KR20220062783A - Substrate cleaning system - Google Patents

Abstract

A substrate cleaning system is disclosed. A substrate cleaning system according to an embodiment may include: a cleaning solution supply module that receives a cleaning solution, heats the cleaning solution to a set first temperature, and discharges the cleaning solution; a gas supply module that receives dry gas, heats the dry gas to a set second temperature, and discharges the dry gas; and a fluid ejection device that is connected to the cleaning liquid supply module and the gas supply module to receive the heated cleaning liquid and drying gas, and sprays a two-fluid mixture of the supplied cleaning liquid and dry gas to a substrate to be cleaned.

Description

Substrate cleaning system {SUBSTRATE CLEANING SYSTEM}

The description below relates to a substrate cleaning system.

Contaminants such as dust, moisture, and various organic substances introduced during the manufacturing of FPD (Flat Panel Display) and semiconductor devices have a fatal effect on the performance, reliability, and production yield of FPD and semiconductor devices. Therefore, in the process of processing FPD, semiconductor substrate, glass, etc., a cleaning process for cleaning the surface is essential so that contamination of the surface can be minimized.

A commonly used cleaning method is a water-based cleaning method in which pure water (DI Water) is sprayed on the surface of a substrate to be cleaned. can be

In the case of using the water-based cleaning method, the surface of the substrate is cleaned by spraying a cleaning solution on the surface of the substrate while moving the substrate in one direction. In this case, while the cleaning liquid is uniformly sprayed on the entire substrate surface, it is necessary to ensure a uniform cleaning degree for the entire substrate surface. In this regard, Korean Patent Application Laid-Open No. 10-2006-0079561 discloses an invention for a spray nozzle and a cleaning system using the same.

The content described as the above-mentioned background art is possessed or acquired by the inventor in the process of derivation of the present invention, and cannot necessarily be acknowledged as known technology disclosed to the general public prior to the filing of the present invention.

An object of the embodiment is to provide a substrate cleaning system capable of ensuring uniformity of inertia of a cleaning liquid sprayed on a substrate.

An object of the embodiment is to provide a substrate cleaning system capable of stably supplying a cleaning solution in a heated state so as to improve a removal rate of foreign substances from the substrate.

An object of the embodiment is to provide a substrate cleaning system capable of securing versatility and remodeling of equipment through a module that individually heats a drying gas and a cleaning liquid.

The problems to be solved in the embodiment are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A substrate cleaning system according to an embodiment includes: a cleaning solution supply module that receives a cleaning solution and heats it to a set first temperature and discharges it; a gas supply module for receiving dry gas and heating it to a set second temperature; and a fluid ejection device connected to the cleaning liquid supply module and the gas supply module, respectively, to receive the heated cleaning liquid and the drying gas, and to spray a double fluid mixed with the supplied cleaning liquid and the drying gas onto the substrate to be cleaned. there is.

The cleaning solution supply module includes a first supply line into which the cleaning solution is injected; a bubbler connected to the first supply line and configured to reduce the specific resistance of the cleaning solution; a cleaning liquid heating unit in which the cleaning liquid passing through the bubbler flows and heating the cleaning liquid flowing therein to the first temperature; and a discharge line for discharging the heated cleaning liquid to the fluid ejection device.

The cleaning solution supply module is connected to the bubbler and further includes a second supply line for receiving carbon dioxide, wherein the bubbler dissolves the carbon dioxide in the cleaning solution passing through the first supply line, The resistivity can be reduced.

The cleaning liquid supply module may further include a pressure pump disposed between the bubbler and the cleaning liquid heating unit and configured to adjust a cleaning liquid supply pressure to the cleaning liquid heating unit.

The cleaning liquid may be de-ionized water and the first temperature may be in the range of 30 degrees to 70 degrees.

The gas supply module may include: a gas supply line into which the dry gas is injected; a gas heating unit connected to the gas supply line and heating the dry gas to the second temperature; and an exhaust line for exhausting the dry gas heated by the gas heating unit to the fluid injection device.

