KR20220043762A - resin composition - Google Patents

Abstract

The application provides a resin composition which exhibits adequate viscosity, thixotropy, and/or thermal conductivity before and after curing and exhibits adequate adhesion to effectively maintain a plurality of battery modules before and after curing and re-workability to enable separation and reattachment of modules during an assembly process of a battery pack.

Description

resin composition

This application relates to a resin composition.

Thermal interface material (TIM) refers to any material interposed between two components to improve the thermal coupling between them. In general, a thermal interface material is used as a heat dissipation material. Among these heat dissipating materials, a resin composition in which a thermally conductive filler is blended with resin is known, and Patent Document 1 is known for a battery module to which a resin composition is applied.

Thermal interface materials may sometimes require low adhesion and room temperature hardenability.

A resin having such physical properties is, for example, a silicone resin. Silicone resin is mainly used as a heat dissipation material due to its low adhesive strength and room temperature curability and excellent heat resistance. However, when low molecular weight siloxane is used, there is a problem in that VOC (volatile organic compound) is pressed to the electrode and causes contact defects.

As an alternative to the poor contact problem, a urethane resin or an epoxy resin may be considered. However, both the urethane resin and the epoxy resin have high adhesion, and the epoxy resin has a problem that it takes a long time to cure at room temperature.

Republic of Korea Patent Publication No. 10-2016-0105354

The present application is to provide a resin composition as a thermal interface material that requires room temperature curing and has low adhesion (especially to metals such as aluminum).

An object of the present application is to provide a resin composition exhibiting an appropriate viscosity, thixotropy, and/or thermal conductivity before and after curing.

The present application relates to a resin composition that exhibits adequate adhesion to effectively maintain a plurality of battery modules before and after curing and re-workability to enable separation and reattachment of modules during the assembly process of a battery pack at the same time is intended to provide

Another object of the present application is to provide a resin composition that exhibits room temperature curability and rapid curability even with an excessive amount of filler.

The present application relates to a resin composition which is a thermal interface material that requires room temperature curing and has low adhesion (especially, low adhesion to metals such as aluminum).

In the present application, a urethane reaction may be used as the resin composition. In this case, the main part including the polyol and the like and the curing agent part including the isocyanate compound may react at room temperature to be cured. That is, the composition of the present application may be a curable composition of room temperature curing type.

The term "room temperature" used in this application is a state that is not particularly heated or reduced, and is at any one temperature within the range of about 10 ° C. to 30 ° C., for example, about 15 ° C. or more, about 18 ° C. or more, about 20 ° C. or higher, or about 23 °C or higher, and may mean a temperature of about 27 °C or lower.

In an example of the present application, the resin composition is a one-component type in which a curing reaction occurs when a specific condition (eg, temperature and ultraviolet irradiation) is satisfied in a state in which the main part, the curing agent part, and a compound that inhibits curing thereof are mixed. It may be a composition.

In an example of the present application, the resin composition may be a two-component composition in which the main part and the curing agent part are mixed without mixing, and the curing reaction is performed with the help of a catalyst or the like.

In an example of the present application, the resin composition may include a filler. For example, in order to secure thixotropy as needed in the process, and/or to ensure heat dissipation (thermal conductivity) within a battery module or battery pack, the composition of the present application contains an excess of filler as described below. may be included. Specific details are described in detail in the related description below.

Unless otherwise stated, the term alkyl group or alkylene group used in the present application has 1 to 20 carbon atoms, or 1 to 16 carbon atoms, or 1 to 12 carbon atoms, or 1 to 8 carbon atoms, or a straight chain or branched chain having 1 to 6 carbon atoms. A chain acyclic alkyl group or alkylene group, or a cyclic alkyl group or alkylene group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms, or an alkylene group, or a combination thereof It may be a saturated hydrocarbon group.

The term alkenyl group or alkenylene group used in the present application, unless otherwise specified, has 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms straight chain or branched. an acyclic alkenyl group or an alkenylene group in the chain; It may be a cyclic alkenyl group or alkenylene group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms, or an unsaturated hydrocarbon group to which they are bonded.

Unless otherwise stated, the alkynyl group or alkynylene group as used in the present application has 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms straight or branched. A chain alkynyl group or alkynylene group, or a cyclic alkynyl group or alkynyl group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms It may be a lene group or an unsaturated hydrocarbon group to which they are bonded.

An aryl group as a term used in the present application may mean an aromatic ring in which one hydrogen is removed from an aromatic hydrocarbon ring unless otherwise specified. The aryl group may be monocyclic or polycyclic.

The term heteroaryl group used in the present application, unless otherwise stated, as an atom forming a ring may mean a substituent including an aromatic ring containing one or more hetero atoms (eg, N, O, S, etc.) there is. The heteroaryl group may be monocyclic or polycyclic.

The alkyl group, alkylene group, alkenyl group, alkenylene group, alkynyl group, alkynylene group, aryl group or heteroaryl group may be optionally substituted with one or more substituents. In this case, the substituent includes halogen (chloro (Cl), iodine (I), bromo (Br), fluorine (F)), an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an ether group and a hydroxyl group. It may be one or more selected from the group consisting of, but is not limited thereto.

The term "thermal conductivity" as used in this application, in a state in which the resin composition is prepared as a sample (hardened product) having a diameter of 2 cm or more and a thickness of 500 μm, is ASTM D5470 standard or ISO along the thickness direction of the sample. When measured according to the 22007-2 standard, it may mean a case showing thermal conductivity of about 1.2 W/m·K or more.

In another example, the thermal conductivity is 1.3 W/m·K or more, 1.4 W/m·K or more, 1.5 W/m·K or more, 1.6 W/m·K or more, 1.7 W/m·K or more, 1.8 W/ m K or more, 1.9 W/m K or more, 2.0 W/m K or more, 2.1 W/m K or more, 2.2 W/m K or more, 2.3 W/m K or more, 2.4 W/m K or more It may be about K or more or 2.5 W/m·K or more. Since the higher the thermal conductivity, the higher the thermal conductivity, the upper limit thereof is not particularly limited. For example, the thermal conductivity is 20 W/m·K or less, 18 W/m·K or less, 16 W/m·K or less, 14 W/m·K or less, 12 W/m·K or less, 10 W /m·K or less, 8 W/m·K or less, 6 W/m·K or less, or 5 W/m·K or less.

The resin composition according to the present application includes a main part having a polyol component; and a curing agent part having an isocyanate component.

1. Topic Part

The resin composition according to the present application includes a main part having a polyol component. As the polyol component of the main part, polyester polyol may be used, and when it is used, it is advantageous to ensure proper adhesion and adhesion reliability after curing the resin composition.

The polyol component of the subject part according to the present application may include a polymer diol compound and a polymer multiol compound. In this case, the diol compound refers to a compound containing two hydroxyl groups, and the multiol compound refers to a compound containing three or more hydroxyl groups. In addition, the polymer refers to a compound having a number average molecular weight (M _n ) of 200 g/mol or more. Here, as the multiol compound, a triol compound, which is a compound containing three hydroxyl groups, is suitable. Unless otherwise specified, in the present application, the number average molecular weight (M _n ) may be measured using Gel Permeation Chromatography (GPC).

The polymer diol compound may be exemplified by polyethylene glycol and polypropylene glycol, but is not particularly limited as long as it contains two hydroxyl groups and has a number average molecular weight of 200 g/mol or more. In addition, even if the same type of polymeric diol compound is used, mixtures having different average molecular weights may be mixed and used.

The polymer triol compound may be exemplified by polyethylene triol and polypropylene triol, but is not particularly limited as long as it contains three hydroxyl groups and has a number average molecular weight of 200 g/mol or more. In addition, even if the same type of polymer triol compound is used, mixtures having different average molecular weights may be mixed and used.

Similarly, the type of the polymer multiol compound other than the polymer triol compound is not particularly limited as long as it contains 4 or more hydroxyl groups and has a number average molecular weight of 200 g/mol or more.

The high molecular weight diol compound has a number average molecular weight (M _n ) of about 300 g/mol or more, 400 g/mol or more, 500 g/mol or more, 600 g/mol or more, 700 g/mol or more, 800 g/mol or more, 900 g/mol or more, 1,000 g/mol or more, 1,500 g/mol or more, 2,000 g/mol or more, 2,500 g/mol or more, 3,000 g/mol or more, 3,500 g/mol or more, 4,000 g/mol or more, 4,500 g/mol mol or more, 5,000 g/mol or more, 5,500 g/mol or more, or 5,750 g/mol or more. In addition, in another example, the high molecular weight diol compound has a number average molecular weight (M _n ) of about 6,000 g/mol or less, 5,500 g/mol or less, 5,000 g/mol or less, 4,500 g/mol or less, 4,000 g/mol or less, 3,500 or less. g/mol or less, 3,000 g/mol or less, 2,500 g/mol or less, 2,000 g/mol or less, 1,500 g/mol or less, 1,000 g/mol or less, 900 g/mol or less, 800 g/mol or less, 700 g/mol or less mol or less, 600 g/mol or less, 500 g/mol or less, 400 g/mol or less, or 350 g/mol or less.

