KR20220047169A - Cmp system for wafer - Google Patents

Abstract

An object of the present invention is to provide a substrate polishing system capable of efficiently performing a substrate polishing process. Disclosed is a substrate polishing system comprising: a cassette module for storing the substrate; a cleaning module for cleaning a surface of the substrate; at least one polishing module for polishing the surface of the substrate; and a transfer module for unloading the substrate from the polishing module. The polishing module includes: a plurality of polishing plates having a polishing pad thereon; and a carrier device for sequentially positioning the substrate on the plurality of polishing plates.

Description

Substrate polishing system {CMP SYSTEM FOR WAFER}

The embodiments below relate to a substrate polishing system.

Substrate manufacturing requires a chemical mechanical planarization (CMP) operation including polishing, buffing, and cleaning. The CMP operation includes a polishing process of physically abrading a substrate to be polished by contacting a polishing pad, and the surface state of the substrate reaches a target profile through the polishing process.

During the polishing process of the substrate, a slurry (Slurry) may be supplied to the surface of the substrate. The slurry is supplied between the substrate and the polishing pad to perform physical polishing through mechanical friction against the surface of the substrate, and at the same time, it is possible to chemically polish the surface of the substrate through a chemical reaction of the composition constituting the slurry.

Since polishing of a substrate requires a plurality of different processes, a plurality of modules for performing each process are required for polishing of a substrate. A substrate is sequentially passed through a plurality of modules, and since a substrate polishing process is performed on a plurality of substrates, it is necessary to optimize the transfer of the substrate between modules in order to improve the productivity of substrate manufacturing.

The above-mentioned background art is possessed or acquired by the inventor in the process of deriving the disclosure of the present application, and it cannot necessarily be said to be a known technology disclosed to the general public prior to the present application.

SUMMARY An object of an embodiment is to provide a substrate polishing system capable of efficiently performing a substrate polishing process.

A substrate polishing system according to an embodiment includes a cassette module for storing a substrate; a cleaning module for cleaning the surface of the substrate; at least one polishing module for polishing the surface of the substrate; and a transfer module for unloading the substrate from the polishing module, wherein the polishing module includes: a plurality of polishing plates having a polishing pad thereon; and a carrier device for sequentially positioning the substrate on the plurality of polishing plates.

The carrier device may include: a rotating part rotating about a central axis; and a gripper connected to the lower side of the rotating part and gripping the substrate, wherein the holding part is disposed at a position spaced apart from the central axis of the rotating part, and revolves around the rotational axis of the rotating part by the rotational operation of the rotating part. can exercise

The polishing module may further include a substrate loading unit that provides a space for the holding unit to hold the substrate.

By the rotational operation of the rotating unit, the substrate held by the holding unit may be sequentially positioned on the substrate loading unit and the plurality of polishing plates.

The holding unit may be provided in plurality.

When any one of the plurality of grippers grips the substrate in the substrate loading unit, at least another of the plurality of grippers may polish the substrate on the polishing platen.

When any one of the plurality of grippers polishes the substrate on any one of the plurality of polishing plates, at least the other of the plurality of grippers may polish the substrate on at least another one of the plurality of polishing plates .

The polishing platen may be provided in two pieces.

The grip part is provided in three pieces, and forms an angle of 120 degrees with respect to the central axis of the rotation part and may be symmetrically disposed.

When any one of the three gripping parts grips the substrate in the substrate loading part, at least the other one of the three gripping parts grinds the substrate on any one of the two polishing platens, The other one may polish the substrate on the other one of the two polishing plates.

The polishing module may be provided in two pieces.

The substrate polishing system according to an embodiment may efficiently perform a substrate polishing process.

Effects of the substrate polishing system according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a schematic diagram of a substrate polishing system according to an embodiment.
2 is a schematic perspective view of a substrate polishing system according to an embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various changes may be made to the embodiments, the scope of the patent application is not limited or limited by these embodiments. It should be understood that all modifications, equivalents and substitutes for the embodiments are included in the scope of the rights.

Terms used in the examples are used for the purpose of description only, and should not be construed as limiting. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as "comprise" or "have" are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiment belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

In addition, in the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and the overlapping description thereof will be omitted. In describing the embodiment, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Components included in one embodiment and components having a common function will be described using the same names in other embodiments. Unless otherwise stated, descriptions described in one embodiment may be applied to other embodiments as well, and detailed descriptions within the overlapping range will be omitted.

1 is a schematic schematic diagram of a substrate polishing system 1 according to an embodiment, and FIG. 2 is a schematic perspective view of a substrate polishing system 1 according to an embodiment.

