KR20220033876A - Electronic component device - Google Patents

Abstract

One of several objects of the present invention is to provide an electronic component device capable of effectively dissipating heat generated from an electronic component. The present invention relates to an electronic component device comprising: a first wiring substrate including a first wiring board; a second wiring substrate including a second wiring board; an electronic component disposed between the first and second wiring boards and having a first surface facing the first wiring board and a second surface facing the second wiring board; and a heat dissipation member connecting the second surface of the electronic component and at least a portion of each of the second wiring board to each other. The heat dissipation member includes a first conductor part connected to the second surface of the electronic component, and a second conductor part disposed on the first conductor portion and connected to the second wiring layer. The first and second conductor parts include different materials.

Description

Electronic component device {ELECTRONIC COMPONENT DEVICE}

The present disclosure relates to an electronic component device.

As mobile products, such as smartphones, are gradually becoming lighter, thinner and smaller, the quality is required to be upgraded, and accordingly, devices including an application processor (AP) or controller are also becoming higher specifications, so the heat dissipation efficiency and Improvements related to the stable supply of power due to an increase in impedance are required.

One of several objects of the present disclosure is to provide an electronic component device capable of effectively dissipating heat generated from the electronic component.

Another object of the present disclosure is to provide an electronic component device capable of supplying stable power by reducing the impedance of power.

One of the various solutions proposed through the present disclosure is to connect a heat dissipation member composed of a plurality of conductor parts including different materials to the back surface of the electronic component to be connected to a wiring layer of a wiring board disposed on the electronic component.

Another of the various solutions proposed through the present disclosure is to extend the ground by connecting the above-described heat dissipating member to the ground of the wiring layer of the wiring board.

For example, the electronic component device according to an example is disposed between a first wiring board including a first wiring layer, a second wiring board including a second wiring layer, and the first and second wiring boards, and the first wiring board An electronic component having a first surface facing the first surface and a second surface facing the second wiring board, and a heat dissipation member connecting the second surface of the electronic component and at least a portion of each of the second wiring layer to each other, The heat dissipation member includes a first conductor portion connected to the second surface of the electronic component and a second conductor portion disposed on the first conductor portion and connected to the second wiring layer, wherein the first and second conductor portions are different from each other. It may contain a substance.

As one of several effects of the present disclosure, it is possible to provide an electronic component device capable of effectively dissipating heat generated from the electronic component.

As another one of several effects of the present disclosure, an electronic component device capable of supplying stable power by reducing the impedance of power may be provided.

1 is a block diagram schematically showing an example of an electronic device system.
2 is a perspective view schematically illustrating an example of an electronic device.
3 is a cross-sectional view schematically illustrating an example of an electronic component device.
4 is a process diagram schematically illustrating an example of manufacturing the electronic component device of FIG. 3 .
5 is a cross-sectional view schematically illustrating another example of an electronic component device.
6 is a process diagram schematically illustrating an example of manufacturing the electronic component device of FIG. 5 .
7 is a cross-sectional view schematically illustrating another example of an electronic component device.
8 is a process diagram schematically illustrating an example of manufacturing the electronic component device of FIG. 7 .
9 is a cross-sectional view schematically illustrating another example of an electronic component device.
10 is a process diagram schematically illustrating an example of manufacturing the electronic component device of FIG. 9 .

Hereinafter, the present disclosure will be described with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be exaggerated or reduced for clearer description.

1 is a block diagram schematically showing an example of an electronic device system.

Referring to the drawings, the electronic device 1000 accommodates the main board 1010 . A chip-related component 1020 , a network-related component 1030 , and other components 1040 are physically and/or electrically connected to the main board 1010 . These are also combined with other electronic components to be described later to form various signal lines 1090 .

The chip-related component 1020 includes a memory chip such as a volatile memory (eg, DRAM), a non-volatile memory (eg, ROM), and a flash memory; application processor chips such as a central processor (eg, CPU), a graphics processor (eg, GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; Logic chips such as analog-to-digital converters and application-specific ICs (ASICs) are included. However, the present invention is not limited thereto, and other types of chip-related components may be included in addition to these chips. Also, these chip related parts may be combined with each other. The chip-related component 1020 may be in the form of a package including the above-described chip.

