JP2024014768A - Substrate transfer system and transfer module - Google Patents

Abstract

To reduce the footprint of a substrate processing system.SOLUTION: A substrate transfer system has a load lock module, an atmosphere transfer module, a first load port, and a second load port. The atmosphere transfer module has a first sidewall, a second sidewall, and a third sidewall. The first sidewall extends along the first direction and is connected to the load lock module. The second sidewall extends along a second direction orthogonal to the first direction. The third sidewall is on the opposite side of the second sidewall. The first load port extends outwardly from the second sidewall along the first direction. The second load port extends outwardly along the first direction from the third sidewall.SELECTED DRAWING: Figure 1

Description

Various aspects and embodiments of the present disclosure relate to substrate transport systems and transport modules.

Substrate processing systems are known that include a plurality of processing modules (PM), a vacuum transfer module (VTM), a load lock module (LLM), an equipment front end module (EFEM), and a load port (LP). (For example, see Patent Document 1 below). Each PM processes the substrate using plasma or the like. The VTM transports the substrates to their respective PMs under a low pressure environment. The LLM performs pressure conversion between the VTM and the EFEM. The LP is provided in the EFEM and connected to a container containing a plurality of substrates. The EFEM transports substrates between a container connected to the LP and the LLM.

JP 2021-141136 Publication

The present disclosure provides a substrate transport system and transport module that can reduce the footprint of a substrate processing system.

A substrate transfer system according to one aspect of the present disclosure includes a load lock module, an atmospheric transfer module, a first load port, and a second load port. The atmospheric transport module has a first sidewall, a second sidewall and a third sidewall. The first sidewall extends along the first direction and is connected to the loadlock module. The second side wall extends along a second direction orthogonal to the first direction. The third sidewall is opposite the second sidewall. A first load port extends outwardly from the second sidewall along the first direction. A second load port extends outwardly from the third sidewall along the first direction.

According to various aspects and embodiments of the present disclosure, the footprint of a substrate processing system can be reduced.

FIG. 1 is a schematic plan view showing an example of a substrate processing system according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing an example of PM. FIG. 3 is a schematic cross-sectional view showing an example of the AA cross section of the EFEM and LP illustrated in FIG. FIG. 4 is a schematic cross-sectional view showing an example of the BB cross section of the EFEM illustrated in FIG. FIG. 5A is a diagram showing an example of a process in which a container placed on the moving part of the LP is connected to the EFEM. FIG. 5B is a diagram showing an example of a process in which a container placed on the moving part of the LP is connected to the EFEM. FIG. 5C is a diagram showing an example of a process in which a container placed on the moving part of the LP is connected to the EFEM. FIG. 6 is a schematic plan view showing an example of the EFEM and LP in the second embodiment. FIG. 7 is a schematic cross-sectional view showing an example of the AA cross section of the EFEM and LP illustrated in FIG. FIG. 8 is a schematic cross-sectional view showing an example of the BB cross section of the EFEM illustrated in FIG. FIG. 9A is a diagram showing an example of a process in which a container placed on the moving part of the LP is connected to the EFEM. FIG. 9B is a diagram showing an example of a process in which a container placed on the moving part of the LP is connected to the EFEM. FIG. 9C is a diagram showing an example of a process in which a container placed on the moving part of the LP is connected to the EFEM. FIG. 9D is a diagram showing an example of a process in which a container placed on the moving part of the LP is connected to the EFEM. FIG. 10 is a schematic plan view showing an example of an EFEM and LP in the third embodiment. FIG. 11 is a schematic sectional view showing an example of the AA cross section of the EFEM and LP illustrated in FIG. 10. FIG. 12 is a schematic cross-sectional view showing an example of the BB cross section of the EFEM illustrated in FIG. FIG. 13 is a schematic plan view showing an example of the EFEM and LP in the fourth embodiment. FIG. 14 is a schematic cross-sectional view showing an example of the AA cross section of the EFEM and LP illustrated in FIG. 13. FIG. 15 is a schematic sectional view showing an example of the BB cross section of the EFEM illustrated in FIG. 14. FIG. 16 is a schematic plan view showing an example of the EFEM and LP in the fifth embodiment. FIG. 17 is a schematic cross-sectional view showing an example of the AA cross section of the EFEM illustrated in FIG. 16. FIG. 18 is a schematic sectional view showing an example of the BB cross section of the EFEM illustrated in FIG. 17.

Below, embodiments of a substrate transport system and a transport module will be described in detail based on the drawings. Note that the disclosed substrate transport system and transport module are not limited to the following embodiments.

By the way, in order to increase the number of substrates that can be processed per unit time, it is conceivable to increase the amount of PM for the substrates. As the number of PM increases, the substrate processing system including multiple PMs, VTMs, LLMs, EFEMs, etc. becomes larger. As the substrate processing system becomes larger, the installation area (footprint) of the substrate processing system within equipment such as a clean room becomes larger, making it difficult to arrange multiple substrate processing systems. Therefore, there is a need to reduce the installation area of substrate processing systems.

Therefore, the present disclosure provides a technique that can reduce the installation area of a substrate processing system.

(First embodiment)
[Configuration of substrate processing system 1]
FIG. 1 is a plan view showing an example of the configuration of a substrate processing system 1 according to the first embodiment. In FIG. 1, for convenience, some of the internal components of the device are shown transparently. The substrate processing system 1 includes a Vacuum Transfer Module (VTM) 11 , a plurality of Process Modules (PM) 12 , a Load Lock Module (LLM) 13 , and an Equipment Front End Module (EFEM) 14 . EFEM 14 is an example of a transport module. In the example of FIG. 1, the VTM 11, LLM 13, and EFEM 14 are arranged side by side along the y-axis direction of FIG.

A plurality of PMs 12 are connected to the side wall of the VTM 11 via a gate valve G1. Each PM 12 performs a process such as etching or film formation on the substrate W to be processed. In the example of FIG. 1, six PMs 12 are connected to the VTM 11, but the number of PMs 12 connected to the VTM 11 may be more than six or less than six.

