KR20220127548A - Foldable electronic device for detecting folding state and operating method thereof - Google Patents

Abstract

According to various embodiments of the present disclosure, an electronic device includes: a hinge module; a first housing coupled to at least a portion of a first side of the hinge module; a second housing coupled to at least a portion of a second side of the hinge module and configured to be foldable and unfoldable with the first housing based on a folding axis using the hinge module; a flexible display supported on upper portions of the first housing and the second housing and configured to be foldable and unfoldable; a first conductive plate disposed on a lower surface of the flexible display and facing the first housing; a second conductive plate facing the second housing; a wiring member which is disposed under the first housing and the second housing, and includes a bending area, a first touch sensor disposed at a first point of the bending area, and a second touch sensor disposed at a second point of the bending area; and a processor operatively connected to the first touch sensor and the second touch sensor. The processor may be set to check a folding state of the electronic device based on a change in first capacitance due to a change in the distance between the first conductive plate and the first touch sensor and/or a change in second capacitance due to a change in the distance between the second conductive plate and the second touch sensor. Various embodiments other than the various embodiments disclosed in this document may be possible. The usage of a space can be minimized.

Description

FOLDABLE ELECTRONIC DEVICE FOR DETECTING FOLDING STATE AND OPERATING METHOD THEREOF

Various embodiments of the present disclosure relate to a foldable electronic device detecting a folding state and an operating method thereof.

Electronic devices are gradually becoming slimmer, and are being improved in order to strengthen design aspects and differentiate functional elements thereof. BACKGROUND ART Electronic devices are being transformed from a uniform shape of a rectangular shape to a variety of shapes. For example, the electronic device may have a deformable structure capable of adjusting the size of the display to satisfy portability and usability of the electronic device. The electronic device having a deformable structure may include a foldable electronic device in which at least two housings are folded or unfolded with respect to each other. The foldable electronic device may sense a folding state (eg, an unfolded state, a folded state, and/or an intermediate state) of the foldable electronic device through a sensor (eg, a hall sensor).

The foldable electronic device may need to include a plurality of sensors (eg, a Hall sensor) and a magnetic material for operation of the plurality of sensors in order to sense a folding state of the foldable electronic device. Accordingly, it may cause an increase in material cost, and a space for mounting a plurality of sensors and magnetic bodies may be insufficient.

In various embodiments of the present disclosure, the electronic device is a foldable electronic device by mounting at least two touch sensors on a wiring member on the rear surface of the display and using a change in capacitance between the at least two touch sensors and a conductive plate included in the display. A folding state (eg, an unfolded state, a folded state, and/or an intermediate state) of the .

An electronic device according to various embodiments of the present disclosure includes a hinge module, a first housing coupled to at least a first side of the hinge module, and at least a portion coupled to a second side of the hinge module, and the hinge module a second housing configured to be foldable and expandable with the first housing based on a folding axis using a first conductive plate facing the first housing and a second conductive plate facing the second housing, disposed under the first housing and the second housing, a bent region, the bent region a wiring member including a first touch sensor disposed at a first point of A processor, comprising: a change in first capacitance according to a change in a distance between the first conductive plate and the first touch sensor and/or a change in a distance between the second conductive plate and the second touch sensor Based on a change in the second capacitance according to

A foldable electronic device according to various embodiments of the present disclosure uses a change in capacitance between at least two touch sensors and a conductive plate corresponding thereto in a folded state (eg, an unfolded state, a folded state, and/or an intermediate state). Accordingly, it is not necessary to provide a plurality of sensors and a magnetic material for the operation of the plurality of sensors, thereby minimizing space use due to the mounting of the plurality of sensors and the magnetic material, as well as reducing material costs.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2A is a perspective view of an electronic device 200 illustrating a flat state or unfolding state according to various embodiments of the present disclosure.
2B is a plan view illustrating a front surface of an electronic device in an unfolded state according to various embodiments of the present disclosure;
2C is a plan view illustrating a rear surface of an electronic device in an unfolded state, according to various embodiments of the present disclosure;
3A is a perspective view of an electronic device illustrating a folding state according to various embodiments of the present disclosure;
3B is a perspective view of an electronic device illustrating an intermediate state, according to various embodiments of the present disclosure;
4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;
5 is an exploded perspective view of a flexible display according to various embodiments of the present disclosure;
6A is a view from one side of a wiring member on which a first touch sensor and a second touch sensor are disposed, according to various embodiments of the present disclosure;
6B is a perspective view of a wiring member on which a first touch sensor and a second touch sensor are disposed, according to various embodiments of the present disclosure;
7A is a diagram illustrating a folded state of an electronic device including a first touch sensor and a second touch sensor, according to various embodiments of the present disclosure;
7B is a diagram illustrating an unfolded state of an electronic device including a first touch sensor and a second touch sensor, according to various embodiments of the present disclosure;
FIG. 8 is a diagram for explaining a change in capacitance according to a transition of an electronic device to a folding state and a transition to a folding state of an electronic device, according to various embodiments of the present disclosure;
9 is a view of a folded state, an unfolded state, and a wiring member of an electronic device including a first touch sensor and a second touch sensor viewed from one side, according to various embodiments of the present disclosure;
10A is a view of a wiring member including a plurality of first touch sensors and a plurality of second touch sensors as viewed from one side, according to various embodiments of the present disclosure;
10B is a perspective view of a wiring member including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure;
11A is a diagram illustrating a folded state of an electronic device including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure;
11B is a diagram illustrating an unfolded state of an electronic device including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure;
12 is a view of a folded state, an unfolded state, and a wiring member of an electronic device including a plurality of first touch sensors and a plurality of second touch sensors as viewed from one side, according to various embodiments of the present disclosure;
13 is a diagram illustrating a stacked structure of a wiring member according to various embodiments of the present disclosure;
14 is a diagram for describing a mesh pattern according to various embodiments of the present disclosure;
15 is a view for explaining a second wiring layer grounded in a mesh pattern according to various embodiments of the present disclosure;
16 is a flowchart illustrating a method of detecting a folding state of an electronic device, according to various embodiments of the present disclosure.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.

Referring to FIG. 1 , in a network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations performed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.

2A is a perspective view of an electronic device 200 illustrating a flat state or unfolding state according to various embodiments of the present disclosure. 2B is a plan view illustrating a front surface of the electronic device 200 in an unfolded state according to various embodiments of the present disclosure. 2C is a plan view illustrating a rear surface of the electronic device 200 in an unfolded state, according to various embodiments of the present disclosure.

3A is a perspective view of an electronic device 200 illustrating a folding state according to various embodiments of the present disclosure. 3B is a perspective view of an electronic device 200 illustrating an intermediate state, according to various embodiments.

2A to 3B , the electronic device 200 includes a pair of housings 210 that are rotatably coupled to face each other and to be folded based on a hinge device (eg, the hinge device 240 of FIG. 2B ). , 220) (eg, a foldable housing). In some embodiments, the hinge device (eg, the hinge device 240 of FIG. 2B ) may be disposed in the x-axis direction or the y-axis direction. In some embodiments, two or more hinge devices (eg, the hinge device 240 of FIG. 2B ) may be arranged to be folded in the same direction or in different directions. According to an embodiment, the electronic device 200 may include a flexible display 500 (eg, a foldable display) disposed in an area formed by a pair of housings 210 and 220 . According to one embodiment, the first housing 210 and the second housing 220 may be disposed on both sides about the folding axis (axis A), and may have a substantially symmetrical shape with respect to the folding axis (axis A). have. According to an embodiment, the first housing 210 and the second housing 220 may be in a state of the electronic device 200 in a flat state or an unfolding state, a folding state, or an intermediate state. (intermediate state), the angle or distance formed with each other may be different.

According to various embodiments, the pair of housings 210 and 220 includes a first housing 210 (eg, a first housing structure) coupled with a hinge device (eg, the hinge device 240 of FIG. 2B ) and a hinge. and a second housing 220 (eg, a second housing structure) coupled with a device (eg, the hinge device 240 of FIG. 2B ). According to one embodiment, the first housing 210, in the unfolded state, the first surface 211 facing the first direction (eg, the front direction) (z-axis direction) and the first surface 211 opposite to A second surface 212 facing a second direction (eg, a rear direction) (-z-axis direction) may be included. According to one embodiment, in the unfolded state, the second housing 220 has a third surface 221 facing the first direction (z-axis direction) and a fourth surface 222 facing the second direction (-z-axis direction). ) may be included. According to an embodiment, in the unfolded state, the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 are substantially identical to the first electronic device 200 . It may be operated in such a way that the first surface 211 and the third surface 221 face each other in the folded state in the direction (z-axis direction). According to an embodiment, in the unfolded state, the second surface 212 of the first housing 210 and the fourth surface 222 of the second housing 220 are substantially identical to the second electronic device 200 . direction (-z axis direction), and in a folded state, the second surface 212 and the fourth surface 222 may be operated to face opposite directions. For example, in the folded state, the second surface 212 may face a first direction (z-axis direction), and the fourth surface 222 may face a second direction (-z-axis direction).

According to various embodiments, the first housing 210 is coupled to the first side member 213 and the first side member 213 that at least partially form the exterior of the electronic device 200 , and the electronic device 200 . ) may include a first back cover 214 forming at least a portion of the second surface 212 . According to one embodiment, the first side member 213 includes a first side surface 213a, a second side surface 213b extending from one end of the first side surface 213a, and a second side surface extending from the other end of the first side surface 213a. A third side surface 213c may be included. According to one embodiment, the first side member 213 may be formed in a rectangular (eg, square or rectangular) shape through the first side surface 213a, the second side surface 213b, and the third side surface 213c. have.

According to various embodiments, the second housing 220 is coupled to the second side member 223 and the second side member 223 that at least partially form an exterior of the electronic device 200 , and the electronic device 200 . ) may include a second rear cover 224 forming at least a portion of the fourth surface 222 . According to an embodiment, the second side member 223 may include a fourth side surface 223a, a fifth side surface 223b extending from one end of the fourth side surface 223a, and the other end of the fourth side surface 223a. A sixth side surface 223c may be included. According to an embodiment, the second side member 223 may be formed in a rectangular shape through the fourth side surface 223a, the fifth side surface 223b, and the sixth side surface 223c.

According to various embodiments, the pair of housings 210 and 220 is not limited to the illustrated shape and combination, and may be implemented by a combination and/or combination of other shapes or parts. For example, in some embodiments, the first side member 213 may be integrally formed with the first back cover 214 , and the second side member 223 may be integrally formed with the second back cover 224 . can be formed.

According to various embodiments of the present disclosure, in the unfolded state, the electronic device 200 has a certain gap between the second side surface 213b of the first side member 213 and the fifth side surface 223b of the second side member 223 . Can be connected without (gap). According to one embodiment, in the unfolded state, in the electronic device 200 , a gap ( ) between the third side surface 213c of the first side member 213 and the sixth side surface 223c of the second side member 223 is any can be connected without gap). According to an embodiment, in the unfolded state, the combined length of the second side surface 213b and the fifth side surface 223b of the electronic device 200 is that of the first side surface 213a and/or the fourth side surface 223a. It may be configured to be longer than the length. Also, the combined length of the third side surface 213c and the sixth side surface 223c may be longer than the length of the first side surface 213a and/or the fourth side surface 223a.