The network-related components 1030 include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM. , GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated thereafter, including, but not limited to, many other wireless or wired protocols. Any of the standards or protocols may be included. In addition, the network-related component 1030 may be combined with the chip-related component 1020 to be provided in the form of a package.

The other components 1040 include a high frequency inductor, a ferrite inductor, a power inductor, ferrite beads, low temperature co-firing ceramics (LTCC), an electro magnetic interference (EMI) filter, a multi-layer ceramic condenser (MLCC), and the like. . However, the present invention is not limited thereto, and in addition to this, a passive element in the form of a chip component used for various other purposes may be included. In addition, the other component 1040 may be provided in the form of a package in combination with the chip-related component 1020 and/or the network-related component 1030 .

Depending on the type of the electronic device 1000 , the electronic device 1000 may include other electronic components that may or may not be physically and/or electrically connected to the main board 1010 . Examples of other electronic components include a camera module 1050 , an antenna module 1060 , a display 1070 , and a battery 1080 . However, the present invention is not limited thereto, and an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (eg, a hard disk drive), a compact disk (CD), a digital versatile disk (DVD), etc. may be In addition to this, it goes without saying that other electronic components used for various purposes may be included depending on the type of the electronic device 1000 .

The electronic device 1000 includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer ( computer), monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, and the like. However, the present invention is not limited thereto, and may be any other electronic device that processes data in addition to these.

2 is a perspective view schematically illustrating an example of an electronic device.

Referring to the drawings, the electronic device may be, for example, a smartphone 1100 . A motherboard 1110 is accommodated inside the smartphone 1100 , and various electronic component devices 1120 are physically and/or electrically connected to the motherboard 1110 . In addition, a camera module 1130 and/or a speaker 1140 are accommodated therein. Some of the electronic component devices 1120 may be the aforementioned chip-related components 1121 , but are not limited thereto. On the other hand, the electronic device is not necessarily limited to the smart phone 1100, and of course, it may be another electronic device as described above.

3 is a cross-sectional view schematically illustrating an example of an electronic component device.

Referring to the drawings, an electronic component device 100A according to an example includes a first wiring board 110 including a first wiring layer 112 , a second wiring board 120 including a second wiring layer 122 , An electronic component 130 disposed between the first and second wiring boards 110 and 120 and having a first surface facing the first wiring board 110 and a second surface facing the second wiring board 120; and a heat dissipation member 140 connecting at least a portion of each of the second surface of the electronic component 130 and the second wiring layer 122 to each other, and each of the first surface and the first wiring layer 112 of the electronic component 130 . At least each of the first and second wiring layers 112 and 122 disposed around the connecting member 150 for connecting at least a portion of the electronic component 130 between the first and second wiring boards 110 and 120 and An encapsulant 170 that fills the gaps between the electrical connection structure 160 and the first and second wiring boards 110 and 120 and covers at least a portion of each of the electronic component 130 and the electrical connection structure 160 , respectively. , and/or may further include a connection terminal 180 disposed below the first wiring substrate 110 and connected to the first wiring layer 112 .

Meanwhile, the heat dissipation member 140 includes a first conductor part 141a connected to the second surface of the electronic component 130 and a second conductor part connected to the first conductor part 141a and connected to the second wiring layer 122 ( 142), and the first and second conductor parts 141a and 142 include different materials. Specifically, in one example, the heat dissipation member 140 includes a plurality of first conductor parts 141a each including a conductive resin layer, and a plurality of second conductor parts 142 each including a metal post, and The first conductor part 141a and the plurality of second conductor parts 142 are respectively connected to each other to provide a plurality of heat transfer paths between the second surface of the electronic component 130 and the second wiring layer 122 .

As described above, in the electronic component device 100A according to an example, the heat dissipation member 140 including the plurality of first and second conductor portions 141a and 142 is brought into contact with the back surface of the electronic component 130 to contact the second wiring board. Since it is connected to the second wiring layer 122 of 120 , heat generated from the electronic component 130 can be effectively dissipated. In this case, the second conductor part 142 may be a metal post, for example, a copper post, so that the heat dissipation efficiency can be further maximized, and the first conductor part 141a is formed of a conductive resin layer, for example, , a layer including a binder resin and conductive particles may reduce contact resistance with the electronic component 130 .