FIG. 2 is a schematic cross-sectional view showing an example of the PM 12. In this embodiment, the PM 12 is, for example, a capacitively coupled plasma processing device. PM 12 includes a plasma processing chamber 120, a gas supply 124, a power source 125, and an exhaust system 128. Further, the PM 12 includes a substrate support section 121 and a gas introduction section. The gas inlet is configured to introduce at least one processing gas into the plasma processing chamber 120. The gas introduction section includes a shower head 123. Substrate support 121 is located within plasma processing chamber 120 . The shower head 123 is arranged above the substrate support section 121. In one embodiment, showerhead 123 forms at least a portion of the ceiling of plasma processing chamber 120 . The plasma processing chamber 120 has a plasma processing space 120s defined by a shower head 123, a side wall 120a of the plasma processing chamber 120, and a substrate support 121. The plasma processing chamber 120 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 120s, and at least one gas outlet for discharging gas from the plasma processing space 120s. Plasma processing chamber 120 is grounded. The shower head 123 and the substrate support section 121 are electrically insulated from the casing of the plasma processing chamber 120. An opening 120b is formed in the side wall 120a of the plasma processing chamber 120 for loading and unloading the substrate W. The opening 120b is opened and closed by a gate valve G1.

The substrate support section 121 includes a main body section 1211 and a ring assembly 1212. The main body portion 1211 has a central region 1211a for supporting the substrate W and an annular region 1211b for supporting the ring assembly 1212. A wafer is an example of a substrate W. The annular region 1211b of the main body 1211 surrounds the central region 1211a of the main body 1211 in plan view. The substrate W is arranged on the central region 1211a of the main body 1211, and the ring assembly 1212 is arranged on the annular region 1211b of the main body 1211 so as to surround the substrate W on the central region 1211a of the main body 1211. The central region 1211a is also referred to as a substrate support surface for supporting the substrate W, and the annular region 1211b is also referred to as a ring support surface for supporting the ring assembly 1212.

In one embodiment, body portion 1211 includes a base 12110 and an electrostatic chuck 12111. Base 12110 includes a conductive member. The conductive member of the base 12110 can function as a bottom electrode. Electrostatic chuck 12111 is placed on base 12110. Electrostatic chuck 12111 includes a ceramic member 12111a and an electrostatic electrode 12111b disposed within ceramic member 12111a. Ceramic member 12111a has a central region 1211a. In one embodiment, ceramic member 12111a also has an annular region 1211b. Note that another member surrounding the electrostatic chuck 12111, such as an annular electrostatic chuck or an annular insulating member, may have the annular region 1211b. In this case, the ring assembly 1212 may be placed on the annular electrostatic chuck or the annular insulation member, or may be placed on both the electrostatic chuck 12111 and the annular insulation member. Furthermore, at least one RF/DC electrode coupled to an RF (Radio Frequency) power source 126 and/or a DC (Direct Current) power source 127, which will be described later, may be disposed within the ceramic member 12111a. In this case, at least one RF/DC electrode functions as a bottom electrode. An RF/DC electrode is also referred to as a bias electrode if at least one RF/DC electrode is supplied with a bias RF signal and/or a DC signal as described below. Note that the conductive member of the base 12110 and at least one RF/DC electrode may function as a plurality of lower electrodes. Further, the electrostatic electrode 12111b may function as a lower electrode. Substrate support 121 includes at least one lower electrode.

Ring assembly 1212 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one cover ring. The edge ring is formed of a conductive or insulating material, and the cover ring is formed of an insulating material.

Further, the substrate support unit 121 may include a temperature control module configured to adjust at least one of the electrostatic chuck 12111, the ring assembly 1212, and the substrate W to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 12110a, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path 12110a. In one embodiment, a flow path 12110a is formed within the base 12110 and one or more heaters are disposed within the ceramic member 12111a of the electrostatic chuck 12111. Further, the substrate support section 121 may include a heat transfer gas supply section configured to supply heat transfer gas to the gap between the back surface of the substrate W and the central region 1211a.

The shower head 123 is configured to introduce at least one processing gas from the gas supply section 124 into the plasma processing space 120s. Shower head 123 has at least one gas supply port 123a, at least one gas diffusion chamber 123b, and multiple gas introduction ports 123c. The processing gas supplied to the gas supply port 123a passes through the gas diffusion chamber 123b and is introduced into the plasma processing space 120s from the plurality of gas introduction ports 123c. The showerhead 123 also includes at least one upper electrode. Note that an upper electrode plate may be removably provided on the lower surface of the shower head 123. Further, in addition to the shower head 123, the gas introduction section may include one or more side gas injectors (SGI) attached to one or more openings formed in the side wall 120a.

Gas supply 124 may include at least one gas source 1240 and at least one flow controller 1241. In one embodiment, gas supply 124 is configured to supply at least one process gas from respective gas sources 1240 to showerhead 123 via respective flow controllers 1241 . Each flow controller 1241 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, gas supply 124 may include one or more flow modulation devices that modulate or pulse the flow rate of at least one process gas.

Power source 125 includes an RF power source 126 coupled to plasma processing chamber 120 via at least one impedance matching circuit. RF power source 126 is configured to provide at least one RF signal (RF power) to at least one bottom electrode and/or at least one top electrode. Thereby, plasma is formed from at least one processing gas supplied to the plasma processing space 120s. Accordingly, RF power source 126 may function as at least part of a plasma generation unit configured to generate a plasma from one or more process gases in plasma processing chamber 120. Further, by supplying a bias RF signal to at least one lower electrode, a bias potential is generated in the substrate W, and ion components in the formed plasma can be drawn into the substrate W.

In one embodiment, RF power supply 1261 includes a first RF generator 126a and a second RF generator 126b. The first RF generation section 126a is coupled to at least one lower electrode and/or at least one upper electrode via at least one impedance matching circuit, and generates a source RF signal (source RF power) for plasma generation. It is configured as follows. In one embodiment, the source RF signal has a frequency within the range of 10 MHz to 150 MHz. In one embodiment, the first RF generator 126a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are provided to at least one bottom electrode and/or at least one top electrode.

The second RF generator 126b is coupled to at least one lower electrode via at least one impedance matching circuit and configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a lower frequency than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency within the range of 100kHz to 60MHz. In one embodiment, the second RF generator 126b may be configured to generate multiple bias RF signals having different frequencies. The generated one or more bias RF signals are provided to at least one bottom electrode. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

Power source 125 may also include a DC power source 127 coupled to plasma processing chamber 120 . DC power supply 127 includes a first DC generation section 127a and a second DC generation section 127b. In one embodiment, the first DC generator 127a is connected to the at least one bottom electrode and configured to generate the first DC signal. The generated first bias DC signal is applied to the at least one bottom electrode. In one embodiment, the second DC generator 127b is connected to the at least one upper electrode and configured to generate the second DC signal. The generated second DC signal is applied to the at least one top electrode.