The high molecular weight multiol compound has a number average molecular weight (M _n ) of about 300 g/mol or more, 400 g/mol or more, 500 g/mol or more, 600 g/mol or more, 700 g/mol or more, 800 g/mol or more, 900 g/mol or more, 1,000 g/mol or more, 1,500 g/mol or more, 2,000 g/mol or more, 2,500 g/mol or more, 3,000 g/mol or more, 3,500 g/mol or more, 4,000 g/mol or more, 4,500 g /mol or more, 5,000 g/mol or more, 5,500 g/mol or more, or 5,750 g/mol or more. In addition, in another example, the polymer multiol compound has a number average molecular weight (M _n ) of about 6,000 g/mol or less, 5,500 g/mol or less, 5,000 g/mol or less, 4,500 g/mol or less, 4,000 g/mol or less, 3,500 g/mol or less, 3,000 g/mol or less, 2,500 g/mol or less, 2,000 g/mol or less, 1,500 g/mol or less, 1,000 g/mol or less, 900 g/mol or less, 800 g/mol or less, 700 g /mol or less, 600 g/mol or less, 500 g/mol or less, 400 g/mol or less, or 350 g/mol or less.

The content of the polymer multiol compound may be 20 wt% or more, 25 wt% or more, 30 wt% or more, 35 wt% or more, 40 wt% or more, 45 wt% or more, or 50 wt% or more, based on the total weight of the polyol component, and other In an example, the content of the polymer multiol compound may be 80 wt% or less, 75 wt% or less, 70 wt% or less, 65 wt% or less, 60 wt% or less, or 55 wt% or less based on the total weight of the polyol component.

In addition, the content of the polymeric diol compound is 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, based on 100 parts by weight of the polymer multiol compound. , 75 parts by weight or more or 80 parts by weight or more, in another example, the content of the polymeric diol compound is 200 parts by weight or less, 150 parts by weight or less, 140 parts by weight or less, 130 parts by weight compared to 100 parts by weight of the polymer multiol compound or less, 120 parts by weight or less, 110 parts by weight or less, 100 parts by weight or less, or 90 parts by weight or less.

The range of the content of the polymeric diol compound and the polymeric multiol compound is in consideration of mixing with at least one compound selected from the group consisting of an alcohol compound and a thiol compound, which will be described later. When the content of the polymer diol compound and the polymer multiol compound satisfies the above ranges, it is possible to secure a resin composition having reworkability by implementing low adhesion to metals such as aluminum.

Any one of the high molecular diol compound and the high molecular multiol compound of the polyol component may be a polyester polyol.

The number average molecular weight (M _n ) of the polyester polyol may be adjusted in consideration of appropriate viscosity, adhesion, and reworkability. For example, the number average molecular weight (M _n ) of the polyester polyol is about 300 g/mol or more, 400 g/mol or more, 500 g/mol or more, 600 g/mol or more, 700 g/mol or more, 800 g/mol or more. mol or more, 900 g/mol or more, 1,000 g/mol or more, 1,500 g/mol or more, 2,000 g/mol or more, 2,500 g/mol or more, 3,000 g/mol or more, 3,500 g/mol or more, 4,000 g/mol or more , 4,500 g/mol or more, 5,000 g/mol or more, 5,500 g/mol or more, or 5,750 g/mol or more. In addition, in another example, the number average molecular weight (M _n ) of the polyester polyol is about 6,000 g/mol or less, 5,500 g/mol or less, 5,000 g/mol or less, 4,500 g/mol or less, 4,000 g/mol or less, 3,500 g /mol or less, 3,000 g/mol or less, 2,500 g/mol or less, 2,000 g/mol or less, 1,500 g/mol or less, 1,000 g/mol or less, 900 g/mol or less, 800 g/mol or less, 700 g/mol or less or less, 600 g/mol or less, 500 g/mol or less, 400 g/mol or less, or 350 g/mol or less. When the number average molecular weight (M _n ) of the polyester polyol is within the above range, problems related to volatile components may be improved.

The polyester polyol according to the present application may be, for example, a carboxylic acid-based polyol. The carboxylic acid-based polyol may be formed by reacting a component including a carboxylic acid and a compound having a polyfunctional hydroxyl group. In this case, the carboxylic acid may be dicarboxyl acid.

In another example, the polyester polyol according to the present application may include a compound represented by the following Chemical Formula 1.

[Formula 1]

In Formula 1, R ₁ may be an alkyl group, an alkenyl group, or an alkynyl group unsubstituted or substituted with a hydroxyl group.

In addition, L ₁ and L ₂ may each independently be a single bond, an alkyl group, an alkenyl group, or an alkynyl group. L ₁ and L ₂ are each independently preferably an alkyl group having 1 to 8 carbon atoms, and more preferably each independently an alkyl group having 1 to 4 carbon atoms.

In addition, l and m may each independently be an integer within the range of 0 to 10, and l+m is 1 or more. That is, l and m cannot be 0 at the same time, if l is 0, m must be 1 or more, and if m is 0, l must be 1 or more.

In addition, X ₁ and X ₂ may each independently be an alkyl group, an alkenyl group, or an alkynyl group. It is preferable that X ₁ and X ₂ are each independently an alkyl group having 1 to 12 carbon atoms, and more preferably, each independently an alkyl group having 3 to 9 carbon atoms.

In addition, Y ₁ and Y ₂ may each independently be an alkyl group, an alkenyl group, or an alkynyl group. Y ₁ and Y ₂ are each independently preferably an alkyl group having 1 to 12 carbon atoms, and more preferably each independently an alkyl group having 1 to 8 carbon atoms.

In addition, R ₂ may be hydrogen, an alkyl group, an alkenyl group, an alkynyl group, or a functional group represented by Formula 2 below.

[Formula 2]

In Formula 2, L ₃ may be a single bond, an alkyl group, an alkenyl group, or an alkynyl group. L ₃ is preferably an alkyl group having 1 to 8 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms.

In addition, X ₃ may be an alkyl group, an alkenyl group, or an alkynyl group. X ₃ is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 3 to 9 carbon atoms.

In addition, Y ₃ may be an alkyl group, an alkenyl group, or an alkynyl group. Y ₃ is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 8 carbon atoms.

Also, n may be an integer within the range of 0 to 10.

1 and m in Formula 1 and n in Formula 2 may be selected in consideration of desired physical properties of the resin composition or a cured product thereof. When l and m in Formula 1 and n in Formula 2 are within the above ranges, it is possible to improve the injection processability of the composition while suppressing the crystallinity of the polyol component.

In addition, the polyester polyol according to the present application includes the compound represented by Chemical Formula 1, and may include two or more compounds of different types but included in the scope of Chemical Formula 1.

The content of the polyester polyol is preferably within the range of 30 to 70% by weight, within the range of 35 to 65% by weight, or within the range of 40 to 60% by weight relative to the total weight of the polyol, and the content of the polyester polyol satisfies the above range If it is not possible, it is impossible to mix and form a cured product.

Any one of the high molecular diol compound and the high molecular multiol compound of the polyol component may be a polyester polyol, and the other may be a polyether polyol. Details regarding the polyester polyol are the same as those described above.

The number average molecular weight (M _n ) of the polyether polyol may be determined according to the number average molecular weight (M _n ) of the polyester polyol. The ratio (M _n1 /M _n2 ) of the number average molecular weight (M _n1 ) of the polyester polyol and the number average molecular weight (M _n2 ) of the polyether polyol may be in the range of 0.5 to 2. In another example, the ratio (M _n1 /M _n2 ) of the number average molecular weight (M _n1 ) of the polyester polyol and the number average molecular weight (M _n2 ) of the polyether polyol is in the range of 0.75 to 1.5 or within the range of 0.8 to 1.25 can When the ratio (M _n1 /M _n2 ) of the number average molecular weight (M _n1 ) of the polyester polyol to the number average molecular weight (M _n2 ) of the polyether polyol satisfies the above range, the resin composition has an appropriate viscosity, adhesiveness and reworkability can be obtained

The number average molecular weight (M _n ) of the polyether polyol satisfies the ratio with the number average molecular weight of the polyester polyol, and is about 300 g/mol or more, 400 g/mol or more, 500 g/mol or more, 600 g/mol or more, 700 g/mol or more, 800 g/mol or more, 900 g/mol or more, 1,000 g/mol or more, 1,500 g/mol or more, 2,000 g/mol or more, 2,500 g/mol or more, 3,000 g/mol or more, 3,500 g/mol or more, 4,000 g/mol or more, 4,500 g/mol or more, 5,000 g/mol or more, 5,500 g/mol or more, or 5,750 g/mol or more. In addition, in another example, the number average molecular weight (M _n ) of the polyether polyol is about 6,000 g/mol or less, 5,500 g/mol or less, 5,000 g/mol or less, while satisfying the ratio with the number average molecular weight of the polyester polyol. , 4,500 g/mol or less, 4,000 g/mol or less, 3,500 g/mol or less, 3,000 g/mol or less, 2,500 g/mol or less, 2,000 g/mol or less, 1,500 g/mol or less, 1,000 g/mol or less, 900 g/mol or less, 800 g/mol or less, 700 g/mol or less, 600 g/mol or less, 500 g/mol or less, 400 g/mol or less, or 350 g/mol or less.

The polyether polyol may be polyalkylene glycol. For example, it may be exemplified by polyethylene glycol and polypropylene glycol, but is not limited thereto.

