KR20220037302A - Electronic device including flexible printed circuit board - Google Patents

Abstract

Various embodiments of the present invention provide an electronic device comprising a flexible printed circuit board for easily placing a flexible printed circuit board (eg, an electromagnetic induction panel). According to an embodiment of the present invention, an electronic device comprises: a display including a first layer comprising a plurality of pixels, and a second layer, coupled to a rear surface of the first layer, which includes an opening; a module located in the opening; a flexible printed circuit board including a first portion included in the second layer around the opening and a second portion extending from the first portion to at least partially cover the module disposed in the opening; and a conductive bonding member electrically connecting the first portion and the second portion across a slit between the first portion and the second portion.

Description

ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD comprising a flexible printed circuit board

Various embodiments of the present invention relate to electronic devices including flexible printed circuit boards.

With the establishment of a 'paperless' environment that considers the environment and can change the way we work more efficiently, the use of smart devices is increasing, and pen input devices (such as stylus pen) are rapidly changing into the mobile era. is expanding its role. The pen input device may be implemented by an electromagnetic induction method (eg, an electro-magnetic resonance (EMR) method), and an electronic device such as a smart phone uses an electromagnetic induction panel (eg, a digitizer) for detecting an input of the pen input device. )) may be included.

The electromagnetic induction panel may be implemented as, for example, a flexible printed circuit board, and may be disposed along substantially the entire area of the screen (or display area). According to the trend of screen maximization, an attempt is made to position the sensor module under the screen in the bezel area around the screen, which may make it difficult to arrange the electromagnetic induction panel.

Various embodiments of the present invention include a flexible printed circuit board for easily disposing a flexible printed circuit board (eg, electromagnetic induction panel) in consideration of an overlapping relationship with at least one module (eg, a sensor module) An electronic device may be provided.

The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. There will be.

According to one embodiment of the present invention, an electronic device comprises a display comprising a first layer comprising a plurality of pixels and a second layer coupled to a rear surface of the first layer and comprising an opening, the display positioned in the opening a flexible printed circuit board comprising a module, a first portion included in the second layer around the opening, and a second portion extending from the first portion to at least partially cover the module disposed in the opening, and the and a conductive bonding member electrically connecting the first portion and the second portion across a slit between the first portion and the second portion.

Various embodiments of the present invention facilitate the disposition of the sensor module and the flexible printed circuit board when the sensor module (eg, fingerprint sensor) and the flexible printed circuit board (eg, electromagnetic induction panel) are positioned to overlap each other with respect to the display. and can contribute to slimming of the electronic device.

In addition, effects obtainable or predicted by various embodiments of the present invention will be disclosed directly or implicitly in the detailed description of the embodiments of the present invention. For example, various effects predicted according to various embodiments of the present invention will be disclosed in the detailed description to be described later.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a perspective view of a front surface of a mobile electronic device according to an exemplary embodiment;
3 is a perspective view of a rear surface of the electronic device of FIG. 2 according to an exemplary embodiment.
4 is an exploded perspective view of the electronic device of FIG. 2 according to an exemplary embodiment.
5 illustrates a partial cross-sectional structure of a line AA′ in FIG. 2 according to an embodiment.
6 is a plan view illustrating a state in which a display, a sensor module, and an electromagnetic induction panel are coupled according to an embodiment.
7 is a plan view illustrating a state in which a conductive bonding member connects a first portion and a second portion of an electromagnetic induction panel according to an embodiment;
FIG. 8 is a plan view of a state in which the copper sheet of FIG. 5 is disposed on an electromagnetic induction panel according to an embodiment;
9A is a plan view illustrating a state in which a display, a sensor module, and an electromagnetic induction panel are coupled according to another embodiment.
9B is a plan view illustrating a state in which a display, a sensor module, and an electromagnetic induction panel are coupled according to another embodiment.
10 is a perspective view of a sensor module according to various embodiments of the present disclosure;
11 is a plan view illustrating a state in which the sensor module of FIG. 10 is coupled to a display and an electromagnetic induction panel according to various embodiments of the present disclosure;
12 is a perspective view of a sensor module and a support structure according to another embodiment.
13 is a plan view of a state in which the sensor module and the support structure of FIG. 12 are combined with a display and an electromagnetic induction panel according to various embodiments of the present disclosure;
14 is a perspective view of a sensor module, a first support structure, and a second support structure according to another exemplary embodiment.
15 is a plan view illustrating a state in which the sensor module, the first support structure, and the second support structure of FIG. 14 are coupled to a display and an electromagnetic induction panel according to various embodiments of the present disclosure;
16 illustrates a cross-sectional structure of an assembly including a first module, a second module, and a flexible printed circuit board according to various embodiments.
17 is a perspective view of a front surface of an electronic device according to various embodiments of the present disclosure;
18 is a perspective view of a rear surface of the body of FIG. 17 according to various embodiments;

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 may use less power than the main processor 121 or may be set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the co-processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but the above-described example is not limited to The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks, or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. Technologies such as input/output (full dimensional MIMO (FD-MIMO)), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, underside) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band. can

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, a processor (eg, processor 120 ) of a device (eg, electronic device 101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly between smartphones (eg: smartphones) and online. In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2 is a perspective view of a front side of a mobile electronic device 200 according to an exemplary embodiment. 3 is a perspective view of a rear surface of the electronic device 200 of FIG. 2 according to an exemplary embodiment.

According to various embodiments, the electronic device 200 of FIG. 2 may include the electronic device 101 of FIG. 1 .

2 and 3 , the electronic device 200 according to an embodiment includes a front surface 210A, a rear surface 210B, and a side surface 210C surrounding a space between the front surface 210A and the rear surface 210B. It may include a housing 210 including a. According to various embodiments, the housing 210 may refer to a structure forming at least a portion of the front surface 210A, the rear surface 210B, and the side surface 210C of FIG. 2 . According to one embodiment, the front surface 210A may be formed by a front plate (or first plate) 202 (eg, a glass plate comprising various coating layers, or a polymer plate) at least a portion of which is substantially transparent. there is. The rear surface 210B may be formed by a substantially opaque rear surface plate (or second plate) 211 . The back plate 211 may be formed by, for example, coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing. can The side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or “side member”) 218 comprising a metal and/or a polymer. In some embodiments, the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment (see FIG. 2 ), the front plate 202 comprises two first regions 210D that extend seamlessly by bending from the front 210A toward the back plate 211 . It can include both ends of the long edge (long edge) of (202). In the illustrated embodiment (see FIG. 3 ), the rear plate 211 includes two second regions 210E that extend seamlessly from the rear surface 210B toward the front plate 202 at both ends of the long edge. can In some embodiments, the front plate 202 (or the back plate 211 ) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, some of the first regions 210D or the second regions 210E may not be included. In the above embodiments, when viewed from the side of the electronic device 200 , the side bezel structure 218 is at the side where the first regions 210D or the second regions 210E are not included. It may have a first thickness (or width), and may have a second thickness that is thinner than the first thickness on a side surface including at least one of the first regions 210D and at least one of the second regions 210E.

According to an embodiment, the electronic device 200 includes a display 201 , audio modules 203 , 206 , 207 , a sensor module 204 , 300 , and camera modules 205 , 212a , 212b , 212c , 213a , 213b and 214 , key input devices 217 , the pen input device 220 , and at least one of connector holes 208 and 209 . According to some embodiments, the electronic device 200 may omit at least one of the components (eg, key input devices 217 ) or additionally include other components (eg, a light emitting device).

The display 201 may be exposed through a substantial portion of the front plate 202 , for example. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first regions 210D of the front surface 210A and the side surface 210C. In some embodiments, the corners of the display 201 may be formed to be substantially identical to the adjacent outer shape of the front plate 202 . In another embodiment (not shown), in order to expand the area to which the display 201 is exposed, the distance between the outer periphery of the display 201 and the outer periphery of the front plate 202 may be substantially the same. According to various embodiments, the display 201 is configured to detect a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a magnetic field type pen input device (eg, a stylus pen) 220 . It may be coupled to or disposed adjacent to the digitizer.

The audio modules 203 , 206 , and 207 may include a microphone hole (eg, the audio module 203 ) and speaker holes (eg, the audio module 206 and the audio module 207 ). In the microphone hole, a microphone for acquiring an external sound may be disposed therein. In some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes may include an external speaker hole (eg, the audio module 206) and a receiver hole for a call (eg, the audio module 207). In some embodiments, the speaker holes and the microphone hole may be implemented as a single hole, or a speaker may be included without speaker holes (eg, a piezo speaker).

The sensor modules 204 and 300 (eg, the sensor module 176 of FIG. 1 ) may generate an electrical signal or data value corresponding to an external environmental state (eg, a user state). For example, the sensor module 204 may include a proximity sensor or an illuminance sensor, and the other sensor module 300 may include a fingerprint sensor. The position of the sensor module may vary, and for example, may be located on the front side 210A side of the housing 210 , or located on the rear side surface 210B side of the housing 210 inside the housing 210 . According to various embodiments, the electronic device 200 may further include a sensor module that generates an electrical signal or data value corresponding to an internal operating state (eg, power or temperature) of the electronic device 200 . According to various embodiments, the electronic device 200 may include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, and a humidity sensor. It may include one more. According to various embodiments, the sensor module may be positioned to correspond to at least one of the first regions 210D and/or the second regions 210E.

The camera modules (205, 212a, 212b, 212c, 213a, 213b, 214) are the first camera module (205) positioned on the front (210A) side of the housing (210), the opening formed in the rear plate (211) The second camera modules 212a, 212b, 212c disposed in (opening) (eg, the opening 2111 in FIG. 4 ), or third camera modules positioned at the rear 210B side from the inside of the housing 210 (213a, 213b) and/or a flash (eg, camera module 214). The first camera module 205 and/or the second camera modules 212a, 212b, 212c may include one or more lenses, an image sensor, and/or an image signal processor. The flash may include, for example, a light emitting diode or a xenon lamp.

The key input devices 217 may be disposed on the side surface 210C of the housing 210 . In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217 and the not included key input devices 217 are soft keys on the display 201 . etc. may be implemented in other forms. In some embodiments, the key input device may include a sensor module. According to various embodiments, the key input device may be positioned to correspond to at least one of the first regions 210D and/or the second regions 210E.

The electronic device 200 may further include a light emitting device (not shown). The light emitting device may provide, for example, state information of the electronic device 200 in the form of light. In another embodiment, the light emitting device may provide a light source that is interlocked with the operation of the first camera module 205 . The light emitting element may include, for example, an LED, an IR LED or a xenon lamp.