The drying gas may be compressed dry air (CDA), and the second temperature may be in a range of 60°C to 130°C.

The cleaning liquid supply module and the gas supply module may include: a control valve for selectively controlling supply of the cleaning liquid and the drying gas to the fluid spraying device; and a measurement sensor for measuring the pressure and temperature of the cleaning liquid and the drying gas supplied to the fluid ejection device, respectively.

The fluid ejection device may include: an injection nozzle formed along a longitudinal direction and including a discharge port through which a mixed air mixture of the cleaning liquid and the drying gas is discharged; a cleaning liquid injection unit connecting the cleaning liquid supply module and the spray nozzle; and a gas injection unit connecting the gas supply module and the injection nozzle.

The jet nozzle may have a longitudinal direction perpendicular to the moving direction of the substrate to be cleaned, and may simultaneously jet the mixed air in the entire longitudinal direction through the discharge port.

The spray nozzle may include a cleaning liquid supply slit through which the supplied cleaning liquid flows based on a cross section perpendicular to the longitudinal direction; a gas supply slit through which the supplied dry gas flows; and a spray slit having one side communicating with the cleaning solution supply slit and the gas supply slit at the same time, and the other side communicating with the discharge port.

Based on a cross section perpendicular to the longitudinal direction of the spray nozzle, the cleaning solution supply slit may be connected in a direction perpendicular to the spray slit, and the gas supply slit may be connected in a direction parallel to the spray slit.

A width of the cleaning solution supply slit may be narrower than a width of the spray slit.

The temperature of the mixed air of the cleaning liquid and the drying gas injected through the outlet may be in the range of 45 degrees to 52 degrees.

A substrate cleaning system according to an embodiment includes a substrate transfer device for transferring a substrate; a fluid jetting device having a longitudinal direction perpendicular to the transport direction of the substrate and including a jet nozzle configured to jet a mixed air of a cleaning liquid and a drying gas through a discharge port formed along the longitudinal direction; a cleaning liquid supply module connected to the spray nozzle, heating the cleaning liquid to a set first temperature, and supplying the cleaning liquid to the fluid spraying device; and a gas supply module connected to the injection nozzle, heating the dry gas to a set second temperature, and supplying it to the fluid injection device.

The substrate cleaning system according to the embodiment includes a module for individually heating the cleaning liquid and the drying gas, thereby ensuring the convenience and versatility of the equipment.

The substrate cleaning system according to the embodiment mixes a cleaning liquid and a drying gas in a heated state and sprays the mixture onto the substrate, thereby increasing cleaning efficiency of the substrate.

Effects of the substrate cleaning system according to the embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

The following drawings attached to the present specification illustrate a preferred embodiment of the present invention, and serve to further understand the technical idea of the present invention together with the detailed description of the present invention, so the present invention is limited to the matters described in those drawings It should not be construed as being limited.
1 is a schematic diagram of a substrate cleaning system according to an embodiment.
2 is a perspective view of a fluid ejection device according to an exemplary embodiment.
3 is a cross-sectional view of a spray nozzle according to an embodiment.
4 is a structural diagram of a cleaning solution supply module according to an embodiment.
5 is a structural diagram of a gas supply module according to an embodiment.

Hereinafter, embodiments will be described in detail with reference to exemplary drawings. In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in the description of the embodiment, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. When it is described that a component is "connected", "coupled" or "connected" to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Components included in one embodiment and components having a common function will be described using the same names in other embodiments. Unless otherwise stated, descriptions described in one embodiment may be applied to other embodiments as well, and detailed descriptions within the overlapping range will be omitted.

1 is a schematic diagram of a substrate cleaning system according to an embodiment, FIG. 2 is a perspective view of a fluid ejection apparatus according to an embodiment, and FIG. 3 is a cross-sectional view of a spray nozzle according to an embodiment.

