1 sort(s) of additives other than a thermoplastic resin as needed. The additive is not particularly limited as long as it is an additive generally used for thermoplastic resins. Such additives include, for example, antioxidants, chlorine absorbers, stabilizers such as ultraviolet absorbers, lubricants, plasticizers, flame retardants, antistatic agents, colorants, nucleating agents, and the like. Such additives may be added to the thermoplastic resin composition within a range that does not impair the effects of the present invention.

Example

The present invention will be described in detail with reference to Examples and Comparative Examples below. However, the present invention is not limited to the Examples.

(Example 1)

First, a PET film (Lumiror 12S10 manufactured by Toray Corporation, 12 µm in thickness, 620 mm in width × 3,300 m in length) was prepared. Then, aluminum metal deposition is performed on the PET film, so that (1) aluminum metal deposition portions and (2) aluminum metal non-deposited portions are alternately continuous in the advancing direction and in the width direction on the PET film in a pattern shape. A formed metallized film was obtained.

In addition, the process which performed the said aluminum metal vapor deposition is demonstrated below. As shown in Fig. 4 , a resin film supply unit 101 (hereinafter also referred to as an unwinder), a pattern-type non-evaporation unit forming unit 103 , a vapor deposition unit 104 , and a winding roll 105 (hereinafter referred to as wine). Also referred to as more) to prepare a manufacturing apparatus equipped with. The PET film 2 supplied from the film roll 2R is conveyed to the patterned non-evaporated part forming part 103 . Here, the resin film supply unit 101 supports the film roll 2R on which the PET film 2 is wound, and supplies the PET film 2 .

Next, in the pattern-type non-deposition part forming part 103 , oil is applied to one surface 2a of the PET film 2 in a pattern substantially corresponding to the pattern of the aluminum metal deposition part to form an oil mask. The oil mask is for preventing metal particles from adhering to the portion to be the pattern-type non-deposited portion of the metallized film 1 in the deposition process. Here, the pattern-type non-deposition part forming part 103 has an oil tank 103a, an anilox roll 103b, a transfer roll 103c, a plate roll 103d, and a backup roll 103e. The oil tank 103a vaporizes the stored oil and ejects it from the nozzle. The anilox roll 103b and the transfer roll 103c rotate with the oil ejected from the nozzle of the oil tank 103a attached to their outer peripheral surfaces.

The backup roll 103e faces the plate roll 103d via the PET film 2 and abuts against the surface 2b of the PET film 2 .

Next, the PET film 2 that has passed through the patterned non-evaporated part forming part 103 is conveyed to the vapor deposition part 104 .

The vapor deposition unit 104 includes a metal vapor generating unit 104a and a cooling roll 104c facing the metal vapor generating unit 104a with the PET film 2 interposed therebetween. Next, in the metal vapor generating unit 104a, the metal is heated and evaporated to generate a metal vapor, and the generated metal vapor is deposited on the surface 2a of the PET film 2 . On the other hand, the metal vapor generated in the metal vapor generating unit 104a is attached to a portion other than the oil mask formed on the surface 2a of the PET film 2 to form an aluminum metal vapor deposition unit. The cooling roll 104c abuts against the PET film 2 to cool the PET film 2 .

The metallized film 1 formed by forming the aluminum metal vapor deposition part by the vapor deposition part 104 on the PET film 2 is conveyed by the winding roll 105, and is wound up.

Thus, on the surface 2a of the PET film which is the film 2, the aluminum metal vapor deposition part of the desired pattern type continuous in the advancing direction and the width direction was formed.

In addition, in Example 1, vapor deposition conditions were carried out as follows.

Deposition pattern: Fig. 1A

Tension (UW/WD): 110N/110N (UW represents the tension in the unwinder, WD represents the tension in the winder)

Line speed: 60m/min

Aluminum evaporation source output: 90%

Al wire feed: 500mm/min

Thus, the metallized film of Example 1 was obtained. The thickness (calculated value) of the aluminum metal vapor deposition part (metal vapor deposition film) was 89 nm.

(Examples 2 to 8, Comparative Examples 1 to 8)

In Example 1, the metallized films of Examples 2 to 8 and Comparative Examples 1 to 8 were prepared in the same manner as in Example 1 except that the manufacturing conditions of the metallized film were changed as shown in Tables 1 and 2. . Hereinafter, in each Example and a comparative example, the main manufacturing conditions changed at the time of manufacture of a metallized film are demonstrated.

(Example 2)

A metallized film of Example 2 was obtained in the same manner as in Example 1 except that the line speed was set to 30 m/min instead of 60 m/min and the metal deposition amount was adjusted.

(Example 3)

In the deposition conditions of Example 1, the line speed was 120 m/min instead of 60 m/min, and the metallized film of Example 3 was obtained in the same manner as in Example 1 except that the metal deposition amount was adjusted.

