KR20220094708A - Film for packaging polymer cell - Google Patents
Film for packaging polymer cell Download PDFInfo
- Publication number
- KR20220094708A KR20220094708A KR1020200186198A KR20200186198A KR20220094708A KR 20220094708 A KR20220094708 A KR 20220094708A KR 1020200186198 A KR1020200186198 A KR 1020200186198A KR 20200186198 A KR20200186198 A KR 20200186198A KR 20220094708 A KR20220094708 A KR 20220094708A
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- modified
- layer
- film
- polypropylene
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 229920000642 polymer Polymers 0.000 title description 10
- 239000010410 layer Substances 0.000 claims abstract description 315
- 239000012790 adhesive layer Substances 0.000 claims abstract description 62
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 238000002844 melting Methods 0.000 claims abstract description 37
- 230000008018 melting Effects 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 18
- -1 polyethylene terephthalate Polymers 0.000 claims description 205
- 239000004743 Polypropylene Substances 0.000 claims description 147
- 229920001155 polypropylene Polymers 0.000 claims description 147
- 239000004698 Polyethylene Substances 0.000 claims description 61
- 229920000573 polyethylene Polymers 0.000 claims description 61
- 239000004677 Nylon Substances 0.000 claims description 56
- 229920001778 nylon Polymers 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 37
- 229910052782 aluminium Inorganic materials 0.000 claims description 36
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 36
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 34
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 34
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 25
- 239000005062 Polybutadiene Substances 0.000 claims description 20
- 229920002857 polybutadiene Polymers 0.000 claims description 20
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 20
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 18
- 239000002253 acid Substances 0.000 claims description 17
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 12
- 229920000098 polyolefin Polymers 0.000 claims description 11
- 239000012785 packaging film Substances 0.000 claims description 10
- 229920006280 packaging film Polymers 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 8
- 229920006284 nylon film Polymers 0.000 claims description 7
- 239000002356 single layer Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 229920006122 polyamide resin Polymers 0.000 claims description 6
- 239000005060 rubber Substances 0.000 claims description 6
- 229920002292 Nylon 6 Polymers 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229920000554 ionomer Polymers 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 claims description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical class O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 claims description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical class C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 2
- 239000000806 elastomer Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920002215 polytrimethylene terephthalate Polymers 0.000 claims description 2
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 claims 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 21
- 239000000126 substance Substances 0.000 abstract description 13
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 46
- 239000010408 film Substances 0.000 description 45
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 27
- 150000001875 compounds Chemical class 0.000 description 14
- 238000009820 dry lamination Methods 0.000 description 13
- 238000001125 extrusion Methods 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 239000003792 electrolyte Substances 0.000 description 12
- 239000007789 gas Substances 0.000 description 10
- 241000985630 Lota lota Species 0.000 description 8
- 230000035699 permeability Effects 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920013716 polyethylene resin Polymers 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- 230000006353 environmental stress Effects 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229920002302 Nylon 6,6 Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920005629 polypropylene homopolymer Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical group ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- FAIFRACTBXWXGY-JTTXIWGLSA-N COc1ccc2C[C@H]3N(C)CC[C@@]45[C@@H](Oc1c24)[C@@]1(OC)C=C[C@@]35C[C@@H]1[C@](C)(O)CCc1ccccc1 Chemical compound COc1ccc2C[C@H]3N(C)CC[C@@]45[C@@H](Oc1c24)[C@@]1(OC)C=C[C@@]35C[C@@H]1[C@](C)(O)CCc1ccccc1 FAIFRACTBXWXGY-JTTXIWGLSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- FAIIFDPAEUKBEP-UHFFFAOYSA-N Nilvadipine Chemical compound COC(=O)C1=C(C#N)NC(C)=C(C(=O)OC(C)C)C1C1=CC=CC([N+]([O-])=O)=C1 FAIIFDPAEUKBEP-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- TVTWQSMVKRRNKC-UHFFFAOYSA-N [N].[O].O=C=O Chemical compound [N].[O].O=C=O TVTWQSMVKRRNKC-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical class C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- OBAMWENTFIOOIT-UHFFFAOYSA-N butan-2-one;ethyl acetate Chemical compound CCC(C)=O.CCOC(C)=O OBAMWENTFIOOIT-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- VKLYZBPBDRELST-UHFFFAOYSA-N ethene;methyl 2-methylprop-2-enoate Chemical group C=C.COC(=O)C(C)=C VKLYZBPBDRELST-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000029052 metamorphosis Effects 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007773 negative electrode material Substances 0.000 description 1
- 150000007523 nucleic acids Chemical class 0.000 description 1
- 102000039446 nucleic acids Human genes 0.000 description 1
- 108020004707 nucleic acids Proteins 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
- 239000007774 positive electrode material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
- H01M50/126—Primary casings; Jackets or wrappings characterised by the material having a layered structure comprising three or more layers
- H01M50/129—Primary casings; Jackets or wrappings characterised by the material having a layered structure comprising three or more layers with two or more layers of only organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J113/00—Adhesives based on rubbers containing carboxyl groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
- H01M50/105—Pouches or flexible bags
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2300/00—Electrolytes
- H01M2300/0017—Non-aqueous electrolytes
- H01M2300/0065—Solid electrolytes
- H01M2300/0082—Organic polymers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
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Abstract
Description
본 발명은 폴리머 전지용 포장재료에 관한 것이다.The present invention relates to a packaging material for a polymer battery.
폴리머전지는 리튬2차전지로도 불려지며, 고분자 폴리머 전해질을 갖고, 리튬이온의 이동으로 전류를 발생하는 전지이다. A polymer battery, also called a lithium secondary battery, is a battery that has a polymer electrolyte and generates an electric current by the movement of lithium ions.
폴리머전지의 구성은 정극집전재료 /정극활성물질층/ 전해질층/ 부극활성물질층 /부극집전재료 및 이들을 포장하는 외장체로 이루어진다. 외장체를 형성하는 포장 재료로서 종래 금속을 프레스 가공하여 원통 형상 또는 직방체 형상 등으로 용기화한 금속제관이 이용되어 왔다. The polymer battery is composed of a positive electrode current collector material/positive electrode active material layer/electrolyte layer/negative electrode active material layer/negative electrode current collector material and an exterior body for packaging them. As a packaging material for forming an exterior body, a metal tube obtained by press-working metal to form a container in a cylindrical shape or a rectangular parallelepiped shape has been used.
이러한 금속제관은 용기 외벽이 단단하여 전지 자체의 형상이 한정되기 때문에 형상의 자유도가 떨어졌다. 이러한 이유로 최근에는 포장 재료로서 다층 필름이 이용되고 있다. Since the outer wall of the container is hard and the shape of the battery itself is limited in such a metal tube, the degree of freedom of shape is low. For this reason, in recent years, a multilayer film is used as a packaging material.
다층 필름의 경우에는 적어도 기재층, 알루미늄층, 및 열접착성 수지층으로 구성된다. 이러한 다층 필름은 프레스 가공 등을 이용하여 원하는 형상으로 가공하여 사용되어 왔다. 그러나, 다층 필름의 경우 내구성 면에서 취약하다는 지적이 있었다. 특히 리튬 이온 폴리머 전지의 경우, 축/방전시 발열로 인한 온도상승에 따른 내구성 저하와 탄산 프로필렌, 탄산 에틸렌, 탄산 디메틸, 탄산 디에틸, 또는 탄산 에틸 메틸 등의 비 프로톤성 용매와 같은 강 침투성 용매를 포함하는 고활성 전해질의 외부 유출에 따른 내구성 문제가 있었다. In the case of a multilayer film, it consists of a base material layer, an aluminum layer, and a heat-adhesive resin layer at least. Such a multilayer film has been used by processing it into a desired shape using press working or the like. However, it has been pointed out that the multilayer film is weak in terms of durability. In particular, in the case of lithium ion polymer batteries, durability decreases due to temperature rise due to heat generation during axial/discharge, and strongly permeable solvents such as aprotic solvents such as propylene carbonate, ethylene carbonate, dimethyl carbonate, diethyl carbonate, or ethyl methyl carbonate There was a durability problem due to external leakage of a highly active electrolyte containing
일본등록특허 4,559,547호에서는 가스 베리어성이 우수한 알루미늄층과 열접착수지층과의 접착력을 좋게 하기 위하여 산변성 폴리올레핀수지를 적용하고 있으나, 금속층과의 접착강도가 안정적이지 못하고, 접착강도가 균일하지 못하다는 문제점이 있었다. In Japanese Patent No. 4,559,547, acid-modified polyolefin resin is applied to improve adhesion between an aluminum layer with excellent gas barrier properties and a heat-adhesive resin layer, but the adhesive strength with the metal layer is not stable and the adhesive strength is not uniform. had a problem.
그러나 산변성폴리올레핀의 경우 용융 온도가 90°C 내지 110°C이다. 따라서 전지의 충/방전시 발생하는 고온(120°C이상)에 견디지 못하고 박리가 일어나 전해질이 외부로 유출되는 등의 내구성 면에서 문제가 있었다.However, in the case of acid-modified polyolefin, the melting temperature is 90°C to 110°C. Therefore, there was a problem in terms of durability such as exfoliation and leakage of electrolyte due to not being able to withstand the high temperature (120°C or more) generated during charging/discharging of the battery.
또한, 금속층과의 접착강도가 안정적이고 균일하지 못하다는 문제점이 있었다.In addition, there was a problem that the adhesive strength with the metal layer was not stable and uniform.
본 발명이 이루고자 하는 기술적 과제는 고온(120°C이상) 안정성, 강도, 접착 지속성(Al/열접착층), 가스 베리어(Gas barrier)성, 실링(sealing)성, 내핀홀성, 내화학응력성, 및 베리어성(High barrier)이 우수한 폴리머 전지 포장용 필름을 제공하는 것이다.The technical tasks to be achieved by the present invention are high temperature (over 120 °C) stability, strength, adhesion durability (Al/heat adhesive layer), gas barrier properties, sealing properties, pinhole resistance, chemical stress resistance, And to provide a film for polymer battery packaging excellent in barrier properties (High barrier).