In various embodiments, at least one of the first and second DC signals may be pulsed. In this case, a sequence of voltage pulses is applied to at least one bottom electrode and/or at least one top electrode. The voltage pulse may have a pulse waveform that is rectangular, trapezoidal, triangular, or a combination thereof. In one embodiment, a waveform generator for generating a sequence of voltage pulses from a DC signal is connected between the first DC generator 127a and the at least one bottom electrode. Therefore, the first DC generating section 127a and the waveform generating section constitute a voltage pulse generating section. When the second DC generation section 127b and the waveform generation section constitute a voltage pulse generation section, the voltage pulse generation section is connected to at least one upper electrode. The voltage pulse may have positive polarity or negative polarity. Further, the sequence of voltage pulses may include one or more positive voltage pulses and one or more negative voltage pulses within one cycle. Note that the first DC generation section 127a and the second DC generation section 127b may be provided in addition to the RF power source 126, or the first DC generation section 127a may be provided in place of the second RF generation section 126b. It's okay to be hit.

Exhaust system 128 may be connected to a gas outlet 120e provided at the bottom of plasma processing chamber 120, for example. Evacuation system 128 may include a pressure regulating valve and a vacuum pump. The pressure within the plasma processing space 120s is adjusted by the pressure adjustment valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

Returning to FIG. 1, the explanation will be continued. A plurality of LLMs 13 are connected to the other side wall of the VTM 11 via a gate valve G2. In the example of FIG. 1, two LLMs 13 are connected to the VTM 11, but the number of LLMs 13 connected to the VTM 11 may be more than two or less than two.

A transfer robot 110 is arranged within the VTM 11 . The transport robot 110 moves within the VTM 11 along guide rails 111 provided within the VTM 11 and transports the substrate W between the PM 12 and the LLM 13. The substrate W is an example of an object to be transported. Note that the transfer robot 110 may be fixed at a predetermined position within the VTM 11 and not move within the VTM 11. The inside of the VTM 11 is maintained at a pressure atmosphere lower than atmospheric pressure.

The VTM 11 is connected to one side wall of each LLM 13 via a gate valve G2, and the EFEM 14 is connected to the other side wall of each LLM 13 via a gate valve G3. In the LLM 13, when the substrate W is carried into the LLM 13 from the EFEM 14 via the gate valve G3, the gate valve G3 is closed. Then, the pressure inside the LLM 13 is lowered from a predetermined first pressure (for example, atmospheric pressure) to a predetermined second pressure (for example, a pressure at a predetermined degree of vacuum). Then, the gate valve G2 is opened, and the substrate W in the LLM 13 is carried out into the VTM 11 by the transfer robot 110.

Further, while the inside of the LLM 13 is at the second pressure, the transfer robot 110 carries the substrate W from the VTM 11 into the LLM 13 via the gate valve G2, and the gate valve G2 is closed. Then, the pressure inside the LLM 13 is increased from the second pressure to the first pressure. Then, the gate valve G3 is opened, and the substrate W inside the LLM 13 is carried out into the EFEM 14.

EFEM 14 has sidewall 147, sidewall 148-1, and sidewall 148-2. In the EFEM 14, a plurality of LPs (Load Ports) 15 are respectively provided on a side wall 148-1 and a side wall 148-2 on the opposite side of the side wall 147 of the EFEM 14 to which the LLM 13 is connected. In the example of FIG. 1, the side wall 147 extends along the x-axis direction and is connected to the LLM 13. The side wall 148-1 extends along the y-axis direction orthogonal to the x-axis direction. Side wall 148-2 is provided on the opposite side of side wall 148-1. The side wall 148-1 is provided with an LP 15 that extends outward from the side wall 148-1 along the x-axis direction, and the side wall 148-2 is provided with an LP 15 that extends outward from the side wall 148-2 along the x-axis direction. An LP 15 is provided that extends in the direction.

The side wall 147 is an example of a first side wall, the side wall 148-1 is an example of a second side wall, and the side wall 148-2 is an example of a third side wall. Furthermore, the LP15 provided on the side wall 148-1 is an example of a first load port, and the LP15 provided on the side wall 148-2 is an example of a second load port. Further, the x-axis direction is an example of a first direction, and the y-axis direction is an example of a second direction.

Each LP 15 is provided with a moving section 150 on which a container such as a FOUP (Front Opening Unified Pod) capable of accommodating a plurality of substrates W is placed. The moving section 150 provided on the LP15 provided on the side wall 148-1 is an example of a first substrate carrier stage, and the moving section 150 provided on the LP15 provided on the side wall 148-2 is an example of a second substrate carrier. This is an example of a stage. A container such as a FOUP is transported by a container transport mechanism such as an OHT (Overhead Hoist Transport), and placed on the moving unit 150.

Thus, in this embodiment, a plurality of LPs 15 are provided on the side walls 148-1 and 148-2 other than the side wall on the opposite side of the side wall 147 of the EFEM 14 to which the LLM 13 is connected. This allows the length of the substrate processing system 1 in the direction along the y-axis to be shorter than when a plurality of LPs 15 are provided on the side wall facing the side wall 147. Thereby, the installation area of the substrate processing system 1 can be reduced.

A transfer robot 140 is provided within the EFEM 14. The transport robot 140 is an example of a transport device. Further, an alignment chamber 142 is provided within the EFEM 14, and an aligner unit 1420 for adjusting the orientation of the substrate W is disposed within the alignment chamber 142. The transport robot 140 moves vertically within the EFEM 14 along guide rails 141 provided within the EFEM 14 and transports the substrate W between the container set in the LP 15, the alignment chamber 142, and the LLM 13. Note that the transfer robot 140 may be fixed at a predetermined position within the EFEM 14 and not move within the EFEM 14 .

In this embodiment, the EFEM 14 is configured to be airtight, and an inert gas such as nitrogen gas or rare gas is supplied into the EFEM 14 from a gas supply section (not shown), and the inert gas is circulated within the EFEM 14. An FFU (Fan Filter Unit) is provided in the upper part of the EFEM 14, and inert gas from which particles and the like have been removed is supplied into the EFEM 14 from the upper part, and a downflow is formed in the EFEM 14. In this embodiment, the pressure inside the EFEM 14 is atmospheric pressure, but in another embodiment, the pressure inside the EFEM 14 may be controlled to be positive pressure. Thereby, it is possible to suppress particles and the like from entering into the EFEM 14 from the outside.

