KR20220070903A - Light emitting display device with integrated touch screen - Google Patents

Abstract

A touch screen-integrated light emitting display device according to an embodiment of the present invention comprises a substrate having a display area in which a plurality of pixels are disposed and a non-display area around the display area. At least one inorganic insulating layer may be disposed on the substrate. A dam disposed in the non-display area and configured to surround the display area may be included. A covering member disposed in the non-display area, spaced apart from the dam, and covering an end of the inorganic insulating layer may be included. An encapsulation part covering the display area and the non-display area and composed of a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer may be included. The encapsulation part extends outside the covering member to be in contact with the substrate and may include a crack prevention pattern. Accordingly, a highly reliable display device can be provided.

Description

Touch screen integrated light emitting display device {LIGHT EMITTING DISPLAY DEVICE WITH INTEGRATED TOUCH SCREEN}

The present specification relates to a touch screen-integrated light emitting display device.

As the information society develops, a demand for a display device for displaying an image is increasing, and various types of display devices such as a liquid crystal display device and an organic light emitting display device are utilized.

The display device may recognize a user's touch on the display panel and perform input processing based on the recognized touch in order to provide more various functions to the user. For example, a plurality of touch electrodes may be disposed in the active area of the display panel. In addition, the display device may sense the touch by detecting a change in capacitance of the touch electrode generated by the user's touch. In particular, when applied to an organic light emitting display device, elements constituting the touch device may be formed on or below an encapsulation film for protecting the light emitting part of the organic light emitting display device. That is, the touch driving electrodes constituting the touch driving signal transmission channel and the touch sensing electrodes constituting the touch recognition signal receiving channel are formed on the upper surface and/or the lower surface of the encapsulation layer that covers the display elements of the electroluminescent display device. do.

In the non-display area of the display device, an area in which the inorganic film is located on the substrate and an area in which there is no inorganic film outside the area are disposed. Since the end of the inorganic film is vulnerable to damage, a cladding member covering the inorganic film is formed to protect the end of the inorganic film. An encapsulation film composed of a plurality of inorganic layers and organic layers is disposed in the display area and the non-display area to protect the pixels. Although the encapsulation layer is designed to be formed up to the end of the covering member, it may be formed up to the outer edge of the covering member due to process errors. That is, when the inorganic layer of the encapsulation layer is formed in a region where there is no inorganic layer, and the inorganic layer is cracked by an external force, there is a problem that external moisture and oxygen penetrate through the crack.

Accordingly, an object of the present specification is to provide a light emitting display device with a touch screen that can prevent propagation of cracks toward a display area even when cracks occur in an encapsulation unit.

The tasks of the present specification are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the object as described above, a touch screen-integrated light emitting display device according to an embodiment of the present invention includes a substrate having a display area on which a plurality of pixels are disposed and a non-display area around the display area. At least one inorganic insulating layer may be disposed on the substrate. A dam disposed in the non-display area and configured to surround the display area may be included. It may include a covering member disposed in the non-display area, spaced apart from the dam, and covering the end of the inorganic insulating layer. It may include an encapsulation unit covering the display area and the non-display area and including the first inorganic encapsulation layer, the second inorganic encapsulation layer, and the organic encapsulation layer. The encapsulation part may extend to the outside of the covering member to contact the substrate and include a crack prevention pattern.

Details of other embodiments are included in the detailed description and drawings.

In the display device according to an embodiment of the present invention, a crack prevention pattern is formed in the encapsulation portion disposed outside the covering member disposed in the non-display area, so that even if a crack occurs in the encapsulation portion, cracks are generated toward the display area. Since this does not propagate, it is possible to minimize the penetration of external moisture or oxygen into the light emitting element (ED), thereby providing a highly reliable display device.

Since the content of the invention described in the problems to be solved above, the means for solving the problems, and the effects do not specify the essential characteristics of the claims, the scope of the claims is not limited by the matters described in the content of the invention.

1 is a view showing a schematic configuration of a touch screen-integrated light emitting display device according to embodiments of the present invention.
2 is a diagram schematically illustrating a display panel of a touch screen-integrated light emitting display device according to embodiments of the present disclosure.
3 is a diagram exemplarily illustrating a structure in which a touch panel is embedded in a display panel according to embodiments of the present invention.
4 and 5 are diagrams exemplarily showing types of touch electrodes disposed on a display panel according to embodiments of the present invention.
FIG. 6 is a diagram illustrating the mesh-type touch electrode of FIG. 5 by way of example;
7 is a diagram schematically illustrating a structure of a touch sensor in a display panel according to embodiments of the present invention.
FIG. 8 is an exemplary implementation diagram of the structure of the touch sensor of FIG. 7 .
9 is a partial cross-sectional view of a display panel according to embodiments of the present invention, illustrating an example of a cross-sectional structure of a portion XX′ shown in FIG. 8 .

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, cases including the plural are included unless otherwise explicitly stated.

In interpreting the components, it is construed as including an error range even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

Reference to a device or layer “on” another device or layer includes any intervening layer or other device directly on or in the middle of the other device or layer.

Although first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Like reference numerals refer to like elements throughout.

The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated component.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and as those skilled in the art will fully understand, technically various interlocking and driving are possible, and each embodiment may be implemented independently of each other, It may be possible to implement together in a related relationship.

Hereinafter, an embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a system configuration diagram of a touch screen-integrated light emitting display device according to embodiments of the present invention.

Referring to FIG. 1 , the touch screen-integrated light emitting display device according to embodiments of the present invention may provide both a function for displaying an image and a function for sensing a touch.

In order to provide an image display function, the touch screen-integrated light emitting display device according to the embodiments of the present invention includes a plurality of data lines and a plurality of gate lines, and a plurality of data lines and a plurality of gate lines defined by the plurality of gate lines. a display panel DISP in which subpixels are arranged, a data driving circuit DDC driving a plurality of data lines, a gate driving circuit GDC driving a plurality of gate lines, a data driving circuit DDC It may include a display controller DCTR that controls the operation of the gate driving circuit GDC, and the like.

Each of the data driving circuit DDC, the gate driving circuit GDC, and the display controller DCTR may be implemented as one or more individual components. In some cases, two or more of the data driving circuit DDC, the gate driving circuit GDC, and the display controller DCTR may be integrated and implemented as one component. For example, the data driving circuit DDC and the display controller DCTR may be implemented as one integrated circuit chip (IC Chip).