본 발명은, 상기 과제를 해결하기 위한 수단으로서, The present invention, as a means for solving the above problems,
제1기재층; 상기 제1기재층 내측에 배치된 금속층; 상기 금속층 내측에 배치된 제2기재층; 및 상기 금속층 및 제2기재층 사이에 배치된 접착층을 포함하고,a first base layer; a metal layer disposed inside the first base layer; a second base layer disposed inside the metal layer; and an adhesive layer disposed between the metal layer and the second base layer,
상기 접착층은 산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무로 이루어진 군으로부터 선택된 하나 이상의 필수적 산변성 수지로 이루어지며 선택적으로 산변성 폴레올레핀 수지를 포함하는 전지 포장용 필름을 제공한다. The adhesive layer consists of at least one essential acid-modified resin selected from the group consisting of acid-modified butadiene rubber, acid-modified styrene-butadiene rubber, and optionally contains an acid-modified polyolefin resin It provides a film for battery packaging.
본 발명에 따르면, 산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무로 이루어진 군으로부터 선택된 하나 이상의 필수적 산변성 수지로 이루어지며 선택적으로 산변성 폴레올레핀 수지를 포함하는 접착층을 통해 고온(120°C이상) 안정성을 갖고, 높은 강도와 접착 지속성(Al/열접착층), 우수한 가스 베리어(Gas barrier)성, 실링(sealing)성, 내핀홀성, 내화학응력성, 및 베리어성(High barrier)을 갖는 전지 포장용 필름을 제공할 수 있다. According to the present invention, one or more essential acid-modified resins selected from the group consisting of acid-modified butadiene rubber, acid-modified styrene-butadiene rubber, and optionally acid-modified polyolefin resin High-temperature (over 120°C) stability through an adhesive layer containing It is possible to provide a film for battery packaging having high barrier properties and high barrier properties.
본 발명은 제1기재층; 상기 제1기재층 내측에 배치된 금속층; 상기 금속층 내측에 배치된 제2기재층; 및 상기 금속층 및 제2기재층 사이에 배치된 접착층을 포함하고,The present invention is a first base layer; a metal layer disposed inside the first base layer; a second base layer disposed inside the metal layer; and an adhesive layer disposed between the metal layer and the second base layer,
상기 접착층은 산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무로 이루어진 군으로부터 선택된 하나 이상의 필수적 산변성 수지로 이루어지며 선택적으로 산변성 폴레올레핀 수지를 포함하는 전지 포장용 필름에 관한 것이다.The adhesive layer consists of at least one essential acid-modified resin selected from the group consisting of acid-modified butadiene rubber, acid-modified styrene-butadiene rubber, and optionally contains an acid-modified polyolefin resin It relates to a film for battery packaging.
상기 접착층은 상술한 산변성 수지를 티-다이(T-Dies)압출 방식 또는 드라이 라미네이션(Dry lamination)방식으로 가공하여 내열성이 우수하고 내핀홀성이 양호하며 알루미늄과의 접착강도가 우수한 전지 포장용 필름을 제공할 수 있다. The adhesive layer is a film for battery packaging that has excellent heat resistance, good pinhole resistance, and excellent adhesive strength with aluminum by processing the above-described acid-modified resin by T-die extrusion method or dry lamination method. can provide
이하, 본 발명의 전지 포장용 필름을 구체적으로 설명하면 다음과 같다.Hereinafter, the battery packaging film of the present invention will be specifically described as follows.
본 발명에 있어서, 제1기재층은 폴리프로필렌과 같은 폴리올레핀 수지; 폴리에틸렌 테레프탈레이트, 폴리부틸렌 테레프탈레이트, 폴리트리메틸렌 테레프탈레이트 또는 폴리에틸렌 나프탈레이트와 같은 지방족-방향족 폴리에스테르 수지; 폴리카프로락탐(나이론6), 폴리헥사 메틸렌 아디페이트(나이론6.6), 나이론6와 나이론6.6의 공중합체, 폴리라우릴락탐(나이론12), 폴리헥사메틸렌 세바카미드(나이론6.10), 또는 폴리(메타-자이렌 아디프아미드)(MXD6) 등과 같은 폴리아미드 수지; 및 폴리카보네이트로 이루어진 군으로부터 선택된 어느 1종 이상을 포함할 수 있다.In the present invention, the first base layer is a polyolefin resin such as polypropylene; aliphatic-aromatic polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polytrimethylene terephthalate or polyethylene naphthalate; Polycaprolactam (Nylon 6), polyhexamethylene adipate (Nylon 6.6), a copolymer of nylon 6 and nylon 6.6, polylauryllactam (Nylon 12), polyhexamethylene sebacamide (Nylon 6.10), or poly ( polyamide resins such as meta-xylene adipamide) (MXD6) and the like; And it may include any one or more selected from the group consisting of polycarbonate.
상기 제1기재층은 요구되는 물성, 예를 들어 내핀홀성 및 절연성을 향상시키기 위하여, 적층화하는 것도 가능하다. 제1기재층을 적층화 할 경우, 제1기재층이 2층 이상의 수지층을 적어도 1개 포함하고, 각 층의 두께가 5㎛ 이상, 예를 들어 6 내지 50㎛, 10 내지 20㎛일 수 있다.The first base layer may be laminated to improve required physical properties, for example, pinhole resistance and insulation properties. When the first base layer is laminated, the first base layer includes at least one resin layer of two or more layers, and the thickness of each layer is 5 μm or more, for example, 6 to 50 μm, 10 to 20 μm. have.
일 구체예에서 제1기재층은 폴리에틸렌 텔레프탈레이트 필름, 나이론 필름 및 폴리프로필렌 필름으로 이루어진 그룹 중에서 선택된 필름이 단층 또는 다층으로 형성된다. 이 경우 외부의 표면마찰성, 내열성, 유연성, 내구성, 절곡성, 베리어(Barrier)성을 향상 시킬 수 있을 뿐만 아니라 기계적인 물성도 향상시킬 수 있다.In one embodiment, the first base layer is a polyethylene terephthalate film, a film selected from the group consisting of a nylon film and a polypropylene film is formed as a single layer or a multi-layer. In this case, it is possible to improve external surface friction, heat resistance, flexibility, durability, bendability, and barrier properties, as well as improve mechanical properties.
구체 예에서, 제1기재층은 상기 기재층 재료들을 이축연신시킨 필름을 사용할 수 있다. In an embodiment, the first base layer may use a film obtained by biaxially stretching the base layer materials.
본 발명에 있어서, 금속층은 가스 배리어성을 부여할 수 있다는 특별히 제한되지 않으며, 예를 들어 알루미늄 또는 구리 등을 적합하게 사용할 수 있다. 그 중에서도, 가격 및 접합 등의 가공성을 고려할 때, 알루미늄을 사용할 수 있다. In the present invention, the metal layer is not particularly limited that it can impart gas barrier properties, for example, aluminum or copper can be suitably used. Among them, aluminum can be used in consideration of cost and workability such as bonding.
일 구체예에서 베리어성, 내 핀홀(pin hole)성 및 가공성 면에서 우수한 금속이면 특별히 제안을 두는 것은 아니며, 일반적인 연질 알루미늄이나 철성분 함유량이 10wt%이하인 알루미늄을 사용할 수 있다. 이때, 철성분 함유량이 10wt%를 초과할 경우 가공성이 떨어질 수 있다. In one embodiment, if it is a metal excellent in barrier properties, pin hole resistance and workability, there is no particular suggestion, and general soft aluminum or aluminum having an iron content of 10 wt% or less may be used. In this case, when the iron content exceeds 10 wt%, workability may be deteriorated.
또한, 알루미늄층 경우 전해질과 수분에 의해 생성되는 불화수소로 인한 알루미늄 부식 문제를 방지하기 위하여 알루미늄층에 인산염 처리, 크롬산염 처리 지르코늄처리, 또는 티타늄처기리 중 하나를 선택하여 알루미늄에 처리할 경우 부식을 방지할 수 있다. In addition, in the case of the aluminum layer, in order to prevent the problem of aluminum corrosion caused by hydrogen fluoride generated by electrolyte and moisture, if the aluminum layer is treated with either phosphate treatment, chromate treatment, zirconium treatment, or titanium treatment, corrosion is performed. can prevent
더욱이 상기 알루미늄층과 열접착층의 접착강도를 더욱 높이기 위하여 유기티탄계, 이소시아네이트계, 폴리우레탄계, 아민계, 또는 폴리부타디엔계의 앵커코팅(Anchor coating)제를 사용하여 앵커코팅(Anchor coating)처리할 수 있다. Furthermore, in order to further increase the adhesive strength between the aluminum layer and the heat bonding layer, an anchor coating agent of an organic titanium-based, isocyanate-based, polyurethane-based, amine-based, or polybutadiene-based anchor coating agent is used. can
상기 금속층은 10㎛ 내지 120㎛의 두께가 바람직하며 금속층의 두께가 10㎛ 미만인 경우에는 핀홀이 발생할 소지가 있으며 120㎛를 초과할 경우 작업성이 떨어질 뿐만 아니라 재료비 원가 부담이 클 수가 있다.The metal layer preferably has a thickness of 10 μm to 120 μm, and when the thickness of the metal layer is less than 10 μm, pinholes may occur.
본 발명에 있어서, 접착층은 산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무로 이루어진 군으로부터 선택된 하나 이상의 필수적 산변성 수지로 이루어지며 선택적으로 산변성 폴레올레핀 수지를 포함할 수 있다. In the present invention, the adhesive layer is made of one or more essential acid-modified resins selected from the group consisting of acid-modified butadiene rubber, acid-modified styrene-butadiene rubber, and optionally acid-modified poly It may include an olefin resin.
