KR20220046079A - Fingerprint sensing substrate, fingerprint sensing module and display device comprising the same - Google Patents

Abstract

According to an embodiment of the present invention, provided are a fingerprint recognition substrate and a fingerprint recognition module. The fingerprint recognition substrate of the present invention comprises: a substrate including a chip mounting area; a wiring pattern and a dummy pattern disposed on the substrate; and a protective layer disposed on the wiring pattern. The chip mounting area includes a first area where the wiring pattern is disposed and a second area where the dummy pattern is disposed. The fingerprint recognition module of the present invention comprises: a substrate including a first chip mounting area; a wiring pattern and a dummy pattern disposed on the substrate; a protective layer disposed on the wiring pattern; a first chip disposed on the first chip mounting area; and an adhesive layer disposed between the first chip and the wiring pattern. A separation area is disposed between the first chip and the substrate. Therefore, reliability and driving characteristics of the fingerprint recognition module can be improved.

Description

A fingerprint recognition board, a fingerprint recognition module, and a display device including the same

The embodiment relates to a fingerprint recognition substrate, a fingerprint recognition module, and a display device including the same.

A fingerprint recognition module including a fingerprint sensor is widely used as a means for enhancing security in portable electronic devices such as smartphones and tablet computers by detecting human fingerprints.

That is, data stored in the portable electronic device can be protected and a security incident can be prevented in advance by allowing a user registration or security authentication procedure to be performed through the fingerprint recognition module.

In general, a home key implemented as a button unit or a touch unit may be disposed on the lower front side of the smartphone. The home key implements various functions of a smartphone in a one-touch method, thereby improving ease of use. On the other hand, the tablet computer is provided with a home key on the front lower part of the main body similarly to the smart phone.

As such, the home key in smart phones and tablet computers implements the operation set through the portable electronic device. For example, when the home key is pressed or touched while the portable electronic device is in use, a convenient function such as returning to the initial screen is provided. to provide.

Meanwhile, the fingerprint recognition module has a structure in which a fingerprint sensor and an application specific integrated circuit (ASIC) are mounted on a substrate. However, the fingerprint recognition module as described above cannot be directly connected to the main board. That is, a printed circuit board is required between the fingerprint recognition module and the main board.

An electronic device having a display has a problem in that a plurality of printed circuit boards are required, resulting in an increase in thickness. Also, the size of the plurality of printed circuit boards may be a constraint on miniaturization of the display device. In addition, poor bonding of the plurality of printed circuit boards may deteriorate the reliability of the display device.

Meanwhile, the fingerprint recognition module may be formed by mounting a chip for fingerprint sensing on a chip mounting area of a fingerprint recognition substrate.

In this case, the chip requires a certain space between the chip and the fingerprint recognition substrate to generate vibration for fingerprint sensing.

In addition, when the chip and the fingerprint recognition substrate are adhered, when the adhesive material flows into the chip mounting area, there is a problem in that an appearance defect and a sensing defect occur.

Accordingly, there is a need for a fingerprint recognition substrate, a fingerprint recognition module, and a display device including the same having a new structure capable of solving the above problems.

SUMMARY An embodiment is to provide a fingerprint recognition substrate having improved reliability and fingerprint sensing characteristics, a fingerprint recognition module, and a display device including the same.

A fingerprint recognition substrate according to an embodiment includes: a substrate including a chip mounting region; a wiring pattern and a dummy pattern disposed on the substrate; and a protective layer disposed on the wiring pattern, wherein the chip mounting region includes a first region in which the wiring pattern is disposed and a second region in which the dummy pattern is disposed.

A fingerprint recognition module according to an embodiment includes: a substrate including a first chip mounting area; a wiring pattern and a dummy pattern disposed on the substrate; a protective layer disposed on the wiring pattern; a first chip disposed on the first chip mounting area; and an adhesive layer disposed between the first chip and the wiring pattern, and a spaced region is disposed between the first chip and the substrate.

The fingerprint recognition board and the fingerprint recognition module according to the embodiment may include a dummy pattern disposed in a first chip mounting area on which a first chip including a fingerprint sensor is mounted.

The dummy pattern may be formed in various shapes to improve adhesion of the first chip and improve reliability of the first chip.

That is, by forming the area of the dummy pattern to be larger than that of other patterns, the area to which the adhesive layer is applied can be enlarged, and thus, the adhesive force of the first chip adhered through the adhesive layer can be improved.

In addition, by forming a guide pattern and a guide groove-shaped pattern on the dummy pattern, it is possible to minimize movement of the adhesive layer applied to the dummy pattern into the first chip mounting area.

That is, by controlling the flow of the adhesive layer according to the spreading phenomenon of the adhesive layer caused by the pressure generated when the first chip is bonded by the guide pattern and the guide groove, the adhesive layer is the first chip during the bonding process. can be prevented from flowing in the downward direction of the

Accordingly, it is possible to prevent the adhesive layer from flowing into the region where the first chip is disposed, thereby preventing the vibration operation of the first chip from being disturbed by the adhesive layer, thereby improving the reliability and driving characteristics of the fingerprint recognition module.

1 is a view for explaining an example of a display device to which a fingerprint recognition substrate according to an embodiment is applied.
2 is a diagram illustrating a top view of a fingerprint recognition substrate according to an embodiment.
3 is a diagram illustrating a bottom view of a fingerprint recognition substrate according to an embodiment.
FIG. 4 is a diagram illustrating an enlarged path of area A of FIG. 2 .
FIG. 5 is a schematic cross-sectional view of a region BB′ of FIG. 4 .
6 and 7 are enlarged views illustrating the second area of FIG. 4 .
8 is a diagram illustrating an enlarged view of a fingerprint recognition module in which a chip is mounted on a fingerprint recognition substrate according to an embodiment.
9 to 11 are schematic cross-sectional views of a region CC′ of FIG. 8 .
12 is a view illustrating a state before heat treatment of an adhesive layer disposed in a first chip mounting region.
13 is a view illustrating a state after heat treatment of an adhesive layer disposed in a first chip mounting area.
FIG. 14 is an enlarged view of area D of FIG. 13 .
15 is a diagram illustrating a cross-sectional view of an area EE′ of FIG. 14 .
FIG. 16 is a cross-sectional view of a region FF′ of FIG. 14 .
17 is a view showing a cross-sectional view in which a chip is mounted in a region GG′ of FIG. 2 .
18 is a diagram illustrating a contact relationship between a fingerprint recognition module, a display panel, and a main board according to an embodiment.
19 is a view showing another cross-sectional view in which a chip is mounted in a region GG′ of FIG. 2 .
20 to 25 are diagrams of various display devices including a fingerprint recognition module.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of the components may be selected between the embodiments. It can be used by combining or substituted with .

