KR20220039513A - Electronic device comprising display module - Google Patents

Abstract

An electronic device, which can prevent cracks in a display module from being generated due to drop impact, is disclosed. The electronic device comprises: a housing; and a display module, wherein the display module may include: a transparent plate at least partially forming a front surface of the electronic device; a display panel on which the front surface of the electronic device is at least partially recognized through the transparent plate; a panel flexible circuit film disposed below the rear surface of the display panel, and including a bending portion extending toward the front surface of the display panel in a region adjacent to a first side surface of the electronic device in which the bending portion is electrically connected to the display panel on the front surface of the display panel; and a first support member disposed between the rear surface of the display panel and the panel flexible circuit film, and at least a part of a region of the first support member may have an area larger than an area of the panel flexible circuit film within a specified distance from the first side surface. Various other embodiments identified in the present document are also possible.

Description

Electronic device comprising a display module {ELECTRONIC DEVICE COMPRISING DISPLAY MODULE}

Various embodiments disclosed in this document relate to a display module structure including a member supporting a COF, and an electronic device including the same.

A portable electronic device (hereinafter, referred to as an electronic device) such as a smart phone or a tablet PC may include a display module for displaying an image. The display module may be manufactured by stacking a plurality of layers such as a display panel, a transparent plate, and a cover panel during the manufacturing process, and a display diver IC (DDI) and a chip on file (COF) that control the display module. may include

In an electronic device, a gap (or an empty space) may be formed between each component constituting the electronic device during a manufacturing process. However, due to a gap existing inside the display module or around the display module, when the electronic device is dropped, the display module may receive a stronger impact and may cause cracks in the display module.

Recently, as the demand for high-performance display modules increases, a display module using a display diver IC (DDI) supporting an operating frequency of 120 Hz or an electronic device to which the display module is applied has been released. In the case of an electronic device to which a 120Hz DDI is applied, the size of the COF is inevitably expanded as the number of wirings and/or PADs increases compared to a conventional electronic device to which a 60Hz DDI is applied.

However, in the case of an electronic device to which the extended COF is applied, when the electronic device is dropped, the display module may be more vulnerable to cracks due to a gap existing inside the electronic device (particularly, a corner part inside the electronic device).

According to various embodiments of the present disclosure, by arranging at least one support member for compensating for a gap or a step formed inside a display module of an electronic device, damage to a display module due to a drop impact can be improved. would like to provide

According to an embodiment, an electronic device includes: a housing forming at least a part of an exterior of the electronic device; and a display module mounted on the housing, the display module comprising: a transparent plate forming at least a portion of a front surface of the electronic device; a display panel through which at least a portion is visually recognized from the front surface of the electronic device through the transparent plate; A panel flexible circuit film disposed under a rear surface of the display panel, the panel flexible circuit film including a bending portion extending toward the front surface of the display panel in an area adjacent to the first side surface of the electronic device, wherein the bending portion is disposed on the front surface of the display panel electrically connected to the display panel; and a first supporting member disposed between the rear surface of the display panel and the panel flexible circuit film, wherein at least a partial region of the first supporting member is within a predetermined distance from the first side surface of the panel flexible circuit It may have a larger area than the film.

According to an embodiment, a display module of an electronic device includes: a display panel; A panel flexible circuit film disposed under a rear surface of the display panel, the panel flexible circuit film including a bending portion extending toward the front surface of the display panel in an area adjacent to the first side surface of the electronic device, wherein the bending portion is disposed on the front surface of the display panel electrically connected to the display panel; and a first support member disposed between the rear surface of the display panel and the panel flexible circuit film, wherein at least a portion of the first support member is formed when the display module is viewed from the rear surface of the display module, It may be exposed to the outside of the panel flexible circuit film.

The electronic device according to various embodiments of the present disclosure may reduce the empty space formed inside the electronic device by extending the area of the support member disposed between the rear surface of the display panel and the panel flexible circuit film to the corner of the electronic device. And it is possible to improve the crack generation of the display module due to the drop impact.

In an electronic device according to various embodiments of the present disclosure, a support member for compensating for a step (or empty space) generated by the panel flexible circuit film is additionally disposed in the display module to reduce the empty space formed inside the electronic device. And it is possible to improve the crack generation of the display module due to the drop impact.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2A is a perspective view illustrating a front surface of an electronic device according to an exemplary embodiment.
FIG. 2B is a perspective view illustrating a rear surface of the electronic device of FIG. 2A .
3 is an exploded perspective view of an electronic device according to an exemplary embodiment;
4A to 4C are internal cross-sectional views comparing an arrangement structure of an electronic device according to a comparative embodiment and an electronic device according to various embodiments of the present disclosure;
5 is a plan view illustrating a comparison between a display module according to a comparative embodiment and an internal arrangement structure of a display module according to an embodiment of the present disclosure.
6 is a view illustrating a state in which an OCTA module and a first support member are disposed on a rear surface of a display module according to an exemplary embodiment.
7 is a view illustrating a state in which a second support member, a panel flexible circuit film, and an FPCB are disposed on the rear surface of the display module of FIG. 6 , according to an exemplary embodiment.
8A is a cross-sectional view of the display module of FIG. 7 taken along A-A', according to an exemplary embodiment.
8B is a cross-sectional view of the display module of FIG. 7 taken in a direction B-B', according to an exemplary embodiment.
8C is a cross-sectional view taken along the C-C′ direction of the display module of FIG. 7 , according to an exemplary embodiment.
9 is an exemplary diagram illustrating an impact according to a drop of an electronic device according to an embodiment.
FIG. 10 is a table comparing an impact distribution (or stress contour) due to a fall secondary impact of FIG. 9 in a fall simulation of electronic devices according to various embodiments of the present disclosure;
11A is a diagram illustrating an assembly of a first support member and a second support member in an OCTA module according to an exemplary embodiment.
11B is a diagram illustrating an assembly of a panel flexible circuit film and an FPCB in the display module of FIG. 11A , according to an exemplary embodiment.
11C is a diagram illustrating an assembly of a front housing in the display module of FIG. 11B , according to an exemplary embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 may use less power than the main processor 121 or may be set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as a part of another functionally related component (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a specified high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band. there is.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or the server 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may be a device of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, a processor (eg, processor 120 ) of a device (eg, electronic device 101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly between smartphones (eg: smartphones) and online. In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repetitively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

FIG. 2A is a perspective view illustrating a front side of the electronic device 200 according to an exemplary embodiment, and FIG. 2B is a perspective view illustrating a rear side view of the electronic device 200 of FIG. 2A .