또한, 본 발명에 있어서 산변성 폴리올레핀 수지는 용융 온도(Tm)가 65 내지 75인 것을 사용할 수 있고, 이러한 산변성 폴리올레핀 수지는 용융 온도(Tm)가 65 내지 75℃인 산변성 폴레올레핀 수지는 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌 또는 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리에틸렌을 포함한다.In addition, in the present invention, the acid-modified polyolefin resin has a melting temperature (Tm) of 65 to 75 may be used, and the acid-modified polyolefin resin has a melting temperature (Tm) of 65 to 75° C. The acid-modified polyolefin resin has a melting temperature (Tm) of 65 to 75° C., acid-modified polypropylene or melting temperature (Tm) contains acid-modified polyethylene of 65 to 75 °C.
또한 산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무는 예를 들어, 산변성 아크로니트릴- 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-에틸렌 고무, 산변성 Styrene- ethylene-butylene-styrene 고무, Styrene-isoprene-styrene 고무 등을 포함한다. In addition, acid-modified butadiene rubber, acid-modified styrene (Styrene)-butadiene rubber is, for example, acid-modified acrylonitrile-butadiene rubber, acid-modified styrene (Styrene)- These include ethylene rubber, acid-modified Styrene-ethylene-butylene-styrene rubber, and Styrene-isoprene-styrene rubber.
또한, 상기 산변성 수지의 극성 산성분 함유량은 예를 들어 0.01wt% 내지 15wt%, 또는 4wt% 내지 10wt%이다. 이러한 극성 산성분 함유량이 0.01wt% 미만일 경우 금속층과 제2기재층과의 접착강도가 약해질 수 있고, 15wt%를 초과할 경우 후가공성이 떨어질 수 있다. In addition, the content of the polar acid component of the acid-modified resin is, for example, 0.01wt% to 15wt%, or 4wt% to 10wt%. When the content of the polar acid component is less than 0.01wt%, the adhesive strength between the metal layer and the second base layer may be weakened, and if it exceeds 15wt%, post-processability may be deteriorated.
본 발명에서 산변성은 말레인산, 무수말레인산, 아크릴산, 메타크릴산, 시트라콘산, 무수시트라콘산, 이타콘산, 또는 무수이타콘산과 같은 불포화 카르본산 또는 그 무수물을 그라프트(그라프트) 공중합 반응을 통하여 도입할 수 있다. In the present invention, acid modification is a graft copolymerization reaction of an unsaturated carboxylic acid or anhydride thereof such as maleic acid, maleic anhydride, acrylic acid, methacrylic acid, citraconic acid, citraconic anhydride, itaconic acid, or itaconic anhydride. can be introduced through
다른 구체예에서 산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무, 산변성 폴레올레핀 수지는 용제 내에서 그라프트 변성하여 산변성시킨 것을 사용할 수 있다. 즉, 반응기 내에서 용제, 수지. 상기 카르본산 또는 그 무수물, 및 촉매를 혼합하고 적절한 압력과 온도하에서 산변기를 수지에 균일하게 그라프트하여 제조된 액상형태의 수지를 사용할 수 있다.In another embodiment, acid-modified butadiene rubber, acid-modified styrene-butadiene rubber, and acid-modified polyolefin resin may be graft-modified in a solvent and acid-modified. That is, the solvent, the resin in the reactor. A liquid resin prepared by mixing the carboxylic acid or its anhydride, and a catalyst and uniformly grafting an acid toilet to the resin under an appropriate pressure and temperature may be used.
이와 같이 용제 내에서 산변기를 그라프트시킬 경우, 기존 방식인 고상 폴리머를 단순히 열을 이용하여 폴리머를 용융 혼합(Melting Compounding)하면서 산변기를 그라프트시킨 것에 대비하여 산변기가 균일하게 그라프트 되기 때문에 동일한 조건에서 금속층과의 접착강도를 균일하고 안정적으로 높이는 효과가 있다. In this way, when the acid toilet is grafted in a solvent, the acid toilet is uniformly grafted in contrast to the conventional method in which the solid polymer is simply melted and mixed using heat (melting compounding). Therefore, there is an effect of uniformly and stably increasing the adhesive strength with the metal layer under the same conditions.
본 발명에서 반응기에서 사용되는 용제로는 에탄올, 메탄올, 시클로헥산, 노말핵산, 톨루엔, 밴젠, 순수, 디클로로에틸렌. 디클로로에탄, 메탄올, 사염화탄소, 아세톤, 오르토-디클로로벤젠, 초산메틸, 크실렌, 클로로벤젠, 클로로포름, 테트라클로로에탄, 테트라클로로에틸렌 및 트리클로로에틸렌으로 이루어진 군으로부터 선택된 어느 1종 이상을 들 수 있으며, 균일한 액상을 만드는 측면에서 톨루엔을 사용할 수 있다. Examples of the solvent used in the reactor in the present invention include ethanol, methanol, cyclohexane, normal nucleic acid, toluene, benzene, pure water, and dichloroethylene. any one or more selected from the group consisting of dichloroethane, methanol, carbon tetrachloride, acetone, ortho-dichlorobenzene, methyl acetate, xylene, chlorobenzene, chloroform, tetrachloroethane, tetrachloroethylene and trichloroethylene, and uniform Toluene can be used in terms of making a liquid phase.
특히 용제 내에서 산변성을 한 폴리올레핀은 65 내지 75℃의 용융 온도(Tm)를 갖는 점에서 용융 혼합하여 산변성을 한 산변성 폴리올레핀, 또는 그라프트 공중합으로 산성기를 도입한 산변성 폴리올레핀과 구별된다.In particular, the acid-modified polyolefin in a solvent has a melting temperature (Tm) of 65 to 75° C., so it is distinguished from acid-modified polyolefin that has been acid-modified by melt mixing, or acid-modified polyolefin introduced with an acid group by graft copolymerization. .
구체 예에서 산변성 수지는 필요에 따라 다른 수지와 혼합하여 사용할 수 있다. 상기 산변성 수지와 혼합하여 사용할 수 있는 수지는 폴리프로필렌 또는 폴리에틸렌과 같은 폴리올레핀; 프로필렌-아크릴산 에스테르 공중합체와 같은 α-올레핀-아크릴산 에스테르 공중합체; 프로필렌-메타크릴산 에스테르 공중합체와 같은 α-올레핀-메타크릴산 에스테르 공중합체; 에틸렌 비닐 아세테이트 공중합체 또는 에틸렌 부틸 아세테이트 공중합체(EBA)와 같은 아세테이트 공중합체; 에틸렌 부틸 고무(EBR), 에틸렌 아크릴산 공중합체(EAA), 또는 에틸렌 메타크릴산 공중합체(EMAA)와 같은 일라스토머; 또는 아연 이오노머 또는 나트륨 이오노머와 같은 이오노머 등이 있으나, 이에 제한되지 않는다. In an embodiment, the acid-modified resin may be mixed with other resins as needed. Resins that can be mixed with the acid-modified resin include polyolefins such as polypropylene or polyethylene; α-olefin-acrylic acid ester copolymers such as propylene-acrylic acid ester copolymers; ?-olefin-methacrylic acid ester copolymers such as propylene-methacrylic acid ester copolymers; acetate copolymers such as ethylene vinyl acetate copolymer or ethylene butyl acetate copolymer (EBA); elastomers such as ethylene butyl rubber (EBR), ethylene acrylic acid copolymer (EAA), or ethylene methacrylic acid copolymer (EMAA); or an ionomer such as a zinc ionomer or a sodium ionomer, but is not limited thereto.
본 발명에 있어서, 제2기재층은 상술한 제1기재층과 동일한 수지를 제한 없이 사용할 수 있다. 예를 들어 폴리프로필렌 수지 또는 폴리에틸렌 수지와 같은 폴리올레핀 수지; 폴리에틸렌 테레프탈레이트, 또는 폴리에틸렌 나프탈레이트 등의 폴리에스테르 수지; 및 지방족 폴리아미드, 또는 방향족 폴리아미드 등의 폴리아미드 수지로 이루어진 그룹 중에서 선택된 하나 이상의 수지를 포함할 수 있다. 또한 제1기재와 유사하게 필요에 따라 하나 이상의 필름을 적층하여 사용할 수 있다.In the present invention, the second base layer may use the same resin as the above-described first base layer without limitation. polyolefin resins such as, for example, polypropylene resins or polyethylene resins; polyester resins such as polyethylene terephthalate and polyethylene naphthalate; and at least one resin selected from the group consisting of polyamide resins such as aliphatic polyamide or aromatic polyamide. In addition, similar to the first substrate, one or more films may be laminated and used as needed.
본 발명에 있어서, 제1기재층/금속층/접착층/제2기재층의 다층 구조 중 접착층/제2기재층 구조를 예를 들면 하기 1) 내지 15)와 같다. In the present invention, the adhesive layer/second base layer structure among the multilayer structure of the first base layer/metal layer/adhesive layer/second base layer is, for example, as follows 1) to 15).
1) 산변성 나이론층 / 폴리에틸렌층One) Acid-modified nylon layer / polyethylene layer
2) 산변성 나이론층 / 폴리프로필렌층 2) Acid-modified nylon layer / polypropylene layer
3) 산변성 나이론층 / 폴리에틸렌과 폴리프로필렌 혼합층3) Acid-modified nylon layer / Polyethylene and polypropylene mixed layer
4) 산변성 PBT층 / 폴리에틸렌층4) Acid-modified PBT layer / polyethylene layer
5) 산변성 PBT층 / 폴리프로필렌층5) Acid-modified PBT layer / polypropylene layer
6) 산변성 PBT층 / 폴리에틸렌과 폴리프로필렌 혼합층6) Acid-modified PBT layer / Polyethylene and polypropylene mixed layer
7) 산변성 PET층 / 폴리에틸렌층7) Acid-modified PET layer / Polyethylene layer
8) 산변성 PET층 / 폴리프로필렌층8) Acid-modified PET layer / polypropylene layer
9) 산변성 PET층 / 폴리에틸렌과 폴리프로필렌 혼합층9) Acid-modified PET layer / Polyethylene and polypropylene mixed layer
10) 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌층 / 폴리프로필렌층10) Acid-modified polypropylene layer / polypropylene layer having a melting temperature (Tm) of 65 to 75°C
11) 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌층 / 폴리에틸렌층11) Acid-modified polypropylene layer / polyethylene layer having a melting temperature (Tm) of 65 to 75°C
12) 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌층 / 폴리에틸렌과 폴리프로필렌 혼합층12) Acid-modified polypropylene layer having a melting temperature (Tm) of 65 to 75°C / Polyethylene and polypropylene mixed layer
13) 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리에틸렌층 / 폴리프로필렌층13) Acid-modified polyethylene layer / polypropylene layer having a melting temperature (Tm) of 65 to 75°C
14) 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리에틸렌층 / 폴리에틸렌층14) Acid-modified polyethylene layer / polyethylene layer having a melting temperature (Tm) of 65 to 75°C
15) 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리에틸렌층 / 폴리에틸렌과 폴리프로필렌 혼합층15) Acid-modified polyethylene layer having a melting temperature (Tm) of 65 to 75°C / Polyethylene and polypropylene mixed layer
본 발명에 있어서, 상기 접착층과 제2기재 사이에 접착강화층을 추가로 포함하여 전해질 용액의 베리어성을 높이고 내핀홀성을 개선시킬 수 있다.In the present invention, it is possible to increase the barrier properties of the electrolyte solution and improve the pinhole resistance by additionally including an adhesion reinforcing layer between the adhesive layer and the second substrate.
