KR20220122527A - Substrate accommodating device and processing system - Google Patents

Abstract

It is possible to reduce the footprint of the entire system. A substrate accommodating device that accommodates a substrate transported by a transport device having an end effector for holding a substrate and a member including consumable parts provided in a substrate processing device that processes the substrate, includes a container. A first opening part through which the end effector holding the substrate passes is formed on the side wall of a container. Further, a concave part into which the tip of the end effector is inserted is formed on a surface facing the first opening part on the inner side of the container.

Description

SUBSTRATE ACCOMMODATING DEVICE AND PROCESSING SYSTEM

Various aspects and embodiments of the present disclosure relate to substrate receiving apparatus and processing systems.

For example, the conveying apparatus which conveys not only a board|substrate but the consumables in a processing apparatus is disclosed by the following patent document 1, too. Thereby, since replacement|exchange of a consumable part becomes possible without opening the chamber of a processing apparatus to the atmosphere, the stop time in the processing apparatus which performs a process at low pressure can be shortened.

Japanese Patent Laid-Open No. 2020-96149

The present disclosure provides a substrate receiving apparatus and processing system capable of reducing the overall footprint of the system.

An aspect of the present disclosure is a substrate accommodating apparatus for accommodating a substrate conveyed by a conveying apparatus having an end effector for holding a substrate and a member including a consumable component provided in the substrate processing apparatus for processing the substrate, the apparatus including a container do. A first opening through which the end effector holding the substrate passes is formed in the sidewall of the container. Further, a concave portion into which the tip of the end effector is inserted is formed on a surface opposite to the first opening on the inner side of the container.

According to the various aspects and embodiments disclosed herein, it is possible to suppress an increase in the footprint of the entire system.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows an example of the processing system in one Embodiment.
2 is a schematic cross-sectional view showing an example of a processing module.
3 is a cross-sectional view showing an example of an ashing module according to the first embodiment.
Fig. 4 is a cross-sectional view showing an example of the loadlock module according to the first embodiment.
5 is a plan view showing an example of an end effector.
6 is a side view showing an example of an end effector.
Fig. 7 is a plan view showing an example of an end effector when an edge ring is conveyed.
Fig. 8 is a side view showing an example of an end effector when an edge ring is conveyed.
9 is a plan view showing an example of an end effector when a substrate is conveyed.
Fig. 10 is a side view showing an example of an end effector when a substrate is conveyed.
11 is a diagram showing an example of a positional relationship between an end effector and an ashing module when a substrate is loaded into an ashing module in a comparative example.
Fig. 12 is a diagram showing an example of the positional relationship between the end effector and the ashing module when the substrate is loaded into the ashing module in the first embodiment.
Fig. 13 is a diagram showing an example of the positional relationship between the end effector and the load-lock module when the substrate is transferred between the vacuum transfer module and the load-lock module in the first embodiment.
Fig. 14 is a diagram showing an example of the positional relationship between the end effector and the load-lock module when the substrate is transferred between the standby transfer module and the load-lock module in the first embodiment;
15 is a cross-sectional view showing an example of an ashing module according to the second embodiment.
Fig. 16 is a diagram showing an example of the positional relationship between the end effector and the ashing module when the substrate is loaded into the ashing module according to the second embodiment.
Fig. 17 is a cross-sectional view showing an example of a loadlock module according to the second embodiment.
Fig. 18 is a diagram showing an example of the positional relationship between the end effector and the load-lock module when the substrate is transferred between the vacuum transfer module and the load-lock module in the second embodiment.
Fig. 19 is a diagram showing an example of the positional relationship between the end effector and the load-lock module when the substrate is transferred between the standby transfer module and the load-lock module in the second embodiment;

EMBODIMENT OF THE INVENTION Below, embodiment of a board|substrate accommodation apparatus and a processing system is demonstrated in detail based on drawing. In addition, the board|substrate accommodation apparatus and processing system which are disclosed by the following embodiment are not limited.

By the way, when a board|substrate or a consumable part is conveyed, the board|substrate or a consumable part is mounted on the end effector so that its reference position (for example, a center) may become a predetermined position on the end effector provided at the front-end|tip of a robot arm. When the consumable part is a ring-shaped part larger than the board, such as an edge ring, if the position where the consumable part is mounted is too close to the tip side of the end effector, the consumable part falls from the end effector as the end effector moves there is Therefore, it is necessary to prevent the position at which the consumable parts are mounted too close to the tip side of the end effector. Thereby, the consumable part is mounted on the end effector so that the reference position of the consumable part is a position away from the tip of the end effector.

On the other hand, in the case of transporting a board having an outer shape smaller than the consumable part, if the board is mounted on the end effector so that the reference position of the consumable part and the reference position of the board are the same when transporting the consumable part, the tip of the end effector is It protrudes from the area below the substrate. If the portion of the end effector that exceeds from the region below the substrate is large, the end effector becomes obstructed when transferring the substrate into an apparatus in which a space for accommodating the consumable parts is not secured, so that the substrate is carried to a predetermined position in the apparatus. it is difficult

In order to carry the board|substrate to a predetermined position in an apparatus without an end effector interfering, it is also conceivable to widen the space in the apparatus in which the space for accommodating a consumable part is not secured. However, in that case, the footprint of such an apparatus becomes large, and the footprint of the whole system becomes large.