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be generally understood by those of ordinary skill in the art to which the present invention belongs, unless specifically defined and described explicitly. It may be interpreted as a meaning, and generally used terms such as terms defined in advance may be interpreted in consideration of the contextual meaning of the related art.

In addition, the terminology used in the embodiments of the present invention is for describing the embodiments and is not intended to limit the present invention. In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "at least one (or one or more) of A and (and) B, C", it can be combined with A, B, and C. It may include one or more of all possible combinations.

In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the component from other components, and are not limited to the essence, order, or order of the component by the term.

And, when it is described that a component is 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also with the component It may also include a case of 'connected', 'coupled' or 'connected' due to another element between the other elements.

In addition, when it is described as being formed or disposed on "above (above) or below (below)" of each component, the top (above) or bottom (below) is one as well as when two components are in direct contact with each other. Also includes a case in which another component as described above is formed or disposed between two components.

In addition, when expressed as “up (up) or down (down)”, it may include not only the upward direction but also the meaning of the downward direction based on one component.

Hereinafter, a fingerprint recognition substrate, a fingerprint recognition module, and a display device including the same according to an embodiment will be described with reference to the drawings.

1 is a diagram illustrating an example of a display device to which a fingerprint recognition substrate and a fingerprint recognition module according to an embodiment are applied.

Referring to FIG. 1 , a fingerprint recognition substrate and a fingerprint recognition module according to an embodiment may be applied to a smartphone 10 .

The smartphone may include a screen area AA and a bezel area UA. Also, a home key HK may be disposed in the bezel area UA. The home key HK may be configured as a button unit or a touch unit. However, the embodiment is not limited thereto, and the home key HK may be disposed in a screen area other than the bezel area.

The fingerprint recognition substrate and the fingerprint recognition module may be disposed at a position overlapping the home key HK. That is, when a user's fingerprint contacts the fingerprint recognition module disposed in the home key (HK) area, the fingerprint recognition module may recognize the contacted fingerprint.

Accordingly, the user can use the security functions such as locking and disassembling the smart phone through the home key while using the smart phone.

Below. 2 to 7 , a fingerprint recognition substrate according to an embodiment will be described.

2 is a diagram illustrating a top view of the fingerprint recognition substrate 1000 according to the embodiment.

Referring to FIG. 2 , the fingerprint recognition substrate 1000 according to the embodiment may include a plurality of chip mounting regions.

In detail, the fingerprint recognition substrate 1000 may include a first chip mounting area CMA1 , a second chip mounting area CMA2 , and a third chip mounting area CMA3 .

The first chip mounting area CMA1 , the second chip mounting area CMA2 , and the third chip mounting area CMA3 may be disposed at different positions on the fingerprint recognition substrate 1000 . That is, the first chip mounting area CMA1 , the second chip mounting area CMA2 , and the third chip mounting area CMA3 may be disposed at different positions while being spaced apart from each other on the fingerprint recognition substrate 1000 . there is.

Chips having different functions may be mounted in the first chip mounting area CMA1 , the second chip mounting area CMA2 , and the third chip mounting area CMA3 . That is, the first chip mounting area CMA1 , the second chip mounting area CMA2 , and the third chip mounting area CMA3 may be formed on the same surface of the fingerprint recognition substrate 1000 .

Accordingly, since a plurality of chips can be disposed on the same surface of the fingerprint recognition substrate 1000 , the manufacturing process efficiency of the fingerprint recognition module can be improved and the thickness of the fingerprint recognition module can be reduced.

For example, a first chip including a fingerprint sensor may be mounted in the first chip mounting area CMA1 . In detail, a first chip including an ultrasonic fingerprint sensor may be mounted in the first chip mounting area CMA1 .

In addition, a second chip including an application specific integrated circuit (ASIC) may be mounted in the second chip mounting area CMA2 . The application specific integrated circuit (ASIC) may receive a control signal transmitted through a main board and transmit it to the first chip, or analog-process a signal obtained through the first chip and transmit it to the main board.

In addition, a third chip including at least one of a diode chip, an MLCC chip, a BGA chip, and a chip capacitor may be mounted in the third chip mounting area CMA3 .

The fingerprint recognition substrate 1000 may be bent. In detail, the fingerprint recognition substrate 1000 may be bent in one direction about the folding axis FA. For example, the folding axis FA is disposed between the first chip mounting area CMA1 and the second chip mounting area CMA2 , and the fingerprint recognition substrate 1000 forms the folding protrusion FA. It can be bent around the center.

Accordingly, after the fingerprint recognition substrate 1000 is bent, the first chip mounting area CMA1 may be disposed on a surface opposite to the second chip mounting area CMA2 and the third chip mounting area CMA3. there is. In addition, a first chip mounted on the first chip mounting area CMA1 , and a second chip and a third chip mounted on the second chip mounting area CMA2 and the third chip mounting area CMA3 , respectively may be bonded to different members, respectively.

The curved fingerprint recognition substrate 1000 will be described in detail below.

Meanwhile, the first chip including the fingerprint sensor may be bonded to the first chip mounting area CMA1 through an adhesive layer.

FIG. 4 is an enlarged view of area A of FIG. 2 , and is an enlarged view of the first chip mounting area CMA1 in which the first chip is mounted, and FIG. 5 is an enlarged view of area B-B' of FIG. 4 . It is a drawing showing a schematic cross-sectional view.

4 and 5 , the fingerprint recognition substrate 1000 may include a substrate 100 and a first chip mounting area CMA1 formed on one surface of the substrate 100 .

In addition, the fingerprint recognition substrate 1000 may include a wiring pattern 200 disposed on the substrate 100 and a protective layer 400 disposed on the wiring pattern 200 .