The connector holes 208 and 209 include a first connector hole 208 that can receive a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 209 capable of accommodating a connector for transmitting and receiving audio signals. According to various embodiments, the first connector hole 208 and the connector related thereto may be used for transmitting/receiving an audio signal with an external electronic device, and in this case, the second connector hole 209 and the connector related thereto may be omitted. .

The pen input device 220 (eg, a stylus pen) may be guided and inserted into the housing 210 through a hole 221 formed in a side surface of the housing 210 . According to various embodiments, the pen input device 220 may include a button for facilitating separation into the housing 210 . According to an embodiment, the pen input device 220 may be implemented using an electromagnetic induction method (eg, an electro-magnetic resonance (EMR) method). The pen input device 220 may include a resonance circuit and may interwork with an electromagnetic induction panel (eg, the electromagnetic induction panel 400 of FIG. 4 ) included in the electronic device 200 .

According to one embodiment, the sensor module 204 or 300 may be located on the back of the screen display area (or active area) of the display 201 , or below or beneath the screen display area of the display 201 . can In this case, the position of the sensor module 204 or 300 is not visually distinguished (or exposed), and a related function using the sensor module 204 or 300 may be performed. For example, when the sensor module 204 or 300 includes an optical sensor, light related to an external environmental state (eg, user state) may pass through the screen display area of the display 201 and may flow into the optical sensor. there is. According to various embodiments, the sensor module 204 or 300 may be aligned and positioned in a recess formed in the screen display area of the display 201 , or at least a portion of the sensor module 204 or 300 may be inserted into the recess. In various embodiments, a sensor module positioned to overlap the screen display area of the display 201 may be referred to as an in-display sensor. According to some embodiments, the sensor module may be positioned in alignment with an opening formed in the screen display area of the display 201 .

According to various embodiments, the first camera module 205 may be located on the back side of the screen display area (or active area) of the display 201 , or below or beneath the screen display area of the display 201 . can In this case, the position of the first camera module 205 is not visually distinguished (or exposed), and a related function (eg, image capturing) using the first camera module 205 may be performed. For example, when viewed from above (eg, in the -z axis direction) of the front surface 210A, the first camera module 205 is disposed to overlap at least a portion of the screen display area and exposed to the outside It is not possible to obtain an image of an external subject. According to various embodiments, the first camera module 205 may be aligned and positioned in a recess formed in the screen display area of the display 201 , or at least a part of the first camera module 205 may be inserted into the recess. According to some embodiments, the first camera module 205 may be positioned in alignment with an opening formed in the screen display area of the display 201 .

According to various embodiments, at least one audio module (eg, a speaker or a receiver for a call) is disposed on a rear surface of an on-screen display area (or active area) of the display 201 , or below the on-screen display area of the display 201 . It can be located (below or beneath). In this case, the position of the audio module is not visually distinguished (or exposed), and a related function using the audio module may be performed. According to various embodiments, the audio module may be aligned and positioned in a recess formed in the screen display area of the display 201 , or at least a part of the audio module may be inserted into the recess. According to some embodiments, the audio module may be positioned in alignment with an opening formed in the screen display area of the display 201 .

4 is an exploded perspective view of the electronic device 200 of FIG. 2 according to an exemplary embodiment.

Referring to FIG. 4 , in an embodiment, the electronic device 200 includes a side bezel structure 218 , a first support member 410 (eg, a bracket), a front plate 202 , and a display 201 . ), electromagnetic induction panel 400 , first substrate assembly 431 , second substrate assembly 432 , battery 440 , second support member 451 , third support member 452 , antenna structure 460 . ), a pen input device 220 , or a rear plate 211 . According to some embodiments, the electronic device 200 may omit at least one of the components (eg, the first support member 410 , the second support member 451 , or the third support member 452 ) or use other components. It may include additional components.

According to an embodiment, the electromagnetic induction panel 400 (eg, a digitizer) may be a panel for detecting an input of the pen input device 220 . For example, the electromagnetic induction panel 400 may include a printed circuit board (PCB) (eg, flexible printed circuit board (FPCB)) and a shielding sheet. The shielding sheet may prevent the components included in the electronic device 200 from interfering with each other by an electromagnetic field generated from the components. The shielding sheet blocks electromagnetic fields generated from the components, so that an input from the pen input device 220 can be accurately transmitted to a coil included in the electromagnetic induction panel 400 .

The first support member 410 may be disposed inside the electronic device 200 and connected to the side bezel structure 218 , or may be integrally formed with the side bezel structure 218 . The first support member 410 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 410 may include a plurality of openings 411 , 412 , 413 , and 502 . For example, the operation of forming the first support member 410 and/or a structure including the first support member 410 and the side bezel structure 218 may include contouring, the plurality of openings being At least some of (411, 412, 413, 502) may be utilized to fix the object to be processed in the machine for such external processing. For another example, the operation of forming the first support member 410 and/or a structure including the first support member 410 and the side bezel structure 218 includes post processing including a surface treatment such as coating. And, at least some of the plurality of openings (411, 412, 413, 502) may be utilized to fix the object to be processed in the machine for such post-processing. For another example, at least some of the plurality of openings 411 , 412 , 413 , and 502 are aligned with the electronic component or the mechanical structure to prevent stress (or load) applied to the electronic component or the mechanical structure, or an electronic device (200) can contribute to slimming. As another example, some of the plurality of openings 411 , 412 , 413 , and 502 may be utilized as a light transmission path for an optical element such as a camera module. The number or location of the openings is not limited to the embodiment of FIG. 4 and may vary.

The display 201 may be coupled to one surface of the first support member 410 , and be disposed between the first support member 410 and the front plate 202 . The first substrate assembly 431 and the second substrate assembly 432 are, for example, coupled to the other surface of the first support member 410 and disposed between the first support member 410 and the back plate 211 . can be

According to an embodiment, when viewed from above (eg, in the -z axis direction) of the front plate 202 , at least one electronic component (eg, the sensor module 204 of FIG. 2 , the sensor module 300 , Alternatively, the first camera module 205) may be positioned at least partially overlapping the display 201 . In this case, the at least one electronic component may be located between the display 201 and the electromagnetic induction panel 400 , or between the electromagnetic induction panel 400 and the first supporting member 410 . In embodiments where at least one electronic component is positioned between the electromagnetic induction panel 400 and the first support member 410, the electromagnetic induction panel 400 may include an opening corresponding to the at least one electronic component. . According to some embodiments, the at least one electronic component may be positioned between the first support member 410 and the first substrate assembly 431 , in this case, the electromagnetic induction panel 400 and the first support member 410 . ) may include openings corresponding thereto, respectively.

According to an embodiment, the first substrate assembly 431 may include a first printed circuit board (PCB). The display 201 and/or the electromagnetic induction panel 400 may be electrically connected to the first printed circuit board through various electrical paths such as a flexible printed circuit board (FPCB). The first substrate assembly 431 may include various electronic components electrically connected to the first printed circuit board. The electronic component may be disposed on the first printed circuit board or may be electrically connected to the first printed circuit board through an electrical path such as a cable or FPCB. The electronic component may include, for example, at least some of components included in the electronic device 101 of FIG. 1 .

According to various embodiments, the first substrate assembly 431, when viewed from the top of the rear plate 211, a Main PCB, a slave PCB disposed partially overlapping the Main PCB, and/or an interface between the Main PCB and the slave PCB It may include an interposer substrate.

According to an embodiment, when viewed from above the front plate 202 , the second substrate assembly 432 may be disposed to be spaced apart from the first substrate assembly 431 with the battery 440 interposed therebetween. The second substrate assembly 432 may include a second printed circuit board electrically connected to the first printed circuit board of the first substrate assembly 431 . The second board assembly 432 may include various electronic components electrically connected to the second printed circuit board. The electronic component may be disposed on the second printed circuit board or may be electrically connected to the second printed circuit board through an electrical path such as a cable or FPCB. The electronic component may include, for example, some of the components included in the electronic device 101 of FIG. 1 . According to an embodiment, the electronic component includes a USB connector utilizing the first connector hole 208 , an earphone jack utilizing the second connector hole 209 , a microphone utilizing the microphone hole 203 , or a speaker hole It may be a speaker utilizing 206 . According to various embodiments, the first printed circuit board included in the first board assembly 431 and the second printed circuit board included in the second board assembly 432 may be implemented as an integrated printed circuit board.

According to an embodiment, the battery 440 may be disposed between the first support member 410 and the rear plate 211 , and may be coupled to the first support member 410 . The battery 440 is a device for supplying power to at least one component of the electronic device 200 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 440 may be disposed substantially coplanar with, for example, a first printed circuit board of the first board assembly 431 or a second printed circuit board of the second board assembly 432 . there is. The battery 440 may be integrally disposed inside the electronic device 200 , or may be disposed detachably from the electronic device 200 .

According to an embodiment, the second support member 451 may be disposed between the first support member 410 and the rear plate 211 , and is coupled to the first support member 410 through a fastening element such as a bolt. can be At least a portion of the first substrate assembly 431 may be disposed between the first support member 410 and the second support member 451 , and the second support member 451 covers the first substrate assembly 431 . can be protected by

According to an embodiment, the third support member 452 may be disposed to be spaced apart from the second support member 451 with the battery 440 interposed therebetween when viewed from above the front plate 202 . The third support member 452 may be disposed between the first support member 410 and the rear plate 211 , and may be coupled to the first support member 410 through a fastening element such as a bolt. At least a portion of the second substrate assembly 432 may be disposed between the first support member 410 and the third support member 452 , the third support member 452 covering the second substrate assembly 432 . can be protected by

According to an embodiment, the second support member 451 and/or the third support member 452 may be formed of a metal material and/or a non-metal material (eg, polymer). According to various embodiments, the second support member 451 and/or the third support member 452 may be referred to as a rear case. According to various embodiments, the second support member 451 and the third support member 452 may be implemented as an integral support member.

According to an embodiment, the antenna structure 460 may be disposed between the second support member 451 and the rear plate 211 . The antenna structure 460 may be implemented in the form of a film such as, for example, an FPCB. According to an embodiment, the antenna structure 460 may include at least one conductive pattern used as a loop-type antenna radiator. For example, the at least one conductive pattern may include a planar spiral conductive pattern (eg, a planar coil or a pattern coil). According to various embodiments (not shown), the antenna structure 460 may be at least partially disposed between the rear plate 211 and the battery 440 . The antenna structure 360 may include, for example, an antenna radiator for near field communication (NFC), an antenna radiator for wireless charging, and/or an antenna radiator for magnetic secure transmission (MST). The antenna structure 460 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 218 and/or the first support member 410 or a combination thereof.

FIG. 5 shows a partial cross-sectional structure 500 along the line A-A′ in FIG. 2 according to one embodiment.