Therefore, the present disclosure provides a technique capable of suppressing an increase in the overall footprint of the system.

(First embodiment)

[Configuration of processing system 1]

1 : is a top view which shows an example of the structure of the processing system 1 in one Embodiment. In FIG. 1 , for convenience, the internal components of some devices are shown to be visible. The processing system 1 includes a body 10 and a control unit 100 for controlling the body 10 .

The main body 10 includes a vacuum transfer module 11 , a plurality of processing modules 12 , a plurality of ashing modules 13 , a plurality of load-lock modules 14 , and an atmospheric transfer module 15 . A plurality of processing modules 12 are connected to the sidewall of the vacuum transfer module 11 via a gate valve G1 . The processing module 12 is an example of a substrate processing apparatus. In the example of FIG. 1 , eight processing modules 12 are connected to the vacuum transfer module 11 , but the number of processing modules 12 connected to the vacuum transfer module 11 may be seven or less. , may be 9 or more.

Each processing module 12 performs processing such as etching or film formation on the substrate W to be processed. The processing module 12 is an example of a substrate processing apparatus. 2 is a schematic cross-sectional view showing an example of the processing module 12 . In this embodiment, the processing module 12 is, for example, a capacitively coupled plasma processing apparatus. The processing module 12 includes a plasma processing chamber 1210 , a gas supply 1220 , a power source 1230 , and an exhaust system 1240 . The processing module 12 also includes a substrate support 1211 and a gas inlet. The gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 1210 . The gas inlet includes a shower head 1213 . The substrate support 1211 is disposed in the plasma processing chamber 1210 . The shower head 1213 is disposed above the substrate support 1211 . In one embodiment, the shower head 1213 constitutes at least a portion of a ceiling of the plasma processing chamber 1210 . The plasma processing chamber 1210 has a shower head 1213 , a sidewall 1210a of the plasma processing chamber 1210 , and a plasma processing space 1210s defined by a substrate support 1211 . The plasma processing chamber 1210 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 1210s and at least one gas exhaust port for exhausting the gas from the plasma processing space. The sidewall 1210a is grounded. The shower head 1213 and the substrate support 1211 are electrically insulated from the plasma processing chamber 1210 housing.

The substrate support 1211 includes a body 12111 and a ring assembly 12112 . The body portion 12111 has a central region (substrate supporting surface) 12111a for supporting the substrate (wafer) W, and an annular region (ring supporting surface) 12111b for supporting the ring assembly 12112 . . The annular region 12111b of the body portion 12111 surrounds the central region 12111a of the body portion 12111 when viewed in a plan view. The substrate W is disposed on the central region 12111a of the body portion 12111 , and the ring assembly 12112 surrounds the substrate W on the central region 12111a of the body portion 12111 . ) on the annular region 12111b. In one embodiment, the body portion 12111 includes a base and an electrostatic chuck. The reclining includes a conductive member. The conductive member of the base functions as a lower electrode. An electrostatic chuck is placed on the base. A top surface of the electrostatic chuck has a substrate support surface 12111a. Ring assembly 12112 includes one or more annular members. At least one of the one or the plurality of annular members is an edge ring. Also, although not shown, the substrate support 1211 may include an electrostatic chuck, a ring assembly 12112, and a temperature control module configured to adjust at least one of the substrates to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path, or a combination thereof. In the flow path, a heat transfer fluid such as brine or gas flows. In addition, the substrate support part 1211 may include a heat transfer gas supply part configured to supply a heat transfer gas between the back surface of the substrate W and the substrate support surface 12111a.

The shower head 1213 is configured to introduce at least one processing gas from the gas supply unit 1220 into the plasma processing space 1210s. The shower head 1213 has at least one gas supply port 1213a , at least one gas diffusion chamber 1213b , and a plurality of gas introduction ports 1213c . The processing gas supplied to the gas supply port 1213a passes through the gas diffusion chamber 1213b and is introduced into the plasma processing space 1210s from the plurality of gas introduction ports 1213c. Also, the shower head 1213 includes a conductive member. The conductive member of the shower head 1213 functions as an upper electrode. Further, in addition to the shower head 1213 , the gas introduction unit may include one or a plurality of side gas injectors (SGIs) mounted in one or a plurality of openings formed in the side wall 1210a.

The gas supply unit 1220 may include at least one gas source 1221 and at least one flow controller 1222 . In one embodiment, the gas supply 1220 is configured to supply at least one process gas from a corresponding gas source 1221 to the shower head 1213 via a respective flow controller 1222 . . Each flow controller 1222 may include, for example, a mass flow controller or a pressure-controlled flow controller. In addition, the gas supply 1220 may include one or more flow rate modulation devices for modulating or pulsing the flow rate of at least one process gas.

