KR20220085011A - Highly heat-dissipative polymer composition and an article comprising the same - Google Patents

Abstract

The present invention relates to a high heat dissipation polymer composition comprising a polymer binder and a heat dissipation filler, and specifically, the heat dissipation filler includes boron nitride particles, aluminum particles and boron nitride nanotubes, and a high heat dissipation polymer composition prepared from the high heat dissipation polymer composition. The molded article has excellent thermal conductivity and excellent heat dissipation properties.

Description

Highly heat-dissipative polymer composition and an article comprising the same

The present invention relates to a high heat dissipation polymer composition, and more particularly, to a high heat dissipation polymer composition having excellent heat dissipation ability and low dielectric constant.

Conventionally, a printed circuit board (PCB) is generally a metal base substrate such as aluminum, copper, silicon steel plate, or galvanized steel plate having high thermal conductivity, an insulating layer made of a polymer resin, etc. on the base substrate, the insulating layer An adhesive layer made of a prepreg, an epoxy resin, etc., for bonding a copper foil forming an electrode thereon, and a copper foil formed as a circuit pattern on the adhesive layer.

Such a printed circuit board has a disadvantage that, as the circuit pattern is heated according to operation, the temperature of the electronic device on which the printed circuit board is installed increases, resulting in a reduction in the lifespan of the electronic device and deterioration of performance such as malfunction. Accordingly, the printed circuit board is required to have high heat dissipation characteristics. The printed circuit board radiates heat not only directly from the circuit pattern itself, but also through the metal base board through the insulating layer. Accordingly, in order to sufficiently exhibit the heat dissipation effect of the metal base substrate, it is advantageous to sufficiently high the thermal conductivity of the heat insulating layer, and the heat insulating layer is required to have high thermal conductivity, low dielectric constant and heat resistance.

In particular, the insulating layer of a flexible printed circuit board (FPCB) requires excellent flexibility as well as high thermal conductivity, low dielectric constant and heat resistance. Accordingly, a liquid crystal polyester material was used as an insulating layer material of a conventional flexible printed circuit board.

As described above, liquid crystal polyester has high thermal conductivity and excellent heat resistance, and at the same time has low hygroscopicity and is used as a material for the insulating layer of a printed circuit board. However, the insulating layer including the liquid crystal polyester must be formed to have a relatively thick thickness in order to have a low dielectric constant required as a printed circuit board. Accordingly, there is a disadvantage that the flexibility is relatively poor, and there is a problem that there is a limitation in being used as a recent electronic device that requires further miniaturization.

Therefore, there is a need for a new organic film having a thin thickness and implementing excellent thermal conductivity and low dielectric constant.

(Patent Document 1): Republic of Korea Patent No. 10-0566679

In order to solve the conventional problems, an object of the present invention is to provide a high heat dissipation polymer composition comprising a polymer binder and a heat dissipation filler.

Another object of the present invention is to provide a high heat dissipation molded article made of the high heat dissipation polymer composition.

Another object of the present invention is that the high heat dissipation polymer composition includes a heat dissipation filler made of boron nitride particles, alumina particles and boron nitride nanotubes, thereby converting anisotropic thermal conductivity properties into isotropic properties.

Another object of the present invention is to change the mass ratio of boron nitride, alumina particles, and boron nitride nanotubes included in the heat dissipation filler to provide a change in thermal conductivity of a high heat dissipation molded article including the same.

The present invention includes a polymer binder and a heat dissipation filler, wherein the heat dissipation filler provides a high heat dissipation polymer composition comprising boron nitride particles, alumina particles and boron nitride nanotubes.

The boron nitride particles according to an aspect of the present invention may be hexagonal boron nitride particles.

According to an aspect of the present invention, the polymer binder may include a polyphenylene oxide-based polymer and an unsaturated polyolefin-based polymer.

According to an aspect of the present invention, the polyphenylene oxide-based polymer may include a vinyl group at the terminal.

According to an aspect of the present invention, the polyphenylene oxide-based polymer may be a polyphenylene oxide-based polymer in which a terminal group is substituted with a styrene group.

According to an aspect of the present invention, the high heat dissipation polymer composition may include 10 to 50% by weight of a polymer binder and 50 to 90% by weight of a heat dissipation filler.

According to an aspect of the present invention, of the total weight of the heat dissipation filler, boron nitride nanotubes may be included in an amount of 0.1 to 10% by weight.

The high heat dissipation polymer composition according to an aspect of the present invention may further include a polymerization initiator.