The first chip mounting area CMA1 may be divided into two areas depending on whether the wiring pattern 200 is disposed. In detail, in the first chip mounting area CMA1 , the first area 1A in which the wiring pattern 200 is disposed and the wiring pattern 200 are not disposed and a dummy pattern spaced apart from the wiring pattern 200 . It may include a second region 2A in which 500 is disposed. That is, the first area 1A may be defined as an area in which the wiring pattern 200 is disposed, and the second area 2A may be defined as an area in which the dummy pattern 500 is disposed.

The second area 2A may be disposed in a corner area of the first chip mounting area CMA1 . In detail, the second area 2A may be disposed in a plurality of corner areas of the first chip mounting area CMA1 . For example, the second area 2A may be disposed at four corner areas of the first chip mounting area CMA1 . Accordingly, the second area 2A may include a plurality of areas spaced apart from each other. Accordingly, an imaginary extension line connecting the second regions 2A may be connected to surround the first chip mounting region CMA1 .

6 and 7 , the dummy pattern 500 disposed on the second region 2A may be formed in various shapes.

Referring to FIG. 6 , the dummy pattern 500 may be formed in a bulk shape. In detail, the dummy pattern 500 may include the same material as the wiring pattern 200 and may be formed in a bulk shape having a predetermined area.

Accordingly, when the first chip is mounted on the first chip mounting area CMA1 , the bonding area of the adhesive layer may be increased. That is, since the dummy pattern 500 is not formed in a separate pattern but is formed in a bulk shape having a constant area, the contact area of the adhesive layer in the dummy pattern may be increased.

Accordingly, by increasing the contact area of the adhesive layer, the adhesive force of the adhesive layer can be increased, and thus the adhesive force of the first chip can be improved.

Alternatively, referring to FIG. 7 , the dummy pattern 500 may include a pattern. In detail, the dummy pattern 500 may include a plurality of guide patterns 510 extending in at least one direction and spaced apart from each other. The guide patterns 510 are disposed to be spaced apart from each other, and accordingly, a guide groove 520 may be disposed between the guide patterns 510 . That is, the guide pattern 510 may be an area in which the same material as that of the wiring pattern 200 is disposed, and the guide groove 520 may be an area in which the first surface 1S of the substrate 100 is exposed. can

The guide patterns 510 may be connected to each other. That is, the guide pattern 510 may be connected to each other through a connection part 530 disposed at one end of the guide pattern 510 .

The dummy pattern 500 may control the flow of the adhesive layer disposed on the dummy pattern 500 through the guide pattern 510 and the guide groove 520 . That is, the flow of the adhesive layer in a direction in which the guide groove 520 disposed on the dummy pattern 500 extends may be controlled.

The guide pattern 510 , the guide groove 520 , and the flow of the adhesive layer will be described in detail in the following description of the fingerprint recognition module.

Referring to FIG. 5 , the substrate 100 may support the wiring pattern 200 and the protective layer 400 . That is, the substrate 100 may be a support substrate.

The substrate 100 may be a flexible substrate having insulating properties. Accordingly, the substrate 100 may be bent. That is, the substrate 100 may be bent in one direction. Accordingly, the fingerprint recognition substrate including the substrate 100 may be easily bent around the aforementioned folding axis FA.

For example, the substrate 100 includes a first surface 1S on which the chip mounting region is formed and a second surface 2S opposite to the first surface 1S, and the substrate 100 includes The second surfaces 2S may be bent to face each other.

For example, the substrate 100 may include a flexible plastic. For example, the substrate 100 may be a polyimide (PI) substrate. However, the embodiment is not limited thereto, and the substrate 100 may include a polymer material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN). Accordingly, the fingerprint recognition substrate including the substrate 100 may be used in various electronic devices provided with curved display devices. For example, since the fingerprint recognition substrate including the substrate 100 has excellent flexible characteristics, it may be suitable for mounting a semiconductor chip of a wearable electronic device. .

The substrate 100 may have a thickness of 20 μm to 100 μm. For example, the substrate 100 may have a thickness of 25 μm to 50 μm. For example, the substrate 100 may have a thickness of 30 μm to 40 μm. When the thickness of the substrate 100 exceeds 100 μm, the overall thickness of the fingerprint recognition substrate may increase. When the thickness of the substrate 100 is less than 20 μm, it may be difficult to simultaneously dispose a plurality of chips on one surface of the substrate 100, and in the process of mounting the plurality of chips, the substrate 100 is subjected to heat/pressure. It may be vulnerable to the like, and it may be difficult to place multiple chips at the same time.

A wiring pattern 200 may be disposed on the substrate 100 . In detail, a plurality of wiring patterns 200 spaced apart from each other may be disposed on the substrate 100 . The wiring pattern 200 may be disposed on one or both surfaces of the substrate 100 .

That is, the wiring pattern 200 is disposed only on the first surface 1S of the substrate 100 , or the wiring pattern 200 is disposed on the first surface 1S and the second surface of the substrate 100 . All of them can be placed in (2S).

Hereinafter, for convenience of description, the wiring pattern 200 will be mainly described as being disposed on both the first surface 1S and the second surface 2S of the substrate 100 .

The wiring patterns 200 disposed on the first surface 1S and the second surface 2S of the substrate 100 are a first via V1 and a conductive material CM disposed inside the first via V1. ) through which it can be electrically connected.

The wiring pattern 200 may include a plurality of layers. That is, the wiring pattern 200 may be formed in a multi-layered structure. In detail, the wiring pattern 200 may include a first layer 210 , a second layer 220 , and a third layer 230 . That is, the wiring pattern 200 may include the first layer 210 , the second layer 220 on the first layer 210 , and the third layer 230 on the second layer 220 . there is.

The first layer 210 may include a conductive material. For example, the first layer 210 may include a metal material having excellent electrical conductivity. In more detail, the first layer 210 may include copper (Cu). However, embodiments are not limited thereto, and the first layer 210 may include copper (Cu), aluminum (Al), chromium (Cr), nickel (Ni), silver (Ag), or molybdenum (Mo). Of course, it may include at least one metal among gold (Au), titanium (Ti), and alloys thereof.