The substrate processing system 1 is controlled by a controller 10. The control unit 10 has a memory, a processor, and an input/output interface. Data such as recipes, programs, etc. are stored in the memory. The memory is, for example, RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), or SSD (Solid State Drive). The processor controls each part of the substrate processing system 1 via the input/output interface based on data such as a recipe stored in the memory by executing a program read from the memory. The processor is a CPU (Central Processing Unit), a DSP (Digital Signal Processor), or the like.

[Details of EFEM14 and LP15]
3 is a schematic sectional view showing an example of the AA cross section of the EFEM 14 and the LP 15 illustrated in FIG. 1, and FIG. 4 is a schematic sectional view showing an example of the BB cross section of the EFEM 14 illustrated in FIG. It is a diagram. In FIG. 3, the guide rail 141 is also illustrated.

EFEM 14 has a housing 149. The EFEM 14 is provided with an alignment chamber 142, as shown in FIGS. 3 and 4, for example, and an aligner unit 1420 is disposed within the alignment chamber 142. An FFU 143 is provided above the EFEM 14. An opening 144 communicating with the LLM 13 is formed in a side wall 147 of the EFEM 14 to which the LLM 13 is connected. The opening 144 is an example of a first opening. The aligner unit 1420 is arranged above the LLM 13, as shown in FIG. 4, for example.

The guide rail 141 is arranged on a side wall opposite to a side wall 147 of the EFEM 14 provided with an opening 144 so as to extend vertically along the side wall. The transfer robot 140 moves vertically within the EFEM 14 along a guide rail 141. A storage unit 145 is arranged below the EFEM 14 to temporarily store the substrates W before and after processing.

For example, as shown in FIGS. 3 and 4, side walls 148-1 and 148-2 other than the side wall 147 opposite to the side wall 147 in which the opening 144 to which the LLM 13 is connected are provided with a An opening 146 is formed to which the container is connected. Opening 146 is an example of a second opening.

[Operation of LP15]
5A to 5C are diagrams showing an example of a process in which the container 16 placed on the moving part 150 of the LP 15 is connected to the EFEM 14. 5A-5C, LP 15 is shown connected to sidewall 148-1.

A container 16 such as a FOUP containing a plurality of substrates W is transported by a transport mechanism such as an OHT, and placed on the moving unit 150. For example, as shown in FIG. 5A, the container 16 has a surface of an opening 161 provided with a door 160 in a direction along the surface of the side wall opposite to the side wall 147 of the EFEM 14 (in the example of FIG. 5A, along the x-axis). direction) on the moving unit 150. The opening 161 of the container 16 is an example of a first opening.

Next, as shown in FIG. 5B, for example, the moving unit 150 is configured so that the surface of the opening 161 is oriented along the side wall 148-1 of the EFEM 14 (in the example of FIG. 5B, along the y-axis direction). Then, change the orientation of the container 16.

Next, the moving unit 150 moves on the guide rail 151 so that the opening 161 of the container 16 and the opening 146 formed in the side wall 147 of the EFEM 14 approach each other, as shown in FIG. 5C, for example. Move the container 16. Thereafter, the container 16 and the EFEM 14 are connected by opening the door 160 and the gate valve G4.

The first embodiment has been described above. As described above, the EFEM 14 in this embodiment includes a housing 149 and a transport robot 140 that is disposed within the housing 149 and transports a substrate W, which is an example of an object to be transported. The housing 149 includes a side wall 147 having an opening 144 communicating with the LLM 13, and a side wall 148-1 other than the side wall on the opposite side of the side wall 147. The side wall 148-1 is connected to the LP 15 and has at least one opening. A side wall 148-1 having a portion 146. Thereby, the installation area of the substrate processing system 1 can be reduced.

Furthermore, in the embodiment described above, the LP 15 includes the moving section 150. The moving unit 150 moves the container 16 arranged so that the surface of the container 16 in which the opening 161 is formed is oriented along the surface of the side wall opposite to the side wall 147 of the EFEM 14 by the container transport mechanism that transports the container 16. , the position and orientation of the container 16 are changed so that the opening 161 of the container 16 and the opening 146 of the side wall 148-1 are in communication with each other. Thereby, the container 16 transported by the container transport mechanism can be connected to the EFEM 14.

Further, in the embodiment described above, the EFEM 14 includes an aligner unit 1420 disposed within the housing 149. Thereby, the space within the EFEM 14 can be effectively utilized.

Furthermore, in the embodiment described above, the EFEM 14 includes a storage unit 145 disposed within the housing 149. Thereby, the space within the EFEM 14 can be effectively utilized.

Furthermore, in the embodiment described above, the EFEM 14 further includes a gas supply section that circulates and supplies inert gas into the housing 149. Thereby, in the substrate W passing through the EFEM 14, deterioration of the quality of the substrate W such as oxidation can be suppressed.

(Second embodiment)
In the first embodiment, one container 16 is connected to each of the side wall 148-1 and the side wall 148-2 of the EFEM 14, but in this embodiment, the container 16 is connected to each of the side wall 148-1 and the side wall 148-2 of the EFEM 14. This embodiment differs from the first embodiment in that a plurality of containers 16 are connected to each other. In the following, points different from the first embodiment will be mainly explained.

FIG. 6 is a schematic plan view showing an example of the EFEM 14 and LP 15 in the second embodiment. FIG. 7 is a schematic sectional view showing an example of the AA cross section of the EFEM 14 and LP 15 illustrated in FIG. FIG. 8 is a schematic sectional view showing an example of the BB cross section of the EFEM 14 illustrated in FIG. The LP 15 in this embodiment is provided with a plurality of moving parts 150a and a plurality of moving parts 150b, as shown in FIGS. 6 and 7, for example. The plurality of moving parts 150a and moving parts 150b are arranged side by side in the direction along the surface of the side wall opposite to the side wall 147 of the EFEM 14 (for example, the direction along the x-axis in FIG. 6). In this embodiment, the interval ΔL1 between the plurality of moving parts 150a and the moving parts 150b is, for example, 505 mm in accordance with the SEMI (Semiconductor Equipment and Materials International) standard.

