KR20210081701A - Light emitting display device with integrated touch screen - Google Patents

Abstract

A light emitting display device integrated with a touch screen in accordance with an embodiment of the present invention may comprise: a substrate having an active region and an inactive region, wherein, in the active region, an opening region penetrating the substrate and a functional layer of the upper part thereof, a pixel region on which a plurality of display pixels are arranged, and a boundary region between the opening region and the pixel region are included; an encapsulation unit covering the pixel region and the boundary region, wherein on the encapsulation unit, a plurality of first touch electrodes extended in a first direction and a plurality of second touch electrodes extended in a second direction may be arranged; a second touch electrode connecting wire electrically connecting two adjacent touch electrodes among the plurality of second touch electrodes; a contact link connecting the second touch electrodes to the second touch electrode connecting wire; and a first touch electrode connecting wire electrically connecting two adjacent touch electrodes among the plurality of first touch electrodes, wherein the second touch electrode connecting wire is arranged on the boundary region for connecting two second touch electrodes with the opening region disposed therebetween and is capable of bypassing the opening region to connect the two second touch electrodes with the opening region disposed therebetween. The present invention can easily arrange the touch electrode connecting wire for touch sensing around a hole.

Description

Touch screen integrated light emitting display device {LIGHT EMITTING DISPLAY DEVICE WITH INTEGRATED TOUCH SCREEN}

The present specification relates to a touch screen-integrated light emitting display device.

As the information society develops, the demand for a display device for displaying an image is increasing, and various types of display devices such as a liquid crystal display device and an organic light emitting display device are utilized.

The display device may recognize a user's touch on the display panel and perform input processing based on the recognized touch in order to provide more various functions to the user. For example, a plurality of touch electrodes may be disposed in the active area of the display panel. In addition, the display device may sense the touch by detecting a change in capacitance of the touch electrode that is generated due to the user's touch.

The active area of the display panel in which the touch electrodes are disposed may have various shapes, and in some cases, an area in which a module such as a camera sensor or a proximity sensor is disposed may be located in the active area. In addition, an area in which the sensor is disposed may be disposed in the form of a hole in the active area.

As such, when a hole in which a sensor or the like is disposed is located in the active area, a portion of the touch electrode disposed in the peripheral area of the hole or a wiring for connecting the touch electrode may have to pass through the area in which the hole is disposed. . Accordingly, there may be many difficulties in arranging the touch electrode or wiring for connecting the touch electrode in the peripheral area of the hole located in the active area.

Embodiments of the present invention provide a method for easily disposing electrodes and wires for touch sensing in a structure in which a hole is located in an active area of a display panel.

The tasks of the present specification are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the object as described above, the touch screen-integrated light emitting display device according to an embodiment of the present invention may include a substrate having an active region and an inactive region. The active region may include an opening region penetrating the substrate and the functional layer thereon, a pixel region in which a plurality of display pixels are disposed, and a boundary region between the opening region and the pixel region. The encapsulation unit may cover the pixel area and the boundary area, and a plurality of first touch electrodes extending in the first direction and a plurality of second touch electrodes extending in the second direction may be disposed on the encapsulation unit. It may include a second touch electrode connection line electrically connecting two adjacent touch electrodes among the plurality of second touch electrodes, and a contact link connecting the second touch electrode and the second touch electrode connection line. a first touch electrode connecting line electrically connecting two adjacent touch electrodes among the plurality of first touch electrodes, wherein the second touch electrode connecting line is configured to connect two second touch electrodes with an opening area therebetween The two second touch electrodes are disposed in the boundary region to bypass the opening region and connect the two second touch electrodes with the opening region therebetween.

The details of other embodiments are included in the detailed description and drawings.

According to embodiments of the present invention, in a structure in which one or more holes are located in an active area of a display panel, a wire connecting a touch electrode is disposed in a boundary area between a hole and a pixel area to perform touch sensing in a peripheral area of the hole. The electrode connection wiring can be easily arranged.

In addition, by disposing a plurality of touch electrode connection wires to bypass the outside of the opening area in different directions, even if one part is cut off, the touch signal may be transmitted through the other.

Since the content of the invention described in the problems to be solved above, the means for solving the problems, and the effects do not specify the essential characteristics of the claims, the scope of the claims is not limited by the matters described in the content of the invention.

1 is a diagram illustrating a schematic configuration of a touch screen-integrated light emitting display device according to embodiments of the present invention.
2 is a diagram schematically illustrating a display panel of a touch screen-integrated light emitting display device according to embodiments of the present invention.
3 is a view exemplarily illustrating a structure in which a touch panel is embedded in a display panel according to embodiments of the present invention.
4 and 5 are views exemplarily showing types of touch electrodes disposed on a display panel according to embodiments of the present invention.
FIG. 6 is a diagram exemplarily illustrating the mesh-type touch electrode of FIG. 5 .
7 is a diagram schematically illustrating a structure of a touch sensor in a display panel according to embodiments of the present invention.
FIG. 8 is an exemplary implementation diagram of the structure of the touch sensor of FIG. 7 .
9 is a partial cross-sectional view of a display panel according to embodiments of the present invention, and is a view showing an example of a cross-sectional structure of a portion XX′ shown in FIG. 8 .
10 to 11 are diagrams exemplarily showing a cross-sectional structure in a case in which a color filter is included in a display panel according to embodiments of the present invention.
12 is a diagram illustrating an example of a structure in which holes are disposed in an active area of a display panel according to embodiments of the present invention.
13 is a plan view illustrating a touch screen-integrated light emitting display device according to an exemplary embodiment of the present specification.
FIG. 14 is a view showing a cross section taken along line I-I' in FIG. 13 .
FIG. 15 is a view showing a cross-section taken along II-II′ of FIG. 13 .

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are exemplary, and thus the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is interpreted as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between the two parts unless 'directly' is used.

Reference to a device or layer “on” another device or layer includes any intervening layer or other device directly on or in the middle of another device.

Although first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Like reference numerals refer to like elements throughout.

The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated component.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and technically various interlocking and driving are possible, as will be fully understood by those skilled in the art, and each embodiment may be independently implemented with respect to each other, It may be possible to implement together in a related relationship.

Hereinafter, an embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a system configuration diagram of a touch screen-integrated light emitting display device according to embodiments of the present invention.

Referring to FIG. 1 , a touch screen-integrated light emitting display device according to embodiments of the present invention may provide both a function for displaying an image and a function for sensing a touch.

In order to provide an image display function, the touch screen-integrated light emitting display device according to the embodiments of the present invention includes a plurality of data lines and a plurality of gate lines, and a plurality of data lines and a plurality of gate lines defined by the plurality of gate lines a display panel DISP in which subpixels are arranged, a data driving circuit DDC driving a plurality of data lines, a gate driving circuit GDC driving a plurality of gate lines, a data driving circuit DDC, and It may include a display controller DCTR that controls the operation of the gate driving circuit GDC.

Each of the data driving circuit DDC, the gate driving circuit GDC, and the display controller DCTR may be implemented as one or more individual components. In some cases, two or more of the data driving circuit DDC, the gate driving circuit GDC, and the display controller DCTR may be integrated and implemented as one component. For example, the data driving circuit DDC and the display controller DCTR may be implemented as one integrated circuit chip (IC Chip).

In order to provide a touch sensing function, a touch screen-integrated light emitting display device according to embodiments of the present invention supplies a touch driving signal to a touch panel (TSP) including a plurality of touch electrodes and the touch panel (TSP); and a touch sensing circuit TSC for detecting a touch sensing signal from the touch panel TSP and sensing the presence or absence of a user's touch or a touch position (touch coordinates) on the touch panel TSP based on the detected touch sensing signal. can

The touch sensing circuit TSC includes, for example, a touch driving circuit TDC that supplies a touch driving signal to the touch panel TSP and detects a touch sensing signal from the touch panel TSP, and the touch driving circuit TDC. It may include a touch controller TCTR that senses the presence and/or touch position of the user on the touch panel TSP based on the touch sensing signal detected by the touch panel TSP.

The touch driving circuit TDC may include a first circuit part for supplying a touch driving signal to the touch panel TSP and a second circuit part for detecting a touch sensing signal from the touch panel TSP.

The touch driving circuit TDC and the touch controller TCTR may be implemented as separate components, or may be integrated into one component in some cases.