본 발명에서 접착강화층은 예를 들어 산변성 폴리 올레핀 수지를 사용할 수 있다. 구체 예에서 산변성 폴리프로필렌 또는 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌을 사용하는 경우 내열성을 높일 수 있다.In the present invention, the adhesion reinforcing layer may be, for example, an acid-modified polyolefin resin. In an embodiment, when acid-modified polypropylene or acid-modified polypropylene having a melting temperature (Tm) of 65 to 75° C. is used, heat resistance may be improved.
본 발명에 있어서, 접착층/접착강화층/제2기제층의 다층 구조를 예를 들면 하기 16) 내지 27)에 나타낸 바와 같다. In the present invention, the multilayer structure of the adhesive layer/adhesion reinforcing layer/second base layer is as shown in 16) to 27) below, for example.
1) 산변성 나이론층/ 산변성 PP층 / 폴리에틸렌층One) Acid-modified nylon layer/ Acid-modified PP layer/ Polyethylene layer
2) 산변성 나이론층/ 산변성 PP층 / 폴리프로필렌층2) Acid-modified nylon layer / Acid-modified PP layer / Polypropylene layer
3) 산변성 나이론층/ 산변성 PP층 /폴리에틸렌과 폴리프로필렌 혼합층3) Acid-modified nylon layer / Acid-modified PP layer / Polyethylene and polypropylene mixed layer
4) 산변성 PBT층/ 산변성 PP층 / 폴리에틸렌층4) Acid-modified PBT layer / Acid-modified PP layer / Polyethylene layer
5) 산변성 PBT층/ 산변성 PP층 / 폴리프로필렌층 5) Acid-modified PBT layer / Acid-modified PP layer / Polypropylene layer
6) 산변성 PBT층/ 산변성 PP층 / 폴리에틸렌과 폴리프로필렌 혼합층6) Acid-modified PBT layer / Acid-modified PP layer / Polyethylene and polypropylene mixed layer
7) 산변성 PET층/ 산변성 PP층 / 폴리에틸렌층7) Acid-modified PET layer/ Acid-modified PP layer/ Polyethylene layer
8) 산변성 PET층/ 산변성 PP층 / 폴리프로필렌층8) Acid-modified PET layer / Acid-modified PP layer / Polypropylene layer
9) 산변성 PET층/ 산변성 PP층 / 폴리에틸렌과 폴리프로필렌 혼합층9) Acid-modified PET layer/ Acid-modified PP layer/ Polyethylene and polypropylene mixed layer
10) 용융 온도(Tm)가 65 내지 75℃인 산변성 PP / 산변성 PP층 / 폴리에틸렌층10) Acid-modified PP / acid-modified PP layer / polyethylene layer having a melting temperature (Tm) of 65 to 75 °C
11) 용융 온도(Tm)가 65 내지 75℃인 산변성 PP / 산변성 PP층 / 폴리프로필렌층11) Acid-modified PP / acid-modified PP layer / polypropylene layer having a melting temperature (Tm) of 65 to 75 °C
12) 용융 온도(Tm)가 65 내지 75℃인 산변성 PP/ 산변성 PP층 / 폴리에틸렌과 폴리프로필렌 혼합층12) Acid-modified PP/acid-modified PP layer with a melting temperature (Tm) of 65 to 75°C/polyethylene and polypropylene mixed layer
13) 산변성 Butadiene 고무/ 폴리에틸렌과 폴리프로필렌 혼합층13) Acid-modified Butadiene rubber/ Polyethylene and polypropylene mixed layer
14) 산변성 Styrene-Butadiene 고무/ 폴리에틸렌과 폴리프로필렌 혼합층14) Acid-modified Styrene-Butadiene Rubber/ Polyethylene and Polypropylene Mixed Layer
15) 산변성 Butadiene 고무/ 산변성 PP층 /폴리에틸렌과 폴리프로필렌 혼합층15) Acid-modified Butadiene rubber / Acid-modified PP layer / Polyethylene and polypropylene mixed layer
31)산변성 Styrene-Butadiene 고무 / 산변성 PP층 /폴리에틸렌과 폴리프로필렌 혼합층31) Acid-modified Styrene-Butadiene rubber / Acid-modified PP layer / Polyethylene and polypropylene mixed layer
일 구체예에서, 본 발명의 전지 포장용 필름은,In one embodiment, the battery packaging film of the present invention,
폴리에틸렌 텔레프탈레이트 필름, 나이론 필름 및 폴리프로필렌 필름으로 이루어진 그룹 중에서 선택된 필름이 단층 또는 다층으로 형성된 제1기재층; a first base layer in which a film selected from the group consisting of a polyethylene terephthalate film, a nylon film, and a polypropylene film is formed in a single layer or in multiple layers;
상기 제1기재층 내측에 배치된 알루미늄층;an aluminum layer disposed inside the first base layer;
상기 금속층 내측에 배치되고, 폴리프로필렌, 또는 폴리에틸렌과 폴리프로필렌의 혼합물을 포함하는 제2기재층; 및 a second base layer disposed inside the metal layer and including polypropylene or a mixture of polyethylene and polypropylene; and
상기 알루미늄층 및 제2기재층 사이에 배치되고, 산변성 폴리에틸렌 테레프탈레이트, 산변성 폴리부틸렌테레프탈레이트, 및 산변성 나일론으로 이루어진 그룹 중에서 선택된 하나 이상의 산변성 수지를 포함하는 접착층을 포함한다.and an adhesive layer disposed between the aluminum layer and the second base layer and including at least one acid-modified resin selected from the group consisting of acid-modified polyethylene terephthalate, acid-modified polybutylene terephthalate, and acid-modified nylon.
다른 구체예에서, 본 발명의 전지 포장용 필름은, In another embodiment, the battery packaging film of the present invention,
폴리에틸렌 텔레프탈레이트 필름, 나이론 필름 및 폴리프로필렌 필름으로 이루어진 그룹 중에서 선택된 필름이 단층 또는 다층으로 형성된 제1기재층; a first base layer in which a film selected from the group consisting of a polyethylene terephthalate film, a nylon film, and a polypropylene film is formed in a single layer or in multiple layers;
상기 제1기재층 내측에 배치된 알루미늄층;an aluminum layer disposed inside the first base layer;
상기 금속층 내측에 배치되고, 폴리프로필렌, 또는 폴리에틸렌과 폴리프로필렌의 혼합물을 포함하는 제2기재층; 및 a second base layer disposed inside the metal layer and including polypropylene or a mixture of polyethylene and polypropylene; and
상기 알루미늄층 및 제2기재층 사이에 배치되고, 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리에틸렌 및 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌으로 이루어진 그룹 중에서 선택된 하나 이상의 산변성 수지를 포함하는 접착층을 포함한다.At least one selected from the group consisting of acid-modified polyethylene having a melting temperature (Tm) of 65 to 75°C and acid-modified polypropylene having a melting temperature (Tm) of 65 to 75°C, disposed between the aluminum layer and the second base layer and an adhesive layer comprising an acid-modified resin.
여기에서, 본 발명의 금속층과 접착층의 적층은 몇 가지 방법을 사용할 수 있다. 첫째 방법은 히팅(heating)된 롤(roll)을 이용하여 금속층과 접착층에 압력을 주어 열융착하는 방법이다. 두 번째로는 티-다이(T-Dies)압출기로 접착층 수지를 압출하면서 금속층과 열융착시키는 방법이다. 그 외 금속층과 접착층 필름을 드라이 라미네이션법을 통해서도 적층시킬 수 있다. Here, several methods may be used for lamination of the metal layer and the adhesive layer of the present invention. The first method is a method of heat-sealing by applying pressure to the metal layer and the adhesive layer using a heated roll. The second method is to heat-seal the metal layer while extruding the adhesive layer resin with a T-die extruder. In addition, the metal layer and the adhesive layer film may be laminated through a dry lamination method.
그리고 제1기재층을 금속층과 접합하는 방식은 일액형 또는 이액형으로 드라이 라미네이션 방법을 사용 할 수 있으나, 이에 제한되지 않는다. In addition, the method of bonding the first base layer to the metal layer may be a one-component or two-component dry lamination method, but is not limited thereto.
본 발명의 드라이 라미네이션에 사용되는 접착제로는 경화형태의 폴리우레탄계, 폴리실콘계, 용제 내에서 산변성 그라프트시킨 산변성 폴리프로필렌, 또는 용제 내에서 산변성 그라프트시킨 산변성 폴리올레핀 또는 폴리 아크릴계의 접착제를 사용할 수 있다. The adhesive used in the dry lamination of the present invention is a cured polyurethane-based, polysilicon-based, acid-modified polypropylene, acid-modified polypropylene, or acid-modified polyolefin or polyacrylic-based adhesive grafted in a solvent. Adhesives may be used.
