KR20220049164A - Rubbing apparatus for manufacturing organic electronic device parts and system for manufacturing organic electronic device parts and method for manufacturing encapsulation member of organic electronic device parts using the same - Google Patents

Abstract

Provided is a rubbing apparatus for manufacturing an organic electronic device component comprising: a seating unit on which an organic electronic device component is seated; and a film peeling unit which is disposed at an edge of the seating unit. The organic electronic device component includes: a metallic sheet; and an adhesive sheet which is attached to an upper end of the metallic sheet, and which is provided with a protective film attached to the top side thereof. The film peeling unit presses and rolls the top side of an edge region of the adhesive sheet of the organic electronic device component, thereby peeling a part of the edge region of the protective film. In addition, the present invention also provides a system for manufacturing a component for an organic electronic device, and a manufacturing process for an organic electronic device component using the same.

Description

Rubbing apparatus for manufacturing organic electronic device parts, manufacturing system for organic electronic device parts having same, and organic electronic device parts manufacturing process using same member of organic electronic device parts using the same}

The present invention relates to a rubbing device for manufacturing an organic electronic device component, a manufacturing system for an organic electronic device component having the same, and a manufacturing process for an organic electronic device component using the same.

2. Description of the Related Art In general, an organic light emitting diode (OLED) is a light emitting diode in which a light emitting layer is made of a thin organic compound, and uses an electroluminescence phenomenon to generate light by passing a current through a fluorescent organic compound.

In general, such an organic light emitting diode implements a main color by a three-color (Red, Green, Blue) independent pixel method, a bioconversion method (CCM), a color filter method, and the like.

The organic light emitting diode is classified into a low molecular weight organic light emitting diode and a high molecular weight organic light emitting diode according to the amount of organic material included in the light emitting material used.

In addition, according to the driving method, it may be divided into a passive driving method and an active driving method.

Since such an organic light emitting diode has characteristics such as high efficiency by self-emission, low voltage driving, and simple driving, it is possible to express high-quality video.

In addition, applications to flexible displays and organic electronic devices using the flexible characteristics of organic materials are also expected.

The organic light emitting diode is manufactured in the form of laminating an organic compound, which is a light emitting layer, in the form of a thin film on a substrate.

The organic compound used in the organic light emitting diode is very sensitive to impurities, oxygen, and moisture, and thus there is a problem in that properties are easily deteriorated by external exposure or penetration of moisture and oxygen.

This deterioration of the organic material affects the light emitting characteristics of the organic light emitting diode and shortens the lifespan. In order to prevent this phenomenon, a thin film encapsulation process is required to prevent oxygen, moisture, etc. from flowing into the inside of the organic electronic device.

An organic electronic device component manufactured in such a thin film encapsulation process includes a metal sheet and an adhesive sheet bonded to an upper surface of the metal sheet.

A manufacturing process of a conventional organic electronic device component will be described.

In the pretreatment process, the metal sheet is rolled to a constant thickness. The rolled metal sheet is produced in the form of a roll.

In the post-processing process, the metal sheet is supplied to the lamination unit through the metal sheet supply unit.

The adhesive sheet is supplied to the lamination unit through the adhesive sheet supply unit.

The lamination unit laminates the supplied metal sheet and the adhesive sheet by applying a predetermined heat.

The metal sheet and the adhesive sheet laminated as described above (hereinafter referred to as an organic electronic device component) are cut to achieve a certain standard through a laser cutting unit.

Then, the appearance and cut surface of the cut organic electronic device parts are inspected.

The organic electronic device parts cut after the inspection is completed as described above may be discharged after being sorted into good products and defective products according to the inspection standards.

The organic electronic device components selected as good products are moved to the cleaning unit.

The cleaning unit may sequentially clean a long side and a short side of the organic electronic device component.

In addition, the organic electronic device components that have been cleaned may be discharged and stacked on a tray.

On the other hand, in the case of manufacturing an organic electronic device component for an organic electronic device in this way, the laminated metal sheet and the adhesive sheet were cut using a CO2 laser and a fiber laser cutting method.

The conventional laser cutting method has a problem of forming a heat deformation region between the metal sheet and the adhesive sheet because the laser cutting is performed using the heat of the laser itself. That is, the thermal strain formation region includes a region in which a barrier is formed on an upper edge of the adhesive sheet and residues are generated on cut surfaces of the metal sheet and the adhesive sheet.

In addition, there is a problem in that burrs are generated on the cut surfaces of the metal sheet and the adhesive sheet.

Accordingly, when the upper surface of the adhesive sheet is adhered to the TFT cathode layer, if impurities or foreign substances are present on the surface, there is a problem of causing damage to the organic device and causing defects in the form of dark spots.

Accordingly, in the case of manufacturing an organic electronic device component using the laser cutting method, the edge portion of the protective layer attached to the upper layer of the adhesive sheet while efficiently removing the barrier formed on the upper edge of the adhesive sheet of the organic electronic device component A skill is required to make a part excited.