Meanwhile, each of the data driving circuit DDC, the gate driving circuit GDC, and the touch driving circuit TDC may be implemented as one or more integrated circuits, and in terms of electrical connection with the display panel DISP, COG (Chip On) Glass) type, COF (Chip On Film) type, or TCP (Tape Carrier Package) type may be implemented, and the gate driving circuit (GDC) may also be implemented as a GIP (Gate In Panel) type.

Meanwhile, each of the circuit components DDC, GDC, and DCTR for driving the display and the circuit components TDC and TCTR for the touch sensing may be implemented with one or more individual components. In some cases, one or more of the circuit components DDC, GDC, and DCTR for driving the display and one or more of the circuit components TDC and TCTR for touch sensing may be functionally integrated and implemented as one or more components.

For example, the data driving circuit DDC and the touch driving circuit TDC may be integrated into one or two or more integrated circuit chips. When the data driving circuit DDC and the touch driving circuit TDC are integrated into two or more integrated circuit chips, each of the two or more integrated circuit chips may have a data driving function and a touch driving function.

Meanwhile, the touch screen-integrated light emitting display device according to embodiments of the present invention may be of various types such as an organic light emitting display device and a liquid crystal display device. Hereinafter, for convenience of description, the touch screen-integrated light emitting display device will be described as an organic light emitting display device as an example. That is, the display panel DISP may be of various types such as an organic light emitting display panel, a liquid crystal display panel, and the like. Hereinafter, for convenience of description, the display panel DISP will be described as an organic light emitting display panel.

Meanwhile, as will be described later, the touch panel TSP includes a plurality of touch electrodes to which a touch driving signal may be applied or a touch sensing signal to be detected, and a plurality of touch electrodes for connecting the plurality of touch electrodes to the touch driving circuit TDC. may include touch routing wiring and the like.

The touch panel TSP may exist outside the display panel DISP. That is, the touch panel TSP and the display panel DISP may be separately manufactured and combined. Such a touch panel TSP is called an external type or an add-on type.

Alternatively, the touch panel TSP may be built into the display panel DISP. That is, when manufacturing the display panel (DISP), a touch sensor structure such as a plurality of touch electrodes and a plurality of touch routing wires constituting the touch panel (TSP) may be formed together with electrodes and signal lines for driving the display. have. Such a touch panel (TSP) is called a built-in type. Hereinafter, for convenience of description, a case in which the touch panel TSP is a built-in type will be described as an example.

2 is a diagram schematically illustrating a display panel DISP of a touch screen-integrated light emitting display device according to embodiments of the present invention.

Referring to FIG. 2 , the display panel DISP may include an active area AA in which an image is displayed and a non-active area NA that is an outer area of the outer boundary line BL of the active area AA. have.

In the active area AA of the display panel DISP, a plurality of subpixels for image display are arranged, and various electrodes or signal lines for driving the display are arranged.

Also, in the active area AA of the display panel DISP, a plurality of touch electrodes for touch sensing and a plurality of touch routing wires electrically connected thereto may be disposed. Accordingly, the active area AA may also be referred to as a touch sensing area in which touch sensing is possible.

In the non-active area NA of the display panel DISP, various signal lines disposed in the active area AA are extended link lines or links electrically connected to various signal lines disposed in the active area AA. Lines and pads electrically connected to these link lines may be disposed. The pads disposed in the non-active area NA may be bonded to or electrically connected to a display driving circuit (DDC, GDC, etc.).

In addition, in the non-active area NA of the display panel DISP, a plurality of touch routing wires disposed in the active area AA are extended link lines or a plurality of touch routing wires disposed in the active area AA. Link lines electrically connected to and pads electrically connected to the link lines may be disposed. The pads disposed in the non-active area NA may be bonded to or electrically connected to the touch driving circuit TDC.

In the non-active area NA, a portion in which a part of the outermost touch electrode is extended among the plurality of touch electrodes disposed in the active area AA may be present, and the plurality of touch electrodes disposed in the active area AA and One or more electrodes (touch electrodes) of the same material may be further disposed.

That is, the plurality of touch electrodes disposed on the display panel DISP are all present in the active area AA, or some of the plurality of touch electrodes disposed on the display panel DISP (eg, the outermost touch electrode) are non- Some of the plurality of touch electrodes present in the active area NA or disposed on the display panel DISP (eg, an outermost touch electrode) may span the active area AA and the non-active area NA. .

Meanwhile, referring to FIG. 2 , the display panel DISP of the touch screen-integrated light emitting display device according to the embodiments of the present invention includes any layer (eg, encapsulation in the organic light emitting display panel) in the active area AA. part) may include a dam area DA in which a dam DAM for preventing collapsing is disposed.

The dam area DA may be located at a boundary point between the active area AA and the non-active area NA or at any one point of the non-active area NA that is an outer area of the active area AA.

The dams disposed in the dam area DA are disposed to surround all directions of the active area AA, or only outside one or two or more portions of the active area AA (eg, a portion with a fragile layer). may be placed.

The dams disposed in the dam area DA may be formed of one pattern that is all connected or two or more patterns that are disconnected. Also, in the dam area DA, only a primary dam may be disposed, two dams (a primary dam, a secondary dam) may be disposed, and three or more dams may be disposed.

In the dam area DA, there may be only the primary dam in one direction, and both the primary dam and the secondary dam may be present in the other direction.

3 is a diagram exemplarily illustrating a structure in which a touch panel TSP is embedded in a display panel DISP according to embodiments of the present invention.

Referring to FIG. 3 , in the active area AA of the display panel DISP, a plurality of sub-pixels SP are arranged on the substrate SUB.

Each subpixel SP includes a light emitting element ED, a first transistor T1 for driving the light emitting element ED, and a data voltage VDATA to a first node N1 of the first transistor T1. ) may include a second transistor T2 for transferring the voltage, a storage capacitor Cst for maintaining a constant voltage for one frame, and the like.

The first transistor T1 has a driving voltage from a first node N1 to which the data voltage VDATA may be applied, a second node N2 electrically connected to the light emitting device ED, and a driving voltage line DVL. It may include a third node N3 to which VDD is applied. The first node N1 may be a gate node, the second node N2 may be a source node or a drain node, and the third node N3 may be a drain node or a source node. The first transistor T1 is also referred to as a driving transistor for driving the light emitting device ED.

The light emitting device ED may include a first electrode (eg, an anode electrode), a light emitting layer, and a second electrode (eg, a cathode electrode). The first electrode may be electrically connected to the second node N2 of the first transistor T1 , and a ground voltage VSS may be applied to the second electrode.

In such a light emitting device ED, the emission layer may be an organic emission layer including an organic material. In this case, the light emitting device ED may be an organic light emitting diode (OLED).

On-off of the second transistor T2 is controlled by the scan signal SCAN applied through the gate line GL, and includes the first node N1 and the data line DL of the first transistor T1 . may be electrically connected between them. This second transistor T2 is also referred to as a switching transistor.

When the second transistor T2 is turned on by the scan signal SCAN, it transfers the data voltage VDATA supplied from the data line DL to the first node N1 of the first transistor T1 .

The storage capacitor Cst may be electrically connected between the first node N1 and the second node N2 of the first transistor T1 .

Each sub-pixel SP may have a 2T1C structure including two transistors T1 and T2 and one capacitor Cst as shown in FIG. 3 , and in some cases, further include one or more transistors Alternatively, it may further include one or more capacitors.

The storage capacitor Cst is not a parasitic capacitor (eg, Cgs, Cgd) which is an internal capacitor that may exist between the first node N1 and the second node N2 of the first transistor T1 . , may be an external capacitor intentionally designed outside the first transistor T1 .

Each of the first transistor T1 and the second transistor T2 may be an n-type transistor or a p-type transistor.

Meanwhile, as described above, circuit elements such as a light emitting element ED, two or more transistors T1 and T2 and one or more capacitors Cst are disposed in the display panel DISP. Since such a circuit element (especially, the light emitting element ED) is vulnerable to external moisture or oxygen, an encapsulation unit ( ENCAP) may be disposed on the display panel DISP.

The encapsulation unit ENCAP may be formed of one layer or a plurality of layers.

Meanwhile, in the touch screen-integrated light emitting display device according to the embodiments of the present invention, the touch panel TSP may be formed on the encapsulation unit ENCAP.

That is, in the touch screen-integrated light emitting display device, a touch sensor structure such as a plurality of touch electrodes TE constituting the touch panel TSP may be disposed on the encapsulation unit ENCAP.

