KR20220014355A - Exposure device and method for manufacturing display device using same - Google Patents

Abstract

Disclosed are an exposure device capable of reducing a face generated during an exposure and curing process and a method of manufacturing a display device. According to an embodiment, an exposure device comprises: a stage including a plurality of pinholes; a light source for emitting light to the stage; a plurality of lifting pins disposed to respectively penetrate the plurality of pin holes of the stage; an elevating pin moving unit for elevating the plurality of elevating pins; and a plurality of pin cooling bushings disposed under the stage for each of the plurality of lifting pins and including a lifting pin receiving hole which communicates with the plurality of pin holes and into which at least a portion of the lifting pins is inserted, and a gas supply hole communicating with the lifting pin receiving hole.

Description

Exposure apparatus and display apparatus manufacturing method using same

The present invention relates to an exposure apparatus and a method of manufacturing a display device using the same.

The importance of the display device is increasing with the development of multimedia. In response to this, various types of display devices such as a liquid crystal display (LCD) and an organic light emitting display (OLED) are being used.

In the manufacturing process of the display device as described above, a process of curing the monomer coated on the substrate by exposing it to ultraviolet rays may be performed. Since the spreadability of the monomer layer varies depending on the temperature, it is important to appropriately control the temperature of the apparatus for performing the exposure and curing process and the chamber for accommodating the same in order to prevent staining caused by the temperature deviation.

SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure apparatus capable of reducing a face generated during an exposure and curing process, and a method of manufacturing a display device using the same.

The problems of the present invention are not limited to the problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

An application device according to an embodiment for solving the above problems includes a stage including a plurality of pin holes; a light source for emitting light to the stage; a plurality of lifting pins disposed to respectively penetrate the plurality of pin holes of the stage; an elevating pin moving unit for elevating the plurality of elevating pins; and a lifting pin accommodating hole disposed under the stage for each of the plurality of lifting pins, communicating with the plurality of pin holes and into which at least a portion of the lifting pins is inserted, and a gas supply hole communicating with the lifting pin receiving hole, respectively. A plurality of fin cooling bushings comprising:

When the target substrate is loaded on the stage, the plurality of lifting pins rise to protrude from the upper surface of the stage to support the lower surface of the target substrate, and when the light source unit exposes the target substrate, the plurality of lifting pins may descend and be accommodated in the plurality of pinholes, respectively.

When the plurality of lifting pins are lowered, gas may be injected into the lifting pins receiving holes through the gas supply holes.

The gas may be nitrogen gas.

When the plurality of lifting pins are lowered, each end of the plurality of lifting pins may be accommodated in the lifting pin accommodating hole.

The target substrate may include a base substrate and a cured layer disposed on the base substrate and including a monomer.

The target substrate may include a base substrate, a thin film transistor layer on the base substrate, a light emitting element layer on the thin film transistor layer, an inorganic film on the light emitting element layer, and an organic film composition coated on the inorganic film and including a monomer have.

The stage may include a plurality of gas injection holes for ejecting gas upward, and when the target substrate is exposed, the target substrate may be lifted by the gas injected by the plurality of gas injection holes.

The fin cooling bushing may include a cylinder part that surrounds the lifting pin receiving hole and one side is inserted into the pin hole, and an extension part protruding in a centrifugal direction from the outer peripheral surface of the cylinder part to limit the insertion depth of the one side of the cylinder part. .

The exposure apparatus may include a gas supply passage connected to the gas supply hole of the plurality of fin cooling bushings; and a gas supply unit connected to the gas supply passage.

The gas supply passage may include a main passage having one end connected to the gas supply unit; a plurality of first sub passages branching from the main passage; and a plurality of second sub-channels branched from the plurality of first sub-channels and respectively connected to the plurality of fin cooling bushings.

The plurality of fin cooling bushings may be arranged in a matrix form, and each first sub-channel of the plurality of first sub-channels may connect the second flow passages connected to the fin cooling bushings in the same row among the plurality of second flow passages. .

The number of rows of the plurality of fin cooling bushings may be smaller than the number of columns of the plurality of fin cooling bushings.

The exposure apparatus further includes a first control valve disposed in the main flow path, a plurality of second control valves disposed in each of the plurality of first sub flow paths, and a plurality of third control valves disposed in each of the plurality of second sub flow paths. may include

The first control valve may be a regulator, and the second control valve and the third control valve may be a speed controller.

According to an exemplary embodiment, a method of manufacturing a display device includes loading a target substrate on a stage; lowering a plurality of lifting pins supporting a lower surface of the target substrate; and spraying gas to the plurality of lifting pins to cool the plurality of lifting pins.

The method of manufacturing the display device may further include irradiating ultraviolet rays to the target substrate after the plurality of lifting pins are lowered, and cooling of the plurality of lifting pins and irradiation of the ultraviolet rays may be performed simultaneously.

The method of manufacturing the display device may include supporting the target substrate by raising the plurality of cooling pins after the UV irradiation; and unloading the target substrate from the stage.

The cooling of the plurality of lifting pins may include injecting the gas into at least one hole in which the plurality of lifting pins are accommodated.

The method of manufacturing the display device includes the steps of applying a monomer layer to the target substrate before loading the target substrate, and exposing the target substrate on which the application of the monomer layer is completed according to a predetermined sequence using any one of a plurality of exposure apparatuses. It may further include the step of transferring to the device.

Details of other embodiments are included in the detailed description and drawings.

According to the coating device and the method for manufacturing a display device using the same according to an embodiment, it is possible to provide an appropriate temperature environment for exposure and curing, and to reduce stains caused by temperature rise and/or temperature deviation.