The first layer 210 may be disposed to have a thickness of 1 μm to 15 μm. For example, the first layer 210 may be disposed to have a thickness of 4 μm to 10 μm. For example, the first layer 210 may be disposed to have a thickness of 6 μm to 9 μm.

When the thickness of the first layer 210 is less than 1 μm, the resistance of the first layer 210 may increase. When the thickness of the first layer 210 is more than 15 μm, it is difficult to use a mask when using a side etching or printing method when using the lithography method, and in the case of the sputtering method, it is necessary to deposit for a long time to implement a fine pattern. It can be difficult.

The second layer 220 and the third layer 230 may be disposed on the first layer 210 . The second layer 220 and the third layer 230 may be a plating layer disposed on the first layer 210 .

The second layer 220 and the third layer 230 may be formed on the first layer 210 to prevent whisker formation. Accordingly, a short circuit between the wiring patterns 200 spaced apart from each other can be prevented. In addition, as a multi-layer plating layer is disposed on the first layer 210 , bonding characteristics with the chip may be improved.

When the first layer 210 includes copper (Cu), the first layer 210 cannot be directly bonded to the first chip, and a separate bonding process may be required. In addition, when the plating layer disposed on the first layer 210 is formed as a single layer, that is, when only the second layer 220 is disposed, copper (Cu) of the first layer 210 is formed in the plating process. Diffusion into the second layer 220 may cause defects in bonding with the chip.

Accordingly, the third layer 230 is additionally formed on the second layer 220 to minimize the amount of copper (Cu) on the surface of the wiring pattern 200 to be bonded to the chip, thereby improving bonding characteristics with the chip. can do it That is, when the second layer 220 and the third layer 230 include tin (Sn), the surface of the wiring pattern 200 may be a pure tin layer, so that It is possible to improve bonding properties.

The second layer 220 and the third layer 230 may include tin (Sn). That is, the wiring pattern 200 may be disposed in a multi-layered structure of a first layer 210 including copper (Cu), a second layer 220 including a main line (Sn), and a third layer 230 including a main line (Sn). there is.

When the third layer 230, which is the outermost layer of the wiring pattern 200, includes tin, the corrosion resistance of tin (Sn) is excellent, so that oxidation of the wiring pattern 200 can be effectively prevented. .

A heat treatment process may be included in the process of forming a wiring pattern, a protective layer, etc. on the fingerprint recognition substrate.

In this case, copper of the first layer 210 of the wiring pattern 200 may be diffused into the second layer 220 and the third layer 230 by the heat treatment process.

That is, tin, copper, and a tin-copper alloy may be mixed in the second layer 220 and the third layer 230 by diffusion of copper. In this case, the copper content may decrease while extending from the second layer 220 to the third layer 230 . That is, the third layer 230 may be a pure tin layer containing almost no copper.

The second layer 220 and the third layer 230 may correspond to each other or may have different thicknesses. The total thickness of the second layer 220 and the third layer 230 may be 0.07 μm to 1 μm. The total thickness of the second layer 220 and the third layer 230 may be 0.15 μm to 0.7 μm. The total thickness of the second layer 220 and the third layer 230 may be 0.3 μm to 0.5 μm. Any one of the second layer 220 and the third layer 230 may have a thickness of 0.05 μm to 0.15 μm or less. For example, any one of the second layer 220 and the third layer 230 may have a thickness of 0.07 μm to 0.13 μm or less.

The protective layer 400 may be partially disposed on the wiring pattern 200 . In detail, the protective layer 400 may be disposed on an area other than the first chip mounting area CMA1 . That is, the protective layer 400 may be disposed on an area of the wiring pattern 200 , excluding the area where the first terminal part 310 is disposed.

The protective layer 400 is disposed while covering the wiring pattern 200 , thereby preventing the wiring pattern 200 from being oxidized by external moisture, air, etc. and preventing film removal of the wiring pattern 200 . there is.

A first terminal unit 310 may be disposed on the wiring pattern 200 on the first chip mounting area CMA. In detail, the first terminal part 310 may be disposed on the wiring pattern 200 exposed in the first chip mounting area CMA1 .

The first terminal part 310 is disposed on the wiring pattern 200 in the first chip mounting area CMA1 , and when bonding the first chip and the wiring pattern, the terminal of the first chip and the adhesive layer can be bonded through The first terminal part 310 may include the same material as the wiring pattern 200 . For example, the first end part 310 may include at least one of copper and tin.

Alternatively, the embodiment is not limited thereto, and the first terminal part 310 may be omitted. In detail, a separate first terminal part 310 is not disposed on the wiring pattern 200 of the first chip mounting region, and the chip may be directly bonded to the third layer 230 of the wiring pattern 200 . there is.

The protective layer 400 may include an insulating material. The protective layer 400 may include various materials that may be applied to protect the surface of the wiring pattern 200 and then cured by heating. The protective layer 400 may be a resist layer. For example, the protective layer 400 may be a solder resist layer including an organic polymer material. For example, the protective layer 400 may include an epoxy acrylate-based resin. In detail, the protective layer 400 may include a resin, a curing agent, a photoinitiator, a pigment, a solvent, a filler, an additive, an acryl-based monomer, and the like. However, the embodiment is not limited thereto, and the protective layer 400 may be any one of a photo-solder resist layer, a cover-lay, and a polymer material.

The protective layer 400 may have a thickness of 1 μm to 20 μm. The protective layer 400 may have a thickness of 5 μm to 15 μm. For example, the protective layer 400 may have a thickness of 7 μm to 12 μm. When the thickness of the protective layer 400 is greater than 20 μm, the thickness of the fingerprint recognition substrate may increase. When the thickness of the protective layer 400 is less than 1 μm, the reliability of the wiring pattern on the fingerprint recognition substrate may be deteriorated.

Meanwhile, FIG. 3 is a diagram illustrating a bottom view of a fingerprint recognition substrate according to an embodiment. Referring to FIG. 3 , a wiring pattern 200 disposed on the substrate 100 and a protective layer 400 disposed on the wiring pattern 200 may be disposed on a lower surface of the fingerprint recognition substrate 1000 . .