The present invention provides a high heat dissipation film prepared from the high heat dissipation resin composition of the present invention.

The present invention is a substrate layer; The high heat dissipation film located on the base layer; and a metal foil positioned on the high heat dissipation film.

According to an aspect of the present invention, the metal foil may be a copper foil.

According to an aspect of the present invention, the base layer may be a conductive metal.

The present invention provides a molded article prepared from the high heat dissipation resin composition of the present invention.

According to an aspect of the present invention, the high heat dissipation molded article may have a thermal conductivity of 6.0 W/m·k or more according to ASTM E1461.

According to an aspect of the present invention, the molded article may be a low-k electronic circuit board.

The high heat dissipation polymer composition according to the present invention has excellent thermal conductivity and, when used in an electronic circuit board, has an excellent effect of dissipating heat generated in the electronic circuit board, thereby preventing damage to the electronic circuit board caused by high heat.

Since the high heat dissipation polymer composition according to the present invention has a low dielectric constant, when used as an electronic circuit board, it is possible to minimize a malfunction of a signal by minimizing dielectric loss and resistance of electrical wiring and suppressing heat generation.

1 is a photograph of a heat dissipation filler included in a high heat dissipation polymer composition according to an embodiment of the present invention observed with a scanning electron microscope.
2 is a measurement result of thermal conductivity of the high heat dissipation polymer composition according to an embodiment of the present invention.

Unless otherwise defined in technical terms and scientific terms used in this specification, those of ordinary skill in the art to which this invention belongs have the meanings commonly understood, and in the following description and accompanying drawings, the subject matter of the present invention Descriptions of known functions and configurations that may unnecessarily obscure will be omitted.

Also, the singular form used herein may be intended to include the plural form as well, unless the context specifically dictates otherwise.

In addition, in the present specification, the unit used without special mention is based on the weight, for example, the unit of % or ratio means weight % or weight ratio, and the weight % means any one component of the entire composition unless otherwise defined. It means the weight % occupied in the composition.

In addition, the numerical range used herein includes the lower limit and upper limit and all values within the range, increments logically derived from the form and width of the defined range, all values defined therein, and the upper limit of the numerical range defined in different forms. and all possible combinations of lower limits. Unless otherwise defined in the specification of the present invention, values outside the numerical range that may occur due to experimental errors or rounding of values are also included in the defined numerical range.

As used herein, the term 'comprising' is an open-ended description having an equivalent meaning to expressions such as 'comprising', 'containing', 'having' or 'characterized', and elements not listed in addition; Materials or processes are not excluded.

Conventionally, liquid crystal polyester used as an insulating layer material of a flexible printed circuit board (FPCB) has high thermal conductivity, excellent heat resistance, and low hygroscopicity. However, the insulating layer including the liquid crystal polyester must be formed to a relatively thick thickness in order to have the thermal conductivity and low dielectric constant required as a printed circuit board. In addition, there is a disadvantage that the flexibility is relatively poor, and there is a problem that there is a limitation in being used as a recent electronic device that requires further miniaturization. Accordingly, there is a need for a new high heat dissipation polymer composition having better thermal conductivity and low dielectric constant.

The high heat dissipation polymer composition of the present invention includes a polymer binder and a heat dissipation filler, and the heat dissipation filler includes boron nitride particles, alumina particles and boron nitride nanotubes. As such a high heat dissipation polymer composition has high thermal conductivity and low dielectric constant at the same time, it can provide excellent insulation and heat dissipation performance as an insulating layer material such as an electronic circuit board.

The high heat dissipation polymer composition of the present invention may include 10 to 50% by weight of a polymer binder and 50 to 90% by weight of a heat dissipation filler. Specifically, the high heat dissipation polymer composition may include 20 to 40 wt% and 60 to 80 wt% of a heat dissipation filler. The high heat dissipation polymer composition including the polymer binder and the heat dissipation filler in the above weight range can implement excellent heat dissipation effect and strength.

The polymer binder may impart a low dielectric constant to the high heat dissipation polymer composition, and the heat dissipation filler may provide excellent thermal conductivity of the high heat dissipation polymer composition.

According to one embodiment, the polymer binder may include a polyphenylene oxide-based polymer and an unsaturated polyolefin-based polymer.