During touch sensing, a touch driving signal or a touch sensing signal may be applied to the touch electrode TE. Accordingly, during touch sensing, a potential difference is formed between the touch electrode TE and the cathode electrode disposed with the encapsulation unit ENCAP interposed therebetween, so that unnecessary parasitic capacitance may be formed. Since such parasitic capacitance may reduce touch sensitivity, in order to reduce the parasitic capacitance, the distance between the touch electrode (TE) and the cathode electrode is set to a predetermined value (eg, 1) in consideration of panel thickness, panel manufacturing process, and display performance. μm) or larger. To this end, as an example, the thickness of the encapsulation unit ENCAP may be designed to be at least 1 μm.

4 and 5 are diagrams exemplarily showing types of touch electrodes TE disposed on a display panel DISP according to embodiments of the present invention.

As shown in FIG. 4 , each touch electrode TE disposed on the display panel DISP may be a plate-shaped electrode metal without a hole. In this case, each touch electrode TE may be a transparent electrode. That is, each touch electrode TE may be made of a transparent electrode material so that light emitted from the plurality of sub-pixels SP disposed below may be transmitted upward.

Alternatively, as shown in FIG. 5 , each touch electrode TE disposed on the display panel DISP may be an electrode metal EM patterned in a mesh type and having two or more holes. .

The electrode metal EM is a portion corresponding to the actual touch electrode TE, and is a portion to which a touch driving signal is applied or a touch sensing signal is sensed.

As shown in FIG. 5 , when each touch electrode TE is an electrode metal EM patterned in a mesh type, two or more holes may exist in an area of the touch electrode TE.

Each of the two or more holes present in each touch electrode TE may correspond to the emission area of the one or more subpixels SP. That is, the plurality of holes are paths through which light emitted from the plurality of sub-pixels SP disposed below pass upward. Hereinafter, for convenience of description, it will be described that each touch electrode TE is a mesh-type electrode metal EM as an example.

The electrode metal EM corresponding to each touch electrode TE may be positioned on a bank disposed in an area other than the light emitting area of the two or more subpixels SP.

On the other hand, as a method of forming a plurality of touch electrodes TE, the electrode metal EM is widely formed in a mesh type, and then the electrode metal EM is cut in a predetermined pattern to electrically separate the electrode metal EM. , it is possible to make several touch electrodes TE.

The outline shape of the touch electrode TE may be a square shape such as a diamond shape or a rhombus, as shown in FIGS. 4 and 5 , or various shapes such as a triangle, a pentagon, or a hexagon.

FIG. 6 is a diagram exemplarily illustrating the mesh-type touch electrode TE of FIG. 5 .

Referring to FIG. 6 , in the region of each touch electrode TE, one or more dummy metals DM that are disconnected from the mesh-type electrode metal EM may exist.

The electrode metal EM is a portion corresponding to the actual touch electrode TE and is a portion to which a touch driving signal is applied or a touch sensing signal is sensed. However, the dummy metal DM is present in the area of the touch electrode TE. A portion to which a touch driving signal is not applied and a touch sensing signal is not sensed. That is, the dummy metal DM may be an electrically floating metal.

Accordingly, the electrode metal EM may be electrically connected to the touch driving circuit TDC, but the dummy metal DM is not electrically connected to the touch driving circuit TDC.

In each area of all of the touch electrodes TE, one or more dummy metals DM may exist in a state in which they are disconnected from the electrode metals EM.

Alternatively, one or more dummy metals DM may exist in a state in which they are cut off from the electrode metal EM only in a region of each touch electrode TE of a portion of all the touch electrodes TE. That is, the dummy metal DM may not exist in a portion of the touch electrode TE.

Meanwhile, in relation to the role of the dummy metal DM, as shown in FIG. 5 , one or more dummy metals DM do not exist in the area of the touch electrode TE, and only the electrode metal EM exists in a mesh type. In this case, a visibility issue in which the outline of the electrode metal EM is visible on the screen may occur.

In contrast, as shown in FIG. 6 , when one or more dummy metals DM are present in the area of the touch electrode TE, a visibility issue in which the outline of the electrode metal EM is visible on the screen may be prevented. .

In addition, by adjusting the presence or the number (dummy metal ratio) of the dummy metal DM for each touch electrode TE, the capacitance may be adjusted for each touch electrode TE to improve touch sensitivity.

Meanwhile, by cutting some points in the electrode metal EM formed in the region of one touch electrode TE, the cut electrode metal EM may be formed as the dummy metal DM. That is, the electrode metal EM and the dummy metal DM may be formed of the same material on the same layer.

Meanwhile, the touch screen-integrated light emitting display device according to embodiments of the present invention may sense a touch based on capacitance formed in the touch electrode TE.

The touch screen-integrated light emitting display device according to the embodiments of the present invention is a capacitance-based touch sensing method, and may sense a touch using a mutual-capacitance-based touch sensing method, and may include a self-capacitance method. -capacitance)-based touch sensing method may be used to sense a touch.

In the case of the mutual-capacitance-based touch sensing method, the plurality of touch electrodes TE include a driving touch electrode (transmitting touch electrode) to which a touch driving signal is applied, and a touch sensing signal to form a capacitance with the driving touch electrode. It may be classified as a sensing touch electrode (receiving touch electrode).

In the case of such a mutual-capacitance-based touch sensing method, the touch sensing circuit (TSC) determines the presence and absence of touch based on a change in capacitance (mutual-capacitance) between the driving touch electrode and the sensing touch electrode according to the presence or absence of a pointer such as a finger or pen. / or sense the touch coordinates and the like.

In the case of the self-capacitance-based touch sensing method, each touch electrode TE functions as both a driving touch electrode and a sensing touch electrode. That is, the touch sensing circuit TSC applies a touch driving signal to one or more touch electrodes TE, detects the touch sensing signal through the touch electrode TE to which the touch driving signal is applied, and receives the detected touch sensing signal. Based on the change in capacitance between a pointer such as a finger or a pen and the touch electrode TE, the presence or absence of a touch and/or touch coordinates are sensed. In the self-capacitance-based touch sensing method, there is no distinction between the driving touch electrode and the sensing touch electrode.

As such, the touch screen-integrated light emitting display device according to embodiments of the present invention may sense a touch using a mutual-capacitance-based touch sensing method, or may sense a touch using a self-capacitance-based touch sensing method. . However, hereinafter, for convenience of description, the touch screen-integrated light emitting display device performs mutual-capacitance-based touch sensing and has a touch sensor structure for this as an example.

7 is a diagram schematically illustrating a structure of a touch sensor in a display panel DISP according to embodiments of the present invention, and FIG. 8 is an exemplary implementation diagram of the structure of the touch sensor of FIG. 7 .

Referring to FIG. 7 , a touch sensor structure for mutual-capacitance-based touch sensing may include a plurality of X-touch electrode lines (X-TEL) and a plurality of Y-touch electrode lines (Y-TEL). . Here, the plurality of X-touch electrode lines X-TEL and the plurality of Y-touch electrode lines Y-TEL are positioned on the encapsulation unit ENCAP. The X-touch electrode line may be referred to as a first touch electrode line, and the Y-touch electrode line may be referred to as a second touch electrode line.

Each of the plurality of X-touch electrode lines X-TEL may be disposed in a first direction, and each of the plurality of Y-touch electrode lines Y-TEL may be disposed in a second direction different from the first direction.

In the present specification, the first direction and the second direction may be relatively different from each other. For example, the first direction may be an x-axis direction and the second direction may be a y-axis direction. Conversely, the first direction may be a y-axis direction and the second direction may be an x-axis direction. In addition, the first direction and the second direction may be orthogonal to each other, but may not be orthogonal to each other. In addition, in this specification, a row and a column are relative, and a row and a column may change according to a viewing point of view.

Each of the plurality of X-touch electrode lines X-TEL may include a plurality of X-touch electrodes X-TE that are electrically connected. Each of the plurality of Y-touch electrode lines Y-TEL may include a plurality of Y-touch electrodes Y-TE that are electrically connected. The X-touch electrode may be referred to as a first touch electrode, and the Y-touch electrode may be referred to as a second touch electrode.

Here, the plurality of X-touch electrodes X-TE and the plurality of Y-touch electrodes Y-TE are electrodes included in the plurality of touch electrodes TE and whose roles (functions) are distinguished.