Furthermore, a plurality of openings 146a and openings 146b to which the container 16 placed on the LP 15 is connected are formed in the side wall 148-1 and the side wall 148-2 of the EFEM 14, respectively. In this embodiment, the plurality of openings 146a and the openings 146b are arranged in a direction along the respective surfaces of the side wall 148-1 and the side wall 148-2 of the EFEM 14 (for example, as shown in FIGS. 6 and 8). and the direction along the y-axis in FIG. 8). In the examples of FIGS. 6 and 8, the plurality of openings 146a and openings 146b are arranged laterally along the respective surfaces of the sidewalls 148-1 and 148-2 of the EFEM 14. The opening 146a is opened and closed by a gate valve G4a, and the opening 146b is opened and closed by a gate valve G4b.

Furthermore, in the EFEM 14 of this embodiment, the opening 144 to which the LLM 13 is connected and the opening 146b to which the container 16 is connected are formed at different heights, as shown in FIGS. 7 and 8, for example. has been done. Further, as shown in FIG. 8, for example, when viewed from a direction intersecting the side walls 148-1 and 148-2, the surface of the side wall 147 protrudes into the area of the side walls 148-1 and 148-2. ing. In other words, as shown in FIG. 8, for example, in the EFEM 14, the width of the side wall 148-1 and the side wall 148-2 at the height where the plurality of openings 146a and the openings 146b are formed is equal to It is wider than the width of side wall 148-1 and side wall 148-2 at the formed height. Note that the opening 146a may be formed at the same height as the opening 146b or the opening 144, or may be formed at a different height from the opening 146b and the opening 144.

In the example of FIGS. 6 to 8, two openings 146a and 146b are provided in the side wall 148-1 and side wall 148-2 of the EFEM 14, respectively, and two moving parts 150a and 150b are provided in the LP15. However, the disclosed technology is not limited thereto. As another form, for example, three or more openings 146 may be provided in each of the side walls 148-1 and 148-2 of the EFEM 14, and three or more moving parts 150 may be provided in the LP 15.

[Operation of LP15]
9A to 9D are diagrams showing an example of a process in which the containers 16 placed on the moving part 150a and the moving part 150b of the LP 15 are connected to the EFEM 14. 9A-9D, LP 15 is shown connected to sidewall 148-1.

Containers 16a and 16b such as FOUPs containing a plurality of substrates W are transported by a transport mechanism such as OHT, and placed on moving section 150a and moving section 150b, respectively. At this time, the container 16a and the container 16b are oriented so that the surface of the opening 161 is along the surface of the side wall opposite to the side wall 147 of the EFEM 14 (in the example of FIG. 9A, the direction along the x-axis). Each is placed on the moving part 150b.

Next, as shown in FIG. 9B, for example, the moving unit 150a is configured so that the surface of the opening 161 is oriented along the side wall 148-1 of the EFEM 14 (in the example of FIG. 9B, along the y-axis direction). Then, change the orientation of the container 16a. Furthermore, as shown in FIG. 9B, for example, the moving unit 150b moves the container 16b along the side wall 148-1 of the EFEM 14 (for example, in the y-axis direction in FIG. 9B).

Next, by moving on the guide rail 151a, the moving unit 150a moves the container 16a so that the opening 161 of the container 16a and the opening 146a of the EFEM 14 approach each other, as shown in FIG. 9C, for example. Furthermore, as shown in FIG. 9C, for example, the moving unit 150b is configured such that the surface of the opening 161 is oriented along the side wall 148-1 of the EFEM 14 (in the example of FIG. 9C, along the y-axis direction). , change the orientation of the container 16b.

Next, the moving unit 150b moves the container 16b so that the opening 161 of the container 16b and the opening 146b of the EFEM 14 approach each other by moving on the guide rail 151b, for example, as shown in FIG. 9D. Thereafter, by opening the door 160 and the gate valve G4, the containers 16a and 16b are connected to the EFEM 14. Thereby, the plurality of containers 16a and containers 16b are connected to the EFEM 14 so as to be lined up laterally along the side wall of the EFEM 14.

Here, as shown in FIG. 9D, the distance ΔL2 between the container 16a and the container 16b in the state where they are connected to the EFEM 14 is shorter than the distance ΔL1 illustrated in FIGS. 6 and 9A. In this embodiment, the interval ΔL2 is, for example, 400 mm. Thereby, the length of the EFEM 14 in the direction along the y-axis can be shortened, and the installation area of the substrate processing system 1 can be reduced.

The second embodiment has been described above. As described above, in this embodiment, each of the side wall 148-1 and the side wall 148-2 of the EFEM 14 has a plurality of openings 146a and a plurality of openings 146b along the surface of the side wall 148-1 or the side wall 148-2. They are formed so that they are lined up horizontally. This allows more containers 16 to be connected to the EFEM 14.

Further, in the embodiment described above, an opening 144 communicating with the LLM 13 is formed in the side wall 147 of the EFEM 14, and the opening 144 and the opening 146 are formed at different heights. Thereby, the substrate W can be transported through the opening 144 and the substrate W can be transported through the opening 146 without interfering with each other.

Further, in the embodiment described above, when viewed from a direction intersecting the surfaces of the side wall 148-1 and the side wall 148-2 of the EFEM 14, the surface of the side wall 147 in which the opening 144 is formed is the same as that of the side wall 148-1 and the side wall 148-2. It is looming within the area of 148-2. Thereby, the EFEM 14 can be made smaller while ensuring areas for a plurality of openings 146 for connection with the container 16 in each of the side walls 148-1 and 148-2.

(Third embodiment)
In the second embodiment, a plurality of containers 16 are connected to each of the side walls 148-1 and 148-2 of the EFEM 14 so as to be lined up laterally. In contrast, this embodiment differs from the second embodiment in that a plurality of containers 16 are connected to each of the side walls 148-1 and 148-2 of the EFEM 14 so as to be lined up in the vertical direction (vertical direction). is different. In the following, points different from the second embodiment will be mainly explained.