The polyphenylene oxide-based polymer and the unsaturated polyolefin-based polymer may have a weight ratio of 5:5 to 9:1, specifically 6:4 to 9:1, and more specifically 7:3 to 9:1 can be

As the polyphenylene oxide-based polymer and the unsaturated polyolipine-based polymer are included as one component of the polymer binder and at the same time are included in the above weight range, boron nitride particles, alumina particles and boron nitride nanotubes can be effectively dispersed, The high heat dissipation polymer composition in which the heat dissipation filler is dispersed may have excellent low dielectric constant and thermal conductivity.

The polyphenylene oxide-based polymer included in the polymer binder may refer to both a modified polyphenylene oxide-based polymer or an unmodified polyphenylene oxide-based polymer, and may preferably be a modified polyphenylene oxide-based polymer. . The modified polyphenylene oxide-based copolymer not only satisfies moisture resistance and dielectric properties due to a low coefficient of thermal expansion, improvement of glass transition temperature and reduction of hydroxyl groups, but also made it possible to apply in existing thermosetting systems, and dielectric properties depending on crosslinking agents Through research on characteristics, it is possible to secure various physical properties and processability at the same time.

The modified polyphenylene oxide-based polymer may be a polyphenylene oxide-based polymer containing a vinyl group at one or both terminals, specifically, the vinyl group is a styrene group, an alkylene group, a butylene group, a propylene group, a methacrylate group and at least one selected from an acrylate group, and more specifically, may be a styrene group or an alkylene group.

The high heat dissipation polymer composition of the present invention from the viewpoint of producing a film and molded article implementing excellent chemical resistance, impact resistance, chemical resistance and heat dissipation ability, the modified polyphenylene oxide polymer of the present invention is a polyphenylene oxide polymer containing a styrene group at the terminal A phenylene oxide-based polymer may be more preferred.

The polyphenylene oxide-based polymer may have a weight average molecular weight of 10,000 to 40,000 g/mol. Specifically, the weight average molecular weight of the polyphenylene oxide-based polymer may be 15,000 to 30,000 g/mol, and more specifically, 15,000 to 25,000 g/mol.

The unsaturated polyolefin-based polymer included in the polymer binder may be a conjugated diene-based polyolefin polymer, for example, polyisoprene or polybutadiene, and specifically polybutadiene.

The weight average molecular weight of the unsaturated polyolefin-based polymer may be 1,000 to 20,000 g/mol, specifically 1,000 to 10,000 g/mol, and more specifically 1,000 to 7,000 g/mol.

The polyphenylene oxide-based polymer and the unsaturated polyolefin-based polymer having a weight average molecular weight in the above range may allow the high heat dissipation polymer composition before curing to have high fluidity. In addition, high heat dissipation molded articles and electronic circuit boards made of the high heat dissipation polymer composition are preferred because they can have the effect of improving excellent heat resistance and peel strength.

The high heat dissipation polymer composition may include a polymerization initiator. Specific examples of the polymerization initiator may be organic peroxides, hydroperoxides, azo compounds, oxidation-reducing agents, or organometallic complexes, and more specifically, organic peroxides or hydroperoxides.

The organic peroxide or hydroperoxide forms radicals through a thermal decomposition reaction. After the high heat dissipation polymer composition is applied to a substrate, radicals can be generated through decomposition of the organic peroxide or hydroperoxide through heat treatment. A curing (crosslinking) reaction between the terminal vinyl group of the polyphenylene oxide-based polymer and the unsaturated polyolefin-based polymer may be performed through the radical generated in the high heat dissipation polymer composition.

For example, the organic peroxide is t-hexyl peroxybenzoate, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-butylperoxybenzoate, di(2-t-butyl peroxyiso propyl) benzene, dicumyl peroxide, t-butyl cumyl peroxide, diisopropylbenzene hydroperoxide, di-(3-methylbenzoyl) peroxide, benzoyl (3-methylbenzoyl) peroxide and dibenzoyl One or two or more may be used in the peroxide, but is not limited thereto.

The high heat dissipation polymer composition may further include a solvent.

The solvent may be used without limitation as long as it is a solvent capable of dissolving the high heat dissipation polymer composition in terms of solubility, and non-limiting examples include aromatic solvents such as toluene and xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, or Chloroform, etc. may be used, but is not limited thereto.

Hereinafter, the heat dissipation filler will be described.

The heat dissipation filler includes boron nitride particles, alumina particles and boron nitride nanotubes as described above.

Of the total weight of the heat dissipation filler, boron nitride particles may be 40 to 80% by weight, specifically 50 to 80% by weight, more specifically 60 to 80% by weight.