Effects according to the embodiments are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a diagram illustrating a display device related to an apparatus for manufacturing a display device according to an exemplary embodiment.
FIG. 2 is a cross-sectional view taken along line I-I' of FIG. 1 .
3 is a perspective view of an apparatus for manufacturing a display device according to an exemplary embodiment.
4 is an exploded perspective view of an apparatus for manufacturing a display device according to an exemplary embodiment.
5 is a cross-sectional view of part 'A' of FIG. 3 .
6 is an enlarged perspective view of the lower surface of the stage of part 'A' of FIG. 3 .
7 is a plan view and a side view of a fin cooling bushing of an apparatus for manufacturing a display device according to an exemplary embodiment;
8 is a plan view of a cooling passage of an apparatus for manufacturing a display device according to an exemplary embodiment.
9 is a conceptual layout diagram of a display device manufacturing system according to an exemplary embodiment. 10 is a perspective view of an application device of a display device manufacturing system according to an exemplary embodiment.
11 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment.
12 to 14 are diagrams illustrating steps of a method of manufacturing a display device according to an exemplary embodiment.
15 is a table illustrating a stage of an exposure apparatus, atmospheric air in an exposure chamber, and temperature and temperature deviation of a lifting pin of the exposure apparatus when the display apparatus manufacturing system according to an exemplary embodiment is used and when not used.
16 is an experiment result comparing a profile of a stain when the display device manufacturing system according to an exemplary embodiment is used and when it is not used.
17 is an experimental result comparing the intensity of stains when the display device manufacturing system according to an exemplary embodiment is used and when it is not used.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

Reference to an element or layer "on" of another element or layer includes any intervening layer or other element directly on or in the middle of the other element or layer. Like reference numerals refer to like elements throughout. The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments are examples, and thus the present invention is not limited to the illustrated matters.

Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

1 is a diagram illustrating a display device related to an apparatus for manufacturing a display device according to an exemplary embodiment. FIG. 2 is a cross-sectional view taken along line I-I' of FIG. 1 .

The display device 1 manufactured by a display device manufacturing apparatus and/or a display device manufacturing system to be described below is exemplified, but is not limited thereto.

1 and 2 , a display device 1 may refer to any electronic device that provides a display screen. For example, mobile phones, smart phones, tablet PCs (personal computers), electronic watches, smart watches, watch phones, mobile communication terminals, electronic notebooks, e-books, PMPs (Portable Multimedia Player), navigation, The display device 1 may include a television, a laptop computer, a monitor, a billboard, and the Internet of Things, as well as a portable electronic device such as a game machine or a digital camera. The display device 1 may include a foldable display device, a rollable display device, and a bendable display device.

The display device 1 may have a substantially rectangular shape in plan view. The display device 1 may have a rectangular shape with vertical edges or a rectangular shape with rounded edges on a plane. The display device 1 may include four sides or edges. The display device 1 may include long sides and short sides.

The display device 1 may include a display area DA displaying a screen and a non-display area NDA not displaying a screen. When the display device 1 has a touch function, the display area DA and/or the non-display area NDA may include a touch area in which a touch input is sensed.

The display area may include a plurality of pixels PX. The plurality of pixels PX may be arranged in a matrix direction. The shape of each pixel PX may have a rectangular, square, or rhombus shape in a plan view (ie, when viewed in a plan view).

The non-display area NDA is disposed around the display area DA. The non-display area NDA may surround at least a portion of the display area DA. The non-display area NDA may be a bezel area. Signal wires or driving circuits for applying a signal to the display area DA may be disposed in the non-display area NDA.

The display device 1 may include a display panel 10 .

The display panel 10 includes an organic light emitting display panel, a micro LED display panel, a nano LED display panel, a quantum dot light emitting display panel, a liquid crystal display panel, a plasma display panel, a field emission display panel, an electrophoretic display panel, an electrowetting display panel, etc. can be heard Hereinafter, an organic light emitting display panel is exemplified as an example of the display panel 10 , but is not limited thereto.

The display panel 10 includes a substrate SUB, a thin film transistor layer TFTL on the substrate SUB, a light emitting element layer EL on the thin film transistor layer TFTL, and a thin film encapsulation layer on the light emitting element layer EL. (TFE). In some embodiments, the display panel 10 may further include a touch layer disposed on the thin film encapsulation layer (TFE) and including a plurality of electrodes for sensing a touch input.

The substrate SUB may be made of a glass material or, for example, a plastic material such as polyimide. The substrate SUB is flexible and can be bent.

The thin film transistor layer TFTL may control the current transmitted to each pixel PX of the display device 1 to control the brightness of each pixel PX. The thin film transistor layer TFTL may include, for example, an active layer through which current may flow, and a gate electrode, a source electrode, and a drain electrode for driving the active layer.

The light emitting element layer EL may include an anode, a cathode, and an organic light emitting layer disposed between the anode and the cathode and composed of an organic compound that emits light by recombination of charges and holes moved through the anode and cathode.

The thin film encapsulation layer TFE may cover the light emitting element layer EL to prevent penetration of moisture and air into the light emitting element layer EL.

The thin film encapsulation layer TFE may be formed by alternately forming a plurality of inorganic layers and at least one organic layer OL. For example, the thin film encapsulation layer TFE may form the first inorganic layer IOL1 , the second inorganic layer IOL2 , and the organic layer OL between the first inorganic layer IOL1 and the second inorganic layer IOL2 . may include For example, the organic layer OL may be formed by exposing a monomer applied on the substrate SUB to ultraviolet light.