Also, a dummy pattern may be disposed on the lower surface of the fingerprint recognition substrate 1000 . In detail, a first dummy part 550 may be disposed on a lower surface of the fingerprint recognition substrate 1000 in an area corresponding to the dummy pattern 500 on the upper surface of the fingerprint recognition substrate 1000 .

The first dummy part 550 may also include a guide dummy part 551 , a guide dummy groove 552 , and a guide connection part 553 .

The extension directions of the guide pattern 510 and the guide dummy part 551 may be the same. That is, the guide pattern 510 and the guide dummy part 551 may be disposed to extend in the same or similar directions to each other.

In addition, a second dummy part 250 may be disposed on a lower surface of the fingerprint recognition substrate 1000 . In detail, a second dummy part 250 may be disposed on a lower surface of the fingerprint recognition board 1000 in an area corresponding to the first terminal part 310 on the upper surface of the fingerprint recognition board 1000 .

The second dummy part 250 may serve to prevent bending of the fingerprint recognition substrate 1000 . That is, since the second dummy part 250 is disposed in an area corresponding to the first terminal part 310 , the pressure on the upper and lower surfaces of the fingerprint recognition board 1000 can be uniformly maintained. , it is possible to prevent bending of the fingerprint recognition substrate.

Hereinafter, a fingerprint recognition module in which a chip is mounted on the aforementioned fingerprint recognition board will be described with reference to FIGS. 8 to 16 . In the description of the fingerprint recognition module according to the embodiment, the description of the same configuration as the fingerprint recognition module described above is omitted, and the same reference numerals are given to the same configuration.

8 is an enlarged view showing a first chip mounted on a first chip mounting region of a fingerprint recognition substrate according to an embodiment, and FIGS. 9 to 11 are schematic cross-sectional views of region C-C′ of FIG. It is a drawing.

8 to 11 , the first chip C1 may be disposed on the first chip mounting area CMA1 and may be connected to the wiring pattern 200 . In detail, the first chip C1 and the wiring pattern 200 are the first terminal portion 310 of the wiring pattern 200 and the first terminal portion of the first chip C1 in the first chip mounting area CMA1. The two terminal parts 320 may be attached to each other to be electrically connected.

The first chip C1 and the wiring pattern 200 may be bonded through an adhesive layer 600 between the first terminal part 310 and the second terminal part 320 .

The adhesive layer 600 may include a material whose viscosity varies according to temperature. That is, according to this, the adhesive layer 600 may be disposed between the first terminal part 310 and the second terminal part 3200 in various shapes and sizes.

Referring to FIG. 9 , the adhesive layer 600 may be disposed to have a width similar to that of the second terminal part 320 . Alternatively, referring to FIGS. 10 and 11 , the adhesive layer 600 may be disposed to have a greater width than the second terminal part 320 .

For electrical connection between the first chip C1 and the wiring pattern 200 , the adhesive layer 600 may have conductivity. For example, the adhesive layer 600 may include a conductive paste. For example, the adhesive layer 600 may include a resin and a conductive paste including a plurality of conductive balls inside the resin.

Meanwhile, the adhesive layer 600 may include a material having a low melting point. For example, the adhesive layer 600 may include a material having a melting point of 50°C to 70°C.

Since the adhesive layer 600 includes a material having a low melting point, when bonding the first chip C1 and the wiring pattern 200 through the adhesive layer 600 , the bonding process may be possible at a low temperature. . Accordingly, it is possible to prevent damage or deformation of the wiring pattern or the protective layer due to high temperature when the first chip C1 and the wiring pattern 200 are bonded.

As an example, the adhesive layer 600 may include a low melting point solder ball (Anisotropic Conductive Adhesive, ACA), but the embodiment is not limited thereto.

The first chip C1 may include a fingerprint recognition sensor. In detail, the first chip C1 may include an ultrasonic fingerprint recognition sensor. In detail, the first chip C1 may include a transducer. The transducer constitutes an ultrasonic fingerprint sensor, which is a type of fingerprint recognition sensor, and may acquire a fingerprint image by projecting ultrasonic waves to a finger placed on a contact surface and converting reflected sound waves into electrical signals. Accordingly, the first chip C1 may include a transducer that converts the sound wave reflected by the finger into an electrical signal.

The first chip C1 may be disposed to be spaced apart from the first surface 1S of the substrate 100 in the first chip mounting area CMA1 . Accordingly, a separation area DA may be formed between the first chip C1 and the substrate 100 .

The separation area DA is an area in which the first chip C1 and the substrate 100 are spaced apart, and may be defined as an area including air.

The first chip C1 includes an ultrasonic fingerprint sensor, and vibration may occur during operation. Accordingly, it is possible to secure a space in which the vibration of the first chip C1 can be stably generated by the separation area DA.

At this time, if the height h of the separation area DA is too large, there is a problem in that the overall volume of the fingerprint recognition module increases. If the height h of the separation area DA is too small, the fingerprint recognition sensor During operation, a problem may occur in operation reliability of the first chip C1 due to the contact between the first chip C1 and the substrate 100 .

Accordingly, the height h of the separation area DA may be controlled. In detail, by adjusting the thickness of the adhesive layer 600 , the height h of the separation area DA may be controlled.

The height h of the separation area DA may be 3 μm or more. In detail, the height h of the separation area DA may be 5 μm or more. In more detail, the height h of the separation area DA may be 7 μm or more. In more detail, the height h of the separation area DA may be 10 μm or more.

For example. A height h of the separation area DA may be 3 μm to 70 μm. In detail, the height h of the separation area DA may be 5 μm to 50 μm. In more detail, the height h of the separation area DA may be 7 μm to 40 μm. In more detail, the height h of the separation area DA may be 10 μm to 30 μm.

When the height h of the separation area DA exceeds 70 μm, there is a problem in that the overall thickness of the fingerprint recognition module increases, and when the height h of the separation area DA is less than 3 μm, the fingerprint During the operation of the recognition sensor, a problem may occur in operation reliability of the first chip C1 due to the contact between the first chip C1 and the substrate 100 .

12 and 13 are views for explaining bonding the first chip by disposing an adhesive layer in the first chip mounting area.

Referring to FIG. 12 , in order to mount the first chip C1 in the first chip mounting area CMA1 , an adhesive layer 600 may be disposed on the first terminal part 310 of the wiring pattern 200 . there is.