Republic of Korea Patent Publication No. 10-2017-0126215 (published on November 17, 2017)

The present invention has been devised to solve the above problems, and a first object of the present invention is to eliminate barrier defects in the adhesive sheet that are generated when an organic electronic device component having a metal sheet and an adhesive sheet is cut using a laser. To provide a rubbing device for manufacturing an organic electronic device component capable of preventing defects in the organic electronic device, a manufacturing system for an organic electronic device component having the same, and a manufacturing process for an organic electronic device component using the same.

In addition, a second object of the present invention is a rubbing device for manufacturing an organic electronic device component capable of stably removing the protective film in a post-process by peeling a portion of the protective film from a plurality of corners of the upper surface of an adhesive sheet constituting an organic electronic device component, and An object of the present invention is to provide a system for manufacturing a component for an organic electronic device having the same, and a manufacturing process for an organic electronic device component using the same.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned may be understood by the following description, and will be more clearly understood by the examples of the present invention. Moreover, it will be readily apparent that the objects and advantages of the present invention may be realized by means of the instrumentalities and combinations thereof indicated in the appended claims.

In order to achieve the above object, the present invention provides a rubbing apparatus for manufacturing an organic electronic device component.

The rubbing device for manufacturing an organic electronic device component includes: a metal sheet; a seating part on which an organic electronic device component having an adhesive sheet attached to an upper end of the metal sheet and having a protective film attached thereon is seated; and a film peeling unit disposed at a corner portion of the seating unit and configured to peel a part of the corner area of the protective film by pressing and rolling an upper surface of the corner area of the adhesive sheet of the organic electronic device component.

Here, the film peeling part includes a plurality of unit peeling parts forming a plurality to be disposed on each corner of the seating part,

The plurality of unit peeling parts,

It is preferable to include a peeling roller for peeling a part of the edge area of the protective film by rolling after pressing the upper surface of the edge area of the adhesive sheet with a set pressing force.

And it is preferable that the said peeling roller is replaceable.

In addition, the plurality of unit peeling parts,

It is preferable to include a sensor for detecting whether a portion of the edge region of the protective film is peeled off.

In addition, it is preferable that the pressing force can be variably set by adjusting the elevation level of the peeling roller.

In addition, on the outer periphery of the peeling roller,

It is preferable that the adhesive layer is selectively provided.

According to another embodiment, the present invention provides a system for manufacturing an organic electronic device component.

The organic electronic device component manufacturing system uses a laser or a cutting blade to cut the organic electronic device parts in which the metal sheet and the adhesive sheet that are moved along a set movement path are laminated to a set size to form unit organic electronic device parts. cut to form; a cleaning unit disposed along the movement path and cleaning an edge of each of the unit organic electronic device components moving along the movement path; The edge region of the protective film attached to the top surface of the adhesive sheet by pressing and rolling the upper surface of the edge region of the adhesive sheet of each of the unit organic electronic device components disposed along the movement path and moving along the movement path It includes; a rubbing part that peels off a part.

Here, the rubbing part,

a seating portion on which the organic electronic device component is mounted;

It is preferable to include a film peeling part disposed at the corner of the seating part and configured to peel a part of the edge of the protective film by pressing and rolling the upper surface of the edge area of the adhesive sheet of the organic electronic device component.

And the film peeling unit includes a plurality of unit peeling units forming a plurality so as to be disposed on each corner of the seating unit,

The plurality of unit peeling parts,

It is preferable to include a peeling roller for peeling a part of the edge area of the protective film by rolling after pressing the upper surface of the edge area of the adhesive sheet with a set pressing force.

Moreover, it is preferable that the said peeling roller is replaceable.

In addition, the plurality of unit peeling parts,

It is preferable to include a sensor for detecting whether a portion of the edge region of the protective film is peeled off.

In addition, the pressing force is

It is preferable that the lifting level of the peeling roller can be adjusted to be variably set.

In addition, on the outer periphery of the peeling roller,

It is preferable that the adhesive layer is selectively provided.

In addition, the cleaning unit,

Adhering the cleaning member to the upper surface and lower surface of the edge of the organic electronic device component,

As the cleaning member reciprocates, it is preferable to simultaneously clean the upper and lower surfaces of the edges of the organic electronic device component.

In addition, the cleaning unit,

a rotating part for reciprocating the cleaning member;

Provided with a cleaning liquid supply for supplying a cleaning liquid to the rotating cleaning member,

The cleaning solution supply unit,

It is preferable to supply the cleaning liquid before the cleaning member is in close contact with the upper and lower surfaces of the edges of the organic electronic device component.

In addition, the cleaning solution may include at least one organic solvent selected from ethanol, isopropyl alcohol, methyl ethyl ketone, acetone, toluene, xylene, and tetrahydrofuran.

In yet another embodiment, the present invention provides a process for manufacturing an organic electronic device component.

In the manufacturing process of the organic electronic device part, the organic electronic device part in which the metal sheet and the adhesive sheet moving along a set movement path are laminated to each other are cut through a cutting unit using a laser or a cutting blade to achieve a set size to form a unit organic electronic device. A cutting step of forming parts, a cleaning step of cleaning the edges of each of the unit organic electronic device components moving along the movement path using a cleaning unit disposed along the movement path, and a cleaning step along the movement path A portion of the edge region of the protective film attached to the top surface of the adhesive sheet by pressing and rolling the upper surface of the edge region of the adhesive sheet of each of the unit organic electronic device components moving along the movement path using the disposed rubbing part It includes a peeling step of peeling off.