1 and 3 , during an exposure process of curing the organic film OL of the thin film encapsulation layer TFE by exposing it to UV light, stains STN may occur on the organic film OL of the thin film encapsulation layer TFE. can The stain STN may be generated by a temperature increase of a lift pin supporting the rear surface of the substrate SUB during an exposure process and/or a temperature increase of the substrate SUB due to conduction during curing of the organic layer OL. Such stains STN may be visually recognized, impair aesthetics, and may cause malfunction or malfunction of the display device 1 .

In order to remove or reduce the stain STN, temperature rise and deviation of the exposure apparatus and the exposure chamber in which the exposure apparatus is disposed may be controlled. The temperature rise and deviation of the exposure chamber may be controlled by an exposure apparatus and a method of manufacturing a display apparatus, which will be described later.

Hereinafter, an apparatus for manufacturing a display device will be described in detail with reference to FIGS. 3 to 8 .

3 is a perspective view of an apparatus for manufacturing a display device according to an exemplary embodiment. 4 is an exploded perspective view of an apparatus for manufacturing a display device according to an exemplary embodiment. 5 is a cross-sectional view of part 'A' of FIG. 3 . 6 is an enlarged perspective view of the lower surface of the stage of part 'A' of FIG. 3 . 7 is a plan view and a side view of a fin cooling bushing of an apparatus for manufacturing a display device according to an exemplary embodiment; 8 is a plan view of a cooling passage of an apparatus for manufacturing a display device according to an exemplary embodiment.

Hereinafter, the first direction DR1 , the second direction DR2 , and the third direction DR3 intersect in different directions. The first direction DR1 may be a horizontal direction. The second direction DR2 may be a vertical direction. The third direction DR3 may be a thickness direction. The first direction DR1 , the second direction DR2 , and/or the third direction DR3 may include two or more directions. For example, the third direction DR3 may include an upper direction toward the upper side of the drawing and a lower direction toward the lower side of the drawing. Accordingly, one surface of the member disposed to face in the upper direction may be referred to as an upper surface, and the other surface of the member disposed to face in the lower direction may be referred to as a lower surface. However, the above directions are exemplary and relative, and are not limited thereto.

The target substrate T described below includes a base substrate T_SUB and a cured layer T_MN laminated on the base substrate T_SUB and including a monomer that is cured by exposure, and the exposure apparatus 10 includes It may be an apparatus for processing by exposing at least one layer of the target substrate T. In some embodiments, the base substrate T_SUB of the target substrate T is the substrate SUB illustrated in FIG. 2 , the thin film transistor layer TFTL on the substrate SUB, and light emission on the thin film transistor layer TFTL The device layer (EL), the first inorganic layer (IOL1) on the light emitting device layer (EL), and an organic layer composition including a monomer applied to form an organic layer (OL) on the first inorganic layer (IOL1) may include

3 to 5 , the exposure apparatus 10 includes a light source unit 100 , a stage 200 , a plurality of lifting pins 300 , a lifting pin moving unit 400 , and a plurality of fin cooling bushings 500 . include The exposure apparatus 10 may further include a gas supply flow path 600 , a gas supply unit 700 , a support unit 800 , and a control unit 900 .

The light source unit 100 emits light having a specific wavelength range. For example, the light source unit 100 may emit ultraviolet rays having a wavelength range of 10 nm to 400 nm. In an embodiment, the light source unit 100 may be disposed on the stage 200 to emit light downward to expose the target substrate T loaded on the stage 200 . In some embodiments, the exposure apparatus 10 may further include a light source moving unit 110 that moves the light source unit 100 in at least one direction. In some embodiments, the light source unit 100 may be disposed in an internal space of an exposure chamber in which the exposure apparatus 10 is accommodated. In some embodiments, the light source unit 100 may be fixed and the stage 200 to be described later may be moved.

The stage 200 loads the target substrate T. In one embodiment, the stage 200 may be an air floating stage including a plurality of gas injection holes 210 . The plurality of gas injection holes 210 may be disposed on the upper surface of the stage 200 , and may lift the target substrate T so as to be spaced apart from the upper surface of the stage 200 by spraying gas upward. The stage 200 may further include a plurality of pin holes 220 through which a plurality of lifting pins 300 to be described later pass. In an embodiment, the stage 200 may be supported at a predetermined height by the support parts 800 supporting both sides of the stage 200 extending in the first direction DR1 , but is not limited thereto.

The plurality of lifting pins 300 are formed of rod-shaped members, and are disposed to pass through the plurality of pin holes 220 of the stage 200 , respectively. The plurality of lifting pins 300 may be raised and lowered by a lifting pin moving unit 400 to be described later. The plurality of lifting pins 300 may rise to protrude from the upper surface of the stage 200 to support the lower surface of the target substrate T. Specifically, when the target substrate T is transferred from the outside and/or when the target substrate T on which the exposure process is completed is transferred to the outside, the plurality of lifting pins 300 rise and the lower surface of the target substrate T is raised. can support When the target substrate T is floated by the pressure of the gas injected from the stage 200 , the plurality of lifting pins 300 may be lowered. In this case, the ends of the plurality of lifting pins 300 may be accommodated in the plurality of pin holes 220 of the stage 200 so as not to protrude from the upper surface of the stage 200 . In one embodiment, 16 lifting pins 300 are arranged in a matrix shape having 4 rows and 4 columns, but is not limited thereto.