이하, 본 발명에 따른 실시예 및 본 발명에 따르지 않는 비교예를 통하여 본 발명을 보다 상세히 설명하나, 본 발명의 범위가 하기 제시된 실시예에 의해 제한되는 것은 아니다.Hereinafter, the present invention will be described in more detail through Examples according to the present invention and Comparative Examples not according to the present invention, but the scope of the present invention is not limited by the Examples presented below.
[실시예 1 내지 3, 비교예 1 내지 3][Examples 1 to 3, Comparative Examples 1 to 3]
실시예 1 내지 3와 비교예 1 내지 3는 하기 표 1에 나타낸 각 층의 성분을 3-레이어(layer) 공압출 방식 또는 티-다이 다층공압출 방식으로 접착시켜 필름을 제조하였다. In Examples 1 to 3 and Comparative Examples 1 to 3, films were prepared by bonding the components of each layer shown in Table 1 below in a 3-layer co-extrusion method or a T-die multi-layer co-extrusion method.
이때, 제1기재층은 이축연신 나이론으로 나이론6.6을 두께 15㎛로 사용하였고, 금속층은 철성분 함유량 1%인 알루미늄 40㎛, 접착층은 20㎛의 두께로, 제2기재층은 티-다이 캐스트로 가공한 폴리프로필렌을 40㎛ 두께로 적층하여 필름을 제조하였다.At this time, the first base layer was biaxially oriented nylon, and nylon 6.6 was used to a thickness of 15 μm, the metal layer had an iron content of 1% aluminum 40 μm, the adhesive layer had a thickness of 20 μm, and the second base layer was T-die cast. A film was prepared by laminating the processed polypropylene to a thickness of 40 μm.
본 발명에 있어서, 상기 접착층과 제2기재 사이에 접착강화층을 추가로 포함하여 전해질 용액의 베리어성을 높이고 내핀홀성을 개선시킬 수 있다.In the present invention, it is possible to increase the barrier properties of the electrolyte solution and improve the pinhole resistance by additionally including an adhesion reinforcing layer between the adhesive layer and the second substrate.
본 발명에서 접착강화층은 예를 들어 산변성 폴리 올레핀 수지를 사용할 수 있다. 구체 예에서 산변성 폴리프로필렌 또는 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌을 사용하는 경우 내열성을 높일 수 있다.In the present invention, the adhesion reinforcing layer may be, for example, an acid-modified polyolefin resin. In an embodiment, when acid-modified polypropylene or acid-modified polypropylene having a melting temperature (Tm) of 65 to 75° C. is used, heat resistance may be improved.
본 발명에 있어서, 접착층/접착강화층/제2기제층의 다층 구조를 예를 들면 하기 16) 내지 27)에 나타낸 바와 같다. In the present invention, the multilayer structure of the adhesive layer/adhesion reinforcing layer/second base layer is as shown in 16) to 27) below, for example.
1) 산변성 나이론층/ 산변성 PP층 / 폴리에틸렌층One) Acid-modified nylon layer/ Acid-modified PP layer/ Polyethylene layer
2) 산변성 나이론층/ 산변성 PP층 / 폴리프로필렌층2) Acid-modified nylon layer / Acid-modified PP layer / Polypropylene layer
3) 산변성 나이론층/ 산변성 PP층 /폴리에틸렌과 폴리프로필렌 혼합층3) Acid-modified nylon layer / Acid-modified PP layer / Polyethylene and polypropylene mixed layer
4) 산변성 PBT층/ 산변성 PP층 / 폴리에틸렌층4) Acid-modified PBT layer / Acid-modified PP layer / Polyethylene layer
5) 산변성 PBT층/ 산변성 PP층 / 폴리프로필렌층 5) Acid-modified PBT layer / Acid-modified PP layer / Polypropylene layer
6) 산변성 PBT층/ 산변성 PP층 / 폴리에틸렌과 폴리프로필렌 혼합층6) Acid-modified PBT layer / Acid-modified PP layer / Polyethylene and polypropylene mixed layer
7) 산변성 PET층/ 산변성 PP층 / 폴리에틸렌층7) Acid-modified PET layer/ Acid-modified PP layer/ Polyethylene layer
8) 산변성 PET층/ 산변성 PP층 / 폴리프로필렌층8) Acid-modified PET layer / Acid-modified PP layer / Polypropylene layer
9) 산변성 PET층/ 산변성 PP층 / 폴리에틸렌과 폴리프로필렌 혼합층9) Acid-modified PET layer/ Acid-modified PP layer/ Polyethylene and polypropylene mixed layer
10) 용융 온도(Tm)가 65 내지 75℃인 산변성 PP / 산변성 PP층 / 폴리에틸렌층10) Acid-modified PP / acid-modified PP layer / polyethylene layer having a melting temperature (Tm) of 65 to 75 °C
11) 용융 온도(Tm)가 65 내지 75℃인 산변성 PP / 산변성 PP층 / 폴리프로필렌층11) Acid-modified PP / acid-modified PP layer / polypropylene layer having a melting temperature (Tm) of 65 to 75 °C
12) 용융 온도(Tm)가 65 내지 75℃인 산변성 PP/ 산변성 PP층 / 폴리에틸렌과 폴리프로필렌 혼합층12) Acid-modified PP/acid-modified PP layer with a melting temperature (Tm) of 65 to 75°C/polyethylene and polypropylene mixed layer
13) 산변성 Butadiene 고무/ 폴리에틸렌과 폴리프로필렌 혼합층13) Acid-modified Butadiene rubber/ Polyethylene and polypropylene mixed layer
14) 산변성 Styrene-Butadiene 고무/ 폴리에틸렌과 폴리프로필렌 혼합층14) Acid-modified Styrene-Butadiene Rubber/ Polyethylene and Polypropylene Mixed Layer
15) 산변성 Butadiene 고무/ 산변성 PP층 /폴리에틸렌과 폴리프로필렌 혼합층15) Acid-modified Butadiene rubber / Acid-modified PP layer / Polyethylene and polypropylene mixed layer
31)산변성 Styrene-Butadiene 고무 / 산변성 PP층 /폴리에틸렌과 폴리프로필렌 혼합층31) Acid-modified Styrene-Butadiene rubber / Acid-modified PP layer / Polyethylene and polypropylene mixed layer
일 구체예에서, 본 발명의 전지 포장용 필름은,In one embodiment, the battery packaging film of the present invention,
폴리에틸렌 텔레프탈레이트 필름, 나이론 필름 및 폴리프로필렌 필름으로 이루어진 그룹 중에서 선택된 필름이 단층 또는 다층으로 형성된 제1기재층; a first base layer in which a film selected from the group consisting of a polyethylene terephthalate film, a nylon film, and a polypropylene film is formed in a single layer or in multiple layers;
상기 제1기재층 내측에 배치된 알루미늄층;an aluminum layer disposed inside the first base layer;
상기 금속층 내측에 배치되고, 폴리프로필렌, 또는 폴리에틸렌과 폴리프로필렌의 혼합물을 포함하는 제2기재층; 및 a second base layer disposed inside the metal layer and including polypropylene or a mixture of polyethylene and polypropylene; and
상기 알루미늄층 및 제2기재층 사이에 배치되고, 산변성 폴리에틸렌 테레프탈레이트, 산변성 폴리부틸렌테레프탈레이트, 및 산변성 나일론으로 이루어진 그룹 중에서 선택된 하나 이상의 산변성 수지를 포함하는 접착층을 포함한다.and an adhesive layer disposed between the aluminum layer and the second base layer and including at least one acid-modified resin selected from the group consisting of acid-modified polyethylene terephthalate, acid-modified polybutylene terephthalate, and acid-modified nylon.
다른 구체예에서, 본 발명의 전지 포장용 필름은, In another embodiment, the battery packaging film of the present invention,
폴리에틸렌 텔레프탈레이트 필름, 나이론 필름 및 폴리프로필렌 필름으로 이루어진 그룹 중에서 선택된 필름이 단층 또는 다층으로 형성된 제1기재층; a first base layer in which a film selected from the group consisting of a polyethylene terephthalate film, a nylon film, and a polypropylene film is formed in a single layer or in multiple layers;
상기 제1기재층 내측에 배치된 알루미늄층;an aluminum layer disposed inside the first base layer;
상기 금속층 내측에 배치되고, 폴리프로필렌, 또는 폴리에틸렌과 폴리프로필렌의 혼합물을 포함하는 제2기재층; 및 a second base layer disposed inside the metal layer and including polypropylene or a mixture of polyethylene and polypropylene; and
상기 알루미늄층 및 제2기재층 사이에 배치되고, 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리에틸렌 및 용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌으로 이루어진 그룹 중에서 선택된 하나 이상의 산변성 수지를 포함하는 접착층을 포함한다.At least one selected from the group consisting of acid-modified polyethylene having a melting temperature (Tm) of 65 to 75°C and acid-modified polypropylene having a melting temperature (Tm) of 65 to 75°C, disposed between the aluminum layer and the second base layer and an adhesive layer comprising an acid-modified resin.
여기에서, 본 발명의 금속층과 접착층의 적층은 몇 가지 방법을 사용할 수 있다. 첫째 방법은 히팅(heating)된 롤(roll)을 이용하여 금속층과 접착층에 압력을 주어 열융착하는 방법이다. 두 번째로는 티-다이(T-Dies)압출기로 접착층 수지를 압출하면서 금속층과 열융착시키는 방법이다. 그 외 금속층과 접착층 필름을 드라이 라미네이션법을 통해서도 적층시킬 수 있다. Here, several methods may be used for lamination of the metal layer and the adhesive layer of the present invention. The first method is a method of heat-sealing by applying pressure to the metal layer and the adhesive layer using a heated roll. The second method is to heat-seal the metal layer while extruding the adhesive layer resin with a T-die extruder. In addition, the metal layer and the adhesive layer film may be laminated through a dry lamination method.
그리고 제1기재층을 금속층과 접합하는 방식은 일액형 또는 이액형으로 드라이 라미네이션 방법을 사용 할 수 있으나, 이에 제한되지 않는다. In addition, the method of bonding the first base layer to the metal layer may be a one-component or two-component dry lamination method, but is not limited thereto.