FIG. 10 is a schematic plan view showing an example of the EFEM 14 and LP 15 in the third embodiment. FIG. 11 is a schematic sectional view showing an example of the AA cross section of the EFEM 14 and LP 15 illustrated in FIG. FIG. 12 is a schematic sectional view showing an example of the BB cross section of the EFEM 14 illustrated in FIG. In this embodiment, as shown in FIGS. 10 and 11, for example, a plurality of LPs 15a and LPs 15b are provided in the vertical direction (vertical direction) along the surfaces of the side walls 148-1 and 148-2 of the EFEM 14. There is. The LP 15a is provided with a moving section 150a, and the LP 15b is provided with a moving section 150b. In the example of FIG. 11, the LP 15a extends outward along the x-axis direction from the side wall 148-1 or the side wall 148-2 above the LP 15b. Moreover, the moving part 150a and the moving part 150b are arranged at different positions in plan view. The LP 15b provided on the side wall 148-1 is an example of a first load port, and the LP 15a provided on the side wall 148-1 is an example of a third load port. Further, the LP 15b provided on the side wall 148-2 is an example of a second load port, and the LP 15a provided on the side wall 148-2 is an example of a fourth load port. Furthermore, the moving section 150b provided on the LP 15b provided on the side wall 148-1 is an example of the first substrate carrier stage, and the moving section 150b provided on the LP 15a provided on the side wall 148-1 is an example of the third substrate carrier stage. This is an example of a substrate carrier stage. Furthermore, the moving section 150b provided on the LP 15b provided on the side wall 148-2 is an example of a second substrate carrier stage, and the moving section 150b provided on the LP 15a provided on the side wall 148-2 is an example of a fourth substrate carrier stage. This is an example of a substrate carrier stage. Furthermore, in the present embodiment, in the LP15a and LP15b provided on one side wall 148-1 or 148-2, the distance ΔL1 between the moving part 150a and the moving part 150b is compliant with, for example, the SEMI standard in plan view. It is 505mm.

As shown in FIGS. 11 and 12, for example, a plurality of openings 146a and a plurality of openings 146b are formed in the side wall 148-1 and the side wall 148-2 in the vertical direction. In this embodiment, at least one of the plurality of openings 146a and openings 146b (in the examples of FIGS. 11 and 12, the opening 146a) is located at a position above the opening 144 to which the LLM 13 is connected. It is formed. Furthermore, at least one of the plurality of openings 146a and openings 146b (in the examples of FIGS. 11 and 12, the opening 146b) is formed at a position below the opening 144 to which the LLM 13 is connected. be done.

Thereby, the moving distance of the substrate W when being carried out from the LLM 13 to the container 16 can be shortened, and the time required for transporting the substrate W can be shortened. Note that the aligner unit 1420 is also preferably arranged at a height between the openings 146a and 146b. Thereby, the moving distance of the substrate W when being transported from the container 16 to the aligner unit 1420 can be shortened.

In addition, in this embodiment, the plurality of openings 146a and openings 146b formed in the sidewall 148-1 and the sidewall 148-2, as shown in FIGS. 11 and 12, for example, the sidewall 148-1 Alternatively, they are formed on the same surface of the side wall 148-2. Thereby, unevenness of the side walls 148-1 and 148-2 can be reduced, and inert gas can be smoothly circulated within the casing 149 of the EFEM 14. This makes it possible to suppress the occurrence of gas pools within the casing 149. Note that, as another form, the plurality of openings 146a and the plurality of openings 146b may be formed at different positions of the sidewall 148-1 and the sidewall 148-2 in plan view.

An opening 146a is formed in the side wall 148-1 and the side wall 148-2 at the position where the LP 15a is provided. The opening 146a is opened and closed by a gate valve G4a. Further, an opening 146b is formed in the side wall 148-1 and the side wall 148-2 at the position where the LP 15b is provided. The opening 146b is opened and closed by a gate valve G4b. The operations of the moving unit 150a and the moving unit 150b are similar to the operations of the moving unit 150 in the first embodiment described using FIGS. 5A to 5C, and therefore the description thereof will be omitted.

Note that in the example of FIGS. 10 to 12, two openings 146a and 146b are provided in the side wall 148-1 and side wall 148-2 of the EFEM 14, and two LPs 15a and LP15b are provided, but the disclosed The technology is not limited to this. As another form, for example, three or more openings 146 and LP15 may be provided in each of side wall 148-1 and side wall 148-2 of EFEM 14, respectively.

The third embodiment has been described above. As described above, in the present embodiment, a plurality of openings 146a and a plurality of openings 146b are formed in each of the sidewalls 148-1 and 148-2 of the EFEM 14 so as to be aligned in the vertical direction. Thereby, more containers 16 can be connected to the EFEM 14.

Further, in the embodiment described above, the side wall 147 of the EFEM 14 is formed with an opening 144 that communicates with the LLM 13, and the side wall 148-1 and the side wall 148-2 of the EFEM 14 are each formed with a container placed on the LP 15. A plurality of openings 146 are formed that communicate with the opening 161 formed in the opening 16 . At least one of the plurality of openings 146 is formed at a position above the opening 144, and at least one other among the plurality of openings 146 is formed at a position below the opening 144. has been done. Thereby, the time required to transport the substrate W can be shortened.

(Fourth embodiment)
In the second embodiment, a plurality of containers 16 are connected to the side walls 148-1 and 148-2 of the EFEM 14 so as to be lined up in the horizontal direction, and in the third embodiment, the containers 16 are connected to the side walls 148-1 and 148-2 of the EFEM 14 so as to be lined up in the horizontal direction. A plurality of containers 16 are connected to each of the side walls 148-2 so as to be vertically lined up. In contrast, in the present embodiment, a plurality of containers 16 are connected to each of the side wall 148-1 and the side wall 148-2 of the EFEM 14 so as to be lined up laterally and vertically, unlike the second and third embodiments. It is different from the form. In the following, points different from the second and third embodiments will be mainly explained.

FIG. 13 is a schematic plan view showing an example of the EFEM 14 and LP 15 in the fourth embodiment. FIG. 14 is a schematic sectional view showing an example of the AA cross section of the EFEM 14 and LP 15 illustrated in FIG. 13. FIG. 15 is a schematic sectional view showing an example of the BB cross section of the EFEM 14 illustrated in FIG. Each of the side walls 148-1 and 148-2 of the EFEM 14 has a plurality of openings 146a1 and a plurality of openings 146a2, as shown in FIGS. 13 to 15, respectively. They are formed so as to be lined up laterally along the plane (for example, in the direction along the y-axis in FIGS. 13 to 15). Further, each of the side wall 148-1 and the side wall 148-2 of the EFEM 14 has a plurality of openings 146b1 and a plurality of openings 146b2, as shown in FIGS. 13 to 15, respectively. They are formed so as to be lined up in the lateral direction (for example, the direction along the y-axis in FIGS. 13 to 15) along each surface. Further, each of the side wall 148-1 and the side wall 148-2 has a plurality of openings 146a1 and an opening 146b1, and a plurality of openings 146a2 and an opening 146b2, as shown in FIGS. 13 to 15, for example. They are formed to be aligned in the vertical direction (for example, the direction along the z-axis in FIGS. 13 to 15) along the respective surfaces of the side wall 148-1 and the side wall 148-2.