As shown in FIG. 5 , when the plurality of lifting pins 300 are raised, ends of the plurality of lifting pins 300 may be in contact with the lower surface of the target substrate T. As shown in FIG. In this case, the temperature of the plurality of lifting pins 300 is changed due to absorption of ultraviolet rays and/or heat generated during curing of the monomers, such as other members of the adjacent exposure apparatus 10 , for example, the stage 200 and/or the exposure apparatus. (10) may be higher than the ambient temperature inside the chamber in which it is placed. Accordingly, the temperature of the portion of the target substrate T in contact with the end of the lifting pin 300 may be higher than the temperature of the remaining portion. The temperature increase and/or temperature deviation as described above may cause a thickness deviation of the cured layer T_MN disposed on the part of the target substrate T to generate stains STN. For example, a portion of the hardened layer T_MN positioned above the elevating pin 300 may be recessed than a peripheral area as the spreadability increases due to a rise in temperature, and an edge of a portion of the hardened layer T_MN The region may protrude beyond the periphery. The occurrence of stains (STN) due to the temperature rise and/or temperature deviation of the lifting fins 300 as described above may be reduced by the fin cooling bushings 500 to be described later.

Referring again to FIGS. 3 to 5 , the lifting pin moving unit 400 lifts the plurality of lifting pins 300 . The lifting pin moving unit 400 may be implemented as, for example, a cylinder driven by hydraulic pressure or pneumatic pressure and/or a linear movement guide driven by a servo motor. In one embodiment, the lifting pin moving unit 400 is arranged in plurality under the stage 200, the plurality of lifting pins 300 arranged in the second direction DR2 to connect and support a portion of the rod shape. It may be composed of a member of, but is not limited thereto.

The plurality of fin cooling bushings 500 may be disposed under the stage 200 for each of the plurality of lifting fins 300 . In one embodiment, the plurality of fin cooling bushings 500 may be disposed between the lifting fin moving unit 400 and the stage 200 . The plurality of lifting fins 300 may be disposed to pass through the plurality of fin cooling bushings 500 and the plurality of pin holes 220 .

6 to 7 , the plurality of fin cooling bushings 500 may include a cylinder part 510 , a lifting pin accommodating hole 520 , a gas injection hole and an extension part 540 .

The cylinder part 510 may be formed of a tube-shaped member having an inner diameter and an outer diameter. In an embodiment, the upper end of the cylinder unit 510 may be inserted into the pin hole 220 of the stage 200 , and the lower end of the cylinder unit 510 may be supported by the lifting pin moving unit 400 .

The lifting pin accommodating hole 520 is formed through the cylinder part 510 , and at least a portion of the lifting pin 300 may be accommodated therein. The lifting pin accommodating hole 520 is formed to extend in the same direction as the pin hole 220 of the stage 200 , for example, in a vertical direction, and has one end connected to the pin hole 220 of the stage 200 . It may communicate with the pin hole 220 .

The gas injection hole may be formed through the cylinder part 510 in a direction crossing the extending direction of the lifting pin accommodating hole 520 , for example, in a horizontal direction. The gas injection hole may be formed to pass through the inner peripheral surface of the cylinder part 510 forming the lifting pin accommodating hole 520 and the outer peripheral surface of the cylinder part 510 surrounding the inner peripheral surface. One end of the gas injection hole may be connected to the lifting pin receiving hole 520 to communicate with the lifting pin receiving hole 520 .

The extension part 540 may be formed to protrude from the outer circumferential surface of the cylinder part 510 in a centrifugal direction. The upper surface of the extension part 540 may be in close contact with the lower surface of the stage 200 to limit the insertion depth of the cylinder part 510 .

The gas supply passage 600 connects the gas supply hole 530 of the plurality of fin cooling bushings 500 and the gas supply unit 700 . In one embodiment, the gas supply flow path 600 may be provided in a space between the lower surface of the stage 200 and the lifting pin moving unit 400 , but is not limited thereto. In detail, the plurality of fin cooling bushings 500 are respectively disposed for each of the plurality of lifting fins 300 arranged in a matrix form between the lower surface of the stage 200 and the moving part of the lifting fins 300 , and the gas supply passage 600 . ) may be connected in series and/or in parallel to the gas supply hole 530 of each fin cooling bushing 500 . The gas transported through the gas supply passage 600 may be supplied to the lifting fin accommodating hole 520 of each fin cooling bushing 500 through the gas supply hole 530 .

Referring further to FIG. 8 , the gas supply flow path 600 includes a main flow path 610 having one end connected to the gas supply unit 700 , a plurality of first sub flow paths 620 branching from the main flow path 610 , and the It may include a plurality of second sub-channels 630 branched from the plurality of first sub-channels 620 and respectively connected to the plurality of fin cooling bushings 500 .

As described above, the plurality of lifting fins 300 and the plurality of fin cooling bushings 500 extend in a plurality of rows (C1, C2, C3, Cn) extending in one direction and in the other direction crossing the one direction. may be arranged in a matrix form having a plurality of columns R1, R2, R3, and Rn. The one direction may be the first direction DR1 and the other direction may be the second direction DR2, but is not limited thereto. In one embodiment, the plurality of lifting fins 300 and the plurality of fin cooling bushings 500 may be arranged in a matrix form having M columns and N rows. In this case, the gas supply flow path 600 may be disposed between M columns and/or N rows. Since the plurality of fin cooling bushings 500 are disposed for each of the plurality of lifting fins 300 , the plurality of fin cooling bushings 500 will be mainly described below.

The plurality of second sub-channels 630 may be differently disposed according to the number of rows and columns of the plurality of fin cooling bushings 500 . Specifically, the plurality of second sub-channels 630 includes a plurality of rows C1, C2, C3, Cn) or the second sub-channels 630 connected to the fin cooling bushings 500 positioned in the plurality of rows R1, R2, R3, and Rn may be connected. Accordingly, it is possible to reduce the amount of piping and/or to efficiently arrange a control valve to be described later. For example, when M is greater than N, the plurality of second sub-channels 630 may be disposed between the plurality of rows C1, C2, C3, and Cn in the column direction. As another example, when M is less than N, the plurality of second sub-channels 630 may be disposed between the plurality of columns R1 , R2 , R3 , and Rn in a row direction.