본 발명의 드라이 라미네이션에 사용되는 접착제로는 경화형태의 폴리우레탄계, 폴리실콘계, 용제 내에서 산변성 그라프트시킨 산변성 폴리프로필렌, 또는 용제 내에서 산변성 그라프트시킨 산변성 폴리올레핀 또는 폴리 아크릴계의 접착제를 사용할 수 있다. The adhesive used in the dry lamination of the present invention is a cured polyurethane-based, polysilicon-based, acid-modified polypropylene, acid-modified polypropylene, or acid-modified polyolefin or polyacrylic-based adhesive grafted in a solvent. Adhesives may be used.
이하, 본 발명에 따른 실시예 및 본 발명에 따르지 않는 비교예를 통하여 본 발명을 보다 상세히 설명하나, 본 발명의 범위가 하기 제시된 실시예에 의해 제한되는 것은 아니다.Hereinafter, the present invention will be described in more detail through Examples according to the present invention and Comparative Examples not according to the present invention, but the scope of the present invention is not limited by the Examples presented below.
[실시예 1 내지 3, 비교예 1 내지 3][Examples 1 to 3, Comparative Examples 1 to 3]
실시예 1 내지 3와 비교예 1 내지 3는 하기 표 1에 나타낸 각 층의 성분을 3-레이어(layer) 공압출 방식 또는 티-다이 다층공압출 방식으로 접착시켜 필름을 제조하였다. In Examples 1 to 3 and Comparative Examples 1 to 3, films were prepared by bonding the components of each layer shown in Table 1 below in a 3-layer co-extrusion method or a T-die multi-layer co-extrusion method.
이때, 제1기재층은 이축연신 나이론으로 나이론6.6을 두께 15㎛로 사용하였고, 금속층은 철성분 함유량 1%인 알루미늄 40㎛, 접착층은 20㎛의 두께로, 제2기재층은 티-다이 캐스트로 가공한 폴리프로필렌을 40㎛ 두께로 적층하여 필름을 제조하였다.At this time, the first base layer was biaxially oriented nylon, and nylon 6.6 was used to a thickness of 15 μm, the metal layer had an iron content of 1% aluminum 40 μm, the adhesive layer had a thickness of 20 μm, and the second base layer was T-die cast. A film was prepared by laminating the processed polypropylene to a thickness of 40 μm.
용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌 : 30%Acid-modified Styrene-Butadiene rubber: 70%
Acid-modified polypropylene having a melting temperature (Tm) of 65 to 75°C: 30%
acid-modified polyethylene
A product obtained by grafting 5% maleic anhydride to a linear low-density polyepylene (product name: Lotte Chemical UF315) using a twin compound device.
Styrene-Butadiene 고무acid metamorphosis
Styrene-Butadiene Rubber
- 내 핀홀성 -- My Pinhole -
상온(23℃)에서 100회 스트레스(접었다 폈다를 반복)를 가한 후, 내핀홀성(코팅된 면적 1m2당 핀홀의 수)을 측정하고 표 2에 나타내었다.After applying stress (folding and unfolding) 100 times at room temperature (23°C), pinhole resistance (number of pinholes per 1m2 of coated area) was measured and shown in Table 2.
- 박리온도 -- Peeling Temperature -
노화 오븐(Aging Oven)기를 통해 온도를 5℃ 간격으로 승온하면서, 금속층과 제2기재층간의 박리온도를 측정하고, 그 결과를 표 2에 나타내었다.The peeling temperature between the metal layer and the second base layer was measured while the temperature was raised at 5° C. intervals through an aging oven, and the results are shown in Table 2.
상기 표 2에 나타낸 바와 같이 산변성 나이론과 산변성 PBT수지 및 산변성 PET,산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무로 알루미늄과 열접착한 실시예 1 내지 3, 12,13,14에서는 핀홀이 전혀 나타나지 않은 반면, 산변성 에틸렌, 산변성 폴리에틸렌, 산변성 폴리프로필렌을 사용한 비교예 1 내지 3에서는 각각 100개, 10개, 15개의 핀홀이 발견된 것으로 보아 내핀홀성이 크게 떨어짐을 알 수 있었다.As shown in Table 2, acid-modified nylon, acid-modified PBT resin, acid-modified PET, acid-modified butadiene rubber, and acid-modified styrene-butadiene rubber were heat-bonded with aluminum. In Examples 1 to 3, 12, 13, and 14, pinholes did not appear at all, whereas in Comparative Examples 1 to 3 using acid-modified ethylene, acid-modified polyethylene, and acid-modified polypropylene, 100, 10, and 15 pinholes were It was found that the pinhole resistance was significantly reduced.
또한, 박리온도에서는 실시예 1 내지 3, 12, 13, 14의 박리온도가 180℃이상을 유지하는 반면 비교예 1 내지 3에서는 150℃이상이 되면 모두 박리가 일어남을 알 수 있었다.In addition, in the peeling temperature, the peeling temperatures of Examples 1 to 3, 12, 13, and 14 were maintained at 180°C or higher, whereas in Comparative Examples 1 to 3, the peeling occurred when the peeling temperature was 150°C or higher.
-유기용제의 베리어(barrier)성 측정(투습도)--Measurement of barrier properties of organic solvents (water vapor permeability)-
금속층이 포함이 안된 제2기재층을 ASTM E96 CaCl2법에 의하여 유기용제의 베리어성(투습도)를 측정하고 그 결과를 표 3에 나타내었다. The barrier properties (moisture permeability) of the organic solvent were measured for the second base layer not including the metal layer by the ASTM E96 CaCl 2 method, and the results are shown in Table 3.
(MEK)methyl ethyl ketone
(MEK)
상기 표 3에 나타낸 바와 같이 실시예 1 내지 3의 유기용제 베리어성이 비교예 1 내지 3, 12, 13,14에 비하여, 매우 우수한 유기용제 베리어성(투수성)을 나타냄을 알 수 있었다.As shown in Table 3, it was found that the organic solvent barrier properties of Examples 1 to 3 exhibited very excellent organic solvent barrier properties (permeability) compared to Comparative Examples 1 to 3, 12, 13, and 14.
- 금속층/접착층의 접착강도 -- Adhesive strength of metal layer/adhesive layer -
알루미늄층을 축에 고정시키고, 열접착층 필름을 분당 50mm 속도로 잡아 당겨 접착강도(N/15mm)를 측정하고 그 결과를 하기 표 4에 나타내었다.The aluminum layer was fixed to the shaft, and the adhesive strength (N/15 mm) was measured by pulling the heat-adhesive layer film at a speed of 50 mm per minute, and the results are shown in Table 4 below.
-성형성(Deep drawing)--Deep drawing-
시편 : 가로 * 세로 = 140mm * 170mm를 채취후 Specimen: After taking horizontal * vertical = 140mm * 170mm
Pressure/Time = 0.382MPA/5sec로 가압하여 늘어난 깊이를 측정하였다. Pressure/Time = 0.382MPA/5sec to measure the increased depth.
(N/15mm)Adhesive strength of aluminum/heat adhesive layer
(N/15mm)
(deep drawing)formability
(deep drawing)
상기 표 4에 나타낸 바와 같이 실시예 1 내지 3, 12, 13,14이 비교예 1 내지 3 대비 최소 50% 이상의 접착강도를 갖는 것으로 나타났으며, 폴리에틸렌수지를 사용한 비교예 1의 경우, 금속층과의 접착강도가 현저하게 떨어짐을 확인할 수 있다.As shown in Table 4, Examples 1 to 3, 12, 13, and 14 were found to have an adhesive strength of at least 50% or more compared to Comparative Examples 1 to 3, and in Comparative Example 1 using a polyethylene resin, the metal layer and It can be seen that the adhesive strength of
성형성 또한 실시예 1 내지 3, 12, 13, 14이 비교예 1 내지 3 대비 10%이상의 성형성(deep drawing)성이 좋아지는 것으로 나타났음.또한 실시예 1내지3보다는 실시예 12,13,14가 성형성이 더 우수한 것으로 확인이 되었다. Formability It was also found that Examples 1 to 3, 12, 13, and 14 improved the formability by 10% or more compared to Comparative Examples 1 to 3. Also, Examples 12, 13, 14 rather than Examples 1 to 3 It was confirmed that the moldability was better.
[실시예 1 내지 3, 비교예 1 내지 3][Examples 1 to 3, Comparative Examples 1 to 3]
실시예 1 내지 3와 비교예 1 내지 3는 하기 표 5에 나타낸 각 층의 성분을 드라이 라미네이션 방식 또는 티-다이 다층공압출 방식으로 접착시켜 필름을 제조하였다. In Examples 1 to 3 and Comparative Examples 1 to 3, films were prepared by bonding the components of each layer shown in Table 5 below by a dry lamination method or a T-die multi-layer coextrusion method.
이때, 제1기재층은 이축연신 나이론으로 나이론66을 두께 15㎛로 사용하였고, 금속층은 철성분 함유량 1%인 알루미늄 40㎛, 접착층은 20㎛의 두께로, 제2기재층은 티-다이 캐스트로 가공한 폴리프로필렌을 40㎛ 두께로 적층하여 필름을 제조하였다.At this time, the first base layer was biaxially oriented nylon, and nylon 66 was used to a thickness of 15 μm, the metal layer was 40 μm aluminum with 1% iron content, the adhesive layer had a thickness of 20 μm, and the second base layer was T-die cast. A film was prepared by laminating the processed polypropylene to a thickness of 40 μm.
[실시예 4 내지 7 , 15, 16, 17 및 비교예 4][Examples 4 to 7, 15, 16, 17 and Comparative Example 4]
실시예 4 내지 7, 15, 16, 17과 비교예 4는 하기 표 5에 나타낸 각 층의 성분을 드라이 라미네이션 방식 또는 티-다이 다층 공압출 방식으로 접착시켜 필름을 제조하였다. In Examples 4 to 7, 15, 16, 17 and Comparative Example 4, the components of each layer shown in Table 5 below were adhered to each other by a dry lamination method or a T-die multi-layer co-extrusion method to prepare a film.