Among the total weight of the heat dissipation filler, the aluminum particles may be 19.9 to 50% by weight, specifically 19.9 to 45% by weight, more specifically 19.9 to 40% by weight.

Of the total weight of the heat dissipation filler, boron nitride nanotubes may be included in an amount of 0.1 to 10 wt%, specifically 0.1 to 6 wt%, and more specifically 1 to 5 wt%.

Specifically, the heat dissipation filler includes boron nitride particles and alumina particles having different particle shapes, and at the same time includes rod-shaped boron nitride nanotubes extending in the uniaxial direction compared to boron nitride particles and alumina particles. The thermal conductivity of the polymer composition can also convert anisotropic properties into isotropic properties. In detail, the heat dissipation filler may allow the polymer composition to exhibit excellent heat dissipation performance not only in the plane direction (X-axis and y-axis direction) but also in the direction perpendicular thereto (Z-axis direction).

Specifically, when the weight% of the boron nitride nanotubes is less than 0.1% by weight, the lamination phenomenon of the boron nitride particles is promoted, the thermal conductivity in the vertical direction is lowered, and the boron nitride particles are non-uniformly dispersed in the high heat dissipation polymer composition. Heat dissipation characteristics may be lowered. In addition, when the weight % of the boron nitride nanotubes is more than 10% by weight, the boron nitride nanotubes dispersed in the high heat dissipation polymer resin composition have difficulty in dispersion, and thus pores of the high heat dissipation polymer resin composition are generated to conduct overall heat. The value may also decrease.

The boron nitride (BN) particles are insulating ceramics, and may have excellent thermal conductivity as well as excellent insulating performance. The boron nitride particles may be c-BN particles having a diamond structure, h-BN particles having a graphite structure, and a-BN particles having a hard layer structure, but preferably a hexagonal system having excellent thermal conductivity, corrosion resistance, heat resistance and electrical insulation. It may be a boron nitride (hexagonal BN, h-BN) particle.

The hexagonal boron nitride particles may be provided in a plate shape, and the plate-shaped hexagonal boron nitride particles may exhibit very good heat dissipation performance. At this time, the average diameter of the hexagonal boron nitride particles is not particularly limited, but may be 100 μm or less, specifically 10 nm to 50 μm, and more specifically 70 nm to 30 μm.

The average aspect ratio of the hexagonal boron nitride particles may be 2 to 100, specifically 5 to 50. In this case, the aspect ratio means a value obtained by dividing the maximum major axis diameter in the plane direction of the plate-shaped particles by the thickness.

The alumina particles may be alumina particles having a crystal structure such as α, β, γ, δ, κ, θ and χ. However, it is advantageous that the alumina particles have a relatively spherical or similar spherical shape. Such alumina particles have relatively high insulation and thermal conductivity, and when mixed with the aforementioned plate-shaped hexagonal boron nitride particles, it is possible to suppress stacking between the boron nitride particles to increase the dispersibility of the boron nitride particles. Therefore, the boron nitride particles are not stacked, and may exist horizontally, vertically, or at various angles in the high heat dissipation polymer resin, and isotropic thermal conductivity may be realized. The average diameter of the alumina particles may be 0.5 to 100 μm, specifically 1 to 70 μm, but is not limited thereto. In addition, the average aspect ratio of the spherical alumina may be 0.7 or more, specifically, 0.7 to 1.0, and most of the particles may have a spherical or similar spherical shape.

The boron nitride nanotube has a rod-like shape extending in a uniaxial direction, unlike the above-described boron nitride particles and alumina particles. The heat dissipation filler including such boron nitride nanotubes can further increase the thermal conductivity in the vertical direction than the heat dissipation filler including only boron nitride particles and alumina particles. Specifically, it is possible not only to further suppress the lamination of the plate-shaped boron nitride particles, but also to prevent aggregation between the alumina particles to further improve the thermal conductivity anisotropy properties of the polymer composition, and to maximize the thermal conductivity properties in the vertical direction. The diameter of the boron nitride nanotubes may be 5 to 100 nm, specifically 10 to 80 nm, more specifically 10 to 50 nm. In addition, the particle length of the boron nitride nanotubes may be 20 to 500 nm, specifically 30 to 300 nm, more specifically 50 to 100 nm. The average aspect ratio of the boron nitride nanotubes may be 2 to 100, specifically 5 to 50, but is not limited thereto.