The display device 1 manufacturing apparatus includes a first control valve RT disposed in a main flow path 610 , a plurality of second control valves SC1 disposed in each of a plurality of first sub flow paths 620 , and a plurality of second It may further include a plurality of third control valves SC2 disposed for each sub-channel 630 .

The first control valve RT may be disposed between a point at which the first branching first sub flow path 620 is connected to the main flow path 610 and a point connected to the gas supply unit 700 . Each of the plurality of second control valves SC1 includes a point where the main flow path 610 and the first sub flow path 620 are connected and a second branching first from the first sub flow path 620 and the first sub flow path 620 . The sub flow path 630 may be disposed between the connected points. The plurality of third control valves SC2 may be disposed between one end connected to the fin cooling bushing 500 of the second sub-channel 630 and the other end connected to the first sub-channel 620 , respectively.

The first control valve RT may control the flow rate of the gas passing through the main flow path 610 . The second control valve SC1 may control the flow rate of gas passing through the first sub flow path 620 , and the third control valve SC2 may control the flow rate of gas passing through the second sub flow path 630 . have. In detail, the second control valve SC1 controls the flow rate branching ratio from the main flow path 610 of the first sub flow path 620 , and the third control valve SC2 is the second control valve SC2 of the second sub flow path 630 . A flow rate branching rate from one sub-channel 620 may be controlled.

Each of the plurality of first sub-channels 620 may have the same flow rate. In detail, the flow rate branching ratio of the second sub-channel 630 for supplying gas to the fin cooling bushings 500 in the first row R1 is 1, and the fin cooling bushing 500 in the second row R2 is The flow rate branching ratio of the second sub-channel 630 for supplying gas to the fields is 1/(N-(N-1)), and for supplying gas to the fin cooling bushings 500 of the third row R3 The flow rate branching ratio of the second sub-channel 630 is 1/(N-(N-2)), and the second sub-channel 630 for supplying gas to the fin cooling bushings 500 of the n-th row Rn. ) may have a flow branching ratio of 1/(N-1). In some embodiments, the plurality of first sub-channels 620 may have different flow rates.

The plurality of second sub-channels 630 may each have the same flow rate. In detail, the flow rate branching ratio of the second sub-channel 630 for supplying gas to the fin cooling bushings 500 of the first row C1 is 1, and the fin cooling bushing 500 of the second row C2 is The flow rate branching ratio of the second sub-channel 630 for supplying gas to the fields is 1/(M-(M-1)), and for supplying gas to the fin cooling bushings 500 of the third row C3 The flow rate branching ratio of the second sub-channel 630 is 1/(M-(M-2)), and the second sub-channel 630 for supplying gas to the fin cooling bushings 500 of the n-th row Rn. ) may have a flow branching ratio of 1/(M-1). In some embodiments, the plurality of second sub-channels 630 may have different flow rates.

For example, when a plurality of fin cooling bushings 500 are arranged in a 4 x 4 matrix form and the flow rate supplied from the gas supply unit 700 is 100, a flow rate of 25 in each of the four second sub-channels 630 . is distributed, and a flow rate of 6.25 may be uniformly distributed to each of the 16 second sub-channels 630 .

In an embodiment, the first control valve RT may be a regulator, and the second control valve SC1 and the third control valve SC2 may be speed controllers. By disposing different flow rate control means according to the location, assembly is simple, cost is reduced, and the space between the lower surface of the stage 200 and the lifting pin moving unit 400 can be efficiently utilized. The regulator and/or the speed controller may be controlled by the controller 900 or may be manually operated. For example, the flow rates of the second sub-channel 630 and the second sub-channel 630 may be adjusted by appropriately adjusting the number of rotations of the needle and/or handle of the speed controller.

The gas supply unit 700 supplies gas to the gas supply holes 530 of the plurality of fin cooling bushings 500 through the gas supply passage 600 . The gas supplied by the gas supply unit 700 may have a lower temperature than the exposure apparatus 10 and/or the internal space of the chamber surrounding the exposure apparatus 10 . That is, the gas may be a cooling gas. In one embodiment, the gas may be a nitrogen (N ₂ ) gas, but is not limited thereto. In some embodiments, the gas supply unit 700 may include at least one pump and a regulator for controlling the pressure and/or flow rate of the gas.

Referring again to FIGS. 3 and 4 , the controller 900 may control the overall operation of the exposure apparatus 10 . The control unit 900 includes the light source unit 100 , the stage 200 , the lifting pin moving unit 400 , the first control valve RT, the second control valve SC1 , the third control valve SC2 , and the gas supply unit ( 700) can be controlled.

In some embodiments, the exposure apparatus 10 may be provided in a chamber. In some embodiments, the chamber may be maintained in a nitrogen atmosphere.

The temperature rise and/or temperature deviation of the plurality of lifting fins 300 described above in FIG. 5 is not only the fin cooling bushing 500 of the exposure apparatus 10 of FIG. 4 , but also the display device manufacturing system of FIGS. 9 and 10 . (1000) can be reduced by

9 is a conceptual layout diagram of a display device manufacturing system according to an exemplary embodiment. 10 is a perspective view of an application device of a display device manufacturing system according to an exemplary embodiment.

9 and 10 , the display device manufacturing system 1000 includes a plurality of application chambers PC in which an application process is performed, a plurality of exposure chambers UC in which an exposure process is performed, an application chamber PC and an exposure process. It may include a transfer robot RBT and a controller 9000 for transferring the target substrate T between the chambers UC.