Referring to FIG. 5 , in one embodiment, the cross-sectional structure 500 includes a front plate 202 , a display 201 , an optically transparent adhesive member 550 , a sensor module 300 , an electromagnetic induction panel 400 , It may include a conductive bonding member 570 , a first support member 410 , or a battery 440 . A redundant description of some of the reference numerals in FIG. 5 will be omitted. The cross-sectional structure 500 shown in FIG. 5 schematically presents a stacking relationship between components, and each component may be formed to have substantially various thicknesses.

The display 201 may be coupled to the front plate 202 using an optically transparent adhesive member 550 . The display 201 may be, for example, a flexible display capable of being bent corresponding to the curved first regions 210D (refer to FIG. 2 ). The front plate 202 (eg, a window or a transparent cover) may cover the display 201 to protect the display 201 from the outside. The front plate 202 may be implemented in the form of a flexible thin film (eg, a thin film layer). For example, the front plate 202 may include a plastic film (eg, a polyimide film) or a thin glass (eg, ultra thin glass (UTG)). According to various embodiments, the front plate The 202 may include a plurality of layers. For example, the front plate 202 may have a form in which various coating layers are disposed on a plastic film or thin glass. For example, the front plate 202 may include , at least one protective layer or coating layer containing a polymer material (eg, PET (polyester), PI (polyimide), or TPU (thermoplastic polyurethane)) may be disposed on a plastic film or thin glass.

According to an embodiment, the display 201 may include a display panel 510 , a base film 520 , a lower panel 530 , or an optical layer 540 . The display panel 510 may be positioned between the optical layer 540 and the base film 520 . The base film 520 may be positioned between the display panel 510 and the lower panel 530 . The optical layer 540 may be positioned between the optically transparent adhesive member 550 and the display panel 510 . An adhesive member of various polymers between the display panel 510 and the base film 520 , between the base film 520 and the lower panel 530 , and/or between the display panel 510 and the optical layer 540 . (not shown) may be disposed.

According to an embodiment, the display panel 510 may include an emission layer 511 and a thin film transistor (TFT) film 512 . The light emitting layer 511 may include, for example, a plurality of pixels implemented as light emitting devices such as OLEDs or micro LEDs. The light emitting layer 511 may be disposed on the TFT film 512 through organic material evaporation. A TFT film 512 may be positioned between the light emitting layer 511 and the base film 520 . The TFT film 512 may refer to a structure in which at least one TFT is disposed on a flexible substrate (eg, a PI film) through a series of processes such as deposition, patterning, and etching. The at least one TFT may control the current to the light emitting device of the light emitting layer 511 to turn on or off the pixel or adjust the brightness of the pixel. The at least one TFT may be implemented as, for example, an amorphous silicon (a-Si) TFT, a liquid crystalline polymer (LCP) TFT, a low-temperature polycrystalline oxide (LTPO) TFT, or a low-temperature polycrystalline silicon (LTPS) TFT. can The display panel 510 may include a storage capacitor, and the storage capacitor maintains a voltage signal to the pixel, maintains the voltage applied to the pixel within one frame, or changes the gate voltage of the TFT due to leakage during the light emission time can reduce By a routine (eg, initialization, data write) controlling at least one TFT, the storage capacitor may maintain the voltage applied to the pixel at a predetermined time interval.

According to an embodiment, the display panel 510 may be implemented based on OLED, and includes an encapsulation (eg, thin-film encapsulation (TFE)) 513 covering the light emitting layer 511 . can do. Organic materials and electrodes that emit light in OLEDs are very sensitive to oxygen and/or moisture and may lose their luminescent properties. The encapsulation layer 513 may seal the light emitting layer 511 so that oxygen and/or moisture do not penetrate into the OLED.

According to an embodiment, the base film 520 may include a flexible film formed of a material such as polyimide or polyester (PET). The base film 520 may serve to support and protect the display panel 510 . According to some embodiments, the base film 520 may be referred to as a protective film, a back film, or a back plate.

According to an embodiment, the lower panel 530 may include a plurality of layers for various functions. An adhesive member (not shown) of various polymers may be disposed between the plurality of layers. According to an embodiment, the lower panel 530 may include a light blocking layer 531 , a buffer layer 532 , or a lower layer 533 . The light blocking layer 531 may be positioned between the base film 520 and the buffer layer 532 . A buffer layer 532 may be positioned between the light blocking layer 531 and the lower layer 533 .

According to an embodiment, the light blocking layer 531 may block at least a portion of light incident from the outside. For example, the light blocking layer 531 may include an emboss layer. The embossed layer may be a black layer comprising an uneven pattern.

According to an embodiment, the buffer layer 532 may mitigate an external impact applied to the display 201 . For example, the buffer layer 532 may include a sponge layer, or a cushion layer.

According to an embodiment, the lower layer 533 may diffuse, disperse, or radiate heat generated in the electronic device 200 or the display 201 . The lower layer 533 may absorb or shield electromagnetic waves. The lower layer 533 may mitigate an external shock applied to the electronic device 200 or the display 201 . For example, the lower layer 533 may include a composite sheet 533a or a copper sheet 533b. According to an embodiment, the composite sheet 533a may be a sheet processed by combining layers or sheets having different properties. For example, the composite sheet 533a may include at least one of polyimide and graphite. The composite sheet 533a may be replaced with a single sheet including one material (eg, polyimide, or graphite). Composite sheet 533a may be positioned between buffer layer 532 and copper sheet 533b. The copper sheet 533b may be replaced with various other metal sheets. The lower layer 533 may include various layers for various other functions.

According to various embodiments (not shown), at least one additional polymer layer (eg, a layer including PI, PET, or TPU) other than the base film 520 may be further disposed on the rear surface of the display panel 510 .

According to various embodiments, at least one of the plurality of layers (eg, the light blocking layer 531 , the buffer layer 532 , the composite sheet 533a , and the copper sheet 533b) included in the lower panel 530 is omitted. it might be According to various embodiments, the arrangement order of the plurality of layers included in the lower panel 530 is not limited to the embodiment of FIG. 5 and may be variously changed.

The optical layer 540 may include, for example, a polarizing layer (or polarizer), or a retardation layer (or retarder). The polarization layer and the phase delay layer can improve the outdoor visibility of the screen. According to an embodiment, the optical layer 540 may selectively pass light that is generated from the light source of the display panel 510 and vibrates in a predetermined direction. According to various embodiments, a single layer in which the polarization layer and the retardation layer are combined may be provided, and this layer may be defined as a 'circularly polarization layer'. The optically transparent adhesive member 550 may be positioned between the front plate 202 and the optical layer 540 , for example, optical clear adhesive (OCA), optical clear resin (OCR), or super view (SVR). resin) may be included. According to various embodiments, the polarization layer (or the circular polarization layer) may be omitted, and in this case, a black pixel define layer (PDL) and/or a color filter may be provided to replace the polarization layer.

According to an embodiment (not shown), the electronic device 200 of FIG. 2 may include a touch sensing circuit (eg, a touch sensor). The touch sensing circuit may be implemented as a transparent conductive layer (or film) based on various conductive materials such as indium tin oxide (ITO). According to one embodiment, the touch sensing circuit may be disposed between the front plate 202 and the optical layer 540 (eg, an add-on type). According to another embodiment, the touch sensing circuit may be disposed between the optical layer 540 and the display panel 510 (eg, on-cell type). According to another embodiment, the display panel 510 may include a touch sensing circuit or a touch sensing function (eg, in-cell type).

According to various embodiments (not shown), the display panel 510 may be based on an OLED and may include an encapsulation layer 513 disposed between the light emitting layer 511 and the optical layer 540 . For example, the encapsulation layer 513 may serve as a pixel protection layer for protecting a plurality of pixels of the emission layer 511 . According to various embodiments (not shown), the display 201 is a metal mesh (eg, aluminum) as a touch sensing circuit disposed in the encapsulation layer 513 between the encapsulation layer 513 and the optical layer 540 . a conductive pattern such as a metal mesh). For example, in response to warping of the display 201 , the metal mesh may have greater durability than a transparent conductive layer implemented with ITO.

According to various embodiments (not shown), the display 201 may further include a pressure sensor capable of measuring the intensity (pressure) of the touch.

According to various embodiments, a plurality of layers included in the display panel 510 or the lower panel 530, a stacking structure thereof, or a stacking order may vary. According to various embodiments, the display 201 may be implemented by omitting some of the components or adding other components according to its provision form or convergence trend.

According to an embodiment, at least some of the plurality of layers included in the lower panel 530 may include the first opening 501 . At least two or more layers may include an opening, and the openings formed in each layer may overlap each other when viewed from the top of the front surface 210A, and may have substantially the same size and shape. According to some embodiments, the size or shape of the opening formed in each layer may not be the same. In the illustrated embodiment, the first opening 501 includes an opening formed in the light blocking layer 531 , an opening formed in the buffer layer 532 , an opening formed in the composite sheet 533a , and an opening formed in the copper sheet 533b . It may be formed by overlapping. A recess 503 due to the first opening 501 of the lower panel 530 may be formed on the rear surface of the display 201 . The stacking structure or the stacking order of the plurality of layers included in the lower panel 530 may vary, and the first opening 501 is not limited to the embodiment of FIG. A recess may be formed.

In some embodiments, the display 201 may be defined as comprising a first layer 51 comprising a plurality of pixels, and a second layer 52 coupled to a backside of the first layer 51 . For example, the first layer 51 may include a display panel 510 and an optical layer 513 . The second layer 52 may include, for example, a bottom panel 530 . The second layer 52 may include a first opening 501 . According to an embodiment, the sensor module 300 may be located in the first opening 501 of the second layer 52 (eg, the lower panel 530 ). The sensor module 300 may generate, for example, an electrical signal or data value corresponding to an external environmental state. According to an embodiment, the sensor module 300 may include a substrate (eg, a PCB or FPCB) 560 , and at least one sensing-related electronic component (not shown) disposed on the substrate 560 . The substrate 560 may include a first side 561 facing the first layer 51 , and a second side 562 facing opposite the first side 561 .

According to an embodiment, an adhesive material may be positioned between the sensor module 300 and the first layer 51 . The adhesive material between the sensor module 300 and the first layer 51 may be selected so as not to degrade the performance of the sensor module 300 .