The adhesive layer 600 may be disposed along an edge of the first chip C1 according to the shape of the first chip C1 . For example, when the first chip C1 is defined as a quadrangle, the adhesive layer 600 may be disposed to extend in a quadrangular direction.

Accordingly, the adhesive layer 600 may be disposed in both the first area 1A and the second area 2A. That is, the adhesive layer 600 may be disposed on the wiring pattern 200 in the first area 1A, and may be disposed on the dummy pattern 500 in the second area 2A.

In this case, since the area of the dummy pattern 500 is larger than that of the wiring pattern 200 , the contact area of the adhesive layer 600 may be increased to improve the adhesive force of the adhesive layer 600 .

Referring to FIG. 13 , heat may be applied to the adhesive layer 600 . In detail, a temperature greater than or equal to the melting point of the adhesive layer 600 may be applied to the adhesive layer 600 , and the adhesive layer 600 may be melted by the heat. Subsequently, after disposing the first chip C1 on the adhesive layer 600 , the first chip C1 and the wiring pattern 200 may be adhered through the adhesive layer 600 through a compression process. there is.

In this case, the melted adhesive layer 600 may be spread around the pressure according to the compression process. Accordingly, the width w of the adhesive layer 600 may be greater than the width before the heat treatment. In this case, when the first chip C1 is spread inside, the adhesive layer 600 may penetrate into the area where the first chip C1 is disposed, that is, the separation area DA.

Accordingly, vibration of the ultrasonic fingerprint sensor is prevented by the adhesive layer 600 penetrating into the separation area DA, and the fingerprint sensing characteristic of the first chip C1 may be deteriorated.

Accordingly, referring to FIG. 14 , a guide pattern 510 and a guide groove 520 may be formed on the dummy pattern 500 to form a movement path of the adhesive layer 600 . That is, in the dummy pattern 500, a path through which heat moves is formed by the guide pattern 510 and the guide groove 520, and the molten adhesive layer 600 along the path through which the heat moves may also be moved. there is. Accordingly, during the bonding process of the first chip C1, the flow of the adhesive layer 600 is guided to the outer region of the first chip C1, and the adhesive layer 600 penetrates into the separation region DA. can be prevented from becoming

Through this, it is possible to prevent the adhesive material from penetrating into the separation area DA, so it is possible to sufficiently secure a space in which air can vibrate in the separation area DA, whereby the ultrasonic fingerprint sensor Vibration can be used effectively.

Meanwhile, the extending directions of the guide pattern 510 and the guide groove 520 may be tilted toward the edge of the substrate 100 to extend. That is, the guide pattern 510 and the guide groove 520 may extend by tilting in the direction of the edge of the first chip mounting area CMA1 in the extension direction.

When bonding the first chip C1 , the degree of spreading of the adhesive layer 600 is greatest in the edge direction of the substrate 100 , so to facilitate the flow of the adhesive layer 600 , the guide pattern It may be formed by tilting the extending directions of the 510 and the guide groove 520 toward the edge of the substrate 100 .

15 is a view illustrating a cross-sectional view taken along region E-E′ of FIG. 14 .

14 and 15 , a dummy pattern 500 including a guide pattern 510 and a guide groove 520 may be disposed in the second region 2A.

The first width w1 of the guide pattern 510 and the second width w2 of the guide groove 520 may be different from each other. In detail, the first width w1 of the guide pattern 510 may be smaller than the second width w2 of the guide groove 520 . That is, the second width w2 of the guide groove 520 may be greater than the first width w1 of the guide pattern 510 . Accordingly, it is possible to facilitate the flow of the adhesive layer 600 moving along the guide groove 520 , and to widen the width of the guide groove 520 sufficiently to prevent overflow of the adhesive layer 600 . can

The guide groove 520 may include a first area 521 and a second area 522 . The first region 521 and the second region 522 may be connected to each other. That is, the first region 521 and the second region 522 may be integrally formed.

The first region 521 may be disposed in an inner region of the adhesive layer 600 . Also, the second region 522 may be disposed in a region overlapping the adhesive layer 600 and in an outer region. That is, the first area 521 may be disposed closer to the separation area DA than the second area 522 .

That is, the first area 521 may be disposed closer to the separation area DA than the second area 522 .

For example, the first region 521 may be disposed in a region overlapping the first chip C1 in a vertical direction. Also, the second region 522 may be disposed in a region that vertically overlaps the adhesive layer 600 and the first chip C1 .

Accordingly, the amount of the adhesive layer disposed on the first region 521 and the second region 522 may be different. In detail, the amount of the adhesive layer disposed on the second region 522 may be greater than the amount of the adhesive layer disposed on the first region 521 . That is, the thickness of the adhesive layer disposed on the second region 522 may be greater than the thickness of the adhesive layer disposed on the first region 521 .

In more detail, the adhesive layer 600 may not be disposed in the first region 521 . That is, one surface of the substrate 100 may be exposed in the first region 521 . That is, the first region 521 of the guide groove 520 and the guide pattern 510 between the first region 521 may be disposed to be exposed to the outside of the adhesive layer 600 .

In addition, the adhesive layer 600 may be disposed in the second region 522 . That is, the adhesive layer 600 may be disposed only inside the second region 521 . Accordingly, by preventing the adhesive layer 600 from penetrating into the lower region of the first chip C1 , the fingerprint sensing characteristic of the first chip C1 may be improved.

In addition, the adhesive layer 600 may be disposed to have a different thickness for each location in the second region 522 . For example, the thickness of the adhesive layer 600 may decrease as it extends in a direction away from the separation area DA.

The second region 522 may include a 2-1 th region 522a and a 2-2 th region 522b. The 2-1 th region 522a may be disposed closer to the first region 521 than the 2-2 th region 522b. That is, the 2-2 th region 522b may be disposed outside the first chip C1 than the 2-1 th region 522a.

The adhesive layer disposed in the 2-1 th region 522a may be in contact with the first chip C1, and the adhesive layer disposed in the 2-2 th region 522b may be in contact with the first chip C1. may not come into contact with

A thickness T1 of the adhesive layer disposed in the 2-1 th region 522a may be different from a thickness T2 of the adhesive layer disposed in the 2-2 th region 522b. In detail, the thickness T2 of the adhesive layer disposed in the 2-2nd region 522b may be smaller than the thickness T1 of the adhesive layer disposed in the 2-1th region 522a. Accordingly, it is possible to prevent overflow of the adhesive layer disposed in the guide groove 520 and moving along the guide groove.