1 to 3 , the substrate cleaning system 1 according to an embodiment may be used to clean the substrate S. The substrate cleaning system 1 may remove dust, particles, foreign substances, etc. from the surface of the substrate S by spraying a cleaning fluid toward the substrate S to be cleaned. The substrate cleaning system 1 may spray a mixture of a cleaning liquid and a drying gas on the substrate S surface to ensure cleaning efficiency and cleaning uniformity for the substrate S surface. In this case, the substrate cleaning system 1 adjusts the temperature of the mixture to a set temperature and sprays the mixture onto the substrate S, thereby increasing cleaning efficiency for the substrate S.

The substrate S cleaned through the substrate cleaning system 1 is glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) or a plasma display panel (PDP), or a solar panel (solar panel). It may be a large-area panel glass such as cell panel). However, the type of the substrate S is not limited thereto, and the substrate S may be a silicon wafer for manufacturing a semiconductor device. Hereinafter, a case in which the substrate S is provided in a rectangular shape is exemplified for convenience of description, but this is for convenience of description and the shape of the substrate S is not limited thereto.

The substrate cleaning system 1 may include a substrate transfer device 130 , a fluid ejection device 100 , a cleaning solution supply module 110 , and a gas supply module 120 .

The substrate transfer apparatus 130 may transfer the substrate S. The substrate transfer apparatus 130 may transfer the substrate S to a cleaning position. The substrate transfer device 130 may move the substrate S to be cleaned in a state in which it is supported and translated along a setting direction. The substrate transport apparatus 130 may include, for example, a plurality of rollers 131 rotating about an axis as shown in FIG. 1 . The plurality of rollers 131 may be transferred along the rotational direction in a state in which the substrate S is supported. The cleaning target substrate S may be cleaned while moving through the cleaning position according to the rotation operation of the roller 131 . In the drawings, the substrate transport device 130 has been described on the assumption that the substrate S is transported through the plurality of rollers 131 , but this is only an example, and the substrate transport device 130 is a conveyor belt or, It may be a known device for transporting the substrate S through a cleaning position while supporting the substrate S through a bearing or other mechanical device. A detailed description of the substrate transfer apparatus 130 will be omitted.

The fluid spraying device 100 may spray the cleaning liquid toward the substrate S. The fluid ejection apparatus 100 may be disposed at the cleaning position and may spray the cleaning liquid toward the portion of the substrate S passing through the cleaning position. The fluid spraying apparatus 100 may receive the heating-treated cleaning liquid and drying gas separately, mix the supplied cleaning liquid and the drying gas, and spray the heated cleaning liquid and drying gas toward the substrate S. The fluid injection device 100 may include a cleaning solution injection unit 102 , a gas injection unit 103 , and an injection nozzle 101 .

The cleaning liquid injection unit 102 may receive the heated cleaning liquid from the cleaning liquid supply module 110 to be described later. The cleaning liquid may be, for example, deionized water.

The gas injection unit 103 may receive the heated dry gas from the gas supply module 120 to be described later. The dry gas may be, for example, compressed dry air (CDA).

The spray nozzle 101 is connected to the cleaning solution injection unit 102 and the gas injection unit 103 , and mixes the cleaning solution and the drying gas supplied through the cleaning solution injection unit 102 and the gas injection unit 103 through the discharge port. can be sprayed Hereinafter, the mixture of the cleaning liquid and the drying gas will be referred to as a mixed fluid (F). The spray nozzle 101 may spray a double stream of a cleaning liquid and a drying gas through a discharge port.

The spray nozzle 101 may have a longitudinal direction disposed along the width of the substrate S. In this case, the substrate S passes through the cleaning position along the movement direction perpendicular to the width, and the mixed fluid F is injected to the substrate S through the discharge port formed along the longitudinal direction of the injection nozzle 101. Therefore, the mixed fluid F may be evenly sprayed on the entire surface of the substrate S.

Since the plurality of spray nozzles 101 spray the mixed fluid F toward the substrate S, the cleaning solution may be evenly sprayed on the entire surface of the substrate S.