The power source 1230 includes an RF power source 1231 coupled to the plasma processing chamber 1210 via at least one impedance matching circuit. The RF power source 1231 supplies at least one RF signal (RF power), such as a source RF signal and a bias RF signal, to the conductive member of the substrate support 1211 , the conductive member of the shower head 1213 , or both. is composed As a result, plasma is formed from at least one processing gas supplied to the plasma processing space 1210s. Accordingly, the RF power source 1231 may function as at least a portion of a plasma generator configured to generate a plasma from one or more processing gases for the plasma processing chamber 1210 . In addition, by supplying the bias RF signal to the conductive member of the substrate support portion 1211 , a bias potential is generated in the substrate W, and an ion component in the plasma formed can be introduced into the substrate W.

In an embodiment, the RF power source 1231 includes a first RF generator 1231a and a second RF generator 1231b. The first RF generator 1231a is coupled to the conductive member of the substrate support 1211 , the conductive member of the shower head 1213 , or both through at least one impedance matching circuit. Further, the first RF generator 1231a is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of, for example, 13 MHz to 150 MHz. In one embodiment, the first RF generator 1231a may be configured to generate a plurality of source RF signals having different frequencies. The generated one or more source RF signals are supplied to the conductive member of the substrate support 1211 , the conductive member of the shower head 1213 , or both. The second RF generator 1231b is coupled to the conductive member of the substrate support 1211 via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). In one embodiment, the bias RF signal has a lower frequency than the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of, for example, 400 kHz to 13.56 MHz. In one embodiment, the second RF generator 1231b may be configured to generate a plurality of bias RF signals having different frequencies. One or more generated bias RF signals are supplied to the conductive member of the substrate support 1211 . Further, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

Power supply 1230 may also include a DC power supply 1232 coupled to plasma processing chamber 1210 . The DC power supply 1232 includes a first DC generator 1232a and a second DC generator 1232b. In one embodiment, the first DC generator 1232a is connected to the conductive member of the substrate support 1211 and is configured to generate a first DC signal. The generated first bias DC signal is applied to the conductive member of the substrate support 1211 . In one embodiment, the first DC signal may be applied to another electrode, such as an electrode in an electrostatic chuck. In one embodiment, the second DC generator 1232b is connected to the conductive member of the shower head 1213 and is configured to generate a second DC signal. The generated second DC signal is applied to the conductive member of the shower head 1213 . In various embodiments, at least one of the first and second DC signals may be pulsed. In addition, the first DC generator 1232a and the second DC generator 1232b may be provided in addition to the RF power source 1231, and the first DC generator 1232a is replaced with the second RF generator 1231b. It may be provided in

The exhaust system 1240 may be connected to, for example, a gas outlet 1210e provided at the bottom of the plasma processing chamber 1210 . The exhaust system 1240 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 1210s is adjusted by the pressure regulating valve. The vacuum pump may include a turbo molecular pump, a dry pump, or a combination thereof.

Returning to FIG. 1, the description continues. A plurality of ashing modules 13 are connected to the other side wall of the vacuum transfer module 11 via a gate valve G2. The ashing module 13 removes a mask or the like remaining on the substrate W after the processing is performed by the processing module 12 by ashing. In addition, in the example of FIG. 1, although two ashing modules 13 are connected to the vacuum conveying module 11, the number of the ashing modules 13 connected to the vacuum conveying module 11 may be one, Three or more may be sufficient.

3 : is a figure which shows an example of the ashing module 13 in 1st Embodiment. The ashing module 13 has a container 130 . In the container 130 , a stage 131 on which the substrate W is mounted is provided. A reference position (eg, center) of the stage 131 is defined as a position P0. An opening 132b through which the end effector 21 holding the substrate W or the like passes is formed in the sidewall 132 of the container 130 . The opening 132b is an example of the first opening. The opening 132b is opened and closed by the gate valve G2.

Further, a concave portion 133 into which the tip of the end effector 21 is inserted is formed on the surface 132a opposite to the opening portion 132b on the inner side of the container 130 . In the example of FIG. 3 , the recess 133 is formed in the surface 132a of the side wall 132 of the container 130 opposite the opening 132b. The ashing module 13 is an example of a substrate receiving apparatus.

Returning to FIG. 1, the description continues. A plurality of load-lock modules 14 are connected to the other side wall of the vacuum transfer module 11 via a gate valve G3. In the example of FIG. 1 , two load-lock modules 14 are connected to the vacuum transfer module 11, but the number of load-lock modules 14 connected to the vacuum transfer module 11 may be one; Three or more may be sufficient. In addition, at least one of the two load-lock modules 14 can accommodate the substrate W, and at least one of the two load-lock modules 14 can accommodate the edge ring ER. The edge ring ER is an example of a consumable part.