By means of the above solution, the present invention is effective in preventing defects in the organic electronic device by removing barrier defects in the adhesive sheet that are generated when the organic electronic device parts having the metal sheet and the adhesive sheet are cut using a laser. has

In addition, the present invention has the effect of stably removing the protective film in a post-process by peeling a portion of the protective film from a plurality of corners of the upper surface of the adhesive sheet constituting the component of the organic electronic device.

In addition to the above-described effects, the specific effects of the present invention will be described together while describing specific details for carrying out the invention below.

1 is a diagram schematically showing the configuration of a system for manufacturing an organic electronic device component according to the present invention.
2 is a view showing an example of a cut part according to the present invention.
3 is a view schematically showing an arrangement state of a cleaning unit according to the present invention.
4A is a view showing the configuration of a first cleaning unit according to the present invention.
Figure 4b is a view showing the configuration of the second cleaning unit according to the present invention.
5 is a schematic view showing an arrangement state of the rubbing part according to the present invention.
6 is a perspective view showing the configuration of a rubbing part according to the present invention.
7 is a flowchart illustrating a manufacturing process of an organic electronic device component for an organic electronic device according to the present invention.
8 is a view showing the process of a cleaning step according to the present invention.
9A to 9D are views illustrating a process of cleaning the long side.
10 to 15 are views showing a rubbing step according to the present invention.
16 is a view showing an organic electronic device component having a barrier formed thereon and an organic electronic device component after a rubbing process.

Hereinafter, with reference to the drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them.

The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly explain the present invention, parts irrelevant to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

In the following, the provision or arrangement of an arbitrary component on the “upper (or lower)” or “top (or below)” of the substrate means that any component is provided or disposed in contact with the upper surface (or lower surface) of the substrate. means that

Further, it is not limited to not include other components between the substrate and any components provided or disposed on (or under) the substrate.

Hereinafter, a rubbing device for manufacturing an organic electronic device component, a manufacturing system for an organic electronic device component for an organic electronic device having the same, and a manufacturing process for an organic electronic device component using the same will be described with reference to the accompanying drawings.

First, since the rubbing apparatus for manufacturing an organic electronic device component of the present invention is a component included in the manufacturing system of the organic electronic device component for an organic electronic device of the present invention, the system will be described including the description.

1 is a diagram schematically showing the configuration of a system for manufacturing an organic electronic device component according to the present invention.

Referring to FIG. 1 , the manufacturing system of an organic electronic device component of the present invention includes a metal sheet supply unit 100 , an adhesive sheet supply unit 200 , a lamination unit 300 , a cutting unit 400 , and a cleaning unit 500 . ) and a rubbing part 600 .

Here, the organic electronic device component to be manufactured according to the present invention is preferably an encapsulant including a metal sheet and an adhesive sheet attached to the metal sheet. In the following description, the component will be described as an encapsulant.

The metal sheet supply unit 100 according to the present invention supplies the metal sheet 10 having a set thickness. The metal sheet 10 is preferably cleaned in a pre-treatment process. Accordingly, it is preferable to form a state in which foreign substances such as rolling oil are removed from the outer surface of the metal sheet 10 .

The metal sheet supply unit 100 supplies the metal sheet 10 to the lamination unit.

The adhesive sheet supply unit 200 according to the present invention supplies the adhesive sheet 20 to the lamination unit 300 .

The adhesive sheet 20 may include a polyolefin-based adhesive resin, a tackifier, and a moisture absorbent.

Here, the metal sheet supply unit 100 supplies the metal sheet 10 along a first path, and the adhesive sheet supply unit 200 supplies the adhesive sheet 20 along a second path.

The lamination unit 300 laminates the metal sheet 10 and the adhesive sheet 20 moving along each path within a set heating temperature range.

The lamination unit 300 includes a temperature controller (not shown) for controlling the temperature, and may variably control the temperature according to the control of the controller 900 .

As described above, the metal sheet 10 and the adhesive sheet 20 laminated in the lamination unit 300 are moved along the movement path set by the cutting unit 400 .

Hereinafter, the metal sheet 10 and the adhesive sheet 20 laminated to each other are referred to as an encapsulant (E). A release paper is formed on the upper surface of the adhesive sheet.

2 is a view showing an example of a cutout according to the present invention.

Referring to FIG. 2 , the cutting unit 400 according to the present invention has a laser emitter 410 . The laser emitter 410 may use a CO2 laser.

The laser emitter 410 cuts the encapsulant E moving along a set movement path.

The laser emitter 410 emits at time intervals to the first and second positions of the moving encapsulant (E) and cuts along the width direction orthogonal to the moving direction, thereby cutting the encapsulant to a certain standard. can

That is, the pair of short sides of the encapsulant E are cut and formed by the laser emitted from the laser emitter 410 .