For example, the plurality of X-touch electrodes X-TE constituting each of the plurality of X-touch electrode lines X-TEL are driving touch electrodes, and each of the plurality of Y-touch electrode lines Y-TEL is configured. The plurality of Y-touch electrodes Y-TE may be sensing touch electrodes. In this case, each of the plurality of X-touch electrode lines X-TEL corresponds to a driving touch electrode line, and each of the plurality of Y-touch electrode lines Y-TEL corresponds to a sensing touch electrode line.

On the contrary, the plurality of X-touch electrodes X-TE constituting each of the plurality of X-touch electrode lines X-TEL are sensing touch electrodes, and each of the plurality of Y-touch electrode lines Y-TEL is connected to each other. The plurality of Y-touch electrodes Y-TE constituting it may be a driving touch electrode. In this case, each of the plurality of X-touch electrode lines X-TEL corresponds to a sensing touch electrode line, and each of the plurality of Y-touch electrode lines Y-TEL corresponds to a driving touch electrode line.

The touch sensor metal for touch sensing may include a plurality of touch routing wires TL in addition to a plurality of X-touch electrode lines (X-TEL) and a plurality of Y-touch electrode lines (Y-TEL).

A plurality of touch routing wiring (TL), one or more X-touch routing wiring (X-TL) connected to each of the plurality of X-touch electrode lines (X-TEL), and a plurality of Y- touch electrode lines (Y- TEL) and one or more Y-touch routing wires (Y-TLs) connected to each.

Referring to FIG. 8 , each of the plurality of X-touch electrode lines X-TEL includes a plurality of X-touch electrodes X-TE disposed in the same row (or column), and at least one electrically connecting them. An X-touch electrode connection line X-CL may be included. Here, the X-touch electrode connection wiring X-CL connecting the two adjacent X-touch electrodes X-TE may be a metal integrated with the two adjacent X-touch electrodes X-TE ( 8), it may be a metal connected to two adjacent X-touch electrodes X-TE through a contact hole.

Each of the plurality of Y-touch electrode lines Y-TEL includes a plurality of Y-touch electrodes Y-TE disposed in the same column (or row), and one or more Y-touch electrode connection wires electrically connecting them. (Y-CL). Here, the Y-touch electrode connection wiring Y-CL connecting the two adjacent Y-touch electrodes Y-TE may be a metal integrated with the two adjacent Y-touch electrodes Y-TE, It may be a metal connected to two adjacent Y-touch electrodes Y-TE through a contact hole (example of FIG. 8 ).

In the area where the X-touch electrode line (X-TEL) and the Y-touch electrode line (Y-TEL) intersect (touch electrode line intersection area), the X-touch electrode connection line (X-CL) and the Y-touch electrode The connection lines Y-CL may cross each other.

In this case, in the region where the X-touch electrode line (X-TEL) and the Y-touch electrode line (Y-TEL) intersect (the touch electrode line crossing region), the X-touch electrode connection line (X-CL) and the Y - The touch electrode connection wiring (Y-CL) may be crossed.

As such, when the X-touch electrode connection wiring (X-CL) and the Y-touch electrode connection wiring (Y-CL) cross in the touch electrode line crossing region, the X-touch electrode connection wiring (X-CL) and The Y-touch electrode connection wiring (Y-CL) must be located on different layers.

Accordingly, in order to be arranged such that the plurality of X-touch electrode lines X-TEL and the plurality of Y-touch electrode lines Y-TEL cross each other, the plurality of X-touch electrodes X-TE, the plurality of X- The touch electrode connection wiring (X-CL), the multiple Y-touch electrodes (Y-TE), the multiple Y-touch electrode lines (Y-TEL), and the multiple Y-touch electrode connection wirings (Y-CL) are two It may be located on more than one floor. The X-touch electrode connection wiring may be referred to as a first touch electrode connection wiring, and the Y-touch electrode connection wiring may be referred to as a second touch electrode connection wiring.

Referring to FIG. 8 , each of the plurality of X-touch electrode lines X-TEL is electrically connected to the corresponding X-touch pad X-TP through one or more X-touch routing wires X-TL. That is, the X-touch electrode (X-TE) disposed at the outermost of the plurality of X-touch electrodes (X-TE) included in one X-touch electrode line (X-TEL) is the X-touch routing wiring ( X-TL) is electrically connected to the corresponding X-touch pad (X-TP).

Each of the plurality of Y-touch electrode lines (Y-TEL) is electrically connected to a corresponding Y-touch pad (Y-TP) through one or more Y-touch routing wires (Y-TL). That is, the Y-touch electrode (Y-TE) disposed at the outermost among the plurality of Y-touch electrodes (Y-TE) included in one Y-touch electrode line (Y-TEL) is the Y-touch routing wiring ( Y-TL) is electrically connected to the corresponding Y-touch pad (Y-TP).

Meanwhile, as shown in FIG. 8 , a plurality of X-touch electrode lines X-TEL and a plurality of Y-touch electrode lines Y-TEL may be disposed on the encapsulation unit ENCAP. That is, the plurality of X-touch electrodes X-TE and the plurality of X-touch electrode connection lines X-CL constituting the plurality of X-touch electrode lines X-TEL are formed on the encapsulation unit ENCAP. can be placed in The plurality of Y-touch electrodes Y-TE and the plurality of Y-touch electrode connection lines Y-CL constituting the plurality of Y-touch electrode lines Y-TEL are disposed on the encapsulation unit ENCAP. can be

On the other hand, as shown in FIG. 8, each of the plurality of X-touch routing wires (X-TL) electrically connected to the plurality of X-touch electrode lines (X-TEL) is encapsulated while being disposed on the encapsulation unit (ENCAP). It may extend to a place where there is no part ENCAP and may be electrically connected to a plurality of X-touch pads X-TP. Each of the plurality of Y-touch routing wires (Y-TL) electrically connected to the plurality of Y-touch electrode lines (Y-TEL) is disposed on the encapsulation unit (ENCAP) and extends to a place where there is no encapsulation unit (ENCAP). It may be electrically connected to a plurality of Y-touch pads Y-TP. Here, the encapsulation ENCAP may be located in the active area AA, and in some cases, may extend to the non-active area NA.

Meanwhile, as described above, in order to prevent a layer (eg, an encapsulation part in an organic light emitting display panel) in the active area AA from collapsing, the active area AA and the non-active area NA are formed. The dam area DA may exist in the non-active area NA that is a boundary area of , or an area outside the active area AA.

As shown in FIG. 8 , for example, a primary dam DAM1 and a secondary dam DAM2 may be disposed in the dam area DA. Here, the secondary dam DAM2 may be located more outside than the primary dam DAM1.

Unlike the example of FIG. 8 , only the primary dam DAM1 may be located in the dam area DA, and in some cases, not only the primary dam DAM1 and the secondary dam DAM2 are located in the dam area DA. One or more additional dams may be further deployed.

Meanwhile, referring to FIG. 8 , the encapsulation unit ENCAP may be located on the side of the primary dam DAM1 , or the encapsulation unit ENCAP may be located on the side of the primary dam DAM1 as well as the upper portion.

9 is a partial cross-sectional view of a display panel DISP according to embodiments of the present invention, taken along line X-X′ of FIG. 8 . However, in FIG. 9 , the touch electrode TE is illustrated in a plate shape, which is only an example and may be formed in a mesh type. In addition, when the touch electrode TE is a mesh type, a hole of the touch electrode TE may be located on the light emitting area of the subpixel SP.

The first transistor T1 , which is a driving transistor in each sub-pixel SP in the active area AA, is disposed on the substrate SUB.

The first transistor T1 includes a first node electrode NE1 corresponding to a gate electrode, a second node electrode NE2 corresponding to a source electrode or a drain electrode, and a third node electrode NE1 corresponding to a drain electrode or a source electrode. NE3) and the semiconductor layer SEMI.

The first node electrode NE1 and the semiconductor layer SEMI may overlap with the gate insulating layer GI interposed therebetween. The second node electrode NE2 is formed on the insulating layer INS to contact one side of the semiconductor layer SEMI, and the third node electrode NE3 is formed on the insulating layer INS to make the semiconductor layer SEMI. ) can be in contact with the other side.

The light emitting element ED includes a first electrode E1 corresponding to an anode electrode (or a cathode electrode), a light emitting layer EL formed on the first electrode E1 , and a cathode electrode formed on the light emitting layer EL (or a second electrode E2 corresponding to the anode electrode) and the like.