4 is a diagram showing an example of the loadlock module 14 in the first embodiment. In this embodiment, the load-lock module 14 which temporarily accommodates the board|substrate W, and the load-lock module 14 which temporarily accommodates consumable parts, such as the edge ring ER, are divided. 4, the load lock module 14 in which the substrate W is temporarily accommodated is shown. In addition, the load lock module 14 may temporarily accommodate both the board|substrate W and the edge ring ER. The load lock module 14 has a container 140 . In the container 140 , a stage 141 on which the substrate W is mounted is provided. A reference position (eg, center of gravity) of the stage 141 is defined as a position P1 . An opening 140a and an opening 140b through which the end effector 21 holding the substrate W or the like passes are formed on the sidewall of the container 140 . The opening 140a is an example of the first opening, and the opening 140b is an example of the second opening. The opening 140a is opened and closed by the gate valve G3 , and the opening 140b is opened and closed by the gate valve G4 .

Further, in the inner surface 142 of the container 140 of the gate valve G3, a recess 143 into which the tip of the end effector 21 entering the container 140 through the opening 140b is inserted. ) is formed. Further, in the inner surface 144 of the container 140 of the gate valve G4, a recess 145 into which the tip of the end effector 21 entering the container 140 through the opening 140a is inserted. ) is formed. The load-lock module 14 is an example of a board|substrate accommodation apparatus, and the gate valve G4 is an example of the door which opens and closes the 2nd opening part.

Returning to FIG. 1, the description continues. In the vacuum transfer module 11 , a transfer robot 20 is disposed. The transfer robot 20 has an end effector 21 and an arm 22 . The end effector 21 holds the member. In the present embodiment, the members held by the end effector 21 are, for example, the substrate W and the edge ring ER. Hereinafter, members such as the substrate W and the edge ring ER are collectively referred to as the substrate W or the like. The arm 22 moves the end effector 21 . The transfer robot 20 moves in the vacuum transfer module 11 along a guide rail 110 provided in the vacuum transfer module 11 , and the processing module 12 , the ashing module 13 , and the load lock module 14 . ) to transport the substrate W or the like. In addition, the conveyance robot 20 is fixed at a predetermined position in the vacuum conveyance module 11, and the structure which does not move in the vacuum conveyance module 11 may be sufficient. The transport robot 20 is an example of a transport device. The inside of the vacuum transfer module 11 is maintained in a pressure atmosphere lower than atmospheric pressure.

A vacuum transfer module 11 is connected to one side wall of each load lock module 14 via a gate valve G3, and to the other side wall, a standby transfer module 15 via a gate valve G4. ) is connected. When the substrate W or the like is loaded into the load lock module 14 from the atmospheric transfer module 15 via the gate valve G4, the gate valve G4 is closed, and the pressure in the load lock module 14 is atmospheric pressure. from to a predetermined pressure. And the gate valve G3 is opened, and the board|substrate W etc. in the load-lock module 14 are carried out into the vacuum transfer module 11 by the transfer robot 20. As shown in FIG.

Further, in a state where the pressure inside the load lock module 14 is lower than atmospheric pressure, the substrate W is moved from the vacuum transfer module 11 through the gate valve G3 by the transfer robot 20 into the load lock module 14 by the transfer robot 20 . ) and the like are brought in, and the gate valve G3 is closed. Then, the pressure in the load lock module 14 rises to atmospheric pressure. And the gate valve G4 is opened, and the board|substrate W etc. in the load-lock module 14 are carried out into the standby|standby conveyance module 15. As shown in FIG.

A plurality of load ports 16 are provided on the side wall of the atmospheric transport module 15 on the opposite side to the side wall of the atmospheric transport module 15 in which the gate valve G4 is provided. A container such as a FOUP (Front Opening Unified Pod) capable of accommodating a plurality of substrates W and the like is connected to each load port 16 . Moreover, the aligner module etc. which change the direction of the board|substrate W may be provided in the air|standby conveyance module 15. In addition, a container capable of accommodating the edge ring ER is connected to any one of the plurality of load ports 16 .

A transfer robot 20 is provided in the standby transfer module 15 , and the transfer robot 20 has an end effector 21 and an arm 22 . The pressure in the atmospheric conveying module 15 is atmospheric pressure. The transfer robot 20 in the standby transfer module 15 moves in the standby transfer module 15 along the guide rail 150 , and is located between the load lock module 14 and the container connected to the load port 16 . The board|substrate W etc. are conveyed. In addition, the transfer robot 20 may be fixed at a predetermined position in the standby transfer module 15 and may have a configuration that does not move in the standby transfer module 15 . A Fan Filter Unit (FFU) or the like is provided on the upper part of the atmospheric transport module 15 , and air from which particles are removed is supplied into the atmospheric transport module 15 from the top, and a downflow in the atmospheric transport module 15 is performed. is formed In addition, in this embodiment, although the inside of the atmospheric|air-transfer module 15 is atmospheric pressure atmosphere, as another aspect, the pressure in the atmospheric|air-transport module 15 may be controlled so that it may become a positive pressure. In this way, it is possible to suppress the intrusion of particles or the like into the atmospheric transport module 15 from the outside.