Furthermore, in this embodiment, as shown in FIGS. 13 to 15, for example, a plurality of LPs 15a and LPs 15b are provided in the vertical direction along each of the side walls 148-1 and 148-2 of the EFEM 14. The LP15a is provided with a moving section 150a1 and a moving section 150a2, and the LP15b is provided with a moving section 150b1 and a moving section 150b2. In the LP15a and LP15b provided on the side wall 148-1 and the side wall 148-2, respectively, the interval ΔL1 between the moving part 150a1, the moving part 150a2, the moving part 150b1, and the moving part 150b2 is in accordance with, for example, the SEMI standard in plan view. It is 505mm in compliance.

The opening 146a1 is opened and closed by a gate valve G4a1, and the opening 146a2 is opened and closed by a gate valve G4a2. Furthermore, the opening 146b1 is opened and closed by a gate valve G4b1, and the opening 146b2 is opened and closed by a gate valve G4b2.

Furthermore, in the EFEM 14 of this embodiment, the opening 144 to which the LLM 13 is connected and the openings 146a2 and 146b2 to which the container 16 is connected are located at different heights, for example, as shown in FIG. It is formed. Further, as shown in FIG. 15, for example, when viewed from a direction intersecting the side walls 148-1 and 148-2, the surface of the side wall 147 to which the LLM 13 is connected is the same as that of the side walls 148-1 and 148-2. It's looming into the area. In other words, as shown in FIG. 15, for example, in the EFEM 14, the width of the side wall 148-1 and the side wall 148-2 at the height where the plurality of openings 146a1 to 146b2 are formed is the same as that at which the opening 144 is formed. The width of the side walls 148-1 and 148-2 is wider than the width of the side walls 148-1 and 148-2 at the height.

The operations of moving unit 150a1, moving unit 150a2, moving unit 150b1, and moving unit 150b2 are similar to the operations of moving unit 150a and moving unit 150b in the second embodiment described using FIGS. 9A to 9D. Therefore, the explanation will be omitted.

Note that in the examples of FIGS. 13 to 15, one LP 15 is provided with two moving sections 150, but one LP 15 may be provided with three or more moving sections 150. Further, in the examples of FIGS. 13 to 15, two LPs 15 are provided on each of the side wall 148-1 and the side wall 148-2, but three or more LPs 15 are provided on each of the side wall 148-1 and the side wall 148-2. LP15 may be provided.

The fourth embodiment has been described above. Also in this embodiment, the installation area of the substrate processing system 1 can be reduced.

(Fifth embodiment)
In the first to fourth embodiments, the side wall 147 of the EFEM 14 to which the LLM 13 is connected and the side walls 148-1 and 148-2 of the EFEM 14 to which the container 16 is connected are different side walls. In contrast, this embodiment differs from the first to fourth embodiments in that the side wall 147 and the side wall 148 are the same side wall. In the following, points different from the first to fourth embodiments will be mainly explained.

FIG. 16 is a schematic plan view showing an example of the EFEM 14 and LP 15 in the fifth embodiment. FIG. 17 is a schematic cross-sectional view showing an example of the AA cross section of the EFEM 14 illustrated in FIG. 16. FIG. 18 is a schematic sectional view showing an example of the BB cross section of the EFEM 14 illustrated in FIG. 17. For example, as shown in FIG. 18, an opening 146 is provided in a side wall 147 of the EFEM 14 to which the LLM 13 is connected. In this embodiment, the side wall 147 to which the LLM 13 is connected and the side wall 148 to which the container 16 is connected are the same side wall. Further, an opening 146 to which the container 16 is connected is formed in the side wall 147 above the opening 144 communicating with the LLM 13. For example, side wall 148 to which container 16 is connected is arranged along a plane that includes side wall 147 to which LLM 13 is connected. Side wall 147 is an example of a first side wall, and side wall 148 is an example of a second side wall. Even with this configuration, the length of the substrate processing system 1 in the direction along the y-axis in FIGS. 16 to 18 can be shortened. Thereby, the installation area of the substrate processing system 1 can be reduced.

In this embodiment, the alignment chamber 142 is arranged above the LLM 13. Furthermore, in this embodiment, the alignment chamber 142 is provided at a position lower than the opening 146 to which the container 16 is connected and higher than the opening 144 to which the LLM 13 is connected. Thereby, it is possible to shorten the movement distance of the substrate W when the substrate W is carried into the alignment chamber 142 from the container 16 and whose orientation is adjusted by the aligner unit 1420 and is carried into the LLM 13. Note that the alignment chamber 142 in which the aligner unit 1420 is arranged may be provided at a position higher than the opening 146 or lower than the opening 144.

Note that the embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. Indeed, the embodiments described above may be implemented in various forms. Further, the above-described embodiments may be omitted, replaced, or modified in various forms without departing from the scope and spirit of the appended claims.

For example, in each of the embodiments described above, the VTM 11 and the EFEM 14 that transport the substrate W are used as an example of the object to be transported, but the disclosed technology is not limited thereto. For example, as another form, the disclosed technology can also be applied to the VTM 11 and EFEM 14 that transport objects other than the substrate W, such as edge rings, cover rings, upper electrode plates, and electrostatic chucks. .

Further, in each of the embodiments described above, the shape of the EFEM 14 in plan view is rectangular, but the disclosed technology is not limited to this. As another form, the shape of the EFEM 14 in plan view may be a triangle or a polygon of pentagon or more, and in the case of a quadrangle, it may be a trapezoid, a parallelogram, a rhombus, or the like. Moreover, the shape of the EFEM 14 in plan view may have at least one of the plurality of sides curved.

Further, in each of the embodiments described above, the PM 12 that performs processing using capacitively coupled plasma (CCP) has been described as an example of a plasma source, but the plasma source is not limited to this. Examples of plasma sources other than capacitively coupled plasma include inductively coupled plasma (ICP), microwave excited surface wave plasma (SWP), electron cycloton resonance plasma (ECP), and helicon wave excited plasma (HWP). It will be done.

Further, regarding the above embodiment, the following additional notes are further disclosed.