In addition, in the electronic component device 100A according to an example, the second wiring layer 122 may include a ground, and the heat dissipation member 140 including the plurality of first and second conductor parts 141a and 142 is the second wiring layer 122 . Since it may be electrically connected to the ground of the second wiring layer 122 , the power impedance may be reduced by extending the ground in the device, and as a result, stable power supply may be possible. At this time, the first wiring layer 112 may also include a ground, and the ground of the first wiring layer 112 and the ground of the second wiring layer 122 may be electrically connected to each other through the electrical connection structure 160, As a result, the heat dissipation member 140 including the plurality of first and second conductors 141a and 142 may also be electrically connected to the ground of the first wiring layer 112 . Accordingly, it is possible to further maximize the effect of a stable power supply.

Hereinafter, each configuration included in the electronic component device 100A according to an example will be described in more detail with reference to the drawings.

The first wiring substrate 110 includes a first insulating layer 111 , a first wiring layer 112 , and a first wiring via layer 113 . Each of the first insulating layer 111 , the first wiring layer 112 , and the first wiring via layer 113 may be a plurality of layers. The first wiring substrate 110 may be a coreless type substrate, but is not limited thereto. For example, the first wiring substrate 110 may be a core-type substrate having a core layer in the center.

An insulating material may be used as the material of the first insulating layer 111 . As the insulating material, a thermosetting resin such as an epoxy resin or a thermoplastic resin such as polyimide, and inorganic fillers such as silica and/or glass fiber to these resins Those containing reinforcing materials such as these may be used. For example, as a material of the first insulating layer 111, an insulating material of PPG (Prepreg), CCL (Copper Clad Laminate), Ajinomoto Build-up Film (ABF), PID (Photo Image-able Dielectric), etc. may be used. can When the first insulating layer 111 is a plurality of layers, their materials may be the same or different from each other. When the first insulating layer 111 is a plurality of layers, the boundary may be divided within the through portion 110H, but may not be divided.

A metal material may be used as the material of the first wiring layer 112 , and the metal material includes copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni). , lead (Pb), titanium (Ti), or an alloy thereof may be used. The first wiring layer 112 may perform various functions according to a design design. For example, it may include a ground pattern, a power pattern, a signal pattern, and the like. Here, the signal pattern includes various signals other than the ground pattern and the power pattern, for example, a data signal. Each of these patterns may have a line, plane, or pad shape. The first wiring layer 112 may be formed by a plating process such as AP (Additive Process), SAP (Semi AP), MSAP (Modified SAP), TT (Tenting), etc. As a result, each of the seed layer, which is an electroless plating layer, and these It may include an electrolytic plating layer formed based on the seed layer. Certain layers may further include copper foil.

A metal material may be used as a material of the first wiring via layer 113 , and as the metal material, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel ( Ni), lead (Pb), titanium (Ti), or an alloy thereof may be used. The first wiring via layer 113 passes through the first insulating layer 111 and electrically connects the first wiring layers 112 disposed on different layers. The first wiring via layer 113 may include a signal wiring via, a ground wiring via, and a power wiring via according to a design design. Each of the wiring vias of the first wiring via layer 113 may be completely filled with a metal material, or the metal material may be formed along the wall surface of the via hole. In the first wiring via layer 113 , the wiring via may have a tapered shape. The first wiring via layer 113 may be formed by a plating process, for example, AP, SAP, MSAP, TT, etc. As a result, the seed layer, which is an electroless plating layer, and an electrolysis formed based on the seed layer It may include a plating layer.

The second wiring substrate 120 includes a second insulating layer 121 , a second wiring layer 122 , and a second wiring via layer 123 . Each of the second insulating layer 121 , the second wiring layer 122 , and the second wiring via layer 123 may be a plurality of layers. The second wiring substrate 120 may be a coreless type substrate, but is not limited thereto. For example, the second wiring substrate 120 may be a core type substrate having a core layer in the center.