The control unit 100 processes computer-executable instructions for causing the main body 10 to execute various processes described in the present disclosure. The control unit 100 may be configured to control each element of the main body 10 to execute various processes described herein. In one embodiment, a part or all of the control unit 100 may be included in several modules included in the main body 10 . The control unit 100 may include, for example, the computer 100a. The computer 100a may include, for example, a processing unit (CPU: Central Processing Unit) 100a1 , a storage unit 100a2 , and a communication interface 100a3 . The processing unit 100a1 may be configured to execute various control operations based on the program stored in the storage unit 100a2 . The storage unit 100a2 may include a random access memory (RAM), a read only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 100a3 may communicate with the main body 10 via a communication line such as a LAN (Local Area Network).

[Details of the end effector 21]

5 is a plan view showing an example of the end effector 21 . On the upper surface of the end effector 21 , for example, as shown in FIG. 5 , a plurality of first holding parts 211 and a plurality of second holding parts 212 are provided. Each of the first holding portions 211 is formed of an elastic member such as rubber, for example, and holds the edge ring ER. In addition, each of the second holding portions 212 is formed of an elastic member such as rubber, for example, and holds the substrate W. As shown in FIG. In addition, in the transfer robot 20 provided in the atmospheric transfer module 15, the 1st holding part 211 and the 2nd holding part 212 may be a vacuum pad which suction-holds a member by sucking air. .

When the edge ring ER is mounted on the end effector 21 , the position of the outer shape of the edge ring ER becomes, for example, the circle C1 . When the edge ring ER is mounted on the end effector 21, the edge ring ER is mounted on the end effector 21 so that the position of the center (center) of the edge ring ER becomes the position P2. do. The position P2 is at a distance d1 from the tip of the end effector 21 .

When the substrate W is mounted on the end effector 21 , the position of the outer shape of the substrate W is, for example, a circle C2 . When the substrate W is mounted on the end effector 21 , the substrate W is placed on the end effector 21 so that the position of the center (center) of the substrate W becomes the position P2 . is mounted That is, the edge ring ER and the substrate W are held on the end effector 21 so that the center is at the position P2 .

6 is a side view showing an example of the end effector 21 . In the present embodiment, the height of the second holding part 212 is higher than the height of the first holding part 211 . When the edge ring ER is conveyed, a reaction by-product (so-called depot) may adhere to the conveyed edge ring ER. Therefore, when the edge ring ER to which the deformable is attached is conveyed, the case where the deformed attached to the edge ring ER becomes particles and falls on the first holding part 211 or the end effector 21 . have.

If the substrate W is held by the first holding unit 211 , the substrate W may be contaminated with particles that have fallen on the first holding unit 211 . On the other hand, in this embodiment, since the board|substrate W is not held by the 1st holding part 211 by which the edge ring ER is held, contamination of the board|substrate W can be suppressed.

In addition, when the height of the second holding part 212 is equal to or lower than that of the first holding part 211 , when the substrate W is transported, the first holding part 211 or the Particles that have fallen on the end effector 21 may be re-attached to the substrate W. On the other hand, in this embodiment, the height of the 2nd holding part 212 which holds the board|substrate W is higher than the height of the 1st holding part 211 which holds the edge ring ER. Therefore, it is possible to suppress the re-adhesion of particles on the first holding portion 211 or the end effector 21 to the substrate W .

When the edge ring ER is conveyed, the edge ring ER is mounted on the end effector 21 as shown in FIGS. 7 and 8, for example. 7 is a plan view showing an example of the end effector 21 when the edge ring ER is conveyed. 8 is a side view showing an example of the end effector 21 when the edge ring ER is conveyed. Since the diameter of the edge ring ER is larger than the diameter of the substrate W, the edge ring ER is held by the end effector 21 using up to the tip of the end effector 21 . Therefore, in the state where the edge ring ER is held by the end effector 21 , the outermost periphery of the edge ring ER is at the same position as the tip of the end effector 21 , or, for example, as shown in FIG. 8 . As shown, it protrudes outward from the tip of the end effector 21 .

Further, when the substrate W is conveyed, the substrate W is mounted on the end effector 21 as shown in FIGS. 9 and 10 , for example. 9 is a plan view showing an example of the end effector 21 when the substrate W is conveyed, and FIG. 10 is a side view showing an example of the end effector 21 when the substrate W is conveyed. In this embodiment, the substrate W and the edge ring ER are held by the end effector 21 so that the center position is located at the position P2 in the end effector 21, and the diameter of the substrate W is smaller than the diameter of the edge ring ER. Therefore, in the state where the substrate W is held by the end effector 21 , for example, as shown in FIGS. 9 and 10 , the tip of the end effector 21 is the outermost periphery of the substrate W . It protrudes from it by a distance d2.