As the boron nitride particles, alumina particles and boron nitride nanotubes have the content and particle size as described above, they can be homogeneously dispersed in the high heat dissipation polymer composition, and isotropic thermal conductivity can be realized.

The present invention provides a high heat dissipation film produced by curing a high heat dissipation resin composition. The high heat dissipation film may be a film prepared by casting a high heat dissipation resin composition in a conventional manner, and a drying process may be further included if necessary.

In addition, the present invention provides an electronic circuit board comprising a base layer, a high heat dissipation film, and a metal foil, the high heat dissipation film is positioned on the base layer, and the metal foil is positioned on the high heat dissipation film.

The electronic circuit board may include a base layer, a high heat dissipation film, and a metal foil, a high heat dissipation film may be disposed on the base layer, and a metal foil may be disposed on the high heat dissipation film.

The metal foil may be, for example, a copper foil. The wiring pattern of a circuit may be formed in metal foil by etching etc., for example. The metal foil may have a thickness of 10 to 100 μm, specifically 40 to 100 μm, and more specifically 50 to 70 μm.

The base layer may be a conductive metal, and specifically, may be a metal plate such as aluminum, copper, stainless steel, or an alloy thereof. In addition, as the base layer, a flat plate or a bending process may be used. The thickness of the base layer may be 0.1 to 5 mm, specifically 0.5 to 5 mm, and more specifically, 1 to 3 mm.

The thickness of the high heat dissipation film may be 50 to 500 μm, specifically 100 to 400 μm, and more specifically 100 to 300 μm.

The above-described high heat dissipation film has a low dielectric constant and high heat dissipation property, and thus an electronic circuit board including the same may have excellent durability.

The present invention provides a high heat dissipation molded article prepared from the high heat dissipation polymer composition.

The high heat dissipation molded article may have a thermal conductivity of 6.0 W/m·k or more according to ASTM E1461. Accordingly, the high heat dissipation film can be preferably used as a material for an electronic circuit board.

Hereinafter, the present invention will be described with reference to examples. That is, the present invention can be better understood by the following examples, which are for illustrative purposes of the present invention. However, the embodiments of the present invention are not intended to limit the protection scope limited by the appended claims.

<Measuring method>

1. Measurement of thermal conductivity

It was measured according to the standard of ASTM E1461, and the thermal conductivity was calculated by calculating the thermal diffusivity, specific heat, and density by the measurement method, and performing the calculation of the following formula. It was measured at atmospheric pressure, and the thermal conductivity was measured at room temperature by a temperature burst analysis method. As the measuring device, ai-Phase Mobile manufactured by iPhase was used, and the density was measured using the Archimedes method.

Thermal conductivity = thermal diffusivity × specific heat × density

Examples 1 to 3: Preparation of high heat dissipation film containing heat dissipation filler

A high heat dissipation polymer composition was prepared with the content of the composition shown in Table 1 below.

Styrene-terminated polyphenylene oxide (MW: 20,000 g/mol, Styrene-terinated PPO, synthetic material) and polybutadiene (MW: 5,000 g/mol, PB, Sigma-aldrich) in toluene solvent (500 g) 3: 1, and additionally t-hexylperoxybenzoate was dissolved.

After adding Al ₂ O ₃ particles (Sumitomo Chemical Co., Ltd., Sumikoramderm AA-0.3), h-boron nitride (Sigma-Aldrich) and boron nitride nanotubes (Merck) to the prepared solution, A high heat dissipation polymer composition was prepared by stirring for 5 minutes. After applying the prepared composition on polyethylene terephthalate (PET), the thermosetting temperature was heated to 40 ℃, and vacuum dried at 105 ℃ for 5 hours to prepare a high heat dissipation film.

The prepared high heat dissipation film was cut to 10 mm × 10 mm × 0.1 mm (width × length × thickness), and the above-described thermal conductivity was measured, and is shown in Table 2 below.

Comparative Example 1: Preparation of a heat dissipation film not containing boron nitride nanotubes

A film was prepared in the same manner as in Example 1, except that boron nitride nanotubes were not included in Example 1.

Comparative Example 2: Preparation of a heat dissipation film not containing h-boron nitride

A film was prepared in the same manner as in Example 1, except that in Example 1, h-boron nitride was not included.