An insulating material may be used as the material of the second insulating layer 121, and as the insulating material, a thermosetting resin such as an epoxy resin or a thermoplastic resin such as polyimide, and inorganic fillers such as silica and/or glass fiber to these resins Those containing reinforcing materials such as these may be used. For example, as a material of the second insulating layer 121 , an insulating material such as PPG or CCL, ABF, or PID may be used. When the second insulating layer 121 is a plurality of layers, their materials may be the same or different from each other. When the second insulating layer 121 is a plurality of layers, the boundary may be clear or separated.

A metal material may be used as the material of the second wiring layer 122 , and the metal material includes copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni). , lead (Pb), titanium (Ti), or an alloy thereof may be used. The second wiring layer 122 may perform various functions according to a design design. For example, it may include a ground pattern, a power pattern, a signal pattern, and the like. Here, the signal pattern includes various signals other than the ground pattern and the power pattern, for example, a data signal. Each of these patterns may have a line, plane, or pad shape. The second wiring layer 122 may be formed by a plating process such as AP, SAP, MSAP, or TT, and as a result, may include a seed layer that is an electroless plating layer and an electrolytic plating layer formed based on the seed layer, respectively. Certain layers may further include copper foil.

A metal material may be used as a material of the second wiring via layer 123 , and as the metal material, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel ( Ni), lead (Pb), titanium (Ti), or an alloy thereof may be used. The second wiring via layer 123 passes through the second insulating layer 121 and electrically connects the second wiring layers 122 disposed on different layers. The second wiring via layer 123 may include a signal wiring via, a ground wiring via, and a power wiring via according to a design design. Each of the wiring vias of the second wiring via layer 123 may be completely filled with a metal material, or the metal material may be formed along the wall surface of the via hole. In the second wiring via layer 123 , the wiring via may have a tapered shape. The second wiring via layer 123 may be formed by a plating process, for example, AP, SAP, MSAP, TT, etc. As a result, the seed layer, which is an electroless plating layer, and an electrolysis formed based on the seed layer It may include a plating layer.

The electronic component 130 may be an IC (Integrated Circuit) in which hundreds to millions of devices are integrated in one chip. For example, the electronic component 130 includes a central processor (eg, CPU), a graphics processor (eg, GPU), a field programmable gate array (FPGA), a digital signal processor, an encryption processor, a microprocessor, a microcontroller, etc. It may be a processor chip, specifically, an application processor (AP), but is not limited thereto, and other volatile memory (eg, DRAM), non-volatile memory (eg, ROM), flash memory, etc., or analog - It may be a digital converter, or logic such as an ASIC (application-specific IC). However, the present invention is not limited thereto, and may be other known passive parts.

The heat dissipation member 140 includes a plurality of first conductor parts 141a each including a conductive resin layer and a plurality of second conductor parts 142 each including a metal post, and a plurality of first conductor parts 141a. ) and the plurality of second conductors 142 are respectively connected to each other to provide a plurality of heat transfer paths between the second surface of the electronic component 130 and the second wiring layer 122 . The conductive resin layer may include a binder resin and conductive particles. For example, it may be a layer in which metal particles such as silver particles are dispersed in an insulating resin such as an epoxy resin. The conductive resin layer may be formed by applying or coating a conductive paste including a binder resin and conductive particles. The metal post may be formed by metal plating. For example, it may be a copper post or the like. Each of the second conductor parts 142 may be thicker than each of the first conductor parts 141a. The heat dissipation member 140 may be electrically connected to the ground of the second wiring layer 122 , and may also be electrically connected to the ground of the first wiring layer 112 .

The connecting member 150 connects the electronic component 130 to the first wiring layer 112 of the first wiring board 110 . For example, the electronic component 130 may be disposed on the first wiring board 110 through the connection member 150 in the form of surface mounting. The connecting member 150 includes a plurality of third conductor parts 151 . Each of the plurality of third conductor parts 151 may be formed of tin (Sn), which is a low-melting-point metal, or an alloy including tin (Sn), for example, solder or the like.