Accordingly, the encapsulant (E) is manufactured in a rectangular plate shape having a pair of long sides and a pair of short sides.

Of course, the cutting unit 400 according to the present invention may use a cutting unit using a cutting blade in addition to cutting using a laser.

As described above, the unit encapsulants 30 having a predetermined standard are sequentially cut and then sequentially moved to the cleaning unit 500 .

The cleaning unit 500 according to the present invention will be described.

3 is a view schematically showing an arrangement state of the cleaning unit according to the present invention, FIG. 4A is a view showing the configuration of the first cleaning unit according to the present invention, and FIG. 4B is the configuration of the first cleaning unit according to the present invention is a drawing showing

Referring to FIG. 3 , the cleaning unit 500 according to the present invention includes a first cleaning unit 501 and a second cleaning unit 502 .

Meanwhile, the first cleaning unit 501 is disposed to clean the short sides of both sides of the cut unit encapsulant 30 as shown in FIG. 3A .

The configuration of the first cleaning unit 501 will be described.

Referring to FIG. 4A , the first cleaning unit 501 includes a first rail 510 and a first cleaning device 530 disposed on the first rail 520 . The first cleaning device 530 is configured as a single piece.

The configuration of each of the first cleaning devices 530 is as follows.

The first cleaning device 530 has a cleaning unit body 531 on which the first rail 510 is formed.

A space is formed at one side of the cleaning unit body 531 .

A pair of first clamps 532 are disposed to face each other at the upper and lower portions of the space.

The pair of first clamps 532 are moved in opposite directions under the control of the controller 900 .

And a first cleaning member 533 is positioned on the outer surface of the pair of first clamps 532 .

The first cleaning member 533 has a predetermined width and length.

A first winder 534 is installed at an upper end of the washing unit body 531 , and a second winder 535 is installed at a lower end of the washing unit main body 531 .

The first and second winders 534 and 535 are rotating parts.

In the cleaning unit body 531 , a first cleaning member 533 forms a path for the first winder 534 , the outer surface of the pair of first clamps 532 , and the second winder 535 . A plurality of guide rollers 536 are installed to do so.

The first and second winders 534 and 535 are driven under the control of the controller 900 .

Accordingly, the first cleaning member 533 wound on the first winder 534 is moved along the path while being unwound by the driving of the first winder 534 and is wound up by the second winder 535 . do.

In addition, a cleaning liquid supply 537 is installed in the vicinity of the cleaning unit body 531 .

The cleaning liquid supply 537 supplies a predetermined amount of the cleaning liquid to the first cleaning member 533 moving through the supply pipe.

The cleaning solution may include at least one organic solvent selected from ethanol, isopropyl alcohol, methyl ethyl ketone, acetone, toluene, xylene, and tetrahydrofuran.

Accordingly, the first cleaning member 533 may absorb the supplied cleaning liquid.

Each of the first cleaning devices 530 stand by at positions forming a set interval on the first rail 510 .

Under the control of the controller 900 , the first cleaning device 530 is moved to a position corresponding to one side of each short side of the unit encapsulant 30 .

A pair of first clamps 532 of each of the first cleaning devices 530 grip the upper and lower surfaces of the unit encapsulant 30 . Accordingly, the first cleaning member 533 is in close contact with the upper and lower surfaces of the unit encapsulant 30 .

The first cleaning device 530 reciprocates from one end surface side of the unit encapsulant 30 to the other side.

During the reciprocating movement, the upper and lower surfaces of each short side of the unit encapsulant 30 are cleaned while being in close contact with the moving first cleaning member 533 . The cleaning may be more efficiently performed by the cleaning liquid supplied to the first cleaning member 533 .

Meanwhile, as shown in FIG. 3B , the second cleaning unit 502 is disposed to clean the long side of the cut unit encapsulant 30 .

Referring to FIG. 4B , the second cleaning unit 502 includes a second rail 540 and a second cleaning device 550 disposed on the second rail 540 . The second cleaning device 550 is configured as a single piece.

The configuration of each of the second cleaning devices 550 is as follows.

The second cleaning device 550 has a cleaning unit body 551 on which the second rail 540 is formed.

A space is formed at one side of the cleaning unit body 551 .

A pair of second clamps 552 are provided at the upper and lower portions of the space to face each other.

The pair of second clamps 552 are moved in opposite directions under the control of the controller 900 .

And a second cleaning member 553 is positioned on the outer surface of the pair of second clamps 552 .

The second cleaning member 553 has a predetermined width and length.

A first winder 554 is installed at an upper end of the washing unit body 551 , and a second winder 555 is installed at a lower end of the washing unit main body 551 .

The first and second winders 554 and 555 are rotating parts.

In the cleaning unit body 551 , a second cleaning member 553 forms a path for the first winder 554 , the outer surface of the pair of second clamps 552 , and the second winder 555 . A plurality of guide rollers 556 are installed to do so.

The first and second winders 554 and 555 are driven under the control of the controller 900 .

Accordingly, the second cleaning member 553 wound around the first winder 554 is moved along the path while being unwound by the driving of the first winder 554 to be wound by the second winder 555 . do.