According to various embodiments, the first side member 213 and/or the second side member 223 may be formed of a metal or may further include a polymer injected into the metal. According to one embodiment, the first side member 213 and/or the second side member 223 may be electrically segmented through at least one segmented portion 2161 , 2162 , and/or 2261 , 2262 formed of a polymer. It may include at least one conductive portion 216 and/or 226 . In this case, at least one conductive part may be used as an antenna operating in at least one band (eg, legacy band) designated by being electrically connected to the wireless communication circuit included in the electronic device 200 .

According to various embodiments, first back cover 214 and/or second back cover 224 may be, for example, coated or colored glass, ceramic, polymer, or metal (eg, aluminum, stainless steel ( STS), or magnesium), or a combination of at least two.

According to various embodiments, the flexible display 500 crosses the hinge device (eg, the hinge device 240 of FIG. 2B ) from the first surface 211 of the first housing 210 to the second housing 220 . It may be arranged to extend to at least a part of the third surface 221 of the . For example, the flexible display 500 may include a first portion 230a substantially corresponding to the first surface 211 , a second portion 230b corresponding to the third surface 221 , and the first portion 230a . ) and the second part 230b, and may include a third part 230c (eg, a bendable region) corresponding to a hinge device (eg, the hinge device 240 of FIG. 2B ). According to an embodiment, the electronic device 200 may include a first protective cover 215 (eg, a first protective frame or a first decorative member) coupled along an edge of the first housing 210 . According to an embodiment, the electronic device 200 may include a second protective cover 225 (eg, a second protective frame or a second decorative member) coupled along an edge of the second housing 220 . According to an embodiment, the first protective cover 215 and/or the second protective cover 225 may be formed of a metal or polymer material. According to one embodiment, the first protective cover 215 and/or the second protective cover 225 may be used as a decoration member. According to an embodiment, the flexible display 500 may be positioned such that an edge of the first portion 230a is interposed between the first housing 210 and the first protective cover 215 . According to an embodiment, the flexible display 500 may be positioned such that an edge of the second portion 230b is interposed between the second housing 220 and the second protective cover 225 . According to one embodiment, the flexible display 500 may be configured to correspond to the protective cap 235 through the protective cap 235 disposed in an area corresponding to the hinge device (eg, the hinge device 240 of FIG. 2B ). The edge of the display 400 may be positioned to be protected. Accordingly, the edge of the flexible display 500 may be substantially protected from the outside. According to an embodiment, the electronic device 200 supports a hinge device (eg, the hinge device 240 of FIG. 2B ), is exposed to the outside when the electronic device 200 is in a folded state, and is in an unfolded state. , a hinge housing 241 (eg, an internal space of the first housing 210) and a second space (eg, an internal space of the second housing 220) disposed invisibly from the outside by being introduced into the first space (eg, the internal space of the first housing 210) : hinge cover) may be included. In some embodiments, the flexible display 500 may be arranged to extend from at least a portion of the second surface 212 to at least a portion of the fourth surface 222 . In this case, the electronic device 200 may be folded to expose the flexible display 500 to the outside (out-folding method).

According to various embodiments, the electronic device 200 may include a sub-display 231 that is separately disposed from the flexible display 500 . According to an embodiment, the sub-display 231 is disposed to be at least partially exposed to the second surface 212 of the first housing 210 , and thus, when in a folded state, replaces the display function of the flexible display 500 . , status information of the electronic device 200 may be displayed. According to an embodiment, the sub-display 231 may be disposed to be visible from the outside through at least a partial area of the first rear cover 214 . In some embodiments, the sub-display 231 may be disposed on the fourth surface 222 of the second housing 220 . In this case, the sub-display 231 may be disposed to be visible from the outside through at least a partial area of the second rear cover 224 .

According to various embodiments, the electronic device 200 includes an input device 203 (eg, a microphone), sound output devices 201 and 202 , a sensor module 204 , camera devices 205 and 208 , and a key input device. 206 , or at least one of a connector port 207 . In the illustrated embodiment, an input device 203 (eg, a microphone), a sound output device 201 , 202 , a sensor module 204 , a camera device 205 , 208 , a key input device 206 , or a connector port Reference numeral 207 denotes a hole or shape formed in the first housing 210 or the second housing 220 , but a substantial electronic component (eg, disposed inside the electronic device 200 ) that operates through the hole or shape. : may be defined to include an input device, a sound output device, a sensor module, or a camera device).

According to various embodiments, the input device 203 may include at least one microphone 203 disposed in the second housing 220 . In some embodiments, the input device 203 may include a plurality of microphones 203 arranged to sense the direction of the sound. In some embodiments, the plurality of microphones 203 may be disposed at appropriate locations in the first housing 210 and/or the second housing 220 . According to an embodiment, the sound output devices 201 and 202 may include speakers 201 and 202 . According to an embodiment, the speakers 201 and 202 may include the receiver 201 for a call disposed in the first housing 210 and the speaker 202 disposed in the second housing 220 . In some embodiments, the input device 203 , the sound output devices 201 , 202 , and the connector port 207 are provided in the first housing 210 and/or the second housing 220 of the electronic device 200 . It is disposed in the space and may be exposed to the external environment through at least one hole formed in the first housing 210 and/or the second housing 220 . According to an embodiment, at least one connector port 207 may be used to transmit/receive power and/or data to/from an external electronic device. In some embodiments, at least one connector port (eg, an ear jack hole) may accommodate a connector (eg, an ear jack) for transmitting and receiving audio signals to and from an external electronic device. In some embodiments, the holes formed in the first housing 210 and/or the second housing 220 may be commonly used for the input device 203 and the sound output devices 201 and 202 . In some embodiments, the sound output devices 201 and 202 may include a speaker (eg, a piezo speaker) that operates while excluding holes formed in the first housing 210 and/or the second housing 220 . have.

According to various embodiments, the sensor module 204 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. The sensor module 204 may detect the external environment, for example, through the first surface 211 of the first housing 210 . In some embodiments, the electronic device 200 may further include at least one sensor module disposed to detect an external environment through the second surface 212 of the first housing 210 . According to an embodiment, the sensor module 204 (eg, an illuminance sensor) may be disposed under the flexible display 500 to detect an external environment through the flexible display 500 . According to an embodiment, the sensor module 204 may include a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illuminance sensor. , a proximity sensor, a biometric sensor, an ultrasonic sensor, or an illuminance sensor.

According to various embodiments, the camera devices 205 and 208 include a first camera device 205 (eg, a front camera device) and a first camera device 205 (eg, a front camera device) disposed on the first surface 211 of the first housing 210 . and a second camera device 208 disposed on the second side 212 of the housing 210 . The electronic device 200 may further include a flash 209 disposed near the second camera device 208 . According to one embodiment, the camera device 205 , 208 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 209 may include, for example, a light emitting diode or a xenon lamp. According to an embodiment, the camera devices 205 and 208 have two or more lenses (eg, a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors on one side (eg, a first side) of the electronic device 200 . 211), the second surface 212, the third surface 221, or the fourth surface 222). In some embodiments, the camera device 205 , 208 may include lenses and/or an image sensor for time of flight (TOF).

According to various embodiments, the key input device 206 (eg, a key button) may be disposed on the third side surface 213c of the first side member 213 of the first housing 210 . In some embodiments, the key input device 206 may use at least one of the other sides 213a , 213b of the first housing 210 and/or the sides 223a , 223b , 223c of the second housing 220 . It can also be placed on the side. In some embodiments, the electronic device 200 may not include some or all of the key input devices 206 and the not included key input devices 206 may be in another form, such as soft keys, on the flexible display 500 . may be implemented as In some embodiments, the key input device 206 may be implemented using a pressure sensor included in the flexible display 500 .

According to various embodiments, some of the camera devices 205 and 208 (eg, the first camera device 205 ) or the sensor module 204 may be disposed to be exposed through the flexible display 500 . For example, the first camera device 205 or the sensor module 204 may contact the external environment through an opening (eg, a through hole) formed at least partially in the flexible display 500 in the internal space of the electronic device 200 . It can be arranged so that In another embodiment, some sensor modules 204 may be arranged to perform their functions without being visually exposed through the flexible display 500 in the internal space of the electronic device 200 . For example, in this case, the opening of the area facing the sensor module 204 of the flexible display 500 may not be necessary.

Referring to FIG. 3B , the electronic device 200 may be operated to maintain an intermediate state through a hinge device (eg, the hinge device 240 of FIG. 2B ). In this case, the electronic device 200 may control the flexible display 500 to display different contents on the display area corresponding to the first surface 211 and the display area corresponding to the third surface 221 . . According to one embodiment, the electronic device 200 is connected to the first housing 210 and the second housing (eg, when in an intermediate state) at a predetermined angle of inflection (eg, the hinge device 240 of FIG. 2B ) through a hinge device (eg, the hinge device 240 of FIG. 2B ). 220) based on the substantially unfolded state (eg, the unfolded state of FIG. 2A ) and/or the substantially folded state (eg, the folded state of FIG. 3A ). For example, when a pressing force is provided in the unfolding direction (B direction) in a state in which the electronic device 200 is unfolded at a predetermined inflection angle through a hinge device (eg, the hinge device 240 of FIG. 2B ), It may be operated to transition to an unfolded state (eg, the unfolded state of FIG. 2A ). For example, when a pressing force is applied to the electronic device 200 in a folding direction (C direction) in a state in which the electronic device 200 is unfolded at a predetermined angle of inflection through a hinge device (eg, the hinge device 240 of FIG. 2B ) , may be operated to transition to a closed state (eg, the folded state of FIG. 3A ). In an embodiment, the electronic device 200 may be operated to maintain an unfolded state (not shown) at various angles through a hinge device (eg, the hinge device 240 of FIG. 2B ).

4 is an exploded perspective view of the electronic device 200 according to various embodiments of the present disclosure.

Referring to FIG. 4 , the electronic device 200 includes a first side member 213 (eg, a first side frame), a second side member 223 (eg, a second side frame), and a first side member 213 . ) and a hinge device 240 (eg, a hinge module) rotatably connecting the second side member 223 to each other. According to an embodiment, the electronic device 200 includes at least a first support member 2131 (eg, a first support member) extending at least partially from the first side member 213 , and at least from the second side member 223 . A second support member 2231 that partially extends may be included. According to an embodiment, the first support member 2131 may be integrally formed with the first side member 213 or may be structurally coupled to the first side member 213 . Similarly, the second support member 2231 may be integrally formed with the second side member 223 or may be structurally coupled to the second side member 223 . According to an embodiment, the electronic device 200 may include the flexible display 500 disposed to receive support from the first support member 2131 and the second support member 2231 . According to one embodiment, the electronic device 200 is coupled to the first side member 213 and provides a first space between the first back cover 214 and the second side surface with the first support member 2131 . A second rear cover 224 coupled to the member 223 and providing a second space therebetween may be included. In some embodiments, the first side member 213 and the first back cover 214 may be integrally formed. In some embodiments, the second side member 223 and the second back cover 224 may be integrally formed. According to an embodiment, the electronic device 200 includes a first housing 210 (eg, FIG. 2A ) provided through the first side member 213 , the first support member 2131 , and the first rear cover 214 . of the first housing 210) (eg, a first housing structure). According to an embodiment, the electronic device 200 includes a second housing (eg, the second housing of FIG. 2A ) provided through the second side member 223 , the second support member 2231 , and the second rear cover 224 . 2 housing 220) (eg, a second housing structure). According to an embodiment, the electronic device 200 may include a sub-display 231 that is disposed to be visible from the outside through at least a partial area of the first rear cover 214 .