The electrical connection structure 160 is disposed between the first and second wiring boards 110 and 120 to provide an electrical connection path therebetween. The electrical connection structure 160 may be in the form of a metal mass, for example, a copper core ball, as shown in the drawings. However, the present invention is not limited thereto, and may be in the form of a metal post or a frame in which a through-via is formed. There may be a plurality of electrical connection structures 160 , and each of them may be a signal connection path, a power connection path, or a ground connection path. At least one of the electrical connection structures 160 may be used as a heat dissipation path downward.

An insulating material may be used as the material of the encapsulant 170 , and a thermosetting resin such as an epoxy resin or a thermoplastic resin such as polyimide may be used as the insulating material. In addition, those in which inorganic fillers, such as silica, are contained in these resins can also be used. For example, ABF may be used as the material of the encapsulant 170 . However, the present invention is not limited thereto, and other types of EMC (Epoxy Molding Compound) may be used, and a photosensitive material such as PIE (Photo Image-able Dielectric) may be used.

The connection terminal 180 may physically and/or electrically connect the electronic component device 100A to the outside. For example, the electronic component device 100A may be mounted on a main board of an electronic device or another BGA (Ball Grid Array) board through this. The connection terminal 180 may be formed of tin (Sn), which is a low melting point metal, or an alloy containing tin (Sn), for example, solder, but this is only an example and the material is not particularly limited thereto. Each of the connection terminals 180 may be a land, a ball, a pin, or the like.

4 is a process diagram schematically illustrating an example of manufacturing the electronic component device of FIG. 3 .

Referring to the drawings, first, a first wiring board 110 is prepared, and the electronic component 130 is surface mounted on the first wiring board 110 using a connection member 150 . Next, the electrical connection structure 160 is disposed on the first wiring board 110 . Next, the second wiring board 120 is prepared, and the second wiring board 120 is disposed on the first wiring board 110 using the electrical connection structure 160 . At this time, the heat dissipation member 140 including the plurality of first conductor parts 141a and the plurality of second conductor parts 142 connected to each other is disposed on the second surface of the electronic component 130, and the second wiring board ( 120) is connected to it when it is placed. Next, the first and second wiring boards 110 and 120 are filled with an encapsulant 170 , and a connection terminal 180 and the like are formed. The electronic component device 100A according to an example may be manufactured through a series of processes, and other contents are substantially the same as those described above, and a detailed description thereof will be omitted.

5 is a cross-sectional view schematically illustrating another example of an electronic component device.

Referring to the drawings, in the electronic component device 100B according to another example, in the electronic component device 100A according to the above-described example, the heat dissipation member 140 includes one first conductor part 141b and a plurality of second conductive parts 141b. It includes two conductor parts 142 , and a plurality of second conductor parts 142 are respectively connected to one first conductor part 141b. In this case, one first conductor part 141b may include a conductive film, and each of the plurality of second conductor parts 142 may include a metal post. The conductive film may substantially entirely cover the second surface of the electronic component 130 . The conductive film may be one in which conductive particles are dispersed in an insulating film, for example, may be an anisotropic conductive film (ACF), but is not limited thereto. Other contents are substantially the same as those described above, and detailed descriptions thereof will be omitted.

6 is a process diagram schematically illustrating an example of manufacturing the electronic component device of FIG. 5 .

Referring to the drawings, first, a first wiring board 110 is prepared, and the electronic component 130 is surface mounted on the first wiring board 110 using a connection member 150 . Next, the first conductor part 141b is disposed on the second surface of the electronic component 130 . Next, the electrical connection structure 160 is disposed on the first wiring board 110 , the second wiring board 120 is prepared, and the second wiring board 120 is connected using the electrical connection structure 160 . It is disposed on the first wiring board 110 . At this time, the plurality of second conductor parts 142 are respectively disposed on the first conductor part 141b, and as a result, the heat dissipation member 140 is disposed on the second surface of the electronic component 130, and the second wiring board ( 120) is connected to it when it is placed. Next, the first and second wiring boards 110 and 120 are filled with an encapsulant 170 , and a connection terminal 180 and the like are formed. The electronic component device 100B according to another example may be manufactured through a series of processes, and other contents are substantially the same as those described above, and a detailed description thereof will be omitted.

7 is a cross-sectional view schematically illustrating another example of an electronic component device.