In addition, a cleaning liquid supply 557 is installed in the vicinity of the cleaning unit body 551 .

The cleaning liquid supply 557 supplies a predetermined amount of the cleaning liquid to the second cleaning member 553 moving through the supply pipe.

Accordingly, the second cleaning member 553 may absorb the supplied cleaning liquid.

Each of the pair of second cleaning devices 550 is on standby at a position forming a set interval on the second rail 540 .

Under the control of the controller 900 , the pair of second cleaning devices 550 is moved to a position corresponding to the center of the long side of the unit encapsulant 30 .

A pair of second clamps 552 of each of the second cleaning devices 550 grip the upper and lower surfaces of the unit encapsulant 30 . Accordingly, the second cleaning member 553 is in close contact with the upper and lower surfaces of the unit encapsulant.

Each of the second cleaning devices 550 is spaced apart from one another by a predetermined distance. The upper and lower surfaces of each long side of the unit encapsulant 30 are cleaned by this distance.

Then, the controller 900 moves each of the second cleaning devices 550 to their original positions. While moving, the upper and lower surfaces of the unit encapsulant 30 may be cleaned while being in close contact with the moving second cleaning member 553 .

5 is a schematic view showing an arrangement state of the rubbing part according to the present invention, FIG. 6 is a perspective view showing the configuration of the rubbing part according to the present invention, and FIG. 7 is a manufacturing process of an organic electronic device component for an organic electronic device according to the present invention It is a flowchart showing, and FIG. 8 is a view showing the process of the cleaning step according to the present invention.

Referring to FIG. 5 , the rubbing part 600 according to the present invention has a seating part 601 and a film peeling part 602 . Here, the rubbing unit 600 according to the present invention has substantially the same configuration as that of the rubbing apparatus according to the present invention.

The seating portion 601 is formed in a plate shape.

The moving unit encapsulant 30 is seated on the seating portion 601 .

The unit encapsulant 30 may be adsorbed while waiting at a position moved through an adsorption unit (not shown) using a vacuum to be seated on the mounting unit 601 .

A film peeling unit 602 is disposed at a corner of the seating unit 601 .

The film peeling unit 602 presses and rolls the upper surface of the edge region of the adhesive sheet 20 of the unit encapsulant 30 to peel a portion of the edge region of the protective film 21 .

The film peeling part 602 includes a plurality of unit peeling parts 603 forming a plurality so as to be disposed on each corner of the seating part 601 .

Referring to FIG. 6 , the configuration of each of the plurality of unit peeling units 603 according to the present invention is as follows.

Each of the plurality of unit peeling parts 603 includes a base 610, an upright body 620 formed to be orthogonal to the base 610, and an elevating body that is arranged to be lifted from the upright body 620 ( 630), a protruding body 640 installed on the upper end of the elevating body 630 and bent to protrude forward, and a movable body 650 connected to the end of the protruding body 640 and moving forward and backward; , a support member 660 installed at an end of the movable body 650 , and a roller part 670 installed on the support member 660 .

An elevating cylinder 631 for elevating the elevating body 630 is provided on the base 610 . The lifting cylinder 631 is driven under the control of the controller 900 .

A pressing force sensor 690 measuring the pressing force generated while the lifting body 630 is lowered to the lifting cylinder 631 and the peeling roller 680 is in contact with the upper surface of the edge of the adhesive sheet 20 of the unit encapsulant 30 . ) is installed. The pressing force sensor 690 transmits the measured pressing force to the controller 900 .

A reference pressing force is set in the control unit 900 .

The controller 900 controls the driving of the lifting cylinder 631 so that the measured pressing force reaches the reference pressing force.

Also, the movable body 650 is moved forward and backward by driving the linear motor 651 .

Accordingly, in a state where the reference pressing force is formed, the controller 900 drives the linear motor 651 to move the moving body 650 forward and backward. Accordingly, the peeling roller 680 moves forward and backward while in contact with the upper surface of the corner portion of the adhesive sheet 20 of the unit encapsulant 30 to form a protective film at the corner of the adhesive sheet 20 of the unit encapsulant 30 . A part of (21) is peeled off.

The roller part 670 includes a first support member 671 and a second support member 672 that is detachably installed at an end of the first support member 671 and has a peeling roller 680 rotatably installed. ) has

The peeling roller 680 is rotatably fastened to a rotation shaft formed on the second support member 672 .

An extension member 673 extending to an area adjacent to the side of the peeling roller 680 is installed on the first supporting member 671 .

A sensor 674 is installed on the extension member 673 .

The sensor 674 is a sensor that detects that a portion of the protective film 21 of the adhesive sheet 20 is peeled off at the edge of the unit encapsulant 30 . The sensor 674 may be an optical sensor. The sensor 674 detects peeling by receiving light reflected on the peeled film 21 by irradiating light, and transmits the detection result to the controller 900 .

In addition, an adhesion layer (not shown) may be selectively installed on the outer periphery of the peeling roller 900 .

That is, an adhesive tape (not shown) may or may not be installed on the outer periphery of the peeling roller 680 .