Referring to FIGS. 2A and 2B , the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment has a first side (or “front”) 210A, a second side (or a housing 210 including a “back”) 210B, and a side (or “sidewall”) 210C that encloses a space between the first side 210A and the second side 210B. . In another embodiment (not shown), the housing 210 may refer to a structure forming a part of the first surface 210A, the second surface 210B, and the side surface 210C of FIGS. 2A and 2B . there is.

According to an embodiment, the first surface 210A may be formed by the front plate 202 (eg, a glass plate including various coating layers or a polymer plate), at least a portion of which is substantially transparent. According to an embodiment, the front plate 202 may include a curved portion extending seamlessly from the first surface 210A toward the rear plate 211 at at least one side edge portion. .

According to an embodiment, the second surface 210B may be formed of a substantially opaque rear plate 211 . The back plate 211 may be formed by, for example, coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing. can According to an embodiment, the rear plate 211 may include a curved portion that extends seamlessly from the second surface 210B toward the front plate 202 at at least one end.

According to one embodiment, the side 210C is coupled to the front plate 202 and the back plate 211 and may be formed by a side member (or “bracket”) 218 comprising a metal and/or a polymer. can In some embodiments, the back plate 211 and the side member 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).

According to an embodiment, the electronic device 200 includes a display 201 , an audio module 203 , a sensor module (not shown), camera modules 205 , 212 , 213 , 206 , a key input device 217 and At least one of the connector holes 208 may be included. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 ) or additionally include other components. In one example, the electronic device 200 may include a sensor module (not shown). For example, the sensor module may be disposed on the rear surface of the screen display area of the display 201 that is viewed outside the electronic device 200 through the front plate 202 . For example, at least one of an optical sensor, an ultrasonic sensor, or a capacitive sensor may be disposed on the rear surface of the screen display area of the display 201 , but is not limited thereto. In some embodiments, the electronic device 200 may further include a light emitting device, and the light emitting device may be disposed at a position adjacent to the display 201 within an area provided by the front plate 202 . The light emitting device may provide, for example, state information of the electronic device 200 in the form of light. In another embodiment, the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 205 . The light emitting element may comprise, for example, an LED, an IR LED and/or a xenon lamp.

The display 201 may be seen outside of the electronic device 200 through, for example, a substantial portion of the front plate 202 . In an embodiment, the edge of the display 201 may be formed to be substantially the same as an adjacent outer shape (eg, curved surface) of the front plate 202 .

In another embodiment (not shown), the electronic device 200 may form a recess, a notch, or an opening in a portion of the screen display area of the display 201, and the Other electronic components aligned with the set, notch or opening may include, for example, a camera module 205 or a sensor module not shown. In another embodiment (not shown), at least one of a camera module (eg, 212, 213, 214, 215), a fingerprint sensor, and a flash (eg, 206) on the rear surface of the screen display area of the display 201 may include In another embodiment (not shown), the display 201 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.

The audio module 203 may include a microphone hole and a speaker hole. In the microphone hole, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. In some embodiments, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (eg, a piezo speaker). The speaker hole may include an external speaker hole and a receiver hole for a call.

By including a sensor module (not shown), the electronic device 200 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state. The sensor module may include, for example, a proximity sensor disposed on the first side 210A of the housing 210 , a fingerprint sensor disposed on the back side of the display 201 , and/or a second side 210A of the housing 210 ( 210B) may further include a biometric sensor (eg, an HRM sensor). The electronic device 200 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.

The camera modules 205 , 212 , 213 , 214 , 215 , and 206 are disposed on the first side 210A of the electronic device 200 , the first camera device 205 , and the second side 210B of the electronic device 200 . a second camera device 212 , 213 , 214 , 215 , and/or a flash 206 . The aforementioned camera devices 205 , 212 , 213 , 214 , 215 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 206 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .

The key input device 217 may be disposed on the side surface 210C of the housing 210 . In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217 and the not included key input devices 217 may be displayed on the display 201 as soft keys, etc. It can be implemented in the form In some embodiments, the key input device may include at least a portion of a fingerprint sensor disposed on the second surface 210B of the housing 210 .

The connector hole 208 may accommodate a connector for transmitting/receiving power and/or data to/from an external electronic device, and/or a connector for transmitting/receiving an audio signal to/from an external electronic device. For example, the connector hole 208 may include a USB connector or an earphone jack. In one embodiment, the USB connector and the earphone jack may be implemented as a single hole (eg, 208 in FIGS. 2A and 2B ), and according to another embodiment (not shown), the electronic device 200 is a separate connector. Power and/or data may be transmitted/received to/from an external electronic device (eg, the electronic devices 102 and 104 of FIG. 1 ) without a hole, or an audio signal may be transmitted/received.

In the present disclosure, the surface in the +z direction of FIGS. 2A and 2B is referred to as the front surface, the surface in the -z direction of FIGS. 2A and 2B is referred to as the rear surface, and the +y direction of FIGS. 2A and 2B is referred to as the upper end, and The -y direction is called the bottom.

3 is an exploded perspective view of an electronic device 300 according to an embodiment.

Referring to FIG. 3 , an electronic device 300 (eg, the electronic device 200 of FIGS. 2A and 2B ) according to an embodiment includes a display module 400 (eg, the display 201 of FIG. 2A ); Front housing 310 (eg, side member 218 in FIGS. 2A, 2B ), battery 320 , main PCB 330 , and/or back plate 340 (eg, back plate in FIGS. 2A and 2B ) (211)) may be included. The display module 400 according to an embodiment includes an on cell touch AMOLED (OCTA) module 410 , a first support member 420 , a second support member 430 , and a display driving chip (display diver IC, DDI). (or a display driving circuit) 440 , a panel flexible circuit film 450 , and/or a flexible printed circuit board (FPCB) 460 . At least one of the components of the electronic device 300 according to an embodiment is the same as at least one of the components of the electronic device 101 of FIG. 1 and/or the electronic device 200 of FIGS. 2A and 2B . Alternatively, it may be similar, and the overlapping description below will be omitted.