Also, the guide groove 520 may further include a third region 523 . The third region 523 may be disposed outside the second-second region 522b. That is, the second region 522 may be disposed between the first region 521 and the third region 523 .

The adhesive layer 600 may not be disposed in the third region 523 . That is, the substrate 100 may be exposed in the third region 523 . That is, the third region 523 may be a region in the guide groove 520 in which the adhesive layer 600 is not disposed.

Meanwhile, the third region 523 may be selectively included. That is, the guide groove 520 may include only the first area 521 and the second area 522 , or the guide groove 520 may include the first area 521 and the second area 521 . It may include a region 522 and the third region 523 .

FIG. 16 is a view showing a cross-sectional view taken along an area F-F' of FIG. 14 .

Referring to FIG. 16 , the dummy pattern 500 may include a connection part 530 connecting the plurality of guide patterns 510 . That is, widths of the guide pattern 510 , the guide groove 520 , and the connection part 530 may be different from each other.

In detail, the third width w3 of the connection part 530 may be greater than the first width w1 of the guide pattern 510 and the second width w2 of the guide groove 520 . Accordingly, the guide pattern 510 can be stably fixed through the connection part 530 .

A second via V2 may be formed on the substrate 100 corresponding to the connection part 530 . The connection part 530 may be connected to the ground electrode 700 disposed on the second surface 2S of the substrate 100 through the second via V2 .

The fingerprint recognition board and the fingerprint recognition module according to the embodiment may include a dummy pattern disposed in a first chip mounting area on which a first chip including a fingerprint sensor is mounted.

The dummy pattern may be formed in various shapes to improve adhesion of the first chip and improve reliability of the first chip.

That is, by forming the area of the dummy pattern to be larger than that of other patterns, the area to which the adhesive layer is applied can be enlarged, and thus, the adhesive force of the first chip adhered through the adhesive layer can be improved.

In addition, by forming a guide pattern and a guide groove-shaped pattern on the dummy pattern, it is possible to minimize movement of the adhesive layer applied to the dummy pattern into the first chip mounting area.

That is, by controlling the flow of the adhesive layer according to the spreading phenomenon of the adhesive layer caused by the pressure generated when the first chip is bonded by the guide pattern and the guide groove, the adhesive layer is the first chip during the bonding process. can be prevented from flowing in the downward direction of

Accordingly, it is possible to prevent the adhesive layer from flowing into the region where the first chip is disposed, thereby preventing the vibration operation of the first chip from being disturbed by the adhesive layer, thereby improving the reliability and driving characteristics of the fingerprint recognition module.

Hereinafter, bending of the fingerprint recognition module according to the embodiment and contact relationship with other members will be described with reference to FIGS. 17 to 19 .

17 is a cross-sectional view illustrating a fingerprint recognition module on which the first chip, the second chip, and the third chip are mounted in a cross-sectional view of the fingerprint recognition substrate cut in the region G-G' of FIG. 2 .

Referring to FIG. 17 , a first chip C1 , a second chip C2 , and a third chip C3 may be respectively mounted on the fingerprint recognition substrate 1000 .

The first chip C1 , the second chip C2 , and the third chip C3 may be disposed on the same surface of the fingerprint recognition substrate 1000 . That is, the first chip C1 , the second chip C2 , and the third chip C3 may all be disposed on the first surface 1S of the substrate 100 .

Accordingly, only one printed circuit board may be applied to transmit the fingerprint recognition signal recognized by the first chip C1 to the main board.

Referring to FIG. 18 , the fingerprint recognition module may be folded in one direction about the folding axis FA.

Accordingly, the first chip C1 may be disposed in a direction different from that of the second chip C2 and the third chip C3 . That is, the first chip C1 may be disposed in an upper direction of the fingerprint recognition module, and the second chip C2 and the third chip C3 may be disposed in a lower direction of the fingerprint recognition module.

A display panel 1100 and a cover substrate 1200 may be disposed on the fingerprint recognition module. An upper surface of the fingerprint recognition module may be adhered to the display panel 1100 . In detail, the first chip C1 may contact the display panel 1100 . In detail, a first adhesive layer 610 is disposed between the upper surface of the first chip C1 and the display panel 1100 , and the first chip C1 is displayed through the first adhesive layer 610 . It may be adhered to the panel 1100 . Through this, a device that secures the effective area of the display as much as possible can be manufactured.

Also, the lower surface of the fingerprint recognition module may be adhered to the main board 1500 . In detail, the wiring pattern 200 on the lower surface of the fingerprint recognition module and the main board may be electrically connected by being adhered through an adhesive layer or the like.

Meanwhile, referring to FIG. 19 , the first chip C1 , the second chip C2 , and the third chip C3 may be disposed on different surfaces of the substrate 100 .

In detail, the first chip C1 is disposed on the first surface 1S of the substrate 100 , and the second chip C2 and the third chip C3 are the second chip C2 and the third chip C3 of the substrate 100 . It may be disposed on the two surfaces 2S.

Accordingly, the fingerprint recognition module may be connected to the display panel and the main board without separate folding.

Since only one flexible circuit board is required between the display panel and the main board in the display device including the fingerprint recognition module according to the embodiment, the overall thickness of the display device can be reduced.

Hereinafter, various display devices to which a fingerprint recognition module according to an embodiment is applied will be described with reference to FIGS. 20 to 25 .

20 to 25 are diagrams of various display devices including a fingerprint recognition module.

Since the fingerprint recognition module according to the embodiment is flexible, small in size, and thin in thickness, it can be used in various display devices.

For example, referring to FIG. 20 , the fingerprint recognition module according to the embodiment may be applied to a flexible display device that can be bent. Accordingly, a touch device apparatus including the same may be a flexible touch device apparatus. Accordingly, the user may bend or bend it by hand. Such a flexible touch window may be applied to a wearable touch or the like.