The polyol component contains 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, 75 parts by weight or more, or 80 parts by weight or more of the polyether polyol, based on 100 parts by weight of the polyester polyol. In another example, 120 parts by weight or less, 115 parts by weight or less, 110 parts by weight or less, 105 parts by weight or less, 100 parts by weight or less, or 90 parts by weight or less of the polyether polyol based on 100 parts by weight of the polyester polyol. can do.

The subject part of the resin composition according to the present application may further include an alcohol compound and/or a thiol compound.

Since the main part of the resin composition according to the present application contains an alcohol compound or a thiol compound in addition to the polyol component, it is possible to secure a resin composition that forms a cured product having desired elastic strength and tensile strength.

At this time, the elastic force and tensile strength can be expressed as a radius of curvature, and the appropriate elastic force and tensile strength are about 10 cm in width, 10 cm in length, and 2 mm in height, for a cured product sample prepared using a resin composition to have a radius of curvature. It may mean a case where a curved surface of less than mm can be formed. The radius of curvature may be less than 9 mm, less than 8 mm, less than 7 mm, less than 6 mm, less than 5 mm, or less than 4 mm in another example.

An alcohol compound is a compound containing one hydroxyl group, and a thiol compound is a compound containing one thiol group.

As an example, the alcohol compound according to the present application may be represented by the following Chemical Formula 3.

[Formula 3]

In Formula 3, R ₁ is a single bond, an alkylene group, an alkenylene group, or an alkynylene group, and R ₂ , R ₃ and R ₄ may each independently be hydrogen, an alkyl group, an alkenyl group, or an alkynyl group. In addition, in Formula 2, the sum of carbon atoms present in R ₂ , R ₃ , and R ₄ may be in the range of 1 to 12, 2 to 10, 3 to 9, or 4 to 8.

In addition, in Chemical Formula 3, considering an appropriate elastic force, R ₁ is a single bond or an alkylene group, and R ₂ , R ₃ and R ₄ may each independently be hydrogen or an alkyl group. Also at this time, the sum of carbon atoms present in R ₂ , R ₃ , and R ₄ may be in the range of 1 to 12, 2 to 10, 3 to 9, or 4 to 8.

The thiol compound according to the present application may, for example, be represented by the following Chemical Formula 4.

[Formula 4]

In Formula 4, R ₅ is a single bond, an alkylene group, an alkenylene group, or an alkynylene group, and R ₆ , R ₇ and R ₈ may each independently be hydrogen, an alkyl group, an alkenyl group, or an alkynyl group. In addition, in Formula 3, the sum of carbon atoms present in R ₆ , R ₇ , and R ₈ may be in the range of 1 to 12, 2 to 10, 3 to 9, or 4 to 8.

In addition, in Chemical Formula 4, considering an appropriate elastic force, R ₅ is a single bond or an alkylene group, and R ₆ , R ₇ and R ₈ may each independently be hydrogen or an alkyl group. Also at this time, the sum of carbon atoms present in R ₆ , R ₇ and R ₈ may be in the range of 1 to 12, 2 to 10, 3 to 9, or 4 to 8.

Alcohol compounds include ethanol, propanol, butanol, pentanol, hexanol, heptanol, octanol, 2-ethylhexanol, nonanol, decanol, 2-propylheptanol, ethenol, protenol, butenol, acetylenol , propainol, butynol, phenol, methylphenol, pyridinol and methylpyridinol may be exemplified, but it is not particularly limited as long as it contains one hydroxyl group. In addition, 1 type or 2 or more types can be used for an alcohol compound.

The thiol compound is ethanethiol, propanethiol, butanethiol, pentanethiol, hexanethiol, heptanethiol, octanethiol, 2-ethylhexanethiol, nonanethiol, decanethiol, 2-propylheptanethiol, ethenethiol, protenethiol , butenethiol, acetylenethiol, propinethiol, butynthiol, benzenethiol, methylbenzenethiol, pyridinethiol and methylpyridinethiol may be exemplified, but if it contains one thiol group, it is not particularly limited. In addition, 1 type or 2 or more types can be used for a thiol compound.

The content of the alcohol compound or thiol compound may be 5 parts by weight or more, 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, or 30 parts by weight or more, based on 100 parts by weight of the polyester polyol, and in another example It may be 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, 45 parts by weight or less, or 40 parts by weight or less based on 100 parts by weight of the polyester polyol. When the content of the alcohol compound or the thiol compound satisfies the above range, it is possible to secure an appropriate viscosity before and after curing to improve workability.

The main part of the resin composition according to the present application may further include a filler. The filler may be a thermally conductive filler, and the thermally conductive filler is a filler capable of forming a cured product having thermal conductivity as described above.

The thermal conductivity of the thermally conductive filler itself may be, for example, about 1 W/m·K or more, about 5 W/m·K or more, about 10 W/m·K or more, or about 15 W/m·K or more. In another example, the thermal conductivity of the thermally conductive filler itself may be, for example, about 400 W/m·K or less, about 350 W/m·K or less, or about 300 W/m·K or less.

Examples of the thermally conductive filler include oxides such as aluminum oxide (alumina), magnesium oxide, beryllium oxide or titanium oxide; nitrides such as boron nitride, silicon nitride or aluminum nitride, and carbides such as silicon carbide; Hydrated metals, such as aluminum hydroxide or magnesium hydroxide, Metal fillers, such as copper, silver, iron, aluminum, or nickel; metal alloy fillers such as titanium; It may be a silicon powder such as quartz, glass or silica, but is not limited thereto.

In addition, if insulating properties can be secured, application of a carbon filler such as graphite may be considered. For example, the carbon filler may use activated carbon. The form or ratio of the filler included in the cured product is not particularly limited, and is selected in consideration of the viscosity of the curable composition, the possibility of sedimentation in the cured product, desired thermal resistance or thermal conductivity, insulation, filling effect or dispersibility, etc. can be

The shape of the thermally conductive filler may be appropriately selected from spherical and/or non-spherical (eg, needle-shaped and plate-shaped, etc.) as needed, and is not limited thereto.

The thermally conductive filler can use 1 type(s) or 2 or more types suitably selected as needed. In addition, even if the same type of thermally conductive filler is used, different shapes may be mixed and used, or those having different average particle diameters may be mixed and used. For example, aluminum hydroxide, aluminum, and alumina may be mixed and used as a thermally conductive filler, and their shapes and average particle diameters may be different from each other.

In general, the smaller the size of the thermally conductive filler, the higher the viscosity of the curable composition and the higher the likelihood that the thermally conductive filler will settle in the cured product of the curable composition. In addition, as the size of the filler increases, the thermal resistance tends to increase. Therefore, an appropriate type of filler may be selected in consideration of the above points, and if necessary, two or more types of fillers may be used.

In addition, it is advantageous to use a spherical thermally conductive filler in consideration of the amount to be filled, but a thermally conductive filler in a form such as a needle-shaped or plate-shaped filler in consideration of network formation or conductivity may also be used.

In one example, the curable composition may include a thermally conductive filler having an average particle diameter in the range of 0.001 μm to 80 μm. The average particle diameter of the thermally conductive filler may be 0.01 μm or more, 0.1 or more, 0.5 μm or more, 1 μm or more, 2 μm or more, 3 μm or more, 4 μm or more, 5 μm or more, or about 6 μm or more in another example. In another example, the average particle diameter of the thermally conductive filler is about 75 μm or less, about 70 μm or less, about 65 μm or less, about 60 μm or less, about 55 μm or less, about 50 μm or less, about 45 μm or less, about 40 μm or less , about 35 μm or less, about 30 μm or less, about 25 μm or less, about 20 μm or less, about 15 μm or less, about 10 μm or less, or about 5 μm or less.

In this case, the average particle diameter of the thermally conductive filler is a so-called D50 particle diameter (median particle diameter), and may mean a particle diameter at 50% cumulative by volume of the particle size distribution. That is, the particle size distribution is obtained on the basis of the volume, and the average particle diameter can be viewed as the particle diameter at the point where the cumulative value becomes 50% on the cumulative curve with 100% of the total volume. The D50 particle size as described above may be measured by a laser diffraction method.

According to the size of the thermally conductive filler, it can be divided into a large thermally conductive filler, a medium thermally conductive filler, and a small thermally conductive filler. The large thermally conductive filler may have an average particle diameter of 80 μm or less, 78 μm or less, 76 μm or less, 74 μm or less, or 72 μm or less. In another example, the large thermally conductive filler may have an average particle diameter of 60 μm or more, 62 μm or more, 64 μm or more, 66 μm or more, or 68 μm or more. The medium-sized thermally conductive filler may have an average particle diameter of 58 μm or less, 50 μm or less, 40 μm or less, or 25 μm or less. In another example, the medium-sized thermally conductive filler may have an average particle diameter of 10 μm or more, 12.5 μm or more, 15 μm or more, or 17.5 μm or more. The small thermally conductive filler may have an average particle diameter of 9 μm or less, 5 μm or less, or 3 μm or less. In another example, the small thermally conductive filler may have an average particle diameter of 0.001 μm or more, 0.01 μm or more, 0.05 μm or more, 0.1 μm or more, 0.2 μm or more, 0.4 μm or more, 0.8 μm or more, or 1 μm or more.