In this specification, for example, as shown in FIG. 11, the ashing module 13 in which the recessed part 133 is not formed in the surface 132a opposite to the opening part 132b in the inner side of the container 130. ) is considered as a comparative example. 11 is a diagram showing an example of the positional relationship between the end effector 21 and the ashing module 13 when the substrate W is loaded into the ashing module 13 in the comparative example. In the present embodiment, in a state in which the substrate W is held by the end effector 21 , the tip 21a of the end effector 21 protrudes from the outermost periphery of the substrate W by a distance d2 . Therefore, the tip 21a of the end effector 21 contacts the sidewall of the ashing module 13 , and the center of the substrate W at the position P2 coincides with the reference position P0 of the stage 131 . It is difficult to carry the substrate W into the ashing module 13 so as to do so. When the substrate W is loaded into the ashing module 13 , the side wall 132 of the ashing module 13 is moved so that the tip 21a of the end effector 21 comes into contact with the sidewall of the ashing module 13 . It is also considered to be provided at a position away from the stage 131 . However, in that case, the container 130 as a whole becomes enlarged, resulting in an increase in the footprint of the processing system 1 .

On the other hand, in this embodiment, as shown in FIG. 12, the recessed part 133 is formed in the surface 132a opposite to the opening part 132b in the inner side of the container 130, for example. . 12 is a diagram showing an example of the positional relationship between the end effector 21 and the ashing module 13 when the substrate W is loaded into the ashing module 13 in the first embodiment. Accordingly, when the substrate W is loaded into the ashing module 13 , the tip 21a of the end effector 21 is inserted into the recess 133 . Thereby, for example, as shown in FIG. 12 , the substrate W is placed in the ashing module ( 13) It becomes possible to bring it in. Accordingly, when the substrate W is loaded into the ashing module 13, in order to prevent the tip 21a of the end effector 21 from coming into contact with the sidewall of the ashing module 13, the sidewall 132 is There is no need to arrange the 132a at a position away from the stage 131 . Thereby, enlargement of the container 130 can be suppressed and the increase of the footprint of the processing system 1 can be suppressed.

Moreover, in the load lock module 14 of this embodiment, as shown in FIG. 4, for example, the recessed part 145 in the inner surface 144 of the container 140 in the gate valve G4. ) is formed. Accordingly, when the substrate W is loaded into the load lock module 14 from the vacuum transfer module 11 , for example, as shown in FIG. 13 , the tip 21a of the end effector 21 is gated. It is inserted into the recess 145 of the valve G4. 13 is a diagram of the positional relationship between the end effector 21 and the load-lock module 14 when the substrate W is transferred between the vacuum transfer module 11 and the load-lock module 14 in the first embodiment. It is a figure which shows an example.

Accordingly, when the substrate W is loaded into the load lock module 14 from the vacuum transfer module 11 , the substrate W is positioned so that the center of the substrate W coincides with the reference position P1 of the stage 141 . ) can be imported into the loadlock module 14 . Accordingly, when the substrate W is loaded into the load lock module 14, in order to prevent the tip 21a of the end effector 21 from contacting the gate valve G4, the gate valve G4 is 141), there is no need to provide it at a location away from it. Thereby, enlargement of the container 140 can be suppressed, and the increase of the footprint of the processing system 1 can be suppressed.

In addition, in this embodiment, as shown in FIG. 4, the recessed part 143 is formed in the inner side surface 142 of the container 140 in the gate valve G3. Accordingly, when the substrate W is loaded into the load lock module 14 from the standby transfer module 15, for example, as shown in FIG. 14 , the tip 21a of the end effector 21 is gated. It is inserted into the recess 143 of the valve G3. 14 is a diagram of the positional relationship between the end effector 21 and the load-lock module 14 when the substrate W is transferred between the standby transfer module 15 and the load-lock module 14 in the first embodiment. It is a figure which shows an example.

As a result, when the substrate W is loaded into the load lock module 14 from the standby transfer module 15 , the substrate W is positioned so that the center of the substrate W coincides with the reference position P1 of the stage 141 . ) can be imported into the loadlock module 14 . Accordingly, when the substrate W is loaded into the load lock module 14, in order to prevent the tip 21a of the end effector 21 from contacting the gate valve G3, the gate valve G3 is 141), there is no need to provide it at a location away from it. Thereby, enlargement of the container 140 can be suppressed, and the increase of the footprint of the processing system 1 can be suppressed.

As mentioned above, 1st Embodiment was demonstrated. As described above, the processing system 1 in the present embodiment includes the processing module 12 , the transfer robot 20 , and the ashing module 13 . The processing module 12 processes the substrate W. The transfer robot 20 has an end effector 21 that holds a member including an edge ring ER provided on the substrate W and the processing module 12 , and transports the member. The ashing module 13 temporarily stores the substrate. The ashing module 13 has a container 130 . An opening 132b through which the end effector 21 holding the substrate W passes is formed in the sidewall 132 of the container 130 . Further, a concave portion 133 into which the tip 21a of the end effector 21 is inserted is formed in the surface 132a opposite to the opening 132b on the inner side of the container 130 . With such a configuration, it is possible to suppress an increase in the size of the ashing module 13 and to suppress an increase in the footprint of the processing system 1 .