According to an embodiment, the on cell touch AMOLED (OCTA) module 410 may be a touch screen panel (TSP) in which a touch sensor electrode is directly deposited on an active organic light emitting diode (OLED) display. The OCTA module 410 according to an embodiment may receive a user's touch input. According to an embodiment, the OCTA module 410 includes a transparent plate 411 (eg, the front plate 202 of FIGS. 2A and 2B ) that forms at least a part of the front surface of the electronic device 300 , and pixels that emit light. It may include a display panel 412 and/or a cover panel 413 covering the rear surface of the display panel. According to an embodiment, the four corner portions of the edge of the OCTA module 410 may have a round shape or a chamfer shape.

According to an embodiment, the display panel of the OCTA module is configured to display an image, and may include an OLED, and an organic light emitting material may be disposed between at least two glasses and/or films. However, in various embodiments of the present invention, the display panel is not limited to OLED, and various types of display panels may be used.

According to an embodiment, the first support member 420 may be disposed between the rear surface of the OCTA module 410 and the panel flexible circuit film 450 adjacent to the lower end of the electronic device 300 . The first support member 420 according to an embodiment includes the OCT module 410 and the panel that may be formed by a bending part (not shown) of the display driving chip 440 and/or the panel flexible circuit film 450 . An empty space between the flexible circuit films 450 may be filled. According to an embodiment, the first support member 420 may be formed of a strong material to protect the display driving chip 440 .

According to an embodiment, the second support member 430 may be disposed to cover a portion of the rear surface of the first support member 420 . The second support member 430 according to an exemplary embodiment may fill an empty space between the panel flexible circuit film 450 and the front housing 310 that may be formed of the panel flexible circuit film 450 . According to an embodiment, the second support member 430 may be made of a tape to be adhesively attached to the rear surface of the first support member 420 . According to an embodiment, the pair of second support members 430 may be respectively disposed at both ends of the first support member 420 .

According to an embodiment, the panel flexible circuit film 450 may be disposed adjacent to the lower end of the electronic device 300 to cover at least a portion of the rear surface of the OCTA module 410 , and include the first support member 420 and It may be disposed between the front housings 310 . According to an embodiment, the panel flexible circuit film 450 may electrically connect the display panel 412 and the FPCB 460 , and a display driving chip 440 (or display) capable of controlling the display panel 412 . driving circuit).

According to an embodiment, the display driving chip 440 may be electrically connected to the panel flexible circuit film 450 , and may be disposed between the rear surface of the OCTA module 410 and the panel flexible circuit film 450 . According to an embodiment, the display driving chip 440 may receive image information including an image control signal corresponding to a command for controlling image data from the FPCB 460 and/or the main PCB 330, An image may be realized by controlling the display panel 412 according to the received image information. For example, the display driving chip 440 may support an operating frequency of 120 Hz.

According to an embodiment, the display driving chip 440 and the panel flexible circuit film 450 may constitute a chip on film (COF) that controls the display module 400 (or the display panel 412 ).

According to an embodiment, the FPCB 460 is disposed adjacent to the lower end of the electronic device 300 to cover at least a portion of the rear surface of the OCTA module 410 and/or at least a portion of the rear surface of the panel flexible circuit film 450 . can be According to an embodiment, the FPCB 460 may be electrically connected to the main PCB 330 of the electronic device 300 , and a plurality of electronic components (eg, a processor, a memory, an interface) may be disposed.

According to an embodiment, the front housing 310 may form at least a part of the exterior of the electronic device 300 , and may be used for arranging various electronic components (eg, the battery 320 and the main PCB 330 ). It may include a seating part.

According to an embodiment, the battery 320 may be disposed inside the front housing 310 . The battery 320 is a device for supplying power to at least one electronic component of the electronic device 300 , and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 320 may be disposed, for example, on the same plane as the main PCB 330 . According to an embodiment, the battery 320 may be integrally disposed inside the electronic device 300 , or may be disposed detachably from the electronic device 300 .

According to an embodiment, the main PCB 330 may be accommodated and disposed inside the front housing 310 . According to an embodiment, a plurality of electronic components (eg, a processor, a memory, an interface) may be disposed on the main PCB 330 . The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to an embodiment, the rear plate 340 may form a rear surface (eg, the second surface 210B of FIG. 2B ) of the electronic device 300 . The rear plate 340 may protect the internal components of the electronic device 300 from external impact or inflow of foreign substances.

4A to 4C are internal cross-sectional views comparing arrangement structures of an electronic device 300a according to a comparative embodiment and electronic devices 300b and 300c according to various embodiments of the present disclosure.

4A is a view showing a display module 400a and a front housing 310a in an electronic device 300a according to a comparative embodiment, and FIG. 4B is a display module in the electronic device 300b according to an embodiment of the present disclosure. 400b) and the front housing 310b are shown, and FIG. 4C shows the display module 400c and the front housing 310c in the electronic device 300c according to an embodiment of the present disclosure. For example, the display module 400a of FIG. 4A and the display module 400b of FIG. 4B may use a display driving chip that supports an operating frequency of 60 Hz, and the display module 400c of FIG. 4C has an operating frequency of 120 Hz A display driving chip that supports

Referring to FIG. 4A , in the electronic device 300a according to the comparative embodiment, the first support member 420a disposed between the panel flexible circuit film 450a and the cover panel 413 of the OCTA module 410 is a panel The flexible circuit film 450a may be disposed not to be exposed to the outside. That is, the first support member 420a may be disposed so as not to extend to the end of the cover panel 413 . Accordingly, an empty space A is inevitably formed between the panel flexible circuit film 450a and the cover panel 413 .

Also, in the electronic device 300a according to the comparative embodiment, the front housing 310a may include three steps 311a, 312a, and 313a for accommodating the display module 400a. For example, the front housing 310a of FIG. 4A has a first step 311a on which the transparent plate 411 is seated, a second step 312a on which the display panel 412 and the cover panel 413 are seated, and It may include a third step 313a on which the first support member 420a and the panel flexible circuit film 450a are mounted. For example, the front housing 310a of FIG. 4A includes a first step 311a forming a space for accommodating the transparent plate 411 , a space for accommodating the display panel 412 and the cover panel 413 . It may include a second step 312a forming a third step 313a forming a space for accommodating the first support member 420a and the panel flexible circuit film 450a.