(Additional note 1)
load lock module,
an atmospheric transport module having a first sidewall, a second sidewall and a third sidewall, the first sidewall extending along a first direction and connected to the load lock module; a second side wall extending along a second direction perpendicular to the first direction, and the third side wall being on an opposite side of the second side wall;
a first load port extending outward from the second sidewall along the first direction;
a second load port extending outward from the third side wall along the first direction;
A board transport system equipped with
(Additional note 2)
the first load port includes a first substrate carrier stage;
The substrate transport system according to appendix 1, wherein the second load port includes a second substrate carrier stage.
(Additional note 3)
further comprising a third load port extending outward along the first direction from the second side wall above the first load port,
the third load port includes a third substrate carrier stage;
The substrate transport system according to appendix 2, wherein the first substrate carrier stage and the third substrate carrier stage are arranged at different positions in a plan view.
(Additional note 4)
further comprising a fourth load port extending outward along the first direction from the third side wall above the second load port,
the fourth load port includes a fourth substrate carrier stage;
The substrate transport system according to appendix 2 or 3, wherein the second substrate carrier stage and the fourth substrate carrier stage are arranged at different positions in a plan view.
(Appendix 5)
A casing and
and a transport device disposed within the housing,
The casing is
a first sidewall having a first opening communicating with the loadlock module;
a second sidewall other than the sidewall opposite the first sidewall, the second sidewall being connected to a load port and having at least one second opening; , transport module.
(Appendix 6)
The transport module according to appendix 5, wherein the at least one second opening has a plurality of second openings arranged along the lateral direction.
(Appendix 7)
The transport module according to appendix 5 or 6, wherein the first opening is formed at a different height from the at least one second opening.
(Appendix 8)
When viewed from a direction intersecting a surface of the second side wall, a surface of the first side wall in which the third opening is formed protrudes into a region of the second side wall. The transport module according to appendix 7.
(Appendix 9)
The transport module according to appendix 5, wherein the at least one second opening has a plurality of second openings arranged along the longitudinal direction.
(Appendix 10)
At least one of the plurality of second openings is formed at a higher position than the first opening, and at least another one of the plurality of second openings is formed at a higher position than the first opening. 1. The transport module according to Supplementary note 9, which is formed at a position lower than the opening of No. 1.
(Appendix 11)
The transport module according to appendix 10, wherein the plurality of second openings are formed on the same plane.
(Appendix 12)
Supplementary note 10, wherein the second side wall has a plurality of second openings formed at the same height so as to be arranged laterally along the surface of the second side wall. 12. The transport module according to 11.
(Appendix 13)
When viewed from a direction intersecting the surface of the second side wall, the surface of the first side wall in which the third opening is formed protrudes into the area of the second side wall. The transport module according to appendix 12.
(Appendix 14)
The transport module according to any one of Supplementary Notes 5 to 13, further comprising an aligner unit disposed within the housing.
(Additional note 15)
15. The transport module according to any one of Supplementary Notes 5 to 14, further comprising a storage unit disposed within the housing.
(Appendix 16)
16. The transport module according to any one of Supplementary Notes 5 to 15, further comprising a gas supply section configured to circulately supply an inert gas into the housing.
(Appendix 17)
A casing and
and a transport device disposed within the housing,
The casing is
a first sidewall having a first opening communicating with the loadlock module;
a second side wall disposed along a plane including the first side wall, the second side wall having at least one second opening connected to a load port; A transport module comprising:

G Gate valve W Substrate 1 Substrate processing system 10 Control unit 11 VTM
110 Transfer robot 111 Guide rail 12 PM
13 LLM
14 EFEM
140 Transfer robot 141 Guide rail 142 Alignment chamber 1420 Aligner unit 143 FFU
144 Opening 145 Storage unit 146 Opening 147 Side wall 148 Side wall 149 Housing 15 LP
150 Moving part 151 Guide rail 16 Container 160 Door 161 Opening part

Claims (17)

load lock module,
an atmospheric transport module having a first sidewall, a second sidewall and a third sidewall, the first sidewall extending along a first direction and connected to the load lock module; a second side wall extending along a second direction perpendicular to the first direction, and the third side wall being on an opposite side of the second side wall;
a first load port extending outward from the second sidewall along the first direction;
a second load port extending outward from the third side wall along the first direction;
A board transport system equipped with the first load port includes a first substrate carrier stage;
2. The substrate transport system of claim 1, wherein the second load port includes a second substrate carrier stage. further comprising a third load port extending outward along the first direction from the second side wall above the first load port,
the third load port includes a third substrate carrier stage;
The substrate transport system according to claim 2, wherein the first substrate carrier stage and the third substrate carrier stage are arranged at different positions in a plan view. further comprising a fourth load port extending outward along the first direction from the third side wall above the second load port,
the fourth load port includes a fourth substrate carrier stage;
The substrate transport system according to claim 3, wherein the second substrate carrier stage and the fourth substrate carrier stage are arranged at different positions in a plan view. A casing and
and a transport device disposed within the housing,
The casing is
a first sidewall having a first opening communicating with the loadlock module;
a second sidewall other than the sidewall opposite the first sidewall, the second sidewall being connected to a load port and having at least one second opening; , transport module. The transport module according to claim 5, wherein the at least one second opening has a plurality of second openings arranged along the lateral direction. The transport module according to claim 5 or 6, wherein the first opening is formed at a different height than the at least one second opening. When viewed from a direction intersecting a surface of the second side wall, a surface of the first side wall in which the first opening is formed protrudes into a region of the second side wall. The transport module according to claim 7. The transport module according to claim 5, wherein the at least one second opening has a plurality of second openings arranged along the longitudinal direction. At least one of the plurality of second openings is formed at a higher position than the first opening, and at least another one of the plurality of second openings is formed at a higher position than the first opening. The transport module according to claim 9, wherein the transport module is formed at a position lower than the first opening. The transport module according to claim 10, wherein the plurality of second openings are formed on the same plane. 10. The second side wall further includes a plurality of second openings formed at the same height so as to be arranged laterally along the surface of the second side wall. Or the conveyance module according to 11. When viewed from a direction intersecting a surface of the second side wall, a surface of the first side wall in which the first opening is formed protrudes into a region of the second side wall. The transport module according to claim 12. The transport module according to claim 5, further comprising an aligner unit disposed within the housing. The transport module according to claim 5, further comprising a storage unit disposed within the housing. The transport module according to claim 5, further comprising a gas supply section configured to circulately supply an inert gas into the housing. A casing and
and a transport device disposed within the housing,
The casing is
a first sidewall having a first opening communicating with the loadlock module;
a second side wall disposed along a plane including the first side wall, the second side wall having at least one second opening connected to a load port; A transport module comprising:

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