Further, in the above-described embodiment, the concave portion 133 is formed in the surface 132a of the side wall 132 of the container 130 opposite to the opening 132b. Thereby, the enlargement of the ashing module 13 can be suppressed and the increase of the footprint of the processing system 1 can be suppressed.

In addition, in the above-described embodiment, the substrate receiving apparatus may be the load lock module 14 . For example, in the load lock module 14 , another end effector 21 holding the substrate W passes through the side wall of the container 140 opposite to the opening 140a of the load lock module 14 . An opening 140b is formed. The opening 140b is provided with a gate valve G4 that opens and closes the opening 140b. A recess 145 into which the tip 21a of the end effector 21 is inserted is formed on the inner surface 144 of the container 140 of the gate valve G4. With this configuration, it is possible to suppress an increase in the size of the load lock module 14 and to suppress an increase in the footprint of the processing system 1 .

(Second Embodiment)

In the first embodiment described above, when the substrate W is loaded into the ashing module 13 through the opening 132b, a direction perpendicular to the surface 132a facing the opening 132b is, for example. Accordingly, the substrate W is loaded into the ashing module 13 . On the other hand, in this embodiment, the board|substrate W is carried in into the ashing module 13 along the direction of inclination with respect to the surface 132a opposite to the opening part 132b. Thereby, the moving distance of the board|substrate W can be shortened, and the time required for carrying in the board|substrate W into the ashing module 13 can be shortened. Further, since the arm 22 of the transport robot 20 can be shortened, the transport robot 20 can be downsized.

15 is a cross-sectional view showing an example of the ashing module 13 in the second embodiment. In addition, in FIG. 15, since the structure to which the code|symbol same as FIG. 3 was attached|subjected is the same as or the same as the structure demonstrated in FIG. 3, description is abbreviate|omitted. In the ashing module 13 of the present embodiment, a wall surface 136 , a wall surface 137 , a tapered portion 138 , and a tapered portion 139 are formed on the sidewall 132 . The tapered portion 138 and the tapered portion 139 are formed on the sidewall 132 in the vicinity of the opening 132b to be inclined with respect to the surface 132a facing the opening 132b.

When the substrate W is conveyed in the ashing module 13 , for example, as shown in FIG. 16 , the end effector 21 holding the substrate W has a tapered portion 138 and a tapered portion. Enters vessel 130 along 139 . 16 is a diagram showing an example of the positional relationship between the end effector 21 and the ashing module 13 when the substrate W is loaded into the ashing module 13 in the second embodiment.

In this embodiment, since the board|substrate W is carried in in the ashing module 13 along the direction of inclination with respect to the surface 132a, in the direction orthogonal to the surface 132a, WHEREIN: The board|substrate W and the front-end|tip 21a ) becomes longer than in the case of the first embodiment. Therefore, in this embodiment, loading the substrate W into the ashing module 13 so that the center of the substrate W at the position P2 coincides with the reference position P0 of the stage 131, It becomes more difficult compared to the case of the first embodiment.

On the other hand, also in the ashing module 13 of this embodiment, as shown, for example in FIG. 16, the recessed part in the surface 132a opposite to the opening part 132b in the inner side of the container 130. (133) is formed. Accordingly, when the substrate W is loaded into the ashing module 13 , the tip 21a of the end effector 21 is inserted into the recess 133 . Therefore, for example, as shown in FIG. 16 , the substrate W is placed in the ashing module ( 13) It becomes possible to bring it in. Accordingly, as shown in FIG. 15 , for the ashing module 13 having the tapered portion 138 and the tapered portion 139 that are formed to be inclined with respect to the surface 132a facing the opening 132b, the surface 132a is It is especially effective that the recessed part 133 is formed.

Moreover, in this embodiment, the board|substrate W is carried in into the load-lock module 14 along the direction of an inclination with respect to the gate valve G4 of the load-lock module 14. As shown in FIG. Thereby, the movement distance of the board|substrate W can be shortened, and the time required for carrying in the board|substrate W from the vacuum transfer module 11 to the load-lock module 14 can be shortened. Further, since the arm 22 of the transport robot 20 can be shortened, the transport robot 20 can be downsized.

Fig. 17 is a cross-sectional view showing an example of the load lock module 14 in the second embodiment. In addition, in FIG. 17, since the structure to which the code|symbol same as FIG. 4 was attached|subjected is the same as that of the structure demonstrated with respect to FIG. 4, description is abbreviate|omitted. In the load lock module 14 of the present embodiment, a tapered portion 148 is formed in the vicinity of the opening 140a of the sidewall 146, and a tapered portion ( 149) is formed. The tapered portion 148 and the tapered portion 149 are formed to be inclined with respect to the surface 144 of the gate valve G4 facing the opening 140a.