In order to provide a touch sensing function, a touch screen-integrated light emitting display device according to embodiments of the present invention supplies a touch driving signal to a touch panel (TSP) including a plurality of touch electrodes and the touch panel (TSP); and a touch sensing circuit TSC for detecting a touch sensing signal from the touch panel TSP and sensing the presence or absence of a user's touch or a touch position (touch coordinates) on the touch panel TSP based on the detected touch sensing signal. can

The touch sensing circuit TSC includes, for example, a touch driving circuit TDC that supplies a touch driving signal to the touch panel TSP and detects a touch sensing signal from the touch panel TSP, and the touch driving circuit TDC. It may include a touch controller TCTR that senses the presence and/or touch position of the user on the touch panel TSP based on the touch sensing signal detected by the touch panel TSP.

The touch driving circuit TDC may include a first circuit part for supplying a touch driving signal to the touch panel TSP and a second circuit part for detecting a touch sensing signal from the touch panel TSP.

The touch driving circuit TDC and the touch controller TCTR may be implemented as separate components, or may be implemented by being integrated into one component in some cases.

Meanwhile, each of the data driving circuit DDC, the gate driving circuit GDC, and the touch driving circuit TDC may be implemented as one or more integrated circuits, and in terms of electrical connection with the display panel DISP, COG (Chip On) Glass) type, COF (Chip On Film) type, or TCP (Tape Carrier Package) type, etc. may be implemented, and the gate driving circuit (GDC) may also be implemented as a GIP (Gate In Panel) type.

Meanwhile, each of the circuit components DDC, GDC, and DCTR for driving the display and the circuit components TDC and TCTR for touch sensing may be implemented with one or more individual components. In some cases, at least one of the circuit components DDC, GDC, and DCTR for driving the display and at least one of the circuit components TDC and TCTR for touch sensing may be functionally integrated and implemented as one or more components.

For example, the data driving circuit DDC and the touch driving circuit TDC may be integrated into one or two or more integrated circuit chips. When the data driving circuit DDC and the touch driving circuit TDC are integrated into two or more integrated circuit chips, each of the two or more integrated circuit chips may have a data driving function and a touch driving function.

Meanwhile, the touch screen-integrated light emitting display device according to the embodiments of the present invention may be of various types such as an organic light emitting display device and a liquid crystal display device. Hereinafter, for convenience of description, the touch screen-integrated light emitting display device will be described as an organic light emitting display device as an example. That is, the display panel DISP may be of various types such as an organic light emitting display panel and a liquid crystal display panel, but hereinafter, for convenience of description, the display panel DISP will be described as an organic light emitting display panel.

Meanwhile, as will be described later, the touch panel TSP includes a plurality of touch electrodes to which a touch driving signal may be applied or a touch sensing signal to be detected, and a plurality of touch electrodes for connecting the plurality of touch electrodes to the touch driving circuit TDC. may include touch routing wiring and the like.

The touch panel TSP may exist outside the display panel DISP. That is, the touch panel TSP and the display panel DISP may be separately manufactured and combined. Such a touch panel TSP is called an external type or an add-on type.

Alternatively, the touch panel TSP may be built in the display panel DISP. That is, when manufacturing the display panel (DISP), a touch sensor structure such as a plurality of touch electrodes and a plurality of touch routing wires constituting the touch panel (TSP) may be formed together with electrodes and signal lines for driving the display. have. Such a touch panel (TSP) is called a built-in type. Hereinafter, for convenience of description, a case in which the touch panel TSP is a built-in type will be described as an example.

2 is a diagram schematically illustrating a display panel DISP of a touch screen-integrated light emitting display device according to embodiments of the present invention.

Referring to FIG. 2 , the display panel DISP may include an active area AA in which an image is displayed and a non-active area NA that is an outer area of an outer boundary line BL of the active area AA. have.

In the active area AA of the display panel DISP, a plurality of sub-pixels for image display are arranged, and various electrodes or signal lines for driving the display are arranged.

In addition, in the active area AA of the display panel DISP, a plurality of touch electrodes for touch sensing and a plurality of touch routing wires electrically connected thereto may be disposed. Accordingly, the active area AA may also be referred to as a touch sensing area in which touch sensing is possible.

In the non-active area NA of the display panel DISP, various signal lines disposed in the active area AA are extended link lines or links electrically connected to various signal lines disposed in the active area AA. Lines and pads electrically connected to the link lines may be disposed. The pads disposed in the non-active area NA may be bonded to or electrically connected to a display driving circuit (DDC, GDC, etc.).

In addition, in the non-active area NA of the display panel DISP, a plurality of touch routing wires disposed in the active area AA are extended link lines or a plurality of touch routing wires disposed in the active area AA. Link lines electrically connected to and pads electrically connected to the link lines may be disposed. The pads disposed in the non-active area NA may be bonded to or electrically connected to the touch driving circuit TDC.

In the non-active area NA, a portion in which a part of the outermost touch electrode is extended among the plurality of touch electrodes disposed in the active area AA may be present, and the plurality of touch electrodes disposed in the active area AA and One or more electrodes (touch electrodes) of the same material may be further disposed.

That is, the plurality of touch electrodes disposed on the display panel DISP are all present in the active area AA, or some of the plurality of touch electrodes disposed on the display panel DISP (eg, the outermost touch electrode) are non- Some of the plurality of touch electrodes present in the active area NA or disposed on the display panel DISP (eg, an outermost touch electrode) may span the active area AA and the non-active area NA. .

Meanwhile, referring to FIG. 2 , the display panel DISP of the touch screen-integrated light emitting display device according to the embodiments of the present invention includes any layer (eg, encapsulation in the organic light emitting display panel) in the active area AA. Part) may include a dam area DA in which a dam DAM for preventing collapsing is disposed. That is, the dam DAM may function to prevent the organic material layer included in the encapsulation unit ENCAP from overflowing to the outside. Therefore, the dam DAM may be referred to as a blocking structure.

The dam area DA may be located at a boundary point between the active area AA and the non-active area NA or at any one point of the non-active area NA that is an outer area of the active area AA.

The dams disposed in the dam area DA are disposed to surround all directions of the active area AA, or only outside of one or two or more portions (eg, a portion with a fragile layer) of the active area AA. may be placed.

The dams disposed in the dam area DA may be formed of one pattern that is all connected or two or more patterns that are disconnected. Also, in the dam area DA, only a primary dam may be disposed, two dams (a primary dam and a secondary dam) may be disposed, and three or more dams may be disposed.

In the dam area DA, there may be only the primary dam in one direction, and both the primary dam and the secondary dam may be present in the other direction.

3 is a diagram exemplarily illustrating a structure in which a touch panel TSP is embedded in a display panel DISP according to embodiments of the present invention.

Referring to FIG. 3 , in the active area AA of the display panel DISP, a plurality of sub-pixels SP are arranged on the substrate SUB.

Each subpixel SP includes a light emitting element ED, a first transistor T1 for driving the light emitting element ED, and a data voltage VDATA to a first node N1 of the first transistor T1. ) may include a second transistor T2 for transferring the data, a storage capacitor Cst for maintaining a constant voltage for one frame, and the like.