The first electrode E1 is electrically connected to the second node electrode NE2 of the first transistor T1 exposed through the pixel contact hole penetrating the planarization layer PLN.

The light emitting layer EL is formed on the first electrode E1 of the light emitting area provided by the bank BANK. The light-emitting layer EL is formed by stacking the hole-related layer, the light-emitting layer, and the electron-related layer on the first electrode E1 in the order or in the reverse order. The second electrode E2 is formed to face the first electrode E1 with the light emitting layer EL interposed therebetween.

The encapsulation unit ENCAP blocks the penetration of external moisture or oxygen into the light emitting device ED, which is vulnerable to external moisture or oxygen.

The encapsulation unit ENCAP may be formed of one layer, but may also be formed of a plurality of layers PAS1 , PCL, and PAS2 as shown in FIG. 9 .

For example, when the encapsulation unit ENCAP is formed of a plurality of layers PAS1, PCL, and PAS2, the encapsulation unit ENCAP includes one or more inorganic encapsulation layers PAS1 and PAS2 and one or more organic encapsulation layers PCL. may include As a specific example, the encapsulation unit ENCAP may have a structure in which the first inorganic encapsulation layer PAS1 , the organic encapsulation layer PCL, and the second inorganic encapsulation layer PAS2 are sequentially stacked.

Here, the organic encapsulation layer PCL may further include at least one organic encapsulation layer or at least one inorganic encapsulation layer.

The first inorganic encapsulation layer PAS1 is formed on the substrate SUB on which the second electrode E2 corresponding to the cathode electrode is formed to be closest to the light emitting device ED. The first inorganic encapsulation layer PAS1 is formed of an inorganic insulating material capable of low-temperature deposition, such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3) . Since the first inorganic encapsulation layer PAS1 is deposited in a low temperature atmosphere, the first inorganic encapsulation layer PAS1 may prevent the light emitting layer EL including an organic material vulnerable to a high temperature atmosphere from being damaged during the deposition process.

The organic encapsulation layer PCL may be formed to have a smaller area than the first inorganic encapsulation layer PAS1 . In this case, the organic encapsulation layer PCL is formed to expose both ends of the first inorganic encapsulation layer PAS1 . can be The organic encapsulation layer (PCL) serves as a buffer for relieving stress between layers due to bending of the touch screen-integrated light emitting display device, which is an organic light emitting display device, and may serve to enhance planarization performance. The organic encapsulation layer (PCL) may be formed of, for example, an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon oxycarbon (SiOC).

On the other hand, when the organic encapsulation layer PCL is formed through the inkjet method, a dam area corresponding to a boundary area between the non-active area NA and the active area AA or a partial area within the non-active area NA ( One or two or more dams DAM may be formed in DA).

For example, as shown in FIG. 9 , in the dam area DA, a plurality of X-touch pads X-TP and a plurality of Y-touch pads Y-TP are formed in the non-active area NA. It is positioned between the pad area and the active area AA, and in the dam area DA, a primary dam DAM1 adjacent to the active area AA and a secondary dam DAM2 adjacent to the pad area may exist.

In the one or more dams DAM disposed in the dam area DA, when the liquid organic encapsulation layer PCL is dropped on the active area AA, the liquid organic encapsulation layer PCL is formed in the non-active area ( It can be prevented from collapsing in the direction of NA) and encroaching on the pad area.

This effect may be further increased when the primary dam DAM1 and the secondary dam DAM2 are provided, as shown in FIG. 9 .

The primary dam DAM1 and/or the secondary dam DAM2 may be formed in a single-layer or multi-layer structure. For example, the primary dam DAM1 and/or the secondary dam DAM2 may be simultaneously formed of the same material as at least one of a bank BANK and a spacer (not shown). In this case, the dam structure can be formed without a mask addition process and cost increase.

In addition, as shown in FIG. 9 , the primary dam DAM1 and/or the secondary dam DAM2 includes the first inorganic encapsulation layer PAS1 and/or the second inorganic encapsulation layer PAS2 as a bank BANK. It may have a structure laminated on it.

Also, the organic encapsulation layer PCL including the organic material may be positioned only on the inner side surface of the primary dam DAM1 as shown in FIG. 9 .

Alternatively, the organic encapsulation layer PCL including an organic material may also be positioned on at least a portion of the primary dam DAM1 and the secondary dam DAM2. For example, the organic encapsulation layer PCL may be positioned on the primary dam DAM1.

The second inorganic encapsulation layer PAS2 may be formed on the substrate SUB on which the organic encapsulation layer PCL is formed to cover the top and side surfaces of the organic encapsulation layer PCL and the first inorganic encapsulation layer PAS1, respectively. have. The second inorganic encapsulation layer PAS2 minimizes or blocks external moisture or oxygen from penetrating into the first inorganic encapsulation layer PAS1 and the organic encapsulation layer PCL. The second inorganic encapsulation layer PAS2 is formed of, for example, an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3).

A touch buffer layer T-BUF may be disposed on the encapsulation unit ENCAP. The touch buffer layer T-BUF is formed with a touch sensor metal including X and Y-touch electrodes X-TE, Y-TE and X, Y-touch electrode connection wirings X-CL and Y-CL. , may be positioned between the second electrode E2 of the light emitting device ED.

The touch buffer layer T-BUF may be designed such that the separation distance between the touch sensor metal and the second electrode E2 of the light emitting device ED maintains a predetermined minimum separation distance (eg, 1 μm). Accordingly, it is possible to reduce or prevent a parasitic capacitance formed between the touch sensor metal and the second electrode E2 of the light emitting element ED, and thereby, it is possible to prevent a decrease in touch sensitivity due to the parasitic capacitance.

Without the touch buffer layer T-BUF, the X, Y-touch electrodes X-TE, Y-TE and the X, Y-touch electrode connection wirings X-CL, Y- on the encapsulation unit ENCAP A touch sensor metal including CL) may be disposed.

In addition, the touch buffer film (T-BUF) is a chemical (developer or etchant, etc.) used in the manufacturing process of the touch sensor metal disposed on the touch buffer film (T-BUF) or moisture from the outside containing organic matter. Penetration into the light emitting layer EL may be blocked. Accordingly, the touch buffer layer T-BUF may prevent damage to the light emitting layer EL, which is vulnerable to chemical or moisture.

The touch buffer film (T-BUF) can be formed at a certain temperature (for example, at a low temperature of 100 degrees (°C) or less and has a low dielectric constant of 1 to 3 in order to prevent damage to the light emitting layer (EL) containing an organic material vulnerable to high temperature It is formed of an organic insulating material For example, the touch buffer layer T-BUF may be formed of an acryl-based, epoxy-based or siloxan-based material A touch buffer layer having planarization performance with an organic insulating material (T-BUF) is a damage to each of the encapsulation layers PAS1, PCL, and PAS2 constituting the encapsulation ENCAP due to the bending of the organic light emitting display device and a touch sensor formed on the touch buffer layer T-BUF. It is possible to prevent metal cracking.

According to the mutual-capacitance-based touch sensor structure, an X-touch electrode line (X-TEL) and a Y-touch electrode line (Y-TEL) are disposed on the touch buffer layer T-BUF, and the X-touch electrode The line X-TEL and the Y-touch electrode line Y-TEL may be disposed to cross each other.

The Y-touch electrode line (Y-TEL) is a plurality of Y-touch electrode connection wirings that electrically connect the plurality of Y-touch electrodes (Y-TE) and the plurality of Y-touch electrodes (Y-TE). (Y-CL).

9 , the plurality of Y-touch electrodes Y-TE and the plurality of Y-touch electrode connection lines Y-CL may be positioned on different layers with the touch insulating layer IND interposed therebetween. have.

The plurality of Y-touch electrodes Y-TE may be spaced apart from each other at regular intervals along the y-axis direction. Each of the plurality of Y-touch electrodes Y-TE may be electrically connected to another Y-touch electrode Y-TE adjacent in the y-axis direction through the Y-touch electrode connection line Y-CL.

The Y-touch electrode connection wiring Y-CL is formed on the touch buffer layer T-BUF, is exposed through a touch contact hole penetrating the touch insulating layer ILD, and is adjacent to two Y-touch electrodes in the y-axis direction. (Y-TE) may be electrically connected.