According to various embodiments, the electronic device 200 includes a first substrate assembly 261 (eg, a main printed circuit board) disposed in a first space between the first side member 213 and the first rear cover 214 . ), a camera assembly 263 , a first battery 271 , or a first bracket 251 . According to an embodiment, the camera assembly 263 may include a plurality of camera devices (eg, the camera devices 205 and 208 of FIGS. 2A and 3A ), and may be electrically connected to the first substrate assembly 261 . can be connected to According to an embodiment, the first bracket 251 may provide a support structure for supporting the first substrate assembly 261 and/or the camera assembly 263 and improved rigidity. According to an embodiment, the electronic device 200 includes a second board assembly 262 (eg, a sub printed circuit board) disposed in a second space between the second side member 223 and the second rear cover 224 . , an antenna 290 (eg, a coil member), a second battery 272 , or a second bracket 252 . According to one embodiment, the electronic device 200 crosses the hinge device 240 from the first substrate assembly 261 , and includes a plurality of pieces disposed between the second side member 223 and the second back cover 224 . A wiring member 280 (eg, a flexible substrate) disposed to extend to electronic components (eg, the second board assembly 262 , the second battery 272 , or the antenna 290 ) and providing an electrical connection. flexible printed circuit board, FPCB) According to one embodiment, the antenna 290 may include a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 290 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.

According to various embodiments, the electronic device 200 supports the hinge device 240 , is exposed to the outside when the electronic device 200 is in a folded state (eg, the folded state of FIG. 3A ), and is in an unfolded state ( Example: in the unfolded state of FIG. 2A , a hinge housing 241 (eg, a hinge cover) that is disposed invisibly from the outside by being introduced into the first space and/or the second space may be included.

According to various embodiments, the electronic device 200 may include a first protective cover 215 coupled along an edge of the first side member 213 . According to an embodiment, the electronic device 200 may include a second protective cover 225 coupled along an edge of the second side member 223 . According to an embodiment, an edge of the first flat portion (eg, the first portion 230a of FIG. 2B ) of the flexible display 500 may be protected by the first protective cover 215 . According to an embodiment, an edge of the second flat portion (eg, the second portion 230a of FIG. 2B ) of the flexible display 500 may be protected by the second protective cover 225 . According to an embodiment, the electronic device 200 is disposed to protect an edge of a third portion corresponding to the hinge device 240 of the flexible display 500 (eg, the third portion 230c of FIG. 2B ). A protective cap 235 may be included.

According to various embodiments, the first support member 2131 may have a first support surface 2131a facing a first direction (z-axis direction) and a second direction opposite to the first direction (-z-axis direction). A second support surface 2131b may be included. According to an embodiment, the second support member 2231 may include a third support surface 2231a facing the first direction and a fourth support surface 2231b facing the second direction in the unfolded state. According to one embodiment, the flexible display 400 may be disposed to receive support from the first support surface 2131a of the first support member 2131 and the third support surface 2231a of the second support member 2231 . have.

5 is an exploded perspective view of the flexible display 500 according to various embodiments of the present disclosure.

The flexible display 500 according to exemplary embodiments of the present invention may include an unbreakable (UB) type OLED display (eg, curved display).

Referring to FIG. 5 , the flexible display 500 includes a window layer 510 , a polarizer (POL) 520 (eg, a polarizing film) sequentially disposed on the rear surface of the window layer 510 , and a display panel. 530 , a polymer layer 540 , a metal sheet layer 550 , and a conductive plate 570 may be included. In some embodiments, the flexible display 500 may include a digitizer 560 disposed between the polymer layer 540 and the metal sheet layer 550 or between the metal sheet layer 550 and the conductive plate 570 . .

According to various embodiments, the window layer 510 may include a glass layer. According to one embodiment, the glass layer includes a plurality of openings disposed in an area corresponding to the bendable third portion of the flexible display 500 (eg, the third portion 230c of FIG. 2B ), thereby forming the flexible display ( 500) can be improved. According to an embodiment, the plurality of openings are arranged to have different opening ratios for each area divided along the folding axis A, so that flexibility corresponding to the curvature of each bent area is provided, thereby smooth bending operation of the window layer 510 And it can help to reinforce the rigidity.

According to various embodiments, the window layer 510 , the polarization layer 520 , the display panel 530 , the polymer layer 540 , and the metal sheet layer 550 may include the first housing (eg, the first housing of FIG. 2A ). The first side of the housing 210 (eg, the first side 211 of FIG. 2A ) and the third side of the second housing (eg, the second housing 120 of FIG. 2A ) (eg, the second side of FIG. 2A ) It may be disposed to cross at least a portion of the three surfaces 221). According to one embodiment, the conductive plate 570 includes a first conductive plate 571 and a second housing (eg, the second housing 210 of FIG. 2A ) facing the first housing (eg, the first housing 210 of FIG. 2A ). a second conductive plate 572 facing the housing 220 . According to one embodiment, the window layer 510 , the polarization layer 520 , the display panel 530 , the polymer layer 540 , the metal sheet layer 550 , and the conductive plate 570 may include adhesives P1 , P2 , P3, P4) (or adhesive) can be attached to each other. For example, the adhesives P1 , P2 , P3 , and P4 may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, and a double-sided tape.

According to various embodiments, the display panel 530 may include a plurality of pixels and a wiring structure (eg, an electrode pattern). According to an embodiment, the polarization layer 520 may selectively pass light generated from the light source of the display panel 530 and vibrating in a predetermined direction. According to an embodiment, the display panel 530 and the polarization layer 520 may be integrally formed. According to an embodiment, the flexible display 500 may include a touch panel (not shown).

According to various embodiments, the polymer layer 540 is disposed under the display panel 530 to provide a dark background for securing visibility of the display panel 530 and may be formed of a cushioning material for a buffering action. . In some embodiments, for waterproofing the flexible display 500 , the polymer layer 540 may be removed or disposed under the metal sheet layer 550 .

According to various embodiments, the metal sheet layer 550 may be formed in a shape that provides flexibility to the flexible display 500 . According to an exemplary embodiment, the metal sheet layer 550 may include steel use stainless (SUS) (eg, stainless steel (STS)), Cu, Al, or a metal CLAD (eg, a stacked member in which SUS and Al are alternately disposed). may include at least one of In some embodiments, the metal sheet layer 550 may include other alloy materials. In some embodiments, the metal sheet layer 550 can help reinforce the stiffness of an electronic device (eg, the electronic device 200 of FIG. 2A ), shield ambient noise, and prevent heat dissipation from surrounding heat dissipating components. It can be used to dissipate heat.

According to various embodiments, the flexible display 500 is disposed under the metal sheet layer 550 and may include a digitizer 560 as a detection member receiving an input of an electronic pen (eg, a stylus). For example, the digitizer 560 may include a coil member disposed on the dielectric substrate to detect the resonance frequency of the electromagnetic induction method applied from the electronic pen.

According to various embodiments, the flexible display 500 may include at least one functional member (not shown) disposed between the polymer layer 540 and the metal sheet layer 550 or below the metal sheet layer 550 . have. According to an embodiment, the functional member may include a graphite sheet for heat dissipation, an added display, a poster touch FPCB, a fingerprint sensor FPCB, an antenna radiator for communication, or a conductive/non-conductive tape. According to one embodiment, when bending is not possible, the functional member may be individually attached to the first housing (eg, the first housing 210 in FIG. 2A ) and the second housing (eg, the second housing 220 in FIG. 2A ). may be placed. According to one embodiment, when the functional member is bendable, the first housing (eg, the first housing 210 in FIG. 2A ) passes through a hinge device (eg, the hinge device 240 in FIG. 2B ) to the second housing. (eg, the second housing 220 of FIG. 2A ) may be disposed up to at least a portion.

According to various embodiments, the electronic device (eg, the electronic device 200 of FIG. 2A ) is disposed under the flexible display 500 , and a camera device (eg, the electronic device 200 of FIG. 2A ) detects an external environment through the flexible display 500 . The first camera device 205 of 2a) may be included. In some embodiments, the electronic device (eg, electronic device 200 of FIG. 2A ) includes at least one sensor module (eg, sensor module 204 of FIG. 2A ) disposed below flexible display 500 (eg, illuminance) sensor, proximity sensor, or TOF sensor). According to one embodiment, the polarization layer 520 , the display panel 530 , the polymer layer 540 , the metal sheet layer 550 , the digitizer 560 , and the conductive plate 570 may include the through holes 5201 and 5301 , 5401, 5501, 5601, 5701). In some embodiments, the through-holes 5201 and 5301 may be unnecessary in the display panel 530 and/or the polarization layer 520 by adjusting the transmittance of the corresponding area. In some embodiments, the size of the through holes 5201 , 5301 , 5401 , 5501 , 5601 , 5701 is the size of the camera device (eg, the first camera device 205 of FIG. 2A ), and/or the size of the camera device (eg, the camera device 205 of FIG. 2A ). : It may be formed based on the angle of view of the first camera device 205 of FIG. 2A , and sizes of the respective through holes 5201 , 5301 , 5401 , 5501 , 5601 and 5701 may be different from each other.

6A is a view from one side of a wiring member 280 on which a first touch sensor and a second touch sensor are disposed, according to various embodiments of the present disclosure. 6B is a perspective view of a wiring member 280 on which a first touch sensor and a second touch sensor are disposed, according to various embodiments of the present disclosure.

6A and 6B , an electronic device (eg, the electronic device 200 of FIG. 2A ) may include a wiring member 280 (eg, a flexible printed circuit board (FPCB)). . For example, the wiring member 280 crosses the hinge device (eg, the hinge device 240 of FIG. 4 ) from the first substrate assembly (eg, the first substrate assembly 261 of FIG. 4 ), the second side member (eg, the hinge device 240 of FIG. 4 ). Example: a plurality of electronic components (eg, the second substrate of FIG. 4 ) disposed between the second side member 223 of FIG. 4 and the second rear cover (eg, the second rear cover 224 of FIG. 4 ) disposed to extend to an assembly (eg, second substrate assembly 262 in FIG. 4 ), a second battery (eg, second battery 272 in FIG. 4 ), or an antenna (eg, antenna 290 in FIG. 4 ). and may provide an electrical connection.