The first transistor T1 has a driving voltage from a first node N1 to which the data voltage VDATA may be applied, a second node N2 electrically connected to the light emitting device ED, and a driving voltage line DVL. It may include a third node N3 to which VDD is applied. The first node N1 may be a gate node, the second node N2 may be a source node or a drain node, and the third node N3 may be a drain node or a source node. The first transistor T1 is also referred to as a driving transistor for driving the light emitting device ED.

The light emitting device ED may include a first electrode (eg, an anode electrode), a light emitting layer, and a second electrode (eg, a cathode electrode). The first electrode may be electrically connected to the second node N2 of the first transistor T1 , and a ground voltage VSS may be applied to the second electrode.

In the light emitting device ED, the light emitting layer may be an organic light emitting layer including an organic material. In this case, the light emitting device ED may be an organic light emitting diode (OLED).

The on-off of the second transistor T2 is controlled by the scan signal SCAN applied through the gate line GL, and the first node N1 and the data line DL of the first transistor T1 are turned on and off. may be electrically connected between them. This second transistor T2 is also referred to as a switching transistor.

When the second transistor T2 is turned on by the scan signal SCAN, it transfers the data voltage VDATA supplied from the data line DL to the first node N1 of the first transistor T1 .

The storage capacitor Cst may be electrically connected between the first node N1 and the second node N2 of the first transistor T1 .

Each sub-pixel SP may have a 2T1C structure including two transistors T1 and T2 and one capacitor Cst as shown in FIG. 3 , and in some cases, further include one or more transistors Alternatively, it may further include one or more capacitors.

The storage capacitor Cst is not a parasitic capacitor (eg, Cgs, Cgd) that is an internal capacitor that may exist between the first node N1 and the second node N2 of the first transistor T1 . , may be an external capacitor intentionally designed outside the first transistor T1 .

Each of the first transistor T1 and the second transistor T2 may be an n-type transistor or a p-type transistor.

Meanwhile, as described above, circuit elements such as a light emitting element ED, two or more transistors T1 and T2 , and one or more capacitors Cst are disposed on the display panel DISP. Since such a circuit element (especially, the light emitting element ED) is vulnerable to external moisture or oxygen, an encapsulation unit ( ENCAP) may be disposed on the display panel DISP.

The encapsulation unit ENCAP may be formed of one layer or a plurality of layers.

Meanwhile, in the touch screen-integrated light emitting display device according to embodiments of the present invention, the touch panel TSP may be formed on the encapsulation unit ENCAP.

That is, in the touch screen-integrated light emitting display device, a touch sensor structure such as a plurality of touch electrodes TE constituting the touch panel TSP may be disposed on the encapsulation unit ENCAP.

During touch sensing, a touch driving signal or a touch sensing signal may be applied to the touch electrode TE. Accordingly, during touch sensing, a potential difference may be formed between the touch electrode TE and the cathode electrode disposed with the encapsulation unit ENCAP interposed therebetween, thereby forming unnecessary parasitic capacitance. Since such parasitic capacitance may reduce touch sensitivity, in order to reduce parasitic capacitance, the distance between the touch electrode (TE) and the cathode electrode is set to a predetermined value (eg, 1) in consideration of panel thickness, panel manufacturing process, and display performance. μm) or larger. To this end, as an example, the thickness of the encapsulation unit ENCAP may be designed to be at least 1 μm or more.

4 and 5 are diagrams exemplarily showing types of touch electrodes TE disposed on a display panel DISP according to embodiments of the present invention.

As shown in FIG. 4 , each touch electrode TE disposed on the display panel DISP may be a plate-shaped electrode metal without a hole. In this case, each touch electrode TE may be a transparent electrode. That is, each touch electrode TE may be made of a transparent electrode material so that light emitted from the plurality of sub-pixels SP disposed below may be transmitted upward.

Alternatively, as shown in FIG. 5 , each touch electrode TE disposed on the display panel DISP may be an electrode metal EM patterned in a mesh type and having two or more holes. .

The electrode metal EM is a portion corresponding to the actual touch electrode TE, and is a portion to which a touch driving signal is applied or a touch sensing signal is sensed.

As shown in FIG. 5 , when each touch electrode TE is an electrode metal EM patterned in a mesh type, two or more holes may exist in an area of the touch electrode TE.

Each of the two or more holes present in each touch electrode TE may correspond to the light emitting area of the one or more subpixels SP. That is, the plurality of holes are paths through which light emitted from the plurality of sub-pixels SP disposed below pass upward. Hereinafter, for convenience of description, it will be described that each touch electrode TE is a mesh-type electrode metal EM as an example.

The electrode metal EM corresponding to each touch electrode TE may be located on a bank disposed in an area other than the light emitting area of the two or more subpixels SP.

On the other hand, as a method of forming a plurality of touch electrodes TE, the electrode metal EM is widely formed in a mesh type, and then the electrode metal EM is cut in a predetermined pattern to electrically separate the electrode metal EM. , it is possible to make several touch electrodes TE.

The shape of the outline of the touch electrode TE may be a square shape such as a diamond shape or a rhombus, as shown in FIGS. 4 and 5 , or various shapes such as a triangle, a pentagon, or a hexagon.

FIG. 6 is a diagram exemplarily illustrating the mesh-type touch electrode TE of FIG. 5 .

Referring to FIG. 6 , in the region of each touch electrode TE, one or more dummy metals DM that are disconnected from the mesh-type electrode metal EM may exist.

Although the electrode metal EM is a portion corresponding to the actual touch electrode TE and a portion to which a touch driving signal is applied or a touch sensing signal is sensed, the dummy metal DM is present in the area of the touch electrode TE. A portion to which a touch driving signal is not applied and a touch sensing signal is not sensed. That is, the dummy metal DM may be an electrically floating metal.

Accordingly, the electrode metal EM may be electrically connected to the touch driving circuit TDC, but the dummy metal DM is not electrically connected to the touch driving circuit TDC.

In each area of all of the touch electrodes TE, one or more dummy metals DM may exist in a state in which they are disconnected from the electrode metals EM.

Alternatively, one or more dummy metals DM may exist in a state in which they are cut off from the electrode metal EM only in the area of each of the touch electrodes TE of some of all the touch electrodes TE. That is, the dummy metal DM may not exist in a portion of the touch electrode TE.

Meanwhile, in relation to the role of the dummy metal DM, as shown in FIG. 5 , one or more dummy metals DM do not exist in the area of the touch electrode TE, and only the electrode metal EM exists in a mesh type. In this case, a visibility issue in which the outline of the electrode metal EM is visible on the screen may occur.

In contrast, as shown in FIG. 6 , when one or more dummy metals DM are present in the area of the touch electrode TE, a visibility issue in which the outline of the electrode metal EM is visible on the screen may be prevented. .