The sensor module 300 may include, for example, an optical sensor. The optical sensor may include at least one light emitting unit (eg, a light source such as an LED) and at least one light receiving unit (eg, a photodiode, or an image sensor), and the at least one light emitting unit and the at least one light receiving unit may include a substrate ( 560 may be disposed on the first surface 561 . Light output from the at least one light emitting unit may pass through the first layer 51 , the optically transparent adhesive member 550 , and the front plate 202 to travel to the outside. The light output from the at least one light emitting unit is scattered or reflected by an object located outside the electronic device 200 , and the scattered or reflected light is the front plate 202 , the optically transparent adhesive member 550 , and the first It may be introduced into the at least one light receiving unit through the first layer 51 . The at least one light receiving unit may generate an electrical signal from light scattered or reflected by an external object. According to an embodiment, the sensor module 300 may include an optical fingerprint sensor. When a finger is brought close to a partial region of the front surface 210A overlapping the fingerprint sensor, the light output from the light emitting unit of the fingerprint sensor is reflected by the finger and flows into the light receiving unit (eg, photodiode, or image sensor) of the fingerprint sensor. , the light receiving unit may generate an electrical signal (eg, image data) related to the fingerprint information. The sensor module 300 under the display panel 510 may be implemented to detect light related to various other information, and its location may also vary without being limited to the embodiment of FIG. 2 . For example, the sensor module 300 detects light in a specified wavelength band and generates an electrical signal related to biometric information (eg, skin moisture, skin melanin, skin temperature, heart rate, blood flow rate, iris, or fingerprint). You can (eg biosensors). For example, the sensor module 300 may detect light of a specified wavelength band and generate an electrical signal regarding whether an external object is in proximity or a proximity distance (eg, a proximity sensor) (eg, the sensor module ( 204)). As another example, the sensor module 300 may detect light of a specified wavelength band and generate an electrical signal related to the movement of the user's hand (eg, a gesture) (eg, a gesture sensor).

According to another embodiment, the sensor module 300 may include an ultrasonic sensor. For example, the sensor module 300 may include an ultrasonic fingerprint sensor. Fingerprint information may be obtained by using a fingerprint sensor to detect a fine air layer gap between a finger and the front surface 210A with ultrasound. The fingerprint sensor may include one or more ultrasound transmitters and one or more ultrasound receivers, which may be disposed on the first side 561 of the substrate 560 . The ultrasound output from the one or more ultrasound transmitters may be reflected by a finger close to (eg, in contact with) a partial region of the front surface 210A overlapped with the fingerprint sensor and received by the one or more ultrasound receivers. An ultrasonic reception amount that varies according to the curvature of the fingerprint may be detected by one or more ultrasonic receivers, and fingerprint information may be obtained based on this method.

According to various embodiments, the sensor module 300 may include a capacitive sensor. For example, the sensor module 300 may include a capacitive fingerprint sensor. The capacitive fingerprint sensor may include a plurality of electrodes positioned on the first surface 561 of the substrate 560 . Fingerprint information may be obtained through a method of detecting a change in capacitance according to the curvature of the fingerprint through each electrode.

According to an embodiment, when viewed from above (eg, in the -z axis direction) of the front plate 202 , a partial region of the first layer 51 that is at least partially overlapped with the sensor module 300 may be compared to another region. It may include other pixel structures and/or wiring structures. For example, a portion of the first layer 51 that is at least partially overlapped with the sensor module 300 may have a different pixel density than other areas. A pixel structure and/or a wiring structure formed in a partial region of the first layer 51 that is at least partially overlapped with the sensor module 300 transmits various types of signals (eg, light or ultrasound) between the outside and the sensor module 300 . You can reduce that loss when passing. According to some embodiments, a plurality of pixels may not be disposed in a partial region of the first layer 51 that at least partially overlaps with the sensor module 300, and in this case, the sensor module 300 is disposed on the front surface 210A. It may be located on the edge side.

According to various embodiments, the sensor module 300 may be replaced with various other electronic components (eg, a camera module or an audio module), and the positions of the other electronic components may vary depending on the type of provision thereof. The audio module may include, for example, a speaker or a receiver for a call.

According to one embodiment, the electromagnetic induction panel 400 may be implemented in the form of a flexible film or sheet. The electromagnetic induction panel 400 may be formed of, for example, a flexible printed circuit board. The electromagnetic induction panel 400 may include a plurality of electrode patterns. When alternating current is supplied to the electromagnetic induction panel 400 , an electromagnetic field may be formed by the plurality of electrode patterns. When the pen tip of the pen input device 220 (refer to FIG. 4 ) is brought close to the front surface 210A, a current may flow through the coil included in the pen input device 220 by electromagnetic induction. The pen input device 220 responds to a user input on a screen (eg, a device comprising the front plate 202 , the display 201 , and the electromagnetic induction panel 400 ) using the energy supplied from the electromagnetic induction panel 400 . A signal (eg, a radio frequency signal) (eg, a position signal, a pen pressure signal, and/or an angle signal) may be generated and transmitted to a screen (eg, the electromagnetic induction panel 400 ). According to an embodiment, the electromagnetic induction panel 400 may include a shielding sheet. The shielding sheet may be positioned on the rear surface of the flexible printed circuit board including the plurality of electrode patterns (eg, the side of the flexible printed circuit board facing the copper sheet 533b in the illustrated embodiment). The shielding sheet may prevent the components included in the electronic device 200 from interfering with each other by an electromagnetic field generated from the components. The shielding sheet blocks electromagnetic fields generated from the components, so that an input from the pen input device 220 can be accurately transmitted to a coil included in the electromagnetic induction panel 400 .

According to an embodiment, the electromagnetic induction panel 400 (eg, a digitizer) may be positioned on the display 201 . In some embodiments, display 201 may be defined as an element comprising electromagnetic induction panel 400 . The electromagnetic induction panel 400 includes a first portion (①) at least partially included in the second layer 52 (eg, lower panel 530), and a second portion (②) extending from the first portion (①) may include The first portion ① may not substantially overlap the first opening 501 when viewed from above (eg, in the -z axis direction) of the front surface 210A. The second portion ② may at least partially cover the sensor module 300 (or the second surface 562 of the substrate 560 ) located in the first opening 501 of the second layer 52 . . After opening the first opening 501 of the second layer 52 by bending the second part (②) like an imaginary line indicated by the reference numeral '509', the sensor module 300 opens the first opening 501 can be placed in After the sensor module 300 is disposed in the first opening 501 , the second part ② may be positioned to cover the sensor module 300 . A state in which the second part (②) is bent as indicated by reference numeral '509' may be referred to as an 'open state', and a state in which the second part (②) covers the sensor module 300 and is located is a 'closed state' may be referred to as The electromagnetic induction panel 400 may include a slit 610 between the first portion (①) and the second portion (②). Due to the slit 610, the second part (②) capable of an open state or a closed state may be formed.

According to an embodiment, the first portion (①) of the electromagnetic induction panel 400 may be positioned between the composite sheet 533a and the copper sheet 533b of the lower layer 533 . According to another embodiment, the first portion ① of the electromagnetic induction panel 400 may be positioned between the buffer layer 532 and the lower layer 533 . According to another embodiment, the first part (①) of the electromagnetic induction panel 400 may be positioned between the light blocking layer 531 and the buffer pad 532 .

In the illustrated embodiment, the rear surface of the sensor module 300 (eg, the second surface 562 of the substrate 560) is directed toward the rear plate 211 (see FIG. 4 ) with respect to the composite sheet 533a (see FIG. 4 ). For example, it may not protrude in the -z axis direction). This may contribute so that the first portion (①) and the second portion (②) of the electromagnetic induction panel 400 can be arranged substantially flat without a difference in height.

According to an embodiment, the conductive bonding member 570 (eg, solder) may cross the slit 610 to electrically connect the first portion (①) and the second portion (②). The closed state of the second part (②) may be maintained by the conductive bonding member 570 .

According to one embodiment, when the sensor module 300 includes an ultrasonic sensor, an air gap (G) between the sensor module 300 and the second part (②) of the electromagnetic induction panel 400 is can be provided. The air gap G between the sensor module 300 and the second part (②) of the electromagnetic induction panel 400 may contribute to securing the performance of the ultrasonic sensor (eg, an ultrasonic fingerprint sensor). The air gap G may reduce the influence of the second part ② of the electromagnetic induction panel 400 on the sensor module 300 . The sensor module 300 disposed in the first opening 501 has a thickness that can contribute to the formation of an air gap G between the sensor module 300 and the second part ② (eg, from the first surface 561 ). height up to the second surface 562). The second part (②) may be arranged flat with respect to the first part (①), and the first part (①) is used to form an air gap (G) between the sensor module 300 and the second part (②). may be located on the second layer 52 of the display 201 . For example, the first part (①) is located at a location where the distance spaced apart from the first layer 51 is greater than the second surface 562 of the sensor module 300 (eg, the composite sheet 533a and the copper sheet ( 533b), and may contribute to the formation of an air gap G between the sensor module 300 and the second part (②).

According to various embodiments, when the sensor module 300 is not implemented as an ultrasonic sensor, or when the performance of the sensor module 300 is secured even if there is no air gap G, the electromagnetic wave G so that the air gap G is substantially absent. The second part (②) of the induction panel 400 may be in close contact with the sensor module 300 , or the air gap G may be filled with an adhesive material that does not substantially deteriorate the performance of the sensor module 300 .

The first support member 410 may include, for example, a third surface 410a facing toward the front plate 202 and a fourth surface 410b facing toward the rear plate 211 . The display 201 , the sensor module 300 , and the electromagnetic induction panel 400 may be positioned between the front plate 202 and the third side 410a. The battery 440 may be positioned between the fourth surface 410b and the rear plate 211 (see FIG. 4 ). In the illustrated embodiment, an adhesive material may be disposed between the copper sheet 533b and the third surface 410a. According to various embodiments, at least a portion of the third surface 410a may be formed by a conductive portion included in the first support member 410 , and may be electrically conductive between the copper sheet 533b and the third surface 410a. The copper sheet 533b and the conductive portion of the first support member 410 may be electrically connected to each other by the adhesive material. According to an embodiment, an adhesive material 505 may be disposed between the battery 440 and the fourth surface 410b.

The first support member 410 may include, for example, a conductive portion and a non-conductive portion coupled to the conductive portion. The side bezel structure 218 (see FIGS. 2, 3, or 4) and the conductive portion of the first support member 410 may be integrally formed and may include the same material (eg, a metal material such as aluminum). there is. The non-conductive portion of the first support member 410 may extend to a plurality of segmented portions included in the side bezel structure 218 to form a side surface 210C (see FIGS. 2 or 3 ) together with the side structure 218 . there is. For example, the operation of forming the side bezel structure 218 and the conductive portion of the first support member 410 may include die casting, and the operation of forming the non-conductive portion of the first support member 410 includes an insert. may include injection molding. According to an embodiment, the first support member 410 may include a second opening 502 . The operation of forming the first support member 410 and the side bezel structure 218 may include contour processing, and the second opening 502 may be utilized to fix a workpiece to a machine for contour processing. . As another example, the operation of forming the first support member 410 and the side bezel structure 218 may include a post-processing including a surface treatment such as a coating, and the second opening 502 may be configured for such post-processing. It can be used to fix the processing object to the machine.