In one embodiment, the wiring member 280 includes a first area 280a facing the first housing (eg, the first housing 210 in FIG. 2A ), and a second housing (eg, the second housing 210 in FIG. 2A ). 220)), and a third region 280c disposed in the inner space of the hinge device (eg, the hinge device 240 of FIG. 2B ). In an embodiment, the third region 280c may connect the first region 280a and the second region 280b.

In an embodiment, the third region 280c may include a curved region 630 .

In an embodiment, the electronic device 200 may include a first touch sensor 610 and a second touch sensor 620 . The first touch sensor 610 and the second touch sensor 620 may include a capacitive type touch sensor.

In an embodiment, the first touch sensor 610 and the second touch sensor 620 may be disposed in the bent region 630 of the wiring member 280 . For example, the first touch sensor 610 may be disposed at a first point of the curved area 630 . The second touch sensor 620 may be disposed at a second point of the curved area 630 . The first touch sensor 610 and the second touch sensor 620 are in a folded state (eg, an unfolded state (eg, a state of FIG. 2A ), a folded state (eg, a state of FIG. 3A ) of the electronic device 200 , and / or to detect an intermediate state (eg, the state of FIG. 3B ).

The arrangement structure of the first touch sensor 610 and the second touch sensor 620 and the folding of the electronic device 200 using the first touch sensor 610 and the second touch sensor 620 according to various embodiments With respect to the embodiment of detecting the state, various embodiments will be described with reference to FIGS. 7A to 12 to be described later.

FIG. 7A is a diagram 700 illustrating a folded state of the electronic device 200 including the first touch sensor and the second touch sensor, according to various embodiments of the present disclosure. FIG. 7B is a view 750 illustrating an unfolded state of the electronic device 200 including the first touch sensor and the second touch sensor, according to various embodiments of the present disclosure.

7A and 7B , the electronic device (eg, the electronic device 200 of FIG. 2A ) includes a hinge housing 241 and a first housing 210 rotatably disposed on one side of the hinge housing 241 . and a second housing 220 rotatably disposed on the other side. The first housing 210 , the second housing 220 , and the hinge housing 241 may be formed of a conductive material.

In various embodiments, the electronic device 200 includes a member 710 for preventing the inflow of foreign substances (eg, dust, moisture) into the inner space of the first housing 210 and the inner space of the second housing 220 . may include The member 710 may have a shape capable of blocking the inflow of foreign substances. For example, the member 710 may have a brush shape, a porous shape, or a mesh shape.

In an embodiment, the electronic device 200 may include a flexible display 500 . As shown in FIG. 5 , the flexible display 500 includes a window layer 510 and a polarization layer (eg, FIG. 5 ) sequentially disposed on a rear surface (eg, -z-axis direction in FIG. 5 ) of the window layer 510 . of a polarization layer 520 ), a display panel 530 , a polymer layer 540 , a metal sheet layer 550 , and a conductive plate 570 . For example, the conductive plate 570 may include a first conductive plate 571 and a second conductive plate 572 arranged to be separated from each other when the electronic device 200 is in a folded state.

In an embodiment, the flexible display 500 includes a window layer 510 and a display panel (except for the first conductive plate 571 and the second conductive plate 572) when the electronic device 200 is in a folded state. 530 , the polymer layer 540 , and the metal sheet layer 550 may be deformed to be folded together.

In an embodiment, when the electronic device 200 is in a folded state, the window layer 510 generally faces the first region 510a and the second region 510b to face each other, and the third region 510c It can be folded with a specified curvature.

In an embodiment, the electronic device 200 is in a folded state (eg, an unfolded state (eg, a state of FIG. 2A ), a closed state (eg, a state of FIG. 3A ), and an intermediate state (eg, a state of FIG. 3A ) of the electronic device 200 . a first touch sensor 610 and a second touch sensor 620 for detecting (state of FIG. 3B )). The first touch sensor 610 and the second touch sensor 620 may include a capacitive touch sensor.

In an embodiment, the electronic device 200 may include a wiring member 280 extending through the first housing 210 , the hinge housing 241 , and the second housing 220 . The first touch sensor 610 and the second touch sensor 620 may be disposed in the bent region 630 of the wiring member 280 . For example, the first touch sensor 610 and the second touch sensor 620 may transition from a folded state of the electronic device 200 (eg, a folded state (eg, the state of FIG. 3A ) to an intermediate state (eg, the state of FIG. 3B ). a conductive plate (e.g., the second state) based on transitioning from an unfolded state to a folded or intermediate state, or from an intermediate state to an unfolded or folded state) or to an unfolded state (eg, the state of FIG. The first conductive plate 571 and the second conductive plate 572) may be disposed at a point of the curved region 630 where the detection is possible.

For example, the first touch sensor 610 may be disposed at a first point of the curved area 630 . The second touch sensor 620 may be disposed at a second point of the curved area 630 . In an embodiment, the first point of the bent region 630 may include a point corresponding to one side of the first conductive plate 571 in the folded state of the electronic device 200 (eg, the state of FIG. 3A ). . The second point of the bent region 630 may include a point corresponding to one side of the second conductive plate 572 in the folded state of the electronic device 200 (eg, the state of FIG. 3A ). However, the present invention is not limited thereto.

In an embodiment, when the electronic device 200 transitions from the folded state (eg, the state of FIG. 7A ) to the unfolded state (eg, the state of FIG. 7B ), the first housing 210 and the second housing 220 are An angle of 180 degrees may be formed, and the first portion (eg, the first portion 230a of FIG. 2B ) and the second portion (eg, the second portion 230b of FIG. 2B ) of the flexible display 500 are in the same direction It can be arranged to face. In addition, a third portion 230c (eg, a third portion 230c) that connects the first portion 230a and the second portion 230b of the flexible display 500 and corresponds to a hinge device (eg, the hinge device 240 of FIG. 2B ). : bendable region), the first portion 230a and the second portion 230b may be formed on the same plane.

In various embodiments, a transition of the electronic device 200 from a folded state (eg, a folded state (eg, the state of FIG. 3A ) to an intermediate state (eg, the state of FIG. 3B ) or an unfolded state (eg, the state of FIG. 2A ) ), when a transition from an unfolded state to a folded state or an intermediate state, or a transition from an intermediate state to an unfolded state or a folded state) is detected, the distance between the first touch sensor 610 and the first conductive plate 571 and / Alternatively, the distance between the second touch sensor 620 and the second conductive plate 572 may vary.

For example, when a transition from the folded state of the electronic device 200 of FIG. 7A to the unfolded state of FIG. 7B is detected, the first distance 730 between the first conductive plate 571 and the first touch sensor 610 . may be changed to the third distance 760 . For example, the third distance 760 may be greater than the first distance 730 . In other words, as the electronic device 200 transitions from the folded state to the unfolded state, the distance between the first conductive plate 571 and the first touch sensor 610 may increase. In addition, when a transition from the folded state of the electronic device 200 of FIG. 7A to the unfolded state of FIG. 7B is detected, the second distance 740 between the second conductive plate 572 and the second touch sensor 620 . may be changed to the fourth distance 770 . For example, the fourth distance 770 may be greater than the second distance 740 . In other words, as the electronic device 200 transitions from the folded state to the unfolded state, the distance between the second conductive plate 572 and the second touch sensor 620 may increase.

In one embodiment, as the distance between the first touch sensor 610 and the first conductive plate 571 and/or the distance between the second touch sensor 620 and the second conductive plate 572 is changed, the first touch A change in capacitance according to a distance between the sensor 610 and the first conductive plate 571 and/or a change in capacitance according to a distance between the second touch sensor 620 and the second conductive plate 572 may occur. .

In various embodiments, each of the first touch sensor 610 and the second touch sensor 620 may be connected to the sensor circuit 720 (eg, the sensor module 176 of FIG. 1 ) through wiring. The electronic device 200 changes the distance between the first conductive plate 571 and the first touch sensor 610 through the sensor circuit 720 (eg, the first distance 730 to the second distance 760 ). ) as the first capacitance changes and the distance between the second conductive plate 572 and the second touch sensor 620 is changed (eg, the second distance 740 to the fourth distance 770 is changed) A change in the second capacitance may be confirmed. The electronic device 200 may check a folded state (eg, an unfolded state, a folded state, or an intermediate state) of the electronic device 200 based on the change in the first capacitance and the change in the second capacitance.

In an embodiment, the electronic device 200 may control the electronic device 200 to operate in an operation mode corresponding to the confirmed folding state. For example, when the electronic device 200 is in an unfolded state, the electronic device 200 may display content through the flexible display 500 . As another example, when the folded state of the electronic device 200 is the folded state, the electronic device 200 displays the state information of the electronic device 200 through the sub-display (eg, the sub-display 231 of FIG. 3A ). can be displayed As another example, when the folded state of the electronic device 200 is an intermediate state, the electronic device 200 includes a display area corresponding to the first surface (eg, the first surface 211 of FIG. 2B ); Different content may be displayed on the display area corresponding to the three surfaces (eg, the third surface 221 of FIG. 2B ).

Various embodiments will be described with reference to FIG. 8, which will be described later, in relation to a change in capacitance due to detection of a transition of the folding state of the electronic device 200 according to various embodiments.

FIG. 8 is a diagram 800 for explaining a transition of the electronic device 200 to a folded state and a change in capacitance according to a transition of the electronic device 200, according to various embodiments of the present disclosure.

In the electronic device (eg, the electronic device 200 of FIG. 2A ) according to various embodiments, the first touch sensor 610 and the third A second touch sensor 620 disposed at a second point of the region 280c may be included.

In an embodiment, when the electronic device 200 detects a transition from the folded state (eg, the state of FIG. 7A ) to the unfolded state (eg, the state of FIG. 7B ), the first conductive plate 571 and the first touch sensor The distance between the 610 and/or the second conductive plate 572 and the second touch sensor 620 may be changed.

For example, referring to reference number <810> of FIG. 8, when the electronic device 200 transitions from the folded state (eg, the state of FIG. 7A) to the unfolded state (eg, the state of FIG. 7B), the first housing ( Example: The flexible display 500 disposed to cross the first housing 210 of FIG. 2A and the second housing 220 of FIG. 2A ) may be unfolded from 90 degrees to 180 degrees. can As the flexible display 500 is unfolded from 90 degrees to 180 degrees, the first conductive plate 571 for detecting a change in capacitance using the first touch sensor 610 and the second touch sensor 620 . and the second conductive plate 572 may also be in the unfolded states 815 and 825 from 90 degrees to 180 degrees. As the first conductive plate 571 and the second conductive plate 572 are unfolded from 90 degrees to 180 degrees (815 and 825), the distance between the first conductive plate 571 and the first touch sensor 610 and /or the distance between the second conductive plate 572 and the second touch sensor 620 may also be changed.

For example, as the electronic device 200 transitions from the folded state to the unfolded state, the distance between the first conductive plate 571 and the first touch sensor 610 is a first distance d1 ( 811 ) and a second distance ( d2 ). (812), . , the n-th distance dn 813 may be changed. In addition, as the electronic device 200 transitions from the folded state to the unfolded state, the distance between the second conductive plate 572 and the second touch sensor 620 is a first distance (d'1) (821), a second distance ( d'2) (822), ... , may be changed to an n-th distance (d'n) 823 .