The thermally conductive filler may be used by selecting two or more of a large thermally conductive filler, a medium thermally conductive filler, and a small thermally conductive filler. In this case, the thermally conductive filler may satisfy the content ratio and/or particle size ratio within the following ranges so as to ensure fast curing at room temperature through an appropriate combination with each component included in the curable composition of the present application.

When the thermally conductive filler includes a large thermally conductive filler, the content of the large thermally conductive filler is 30% by weight or more, 37.5% by weight or more, 42.5% by weight or more, 47.5% by weight or more, 50% by weight relative to the total weight of the thermally conductive filler or more, 52.5 wt% or more, 55 wt% or more, or 57.5 wt% or more. In another example, the content of the large thermally conductive filler is 87.5% by weight or less, 80% by weight or less, 75% by weight or less, 72.5% by weight or less, 70% by weight or less, 67.5% by weight or less, 65% by weight or less, based on the total weight of the thermally conductive filler % or less or 62.5 wt% or less. Moreover, it is preferable that a large sized thermally conductive filler is a spherical particle.

When the thermally conductive filler includes a medium thermally conductive filler, the content of the medium thermally conductive filler is 5% by weight or more, 10% by weight or more, 12% by weight or more, 14% by weight or more, 16% by weight or more, based on the total weight of the thermally conductive filler or more, 18 wt% or more, or 20 wt% or more. In another example, the content of the medium-sized thermally conductive filler is 52.5% by weight or less, 50% by weight or less, 45% by weight or less, 40% by weight or less, 36% by weight or less, 32% by weight or less, 28% by weight or less, based on the total weight of the thermally conductive filler % or less, 24 wt% or less, or 20 wt% or less. Moreover, it is preferable that a medium-sized thermally conductive filler is a spherical particle.

When the thermally conductive filler includes a small thermally conductive filler, the content of the small thermally conductive filler is 5% by weight or more, 10% by weight or more, 12% by weight or more, 14% by weight or more, 16% by weight of the total weight of the thermally conductive filler or more, 18 wt% or more, or 20 wt% or more. In another example, the content of the small thermally conductive filler is 52.5% by weight or less, 50% by weight or less, 45% by weight or less, 40% by weight or less, 36% by weight or less, 32% by weight or less, 28% by weight or less, based on the total weight of the thermally conductive filler % or less, 24 wt% or less, or 20 wt% or less. In addition, it is preferable that the small-sized thermally conductive fillers are non-spherical (square-shaped, etc.) particles.

When the thermally conductive filler includes a large thermally conductive filler and a medium thermally conductive filler, the content of the medium thermally conductive filler is 25 parts by weight compared to 100 parts by weight of the large thermally conductive filler, considering the room temperature rapid curing of the curable composition according to the present application It is preferable that at least 26 parts by weight, at least 27 parts by weight, at least 28 parts by weight, at least 29 parts by weight, or at least 30 parts by weight. In another example, considering the room temperature rapid curing of the curable composition according to the present application, the content of the medium-sized thermally conductive filler is 45 parts by weight or less, 42.5 parts by weight or less, 40 parts by weight or less, 37.5 parts by weight compared to 100 parts by weight of the large thermally conductive filler. It is preferable that it is less than or equal to 35 parts by weight or less. In addition, the value of the average particle diameter (D1) of the large-sized thermally conductive filler / the average particle diameter (D2) of the medium-sized thermally conductive filler is preferably 2 or more, 2.25 or more, 2.5 or more, 2.75 or more, 3 or more, 3.25 or more, or 3.5 or more, It is preferable that they are 5 or less, 4.5 or less, 4.25 or less, 4 or less, 3.75 or less, or 3.5 or less. When the large-size and medium-sized thermally conductive fillers satisfy the above range, it is possible to secure room temperature fast curing of the curable composition according to the present application.

When the thermally conductive filler includes a large thermally conductive filler and a small thermally conductive filler, the content of the small thermally conductive filler is 25 parts by weight compared to 100 parts by weight of the large thermally conductive filler, considering the room temperature rapid curing of the curable composition according to the present application It is preferable that at least 26 parts by weight, at least 27 parts by weight, at least 28 parts by weight, at least 29 parts by weight, or at least 30 parts by weight. In another example, considering the room temperature rapid curing of the curable composition according to the present application, the content of the small thermal conductive filler is 45 parts by weight or less, 42.5 parts by weight or less, 40 parts by weight or less, 37.5 parts by weight compared to 100 parts by weight of the large thermal conductive filler. It is preferable that it is less than or equal to 35 parts by weight or less. In addition, the value of the average particle diameter (D1) of the large thermal conductive filler / the average particle diameter (D3) of the small thermal conductive filler is preferably 10 or more, 15 or more, 20 or more, 25 or more, 30 or more, or 32.5 or more, and 500 or less, It is preferably 100 or less, 90 or less, 80 or less, 70 or less, 60 or less, or 50 or less. When the large-size and small-sized thermally conductive fillers satisfy the above ranges, it is possible to secure room temperature fast curing of the curable composition according to the present application.

In the present application, it is most preferable to use a thermally conductive filler including all of a large thermally conductive filler, a medium thermally conductive filler, and a small thermally conductive filler. At this time, the content ratio of each particle and the average particle diameter ratio are as described above, and through the binder component and an appropriate combination thereof, it is possible to secure room temperature fast curing of the curable composition according to the present application.

The thermally conductive filler may include spherical and non-spherical particles. In the present application, the term spherical particle means a particle having a sphericity of about 0.95 or more, and a non-spherical particle means a particle having a sphericity of less than 0.95. The sphericity can be confirmed through particle shape analysis. Specifically, the sphericity of the filler, which is a three-dimensional particle, may be defined as a ratio (S'/S) of the surface area (S) of the particle to the surface area (S') of a sphere having the same volume of the particle. For real particles, we usually use circularity. The circularity is obtained by obtaining a two-dimensional image of an actual particle and expressed as a ratio of the boundary P of the image and the boundary of a circle having the same area (A) as the image, and is obtained by the following equation.

<Circularity formula>

Circularity=4πA/P ²

The circularity is expressed as a value from 0 to 1, a perfect circle has a value of 1, and irregularly shaped particles have a value lower than 1. The sphericity value in this specification was taken as the average value of the circularity measured with Marvern's vertical analysis equipment (FPIA-3000).

Considering appropriate viscosity and thixotropy of the curable composition according to the present application, the content of non-spherical particles is 10 parts by weight or more, 12.5 parts by weight or more, 15 parts by weight or more, 17.5 parts by weight or more, 20 parts by weight based on 100 parts by weight of the spherical particles. The amount may be at least 22.5 parts by weight, and in another example, 45 parts by weight or less, 40 parts by weight or less, 35 parts by weight or less, or 30 parts by weight or less.

In order to obtain excellent heat dissipation performance, it may be considered that a high content of the thermally conductive filler is used. The content of the filler in the main part is 300 parts by weight or more, 400 parts by weight or more, 500 parts by weight or more, 600 parts by weight or more, 700 parts by weight or more, 800 parts by weight or more, 900 parts by weight or more, or 1,000 parts by weight based on 100 parts by weight of the polyol component. It may be more than 1 part by weight. In another example, the content of the filler may be 2,000 parts by weight or less, 1,800 parts by weight or less, 1,600 parts by weight or less, 1,400 parts by weight or less, or 1,200 parts by weight or less, based on 100 parts by weight of the polyol component.

2. Hardener part

The resin composition according to the present application includes a curing agent part having an isocyanate component. The isocyanate component of the curing agent part may include a bifunctional isocyanate compound and a trifunctional or more polyfunctional isocyanate compound.

In this case, the polyfunctional isocyanate compound means a compound containing three or more isocyanate groups. In addition, as the polyfunctional isocyanate compound, a trifunctional isocyanate compound, which is a compound containing three isocyanate groups, is suitable.

The curing agent part of the resin composition according to the present application includes a bifunctional isocyanate compound and a polyfunctional isocyanate compound at the same time, thereby securing a resin composition that forms a cured product having desired hardness, adhesion and reworkability. Specifically, when the difunctional isocyanate compound is not included, the hardness increases and the resin composition is cured after being brittle and the flexibility is lowered. In addition, in the case where the polyfunctional isocyanate compound is not included, the adhesive strength increases and it is difficult to secure the desired reworkability.

The kind in particular of a bifunctional isocyanate compound and a polyfunctional isocyanate compound is not restrict|limited. However, in order to secure the desired physical properties, a non-aromatic isocyanate compound that does not contain an aromatic group may be used. That is, it may be advantageous to use an aliphatic or cycloaliphatic series. When an aromatic polyisocyanate is used, since the reaction rate is excessively fast and the glass transition temperature of the cured product may be high, it may be difficult to secure processability and physical properties suitable for the use of the composition of the present application.

At least one of an aliphatic difunctional isocyanate compound and an alicyclic difunctional isocyanate compound may be used as the bifunctional isocyanate compound according to the present application. The aliphatic difunctional isocyanate compound may be exemplified by hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate, and tetramethylene diisocyanate, and in particular, thereto. It is not limited. The alicyclic difunctional isocyanate compound may be exemplified by transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatemethyl)cyclohexane diisocyanate and dicyclohexylmethane diisocyanate, and the like, and is particularly limited thereto. it is not In addition, 1 type or 2 or more types can be used for a bifunctional isocyanate compound.