Also, by adjusting the presence or the number (dummy metal ratio) of the dummy metal DM for each touch electrode TE, the capacitance may be adjusted for each touch electrode TE to improve touch sensitivity.

Meanwhile, by cutting some points in the electrode metal EM formed in the region of one touch electrode TE, the cut electrode metal EM may be formed as the dummy metal DM. That is, the electrode metal EM and the dummy metal DM may be formed of the same material on the same layer.

Meanwhile, the touch screen-integrated light emitting display device according to the embodiments of the present invention may sense a touch based on capacitance formed in the touch electrode TE.

The touch screen-integrated light emitting display device according to the embodiments of the present invention is a capacitance-based touch sensing method, and may sense a touch using a mutual-capacitance-based touch sensing method, and may include a self-capacitance method. -capacitance)-based touch sensing method may be used to sense a touch.

In the case of the mutual-capacitance-based touch sensing method, the plurality of touch electrodes TE include a driving touch electrode (transmitting touch electrode) to which a touch driving signal is applied, and a touch sensing signal to form a capacitance with the driving touch electrode. It may be classified as a sensing touch electrode (receiving touch electrode).

In the case of such a mutual-capacitance-based touch sensing method, the touch sensing circuit (TSC) determines the presence and absence of a touch based on a change in capacitance (mutual-capacitance) between the driving touch electrode and the sensing touch electrode according to the presence or absence of a pointer such as a finger or a pen. / or sense the touch coordinates and the like.

In the case of the self-capacitance-based touch sensing method, each touch electrode TE functions as both a driving touch electrode and a sensing touch electrode. That is, the touch sensing circuit TSC applies a touch driving signal to one or more touch electrodes TE, detects the touch sensing signal through the touch electrode TE to which the touch driving signal is applied, and applies the detected touch sensing signal. Based on the change in capacitance between a pointer such as a finger or a pen and the touch electrode TE, the presence or absence of a touch and/or touch coordinates are sensed. In the self-capacitance-based touch sensing method, there is no distinction between the driving touch electrode and the sensing touch electrode.

As such, the touch screen-integrated light emitting display device according to embodiments of the present invention may sense a touch using a mutual-capacitance-based touch sensing method, or may sense a touch using a self-capacitance-based touch sensing method. . However, hereinafter, for convenience of description, the touch screen-integrated light emitting display device performs mutual-capacitance-based touch sensing and has a touch sensor structure for this as an example.

7 is a diagram schematically illustrating a structure of a touch sensor in a display panel DISP according to embodiments of the present invention, and FIG. 8 is an exemplary implementation diagram of the structure of the touch sensor of FIG. 7 .

Referring to FIG. 7 , a touch sensor structure for mutual-capacitance-based touch sensing may include a plurality of X-touch electrode lines (X-TEL) and a plurality of Y-touch electrode lines (Y-TEL). . Here, the plurality of X-touch electrode lines X-TEL and the plurality of Y-touch electrode lines Y-TEL are positioned on the encapsulation unit ENCAP. The X-touch electrode line may be referred to as a first touch electrode line, and the Y-touch electrode line may be referred to as a second touch electrode line.

Each of the plurality of X-touch electrode lines X-TEL may be disposed in a first direction, and each of the plurality of Y-touch electrode lines Y-TEL may be disposed in a second direction different from the first direction.

In this specification, the first direction and the second direction may be relatively different from each other. For example, the first direction may be an x-axis direction and the second direction may be a y-axis direction. Conversely, the first direction may be a y-axis direction and the second direction may be an x-axis direction. In addition, the first direction and the second direction may be orthogonal to each other, but may not be orthogonal to each other. In addition, in this specification, a row and a column are relative, and a row and a column may change according to a viewing point of view.

Each of the plurality of X-touch electrode lines X-TEL may include a plurality of X-touch electrodes X-TE that are electrically connected. Each of the plurality of Y-touch electrode lines Y-TEL may include a plurality of Y-touch electrodes Y-TE that are electrically connected. The X-touch electrode may be referred to as a first touch electrode, and the Y-touch electrode may be referred to as a second touch electrode.

Here, the plurality of X-touch electrodes X-TE and the plurality of Y-touch electrodes Y-TE are electrodes included in the plurality of touch electrodes TE and whose roles (functions) are distinguished.

For example, the plurality of X-touch electrodes X-TE constituting each of the plurality of X-touch electrode lines X-TEL are driving touch electrodes, and each of the plurality of Y-touch electrode lines Y-TEL is configured. The plurality of Y-touch electrodes Y-TE may be sensing touch electrodes. In this case, each of the plurality of X-touch electrode lines X-TEL corresponds to a driving touch electrode line, and each of the plurality of Y-touch electrode lines Y-TEL corresponds to a sensing touch electrode line.

On the contrary, the plurality of X-touch electrodes X-TE constituting each of the plurality of X-touch electrode lines X-TEL are sensing touch electrodes, and each of the plurality of Y-touch electrode lines Y-TEL is connected to each other. The plurality of Y-touch electrodes Y-TE included may be driving touch electrodes. In this case, each of the plurality of X-touch electrode lines X-TEL corresponds to a sensing touch electrode line, and each of the plurality of Y-touch electrode lines Y-TEL corresponds to a driving touch electrode line.

The touch sensor metal for touch sensing may include a plurality of touch routing wires TL in addition to a plurality of X-touch electrode lines (X-TEL) and a plurality of Y-touch electrode lines (Y-TEL).

A plurality of touch routing wiring (TL), one or more X- touch routing wiring (X-TL) connected to each of the plurality of X-touch electrode lines (X-TEL), and a plurality of Y- touch electrode lines (Y- TEL) may include one or more Y-touch routing wires (Y-TLs) connected to each.

Referring to FIG. 8 , each of the plurality of X-touch electrode lines X-TEL includes a plurality of X-touch electrodes X-TE disposed in the same row (or column), and at least one electrically connecting them. An X-touch electrode connection line X-CL may be included. Here, the X-touch electrode connection wiring X-CL connecting the two adjacent X-touch electrodes X-TE may be a metal integrated with the two adjacent X-touch electrodes X-TE ( 8), it may be a metal connected to two adjacent X-touch electrodes X-TE through a contact hole.

Each of the plurality of Y-touch electrode lines Y-TEL includes a plurality of Y-touch electrodes Y-TE disposed in the same column (or row), and one or more Y-touch electrode connection wires electrically connecting them. (Y-CL). Here, the Y-touch electrode connection wiring Y-CL connecting the two adjacent Y-touch electrodes Y-TE may be a metal integrated with the two adjacent Y-touch electrodes Y-TE, It may be a metal connected to two adjacent Y-touch electrodes Y-TE through a contact hole (example of FIG. 8 ).