Comparative Example 3: Al ₂ 0 ₃ Manufacture of heat-dissipating film that does not contain particles

A film was prepared in the same manner as in Example 1, except that Al ₂ O ₃ particles were not included in Example 1.

polymer binder h-boron nitride
(weight%) boron nitride nanotubes
(weight%) Al ₂ O ₃
(weight%)
(SPPO:PB)
(weight%)
Example 1 24:6 45 One 24 Example 2 24:6 50 2 18 Example 3 24:6 42 3 25 Comparative Example 1 24:6 40 0 30 Comparative Example 2 24:6 0 3 67 Comparative Example 3 24:6 67 3 0

density
(g/cm ² ) specific heat heat diffusivity
(mm ² /s) thermal conductivity
(W/mk) Example 1 1.765 1.16 3.649 7.470 Example 2 1.733 1.16 3.043 6.116 Example 3 1.788 1.16 3.043 6.809 Comparative Example 1 1.736 1.16 1.665 4.343 Comparative Example 2 1.732 1.16 1.763 3.443 Comparative Example 3 1.759 1.16 1.792 4.511

All of the samples of Examples 1 to 3 of Table 2 had a thermal conductivity value of 6.0 W/m·k or more, and a thermal diffusivity of 3.0 mm ² /s or more. This is a remarkable effect generated as all of boron nitride, boron nitride nanotubes, and Al ₂ O ₃ are included in the high heat dissipation film.

In contrast, in Comparative Example 1, Comparative Example 2, and Comparative Example 3, in Example 1, respectively, as boron nitride nanotubes, h-boron nitride, or Al ₂ O ₃ were not included, in the case of the films, thermal conductivity and heat It can be seen that the diffusion rate is all decreased.

As the high heat dissipation polymer composition according to the present invention contains all of h-boron nitride in the form of a hexagonal plate-like compound, long rod-shaped boron nitride nanotubes, and Al ₂ O ₃ particles having excellent conductivity, each composition is laminated The dispersibility is improved by suppressing the heat dissipation, and in particular, the high heat dissipation polymer composition increases the thermal conductivity of all cubic axes, suggesting that the heat of the copper wire can be effectively dissipated.

As described above, the present invention has been described with reference to specific matters and limited examples and drawings, but these are only provided to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments, and the present invention is not limited to the above embodiments. Various modifications and variations are possible from these descriptions by those of ordinary skill in the art.

Therefore, the spirit of the present invention should not be limited to the described embodiments, and not only the claims to be described later, but also all those with equivalent or equivalent modifications to the claims will be said to belong to the scope of the spirit of the present invention. .

Claims (15)

It contains a polymer binder and a heat dissipation filler,
The heat dissipation filler is a high heat dissipation polymer composition comprising boron nitride particles, alumina particles and boron nitride nanotubes. The method of claim 1,
The boron nitride particles are hexagonal boron nitride particles, high heat dissipation polymer composition. The method of claim 1,
The polymer binder is a high heat dissipation polymer composition comprising a polyphenylene oxide-based polymer and an unsaturated polyolefin-based polymer. The method of claim 1,
The polyphenylene oxide-based polymer comprises a vinyl group at the terminal, high heat dissipation polymer composition. 5. The method of claim 4,
The polyphenylene oxide-based polymer is a polyphenylene oxide-based polymer in which the terminal group is substituted with a styrene group, high heat dissipation polymer composition. The method of claim 1,
The high heat dissipation polymer composition comprises 10 to 50% by weight of a polymer binder and 50 to 90% by weight of a heat dissipation filler, a high heat dissipation polymer composition. The method of claim 1,
A high heat dissipation polymer composition comprising 0.1 to 10 wt% of boron nitride nanotubes based on the total weight of the heat dissipation filler. The method of claim 1,
The high heat dissipation polymer composition further comprises a polymerization initiator, high heat dissipation polymer composition. A high heat dissipation film produced by curing the high heat dissipation polymer composition according to any one of claims 1 to 8. base layer;
The high heat dissipation film according to claim 7 located on the base layer; and
a metal foil positioned on the high heat dissipation film;
An electronic circuit board comprising a. 11. The method of claim 10,
The metal foil is a copper foil, the electronic circuit board. 11. The method of claim 10,
The base layer is a conductive metal, the electronic circuit board. A high heat dissipation molded article prepared from the high heat dissipation polymer composition according to any one of claims 1 to 8. 14. The method of claim 13,
The molded article is a high heat dissipation molded article having a thermal conductivity of 6.0W/m·k or more according to ASTM E1461. 14. The method of claim 13,
The molded article is a low dielectric electronic circuit board, a high heat dissipation molded article.

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