The polyfunctional isocyanate compound according to the present application is not particularly limited as long as it is a compound containing three or more isocyanate groups. The polyfunctional isocyanate compound according to the present application may use, for example, a multimer or more of a trimer of the isocyanate compound, and a compound in the form of a biuret obtained by reacting the isocyanate compound with water may also be used. . That is, at least one selected from a multimer of an isocyanate compound and a biuret compound may be used as the polyfunctional isocyanate compound.

Specifically, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate, tetramethylene diisocyanate, transcyclohexane-1,4-diisocyanate, Polymers, such as isophorone diisocyanate, bis(isocyanate methyl) cyclohexane diisocyanate, and dicyclohexylmethane diisocyanate, and the compound in the form of a biuret can be mentioned as an example of a polyfunctional isocyanate compound.

The content of the polyfunctional isocyanate compound may be 30% by weight or more, 35% by weight or more, 40% by weight or more, 45% by weight or more, 50% by weight or more, 55% by weight or more, or 60% by weight or more, and other In an example, the content of the polyfunctional isocyanate compound may be 85 wt% or less, 80 wt% or less, 75 wt% or less, 70 wt% or less, or 65 wt% or less based on the total weight of the isocyanate component.

The content of the bifunctional isocyanate compound is 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, or It may be 55 parts by weight or more. In another example, the content of the bifunctional isocyanate compound is 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, or It may be 65 parts by weight or less.

When the content of the polyfunctional isocyanate compound and the content of the bifunctional isocyanate compound satisfy the above ranges, respectively, it is possible to secure a resin composition for forming a cured product having reworkability and flexibility.

In order to obtain excellent heat dissipation performance, it may be considered that a high content of the thermally conductive filler is used. The content of the filler in the curing agent part is 500 parts by weight or more, 600 parts by weight or more, 700 parts by weight or more, 800 parts by weight or more, 900 parts by weight or more, 1,000 parts by weight or more, 1,100 parts by weight or more, 1,200 parts by weight or more based on 100 parts by weight of the isocyanate component. parts by weight or more, 1,300 parts by weight or more, 1,400 parts by weight or more, 1,500 parts by weight or more, 1,600 parts by weight or more, 1,700 parts by weight or more, or 1,800 parts by weight or more. In another example, the content of the filler may be 3,000 parts by weight or less, 2,800 parts by weight or less, 2,600 parts by weight or less, 2,400 parts by weight or less, 2,200 parts by weight or less, or 2,100 parts by weight or less based on 100 parts by weight of the isocyanate component.

In addition, the filler used in the curing agent part may have the same characteristics as the content of the filler described in the main part except for the content ratio.

3. Resin composition and cured product thereof

As described above, the resin composition according to the present application may be a one-component or two-component composition.

In the resin composition according to the present application, the ratio (V1/V2) of the volume (V1) of the main part to the volume (V2) of the curing agent part may be in the range of 0.5 to 1.5 or 0.75 to 1.25. When the ratio (V1/V2) of the volume (V1) of the main part to the volume (V2) of the curing agent part satisfies the above range, the urethane reaction may be efficiently performed.

In the resin composition according to the present application, the main part and the curing agent part may be physically separated.

The resin composition of the present application may contain an excessive amount of filler in order to secure heat dissipation (thermal conductivity) or to secure thixotropy as required in the process. When an excessive amount of filler is used, the viscosity of the composition increases and the processability of injecting the composition into the case of the battery module may deteriorate. Therefore, while containing an excess of filler, sufficient low-viscosity properties are required so as not to interfere with processability. In addition, if only low viscosity is shown, proper thixotropy is required because it is also difficult to secure fairness, exhibits desired appropriate adhesive strength while curing, and curing itself may be required to proceed at room temperature.

In the resin composition according to the present application, when the main part and the curing agent part are mixed, the content of the filler is 75 wt% or more, 76 wt% or more, 77 wt% or more, 78 wt% or more, 79 wt%, based on the total weight of the mixture % or more, 80% or more, 81% or more, 82% or more, 83% or more, 84% or more, 85% or more, 86% or more, 87% or more, or 88% or more. In another example, the content of the filler is 96 wt% or less, 95 wt% or less, 94 wt% or less, 93 wt% or less, 92 wt% or less, 91 wt% or less, 90 wt% or less, or 89 wt% or less based on the total weight of the mixture weight % or less.

The resin composition according to the present application may further include a plasticizer, if necessary. The plasticizer is an additive that reduces the viscosity or plasticity of a material, and may include a phthalate-based, trimellit-based, epoxy-based, polyester-based, and the like. The phthalate-based plasticizer includes, for example, Diethylhexyl phthalate (DEHP), Diisononyl phthalate (DINP), and Diisodecy phthalate (DIDP), and the trimellitic plasticizer includes, for example, TOTM (Tris (2-Ethylhexyl) Trimellitate). In addition, the epoxy-based plasticizer includes, for example, epoxidized soybean oil (ESBO). In addition, the plasticizer may be polyvinyl acetate used as an emulsion for a general-purpose adhesive in addition to those described above, but is not limited thereto.

If necessary, the resin composition according to the present application may contain a viscosity modifier, for example, a thixotropic agent, a diluent, a dispersant, a surface treating agent, or A coupling agent and the like may be further included. The thixotropic agent may adjust the viscosity according to the shear force of the resin composition. As the thixotropic agent that can be used, fumed silica and the like can be exemplified. Diluents or dispersants are generally used to lower the viscosity of the resin composition, and as long as they can exhibit the above action, various types known in the art may be used without limitation. The surface treatment agent is for surface treatment of the filler introduced into the cured product of the resin composition, and as long as it can exhibit the above action, various types known in the art may be used without limitation. In the case of the coupling agent, for example, it can be used to improve the dispersibility of the thermally conductive filler such as alumina, and if it can exhibit the above action, various types of known in the art can be used without limitation.

If necessary, the resin composition according to the present application may further include a flame retardant or a flame retardant auxiliary agent. The resin composition further including a flame retardant or a flame retardant auxiliary may be cured to form a flame retardant resin. In the present application, the term flame-retardant resin may mean a resin showing a V-0 grade in the UL 94V Test (Vertical Burning Test). As the flame retardant, various known flame retardants may be applied without particular limitation, for example, a flame retardant in the form of a solid filler or a liquid flame retardant may be applied. The flame retardant may include, for example, an organic flame retardant such as melamine cyanurate or an inorganic flame retardant such as magnesium hydroxide, but is not limited thereto. When the amount of the thermally conductive filler included in the resin composition is large, a liquid type flame retardant material (TEP, Triethyl phosphate or TCPP, tris(1,3-chloro-2-propyl)phosphate, etc.) may be used. In addition, a silane coupling agent capable of acting as a flame retardant synergist may be added.

The composition may include the composition as described above, and may be a solvent-based composition, an aqueous composition, or a solvent-free composition.

The resin composition may be cured to form a cured product, and may have at least one of the following physical properties. Each of the following physical properties is independent, and any one physical property does not take precedence over the other properties, and the cured product of the resin composition may satisfy at least one or two or more of the following physical properties. The cured product of the resin composition satisfying at least one or two or more of the following physical properties is caused by a combination of each component of the resin composition.

The cured product of the resin composition must have a thermal resistance of about 5 K/W or less, about 4.5 K/W or less, about 4 K/W or less, about 3.5 K/W or less, about 3 K/W or less, or about 2.8 K/W or less. can When the heat resistance in this range is adjusted to appear, excellent cooling efficiency or heat dissipation efficiency can be secured. The heat resistance may be a numerical value measured according to ASTM D5470 standard or ISO 22007-2 standard, and the measuring method is not particularly limited.

The cured product of the resin composition has an adhesion to aluminum of less than about 0.1 N/mm ² , less than about 0.09 N/mm ² , less than about 0.08 N/mm ² , less than about 0.07 N/mm ² , or less than about 0.06 N/mm ² can In another example, the cured product of the resin composition has an adhesive strength of about 0.01 N/mm ² or more, about 0.02 N/mm ² or more, about 0.03 N/mm ² or more, about 0.04 N/mm ² or more, or about 0.05 N/mm It can be ² or more.

The adhesive strength is obtained by applying the resin composition to an aluminum substrate with a width of 2 cm, a length of 2 cm, and a thickness of 2 mm, and maintaining it for 24 hours to cure, and then using a texture analyzer (TA) to measure the cured product by 0.5 mm It may be a value measured at a peel rate of /s and a peel angle of 90 degrees.

In addition, the adhesive force may be an adhesive force to any substrate or module case in contact with the cured product of the resin composition. If the adhesive force as described above can be secured, an appropriate adhesive force may appear with respect to various materials, for example, a case or a battery cell included in a battery module. In addition, when the adhesive force within this range is secured, volume change during charging and discharging of battery cells in the battery module, change in the use temperature of the battery module, peeling due to curing shrinkage, etc. are prevented, and excellent durability can be secured. In addition, re-workability capable of enabling the module to be detached and reattached during the assembly process of the battery pack may be secured.

The cured product of the resin composition may have a width of 1 cm, a length of 10 cm, and a height of 2 mm to form a curved surface having a radius of curvature of less than about 10 mm. The radius of curvature may be less than 9 mm, less than 8 mm, less than 7 mm, less than 6 mm, less than 5 mm, or less than 4 mm in another example.