In the area where the X-touch electrode line (X-TEL) and the Y-touch electrode line (Y-TEL) intersect (touch electrode line intersection area), the X-touch electrode connection line (X-CL) and the Y-touch electrode The connection lines Y-CL may cross each other.

In this case, in the area where the X-touch electrode line (X-TEL) and the Y-touch electrode line (Y-TEL) intersect (the touch electrode line intersection area), the X-touch electrode connection line (X-CL) and the Y - The touch electrode connection wiring (Y-CL) may cross.

As such, in the touch electrode line crossing region, when the X-touch electrode connection wiring (X-CL) and the Y-touch electrode connection wiring (Y-CL) cross each other, the X-touch electrode connection wiring (X-CL) and The Y-touch electrode connection wiring Y-CL must be located on different layers.

Accordingly, in order to be arranged such that the plurality of X-touch electrode lines X-TEL and the plurality of Y-touch electrode lines Y-TEL cross each other, the plurality of X-touch electrodes X-TE, the plurality of X- Two touch electrode connection wiring (X-CL), multiple Y-touch electrodes (Y-TE), multiple Y-touch electrode lines (Y-TEL), and multiple Y-touch electrode connection wirings (Y-CL) It may be located on more than one floor. The X-touch electrode connection wiring may be referred to as a first touch electrode connection wiring, and the Y-touch electrode connection wiring may be referred to as a second touch electrode connection wiring.

Referring to FIG. 8 , each of the plurality of X-touch electrode lines X-TEL is electrically connected to the corresponding X-touch pad X-TP through one or more X-touch routing wires X-TL. That is, the X-touch electrode (X-TE) disposed at the outermost among the plurality of X-touch electrodes (X-TE) included in one X-touch electrode line (X-TEL) is the X-touch routing wiring ( X-TL) is electrically connected to the corresponding X-touch pad (X-TP).

Each of the plurality of Y-touch electrode lines (Y-TEL) is electrically connected to a corresponding Y-touch pad (Y-TP) through one or more Y-touch routing wires (Y-TL). That is, the Y-touch electrode (Y-TE) disposed at the outermost among the plurality of Y-touch electrodes (Y-TE) included in one Y-touch electrode line (Y-TEL) is the Y-touch routing wiring ( Y-TL) is electrically connected to the corresponding Y-touch pad (Y-TP).

Meanwhile, as shown in FIG. 8 , a plurality of X-touch electrode lines X-TEL and a plurality of Y-touch electrode lines Y-TEL may be disposed on the encapsulation unit ENCAP. That is, the plurality of X-touch electrodes X-TE and the plurality of X-touch electrode connection lines X-CL constituting the plurality of X-touch electrode lines X-TEL are formed on the encapsulation unit ENCAP. can be placed in A plurality of Y-touch electrodes Y-TE and a plurality of Y-touch electrode connection lines Y-CL constituting the plurality of Y-touch electrode lines Y-TEL are disposed on the encapsulation unit ENCAP can be

On the other hand, as shown in FIG. 8 , each of the plurality of X-touch routing wires (X-TL) electrically connected to the plurality of X-touch electrode lines (X-TEL) is encapsulated while disposed on the encapsulation unit (ENCAP). It may extend to a place where there is no ENCAP and may be electrically connected to a plurality of X-touch pads X-TP. Each of the plurality of Y-touch routing wires (Y-TL) electrically connected to the plurality of Y-touch electrode lines (Y-TEL) is disposed on the encapsulation unit (ENCAP) and extends to a place where there is no encapsulation unit (ENCAP). It may be electrically connected to a plurality of Y-touch pads Y-TP. Here, the encapsulation unit ENCAP may be located in the active area AA, and in some cases, may extend to the non-active area NA.

Meanwhile, as described above, in order to prevent a layer (eg, an encapsulation part in an organic light emitting display panel) in the active area AA from collapsing, the active area AA and the non-active area NA are formed. The dam area DA may exist in the non-active area NA that is a boundary area of , or an area outside the active area AA. That is, the dam DAM may function to prevent the organic material layer included in the encapsulation unit ENCAP from overflowing to the outside. Therefore, the dam DAM may be referred to as a blocking structure.

As shown in FIG. 8 , for example, a primary dam DAM1 and a secondary dam DAM2 may be disposed in the dam area DA. Here, the secondary dam DAM2 may be located more outside than the primary dam DAM1.

Unlike the example of FIG. 8 , only the primary dam DAM1 may be located in the dam area DA, and in some cases, the primary dam DAM1 and the secondary dam DAM2 as well as the primary dam DAM1 and the secondary dam DAM2 in the dam area DA. One or more additional dams may be further deployed.

Meanwhile, the encapsulation unit ENCAP may be positioned up to the upper portions of the primary dams DAM1 and the secondary dams DAM2 , and the covering member EC and its outer periphery.

9 is a partial cross-sectional view of a display panel DISP according to embodiments of the present invention, taken along line X-X′ of FIG. 8 .

A single-layer or multi-layered buffer layer BUF may be disposed on the substrate SUB. The substrate SUB may be formed of a flexible material. When the substrate SUB is formed of a material such as polyimide, the buffer layer BUF is formed of an inorganic material and an organic material to prevent damage to the light emitting device from impurities such as alkali ions leaking from the substrate SUB in a subsequent process. It may be formed as a single layer composed of any one of them. Alternatively, the buffer layer BUF may be formed of multiple layers formed of different inorganic materials. In addition, the buffer layer BUF may be formed as a multi-layer formed of an organic material layer and an inorganic material layer. The inorganic material layer may include any one of a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), and a silicon oxynitride layer (SiON). The organic material may include any one of polyimide, benzocyclobutene series resin, and polyacrylate. Examples of the polyacrylate may include photoacryl. A first transistor T1 serving as a driving transistor in each subpixel SP in the active area AA on the substrate SUB is disposed.

The first transistor T1 includes a first node electrode NE1 corresponding to a gate electrode, a second node electrode NE2 corresponding to a source electrode or a drain electrode, and a third node electrode NE1 corresponding to a drain electrode or a source electrode. NE3) and the semiconductor layer SEMI.

The first node electrode NE1 and the semiconductor layer SEMI may overlap with the gate insulating layer GI interposed therebetween. The second node electrode NE2 is formed on the interlayer insulating layer ILD to contact one side of the semiconductor layer SEMI, and the third node electrode NE3 is formed on the interlayer insulating layer ILD to form a semiconductor layer. (SEMI) can be in contact with the other side.

An insulating layer INS covering the second node electrode NE2 , the third node electrode NE3 , and the data line may be disposed. The insulating layer INS may be formed of a single layer made of an inorganic material or a multilayer made of different inorganic materials. For example, the insulating layer INS may be formed of a single layer of any one of a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), and a silicon oxynitride layer (SiON) or multiple layers thereof.