The spray nozzle 101 may include a cleaning liquid supply slit 1013 formed therein to allow the supplied cleaning liquid to flow, and a gas supply slit 1012 formed therein to allow the supplied gas to flow. The cleaning solution supply slit 1013 and the gas supply slit 1012 may be formed in the spray nozzle 101 to be separated from each other. The cleaning solution supply slit 1013 and the gas supply slit 1012 may be connected to one another through the spray slit 1011 . One side of the spray slit 1011 may be simultaneously connected to the cleaning solution supply slit 1013 and the gas supply slit 1012 , and the other end may communicate with a discharge port formed at an end of the spray nozzle 101 . In other words, the cleaning liquid supply slit 1013 and the gas supply slit 1012 may be integrated into the spray slit 1011 . Since the cleaning liquid and the drying gas are supplied through the cleaning liquid supply slit 1013 and the gas supply slit 1012 , the cleaning liquid and the gas slit may be mixed in the spray slit 1011 . In the process in which the cleaning liquid is supplied to the injection slit 1011 , the dry gas supplied from the gas supply slit 1012 is supplied to the injection slit 1011 , so the mixed fluid F discharged from the injection slit 1011 is the liquid and The gas may be injected through the outlet in the form of a mixed aerosol.

Meanwhile, since the cleaning liquid and the drying gas are supplied to the spray nozzle 101 in a heated state, the mixed fluid F sprayed through the outlet of the spray nozzle 101 may have a temperature higher than room temperature. In this case, the temperature of the mixed fluid F injected through the outlet may be in the range of 45 degrees to 52 degrees. Preferably, the temperature of the mixed fluid F may be in the range of 47.5 degrees to 49.5 degrees.

Based on the cross section perpendicular to the longitudinal direction of the spray nozzle 101, the cleaning solution supply slit 1013 is connected in a direction perpendicular to the spray slit 1011, and the gas supply slit 1012 is the spray slit ( 1011) can be connected in a parallel direction. In other words, the width D1 of the spray slit 1011 and the width D2 of the cleaning solution supply slit 1013 are perpendicular to each other, and the width D1 of the spray slit 1011 and the width D of the gas supply slit 1012 ( D3) may be parallel to each other.

The width D1 of the spray slit 1011 may be greater than the width D2 of the cleaning solution supply slit 1013 . According to such a structure, while the inertia force of the mixed fluid F with respect to the substrate S passing through the cleaning position has a maximum value, it is possible to ensure high cleaning uniformity with respect to the entire surface of the substrate S.

4 is a structural diagram of the cleaning solution supply module 110 according to an embodiment, and FIG. 5 is a perspective view of the gas supply module 120 according to an embodiment.

4 and 5 , the cleaning liquid supply module 110 and the gas supply module 120 may heat the cleaning liquid and the drying gas, respectively, and supply them to the fluid spraying device 100 .

The cleaning solution supply module 110 may include a first supply line 111 , a second supply line 112 , a bubbler 113 , a pressure pump 114 , a cleaning solution heating unit 115 , and a discharge line.

The first supply line 111 may receive a cleaning solution at room temperature. The cleaning liquid may be, for example, pure water. The first supply line 111 may be provided with a manual valve for selectively blocking the flow of the cleaning liquid and an air valve for adjusting the flow pressure of the cleaning liquid.

The second supply line 112 may receive carbon dioxide.

The first supply line 111 and the second supply line 112 may be connected to the bubbler 113 . The bubbler 113 may reduce the specific resistance of the cleaning liquid by dissolving the carbon dioxide supplied through the second supply line 112 in the cleaning liquid supplied through the first supply line 111 . When the specific resistance of the cleaning liquid is reduced, it is possible to prevent the cleaning liquid sprayed on the substrate (S) from generating static electricity, thereby preventing dust and foreign substances from adhering to the surface of the substrate (S) due to static electricity. The bubbler 113 may include a resistivity meter for measuring the resistivity value of the cleaning solution treated therein. When the measured specific resistance value of the cleaning liquid reaches the set value, the cleaning liquid inside the bubbler 113 may be supplied to the cleaning liquid heating unit 115 to be described later.