1 and 2 , a substrate polishing system 1 according to an exemplary embodiment may be used for chemical mechanical planarization (CMP) of a substrate. The substrate polishing system 1 may physically and chemically polish the surface of the substrate so that the polishing degree of the substrate surface reaches a target profile.

A substrate to be polished through the substrate polishing system 1 may be a silicon wafer for a semiconductor device. However, the type of the substrate is not limited thereto, and the substrate may be glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) or a plasma display panel (PDP).

The substrate polishing system 1 includes a cassette module 11 in which a substrate is stored; a cleaning module 12 for cleaning the surface of the substrate; a polishing module 13 for polishing the surface of the substrate; and a transfer module 14 for transferring the substrate.

The cassette module 11 may store a substrate. The cassette module 11 may transport the substrate to various process modules that process the substrate, and may carry and store the processed substrate. The cassette module 11 may be, for example, an END-FRONT EQUIMENT MODULE (EFEM). The cassette module 11 includes a substrate cassette on which a substrate is loaded; It may include a substrate transfer unit for unloading the substrate from the cassette or loading the substrate.

The substrate transfer unit may include a transfer robot that supports the substrate and moves the supported substrate. The transfer robot may unload the substrate to be polished from the cassette, and transfer the transported substrate to a cleaning module 12 to be described later.

The cleaning module 12 may clean the surface of the substrate. The cleaning module 12 includes: a substrate support for supporting a substrate; and a substrate cleaning unit for cleaning a surface of the supported substrate; and a cleaning liquid spraying unit that sprays the cleaning liquid on the surface of the substrate.

The substrate support may hold the substrate and rotate the substrate. For example, the substrate support may include a plurality of spindles that support multiple points of the edge of the substrate and rotate about an axis.

The substrate cleaning unit may clean the surface of the substrate. The cleaning performed by the substrate cleaning unit may include a process of removing foreign substances or dust from the surface of the substrate, and a buffing process of rubbing the surface of the substrate prior to polishing the substrate. The substrate cleaning unit may include a brush in contact with the surface of the substrate.

The cleaning liquid spraying unit may spray a fluid onto the surface of the substrate. The fluid sprayed by the cleaning liquid spraying unit may include a cleaning liquid, pure water for removing the cleaning liquid from the substrate surface, an inert gas for removing the fluid from the substrate surface, and the like.

The polishing module 13 may polish a substrate. The polishing module 13 may be provided as a pair. For example, two polishing modules 13a and 13b may be provided. Each of the polishing modules 13a and 13b may perform polishing of different substrates. In other words, the polishing target substrate may be polished through one polishing module (eg, 13a) among the pair of polishing modules 13a and 13b.

The polishing module 13 may include a substrate loading unit 133 , a plurality of polishing plates 131 , and a carrier device.

The substrate loaded into the polishing module 13 may be positioned in the substrate loading unit 133 . The substrate loading unit 133 may be a reference position for loading and unloading a substrate with respect to the polishing module 13 . The transfer module 14 to be described later may load a substrate to be polished onto the substrate loading unit 133 by loading the substrate to be polished into the polishing module 13 . The substrates loaded on the substrate loading unit 133 may be sequentially positioned on the plurality of polishing plates 131 by a carrier device to be described later. Accordingly, the substrate loading unit 133 may provide a space in which the holding unit 1322 of the carrier device grips the substrate.

The polished substrate may be placed again in the substrate loading unit 133 , and the transfer module 14 may unload the substrate from the substrate loading unit 133 to be unloaded from the polishing module 13 . In other words, the substrate loading unit 133 may be a reference position for loading and unloading a substrate with respect to the polishing module 13 .

The plurality of polishing plates 131 may polish the surface of the substrate. A polishing pad for polishing the surface of the substrate may be provided on each polishing plate 131 . Each polishing plate 131 may rotate about an axis perpendicular to the ground.

The carrier device may grip the substrate and transport it within the polishing module 13 . The carrier device may include a rotating unit rotating about the central axis (A), and a holding unit 1322 connected to a lower side of the rotating unit and holding the substrate.

The gripping part 1322 may be disposed at a position spaced apart from the central axis A of the rotating part. According to such a structure, the holding part 1322 can make an orbital motion about the rotational axis (A) of the rotating part by the rotational operation of the rotating part. The gripping unit 1322 may sequentially pass through the substrate loading unit 133 and the upper portions of the plurality of polishing plates 131 in an orbiting process according to the rotation of the rotating unit. In other words, the holding unit 1322 may cycle through the substrate loading unit 133 and the plurality of polishing plates 131 according to the operation of the rotating unit. Accordingly, the substrate held by the gripper 1322 may sequentially pass through the substrate loading portion 133 and the plurality of polishing plates.