Referring to FIG. 4B , in the electronic device 300b according to an embodiment of the present disclosure, the first supporting member 420b is disposed between the panel flexible circuit film 450b and the cover panel 413 of the OCTA module 410 . may be arranged to extend to the end of the panel flexible circuit film 450b. For example, the first support member 420b may be disposed to extend to the end of the panel flexible circuit film 450b but not be exposed to the outside of the panel flexible circuit film 450b. Accordingly, an empty space may not be formed between the panel flexible circuit film 450b and the cover panel 413 .

According to an embodiment, the front housing 310b in the electronic device 300b of FIG. 4B includes three pieces for accommodating the front housing 310a (ie, the display module 400a) in the electronic device 300a of FIG. 4A . It may be the same as the front housing 310a) including the steps 311a, 312a, and 313a.

However, referring to FIG. 4C , in the electronic device 300c according to an embodiment of the present disclosure, the first support member ( The 420c may be disposed to be exposed to the outside of the panel flexible circuit film 450c. That is, the first support member 420c may be disposed to extend (or expand) to the end of the cover panel 413 . Accordingly, as compared with FIG. 4A , an empty space between the panel flexible circuit film 450c and the cover panel 413 may be eliminated.

The display module 400c of the electronic device 300c according to an embodiment of the present disclosure may further include a second support member 430 disposed between the first support member 420c and the front housing 310c. there is. According to an embodiment, the second support member 430 may cover at least a partial area of the rear surface of the first support member 420c exposed to the outside of the panel flexible circuit film 450c. According to an embodiment, the second support member 430 may fill an empty space that may be formed between the first support member 420c and the front housing 310c, and accordingly, an empty space inside the electronic device 300c. space can be minimized.

Also, referring to FIG. 4C , in the electronic device 300c according to an embodiment of the present disclosure, the front housing 310c may include two steps 311c and 312c for accommodating the display module 400c. . For example, in the front housing 310c of FIG. 4C , the first step 311c on which the transparent plate 411 is mounted, the display panel 412 , the cover panel 413 , the first support member 420c, and the second The support member 430 and the second step 312c on which the panel flexible circuit film 450c is mounted may be included. For example, the front housing 310c of FIG. 4C includes a first step 311c forming a space for accommodating the transparent plate 411 , a display panel 412 , a cover panel 413 , and a first support member ( 420c), the second support member 430, and a second step 312c forming a space for accommodating the panel flexible circuit film 450c. According to an embodiment, in the case of the electronic device 300c according to an embodiment of the present disclosure, compared with the electronic device 300a of FIG. 4A , the step difference in which the display module 400c is accommodated in the front housing 310c is number can be reduced.

The electronic device 300c according to an embodiment of the present disclosure minimizes an empty space around the display module 400c inside the electronic device 300c and has a step difference in which the display module 400c is accommodated in the front housing 310c. By minimizing the number, damage to the display module 400c due to the drop impact of the electronic device 300c may be improved.

5 shows a display module 400 ′ (eg, the display module 400a of FIG. 4A ) according to a comparative embodiment and a display module 400 (eg, the display module 400c of FIG. 4C ) according to an embodiment of the present disclosure. ))) is a plan view comparing the internal arrangement structure.

FIG. 5(a) illustrates a panel flexible circuit film 450' and an FPCB 460 in a display module 400' according to a comparative embodiment, and FIG. 5(b) is an embodiment of the present disclosure. The panel flexible circuit film 450 and the FPCB 460 are shown in the display module 400 according to FIG. For example, the display module 400' of FIG. 5(a) may use a display driving chip (not shown) supporting an operating frequency of 60Hz, and the display module 400 of FIG. 5(b) may A display driving chip 440 supporting an operating frequency of 120 Hz may be used.

According to an embodiment, in FIGS. 5A and 5B , the panel flexible circuit films 450 ′ and 450 may electrically connect the FPCB 460 and the OCTA module 410 .

Comparing FIGS. 5A and 5B , a panel flexible circuit film 450 using a 120Hz display driving chip 440 according to an embodiment of the present disclosure is a 60Hz display driving according to a comparative embodiment. A larger area of the rear surface of the OCTA module 410 may be covered than the panel flexible circuit film 450 ′ using a chip.

The panel flexible circuit film 450 ′ of the display module 400 ′ in FIG. 5A does not extend to both corners of the lower end of the OCTA module 410 and covers only the central region of the lower end of the OCTA module 410 . can be placed. On the other hand, in FIG. 5B , the panel flexible circuit film 450 of the display module 400 of the present disclosure extends from the central area of the lower end of the OCTA module 410 to the area adjacent to both corners of the OCTA module 410 . may be disposed to cover the According to an embodiment, in the case of the display module 400 using the display driving chip 440 of 120 Hz, the panel flexible circuit film 450 having a larger area than the display module 400 ′ using the display driving chip of 60 Hz is used. Available.

Hereinafter, an internal arrangement structure of the display module 400 of the electronic device 300 according to an embodiment of the present disclosure will be described in detail with reference to FIGS. 6 to 8 .

6 is a diagram illustrating a state in which the OCTA module 410 and the first support member 420 are disposed on the rear surface of the display module 400 according to an exemplary embodiment.

Referring to FIG. 6 , the first support member 420 is adjacent to the lower end (eg, the -y direction in FIG. 6 ) of the rear surface of the OCTA module 410 (or the cover panel 413 of the OCTA module 410 ). can be placed. According to an embodiment, an opening 421 for disposing the display driving chip 440 may be included in the first support member 420 . The first support member 420 according to an embodiment may be disposed to surround the display driving chip 440 in all directions to protect the display driving chip 440 from external impact.

According to an embodiment, the length L1 of the first support member 420 in the first direction (eg, the x-axis direction of FIG. 6 ) may be the same as the length L2 of the cover panel 413 in the first direction. can According to an embodiment, the first support member 420 may cover all of the lower end area of the rear surface of the cover panel 413 in the first direction. That is, the first support member 420 may be disposed to extend from the center of the lower end of the cover panel 413 to both ends in the first direction.