According to an embodiment, the second opening 502 may at least partially overlap the first opening 501 when viewed from above the front surface 210A. The second opening 502 is such that the first supporting member 410 includes the front plate 202 , the display 201 , the sensor module 300 , the electromagnetic induction panel 400 , and the conductive bonding member 570 . The influence of stress (or load) on the assembly may be reduced, and may contribute to slimming of the electronic device 200 . According to an embodiment, the shape of the second opening 502 may be formed to reduce the amount of displacement in which the portion in which the conductive bonding member 570 is positioned in the assembly is drooping toward the battery 440 due to an external shock or external load. there is. Accordingly, an impact (eg, dent) of the conductive bonding member 570 on the battery 440 due to an external shock or an external load may be prevented. For example, assuming that the width of the second opening 502 in the x-axis direction is constant along the y-axis direction, when viewed from above the front surface 210A, one edge of the second opening 502 is a conductive bonding member. As the distance D spaced from the 570 is formed to be larger than the illustrated example, the amount of displacement in which the conductive bonding member 570 in the assembly is sagged toward the battery 440 due to an external shock or external load becomes relatively larger. may be large, and due to this, there may be a high possibility that the conductive bonding member 570 applies an impact to the battery 440 . In the operation of forming the first support member 410 and the side bezel structure 218 , the shape of the second opening 502 may be provided in consideration of the use for fixing the object to be processed to a corresponding processing machine. According to some embodiments, the second opening 502 is independent of its use for fixing the object to be processed to a corresponding processing machine in the operation of forming the first support member 410 and the side bezel structure 218, The first support member 410 may be provided to overlap the first opening 501 for a function of reducing the stress (or load) exerted on the assembly and/or a function of slimming the electronic device 200 . . According to various embodiments, a recess overlapping the first opening 501 may be formed in the first support member 410 to replace the second opening 502 . According to some embodiments, even if the second opening 502 overlapping the first opening 501 is omitted, the first support member 410 substantially eliminates the stress (or load) exerted on the assembly while the electronic device ( 200) may be secured.

In order to help the understanding of the present invention, the electromagnetic induction panel 400 is merely provided as a specific example, and various other circuit boards may be positioned instead of the electromagnetic induction panel 400 . The other circuit board may be various, for example, a PCB, a FPCB, or a rigid-flexible (RF) PCB. In various embodiments, the electromagnetic induction panel 400 may be used in or replaced with a circuit board (eg, a PCB, FPCB, or RFPCB) associated with the display 201 . In various embodiments, the electromagnetic induction panel 400 may be replaced with an FPCB type antenna structure. The electromagnetic induction panel 400 may be replaced with a circuit board for various other functions.

6 is a plan view 600 of a state in which the display 201, the sensor module 300, and the electromagnetic induction panel 400 are coupled according to an embodiment. 7 is a plan view 700 illustrating a state in which the conductive bonding member 570 connects the first part (①) and the second part (②) of the electromagnetic induction panel 400 according to an embodiment.

6 shows the closed state of the second part (②) of the electromagnetic induction panel 400 . In FIGS. 6 and 7 , the copper sheet 533b included in the display 201 is omitted, and redundant descriptions of some of the reference numerals in FIGS. 6 and 7 are omitted.

5 and 6 , in one embodiment, the electromagnetic induction panel 400 may include a slit 610 . The slit 610 is an empty area between the first part (①) and the second part (②), and may extend, for example, along a dotted line indicated by reference numeral '601'. According to an embodiment, the slit 610 is a first slit portion 611 extending in a first direction (eg, an x-axis direction), and one end of the first slit portion 611 is orthogonal to the first direction. It may include a second slit part 612 extending in the second direction (eg, the y-axis direction), and a third slit part 613 extending in the second direction from the other end of the first slit part 611 . there is. The connection region 325 between the first portion (①) and the second portion (②) is, for example, to extend from the other end of the second slit portion 612 to the other end of the third slit portion 613 . and may be spaced apart from and parallel to the first slit portion 611 . Due to the slit 610, the second part (②) capable of an open state or a closed state may be formed. The slit 610, and thus the second part (②), is not limited to the embodiment of FIG. 6 or 7, but according to the shape of the first opening 501 (refer to FIG. 5) for arranging the sensor module 300 It can be formed into a variety of different shapes.

According to an embodiment, the electromagnetic induction panel 400 may include a plurality of first electrode patterns 620 and a plurality of second electrode patterns 630 extending to cross each other. When alternating current is supplied to the electromagnetic induction panel 400 , an electromagnetic field may be formed between the plurality of first electrode patterns 620 and the plurality of second electrode patterns 630 . The electrode pattern is not limited to the embodiment of FIG. 6 and may be arranged in various arrangements. Some of the plurality of first electrode patterns 620 and/or the plurality of second electrode patterns 630 may be cut-off due to the slit 610 . In the illustrated example, some of the plurality of first electrode patterns 620 may be cut off in the first slit part 611 . For example, any one of the cut-off first electrode patterns may be divided into one side portion 621 and the other side portion 622 based on the first slit portion 611 . The electromagnetic induction panel 400 includes a first conductive pad (or first terminal) 641 positioned on the first part (①) and a second conductive pad (or second terminal) positioned on the second part (②). ) 642 . The first conductive pad 641 and the second conductive pad 642 may be located close to the first slit portion 611 . In the closed state of the second part (②), the first conductive pad 641 and the second conductive pad 642 may be aligned while being positioned on opposite sides of each other with the first slit portion 611 interposed therebetween. The one side portion 621 may be electrically connected to the first conductive pad 641 , and the other side portion 622 may be electrically connected to the second conductive pad 642 . The conductive bonding member 570 may electrically connect the first conductive pad 641 and the second conductive pad 642 to each other. One side portion 621 and the other side portion 622 of the first electrode pattern may be electrically connected through a conductive bonding member 570 . The pad structure 640 including the first conductive pad 641 and the second conductive pad 642 may be prepared in the same manner with respect to the other cut-off first electrode patterns. The conductive bonding member 570 may be disposed in the pad structure 640 provided with respect to the plurality of cut-off first electrode patterns, and in FIG. 7 , an array 701 of the conductive bonding member 570 is shown. shows

According to an embodiment, the flexible printed circuit board 660 may electrically connect the sensor module 300 and the first printed circuit board included in the first board assembly 431 of FIG. 4 . The flexible printed circuit board 660 may be electrically connected to the board 560 (refer to FIG. 5 ) of the sensor module 300 . According to an embodiment, the flexible printed circuit board 660 may be electrically connected to the substrate 560 of the sensor module 300 using anisotropic conductive film bonding. The ACF may be an anisotropic conductive film in which fine conductive particles (eg, Ni, carbon, or solder ball) are mixed with an adhesive resin (eg, thermosetting resin) to form a film and conduct electricity in only one direction. When the ACF is disposed between the flexible printed circuit board 660 and the substrate 560 of the sensor module 300 and compressed by applying heat and pressure, a conductive pattern (not shown) formed on the substrate 560 of the sensor module 300 . The silver may be electrically connected to the conductive pattern formed on the flexible printed circuit board 660 through conductive particles, and the adhesive resin may bond the flexible printed circuit board 660 and the substrate 560 of the sensor module 300 to each other. According to another embodiment, the flexible printed circuit board 660 may be electrically connected to the substrate 560 of the sensor module 300 using solder (eg, surface mounter technology (SMT)).

According to various embodiments, the flexible printed circuit board 660 and the board 560 (refer to FIG. 5 ) included in the sensor module 300 may be implemented as an integrated flexible printed circuit board. According to various embodiments, the flexible printed circuit board 660 and the substrate 560 included in the sensor module 300 may be implemented as an integrated flexible printed circuit board, and the substrate included in the sensor module 300 ( The substrate area corresponding to 560 may be rigid.

FIG. 8 is a plan view 800 of a state in which the copper sheet 533b of FIG. 5 is disposed on the electromagnetic induction panel 400 according to an embodiment.

FIG. 8 shows a closed state of the second part (②) of the electromagnetic induction panel 400 , and redundant description of some of the reference numerals in FIG. 8 will be omitted.

Referring to FIG. 8 , in one embodiment, a copper sheet 533b may be disposed on the electromagnetic induction panel 400 . The copper sheet 533b may be disposed on the electromagnetic induction panel 400 so as not to overlap the slit 610 and the pad structure 640 . The copper sheet 533b may include, for example, a slit corresponding to the slit 610 of the electromagnetic induction panel 400 .

9A is a plan view 900A illustrating a state in which the display 201, the sensor module 300, and the electromagnetic induction panel 400 are coupled according to another embodiment. 9B is a plan view 900B of a state in which the display 201, the sensor module 300, and the electromagnetic induction panel 400 are coupled according to another embodiment.

According to various embodiments, in order to secure or improve the flexibility of the connection region 325 between the first part (①) and the second part (②), the connection region 325 is formed by the first part (①) and the second part (②). It may be implemented in a form in which at least a part is omitted compared to the second part (②). For example, the electromagnetic induction panel 400 may be implemented to omit some of the plurality of layers in the connection region 325 . Due to the secured or improved connection region 325 in flexibility, the second part (②) may be easily bent in an open state as indicated by reference numeral 509 of FIG. 5 . This omitted portion for securing or improving flexibility may be implemented in, for example, at least one line shape or at least one surface shape.

Referring to FIG. 9A , for example, the electromagnetic induction panel 400 may include a cover layer 901 . The cover layer 901 may not be substantially disposed in the connection region 325 between the first portion (①) and the second portion (②), and thus the flexibility of the connection region 325 may be secured. In the embodiment of FIG. 9A , an omitted portion for securing or improving flexibility may be referred to as a planar shape. The cover layer 901 may be, for example, a protective layer for protecting the electromagnetic induction panel 400 . As another example, the cover layer 901 may include a shielding sheet. In various embodiments, as shown in FIG. 5 , when the first portion ① of the electromagnetic induction panel 400 is positioned between the composite sheet 533a and the copper sheet 533b, the cover layer 901 may be It may include a copper sheet 533b. In various embodiments, the cover layer 901 may vary according to a position where the first portion ① of the electromagnetic induction panel 400 is disposed on the second layer 52 of FIG. 5 . For example, when the first part (①) of the electromagnetic induction panel 400 is positioned between the buffer pad 532 and the lower layer 533 of FIG. 5, the cover layer 901 is formed of a copper sheet 533b, or a lower layer 533 .