The pressure pump 114 may be connected between the bubbler 113 and the cleaning liquid heating unit 115 to adjust the pressure of the cleaning liquid supplied to the cleaning liquid heating unit 115 . Through the operation of the pressure pump 114 , the flow rate of the cleaning liquid and the pressure of the cleaning liquid supplied to the fluid injection device 100 may be adjusted.

A manual valve for selectively blocking the flow of the cleaning liquid may be provided between the pressure pump 114 and the cleaning liquid heating unit 115 .

The cleaning liquid heating unit 115 may be configured in the form of a pipe, and may heat the cleaning liquid while flowing the cleaning liquid along the inside. The cleaning liquid heating unit 115 is provided with a heater for heating the cleaning liquid, the heater may be formed of a titanium material. The pipe forming the cleaning solution heating unit 115 is made of stainless steel (Steel Use Stainless), and Teflon may be coated therein.

The cleaning liquid may be heated to a set temperature while passing through the cleaning liquid heating unit 115 . The set temperature of the cleaning solution may be, for example, in the range of 30 degrees to 70 degrees. A temperature sensor and a valve are provided at the discharge portion of the cleaning liquid heating unit 115 , and the valve may operate to discharge the cleaning liquid only when the temperature of the cleaning liquid measured through the temperature sensor falls within a set temperature range.

The cleaning liquid that has passed through the cleaning liquid heating unit 115 is supplied to a discharge line, which includes a filter 116 for filtering the cleaning liquid, a temperature sensor 117 and a pressure sensor 118 for measuring the pressure and temperature of the cleaning liquid. ) may be provided.

When the temperature and pressure of the cleaning liquid after the heating process is within the set range, the discharge line may discharge the cleaning liquid to the cleaning liquid injection unit 102 of the fluid ejection device 100 .

The gas supply module 120 may heat the dry gas and supply it to the fluid injection device 100 . The gas supply module 120 may include a gas supply line 121 , a gas heating unit 123 , and an exhaust line.

The gas supply line 121 may receive dry gas from the outside. The drying gas may be, for example, compressed dry air. The gas supply line 121 may include a manual valve for selectively blocking the flow of the drying gas, a pressure gauge and regulator 122 for flowing the drying gas at a set pressure, and an air valve.

The dry gas passing through the gas supply line 121 may be supplied to the gas heating unit 123 . The gas heating unit 123 may heat the dry gas passing through the inside to a set temperature. The set temperature may be, for example, in the range of 60 degrees to 130 degrees.

The gas heating unit 123 may be formed of a titanium material to prevent thermal damage due to heating.

A temperature sensor 125 for measuring the temperature of the heated dry gas may be provided at the discharge part of the gas heating unit 123 . The dry gas that has passed through the gas heating unit 123 may pass through the filter 124 and be supplied to the exhaust line.

A temperature sensor and a pressure sensor 126 for measuring the pressure and temperature of the drying gas are provided in the exhaust line, and a valve for controlling the discharge of the drying gas may be provided.

The dry gas passing through the exhaust line may be discharged to the dry gas supply unit of the fluid injection device 100 .

According to this structure, in the substrate cleaning system 1 according to an embodiment, the drying gas and the cleaning liquid are independently heated to be supplied to a temperature within a set range, and the supplied drying gas and the cleaning liquid are mixed to form the substrate S. By spraying, the cleaning efficiency with respect to the board|substrate S can be greatly increased.

As described above, although the embodiments have been described with reference to the limited drawings, various modifications and variations are possible from the above description by those of ordinary skill in the art. For example, the described techniques are performed in an order different from the described method, and/or the described components of structures, devices, etc. are combined or combined in a different form than the described method, or other components or equivalents are used. Appropriate results can be achieved even if substituted or substituted by

1: Substrate cleaning system
100: fluid injection device
110: cleaning solution supply module
120: dry gas supply module