(Example 4)

In the deposition conditions of Example 1, the deposition pattern was set to FIG. 1B (a pattern in which the aluminum metal deposited portion and the aluminum metal non-deposited portion of FIG. 1A were reversed) instead of FIG. 1A, and the line speed was 30 m/min instead of 60 m/min. A metallized film of Example 4 was obtained in the same manner as in Example 1 except that the metal deposition amount was adjusted.

(Example 5)

In Example 1, the thickness of the PET film was 50 μm instead of 12 μm, and in the deposition conditions of Example 1, the tension was 120N/120N instead of 110N/110N, and the line speed was changed to 60m/min. It was 30 m/min and except having adjusted the metal deposition amount, it carried out similarly to Example 1, and obtained the metallized film of Example 5.

(Example 6)

In Example 1, the thickness of the PET film was 75 μm instead of 12 μm, and in the deposition conditions of Example 1, the tension was 120N/120N instead of 110N/110N, and the line speed was changed to 60m/min. It was 30 m/min and except having adjusted the metal deposition amount, it carried out similarly to Example 1, and obtained the metallization film of Example 6.

(Example 7)

In Example 1, the thickness of the PET film was 75 μm instead of 12 μm, and in the deposition conditions of Example 1, the deposition pattern was changed to FIG. pattern), the tension is 120N/120N instead of 110N/110N, the line speed is 30m/min instead of 60m/min, and the same as in Example 1, except that the metal deposition amount is adjusted. A metallized film of 7 was obtained.

(Example 8)

In Example 1, the resin film was a PEN film instead of the PET film, and in the deposition conditions of Example 1, the line speed was 30 m/min instead of 60 m/min, and the metal deposition amount was adjusted. It carried out similarly to 1, and obtained the metallized film of Example 8.

(Comparative Example 1)

In the same manner as in Example 1, except for not forming a pattern by the patterned non-deposited portion forming portion (that is, forming an aluminum metal deposited portion on the entire surface of the PET film) and adjusting the metal deposition amount, The metallized film of Example 1 was obtained. In addition, in this specification, vapor deposition which forms an aluminum metal vapor deposition part on the whole surface of a film is also called "beta deposition" or "full beta deposition".

(Comparative Example 2)

It is carried out except that no pattern is formed by the patterned non-deposited portion forming portion (that is, the aluminum metal deposited portion is formed on the entire surface of the PET film), the line speed is 30 m/min, and the metal deposition amount is adjusted. In the same manner as in Example 1, a metallized film of Comparative Example 2 was obtained.

(Comparative Example 3)

Example 1 except that the pattern was not formed by the patterned non-deposited portion (that is, the aluminum metal deposited portion was formed on the entire surface of the PET film), the line speed was 150 m/min, and the metal deposition amount was adjusted. In the same manner as described above, a metallized film of Comparative Example 3 was obtained.

(Comparative Example 4)

Except having adjusted the metal deposition amount, it carried out similarly to Example 1, and obtained the metallized film of the comparative example 4.

(Comparative Example 5)

Except having adjusted the metal deposition amount, it carried out similarly to Example 1, and obtained the metallized film of Comparative Example 5.

(Comparative Example 6)

In Example 1, the thickness of the PET film was 75 μm instead of 12 μm, and in the deposition conditions of Example 1, the tension was 120N/120N instead of 110N/110N, and the line speed was changed to 60m/min. It was set to 15 m/min and except having adjusted the metal deposition amount, it carried out similarly to Example 1, and obtained the metallized film of the comparative example 6.

(Comparative Example 7)

In Example 1, the resin film is a PEN film instead of a PET film, and the deposition pattern is a full surface beta deposition instead of FIG. 1A, and in the deposition conditions of Example 1, the line speed is 30 m/min instead of 60 m/min. min and having adjusted the metal deposition amount, it carried out similarly to Example 1, and obtained the metallized film of Comparative Example 7.

(Comparative Example 8)

In Example 1, the resin film was a PEN film instead of the PET film, and in the deposition conditions of Example 1, the line speed was 20 m/min instead of 60 m/min, and the metal deposition amount was adjusted. In the same manner as in Example 1, a metallized film of Comparative Example 8 was obtained.

The metallized films of Examples and Comparative Examples produced as described above were evaluated by the following method.

<Evaluation of wrinkle occurrence during deposition>

The number of occurrence sites was counted by visually observing the presence or absence of wrinkles during deposition on the winding roll, and evaluation was performed according to the following evaluation criteria. On the other hand, if evaluation is (circle), it is evaluated that there is no problem in actual use.