Alternatively, referring to FIGS. 21 to 23 , the fingerprint recognition module according to the embodiment may be applied to various electronic devices to which the foldable display apparatus is applied. 21 to 23 , in the foldable display device, the foldable cover window may be folded. The foldable display device may be included in various portable electronic products. In detail, the foldable display device may be included in a mobile terminal (cellular phone), a notebook computer (portable computer), and the like. Accordingly, while the display area of the portable electronic product is enlarged, the size of the device can be reduced during storage or movement, thereby enhancing portability. Accordingly, it is possible to improve the convenience of users of portable electronic products. However, embodiments are not limited thereto, and the foldable display device may be used in various electronic products.

Referring to FIG. 21 , the foldable display may include one folded area in the screen area. For example, the foldable display device may have a C-shape in a folded form. That is, in the foldable display device, one end and the other end opposite to the one end may be superimposed on each other. In this case, the one end and the other end may be disposed close to each other. For example, the one end and the other end may be disposed to face each other.

Referring to FIG. 22 , the foldable display may include two folded areas in the screen area. For example, the foldable display device may have a G-shape in a folded form. That is, as one end and the other end opposite to the one end are folded in directions corresponding to each other, the foldable display device may be superimposed on each other. In this case, the one end and the other end may be disposed to be spaced apart from each other. For example, the one end and the other end may be disposed parallel to each other.

Referring to FIG. 23 , the foldable display may include two folded areas in the screen area. For example, the foldable display device may have an S-shape in a folded form. That is, one end of the foldable display device and the other end opposite to the one end may be folded in different directions. In this case, the one end and the other end may be disposed to be spaced apart from each other. For example, the one end and the other end may be disposed parallel to each other.

In addition, although not shown in the drawings, it goes without saying that the fingerprint recognition module according to the embodiment may be applied to a rollable display.

Referring to FIG. 24 , the fingerprint recognition module according to the embodiment may be included in various wearable touch devices including a curved display. Accordingly, the display device including the fingerprint recognition module according to the embodiment may be slimmed down, downsized, or lightened.

Referring to FIG. 25 , the fingerprint recognition module according to the embodiment may be used in various electronic devices having a display part, such as a TV, a monitor, and a notebook computer.

However, the embodiment is not limited thereto, and the fingerprint recognition module according to the embodiment may be used in various electronic devices having a flat panel or curved display portion.

Features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified for other embodiments by those of ordinary skill in the art to which the embodiments belong. Accordingly, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiments have been described above, these are merely examples and do not limit the present invention, and those of ordinary skill in the art to which the present invention pertains are exemplified above in a range that does not depart from the essential characteristics of the present embodiment. It can be seen that various modifications and applications that have not been made are possible. For example, each component specifically shown in the embodiments may be implemented by modification. And the differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (19)

a substrate including a chip mounting area;
a wiring pattern and a dummy pattern disposed on the substrate; and
a protective layer disposed on the wiring pattern;
The chip mounting region may include a first region in which the wiring pattern is disposed and a second region in which the dummy pattern is disposed. The method of claim 1,
The second region is a fingerprint recognition substrate disposed in a corner region of the chip mounting region. The method of claim 1,
The dummy pattern may include a plurality of guide patterns; and a fingerprint recognition substrate including a guide groove between the guide patterns; The method of claim 1,
The fingerprint recognition substrate is disposed at one end of the guide pattern, and further comprises a connection unit for connecting the guide pattern. a substrate including a first chip mounting region;
a wiring pattern and a dummy pattern disposed on the substrate;
a protective layer disposed on the wiring pattern;
a first chip disposed on the first chip mounting area;
an adhesive layer disposed between the first chip and the wiring pattern;
A fingerprint recognition module in which a spaced region is disposed between the first chip and the substrate. 6. The method of claim 5,
The separation area is 3㎛ or more fingerprint recognition module. 6. The method of claim 5,
The separation area is a fingerprint recognition module containing air. 6. The method of claim 5,
The first chip mounting region includes a first region in which the wiring pattern is disposed and a second region in which the dummy pattern is disposed;
The second region is a fingerprint recognition module disposed in a corner region of the chip mounting region. 6. The method of claim 5,
The dummy pattern may include a plurality of guide patterns; and a guide groove between the guide patterns,
The width of the guide groove is greater than the width of the guide pattern fingerprint recognition module. 10. The method of claim 9,
It is disposed at one end of the guide pattern, the guide pattern further comprises a connecting portion for connecting,
A width of the connection part is greater than a width of the guide pattern and a width of the guide groove. 10. The method of claim 9,
The guide groove includes a first area and a second area,
The first region is disposed closer to the separation region than the second region,
A thickness of the adhesive layer disposed in the second region is greater than a thickness of the adhesive layer disposed in the first region. 12. The method of claim 11,
The adhesive layer is a fingerprint recognition module disposed only in the second area. 12. The method of claim 11,
A fingerprint recognition module in which an adhesive layer is not disposed in the first region. 12. The method of claim 11,
A fingerprint recognition module in which the first region and the guide pattern between the first region are exposed to the outside of the adhesive layer. 12. The method of claim 11,
The second area includes a 2-1 area and a 2-2 area,
The adhesive layer disposed in the 2-1 region is in contact with the first chip,
the 2-2 region is disposed outside the first chip than the 2-1 region;
The thickness of the adhesive layer disposed in the 2-1 region is greater than the thickness of the adhesive layer disposed in the 2-2 region. 12. The method of claim 11,
a third region outside the second region;
The third region is a fingerprint recognition module to which the substrate is exposed. 6. The method of claim 5,
The substrate includes a first surface and a second surface opposite to the first surface,
the first chip is disposed on the first surface;
a second chip and a third chip respectively disposed in a second chip mounting region and a third chip mounting region disposed on the first surface;
The substrate is curved between the first chip mounting area and the second chip mounting area. 6. The method of claim 5,
The substrate includes a first surface and a second surface opposite to the first surface,
the first chip is disposed on the first surface;
The fingerprint recognition module further comprising a second chip and a third chip respectively disposed in a second chip mounting area and a third chip mounting area disposed on the second surface. A fingerprint recognition module according to any one of claims 5 to 18;
a display panel and a cover substrate disposed on the fingerprint recognition module;
and a main board disposed under the fingerprint recognition module.

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