When the substrate W is transferred from the vacuum transfer module 11 into the load lock module 14, for example, as shown in FIG. 18 , the end effector 21 holding the substrate W tapers. It enters the vessel 140 along the portion 148 and the tapered portion 149 . Fig. 18 shows the positional relationship between the end effector 21 and the load-lock module 14 when the substrate W is transferred between the vacuum transfer module 11 and the load-lock module 14 in the second embodiment. It is a figure which shows an example.

In this embodiment, since the substrate W is loaded into the load lock module 14 along the direction of the inclination with respect to the face 144 of the gate valve G4, it is orthogonal to the face 144 of the gate valve G4. direction WHEREIN: The distance between the board|substrate W and the front-end|tip 21a becomes long compared with the case of 1st Embodiment. Therefore, in the present embodiment, loading the substrate W into the load lock module 14 is preferred so that the center of the substrate W at the position P2 coincides with the reference position P1 of the stage 141 . , it becomes more difficult compared to the case of the first embodiment.

On the other hand, also in the load lock module 14 of the present embodiment, for example, as shown in FIG. 18 , the gate valve G4 facing the opening 140a inside the container 140 is closed. A recess 145 is formed in the face 144 . Accordingly, when the substrate W is loaded from the vacuum transfer module 11 into the load lock module 14 , the tip 21a of the end effector 21 is inserted into the recess 145 . Therefore, for example, as shown in FIG. 18 , the substrate W is loaded into the load-lock module so that the center of the substrate W at the position P2 coincides with the reference position P1 of the stage 141 . (14) It becomes possible to bring in inside. Therefore, in the load lock module 14 having the taper portions 148 and 149 that are formed to be inclined with respect to the surface 144 of the gate valve G4 facing the opening 140a, the surface of the gate valve G4 is It is particularly effective that the concave portion 145 is formed at 144 .

Further, when the substrate W is transferred from the standby transfer module 15 into the load lock module 14 , for example, as shown in FIG. 19 , the end effector 21 holding the substrate W . enters the container 140 along the direction toward the face 142 of the gate valve G3. 19 shows the positional relationship between the end effector 21 and the load lock module 14 when the substrate W is transferred between the standby transfer module 15 and the load lock module 14 in the second embodiment. It is a figure which shows an example. When the substrate W is transferred from the standby transfer module 15 into the load lock module 14, similarly to the first embodiment, the tip 21a of the end effector 21 is disposed in the recess of the gate valve G3 ( 143) is inserted. As a result, when the substrate W is loaded into the load lock module 14 from the standby transfer module 15 , the substrate W is positioned so that the center of the substrate W coincides with the reference position P1 of the stage 141 . ) can be imported into the loadlock module 14 .

In addition, it should be thought that embodiment disclosed this time is an illustration in every point and is not restrictive. Indeed, the above-described embodiment may be embodied in various forms. In addition, said embodiment may be abbreviate|omitted, substituted, and may be changed in various forms, without deviating from the attached claim and the meaning.

ER: edge ring
G1 : gate valve
G2 : gate valve
G3 : gate valve
G4 : gate valve
P0: position
P1: position
P2: position
W: substrate
1: processing system
10: body
100: control unit
11: vacuum transfer module
12: processing module
13: Ashing module
130: courage
131: stage
132: side wall
132a: cotton
132b: opening
133: concave
136: wall
137: wall
138: taper part
139: taper part
14: loadlock module
140: courage
140a: opening
140b: opening
141: stage
142: cotton
143: concave
144: cotton
145: concave
146: side wall
147: side wall
148: taper part
149: taper part
15: standby transfer module
16: load port
20: transport robot
21: end effector

Claims (5)

A substrate accommodating apparatus for accommodating a substrate conveyed by a conveying apparatus having an end effector for holding a substrate and a member including a consumable component provided in a substrate processing apparatus for processing the substrate, the substrate receiving apparatus comprising:
have a container,
A first opening is formed in the sidewall of the container through which the end effector holding the substrate passes;
A concave portion into which the tip of the end effector is inserted is formed on a surface of the inner side of the container opposite to the first opening.
substrate receiving device. The method of claim 1,
The concave portion is formed in a side wall of the container opposite to the first opening.
substrate receiving device. The method of claim 1,
A second opening through which another end effector holding the substrate passes is formed in a sidewall of the container opposite to the first opening,
A door for opening and closing the second opening is provided in the second opening,
The said recessed part is formed in the inner surface of the said container in the said door,
substrate receiving device. 4. The method of claim 3,
The substrate receiving device is a load lock module
substrate receiving device. a substrate processing apparatus for processing the substrate;
a conveying apparatus having an end effector for holding the substrate and a member including a consumable component provided in the substrate processing apparatus, and conveying the member;
and a substrate accommodating device for temporarily storing the substrate;
The substrate receiving device has a container,
An opening through which the end effector holding the substrate passes is formed in the sidewall of the container;
A concave portion into which the tip of the end effector is inserted is formed on a surface opposite to the opening on the inner side of the container.
processing system.

Images