Next, a manufacturing process of the encapsulant for an organic electronic device using the manufacturing system for the encapsulant for an organic electronic device according to the present invention configured as described above will be described.

Also, in describing the manufacturing process of the encapsulant for an organic electronic device, the configuration of the system will be referred to as described above.

7 is a flowchart illustrating a manufacturing process of an encapsulant for an organic electronic device according to the present invention.

A metal sheet 10 is supplied. The metal sheet 10 is in a state in which foreign substances on the outer surface are removed.

And the adhesive sheet 20 is supplied.

The supplied metal sheet 10 and the adhesive sheet 20 are laminated to each other through a laminating process.

The encapsulant (E) to be laminated in this way is put into the cutting part (400).

cutting step

As described above, the metal sheet 10 and the adhesive sheet 20 laminated to each other form the encapsulant E and are cut to a predetermined standard by the cutting unit 400 . The cutting cuts two cross-sections of the encapsulant (E) along the moving direction. The cut is cut using a laser. Of course, it is also possible to physically cut using a cutting blade other than a laser.

inspection phase

As described above, the unit encapsulant 30 cut to a predetermined standard undergoes an inspection step of visually determining that foreign substances are formed on each side.

In the inspection step, an image of each side of the unit encapsulant may be acquired using a vision device (not shown), and whether foreign matter is formed may be inspected through image processing.

cleaning step

8 is a view showing a process of a cleaning step according to the present invention, and FIGS. 9A to 9D are views showing a process of cleaning the long side.

8 and 9A to 9D , after the inspection step as described above, the unit encapsulant 30 is moved to the cleaning unit 500 .

The cleaning unit 500 sequentially cleans the section and the scene of the unit encapsulant.

The first cleaning unit 501 of the cleaning unit 500 cleans the two short sides of the unit encapsulant 30 moved to the first position.

The first cleaning device 530 of the first cleaning unit 501 is on standby at one end of the unit encapsulant 30 .

A first cleaning member 533 is disposed on the outer surface of the pair of first clamps 532 of each of the first cleaning devices 530 .

The cleaning liquid is supplied to the first cleaning member 533 through the cleaning liquid supplier 537 , and the first cleaning member 533 is wet with the cleaning liquid.

In addition, the cleaning solution may include at least one organic solvent selected from ethanol, isopropyl alcohol, methyl ethyl ketone, acetone, toluene, xylene, and tetrahydrofuran.

A pair of first clamps 532 of each of the first cleaning devices 530 clamp one side of the short side of the unit encapsulant 30 . Accordingly, the first cleaning member 533 is in close contact with the upper and lower surfaces of the unit encapsulant 30 .

Then, the pair of first clamps 532 of each of the first cleaning devices 530 are reciprocated by driving a linear motor (not shown) along the first rail 510 .

As the pair of first clamps 531 reciprocate, the upper and lower surfaces of the short side of the unit encapsulant 30 may be cleaned by wiping the upper and lower surfaces of the short side by the cleaning member 532 wetted with the cleaning solution.

As described above, the unit encapsulant 30 having the short side cleaned is moved to the second position.

The second cleaning unit 502 cleans the scene of the unit encapsulant 30 moved to the second position.

As shown in FIG. 9A , the second cleaning unit 502 has a pair of second cleaning devices 550 on each long side thereof.

Each of the pair of second cleaning devices 550 is on standby at a position forming a set interval on the second rail 540 .

Then, as shown in FIG. 9B , the pair of second cleaning devices 550 are moved to a position corresponding to the center of the long side of the unit encapsulant 30 under the control of the controller 900 (see center line). )

A pair of second clamps 552 of each of the second cleaning devices 550 grip the upper and lower surfaces of the unit encapsulant 30 . Accordingly, the second cleaning member 553 is in close contact with the upper and lower surfaces of the unit encapsulant 30 .

And as shown in FIG. 9C , each of the second cleaning devices 550 is moved to one side by a predetermined distance L. The upper and lower surfaces of each long side of the unit encapsulant 30 are cleaned by the moved distance L.

Then, as shown in FIG. 9D , the controller 900 moves each of the second cleaning devices 550 to their original positions. While moving, the upper and lower surfaces of the unit encapsulant 30 may be cleaned while being in close contact with the moving second cleaning member 553 .

Accordingly, the short and long sides of the unit encapsulant 30 are sequentially cleaned, and the upper and lower surfaces may be simultaneously cleaned. In addition, since the second cleaning devices are moved to the center line on each long side of the unit encapsulant 30 and returned to their original position after being moved a certain distance, it is possible to efficiently solve the problem that an uncleaned area is generated on each long side.

As such, the unit encapsulant 30 on which the side cleaning is completed is moved to the rubbing unit 600 after the surface cleaning is performed.

rubbing step

10 to 15 are views showing a rubbing step according to the present invention.

10 to 15 , the unit encapsulant 30 that has undergone the cleaning step is moved toward the rubbing unit 600 .

The vacuum adsorption means 601a vacuum adsorbs the moved unit encapsulant 30 and moves it through a moving device (not shown) to seat it on the seating unit 601 .