Referring to the drawings, in the electronic component device 100C according to another example, in the electronic component device 100A according to the above-described example, the electronic component 130 penetrates between the first surface and the second surface to dissipate heat, respectively. A plurality of through-vias 135 for connecting the member 140 and the connecting member 150, respectively, are included. Each of the plurality of through vias 135 may be a through silicon via (TSV), but is not limited thereto. In addition, each of the plurality of first conductor portions 141c includes tin (Sn), which is a low-melting-point metal, or an alloy containing tin (Sn), not a conductive resin layer, for example, solder. For example, each of the plurality of first conductor portions 141c may be formed by applying or coating a solder paste. In this case, at least one of the plurality of second conductor parts 142 of the heat dissipation member 140 may be electrically connected to the signal pattern of the second wiring layer 122 . Also, at least one of the plurality of third conductor parts 151 of the connection member 150 may be electrically connected to the signal pattern of the first wiring layer 112 . That is, a signal transmission path may be provided through the through-via 135 inside the electronic component 130 . Other contents are substantially the same as those described above, and detailed descriptions thereof will be omitted.

8 is a process diagram schematically illustrating an example of manufacturing the electronic component device of FIG. 7 .

Referring to the drawings, first, an electronic component 130 having a first wiring board 110 and a through-via 135 formed thereon is prepared, and the electronic component is formed using a connection member 150 on the first wiring board 110 . (130) is a surface mount arrangement. Next, the electrical connection structure 160 is disposed on the first wiring board 110 . Next, the second wiring board 120 is prepared, and the second wiring board 120 is disposed on the first wiring board 110 using the electrical connection structure 160 . At this time, a heat dissipation member 140 including a plurality of first conductor parts 141c and a plurality of second conductor parts 142 connected to each other is disposed on the second surface of the electronic component 130, and a second wiring board ( 120) is connected to it when it is placed. Next, the first and second wiring boards 110 and 120 are filled with an encapsulant 170 , and a connection terminal 180 and the like are formed. The electronic component device 100C according to another example may be manufactured through a series of processes, and other contents are substantially the same as those described above, and thus a detailed description thereof will be omitted.

9 is a cross-sectional view schematically illustrating another example of an electronic component device.

Referring to the drawings, in the electronic component device 100D according to another example, in the electronic component device 100A according to the above-described example, the electronic component 130 penetrates between the first surface and the second surface to dissipate heat, respectively. A plurality of through-vias 135 for connecting the member 140 and the connecting member 150, respectively, are included. Each of the plurality of through-vias 135 may be a through-silivon via (TSV), but is not limited thereto. In addition, the heat dissipation member 140 includes one first conductor part 141b and a plurality of second conductor parts 142 , and the plurality of second conductor parts 142 includes one first conductor part 141b. are each connected to In this case, one first conductor part 141b may include a conductive film, and each of the plurality of second conductor parts 142 may include a metal post. The conductive film may substantially entirely cover the second surface of the electronic component 130 . The conductive film may be one in which conductive particles are dispersed in an insulating film, for example, may be ACF, but is not limited thereto. In this case, at least one of the plurality of second conductor parts 142 of the heat dissipation member 140 may be electrically connected to the signal pattern of the second wiring layer 122 . Also, at least one of the plurality of third conductor parts 151 of the connection member 150 may be electrically connected to the signal pattern of the first wiring layer 112 . That is, a signal transmission path may be provided through the through-via 135 inside the electronic component 130 . Other contents are substantially the same as those described above, and detailed descriptions thereof will be omitted.

10 is a process diagram schematically illustrating an example of manufacturing the electronic component device of FIG. 9 .

Referring to the drawings, first, an electronic component 130 having a first wiring board 110 and a through-via 135 formed thereon is prepared, and the electronic component is formed using a connection member 150 on the first wiring board 110 . (130) is a surface mount arrangement. Next, the first conductor part 141b is disposed on the second surface of the electronic component 130 . Next, the electrical connection structure 160 is disposed on the first wiring board 110 , the second wiring board 120 is prepared, and the second wiring board 120 is connected using the electrical connection structure 160 . It is disposed on the first wiring board 110 . At this time, the plurality of second conductor parts 142 are respectively disposed on the first conductor part 141b, and as a result, the heat dissipation member 140 is disposed on the second surface of the electronic component 130, and the second wiring board ( 120) is connected to it when it is placed. Next, the first and second wiring boards 110 and 120 are filled with an encapsulant 170 , and a connection terminal 180 and the like are formed. The electronic component device 100D according to another example may be manufactured through a series of processes, and other contents are substantially the same as those described above, and a detailed description thereof will be omitted.