The plurality of application chambers PC and the plurality of exposure chambers UC may be disposed with a passage through which the transfer robot RBT moves. In an embodiment, the first application chamber PC1 , the fourth exposure chamber UC4 , the fifth exposure chamber UC5 , and the sixth exposure chamber UC6 are disposed on one side of the passage, and the other side of the passage The second application chamber PC2 , the first exposure chamber UC1 , the second exposure chamber UC2 , and the third exposure chamber UC3 may be disposed, but is not limited thereto.

A plurality of application devices 20 may be respectively disposed in the plurality of application chambers PC. A cured layer T_MN including a monomer and cured by ultraviolet light may be applied to the target substrate T in the plurality of application chambers PC.

As shown in FIG. 10 , the application device 20 includes, for example, a stage 21 , a support 24 supporting the stage 21 , and ink disposed on the stage 21 and containing a monomer. It may be an inkjet printer including an inkjet head 22 for printing the composition on the target substrate T and an inkjet head moving part 23 for moving the inkjet head 22 in at least one direction, but is not limited thereto. .

A plurality of exposure apparatuses 10 may be respectively disposed in the plurality of exposure chambers UC. The exposure apparatus 10 may be the exposure apparatus 10 of FIG. 4 . In an embodiment, the number of exposure chambers UC may be greater than the number of application chambers PC. This is because the time required for the application process may be shorter than the time required for the exposure process.

The transfer robot RBT transfers the target substrate T. The transfer robot RBT may receive the target substrate T from the entrance gate GT_IN provided at one end of the passage and transfer the target substrate T to any one of the exposure chambers UC. The transfer robot RBT may transfer the coated target substrate T from the application chamber PC to the exposure chamber UC. When the exposure process is completed, the transfer robot RBT may transfer the target substrate T from the exposure chamber UC to the exit gate GT_OUT. The transfer robot RBT may be arranged in plurality.

The controller 9000 may control at least one of the application chamber PC, the exposure chamber UC, the application apparatus 20 , the exposure apparatus 10 , and the transfer robot RBT.

The controller 9000 may control the transfer robot RBT to transfer the target substrate T from the application chamber PC to the exposure chamber UC according to a preset order. In detail, the controller 9000 assigns an order to each of the plurality of exposure chambers UC, and when the application process is completed, the target substrate T is exposed to any one of the exposure chambers UC according to the order. It can be transferred to the chamber (UC). For example, the transfer robot RBT may include a first exposure chamber UC1 , a second exposure chamber UC2 , a third exposure chamber UC3 , a fourth exposure chamber UC4 , a fifth exposure chamber UC5 and The target substrate T may be transferred in the order of the sixth exposure chamber UC6 . Specifically, when the application is completed in the first application chamber PC1, the transfer robot RBT transfers the target substrate T to the first exposure chamber UC1, and the application is completed in the second application chamber PC2. In this case, the transfer robot RBT may transfer the target substrate T to the second exposure chamber UC2 instead of the fourth exposure chamber UC4 nearby. Accordingly, the plurality of exposure chambers UC can be uniformly used, traffic generated in a specific exposure chamber is prevented, and a cooling time of each exposure chamber can be sufficiently secured.

The control unit 9000 sequentially transfers the target substrate T to the plurality of exposure chambers UC, and transfers the next target substrate T to each exposure chamber UC based on whether a predetermined time has elapsed. A transfer robot (RBT) can be controlled. Accordingly, a cooling time of the exposure chamber UC before the subsequent input of another target substrate T may be secured.

In an exemplary embodiment, the preset time may be counted from a time point when the previous target substrate T is put into the exposure chamber UC. The preset time may be about 220 seconds. In some embodiments, the preset time may be counted from a point in time when any one target substrate T is unloaded. In some embodiments, the preset time may be counted from a point in time when the lifting pin 300 of the exposure apparatus 10 rises again after exposure is completed.

11 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment. 12 to 14 are diagrams illustrating steps of a method of manufacturing a display device according to an exemplary embodiment.

The following display device manufacturing method may be performed by the application device 20 of FIG. 4 and/or the display device manufacturing system 1000 of FIG. 9 .

Referring to FIG. 11 , the method of manufacturing a display device includes loading a target substrate T on a stage 200 , lowering a plurality of lifting pins 300 supporting the lower surface of the target substrate T, and a plurality of It may include cooling the plurality of lifting fins 300 by injecting gas to the lifting fins 300 .

The method of manufacturing the display device may further include irradiating ultraviolet rays to the target substrate T after the plurality of lifting pins 300 are lowered. In some embodiments, cooling of the plurality of lifting pins 300 and irradiation of ultraviolet rays may be performed simultaneously.

The method of manufacturing a display device includes at least one of lifting the plurality of cooled lifting pins 300 to support the target substrate T and unloading the target substrate T from the stage 200 after irradiation with ultraviolet rays. may include more.

Cooling the plurality of lifting pins 300 may include injecting gas into at least one hole in which the plurality of lifting pins 300 are accommodated.

The display device manufacturing method includes the steps of applying a monomer layer to the target substrate T before loading the target substrate T, and applying the monomer layer to a plurality of exposure apparatuses ( The method may further include at least one of transferring to the exposure apparatus 10 of any one of 10).

The method of manufacturing the display device is not limited to the above example, and at least some of the steps may be omitted or may further include at least one other step with reference to FIGS. 1 to 10 .

Hereinafter, a method of manufacturing a display device will be described in detail with reference to FIGS. 12 to 14 .