Here, the four unit peeling parts 603 constituting the rubbing part 600 according to the present invention are respectively disposed in the vicinity of the corners of the unit encapsulant 30 forming a square plate shape. This is a standby state.

Then, each unit peeling unit 603 moves so that the peeling roller 680 is positioned on the mounting part 601 .

Then, each peeling roller 680 is closely attached to the upper surface of the seating part to form a reference pressing force.

Each unit peeling unit 603 moves each peeling roller 680 forward and backward by a set reciprocating distance in a state where the reference pressing force is formed as described above.

Accordingly, each peeling roller 680 releases the pressure after pressing the protective film 21 attached to the upper surface of the unit encapsulant 30 .

In addition, a portion of the protective film 21 at the corner of the unit encapsulant 30 may be peeled off from the adhesive sheet.

As a part of the protective film 21 is peeled off as described above, the protective film 21 may be easily removed in a subsequent process.

In addition, as described above, the barrier formed by deforming due to the heat of the laser at the edge of the unit encapsulant 30 during the laser cutting process is pressed by the peeling roller 680, so that the region in which the barrier is formed can be flattened. .

16 is a view showing an encapsulant having a barrier formed thereon and an encapsulant after a rubbing process.

As shown in FIG. 16 , in the unit encapsulant 30 manufactured by laser cutting, a barrier is formed at the end of the protective film 21 , which is a release layer, by thermal fusion. The unit encapsulant 30 of the present invention may have a very low or no height deviation because such a barrier hardly occurs.

Accordingly, when the glass is seated on the upper surface of the unit encapsulant 30 in the subsequent process, physical interference with the glass is prevented, thereby preventing product defects.

Then, the rubbing process may be reversed through the unit encapsulant reversing device and loaded into the loading device.

Of course, it is also possible to use a separate vision inspection device to inspect the side of the metal member before loading.

According to the above configuration and action, the present invention can prevent defects in the organic electronic device by removing barrier defects in the adhesive sheet that are generated when the encapsulant having the metal sheet and the adhesive sheet is cut using a laser.

In addition, according to the present invention, a portion of the protective film may be peeled off from a plurality of corners of the upper surface of the adhesive sheet constituting the encapsulant to stably remove the protective film in a subsequent process.

As described above, specific embodiments of the present invention have been described, but it is apparent that various modifications are possible without departing from the scope of the present invention.

Therefore, the scope of the present invention should not be conveyed limited to the described embodiments, and should be defined by the following claims as well as the claims and equivalents.

That is, it should be understood that the above-described embodiments are illustrative in all respects and not restrictive, and the scope of the present invention is indicated by the claims to be described later rather than the detailed description, and the meaning and scope of the claims and their equivalents All changes or modifications derived from the concept should be construed as being included in the scope of the present invention.

100: metal sheet supply unit
200: adhesive sheet supply unit
300: lamination part
400: cut
500: cleaning unit
600: rubbing part
601: seating part
602: film peeling part
603: unit peeling part
610: base
620: upright body
630: elevating body
631: elevating cylinder
640: protruding body
650: moving body
660: support member
670: roller part
680: peeling roller

Claims (26)