○: 0 places

△: 1 or 2 places

×: 3 or more places

<Measuring method of resistance value>

The resistance value of the aluminum metal vapor deposition part (metal vapor deposition film) was measured as follows. Using a low resistance resistivity meter Lorestar GX MCP-T610 manufactured by Mitsubishi Chemical Analytical Co., Ltd., a 4-terminal probe was fitted to the aluminum metal deposition surface of the produced metallized film, and measurements were made. In the part of the metal vapor deposition film which is not pattern-formed, the measurement was measured in 5 places away about 50 mm at a time in the advancing direction from center vicinity of the film width direction, and the average value was made into the resistance value.

<Method for calculating the thickness (calculated value) of the metal deposition part>

In the obtained metallized film, since it is difficult to accurately measure the thickness of the aluminum metal deposition part (metal deposition film), the relationship between the thickness of the metal deposition layer and the resistance value measured by the above method (calibration curve, Fig. 3) The "film thickness-resistance value calibration curve acquisition experiment" for obtaining was performed first. 3 is a diagram showing the relationship between the thickness of an aluminum metal deposition part (metal deposition film) and a resistance value. Specifically, a metallized film in which the resistance value was slightly changed in the range of 0.5 to 4 Ω/square was created, and the respective film thicknesses were measured by a chemical film thickness measurement method by colorimetric analysis. A curve was obtained in which the measured value of the film thickness was plotted against the resistance value (FIG. 3). The calculated value of thickness was computed from the resistance value using the approximate expression obtained by approximating this curve to a 6th-order curve.

<Adhesiveness of the aluminum metal vapor deposition part>

Adhesive evaluation was performed by the cross-cut test based on JISK5600-5-6. The test result was classified into 0-5, and the adhesiveness of a metal vapor deposition film and a resin film was evaluated according to the reference|standard prescribed|regulated to following JISK5600-5-6. On the other hand, if evaluation is 0 or 1, it is evaluated that there is no problem in actual use.

0: The edge of the cut is completely smooth, and there is no peeling in the mesh of any grid.

1: There is a small peeling in the intersection of a cut. The thing affected by the cross-cut part does not clearly exceed 5%.

2: It is peeling along the edge of a cut and/or in an intersection. The thing affected by the crosscut part clearly exceeds 5 %, but does not exceed 15 % in any case.

3: Along the edges of the cut, there is partial or total delamination, and/or various portions of the mesh are partially or fully delaminated. Affected by the cross-cut portion clearly exceeds 15%, but does not exceed 35%.

4: Along the edge of the cut, there is a large partial or total peeling off, and/or some meshes are partially or completely peeling off. The thing affected by the cross-cut part does not clearly exceed 35%.

5: It is the degree of peeling that cannot be classified even in classification 4.

<Evaluation of cracks in a flexural test>

Since the obtained metallized film is supposed to be used while being attached to a case having a curved surface, it is required not to crack when bent. Evaluation of cracking property was performed by the bending resistance test based on JISK5600-5-1. The metallized film was poured on the cylindrical mandrel so that the metal deposition surface turned outward, and the presence or absence of cracks after bending 180 degrees over 1 to 2 seconds was evaluated.

<Evaluation of appearance>

The appearance of the obtained metallized film was visually observed and evaluated according to the following evaluation criteria.

(circle): The metallic luster is sufficiently obtained, and it has the contrast of the degree which an aluminum metal vapor deposition part and an aluminum metal non-evaporation part can recognize clearly.

x: Formation of an aluminum metal non-evaporated part is insufficient, the metallic luster of an aluminum metal vapor deposition part is not enough, and the designability is poor.

A result is shown in Table 1 and Table 2.

Claims (5)

A metallized film comprising:
The metallized film is a resin film, (1) aluminum metal deposition portion, (2) aluminum metal non-deposited portion is formed in a pattern,
(1) the film resistance value of the aluminum metal deposition part is 0.2 to 2.0 Ω/□,
The metallized film, characterized in that the area ratio of the (2) aluminum metal non-deposited portion is 5% or more with respect to the total area of the metallized film. The method of claim 1,
The metallized film, wherein the resin constituting the resin film is at least one selected from the group consisting of polyester and polyolefin. The resin film is conveyed to a patterned non-evaporated portion forming section where oil is applied as an oil mask in a patterned pattern, and after the patterned non-deposited portion is formed, is conveyed to a vapor deposition section for performing metal vapor deposition by generating metal vapor, patterned metal Method for producing the metallized film according to claim 1 or 2, characterized in that deposition is carried out. An electronic device comprising an electronic circuit board in which the metallized film according to claim 1 or 2 is used for a case. 5. The method of claim 4,
The electronic device of which the dielectric constant in the frequency of 10 GHz of the said electronic circuit board is 3.5 or less, and the dielectric loss tangent is 0.007 or less.

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