According to an embodiment, the length L3 of the first support member 420 in the second direction (eg, the y-axis direction of FIG. 6 ) is longer than the height L4 of the rounding shape of the corner of the cover panel 413 . can According to an embodiment, the first support member 420 extends from the lower end (or the area adjacent to the lower end) of the rear surface of the cover panel 413 in the second direction to the area exceeding the rounding shape (or chamfer shape) of at least the corner part of the cover panel ( 413) can be covered. According to an embodiment, the first support member 420 extends from the lower end (or an area adjacent to the lower end) of the rear surface of the cover panel 413 in the second direction to at least an area beyond the area in which the display driving chip 440 is disposed. (413) can be covered.

7 is a view illustrating a state in which the second support member 430, the panel flexible circuit film 450, and the FPCB 460 are disposed on the rear surface of the display module 400 of FIG. 6 according to an embodiment. .

Referring to FIG. 7 , adjacent to the lower end (eg, -y direction in FIG. 7 ) of the rear surface of the OCTA module 410 (or the cover panel 413 of the OCTA module 410), the panel flexible circuit film 450 is can be placed. According to an embodiment, the panel flexible circuit film 450 may be disposed to cover at least a partial area of the rear surface of the OCTA module 410 and at least a partial area of the rear surface of the first support member 420 . According to an embodiment, the panel flexible circuit film 450 may include a display driving chip 440 for controlling the OCTA module 410 , and the display driving chip 440 is formed on the rear surface of the OCTA module 410 and It may be disposed between the flexible circuit films, that is, in the opening 421 of the first support member 420 disposed on the rear surface of the OCTA module 410 .

According to an embodiment, at least a partial region of the first support member 420 may be exposed to the outside of the panel flexible circuit film 450 when the display module 400 is viewed from the rear surface of the display module 400 . According to an embodiment, at least a partial area of the first support member 420 may have a larger area than the panel flexible circuit film 450 within a specified distance from the lower end of the display module 400 . For example, the length L1 of the first support member 420 in the first direction (eg, the x-axis direction of FIG. 7 ) is longer than the length L5 of the panel flexible circuit film 450 in the first direction. can be long

According to an embodiment, the pair of second support members 431 and 432 may be disposed to cover both ends of the rear surface of the first support member 420 , respectively. According to an embodiment, the second support members 431 and 432 may include at least a portion of the first support member 420 exposed to the outside of the panel flexible circuit film 450 (ie, the panel flexible circuit film 450 ). ) can be covered.

According to an embodiment, the FPCB 460 may be disposed adjacent to the lower end of the rear surface of the OCTA module 410 (or the cover panel 413 of the OCTA module 410 ). According to an embodiment, the FPCB 460 may be disposed to cover at least a partial area of the rear surface of the OCTA module 410 and at least a partial area of the rear surface of the panel flexible circuit film 450 . According to an embodiment, the FPCB 460 may be electrically connected to the OCTA module 410 (or the display panel 412 of the OCTA module 410) through the panel flexible circuit film 450, and the flexible circuit film ( Alternatively, the OCTA module 410 may be controlled through the display driving chip 440 included in the flexible circuit film.

8A is a cross-sectional view of the display module 400 of FIG. 7 cut in the AA' direction, according to an embodiment, and FIG. 8B is the display module 400 of FIG. 7 cut in the BB' direction, according to an embodiment. It is a cross-sectional view, and FIG. 8C is a cross-sectional view taken along the CC′ direction of the display module 400 of FIG. 7 , according to an embodiment.

8A to 8C , the OCTA module 410 may include a transparent plate 411 , a display panel 412 , and a cover panel 413 , and a rear surface of the transparent plate 411 (eg, FIG. 8A ). A display panel 412 and a cover panel 413 may be sequentially stacked on the -z-direction side.

According to an embodiment, through the transparent plate 411 formed of a transparent material, on the front surface (eg, the +z direction of FIG. 8A ) of the display module 400 (or the electronic device 300) of the display panel 412 At least a portion may be recognized. According to an embodiment, the transparent plate 411 may transmit at least one light displayed on the display panel 412 and protect the display panel 412 from external physical impact. The transparent plate 411 is a polymer material of polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (PE), polyethylene terephthalate (PET), and polypropylene terephthalate. It may be formed of at least one of a polymer material such as polypropylene terephthalate (PPT) or glass. According to an embodiment, the transparent plate 411 may include a multi-layered structure made of various materials.

According to an embodiment, the display panel 412 covering the rear surface of the transparent plate 411 may be composed of a plurality of layers. According to an embodiment, the display panel 412 may include a base substrate, a thin film transistor (TFT) layer formed on the base substrate, and/or a pixel layer (or organic light emitting layer) receiving a signal voltage from the thin film transistor layer. there is. The thin film transistor layer may include an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a source electrode, and/or a drain electrode, and may transmit a signal necessary for driving the pixel layer. The pixel layer may include a plurality of display elements, for example, light emitting diodes. The pixel layer may be defined as a region in which a plurality of organic display devices formed on the thin film transistor layer are disposed. According to an embodiment, the display panel 412 may include any of a polarizing member layer for transmitting light corresponding to a specified direction, a thin film encapsulation layer for sealing the pixel layer, a back film for supporting the base substrate, and the like. may further include appropriate layers of

According to an embodiment, the cover panel 413 covering the rear surface of the display panel 412 may be composed of a plurality of layers. The cover panel 413 is disposed under the display panel 412 to protect the display panel 412 and may include various components for facilitating attachment to other components of the display module 400 . According to an embodiment, the cover panel 413 may include a black layer (eg, an emboss layer), a support layer (eg, a sponge layer), a tape layer, a digitizer and/or a heat dissipation member layer (eg, copper (Cu)). layer, a graphite layer). The black layer and/or the support layer may absorb shock to the display panel 412 . Also, the black layer may block light generated by the display panel 412 or light incident from the outside. The digitizer may sense a touch or hovering input to the display module 400 using a stylus. The heat dissipation member layer may dissipate heat generated from the display panel 412 and may include graphite and/or a copper film.