The Y-touch electrode connection line Y-CL may be disposed to overlap the bank BANK. Accordingly, it is possible to prevent a decrease in the aperture ratio due to the Y-touch electrode connection line Y-CL.

The X-touch electrode line (X-TEL) is a plurality of X-touch electrode connection wirings electrically connecting the plurality of X-touch electrodes (X-TE) and the plurality of X-touch electrodes (X-TE) (X-CL).

The plurality of X-touch electrodes X-TE may be spaced apart from each other at regular intervals along the x-axis direction on the touch insulating layer ILD. Each of the plurality of X-touch electrodes X-TE may be electrically connected to another X-touch electrode X-TE adjacent in the x-axis direction through the X-touch electrode connection line X-CL.

The X-touch electrode connection wiring (X-CL) is disposed on the same plane as the X-touch electrode (X-TE) and is connected to the two X-touch electrodes (X-TE) adjacent in the x-axis direction without a separate contact hole. It may be electrically connected or may be integrated with two X-touch electrodes X-TE adjacent in the x-axis direction.

The X-touch electrode connection line X-CL may be disposed to overlap the bank BANK. Accordingly, it is possible to prevent a decrease in the aperture ratio due to the X-touch electrode connection line X-CL.

Meanwhile, the Y-touch electrode line Y-TEL may be electrically connected to the touch driving circuit TDC through the Y-touch routing line Y-TL and the Y-touch pad Y-TP. Likewise, the X-touch electrode line X-TEL may be electrically connected to the touch driving circuit TDC through the X-touch routing line X-TL and the X-touch pad X-TP.

A pad cover electrode covering the X-touch pad X-TP and the Y-touch pad Y-TP may be further disposed.

The X-touch pad (X-TP) may be formed separately from the X-touch routing line (X-TL), or may be formed by extending the X-touch routing line (X-TL). The Y-touch pad (Y-TP) may be formed separately from the Y-touch routing wiring (Y-TL), or may be formed by extending the Y-touch routing wiring (Y-TL).

The X-touch pad (X-TP) is formed by extending the X-touch routing wiring (X-TL), and the Y-touch pad (Y-TP) is formed by extending the Y-touch routing wiring (Y-TL). , X-Touch Pad (X-TP), X-Touch Routing Wire (X-TL), Y-Touch Pad (Y-TP) and Y-Touch Routing Wire (Y-TL) are made of the same first conductive material. can be configured. Here, the first conductive material may be formed in a single-layer or multi-layer structure using, for example, a metal having high corrosion resistance and acid resistance and good conductivity, such as Al, Ti, Cu, and Mo.

For example, X-Touch Pad (X-TP), X-Touch Routing Wire (X-TL), Y-Touch Pad (Y-TP) and Y-Touch Routing Wire (Y-TL) in a first conductive material ) may be formed in a three-layered structure such as Ti/Al/Ti or Mo/Al/Mo.

The pad cover electrode capable of covering the X-touch pad (X-TP) and the Y-touch pad (Y-TP) is made of the same material as the first and Y-touch electrodes (X-TE, Y-TE) and has a second conductivity It can be made of material. Here, the second conductive material may be formed of a transparent conductive material such as ITO or IZO with strong corrosion resistance and acid resistance. The pad cover electrode is formed to be exposed by the touch buffer layer T-BUF, and thus may be bonded to the touch driving circuit TDC or to the circuit film on which the touch driving circuit TDC is mounted.

Here, the touch buffer layer T-BUF may be formed to cover the touch sensor metal to prevent the touch sensor metal from being corroded by external moisture. For example, the touch buffer layer T-BUF may be formed of an organic insulating material, a circularly polarizing plate, or a film made of an epoxy or acrylic material. The touch buffer layer T-BUF may not be on the encapsulation part ENCAP. That is, the touch buffer layer T-BUF may not be an essential component.

The Y-touch routing wiring (Y-TL) may be electrically connected to the Y-touch electrode (Y-TE) through the touch routing wiring contact hole, or may be integrated with the Y-touch electrode (Y-TE). .

This Y-touch routing wiring (Y-TL) extends to the non-active area (NA) and passes the top and side of the encapsulation (ENCAP) and the top and side of the dam (DAM) to the Y-touch pad (Y-) TP) may be electrically connected. Accordingly, the Y-touch routing line Y-TL may be electrically connected to the touch driving circuit TDC through the Y-touch pad Y-TP.

The Y-touch routing wiring (Y-TL) transmits a touch sensing signal from the Y-touch electrode (Y-TE) to the touch driving circuit (TDC) or receives a touch driving signal from the touch driving circuit (TDC) It can be transmitted to the Y-touch electrode Y-TE.

The X-touch routing wiring (X-TL) may be electrically connected to the X-touch electrode (X-TE) through a touch routing wiring contact hole, or may be integrated with the X-touch electrode (X-TE). .

These X-touch routing wires (X-TL) extend to the non-active area (NA) and pass the top and side of the encapsulation (ENCAP) and the top and side of the dam (DAM) to the X-touch pad (Y-TP). ) can be electrically connected to. Accordingly, the X-touch routing line X-TL may be electrically connected to the touch driving circuit TDC through the X-touch pad X-TP.

The X-touch routing wiring (X-TL) may receive a touch driving signal from the touch driving circuit (TDC) and transmit it to the X-touch electrode (X-TE), and at the X-touch electrode (X-TE) The touch sensing signal may be transferred to the touch driving circuit TDC.

The arrangement of X-touch routing wiring (X-TL) and Y-touch routing wiring (Y-TL) can be variously changed according to panel design requirements.

A touch protection layer PAC may be disposed on the X-touch electrode X-TE and the Y-touch electrode Y-TE. Such a touch protection film (PAC) may be extended to the front or rear of the dam (DAM) and disposed on the X-touch routing wiring (X-TL) and the Y-touch routing wiring (Y-TL).

Meanwhile, the cross-sectional view of FIG. 9 conceptually shows the structure, and the position, thickness, or width of each pattern (various layers or various electrodes) may vary depending on the viewing direction or position, and the connection structure of various patterns It may be changed, and additional layers may be present in addition to the several illustrated layers, and some of the illustrated various layers may be omitted or integrated. For example, the width of the bank BANK may be narrower than the drawing, and the height of the dam DAM may be lower or higher than the drawing. In addition, the cross-sectional view of FIG. 9 is a touch electrode (TE), a touch routing wire (TL) to show an example of a structure connected to the touch pad (TP) along the inclined surface of the touch routing wire (TL) and the encapsulation part (ENCAP) In the case of the above-described mesh type, a hole of the touch electrode TE is formed on the light emitting area of the subpixel SP. This can be located In addition, a color filter CF may be further disposed on the encapsulation unit ENCAP, and the color filter CF may be located on the touch electrode TE, and the encapsulation unit ENCAP and the touch electrode TE. It may be located between

10 and 11 are views exemplarily showing a cross-sectional structure of a display panel DISP according to an embodiment of the present invention in which a color filter CF is included.

10 and 11 , when the touch panel TSP is embedded in the display panel DISP and the display panel DISP is implemented as an organic light emitting display panel, the touch panel TSP is the display panel DISP. It may be located on the inner encapsulation unit ENCAP. In other words, the touch sensor metal such as the plurality of touch electrodes TE and the plurality of touch routing wires TL may be positioned on the encapsulation ENCAP in the display panel DISP.

As described above, by forming the touch electrode TE on the encapsulation portion ENCAP, the touch electrode TE may be formed without significantly affecting display performance and display-related layer formation.

Meanwhile, referring to FIGS. 10 and 11 , a second electrode E2 , which may be a cathode electrode of the organic light emitting diode OLED, may be positioned under the encapsulation unit ENCAP.

The thickness T of the encapsulation part ENCAP may be, for example, 1 micrometer or more.

As described above, by designing the thickness of the encapsulation unit ENCAP to be 1 micrometer or more, the parasitic capacitance formed between the second electrode E2 and the touch electrodes TE of the organic light emitting diode OLED can be reduced. can Accordingly, it is possible to prevent a decrease in touch sensitivity due to the parasitic capacitance.

As described above, in each of the plurality of touch electrodes TE, the electrode metal EM is patterned in a mesh shape having two or more holes, and each of the two or more holes is one when viewed in the vertical direction. It may correspond to the above sub-pixels or their light emitting regions.