이때, 제1기재층에 사용된 폴리에틸렌테레프탈레이트의 두께는 12㎛, 이축연신 나이론의 두께는 15㎛이고, 금속은 40㎛의 두께로 드라이 라미네이션 공정을 통해 제1기재층과 금속층을 접착한 후, 금속층과 제2기재층에 대해서는, 티-다이 열접착 하였다. 이때 사용된 실시예 4와 5의 접착층과 제2기재층의 제품두께는 합하여 70㎛의 두께로 가공하였다.At this time, the thickness of the polyethylene terephthalate used for the first base layer is 12 μm, the thickness of the biaxially stretched nylon is 15 μm, and the metal has a thickness of 40 μm After bonding the first base layer and the metal layer through a dry lamination process. , the metal layer and the second base layer were T-die thermally bonded. In this case, the product thickness of the adhesive layer and the second base layer used in Examples 4 and 5 was processed to a thickness of 70 μm.
(AL층/열접착층/
접착층/최내수지층)
Extrusion method
(AL layer/heat adhesive layer/
Adhesive layer/most resistant resin layer)
압출가공T-Dies
Extrusion processing
압출가공T-Dies
Extrusion processing
용융 온도(Tm)가 65 내지 75℃인 산변성 폴리프로필렌 : 30%Acid-modified Styrene-Butadiene rubber: 70%
Acid-modified polypropylene having a melting temperature (Tm) of 65 to 75°C: 30%
- 내환경응력성-- Environmental stress resistance-
내환경응력성인 ESCR((Environmental Stress Cracking Resistance)성을 평가하기 위해 이차전지 전해질로 사용 되는 에틸렌 카보네이트(Ethylene carbonate)를 온도 40°C 가 되도록 항온 베스(Bath)를 만들고, 상기 항온 베스에 알루미늄과 열융착한 상기 실시예 4 내지 7, 15,16,17 비교예 1 및 비교예 4를 함침시킨 후, 50% 가 박리되는 시간을 측정하였고 그 결과를 표 6에 나타내었다. In order to evaluate the environmental stress resistance, ESCR (Environmental Stress Cracking Resistance), ethylene carbonate, which is used as a secondary battery electrolyte, was prepared in a constant temperature bath to a temperature of 40 °C, and aluminum and After impregnating the heat-sealed Examples 4 to 7, 15, 16, and 17 Comparative Examples 1 and 4, the time for 50% peeling was measured, and the results are shown in Table 6.
(ESCR성)chemical stress resistance
(ESCR)
표 6에 나타낸 바와 같이, 접착층으로 산변성 나이론, 산변성 폴리부틸렌테레프탈레이트 및 용융 온도(Tm)가 65 내지 75℃인 산변성 5% 폴리프로필렌을 각각 사용한 실시예 4 내지 7,15,16,17이 산변성 폴리프로필렌을 사용한 비교예 1과 비교예 4에 비하여, 최대 38배 이상의 내환경응력성을 갖는 것을 확인할 수 있다.As shown in Table 6, Examples 4 to 7, 15, 16 using acid-modified nylon, acid-modified polybutylene terephthalate, and acid-modified 5% polypropylene having a melting temperature (Tm) of 65 to 75° C. as adhesive layers, respectively , 17 compared to Comparative Examples 1 and 4 using acid-modified polypropylene, it can be confirmed that it has a maximum environmental stress resistance of 38 times or more.
또한, 용제 내에서 산변성을 실시한 용융 온도(Tm)가 65 내지 75℃인 산변성 5% 폴리프로필렌을 사용한 실시예 6과 실시예 7이 일반적인 산변성 폴리프로필렌을 사용한 비교예 4 대비 약 1.7배의 내환경응력을 갖는 것을 확인할 수 있었다. In addition, Examples 6 and 7 using acid-modified 5% polypropylene having an acid-modified melting temperature (Tm) of 65 to 75° C., which were acid-modified in a solvent, were about 1.7 times compared to Comparative Example 4 using general acid-modified polypropylene. It was confirmed that the environmental stress resistance of
[실시예 8][Example 8]
말레익 안하이드라이드(MAH) 가 5wt% 그라프트된 폴리부틸렌테레프탈레이트(PBT)수지 80중량부에 에틸렌 아크릴산 공중합체(EXXON사의 상품명:ESCOR 5100) 15중량부를 혼합한 후 압출기(twin extruder)로 박막을 만들고, 이를 준비된 40㎛ 알루미늄(AL)층에 티-다이(T-Dies)압출기를 이용하여 열융착한 후, 박리하여 80㎛의 두께의 열접착층 필름을 제조하였다.After mixing 15 parts by weight of an ethylene acrylic acid copolymer (EXXON's trade name: ESCOR 5100) to 80 parts by weight of polybutylene terephthalate (PBT) resin grafted with maleic anhydride (MAH) at 5 wt%, an extruder (twin extruder) After making a thin film by using a T-die extruder, it was peeled off to prepare a heat-adhesive layer film having a thickness of 80 μm.
[실시예 9][Example 9]
말레익 안하이드라이드(MAH) 가 5wt% 그라프트된 나이론 (polyamide)수지 80중량부에 EMMA(메타크릴산 메틸-에틸렌 공중합체) 15 중량부를 혼합하여 박막을 제조하는 것을 제외하고는 실시예 8과 동일한 방법으로 필름을 제조하였다. Example 8 except that maleic anhydride (MAH) was prepared by mixing 15 parts by weight of EMMA (methyl methacrylate-ethylene copolymer) with 80 parts by weight of a 5 wt% grafted nylon (polyamide) resin to prepare a thin film A film was prepared in the same manner as described above.
[비교예 5][Comparative Example 5]
말레익 안하이드라이드(MAH) 가 1.5wt% 그라프트된 산변성 폴리에틸렌수지(LLDPE)를 압출하여 박막을 제조하는 것을 제외하고는 실시예 7과 동일한 방법으로 필름을 제조하였다.A film was prepared in the same manner as in Example 7, except that a thin film was prepared by extruding 1.5 wt% of maleic anhydride (MAH) grafted acid-modified polyethylene resin (LLDPE).
[비교예 6][Comparative Example 6]
말레익 안하이드라이드(MAH)가 5wt% 그라프트된 산변성 폴리에틸렌 수지(HDPE)를 압출하여 박막을 제조하는 것을 제외하고는 실시예 7과 동일한 방법으로 필름을 제조하였다.A film was prepared in the same manner as in Example 7, except for preparing a thin film by extruding 5 wt% of maleic anhydride (MAH) grafted acid-modified polyethylene resin (HDPE).
- 가스베리어성(가스투과도)-- Gas barrier properties (gas permeability)-
실시예 8과 실시예 9 및 비교예 5, 비교예 6에서 제조한 필름에 대하여, 시바타가가쿠고오교(Shibata Kagaku Kogyou Co., Ltd.)제 가스 투과도 측정 장치(S-69형 160ml)를 (ASTM D 3985에 따른 산소투과도 측정방법) 이용하여, 23℃의 온도에서 측정하고, 그 결과를 표 7에 나타내었다. For the films prepared in Examples 8 and 9, Comparative Examples 5 and 6, a gas permeability measuring device (S-69 type 160 ml) manufactured by Shibata Kagaku Kogyou Co., Ltd. was used. (Method for measuring oxygen permeability according to ASTM D 3985), and measured at a temperature of 23° C., the results are shown in Table 7.
표 7 나타낸 바와 같이, 본 발명에 따른 접착층인 폴리부틸렌테레프탈레이트(PBT)이나 나이론(폴리아미드 수지)를 포함하는 실시예 8과 실시예 9는 접착층으로 산변성 폴리 에틸렌수지 필름(LLDPE)인 비교예 5에 비하여 가스 베리어성과 유기용제(MEK) 베리어성 모두 약 40배 이상 우수한 것을 확인할 수 있고, 접착층으로 산변성 폴리 에틸렌수지 필름(HDPE)인 비교예 6에 비하여도 매우 우수한 것을 확인할 수 있다. As shown in Table 7, Examples 8 and 9 containing polybutylene terephthalate (PBT) or nylon (polyamide resin) as the adhesive layer according to the present invention were acid-modified polyethylene resin films (LLDPE) as adhesive layers. It can be seen that both gas barrier properties and organic solvent (MEK) barrier properties are about 40 times or more superior to those of Comparative Example 5, and it can be confirmed that they are very excellent compared to Comparative Example 6, which is an acid-modified polyethylene resin film (HDPE) as an adhesive layer. .
따라서, 본 발명에 따른 금속층과 접착층 또는 제2기재층이 접합된 필름을 폴리머전지용 포장재료로 사용할 경우 장기적인 사용시의 내구성을 구비한 제품을 제공할 수 있다. Therefore, when the film in which the metal layer and the adhesive layer or the second base layer are bonded according to the present invention is used as a packaging material for a polymer battery, a product having durability during long-term use can be provided.
[실시예 10 내지 11][Examples 10 to 11]
실시예 10와 11은 접착층으로 하기 표 8에 나타낸 5 중량부의 산변성 함유량을 갖는 산변성 나이론을 사용한다는 점을 제외하고는 상기 실시예 4와 동일한 방법으로 포장재를 제조하였고, 실시예 10에서는 금속층에 앵커코팅제로 엑폭시 실란(상표명 GLYMO)을 앵커코팅(Anchor coating)한 것을 제외하고는 실시예 9과 동일한 방법으로 포장재를 제조하였다.In Examples 10 and 11, a packaging material was prepared in the same manner as in Example 4, except that acid-modified nylon having an acid-modified content of 5 parts by weight shown in Table 8 was used as the adhesive layer, and in Example 10, a metal layer A packaging material was prepared in the same manner as in Example 9, except that epoxy silane (trade name: GLYMO) was anchor-coated as an anchor coating agent.