a seating part on which an organic electronic device component having a metal sheet and an adhesive sheet attached to an upper end of the metal sheet and having a protective film attached thereon; and,
and a film peeling part disposed at the corner of the seating part and pressing and rolling the upper surface of the corner area of the adhesive sheet of the organic electronic device component to peel a part of the corner area of the protective film. A rubbing device for the manufacture of electronic components.
The method of claim 1,
The film peeling part includes a plurality of unit peeling parts so as to be disposed on each corner of the seating part,
The plurality of unit peeling parts,
and a peeling roller for peeling a part of the edge area of the protective film by rolling after pressing the upper surface of the edge area of the adhesive sheet with a set pressing force.
3. The method of claim 2,
The peeling roller,
A rubbing device for manufacturing organic electronic device parts, characterized in that it is replaceable.
3. The method of claim 2,
The plurality of unit peeling parts,
A rubbing device for manufacturing an organic electronic device component comprising a sensor for detecting whether a portion of the edge region of the protective film is peeled off.
3. The method of claim 2,
The pressing force is
A rubbing device for manufacturing an organic electronic device component, characterized in that it can be variably set by adjusting the elevation level of the peeling roller.
3. The method of claim 2,
On the outer periphery of the peeling roller,
A rubbing device for manufacturing an organic electronic device component, characterized in that the adhesive layer is selectively installed.
A metal sheet moving along a set movement path and an adhesive sheet with a protective film attached to the top surface are laminated to each other to form unit organic electronic device parts by cutting them using a laser or a cutting blade to achieve a set size. cuts;
a cleaning unit disposed along the movement path and cleaning an edge of each of the unit organic electronic device components moving along the movement path;
The edge region of the protective film attached to the upper surface of the adhesive sheet by pressing and rolling the upper surface of the edge region of the adhesive sheet of each of the unit organic electronic device components disposed along the movement path and moving along the movement path A manufacturing system for an organic electronic device component comprising a; a rubbing part for peeling a part.
8. The method of claim 7,
The rubbing part,
a seating portion on which the organic electronic device component is mounted;
and a film peeling part disposed at the corner of the seating part and configured to peel a part of the edge of the protective film by pressing and rolling the upper surface of the edge area of the adhesive sheet of the organic electronic device component. The manufacturing system of parts.
9. The method of claim 8,
The film peeling part includes a plurality of unit peeling parts forming a plurality to be disposed on each corner of the seating part,
The plurality of unit peeling parts,
and a peeling roller which presses the upper surface of the edge region of the adhesive sheet with a set pressing force and then rolls to peel a part of the edge region of the protective film.
10. The method of claim 9,
The peeling roller,
A system for manufacturing an organic electronic device component, characterized in that it is replaceable.
10. The method of claim 9,
The plurality of unit peeling parts,
and a sensor for detecting whether a portion of the edge region of the protective film is peeled off.
10. The method of claim 9,
The pressing force is
A system for manufacturing an organic electronic device component, characterized in that it can be variably set by adjusting the elevation level of the peeling roller.
10. The method of claim 9,
On the outer periphery of the peeling roller,
A system for manufacturing an organic electronic device component, characterized in that the adhesive layer is selectively installed.
8. The method of claim 7,
The cleaning unit,
Adhering the cleaning member to the upper surface and lower surface of the edge of the organic electronic device component,
The system for manufacturing an organic electronic device component, characterized in that the upper and lower surfaces of the edge of the organic electronic device component are simultaneously cleaned by reciprocating the cleaning member.
15. The method of claim 14,
The cleaning unit,
a rotating part for reciprocating the cleaning member;
Provided with a cleaning liquid supply for supplying a cleaning liquid to the rotating cleaning member,
The cleaning solution supply unit,
The system for manufacturing an organic electronic device component, wherein the cleaning liquid is supplied before the cleaning member is brought into close contact with the upper and lower surfaces of the edge of the organic electronic device component.
16. The method of claim 15,
The cleaning solution is
A system for manufacturing an organic electronic device component comprising at least one organic solvent selected from ethanol, isopropyl alcohol, methyl ethyl ketone, acetone, toluene, xylene and tetrahydrofuran.
A cutting step of cutting the organic electronic device parts in which the metal sheet and the adhesive sheet moving along the set movement path are laminated to each other through a cutting unit using a laser or a cutting blade to achieve a set size to form unit organic electronic device parts;
a cleaning step of cleaning an edge of each of the unit organic electronic device components moving along the movement path using a cleaning unit disposed along the movement path;
Protection attached to the upper surface of the adhesive sheet by pressing and rolling the upper surface of the corner region of the adhesive sheet of each of the unit organic electronic device components moving along the movement path using the rubbing part disposed along the movement path A manufacturing process of an organic electronic device component comprising a; a peeling step of peeling off a portion of an edge region of the film.
18. The method of claim 17,
The rubbing part,
a seating portion on which the organic electronic device component is mounted;
and a film peeling part disposed at the corner of the seating part and configured to peel a part of the edge of the protective film by pressing and rolling the upper surface of the edge area of the adhesive sheet of the organic electronic device component. The manufacturing process of the part.
19. The method of claim 18,
The film peeling part includes a plurality of unit peeling parts forming a plurality to be disposed on each corner of the seating part,
The plurality of unit peeling parts,
and a peeling roller which presses the upper surface of the edge region of the adhesive sheet with a set pressing force and then rolls to peel a part of the edge region of the protective film.
20. The method of claim 19,
The peeling roller,
A process for manufacturing an organic electronic device component, characterized in that it is replaceable.
20. The method of claim 19,
The plurality of unit peeling parts,
and a sensor for detecting whether a portion of the edge region of the protective film is peeled off.
20. The method of claim 19,
The pressing force is
The manufacturing process of an organic electronic device component, characterized in that it can be variably set by adjusting the elevation level of the peeling roller.
20. The method of claim 19,
On the outer periphery of the peeling roller,
A manufacturing process of an organic electronic device component, characterized in that the adhesive layer is selectively installed.
18. The method of claim 17,
The cleaning unit,
Adhering the cleaning member to the upper surface and lower surface of the edge of the organic electronic device component,
The manufacturing process of an organic electronic device component, characterized in that the upper and lower surfaces of the edge of the organic electronic device component are simultaneously cleaned by reciprocating the cleaning member.
25. The method of claim 24,
The cleaning unit,
a rotating part for reciprocating the cleaning member;
Provided with a cleaning liquid supply for supplying a cleaning liquid to the rotating cleaning member,
The cleaning solution supply unit,
The manufacturing process of an organic electronic device component, characterized in that the cleaning member is supplied before the cleaning member is in close contact with the upper and lower surfaces of the edge of the organic electronic device component.
26. The method of claim 25,
The cleaning solution is
A process for manufacturing an organic electronic device component, wherein the cleaning solution includes at least one organic solvent selected from ethanol, isopropyl alcohol, methyl ethyl ketone, acetone, toluene, xylene, and tetrahydrofuran.

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