Referring to FIG. 12 , the target substrate T may be transferred from the outside and loaded on the stage 200 . In some embodiments, the target substrate T may be transferred onto the stage 200 by the transfer robot RBT of FIG. 9 . In this case, the lower surface of the target substrate T may be supported by the ends of the plurality of lifting pins 300 in a raised state to be spaced apart from the upper surface of the stage 200 . In some embodiments, before loading of the target substrate T, the plurality of lifting pins 300 are respectively accommodated in the plurality of fin cooling bushings 500 , and the lifting pins receiving holes 520 of the plurality of fin cooling bushings 500 . ), a gas supplied from the gas supply unit 700, for example, nitrogen gas may be injected to the plurality of lifting fins 300 to be cooled.

Referring to FIG. 13 , after the target substrate T is mounted on the ends of the plurality of lifting pins 300 , the target substrate T may be lifted by being sprayed upward from the stage 200 . Accordingly, the target substrate T may be floated on the upper surface of the stage 200 . 5 and 13 , when sufficient gas pressure for lifting the target substrate T is provided, the plurality of lifting pins 300 descend, and the ends of the plurality of lifting pins 300 are on the stage 200 . may be accommodated in a plurality of pin holes 220 of In one embodiment, the ends of the plurality of lifting fins 300 may be located in the fin accommodating hole of the fin cooling bushing 500 . In some embodiments, the ends of the plurality of lifting pins 300 may be located in the pin holes 220 of the stage 200 . In some embodiments, when the plurality of lifting pins 300 are lowered, the target substrate T may be leveled to be flatly disposed by adjusting the pressure of the gas injected from the stage 200 .

When the plurality of lifting fins 300 are lowered, gas may be injected from the gas supply hole 530 of the fin cooling bushing 500 . The gas may have a lower temperature than the surrounding temperature to cool the lifting fins 300 . In one embodiment, the gas may be nitrogen gas, but is not limited thereto.

After the target substrate T is floated, the light source unit 100 may irradiate the target substrate T with ultraviolet rays. The cured layer T_MN of the target substrate T may be exposed to UV light to be cured.

Referring to FIG. 14 , after exposure is completed, the light source unit 100 stops irradiating UV rays, and the plurality of lifting pins 300 are raised again to support the lower surface of the target substrate T. Referring to FIG. The target substrate T supported by the plurality of lifting pins 300 may be unloaded from the stage 200 . For example, the target substrate T may be carried out of the exposure apparatus 10 by the transfer robot RBT of FIG. 9 .

15 is a table illustrating a stage of an exposure apparatus, atmospheric air in an exposure chamber, and temperature and temperature deviation of a lifting pin of the exposure apparatus when the display apparatus manufacturing system according to an exemplary embodiment is used and when not used.

Referring to FIG. 15 , in the display device manufacturing system 1000 , the target substrate T is sequentially introduced into the plurality of exposure chambers UC, and gas is injected into the fin cooling bushing 500 of the exposure device 10 . As a result, the lifting pin 300 is cooled, so that the temperature and/or temperature deviation of the stage 200 of the exposure apparatus 10, the atmosphere in the exposure chamber UC, and the lifting pin 300 of the exposure apparatus 10 can be reduced. have. For example, in the display device manufacturing system 1000 according to an exemplary embodiment, the temperature of the atmosphere in the stage 200 and the exposure chamber UC of the exposure apparatus 10 and the lift pin 300 of the exposure apparatus 10 is It can be reduced by about 0.1° and 1.6°, respectively, and the temperature deviation can be reduced by about 1.2°.

16 is an experiment result comparing a profile of a stain when the display device manufacturing system according to an exemplary embodiment is used and when it is not used.

16A is a graph illustrating a profile of a spot STN when the display device manufacturing system 1000 according to an exemplary embodiment is not used. 16B is a graph illustrating a profile of a spot STN when the display device manufacturing system 1000 according to an exemplary embodiment is used.

The horizontal axis of the graph means the distance from an arbitrary measurement point, and the vertical axis of the graph means the thickness of the hardened layer (T_MN).

1, 16 (a) and 16 (b), when the target substrate T is not sequentially transferred to the plurality of exposure chambers UC and the plurality of lifting pins 300 are not cooled, The size S of the speckle STN is about 9 mm to 10 mm, and the distance W between the first peak point P1 and the second peak point P2 of the speckle STN is about 5 mm to 6 mm. In addition, the step (D) of the stain (STN) is about 1.2 μm to 1.7 μm.

When the target substrate T is sequentially transferred to the plurality of exposure chambers UC and the plurality of lifting pins 300 are cooled, the size S′ of the stain STN is about 9 mm to 10 mm, and the size S′ of the stain STN is about 9 mm to 10 mm. ), the interval W' between the first peak point P1' and the second peak point P2' is about 4 mm to 5 mm. In addition, the step (D') of the stain (STN) is about 1.2 μm to 1.7 μm.

That is, when the display device 1 is manufactured using the display device manufacturing system 1000 according to an exemplary embodiment, the first peak point P1 ′ and the second peak point of the spot STN of the display device 1 . The gap between the points P2 ′ and the step difference of the spot STN may be reduced.

17 is an experiment result comparing the intensity of stains when the display device manufacturing system according to an exemplary embodiment is used and when the display device manufacturing system is not used.

The graph of FIG. 17 shows the measurement of the intensity of the spot STN of the display device 1 using an automatic optical inspection device. The horizontal axis of the graph indicates the time period, and the vertical axis indicates the intensity of the stain (STN).

In the first section R1 , when the target substrate T is not sequentially transferred to the plurality of exposure chambers UC and the plurality of lifting pins 300 are not cooled, the intensity of the stain STN of the display device 1 is indicates The second section R2 represents the intensity of the spot STN when the target substrate T is sequentially transferred to the plurality of exposure chambers UC as in the embodiment of FIG. 9 . In the third section R3 , the target substrate T is sequentially transferred to the plurality of exposure chambers UC, and as in the embodiment of FIGS. 5 and 13 , the plurality of lifting fins 300 are fin cooling bushings 500 . It represents the intensity of the stain STN when it is cooled by the gas injected from the gas supply hole 530 .