The cured product of the resin composition can secure durability to be applied to products requiring a long warranty period (in the case of automobiles, about 15 years or more), such as automobiles. The durability is maintained at a low temperature of about -40 ℃ for 30 minutes, then the temperature is raised to 80 ℃ and maintained for 30 minutes as one cycle. After a thermal shock test, the cycle is repeated 100 times. It may mean that there is no peeling or cracking.

The cured product of the resin composition may have electrical insulation properties of about 3 kV/mm or more, about 5 kV/mm or more, about 7 kV/mm or more, 10 kV/mm or more, 15 kV/mm or more, or 20 kV/mm or more. . The higher the dielectric breakdown voltage, the better the cured product of the resin composition exhibits excellent insulation, and about 50 kV/mm or less, 45 kV/mm or less, 40 kV/mm or less, 35 kV/mm or less, 30 kV/ mm or less, but is not particularly limited. In order to achieve the breakdown voltage as described above, an insulating filler may be applied to the resin composition. In general, among thermally conductive fillers, a ceramic filler is known as a component capable of securing insulation. The electrical insulation may be measured with a dielectric breakdown voltage measured according to ASTM D149 standard. In addition, if the cured product of the resin composition can secure the electrical insulation as described above, stability can be secured while maintaining performance with respect to various materials, for example, a case or battery cell included in a battery module.

The cured product of the resin composition may have a specific gravity of 5 or less. The specific gravity may be 4.5 or less, 4 or less, 3.5 or less, or 3 or less in another example. The specific gravity of the cured product of the resin composition is advantageous in reducing the weight of the applied product as the numerical value is lower, so the lower limit is not particularly limited. For example, the specific gravity may be about 1.5 or more or 2 or more. In order for the cured product of the resin composition to exhibit a specific gravity in the above range, for example, a filler that can ensure desired thermal conductivity even at a low specific gravity when adding a thermally conductive filler, that is, a filler with a low specific gravity by itself A method of applying or applying a surface-treated filler may be used.

It is appropriate that the cured product of the resin composition does not contain volatile substances as much as possible. For example, the cured product of the resin composition may have a ratio of nonvolatile components of 90 wt% or more, 95 wt% or more, or 98 wt% or more. In the above, the ratio with the nonvolatile component can be defined in the following manner. That is, the non-volatile content may be defined as the portion remaining after the cured product of the resin composition is maintained at 100° C. for about 1 hour as the non-volatile content, and thus the ratio is the initial weight of the cured product of the resin composition and the initial weight of the resin composition at 100° C. It can be measured based on the ratio after holding for about 1 hour.

The cured product of the resin composition will have excellent resistance to deterioration, if necessary, and may be required to have stability that does not react chemically as much as possible.

It may be advantageous for the cured product of the resin composition to have a low shrinkage during or after curing. Through this, it is possible to prevent peeling or voids that may occur in the process of manufacturing or using various materials, for example, a case or a battery cell included in a battery module. The shrinkage rate may be appropriately adjusted within a range capable of exhibiting the above-described effects, and may be, for example, less than 5%, less than 3%, or less than about 1%. Since the shrinkage ratio is advantageous as the numerical value is lower, the lower limit thereof is not particularly limited.

The cured product of the resin composition may also advantageously have a low coefficient of thermal expansion (CTE). Through this, it is possible to prevent peeling or voids that may occur in the process of manufacturing or using various materials, for example, a case or a battery cell included in a battery module. The coefficient of thermal expansion may be appropriately adjusted within a range capable of exhibiting the above-described effects, for example, less than 300 ppm/K, less than 250 ppm/K, less than 200 ppm/K, less than 150 ppm/K or 100 ppm It can be less than /K. Since the coefficient of thermal expansion is advantageous as the numerical value is lower, the lower limit thereof is not particularly limited.

The cured product of the resin composition may have an appropriate tensile strength, and through this, excellent impact resistance and the like may be secured. The tensile strength may be adjusted, for example, in the range of about 1.0 MPa or more.

Elongation (elongation) of the cured product of the resin composition may be appropriately adjusted, and through this, excellent impact resistance and the like may be secured. The elongation may be adjusted, for example, in the range of about 10% or more or about 15% or more.

It may be advantageous that the cured product of the resin composition also exhibits appropriate hardness. The term appropriate hardness may be a hardness that is not evaluated as brittle in the cured product of the resin composition. When the hardness of the cured product of the resin composition is excessively high, the cured product of the resin composition is excessively brittle, which may adversely affect reliability. In addition, it is possible to secure the impact resistance and vibration resistance through the adjustment of hardness, and to ensure the durability of the product. The hardened|cured material of a resin composition can measure hardness using a hardness meter. In addition, the cured product of the resin composition, for example, after preparing the cured product of the resin composition as a sample having a width of 2 cm, a length of 2 cm, and a thickness of 0.5 to 1 cm, the hardness in shore 00 type is less than 85, 80 It may be less than, less than 75, less than 70, or less than 65, and in another example, the hardness may be about 40 or more, 45 or more, 50 or more, 55 or more, or 60 or more. The hardness of the cured product of the resin composition is usually influenced by the type or ratio of the filler contained in the cured product, and when an excessive amount of the filler is included, the hardness usually increases.

The cured product of the resin composition may also have a 5% weight loss temperature in thermogravimetric analysis (TGA) of 400° C. or more, or a residual amount of 800° C. of 70 wt% or more. Due to these characteristics, stability at high temperature may be further improved with respect to various materials, for example, a case or a battery cell included in a battery module. The remaining amount at 800 °C may be about 75 wt% or more, about 80 wt% or more, about 85 wt% or more, or about 90 wt% or more in another example. The remaining amount at 800°C may be about 99% by weight or less in another example. The thermogravimetric analysis (TGA) may be measured within a range of 25° C. to 800° C. at a temperature increase rate of 20° C./min in a nitrogen (N ₂ ) atmosphere of 60 cm ³ /min. The thermogravimetric analysis (TGA) result can also be achieved by adjusting the composition of the cured product of the resin composition. For example, the remaining amount at 800°C is influenced by the type or ratio of the thermally conductive filler contained in the cured product of the resin composition, and when an excessive amount of the thermally conductive filler is included, the remaining amount increases. However, when the polymer and/or monomer used in the resin composition generally has high heat resistance compared to other polymers and/or monomers, the residual amount is higher, and the polymer and/or monomer component included in the cured product of the resin composition is also the same. affects the hardness.

The resin composition of the present application may be formed by mixing each of the components listed above. In addition, the resin composition may be formed by adding a plasticizer, a flame retardant, a dispersing agent, and the like to the mixture formed by mixing, and then mixing.

The resin composition of the present application is not particularly limited with respect to the mixing order as long as all necessary components can be included.

The resin composition of the present application is an iron, washing machine, dryer, clothes manager, electric shaver, microwave oven, electric oven, electric rice cooker, refrigerator, dishwasher, air conditioner, electric fan, humidifier, air purifier, mobile phone, walkie-talkie, television, radio, computer , it is possible to dissipate heat generated by being used in various electric and electronic products such as laptops, or batteries such as secondary batteries. In particular, the resin composition of the present application may be used as a material for connecting battery modules in a battery car battery manufactured by gathering battery cells to form one battery module, and combining several battery modules to form one battery pack. . When the resin composition of the present application is used as a material for connecting the battery module, it may serve to dissipate heat generated in the battery cell and fix the battery cell from external shock and vibration.

The cured product of the resin composition of the present application may transfer heat generated from the exothermic element to the cooling portion. That is, the cured product of the resin composition may radiate heat generated from the exothermic element.

The cured product of the resin composition may be positioned between the exothermic element and the cooling portion to thermally contact them. Thermal contact means that the cured product of the resin composition is in direct physical contact with the exothermic element and the cooling part to radiate heat generated from the exothermic element to the cooling part, or the cured product of the resin composition is in direct contact with the exothermic element and the cooling part. / or to dissipate the heat generated by the exothermic element to the cooling area even without direct contact with the cooling portion (that is, there is a separate layer between the cured product of the resin composition and the exothermic element and/or the cooling portion) it means.

The present application may provide a resin composition exhibiting appropriate viscosity, thixotropy, and/or thermal conductivity before and after curing.

The present application relates to a resin composition that exhibits adequate adhesion to effectively maintain a plurality of battery modules before and after curing and re-workability to enable separation and reattachment of modules during the assembly process of a battery pack at the same time can provide

The present application may also provide a resin composition that exhibits room temperature curability and rapid curability even with an excessive amount of filler.

Hereinafter, the present application will be described with reference to Examples and Comparative Examples, but the scope of the present application is not limited by the contents presented below.

<Method of measuring physical properties>

(1) Method for measuring number average molecular weight of high molecular weight compounds

The number average molecular weight (M _n ) of the polymer compound was measured using gel permeation chromatography (GPC). Put the polymer compound to be analyzed in a 5 mL vial, and dilute it in THF (tetrahydro furan) to a concentration of about 1 mg/mL. After that, the standard sample for calibration and the sample to be analyzed were filtered through a syringe filter (pore size: 0.45 μm) and then measured. The analysis program used ChemStation of Agilent Technologies, and the number average molecular weight (M _n ) was obtained by comparing the elution time of the sample with the calibration curve.