According to an embodiment, an adhesive member (or an adhesive, adhesive) (not shown) may be used. The adhesive member may include, for example, a double-sided adhesive film, a pressure sensitive adhesive (PSA), an optical clear adhesive (OCA), or an optical clear resin (OCR). can

Referring to FIG. 8A , a first support member 420 , a panel flexible circuit film 450 , and a second support member 430 may be disposed on the rear surface of the cover panel 413 . According to an embodiment, the first support member 420 may be disposed between the panel flexible circuit film 450 and the cover panel 413 or between the second support member 430 and the cover panel 413 . According to an embodiment, the first support member 420 may fill an empty space that may be formed due to the bending portion 451 of the panel flexible circuit film 450 or the display driving chip 440 (refer to FIG. 8C ). there is. The function and shape (eg, thickness) of the first support member 420 will be described in detail with reference to FIG. 8C .

According to an embodiment, the panel flexible circuit film 450 is adjacent to the lower end (eg, the -y direction of FIG. 8A ) of the display module 400 (or the electronic device 300 ) and the rear surface of the cover panel 413 . may be disposed to cover the According to an embodiment, the panel flexible circuit film 450 may electrically connect the display panel 412 (or at least one layer included in the display panel 412 ) and the FPCB 460 of the electronic device 300 . there is.

According to an embodiment, the panel flexible circuit film 450 may include a bending portion 451 extending toward the front surface of the display panel 412 in an area adjacent to the lower end of the display module 400, and the bending The unit 451 may be electrically connected to the display panel 412 at the front of the display panel 412 . According to an embodiment, the bending part 451 may extend toward the front surface of at least one layer included in the display panel 412 in an area adjacent to the lower end of the display module 400 , and may be disposed on the display panel 412 . The at least one included layer may be electrically connected to the front surface of the layer.

According to an embodiment, the second support member 430 may cover at least a partial area of the rear surface of the first support member 420 . According to an embodiment, the second support member 430 is a flexible circuit among at least a partial region of the first support member 420 exposed to the outside of the panel flexible circuit film 450 or a rear surface of the first support member 420 . At least a portion of the area not covered with the film may be covered. According to an embodiment, the thickness w1 of the second support member 430 may be the same as the thickness w2 of the flexible circuit film. Accordingly, the second support member 430 may fill an empty space between the first support member 420 and the front housing 310 that may be formed by the flexible circuit film.

Referring to FIG. 8B , the first support member 420 extends to both ends of the rear surface of the cover panel 413 in the first direction (eg, the x-axis direction of FIG. 8B ). of the -z direction) can be covered. That is, the first support member 420 may be disposed to extend from the center of the lower end of the cover panel 413 to both ends in the first direction. According to an embodiment, the length of the first support member 420 in the first direction may be the same as the length of the cover panel 413 in the first direction, and the amount of the first support member 420 in the first direction The ends may be arranged to fit both ends of the cover panel 413 in the first direction.

Referring to FIG. 8C , the first support member 420 includes a panel flexible circuit film 450 that may be formed by the bending portion 451 of the panel flexible circuit film 450 and/or the display driving chip 440 , and An empty space between the cover panel 413 or between the second support member 430 and the cover panel 413 may be filled. According to an embodiment, the thickness w3 of the first support member 420 may be the same as or longer than the thickness w4 of the display driving chip 440 , and the bending portion 451 of the panel flexible circuit film 450 . ) may be shorter than the length of the diameter (D). Accordingly, the first support member 420 may compensate for an empty space that may be formed due to the bending portion 451 of the panel flexible circuit film 450 and/or the display driving chip 440 .

9 is an exemplary diagram illustrating an impact according to a fall of the electronic device 300 according to an exemplary embodiment.

When the electronic device 300 is dropped, damage due to impact may mainly occur in the thin film encapsulation layer of the display panel 412 of the OCTA module 410, and if there is an empty space around the thin film encapsulation layer, the impact caused by the fall is more can play a big role. Referring to FIG. 9 , when the electronic device 300 is dropped, the horizontal/vertical propagation of the wave due to the first impact meets at the second impact point, causing a greater impact to the thin film encapsulation layer of the OCTA module 410 . can transmit

According to an embodiment, the display module 400 in which the display driving chip 440 supporting the operating frequency of 120 Hz is embedded uses the panel flexible circuit film 450 extended to the corner of the OCTA module 410 . Accordingly, an empty space around the thin film encapsulation layer of the display panel 412 may come closer to a corner portion of the OCTA module 410 , and damage to the electronic device 300 by dropping may be disadvantageous. Accordingly, in the case of the display module 400 of the electronic device 300 according to an embodiment of the present disclosure, in order to improve damage due to a drop, the area of the first support member 420 is the area of the OCTA module 410 . The second support member 430 may be additionally disposed after extending to a corner portion, and an empty space inside the electronic device 300 may be reduced.

FIG. 10 is a comparison diagram of shock distributions (or stress contours) due to the fall secondary impact of FIG. 9 in a fall simulation of electronic devices 300-1, 300-2, and 300-3 according to various embodiments of the present disclosure; is a table

10A is an electronic device 300- including a display module (eg, the display module 400′ of FIG. 5A ) in which a 60Hz display driving chip and a narrow panel flexible circuit film are embedded. 1) (eg, the electronic device 300a of FIG. 4A ), and FIG. 10B shows a display module in which a large-area panel flexible circuit film 450 is embedded by using a 120Hz display driving chip 440 . An electronic device 300-2 including The arrangement is an electronic device 300 - 3 (eg, the electronic device 300c of FIG. 4C ) according to an embodiment of the present disclosure.

Referring to FIG. 10 , in the case of an electronic device 300-2 including a display module in which a 120Hz display driving chip 440 of FIG. 10B and a large area panel flexible circuit film 450 are embedded, Compared with the electronic device 300 - 1 of FIG. 10A , the impact caused by the drop is increased by 12.5%. However, the area of the first support member 420 in the electronic device 300-3 according to an embodiment of the present disclosure of FIG. 10(c), that is, the electronic device 300-2 of FIG. 10(b) . In the case of the electronic device 300-3, which is widened and the second support member 430 is additionally disposed, the level of impact due to a drop increased by 0.5% compared to the electronic device 300-1 of FIG. 10A Accordingly, compared to the electronic device 300 - 2 of FIG. 10B , the impact caused by the drop may be improved.