In various embodiments, in the electronic device 200 , the distance between the first conductive plate 571 and the first touch sensor 610 is changed (eg, a first distance d1 811 and a second distance d2 ). (812, ..., changed to the n-th distance dn (813)), a change in capacitance according to the changed distance may be detected. Also, in the electronic device 200 , the distance between the second conductive plate 572 and the second touch sensor 620 is changed (eg, a first distance d′1 821 and a second distance d′2). As (822), ..., the n-th distance (d'n) is changed to 823), a change in capacitance according to the changed distance may be detected.

For example, referring to reference number <850>, the x-axis is the distance 860 between the first conductive plate 571 and the first touch sensor 610 (and the second conductive plate 572 and the second touch sensor 620). distance) can be shown. The y-axis is the capacitance 870 according to the distance between the first conductive plate 571 and the first touch sensor 610 (and the capacitance according to the distance between the second conductive plate 572 and the second touch sensor 620). is shown.

In an embodiment, based on the transition of the electronic device 200 from the folded state to the unfolded state, the distance between the first conductive plate 571 and the first touch sensor 610 is a first distance d1 (811), The second distance d2 (812), . . . , the n-th distance dn 813 may be changed. As the distance between the first conductive plate 571 and the first touch sensor 610 is changed, the capacitance 870 also includes the first capacitance 870a, the second capacitance 870b, . , may be changed to the nth capacitance 870n. Similarly, based on the transition of the electronic device 200 from the folded state to the unfolded state, the distance between the second conductive plate 572 and the second touch sensor 620 is a first distance (d'1) (821), a second 2 distance (d'2) (822), . . . , may be changed to an n-th distance (d'n) 823 . 2 As the distance between the conductive plate 572 and the second touch sensor 620 is changed, the capacitance 870 also includes the first capacitance 870a, the second capacitance 870b, . , may be changed to the nth capacitance 870n.

In various embodiments, as shown at 850, a conductive plate (eg, first conductive plate 571 and/or second conductive plate 572) and a touch sensor (eg, first touch sensor) It can be seen that the capacitance 870 decreases as the distance 860 between the 610 and/or the second touch sensor 620 increases. The electronic device 200 may determine that the electronic device 200 has transitioned from the folded state to the unfolded state based on detecting a change in the capacitance decrease. Alternatively, between a conductive plate (eg, first conductive plate 571 and/or second conductive plate 572 ) and a touch sensor (eg, first touch sensor 610 and/or second touch sensor 620 ). As the distance 860 increases, the capacitance 870 may increase. The electronic device 200 may determine that the electronic device 200 has transitioned from the unfolded state to the folded state based on detecting a change in the increase in capacitance.

In various embodiments, when the electronic device 200 transitions from a folded state or an unfolded state to an intermediate state (eg, the state of FIG. 3B ), the first touch sensor 610 and the second A change in the distance between the first conductive plates 571 or the distance between the second touch sensor 620 and the second conductive plate 572 may be detected. For example, when the electronic device 200 is transitioned from the folded state to the intermediate state, the distance between the first conductive plate 571 and the first touch sensor 610 is a first distance (d1) 811, a second distance ( d2) (812), ... , the n-th distance (dn) 813 is detected to be changed, or the distance between the second conductive plate 572 and the second touch sensor 620 is the first distance (d'1) 821, the second Distance d'2 (822), . . . , a change to the n-th distance d'n 823 may be detected.

For example, in a state where the first conductive plate 571 and the second conductive plate 572 for detecting a change in capacitance using the first touch sensor 610 and the second touch sensor 620 are at 90 degrees, one Only the conductive plate (eg, the first conductive plate 571 or the second conductive plate 573) may be in a 180-degree unfolded state. As another example, only one conductive plate (eg, the first conductive plate 571 or the second conductive plate 573) is 90 degrees in a state where the first conductive plate 571 and the second conductive plate 572 are 180 degrees. can become a thief. When the state of one of the first conductive plate 571 and the second conductive plate 572 is changed (eg, changed from 90 degrees to 180 degrees or 180 degrees to 90 degrees), one conductive plate whose state is changed The distance between (eg, the first conductive plate 571 or the second conductive plate 573 ) and a corresponding touch sensor (eg, the first touch sensor 610 or the second touch sensor 620 ) may be changed. Based on the change in capacitance detected as the distance between one conductive plate whose state is changed and the corresponding touch sensor is changed, the electronic device 200 changes the folded state from the folded state to the intermediate state or from the unfolded state. It can be seen that the transition to the intermediate state is observed.

FIG. 9 is a view 900 of an electronic device 200 including a first touch sensor and a second touch sensor viewed from one side in a folded state, an unfolded state, and a wiring member 280 according to various embodiments of the present disclosure; .

Referring to FIG. 9 , the first housing 210 and the second housing 220 may be disposed on both sides about the folding axis (axis A), and may have a substantially symmetrical shape with respect to the folding axis (axis A). have.

In various embodiments, as the electronic device 200 transitions from the folded state 700 to the unfolded state 750 , the first disposed in the bent region 630 of the third region 280c of the wiring member 280 . The first distance between the touch sensor 610 and the first conductive plate 571 (eg, the first distance 730 of FIG. 7A ) is a third distance (eg, the third distance 730 of FIG. 7B ) greater than the first distance 730 . distance 760). The electronic device 200 may detect a change in the first capacitance according to a change in the distance between the first touch sensor 610 and the first conductive plate 571 by using the sensor circuit 720 . Also, as the electronic device 200 transitions from the folded state 700 to the unfolded state 750 , the second touch sensor 620 disposed in the bent region 630 of the third region 280c of the wiring member 280 . ) and the second distance between the second conductive plate 572 (eg, the second distance 740 in FIG. 7A ) is a fourth distance greater than the second distance 740 (eg, the fourth distance 770 in FIG. 7B ). ) can be changed to The electronic device 200 may detect a change in the second capacitance according to a change in the distance between the second touch sensor 620 and the second conductive plate 572 using the sensor circuit 720 .

For example, when the electronic device 200 transitions from the folded state 700 to the unfolded state 750 , the distance between the first conductive plate 571 and the first touch sensor 610 may increase, and thus detection The first capacitance to be used may be reduced. When the electronic device 200 transitions from the folded state 700 to the unfolded state 750 , the distance between the second conductive plate 572 and the second touch sensor 620 may increase, and thus the detected second The capacitance can be small. The electronic device 200 may determine that the electronic device 200 is in the unfolded state based on detecting a change in which the capacitance decreases.

This is not limited thereto, and when the electronic device 200 transitions from the unfolded state 750 to the folded state 700 , the distance between the first conductive plate 571 and the first touch sensor 610 may become closer. , the detected first capacitance may increase accordingly. When the electronic device 200 transitions from the unfolded state 750 to the folded state 700 , the distance between the second conductive plate 572 and the second touch sensor 620 may become closer, and accordingly, the detected second 2 The capacitance can be large. The electronic device 200 may determine that the electronic device 200 is in the folded state based on detecting a change in the increase in capacitance.

In an embodiment, the electronic device 200 may control the electronic device 200 to operate in an operation mode corresponding to the folded state. For example, when the electronic device 200 is in an unfolded state, the electronic device 200 may display content through the flexible display 500 . As another example, when the folded state of the electronic device 200 is the folded state, the electronic device 200 displays the state information of the electronic device 200 through the sub-display (eg, the sub-display 231 of FIG. 3A ). can be displayed As another example, when the folded state of the electronic device 200 is an intermediate state, the electronic device 200 includes a display area corresponding to the first surface (eg, the first surface 211 of FIG. 2B ); Different content may be displayed on the display area corresponding to the three surfaces (eg, the third surface 221 of FIG. 2B ).

10A is a view of a wiring member 280 including a plurality of first touch sensors and a plurality of second touch sensors as viewed from one side, according to various embodiments of the present disclosure. 10B is a perspective view of a wiring member 280 including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure.

Since the wiring member 280 of FIGS. 10A and 10B according to various embodiments has substantially the same configuration as the wiring member 280 of FIGS. 6A and 6B described above, a description thereof is provided in FIGS. 6A and 6B . to be replaced with In FIGS. 10A and 10B according to various embodiments, only configurations different from those of FIGS. 6A and 6B will be described.

The first touch sensor 610 and the second touch sensor 620 are disposed in the bent area 630 of the third area 280c of the wiring member 280 in the aforementioned FIGS. 6A to 9 according to various embodiments. has been described, but is not limited thereto.

For example, referring to FIGS. 10A and 10B , the first touch sensor 610 may include a plurality of first touch sensors 610a, 610b, ..., 610n, and the second touch sensor 620 includes a plurality of may include second touch sensors 620a, 620b, ..., 620n. The plurality of first touch sensors 610a, 610b, ..., 610n and the plurality of second touch sensors 620a, 620b, ..., 620n may include a capacitive touch sensor.

In an embodiment, the plurality of first touch sensors 610a, 610b, ..., 610n and the plurality of second touch sensors 620a, 620b, ..., 620n are the bent region 630 of the wiring member 280 . can be placed in For example, the plurality of first touch sensors 610a, 610b, ..., 610n may be disposed at a first point of the curved area 630 . The plurality of first touch sensors 610a, 610b, ..., 610n may be disposed at a first point of the curved area 630 to be spaced apart from each other at a predetermined interval. The plurality of second touch sensors 620a, 620b, ..., 620n may be disposed at a second point of the curved area 630 . The plurality of second touch sensors 620a, 620b, ..., 620n may be disposed at a second point of the curved area 630 to be spaced apart from each other at a predetermined interval.

In an embodiment, the plurality of first touch sensors 610a, 610b, ..., 610n and the plurality of second touch sensors 620a, 620b, ..., 620n are in a folded state (eg, It may be used to detect an unfolded state (eg, the state of FIG. 2A ), a folded state (eg, the state of FIG. 3A ), and/or an intermediate state (eg, the state of FIG. 3B ).

11A is a view 1100 illustrating a folded state of the electronic device 200 including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure. 11B is a diagram 1150 illustrating an unfolded state of the electronic device 200 including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure.

Since FIGS. 11A and 11B according to various embodiments have substantially the same configuration as those of FIGS. 7A and 7B, a description thereof will be replaced with FIGS. 7A and 7B. In FIGS. 11A and 11B according to various embodiments, only a configuration different from that of FIGS. 7A and 7B will be described.

11A and 11B , the electronic device (eg, the electronic device 200 of FIG. 2A ) may be in a folded state (eg, an unfolded state (eg, the state of FIG. 2A ) and a closed state (eg, the electronic device 200 of FIG. 2A ). : A plurality of first touch sensors 610a, 610b, 610c, ..., 610n and a plurality of second touch sensors for detecting an intermediate state (eg, state of FIG. 3B )), and a state of FIG. 3A ) (620a, 620b, 620c, ..., 620n) may be included.