Referring to FIG. 9B , as another example, the electromagnetic induction panel 400 may include a plurality of openings 902 formed in the connection area 325 between the first portion (①) and the second portion (②). can The plurality of openings 902 may contribute to the flexibility of the connection region 325 between the first portion (①) and the second portion (②). The electromagnetic induction panel 400 may include a plurality of openings 902 in at least a portion of the plurality of layers in the connection region. The at least two or more layers may include a plurality of openings, and the plurality of openings formed in each layer may overlap each other and may have substantially the same size and shape. According to some embodiments, the size or shape of the plurality of openings formed in each layer may not be the same. The plurality of openings 902 may be disposed along a straight line, and in the embodiment of FIG. 9B , an omitted portion for securing or improving flexibility may be referred to as a line shape.

10 is a perspective view of the sensor module 1000 according to various embodiments.

The sensor module 1000 of FIG. 10 may be positioned in a recess formed on the rear surface of the display 201 to replace the sensor module 300 of FIG. 5 . Referring to FIG. 10 , in one embodiment, the sensor module 1000 may include a substrate (eg, a PCB or FPCB) 1060 on which at least one component related to a sensing operation is disposed. The substrate 1060 has a first side facing the first layer 51 of FIG. 5 (eg, see first side 561 of FIG. 5 ), and a second side 1062 facing away from the first side. ) (eg, see the second surface 562 of FIG. 5 ). According to one embodiment, the sensor module 1000 may include an arrangement 1002 of a third conductive pad 1001 positioned on a second side 1062 of a substrate 1060 .

11 is a plan view 1100 of a state in which the sensor module 1000 of FIG. 10 is coupled to the display 201 and the electromagnetic induction panel 400 according to various embodiments of the present disclosure. In FIG. 11 , the copper sheet 533b of FIG. 5 is omitted, and overlapping descriptions of some of the reference numerals in FIG. 11 will be omitted.

10 and 11 , in one embodiment, the third conductive pad 1001 disposed on the substrate 1060 of the sensor module 1000, when viewed from above of the electromagnetic induction panel 400 (eg, the z-axis direction), at least partially exposed through the first slit portion 611 of the slit 610 between the first conductive pad 641 and the second conductive pad 642 of the electromagnetic induction panel 400 . . 11 shows an arrangement 1102 of a pad structure 1101 in which a first conductive pad 641 , a second conductive pad 642 , and a third conductive pad 1001 are aligned.

A conductive bonding member (eg, the conductive bonding member 570 of FIG. 5 ) may be disposed in the pad structure 1101 to electrically connect the first conductive pad 641 and the second conductive pad 642 . The region 1003 (see FIG. 10 ) in which the third conductive pad 1001 and/or the arrangement 1002 of the third conductive pad 1001 is disposed is the first conductive pad 641 and the second conductive pad 642 . When connecting to the conductive bonding member, the connection process (eg, soldering) can be made possible without defects. The third conductive pad 1001 connects the first conductive pad 641 and the second conductive pad 642 positioned to be spaced apart from each other with the first slit portion 611 (refer to FIG. 6 ) interposed therebetween by a conductive bonding member without defects. It may be a dummy conductive pattern or a dummy conductive pad that contributes to connecting to . When the region 1003 (refer to FIG. 10) in which the arrangement 1002 of the third conductive pads 1001 is disposed is omitted, the first slit portion 611 is formed on the first conductive pad 641 and the second conductive pad ( 642) may be difficult to connect with the conductive bonding member or may lead to poor connection. The third conductive pad 1001 may also serve to guide the sensor module 300 to be correctly positioned in the recess 503 (refer to FIG. 5 ) formed on the rear surface of the display 201 . When the sensor module 300 is disposed at the correct position in the recess 503 , the first conductive pad 641 , the second conductive pad 642 , and the third conductive pad 1001 may be aligned with each other.

12 is a perspective view of the sensor module 300 and the support structure 1200 according to another embodiment.

Referring to FIG. 12 , in one embodiment, the support structure 1200 may be coupled to the substrate 560 of the sensor module 300 . For example, the substrate 560 may be a rectangular substrate, and the support structure 1200 may include a first support portion 1210 , a second support portion 1220 , or a third support portion 1230 . The first support 1210 may be coupled to a first side of the substrate 560 . The second support 1220 may extend from one end of the first support 1210 and be coupled to a second side of the substrate 560 perpendicular to the first side. The third support part 1230 may extend from the other end of the first support part 12100 and be coupled to a third side of the substrate 560 perpendicular to the first side. The second side and the third side are mutually According to an embodiment, the substrate 560 may be inserted into a groove formed in the support structure 1200 to be coupled to the support structure 1200. For example, the first side of the substrate 560 may be The second side of the substrate 560 is inserted into the groove formed in the second support 1220 , and the third side of the substrate 560 is inserted into the groove formed in the first support 1210 , and the third side of the substrate 560 is formed in the third support 1230 . According to another embodiment, the support structure 1200 may be implemented in a form coupled to the second surface 562 of the substrate 560 .

According to one embodiment, the support structure 1200 may include an arrangement 1202 of third conductive pads 1201 positioned on a first support 1210 .

13 is a plan view 1300 of a state in which the sensor module 300 and the support structure 1200 of FIG. 12 are coupled to the display 201 and the electromagnetic induction panel 400 according to various embodiments of the present disclosure. In FIG. 13 , the copper sheet 533b of FIG. 5 is omitted, and overlapping descriptions of some of the reference numerals in FIG. 13 will be omitted.

12 and 13 , in one embodiment, the first support portion 1210 of the support structure 1200 may be positioned to correspond to the first slit portion 611 of the electromagnetic induction panel 400 , and the first The slit part 611 may at least partially overlap. The second support portion 1220 of the support structure 1200 may be positioned to correspond to the second slit portion 612 of the electromagnetic induction panel 400 , and may at least partially overlap the second slit portion 612 . The third support portion 1230 of the support structure 1200 may be positioned to correspond to the third slit portion 613 of the electromagnetic induction panel 400 , and may at least partially overlap the third slit portion 613 . When viewed from above of the electromagnetic induction panel 400 (eg, when viewed in the z-axis direction), the third conductive pad 1201 is at least partially positioned between the first conductive pad 641 and the second conductive pad 642 . can 13 shows an arrangement 1302 of a pad structure 1301 in which a first conductive pad 641 , a second conductive pad 642 , and a third conductive pad 1201 are aligned. The first support 1210 (see FIG. 12 ) on which the third conductive pad 1201 and/or the arrangement 1202 of the third conductive pads 1201 is disposed is the first conductive pad 641 and the second conductive pad ( 642) may contribute to the connection process (eg, soldering) without defects when connecting the conductive bonding member. The third conductive pad 1201 connects the first conductive pad 641 and the second conductive pad 642 positioned to be spaced apart from each other with the first slit portion 611 (refer to FIG. 6 ) interposed therebetween by a conductive bonding member without defects. It may be a dummy conductive pattern or a dummy conductive pad that contributes to connect the . The third conductive pad 1201 may also serve to guide the sensor module 300 to be accurately positioned in the recess 503 (refer to FIG. 5 ) formed on the rear surface of the display 201 . When the sensor module 300 is disposed at the correct position in the recess 503 , the first conductive pad 641 , the second conductive pad 642 , and the third conductive pad 1201 may be aligned with each other.

According to an embodiment, the support structure 1200 may serve to guide the sensor module 300 to be placed in an accurate position in the recess 503 (refer to FIG. 5 ) formed on the rear surface of the display 201 . there is. When the sensor module 300 is disposed at the correct position of the recess 503 , the first support part 1210 corresponds to the first slit part 611 , and the second support part 1220 corresponds to the second slit part 612 . Corresponding to , and the third support part 1230 may be positioned to correspond to the third slit part 613 . Accordingly, the first conductive pad 641 , the second conductive pad 642 , and the third conductive pad 1001 may be aligned with each other.

According to one embodiment, the first support 1210 is the second part (②) of the electromagnetic induction panel 400 when viewed from above of the electromagnetic induction panel 400 in a closed state (eg, when viewed in the z-axis direction) It may not overlap the electromagnetic induction panel 400 . The second support 1220 may also not overlap the electromagnetic induction panel 400 . The third support 1230 may also not overlap the electromagnetic induction panel 400 .

According to some embodiments, the support structure 1200 is configured to provide electromagnetic induction panel 400 when viewed from above (eg, in the z-axis direction) with the second portion ② of the electromagnetic induction panel 400 closed. It may partially overlap with the induction panel 400 . For example, the support structure 1200 may be expanded such that the second portion ② of the electromagnetic induction panel 400 partially overlaps the support structure 1200 like an imaginary line indicated by reference numeral '1304'. In this case, in various embodiments, the second portion (②) overlapping the support structure 1200 may be located on the step surface formed in the support structure 1200 . The stepped surface may also serve to guide the sensor module 300 to be accurately positioned in the recess 503 (refer to FIG. 5 ) formed on the rear surface of the display 201 . In addition, the stepped surface may reduce a height difference between the first conductive pad 641 and the third conductive pad 1201 . For another example, the support structure 1200 may be extended such that the first portion ① of the electromagnetic induction panel 400 partially overlaps the support structure 1200 , and in various embodiments, the support structure 1200 and The overlapping first portion (①) may be located on the step surface formed in the support structure 1200 .

According to some embodiments, the second support 612 and/or the third support 613 may be omitted.

14 is a perspective view of the sensor module 300 , the first support structure 1410 , and the second support structure 1420 according to another exemplary embodiment.

Referring to FIG. 14 , in an embodiment, the first support structure 1410 may be coupled to the substrate 560 of the sensor module 300 . The first support structure 1410 may be substantially the support structure 1200 of FIG. 12 . For example, the first support structure 1410 may include a first support portion 1411 (eg, the first support portion 1210 of FIG. 12 ) coupled to the first side of the substrate 560 of the sensor module 300 , a second support portion 1412 (eg, the second support portion 1220 of FIG. 12 ) coupled to a second side perpendicular to the first side, and a third side perpendicular to the first side and parallel to the second side; A combined third support part 1413 (eg, the third support part 1230 of FIG. 12 ) may be included. The first support structure 1410 includes an arrangement 1402 of third conductive pads 1401 positioned on the first support 1411 (eg, the arrangement 1202 of the third conductive pads 1201 in FIG. 12 ). can do. According to an embodiment, the second support structure 1420 may be disposed on the second surface 562 of the substrate 560 of the sensor module 300 . According to some embodiments, the second support structure 1420 may be implemented to have a groove into which the fourth side of the substrate 560 of the sensor module 300 is inserted. The second support structure 1420 is to be positioned on the second side 562 near a fourth side perpendicular to the second side and the third side and parallel to the first side of the substrate 560 of the sensor module 300 . can According to an embodiment, the first support structure 1410 and the second support structure 1420 are viewed from above the first surface 561 (refer to FIG. 5 ) in order to secure sensing performance and reduce deterioration in sensing performance. It may not overlap with a sensing region (eg, an ultrasonic sensing region) of the sensor module 300 .