(100회)pinhole resistance
(100 times)
(N/15mm)Aluminum/Inner Layer Adhesive Strength
(N/15mm)
상기 표 8는 실시예 10와 실시예 11에 대한 내핀홀성, 알루미늄/내층 사이의 접착강도를 측정한 결과값으로 내핀홀성과 접착강도의 측정방법은 상술한 바와 같다. 상기 표 9에 나타낸 바와 같이 알루미늄에 앵커코팅(Anchor coating) 처리시 접착강도가 10% 더 개선됨을 알 수가 있다.Table 8 is the result of measuring the pinhole resistance and the adhesive strength between the aluminum/inner layer for Examples 10 and 11, and the method for measuring the pinhole resistance and the adhesive strength is the same as described above. As shown in Table 9, it can be seen that the adhesive strength is further improved by 10% when the aluminum is subjected to anchor coating.
상기에서는 본 발명의 바람직한 실시 예를 참조하여 설명하였지만, 해당 기술 분야의 숙련된 당업자는 하기의 특허 청구의 범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention described in the claims below. You will understand that it can be done.
- 내전해액성 평가 test -- Electrolyte resistance test -
내전해액성 측정을 위해 파우치 시험편 폭 15mm, 길이 150mm로 채취하여 표준전해액에 함침한 후 65℃ 조건에서 일주일간 알루미늄과 접착층간 접착강도 측정To measure the electrolyte resistance, a pouch specimen was collected with a width of 15 mm and a length of 150 mm, impregnated with a standard electrolyte, and then the adhesive strength between aluminum and the adhesive layer was measured at 65℃ for one week.
UTM을 이용하여 속도 300mm/min 조건으로 T형 박리강도를 측정한다. Measure the T-type peel strength using UTM at a speed of 300 mm/min.
평가방법은 ASTM D1876로 측정하고 그 결과를 표10에 나타내었다. The evaluation method was measured by ASTM D1876, and the results are shown in Table 10.
상기 표 10에 나타낸 바와 같이 실시예 1 내지 3, 12, 13,14이 비교예 1 내지 3 ,12,13,14 대비 최소 60% 에서 최대 2배 이상의 내전해액성 접착강도를 갖는 것으로 나타났으며, 실시예 1,2,3보다는 실시예 12,13,14에서 내전해액성강도가 40%정도 좋아지는 것으로 나타났으며 더욱이 시간이 경과할수록 내전해액성강도가 떨어지기 않고 지속적으로 유지되는 것을 확인할 수 있다.As shown in Table 10, Examples 1 to 3, 12, 13, and 14 had an electrolyte-resistant adhesive strength of at least 2 times or more at least 60% compared to Comparative Examples 1 to 3, 12, 13, and 14. , It was found that the electrolyte resistance strength was improved by about 40% in Examples 12, 13, and 14 than in Examples 1, 2, and 3, and moreover, it was confirmed that the strength of the electrolyte resistance did not decrease and was continuously maintained as time passed. have.
Claims (14)
상기 제1기재층 내측에 배치된 금속층;
상기 금속층 내측에 배치된 제2기재층; 및
상기 금속층 및 제2기재층 사이에 배치된 접착층을 포함하고,
상기 접착층은 산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무로 이루어진 군으로부터 선택된 하나 이상의 필수적 산변성 수지로 이루어지며 선택적으로 산변성 폴레올레핀 수지를 포함하는 전지 포장용 필름.
a first base layer;
a metal layer disposed inside the first base layer;
a second base layer disposed inside the metal layer; and
An adhesive layer disposed between the metal layer and the second base layer,
The adhesive layer is composed of at least one essential acid-modified resin selected from the group consisting of acid-modified butadiene rubber, acid-modified styrene-butadiene rubber, and optionally contains an acid-modified polyolefin resin film for battery packaging.
산변성 폴레올레핀 수지는 용융 온도(Tm)가 65 내지 75℃인 전지 포장용 필름.
The method of claim 1,
The acid-modified polyolefin resin has a melting temperature (Tm) of 65 to 75°C for battery packaging.
제1기재층은 폴리올레핀 수지, 지방족-방향족 폴리에스테르 수지, 폴리아미드 수지 및 폴리카보네이트로 이루어진 군으로부터 선택된 하나 이상을 포함하는 전지 포장용 필름.
The method of claim 1,
The first base layer is a battery packaging film comprising at least one selected from the group consisting of a polyolefin resin, an aliphatic-aromatic polyester resin, a polyamide resin, and a polycarbonate.
제1기재층은 폴리에틸렌 텔레프탈레이트 필름, 나이론 필름 및 폴리프로필렌 필름으로 이루어진 그룹 중에서 선택된 필름이 단층 또는 다층으로 형성된 전지 포장용 필름.
The method of claim 1,
The first base layer is a film for battery packaging in which a film selected from the group consisting of a polyethylene terephthalate film, a nylon film, and a polypropylene film is formed as a single layer or a multilayer.
금속층은 알루미늄층인 전지 포장용 필름.
The method of claim 1,
A film for battery packaging whose metal layer is an aluminum layer.
알루미늄층은 부식방지 처리 또는 앵커코팅 처리된 전지 포장용 필름.
6. The method of claim 5,
The aluminum layer is a film for battery packaging treated with anti-corrosion treatment or anchor coating treatment.
접착층은 산변성 폴리에틸렌 테레프탈레이트, 산변성 폴리부틸렌 테레프탈레이트, 산변성 폴리트리메틸렌 테레프탈레이트, 산변성 폴리에틸렌 나프탈레이트, 산변성 나이론6, 산변성 나이론6.6, 산변성 나이론6와 나이론6.6의 공중합체, 산변성 나이론12, 산변성 나이론6.10, 또는 산변성 폴리메타자일렌 이디파마이드(MXD6), 산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무, 산변성 아크로니트릴- 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)- 부타다이엔(Butadiene) 스타일렌(Styrene) 고무, 산변성 Styrene- ethylene-butylene-styrene 고무, Styrene-isoprene-styrene 고무 인 전지 포장용 필름.
The method of claim 1,
The adhesive layer is a copolymer of acid-modified polyethylene terephthalate, acid-modified polybutylene terephthalate, acid-modified polytrimethylene terephthalate, acid-modified polyethylene naphthalate, acid-modified nylon 6, acid-modified nylon 6.6, acid-modified nylon 6 and nylon 6.6. , acid-modified nylon 12, acid-modified nylon 6.10, or acid-modified polymetaxylene idipamide (MXD6), acid-modified butadiene rubber, acid-modified styrene-butadiene rubber, Acid-modified acrynitrile-Butadiene rubber, Acid-modified Styrene-Butadiene Styrene rubber, Acid-modified Styrene-ethylene-butylene-styrene rubber, Styrene-isoprene-styrene rubber Film for battery packaging.
산변성 수지의 산성분 함유량은 0.01wt% 내지 15wt%인 전지 포장용 필름.
The method of claim 1,
The acid content of the acid-modified resin is 0.01wt% to 15wt% of the film for battery packaging.
산변성 수지는 용제 내에서 산성분이 그라프트 변형된 전지 포장용 필름.
The method of claim 1,
Acid-modified resin is a film for battery packaging in which the acid component is graft-modified in a solvent.
접착층은 폴리올레핀, α-올레핀-아크릴산 에스테르 공중합체, α-올레핀-메타크릴산 에스테르 공중합체, 아세테이트 공중합체, 일라스토머; 또는 이오노머를 추가로 포함하는 전지 포장용 필름.
The method of claim 1,
The adhesive layer may include polyolefin, α-olefin-acrylic acid ester copolymer, α-olefin-methacrylic acid ester copolymer, acetate copolymer, and elastomer; Or a film for battery packaging further comprising an ionomer.
제2기재층은 폴리올레핀 수지, 폴리에스테르 수지 및 폴리아미드 수지로 이루어진 그룹 중에서 선택된 하나 이상의 수지를 포함하는 전지 포장용 필름.
The method of claim 1,
The second base layer is a battery packaging film comprising at least one resin selected from the group consisting of polyolefin resin, polyester resin, and polyamide resin.
제2기재층 및 접착층 사이에 배치된 접착강화층을 추가로 포함하는 전지 포장용 필름.
The method of claim 1,
A battery packaging film further comprising an adhesive reinforcing layer disposed between the second base layer and the adhesive layer.
접착강화층은 산변성 폴리올레핀을 포함하는 전지 포장용 필름.
The method of claim 1,
The adhesive reinforcing layer is a battery packaging film comprising an acid-modified polyolefin.
상기 제1기재층 내측에 배치된 알루미늄층;
상기 금속층 내측에 배치되고, 폴리프로필렌, 또는 폴리에틸렌과 폴리프로필렌의 혼합물을 포함하는 제2기재층; 및
상기 알루미늄층 및 제2기재층 사이에 배치되고,
산변성 부타다이엔(Butadiene) 고무, 산변성 스타일렌(Styrene)-부타다이엔(Butadiene) 고무로 이루어진 군으로부터 선택된 하나 이상의 필수적 산변성 수지를 포함하며, 용융 온도(Tm)가 65 내지 75℃인 산변성 폴레에틸렌 및 용융 온도(Tm)가 65 내지 75℃인 산변성 폴레프로필렌으로 이루어진 그룹 중에서 선택된 하나 이상의 산변성 수지를 포함하는 접착층을 포함하는 전지 포장용 필름.a first base layer in which a film selected from the group consisting of a polyethylene terephthalate film, a nylon film, and a polypropylene film is formed in a single layer or in multiple layers;
an aluminum layer disposed inside the first base layer;
a second base layer disposed inside the metal layer and including polypropylene or a mixture of polyethylene and polypropylene; and
It is disposed between the aluminum layer and the second base layer,
It contains at least one essential acid-modified resin selected from the group consisting of acid-modified butadiene rubber, acid-modified styrene-butadiene rubber, and having a melting temperature (Tm) of 65 to 75° C. A battery packaging film comprising an adhesive layer comprising at least one acid-modified resin selected from the group consisting of acid-modified polyethylene and acid-modified polypropylene having a melting temperature (Tm) of 65 to 75°C.
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