In addition, a planarization layer PLN may be disposed on the insulating layer INS. The planarization layer PLN serves to protect the lower structure while mitigating the step difference of the lower structure, and may be formed of an organic material layer. The organic material may include any one of polyimide, benzocyclobutene series resin, and polyacrylate. Examples of the polyacrylate may include photoacryl.

The light emitting element ED includes a first electrode E1 corresponding to an anode electrode (or a cathode electrode), a light emitting layer EL formed on the first electrode E1 , and a cathode electrode formed on the light emitting layer EL (or The second electrode E2 corresponding to the anode electrode) may be included.

The first electrode E1 is electrically connected to the second node electrode NE2 of the first transistor T1 exposed through the pixel contact hole penetrating the planarization layer PLN.

A bank BANK having an opening exposing the first electrode E1 may be formed on the planarization layer PLN. The opening of the bank BANK may be an area defining a light emitting area. The bank may be formed of an organic material such as polyimide, benzocyclobutene series resin, or polyacrylate. A spacer SPC may be formed on the bank BANK. The spacer SPC serves to prevent a mask for subsequent manufacturing of the light emitting stack EL from contacting the stack under the spacer SPC. The spacer SPC may be manufactured simultaneously with the bank BANK by using a half-tone mask when manufacturing the bank BANK. Accordingly, the spacer SPC may be formed of the same material as the bank BANK, and may be formed as one body with the bank BANK.

The above-described spacer SPC may be disposed anywhere above the bank BANK. For example, the spacer SPC may be disposed over the entire bank BANK, and in this case, the spacer SPC may be formed to be narrower than the width of the bank BANK. In addition, the spacer SPC is disposed on the bank BANK and may be formed to be wider than the width of the bank BANK. In this case, the spacer SPC may partially overlap the light emitting area. In addition, the spacer SPC may be disposed on some of the banks BANK. For example, the spacers SPC may be disposed in the entire bank BANK surrounding one subpixel, or may be disposed adjacent to each other with one subpixel interposed therebetween. Also, the spacers SPC may be disposed adjacent to each other with at least two or more sub-pixels therebetween.

The light emitting layer EL is formed on the first electrode E1 of the light emitting area provided by the bank BANK. The light emitting layer EL is formed by stacking the hole related layer, the light emitting layer, and the electron related layer on the first electrode E1 in the order or in the reverse order. The second electrode E2 is formed to face the first electrode E1 with the light emitting layer EL interposed therebetween.

The encapsulation unit ENCAP is a light emitting device ED that is vulnerable to external moisture or oxygen, and blocks the penetration of external moisture or oxygen.

The encapsulation unit ENCAP may be formed of one layer, but may also be formed of a plurality of layers PAS1 , PCL, and PAS2 as shown in FIG. 9 .

For example, when the encapsulation unit ENCAP consists of a plurality of layers PAS1, PCL, and PAS2, the encapsulation unit ENCAP includes one or more inorganic encapsulation layers PAS1 and PAS2 and one or more organic encapsulation layers PCL. may include As a specific example, the encapsulation unit ENCAP may have a structure in which the first inorganic encapsulation layer PAS1 , the organic encapsulation layer PCL, and the second inorganic encapsulation layer PAS2 are sequentially stacked.

Here, the organic encapsulation layer PCL may further include at least one organic encapsulation layer or at least one inorganic encapsulation layer.

The first inorganic encapsulation layer PAS1 is formed on the substrate SUB on which the second electrode E2 corresponding to the cathode electrode is formed to be closest to the light emitting device ED. The first inorganic encapsulation layer PAS1 is formed of, for example, an inorganic insulating material capable of low-temperature deposition, such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3). . Since the first inorganic encapsulation layer PAS1 is deposited in a low temperature atmosphere, the first inorganic encapsulation layer PAS1 may prevent the light emitting layer EL including an organic material vulnerable to a high temperature atmosphere from being damaged during the deposition process.

The organic encapsulation layer PCL may be formed to have a smaller area than the first inorganic encapsulation layer PAS1 . In this case, the organic encapsulation layer PCL is formed to expose both ends of the first inorganic encapsulation layer PAS1 . can be The organic encapsulation layer (PCL) serves as a buffer for relieving stress between layers due to bending of the touch screen-integrated light emitting display device, which is an organic light emitting display device, and may serve to enhance planarization performance. The organic encapsulation layer PCL may be formed of, for example, an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon oxycarbon (SiOC).

On the other hand, when the organic encapsulation layer PCL is formed through the inkjet method, a dam area corresponding to a boundary area between the non-active area NA and the active area AA or a partial area within the non-active area NA ( One or two or more dams DAM may be formed in DA).

As described above, since the dam DAM functions to prevent the organic encapsulation layer PCL included in the encapsulation unit ENCAP from overflowing to the outside, as the height of the dam DAM increases, the organic encapsulation layer PCL ) can be easy to control the overflow of. However, in the display device in which the touch panel is integrally formed inside the display panel (DISP) as in the embodiment of the present invention, a high step area such as an area in which a dam (DAM) of a lower layer is disposed when a touch electrode or a touch routing wiring is formed In this case, the thickness of the wiring is thinned or the possibility of a breakage is increased. Therefore, it may be important to adjust the height of the dam (DAM) to minimize the influence on the formation of the touch electrode or touch routing wiring. In order to reduce the step difference of the lower layer, the height of the dam DAM may be lowered and a plurality of dams may be disposed.

For example, as shown in FIG. 9 , in the dam area DA, a plurality of X-touch pads X-TP and a plurality of Y-touch pads Y-TP are formed in the non-active area NA. It is positioned between the pad area and the active area AA, and in the dam area DA, a primary dam DAM1 adjacent to the active area AA and a secondary dam DAM2 adjacent to the pad area may exist.

At least one dam DAM disposed in the dam area DA, when the liquid organic encapsulation layer PCL is dropped on the active area AA, the liquid organic encapsulation layer PCL is formed in the non-active area ( It can be prevented from collapsing in the direction of NA) and encroaching on the pad area.

This effect may be further increased when the primary dam DAM1 and the secondary dam DAM2 are provided, as shown in FIG. 9 .

The primary dam DAM1 and/or the secondary dam DAM2 may be formed in a single-layer or multi-layer structure. For example, the primary dam DAM1 and/or the secondary dam DAM2 may be simultaneously formed of the same material as at least one of the planarization layer PLN, the bank BANK, and the spacer SPC. In this case, the dam structure can be formed without an additional mask process and cost increase.