11A to 11C are diagrams for explaining a process of assembling the display module 400 of the electronic device 300 according to an exemplary embodiment.

11A is a view illustrating an assembly of the first support member 420 and the second support member 430 in the OCTA module 410 according to an embodiment, and FIG. 11B is the display of FIG. 11A , according to an embodiment. It is a view showing the assembly of the panel flexible circuit film 450 and the FPCB 460 in the module 400, and FIG. 11C is a front housing 310 in the display module 400 of FIG. 11B, according to an embodiment. A drawing showing the assembly.

Referring to FIG. 11A , the first support member 420 may be assembled adjacent to the lower end of the rear surface of the OCTA module 410 , that is, the rear surface of the cover panel 413 of the OCTA module 410 , and the first support member A pair of second support members 430 may be assembled adjacent to both ends of the rear surface of the 420 . According to an embodiment, an area of the pair of second support members 430 may be smaller than an area of the first support member 420 .

Referring to FIG. 11B , the panel flexible circuit film 450 may be assembled over the rear surface of the first support member 420 and the rear surface of the OCTA module 410 , and the rear surface of the panel flexible circuit film 450 and the OCTA module FPCB 460 may be assembled over the back surface of 410 . According to an embodiment, the display driving chip 440 embedded in the panel flexible circuit film 450 may be disposed to be accommodated in the opening 421 of the first support member 420 . According to an embodiment, the panel flexible circuit film 450 may be disposed so as not to overlap the second support member 430 (ie, not cover the second support member 430 ).

Referring to FIG. 11C , the front housing 310 may be assembled to the rear surface of the display module 400 . According to an embodiment, the display module 400 may be disposed to be seated on at least one step formed in the front housing 310 . According to an embodiment, the second support member 430 may fill an empty space that may be formed between the first support member 420 and the front housing 310 due to the panel flexible circuit film 450 .

As described above, the electronic device (eg, the electronic device 100 of FIG. 1 , the electronic device 200 of FIGS. 2A and 2B , and the electronic device 300 of FIG. 3 ) according to an embodiment is the electronic device a housing forming at least a portion of an exterior of the; and a display module mounted on the housing, the display module comprising: a transparent plate forming at least a portion of a front surface of the electronic device; a display panel through which at least a portion is visually recognized from the front surface of the electronic device through the transparent plate; A panel flexible circuit film disposed under a rear surface of the display panel, the panel flexible circuit film including a bending portion extending toward the front surface of the display panel in an area adjacent to the first side surface of the electronic device, wherein the bending portion is disposed on the front surface of the display panel electrically connected to the display panel; and a first supporting member disposed between the rear surface of the display panel and the panel flexible circuit film, wherein at least a partial region of the first supporting member is within a predetermined distance from the first side surface of the panel flexible circuit It may have a larger area than the film.

According to an embodiment, at least a partial region of the first support member may be exposed to the outside of the panel flexible circuit film when the display module is viewed from the rear surface of the display module, and the first portion of the first support member A length in the direction may be longer than a length in the longest first direction in the panel flexible circuit film.

According to an embodiment, the display module may further include at least one second support member disposed under the first support member, wherein the second support member is exposed to the outside of the panel flexible circuit film The at least partial area of the first supporting member may be covered.

According to an embodiment, a thickness of the second support member may be the same as a thickness of the panel flexible circuit film.

According to an embodiment of the present disclosure, the display module may further include a cover panel disposed between the rear surface of the display panel and the first support member, wherein the first support member moves the cover panel in a first direction. The rear surface of the cover panel may be covered from one end to the other end.

According to an embodiment, the display module may further include a cover panel disposed between the rear surface of the display panel and the first support member, wherein the length of the first support member in the first direction is equal to that of the cover. The length of the panel in the first direction may be the same.

According to an embodiment of the present disclosure, the display module may further include a cover panel disposed between the rear surface of the display panel and the first support member, wherein corner portions of the display panel and the cover panel have a round shape. and the first support member may cover at least the round shape of the cover panel.

According to an embodiment, a length of a diameter of the bending portion of the panel flexible circuit film may be longer than a length of a thickness of the first supporting member.

According to an embodiment, the display module may further include a flexible printed circuit board (FPCB), wherein the panel flexible circuit film may electrically connect the display panel and the flexible printed circuit board. there is.

According to an embodiment, the display module may further include a display driving chip (display diver IC, DDI) disposed between the rear surface of the display panel and the panel flexible circuit film, the display driving chip comprising: The panel flexible circuit film may be electrically connected to control driving of the display module, and the first support member may include an opening for accommodating the display driving chip therein.

According to an embodiment, the display module may further include a display driving chip (display diver IC, DDI) disposed between the rear surface of the display panel and the panel flexible circuit film, and The thickness may be equal to or thicker than the thickness of the display driving chip.

According to an embodiment, the display module may further include a display driving chip (display diver IC, DDI) disposed between the rear surface of the display panel and the panel flexible circuit film, the panel flexible circuit film and The display driving chip may constitute a chip on film (COF).

According to an embodiment, the display driving chip may support an operating frequency of 120 Hz.

According to an embodiment, the housing may include a first step and a second step, the transparent plate is seated on the first step, and the display panel, the panel flexible circuit film, and The first support member may be seated.

According to an embodiment, the first side of the electronic device may be a lower end of the electronic device.

As described above, a display module (eg, the electronic device 100 of FIG. 1 , the electronic device 200 of FIGS. 2A and 2B , and the electronic device 300 of FIG. 3 ) according to an embodiment. : The display module 160 of FIG. 1 , the display 201 of FIGS. 2A and 2B , and the display module 400 of FIG. 3 ) include a display panel; A panel flexible circuit film disposed under a rear surface of the display panel, the panel flexible circuit film including a bending portion extending toward the front surface of the display panel in an area adjacent to the first side surface of the electronic device, wherein the bending portion is disposed on the front surface of the display panel electrically connected to the display panel; and a first support member disposed between the rear surface of the display panel and the panel flexible circuit film, wherein at least a portion of the first support member is formed when the display module is viewed from the rear surface of the display module, It may be exposed to the outside of the panel flexible circuit film.