In an embodiment, the plurality of first touch sensors 610a, 610b, 610c, ..., 610n and the plurality of second touch sensors 620a, 620b, 620c, ..., 620n may be bent in the wiring member 280. It may be disposed in the region 630 . For example, the folding state of the electronic device 200 transitions between the plurality of first touch sensors 610a, 610b, 610c, ..., 610n and the plurality of second touch sensors 620a, 620b, 620c, ..., 620n. (eg, a transition from a folded state (eg, the state of FIG. 3A ) to an intermediate state (eg, the state of FIG. 3B ) or an unfolded state (eg, the state of FIG. 2A ), a transition from an unfolded state to a folded or intermediate state, or Based on the transition from the intermediate state to the unfolded state or the folded state), the conductive plate (eg, the first conductive plate 571 and the second conductive plate 572 ) can be detected at the point of the bent region 630 . can be placed.

For example, the plurality of first touch sensors 610a , 610b , 610c , ..., 610n may be disposed at a first point of the curved area 630 . Each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n may be disposed to be spaced apart from each other at a first point of the curved area 630 . The plurality of second touch sensors 620a, 620b, 620c, ..., 620n may be disposed at a second point of the curved area 630 . Each of the plurality of second touch sensors 620a, 620b, 620c, ..., 620n may be disposed to be spaced apart from each other at a second point of the curved area 630 .

In various embodiments, the electronic device 200 determines the distances 1110a, 1110b, 1110c, ..., between the first conductive plate 571 and the plurality of first touch sensors 610a, 610b, 610c, ..., 610n, respectively. 1110n) and the distance between the second conductive plate 572 and the plurality of second touch sensors 620a, 620b, 620c, ..., 620n, respectively, based on the distances 1120a, 1120b, 1120c, ..., 1120n, the electronic device You can check the folding state of (200).

In various embodiments, when the electronic device 200 transitions from the folded state to the unfolded state, the plurality of first touch sensors 610a, 610b, 610c, ..., 610n and the plurality of second touch sensors 620a The first conductive plate 571 and the second conductive plate 572 for detecting a change in capacitance using , 620b, 620c, ..., 620n may also be unfolded from 90 degrees to 180 degrees. As the first conductive plate 571 and the second conductive plate 572 are unfolded from 90 degrees to 180 degrees, the first conductive plate 571 and the plurality of first touch sensors 610a, 610b, 610c, ... , 610n) and/or a distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, 620c, ..., 620n may be changed.

For example, as the electronic device 200 transitions from the folded state to the unfolded state, the distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n is the first distance ( 1110a), a second distance 1110b, a third distance 1110c ... , from the fourth distance 1110n to the fifth distance 1160a, the sixth distance 1160b, the seventh distance 1160c, ... , may be changed to the eighth distance 1160n. Based on a change in the distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n, the electronic device 200 is changed through the sensor circuit 720 It is possible to detect a change in capacitance according to the distance. Similarly, as the electronic device 200 transitions from the folded state to the unfolded state, the distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n is the first distance 1120a. , the second distance 1120b, the third distance 1120c, ... , a fifth distance 1170a, a sixth distance 1170b, a seventh distance 1170c, . , may be changed to the eighth distance 1170n. Based on the change in the distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n, the electronic device 200 changes the distance through the sensor circuit 720 It is possible to detect a change in capacitance according to

In an embodiment, a distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n is a first distance 1110a, a second distance 1110b, a third distance Distance 1110c ... , from the fourth distance 1110n to the fifth distance 1160a, the sixth distance 1160b, the seventh distance 1160c, ... , may gradually increase toward the eighth distance 1160n, and accordingly, the detected capacitance may decrease. In addition, the distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n is a first distance 1120a, a second distance 1120b, a third distance 1120c, … , a fifth distance 1170a, a sixth distance 1170b, a seventh distance 1170c, . , may gradually increase toward the eighth distance 1170n, and thus the detected capacitance may decrease. The electronic device 200 may determine that the electronic device 200 has transitioned from the folded state to the unfolded state based on detecting a change in the capacitance decrease.

In various embodiments, a distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n is a fifth distance 1160a, a sixth distance 1160b, Seventh distance 1160c, ... , the first distance 1110a, the second distance 1110b, the third distance 1110c at the eighth distance 1160n ... , when the fourth distance 1110n gets closer, the detected capacitance may increase. In addition, a distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n is a fifth distance 1170a, a sixth distance 1170b, and a seventh distance 1170c. , … , the first distance 1120a, the second distance 1120b, the third distance 1120c, ... in the eighth distance 1170n. , as the fourth distance 1120n approaches, the detected capacitance may increase. The electronic device 200 may determine that the electronic device 200 has transitioned from the unfolded state to the folded state based on detecting a change in the increase in capacitance.

In various embodiments, a change in the distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a , 610b , 610c , ..., 610n or the second conductive plate 572 and the plurality of second When a change in the distance between each of the touch sensors 620a, 620b, ..., 620n is detected, the electronic device 200 may determine that the electronic device 200 has transitioned from the unfolded state or the folded state to the intermediate state.

12 is a view from one side of a folded state, an unfolded state, and a wiring member 280 of an electronic device 200 including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure; It is a drawing 1200 .

Referring to FIG. 12 , the first housing 210 and the second housing 220 may be disposed on both sides about the folding axis (axis A), and may have a substantially symmetrical shape with respect to the folding axis (axis A). have.

In various embodiments, as the electronic device 200 transitions from the folded state 1200 to the unfolded state 1250 , the plurality of devices disposed in the bent region 630 of the third region 280c of the wiring member 280 . A distance between the first touch sensors 610a, 610b, 610c, ..., 610n and the first conductive plate 571 is a first distance (eg, a first distance 1110a of FIG. 10A ), a second distance (eg, FIG. 10A ) The second distance 1110b of 10a), the third distance (eg, the third distance 1110c of FIG. 10A) ... , a fourth distance (eg, a fourth distance 1110n in FIG. 10A ) to a fifth distance (eg, a fifth distance 1160a in FIG. 10B ), a sixth distance (eg, a sixth distance 1160b in FIG. 10B ) ), the seventh distance (eg, the seventh distance 1160c in FIG. 10B ), ... , the eighth distance (eg, the eighth distance 1160n of FIG. 10B ). The electronic device 200 uses the sensor circuit 720 to change the capacitance as the distance between the plurality of first touch sensors 610a, 610b, 610c, ..., 610n and the first conductive plate 571 is changed. can be detected.

In an embodiment, as the electronic device 200 transitions from the folded state 1200 to the unfolded state 1250 , the plurality of third devices disposed in the bent region 630 of the third region 280c of the wiring member 280 . 2 A distance between the touch sensors 620a, 620b, 620c, ..., 620n and the second conductive plate 572 is a first distance (eg, a first distance 1120a of FIG. 10A ), a second distance (eg, FIG. 10A ) The second distance 1120b of ), the third distance (eg, the third distance 1120c of FIG. 10A ), . . . , a fourth distance (eg, a fourth distance 1120n in FIG. 10A ) to a fifth distance (eg, a fifth distance 1170a in FIG. 10B ), a sixth distance (eg, a sixth distance 1170b in FIG. 10B ) ), the seventh distance (eg, the seventh distance 1170c in FIG. 10B ), . , the eighth distance (eg, the eighth distance 1170n of FIG. 10B ). The electronic device 200 uses the sensor circuit 720 to change the capacitance as the distance between the plurality of second touch sensors 620a, 620b, 620c, ..., 620n and the second conductive plate 572 is changed. can be detected.

For example, when the electronic device 200 transitions from the folded state 1200 to the unfolded state 1250 , the first conductive plate 571 and the plurality of first touch sensors 610a, 610b, 610c, ..., 610n) The distance between them may be increased, and thus the detected capacitance may be reduced. When the electronic device 200 transitions from the folded state 1200 to the unfolded state 1250 , between the second conductive plate 572 and the plurality of second touch sensors 620a , 620b , 620c , ..., 620n, respectively. The distance may be increased, and thus the detected capacitance may be small. The electronic device 200 may determine that the electronic device 200 has transitioned from the folded state 1200 to the unfolded state 1250 based on detecting a change in which the capacitance decreases.

The present invention is not limited thereto, and when the electronic device 200 transitions from the unfolded state 1250 to the folded state 1200 , the first conductive plate 571 and the plurality of first touch sensors 610a, 610b, 610c, ..., 610n) may become closer together, and thus the detected capacitance may increase. When the electronic device 200 transitions from the unfolded state 1250 to the folded state 1200 , the second conductive plate 572 and the plurality of second touch sensors 620a , 620b , 620c , ..., 620n are interposed between each other. The distance may become close, and thus the detected capacitance may increase. The electronic device 200 may determine that the electronic device 200 has transitioned from the unfolded state 1250 to the folded state 1200 based on detecting a change in the capacitance increasing.

In an embodiment, the electronic device 200 may control the electronic device 200 to operate in an operation mode corresponding to the folded state.

13 is a view 1300 illustrating a stacked structure of the wiring member 280 according to various embodiments of the present disclosure.

Referring to FIG. 13 , a wiring member (eg, the wiring member 280 of FIG. 4 ) may include a plurality of wiring layers 1310 . The plurality of wiring layers 1310 include a first wiring layer 1310a, a second wiring layer 1310b, . , an n-th wiring layer 1310n may be included.

In an embodiment, each of the plurality of wiring layers 1310 includes conductive layers 1310aa, 1310ba, ..., 1310na (eg, Cu) and insulating layers 1310ab, 1310bb, …, 1310nb (eg, 1310nb) disposed on the rear surface of the conductive layer. : PPG (prepreg)).

In an embodiment, the first touch sensor 610 and the second touch sensor 620 may be disposed at the first and second points of the third region 280c of the wiring member 280 . For example, the first touch sensor 610 and the second touch sensor 620 may be disposed on the conductive layer 1310aa constituting the first wiring layer 1310a.

In various embodiments, first and second points corresponding to the first and second points of the conductive layer 1310aa constituting the first wiring layer 1310a on which the first touch sensor 610 and the second touch sensor 620 are disposed The first and second points of the conductive layer 1310ba constituting the second wiring layer 1310b may be grounded with a mesh pattern 1400 .

In FIG. 13 according to various embodiments, the first and second points of the conductive layer 1310aa constituting the first wiring layer 1310a on which the first touch sensor 610 and the second touch sensor 620 are disposed The first and second points of the conductive layer 1310ba constituting the second wiring layer 1310b corresponding to Due to the shortest distance between them, it is possible to prevent a change in capacitance due to the surrounding conductive material (eg, metal, magnetic material). Accordingly, it is possible to prevent misrecognition of the folded state of the electronic device 200 (eg, misrecognition such as recognizing an unfolded state as a folded state) due to a surrounding conductive material (eg, a metal or a magnetic material).

14 is a diagram 1400 for explaining a mesh pattern according to various embodiments of the present disclosure.