The gripper 1322 may adjust the height of the substrate with respect to the ground. The gripper 1322 may grip the substrate placed on the substrate loading part 133 to separate it from the substrate loading part 133 , and transfer the substrate to the polishing platen 131 to contact the polishing pad.

The gripping unit 1322 may rotate independently of the rotating unit. The gripper 1322 may be polished by bringing the gripped substrate into contact with the polishing platen 131 .

A plurality of gripping parts 1322 may be provided in one rotating part. When any one of the plurality of grippers 1322 grips the substrate by the substrate loading unit 133 , at least another of the plurality of grippers 1322 may polish the substrate on the polishing platen 131 . In addition, when any one of the plurality of holding units 1322 polishes the substrate on any one of the plurality of polishing plates, at least the other of the plurality of holding units 1322 holds the substrate on at least the other of the plurality of polishing plates. can be polished

For example, two polishing plates 131a and 131b may be provided. Also, for example, three gripping parts 1322a, 1322b, and 1322c may be disposed on one rotating part. The three gripping parts 1322a, 1322b, and 1322c may be symmetrically disposed while forming an angle of 120 degrees with respect to the central axis A of the rotating part. Accordingly, when any one 1322a of the three gripping parts 1322a, 1322b, and 1322c grips the substrate in the substrate loading part 133, at least the other 1322b of the three gripping parts 1322a, 1322b, and 1322c. ) polishes the substrate on any one of the two polishing plates 131a and 131b, and the other one 1322c of the three holding parts 1322a, 1322b, 1322c is the other one of the two polishing plates 131b. ) to polish the substrate. In this case, each of the three holding parts 1322a, 1322b, 1322c may be placed on any one of the substrate loading part 133 and the two polishing plates 131a and 132b, and the substrate loading part 133 according to the operation of the rotating part. ), the plurality of polishing plates 131a and 131b may be sequentially circulated.

Through such a structure, the polishing module 13 may continuously polish a plurality of substrates.

The substrate loaded into the polishing module 13 is placed on the substrate loading unit 133 , is held by the holding unit 1322 , passes sequentially through a plurality of polishing plates 131 , and is polished again by the substrate loading unit 133 . will be located in Thereafter, the substrate may be taken out from the polishing module 13 by the transfer module 14 and transferred back to the cassette module 11 .

As described above, although the embodiments have been described with reference to the limited drawings, those skilled in the art may apply various technical modifications and variations based on the above. For example, the described techniques are performed in an order different from the described method, and/or the described components of the system, structure, apparatus, circuit, etc. are combined or combined in a different form than the described method, or other components Or substituted or substituted by equivalents may achieve an appropriate result.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

1: Substrate polishing system
11: Cassette module
12: cleaning module
13: polishing module
14: transfer module

Claims (11)

a cassette module for storing the substrate;
a cleaning module for cleaning the surface of the substrate;
at least one polishing module for polishing the surface of the substrate; and
A transfer module for unloading the substrate from the polishing module,
The polishing module,
a plurality of polishing plates having a polishing pad thereon; and
and a carrier device for sequentially positioning the substrate on the plurality of polishing plates. According to claim 1,
The carrier device,
Rotating part rotating about the central axis; and
and a gripper connected to the lower side of the rotating part and gripping the substrate,
The grip part,
The substrate polishing system is disposed at a position spaced apart from the central axis of the rotating unit, and revolves around the rotating axis of the rotating unit by the rotational operation of the rotating unit. 3. The method of claim 2,
The polishing module,
The substrate polishing system, further comprising a substrate loading unit that provides a space in which the holding unit grips the substrate. 4. The method of claim 3,
By the rotational operation of the rotating unit, the substrate held by the holding unit is sequentially positioned on the substrate loading unit and the plurality of polishing plates. 5. The method of claim 4,
The grip part is provided in plurality, the substrate polishing system. 6. The method of claim 5,
When any one of the plurality of grippers grips the substrate in the substrate loading part, at least another one of the plurality of grippers polishes the substrate on the polishing platen. 7. The method of claim 6,
When any one of the plurality of grippers polishes the substrate on any one of the plurality of polishing plates, at least the other one of the plurality of grippers grinds the substrate on at least another one of the plurality of polishing plates, the substrate grinding system. 8. The method of claim 7,
The polishing platen is provided in two, the substrate polishing system. 9. The method of claim 8,
The grip part,
It is provided with three, and forms an angle of 120 degrees with respect to the central axis of the rotating part and is symmetrically disposed, the substrate polishing system. 10. The method of claim 9,
When any one of the three gripping parts grips the substrate in the substrate loading part, at least the other one of the three gripping parts grinds the substrate on any one of the two polishing platens, and the other one grinds the substrate on the other one of the two polishing plates. According to claim 1,
The polishing module is provided in two, the substrate polishing system.

Images