According to an embodiment, the display module may further include at least one second support member disposed under the first support member, wherein the second support member is exposed to the outside of the panel flexible circuit film. The at least partial region of the first supporting member may be covered, and the thickness of the second supporting member may be the same as that of the panel flexible circuit film.

According to an embodiment of the present disclosure, the display module may further include a cover panel disposed between the rear surface of the display panel and the first support member, wherein the first support member is disposed on one side of the cover panel in a first direction. The rear surface of the cover panel may be covered from one end to the other end.

According to an embodiment, a length of a diameter of the bending portion of the panel flexible circuit film may be longer than a length of a thickness of the first supporting member.

According to an embodiment, the display module may further include a display driving chip disposed between the rear surface of the display panel and the panel flexible circuit film, wherein the display driving chip is electrically connected to the panel flexible circuit film to control the driving of the display module, the first supporting member may include an opening for accommodating the display driving chip therein, and the thickness of the first supporting member may be the same as that of the display driving chip. It can be equal to or thicker than the thickness.

In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural according to the specific embodiments presented. However, the singular or plural expression is appropriately selected for the context presented for convenience of description, and the present disclosure is not limited to the singular or plural element, and even if the element is expressed in plural, it is composed of the singular or singular. Even an expressed component may be composed of a plurality of components.

Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, various modifications are possible without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments and should be defined by the claims described below as well as the claims and equivalents.

Claims (20)

In an electronic device,
a housing forming at least a portion of an exterior of the electronic device; and
A display module mounted on the housing,
The display module includes:
a transparent plate forming at least a portion of a front surface of the electronic device;
a display panel through which at least a portion is visually recognized from the front surface of the electronic device through the transparent plate;
A panel flexible circuit film disposed under a rear surface of the display panel, the panel flexible circuit film including a bending portion extending toward the front surface of the display panel in an area adjacent to the first side surface of the electronic device, wherein the bending portion is disposed on the front surface of the display panel electrically connected to the display panel; and
a first support member disposed between the rear surface of the display panel and the panel flexible circuit film;
At least a partial area of the first support member has a larger area than the panel flexible circuit film within a specified distance from the first side surface. The method according to claim 1,
At least a partial region of the first support member is exposed to the outside of the panel flexible circuit film when the display module is viewed from the rear surface of the display module;
A length of the first supporting member in a first direction is longer than a length of the panel flexible circuit film in the longest first direction. 3. The method according to claim 2,
The display module further includes at least one second support member disposed under the first support member,
The second supporting member may cover the at least a partial region of the first supporting member exposed to the outside of the panel flexible circuit film. 4. The method according to claim 3,
and a thickness of the second supporting member is the same as a thickness of the panel flexible circuit film. The method according to claim 1,
The display module further includes a cover panel disposed between the rear surface of the display panel and the first support member,
The first support member covers a rear surface of the cover panel from one end to the other end of the cover panel in a first direction. The method according to claim 1,
The display module further includes a cover panel disposed between the rear surface of the display panel and the first support member,
and a length of the first supporting member in the first direction is the same as a length of the cover panel in the first direction. The method according to claim 1,
The display module further includes a cover panel disposed between the rear surface of the display panel and the first support member,
Corner portions of the display panel and the cover panel have a round shape,
and the first support member covers at least the round shape of the cover panel. The method according to claim 1,
and a length of a diameter of the bending portion of the panel flexible circuit film is longer than a length of a thickness of the first supporting member. The method according to claim 1,
The display module further comprises a flexible printed circuit board (FPCB, flexible printed circuit board),
The panel flexible circuit film electrically connects the display panel and the flexible printed circuit board. The method according to claim 1,
The display module further includes a display driving chip (display diver IC, DDI) disposed between the rear surface of the display panel and the panel flexible circuit film,
The display driving chip is electrically connected to the panel flexible circuit film to control driving of the display module,
The electronic device of claim 1, wherein the first supporting member includes an opening for accommodating the display driving chip therein. The method according to claim 1,
The display module further includes a display driving chip (display diver IC, DDI) disposed between the rear surface of the display panel and the panel flexible circuit film,
and a thickness of the first supporting member is equal to or thicker than a thickness of the display driving chip. The method according to claim 1,
The display module further includes a display driving chip (display diver IC, DDI) disposed between the rear surface of the display panel and the panel flexible circuit film,
and the panel flexible circuit film and the display driving chip constitute a chip on film (COF). 13. The method of claim 12,
The display driving chip supports an operating frequency of 120 Hz, an electronic device. The method according to claim 1,
The housing includes a first step and a second step,
The transparent plate is mounted on the first step, and the display panel, the panel flexible circuit film, and the first support member are mounted on the second step. The method according to claim 1,
and the first side of the electronic device is a lower end of the electronic device. In the display module of an electronic device,
display panel;
A panel flexible circuit film disposed under a rear surface of the display panel, the panel flexible circuit film including a bending portion extending toward the front surface of the display panel in an area adjacent to the first side surface of the electronic device, wherein the bending portion is disposed on the front surface of the display panel electrically connected to the display panel; and
a first support member disposed between the rear surface of the display panel and the panel flexible circuit film;
At least a partial region of the first supporting member is exposed to the outside of the panel flexible circuit film when the display module is viewed from a rear surface of the display module. 17. The method of claim 16,
at least one second support member disposed below the first support member;
the second support member covers at least a partial area of the first support member exposed to the outside of the panel flexible circuit film;
and a thickness of the second supporting member is the same as a thickness of the panel flexible circuit film. 17. The method of claim 16,
Further comprising a cover panel disposed between the rear surface of the display panel and the first support member,
The first support member covers a rear surface of the cover panel from one end to the other end of the cover panel in a first direction. 17. The method of claim 16,
A length of a diameter of the bending portion of the panel flexible circuit film is longer than a length of a thickness of the first supporting member. 17. The method of claim 16,
The display module further includes a display driving chip disposed between the rear surface of the display panel and the panel flexible circuit film,
The display driving chip is electrically connected to the panel flexible circuit film to control driving of the display module,
The first support member includes an opening for accommodating the display driving chip therein;
and a thickness of the first supporting member is equal to or thicker than a thickness of the display driving chip.

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