In addition, the symbol M _n referred to in the present specification means a number average molecular weight unless otherwise specified.

<GPC measurement conditions>

Instrument: 1200 series from Agilent technologies

Column: 2 PLgel mixed B from Polymer laboratories

Solvent: THF

Column temperature: 35 ℃

Sample concentration: 1 mg/mL, 200 μL injection

Standard Sample: Polystyrene (Mp: 3900000, 723000, 316500, 52200, 31400, 7200, 3940, 485)

(2) Thermal conductivity evaluation method

Thermal conductivity was measured by a hot disk method. Specifically, the thermal conductivity was measured according to the ISO 22007-2 standard along the thickness direction of the sample in a state in which the resin composition was cured into a circular sample having a diameter of 4 cm and a thickness of about 500 μm.

(3) Adhesion evaluation method

The resin composition is coated with a width of 2 cm, a length of 2 cm, and a thickness of 2 mm on an aluminum substrate (P substrate) having a width of 6 cm and a length of about 2 cm, and a width of 6 cm and a length of about 2 cm on the coated resin composition is An aluminum substrate (Q substrate) to be used was placed to cross the P substrate to form a cross, and then maintained at room temperature for about 24 hours to cure the resin composition. Thereafter, the P substrate or the Q substrate was peeled off at a peeling rate of 0.5 mm/s and a peeling angle of 90 degrees using a texture analyzer (TA) to measure the adhesion of the cured product to the aluminum substrate.

(4) flame retardancy evaluation method

The resin composition was applied to a width of 13 mm, a length of 120 mm, and a thickness of 2 mm, and was cured by maintaining at room temperature for 24 hours. Then, the flame retardancy was evaluated according to the UL94 V Test (Vertical Burning Test).

(5) Hardness evaluation method

Hardness was evaluated using an ASKER, durometer hardness device in accordance with ASTM D 2240, JIS K 6253 standards. The resin composition is coated in the form of a square column having a width of 2 cm, a length of 2 cm, and a thickness of 1 cm, and a load of 1 kg or more (about 1.5 kg) is applied to the surface of the cured product cured by maintaining it at room temperature for 24 hours to measure the initial hardness, After 15 seconds, the hardness was evaluated by confirming the stabilized measured value.

(6) Elasticity and tensile strength evaluation method

The elastic force and tensile strength were evaluated by measuring the radius of curvature. The resin composition was coated to obtain a cured product having a width of 1 cm, a length of 10 cm, and a thickness of 2 mm, and was cured by maintaining at room temperature for 24 hours. When the cured product was attached to a cylinder having various radii and bent, the radius of curvature of the cylinder in which cracks did not occur in the cured product was evaluated. As the radius of curvature is smaller, the cured product can be evaluated as having an appropriate elastic force and tensile strength.

Example 1

Trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray), bifunctional polyether polyol (PPG-1000D, Mn = 1,000 g/mol, Kumho Petrochemical), 2-propylheptanol (2-PH) and filler (F) were mixed in a weight ratio of 100:85:35:1,931 (F-2010:PPG-1000D:2-PH:F) to prepare a main part (A1). At this time, the filler (F) is a prismatic alumina (F1) having an average particle diameter of about 2 μm, a spherical alumina (F2) having an average particle diameter of about 20 μm, and a spherical alumina (F3) having an average particle diameter of about 70 μm 20: It is mixed in a weight ratio of 20:60 (F1:F2:F3).

The average particle diameter of the filler referred to in this specification is the D50 particle diameter, also called a so-called median particle diameter, and is the particle diameter (median diameter) at 50% cumulative of the volume-based cumulative curve of the particle size distribution. Such a particle size can be defined as the particle diameter at a point where the cumulative value becomes 50% on a cumulative curve in which the particle size distribution is calculated on a volume basis and the total volume is 100%. The D50 particle size can be measured using Marven's MASTERSIZER 3000 equipment based on ISO-13320, and Ethanol was used as a solvent.

The curing agent part (A2) consists of an isocyanate burette compound (HDB-LV, trifunctional, Vencorex) based on hexamethylene diisocyanate (HDI), a bifunctional isocyanate compound based on hexamethylene diisocyanate (AE700-100, Asahi Kasei), and a filler (F). ) was prepared by mixing in a weight ratio of 100:60:2,974 (HDB-LV:AE700-100:F).

During curing, the main part (density: about 2.5 g/cm ³ ) and the curing agent part (density: about 3.1 g/cm ³ ) were mixed in a volume ratio of about 1:1 (A1:A2) and then cured.

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Example 2

HDI (hexamethylene diisocyanate)-based trimer compound (TLA-100, trifunctional, Asahi Kasei) instead of HDI (hexamethylene diisocyanate)-based isocyanate burette compound (HDB-LV, trifunctional, Vencorex) in the manufacture of curing agent parts ), except that the main and curing agent parts were prepared in the same manner as in Example 1, respectively.

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 1

Trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray Corporation) and 2-propylheptanol (2-PH) are not used in the production of the main part, and bifunctional polyester polyol (P -1010, Mn = 1,000 g/mol, Kumho Petrochemical Co., Ltd.), 2-ethylhexanol (2-EH) and filler (F) by weight of 100:30:1,269 (P-1010:2-EH:F) Except that the mixture was used in a ratio, the main and curing agent parts were prepared in the same manner as in Example 1, respectively.

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 2

Trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray Corporation) and 2-propylheptanol (2-PH) are not used in the production of the main part, and bifunctional polyester polyol (P -1010, Mn = 1,000 g/mol, Kumho Petrochemical Co., Ltd.), 2-ethylhexanol (2-EH) and filler (F) by weight of 100:50:1,484 (P-1010:2-EH:F) Except that the mixture was used in a ratio, the main and curing agent parts were prepared in the same manner as in Example 1, respectively.

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 3

Bifunctional polyether polyol (PPG-1000D, Mn = 1,000 g/mol, Kumho Petrochemical) and 2-propylheptanol (2-PH) were not used in the production of the main part, and trifunctional polyester polyol ( F-2010, M _n = 2,000 g/mol, Kuraray Corporation), 2-ethylhexanol (2-EH) and filler (F) were mixed with 100:50:1,518 (F-2010:2-EH:F) by weight Except that the mixture was used in a ratio, the main and curing agent parts were prepared in the same manner as in Example 1, respectively.

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 4

No 2-propylheptanol (2-PH) was used in the production of the main part, trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray Corporation), bifunctional polyether polyol (PPG) -1000D, Mn = 1,000 g / mol, Kumho Petrochemical Co.) and the filler (F) were mixed in a weight ratio of 100:500:4,400 (F-2010:PPG-1000D:F) in the above example In the same manner as in 1, the main and curing agent parts were prepared, respectively.

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 5

In the manufacture of the main part, 2-ethylhexanol (2-EH) is used instead of 2-propylheptanol (2-PH), and in the manufacture of the curing agent part, a hexamethylene diisocyanate (HDI) based isocyanate burette compound (HDB- A weight ratio of 100:1,420 (AE700-100:F) of an HDI (hexamethylene diisocyanate)-based bifunctional isocyanate compound (AE700-100, Asahi Kasei) and a filler (F) without using LV, trifunctional, Vencorex) Except that the mixture was used, the main and curing agent parts were prepared in the same manner as in Example 1, respectively.

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 6

In the manufacturing of the curing agent part, without using a bifunctional isocyanate compound (AE700-100, Asahi Kasei), an isocyanate burette compound (HDB-LV, trifunctional, Vencorex) based on HDI (hexamethylene diisocyanate) and a filler (F) were used. A main agent and a curing agent part were respectively prepared in the same manner as in Example 1, except that the mixture was used in a weight ratio of 100:2,569 (HDB-LV:F).

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 7

No 2-propylheptanol (2-PH) was used in the production of the main part, trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray Corporation), bifunctional polyether polyol (PPG) -1000D, Mn = 1,000 g/mol, Kumho Petrochemical Co., Ltd.) and filler (F) were mixed in a weight ratio of 100:100:1,411 (F-2010: PPG-2000D:F) and used,

HDI (hexamethylene diisocyanate)-based isocyanate burette compound (HDB-LV, trifunctional, Vencorex) is not used in the manufacture of hardener parts, but HDI (hexamethylene diisocyanate)-based bifunctional isocyanate compound (AE700-100, Asahi Kasei) Except that the filler (F) was mixed in a weight ratio of 100:2,036 (AE700-100:F) and used, a main agent and a curing agent part were prepared in the same manner as in Example 1, respectively.

The main and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 8

Trifunctional polyether polyol (PPG) without using trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray Corporation) and 2-propylheptanol (2-PH) in the production of the main part -1000, Mn = 1,000 g/mol, Kumho Petrochemical Co.), bifunctional polyether polyol (PPG-1000D, Mn = 1,000 g/mol, Kumho Petrochemical Co.) and filler (F) were 100:100:2,274 ( PPG-1000: PPG-1000D: F) is mixed and used in a weight ratio,

HDI (hexamethylene diisocyanate)-based isocyanate burette compound (HDB-LV, trifunctional, Vencorex) is not used in the manufacture of hardener parts, but HDI (hexamethylene diisocyanate)-based bifunctional isocyanate compound (AE700-100, Asahi Kasei) A main material and a curing agent part were prepared in the same manner as in Example 1, except that the filler (F) was mixed in a weight ratio of 100:1,485 (AE700-100:F).