1 and 17 , in the case of the first section R1, the intensity of the spot STN of the display device 1 is about 44, which is relatively higher than that of other sections. On the other hand, in the second section R2 , the intensity of the spot STN of the display device 1 is about 16, which is lower than that of the first section R1 . That is, when the target substrate T is sequentially transferred to the plurality of exposure chambers UC, the intensity of the spot STN decreases. Also, in the third section R3 , the intensity of the spot STN of the display device 1 is about 11, which is lower than that of the first section R1 and the second section R2 . That is, when the plurality of lifting pins 300 are cooled by gas, the intensity of the stain STN may be further reduced. That is, when the display device 1 is manufactured using the display device manufacturing system 1000 according to an exemplary embodiment, the intensity of the spot STN of the display device 1 may be greatly reduced to about one quarter. have.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. you will be able to understand Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

1: display device
10: exposure apparatus
100: light source unit
200: stage
300: a plurality of lifting pins
400: lifting pin lifting portion
500: Fin cooling bushing
600: gas supply flow path
700: gas supply
800: support
900: control unit
1000: display device manufacturing system

Claims (20)

a stage including a plurality of pin holes;
a light source for emitting light to the stage;
a plurality of lifting pins disposed to respectively penetrate the plurality of pin holes of the stage;
an elevating pin moving unit for elevating the plurality of elevating pins; and
Each of the plurality of lifting pins is disposed under the stage, and a lifting pin accommodating hole communicating with the plurality of pin holes and into which at least a portion of the lifting pins is inserted, and a gas supply hole communicating with the lifting pin accommodating hole, respectively. An exposure apparatus comprising a plurality of fin cooling bushings. According to claim 1,
When the target substrate is loaded on the stage, the plurality of lifting pins rise to protrude from the upper surface of the stage to support the lower surface of the target substrate, and when the light source unit exposes the target substrate, the plurality of lifting pins An exposure apparatus that descends and is accommodated in the plurality of pinholes, respectively. 3. The method of claim 2,
When the plurality of lifting pins are lowered, a gas is injected into the lifting pin accommodation hole through the gas supply hole. 4. The method of claim 3,
The exposure apparatus wherein the gas is nitrogen gas. 3. The method of claim 2,
When the plurality of lifting pins are lowered, each end of the plurality of lifting pins is accommodated in the lifting pin accommodating hole. 3. The method of claim 2,
and the target substrate includes a base substrate and a cured layer disposed on the base substrate and including a monomer. 3. The method of claim 2,
The target substrate is a base substrate, a thin film transistor layer on the base substrate, a light emitting element layer on the thin film transistor layer, an inorganic film on the light emitting element layer, and an organic film composition coated on the inorganic film and including a monomer. Device. 3. The method of claim 2,
The stage includes a plurality of gas injection holes for ejecting gas upward, and when the target substrate is exposed, the target substrate is lifted by the gas injected by the plurality of gas injection holes. According to claim 1,
The fin cooling bushing includes a cylinder part having one side inserted into the pin hole and an extension part protruding in a centrifugal direction from an outer circumferential surface of the cylinder part to limit the insertion depth of the one side of the cylinder part surrounding the lifting pin accommodating hole. . According to claim 1,
a gas supply passage connected to the gas supply hole of the plurality of fin cooling bushings; and a gas supply unit connected to the gas supply passage. 11. The method of claim 10,
The gas supply passage may include a main passage having one end connected to the gas supply unit; a plurality of first sub passages branching from the main passage; and a plurality of second sub-channels branched from the plurality of first sub-channels and respectively connected to the plurality of fin cooling bushings. 12. The method of claim 11,
The plurality of fin cooling bushings are arranged in a matrix form, and each first sub-channel of the plurality of first sub-channels includes the second sub-channels connected to the fin cooling bushings in the same row among the plurality of second sub-channels. Connecting exposure device. 13. The method of claim 12,
The number of rows of the plurality of fin cooling bushings is smaller than the number of columns of the plurality of fin cooling bushings. 12. The method of claim 11,
Exposure apparatus further comprising: a first control valve disposed in the main flow path; a plurality of second control valves disposed in each of the plurality of first sub flow paths; and a plurality of third control valves disposed in each of the plurality of second sub flow paths. . 15. The method of claim 14,
The exposure apparatus wherein the first control valve is a regulator, and the second control valve and the third control valve are speed controllers. loading a target substrate on a stage;
lowering a plurality of lifting pins supporting a lower surface of the target substrate; and
Including the step of cooling the plurality of lifting pins by injecting gas to the plurality of lifting pins
A method of manufacturing a display device. 17. The method of claim 16,
and irradiating ultraviolet rays to the target substrate after the plurality of lifting pins are lowered, wherein cooling of the plurality of lifting pins and irradiation of the ultraviolet rays are simultaneously performed. 18. The method of claim 17,
supporting the target substrate by elevating the plurality of cooling elevating pins after the UV irradiation; and unloading the target substrate from the stage. 17. The method of claim 16,
The cooling of the plurality of lift pins includes injecting the gas into at least one hole in which the plurality of lift pins are accommodated. 17. The method of claim 16,
Before loading the target substrate, applying a monomer layer to the target substrate and transferring the target substrate on which the application of the monomer layer is completed according to a given sequence to any one of a plurality of exposure apparatuses Further comprising a method of manufacturing a display device.

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