Referring to FIG. 14 , as shown by reference number <1410>, the mesh pattern may have a grid type. For example, the mesh pattern has specified widths 1411 and 1412 (eg, about 0.25 mm), and may be formed while forming specified intervals 1413 and 1414 (eg, about 0.25 mm).

As another example, as shown in reference numeral 1430, the mesh pattern may have a cross type. For example, the mesh pattern may be formed at a specified angle 1434 (eg, about 45 degrees), having a specified width 1432 (eg, about 0.2 mm), and forming a specified spacing 1433 (eg, about 0.2 mm). can

As another example, as shown by reference numeral <1450>, the mesh pattern may have a grid type. For example, the mesh pattern may have specified widths 1451 and 1452 (eg, about 0.5 mm), and may be formed while forming specified intervals 1453 and 1454 (eg, about 0.5 mm). For example, the width and spacing of the mesh pattern indicated by reference number <1450> may be smaller than the width and spacing of the mesh pattern indicated by reference number <1410>.

As another example, as shown by reference number <1470>, the mesh pattern may have a cross type. For example, the mesh pattern may be formed at a specified angle 1434 (eg, about 45 degrees), having a specified width 1472 (eg, about 0.8 mm), and forming a specified spacing 1473 (eg, about 0.4 mm). can For example, the width and spacing of the mesh pattern indicated by reference number <1470> may be smaller than the width and spacing of the mesh pattern indicated by reference number <1430>.

15 is a view 1500 for explaining a second wiring layer grounded in a mesh pattern according to various embodiments of the present disclosure.

Referring to FIG. 15 , the wiring member (eg, the wiring member 280 of FIG. 4 ) includes a plurality of wiring layers (eg, the plurality of wiring layers 1310 of FIG. 13 ) (eg, the first wiring layer 1310a of FIG. 13 ). ), a second wiring layer 1310b, ..., an n-th wiring layer 1310n). Each of the plurality of wiring layers 1310 includes a conductive layer (eg, 1310aa, 1310ba, ..., 1310na of FIG. 13 ) (eg, Cu) and an insulating layer (eg, 1310ab, 1310bb, … of FIG. 13 ) disposed on the rear surface of the conductive layer (eg, Cu). , 1310nb) (eg, PPG).

In an embodiment, the first touch sensor 610 and the second touch sensor 620 for detecting the folding state of the electronic device (eg, the electronic device 200 of FIG. 2A ) are conductive of the first wiring layer 1310a. may be disposed on layer 1310aa. The area of the conductive layer 1310ba of the second wiring layer 1310b corresponding to the area of the first wiring layer 1310a in which the first touch sensor 610 and the second touch sensor 620 are disposed is to be grounded in a mesh pattern. can

Referring to FIG. 15 , as shown in reference numerals <1510>, <1520>, and <1530>, in the region of the first wiring layer 1310a in which the first touch sensor 610 and the second touch sensor 620 are disposed. A region of the conductive layer 1310ba of the corresponding second wiring layer 1310b may be grounded with different mesh patterns 1511 , 1521 , and 1531 of a lattice type.

In another embodiment, as shown in reference numerals <1540>, <1550>, and <1560>, the first touch sensor 610 and the second touch sensor 620 correspond to the region of the first wiring layer 1310a disposed therein. A region of the conductive layer 1310ba of the second wiring layer 1310b may be grounded with different cross-type mesh patterns 1541 , 1551 , and 1561 .

16 is a flowchart 1600 for explaining a method of detecting a folding state of the electronic device 200 according to various embodiments of the present disclosure.

Referring to FIG. 16 , in operation 1610 , the electronic device (eg, the electronic device 200 of FIG. 2A ) includes a first conductive plate (eg, the first conductive plate 571 of FIG. 7A ) and a first touch sensor (eg, the first conductive plate 571 of FIG. 7A ). : Change of the first capacitance and/or the second conductive plate (eg, the second conductive plate 572 of FIG. 7A ) and the second touch sensor as the distance between the first touch sensor 610 of FIG. 7A is changed A change in the second capacitance as the distance between (eg, the second touch sensor 620 of FIG. 7A ) is changed may be confirmed. In operation 1620 , the electronic device 200 may check the folding state of the electronic device 200 based on the change in the first capacitance and the change in the second capacitance.

In an embodiment, when the electronic device 200 transitions from the folded state to the unfolded state, the distance between the first conductive plate 571 and the first touch sensor 610 may increase, and accordingly, the first detected first The capacitance can be small. When the electronic device 200 transitions from the folded state 700 to the unfolded state 750 , the distance between the second conductive plate 572 and the second touch sensor 620 may increase, and thus the detected second The capacitance can be small. The electronic device 200 may determine that the folded state of the electronic device 200 is the unfolded state based on detecting a decrease in the first capacitance and the second capacitance.

In another embodiment, when the electronic device 200 transitions from the unfolded state to the folded state, the distance between the first conductive plate 571 and the first touch sensor 610 may become closer, and accordingly, the detected first The capacitance may be large. When the electronic device 200 transitions from the unfolded state to the folded state, the distance between the second conductive plate 572 and the second touch sensor 620 may become close, and thus the detected second capacitance may increase. have. The electronic device 200 may determine that the folded state of the electronic device 200 is the folded state based on detecting a change in which the first capacitance and the second capacitance increase.

In another embodiment, when the electronic device 200 transitions from the unfolded state or the folded state to the intermediate state, only a change in capacitance of one of a change in the first capacitance and a change in the second capacitance may be detected. have. For example, when the electronic device 200 transitions from the unfolded state to the intermediate state, a change in one of the change in the first capacitance or the change in the second capacitance may be detected, and based on this, a change in the increase in the capacitance of the electronic device 200 may be detected. It can be determined that (200) is an intermediate state. As another example, when the electronic device 200 transitions from the folded state to the intermediate state, a change in which one of the change in the first capacitance or the change in the second capacitance becomes smaller may be detected. Based on this, it may be determined that the folded state of the electronic device 200 is an intermediate state.

In another embodiment, when the electronic device 200 transitions from the intermediate state to the unfolded state or the folded state, only a change in capacitance of one of a change in the first capacitance and a change in the second capacitance may be detected. have. For example, when the electronic device 200 transitions from the intermediate state to the unfolded state, it is possible to detect a change in the capacitance of one of the change in the first capacitance or the change in the second capacitance, and based on this, a change in the capacitance of the electronic device 200 may be detected. It may be determined that the folded state of the device 200 is an unfolded state. As another example, when the electronic device 200 transitions from the intermediate state to the folded state, it is possible to detect a change in the capacitance of one of a change in the first capacitance or a change in the second capacitance, which increases based on this. Accordingly, it may be determined that the folded state of the electronic device 200 is an intermediate state.

In an embodiment, in operation 1630 , the electronic device 200 may control the electronic device 200 to operate in an operation mode corresponding to the folded state of the electronic device 200 .

In an embodiment, when the folded state of the electronic device 200 is confirmed to be the unfolded state, the electronic device 200 may display content through a flexible display (eg, the flexible display 500 of FIG. 5 ).

In an embodiment, when the folded state of the electronic device 200 is confirmed as the folded state, the electronic device 200 displays state information of the electronic device 200 through a sub-display (eg, the sub-display 231 of FIG. 3A ). can be displayed. When the state information of the electronic device 200 is displayed through the sub-display 231 and a specified time elapses, the electronic device 200 turns off the sub-display 231 and waits for the electronic device 200 It can be controlled to operate in a mode (eg, power saving mode).

In an embodiment, when the folded state of the electronic device 200 is confirmed as the intermediate state, the electronic device 200 includes a display area corresponding to the first surface (eg, the first surface 211 of FIG. 2B ); The flexible display 500 may be controlled to display different contents on the display area corresponding to the three sides (eg, the third side 221 of FIG. 2B ).

In various embodiments, a change in the first capacitance as the distance between the first conductive plate 571 and the first touch sensor 610 is changed and/or a change in the second conductive plate 572 and the second touch sensor 620 . ) based on the change in the second capacitance as the distance between them is changed, it has been described that the folding state of the electronic device 200 is checked, but the present invention is not limited thereto. For example, the first touch sensor 610 may include a plurality of first touch sensors (eg, the plurality of first touch sensors 610a, 610b, ..., 610n of FIGS. 10A and 10B), The second touch sensor 620 may include a plurality of second touch sensors (eg, the plurality of second touch sensors 620a, 620b, ..., 620n of FIGS. 10A and 10B ). In the electronic device 200, a change in first capacitance and a second conductive plate according to a change in the distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n Based on a change in the second capacitance as the distance between the 572 and each of the plurality of second touch sensors 620a, 620b, 620c, ..., 620n is changed, the folding state of the electronic device 200 is checked. can

In various embodiments, the electronic device 200 includes a hinge module (eg, the hinge device 240 of FIG. 2B ), a first housing (eg, a first side of the hinge module 240 ) coupled to at least a part of it. The first housing 210 of FIG. 2A ) and at least a portion of the second side of the hinge module 240 are coupled to each other, and the first housing 210 of FIG. The first housing 210 and the second housing (eg, the second housing 220 of FIG. 2A ) configured to be foldable and expandable, the first housing 210 and the second housing 220 are supported on top, A flexible display 500 configured to be foldable and unfoldable, a first conductive plate 571 and a second housing 220 disposed on a lower surface of the flexible display 500 and facing the first housing 210 and the second housing 220; A second conductive plate 572 facing each other, disposed under the first housing 210 and the second housing 220, a bent region (eg, a bent region 630 in FIG. 6B ), the bent region ( A wiring member including a first touch sensor 610 disposed at a first point of the 630 and a second touch sensor 620 disposed at a second point of the bent region 630 (eg, FIGS. 6A and 6A ) a wiring member 280 of 6b), and a processor operatively connected to the first touch sensor 610 and the second touch sensor 620 (eg, the processor 120 of FIG. 1 ), wherein the processor Reference numeral 120 denotes a change in first capacitance as the distance between the first conductive plate 571 and the first touch sensor 610 is changed and/or a change between the second conductive plate 572 and the second touch. Based on a change in the second capacitance according to a change in the distance between the sensors 620 , it may be set to check the folding state of the electronic device 200 .

In various embodiments, the first touch sensor 610 and the second touch sensor 620 may include the first conductive plate 571 and The second conductive plate 572 may be disposed at the first point and the second point of the bent region 630 at which it can be detected.

In various embodiments, the first touch sensor 610 and the second touch sensor 620 are based on the folding axis (eg, the folding axis A) when the electronic device 200 is in a folded state. may be disposed at the first point and the second point of the bent region 630 at positions corresponding to each other.

In various embodiments, the first point of the bent region 630 includes a point corresponding to one side of the first conductive plate 571 when the electronic device 200 is folded, and the bent region The second point 630 may include a point corresponding to one side of the second conductive plate 572 in the folded state of the electronic device 200 .

In various embodiments, The wiring member 280 may include a plurality of wiring layers (eg, a plurality of wiring layers 1310 of FIG. 13 ).