As described above, when viewed in a plan view, the electrode of the touch electrode TE is such that the light emitting area of the one or more subpixels corresponds to each position of the two or more holes existing in the area of the touch electrode TE As the metal EM is patterned, the luminous efficiency of the display panel DISP may be increased.

10 and 11 , a black matrix BM may be disposed on the display panel DISP, and a color filter CF may be further disposed.

The position of the black matrix BM may correspond to the position of the electrode metal EM of the touch electrode TE.

The positions of the plurality of color filters CF correspond to the positions of the plurality of touch electrodes TE or the electrode metal EM constituting the plurality of touch electrodes TE.

As described above, since the plurality of color filters CF are positioned at positions corresponding to the positions of the plurality of open areas HOLE, the light emitting performance of the display panel DISP may be improved.

The vertical positional relationship between the plurality of color filters CF and the plurality of touch electrodes TE is as follows.

10 , the plurality of color filters CF and the black matrix BM may be positioned on the plurality of touch electrodes TE.

In this case, the plurality of color filters CF and the black matrix BM may be positioned on the overcoat layer OC disposed on the plurality of touch electrodes TE. Here, the overcoat layer OC may be the same layer as the touch protection layer PAC of FIG. 9 or a different layer.

Alternatively, as shown in the example illustrated in FIG. 11 , the plurality of color filters CF and the black matrix BM may be positioned under the plurality of touch electrodes TE.

In this case, the plurality of touch electrodes TE may be positioned on the plurality of color filters CF and the overcoat layer OC on the black matrix BM. Here, the overcoat layer OC may be the same layer as the touch buffer layer T-BUF or the touch insulating layer ILD of FIG. 9 or a different layer. Alternatively, the touch buffer layer T-BUF or the touch insulating layer ILD may be disposed separately from the overcoat layer OC.

In this way, by adjusting the vertical positional relationship between the touch electrode TE and the configuration for driving the display, it is possible to arrange the configuration for the touch sensing without degrading the display performance.

Meanwhile, the display panel DISP according to embodiments of the present invention may include a sensor such as a camera sensor or a proximity sensor. In addition, the sensor may be disposed in the non-active area NA of the display panel DISP, but may be disposed in a partial area of the active area AA to reduce the non-active area NA.

That is, depending on the type of the display panel DISP, an area in which an image is not displayed and a sensor such as a camera sensor is disposed may exist in the active area AA.

12 is a diagram illustrating an example of a structure in which holes are disposed in the active area AA of the display panel DISP according to embodiments of the present invention.

Referring to FIG. 12 , the display panel DISP includes an active area AA in which the sub-pixel SP and the touch electrode TE are disposed, and a non-active area AA positioned outside the active area AA. NA) may be included.

The active area AA may include a first area A1 in which the subpixel SP is disposed and displays an image, and a second area A2 in which a sensor such as a camera sensor is disposed and does not display an image. have. The first area A1 may be referred to as a pixel area, and the second area A2 may be referred to as a camera arrangement area.

The second area A2 may include an opening area A2-1 passing through the substrate SUB and a boundary area A2-2 outside the opening area A2-1. In addition, at least one opening area may be disposed in the second area A2 , and at least one or more second areas A2 may be disposed in the active area AA.

For example, a first opening region and a second opening region spaced apart from the first opening region may be disposed in the second region A2 . That is, a plurality of opening areas may be disposed in the second area A2 . In addition, a plurality of second areas A2 may be disposed in the active area AA. That is, a plurality of cameras may be disposed in the active area AA and a plurality of second areas A2 may be disposed.

The inventors of the present specification have discovered a problem involved in providing a second area including an opening area for arranging a camera in the active area AA in a structure in which the touch panel TSP is embedded in the display panel DISP. In order to provide the second area in the active area AA, after the touch panel TSP is formed on the display panel DISP, an opening area passing through the display panel DISP and the touch panel TSP must be formed. That is, since the touch electrode TE does not exist in the opening region, the adjacent touch electrodes TE are not connected to each other, so that the touch signal is cut off. Accordingly, the inventors recognized such a problem and devised a new structure for connecting the touch electrodes adjacent to the opening area.

13 is a plan view illustrating a touch screen-integrated light emitting display device according to an exemplary embodiment of the present specification. FIG. 14 is a view showing a cross section taken along line I-I' in FIG. 13 . FIG. 15 is a view showing a cross-section taken along II-II′ of FIG. 13 .

13 to 15 , the display panel DISP includes an active area AA in which the sub-pixel SP and the touch electrode TE are disposed, and a non-active area AA positioned outside the active area AA. It may include an active area NA. Since the display panel DISP includes the same components and stacked structure as those of the display panel DISP of FIG. 3 described above, a detailed description thereof will be omitted.

The active area AA may include a pixel area A1 in which the sub-pixel SP is disposed and displays an image, and a camera arrangement area A2 in which a sensor such as a camera sensor is disposed and does not display an image. .

The camera arrangement area A2 is a boundary area between the opening area A2-1 passing through the substrate SUB and the outside of the opening area A2-1, that is, between the pixel area A1 and the opening area A2-1. (A2-2) may be included. There is an encapsulation ENCAP covering the pixel area A1 and the boundary area A2 - 2 , and a plurality of first touch electrodes X-TE extending in the first direction and the second direction on the encapsulation ENCAP are provided. A plurality of second touch electrodes Y-TE extending to .

Here, the plurality of first touch electrodes X-TE and the plurality of second touch electrodes Y-TE are electrodes that are included in the plurality of touch electrodes TE and have different roles (functions). For example, the plurality of first touch electrodes X-TE may be driving touch electrodes, and the plurality of second touch electrodes Y-TE may be sensing touch electrodes. Conversely, the plurality of first touch electrodes X-TE may be sensing touch electrodes, and the plurality of second touch electrodes Y-TE may be driving touch electrodes.

The first touch electrode connection line X-CL may electrically connect two adjacent touch electrodes among the plurality of first touch electrodes X-TE. Here, the first touch electrode connection wiring X-CL connecting the two adjacent first touch electrodes X-TE may be a metal integrated with the two adjacent first touch electrodes X-TE, The metal may be connected to two adjacent first touch electrodes X-TE through a contact hole.

In addition, the second touch electrode connection line Y-TE may electrically connect two adjacent touch electrodes among the plurality of second touch electrodes Y-TE. Here, the second touch electrode connection wiring Y-CL connecting the two adjacent second touch electrodes Y-TE may be a metal integrated with the two adjacent second touch electrodes Y-TE, The metal may be connected to two adjacent second touch electrodes Y-TE through a contact hole.

It may include a contact link CTL connecting the second touch electrode Y-TE and the second touch electrode connection line Y-CL. The contact link CTL may be disposed on the same layer as the second touch electrode Y-TE. In addition, the second touch electrode connection line Y-CL is disposed on a layer different from the layer on which the second touch electrode Y-TE is disposed. An insulating layer ILD may be disposed between the second touch electrode connection line Y-CL and the contact link CTL. The first contact hole CH1 provided in the insulating layer ILD may be formed in the boundary area A2 - 2 . The second touch electrode connection line Y-CL and the contact link Y-CTL may be electrically connected through the first contact hole CH1 .

The second touch electrode connection wiring Y-CL is disposed in the boundary area A2-2 when connecting two touch electrodes with the opening area A2-1 therebetween, and bypasses the opening area A2-1. Thus, two touch electrodes can be connected. That is, since the display panel DISP and the touch panel TSP pass through the opening area A2-1, no wiring may be positioned. Therefore, in order to connect two adjacent touch electrodes with the opening area A2-1 therebetween, the second touch electrode connection line Y-CL is connected to the boundary area A2- located outside the opening area A2-1. 2) and may be provided to bypass the perimeter of the opening area A2-1.

Each of the contact link CTL and the second touch electrode connection line Y-CL may include at least two portions. For example, the contact link Y-CTL and the second touch electrode connection line Y-CL connecting the two touch electrodes adjacent to the opening area A2-1 form the first part and the second part respectively. may include. The first and second portions of the contact link CTL may be directly connected to one second touch electrode Y-TE adjacent to the opening area A2-1. In addition, the first portion or the second portion of the second touch electrode connection line Y-CL disposed on a different layer from the contact link CTL may have a first portion in the insulating layer ILD from the first portion of the contact link CTL. 1 may be connected through the contact hole CH1.