15 is a state in which the sensor module 300 , the first support structure 1410 , and the second support structure 1420 of FIG. 14 are coupled to the display 201 and the electromagnetic induction panel 400 according to various embodiments. It is a plan view (1500) about. In FIG. 15 , the copper sheet 533b of FIG. 5 is omitted, and overlapping descriptions of some of the reference numerals in FIG. 15 will be omitted.

14 and 15 , in one embodiment, the first support portion 1411 of the first support structure 1410 may be positioned to correspond to the first slit portion 611 of the electromagnetic induction panel 400 . The second support portion 1411 of the first support structure 1410 may be positioned to correspond to the second slit portion 612 of the electromagnetic induction panel 400 . The third support portion 1413 of the first support structure 1410 may be positioned to correspond to the third slit portion 613 of the electromagnetic induction panel 400 . 14 shows an arrangement 1502 of a pad structure 1501 in which a first conductive pad 641 , a second conductive pad 642 , and a third conductive pad 1401 are aligned. The first support portion 1210 (see FIG. 12 ) on which the third conductive pad 1401 and/or the arrangement 1402 of the third conductive pads 1401 is disposed is the first conductive pad 641 and the second conductive pad ( 642) may contribute to the connection process (eg, soldering) without defects when connecting the conductive bonding member. As described for the support structure 1200 of FIG. 12 , the first support structure 1410 is a recess 503 (refer to FIG. 5 ) formed on the rear surface of the display 201 , in which the sensor module 300 is precisely positioned. It can also serve as a guide so that it can be placed in When the sensor module 300 is disposed at the correct position in the recess 503 , the first conductive pad 641 , the second conductive pad 642 , and the third conductive pad 1401 may be aligned with each other.

According to one embodiment, the second support structure 1420 is an air gap between the second part ② of the electromagnetic induction panel 400 and the sensor module 300 (eg, see air gap G in FIG. 5 ). contribute to its formation and maintenance. The second support structure 1420 may prevent the second part (②) of the electromagnetic induction panel 400 from sagging toward the sensor module 300 . When the sensor module 300 includes an ultrasonic sensor, an air gap between the sensor module 300 and the second part (②) of the electromagnetic induction panel 400 is formed and maintained by the second support structure 1420 , The performance of an ultrasonic sensor (eg, an ultrasonic fingerprint sensor) may be secured. The first support structure 1410 may also contribute to forming and maintaining an air gap between the second portion ② of the electromagnetic induction panel 400 and the sensor module 300 . In various embodiments, without being limited to the embodiment of FIG. 15 , the first support structure 1410 may be expanded such that the second portion ② of the electromagnetic induction panel 400 partially overlaps the first support structure 1410 . can

16 illustrates a cross-sectional structure 1600 of an assembly including a first module 1610 , a second module 1620 , and a flexible printed circuit board 1630 in accordance with various embodiments.

Referring to FIG. 16 , in one embodiment, the second module 1620 may be positioned between the first module 1610 and the flexible printed circuit board 1630 . The flexible printed circuit board 1630 may include a first portion 1631 and a second portion 1632 extending from the first portion 1631 . The first portion 1631 may not substantially overlap the second module 1620 when viewed from the top of the first module 1610 (eg, viewed in the -z axis direction). The second portion 1632 may at least partially cover the second module 1620 . After opening the space 1660 for arranging the second module 1620 by bending the second part 1632 like an imaginary line indicated by the reference numeral '1609', the second module 1620 is placed in the space 1660. can be placed. After the second module 1620 is disposed in the space 1660 , the second portion 1632 may be positioned to cover the second module 1620 . A conductive bonding member 1640 (eg, solder) is applied across a slit 1650 between the first portion 1631 and the second portion 1632 to the first portion 1631 and the second portion 1632 . can be electrically connected. According to various embodiments, the first module 1610 may include a recess (eg, see recess 503 in FIG. 5 ) formed in the back surface (eg, the side facing toward the flexible printed circuit board 1630), The space may include at least a part of the recess.

According to various embodiments, an assembly including a cross-sectional structure 1600 according to the embodiment of FIG. 16 includes a display 201 , a sensor module 300 , and an electromagnetic induction panel 400 according to the embodiment of FIG. 5 . It can be implemented in at least some of the same manner as the assembly. The first module 1610 may include, for example, at least a portion of the display 201 of FIG. 5 . The second module 1620 may include, for example, the sensor module 300 of FIG. 5 . The flexible printed circuit board 1630 may include, for example, the electromagnetic induction panel 400 of FIG. 5 . The conductive bonding member 1640 may include, for example, the conductive bonding member 570 of FIG. 5 . The slit 1650 may include, for example, the slit 1610 of FIG. 5 or 6 . 16 shows the arrangement of the second module 1620 and the flexible printed circuit board when the second module 1620 and the flexible printed circuit board 1630 are overlapped with each other with respect to the first module 1610. can be done easily

17 is a perspective view of a front surface of an electronic device 1700 according to various embodiments of the present disclosure. 18 is a perspective view of a rear surface of the body 1710 of FIG. 17 according to various embodiments.

17 and 18 , an electronic device 1700 may be, for example, the electronic device 101 of FIG. 1 or may include at least some of components of the electronic device 101 of FIG. 1 .

The electronic device 1700 is a wearable electronic device, and may be, for example, a watch-type electronic device. The electronic device 1700 includes a main body 1710 in which various electronic components such as a processor, a memory, a display, and a wireless power transmitting and/or receiving device are mounted, and a first strap connected to the main body 1710 (or It may include a first watch strap 1720 and a second strap (or second watch strap) 1730. The first strap 1720 and the second strap 1730 include the electronic device 1700 ) is a portion surrounding the user's wrist when worn on the user's wrist and may be connected to both sides of the body 1710. The first strap 1720 and the second strap 1730 are, for example, leather, rubber It may be formed of a non-metal material such as, or formed of various metal materials such as stainless steel, etc. The first strap 1720 includes a first end (not shown) connected to the body 1710 and a second end extending from the first end. It may include an end (not shown), and may include a plurality of fasteners 1721 arranged from the first end to the second end. The second strap 1730 may include a third It may include an end (not shown) and a fourth end (not shown) extending from the third end, at which a fastening device 1731 may be disposed, for example, a first strap 1720 . The electronic device 1700 can be worn on the user's wrist through a method of fixing the fastening device 1731 to one of the plurality of fasteners 1721 after passing through the fastening device 1731. Various embodiments According to (not shown), various other connection methods for wearing on the user's wrist may be implemented in the first strap 1720 and the second strap 1730. According to various embodiments (not shown), the first The strap 1720 and the second strap 1730 are connected, and a strap adjustable in size to fit the wrist may be provided.

According to an embodiment, the body 1710 may include a housing 1740 . The housing 1740 may include a front surface 1740A, a rear surface 1740B, and a side surface 1740C that at least partially encloses a space between the front surface 1740A and the rear surface 1740B. In various embodiments (not shown), housing 1740 may refer to a structure that forms part of a front surface 1740A, a rear surface 1740B, and a side surface 1740C. According to one embodiment, the front surface 1740A may be formed by a front cover 1741 at least a portion of which is substantially transparent (eg, a glass plate including various coating layers, or a polymer plate). The back side 1740B may be formed by a substantially opaque back cover 1742 ). The back cover 1742 may be formed of, for example, a ceramic, a polymer, or a metal (eg, aluminum, stainless steel (STS), or magnesium). The side surface 1740C may be formed by a side member (or a side bezel structure) 1743 coupled to the front cover 1741 and the rear cover 1742 . According to one embodiment, the front cover 1741 may be circular, and the side member 1743 may be a rounded annular shape surrounding the edge of the front cover 241 . According to various embodiments (not shown), the side member 1743 may be implemented in various other shapes such as a rectangle according to the front cover 1741 .

According to an embodiment, the main body 1710 may include a display (eg, the display module 160 of FIG. 1 ). The display may be visible, for example, through a substantial portion of the front cover 1741 . According to various embodiments, the display may be disposed adjacent to or coupled to a touch sensing circuit and/or a pressure sensor capable of measuring the intensity (pressure) of the touch.

According to various embodiments, the main body 1710 may include at least some of the components shown in FIG. 4 with different shapes. According to one embodiment, the body 1710 includes an assembly including at least a portion of the cross-sectional structure 500 according to the embodiment of FIG. 5 , or an assembly including the cross-sectional structure 1600 according to the embodiment of FIG. 16 . can do.

According to an embodiment of the present invention, the electronic device (eg, the electronic device 200 of FIG. 2 ) includes a first layer (eg, the first layer 51 of FIG. 5 ) including a plurality of pixels, and the A display (eg, in FIG. 5 ) coupled to the back side of the first layer and including a second layer (eg, second layer 52 in FIG. 5 ) including an opening (eg, first opening 501 in FIG. 5 ). display 201). The electronic device may include a module (eg, the sensor module 300 of FIG. 5 ) positioned in the opening. The electronic device may include a flexible printed circuit board (eg, the electromagnetic induction panel 400 of FIG. 5 ). The electromagnetic induction panel includes at least a first part included in the second layer around the opening (eg, the first part (①) in FIG. 5), and the module extending from the first part and disposed in the opening. A second part (eg, the second part (②) of FIG. 5 ) may be included to partially cover it. The electronic device includes a conductive bonding member that electrically connects the first part and the second part across a slit between the first part and the second part (eg, the slit 610 of FIG. 5 or 6 ). For example, the conductive bonding member 570 of FIG. 5) may be included.

According to an embodiment of the present invention, the slit (eg, the slit 610 of FIG. 6 ) includes a first slit part (eg, the first slit part 611 of FIG. 6 ) extending in the first direction, the second A second slit portion (eg, the second slit portion 612 of FIG. 6 ) extending in a second direction orthogonal to the first direction from one end of the first slit portion, and the second slit portion from the other end of the first slit portion A third slit portion extending in two directions (eg, the third slit portion 613 of FIG. 6 ) may be included.

According to an embodiment of the present invention, the flexible printed circuit board (eg, the electromagnetic induction panel 400 of FIG. 6 ) is a first positioned in the first part (eg, the first part (①) of FIG. 6 ). A conductive pad (eg, the first conductive pad 641 in FIG. 6 ), and a second conductive pad (eg, the second conductive pad 641 in FIG. 6 ) positioned on the second part (eg, the second part (②) in FIG. 6 ) conductive pad 642). The first conductive pad and the second conductive pad may be aligned with the first slit part (eg, the first slit part 611 of FIG. 6 ) interposed therebetween. The conductive bonding member (eg, the conductive bonding member 570 of FIG. 7 ) may electrically connect the first conductive pad and the second conductive pad.