In the present disclosure, expressions such as side, side, etc. are used to mean a surface in the left/right direction or the direction based on the drawing for convenience, and expressions such as upper side, upper side, upper surface, etc. It was used to mean the face in the direction, and the lower side, lower side, lower side, etc. were used to mean the face in the downward direction or that direction for convenience. In addition, to be located on the side, upper, upper, lower, or lower side means that the target component not only directly contacts the reference component in the corresponding direction, but also includes a case where the target component is positioned in the corresponding direction but does not directly contact was used as However, this is a definition of the direction for convenience of explanation, and the scope of the claims is not particularly limited by the description of this direction, and the concept of upper/lower may be changed at any time.

The meaning of being connected in the present disclosure is a concept including not only directly connected, but also indirectly connected through an adhesive layer or the like. In addition, the meaning of being electrically connected is a concept including both the case of being physically connected and the case of not being connected. In addition, expressions such as first, second, etc. are used to distinguish one component from another, and do not limit the order and/or importance of the corresponding components. In some cases, without departing from the scope of rights, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

The expression “an example” used in the present disclosure does not mean the same embodiment, and is provided to emphasize and explain different unique features. However, the examples presented above are not excluded from being implemented in combination with features of other examples. For example, even if a matter described in one specific example is not described in another example, it may be understood as a description related to another example unless a description contradicts or contradicts the matter in another example.

The terminology used in the present disclosure is used to describe an example only, and is not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise.

Claims (10)

a first wiring substrate including a first wiring layer;
a second wiring substrate including a second wiring layer;
an electronic component disposed between the first and second wiring boards and having a first surface facing the first wiring board and a second surface facing the second wiring board; and
a heat dissipation member connecting the second surface of the electronic component and at least a portion of each of the second wiring layer to each other; includes,
The heat dissipation member includes a first conductor portion connected to the second surface of the electronic component, and a second conductor portion disposed on the first conductor portion and connected to the second wiring layer,
The first and second conductor portions include different materials,
electronic device.
The method of claim 1,
The heat dissipation member includes a plurality of first conductor parts and a plurality of second conductor parts,
The plurality of first conductor parts and the plurality of second conductor parts are respectively connected to each other,
electronic device.
3. The method of claim 2,
Each of the plurality of first conductor parts includes a conductive resin layer,
Each of the plurality of second conductors includes a metal post,
The conductive resin layer comprises a binder resin and conductive particles,
electronic device.
3. The method of claim 2,
Each of the plurality of first conductor parts includes solder,
Each of the plurality of second conductor portions comprises a metal post,
electronic device.
The method of claim 1,
The heat dissipation member includes one first conductor part and a plurality of second conductor parts,
The plurality of second conductor portions are respectively connected to the one first conductor portion,
electronic device.
6. The method of claim 5,
The one first conductor portion includes a conductive film,
Each of the plurality of second conductor portions comprises a metal post,
electronic device.
The method of claim 1,
The first and second wiring layers each include a ground,
The heat dissipation member is electrically connected to the ground of the first and second wiring layers,
electronic device.
The method of claim 1,
a connecting member connecting the first surface of the electronic component and at least a portion of each of the first wiring layer to each other; further comprising,
The connecting member includes a plurality of third conductor parts,
Each of the plurality of third conductor parts comprises a solder,
electronic device.
9. The method of claim 8,
The electronic component includes a plurality of through-vias respectively penetrating between the first and second surfaces to connect the heat dissipation member and the connection member, respectively,
electronic device.
9. The method of claim 8,
an electrical connection structure disposed around the electronic component between the first and second wiring boards and connecting at least a portion of each of the first and second wiring layers to each other; and
an encapsulant filling between the first and second wiring boards and covering at least a portion of each of the electronic component and the electrical connection structure; further comprising,
electronic device.

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