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 9

Trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray Corporation) and 2-propylheptanol (2-PH) are not used in the production of the main part, and bifunctional polyether polyol (PPG) -1000D, Mn = 1,000 g/mol, Kumho Petrochemical Co., Ltd.) and filler (F) were mixed in a weight ratio of 100:802 (P-1010:F), except that the main and Each curing agent part was prepared.

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 10

Trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray Corporation) and 2-propylheptanol (2-PH) are not used in the production of the main part, and bifunctional polyether polyol (PPG) -1000D, Mn = 1,000 g/mol, Kumho Petrochemical Co., Ltd.), 2-ethylhexanol (2-EH) and filler (F) by weight of 100:40:1,119 (P-1010:2-EH:F) Mix and use in proportions

HDI (hexamethylene diisocyanate)-based bifunctional isocyanate compound (AE700-100, Asahi Kasei Co.) is not used in the manufacture of hardener parts, and HDI (hexamethylene diisocyanate) based isocyanate burette compound (HDB-LV, trifunctional, Vencorex Co.) A main material and a curing agent part were respectively prepared in the same manner as in Example 1, except that the filler (F) was mixed in a weight ratio of 100:1,676 (HDB-LV:F).

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

Comparative Example 11

Trifunctional polyester polyol (F-2010, M _n = 2,000 g/mol, Kuraray Corporation) and 2-propylheptanol (2-PH) are not used in the production of the main part, and bifunctional polyether polyol (PPG) -1000D, Mn = 1,000 g/mol, Kumho Petrochemical Co., Ltd.) and filler (F) are mixed in a weight ratio of 100:745 (PPG-1000D:F) and used,

HDI (hexamethylene diisocyanate)-based bifunctional isocyanate compound (AE700-100, Asahi Kasei Co.) is not used in the manufacture of hardener parts, and HDI (hexamethylene diisocyanate) based isocyanate burette compound (HDB-LV, trifunctional, Vencorex Co.) A main agent and a curing agent part were respectively prepared in the same manner as in Example 1, except that the filler (F) was mixed in a weight ratio of 100:2,497 (HDB-LV:F).

The main agent and curing agent parts were poured into a mold in a volume ratio of about 1:1 and maintained at room temperature for 24 hours to form a disk-shaped cured product having a diameter of 4 cm and a thickness of 500 μm.

The physical property measurement results of the Examples and Comparative Examples are shown in the table below.

division thermal conductivity
(W/mK) flame retardant adhesion
(N/mm ² ) Hardness
(Shore 00) radius of curvature
(mm) Example 1 > 2.5 V-0 0.05 60 3 Example 2 0.08 70 2.5 Comparative Example 1 0.05 91 3 Comparative Example 2 0.13 56 2.5 Comparative Example 3 0.18 55 3 Comparative Example 4 0.13 97 >10 Comparative Example 5 0.30 76 4 Comparative Example 6 0.15 89 4 Comparative Example 7 0.13 98 >10 Comparative Example 8 0.41 70 2.5 Comparative Example 9 0.15 97 >10 Comparative Example 10 0.04 86 4 Comparative Example 11 0.18 94 >10

According to Table 1, it can be seen that Examples 1 and 2 showed low adhesion to aluminum, had appropriate hardness, and had a radius of curvature of 10 mm or less to have appropriate elastic and tensile strength.

On the other hand, Comparative Examples 2 to 9 and Comparative Example 11 has an adhesive strength higher than 0.1 N/mm ² to aluminum, it can be seen that it is difficult to secure reworkability.

In addition, Comparative Examples 1, 4, 6, and 9 to 11, since Shore 00 hardness is greater than 85, it can be seen that the brittle (brittle) and low flexibility.

In addition, it can be seen that Comparative Examples 4, 7, 9 and 11 had a radius of curvature higher than 10 mm and did not have adequate elastic force and tensile strength.

In the above, the configuration and characteristics of the present application have been described based on the embodiments according to the present application, but the present application is not limited thereto, and it is understood that various changes or modifications can be made within the spirit and scope of the present application. It is apparent to those skilled in the art that such changes or modifications are intended to fall within the scope of the appended claims.

Claims (24)

subject part having a polyol component; and
A curing agent part having an isocyanate component,
A curable composition that exhibits an adhesive force of less than 0.1 N/mm ² to aluminum and forms a cured product having a Shore 00 hardness of less than 85.
The curable composition according to claim 1, wherein the cured product has a thermal conductivity of 1.2 W/mK or more.
The curable composition according to claim 1, wherein the cured product is capable of forming a curved surface having a radius of curvature of less than 10 mm.
The curable composition according to claim 1, wherein the polyol component includes a high molecular weight diol compound and a high molecular multiol compound, and any one of the diol and multiol compound is a polyester polyol.
The curable composition according to claim 4, wherein the polyester polyol has a number average molecular weight in the range of 300 to 6,000 g/mol.
The curable composition according to claim 1, wherein the polyol component includes a high molecular weight diol compound and a high molecular multiol compound, wherein one of the diol and multiol compound is a polyester polyol and the other is a polyether polyol.
According to claim 6, wherein the polyester polyol has a number average molecular weight within the range of 300 to 6,000 g / mol, the ratio of the number average molecular weight (M _n1 ) of the polyester polyol to the number average molecular weight of the polyether polyol (M _n2 ) (M _n1 /M _n2 ) is in the range of 0.5 to 2.
The curable composition according to claim 4 or 6, wherein the polyester polyol is represented by the following formula (1):
[Formula 1]

In Formula 1,
R ₁ is an alkyl group, an alkenyl group, or an alkynyl group unsubstituted or substituted with a hydroxyl group,
L ₁ and L ₂ are each independently a single bond, an alkyl group, an alkenyl group or an alkynyl group,
l and m may each independently be an integer in the range of 0 to 10, and l+m is 1 or more,
X ₁ and X ₂ are each independently an alkyl group, an alkenyl group, or an alkynyl group,
Y ₁ and Y ₂ are each independently an alkyl group, an alkenyl group, or an alkynyl group,
R ₂ is hydrogen, an alkyl group, an alkenyl group, an alkynyl group, or a functional group represented by the following formula (2);
[Formula 2]

In Formula 2,
L ₃ is a single bond, an alkyl group, an alkenyl group or an alkynyl group,
X ₃ and Y ₃ are each independently an alkyl group, an alkenyl group, or an alkynyl group,
n is an integer in the range of 0 to 10.
7. The curable composition according to claim 6, wherein the polyether polyol is polyalkylene glycol.
The curable composition according to claim 4 or 6, wherein the polyol component contains the polyester polyol in a proportion within the range of 30 to 70 wt%.
The curable composition according to claim 6, wherein the polyol component comprises 50 to 120 parts by weight of a polyether polyol based on 100 parts by weight of the polyester polyol.
The curable composition according to claim 4 or 6, further comprising an alcohol compound or a thiol compound.
The curable composition according to claim 12, wherein the alcohol compound is a compound of the following formula (3) and the thiol compound is a compound of the following formula (4):
[Formula 3]

In Formula 3, R ₁ is a single bond, an alkylene group, an alkenylene group or an alkynylene group, and R ₂ , R ₃ and R ₄ are each independently hydrogen, an alkyl group, an alkenyl group or an alkynyl group,
[Formula 4]

In Formula 4, R ₅ is a single bond, an alkylene group, an alkenylene group or an alkynylene group, and R ₆ , R ₇ and R ₈ are each independently hydrogen, an alkyl group, an alkenyl group or an alkynyl group.
The curable composition according to claim 12, comprising 5 to 60 parts by weight of an alcohol or thiol compound based on 100 parts by weight of the polyester polyol.
The curable composition of claim 1, wherein the main part further comprises 300 to 2,000 parts by weight of a filler based on 100 parts by weight of the polyol component.
The curable composition according to claim 1, wherein the curing agent part contains a bifunctional isocyanate compound and a trifunctional or higher polyfunctional isocyanate compound.
The curable composition according to claim 16, wherein the difunctional isocyanate compound is an aliphatic or cycloaliphatic difunctional isocyanate compound.
The curable composition according to claim 16, wherein the polyfunctional isocyanate compound is at least one selected from a multimer of an isocyanate compound and a biuret compound of an isocyanate compound.
The curable composition according to claim 16, wherein the isocyanate component comprises 20 to 95 parts by weight of the difunctional isocyanate compound based on 100 parts by weight of the polyfunctional isocyanate compound.
The curable composition of claim 1, wherein the curing agent part further comprises 500 to 3,000 parts by weight of a filler based on 100 parts by weight of the isocyanate component.
The curable composition according to claim 1, wherein the ratio (V1/V2) of the volume (V1) of the main part to the volume (V2) of the curing agent part is in the range of 0.5 to 1.5.
The curable composition according to claim 1, wherein the main part and the curing agent part are physically separated.
The curable composition according to claim 1, which is room temperature curable.
exothermic elements; and a cooling site;
An apparatus comprising a cured product of the curable composition of claim 1 in which both the heat generating element and the cooling part are brought into thermal contact.