According to an embodiment of the present invention, the module (eg, the sensor module 300 of FIG. 5 ) may include a substrate (eg, the substrate 560 of FIG. 5 ). The substrate includes a first side (eg, first side 561 of FIG. 5 ) facing the first layer (eg, first layer 51 of FIG. 5 ) and the flexible printed circuit board (eg, FIG. 5 ) and a second surface (eg, the second surface 562 of FIG. 5 ) facing the second part (②) of the electromagnetic induction panel 400 of FIG.

According to an embodiment of the present invention, the substrate (eg, the substrate 1060 of FIG. 10 ) is a third conductive pad (eg, the second side 1062 of FIG. 10 ) positioned on the second side (eg, the second side 1062 of FIG. 10 ). The third conductive pad 1001 of FIG. 10) may be included. The third conductive pad overlaps the first slit portion (eg, the first slit portion 611 of 6) when viewed from above the flexible printed circuit board, and the first conductive pad (eg, the first slit portion 611 of FIG. 11 ) At least a portion may be positioned between the first conductive pad 641) and the second conductive pad (eg, the second conductive pad 642 of FIG. 11 ).

According to an embodiment of the present invention, the electronic device (eg, the electronic device 200 of FIG. 2 ) has a support structure (eg, the support of FIG. 12 ) coupled to the substrate (eg, the substrate 560 of FIG. 12 ). structure 1200). The third conductive pad (eg, the third conductive pad 1201 of FIG. 12 ) may be positioned on the support structure. The third conductive pad includes the first slit portion (eg, the first slit portion 611 of FIG. 13 ) when viewed from above of the flexible printed circuit board (eg, the electromagnetic induction panel 400 of FIG. 13 ); It may overlap and be positioned at least partially between the first conductive pad (eg, the first conductive pad 641 of FIG. 13 ) and the second conductive pad (eg, the second conductive pad 642 of FIG. 13 ).

According to an embodiment of the present invention, the support structure (eg, the support structure 1200 of FIG. 12 ) is a first support part on which the third conductive pad (eg, the third conductive pad 1201 of FIG. 12 ) is located. (eg, the first support part 1210 of FIG. 12 ), and the first support part may at least partially overlap the first slit part (eg, the first slit part 611 of FIG. 13 ). . The support structure may include a second support part (eg, the second support part 1220 of FIG. 12 ) that at least partially overlaps the second slit part (eg, the second slit part 612 of FIG. 13 ), The second support part may extend from one end of the first support part. The support structure may include a third support part (eg, the third support part 1230 of FIG. 12 ) that at least partially overlaps the third slit part (eg, the third slit part 613 of FIG. 13 ), The third support part may extend from the other end of the first support part.

According to an embodiment of the present invention, the electronic device (eg, the electronic device 200 of FIG. 2 ) includes the substrate (eg, the substrate 560 of FIG. 14 ) and the flexible printed circuit board (eg, the electronic device 200 of FIG. 15 ). The electromagnetic induction panel 400 may further include a support structure coupled to the substrate (eg, the second support structure 1420 of FIG. 14 ).

According to an embodiment of the present invention, the flexible printed circuit board (eg, the electromagnetic induction panel 400 of FIG. 9 ) includes the first part (eg, the first part (①) of FIG. 9 ) and the second part A plurality of openings (eg, a plurality of openings 901 in FIG. 9 ) formed in a connection region (eg, a connection region 325 in FIG. 9 ) between (eg, the second part (②) of FIG. 9 ) may include

According to an embodiment of the present invention, the flexible printed circuit board may include an electromagnetic induction panel (eg, electromagnetic induction panel 400 of FIG. 5 ).

According to an embodiment of the present invention, the module may include a sensor module (eg, the sensor module 300 of FIG. 5 ).

According to an embodiment of the present invention, the sensor module (eg, the sensor module 300 of FIG. 5 ) may include a fingerprint sensor.

According to an embodiment of the present invention, the fingerprint sensor may be an ultrasonic fingerprint sensor. An air gap (eg, air gap G in FIG. 5 ) is formed between the second part (eg, the second part (②) of FIG. 5 ) and the sensor module (eg, the sensor module 300 of FIG. 5 ). may be interposed.

According to another embodiment of the present invention, the module may include a camera module or an audio module.

According to an embodiment of the present invention, the first part (eg, the first part (①) of FIG. 5 ) includes a plurality of layers included in the second layer (eg, the second layer 52 of FIG. 5 ). It may be located between two middle floors.

According to an embodiment of the present invention, the second layer may include a light blocking layer (eg, light blocking layer 531 in FIG. 5 ), a buffer layer (eg, buffer layer 532 in FIG. 5 ), and a composite sheet (eg, FIG. 5 ). 5 composite sheet 533a), and a copper sheet (eg, copper sheet 533b of FIG. 5 ). The first portion (eg, the first portion (①) of FIG. 5 ) may be located between the buffer layer and the composite sheet, or between the composite sheet and the copper sheet.

According to various embodiments of the present disclosure, an electronic device includes a first module (eg, the first module 1610 of FIG. 16 ), a flexible printed circuit board (eg, FIG. 16 ) positioned at least partially overlapping a rear surface of the first module 16 ), and a second module (eg, the second module 1620 of FIG. 16 ) positioned between the first module and the flexible printed circuit board. The flexible printed circuit board includes a first portion that does not overlap the second module (eg, the first portion 1631 of FIG. 16 ), and a second portion extending from the first portion to at least partially cover the second module. part (eg, the second part 1632 of FIG. 16 ). A conductive bonding member (eg, the conductive bonding member 1640 of FIG. 16 ) is disposed across the slit between the first portion and the second portion (eg, the slit 1650 of FIG. 16 ) to cross the first portion and the second portion. The two parts can be electrically connected.

According to various embodiments of the present disclosure, the second module (eg, the second module 1620 of FIG. 16 ) has a recess formed in the rear surface of the first module (eg, the first module 1610 of FIG. 16 ) It may be located at least in part.

According to various embodiments of the present disclosure, the first module (eg, the first module 1610 of FIG. 16 ) may include a display.

According to various embodiments of the present disclosure, the second module (eg, the second module 1620 of FIG. 16 ) may include at least one of a sensor module, a camera module, and an audio module.

The embodiments of the present invention disclosed in the present specification and drawings are merely provided for specific examples in order to easily explain the technical contents according to the embodiments of the present invention and help the understanding of the embodiments of the present invention, and limit the scope of the embodiments of the present invention It's not what you want to do. Therefore, in the scope of various embodiments of the present invention, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical ideas of various embodiments of the present invention should be interpreted as being included in the scope of various embodiments of the present invention. .

500: cross-section structure
202: front plate
201: display
510: display panel
520: base film
530: lower panel
540: optical layer
550: optically transparent adhesive member
501: first opening
300: sensor module
400: electromagnetic induction panel
①: Part 1
②: Part 2
570: conductive bonding member
310: first support member
340: battery
502: second opening

Claims (20)

In an electronic device,
a display comprising a first layer comprising a plurality of pixels, and a second layer coupled to a rear surface of the first layer and comprising an opening;
a module located in the opening;
a flexible printed circuit board including a first portion included in the second layer around the opening, and a second portion extending from the first portion to at least partially cover the module disposed in the opening; and
and a conductive bonding member electrically connecting the first portion and the second portion across a slit between the first portion and the second portion.
The method of claim 1,
The slit is
a first slit portion extending in a first direction;
a second slit portion extending from one end of the first slit portion in a second direction orthogonal to the first direction; and
and a third slit part extending in the second direction from the other end of the first slit part.
3. The method of claim 2,
the flexible printed circuit board comprising a first conductive pad positioned in the first portion and a second conductive pad positioned in the second portion;
The first conductive pad and the second conductive pad are aligned with the first slit portion therebetween,
The conductive bonding member may electrically connect the first conductive pad and the second conductive pad to each other.
4. The method of claim 3,
The module is
and a substrate comprising a first side facing the first layer and a second side facing the second portion of the flexible printed circuit board.
5. The method of claim 4,
The substrate includes a third conductive pad positioned on the second surface;
The third conductive pad,
When viewed from above of the flexible printed circuit board, the electronic device overlaps the first slit portion and is positioned at least partially between the first conductive pad and the second conductive pad.
5. The method of claim 4,
and a support structure coupled to the substrate and including a third conductive pad,
The third conductive pad,
When viewed from above of the flexible printed circuit board, the electronic device overlaps the first slit portion and is positioned at least partially between the first conductive pad and the second conductive pad.
7. The method of claim 6,
The support structure is
a first support portion overlapping at least partially with the first slit portion and on which the third conductive pad is positioned;
a second support portion extending from one end of the first support portion and at least partially overlapping the second slit portion; and
and a third support part extending from the other end of the first support part and at least partially overlapping the third slit part.
5. The method of claim 4,
and a support structure coupled to the substrate between the substrate and the flexible printed circuit board.
The method of claim 1,
The flexible printed circuit board,
and a plurality of openings formed in a connection region between the first part and the second part.
The method of claim 1,
The flexible printed circuit board,
An electronic device comprising an electromagnetic induction panel.
The method of claim 1,
The module is
An electronic device comprising a sensor module.
12. The method of claim 11,
The sensor module is
An electronic device comprising a fingerprint sensor.
13. The method of claim 12,
The fingerprint sensor is an ultrasonic fingerprint sensor,
An air gap is interposed between the second part and the sensor module.
The method of claim 1,
The module is
An electronic device comprising a camera module or an audio module.
The method of claim 1,
The first part is
An electronic device positioned between two of the plurality of layers included in the second layer.
16. The method of claim 15,
The second layer is
a light-shielding layer, a buffer layer, a composite sheet, and a copper sheet;
The first part is
An electronic device positioned between the buffer layer and the composite sheet, or between the composite sheet and the copper sheet.
In an electronic device,
a first module;
a flexible printed circuit board positioned at least partially overlapping a rear surface of the first module; and
a second module positioned between the first module and the flexible printed circuit board;
The flexible printed circuit board,
a first portion that does not overlap the second module; and
a second portion extending from the first portion and covering at least a portion of the second module;
The conductive bonding member is
an electronic device electrically connecting the first portion and the second portion across a slit between the first portion and the second portion.
18. The method of claim 17,
The second module is
The electronic device is at least partially positioned in a recess formed on a rear surface of the first module.
18. The method of claim 17,
The first module is
An electronic device comprising a display.
20. The method of claim 19,
The second module is
An electronic device comprising at least one of a sensor module, a camera module, and an audio module.

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