In various embodiments, each of the plurality of wiring layers 1310 includes a conductive layer (eg, the conductive layers 1310aa, 1310ba, ..., 1310na of FIG. 13 ) and a rear surface of the conductive layers 1310aa, 1310ba, ..., 1310na). It may be formed of an insulating layer (eg, the insulating layers 1310ab, 1310bb, ..., 1310nb of FIG. 13 ) disposed on the .

In various embodiments, The first touch sensor 610 and the second touch sensor 620 are the first and second points of the conductive layer 1310aa of the first wiring layer 1310a among the plurality of wiring layers 1310 . can be placed in

In various embodiments, the first point and the second point of the conductive layer 1310aa of the first wiring layer 1310a on which the first touch sensor 610 and the second touch sensor 620 are disposed The first and second points of the conductive layer 1310ba of the second wiring layer 1310b disposed on the rear surface of the first wiring layer 1310a corresponding to 1400)) and may be grounded.

In various embodiments, the mesh pattern 1400 is a grid-type mesh pattern (eg, reference numbers <1410> and <1450> of FIG. 14, reference numbers <1510>, <1520>, and <1530 of FIG. >) and/or a cross-type mesh pattern (eg, reference numbers <1430> and <1470> of FIG. 14 and reference numbers <1540>, <1550>, and <1560> of FIG. 15).

In various embodiments, a change in the first capacitance and the second conductive plate 572 in which the capacitance decreases as the distance between the first conductive plate 571 and the first touch sensor 610 is changed. When a change in the second capacitance, which decreases in capacitance due to a change in the distance between the second touch sensor 620 and the second touch sensor 620, is detected, it may be set to confirm that the folded state of the electronic device 200 is an unfolded state. can

In various embodiments, the capacitance increases as the distance between the first conductive plate 571 and the first touch sensor 610 changes in the folded state of the electronic device 200 in the unfolded state. When detecting a change in the first capacitance or a change in the second capacitance in which the capacitance increases due to a change in the distance between the second conductive plate 572 and the second touch sensor 620 is detected, the electronic device It may be set to confirm that the folding state of 200 is an intermediate state.

In various embodiments, when the folded state of the electronic device 200 is the intermediate state, the capacitance increases as the distance between the first conductive plate 571 and the first touch sensor 610 is changed. Detecting a change in the second capacitance in which the capacitance increases as the first capacitance increases or the distance between the second conductive plate 572 and the second touch sensor 620 changes In this case, it may be set to confirm that the folded state of the electronic device 200 is the folded state.

In various embodiments, as the distance between the first conductive plate 571 and the first touch sensor 610 is changed, the first capacitance increases as the capacitance increases, and the second conductive plate 572 and When a change in the second capacitance, which increases in capacitance due to a change in the distance between the second touch sensors 620 , is detected, it may be set to confirm that the folded state of the electronic device 200 is a folded state. .

In various embodiments, when the folded state of the electronic device 200 is the folded state, the capacitance decreases as the distance between the first conductive plate 571 and the first touch sensor 610 is changed. When it is detected that a change in the second capacitance in which the capacitance decreases due to a change in the first capacitance or a change in the distance between the second conductive plate 572 and the second touch sensor 620 is detected, the It may be set to confirm that the folded state of the electronic device 200 is an intermediate state.

In various embodiments, when the folded state of the electronic device 200 is the intermediate state, the capacitance decreases as the distance between the first conductive plate 571 and the first touch sensor 610 is changed. When it is detected that a change in the second capacitance in which the capacitance decreases due to a change in the first capacitance or a change in the distance between the second conductive plate 572 and the second touch sensor 620 is detected, the It may be set to check that the folded state of the electronic device 200 is the unfolded state.

In various embodiments, the first touch sensor 610 includes a plurality of first touch sensors 610a, 610b, ..., 610n, and the second touch sensor 620 includes a plurality of first touch sensors 610a, 610b, ..., 610n. It may include two touch sensors 620a, 620b, ..., 620n.

In various embodiments, the plurality of first touch sensors 610a , 610b , ..., 610n are disposed to be spaced apart from each other at the first point of the curved area 630 at a specified interval, and The two touch sensors 620a, 620b, ..., 620n may be disposed to be spaced apart from each other at the second point of the curved area 630 at a predetermined interval.

In various embodiments, a change in the first capacitance as the distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, ..., 610n is changed and/or the Based on a change in the second capacitance as the distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n is changed, It can be set to check the folding status.

In various embodiments, the processor 120 may control to operate in an operation mode corresponding to the checked folding state.

In various embodiments, when the folded state of the electronic device 200 is the unfolded state, the processor 120 displays content through the flexible display 500 and the electronic device 200 is in the folded state. When is in the folded state, the electronic device 200 is displayed through the sub-display 231 disposed to be at least partially exposed on the second surface of the first housing 210 (the second surface 212 in FIG. 3A ). A display corresponding to the first surface of the first housing 210 (eg, the first surface 211 of FIG. 2B ) for displaying state information or when the folded state of the electronic device 200 is an intermediate state It may be set to display different contents in an area and a display area corresponding to the third surface of the second housing 220 (eg, the third surface 221 of FIG. 2B ).

200: electronic device 210: first housing
220: second housing 240: hinge device
280: wiring member 500: flexible display
571: first conductive plate 572: second conductive plate
610: first touch sensor 620: second touch sensor
630: bend area

Claims (20)

In an electronic device,
hinge module;
a first housing to which at least a portion of the first side of the hinge module is coupled;
a second housing coupled to at least a part of the second side of the hinge module and configured to be foldable and expandable with the first housing based on a folding axis using the hinge module;
a flexible display supported on upper portions of the first housing and the second housing and configured to be foldable and unfoldable;
a first conductive plate disposed on a lower surface of the flexible display and facing the first housing and a second conductive plate facing the second housing;
a first touch sensor disposed under the first housing and the second housing, a first touch sensor disposed at a first point of the bent area, and a second touch sensor disposed at a second point of the bent area; a wiring member; and
a processor operatively connected to the first touch sensor and the second touch sensor;
The processor is
A change in the first capacitance as the distance between the first conductive plate and the first touch sensor changes and/or a change in the second capacitance as the distance between the second conductive plate and the second touch sensor changes based on the electronic device configured to check a folding state of the electronic device. The method of claim 1,
The first touch sensor and the second touch sensor are at the first point of the bent region at which the first conductive plate and the second conductive plate may be detected based on the transition of the folding state of the electronic device. and an electronic device disposed at the second point. The method of claim 1,
The first touch sensor and the second touch sensor are disposed at the first point and the second point of the bent area at positions corresponding to each other with respect to the folding axis when the electronic device is in a folded state. The method of claim 1,
The first point of the bent region includes a point corresponding to one side of the first conductive plate when the electronic device is folded, and
The second point of the bent region includes a point corresponding to one side of the second conductive plate in a folded state of the electronic device. The method of claim 1,
The wiring member is an electronic device including a plurality of wiring layers. 6. The method of claim 5,
Each of the plurality of wiring layers includes a conductive layer and an insulating layer disposed on a rear surface of the conductive layer. 7. The method of claim 6,
The first touch sensor and the second touch sensor are disposed at the first point and the second point of the conductive layer of the first wiring layer among the plurality of wiring layers. 8. The method of claim 7,
A conductive layer of a second wiring layer disposed on a rear surface of the first wiring layer corresponding to the first point and the second point of the conductive layer of the first wiring layer on which the first touch sensor and the second touch sensor are disposed The first point and the second second point of the electronic device are grounded in a mesh pattern. 9. The method of claim 8,
The mesh pattern includes a grid type mesh pattern and/or a cross type mesh pattern. The method of claim 1,
The processor is
A change in the first capacitance that the capacitance decreases as the distance between the first conductive plate and the first touch sensor changes, and a capacitance as the distance between the second conductive plate and the second touch sensor changes The electronic device is configured to determine that the folded state of the electronic device is an unfolded state when a change in the second electrostatic capacity that becomes smaller is detected. 11. The method of claim 10,
The processor is
In the folded state of the electronic device, in the unfolded state, a change in the first electrostatic capacity in which the electrostatic capacity increases as the distance between the first conductive plate and the first touch sensor is changed, or the change in the second conductive plate and the second electrostatic capacity An electronic device configured to determine that the folded state of the electronic device is an intermediate state when detecting a change in the second capacitance, which increases the capacitance according to a change in the distance between the two touch sensors. 12. The method of claim 11,
The processor is
When the folded state of the electronic device is the intermediate state, the change in the first capacitance or the second capacitance in which the capacitance increases as the distance between the first conductive plate and the first touch sensor is changed An electronic device configured to determine that the folded state of the electronic device is a folded state when detecting a change in the second electrostatic capacity in which the electrostatic capacity increases as the distance between the conductive plate and the second touch sensor is changed. The method of claim 1,
The processor is
The change in the first capacitance increases as the distance between the first conductive plate and the first touch sensor changes, and the capacitance increases as the distance between the second conductive plate and the second touch sensor changes. an electronic device configured to determine that the folded state of the electronic device is a folded state when detecting a change in the second capacitance. 14. The method of claim 13,
The processor is
When the folded state of the electronic device is the folded state, a change in the first electrostatic capacitance in which the electrostatic capacity decreases as the distance between the first conductive plate and the first touch sensor is changed, or the change in the first electrostatic capacity between the second conductive plate and the second conductive plate An electronic device configured to determine that the folded state of the electronic device is an intermediate state when detecting a change in the second capacitance, which decreases the capacitance due to a change in the distance between the second touch sensors. 15. The method of claim 14,
The processor is
When the folded state of the electronic device is in the intermediate state, a change in the first electrostatic capacity in which the electrostatic capacity decreases as a distance between the first conductive plate and the first touch sensor is changed, or a change in the second conductive plate and the second conductive plate An electronic device configured to determine that the folded state of the electronic device is an unfolded state when detecting a change in the second electrostatic capacity, which decreases the electrostatic capacity due to a change in the distance between the second touch sensors. The method of claim 1,
The first touch sensor includes a plurality of first touch sensors, and
The second touch sensor is an electronic device including a plurality of second touch sensors. 17. The method of claim 16,
The plurality of first touch sensors are disposed to be spaced apart from each other at a predetermined interval at the first point of the curved area, and
The plurality of second touch sensors are disposed to be spaced apart from each other by a predetermined interval at the second point of the curved area. 18. The method of claim 17,
The processor is
A change in the first capacitance as the distance between the first conductive plate and each of the plurality of first touch sensors is changed and/or a change in the distance between the second conductive plate and each of the plurality of second touch sensors is changed An electronic device configured to check a folding state of the electronic device based on a change in the second capacitance according to The method of claim 1,
The processor is
An electronic device that controls to operate in an operation mode corresponding to the confirmed folding state. 20. The method of claim 19,
The processor is
When the folded state of the electronic device is the unfolded state, display content through the flexible display;
When the folded state of the electronic device is the folded state, display the state information of the electronic device through a sub-display disposed to be at least partially exposed on the second surface of the first housing, or
When the folded state of the electronic device is an intermediate state, the electronic device configured to display different contents on a display area corresponding to the first surface of the first housing and a display area corresponding to the third surface of the second housing .

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