The covering member EC may be formed on the outer side of the dam DAM. As described above, on the upper portion of the substrate, the buffer layer BUF for protecting the light emitting device from impurities flowing out from the substrate SUB, the second node electrode NE2, and the third node electrode NE3 and the semiconductor layer SEMI. An inorganic layer such as the formed interlayer insulating layer (ILD), the second node electrode (NE2), the third node electrode (NE3), and the insulating layer (INS) covering the data line is formed, and the ends of the inorganic layer are damaged. Since it is fragile, the covering member EC covering the end of the inorganic membrane may be formed on the outside of the dam.

The encapsulation part ENCAP may extend to the outside of the covering member EC and may be formed in contact with the substrate SUB. The encapsulation unit ENCAP disposed on the outside of the covering member EC may include a crack prevention pattern CPP. For example, the encapsulation unit ENCAP disposed on the outside of the covering member EC may be the first inorganic encapsulation layer PAS1 or the second inorganic encapsulation layer PAS2 .

The crack prevention pattern CPP may include an opening CH passing through the encapsulation part ENCAP. That is, the crack prevention pattern CPP is formed by patterning the encapsulation unit ENCAP in order to prevent cracks in the encapsulation unit ENCAP from propagating toward the active area AA. (SUB) may be exposed to the outside. The crack prevention pattern CPP may be formed to surround the covering member EC. Although it is formed on the upper part, the left part, and the right part of the substrate SUB in FIG. 9 , the present invention is not limited thereto, and it may also be formed on the lower part of the substrate.

As shown in FIG. 9 , the primary dam DAM1 and/or the secondary dam DAM2 has a first inorganic encapsulation layer PAS1 and/or a second inorganic encapsulation layer PAS2 on the bank BANK. It may have a laminated structure.

In addition, as shown in FIG. 9 , the organic encapsulation layer PCL including the organic material may be positioned only on the inner side surface of the primary dam DAM1 .

Alternatively, the organic encapsulation layer PCL including an organic material may also be positioned on at least a portion of the primary dam DAM1 and the secondary dam DAM2. For example, the organic encapsulation layer PCL may be positioned on the primary dam DAM1.

The second inorganic encapsulation layer PAS2 may be formed on the substrate SUB on which the organic encapsulation layer PCL is formed to cover upper surfaces and side surfaces of the organic encapsulation layer PCL and the first inorganic encapsulation layer PAS1, respectively. have. The second inorganic encapsulation layer PAS2 minimizes or blocks external moisture or oxygen from penetrating into the first inorganic encapsulation layer PAS1 and the organic encapsulation layer PCL. The second inorganic encapsulation layer PAS2 is formed of, for example, an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3).

A touch buffer layer T-BUF may be disposed on the encapsulation unit ENCAP. The touch buffer layer T-BUF is formed of a touch sensor metal including X and Y-touch electrodes X-TE and Y-TE and X, Y-touch electrode connection wires X-CL and Y-CL, and , may be positioned between the second electrode E2 of the light emitting device ED.

The touch buffer layer T-BUF may be designed such that the separation distance between the touch sensor metal and the second electrode E2 of the light emitting device ED maintains a predetermined minimum separation distance (eg, 1 μm). Accordingly, it is possible to reduce or prevent the parasitic capacitance formed between the touch sensor metal and the second electrode E2 of the light emitting element ED, and through this, it is possible to prevent a decrease in touch sensitivity due to the parasitic capacitance.

Without the touch buffer layer T-BUF, the X, Y-touch electrodes X-TE, Y-TE and the X, Y-touch electrode connection wirings X-CL, Y- on the encapsulation unit ENCAP A touch sensor metal including CL) may be disposed.

In addition, the touch buffer film (T-BUF) is a chemical (developer or etchant, etc.) used in the manufacturing process of the touch sensor metal disposed on the touch buffer film (T-BUF) or moisture from the outside containing organic matter. Penetration into the light emitting layer EL may be blocked. Accordingly, the touch buffer layer T-BUF may prevent damage to the light emitting layer EL, which is vulnerable to chemical or moisture.

The touch buffer film (T-BUF) can be formed at a certain temperature (for example, at a low temperature of 100 degrees (℃ or less) It is formed of an organic insulating material For example, the touch buffer film T-BUF may be formed of an acrylic, epoxy, or siloxan-based material Touch buffer film having planarization performance made of an organic insulating material (T-BUF) is damage to each of the encapsulation layers PAS1, PCL, and PAS2 constituting the encapsulation ENCAP due to the bending of the organic light emitting display device and a touch sensor formed on the touch buffer layer T-BUF. It is possible to prevent metal cracking.

According to the mutual-capacitance-based touch sensor structure, an X-touch electrode line (X-TEL) and a Y-touch electrode line (Y-TEL) are disposed on the touch buffer layer T-BUF, and the X-touch electrode The line X-TEL and the Y-touch electrode line Y-TEL may be disposed to cross each other.

The Y-touch electrode line (Y-TEL) is a plurality of Y-touch electrode connection wirings electrically connecting the plurality of Y-touch electrodes (Y-TE) and the plurality of Y-touch electrodes (Y-TE). (Y-CL).

9 , the plurality of Y-touch electrodes Y-TE and the plurality of Y-touch electrode connection lines Y-CL are positioned on different layers with the touch insulating layer T-ILD interposed therebetween. can do. That is, after forming the touch insulating layer T-ILD on the plurality of Y-touch electrode connection lines Y-CL, through the contact hole of the touch insulating layer T-ILD, the upper plurality of Y-touch electrodes ( Y-TE) and a plurality of Y-touch electrode connection lines Y-CL may be connected.

The crack prevention pattern CPP included in the first inorganic encapsulation layer PAS1 or the second inorganic encapsulation layer PAS2 of the encapsulation unit ENCAP described above forms a contact hole in the touch insulating layer T-ILD. can be formed at the same time. That is, an additional mask is not required to form the crack prevention pattern CPP included in the first inorganic encapsulation layer PAS1 or the second inorganic encapsulation layer PAS2, and a contact hole is formed in the touch insulating layer T-ILD. The mask used when forming can be utilized.

The plurality of Y-touch electrodes Y-TE may be spaced apart from each other at regular intervals along the y-axis direction. Each of the plurality of Y-touch electrodes Y-TE may be electrically connected to another Y-touch electrode Y-TE adjacent in the y-axis direction through the Y-touch electrode connection line Y-CL.

The Y-touch electrode connection line Y-CL is formed on the touch buffer layer T-BUF, is exposed through a touch contact hole penetrating the touch insulating layer T-ILD, and is exposed through two Y-directions adjacent in the y-axis direction. It may be electrically connected to the touch electrode Y-TE.

The Y-touch electrode connection line Y-CL may be disposed to overlap the bank BANK. Accordingly, it is possible to prevent a decrease in the aperture ratio due to the Y-touch electrode connection line Y-CL.

The X-touch electrode line (X-TEL) is a plurality of X-touch electrode connection wirings electrically connecting the plurality of X-touch electrodes (X-TE) and the plurality of X-touch electrodes (X-TE) (X-CL).