Here, it will be described that the first portion of the contact link CTL is connected to the first portion of the second touch electrode connection line Y-CL. A first portion of the second touch electrode connection line Y-CL connected to the first portion of the contact link CTL bypasses the opening area A2-1 in a counterclockwise direction in the boundary area A2-2 to open the opening. A second touch electrode connected to a first portion of the contact link CTL connected to another second touch electrode Y-TE adjacent to the area A2-1 and connected to a second portion of the contact link CTL is connected The second portion of the wiring Y-CL bypasses the opening region A2-1 in a clockwise direction from the boundary region A2-2 to be adjacent to the opening region A2-1 and the second touch electrode Y- TE) and may be connected to a second portion of the contact link CTL.

In this case, even if one of the first part and the second part of the second touch electrode connection line Y-CL is disconnected, the other one can transmit a touch signal, so that stable touch performance can be realized.

The first touch electrode connection wiring X-CL is disposed in the boundary area A2-2 when connecting two touch electrodes with the opening area A2-1 therebetween, and bypasses the opening area A2-1. Two touch electrodes can be connected. The first touch electrode connection line X-CL may extend to the same layer as the layer on which the first touch electrode X-TE is disposed so as not to meet the second touch electrode connection line Y-CL.

The first touch electrode connection line X-CL may include at least two portions. For example, the first touch electrode connection line X-CL connecting the two first touch electrodes X-TE adjacent to the opening area A2-1 includes the first portion and the second portion. can do. In addition, the first portion or the second portion of the first touch electrode connection line X-CL disposed on the same layer as the first touch electrode X-TE may be electrically connected to the first touch electrode X-TE. have.

A first portion of the first touch electrode connection line X-CL connected to the first touch electrode X-TE adjacent to the opening area A2-1 is opened in the boundary area A2-2 in a counterclockwise direction. A first touch electrode connection wire connected to the other first touch electrode X-TE adjacent to the opening area A2-1 by bypassing the area A2-1 and connected to the first touch electrode X-TE The second part of (X-CL) bypasses the opening area A2-1 in a clockwise direction from the boundary area A2-2 to be adjacent to the opening area A2-1 and the other first touch electrode X-TE ) can be connected to

In this case, even if one of the first part and the second part of the first touch electrode connection line X-CL is disconnected, the other one may transmit a touch signal, thereby realizing stable touch performance. In FIG. 15 , the first touch electrode connection line X-CL is illustrated as overlapping the lower second touch electrode connection line Y-CL, but is not limited thereto, and the second touch electrode connection line Y-CL is not limited thereto. ) and the first touch electrode connection wiring (X-CL) to minimize parasitic capacitance generated between the second touch electrode connection wiring (Y-CL) and the second touch electrode connection wiring (Y-CL) so as not to overlap with the second touch electrode connection wiring (Y-CL). Corresponding parts may be removed.

However, in order to prevent the first touch electrode connection line X-CL from being short-circuited with the second contact link Y-CTL disposed on the same layer as the first touch electrode X-TE, the contact link CTL In a region where the first touch electrode connection line Y-CL overlap with each other, they should be connected through different paths. To this end, a bridge pattern BP may be disposed in a region where the contact link CTL and the first touch electrode connection line X-CL overlap. The bridge pattern BP is disposed on the same layer as the second touch electrode connection line Y-CL, and is insulated from the second touch electrode connection line Y-CL. An insulating layer ILD is disposed between the first touch electrode connection line X-CL and the bridge pattern BP, and the first touch electrode is connected through a second contact hole (not shown) provided in the insulating layer ILD. The wiring X-CL and the bridge pattern BP are electrically connected so that the first touch electrode connection wiring X-CL bypasses the contact link CTL and touches the first touch electrode connection wiring X-CL. signal can be transmitted.

The crack detection pattern CDP may be positioned between the outer portion of the opening area A2-1 and the second touch electrode connection line Y-CL. The crack detection pattern CDP is disposed on the same layer as the second touch electrode connection line Y-CL. The crack detection pattern CDP may be insulated from the second touch electrode connection line Y-CL, and at least a portion thereof may be disposed on the same layer as the second touch electrode Y-TE.

As described above, in the touch screen-integrated light emitting display device according to an example of the present specification, when an opening region for arranging a camera is formed in an active region, a touch electrode connection wire connecting a touch electrode adjacent to the opening region is bypassed outside the opening region. By disposing it so that the touch signal can be transmitted without interruption. In addition, by disposing a plurality of touch electrode connection wires so as to bypass the outside of the opening area in different directions, even if one part is cut off, the touch signal may be transmitted through the other. Accordingly, the present invention can provide a touch screen-integrated display device capable of realizing stable touch performance even when a hole is formed in the touch active region.

Although the embodiments of the present specification have been described in detail with reference to the accompanying drawings, the present specification is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit thereof. Accordingly, the embodiments disclosed in the present specification are intended to explain, not to limit the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and may be technically variously linked and operated by those skilled in the art, and each embodiment may be implemented independently of each other or together in a related relationship. may be carried out. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

Claims (16)

a display region having an opening region passing through the substrate, a pixel region in which a plurality of display pixels are disposed, and a boundary region between the opening region and the pixel region;
an encapsulation unit covering the pixel area and the boundary area;
a plurality of first touch electrodes disposed on the encapsulation part and extending in a first direction and a plurality of second touch electrodes extending in a second direction;
a second touch electrode connection line electrically connecting two adjacent touch electrodes among the plurality of second touch electrodes;
a contact link connecting the second touch electrode and the second touch electrode connection line;
a first touch electrode connection wire electrically connecting two adjacent touch electrodes among the plurality of first touch electrodes;
The second touch electrode connection wiring is disposed in the boundary region to connect the two second touch electrodes having the opening region interposed therebetween, and bypassing the opening region to connect the two second touch electrodes having the opening region interposed therebetween. A touch screen-integrated light emitting display device that connects electrodes. According to claim 1,
The contact link is disposed on the same layer as the layer on which the second touch electrode is disposed,
The second touch electrode connection wiring is disposed on a layer different from the layer on which the second touch electrode is disposed. 3. The method of claim 2,
Further comprising an insulating layer disposed between the second touch electrode connection wiring and the contact link,
A touch screen-integrated light emitting display device in which the second touch electrode connection wire and the contact link are electrically connected to each other through a first contact hole in the insulating layer. 4. The method of claim 3,
The contact link is disposed in the boundary area and electrically connects a second touch electrode adjacent to the opening area and a second touch electrode connection line. 4. The method of claim 3,
The first contact hole is in the boundary area of the touch screen integrated light emitting display device. 3. The method of claim 2,
Each of the contact link and the second touch electrode connection wire includes at least two portions. 7. The method of claim 6,
Each part of the second touch electrode connection wiring bypasses the periphery of the opening area in different directions. According to claim 1,
The first touch electrode connection wiring is disposed in the boundary region to connect the two first touch electrodes having the opening region interposed therebetween and bypassing the opening region to connect the two first touch electrodes having the opening region interposed therebetween. A touch screen-integrated light emitting display device that connects electrodes. 9. The method of claim 8,
The first touch electrode connection wiring extends on the same layer as the layer on which the first touch electrode is disposed, and in a region overlapping the contact link, a touch screen that extends to a layer different from the layer on which the first touch electrode is disposed All-in-one light emitting display device. 10. The method of claim 9,
The first touch electrode connection wiring may further include a bridge pattern disposed in an area where the contact link and the first touch electrode connection wiring overlap. 11. The method of claim 10,
The bridge pattern is disposed on the same layer as the layer on which the second touch electrode connection wiring is disposed. 12. The method of claim 11,
Further comprising an insulating layer disposed between the first touch electrode connection wiring and the bridge pattern,
A touch screen-integrated light emitting display device in which the first touch electrode connection wiring and the bridge pattern are electrically connected to each other through a second contact hole in the insulating layer. According to claim 1,
The touch screen-integrated light emitting display device further comprising: a crack detection pattern positioned between an outer portion of the opening region and the second touch electrode connecting line and disposed on the same layer as the second touch electrode connecting line. 14. The method of claim 13,
The crack detection pattern is insulated from the second touch electrode connection line, and at least a part of the touch screen integrated light emitting display device is disposed on the same layer as the second touch electrode. According to claim 1,
Each of the first touch electrode and the second touch electrode is a touch screen-integrated light emitting display device having a mesh shape including at least one hole. 16. The method of claim 15,
wherein the hole overlaps the light emitting area of the display pixel.

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