Claims (15)

a cleaning liquid supply module for receiving the cleaning liquid and heating it to a set first temperature;
a gas supply module for receiving the dry gas and heating it to a set second temperature; and
and a fluid ejection device connected to the cleaning liquid supply module and the gas supply module, respectively, to receive the heated cleaning liquid and the drying gas, and spray a double fluid mixed with the supplied cleaning liquid and the drying gas onto the substrate to be cleaned. cleaning system. The method of claim 1,
The cleaning solution supply module,
a first supply line into which the cleaning solution is injected;
a bubbler connected to the first supply line and configured to reduce the specific resistance of the cleaning solution;
a cleaning liquid heating unit in which the cleaning liquid passing through the bubbler flows and heating the cleaning liquid flowing therein to the first temperature; and
and a discharge line for discharging the heated cleaning liquid to the fluid ejection device. 3. The method of claim 2,
The cleaning solution supply module,
It is connected to the bubbler, further comprising a second supply line for receiving carbon dioxide,
The bubbler dissolves the carbon dioxide in the cleaning liquid that has passed through the first supply line to reduce the specific resistance of the cleaning liquid. 3. The method of claim 2,
The cleaning solution supply module,
The substrate cleaning system further comprising: a pressure pump disposed between the bubbler and the cleaning solution heating unit and configured to adjust a cleaning solution supply pressure to the cleaning solution heating unit. 3. The method of claim 2,
The washing liquid is pure water (De Ionized Water),
The first temperature is in the range of 30 degrees to 70 degrees, the substrate cleaning system. According to claim 1,
The gas supply module,
a gas supply line into which the drying gas is injected;
a gas heating unit connected to the gas supply line and heating the dry gas to the second temperature; and
and an exhaust line for exhausting the dry gas heated by the gas heating unit to the fluid ejection device. 7. The method of claim 6,
The drying gas is compressed dry air (CDA),
The second temperature is in the range of 60 degrees to 130 degrees, the substrate cleaning system. According to claim 1,
The cleaning solution supply module and the gas supply module,
a control valve for selectively regulating the supply of cleaning liquid and drying gas to the fluid ejection device; and
and measuring sensors for measuring pressures and temperatures of the cleaning liquid and the drying gas supplied to the fluid ejection device, respectively. According to claim 1,
The fluid injection device,
an injection nozzle formed along the longitudinal direction and including a discharge port through which the mixed air of the cleaning liquid and the drying gas is discharged;
a cleaning liquid injection unit connecting the cleaning liquid supply module and the spray nozzle; and
and a gas injection unit connecting the gas supply module and the injection nozzle. 10. The method of claim 9,
The spray nozzle is
The longitudinal direction is disposed so as to be perpendicular to the moving direction of the substrate to be cleaned,
and spraying the mixed air simultaneously throughout the longitudinal direction through the discharge port. 11. The method of claim 10,
The spray nozzle is based on a cross section perpendicular to the longitudinal direction,
a cleaning liquid supply slit through which the supplied cleaning liquid flows;
a gas supply slit through which the supplied dry gas flows; and
and a spray slit having one side communicating with the cleaning solution supply slit and the gas supply slit at the same time and the other side communicating with the discharge port. 12. The method of claim 11,
Based on a cross section perpendicular to the longitudinal direction of the spray nozzle,
The cleaning solution supply slit is connected in a direction perpendicular to the spray slit,
and the gas supply slit is connected in a direction parallel to the injection slit. 13. The method of claim 12,
and a width of the cleaning solution supply slit is narrower than a width of the spray slit. 10. The method of claim 9,
The temperature of the mixed air of the cleaning liquid and the drying gas sprayed through the outlet is in the range of 45 degrees to 52 degrees, the substrate cleaning system. a substrate transfer device for transferring the substrate;
a fluid ejection device having a longitudinal direction perpendicular to the transport direction of the substrate and including a jet nozzle configured to jet a mixed air of a cleaning liquid and a drying gas through a discharge port formed along the longitudinal direction;
a cleaning liquid supply module connected to the spray nozzle and heating the cleaning liquid to a set first temperature and supplying the cleaning liquid to the fluid spraying device; and
and a gas supply module connected to the spray nozzle and configured to heat the dry gas to a set second temperature and supply it to the fluid spray device.

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