The plurality of X-touch electrodes X-TE may be spaced apart from each other at regular intervals along the x-axis direction on the touch insulating layer T-ILD. Each of the plurality of X-touch electrodes X-TE may be electrically connected to another X-touch electrode X-TE adjacent in the x-axis direction through the X-touch electrode connection line X-CL.

The X-touch electrode connection wiring (X-CL) is disposed on the same plane as the X-touch electrode (X-TE) and is connected to the two X-touch electrodes (X-TE) adjacent in the x-axis direction without a separate contact hole. It may be electrically connected or may be integrated with two X-touch electrodes X-TE adjacent in the x-axis direction.

The X-touch electrode connection line X-CL may be disposed to overlap the bank BANK. Accordingly, it is possible to prevent a decrease in the aperture ratio due to the X-touch electrode connection line X-CL.

A plurality of X-touch electrodes X-TE and a plurality of Y-touch electrodes Y-TE may be formed on the touch insulating layer T-ILD through a mask process.

A plurality of Y-touch routing wires Y-TL connected to the plurality of Y-touch electrodes Y-TE may be disposed between the active area AA and the primary dam DAM1. The Y-touch electrode Y-TE may be electrically connected to the touch driving circuit TDC through the Y-touch routing line Y-TL and the Y-touch pad Y-TP.

A cover organic layer (C-PAC) is formed on the X-touch electrode and the Y-touch electrode and the X-touch routing wiring and the Y-touch routing wiring to prevent corrosion by external moisture.

For example, the cover organic layer (C-PAC) may be formed of an organic insulating material, a circularly polarizing plate, or a film of an epoxy or acrylic material.

The cover organic layer C-PAC may be formed on the above-described covering member EC. A touch buffer layer T-BUF and a touch insulating layer T-ILD may be disposed between the cover organic layer C-PAC and the covering member EC. The cover organic layer C-PAC may cover a part or all of the covering member EC. The touch buffer layer T-BUF and the touch insulating layer T-ILD may be formed to cover only a portion of the covering member EC.

Looking at the outer portion of the covering member EC with reference to FIG. 9 , the first inorganic encapsulation layer PAS1 and the second inorganic encapsulation layer PAS2 included in the encapsulation unit ENCAP are sequentially stacked on the substrate SUB. and can be placed.

The first inorganic encapsulation layer PAS1 and the second inorganic encapsulation layer PAS2 may include a crack prevention pattern CPP that minimizes propagation of cracks to the active area AA when cracks occur. can The crack prevention pattern CPP includes an opening CH penetrating the first inorganic encapsulation layer PAS1 and/or the second inorganic encapsulation layer PAS2 and may expose the upper surface of the substrate to the outside. The opening CH may be formed in at least three corners of the substrate parallel to the covering member EC. Accordingly, even when a crack occurs in the first inorganic encapsulation layer PAS1 and/or the second inorganic encapsulation layer PAS2 , the crack may be cut off by the crack prevention pattern CPP. Therefore, it is possible to minimize the penetration of external moisture or oxygen into the light emitting element (ED), which is vulnerable to external moisture or oxygen, thereby providing a highly reliable display device.

A touch screen-integrated light emitting display device according to embodiments of the present invention may be described as follows.

A touch screen-integrated light emitting display device according to an embodiment of the present invention includes a substrate having a display area on which a plurality of pixels are disposed and a non-display area around the display area. At least one inorganic insulating layer may be disposed on the substrate. A dam disposed in the non-display area and configured to surround the display area may be included. It may include a covering member disposed in the non-display area, spaced apart from the dam, and covering the end of the inorganic insulating layer. It may include an encapsulation unit covering the display area and the non-display area and including the first inorganic encapsulation layer, the second inorganic encapsulation layer, and the organic encapsulation layer. The encapsulation part may extend to the outside of the covering member to contact the substrate and include a crack prevention pattern.

For example, it may further include a first touch electrode disposed on the encapsulation unit and extending in a first direction and a second touch electrode extending in a second direction. A cover organic layer formed on the first and second touch electrodes and covering the first and second touch electrodes may be further included.

In addition, the cover organic layer may be formed to cover the covering member. A touch insulating layer may be disposed between the covering member and the cover organic layer.

And the encapsulation unit in contact with the substrate may be the first inorganic encapsulation layer or the second inorganic encapsulation layer. The crack prevention pattern may include an opening penetrating the encapsulation part. The opening may surround the covering member and there may be at least one opening. The anti-crack pattern may be disposed on at least three corners of the substrate.

Although the embodiments of the present specification have been described in detail with reference to the accompanying drawings, the present specification is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit thereof. Accordingly, the embodiments disclosed in the present specification are for explanation rather than limiting the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. Each of the features of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and may be technically variously linked and operated by those skilled in the art, and each of the embodiments may be implemented independently of each other or together in a related relationship. may be carried out. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

AA: active area
NA: non-active area
SUB: Substrate
ED: light emitting element
DAM: Dam, blocking structure
ENCAP: Encapsulation
BANK: bank
SPC: Spacer
X-TEL: X-touch electrode line
X-TE: X-touch electrode
X-CL: X-touch electrode connection wiring
X-TL: X-Touch Routing Wiring
T-BUF: Touch Buffer Film
T-ILD: Touch Insulation Film
EC: cladding member
CH: opening
CPP: crack prevention pattern
C-PAC: cover organic layer

Claims (9)

a substrate having a display area in which a plurality of display pixels are disposed and a non-display area around the display area;
at least one inorganic insulating layer disposed on the substrate;
a dam disposed in the non-display area and configured to surround the display area;
a covering member disposed in the non-display area, spaced apart from the dam, and covering an end of the inorganic insulating layer;
an encapsulation unit covering the display area and the non-display area and comprising a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer;
and the encapsulation part extends outside the covering member, contacts the substrate, and includes a crack preventing pattern. According to claim 1,
The light emitting display device further comprising: a first touch electrode disposed on the encapsulation part and extending in a first direction and a second touch electrode extending in a second direction. 3. The method of claim 2,
The light emitting display device further comprising a cover organic layer covering the first touch electrode and the second touch electrode. 4. The method of claim 3,
The cover organic layer covers the covering member. 5. The method of claim 4,
The light emitting display device further comprising a touch insulating layer positioned between the covering member and the cover organic layer. According to claim 1,
The encapsulation unit in contact with the substrate is the first inorganic encapsulation layer or the second inorganic encapsulation layer. 7. The method of claim 6,
The crack prevention pattern includes an opening penetrating the encapsulation part. 8. The method of claim 7,
The opening surrounds the covering member and includes at least one light emitting display device. 9. The method of claim 8,
The anti-crack pattern is disposed on at least three corners of the substrate.

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